TW201938394A - Method of manufacturing laminate, laminate, and method of manufacturing electronic device to suppress warpage of a laminate having electronic parts - Google Patents

Abstract

The subject of this invention is to suppress warpage of a laminate having electronic parts. The method of manufacturing a laminate comprises the following steps of: laminating a substrate (5) having an electronic part (E) molded with a molding material (M) and a support body (2) having a thermal expansion coefficient of 3 ppm/K or more and 14 ppm/K or less via a separation layer (3) which is denatured by a predetermined treatment.

Description

Method for manufacturing laminated body, method for manufacturing laminated body, and electronic device

The present invention relates to a method for manufacturing a laminate, a method for manufacturing a laminate, and an electronic device.

In the field of semiconductors, in recent years, packaging of electronic components at the wafer level and panel level has been used. For example, a fan-out package is a package with a structure that "the rewiring formed on the semiconductor wafer (wafer) is extended to the outside of the outer shape of the wafer", and it is possible to reduce the size of the package or the density of the wiring , So much attention. As a method for manufacturing a semiconductor in a fan-out package like this, a method is known in which a plurality of electronic components are mounted on a support and sealed with a molding material to form a wiring structure (rewiring). The support is removed from the laminate and singulated (for example, Patent Document 1 described below).
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-306071

[Problems to be Solved by the Invention]

Conventionally, a laminated body provided with an electronic component like Patent Document 1 has been subject to warpage. When the laminated body is warped, a position shift or the like occurs, which is likely to cause defects in the electronic component and lower the yield. In particular, when the size of a package is reduced and the density of wiring is increased, defects in electronic components are liable to occur. Therefore, the inventor of the present case conducted research on the materials and the like of each part of the laminate as described above, and found that the warpage of the laminate can be suppressed by using a support having a predetermined thermal expansion coefficient, thereby completing this invention.

In view of the circumstances as described above, the present invention aims to suppress the warpage of a laminated body having electronic components.

[Means to solve the problem]

According to a first aspect of the present invention, there is provided a method for manufacturing a laminated body, which includes the following steps: The laminated layer has electrons molded from a molding material through a separation layer that is deteriorated by a predetermined process. The substrate of the component and the support having a thermal expansion coefficient of 3 ppm / K or more and 14 ppm / K or less.

According to a second aspect of the present invention, a laminated body is provided, which is based on the order of a support having a thermal expansion coefficient of 3 ppm / K or more and 14 ppm / K or less, and a separation layer, an adhesive layer, and a substrate that are deteriorated by a predetermined process. Laminated.

According to a third aspect of the present invention, there is provided a method for manufacturing an electronic device, which includes: manufacturing the laminated body by the above-mentioned manufacturing method of the laminated body; deteriorating the separation layer, and separating the support body from the laminated body; And removing the adhesion layer and the separation layer from the substrate to obtain an electronic device containing electronic components.

[Effect of the invention]

The manufacturing method of the laminated body of this invention can manufacture the laminated body which suppressed the curvature. Moreover, in the laminated body of the present invention, warping is suppressed. In addition, since the method of manufacturing the electronic device of the present invention uses a laminated body in which warpage is suppressed, the yield of the manufactured electronic component can be improved.

[Embodiment]
The embodiment will be described. In the following description, reference is made to the XYZ orthogonal coordinate system shown in FIG. 1 and the like as appropriate. In the XYZ orthogonal coordinate system, the X and Y directions are horizontal (horizontal), and the Z direction is vertical. In each direction, the same side as the front of the arrow is referred to as the + side (for example, + Z side), and the side opposite to the front of the arrow is referred to as the-side (for example, the -Z side). For example, in the vertical direction (Z direction), the upper side is the + Z side, and the lower side is the -Z side. In addition, in the drawings, a part or the whole is schematically described for explaining the embodiment, a part is enlarged or emphasized, etc., and a part expressed by appropriately changing the scale is included.

[Laminated body]
The laminated body of this embodiment is demonstrated. FIG. 1 is a cross-sectional view as viewed from the −Y side of the laminated body showing this embodiment. As shown in FIG. 1, the laminated body 1 includes: a support 2; a separation layer 3; an adhesive layer 4; and a substrate 5 having an electronic component E. In the laminated body 1, the support 2, the separation layer 3, the adhesive layer 4, and the substrate 5 having the electronic component E are laminated in this order. The laminated body 1 is used for manufacturing the electronic device 10 provided with the electronic component E (refer FIG. 9 (B)). The laminated body 1 is a so-called fan-out package structure including a structure in which the "rewiring layer R formed on the electronic component E is expanded to be more outward than the external shape of the electronic component E". In this embodiment, the laminated body 1 is described as having a structure including a so-called fan-out panel-level package, but other aspects are also possible.

(Support)
The support 2 supports the separation layer 3, the adhesion layer 4 and the substrate 5. A separation layer 3 is laminated on one of the surfaces of the support 2 (the surface on the + Z side in FIG. 1). The size, thickness, and shape of the support 2 can be arbitrarily set. For example, the size of the outer shape of the support body 2 such as one side or diameter can be set to about 10 mm to 1000 mm. In addition, for example, from the viewpoint of suppressing the warpage of the laminate 1, the thickness of the support 2 is preferably set to be 400 μm or more and 1200 μm or less. From the viewpoint of suppressing warpage of the laminated body 1, the thickness of the support 2 is preferably thicker than the thickness of the substrate 5 described later. In addition, for example, the shape of the support 2 may be a shape such as a plate shape such as a rectangular shape or a circular shape.

The support 2 has a coefficient of thermal expansion (CTE) of 3 ppm / K or more and 14 ppm / K or less, 4 ppm / K or more and 9 ppm / K or less is more preferable, and 5 ppm / K or more and 8 ppm / K or less is more preferable. When the thermal expansion coefficient of the support 2 is in the above range, the warpage of the laminated body 1 can be suppressed. I think this is because when the thermal expansion coefficient of the support 2 is in the above range, it will match the thermal expansion coefficient of the substrate 5. Among them, the coefficient of thermal expansion of the support 2 and the coefficient of thermal expansion of the substrate 5 are set to (X coefficient of thermal expansion of the support 2 / coefficient of thermal expansion of the substrate 5) X, and X is preferably 0.5 ≦ X ≦ 1.2, It is more preferable to satisfy 0.8 ≦ X ≦ 1.0. The thermal expansion coefficient of the substrate 5 is preferably 4 ppm / K or more and 12 ppm / K or less, and more preferably 5 ppm / K or more and 10 ppm / K or less. The thermal expansion coefficients of the support 2 and the substrate 5 can be obtained by a conventional thermal expansion coefficient measuring device or the like.
In addition, in the present invention, there is a case where the expansion and contraction behavior of the molding material M provided on the support 2 has a dominant influence on the warpage of the laminated body 1. In this case, the thermal expansion coefficient of the substrate 5 can be regarded as being equal to the thermal expansion coefficient of the molding material M.
From such a viewpoint, the thermal expansion coefficient of the molding material M is preferably 4 ppm / K or more and 12 ppm / K or less, and more preferably 5 ppm / K or more and 10 ppm / K or less.
The thermal expansion coefficient of the molding material M can be obtained by hardening the test piece with a composition for sealing, and analyzing the test piece with a thermal expansion coefficient measuring device.

The material for forming the support 2 is not particularly limited and may be arbitrary, but the separation layer 3 described later is a material that is transmitted by light of a wavelength at which the separation layer 3 is deteriorated when the deterioration is caused by light. The formation is better. In this case, since the separation layer 3 can be irradiated with light that deteriorates the separation layer 3 through the support 2, a treatment for deteriorating the separation layer 3 can be easily performed (see FIG. 8 (B)).

The material for forming the support 2 as described above is, for example, glass, ceramic, or single crystal material. Among these, from the viewpoints of the cost of the material, the ease of obtaining the material, and the like, the forming material of the support 2 is preferably glass. In addition, when the forming material of the support 2 is glass, the composition of the glass is not particularly limited and is arbitrary. As such a glass, a conventional glass can be used.

(Separation layer)
The separation layer 3 is formed on the support 2. The separation layer 3 is formed on the laminated body 1 and is formed between the support 2 and the bonding layer 4 (substrate 5). The separation layer 3 is deteriorated by a predetermined process. Thereby, the laminated body 1 can separate the support body 2 and the substrate 5 by modifying the separation layer 3. For example, as the separation layer 3, a substance (material) that causes deterioration by the action of a compound by absorbing (heating) or deteriorating (eg, decomposing or dissolving) the separation layer 3 can be used. When the separation layer 3 is degraded by absorption of light, a treatment for specifically deteriorating the separation layer 3 can be simply performed.

In addition, in this specification, the "deterioration" of the separation layer 3 means the case where it changed to the state where the adhesive force of the layer which contacts the separation layer 3 was reduced. The separation layer 3 is preferably degraded to a state where the separation layer 3 is damaged by some external force. As a result of the deterioration, the separation layer 3 loses its strength or adhesion before the deterioration. For example, the separation layer 3 becomes brittle by being modified. The deterioration of the separation layer 3 is caused as a result of the above-mentioned predetermined processing and can be controlled. In the present embodiment, the separation layer 3 is set to move the support 2 relative to the separation layer 3 by a predetermined process, thereby deteriorating to the extent that the separation layer 3 is destroyed. Thereby, the laminated body 1 enables the substrate 5 to be easily separated from the support 2.

The material for forming the separation layer 3 is not particularly limited and is arbitrary. When the material forming the separation layer 3 is a material that is deteriorated by absorption of light, fluorocarbons, which are materials described in International Publication No. 2013/008540, can be used, and the repeating unit includes light-absorbing properties. Polymers with inorganic structures, compounds with infrared-absorbing structures, etc. In the case where the formation material of the separation layer 3 is the above-mentioned material, it is deteriorated due to absorption of light and loses its strength or adhesiveness before absorption of light, and a slight external force can be applied (for example, the support 2 is opposed to the separation layer). 3 movement, etc.) to break and easily separate the support 2 and the substrate 5. In addition, when the material forming the separation layer 3 is a material that is deteriorated by absorption of light, it is preferable that the absorption rate of light is 80% or more. When the separation layer 3 is a material that undergoes deterioration due to the absorption of light, the wavelength of the light caused by the deterioration is made arbitrary. In the case where the separation layer 3 is a material that is deteriorated by absorption of light, the separation layer 3 is deteriorated, for example, by absorbing light irradiated from a laser.

When the material forming the separation layer 3 is a material that undergoes deterioration by heating, for example, a conventional thermally decomposable resin that undergoes deterioration at a predetermined temperature may be used. In this case, the predetermined temperature at which the separation layer 3 is deteriorated can be appropriately set by the manufacturing method of the laminated body 1 and adjusted by the material of the thermally decomposable resin.

The separation layer 3 is preferably a material that is dissolved by a predetermined solvent so as to be easily removed from the substrate 5. Although the solvent that dissolves the separation layer 3 is not particularly limited and is arbitrary, for example, when the separation layer 3 is a material that deteriorates by absorbing the light described above, a primary, secondary, or tertiary aliphatic amine may be used. And amine compounds such as alicyclic amines, aromatic amines, and heterocyclic amines.

Although the thickness of the separation layer 3 is not particularly limited, a range of, for example, 0.05 μm to 50 μm is preferable. When the thickness of the separation layer 3 is in the above range, the separation layer 3 can be more reliably deteriorated by simple processing (for example, irradiation of light for a short time and irradiation of light with low energy, etc.).

(Adjacent layer)
The next layer 4 is formed on the separation layer 3. The next layer 4 is tied to the laminated body 1 and is formed between the separation layer 3 and the substrate 5. The adhesion layer 4 is used to adhere the separation layer 3 and the substrate 5.

The next layer 4 is preferably made of a thermoplastic material. In the case where the adhesive layer 4 is made of a thermoplastic material, it can be hardened by dissolving and cooling by heat, so that it is easy to handle and control during manufacture. The layer 4 preferably has a system modulus (tensile stress) of 0.05 MPa to 5.00 MPa, and more preferably 0.1 MPa to 3.00 MPa. When the modulus of the adhesive layer 4 is in the above range, the warpage of the laminated body 1 caused by the adhesive layer 4 can be suppressed.

The material for the formation of the next layer 4 is not particularly limited and is arbitrary. For example, the material for forming the adhesive layer 4 is a resin having adhesive properties. Among them, any of a hydrocarbon resin, an acrylic-styrene resin, a maleimide resin, an elastomer resin, and a polyfluorene resin. A combination of these resins is preferred. The next layer 4 is preferably a material which is dissolved by a predetermined solvent so as to be easily removed from the substrate 5. The solvent for dissolving the adhesive layer 4 is not particularly limited and is arbitrary, but may be, for example, hexane, heptane, octane, nonane, isononane, methyloctane, decane, undecane, ten Dioxane, tridecane, etc. straight chain hydrocarbons, branched chain hydrocarbons with 4 to 15 carbons, such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene, etc. Hydrocarbons such as p-menthane, o-menthane, m-menthane, diphenylmethane and the like. Such an adhesive layer 4 can be formed using, for example, TOKYO OHKA KOGYO Co., Ltd., TZNR (registered trademark) -A4017, A3007, and the like.

Although the thickness of the adhesive layer 4 is not particularly limited, for example, from the viewpoints of adhesiveness and ease of removal of the adhesive layer 4, 10 μm to 150 μm is preferable.

In addition, the adhesive layer 4 may have the characteristics of the separation layer 3 described above, that is, characteristics that are deteriorated by a predetermined process. That is, the separation layer 3 may also serve as the adhesion layer 4. In this case, the laminated body 1 may not be provided with the adhesive layer 4. The material for forming the separation layer 3 is, for example, a material that mixes light absorbing material with a resin having adhesive properties. For example, a material that mixes carbon black and the like with an acrylic ultraviolet curable resin, or an infrared absorbing material with glass bubbles. Materials such as those mixed with adhesive resin.

(Substrate)
The substrate 5 is formed on the adhesion layer 4. The substrate 5 includes a plurality of electronic parts E, a redistribution layer R (RDL (Redistribution Layer)), and a bump B that are molded (sealed) from a molding material M. The substrate 5 of the present embodiment is a sealed substrate having a fan-out package structure. The substrate 5 is singulated (cut) into a plurality of electronic devices 10 (see FIG. 9 (B)).
Here, the next layer 4 is mostly covered with a member "constituted by the combination of the molding material M and the electronic component E provided in the substrate 5".

Each electronic component E is molded from a molding material M. The molding material M is molded so as to cover the electronic component E. The molding material M is formed on each electronic component E, and the opposite surface (the surface on the + Z side) and the side surface (the surface on the ± X side and the surface on the ± Y side) of the bonding layer 4 are molded. The thickness of the molding material M is not particularly limited and is arbitrary. The forming material of the molding material M is not particularly limited and is arbitrary. The forming material of the molding material M is, for example, an epoxy resin, a silicon resin, or the like. The electronic component E is not particularly limited and is arbitrary. For example, the electronic component E is a semiconductor wafer, a MEMS (Micro Electro Mechanical Systems), a transistor, a capacitor, or a resistor. In addition, the plurality of electronic components E may be the same type or different types. The electronic component E molded from the molding material M as described above may be, for example, a plurality of electronic components E (molded wafer) molded from the molding material M, or may be a molding material. Each electronic part E molded by M. In addition, the electronic component E molded by the molding material M may be a single layer or a multilayer.

The rewiring layer R is a wiring body that constitutes a thin film to which wiring such as the terminal T of the electronic component E is connected. The rewiring layer R is formed on the dielectric Ra, and wiring is formed by the conductor Rb. The wiring structure of the redistribution layer R can be arbitrarily set. For example, the redistribution layer R may have a single-layer structure or a plurality of layers. The material of the dielectric Ra and the conductor Rb is not particularly limited and is arbitrary. The material of the dielectric Ra is, for example, a polyimide-based resin, a silicon oxide (SiO _x ), or a photosensitive resin such as a photosensitive epoxy. The material of the conductor Rb is, for example, a metal such as aluminum, copper, titanium, nickel, or gold. The thickness of the redistribution layer R is not particularly limited and is arbitrary. For example, from the viewpoint of stability and thinning of the substrate 5, the thickness is set to several μm or more and several 10 μm.

The bump B is an electrode formed by being connected to the redistribution layer R, and used for connection with other electronic parts. The shape, size, and type of the bumps B are not particularly limited and are arbitrary. The material for forming the bumps B is not particularly limited and is arbitrary, and for example, gold, silver, copper, tin, and solder materials can be used.

As described above, the substrate 5 preferably has a thermal expansion coefficient that satisfies a predetermined relationship with the thermal expansion coefficient of the support 2. The thickness of the substrate 5 is not particularly limited, but from the viewpoint of suppressing the warpage of the laminate 1, the thickness is preferably 100 μm or more and 1000 μm or less.

The above-mentioned substrate 5 is an example and may have other forms. For example, the substrate 5 only needs to include at least the electronic component E, and for example, it may not include at least one of the redistribution layer R and the bump B. The shape of the substrate 5 is arbitrary, and it may not be a layer or a plate.

(Warpage of laminate)
The laminated body 1 has a warpage amount per unit length of 10 μm / mm or less, preferably 5.0 μm / mm or less, and more preferably 3.0 μm / mm or less. In addition, "the amount of warpage per unit length" means that the maximum height difference in a predetermined cross section of the side surface of the side of the separation layer 3 of the unstacked support 2 is set to D and the length of the predetermined cross section (both ends When the distance is set to L, it is expressed by D / L. The maximum height difference D can be measured by a laser displacement meter or the like. In this way, the layered body 1 of this embodiment is suppressed from warping. Thereby, the laminated body 1 can suppress the position shift and the like, and can improve the yield of the manufactured electronic component E (electronic device 10). Therefore, the laminated body 1 is applicable to the production of the electronic device 10 and the like described later.

[Manufacturing method of laminated body]
Next, a method for manufacturing a laminated body according to this embodiment will be described. The manufacturing method of this laminated body is a method of manufacturing the laminated body 1 of this embodiment mentioned above. FIG. 2 and FIG. 3 are flowcharts showing a method for manufacturing a laminated body according to this embodiment. 4 to 6 are diagrams illustrating a method for manufacturing a laminated body according to this embodiment. In addition, in the method for manufacturing the laminated body, the characteristics of each part of the laminated body 1 (separation layer 3, adhesive layer 4, substrate 5) and the like are the same as those of the laminated body 1 of this embodiment described above. The description is appropriately omitted.

The manufacturing method of the laminated body is as shown in step S1 of FIG. 2 (A), and includes the following steps: through the separation layer 3 that is deteriorated by a predetermined process, the laminated layer is made of a molding material M The substrate 5 of the molded electronic component E and the support 2 having a thermal expansion coefficient of 3 ppm / K or more and 14 ppm / K or less.

For example, step S1 is as shown in step S2 shown in FIG. 2 (B), and includes the following steps: layering is performed in this order on the support 2, the separation layer 3, the adhesion layer 4, and the substrate 5. Step S2 is performed, for example, through steps S3 to S5 shown in FIG. 2 (B).

In step S3, the separation layer 3 is laminated on the support body 2. In step S3, first, the above-mentioned support body 2 is prepared (see FIG. 4 (A)). At this time, as described above, when (the thermal expansion coefficient of the support 2 / the thermal expansion coefficient of the substrate 5) is set to X, it is preferable that X satisfy 0.5 ≦ X ≦ 1.2.

The thermal expansion coefficient of the support 2 is preferably set based on the amount of warpage of the laminated body 1 manufactured by using a plurality of support bodies 2 having different thermal expansion coefficients. This is because the warpage of the laminated body 1 may vary depending on a plurality of materials, size, thickness, manufacturing method (processing method), etc. constituting the laminated body 1. The inventor of the present case found that, as described later as a reference example, in the laminated body 1, when the structure and manufacturing method other than the support body 2 are the same, the warpage amount of the laminated body 1 is the same as that of the support The thermal expansion coefficient of 2 is related. For example, in the case where the warpage amount of the laminate manufactured using the support 2 having a thermal expansion coefficient of A1 is W1 and the warpage amount of the laminate manufactured using the support 2 having a thermal expansion coefficient of A2 is W2, The thermal expansion coefficients (A1, A2) and the warpage amounts (W1, W2) have a correlation. With this, the thermal expansion coefficient of the support 2 used can be predicted and set based on the above-mentioned correlation, the thermal expansion coefficient of the support 2 with a reduced warpage of the laminated body 1. In this case, the warpage of the laminated body 1 can be reliably suppressed.

Next, the separation layer 3 is laminated on the prepared support 2. For example, the liquid forming the separation layer 3 in which the above-mentioned formation material of the separation layer 3 is dissolved with a solvent is applied to one surface of the support 2, and the solvent is dried and the solvent is evaporated, as shown in FIG. 4 (B As shown in Figure), the separation layer 3 is laminated on the support 2. The coating method is, for example, a method using spin coating, dipping, wheel blade, spray coating, slit coating, or the like.

Next, in step S4, the adhesion layer 4 is laminated on the separation layer 3. For example, as shown in FIG. 4 (C), the liquid for forming the adhesive layer 4 in which the formation material of the adhesive layer 4 described above is dissolved with a solvent is applied to the separation layer 3, and the solvent is dried and evaporated. Generally, the adhesion layer 4 is laminated on the separation layer 3. The coating method is the same as that in step S3. In addition, as described above, when the separation layer 3 also serves as the adhesive layer 4, step S4 may not be performed.

Next, in step S5, the substrate 5 having the electronic component E molded by the molding material M is laminated on the adhesion layer 4. In the manufacturing method of the laminated body of this embodiment, step S5 is to explain that in the manufacturing method of the fan-out package, a redistribution layer R is formed on an electronic component E called a so-called wafer priority (RDL priority). Method, but it can also be other aspects. For example, as a method of laminating the substrate 5 on the bonding layer 4, a method of laminating an electronic component E on the redistribution layer R after forming a redistribution layer R called a so-called RDL priority, or A plurality of electronic parts E (molded wafer) molded from the molding material M may be laminated on the bonding layer 4 in advance, or a plurality of each electronic part E molded from the molding material M may be laminated in advance Laminated on the next layer 4.

For example, step S5 is performed through steps S6 to S10 shown in FIG. 3. For example, in step S6, the electronic component E is laminated on the adhesion layer 4. As shown in FIG. 5 (A), a plurality of electronic components E are arranged in a predetermined arrangement on the adhesion layer 4. For example, in a predetermined arrangement, a plurality of electronic components E are arranged in advance as an adhesive support or the like, and transferred to the adhesive layer 4 to thereby laminate the electronic component E to the adhesive layer 4. The method of laminating the electronic component E on the adhesive layer 4 is not limited to the method described above and is arbitrary.

Next, in step S7 of FIG. 3, the electronic component E is molded from the molding material M. For example, by applying a coating device to cover the electronic component E, a molding material that dissolves the forming material of the molding material M described above with a solvent is applied, and the solvent is dried and the solvent is evaporated. 5 (B), the entire electronic component E is molded from the molding material M. The thermal expansion coefficient of the molding material M is preferably 4 ppm / K or more and 12 ppm / K or less, and more preferably 5 ppm / K or more and 10 ppm / K or less. In addition, the lamination of the electronic component E to the adhesive layer 4 is not limited to the method described above, and may be other methods. For example, the lamination of the electronic component E to the layer 4 can also be an electronic component molded in advance from a molding material M such as a packaging material sheet in a state where a plurality of electronic components E are arranged in a predetermined arrangement. E, and this layer is laminated on the next layer 4.

Next, in step S8 of FIG. 3, the terminal T of the electronic component E is exposed from the molding material M. For example, as shown in FIG. 5 (C), the surface (the surface on the + Z side) of the molding material M is subjected to processing such as grinding, grinding, cutting, etc., whereby the terminals of the electronic component E are removed from the molding. The material M is exposed.

Next, in step S9 of FIG. 3, a rewiring layer R is formed on the molding material M which exposes the terminal T of the electronic component E. The method for forming the redistribution layer R is not particularly limited and is arbitrary. For example, in this embodiment, first, a layer of a conductor Rb is formed on the molding material M exposing the terminal T of the electronic component E by a subtraction method, a semi-additive method, or the like, and A photoresist of a predetermined pattern is formed on the layer. After unnecessary conductor Rb is etched, the photoresist is peeled off to form a predetermined wiring pattern. Further, a protective layer of a dielectric Ra is formed on the wiring pattern. As shown in FIG. 6 (A), a redistribution layer R is formed on the dielectric Ra. The redistribution layer R is a wiring on which a conductor Rb is formed. pattern. The method for forming the redistribution layer R is not limited to the method described above, and any method can be used.

Next, in step S10 of FIG. 3, a bump B is formed on the redistribution layer R. For example, the bump B is formed by removing a predetermined portion of the dielectric Ra layer, exposing the redistribution layer R, and supplying the material of the bump B to the exposed portion. A bump B is formed on the redistribution layer R. By the above steps, the laminated body 1 of the present embodiment shown in FIG. 1 can be manufactured. Whether or not the bumps B are formed is arbitrary.

[Manufacturing method of electronic device]
Next, a method for manufacturing an electronic device according to this embodiment will be described. The manufacturing method of the electronic device is a method of manufacturing the electronic device 10 by using the laminated body 1 of the embodiment described above. FIG. 7 is a flowchart showing a method for manufacturing an electronic device according to this embodiment. 8 and 9 are diagrams illustrating a method for manufacturing an electronic device according to this embodiment. In addition, in this specification, "electronic device" means the device, an element, and a component provided with the electronic component E.

The manufacturing method of the electronic device includes: manufacturing the laminated body by the above-mentioned manufacturing method of the laminated body; deteriorating the separation layer 3 and separating the support 2 from the laminate 1; and removing the bonding layer 4 from the substrate 5 and The layer 3 is separated to obtain the electronic device 10 containing the electronic component E. The manufacturing method of the electronic device can be performed, for example, through steps S11 to S15 shown in FIG. 7.

For example, in step S11, the substrate 5 described above is supported by the support member 8. For example, the support member 8 is a member that can be used to support the substrate 5 and can be detached from the substrate 5 by using an adhesive tape (sheet) or the like.

Next, in step S12, the separation layer 3 is modified by a predetermined process. This predetermined process is determined based on the properties of the separation layer 3. For example, the predetermined treatment refers to a process of causing the separation layer 3 to absorb light when the separation layer 3 absorbs light and causing deterioration, and a process of heating the separation layer 3 if the separation layer 3 is deteriorated by heating. In the case where the separation layer 3 undergoes a degradation treatment by the compound, the compound is allowed to act (contact) on the separation layer 3. Among them, in the manufacturing method of the electronic device, the support 2 is formed of a material through which light energy is transmitted, and the separation layer 3 is formed of a material that deteriorates due to absorption of light. The predetermined treatment is performed by the support 2 and The method of irradiating light is preferably a treatment in which the separation layer 3 absorbs light. In this case, the separation layer 3 can be specifically deteriorated by a simple process. For example, as shown in FIG. 8 (B), the separation layer 3 is irradiated with light through the support 2 by generating a laser or the like with a wavelength of light that deteriorates the separation layer 3. The separation layer 3 is preferably in a state of being deteriorated to be damaged by a little external force. In addition, in FIG. 8 (B), the symbol "3a" indicates a state of deterioration.

Next, in step S13, the support body 2 is separated from the laminated body 1. In this embodiment, the separation layer 3 is degraded to a state where it is damaged by some external force. For example, as shown in FIG. 8 (C), the support body 2 is moved relative to the separation layer 3, thereby the separation layer 3 3 is broken, and the substrate 5 can be easily separated from the support 2.

Next, in step S14, the separation layer 3 and the adhesion layer 4 are removed from the substrate 5. In this embodiment, as described above, the separation layer 3 and the bonding layer 4 are set to be dissolved by a predetermined solvent, as shown in FIG. 9 (A), and processed by the predetermined solvent, thereby, from The substrate 5 removes the separation layer 3 and the adhesion layer 4. After the separation layer 3 and the adhesion layer 4 are removed, the solvent is washed and dried.

Next, in step S15, the substrate 5 is cut. For example, in step S15, as shown in FIG. 9 (B), the substrate 5 is cut in a predetermined unit. The method of cutting is not particularly limited and is arbitrary. For example, this cutting can be performed by blade cutting, laser cutting, or the like. Thereby, the electronic device 10 in which the substrate 5 of the laminated body 1 is singulated is manufactured. Since the laminated body 1 in which the warpage is suppressed is used in this embodiment, the yield of the manufactured electronic component can be improved.

As described above, the method for producing a laminated body according to this embodiment is capable of producing a laminated body in which warpage is suppressed. Moreover, in the laminated body of the present invention, warping is suppressed. In addition, since the method for manufacturing an electronic device according to this embodiment uses a laminated body in which warpage is suppressed, the yield of the manufactured electronic component can be improved.

[Example]

Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited to these examples.

[Examples 1 to 6]
In Examples 1 to 6, a multilayer body 1 shown in FIG. 1 was manufactured using a plurality of supports having different thermal expansion coefficients, and the warpage of the multilayer body 1 was evaluated.

(Manufacturing of laminated body)
The laminated body 1 of Examples 1 to 6 was manufactured by using the above-described method of manufacturing the laminated body of the present embodiment as described below. The laminated body of each Example was manufactured using the following materials. In each embodiment, the support 2 is a disc-shaped glass having a diameter of 200 mm, a thickness of 700 μm, a thermal expansion coefficient of 3.2 to 10.5 ppm / K (shown in FIG. 10). The separation layer 3 is a fluorocarbon-based separation layer with a forming material and a thickness of 0.4 μm. The next layer 4 was formed using TOKYO OHKA KOGYO Co., Ltd., TZNR (registered trademark) -A4017 (modulus 0.27 MPa) and a thickness of 30 μm. The substrate 5 is one in which a plurality of electronic components E are molded from a molding material M. In each embodiment, the thickness of the substrate 5 is set to 300 μm and 490 μm. In addition, in Examples 1 to 6, the thermal expansion coefficient of the substrate 5 is in a range of 8 to 10 ppm / K. The separation layer 3 and the adhesion layer 4 are formed by applying a material solution in which a material is dissolved by a coating device, and then heating the layer. The lamination of the substrate 5 and the adhesive layer 4 is performed by laminating a substrate 5 having a plurality of electronic components E (molded wafers) molded from a molding material M in a lamination. Body 1.

(Measurement of warpage)
The manufactured laminated body 1 was placed on a platform, and the maximum height difference D in a predetermined section of the laminated body 1 was measured by a laser displacement meter. The predetermined cross-sectional view is a radial direction of the disk-shaped laminated body 1. FIG. 10 shows the warpage of the laminated body 1 in each example. In addition, in FIG. 10, the warped “+” symbol of the laminated body 1 indicates the warpage (upward warping) of the laminated body 1 shown in FIG. 1 in a direction in which it protrudes upward. The warped "-" symbol indicates warpage (downward warpage) in a direction in which the laminated body 1 shown in FIG. 1 protrudes downward.

In addition, the warpage of the substrate 5 laminated in a state before the layer 4 was also measured by a laser displacement meter. As a result, the substrate 5 having a thickness of 300 μm is a direction (-direction) protruding downward along the center, and the maximum height difference is 2022 μm (a warpage amount per unit length of 10.1 μm / mm). The direction (+ direction) protruding upward along the center, the maximum height difference was 3429 μm (the warpage amount per unit length was 17.1 μm / mm).

In Examples 1 to 6, the amount of warpage per unit length of the laminated body 1 was determined by the following formula.
Formula: "Amount of warpage per unit length of laminated body 1" = "Absolute value of warpage of laminated body 1 (μm)" / diameter of support (200mm)
The results are shown below. It also indicates the direction of warping.
Example 1:
300μm thick substrate: 1544μm / 200mm = 7.720μm / mm (+ direction)
490μm thick substrate: 1989μm / 200mm = 9.945μm / mm (+ direction)
Example 2:
300μm thick substrate: 1665μm / 200mm = 8.325μm / mm (+ direction)
490μm thick substrate: 1602μm / 200mm = 8.010μm / mm (+ direction)
Example 3:
300μm thick substrate: 972μm / 200mm = 4.86μm / mm (+ direction)
490μm thick substrate: 1063μm / 200mm = 5.315μm / mm (+ direction)
Example 4:
300μm thick substrate: 660μm / 200mm = 3.3μm / mm (+ direction)
490μm thick substrate: 658μm / 200mm = 3.29μm / mm (+ direction)
Example 5:
300μm thick substrate: 810μm / 200mm = 4.05μm / mm (-direction)
490μm thick substrate: 222μm / 200mm = 1.11μm / mm (-direction)
Example 6:
300μm thick substrate: 2012μm / 200mm = 10.06μm / mm (-direction)
490μm thick substrate: 1842μm / 200mm = 9.21μm / mm (-direction)

(result)
It was confirmed that, as shown in FIG. 10, the laminated body 1 of the present embodiment has suppressed warpage. In addition, from the results of Examples 1 to 6, it was confirmed that the warpage of the laminated body 1 depends on the thermal expansion coefficient of the support 2 and the direction of the warp continuously changes. In addition, it was confirmed that the warpage amount of the laminated body 1 manufactured in the examples 1 to 6 using a plurality of support bodies 2 having different thermal expansion coefficients is related to the thermal expansion coefficient of the support body 2, and the layer The warpage of the product 1 is predicted to be about 6.5 and close to 0 for the thermal expansion coefficient of the support 2.

In addition, the technical scope of the present invention is not limited to those described in the embodiments and the like described above. One or more of the requirements described in the above-mentioned embodiment and the like may be omitted. In addition, the elements described in the above embodiments and the like can be appropriately combined. In addition, to the extent permitted by laws and regulations, the disclosure of all documents cited in the above-mentioned embodiments and the like is used as a part of the description in this document.

1‧‧‧ layered body

2‧‧‧ support

3‧‧‧ separation layer

4‧‧‧ Adjacent layer

5‧‧‧ substrate

8‧‧‧ support member

10‧‧‧ electronic device

B‧‧‧ bump

E‧‧‧Electronic parts

M‧‧‧Molding material

R‧‧‧ redistribution layer

Ra‧‧‧ Dielectric

Rb‧‧‧Conductor

T‧‧‧terminal

[Fig. 1] A view showing a laminated body according to an embodiment.

[Fig. 2] (A) and (B) are flowcharts showing a method for manufacturing a laminated body according to an embodiment.

[Fig. 3] Continued from Fig. 2 and shows a flowchart of a method for manufacturing a laminated body.

[Fig. 4] (A) to (C) are explanatory diagrams of a method for manufacturing a laminated body.

[Fig. 5] Continued from Fig. 4, (A) to (C) are explanatory diagrams of a method for manufacturing a laminated body.

[Fig. 6] Continued from Fig. 5, (A) and (B) are explanatory diagrams of a method for manufacturing a laminated body.

FIG. 7 is a flowchart showing a method of manufacturing an electronic device according to an embodiment.

[FIG. 8] (A) and (B) are explanatory drawings of the manufacturing method of an electronic device.

[Fig. 9] Figs. 9 (A) and (B) are diagrams for explaining a method for manufacturing an electronic device, continued from Fig. 8. [Fig.

Fig. 10 is a graph showing the amount of warpage of the laminates of Examples 1 to 6.

Claims (11)

A method for manufacturing a laminated body, which is characterized by including the following steps: A substrate having electronic parts molded from a molding material and a support having a thermal expansion coefficient of 3 ppm / K or more and 14 ppm / K or less are laminated through a separation layer that is deteriorated by a predetermined process. For example, the method for manufacturing a laminated body according to item 1 of the patent application scope includes the following steps: The support, the separation layer, the adhesion layer, and the substrate are laminated in this order. For example, the manufacturing method of the laminated body in the scope of patent application item 2, wherein, The adhesive layer is made of a thermoplastic material. For example, the manufacturing method of the laminated body in the scope of the patent application No. 2 or 3, wherein, The adhesion layer has a modulus of 0.05 MPa to 5.00 MPa. For example, a method for manufacturing a laminated body according to any one of claims 1 to 4, in which: The relationship between the thermal expansion coefficient of the support and the thermal expansion coefficient of the substrate satisfies a relationship of 0.5 ≦ (the thermal expansion coefficient of the support / the thermal expansion coefficient of the substrate) ≦ 1.2. For example, a method for manufacturing a laminated body according to any one of claims 1 to 5, in which: The thickness of the substrate is 100 μm to 1000 μm. The thickness of the support is 400 μm or more and 1200 μm or less, and is thicker than the thickness of the substrate. For example, a method for manufacturing a laminated body according to any one of claims 1 to 6, in which: The aforementioned support body is formed of a material through which light energy is transmitted, The separation layer is deteriorated by absorption of light. For example, a method for manufacturing a laminated body according to any one of claims 1 to 7, in which: The support is glass. For example, a method for manufacturing a laminated body according to any one of claims 1 to 8, in which: The substrate includes: the electronic component; and a redistribution layer connected to the electronic component. It includes the following steps: Molding the aforementioned electronic parts from a molding material; and The aforementioned redistribution layer is formed. A layered body with characteristics, It is formed by laminating a support body having a thermal expansion coefficient of 3 ppm / K or more and 14 ppm / K or less and a separation layer, an adhesive layer, and a substrate that are deteriorated by a predetermined process in this order. A method for manufacturing an electronic device is characterized in that it includes the following steps: Manufacturing the laminated body by the manufacturing method of the laminated body according to any one of claims 1 to 9; Deteriorating the separation layer and separating the support body from the laminate body; and The bonding layer and the separation layer are removed from the substrate to obtain an electronic device including the electronic component.