TW201930656A - Powder supply apparatus and plating system - Google Patents

Abstract

There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.

Description

   Powder supply device and plating system   

The present invention relates to a powder supply device and a plating system.

Conventionally, wirings are formed in fine wiring grooves, holes, or resist openings provided on the surface of a substrate such as a semiconductor wafer, or bumps (protruded electrodes) which are electrically connected to a packaged electrode or the like are formed on the substrate surface ). As a method of forming the wiring and the bump, for example, a plating method, a vapor deposition method, a printing method, a ball bump method, or the like is known, but as the number of I / Os of the semiconductor chip increases, the The pitch is usually made by a plating method that can be miniaturized and has relatively stable performance.

In an apparatus for performing electroplating, an anode and a substrate are generally oppositely disposed in a plating tank containing a plating solution, and a voltage is applied to the anode and the substrate. Thereby, a plating film is formed on the substrate surface.

Conventionally, a dissolving anode that is soluble in a plating solution or an insoluble anode that does not dissolve in a plating solution is used as an anode used in a plating apparatus. When a plating treatment is performed using an insoluble anode, metal ions in the plating solution are consumed as the plating progresses. Therefore, it is necessary to periodically replenish metal ions to the plating solution to adjust the concentration of metal ions in the plating solution. Then, there is known a device that dissolves metal powder in a plating solution stored in a plating solution tank different from the plating tank and supplies the plating solution to the plating tank (for example, refer to Patent Document 1).

    [Prior Art Literature]         [Patent Literature]    

Patent Document 1: Japanese Patent Application Laid-Open No. 2017-141503

Conventionally, when a metal powder is put into a plating liquid tank, there is a hidden danger that the powder scatters to the outside of the device and contaminates the clean room. In order to prevent contamination of the clean room, conventional devices are installed in a space different from the clean room, such as a downstairs room of the clean room. However, in the case where a space different from the clean room cannot be prepared, there is also a requirement that the device be installed in the clean room. In addition, even if the scattering of the powder is stopped inside the device, there is a problem that the scattered powder cannot be put into the plating liquid tank and wastes.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a powder supply device that prevents powder scattering as much as possible.

According to one aspect of the present invention, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. This powder supply device includes a plating solution tank configured to store a plating solution, an input pipe for inputting the powder into the plating solution tank, a gas supply line for supplying a gas, and a configuration for receiving from A spiral flow generating means for generating gas in the gas supply line and generating a spiral flow toward the plating liquid tank inside the input pipe.

According to another aspect of the present invention, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. The powder supply device includes a plating solution tank configured to store a plating solution, an input pipe for inputting the powder into the plating solution tank, and generating the tube-shaped plating to cover an outlet of the input pipe. The liquid curtain generating member of the liquid curtain covered with liquid.

According to another aspect of the present invention, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. This powder supply device includes a plating solution tank configured to store a plating solution, and a hopper storing the powder. The hopper includes an input port for feeding the powder into the hopper, and an exhaust port for discharging gas in the hopper. The powder supply device further includes a first scattering prevention member configured to prevent the powder from scattering from a gap between the input port and a charging nozzle for feeding the powder into the input port; and a configuration to prevent the powder from being discharged from the exhaust A second scattering prevention member that scatters the port.

According to another aspect of the present invention, a plating system is provided. This plating system includes: any one of the above powder supply devices; a plating tank for plating a substrate; and a plating liquid supply pipe extending from the plating liquid tank of the powder supply device to the plating tank .

1‧‧‧ plating equipment

2‧‧‧ plating tank

5‧‧‧Inner slot

6‧‧‧ Outer trough

8‧‧‧ insoluble anode

9‧‧‧ Anode cage

11‧‧‧ by the substrate holder

15‧‧‧Plating power

17‧‧‧Plating Control Department

18a, 18b‧‧‧Concentration Tester

19‧‧‧ input

20‧‧‧ Powder supply device

21‧‧‧ powder container

22‧‧‧Pure water supply pipeline

23‧‧‧Open and close valve

24‧‧‧closed cavity

25‧‧‧Pump

26‧‧‧Filter

27‧‧‧Flow regulating valve

28‧‧‧Flowmeter

29‧‧‧ put into piping

29a‧‧‧ entrance open end

29b‧‧‧ Exit Open End

30‧‧‧Feeder

30a‧‧‧spiral

30b‧‧‧Export

31‧‧‧Motor

32‧‧‧Action Control Department

33‧‧‧ Hopper

35‧‧‧plating tank

36‧‧‧Plating liquid supply pipe

36a‧‧‧four branch pipes

36b‧‧‧ branch pipe

37‧‧‧Plating liquid return tube

37a‧‧‧four discharge pipes

38‧‧‧Flowmeter

39‧‧‧Flow regulating valve

41‧‧‧ cover

42‧‧‧ exhaust port

43‧‧‧Bracket

43a‧‧‧ opening

44‧‧‧Inert gas supply line

45‧‧‧ container body

46‧‧‧ powder catheter

46a‧‧‧Nozzle

48‧‧‧ Valve

49‧‧‧handle

50‧‧‧ Spiral air flow generating member

51‧‧‧ cylindrical member

51a‧‧‧outer surface

53‧‧‧first end

54‧‧‧ second end

55‧‧‧slot

56‧‧‧Circumferential step

57‧‧‧Gas injection port

58‧‧‧Gas flow path

60‧‧‧Liquid curtain generation component

61‧‧‧Plating liquid supply pipe

62‧‧‧ the first cylindrical part

63‧‧‧Second cylindrical part

63a‧‧‧ bevel

64‧‧‧ entrance

65‧‧‧Exhaust

65a‧‧‧Part I

65b‧‧‧Part II

66‧‧‧First circumferential flow path

67‧‧‧Axial flow path

68‧‧‧Second circumferential flow path

69‧‧‧Exhaust flow path

70‧‧‧Second scattering prevention member

71‧‧‧Fixed components

72‧‧‧ Filter

74‧‧‧First scattering prevention member

75‧‧‧ flange

76‧‧‧ set screw

77‧‧‧ cylindrical member

78‧‧‧ opening

80‧‧‧ middle nozzle

81‧‧‧ flange

82‧‧‧Nozzle section

83‧‧‧hole

84‧‧‧ Bolt

85‧‧‧Fixing plate

W‧‧‧ substrate

FIG. 1 is a schematic diagram showing the entire plating system according to this embodiment.

Fig. 2 is a side view showing a powder container capable of holding copper oxide powder inside.

FIG. 3 is a side view showing a part of the powder supply device.

FIG. 4 is an enlarged perspective view of the inside of the enclosure cover shown in FIG. 3.

Fig. 5A is a perspective view of a spiral airflow generating member.

FIG. 5B is a side cross-sectional view of the spiral airflow generating member.

FIG. 6 is a side view showing an outlet opening end portion of an input pipe in the present embodiment.

Fig. 7A is a perspective view showing an example of a liquid curtain generating member.

Fig. 7B is a side sectional view of the liquid curtain generating member shown in Fig. 7A.

Fig. 7C is a schematic view showing the shape of a discharge port of the liquid curtain generating member.

Fig. 8A is a perspective view showing another example of the liquid curtain generating member.

Fig. 8B is a side sectional view of the liquid curtain generating member shown in Fig. 8A.

Fig. 9 is an enlarged side view of the vicinity of the lid of the hopper.

Fig. 10 is a perspective view of a second scattering prevention member.

Fig. 11 is a perspective view of a first scattering prevention member.

Fig. 12 is a perspective view of the hopper before the first scattering prevention member is brought into contact with the input port of the hopper.

FIG. 13 is a perspective view of the hopper after the first scattering prevention member is brought into contact with the input port of the hopper.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or equivalent components are denoted by the same reference numerals, and redundant descriptions are omitted. FIG. 1 is a schematic diagram showing the entire plating system according to this embodiment. The plating system includes: a plating device 1 installed in a clean room; and a powder supply device 20 installed in a downstairs room. The powder supply device 20 according to the present embodiment may be installed in a clean room in the same manner as the plating device 1.

In this embodiment, the plating device 1 is a plating unit for plating a metal such as copper on a substrate such as a wafer, and the powder supply device 20 is used to supply a powder containing at least a metal to a plating solution used in the plating device 1. installation. In this embodiment, an example using copper oxide powder as a powder containing at least a metal will be described. The average particle diameter of the copper oxide powder in the present embodiment is, for example, 10 μm to 200 μm. In this specification, "powder" includes objects of any shape that may be scattered, such as solid-shaped particles, formed particles, solid objects formed into particles, and solid objects formed into small-sized particles. A ball, a solid metal formed into a stripe or a strand, or a mixture of any of these.

The plating apparatus 1 according to this embodiment includes four plating tanks 2. The plating apparatus 1 can have any number of plating tanks 2. Each plating tank 2 has an inner tank 5 and an outer tank 6. An insoluble anode 8 held by an anode holder 9 is arranged in the inner tank 5. In the plating tank 2, a neutral film (not shown) is disposed around the insoluble anode 8. The inner tank 5 is filled with the plating liquid, and the plating liquid overflowing from the inner tank 5 flows into the outer tank 6. In addition, a stirrer (not shown) for stirring the plating solution can be provided in the inner tank 5. The substrate W is held by the substrate holder 11 and is immersed together with the substrate holder 11 in a plating solution in the inner tank 5. In addition, as the substrate W, a semiconductor substrate, a printed wiring board, or the like can be used.

The insoluble anode 8 is electrically connected to the positive electrode of the plating power source 15 through the anode holder 9, and the substrate W held by the substrate holder 11 is electrically connected to the negative electrode of the plating power source 15 through the substrate holder 11. When a voltage is applied between the insoluble anode 8 immersed in the plating solution and the substrate W by the plating power source 15, an electrochemical reaction occurs in the plating solution stored in the plating tank 2, and the substrate W Copper is precipitated on the surface. In this way, the surface of the substrate W is plated with copper.

The plating apparatus 1 includes a plating control unit 17 that controls the plating process of the substrate W. The plating control unit 17 has a function of calculating the concentration of copper ions contained in the plating solution in the plating tank 2 based on the integrated value of the current flowing through the substrate W. Specifically, as the substrate W is plated, copper in the plating solution is consumed. The consumption of copper is proportional to the cumulative value of the current flowing through the substrate W. The plating control unit 17 can estimate the copper ion concentration in the plating solution in each plating tank 2 based on the amount of copper input into the plating solution and the integrated value (amount of copper consumption) of the current.

The powder supply device 20 includes a closed chamber 24, a hopper 33, a feeder 30, a motor 31, a plating liquid tank 35, and an operation control unit 32. The powder container 21 containing the copper oxide powder is carried into the closed cavity 24. The hopper 33 stores copper oxide powder supplied from the powder container 21. The feeder 30 is configured to transfer powder located in a lower portion of the hopper 33. The motor 31 is a driving source of the feeder 30. The plating solution tank 35 is configured to store the plating solution and receive the copper oxide powder transferred from the feeder 30. The operation control unit 32 controls the operation of the motor 31.

The plating apparatus 1 and the powder supply apparatus 20 are connected via a plating solution supply pipe 36 and a plating solution return pipe 37. More specifically, the plating solution supply pipe 36 extends from the plating solution tank 35 to the bottom of the inner tank 5 of the plating tank 2. The plating solution supply pipe 36 is branched into four branch pipes 36 a, and the four branch pipes 36 a are respectively connected to the bottoms of the inner grooves 5 of the four plating grooves 2. A flow meter 38 and a flow control valve 39 are provided on the four branch pipes 36a, respectively. The flow meter 38 and the flow control valve 39 are communicably connected to the plating control unit 17. The plating control unit 17 is configured to control the opening degree of the flow rate adjustment valve 39 based on the flow rate of the plating solution measured by the flow meter 38. Therefore, the flow rates of the plating liquids supplied to the respective plating tanks 2 through the four branch pipes 36 a are controlled by the respective flow regulating valves 39 provided on the upstream side of the respective plating tanks 2 so that their flow rates are substantially the same. The plating liquid return pipe 37 extends from the bottom of the outer tank 6 of the plating tank 2 to the plating liquid tank 35. The plating liquid return pipe 37 has four discharge pipes 37 a connected to the bottoms of the outer tanks 6 of the four plating tanks 2, respectively.

The plating solution supply pipe 36 is provided with a pump 25 for transferring the plating solution, and a filter 26 disposed downstream of the pump 25. The plating solution used in the plating apparatus 1 is transferred to a plating solution tank 35 of the powder supply apparatus 20 through a plating solution return pipe 37. The plating solution to which the copper oxide powder is added by the powder supply device 20 is transported to the plating device 1 through the plating liquid supply pipe 36. The pump 25 can circulate the plating liquid between the plating apparatus 1 and the powder supply apparatus 20 at all times. Alternatively, a predetermined amount of the plating solution may be intermittently transferred from the plating apparatus 1 to the powder supply apparatus 20, and the plating solution to which the copper oxide powder is added may be intermittently returned from the powder supply apparatus 20 to the plating. Device 1.

Further, in order to replenish pure water (DIW: De-ionized Water) to the plating solution, the pure water supply line 22 is connected to the plating solution tank 35. The pure water supply line 22 is provided with an on-off valve 23 for stopping the supply of pure water when the plating device 1 is stopped, a flow meter 28 for measuring the flow rate of pure water, and a flow meter for adjusting the flow rate of pure water. Flow control valve 27. The on-off valve 23 is normally opened. The flow meter 28 and the flow control valve 27 are communicably connected to the plating control unit 17. When the copper ion concentration in the plating solution exceeds a set value, the plating control unit 17 controls the opening of the flow control valve 27 to supply pure water to the plating solution tank 35 in order to dilute the plating solution.

The plating control unit 17 is communicably connected to the operation control unit 32 of the powder supply device 20. When the copper ion concentration in the plating solution is lower than the set value, the plating control unit 17 is configured to send a signal indicating the replenishment request value to the operation control unit 32 of the powder supply device 20. The powder supply device 20 receives the signal, and adds copper oxide powder to the plating solution until the amount of added copper oxide powder reaches the replenishment required value. In this embodiment, the plating control unit 17 and the operation control unit 32 are configured as different devices, but in one embodiment, the plating control unit 17 and the operation control unit 32 may be configured as one control unit. In this case, the control unit may be a computer that operates in accordance with a program. The program can be stored in a storage medium.

The plating apparatus 1 may include a concentration measuring device 18a for measuring the copper ion concentration in the plating solution. The concentration measuring device 18 a is mounted on each of the four discharge pipes 37 a of the plating liquid return pipe 37. The measured value of the copper ion concentration obtained by the concentration measuring device 18 a is sent to the plating control unit 17. The plating control unit 17 may compare the copper ion concentration in the plating solution calculated from the integrated value of the current with the above-mentioned set value, or may compare the copper ion concentration measured by the concentration measuring device 18a with the above-mentioned set value. . The plating control unit 17 may be based on the copper ion concentration (that is, the estimated value of the copper ion concentration) in the plating solution estimated from the integrated value of the current and the copper ion concentration (that is, the copper ion) measured by the concentration measuring device 18a The measured value of the concentration) is compared, and the estimated value of the copper ion concentration is corrected.

In addition, a branch pipe 36b may be provided in the plating solution supply pipe 36, and a concentration measuring device 18b may be provided in the branch pipe 36b to monitor the copper ion concentration in the plating solution. In addition, an analysis device (for example, a CVS device, a colorimeter, etc.) may be provided on the branch pipe 36b to quantitatively analyze and monitor the solubility of not only copper ions but also various chemical components. Thereby, it is possible to analyze the chemical components, such as the concentration of impurities, existing in the plating solution of the plating solution supply pipe 36 before supplying the plating solution to each plating tank 2. As a result, it is possible to prevent the influence of impurities on the plating performance, and to perform plating processing with higher accuracy. Alternatively, only one of the concentration measuring devices 18a and 18b may be provided.

Fig. 2 is a side view showing a powder container 21 capable of holding copper oxide powder inside. As shown in FIG. 2, the powder container 21 includes a container main body 45 capable of accommodating copper oxide powder therein, a powder duct 46 (corresponding to an example of an injection nozzle) connected to the container main body 45, and a powder duct 46 attached thereto.的 阀 48。 The valve 48. The container body 45 is made of a synthetic resin such as polyethylene. A handle 49 is formed on the container body 45, and an operator can hold the handle 49 to carry the powder container 21.

The powder duct 46 is joined to the container body 45. The powder duct 46 is inclined at an angle of about 30 degrees with respect to the vertical direction. When the valve 48 mounted on the powder duct 46 is opened, the copper oxide powder can pass through the powder duct 46, and when the valve 48 is closed, the copper oxide powder cannot pass through the powder duct 46. FIG. 2 shows a state where the valve 48 is closed. The powder duct 46 has a nozzle 46a at its front end. A cap 47 is attached to the nozzle 46a.

Next, the powder supply device 20 shown in FIG. 1 will be described in detail. FIG. 3 is a side view showing a part of the powder supply device 20. The closed cavity 24 of the powder supply device 20 is omitted in the figure. As shown in the figure, the hopper 33 is a container for powder, and the inside thereof contains copper oxide powder supplied from the powder container 21. The hopper 33 has a circular table shape as a whole, and the copper oxide powder easily flows downward. The upper end opening of the hopper 33 is covered with a cover 41. The lid 41 has a charging port 19 and an exhaust port 42 through which the copper oxide powder is fed from the powder container 21. The exhaust port 42 communicates with the internal space of the hopper 33 and is connected to a negative pressure source (not shown). Therefore, the hopper 33 exhausts the gas in the hopper 33 through the exhaust port 42.

The feeder 30 communicates with an opening provided in a lower portion of the hopper 33. The feeder 30 is configured to supply powder from an opening in a lower portion of the hopper 33 toward an input pipe 29 (see FIG. 4) described later. In the present embodiment, the feeder 30 is a screw feeder having a screw 30a, but it is not limited to this, and an arbitrary conveying device can be used. The motor 31 is connected to the feeder 30 and is configured to drive the feeder 30. The hopper 33 and the feeder 30 are fixed to a bracket 34, and the bracket 34 is supported on the weight measuring device 40. That is, the weight measuring device 40 is configured to measure the total weight of the hopper 33, the feeder 30, the motor 31, and the copper oxide powder existing inside the hopper 33 and the feeder 30.

The exit 30 b of the feeder 30 is surrounded by a surrounding cover 43. When the feeder 31 is driven by the motor 31, the copper oxide powder in the hopper 33 is conveyed to the inside of the enclosure 43 by the feeder 30 and falls into the plating liquid tank 35. An outlet 30 b of the feeder 30 is located inside the enclosure cover 43. The powder supply device 20 includes an inert gas supply line 44 (corresponding to an example of a gas supply line). An inert gas (also called inert gas) supply line 44 passes through the enclosure cover 43 and is connected to a spiral airflow generating member 50 (see FIG. 4) described later.

The weight measuring device 40 is communicably connected to an operation control unit 32 that controls the operation of the motor 31. The measured value of the weight output from the weight measuring device 40 can be transmitted to the operation control unit 32. The operation control unit 32 receives a signal indicating a replenishment request value sent from the plating apparatus 1 (see FIG. 1), and operates the motor 31 until the amount of added copper oxide powder reaches the replenishment request value. The motor 31 drives the feeder 30, and the feeder 30 adds copper oxide powder in an amount corresponding to the replenishment request value to the plating liquid tank 35.

In the powder supply device 20 shown in FIG. 3, as described above, the weight of the feeder 30 is measured by the weight measuring device 40. Therefore, the vicinity of the exit 30 b of the feeder 30 is configured so as not to contact the enclosure cover 43. That is, a gap is formed between the vicinity of the exit 30 b of the feeder 30 and the enclosure cover 43. When the copper oxide powder falls from the outlet 30b of the feeder 30 to the plating liquid tank 35, the copper oxide powder may be scattered from the gap. The powder supply device 20 of this embodiment has a structure that suppresses this scattering.

FIG. 4 is an enlarged perspective view of the inside of the enclosure cover 43 shown in FIG. 3. As shown in FIG. 4, the enclosure cover 43 has an opening 43 a into which the feeder 30 is inserted on its side. Since the feeder 30 is not in contact with the enclosure cover 43, the copper oxide powder may be scattered from the gap between the opening 43a and the feeder 30. The powder supply device 20 includes a charging pipe 29 extending in the vertical direction from the inside of the enclosure cover 43 toward the plating liquid tank 35 shown in FIGS. 1 and 3. The input pipe 29 is preferably made of an ultra-high molecular weight polyethylene material that prevents charging. The feeding pipe 29 has an inlet opening end portion 29a for feeding powder and an outlet opening end portion 29b for discharging powder (refer to FIG. 6 described later). The inlet opening end part 29a is arrange | positioned so that it may open upwards as shown in FIG. Thereby, the copper oxide powder conveyed by the feeder 30 falls from the outlet 30b of the feeder 30, passes through the input pipe 29, and is put into the plating liquid tank 35.

In the present embodiment, in order to suppress the scattering of the copper oxide powder, a spiral airflow generating member 50 configured to generate a spiral airflow inside the input pipe 29 is provided. The spiral airflow generating member 50 receives the inert gas from the inert gas supply line 44 and generates a spiral airflow toward the plating liquid tank 35.

FIG. 5A is a perspective view of the spiral airflow generating member 50. FIG. 5B is a side sectional view of the spiral airflow generating member 50. As shown in FIG. 5A, the spiral airflow generating member 50 is attached to the inlet opening end portion 29 a of the input pipe 29. As shown in FIGS. 5A and 5B, the spiral airflow generating member 50 includes a cylindrical member 51 having a substantially cylindrical shape, and an annular member 52 that is attached to or integrally formed with the cylindrical member 51. In FIG. 5A, the ring-shaped member 52 and the input pipe 29 are shown in a cross-section.

As shown in FIG. 5A, in a state where the spiral airflow generating member 50 is mounted on the input pipe 29, the outer surface 51 a of the cylindrical member 51 is configured to be in contact with the inner surface of the input pipe 29. The cylindrical member 51 has a first end portion 53 (lower end portion in the figure) on the plating liquid tank 35 side, and a second end portion 54 (upper end portion in the figure) on the opposite side. In the present embodiment, the cylindrical member 51 is partially inserted into the insertion pipe 29, and is arranged so that the second end portion 54 protrudes from the insertion pipe 29.

The cylindrical member 51 has one or more grooves 55 extending from the first end portion 53 toward the second end portion 54 on the outer surface 51 a thereof. In other words, the groove 55 reaches at least the first end portion 53 and may or may not reach the second end portion 54. In the present embodiment, a plurality of grooves 55 are formed on the outer surface 51a. As shown in the drawing, the groove 55 is configured to be inclined with respect to the axial direction of the cylindrical member 51. The grooves 55 are each configured to be inclined at the same angle as each other. In addition, it is desirable that the angle, width, and depth of the groove 55 be appropriately set in accordance with the inner diameter, length, and the like of the input pipe 29. When the cylindrical member 51 is partially inserted into the input pipe 29, a plurality of channels inclined with respect to the axial direction of the cylindrical member 51 are divided by the groove 55 of the cylindrical member 51 and the inner surface of the input pipe 29.

Further, the cylindrical member 51 has a circumferential step portion 56 extending in the circumferential direction. In the present embodiment, the circumferential step portion 56 is formed on the second end portion 54 of the cylindrical member 51. Thereby, the circumferential gas flow path 58 communicating with the groove 55 is divided by the cylindrical member 51 and the annular member 52 (refer to FIG. 5B). The annular member 52 has a gas injection port 57 connected to the inert gas supply line 44 on the upper surface (the upper surface in the figure). The gas injection port 57 communicates with a circumferential gas flow path 58 of the cylindrical member 51.

Next, the function of the spiral airflow generating member 50 will be described. When an inert gas is supplied from the inert gas supply line 44 to the gas injection port 57, the inert gas passes through the circumferential gas flow path 58 and reaches each of the plurality of grooves 55. Thereby, the pressure of the inert gas passing through the groove 55 can be made uniform. The inert gas passes through the groove 55 and is discharged from the first end portion 53 of the cylindrical member 51 into the input pipe 29. At this time, since the groove 55 is inclined with respect to the axial direction of the cylindrical member 51, a spiral airflow (spiral airflow) is generated in the input pipe 29 by the inert gas. The spiral airflow generated in the input pipe 29 is discharged from the outlet opening end portion 29b (refer to FIG. 6 described later) of the inlet pipe 29 while the air in the enclosure 43 is introduced into the input pipe 29. Thereby, the copper oxide powder of the ambient gas existing in the enclosure 43 can be introduced into the input pipe 29, and the scattering of the copper oxide powder can be suppressed. In addition, the spiral airflow generated in the input pipe 29 can prevent the copper oxide powder passing through the inside of the input pipe 29 from coming into contact with the inner wall surface of the input pipe 29. This can prevent the copper oxide powder from adhering to the inner wall surface of the input pipe 29.

As described above, in the present embodiment, the spiral airflow can be generated inside the input pipe 29 by the spiral airflow generating member 50, so that the scattering of the powder in the surrounding cover 43 can be suppressed. In addition, according to the present embodiment, it is possible to suppress the powder from adhering to the input pipe 29.

In the present embodiment, the cylindrical member 51 has a groove 55 on its outer surface 51a, and a spiral airflow is generated by supplying gas to the groove 55. Therefore, according to the spiral airflow generating member 50 of this embodiment, a spiral airflow can be generated with a very simple structure. In the present embodiment, the inert gas supply line 44 is connected to the gas injection port 57, and the inert gas is directly supplied into the input pipe 29 via the spiral airflow generating member 50. When the inert gas is supplied into the space in the enclosure 43, the powder of the ambient gas existing in the enclosure 43 may be scattered. Therefore, in this embodiment, it is possible to suppress the scattering of the powder in the envelope 43 as compared with the case where an inert gas is supplied to the space inside the envelope 43.

For example, when the spiral airflow generating member 50 is provided at the middle portion in the longitudinal direction of the input pipe 29, the spiral airflow is not generated inside the input pipe 29 on the inlet opening end portion 29a side of the spiral airflow generating member 50. In this case, powder may adhere to the inner wall of the input pipe 29 on the inlet opening end portion 29 a side of the spiral airflow generating member 50. In the present embodiment, the spiral airflow generating member 50 is provided at the inlet opening end portion 29 a of the input pipe 29. Thereby, a spiral airflow can be generated in the whole inside of the input pipe 29, and it can suppress that powder adheres to the whole inside of the input pipe 29.

In this embodiment, an inert gas is supplied into the input pipe 29. When the plating solution stored in the plating solution tank 35 is maintained at a high temperature (for example, about 45 ° C.), vapor is generated from the plating solution. This vapor rises in the input pipe 29 and reaches the inside of the enclosure cover 43, and may enter the feeder 30. When the vapor is adsorbed on the copper oxide powder in the feeder 30, there is a hidden danger that the copper oxide powder aggregates and blocks the feeder 30. Therefore, by supplying an inert gas into the input pipe 29, it is possible to prevent the vapor of the plating solution from entering the feeder 30.

Next, a structure for suppressing the scattering of the copper oxide powder in the vicinity of the end portion on the plating liquid tank 35 side of the feeding pipe 29 will be described. Fig. 6 is a side view showing an outlet opening end portion 29b of the input pipe 29 in the present embodiment. As shown in FIG. 6, the input pipe 29 has an outlet opening end portion 29 b. When the inert gas from the inert gas supply line 44 is discharged from the outlet opening end portion 29 b of the input pipe 29, it diffuses due to the pressure difference between the inside and the outside of the input pipe 29. Therefore, the copper oxide powder charged into the charging pipe 29 is scattered due to the diffusion of the inert gas, and may be attached to the wall surface of the plating liquid tank 35. Therefore, in the present embodiment, as shown in FIG. 6, the liquid curtain generating member 60 is provided with a liquid curtain that generates a cylindrical plating solution so as to cover the outlet of the input pipe 29. A plating liquid supply line 61 is connected to the liquid curtain generating member 60 to supply a plating liquid. The plating liquid supply line 61 may be connected to, for example, the plating liquid return pipe 37 shown in FIG. 1, or may be configured to extract the plating liquid in the plating liquid tank 35 by a pump or the like and feed it to the liquid curtain generating member. 60 supply.

Next, a detailed configuration of the liquid curtain generating member 60 will be described. FIG. 7A is a perspective view showing an example of the liquid curtain generating member 60. Fig. 7B is a side sectional view of the liquid curtain generating member 60 shown in Fig. 7A. FIG. 7C is a schematic view showing a shape of a discharge port of the liquid curtain generating member 60. As shown in Figs. 7A and 7B, the liquid curtain generating member 60 is a ring-shaped member as a whole, and is configured to be mounted on the outer peripheral surface of the input pipe 29. As shown in detail in FIG. 7B, the liquid curtain generating member 60 includes a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 has an inlet 64 for supplying a plating solution to the liquid curtain generating member 60. A discharge port 65 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 to discharge the plating solution in a liquid curtain shape. The inlet 64 may be formed in the first cylindrical portion 62.

A flow path is formed between the inlet 64 and the discharge port 65 through which the plating solution flows. In the present embodiment, the flow path is configured by a first circumferential flow path 66, an axial flow path 67, a second circumferential flow path 68, and a discharge flow path 69. The first circumferential flow path 66 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in a circumferential direction, and communicates with the inlet 64. The axial flow path 67 communicates with the first circumferential flow path 66. In the present embodiment, a plurality of axial flow paths 67 are arranged at substantially equal intervals along the circumferential direction of the liquid curtain generating member 60. The second circumferential flow path 68 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in the circumferential direction, and communicates with each of the axial flow channels 67. The second circumferential flow path 68 is configured not only to flow the plating liquid in the circumferential direction but also to flow radially outward. The discharge flow path 69 communicates with the radially outer side of the second circumferential flow path 68, and fluidly communicates the second circumferential flow path 68 and the discharge port 65. Here, the axial direction refers to the central axis direction of the first cylindrical portion 62 and the second cylindrical portion 63.

As shown in FIG. 7C, the discharge port 65 of the present embodiment extends in the entire circumferential direction between the first cylindrical portion 62 and the second cylindrical portion 63. In other words, the discharge port 65 has a substantially annular cross section as a whole. In addition, FIG. 7C shows a shape in a cross section orthogonal to the axial direction of the liquid curtain generating member 60. The discharge port 65 has a first portion 65a having a first radial width, and a second portion 65b having a second radial width larger than the first radial width. Specifically, the shape of the first portion 65a is a substantially fan shape, and the shape of the second portion 65b is a substantially circular shape. Here, the fan shape refers to a shape surrounded by two radii of a circle and two arcs between the two radii. In this embodiment, the discharge port 65 is composed of a plurality of first portions 65a and a plurality of second portions 65b, and has a substantially annular cross section as a whole. In other words, the discharge port 65 is configured such that the first portion 65a having a substantially fan shape connects the second portions 65b having a substantially circular shape. As shown in FIG. 7C, the plurality of second portions 65b are preferably arranged at substantially equal intervals in the circumferential direction.

The function of the liquid curtain generating member 60 shown in FIGS. 7A to 7C will be described. When the plating liquid is supplied from the plating liquid supply line 61 shown in FIG. 6 to the inlet 64 of the liquid curtain generating member 60, the plating liquid passes through the first circumferential flow path 66 and spreads throughout the liquid curtain generating member 60. All week. The plating solution spreading over the entire circumference then passes through the plurality of axial flow paths 67 and moves in the axial direction. This changes the flow direction of the plating solution. Next, the plating liquid that has passed through the axial flow path 67 passes through the second circumferential flow path 68 and spreads over the entire periphery of the liquid curtain generating member 60 again. At this time, the pressure of the plating solution is dispersed approximately uniformly throughout the entire periphery of the liquid curtain generating member 60. The plating solution that has reached the second circumferential flow path 68 passes through the second circumferential flow path 68 and flows outward in the circumferential direction and the radial direction, and reaches the discharge flow path 69. The plating solution that has reached the discharge flow path 69 passes through the discharge port 65 to generate a liquid curtain of a substantially cylindrical plating solution.

According to the liquid curtain generating member 60 described above, a liquid curtain of a cylindrical plating solution can be generated so as to cover the outlet of the input pipe 29. This can prevent the copper oxide powder from being scattered and attached to the wall surface of the plating liquid tank 35 due to the diffusion of the inert gas when the copper oxide powder is discharged from the input pipe 29. In this embodiment, the inert gas is supplied to the input pipe 29. However, if the inert gas is not supplied to the input pipe 29, the copper oxide powder discharged from the input pipe 29 may adhere to the wall surface of the plating tank 35. Specifically, for example, when the copper oxide powder collides with the plating liquid when it collides with the plating liquid surface, the copper oxide powder may be scattered around, and the copper oxide powder may adhere to the wall surface of the plating liquid tank 35. Therefore, according to the liquid curtain generating member 60 of this embodiment, even when an inert gas is not supplied to the input pipe 29, it is possible to suppress the scattering of the copper oxide powder when the copper oxide powder collides with the plating liquid surface.

In addition, the liquid curtain generating member 60 has a discharge port 65 including a first portion 65a and a second portion 65b. When the discharge port 65 has a simple ring shape having a fixed width, it is difficult to generate a continuous liquid curtain of the plating solution. In addition, when a plurality of axial flow paths are arranged at intervals in the circumferential direction to constitute the discharge port 65, a shower-like plating solution is discharged, and it is difficult to generate a liquid curtain of the plating solution. Since the discharge port 65 of the present embodiment includes the first portion 65a and the second portion 65b, it is possible to stably generate a liquid curtain of a continuous plating solution. In addition, the discharge ports 65 have a plurality of second portions 65b at substantially equal intervals in the circumferential direction, whereby a continuous liquid curtain of the plating solution can be generated more stably.

The liquid curtain generating member 60 of the present embodiment has the first circumferential flow path 66 and the axial flow path 67. Therefore, it is possible to cause the plating liquid supplied from the inlet 64 to spread throughout the entire circumferential direction of the liquid curtain generating member 60 at the same time. Its flow direction changes. In addition, since the liquid curtain generating member 60 has the second circumferential flow path 68, the pressure of the plating solution can be evenly distributed throughout the entire circumference.

Next, a modification of the liquid curtain generating member 60 will be described. FIG. 8A is a perspective view showing another example of the liquid curtain generating member 60. Fig. 8B is a side sectional view of the liquid curtain generating member 60 shown in Fig. 8A. As shown in FIG. 8A and FIG. 8B, the liquid curtain generating member 60 of this example is a ring-shaped member as a whole similar to the liquid curtain generating member 60 shown in FIGS. 7A to 7C, and is configured to be installed in the input pipe. The outer peripheral surface of 29. As shown in detail in Fig. 8B, the liquid curtain generating member 60 includes a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 has an inlet 64 for supplying a plating solution to the liquid curtain generating member 60. A discharge port 65 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 to discharge the plating solution in a liquid curtain shape. The inlet 64 may be formed in the first cylindrical portion 62. The first cylindrical portion 62 is longer in the axial direction than the second cylindrical portion 63. Specifically, in a state where the liquid curtain generating member 60 is mounted on the input pipe 29, the first cylindrical portion 62 faces the plating liquid tank 35 side than the discharge port 65 (downward directions in FIGS. 8A and 8B). )extend.

A flow path through which the plating solution flows is formed between the inlet 64 and the discharge port 65. In the example shown in the figure, the flow path is configured by a first circumferential flow path 66, an axial flow path 67, and a discharge flow path 69. The first circumferential flow path 66 is formed between the first cylindrical portion 62 and the second cylindrical portion 63 in a circumferential direction, and communicates with the inlet 64. The axial flow path 67 communicates with the first circumferential flow path 66. In the illustrated example, a plurality of axial flow paths 67 are arranged at substantially equal intervals along the circumferential direction of the liquid curtain generating member 60, and each of the axial flow paths 67 and the radially outer side of the first circumferential flow path 66 are radially outward. Connected. The discharge flow path 69 is a flow path that fluidly communicates the axial flow path 67 and the discharge port 65.

The discharge port 65 of the present embodiment extends between the first cylindrical portion 62 and the second cylindrical portion 63 in the entire circumferential direction. The discharge port 65 has a substantially annular cross section as a whole, and the radial width (ring thickness) of the discharge port 65 is substantially constant. The second cylindrical portion 63 has an inclined surface 63 a inclined on the inner peripheral surface thereof so that the distance from the first cylindrical portion 62 becomes closer toward the discharge port 65. On the other hand, the surface of the first cylindrical portion 62 facing the inclined surface 63 a of the second cylindrical portion 63 has a fixed outer diameter. Therefore, the discharge flow path 69 is gradually narrowed toward the discharge port 65 by the inclined surface 63 a of the second cylindrical portion 63.

The function of the liquid curtain generating member 60 shown in FIGS. 8A and 8B will be described. When the plating liquid is supplied from the plating liquid supply line 61 shown in FIG. 6 to the inlet 64 of the liquid curtain generating member 60, the plating liquid passes through the first circumferential flow path 66 and spreads throughout the liquid curtain generating member 60. All week. The plating solution spreading over the entire circumference then passes through the plurality of axial flow paths 67 and moves in the axial direction. This changes the flow direction of the plating solution. Next, the plating solution that has passed through the axial flow path 67 reaches the discharge flow path 69. The plating solution that has reached the discharge flow path 69 passes through the discharge flow path 69 that gradually narrows toward the discharge port 65 and is discharged from the discharge port 65 while the flow rate increases. The plating solution discharged from the discharge port 65 is pressurized by a narrowing discharge flow path 69, thereby generating a liquid curtain of a substantially cylindrical plating solution.

According to the liquid curtain generating member 60 described above, a liquid curtain of a cylindrical plating solution can be generated so as to cover the outlet of the input pipe 29. This can prevent the copper oxide powder from being scattered and attached to the wall surface of the plating liquid tank 35 due to the diffusion of the inert gas when the copper oxide powder is discharged from the input pipe 29. In the present embodiment, the inert gas is supplied to the input pipe 29. However, if the inert gas is not supplied to the input pipe 29, the copper oxide powder discharged from the input pipe 29 may adhere to the wall surface of the plating liquid tank 35. Specifically, for example, when the copper oxide powder collides with the plating liquid when it collides with the plating liquid surface, the copper oxide powder may be scattered around, and the copper oxide powder may adhere to the wall surface of the liquid tank 35. Therefore, according to the liquid curtain generating member 60 of this embodiment, even when an inert gas is not supplied to the input pipe 29, it is possible to suppress the scattering of the copper oxide powder when the copper oxide powder collides with the plating liquid surface.

In addition, the liquid curtain generating member 60 has an inclined surface 63 a in the second cylindrical portion 63, and the discharge flow path 69 gradually narrows toward the discharge port 65. Thereby, a pressure in a direction toward the outer peripheral surface of the first cylindrical portion 62 is generated in the plating solution passing through the discharge flow path 69, and the flow velocity and pressure of the plating solution can be increased. Since the first cylindrical portion 62 extends downward (the plating solution tank 35 side) from the discharge port 65, the plating liquid discharged from the discharge port 65 flows along the outer peripheral surface of the first cylindrical portion 62. This makes it possible to stably generate a liquid curtain of a continuous plating solution in the circumferential direction.

Next, a structure for suppressing the scattering of copper oxide powder near the lid 41 of the hopper 33 will be described. FIG. 9 is an enlarged side view of the vicinity of the lid 41 of the hopper 33. When the copper oxide powder is charged into the input port 19 of the hopper 33 from the powder container 21, the copper oxide powder may be scattered outside the hopper 33 from the gap between the powder duct 46 of the powder container 21 and the input port 19. In addition, when the copper oxide powder is put into the hopper 33, the gas inside the hopper 33 is exhausted from the exhaust port 42, and the copper oxide powder in the hopper 33 may be scattered from the exhaust port 42 to the outside of the hopper 33. Therefore, in this embodiment, as shown in FIG. 9, the powder supply device 20 includes a first scattering prevention member 74 for preventing the copper oxide powder from scattering from a gap between the input port 19 of the hopper 33 and the powder duct 46. And a second scattering prevention member 70 for preventing the copper oxide powder from scattering from the exhaust port 42 of the hopper 33.

As shown in FIG. 9, the powder supply device 20 according to the present embodiment includes an intermediate nozzle 80 that receives copper oxide powder input from the nozzle 46 a of the powder duct 46 and inputs the copper oxide powder into the input port 19 of the hopper 33. . In the present embodiment, the first scattering prevention member 74 is provided in the intermediate nozzle 80. In other embodiments, the copper oxide powder may be directly input from the powder duct 46 of the powder container 21 to the input port 19 of the hopper 33 without providing the intermediate nozzle 80. In this case, the first scattering prevention member 74 is provided in the powder duct 46.

FIG. 10 is a perspective view of the second scattering prevention member 70. As shown in FIG. 10, the second scattering prevention member includes a filter 72 that closes the exhaust port 42, and a fixing member 71 that fixes the filter 72 to the exhaust port 42. In the present embodiment, any filter that can capture copper oxide powder, such as a filter cloth filter, can be used as the filter 72. In this embodiment, a substantially cylindrical member that presses the filter 72 against the exhaust port 42 is used as the fixing member 71.

FIG. 11 is a perspective view of the first scattering prevention member 74. As shown in FIG. 11, the first scattering prevention member 74 includes a cylindrical member 77 and a flange portion 75 extending from the cylindrical member 77 in the radial direction. The cylindrical member 77 is configured to fit into the powder duct 46 or the intermediate nozzle 80. The first scattering prevention member 74 can be fixed to the powder duct 46 or the intermediate nozzle 80 by a fixing screw 76. The flange portion 75 has a plurality of openings. In the present embodiment, four openings are provided in the flange portion 75. The plurality of openings are closed by a filter 72. In addition, an opening 78 is formed inside the cylindrical member 77, and the powder duct 46 or the intermediate nozzle 80 is inserted into the opening 78.

Next, a process for putting copper oxide powder into the hopper 33 from the powder container 21 will be described. FIG. 12 is a perspective view of the hopper 33 before the first scattering prevention member 74 is brought into contact with the input port 19 of the hopper 33. FIG. 13 is a perspective view of the hopper 33 after the first scattering prevention member 74 is brought into contact with the input port 19 of the hopper 33. As shown in FIG. 12, the powder supply device 20 includes a fixing plate 85 extending in the horizontal direction, and a plurality of bolts 84 screwed to the fixing plate 85. The fixed plate 85 is arranged so that no load is applied to the weight measuring device 40 shown in FIG. 3.

As shown in FIG. 12, the intermediate nozzle 80 includes a flange portion 81 and a nozzle portion 82 (corresponding to an example of an injection nozzle) extending from the flange portion 81. The first scattering prevention member 74 is attached to the nozzle portion 82 of the intermediate nozzle 80. The flange portion 81 has a plurality of holes 83 through which the bolts 84 can pass. In the state shown in FIG. 12, the plurality of bolts 84 support the flange portion 81 from below, and the filter 72 (see FIG. 11) of the first scattering prevention member 74 is not in contact with the inlet 19 of the hopper 33. Therefore, when the copper oxide powder is not put into the hopper 33, the first scattering prevention member 74 attached to the intermediate nozzle 80 is not in contact with the hopper 33, so the intermediate is not applied to the weight measuring device 40 shown in FIG. 3 The weight of the nozzle 80 and the first scattering prevention member 74.

As shown in FIG. 13, when the copper oxide powder is charged into the hopper 33, first, the intermediate nozzle 80 is rotated by a predetermined angle in the circumferential direction, and the bolt 84 is passed through the hole 83 of the flange portion 81. The intermediate nozzle 80 moves toward the hopper 33, and the first scattering prevention member 74 is in contact with the input port 19 of the hopper 33. Thereby, the filter 72 of the first scattering prevention member 74 prevents the copper oxide powder from being scattered from the gap between the intermediate nozzle 80 and the input port 19 of the hopper 33.

If the intermediate nozzle 80 is not provided, and the first scattering prevention member 74 is provided on the powder duct 46 of the powder container 21, the powder duct 46 is inserted into the input port 19 until the first scattering prevention member 74 is filtered. The device 72 is in contact with the input port 19 and opens the valve 48 (see FIG. 2). Thereby, the filter 72 of the first scattering prevention member 74 prevents the copper oxide powder from scattering from the gap between the powder duct 46 of the powder container 21 and the input port 19 of the hopper 33.

In another embodiment, the first scattering prevention member 74 may be attached to the input port 19 of the hopper 33 in advance. In this case, the copper oxide powder can be inserted into the nozzle member 82 of the intermediate nozzle 80 or the nozzle 46 a of the powder duct 46 of the powder container 21 into the cylindrical member 77 of the first scattering prevention member 74 attached to the inlet 19. Put into the hopper 33. In this case, the weight of the hopper 33 and the like including the weight of the first scattering prevention member 74 is controlled in advance.

In the above embodiment, a powder supply device provided separately from the plating device has been described. However, the present invention is also applicable to a case where the copper oxide powder is directly supplied to a plating tank provided in the plating device. The powder containing the metal to be supplied to the plating solution is not limited to copper oxide, and may include various metals such as nickel.

As mentioned above, although embodiment of this invention was described, embodiment of the said invention is an embodiment for easy understanding of this invention, and is not intended to limit the embodiment of this invention. The present invention can be changed and improved without departing from the gist thereof, and the present invention naturally includes its equivalents. In addition, within a range that can solve at least a part of the problems described above, or a range that achieves at least a part of the effects, any combination or omission of each structural element described in the claims and the specification can be performed.

Several modes disclosed in this specification are described below.

According to the first aspect, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. This powder supply device includes a plating solution tank configured to store a plating solution, an input pipe for inputting the powder into the plating solution tank, a gas supply line for supplying a gas, and a configuration for receiving from A spiral flow generating means for generating gas in the gas supply line and generating a spiral flow toward the plating liquid tank inside the input pipe.

According to a second aspect, in the powder supply device according to the first aspect, the spiral airflow generating member has a cylindrical member having an outer surface configured to contact an inner surface of the input pipe, and the cylindrical member The first end portion on the plating tank side and the second end portion on the side opposite to the first end portion are provided on the outer surface and extend from the first end portion toward the second end portion. The groove is configured such that gas from the gas supply line passes through the groove of the cylindrical member.

According to a third aspect, in the powder supply device of the second aspect, the groove is formed so as to be inclined with respect to the axial direction of the cylindrical member.

According to a fourth aspect, in the powder supply device according to the second or third aspect, the spiral airflow generating member further includes an air flow path extending in a circumferential direction and communicating with the groove, and connected to the gas supply line and connected to the gas supply line. An air injection port through which the air flow path communicates.

According to a fifth aspect, in any one of the first to fourth aspects of the powder supply device, the feeding pipe has an inlet opening end portion for feeding the powder, and an outlet opening end portion for discharging the powder, and the spiral airflow generating member. It is provided in the said inlet opening end part of the said input piping.

According to a sixth aspect, the powder supply device according to any one of the first to fifth aspects includes: a hopper configured to store the powder; and a device configured to supply the powder from an opening provided in a lower portion of the hopper toward the input pipe. Feeder.

According to a seventh aspect, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. The powder supply device includes a plating solution tank configured to store a plating solution, an input pipe for inputting the powder into the plating solution tank, and generating the tube-shaped plating to cover an outlet of the input pipe. The liquid curtain generating member of the liquid curtain covered with liquid.

According to an eighth aspect, in the powder supply device according to the seventh aspect, the liquid curtain generating member has a first cylindrical portion and a second cylindrical portion located outside the first cylindrical portion, and is provided in the first cylindrical shape. A discharge port through which the plating solution is discharged is formed between the portion and the second cylindrical portion, and the discharge port extends between the first cylindrical portion and the second cylindrical portion in the entire circumferential direction, and the liquid curtain A cross section orthogonal to the axial direction of the generating member includes: a first portion having a first radial width; and a second portion having a second radial width larger than the first radial width.

According to a ninth aspect, in the powder supply device according to the eighth aspect, the discharge port includes a plurality of the second portions, and the plurality of the second portions are arranged at substantially equal intervals in the circumferential direction.

According to a tenth aspect, in the powder supply device according to the seventh aspect, the liquid curtain generating member includes: a first cylindrical portion; a second cylindrical portion positioned outside the first cylindrical portion; and formed on the first A discharge port between the cylindrical portion and the second cylindrical portion is formed between the first cylindrical portion and the second cylindrical portion, and a discharge flow path communicates with the discharge port and discharges the plating solution. The second cylindrical portion has an inclined surface inclined on the inner peripheral surface of the second cylindrical portion so that the distance between the second cylindrical portion and the first cylindrical portion becomes closer toward the discharge port, and the discharge flow path passes through the second cylindrical portion. The inclined surface is configured to gradually narrow toward the discharge port.

According to an eleventh aspect, in the powder supply device according to the tenth aspect, the first cylindrical portion extends toward the plating solution tank side than the discharge port.

According to a twelfth aspect, in any one of the eighth to eleventh powder supply devices, the liquid curtain generating member has: an inlet of the plating solution; and a communication with the inlet, and the first cylindrical portion communicates with the above. A first circumferential flow path extending in the circumferential direction between the second cylindrical portions.

According to a thirteenth aspect, in the powder supply device according to the twelfth aspect, the liquid curtain generating member has a plurality of axial flow paths communicating with the first circumferential flow path.

According to a fourteenth aspect, in the powder supply device according to the twelfth aspect, the liquid curtain generating member is in communication with each of the axial flow paths, and is provided in a circumferential direction between the first cylindrical portion and the second cylindrical portion. The extended second circumferential flow path communicates with the discharge port.

According to a fifteenth aspect, in the powder supply device according to the thirteenth aspect, the plurality of axial flow paths communicate with the discharge flow path.

According to a sixteenth aspect, the powder supply device according to any one of the seventh to fifteenth aspects includes a gas supply line for supplying a gas into the input pipe.

According to a seventeenth aspect, there is provided a powder supply device for supplying a powder including a metal used for plating to a plating solution. This powder supply device includes a plating solution tank configured to store a plating solution, and a hopper containing the powder, the hopper having an input port for putting the powder into the hopper, and a gas exhausting the gas in the hopper. The exhaust port, the powder supply device further includes: a first scattering prevention member configured to prevent the powder from scattering from a gap between the input port and a charging nozzle for feeding the powder into the input port; and configured to prevent the powder from scattering. A second scattering prevention member in which powder is scattered from the exhaust port.

According to an eighteenth aspect, in the powder supply device according to the seventeenth aspect, the first scattering prevention member includes a filter cloth filter and is attached to the input port or the input nozzle.

According to a nineteenth aspect, in the powder supply device according to the seventeenth or eighteenth aspect, the second scattering prevention member includes a filter cloth filter and is attached to the exhaust port.

According to a twentieth aspect, in the powder supply device according to any of the seventeenth to nineteenth aspects, the charging nozzle is a nozzle of a powder container that stores powder.

According to a 21st aspect, in any one of the 17th to 19th powder supply apparatuses, there is an intermediate nozzle which receives the powder fed from a nozzle of a powder container that stores the powder, and inputs the powder into the hopper input port. Powder, the charging nozzle is the intermediate nozzle.

According to a twenty-second aspect, in the powder supply device according to the twenty-first aspect, the first scattering prevention member is attached to the intermediate nozzle, and the first scattering prevention member and the hopper are configured when the powder is charged into the hopper. Put into contact.

According to a 23rd aspect, a plating system is provided. This plating system includes: any one of the first to 22th powder supply devices; a plating tank for plating a substrate; and a plating tank extending from the plating liquid tank of the powder supply apparatus to the plating tank. Plating liquid supply pipe.

Claims (23)

    A powder supply device for supplying a powder containing a metal used for plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive a plating solution; A piping for supplying the powder; a gas supply pipe for supplying gas; and a spiral airflow generation configured to receive a gas from the gas supply pipe and generate a spiral airflow toward the plating tank inside the piping pipe member.         The powder supply device according to claim 1, wherein the spiral airflow generating member has a cylindrical member having an outer surface configured to contact an inner surface of the input pipe, and the cylindrical member The member has the first end portion on the plating tank side and the second end portion on the side opposite to the first end portion, and has an outer surface from the first end portion toward the second end portion. In the extended groove, the powder supply device is configured such that gas from the gas supply line passes through the groove of the cylindrical member.         The powder supply device according to item 2 of the patent application scope, wherein the groove is formed to be inclined with respect to an axial direction of the cylindrical member.         The powder supply device according to item 2 of the scope of patent application, wherein the spiral airflow generating member further has an air flow path extending in the circumferential direction and communicating with the groove, and is connected to the gas supply pipe and is connected to the air flow. The air injection port connected to the road.         The powder supply device according to item 1 of the patent application scope, wherein the input pipe has an inlet opening end portion for inputting the powder and an outlet opening end portion for discharging the powder, and the spiral airflow generating member is provided at the input The inlet opening end of the piping.         The powder supply device according to item 1 of the patent application scope further includes a hopper configured to store the powder, and a feeder configured to supply the powder from an opening provided in a lower portion of the hopper toward the input pipe.         A powder supply device is a supplier for supplying a powder containing a metal used for plating to a plating solution. The powder supplying device includes: a plating liquid tank configured to store a plating liquid; and a method for feeding the powder into the plating liquid tank. And a liquid curtain generating member that generates a cylindrical liquid curtain of the plating solution so as to cover the outlet of the input pipeline.         The powder supply device according to item 7 of the patent application scope, wherein the liquid curtain generating member has a first cylindrical portion and a second cylindrical portion located outside the first cylindrical portion, and the first cylindrical portion A discharge port through which the plating solution is discharged is formed between the cylindrical portion and the second cylindrical portion. The discharge port extends along the entire circumferential direction between the first cylindrical portion and the second cylindrical portion. The cross section orthogonal to the axial direction of the liquid curtain generating member includes: a first portion having a first radial width; and a second portion having a second radial width larger than the first radial width.         The powder supply device according to item 8 of the patent application scope, wherein the discharge port has a plurality of the second portions, and the plurality of the second portions are arranged at substantially equal intervals in the circumferential direction.         The powder supply device according to item 7 of the scope of patent application, wherein the liquid curtain generating member includes: a first cylindrical portion; a second cylindrical portion located outside the first cylindrical portion; and formed in the first A discharge port between a cylindrical portion and the second cylindrical portion is formed between the first cylindrical portion and the second cylindrical portion, and a discharge flow path communicating with the discharge port and discharging the plating solution The second cylindrical portion has an inclined surface inclined on the inner peripheral surface of the second cylindrical portion so that the distance between the second cylindrical portion and the first cylindrical portion becomes closer toward the discharge port, and the discharge flow path passes through the second cylindrical shape. A part of the inclined surface is configured to gradually narrow toward the discharge port.         The powder supply device according to item 10 of the patent application scope, wherein the first cylindrical portion extends toward the plating liquid tank side than the discharge port.         The powder supply device according to item 8 of the scope of patent application, wherein the liquid curtain generating member has: an inlet of the plating solution; and a communication with the inlet, and the first cylindrical portion and the second cylindrical shape communicate with each other. A first circumferential flow path extending circumferentially between the sections.         The powder supply device according to claim 12, wherein the liquid curtain generating member has a plurality of axial flow paths communicating with the first circumferential flow path.         The powder supply device according to item 12 of the patent application scope, wherein the liquid curtain generating member is in communication with each of the axial flow paths, and extends along the circumference between the first cylindrical portion and the second cylindrical portion. The second circumferential flow path extending in a forward direction is in communication with the discharge port.         The powder supply device according to claim 10, wherein the liquid curtain generating member has: an inlet for the plating solution; communicates with the inlet, and is in the first cylindrical portion and the second cylindrical portion. A first circumferential flow path extending in the circumferential direction therebetween; and a plurality of axial flow paths communicating with the first circumferential flow path, the plurality of axial flow paths communicating with the discharge flow path.         The powder supply device according to item 7 of the patent application scope, further comprising a gas supply line for supplying a gas into the input pipe.         A powder supply device is a supplier for supplying a powder containing a metal used for plating to a plating solution. The powder supplying device includes a plating solution tank configured to store the plating solution, and a hopper for storing the powder. The powder supply device has an input port for injecting the powder into the hopper and an exhaust port for exhausting the gas in the hopper, and the powder supply device further includes a structure for preventing the powder from being input from the input port and for injecting the powder into the input port. A first scattering prevention member that scatters into the gap between the injection nozzles; and a second scattering prevention member that prevents the powder from scattering from the exhaust port.         The powder supply device according to claim 17 in the patent application scope, wherein the first scattering prevention member includes a filter cloth filter, and the filter cloth filter is installed at the input port or the input nozzle.         The powder supply device according to claim 17 in the patent application scope, wherein the second scattering prevention member includes a filter cloth filter, and the filter cloth filter is attached to the exhaust port.         The powder supply device according to item 17 of the scope of patent application, wherein the feeding nozzle is a nozzle of a powder container for storing powder.         The powder supply device according to item 17 of the patent application scope, further comprising an intermediate nozzle that receives the powder fed from a nozzle of a powder container that stores the powder, and inputs the powder into a charging port of the hopper, where the charging The nozzle is the aforementioned intermediate nozzle.         The powder supply device according to claim 21, wherein the first scattering prevention member is mounted on the intermediate nozzle, and the powder supply device is configured such that the first scattering prevention member is configured to insert the powder into the hopper. It is in contact with the aforementioned inlet of the aforementioned hopper.         A plating system comprising: the powder supply device according to any one of claims 1 to 22 of the patent application scope; a plating tank for plating a substrate; and the aforementioned plating solution from the aforementioned powder supply device A plating solution supply pipe extending from the tank to the plating tank.