KR102353054B1 - Apparatus and method for supplying plating solution to plating tank, plating system, powder container, and plating method - Google Patents

Abstract

An improved apparatus for adding copper oxide powder to a plating solution and supplying the plating solution to a plating bath is provided.
The apparatus 20 for supplying the plating solution in which the powder containing at least copper is dissolved to the plating tank 2 has an inlet 26 connectable to the powder conduit 46 of the powder container 21 containing the powder. The hopper 27, the feeder 30 communicating with the lower opening of the hopper 27, the motor 31 connected to the feeder 30, and the outlet 30b of the feeder 30 are connected to the plating liquid A plating solution tank (35) for dissolving in the solution is provided.

Description

Apparatus and method for supplying plating solution to plating tank, plating system, powder container and plating method

The present invention relates to an apparatus and method for supplying a plating solution to a plating bath. The invention also relates to a plating system having such a device. Further, the present invention relates to a powder container for accommodating metal powder used for plating. Further, the present invention relates to a method of plating a substrate using a plating solution to which a metal powder used for plating is added.

With the progress of miniaturization, higher speed, and lower power consumption of electronic devices, miniaturization of wiring patterns in semiconductor devices is progressing, and with the miniaturization of this wiring pattern, materials used for wiring are made of copper from conventional aluminum and aluminum alloys. and copper alloys. The resistivity of copper is 1.67 μΩcm, which is about 37% lower than that of aluminum (2.65 μΩcm). For this reason, compared with an aluminum wiring, not only it is possible to suppress the consumption of electric power, but copper wiring can further refine|miniaturize also with the wiring resistance equivalent. In addition, the copper wiring can also suppress signal delay by lowering the resistance.

The copper burying into the trench is generally performed by electroplating, which can form a film at a higher speed than PVD or CVD. In this electrolytic plating, a copper film is deposited on a low-resistance seed layer (power feeding layer) previously formed on the substrate by applying a voltage between the substrate and the anode in the presence of a plating solution. Although it is common that a seed layer consists of a copper thin film (copper seed layer) formed by PVD etc., a thinner seed layer is calculated|required with refinement|miniaturization of wiring. For this reason, the film thickness of the seed layer, which was generally about 50 nm, is expected to be 10 to 20 nm or less from now on.

The applicant has proposed a plating apparatus in which a plurality of divided anodes are used as an anode, and a plating power supply is individually connected to each of these divided anodes (refer to Patent Document 1). According to this plating apparatus, the current density of the divided anode located on the center side is higher than that of the outer periphery side for a certain period of time for forming the initial plating film on the substrate, preventing the plating current from concentrating on the outer periphery of the substrate, and plating is also performed on the center side of the substrate. By allowing the current to flow, it becomes possible to form a plated film having a uniform film thickness even when the sheet resistance is high. Moreover, the applicant proposed the plating technique (refer patent documents 2 and 3) using an insoluble anode as an anode. The anode holder for holding the insoluble anode is provided with a plating solution discharging unit for sucking and discharging the plating solution in the anode chamber, and is provided with a plating solution injection unit connected to a plating solution supply pipe extending from the plating solution supply device.

Moreover, in recent years, in order to satisfy the request|requirement of the miniaturization with respect to the circuit system using a semiconductor, it came out that the semiconductor circuit is mounted in the package close|similar to the chip size. As one of the methods for realizing mounting in such a package, a package method called a wafer level package (WLP, or WL-CSP) has been proposed. Also, in general, this wafer level package includes a fan-in technology (also referred to as a Wafer Level Chip Scale Package (WLCSP)) and a fan-out technology. Fan-in WLP is a technology in which external electrodes (external terminals) are provided in an area equivalent to the chip size. On the other hand, in Fan Out Wafer-Leve1-Packaging (FPWLP), for example, on a substrate formed of an insulating resin in which a plurality of chips are embedded, rewiring and external electrodes are formed. In a large area, it is a technique for installing external terminals. When forming such a rewiring and an insulating layer on the wafer, an electrolytic plating technique may be used, and it is assumed that the electrolytic plating technique is also applied to the fan-out WLP. In order to apply the electrolytic plating technology to the fan-out WLP technology or the like, which requires high miniaturization, a more advanced technology is required in terms of plating solution management and the like.

In order to perform so-called bottom-up plating, the applicant has proposed the method of plating on board|substrates, such as a wafer, preventing generation|occurrence|production of the electrolyte solution component which inhibits bottom-up plating (refer patent document 4). This method is a technique in which an insoluble anode and a substrate are brought into contact with a copper sulfate plating solution containing an additive, and a predetermined plating voltage is applied between the substrate and the insoluble anode by a plating power supply to plate the substrate.

On the other hand, in the plating apparatus using the insoluble anode as described above, for the replenishment of the target metal ion, a method such as adding a powdered metal salt into a circulation tank or dissolving a metal piece in another tank to supplement it is employed. it is assumed Here, when powdery metal salt is supplemented in the plating solution, fine particles increase in the plating solution, and there is a concern that the increased fine particles will cause defects on the surface of the substrate after plating. In a plating apparatus, the technique which maintains the density|concentration of each component of a plating liquid constant over a long time is proposed (patent document 5). According to this technique, the amount of the plating solution used can be suppressed as little as possible by recycling and reusing the plating solution while recovering it. Moreover, by using an insoluble anode, replacement|exchange of an anode becomes unnecessary, and maintenance and management of an anode can be made easy. Furthermore, the concentration of the components of the plating solution that changes as the plating solution is circulated and reused can be maintained within a predetermined range by supplying a replenishment solution containing a component included in the plating solution at a higher concentration than the plating solution to the plating solution.

Japanese Patent Laid-Open No. 2002-129383 Japanese Patent Laid-Open No. 2005-213610 Japanese Patent Laid-Open No. 2008-150631 Japanese Patent Laid-Open No. 2016-074975 Japanese Patent Laid-Open No. 2007-051362

When a substrate is plated with copper using an insoluble anode, copper ions in the plating solution are reduced. Accordingly, the plating solution supply device needs to adjust the concentration of copper ions in the plating solution. What is exemplified as one method of replenishing copper to the plating solution is to add copper oxide powder to the plating solution. However, when powder is scattered in a semiconductor manufacturing plant, it causes contamination in a clean room. Moreover, it is calculated|required by the plating liquid supply apparatus to add copper oxide in a required amount to a plating liquid, without reducing a throughput. Furthermore, requests for a plating technique for forming a higher-quality copper film on a substrate using a plating solution to which such copper oxide is added are also increasing.

An object of the present invention is to provide an improved apparatus and method for adding a powder containing at least a metal such as copper to a plating solution and supplying the plating solution to a plating bath. Another object of the present invention is to provide a plating system having such an apparatus. Another object of the present invention is to provide a powder container for accommodating the powder containing at least a metal such as copper, which is used in the above apparatus. Another object of the present invention is to provide a plating method capable of forming a higher quality metal film on a substrate using a plating solution to which powder containing at least a metal such as copper is added.

According to one aspect of the present invention, there is provided an apparatus for supplying a plating solution in which powder containing at least a metal used for plating is dissolved to a plating tank, comprising: a hopper having an inlet connectable to a powder conduit of a powder container containing the powder; There is provided an apparatus comprising a feeder communicating with the lower opening of the hopper, a motor connected to the feeder, and a plating liquid tank connected to an outlet of the feeder and dissolving the powder in the plating liquid.

In one embodiment, it further includes a weight measuring device for measuring the weight of the hopper and the feeder, and an operation control unit for controlling the operation of the motor based on a change in the measured value of the weight.

In one embodiment, the operation control unit calculates the amount of the powder added to the plating solution from the change in the measured value of the weight, and operates the motor until the addition amount reaches a target value.

In one embodiment, the inlet of the hopper has a connection seal in which the diameter gradually decreases as the distance from the tip increases.

In one embodiment, the said connection seal is comprised with the elastic material.

In one embodiment, the sealed chamber further includes an inlet of the hopper disposed therein, wherein the sealed chamber includes a door allowing the powder container to be carried therein, and gloves constituting a part of the wall of the sealed chamber. to provide

In one embodiment, the hermetic chamber is provided with an exhaust port for communicating the internal space of the negative pressure source.

In one embodiment, in the sealed chamber, a vibration device for vibrating the powder container is disposed.

In one embodiment, in the sealed chamber, a vacuum clamp for holding the powder container is disposed.

In one embodiment, the plating liquid tank includes a stirrer for stirring the plating liquid.

In one embodiment, the said plating liquid tank is equipped with the stirring tank in which the said stirrer was arrange|positioned, and the overflow tank connected to the communication hole formed in the lower part of the said stirring tank.

In one embodiment, the plating liquid tank further includes a bypass passage adjacent to the overflow tank.

In one embodiment, the plating liquid tank further includes a plurality of baffle plates disposed in the overflow tank, wherein the plurality of baffle plates are alternately arranged.

In an embodiment, the apparatus further includes an enveloping cover surrounding the connection portion between the feeder and the plating solution tank, and an inert gas supply line communicating with the inside of the enveloping cover.

According to one aspect of the present invention, there is provided a plating system comprising a plurality of plating baths for plating a substrate, the apparatus, and a plating solution supply pipe extending from the apparatus to the plurality of plating baths.

In one embodiment, a plating solution return pipe extending from the plurality of plating baths to the apparatus is further provided.

According to one aspect of the present invention, there is provided a method of supplying a powder containing at least a metal used for plating to a plating solution, wherein a powder conduit of a powder container containing the powder is connected to an inlet of a hopper, and from the powder container Supplying the powder to a hopper, operating the feeder while measuring the weight of the hopper in which the powder is stored and the feeder communicating with the lower opening of the hopper, and based on a change in the measured value of the weight, the There is provided a method characterized in that the powder is added to the plating solution by the feeder.

In one embodiment, the process of stirring the said plating liquid to which the said powder was added is further included.

In one embodiment, the method further includes the step of calculating an amount of the powder added to the plating solution from a change in the measured value of the weight, and operating the feeder until the amount of the powder reaches a target value.

According to one aspect of the present invention, there is provided a powder container for accommodating powder containing at least a metal used for plating, comprising: a container body capable of accommodating the powder therein; a powder conduit connected to the container body; A powder container is provided, characterized in that it is provided with a valve installed in the powder conduit.

In one embodiment, the tip of the powder conduit has a truncated cone shape.

According to one aspect of the present invention, there is provided a step of transferring a plating solution from a plating tank to a plating solution tank; A step of calculating an amount to be added to the plating solution contained therein; a step of supplying a powder containing at least the metal used for plating to the plating solution housed in the plating solution tank; and dissolving the powder in the plating solution housed in the plating solution tank a step of supplying the plating solution in which the powder is dissolved from the plating solution tank to the plating tank; a step of bringing a substrate into contact with the plating solution accommodated in the plating tank; and the plating so that the metal is deposited on the surface of the substrate in the plating solution There is provided a method for plating a substrate comprising a step of generating an electrochemical reaction in a plating solution accommodated in a bath.

In one embodiment, the plating bath includes a plurality of plating baths, and when the plating solution accommodated in the plating solution tank is supplied to the plurality of plating baths, the plating solution is respectively supplied to the plurality of plating baths while controlling the flow rate of the plating solution.

In one embodiment, the plating tank includes a plurality of plating tanks, and while constantly monitoring metal ions in the plating solution in the plurality of plating tanks, when the concentration of the metal ions becomes lower than a predetermined value, the plurality of plating tanks The plating liquid inside is transferred from the plating tank to the plating liquid tank, and the plating liquid is supplied from the plating liquid tank to any one of the plurality of plating tanks.

According to one aspect of the present invention, there is provided a non-transitory computer-readable storage medium storing a computer program for executing a method for electrolytic plating of a substrate. A step of transferring, a step of supplying a powder containing at least a metal used for plating to a plating solution accommodated in the plating solution tank, a step of dissolving the powder in the plating solution accommodated in the plating solution tank, and the powder is dissolved A step of supplying a plating solution from the plating solution tank to the plating bath, a step of bringing a substrate into contact with the plating solution accommodated in the plating bath, and an electrochemical reaction in the plating solution accommodated in the plating solution so that the metal is deposited on the surface of the substrate in the plating solution There is provided a storage medium characterized in that it has a process for generating

According to one aspect of the present invention, there is provided a non-transitory computer-readable storage medium storing a computer program for executing a method for electroplating a substrate, wherein the method for electroplating the substrate includes a metal contained in a plating solution in a plating bath. a step of monitoring whether the concentration of ions is lower than a set value; and when the concentration of the metal ions is lower than a predetermined value, a step of calculating an amount to be added to the plating solution of at least metal-containing powder; transferring the powder from the plating tank to the plating solution tank; supplying the powder to the plating solution accommodated in the plating solution tank until the calculated amount is reached; and dissolving the powder in the plating solution accommodated in the plating solution tank; , supplying the plating solution in which the powder is dissolved from the plating solution tank to the plating bath; bringing a substrate into contact with the plating solution accommodated in the plating bath; and in the plating bath so that the metal is deposited on the surface of the substrate in the plating solution There is provided a storage medium comprising a step of generating an electrochemical reaction in the received plating solution.

According to the present invention, it is possible to provide an apparatus and method capable of adding and dissolving powder to a plating solution while preventing the powder from scattering. In addition, according to the present invention, a higher quality metal film (eg, a copper film) can be formed on a substrate by using a plating solution to which powder containing at least a metal such as copper is added.

The above-mentioned powder container, plating system and plating method can be used even when the metal species to be plated on the substrate is not copper but other metal such as indium, nickel, cobalt, or ruthenium. Examples of the powder in this case include sulfates such as indium sulfate, nickel sulfate and cobalt sulfate, sulfamates such as nickel sulfamate and cobalt sulfamate, halides such as nickel bromide, nickel chloride and cobalt chloride, indium oxide and The same powder can be mentioned.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the whole plating system which concerns on 1st Embodiment.
It is a side view which shows the powder container which can hold|maintain copper oxide powder inside.
3 is a view showing a powder container in a state in which the cap is removed and the valve is opened.
4 is a perspective view of the hermetic chamber;
5 is a view showing the inside of the hermetic chamber.
6 is a view showing the tip of the powder conduit of the powder container and the inlet of the hopper.
7 is a view showing a state in which the tip of the powder conduit of the powder container is in close contact with the inlet of the hopper.
It is a flowchart which shows the supply process of the copper oxide powder from a powder container to a hopper.
Fig. 9 is a side view showing a hopper and a feeder;
10 is a perspective view of a plating liquid tank;
11 is a plan view of a plating liquid tank.
Fig. 12 is a longitudinal cross-sectional view of the plating liquid tank as viewed from the direction indicated by the arrow A in Fig. 11;
13 is a schematic diagram showing another embodiment of a plating liquid tank.
14 is a schematic diagram showing still another embodiment of a plating liquid tank.
Fig. 15 is a view showing the experimental results of examining the influence of the number of baffle plates on the dissolution of copper oxide powder.
It is a schematic diagram which shows the whole plating system which concerns on 2nd Embodiment.
17 is a flowchart showing a control sequence for adding copper oxide powder to a plating solution in the plating system according to the first embodiment.
18 is a flowchart showing a control sequence for adding copper oxide powder to a plating solution in the plating system according to the second embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the whole plating system which concerns on 1st Embodiment. The plating system is equipped with the plating apparatus 1 provided in the clean room, and the plating liquid supply apparatus 20 provided in the downstairs room. In the present embodiment, the plating apparatus 1 is an electrolytic plating unit for electrolytically plating copper on a substrate such as a wafer, and the plating liquid supply apparatus 20 includes at least copper in the plating liquid used in the plating apparatus 1 . It is a plating liquid supply unit for supplying the powder containing. In this embodiment, although the example using copper oxide powder is described as powder containing copper at least, the pellet-shaped molded object containing copper at least can be used. Moreover, the average particle diameter of the copper oxide powder in this embodiment is the range of 10 micrometers - 200 micrometers, More preferably, it is set as the range of 15 micrometers - 50 micrometers. When an average particle diameter is made small too much, there exists a possibility that it may become dust and become easy to scatter. Conversely, when the average particle diameter is too large, there is a possibility that the solubility in the solution in the plating solution may deteriorate.

In addition, in this specification, "powder" and "powder" refer to solid particles, molded granular substances, pellet-shaped solid substances, small particle diameter spherical copper solid balls, solid copper ribbons or tapes. It contains at least a mixture consisting of a belt-shaped object molded into a phase, or a combination of any one of them.

The plating apparatus 1 has four plating tanks 2 . Each plating tank 2 has an inner tank 5 and an outer tank 6 . In the inner tank 5, the insoluble anode 8 held by the anode holder 9 is arranged. In addition, in the plating tank 2, a neutral film (not shown) is arrange|positioned around the insoluble anode 8. The inner tub 5 is filled with a plating solution, and the plating solution overflows the inner tub 5 and flows into the outer tub 6 . In the inner tank 5, for example, a resin such as PVC, PP, or PTFE, or SUS or titanium is coated with a fluororesin, and the stirring is composed of a rectangular plate-like member having a constant thickness of 3 mm to 5 mm. A paddle (not shown) is installed. This stirring paddle reciprocates parallel to the substrate W to stir the plating solution, whereby sufficient copper ions and additives can be uniformly supplied to the surface of the substrate W.

A substrate W such as a wafer is held by the substrate holder 11 and is immersed in the plating solution in the inner bath 5 of the plating bath 2 together with the substrate holder 11 . In addition, as the board|substrate W which is a to-be-plated object, a semiconductor substrate, a printed wiring board, etc. can be used. Here, for example, when a semiconductor substrate is used as the substrate W, the semiconductor substrate is flat or substantially flat. considered). When plating such a flat object to be plated, it is necessary to control the plating conditions over time while considering the in-plane uniformity of the plated film to be formed and preventing deterioration of the film quality to be formed.

The insoluble anode 8 is electrically connected to the positive electrode of the plating power source 15 through the anode holder 9 , and the substrate W held by the substrate holder 11 is plated through the substrate holder 11 . It is electrically connected to the negative electrode of the power supply 15 . When a voltage is applied by the plating power supply 15 between the insoluble anode 8 immersed in the plating solution and the substrate W, an electrochemical reaction occurs in the plating solution accommodated in the plating bath 2, and the substrate W ), copper is deposited on the surface of In this way, the surface of the substrate W is plated with copper. The plating apparatus 1 may be provided with the plating tanks 2 with fewer than four or more than four.

The plating apparatus 1 is equipped with the plating control part 17 which controls the plating process of the board|substrate W. The plating control unit 17 has a function of calculating the concentration of copper ions contained in the plating solution in the plating bath 2 from the accumulated value of the current flowing through the substrate W . As the substrate W is plated, copper in the plating solution is consumed. The consumption of copper is proportional to the accumulated value of the current flowing through the substrate W. Accordingly, the plating control unit 17 can calculate the copper ion concentration in the plating solution in each plating bath 2 from the accumulated current.

The plating liquid supply device 20 includes a sealed chamber 24 into which a powder container 21 containing copper oxide powder is loaded, a hopper 27 for storing the copper oxide powder supplied from the powder container 21 , and a hopper. A feeder 30 communicating with the lower opening of 27, a motor 31 connected to the feeder 30, and a plating liquid tank 35 connected to the outlet of the feeder 30 and dissolving copper oxide powder in the plating liquid and an operation control unit 32 for controlling the operation of the motor 31 . The feeder 30 is driven by a motor 31 . As the plating solution, in addition to sulfuric acid, copper sulfate and halogen ions, a plating accelerator composed of SPS (bis(3-sulfopropyl)disulfide) as an additive, an inhibitor composed of PEG (polyethylene glycol), etc., and a leveler composed of PEI (polyethyleneimine), etc. An acidic copper sulfate plating solution containing an organic additive (leveling agent) is used. As the halogen ion, a chloride ion is preferably used.

The plating device 1 and the plating solution supply device 20 are connected by a plating solution supply pipe 36 and a plating solution return pipe 37 . More specifically, the plating solution supply pipe 36 extends from the plating solution tank 35 to the bottom of the inner tank 5 of the plating tank 2 . The plating solution supply pipe 36 is branched into four branch pipes 36a, and the four branch pipes 36a are respectively connected to the bottoms of the inner tanks 5 of the four plating tanks 2 . Each of the four branch pipes 36a is provided with a flow meter 38 and a flow rate control valve 39 , and the flow meter 38 and the flow rate control valve 39 are connected to the plating control unit 17 . The plating control unit 17 is configured to control the opening degree of the flow rate control valve 39 based on the flow rate of the plating solution measured by the flow meter 38 . Therefore, the flow rate of the plating liquid supplied to each plating bath 2 through the four branch pipes 36a is controlled by each flow rate control valve 39 provided on the upstream side of each plating bath 2, and these flow is almost the same. The plating solution return pipe 37 extends from the bottom of the outer tank 6 of the plating tank 2 to the plating solution tank 35 . The plating solution return pipe 37 has four discharge pipes 37a respectively connected to the bottoms of the outer tanks 6 of the four plating tanks 2 .

The plating liquid supply pipe 36 is provided with a pump 40 for transferring the plating liquid, and a filter 41 arranged on the downstream side of the pump 40 . The plating solution used in the plating device 1 is sent to the plating solution supply device 20 through the plating solution return pipe 37, and the plating solution to which copper oxide powder is added from the plating solution supply device 20 is transferred to the plating solution supply pipe 36. It is sent to the plating apparatus 1 through The pump 40 may always circulate the plating solution between the plating device 1 and the plating solution supply device 20 , or intermittently pump a predetermined amount of the plating solution from the plating device 1 to the plating solution supply device 20 . It may be sent, and the plating liquid to which the copper oxide powder was added is intermittently returned from the plating liquid supply apparatus 20 to the plating apparatus 1 .

In addition, in order to replenish pure water (DIW) in the plating solution, a pure water supply line 42 is connected to the plating solution tank 35 . In this pure water supply line 42, an on/off valve 43 (usually open) for stopping supply of pure water when the plating apparatus 1 is stopped, etc. (normally open), and a flow meter 44 for measuring the flow rate of pure water , a flow rate control valve 47 for adjusting the flow rate of pure water is disposed. The flow meter 44 and the flow control valve 47 are connected to the plating control unit 17 . When the concentration of copper ions in the plating solution exceeds the set value, in order to dilute the plating solution, the plating control unit 17 controls the opening degree of the flow control valve 47 to supply pure water to the plating solution tank 35 . Consists of.

The plating control unit 17 is connected to the operation control unit 32 of the plating solution supply device 20 . When the copper ion concentration in the plating solution is lower than the set value, the plating control unit 17 is configured to send a signal indicating the replenishment request value to the operation control unit 32 of the plating solution supply device 20 . In response to this signal, the plating liquid supply device 20 adds copper oxide powder to the plating liquid until the amount of the copper oxide powder reaches the replenishment request value. In this embodiment, although the plating control part 17 and the operation|movement control part 32 are comprised as separate devices, in one Embodiment, the plating control part 17 and the operation|movement control part 32 may be comprised as one control part. In this case, the control unit may be a computer operating according to a program. This program may be stored in the storage medium.

The plating apparatus 1 may be equipped with the concentration measuring device 18a which measures the copper ion concentration in a plating liquid. The concentration meter 18a is provided in each of the four discharge pipes 37a of the plating solution return pipe 37 . The measured value of the copper ion concentration obtained by the concentration meter 18a is sent to the plating control unit 17 . The plating control unit 17 may compare the copper ion concentration in the plating solution calculated from the accumulated current value with the set value, or may compare the copper ion concentration measured by the concentration measuring device 18a with the set value. The plating control unit 17 includes a copper ion concentration in the plating solution (that is, the calculated value of the copper ion concentration) calculated from the accumulated value of the current, and the copper ion concentration (that is, the measured value of the copper ion concentration) measured by the concentration measuring device 18a ), you may correct the calculated value of copper ion concentration based on the comparison. For example, the plating control part 17 determines a correction coefficient by dividing the measured value of copper ion concentration by the calculated value of copper ion concentration, By multiplying this correction coefficient by the calculated value of copper ion concentration, copper ion concentration may be corrected. It is preferable to periodically update the correction coefficient.

In addition, a branch pipe 36b is installed in the plating solution supply pipe 36, and a concentration meter 18b is installed in the branch pipe 36b to monitor the copper ion concentration in the plating solution, or an analysis device is installed in the branch pipe 36b. (For example, a CVS device or a colorimeter, etc.) may be installed to quantitatively analyze and monitor the dissolved concentration of not only copper ions but also various chemical components. With this configuration, chemical components in the plating solution in the plating solution supply pipe 36, for example, the concentration of impurities can be analyzed before the plating solution is supplied to each plating tank 2, so that the dissolved impurities can affect the plating performance. Influence is prevented, and a more accurate plating process can be performed more reliably. You may provide only either one of the density|concentration meters 18a, 18b.

With the above configuration, in the plating system according to the first embodiment, copper is supplied to the plating solution while making the copper ion concentration contained in the plating solution substantially the same between the plating tanks 2 .

2 : is a side view which shows the powder container 21 which can hold|maintain copper oxide powder inside. As shown in Fig. 2, the powder container 21 includes a container body 45 capable of accommodating copper oxide powder therein, a powder conduit 46 connected to the container body 45, and a powder conduit ( 46) provided with a valve (48). The container body 45 is comprised from synthetic resins, such as polyethylene. The container body 45 is provided with a handle 49 so that an operator can carry the powder container 21 by holding the handle 49 . Although the capacity|capacitance of the powder container 21 is not specifically limited, It is a capacity|capacitance of the grade which an operator can convey the powder container 21 with which copper oxide powder was filled. In one example, the capacity of the powder container 21 is 4 L. As copper oxide filled in the powder container 21, not only the copper oxide powder which is not shape|molded but the pellet (granular material) shape|molded from copper oxide powder may be sufficient. When using the copper oxide powder shape|molded in pellet form, scattering of dust can be suppressed more effectively.

The powder conduit 46 is joined to the container body 45 by a joining means, such as welding, for example. The powder conduit 46 is constituted by a pipe that allows the copper oxide powder to pass through. This powder conduit 46 is inclined at an angle of about 30 degrees with respect to the vertical direction. When the valve 48 installed in the powder conduit 46 is opened, the copper oxide powder can pass through the powder conduit 46 , and when the valve 48 is closed, the copper oxide powder passes through the powder conduit 46 . can't 2 shows a state in which the valve 48 is closed. A cap (that is, a cover) 50 is provided at the tip 46a of the powder conduit 46 .

3 : is a figure which shows the powder container 21 in the state in which the cap 50 is removed and the valve 48 is opened. Copper oxide powder is thrown into the powder container 21 in the state shown in FIG. 3 through the powder conduit 46. As shown in FIG. When the input of the copper oxide powder is finished, the valve 48 is closed, and the cap 50 is installed at the tip of the powder conduit 46 (refer to FIG. 2 ). The powder container 21 with which the copper oxide powder was filled is carried in in the sealed chamber 24 shown in FIG. 1 in the state in which the valve 48 was closed.

4 is a perspective view of the hermetic chamber 24 . In the present embodiment, the hermetically sealed chamber 24 is a rectangular box capable of forming a sealed space therein. The sealed chamber 24 is provided with a door 55 for allowing the powder container 21 to be carried into the internal space, and two gloves 56 constituting a part of the wall of the sealed chamber 24 . . In addition, the installation frame in which the door 55 is installed is comprised with members, such as rubber|gum which has a sealing function, so that the inside of the sealing chamber 24 may be sealed in the door 55. As shown in FIG. The glove 56 is composed of a film made of a flexible material (eg, synthetic rubber such as vinyl chloride) that can be deformed according to the shape of the operator's hand, and the operator works inside the sealed chamber 24 . The glove 56 body is configured to protrude in the closed chamber 24 so as to be able to do so. These two gloves 56 are arranged on both sides of the door 55 . The hermetic chamber 24 is provided with an exhaust port 58 for communicating its internal space to a negative pressure source. The negative pressure source is, for example, a vacuum pump. Inside the sealed chamber 24 , a negative pressure is formed through the exhaust port 58 .

5 : is a figure which shows the inside of the sealed chamber 24. As shown in FIG. In the sealed chamber 24 , a vacuum clamp 61 for holding the powder container 21 by vacuum suction, a vibrating device (vibrator) 65 for vibrating the powder container 21 , and the powder container 21 . ) is provided with a pedestal 66 for supporting it. The powder container 21 is attached to the vacuum clamp 61 and the pedestal 66 with the powder conduit 46 facing downward. The vacuum clamp 61 is fixed to the frame 68 , and the vibration device 65 is fixed to the vacuum clamp 61 . The vacuum clamp 61 has a vibration-proof rubber 61a in contact with the powder container 21 . A communication hole (not shown) through which a vacuum is formed is formed in the vibration-proof rubber 61a. The operation of the vibration device 65 and the vacuum clamp 61 is controlled by the operation control unit 32 shown in FIG. 1 .

The vacuum clamp 61 is connected to the ejector 70 which is a vacuum generator. The ejector 70 and the vibrating device 65 are connected to a compressed air supply pipe 72 . The compressed air supply pipe 72 is branched into two, and one is connected to the ejector 70 and the other to the vibration device 65 . When compressed air is sent to the ejector 70, the ejector 70 creates a vacuum in the vacuum clamp 61, and the powder container 21 is held by the vibration-proof rubber 61a of the vacuum clamp 61 by vacuum suction. is supported The vibrating device 65 has a structure operated by compressed air. The vibration device 65 transmits vibration to the powder container 21 via the vacuum clamp 61 and vibrates the powder container 21 held by the vacuum clamp 61 . The vibration frequency of the vibration device 65 is configured to be controlled by a vibration control unit (not shown) of the plating liquid supply device 20 . The vibration control unit may be constituted by the operation control unit 32 . The vibration device 65 may directly contact the side surface of the powder container 21 . In one embodiment, the vibration device 65 may be an electric vibration device.

In the sealed chamber 24 , the inlet 26 of the hopper 27 connectable to the powder container 21 is arrange|positioned. The tip 46a (refer to FIG. 3) of the powder conduit 46 of the powder container 21 is inserted into the inlet 26 of the hopper 27 (refer to FIGS. 6 and 7), whereby the powder container ( The tip 46a of the powder conduit 46 of 21 is connected to the inlet 26 of the hopper 27 . When the valve 48 is opened with the powder conduit 46 and the inlet 26 connected (see FIG. 7 ), the copper oxide powder in the powder container 21 is transferred to the inlet 26 through the powder conduit 46 . It flows in and finally falls into the hopper 27.

In the vicinity of the powder conduit 46 in the powder container 21, a bridging phenomenon of the copper oxide powder may occur. The bridging phenomenon is a phenomenon in which the density of the powder increases and the powder container 21 is blocked. In order to prevent such a bridge phenomenon, the vibrating device 65 vibrates the powder container 21, and makes the copper oxide powder in the powder container 21 fluid. The vibration range of the vibration device 65 is preferably from 1000 to 10000 times per minute, and more preferably from 7000 to 8000 times per minute.

When the powder conduit 46 is connected to the inlet 26 of the hopper 27, the powder container 21 is inclined as a whole, and the powder conduit 46 is provided in the powder container 21. . Specifically, when the powder conduit 46 is connected to the inlet 26 of the hopper 27, one side of the powder container 21 is inclined at an angle of 50 to 70 degrees with respect to the horizontal plane, and the other The lateral side is inclined at an angle of 20 to 40 degrees with respect to the horizontal plane. In this way, when the powder conduit 46 is connected to the inlet 26 of the hopper 27, both sides of the powder container 21 face the powder conduit 46 at different angles on the left and right sides of the powder conduit 46 Since it is inclined to the powder conduit 46, the pressure of the powder concentrating in the vicinity of the powder conduit 46 is different on the left side and the right side. Therefore, generation|occurrence|production of a bridge phenomenon can be prevented effectively, and, as a result, copper oxide powder is discharged|emitted rapidly, and copper oxide powder is hard to remain in the powder container 21 .

6 : is a figure which shows the front-end|tip 46a of the powder conduit 46 of the powder container 21, and the inlet 26 of the hopper 27. As shown in FIG. The tip 46a of the powder conduit 46 has a truncated cone shape. The inlet 26 of the hopper 27 has a shape corresponding to the shape of the tip 46a of the powder conduit 46 . More specifically, the inlet 26 of the hopper 27 has a connection seal 28 whose diameter gradually decreases as the distance from the tip (upper end) increases. The connection seal 28 is made of an elastic material such as rubber. As shown in FIG. 7 , when the tip 46a of the powder conduit 46 is inserted into the inlet 26 of the hopper 27 , the tip 46a of the powder conduit 46 is sealed with the inlet 26 . It adheres to (28), and the gap between the tip (46a) of the powder conduit (46) and the inlet port (26) of the hopper (27) is sealed by the connection seal (28). Therefore, scattering of copper oxide powder is prevented.

The supply operation|work of the copper oxide powder from the powder container 21 to the hopper 27 is demonstrated with reference to FIG. In step 1, the powder container 21 with which the copper oxide powder was filled inside is prepared. In step 2, the door 55 of the hermetic chamber 24 is opened, and in step 3, the powder container 21 is put into the hermetic chamber 24. In step 4, the door 55 is closed, and in step 5, the operator puts on the gloves 56 and removes the cap 50 of the powder container 21 in the closed chamber 24. In step 6, the powder conduit 46 of the powder container 21 is connected to the inlet 26 of the hopper 27, the valve 48 of the powder container 21 is opened in step 7, and in step 8, the powder container The powder container 21 is vibrated by the vibrating device 65 while holding 21 by the vacuum clamp 61 . The copper oxide powder in the powder container 21 is supplied into the hopper 27 through the inlet 26 . When the supply of the copper oxide powder is finished, the vibration of the powder container 21 is stopped in step 9, the valve 48 is closed in step 10, and the vacuum clamp 61 is used in step 11 to vacuum the powder container 21 Stop suction. In step 12, the powder container 21 is removed from the vacuum clamp 61 and the pedestal 66, and in step 13, the cap 50 is attached to the powder conduit 46. And the door 55 is opened in step 14, and the powder container 21 is taken out from the sealed chamber 24 in step 15.

All steps from Step 1 to Step 15 described above are performed in a state in which a negative pressure is formed in the sealed chamber 24 . Further, after opening the valve 48 , the powder container 21 remains in the closed chamber 24 until the valve 48 is closed. Therefore, even if copper oxide powder overflows from the powder container 21, copper oxide powder does not leak from the sealed chamber 24, for example. Since the capacity of the hopper 27 is several times the capacity of the powder container 21, steps 1 to 15 described above are repeated until a sufficient amount of copper oxide powder is stored in the hopper 27.

Next, the hopper 27 and the feeder 30 are demonstrated. 9 : is a side view which shows the hopper 27 and the feeder 30. As shown in FIG. The hopper 27 is a powder reservoir (or pellet reservoir), and the copper oxide powder supplied from the powder container 21 is stored in the inside. The lower half of the hopper 27 has a truncated cone shape, and copper oxide powder flows downward easily. The upper end opening of the hopper 27 is covered with a lid 74 . The inlet 26 to which the powder conduit 46 of the powder container 21 mentioned above is connected is being fixed to the cover 74. As shown in FIG. In addition, an exhaust pipe 75 is fixed to the cover 74 . This exhaust pipe 75 communicates with the inner space of the hopper 27 and communicates with a negative pressure source (not shown). Accordingly, a negative pressure is formed in the inner space of the hopper 27 through the exhaust pipe 75 .

The feeder 30 communicates with the lower opening of the hopper 27 . In this embodiment, the feeder 30 is a screw feeder provided with the screw 30a. The motor 31 is connected to the feeder 30 , and the feeder 30 is driven by the motor 31 . The hopper 27 and the feeder 30 are fixed to the bracket 73 , and the bracket 73 is supported by the weighing machine 80 . The weigher 80 is configured to measure the total weight of the hopper 27 , the feeder 30 , the motor 31 , and the copper oxide powder present in the hopper 27 and the feeder 30 .

The outlet 30b of the feeder 30 is connected to the plating liquid tank 35 . When the motor 31 drives the feeder 30 , the copper oxide powder in the hopper 27 is sent to the plating liquid tank 35 by the feeder 30 . An enveloping cover 81 surrounding the connection portion between the feeder 30 and the plating liquid tank 35 is fixed to the plating liquid tank 35 . The outlet 30b of the feeder 30 is located in the envelope cover 81 . An inert gas supply line 83 is connected to the envelope cover 81 , and the inert gas supply line 83 communicates with the inside of the envelope cover 81 . The inert gas supply line 83 supplies an inert gas such as nitrogen gas to the inside of the enclosure cover 81 , and fills the inside of the enclosure cover 81 with the inert gas.

The reason for supplying the inert gas to the inside of the envelope cover 81 is as follows. In some cases, the operation is performed so that the plating liquid stored in the plating liquid tank 35 is maintained at a high temperature. In this case, steam is generated from the plating liquid. This vapor rises, reaches the connection part of the feeder 30 and the plating liquid tank 35, and also penetrates into the feeder 30 through the outlet 30b of the feeder 30. When vapor is adsorbed to the copper oxide powder in the feeder 30, there exists a possibility that copper oxide powder may aggregate and block the feeder 30. Accordingly, in such a case, by injecting an inert gas such as nitrogen gas into the envelope cover 81 , the steam is pushed down and the steam is prevented from entering the feeder 30 .

The weight measurement device 80 is connected to the operation control unit 32 that controls the operation of the motor 31 , and the measured value of the weight output from the weight measurement device 80 is transmitted to the operation control unit 32 . . The operation control unit 32 receives a signal indicating a replenishment request value sent from the plating apparatus 1 (refer to FIG. 1 ), and based on a change in the measured value of the weight output from the weighing device 80 , the plating liquid tank 35 ) calculates the addition amount of copper oxide powder to the plating liquid in, and operates the motor 31 until the addition amount of copper oxide powder reaches a replenishment request|requirement value. The motor 31 drives the feeder 30 , and the feeder 30 adds copper oxide powder in an amount corresponding to the replenishment request value to the plating liquid tank 35 . The replenishment request value is a value that can change depending on the copper ion concentration of the plating liquid so that the copper ion consumption in the plating liquid contained in the plating bath 2 is reflected, and the oxidation to be added to the plating liquid contained in the plating liquid tank 35 . The target value of the quantity of copper powder is shown.

When the copper ion concentration in the plating solution in the plating tank 2 falls below the set value, the plating control unit 17 is configured to calculate a replenishment request value from the copper ion concentration in the plating solution in the plating tank 2 . As the copper ion concentration in the plating solution in the plating tank 2, as described above, the copper ion concentration in the plating solution calculated from the accumulated current or copper measured by the concentration meter 18a and/or the concentration meter 18b. Ion concentrations may be used.

When a large amount of copper oxide powder is added in a plating solution in a short time, before copper oxide powder melt|dissolves in a plating solution, there exists a possibility that copper oxide powder may not melt|dissolve completely. Moreover, when the rotation speed of the screw 30a of the feeder 30 is too high, there exists a possibility that copper oxide powder may aggregate in the feeder 30, and the lump of copper oxide powder which is hard to melt|dissolve in a plating liquid may be formed. Therefore, in order to prevent formation of the aggregate and lump of such copper oxide powder, it is preferable to set the upper limit of the rotation speed of the screw 30a. More specifically, it is preferable that the operation control unit 32 controls the motor 31 so that the screw 30a rotates at a rotation speed equal to or less than a preset upper limit value.

When there is little residual quantity of the copper oxide powder in the hopper 27, it is preferable that the operation|movement control part 32 raise|emits an alarm. More specifically, when the measured value of the weight output from the weight measurement device 80 is less than the lower limit, the operation control unit 32 preferably issues an alarm.

Next, the plating liquid tank 35 is demonstrated. Fig. 10 is a perspective view of the plating liquid tank 35, Fig. 11 is a plan view of the plating liquid tank 35, and Fig. 12 is a longitudinal sectional view of the plating liquid tank 35 seen from the direction indicated by the arrow A in Fig. 11 . The plating liquid tank 35 is provided with the stirring tank 91 in which the stirrer 85 is arrange|positioned, and the overflow tank 92 connected to the communication hole 95 formed in the lower part of the said stirring tank 91. The overflow tank 92 communicates with the stirring tank 91 through the communication hole 95 . The plating solution return pipe 37 connected to the plating tank 2 shown in FIG. 1 is connected to the stirring tank 91 . Accordingly, the plating solution used in the plating apparatus 1 of FIG. 1 is returned to the stirring tank 91 .

The outlet 30b of the feeder 30 is located above the stirring tank 91 , and the copper oxide powder supplied from the feeder 30 is thrown into the stirring tank 91 . The stirrer 85 is equipped with the stirring blade 86 arrange|positioned inside the stirring tank 91, and the motor 87 connected to the stirring blade 86. As shown in FIG. The motor 87 can dissolve the copper oxide powder in the plating solution by rotating the stirring blade 86 . The operation of the stirrer 85 is controlled by the above-described operation control unit 32 . The overflow tank 92 is adjacent to the stirring tank 91 . The plating liquid to which the copper oxide powder is added flows into the overflow tank 92 from the stirring tank 91 through the communication hole 95 . In order to prevent the outflow of the copper oxide powder which is not melt|dissolved, you may provide a filter in the communication hole 95.

Adjacent to the overflow tank 92, a bypass flow path 93 is formed. The plating liquid overflows the overflow tank 92 and flows into the bypass flow passage 93 . The bypass flow path 93 of this embodiment is a meandering flow path formed by the plurality of baffle plates 88 . A cutout 88a is formed at an end of each baffle plate 88 . The cutouts 88a of the adjacent baffle plates 88 are formed at different positions in the longitudinal direction of the baffle plates 88 . Accordingly, as indicated by the arrow in FIG. 11 , the plating solution to which the copper oxide powder is added meanders through the bypass flow path 93 . In one embodiment, the bypass flow passage 93 may be formed by alternately disposing a plurality of baffle plates 88 without the cutout 88a.

The bypass flow path 93 is formed to ensure sufficient time for the copper oxide powder to dissolve in the plating solution. The time for the plating liquid to pass through the bypass flow path 93 is preferably 10 seconds or longer. By forming such a bypass flow path 93, the copper oxide powder can be sufficiently dissolved in the plating solution.

13 is a schematic diagram showing another embodiment of the plating liquid tank 35 . In the present embodiment, the baffle plates 88 are provided in the overflow tank 92, and these baffle plates 88 are alternately disposed in a vertical direction. A bypass flow path 93 of the plating liquid is formed by these baffle plates 88 .

14 is a schematic diagram showing still another embodiment of the plating liquid tank 35 . In this embodiment, the stirring tank 91 in which the stirrer 85 is arranged is provided in the center of the plating liquid tank 35 . The overflow tank 92 is provided on the outer side of the stirring tank 91, and communicates with the communication hole 95 formed in the lower end of the stirring tank 91. The bypass flow path 93 is adjacent to the overflow tank 92 , and the bypass flow path 93 is connected to the plating solution supply path 36 . The bypass flow path 93 is disposed outside the stirring tank 91 and the overflow tank 92 . The bypass flow path 93 in this embodiment is a spiral flow path extending spirally. The plating liquid flows into the overflow tank 92 from the stirring tank 91 through the communication hole 95 , and also overflows the overflow tank 92 and flows into the bypass flow passage 93 . The plating solution flowing through the bypass flow path 93 flows into the plating solution supply path 36 . If the bypass flow path 93 is configured in a spiral shape, that is, in a circular shape as described above, the plating solution can be stored without installing the baffle plate 88 , and since there is no corner part in the plating solution tank 35 , the flow of the plating solution is reduced. It is possible to prevent the powder from settling in the corner of the plating liquid tank 35, which tends to stay frequently, and the plating liquid tank 35 can be configured compactly.

In any case of the embodiment shown in FIGS. 11 to 12 and the embodiment shown in FIG. 13 , by increasing the number of baffle plates 88 , the time for the plating liquid to pass through the bypass flow path 93 is lengthened. can do. Although the baffle plate is not provided in the embodiment shown in FIG. 14 , by lengthening the bypass flow path 93 , the time for the plating liquid to pass through the bypass flow path 93 can be lengthened similarly.

It is a figure (SEM diagram) which shows the experimental result which investigated the influence on the melt|dissolution of copper oxide powder by the number of baffle plates under room temperature conditions. Specifically, when 3 baffle plates are installed in the bypass flow path 93, 2 are provided, 1 sheet is provided, and 0 sheets are provided, copper oxide powder is dissolved in the bypass flow path 93. After passing the solution, the copper oxide powder which has settled on the bottom of the bypass flow path 93 is collected and photographed with an enlarged photograph. 15 shows an SEM photograph, and the magnifications are 50 times, 100 times, and 150 times, respectively.

Considering friction loss in the plating solution supply pipe 36 and losses due to valves, meters, pipe joints, etc., in order to increase the copper concentration in the plating solution in the plating tank 2, the flow rate of the plating solution flowing in the plating solution tank 35 It is necessary to raise it to some extent. On the other hand, when the flow rate of a plating liquid is too high, there also exists a possibility that copper oxide powder may not melt|dissolve in a plating liquid completely.

As can be seen from the experimental results shown in Fig. 15, when the number of baffle plates was set to 3, almost no copper oxide powder remained, but when the number of baffle plates was set to 0, copper oxide powder remained. That is, dissolution of the copper oxide powder proceeds as the number of baffle plates increases. The time required for the plating liquid to pass through the bypass flow path 93 is about 4 seconds when the number of baffle plates is 0, about 8 seconds when the number of baffle plates is 1, about 12 seconds when the number of baffle plates is about 12 seconds, and about 16 when the number of baffle plates is 3 it was about a second.

From the results of this experiment, the time required for the plating liquid to pass through the bypass flow path 93 is longer than at least 10 seconds corresponding to the number of baffles of 1.5, for example, when the number of baffle plates is 2 It can be said that it is preferably longer than about 12 seconds, and more preferably longer than 16 seconds, which corresponds to when the number of baffle plates is three.

In addition, although the example which investigated the influence of the number of baffle plates on the dissolution of copper oxide powder was described above, as a means to accelerate|stimulate dissolution of copper oxide powder, it is not limited only to adjusting the number of baffle plates. As another configuration example, in order to promote the dissolution of the copper oxide powder in the solution, a heater may be installed inside the plating solution tank 35, for example, in the stirring tank 91 to promote dissolution of the copper oxide powder. have. However, when the plating solution is heated to an excessively high temperature, coexistence components such as additives in the plating solution are decomposed and there is also a concern that the plating solution is deactivated. From this viewpoint, it is preferable that the upper limit of the temperature of the plating liquid in the stirring tank 91 shall be 50 degrees or less so that decomposition|disassembly of an additive may not occur. When a configuration capable of heating the plating liquid is added in this way, one baffle plate may be installed in the bypass passage 93 so that the time required for the plating liquid to pass through the bypass passage 93 is 8 seconds or more. Alternatively, it is not necessary to provide a baffle plate in the plating liquid tank 35 . By providing a heater in the stirring tank 91 , the copper oxide powder can be sufficiently dissolved only by allowing the plating liquid to pass through the plating liquid tank 35 .

Next, the plating system which concerns on 2nd Embodiment is demonstrated with reference to FIG. The plating system according to the second embodiment differs from the plating system according to the first embodiment in that the four plating tanks 2 are connected in series. More specifically, the outer tank 6 of each plating tank 2 and the inner tank 5 of the adjacent plating tank 2 are connected by a first connector pipe 110 and a second connector pipe 112 , have. A pump 113 for transferring the plating solution is installed in each of the first connecting pipe 110 and the second connecting pipe 112 .

The plating solution supply pipe 36 is connected to the inner tank 5 of one of the four plating tanks 2 , and the plating solution return pipe 37 is connected to the outer tank 6 of the other one of the four plating tanks 2 . connected. A flow meter 38 and a flow control valve 39 are installed in the plating solution supply pipe 36 , and a flow meter 115 and a plating solution discharge valve 116 are installed in the plating solution return pipe 37 . To the outer tank 6 to which the plating solution return pipe 37 is connected, a concentration meter 118 for measuring the copper ion concentration in the plating solution is connected. The same code|symbol is attached|subjected to the same component as 1st Embodiment, and the overlapping description is abbreviate|omitted.

The plating system according to the second embodiment automatically measures the copper ion concentration in the plating solution while keeping the copper ion concentration contained in any plating solution inside the plating tank 2 substantially the same. If it is necessary to supply copper to the plating liquid, the plating liquid is transferred from the plating apparatus 1 to the plating liquid supply apparatus 20 and a relatively high concentration of copper is transferred from the plating liquid supply apparatus 20 in the downstairs room. It is comprised so that the plating liquid containing copper may be supplied to the plating apparatus 1 .

Next, the control sequence for adding copper oxide powder to the plating solution will be described with reference to Fig. 17 for the plating system according to the first embodiment and Fig. 18 for the plating system according to the second embodiment, respectively. In the plating system according to the first embodiment, as shown in FIG. 17 , in step 1, when the copper ion concentration in the plating solution is lower than the set value, the plating control unit 17 operates a signal indicating the replenishment request value. sent to the control unit 32 . In step 2, the operation control unit 32 receives a signal, operates the motor 31 until the amount of copper oxide powder added to the plating solution reaches the replenishment request value, and the feeder 30 responds to the replenishment request value. An amount of copper oxide powder is added to the plating solution in the plating solution tank (35).

In step 3, the operation control part 32 starts the stirrer 85, and stirs the plating liquid to which copper oxide powder was added. The operation control unit 32 stops the stirring operation of the stirrer 85 when a preset time elapses. In step 4, copper oxide powder is melt|dissolved in the plating liquid to which copper oxide powder was added, flowing through the overflow tank 92 and the bypass flow path 93. And in step 5, the plating liquid in which the copper oxide powder was melt|dissolved is supplied to the plating tank 2 of the plating apparatus 1 through the plating liquid supply pipe 36. As shown in FIG. In this way, the copper ion concentration in the plating solution used in the plating apparatus 1 is maintained at the set value. According to this embodiment, the required amount of copper oxide powder can be automatically added to the plating solution, dissolved, and supplied to each plating tank 2 by a predetermined amount, thereby increasing the throughput of the plating apparatus 1 . The copper ion concentration in the plating solution of each plating bath 2 can be managed and maintained so that it may become a predetermined value, respectively, without reducing it.

Moreover, in the plating system which concerns on 2nd Embodiment, copper oxide powder is added to a plating liquid as follows. That is, the copper ion concentration in the plating solution accommodated in the plating bath 2 is continuously measured by the concentration measuring device 118 , and the measured value of the copper ion concentration is monitored by the plating control unit 17 . As shown in FIG. 18 , in Step 1, when the copper ion concentration in the plating solution in the plating tank 2 is lower than the set value, the plating control unit 17 sends a signal indicating the replenishment request value to the plating solution supply device. A signal is sent to the operation control unit 32 of (20). In step 2, the plating solution discharge valve 116 for discharging the plating solution from the plating tank 2 is opened, and the plating solution is transferred from the plating tank 2 to the plating solution tank 35 . The plating liquid discharge valve 116 operates to be opened only for a predetermined period of time so that the plating liquid having the maximum capacity of the plating liquid tank 35 or less is supplied.

In step 3, the operation control unit 32 receives the signal, operates the motor 31 until the amount of copper oxide powder added to the plating solution reaches the replenishment requested value, and the feeder 30 reaches the replenishment requested value. A corresponding amount of copper oxide powder is added to the plating liquid in the plating liquid tank 35 . In addition, Step 2 and Step 3 may be performed simultaneously, or Step 3 may be performed before Step 2. In step 4, the operation control part 32 starts the stirrer 85, and stirs the plating liquid to which copper oxide powder was added. The operation control unit 32 stops the stirring operation of the stirrer 85 when a preset time elapses.

In step 5, copper oxide powder is melt|dissolved in the plating liquid to which copper oxide powder was added, flowing through the overflow tank 92 and the bypass flow path 93. And in step 6, the plating liquid in which the copper oxide powder was melt|dissolved is supplied to any one of the plating tanks 2 of the plating apparatus 1 through the plating liquid supply pipe 36. As shown in FIG. The plurality of plating tanks 2 are communicated with each other by a first connecting pipe 110 and a second connecting pipe 112 , and a first connecting pipe 110 and a second connecting pipe between the plating tanks 2 . By driving the pump 113 provided at 112 , the plating solution spreads widely throughout the plurality of plating tanks 2 . In this way, the copper ion concentration in the plating solution used in the plating apparatus 1 is maintained at the set value.

As shown in FIG. 1 , in the plating system according to the first embodiment, the plating solution supply pipe 36 includes a plurality of branch pipes 36a respectively connected to the plurality of plating tanks 2 , and has the same concentration. of the plating solution is supplied to these plating baths (2). In the plating system according to the second embodiment, the plurality of plating tanks 2 communicate with each other, and the plating solution supply pipe 36 is connected to one of the plurality of plating tanks 2 . Therefore, in any embodiment, the concentration of the plating solution in the plurality of plating tanks 2 is maintained uniformly. According to this embodiment, not only the quality of the copper film formed by plating can be improved, but also fluctuations in the plating result between the plating baths 2 can be prevented.

It is preferable to make the average particle diameter of copper oxide powder into the range of 10 micrometers to 200 micrometers (referring to the value measured by the laser diffraction/scattering method). Moreover, as for an average particle diameter, it is more preferable to set it as the range of 20 micrometers to 100 micrometers. When an average particle diameter is too small, we are anxious that copper oxide powder will scatter into space at the time of powder supply. In addition, when the average particle diameter is too large, there is also a concern that the powder becomes difficult to dissolve in the solution quickly.

Moreover, as another method, the plating method which can form the copper film of higher quality on the board|substrate can be provided by using the plating liquid which added the solid material shape|molded in the form of pellets of metallic copper. When the solid material in which metallic copper is formed into pellets in this way is used, copper powder with a small amount of impurities is mixed with the copper oxide powder, so that the plating film quality can be improved. And since it is a pellet form, scattering of the powder at the time of powder supply can be prevented more effectively.

In general, when an alkali metal is powdered, there may be a risk of ignition or explosion, but since the metal copper powder itself also has little risk of ignition or explosion, the metal copper powder can be molded into pellets. As explained in FIG. 1 etc., the solid material which shape|molded such metallic copper into pellet shape may be comprised so that it may be supplied to the plating liquid tank 35 instead of or together with copper oxide powder. Moreover, you may use the solid material which shape|molded both metallic copper and copper oxide powder into pellet shape.

In addition, if the solid material molded into pellets as described above is too hard, it may cause a problem in the plating solution supply device 20, and if it is too soft, there is also a possibility that the scattering of the powder may not be effectively prevented. Therefore, it is good to make the hardness of a pellet into a thing of an appropriate range.

Moreover, although the pellet-form solid substance was demonstrated, the copper solid substance ball made into spherical shape of a small particle diameter, or the strip|belt-shaped thing formed by shape|molding solid copper into ribbon or tape shape can also be used for copper plating process. In this case, you may make it give the axis|shaft of the feeder 30 the crushing effect of solid material.

In the above embodiment, the powder container and the plating liquid supply device in the case of plating copper on the substrate have been described. However, even when the metal species to be plated on the substrate is not copper but other metal such as indium, the powder Vessels, plating systems, and plating methods may be used.

The above-described embodiment is described for the purpose that a person having ordinary knowledge in the technical field to which the present invention pertains can practice the present invention. Various modifications of the above embodiments can be made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, this invention is not limited to the described embodiment, It is to be interpreted in the widest scope according to the technical idea defined by the claim.

1: plating device
2: plating bath
5: help
6: maternity
8: insoluble anode
9: Anode holder
11: substrate holder
15: plating power
17: plating control unit
18a, 18b: Densitometer
20: plating solution supply device
21: powder container
24: sealed chamber
26: inlet
27: Hopper
28: access date
30: feeder
31: motor
32: motion control
35: plating liquid tank
36: plating solution supply pipe
36a: branch pipe
37: plating solution return pipe
37a: discharge pipe
38: flow meter
39: flow control valve
40: pump
41: filter
42: pure water supply line
43: on-off valve
44: flow meter
45: container body
46: powder conduit
47: flow control valve
48: valve
49: handle
50: cap
55: door
56: gloves
58: exhaust port
61: vacuum clamp
65: vibration device
66: pedestal
68: frame
70: ejector
72: compressed air supply pipe
73: bracket
74: cover
75: exhaust pipe
80: weighing machine
81: siege cover
83: inert gas supply line
85: agitator
86: stirring blades
87: motor
88: baffle plate
88a: cutout
91: stirring tank
92: overflow jaw
93: Bypass Euro
95: through hole
110: first connector
112: second connector
113: pump
115: flow meter
116: plating solution discharge valve
118: concentration meter
W: substrate

Claims (26)

A device for supplying a plating solution in which powder containing at least a metal used for plating is dissolved to a plating tank,
a hopper having an inlet connectable to the powder conduit of the powder container accommodating the powder;
a feeder in communication with the lower opening of the hopper;
a motor connected to the feeder;
a plating solution tank connected to the outlet of the feeder and dissolving the powder in the plating solution;
an enveloping cover surrounding the connection portion between the feeder and the plating solution tank;
an inert gas supply line communicating with the inside of the envelope cover to prevent vapor generated from the plating solution in the plating solution tank from entering the feeder;
and an airtight chamber disposed inside the inlet of the hopper,
A vibration device for vibrating the powder container is disposed in the sealed chamber. According to claim 1, wherein the weighing machine for measuring the weight of the hopper and the feeder;
Based on a change in the measured value of the weight, the apparatus further comprising an operation control unit for controlling the operation of the motor. The method according to claim 2, wherein the operation control unit calculates the amount of the powder added to the plating solution from a change in the measured value of the weight, and operates the motor until the amount reaches a target value. device to do. The apparatus according to any one of claims 1 to 3, wherein the inlet of the hopper has a connection seal whose diameter gradually decreases as the distance from the tip increases. 5. The device according to claim 4, wherein the connecting seal is made of an elastic material. The sealed chamber according to any one of claims 1 to 3, characterized in that the sealed chamber is provided with a door for allowing the powder container to be carried therein, and gloves constituting a part of a wall of the sealed chamber. Device. 7. The apparatus according to claim 6, wherein the hermetic chamber has an exhaust port for communicating its interior space to a negative pressure source. delete The apparatus according to claim 6, wherein a vacuum clamp for holding the powder container is disposed in the sealed chamber. The apparatus according to any one of claims 1 to 3, wherein the plating liquid tank is provided with a stirrer for stirring the plating liquid. The apparatus according to claim 10, wherein the plating liquid tank includes a stirring tank in which the stirrer is disposed, and an overflow tank connected to a communication hole formed in a lower portion of the stirring tank. The apparatus according to claim 11, wherein the plating liquid tank further includes a bypass passage adjacent to the overflow tank. The apparatus according to claim 11, wherein the plating liquid tank further includes a plurality of baffle plates disposed in the overflow tank, wherein the plurality of baffle plates are alternately arranged. a plurality of plating baths for plating the substrate;
The device according to any one of claims 1 to 3, and
and a plating solution supply pipe extending from the apparatus to the plurality of plating baths. 15. The plating system according to claim 14, further comprising a plating solution return tube extending from said plurality of plating baths to said apparatus. A method of supplying a powder containing at least a metal used for plating to a plating solution,
Connecting the powder conduit of the powder container containing the powder to the inlet of the hopper,
By vibrating the powder container by a vibrating device in an airtight chamber disposed inside the inlet of the hopper, the powder is supplied from the powder container to the hopper,
In order to prevent vapor generated from the plating solution in the plating solution tank from entering the feeder, an inert gas is supplied to the inside of an envelope cover that surrounds the connection portion between the plating solution tank and the feeder communicating with the lower opening of the hopper,
While measuring the weight of the hopper and the feeder in which the powder is stored, the feeder is operated,
and adding the powder to the plating liquid in the plating liquid tank by the feeder based on a change in the measured value of the weight. The method according to claim 16, further comprising a step of stirring the plating solution to which the powder has been added. 18. The method according to claim 16 or 17, wherein the amount of the powder added to the plating solution is calculated from a change in the measured value of the weight;
The method further comprising the step of operating the feeder until the addition amount reaches a target value. delete delete delete delete delete delete delete delete

Images