TW201930452A - Resin composition applied to printed wiring board and semiconductor device for thinning of the insulating layer - Google Patents

Abstract

The present invention provides a resin composition or the like which can have both an insulating property and a laser processability when the insulating layer is a film. The resin composition of the present invention is a resin composition comprising (A) an epoxy resin, (B) an active ester compound, and (C) an inorganic filler, wherein the coefficient of variation of the particle size distribution of the component (C) is 30% or less, and the average particle diameter is 0.01 [mu]m or more and 5 [mu]m or less.

Description

Resin composition

The present invention relates to a resin composition. Further, the present invention relates to a resin sheet, a printed wiring board, and a semiconductor device using a resin composition.

As a manufacturing technique of a printed wiring board, for example, a manufacturing method of a build-up method in which an insulating layer and a conductor layer are alternately stacked is known. In the production method of the build-up method, generally, the insulating layer is formed by thermally curing the resin composition. For example, Patent Document 1 discloses that a resin sheet including a support and a resin composition layer containing cerium oxide particles provided on the support is laminated on the inner substrate, and then the resin composition is laminated on the inner substrate. The resin composition layer is thermally cured, and the obtained hardened body is subjected to a roughening treatment to form an insulating layer.

Further, for example, Patent Document 2 discloses a technique for lowering the thermal expansion coefficient of the formed insulating layer by increasing the content of the inorganic filler such as cerium oxide particles in the resin composition.
[Previous Technical Literature]
[Patent Literature]

[Patent Document 1] International Publication No. 2010/35451
[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-202865

[Problems to be solved by the invention]

In recent years, in order to achieve miniaturization of electronic equipment, the thickness of the printed wiring board has been promoted. Accordingly, the insulating layer is required to be thinned.

In the case of the roughening treatment, Patent Document 1 discloses that the cerium oxide particles on the surface of the hardened body are detached, thereby realizing an insulating layer which exhibits sufficient peeling strength with respect to the conductor layer. However, as a result of careful examination by the inventors, it has been found that only the cerium oxide particles are detached, and a rough surface having a uniform low thickness cannot be obtained, and the size of the detachment trace can be obtained due to the deviation of the size of the cerium oxide particles. Uniform roughened surface. When the insulating layer is a thin film, the surface of the roughened surface penetrating the insulating layer and the surface on the opposite side thereof are separated by the detachment trace, and one conductor layer and the other conductor layer are electrically connected via the detachment trace, thereby maintaining the insulating property. Difficult. On the other hand, the present inventors have found that when the resin composition contains a hydrophobic resin such as an active ester compound, a roughening treatment can be performed to form a roughened surface having a low thickness.

However, the insulating layer has a via hole formed for interlayer connection. Vias are typically formed by laser processing. In the case of laser processing, there is a case where residue is generated, but the residue is usually removed during the roughening treatment. However, a hydrophobic resin such as an active ester compound has high resistance to a chemical solution for roughening treatment. Therefore, when an active ester compound is used, the removal of the residue is likely to be insufficient. When the residue is not sufficiently removed, the via hole is blocked by the residue, so that the interlayer connection becomes poor and the conduction reliability is poor.

When the resin composition containing a hydrophobic resin such as an active ester compound is subjected to a roughening treatment, in order to improve the residue removal property, it is considered that the chemical solution used for the roughening treatment is stronger than usual, or the temperature is made higher. The roughening treatment conditions form a worse condition. However, the inorganic filler contained in the resin composition is easily detached due to severe conditions. As disclosed in Patent Document 1, the roughened surface having a large detachment trace is difficult to maintain the insulation performance.

As described above, in the case of using an active ester compound, the formation of via holes is likely to be insufficient by laser processing in the case of normal roughening treatment conditions. Further, in the case of poor roughening treatment, the via holes can be stably formed by laser processing, but the insulating layer is unintentionally opened due to the detachment of the inorganic filler, and the insulating property is liable to be lowered. Therefore, when an active ester compound is used, it is difficult to achieve both insulation performance and laser processability.

Here, the laser processability indicates the ease of formation of the via holes by the irradiation including the laser irradiation and the subsequent roughening treatment.

In the case of such a problem, in particular, when the insulating layer is thin, it is difficult to solve the above-mentioned problems because the inorganic filler is detached during the roughening treatment, and the unintended pores are easily formed.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a resin composition which can have both an insulating property and a laser processability even if the insulating layer is a film, and a resin composition layer containing the resin composition. a resin sheet; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the cured product of the resin composition.

[Means to solve the problem]

As a result of careful examination of the above-mentioned problems, the present inventors have found that the above problems can be solved by a resin composition comprising (A) an epoxy resin, (B) an active ester compound, and (C) a specific inorganic filler. The present invention has been completed.
That is, the present invention encompasses the following.

[1] A resin composition comprising a resin composition of (A) an epoxy resin, (B) an active ester compound, and (C) an inorganic filler, wherein a coefficient of variation of a particle size distribution of the component (C) is 30 % or less, the average particle diameter is 0.01 μm or more and 5 μm or less.
[2] The resin composition according to the above [1], wherein the content of the component (C) is 50% by mass or more when the nonvolatile content in the resin composition is 100% by mass.
[3] The resin composition according to the above [1] or [2], wherein the component (C) has an average particle diameter of 0.1 μm or more and 3 μm or less.
[4] The resin composition according to any one of the above [1] to [3] which is used for forming an insulating layer of a printed wiring board.
[5] The resin composition according to any one of the above [1] to [4], wherein a ratio (L/S) of a circuit width (L (μm)) to a width (S (μm)) between the circuits is A circuit of 10 μm/10 μm or less is formed.
[6] The resin composition according to any one of [1] to [5], which is a resin composition for forming an insulating layer having a surface having an arithmetic mean roughness (Ra) of 150 nm or less.
[7] The resin composition according to any one of [1] to [6] which is a resin composition for forming a via hole by laser irradiation.
[8] The resin composition according to any one of the above [1] to [7], which is selected from any of 10 on the surface of the cured product which is thermally cured at 200 ° C for 90 minutes, perpendicular thereto. In the sectional image of the surface of the cured product, when an arbitrary selection width of 100 μm and a depth of 5 μm are observed,
When the maximum particle diameter of the component (C) is R1 (μm) and the average particle diameter of the component (C) is R2 (μm), it satisfies
R1 < 1.4 × R2 relationship.
[9] The resin composition according to any one of the above [1] to [8], which is selected from any of 10 on the surface of the cured product which is thermally cured at 200 ° C for 90 minutes, perpendicular thereto. In the cross-sectional view of the surface of the cured product, when an arbitrary selection width of 100 μm and a depth of 5 μm are observed,
When the average particle diameter of the component (C) is R2 (μm),
The number of particles having a particle diameter of (1.2 × R 2 ) μm or more is 4 or less.
[10] A resin sheet comprising a support, and a resin composition layer comprising the resin composition according to any one of [1] to [9], which is provided on the support.
[11] The resin sheet according to the above [10], wherein the resin composition layer has a thickness of 15 μm or less.
[12] A resin sheet comprising a support and a resin composition layer containing a resin composition containing (C) an inorganic filler, which is provided on the support,
When the non-volatile component in the resin composition is 100% by mass, the resin composition contains 50% by mass or more of (C) inorganic filler.
Select any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe the arbitrarily selected width of 100 μm and depth of 5 μm. ,
(C) when the maximum particle diameter of the inorganic filler is R1 (μm), and (C) when the average particle diameter of the inorganic filler is R2 (μm),
The relationship of R1 < 1.4 × R2 is satisfied.
[13] A resin sheet comprising a support and a resin composition layer containing a resin composition containing (C) an inorganic filler, which is provided on the support,
When the non-volatile component in the resin composition is 100% by mass, the resin composition contains 50% by mass or more of (C) inorganic filler.
Select any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe the arbitrarily selected width of 100 μm and depth of 5 μm. ,
(C) When the maximum particle size of the inorganic filler is R2 (μm),
The number of particles having a particle diameter of (1.2 × R 2 ) μm or more is 4 or less.
[14] A printed wiring board comprising a printed wiring board including a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer;
The insulating layer is a cured product of the resin composition according to any one of the above [1] to [9].
[15] A semiconductor device comprising the printed wiring board according to [14] above.

[Effect of the invention]

According to the present invention, there is provided a resin composition which can have both insulating properties and laser processability even if the insulating layer is a film; a resin sheet having a resin composition layer containing the resin composition; and a resin composition comprising the foregoing resin a printed wiring board of an insulating layer formed of a cured product; and a semiconductor device including the cured product of the resin composition.

The embodiments and examples are shown below, and the present invention will be described in detail. However, the present invention is not limited to the embodiments and examples exemplified below, and may be arbitrarily changed without departing from the scope of the invention and the scope of the invention.

[Resin composition]
The resin composition of the present invention comprises a resin composition of (A) an epoxy resin, (B) an active ester compound, and (C) an inorganic filler, wherein the coefficient of variation of the particle size distribution of the component (C) is 30% or less. The average particle diameter is 0.01 μm or more and 5 μm or less. By combining the above-mentioned (A) epoxy resin, (B) active ester compound, and (C) specific inorganic filler, it is possible to obtain the present invention which can have both insulating properties and laser processability even if the insulating layer is a film. The desired effect. Even if the surface of the cured product of the resin composition is roughened by more severe conditions than usual, the removal trace of the (C) inorganic filler of the roughened surface is uniform and small, and as a result, the insulation can be improved even if the insulating layer is thin. reliability. Therefore, the cured product of the resin composition exhibits excellent characteristics and is suitable for use as an insulating layer of a printed wiring board.

Further, the resin composition may be combined with the components (A) to (C), and further contains any component. Examples of the optional component include (D) a curing agent, (E) a curing accelerator, (F) a thermoplastic resin, (G) a flame retardant, and (H) other additives.

<(A) Epoxy Resin>
The resin composition is an epoxy resin (A) containing (A) as a component. (A) Epoxy resin, for example, bisxylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin , dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type Epoxy resin, naphthol type epoxy resin, bismuth type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac epoxy resin, biphenyl type epoxy resin, Linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, screw-containing epoxy resin, cyclohexane epoxy resin, cyclohexane Dimethanol type epoxy resin, naphthene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, and the like. Among them, a bisphenol A type epoxy resin and a biphenyl type epoxy resin are preferable. Epoxy resins may be used alone or in combination of two or more.

(A) It is preferred that the epoxy resin has two or more epoxy groups in one molecule. When the non-volatile component of the epoxy resin is 100% by mass, at least 50% by mass or more is preferably an epoxy resin having two or more epoxy groups in one molecule. Among them, the resin composition system includes an epoxy resin (hereinafter also referred to as "liquid epoxy resin") which is liquid at a temperature of 20 ° C and an epoxy resin which is solid at a temperature of 20 ° C (hereinafter also referred to as " Solid epoxy resin" is preferred. The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule. The solid epoxy resin is preferably a solid epoxy resin having three or more epoxy groups in one molecule. Further, the liquid epoxy resin and the solid epoxy resin are preferably an aromatic epoxy resin.

The liquid epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AF epoxy resin, naphthalene epoxy resin, glycidyl ester epoxy resin, glycidylamine Type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having ester skeleton, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, glycidyl amine type epoxy resin An aliphatic epoxy resin and an epoxy resin having a butadiene structure are preferred, and more preferably an aliphatic epoxy resin, a bisphenol A epoxy resin, or a bisphenol F epoxy resin.

Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene epoxy resin) manufactured by DIC Corporation, "828US" manufactured by Mitsubishi Chemical Co., Ltd., "jER828EL", and "825". "Epikote828EL" (bisphenol A type epoxy resin), "jER807", "1750" (bisphenol F type epoxy resin), "jER152" (phenol novolak type epoxy resin), "630", "630LSD" (Glycidylamine type epoxy resin), "ZX1059" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin), manufactured by Nagase Chemtex Co., Ltd. EX-721" (glycidyl ester type epoxy resin), "CELLOXID2021P" manufactured by DAICEL Co., Ltd. (alicyclic epoxy resin having an ester skeleton), and "PB-3600" (epoxy resin having a butadiene structure) ) "ZX1658", "ZX1658GS" (liquid 1,4-glycidyl cyclohexane type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., and "630LSD" (Glycidylamine type) manufactured by Mitsubishi Chemical Co., Ltd. Epoxy resin), "EXA-850CRP" (bisphenol A type epoxy resin) manufactured by DIC Corporation, Mitsubishi Chemical "YED-216D" (aliphatic epoxy resin) manufactured by al Corporation, "EP-3950S" manufactured by ADEKA Corporation, "EP-3980S" (glycidylamine epoxy resin); "ELM" by Sumitomo Chemical Co., Ltd. -100H" (glycidylamine type epoxy resin) or the like. These may be used alone or in combination of two or more.

The solid epoxy resin is a bisxylenol type epoxy resin, a naphthalene type epoxy resin, a naphthalene type 4-functional epoxy resin, a cresol novolac epoxy resin, a dicyclopentadiene type epoxy resin, and a trisphenol. Epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthene ether type epoxy resin, bismuth type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, four The phenylethane type epoxy resin is preferred, and more preferably a bisxylenol type epoxy resin, a naphthalene type epoxy resin, a bisphenol AF type epoxy resin, and a naphthene ether type epoxy resin.

Specific examples of the solid epoxy resin include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type 4-functional epoxy resin) manufactured by DIC Corporation. "N-690" (cresol novolac epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac epoxy resin) manufactured by DIC Corporation; "HP-7200" manufactured by DIC Corporation (2) Cyclopentadiene type epoxy resin); "HP-7200HH", "HP-7200H", "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA" manufactured by DIC Corporation -7311-G4S", "HP6000" (Naphthyl Ether Epoxy Resin); "EPPN-502H" (Trisphenol Epoxy Resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (Naphthalene) manufactured by Nippon Kayaku Co., Ltd. "Phenolic novolac type epoxy resin"; "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. (naphthalene type epoxy resin); "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; "YX4000H", "YX4000", "YL6121" manufactured by Mitsubishi Chemical Co., Ltd. (Biphenyl type epoxy resin); "YX4000HK" (bisxylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX8800" (蒽 type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; manufactured by Osaka Gas Chemical Co., Ltd. "PG-100", "CG-500"; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL7800" (茀 type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; manufactured by Mitsubishi Chemical Co., Ltd. "jER1010" (solid bisphenol A type epoxy resin); "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., and the like. These may be used alone or in combination of two or more.

When the liquid epoxy resin and the solid epoxy resin are used together as the component (A), the mass ratio (liquid epoxy resin: solid epoxy resin) is preferably a ratio of 1:0.01. The range of 1:20. By setting the ratio of the liquid epoxy resin to the solid epoxy resin in this range, i) has a moderate adhesiveness, ii) sufficient flexibility is obtained, and workability is improved, and iii) The effect of a cured product having a very high breaking strength or the like is obtained. From the viewpoint of the effects of the above i) to iii), the ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is preferably a mass ratio of 1:0.05. The range of ~1:15 is more preferably in the range of 1:0.1~1:10.

When the content of the component (A) in the resin composition is such that an insulating layer exhibiting good mechanical strength and insulation reliability is obtained, when the nonvolatile content in the resin composition is 100% by mass, it is preferably 1 mass. More than %, more preferably 5% by mass or more, and still more preferably 10% by mass or more. The upper limit of the content of the epoxy resin is not particularly limited as long as it exhibits the effects of the present invention, but is preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably 20% by mass or less.
In the present invention, the content of each component in the resin composition is not a value of 100% by mass of the nonvolatile component in the resin composition.

The epoxy equivalent of the component (A) is preferably from 50 to 5,000, more preferably from 50 to 3,000, still more preferably from 80 to 2,000, still more preferably from 110 to 1,000. In this range, the crosslinking density of the cured product becomes sufficient, and an insulating layer having a small surface roughness can be obtained. Further, the epoxy equivalent can be measured in accordance with JIS K7236 and is a mass of a resin containing 1 equivalent of an epoxy group.

The weight average molecular weight of the component (A) is preferably from 100 to 5,000, more preferably from 250 to 3,000, still more preferably from 400 to 1,500. Here, the weight average molecular weight of the epoxy resin is a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatography (GPC) method.

<(B) Active ester compound>
The resin composition contains the (B) active ester compound as the component (B). When an active ester compound is used, the residue removal property is usually inferior. However, since the resin composition of the present invention contains the inorganic filler (C) described later, high insulating properties can be achieved even if the roughening treatment is carried out under more severe conditions than usual. Therefore, the roughening treatment can be performed under more severe conditions than usual, and high laser processability can be achieved.

The active ester compound has a function of curing the (A) epoxy resin, and it is generally preferred to use one of a molecule such as a phenol ester, a thiophenolate ester, an N-hydroxylamine ester, or an ester of a heterocyclic hydroxy compound. Two or more compounds having a high reactivity of an ester group. The active ester compound is preferably obtained by a condensation reaction of a carboxylic acid compound and/or a thiocarboxylic acid compound with a hydroxy compound and/or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester compound obtained from a carboxylic acid compound and a phenol compound and/or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, isaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, and methylated double Phenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, benzenetriol, dicyclopentadiene-type diphenol compound, phenol novolac Varnish, etc. Here, the "dicyclopentadiene type diphenol compound" means a diphenol compound obtained by condensing 1 molecule of dicyclopentadiene with 2 molecules of phenol.

Specifically, the component (B) is an active ester compound containing a dicyclopentadiene type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated phenol novolak, and a phenol novolac. The active ester compound of the benzamidine compound is preferred, and more preferably an active ester compound containing a naphthalene structure or an active ester compound containing a dicyclopentadiene type diphenol structure. The "dicyclopentadiene type diphenol structure" means a divalent structural unit composed of a phenyl-dicyclopentylene-phenylene group.

A commercially available product of an active ester compound, which comprises an active ester compound of a dicyclopentadiene-type diphenol structure, and examples thereof include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", and "HPC-8000H". -65TM", "EXB-8000L-65TM" (manufactured by DIC Corporation), including an active ester compound of a naphthalene structure, and "EXB-8150-60T" and "EXB9416-70BK" (manufactured by DIC Corporation), including phenol novolac The active ester compound of the acetylated oxime is exemplified by "DC 808" (manufactured by Mitsubishi Chemical Co., Ltd.), and the active ester compound of the phenyl sulfonate of the phenol novolak, and the "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.) is contained, and the phenol novolac is contained. The active ester compound of the varnish of the varnish is exemplified by "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.) and the active ester-based curing agent of benzamidine of the phenol novolak, and "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.), " YLH1030 (manufactured by Mitsubishi Chemical Co., Ltd.), "YLH1048" (manufactured by Mitsubishi Chemical Co., Ltd.), and the like.

The ratio of the (A) epoxy resin to the (B) active ester compound is a ratio of [the total number of epoxy groups of the epoxy resin]: [the total number of reactive groups of the active ester compound], preferably 1: The range of 0.01~1:5 is more preferably 1:0.05~1:2, and even more preferably 1:0.1~1:1. Here, the reactive group of the active ester compound means an active ester group. Further, the total number of epoxy groups of the epoxy resin means that the solid content of each epoxy resin is divided by the epoxy equivalent value, and the total value of the reactive groups of the active ester compound is the total value of all the epoxy resins. The value obtained by dividing the mass of the solid component of each active ester compound by the equivalent of the reactive group is the value for the total of all the active ester compounds. By setting the ratio of the epoxy resin to the active ester compound to this range, the heat resistance of the cured product of the resin composition can be further improved.

(B) The content of the active ester compound is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 5% by mass or more, when the nonvolatile content in the resin composition is 100% by mass. Further, the upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less. By setting the content of the component (B) within this range, a cured product excellent in residue removal property can be obtained.

<(C) Inorganic filler>
The resin composition contains (C) an inorganic filler as the component (C). Usually, the (C) inorganic filler is contained in the resin composition in the form of particles. The inorganic filler (C) has an average particle diameter of 0.01 μm or more, preferably 0.05 μm or more, more preferably 0.1 μm or more and 0.3 or more. The upper limit is 5 μm or less, preferably 3 μm or less, more preferably 1 μm or less or 0.5 μm or less. When the average particle diameter of the (C) inorganic filler is below this upper limit, the insulation reliability can be improved even if the insulating layer is thin. In addition, the filling property of the (C) inorganic filler in the resin composition can be further increased by the lower limit or more, and the desired effect of the present invention can be remarkably obtained.

(C) The average particle diameter of the particles of the inorganic filler can be measured by a laser diffraction/scattering method according to the Mie scattering theory. Specifically, the particle size distribution of the particles is prepared on a volume basis by a laser diffraction scattering type particle size distribution measuring device, and the average particle diameter is measured from the particle diameter distribution as a median diameter. The measurement sample is preferably one in which a particle is dispersed in a solvent such as water by ultrasonic waves. For the laser diffraction scattering type particle size distribution measuring device, "LA-500" manufactured by Horiba, Ltd., and "SALD-2200" manufactured by Shimadzu Corporation can be used.

The coefficient of variation of the particle size distribution of the inorganic filler (C) is 30% or less, preferably 20% or less, more preferably 10% or less, still more preferably 5% or less. The lower limit is not particularly limited, but may be 0% or more. The coefficient of variation of the particle size distribution is preferably as close as possible to 0%. When the coefficient of variation of the particle size distribution of the (C) inorganic filler is within this range, the particle size distribution of the inorganic filler (C) is sharp. Therefore, even if the roughening treatment is performed under more severe conditions than usual, (C) the inorganic filler is detached, and the detachment marks of the roughened surface are uniform, and even if the insulating layer is a film, the size of the detachment trace can be suppressed, and the insulation can be prevented. The roughened surface of the layer is opposite to the side of the opposite side. As a result, the insulation reliability can be improved even if the insulating layer is thin. The particle size distribution is a volume-based particle size distribution.

(C) The coefficient of variation of the particle size distribution of the inorganic filler particles can be obtained by multiplying the standard deviation of the average particle diameter by the arithmetic mean of the average particle diameter by 100 (%). The standard deviation is preferably 0.0001 or more, more preferably 0.001 or more, still more preferably 0.01 or more, more preferably 0.5 or less, still more preferably 0.1 or less, still more preferably 0.05 or less. Further, the arithmetic mean is preferably 0.01 or more, more preferably 0.05 or more, still more preferably 0.1 or more, more preferably 5 or less, still more preferably 3 or less, still more preferably 1 or less. By setting the standard deviation and the arithmetic mean to be within this range, the coefficient of variation can be set within a specific range.

Considering selecting any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, the range of 100 μm width and depth 5 μm is selected arbitrarily. The situation. In this case, the maximum particle diameter of the (C) inorganic filler is R1 (μm), and the average particle diameter of the inorganic filler (C) is R2 (μm). In this case, the maximum particle diameter R1 and the average particle diameter R2 preferably satisfy the relationship of the following formula (1), more preferably satisfy the relationship of the following formula (2), and more preferably satisfy the following formula (3). Relationship. By satisfying this relationship by the maximum particle diameter R1 and the average particle diameter R2, even if the roughening treatment is performed under more severe conditions than usual, (C) the inorganic filler is detached, and the detachment trace of the roughened surface is also small, resulting in insulation even. Thin layers can also improve insulation reliability. The above cross-sectional view, for example, observed using a FIB-SIM composite device, can also measure the maximum particle diameter R1 and the average particle diameter R2 from the image.
R1<1.4×R2 (1)
R1<1.3×R2 (2)
R1<1.2×R2 (3)

Considering selecting any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, the range of 100 μm width and depth 5 μm is selected arbitrarily. The situation. At this time, the average particle diameter of the (C) inorganic filler is R2 (μm). In this case, the number of particles having a particle diameter of (1.2 × R 2 ) μm or more is preferably small. The number of the specific ones is preferably 4 or less, more preferably 3 or less, still more preferably 2 or less and 1 or less. The number of (C) inorganic fillers having a particle diameter of 1.2 times or more of the average particle diameter of (C) the inorganic filler observed in a specific range is within this range, even under more severe conditions than usual. In the roughening treatment, (C) the inorganic filler is detached, and the detachment trace of the roughened surface is also small, and as a result, the insulation reliability can be improved even if the insulating layer is thin. The cross-sectional view is observed by, for example, a FIB-SIM composite device, and the number of particles having an average particle diameter R2 and a particle diameter of (1.2 × R 2 ) μm or more can be measured from the image.

(C) The material of the inorganic filler is an inorganic compound. (C) The material of the inorganic filler may, for example, be cerium oxide, aluminum oxide, glass, indigo, cerium oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, water Aluminite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, barium carbonate, barium titanate, calcium titanate, magnesium titanate, Barium titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium phosphotungstate, and the like. Among these, the viewpoint of the desired effect of the present invention is remarkably obtained, and particularly preferred is cerium oxide. Examples of the cerium oxide include amorphous cerium oxide, molten cerium oxide, crystalline cerium oxide, synthetic cerium oxide, hollow cerium oxide, and the like. Further, the cerium oxide is preferably spherical cerium oxide. (C) The inorganic filler may be used alone or in combination of two or more kinds in any ratio.

Examples of the inorganic filler (C) include "seahosterKE-S10", "seahosterKE-S20", "seahosterKE-S30", "seahosterKE-S50", and "KE-P30" manufactured by Nippon Shokubai Co., Ltd.; NIPPON "SP60-05" and "SP507-05" manufactured by STEEL & SUMIKIN MATERIALS, "YC100C", "YA050C", "YA050C-MJE" and "YA010C" manufactured by Admatechs Inc.; "UFP-30" manufactured by Denka Corporation "SilFileNSS-3N", "SilFileNSS-4N" and "SilFileNSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2" and "SO-C1" manufactured by Admatechs; Wait.

(C) The inorganic filler can be adjusted within a range of a coefficient of variation of a specific particle size distribution and a specific average particle diameter, for example, by classification.

(C) The inorganic filler is preferably surface treated with a suitable surface treatment agent. By surface treatment, the moisture resistance and dispersibility of the (C) inorganic filler can be improved. Examples of the surface treatment agent include a fluorine-containing decane coupling agent, an amino decane coupling agent, an epoxy decane coupling agent, a mercapto decane coupling agent, a decane coupling agent, an alkoxy decane compound, and an organic decazane. A compound, a titanate coupling agent, or the like.

For example, "KBM22" (dimethyl dimethoxy decane) manufactured by Shin-Etsu Chemical Co., Ltd., and "KBM403" (3-glycidoxypropyltrimethoxy) manufactured by Shin-Etsu Chemical Co., Ltd., may be used as a commercial product of the surface treatment agent. "Ketamine", "KM903" (3-aminopropyltrimethoxydecane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd. "KBM573" (N-phenyl-3-aminopropyltrimethoxydecane), "KBM5783" (N-phenyl-3-aminooctyltrimethoxydecane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd. "SZ-31" (hexamethyldioxane) manufactured by Seiko Chemical Co., Ltd., "KBM103" (phenyltrimethoxydecane) manufactured by Shin-Etsu Chemical Co., Ltd., and "KBM-4803" (long-chain epoxy resin manufactured by Shin-Etsu Chemical Co., Ltd.) Basic decane coupling agent) and the like. Among them, a decane coupling agent containing a nitrogen atom is preferred, an amine decane coupling agent containing a phenyl group is more preferred, and N-phenyl-3-aminoalkyltrimethoxy decane is more preferred. Further, the surface treatment agent may be used alone or in combination of two or more kinds in any ratio.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the (C) inorganic filler. (C) The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, from the viewpoint of improving the dispersibility of the (C) inorganic filler. It is 0.2 mg/m ² or more. Further, from the viewpoint of suppressing the melt viscosity of the resin composition and the increase in the melt viscosity in the sheet form, the amount of carbon is preferably 1 mg/m ² or less, more preferably 0.8 mg/m ² or less, and particularly preferably 0.5 mg. /m ² or less.

(C) The amount of carbon per unit surface area of the inorganic filler, the surface-treated (C) inorganic filler can be washed by a solvent (for example, methyl ethyl ketone (hereinafter sometimes abbreviated as "MEK")) Processing is measured later. Specifically, a sufficient amount of methyl ethyl ketone was mixed with the (C) inorganic filler surface-treated with a surface treatment agent, and ultrasonically washed at 25 ° C for 5 minutes. Then, after removing the supernatant liquid and drying the solid component, the amount of carbon per unit surface area of the inorganic filler (C) can be measured using a carbon analyzer. For the carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd. can be used.

The amount of the (C) inorganic filler in the resin composition is 100% by mass, preferably 50% by mass or more, more preferably 55% by mass or more, and still more preferably 60% by mass based on the nonvolatile content in the resin composition. % or more is preferably 80% by mass or less, more preferably 75% by mass or less, still more preferably 70% by mass or less. The insulating property of the film can be improved by the amount of the (C) inorganic filler within the above range. Further, according to the present invention, even in the case where the film contains many inorganic fillers, the insulation reliability can be improved.

<(D) hardener>
The resin composition may also contain (D) a hardener as an optional component. However, (B) the active ester compound is not included in the (D) hardener. The (D) curing agent is not particularly limited as long as it has a function of curing the epoxy resin (A), and examples thereof include a phenolic curing agent, a naphthol curing agent, and a benzoxazine curing agent. A cyanate-based curing agent, a carbodiimide-based curing agent, and the like. In view of the improvement of the insulation reliability, (D) the curing agent is preferably one or more of a phenolic curing agent, a naphthol curing agent, a cyanate curing agent, and a carbodiimide curing agent. The bismuth contains a phenolic hardener. The curing agent may be used alone or in combination of two or more.

The phenolic curing agent and the naphthol-based curing agent are preferably a phenolic curing agent having a novolac structure or a naphthol-based curing agent having a novolac structure from the viewpoint of heat resistance and water resistance. Moreover, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferred, and a phenol-based curing agent containing a triazine skeleton is more preferred.

Specific examples of the phenolic curing agent and the naphthol-based curing agent include "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Mingwa Chemical Co., Ltd., and "NHN" manufactured by Nippon Kayaku Co., Ltd. "CBN", "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V" and "SN375" made by Nippon Steel & Sumitomo Chemical Co., Ltd. "SN395", "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500" manufactured by DIC Corporation.

Specific examples of the benzoxazine-based curing agent include "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "P-d" and "F-a" manufactured by Shikoku Chemical Industries, Ltd.

Examples of the cyanate-based curing agent include bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylenecyanate), and 4,4'-Asia. Methyl bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-dual ( 4-cyanate) phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3- Bis(4-cyanate phenyl-1-(methylethylidene)) benzene, bis(4-cyanate phenyl) sulfide, and bis(4-cyanate phenyl) ether A polyfunctional cyanate resin derived from a functional cyanate resin, a phenol novolak, a cresol novolak, or the like, or a triazine-based prepolymer such as a part of the cyanate resin. Specific examples of the cyanate-based curing agent include "PT30" and "PT60" (phenol novolac type polyfunctional cyanate resin) manufactured by Lonza Japan Co., Ltd., and "ULL-950S" (polyfunctional cyanate resin). "BA230" or "BA230S75" (a part or all of bisphenol A dicyanate is triazineated to form a prepolymer of a terpolymer).

Specific examples of the carbodiimide-based curing agent include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co., Ltd.

When the resin composition contains (D) a hardener, the ratio of the epoxy resin to the hardener (D) is a ratio of [the total number of epoxy groups of the epoxy resin]: [the total count of the reactive groups of the hardener] Preferably, it is in the range of 1:0.01 to 1:2, more preferably 1:0.01 to 1:1, and even more preferably 1:0.05 to 1:0.5. Here, the reactive group of the curing agent is an active hydroxyl group or the like, which varies depending on the type of the curing agent. Further, the total number of epoxy groups of the epoxy resin means a value obtained by dividing the mass of the solid content of each epoxy resin by the epoxy equivalent, and the value of the total of all the epoxy resins, and the total number of reactive groups of the hardener The value obtained by dividing the solid content of each hardener by the reaction group equivalent is a value for the total of all the hardeners. By setting the ratio of the epoxy resin to the hardener in this range, the heat resistance of the cured product of the resin composition can be further improved.

When the resin composition contains (B) an active ester compound and (D) a hardener, the ratio of the epoxy resin to the (B) active ester compound and (D) the hardener is [the total number of epoxy groups of the epoxy resin] The ratio of [the total of the reactive groups of the components (B) and (D)] is preferably in the range of 1:0.01 to 1:5, more preferably 1:0.01 to 1:3, still more preferably 1: 0.01~1:1.5. By setting the ratio of the epoxy resin to the amount of the component (B) and the component (D) to be in this range, the heat resistance of the cured product of the resin composition can be further improved.

When the resin composition contains (D) a curing agent, the content of the curing agent (D) is preferably 0.1% by mass or more, and more preferably 0.5% by mass, when the nonvolatile content in the resin composition is 100% by mass. The above is more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 10% by mass or less, still more preferably 8% by mass or less. By setting the content of the (D) curing agent within this range, the heat resistance of the cured product of the resin composition can be further improved.

<(E) hardening accelerator>
The resin composition may contain (E) a hardening accelerator as an optional component. When the resin composition is cured by using a hardening accelerator, hardening can be promoted.

(E) The hardening accelerator may, for example, be a phosphorus-based curing accelerator, an amine-based curing accelerator, an imidazole-based curing accelerator, a lanthanum-based curing accelerator, or a metal-based curing accelerator. Among them, a phosphorus-based curing accelerator, an amine-based curing accelerator, an imidazole-based curing accelerator, and a metal-based curing accelerator are preferable, and an amine-based curing accelerator, an imidazole-based curing accelerator, and a metal-based curing accelerator are more preferable. The curing accelerator may be used alone or in combination of two or more.

Examples of the phosphorus-based hardening accelerator include triphenylphosphine, barium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonate, and (4- Methylphenyl)triphenylsulfonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like. Among them, preferred are triphenylphosphine and tetrabutylphosphonate.

Examples of the amine-based curing accelerator include a trialkylamine such as triethylamine or tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, and 2,4,6,-tri ( Dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, 4-pyrrolidinopyridine, and the like. Among them, 4-dimethylaminopyridine, 1,8-diazabicyclo(5,4,0)-undecene and 4-pyrrolidinopyridine are preferred.

Examples of the imidazole-based hardening accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methylimidazole. , 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1 - cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[ 2'-Methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-B Base-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4- Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine iso-cyanuric acid adduct, 2-phenylimidazolium isocyanurate adduct , 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a Benzimidazole, 1-dodecyl-2-methyl-3-benzyl An imidazole compound such as oxazolidine chloride, 2-methylimidazoline or 2-phenylimidazoline, and an adduct of an imidazole compound and an epoxy resin (Adduct). Among them, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferred.

For the imidazole-based hardening accelerator, a commercially available product can be used, and for example, "P200-H50" manufactured by Mitsubishi Chemical Co., Ltd.; "2E4MZ" manufactured by Shikoku Chemicals Co., Ltd.;

Examples of the lanthanide hardening accelerator include dicyandiamide, 1-methyl hydrazine, 1-ethyl hydrazine, 1-cyclohexyl hydrazine, 1-phenyl fluorene, 1-(o-methylphenyl) fluorene, and dimethyl group. Bismuth, diphenyl hydrazine, trimethyl hydrazine, tetramethyl hydrazine, pentamethyl hydrazine, 1,5,7-triazabicyclo [4.4.0] 癸-5-ene, 7-methyl- 1,5,7-triazabicyclo[4.4.0]non-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-Dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allyl biguanide, 1-phenylbiguanide, 1-(o-methylphenyl)biguanide, and the like. Among them, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]non-5-ene are preferred.

The metal-based hardening accelerator may, for example, be an organometallic complex or an organic metal salt of a metal such as cobalt, copper, zinc, iron, nickel, manganese or tin. Specific examples of the organometallic complex include an organic cobalt complex such as cobalt (II) acetate, cobalt (III), and an organic copper complex such as copper (II). An organic zinc complex such as zinc ketone (II), an organic iron complex such as iron(III) acetonate, an organic nickel complex such as acetonitrile acetone (II), or manganese acetylacetonate (II) ) an organic manganese complex or the like. Examples of the organic metal salt include zinc octoate, tin octylate, zinc naphthate dezinc, cobalt naphthenate, tin stearate, and zinc stearate.

When the resin composition contains (E) a curing accelerator, the amount of the (E) curing accelerator is remarkably obtained from the viewpoint of the desired effect of the present invention, and is preferably 0.01% by mass based on 100% by mass of the resin component of the resin composition. The mass% or more is more preferably 0.05% by mass or more, more preferably 0.1% by mass or more, more preferably 3% by mass or less, still more preferably 1% by mass or less, still more preferably 0.5% by mass or less.

<(F) thermoplastic resin>
The resin composition may also contain (F) a thermoplastic resin as an optional component. Examples of the (F) thermoplastic resin include a phenoxy resin, a polyvinyl acetal resin, a polyolefin resin, a polybutadiene resin, a polyimide resin, a polyamide amide resin, and a polyether oxime. The imine resin, the polyfluorene resin, the polyether oxime resin, the polyphenylene ether resin, the polycarbonate resin, the polyether ether ketone resin, the polyester resin or the like is preferably a phenoxy resin. The thermoplastic resin may be used singly or in combination of two or more.

(F) The weight average molecular weight of the thermoplastic resin in terms of polystyrene, preferably 30,000 or more, more preferably 35,000 or more, still more preferably 40,000 or more. The upper limit is preferably 100,000 or less, more preferably 70,000 or less, and still more preferably 60,000 or less. (F) The polystyrene-equivalent weight average molecular weight of the thermoplastic resin can be measured by a gel permeation chromatography (GPC) method. Specifically, (F) the polystyrene-equivalent weight average molecular weight of the thermoplastic resin is used as the measuring device, the LC-9A/RID-6A manufactured by Shimadzu Corporation, and the Shodex K-800P/K manufactured by Showa Denko Co., Ltd. -804L/K-804L, as a mobile phase of chloroform, etc., measured at a column temperature of 40 ° C, can be calculated using a standard polystyrene calibration line.

The phenoxy resin may, for example, be selected from the group consisting of a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolac skeleton, a biphenyl skeleton, an anthracene skeleton, and a dicyclopentadiene skeleton. A phenoxy resin having one or more kinds of skeletons in a group consisting of a norbornene skeleton, a naphthalene skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be a functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin may be used alone or in combination of two or more. Specific examples of the phenoxy resin include "1256" and "4250" manufactured by Mitsubishi Chemical Co., Ltd. (both phenoxy resins containing a bisphenol A skeleton), and "YX8100" (phenoxy group containing a bisphenol S skeleton). "Resin" and "YX6954" (phenoxy resin containing bisphenol acetophenone skeleton), "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., and "YL7500BH30" manufactured by Mitsubishi Chemical Co., Ltd. "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290" and "YL7482".

The polyvinyl acetal resin may, for example, be a polyvinyl formal resin or a polyvinyl butyral resin, preferably polyvinyl butyral. Specific examples of the polyvinyl acetal resin include "electrochemical butyraldehyde 4000-2", "electrochemical butyraldehyde 5000-A", "electrochemical butyraldehyde 6000-C", and "electrochemical butyl" manufactured by Electrochemical Industries, Inc. Aldehyde 6000-EP", S-Lec BH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, BM series, etc., manufactured by Sekisui Chemical Co., Ltd.

Specific examples of the polyimine resin include "Rikacoat SN20" and "Rikacoat PN20" manufactured by Nippon Chemical and Chemical Co., Ltd. Specific examples of the polyimine resin include a linear polyimine obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (Polymers described in JP-A-2006-37083)改 胺 ) 、 、 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改 改amine.

Specific examples of the polyamidoximine resin include "Vylomax HR11NN" and "Vylomax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of the polyamidoximine resin include modified acrylamides such as "KS9100" and "KS9300" (polyamidoquinone containing a polyoxyalkylene skeleton) manufactured by Hitachi Chemical Co., Ltd. amine.

Specific examples of the polyether oxime resin include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd., and the like. Specific examples of the polyphenylene ether resin include oligophenylene styrene resin and styrene resin "OPE-2 St 1200" manufactured by Mitsubishi Gas Chemical Co., Ltd.

Specific examples of the polybenzazole resin include polydip "P1700" and "P3500" manufactured by Solvay Specialty Polymers.

Among them, (F) a thermoplastic resin is preferably a phenoxy resin or a polyvinyl acetal resin. Therefore, in one embodiment, the thermoplastic resin is one or more selected from the group consisting of a phenoxy resin and a polyvinyl acetal resin. Among them, the thermoplastic resin is preferably a phenoxy resin, and particularly preferably a phenoxy resin having a weight average molecular weight of 30,000 or more.

When the resin composition contains (F) a thermoplastic resin, (F) the amount of the thermoplastic resin is remarkably obtained from the viewpoint of the desired effect of the present invention, and when the nonvolatile content in the resin composition is 100% by mass, it is preferably It is 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 3% by mass or less.

<(G) flame retardant>
The resin composition may also contain (G) a flame retardant as an optional component. (G) The flame retardant may, for example, be a phosphazene compound, an organic phosphorus-based flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a polyfluorene-based flame retardant, a metal hydroxide or the like, preferably phosphorus. Nitrile compound. The flame retardant may be used alone or in combination of two or more.

The phosphazene compound is a cyclic compound containing nitrogen and phosphorus as constituent elements, and the phosphazene compound is preferably a phosphazene compound having a phenolic hydroxyl group. Specific examples of the phosphazene compound include "SPH-100", "SPS-100", "SPB-100", "SPE-100" manufactured by Otsuka Chemical Co., Ltd., and "FP-100" manufactured by Fushimi Pharmaceutical Co., Ltd. "FP-110", "FP-300", "FP-400", etc.

For the flame retardant other than the phosphazene compound, a commercially available product may be used, and examples thereof include "HCA-HQ" manufactured by Sanko Co., Ltd., and "PX-200" manufactured by Daiba Chemical Industry Co., Ltd., and the like. The flame retardant is preferably one which is not easily hydrolyzed, and is preferably, for example, 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide.

When the resin composition contains (G) a flame retardant, (G) the amount of the flame retardant, the effect of the present invention is remarkably obtained, and when the nonvolatile content in the resin composition is 100% by mass, It is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass or more. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 3% by mass or less.

<(H) Optional Additives>
The resin composition may contain any additive as an optional component in addition to the above components. Examples of such an additive include organometallic compounds such as an organic copper compound, an organic zinc compound, and an organic cobalt compound; a tackifier; an antifoaming agent; a flattening agent; a tackifier; and a resin additive such as a colorant. These additives may be used alone or in combination of two or more kinds in any ratio.

<Physical properties and use of resin composition>
The cured product of the resin composition can be subjected to a roughening treatment under severe conditions, and thus exhibits excellent properties of residue removal property. Therefore, the cured product is also excellent in laser workability. Therefore, by using the resin composition of the present invention, an insulating layer excellent in laser workability can be obtained. For example, an insulating layer is formed using the above resin composition, and a via hole is formed using a laser, followed by a roughening treatment. At this time, the maximum residue of the wall surface at the bottom of the via hole is usually as long as 3 μm.

Further, according to the resin composition described above, even if the thickness of the cured product is small, the insulating property is excellent, so that the property of exhibiting a high resistance value can be exhibited. Therefore, by using the resin composition of the present invention, an insulating layer of a film having a high electric resistance value can be obtained. For example, the resistance value of the substrate E for insulation evaluation is measured by the method described in the examples using the above resin composition. At this time, the obtained resistance value can be usually 1 × 10 ⁷ Ω or more.

Moreover, the surface of the cured product after the roughening treatment of the resin composition can exhibit a characteristic that the arithmetic mean roughness (Ra) is low. Therefore, by using the resin composition of the present invention, an insulating layer having a low arithmetic mean roughness can be provided even if the wet desmearing treatment is performed. For example, the arithmetic mean roughness (Ra) of the roughened substrate D is measured by the method described in the examples using the above resin composition. In this case, the arithmetic mean roughness obtained is usually 150 nm or less, preferably 130 nm or less, more preferably 100 nm or less. The lower limit of the arithmetic mean roughness is not particularly limited and may be 1 nm or more.

Further, since the surface of the cured product after the roughening treatment of the resin composition is uniform, the maximum height roughness (Rz) is low. Therefore, by using the resin composition of the present invention, even if the wet degreasing treatment is performed, an insulating layer having a maximum maximum roughness can be provided. For example, the maximum height roughness (Rz) of the roughened substrate D is measured by the method described in the examples using the above resin composition. In this case, the maximum height roughness obtained is usually 1000 nm or less, preferably 500 nm or less, more preferably 400 nm or less. The lower limit of the maximum height roughness is not particularly limited, and may be 1 nm or more.

Moreover, the cured product of the above resin composition can exhibit a characteristic that the elongation at break point is high. Therefore, by using the resin composition of the present invention, an insulating layer having a high elongation at break can be usually provided. For example, using the above resin composition, the elongation at break of the cured product B for evaluation is measured by the method described in the examples. In this case, the obtained elongation at break point is usually 1.5% or more, preferably 2.0% or more, more preferably 2.5% or more. The upper limit is not particularly limited and may be 10% or less.

Further, the resin composition is excellent in insulation performance even if the thickness of the cured product is small, so that an insulating layer capable of forming a fine wiring circuit can be provided. Therefore, the resin composition of the present invention can be suitably used as a resin composition for a circuit in which the ratio (L/S) of the circuit width (L (μm)) to the width (S (μm)) between circuits is small. The ratio (L/S) is usually 10 μm/10 μm or less (20 μm pitch or less), preferably 5 μm/5 μm or less (10 μm pitch or less), more preferably 2 μm/2 μm (4 μm pitch or less) or less.

By utilizing the above advantages, an insulating layer can be formed by the cured product of the foregoing resin composition. Therefore, the resin composition of the present invention can be suitably used as a resin for forming a circuit having a circuit width (L (μm)) and a width (S (μm)) between circuits (L/S) of 10 μm/10 μm or less. The material can be suitably used as a resin composition for forming an insulating layer having a surface having an arithmetic mean roughness (Ra) of 150 nm or less, and can be suitably used as a resin composition for forming a via hole by laser irradiation (printed wiring board) It is used by a resin composition for forming a via hole by laser irradiation. Further, the resin composition of the present invention can be suitably used as a resin composition for insulating use. Specifically, it can be suitably used as a resin composition for forming an insulating layer (including a resin composition for forming an insulating layer for forming a conductor layer) for forming a conductive layer (including a rewiring layer) formed on an insulating layer, and forming a printing The resin composition for the insulating layer of the wiring board (resin composition for the insulating layer of the printed wiring board) is more suitable as a resin composition for forming the interlayer insulating layer of the printed wiring board (for the interlayer insulating layer of the printed wiring board) Resin composition) used. Moreover, since the resin composition of the present invention can provide an insulating layer having a good embedding property, it can also be applied to a case where a printed wiring board is a built-in circuit board of a component.
Further, for example, when the semiconductor wafer package is manufactured by the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a rewiring forming layer of an insulating layer for forming a rewiring layer ( The resin composition for forming a wiring layer and the resin composition for packaging a semiconductor wafer (resin composition for semiconductor wafer packaging) are used. When the semiconductor chip package is manufactured, a rewiring layer can be formed on the package layer.
(1) a step of temporarily fixing a film on a substrate,
(2) a step of temporarily fixing the semiconductor wafer on the temporary fixing film,
(3) a step of forming an encapsulation layer on the semiconductor wafer,
(4) a step of peeling off the substrate and the temporary fixing film from the semiconductor wafer,
(5) a step of forming a rewiring forming layer as an insulating layer on a surface of the semiconductor wafer and a surface on which the thin film is temporarily fixed, and
(6) Step of forming a rewiring layer as a conductor layer on the wiring layer

[resin sheet]
The resin sheet of the present invention has a support and a resin composition layer provided on the support. The resin composition layer is a layer containing the resin composition of the present invention, and is usually formed of a resin composition. According to the above resin composition, even if the thickness of the cured product is thin, the insulating property is excellent, so that the thickness of the resin composition layer can be made thin.

The thickness of the resin composition layer is preferably 15 μm or less, more preferably 13 μm or less, and still more preferably 10 μm or less from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product excellent in insulation even with a film. The lower limit of the thickness of the resin composition layer is not particularly limited, and may be usually 1 μm or more and 2 μm or more.

In a preferred embodiment of the resin composition layer, the resin composition layer is contained in an amount of 50% by mass or more when the non-volatile content in the resin composition is 100% by mass. (C) Inorganic filler, select any 10 places on the surface of the cured product which is cured by heat at room temperature of 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe any choice. In the case of a range of 100 μm in width and 5 μm in depth, when the maximum particle diameter of the (C) inorganic filler is R1 (μm) and (C) the average particle diameter of the inorganic filler is R2 (μm), the above formula is satisfied ( 1) The relationship. The relationship between the above R1 and the aforementioned R2 and the like is as described above.

In a preferred embodiment of the resin composition layer, the resin composition is a resin composition layer, and the resin composition is 50% by mass when the nonvolatile content of the resin composition is 100% by mass. For the above (C) inorganic filler, select any 10 places on the surface of the cured product which is cured by heat at room temperature of 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe any choice. In the case where the average particle diameter of the (C) inorganic filler is R2 (μm), the number of particles having a particle diameter of (1.2 × R 2 ) μm or more is 4 or less in the range of 100 μm in width and 5 μm in depth. The details of the foregoing numbers and the like are as described above.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material or a metal foil is preferable.

When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter referred to as A polyester such as "PEN"); a polycarbonate (hereinafter sometimes abbreviated as "PC"); an acrylic polymer such as polymethyl methacrylate (hereinafter sometimes abbreviated as "PMMA"); Polyolefin; triethylenesulfonyl cellulose (hereinafter sometimes abbreviated as "TAC"); polyether sulfide (hereinafter sometimes abbreviated as "PES"); polyether ketone; polyimine; Among them, polyethylene terephthalate or polyethylene naphthalate is preferred, and polyethylene terephthalate which is inexpensive is particularly preferred.

When a metal foil as a support is used, examples of the metal foil include a copper foil and an aluminum foil. Among them, copper foil is preferred. As the copper foil, a foil made of a single metal of copper may be used, or a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, hafnium, titanium, etc.) may be used.

The support may be subjected to a treatment such as matting treatment, corona treatment, or antistatic treatment on the surface joined to the resin composition layer.

Further, as the support, a support having a release layer having a release layer on the surface joined to the resin composition layer may be used. The release agent to be used for the release layer of the support of the release layer is, for example, one or more selected from the group consisting of an alkyd resin, a polyolefin resin, a urethane resin, and a polyoxymethylene resin. Release agent. The commercially available product of the release agent may, for example, be an alkyd resin release agent, "SK-1", "AL-5", "AL-7" manufactured by Lintec Co., Ltd., or the like. In addition, examples of the support for the release layer include "lumirror T60" manufactured by Toray Industries, "Purex" manufactured by Teijin Co., Ltd., "unipeel" manufactured by Unitika Co., Ltd., and the like.

The thickness of the support is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. Further, when the support having the release layer is used, the thickness of the entire support having the release layer is preferably within the above range.

The resin sheet can be produced, for example, by applying a resin composition onto a support using a coating device such as a die coater. Further, if necessary, the resin composition is dissolved in an organic solvent to prepare a resin varnish, and the resin varnish is applied to produce a resin sheet. The coating property can be improved by adjusting the viscosity by using a solvent. When a resin varnish is used, the resin varnish is usually dried after coating to form a resin composition layer.

The organic solvent may, for example, be a ketone solvent such as acetone, methyl ethyl ketone or cyclohexanone; ethyl acetate, butyl acetate, fibrin acetate, propylene glycol monomethyl ether acetate, and carbitol acetic acid. Acetate solvent such as ester; carbitol solvent such as cellosolve and butyl carbitol; aromatic hydrocarbon solvent such as toluene and xylene; dimethylformamide, dimethylacetamide (DMAc) And a guanamine solvent such as N-methylpyrrolidone; and the like. The organic solvent may be used singly or in combination of two or more kinds in any ratio.

Drying can be carried out by a conventional method such as heating, blowing hot air or the like. In the drying condition, the content of the organic solvent to be dried in the resin composition layer is usually 10% by mass or less, preferably 5% by mass or less. Also, depending on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, it can be formed by drying at 50 ° C to 150 ° C for 3 minutes to 10 minutes. Resin composition layer.

When necessary, the resin sheet may include any layer other than the support and the resin composition layer. For example, in the resin sheet, a protective film conforming to the support may be provided on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support). The thickness of the protective film is, for example, 1 μm to 40 μm. By protecting the film, adhesion or scratches to dirt or the like on the surface of the resin composition layer can be prevented. When the resin sheet has a protective film, the resin sheet can be used by peeling off the protective film. Further, the resin sheet can be wound up in a roll shape for storage.

[Printed wiring board]
The printed wiring board of the present invention comprises an insulating layer, a first conductor layer and a second conductor layer formed of a cured product of the resin composition of the present invention. The insulating layer is provided between the first conductor layer and the second conductor layer, and the first conductor layer is insulated from the second conductor layer (the conductor layer may be referred to as a wiring layer).

The insulating layer is formed by a cured product of the resin composition of the present invention. The thickness of the insulating layer between the first and second conductor layers is preferably 15 μm or less, more preferably 13 μm or less, still more preferably 10 μm or less. The lower limit is not particularly limited and may be 0.1 μm or more. The distance between the first conductor layer and the second conductor layer (the thickness of the insulating layer between the first and second conductor layers) means an example of the main conductor 11 and the second conductor layer 2 of the first conductor layer 1 as shown in FIG. The thickness t1 of the insulating layer 3 between the main faces 21 is. The first and second conductor layers pass through the insulating layer, and the adjacent conductor layers, the main surface 11 and the main surface 21 face each other.

Further, the thickness t2 of the entire insulating layer is preferably 15 μm or less, more preferably 13 μm or less, still more preferably 10 μm or less. The lower limit is not particularly limited, but may be usually 1 μm or more, 1.5 μm or more, 2 μm or more, or the like.

The printed wiring board can be produced by the method including the following steps (I) and (II) using the above-mentioned resin sheet.
(I) a step of bonding a resin composition layer of a resin sheet to an inner layer substrate to laminate on an inner layer substrate
(II) Step of thermally hardening the resin composition layer to form an insulating layer

The "inner substrate" used in the step (I) is a member of the substrate of the printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting type polymerization. a phenyl ether substrate or the like. Further, the substrate may have a conductor layer on one or both sides, and the conductor layer may also be patterned. An inner layer substrate in which a conductor layer (circuit) is formed on one surface or both surfaces of a substrate may be referred to as an "inner layer circuit substrate". Further, when manufacturing a printed wiring board, an intermediate product in which an insulating layer and/or a conductor layer are further formed is also included in the so-called "inner substrate" of the present invention. When the printed wiring board is a built-in circuit board of a component, an inner substrate in which the component is built may be used.

The laminate of the inner layer substrate and the resin sheet can be carried out, for example, by heating and pressure-bonding the resin sheet to the inner layer substrate from the side of the support. The member for heating and pressure-bonding the resin sheet to the inner layer substrate (hereinafter also referred to as "heating pressure bonding member") may, for example, be a heated metal plate (such as a SUS mirror plate) or a metal roll (SUS roll). In addition, the resin sheet is not directly pressed against the resin sheet, but the resin sheet sufficiently follows the surface unevenness of the inner layer substrate, and is preferably pressed through an elastic material such as heat-resistant rubber.

The lamination of the inner layer substrate and the resin sheet can be carried out by a vacuum lamination method. In the vacuum lamination method, the heating and pressing temperature is preferably 60 ° C to 160 ° C, more preferably 80 ° C to 140 ° C, and the heating pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0.29 MPa. The range of 1.47 MPa, the heating and crimping time, is preferably from 20 seconds to 400 seconds, more preferably from 30 seconds to 300 seconds. The laminate is preferably subjected to a reduced pressure of 26.7 hPa or less.

The laminate can be carried out by a commercially available vacuum laminator. For example, a vacuum press laminator manufactured by Nihon Seiki Co., Ltd., a vacuum coater manufactured by Nikko-materials Co., Ltd., a batch vacuum laminator, or the like can be used.

After lamination, under normal pressure (at atmospheric pressure), for example, by heating the pressure-bonding member from the side of the support, smoothing of the laminated resin sheet can be performed. The pressing conditions of the smoothing treatment may be the same conditions as the heating and pressure bonding conditions of the above laminate. The smoothing treatment can be carried out by a commercially available laminator. Further, the lamination and smoothing treatment can be carried out continuously using the above-mentioned commercially available vacuum laminator.

The support may be removed between step (I) and step (II) or may be removed after step (II).

In the step (II), the resin composition layer is thermally cured to form an insulating layer.

The thermosetting conditions of the resin composition layer are not particularly limited, and when an insulating layer of a printed wiring board is formed, generally used conditions can be used.

For example, the thermosetting condition of the resin composition layer varies depending on the type of the resin composition, and the curing temperature is preferably from 120 ° C to 240 ° C, more preferably from 150 ° C to 220 ° C, and still more preferably from 170 ° C to 200 ° C. . The hardening time is preferably from 5 minutes to 120 minutes, more preferably from 10 minutes to 100 minutes, and even more preferably from 15 minutes to 90 minutes.

Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, before the thermosetting of the resin composition layer, the resin composition can be usually used at a temperature of 50 ° C or more and less than 120 ° C (preferably 60 ° C or more and 115 ° C or less, more preferably 70 ° C or more and 110 ° C or less). The layer is preheated for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, still more preferably 15 minutes to 100 minutes).

When the printed wiring board is manufactured, (III) a step of opening the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer may be further performed. These steps (III) to (V) can be carried out in accordance with various methods known to those skilled in the art for the manufacture of printed wiring boards. Further, when the support is removed after the step (II), the support may be removed between the step (II) and the step (III), between the step (III) and the step (IV), or the step (IV). Implemented with step (V). Further, if necessary, the formation of the insulating layer and the conductor layer in the steps (II) to (V) may be repeated, and a multilayer wiring board may be formed. At this time, the thickness of the insulating layer between the respective conductor layers (t1 of Fig. 1) is preferably within the above range.

The step (III) is a step of opening a hole in the insulating layer, and a hole such as a via hole, a through hole or the like can be formed in the insulating layer by the opening. The step (III) can be carried out in accordance with the composition of the resin composition used for the formation of the insulating layer, for example, using a drill, a laser, a plasma, or the like. Since the insulating layer is formed of a cured product of the resin composition of the present invention, it is excellent in laser workability. Therefore, step (III) is preferably performed using a laser. The size or shape of the hole can be appropriately determined depending on the design of the printed wiring board. The specific diameter of the pores is, for example, preferably 70 μm or less, more preferably 50 μm or less, still more preferably 20 μm or less. The lower limit is not particularly limited and may be 0.1 μm or more.

Step (IV) is a step of roughening the insulating layer. The order and conditions of the roughening treatment are preferably such that the residue generated in the step (III) can be removed, and the setting of the penetration of the insulating layer due to the unintentional detachment of the (C) inorganic filler can be suppressed. The specific order and conditions can be generally known using the known order and conditions when forming an insulating layer of a printed wiring board. Further, since the insulating layer is formed of a cured product of the resin composition containing (B) the active ester compound and (C) the inorganic filler, it is possible to use a chemical solution stronger than usual to carry out the roughening treatment.

The roughening treatment of the insulating layer can be carried out, for example, by a swelling treatment of the swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment step in the neutralization liquid. The swelling liquid to be used for the roughening treatment is not particularly limited, and examples thereof include an alkali solution and a surfactant solution, and an alkali solution is preferred. The alkali solution is more preferably a sodium hydroxide solution or a potassium hydroxide solution. For example, "Swelling Dip Securiganth P" manufactured by Atotech Japan Co., Ltd., "Swelling Dip Securiganth SBU", etc. are mentioned. The swelling treatment by the swelling liquid is not particularly limited. For example, the insulating layer can be immersed in a swelling liquid at 30 ° C to 90 ° C for 1 minute to 20 minutes to carry out swelling treatment. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferred to immerse the insulating layer in a swelling liquid at 40 ° C to 80 ° C for 5 minutes to 15 minutes. The oxidizing agent to be used in the roughening treatment is not particularly limited, and examples thereof include an alkaline permanganic acid solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment of the oxidizing agent such as an alkaline permanganic acid solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60 to 80 ° C for 10 minutes to 30 minutes. Further, the concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. The commercially available oxidizing agent is, for example, an alkaline permanganic acid solution such as "Concentrate Compact CP" manufactured by Atotech Japan Co., Ltd. or "Dosing Solution Securiganth P". In addition, the neutralization liquid used for the roughening treatment is preferably an acidic aqueous solution, and a commercially available product is, for example, "Reduction solution Securiganth P" manufactured by Atotech Japan Co., Ltd. The treatment with the neutralizing solution can be carried out by immersing the treated surface roughened with the oxidizing agent in a liquid at 30 ° C to 80 ° C for 5 minutes to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object which has been subjected to the roughening treatment with an oxidizing agent in a liquid at 40 ° C to 70 ° C for 5 minutes to 20 minutes is preferred.

Step (V) is a step of forming a conductor layer. When the inner layer substrate is not formed with a conductor layer, the step (V) is a step of forming the first conductor layer. When the inner layer substrate is formed into a conductor layer, the conductor layer is the first conductor layer, and the step (V) is forming the second conductor layer. step.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer comprises at least one selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be formed, for example, of an alloy (for example, nickel, chromium alloy, copper, nickel alloy, copper or titanium alloy) selected from two or more metals of the above group. Layer. Among them, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper is preferable from the viewpoints of generality of the formation of the conductor layer, cost, ease of patterning, and the like; or nickel An alloy layer of a chromium alloy, a copper alloy, a copper alloy, or a titanium alloy, preferably a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper or an alloy layer of nickel or chromium alloy, More preferably, it is a single metal layer of copper.

The conductor layer may have a single layer structure, or a single metal layer or alloy formed of different kinds of metals or alloys may have a multilayer structure of two or more layers. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel/chromium alloy.

The thickness of the conductor layer varies depending on the desired design of the printed wiring board, and is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

In one embodiment, the conductor layer can be formed by plating. For example, a conductive layer having a desired wiring pattern can be formed by plating on the surface of an insulating layer by a conventionally known technique such as a semi-additive method or a full-addition method, and the viewpoint of ease of manufacture is It is better to form a semi-additive method. An example in which a conductor layer is formed by a semi-additive method is shown below.

First, a plating layer is formed on the surface of the insulating layer by electroless plating. Next, on the formed plating resist layer, a mask pattern corresponding to a desired wiring pattern to partially expose one of the plating resist layers is formed. On the exposed plating protective layer, after forming a metal layer by electroplating, the mask pattern is removed. Then, an unnecessary plating resist layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

Since the resin sheet of the present invention provides an insulating layer having a good embedding property, it is also suitable for use in a case where a printed wiring board is a built-in circuit board of a component. The built-in circuit board of the part can be produced by a known manufacturing method.

The printed wiring board produced using the resin sheet of the present invention may be an insulating layer including a cured product of a resin composition layer of a resin sheet, and a buried wiring layer embedded in the insulating layer.

[semiconductor device]
The semiconductor device of the present invention comprises the printed wiring board of the present invention. The semiconductor device of the present invention can be fabricated using the printed wiring board of the present invention.

Examples of the semiconductor device include electrical products (for example, computers, mobile phones, digital cameras, and televisions) and various semiconductor devices that provide transportation (such as motorcycles, automobiles, electric cars, ships, airplanes, etc.).

The semiconductor device of the present invention can be fabricated by mounting a component (semiconductor wafer), for example, at the conduction of a circuit board. "Conduit" means "where the electrical signal is transmitted on the printed wiring board", which may be either a surface or a buried location. Further, when the semiconductor wafer is an electrical circuit element using a semiconductor as a material, it is not particularly limited.

The semiconductor wafer mounting method in the case of manufacturing a semiconductor device is not particularly limited as long as it can effectively function as a semiconductor wafer, and specific examples thereof include a wire bonding mounting method, a flip chip mounting method, and a bump-free layering ( BBUL) mounting method, mounting method of anisotropic conductive film (ACF), mounting method of non-conductive film (NCF), and the like. Here, the "mounting method of bumpless build-up layer (BBUL)" means "a method of mounting a semiconductor wafer directly in a concave portion of a printed wiring board to connect a semiconductor wafer to a wiring on a printed wiring board".

[Examples]

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to the following embodiments. In the following description, "parts" and "%" indicating the amounts indicate "mass parts" and "mass%", respectively, when there is no other indication. Further, the operation described below is carried out in an environment of normal temperature and normal pressure, unless otherwise specified.

<Measurement of average particle size and coefficient of variation of inorganic fillers>
The measurement of the average particle diameter R2 of the inorganic filler and the coefficient of variation was carried out by the above method.

<Example 1: Production of Resin Composition 1>
10 parts of bisphenol A type epoxy resin ("828 US" manufactured by Mitsubishi Chemical Co., Ltd., epoxy equivalent: about 180), and biphenyl type epoxy resin ("YX4000H" manufactured by Mitsubishi Chemical Co., Ltd., epoxy equivalent: about 190), 20 parts, And bisphenol AF type epoxy resin ("YL7760" manufactured by Mitsubishi Chemical Co., Ltd., epoxy equivalent: about 238) 10 parts, phosphazene resin ("SPS-100" manufactured by Otsuka Chemical Co., Ltd.), 3 parts, phenoxy resin (Mitsubishi Chemical) 10 parts of "YX7553BH30", a 1:1 solution of MEK and cyclohexanone having a solid content of 30% by mass), and 60 parts of MEK, were heated and dissolved while stirring.

After cooling to room temperature, 40 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution having a living base equivalent of about 223, and a solid content of 65 mass%) was mixed, and a phenol-based curing agent (LA manufactured by DIC Corporation) was mixed. -3018-50P", a reactive base equivalent of about 151, a solid component of 50% 2-methoxypropanol solution) 16 parts, a hardening accelerator (4-dimethylaminopyridine (DMAP), solid content 5% by mass 6 parts of MEK solution) spherical cerium oxide particles surface treated with an amine decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) (seahoster KE-S20, manufactured by Nippon Shokubai Co., Ltd.), coefficient of variation of particle size distribution The resin composition 1 was produced by filtering with a cartridge filter ("SHP020" manufactured by ROKITECHNO Co., Ltd.) using a cartridge filter ("SHP020" manufactured by ROKITECHNO Co., Ltd.).

<Example 2: Production of Resin Composition 2>
In Example 1, 6 parts of a curing accelerator (4-dimethylaminopyridine (DMAP), a solid content of 5% by mass of MEK solution) was changed to a hardening accelerator (4-pyrrolidinopyridine (PPY), solid 6 parts by mass of a solution of 5% by mass of 1-methoxy-2-propanol). A resin composition 2 was produced in the same manner as in Example 1 except the above.

<Example 3: Production of Resin Composition 3>
In the first embodiment, the spherical cerium oxide particles (seahoster KE-S20, manufactured by Nippon Shokubai Co., Ltd.) and the particle size distribution variation coefficient of 5.0 were obtained by surface treatment of an amine-based decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.). 6% of the spherical cerium oxide particles (the "Seahoster KE-S30" manufactured by Nippon Shokubai Co., Ltd., and the granules of the spherical cerium oxide particles (the "KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) The coefficient of variation of the diameter distribution was 3.1%, and the average particle diameter was 0.3 μm) 170 parts. A resin composition 3 was produced in the same manner as in Example 1 except the above.

<Example 4: Production of Resin Composition 4>
In Example 3, 40 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution having an active base equivalent of about 223, and a solid content of 65 mass%) was changed to an active ester compound ("EXB9416-" manufactured by DIC Corporation. 37 parts of 70BK", a reactive base equivalent of about 274, and a solid content of 70% by mass of MIBK (methyl isobutyl ketone) solution). A resin composition 4 was produced in the same manner as in Example 3 except for the above.

<Example 5: Production of Resin Composition 5>
In Example 3, 10 parts of a carbodiimide-based curing agent ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., a reactive base equivalent of about 216, and a solid content of 50% by mass in a toluene solution) was further added. A resin composition 5 was produced in the same manner as in Example 3 except for the above.

<Comparative Example 1: Preparation of Comparative Resin Composition 1>
In the first embodiment,
1) 40 parts of an active ester-based curing agent ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution having an active base equivalent of about 223 and a solid content of 65 mass%) was changed to a naphthol-based hardener (Nippon Steel & Sumitomo Chemical Co., Ltd.) The company's "SN-485", active base equivalent of about 215), 7.2 parts,
2) 16 parts of a phenol-based curing agent ("LA-3018-50P" manufactured by DIC Corporation, a reactive base equivalent of 151, and a solid content of 50% 2-methoxypropanol solution) was changed to a phenol-based curing agent (DIC company) 12 parts of "LA-7054", an active base equivalent of about 124, and a 60% solids MEK solution)
3) Spherical cerium oxide particles (seahoster KE-S20, manufactured by Nippon Shokubai Co., Ltd.) having an amine decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.), a coefficient of variation of particle size distribution of 5.0%, average The particle size of 0.2 μm) was changed from 170 parts to 110 parts.
A comparative resin composition 1 was produced in the same manner as in Example 1 except the above.

<Comparative Example 2: Production of Comparative Resin Composition 2>
In Comparative Example 1, spherical cerium oxide particles (seahoster KE-S20, manufactured by Nippon Shokubai Co., Ltd.) and particle size distribution variation coefficient of 5.0 were obtained by surface treatment of an amine-based decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.). 110 parts of the average particle diameter of 0.2 μm) was changed to a spherical cerium oxide particle surface-treated with an amine-based decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) (seahoster KE-S30, manufactured by Nippon Shokubai Co., Ltd.) The coefficient of variation of the diameter distribution was 3.1%, and the average particle diameter was 0.3 μm) of 110 parts. A comparative resin composition 2 was produced in the same manner as in Comparative Example 1, except for the above.

<Comparative Example 3: Production of Comparative Resin Composition 3>
In the first embodiment, the spherical cerium oxide particles (seahoster KE-S20, manufactured by Nippon Shokubai Co., Ltd.) and the particle size distribution variation coefficient of 5.0 were obtained by surface treatment of an amine-based decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.). 170 parts of the average particle diameter of 0.2 μm) was changed to spherical cerium oxide ("SO-C1" manufactured by Admatechs Co., Ltd.) and the particle size distribution was changed by an amine decane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.). The coefficient was 41%, the average particle diameter was 0.3 μm, and 170 parts. A comparative resin composition 3 was produced in the same manner as in Example 1 except the above.

<Production of Resin Sheet A>
A PET film ("lumirror R80" manufactured by Toray Industries Co., Ltd., 38 μm thick, softening point 130 ° C, or less may be referred to as "polyester resin" (AL-5). Demolded PET") as a support.

Each of the resin compositions was uniformly coated on the release PET by a die coater so that the thickness of the dried resin composition layer was 6 μm, and dried at 80 ° C for 1 minute to obtain a resin composition on the release PET. Layer of matter. Then, a polypropylene film ("alphan MA-411" manufactured by Oji F-Tex Co., Ltd., thickness: 15 μm) as a protective film was laminated on the resin composition layer and the support layer was not bonded to the support. The face of the joint. Thereby, the resin sheet A formed in the order of the mold release PET (support), the resin composition layer, and a protective film was obtained.

<Measurement of elongation at break point>
The protective film of the resin sheet A after the production was peeled off, and heated at 200 ° C for 90 minutes to thermally cure the resin composition layer, and then the support was peeled off. The obtained cured product is referred to as "hardened material B for evaluation". In the evaluation hardened material B, a tensile test was performed by a TENSILON universal testing machine ("RTC-1250A" manufactured by ORIENTEC Co., Ltd.) in accordance with Japanese Industrial Standards (JIS K7127), and the breaking point tensile rate was measured.

<Measurement of particle size of inorganic filler in hardened body section>
In the cross-sectional view perpendicular to the surface of the cured product B for evaluation, a cross section of the arbitrarily selected range of 100 μm in width and 5 μm in depth was observed using a FIB-SEM composite apparatus ("SMI3050SE" manufactured by SII NANOTECHNOLOGY Co., Ltd.). The maximum particle diameter R1 (μm) of the inorganic filler and the number of particles having a particle diameter of (1.2 × R 2 ) μm or more in the range of 100 μm in width and 5 μm in depth in each FIB-SEM image were measured. Two points of the diameter were drawn, and the particle diameter was calculated using the above apparatus. This operation was performed at any 10 locations that were not intentionally selected, and the respective average values are as shown in the following table.

<Arithmetic mean roughness (Ra), maximum height roughness (Rz), thickness of insulation layer and insulation evaluation>
(1) Base processing of the inner layer circuit substrate A glass cloth substrate epoxy resin having a circuit conductor (copper) formed on a wiring pattern of L/S (line width/pitch) = 2 μm / 2 μm on both sides is provided with copper on both sides The laminated board (thickness of copper foil: 3 μm, substrate thickness: 0.15 mm, "HL832NSF LCA" manufactured by Mitsubishi Gas Chemical Co., Ltd., 255 × 340 mm size) was used as an inner layer circuit board. On both surfaces of the inner layer circuit board, an organic film treatment on the copper surface was performed using a surface treatment liquid ("FlatBOND-FT" manufactured by Mec Corporation).

(2) Lamination of Resin Sheets From the respective resin sheets A after the production, the protective film was peeled off, and a resin composition was obtained by using a batch type vacuum pressure laminator (manufactured by nikko-materials, a two-stage buildup laminator, CVP700). The layer is in contact with the inner layer circuit substrate and laminated on both sides of the inner layer circuit substrate. The lamination was carried out by decompressing for 30 seconds, at a gas pressure of 13 hPa or less, at 130 ° C, a pressure of 0.74 MPa, and pressure bonding for 45 seconds. Subsequently, it was heat-pressed at 120 ° C and a pressure of 0.5 MPa for 75 seconds.

(3) Thermal hardening of the resin composition layer The inner layer circuit board in which the resin sheet was laminated was placed in an oven at 100 ° C for 30 minutes, and then moved to an oven at 180 ° C for 30 minutes, and thermally hardened to form an insulation having a thickness of 5 μm. Floor. This is the substrate C.

(4) Step of roughening treatment The release PET of the substrate C was peeled off, and the insulating layer was subjected to desmear treatment as a roughening treatment. Further, the desmear treatment is carried out by the following wet desmear treatment.

Wet desmear treatment:
It was immersed for 5 minutes at 60 ° C in a swelling solution ("Swelling Dip Securiganth P" manufactured by Atotech Japan Co., Ltd., diethylene glycol monobutyl ether and sodium hydroxide), and then in an oxidizing agent solution (Concentrate, manufactured by Atotech Japan Co., Ltd.) Compact CP", an aqueous solution having a potassium permanganate concentration of about 6% and a sodium hydroxide concentration of about 4%, immersed at 80 ° C for 20 minutes, and finally neutralized liquid (Reduction solution Securiganth P, atotech Japan), sulfuric acid In the aqueous solution, after immersing at 40 ° C for 5 minutes, it was dried at 80 ° C for 15 minutes. This serves as the roughened substrate D.

(5) Step of forming a conductor layer
(5-1) Electroless plating step In order to form a conductor layer on the surface of the insulating layer of the roughened substrate D, a plating step including the following steps 1 to 6 (a copper plating using a liquid solution of atotech Japan) was carried out. Step), forming a conductor layer.

1. Alkali cleaning (washing and charge adjustment of the surface of the insulating layer provided with via holes)
The surface of the substrate D was roughened and washed with a Cleaning Cleaner Securiganth 902 (trade name) at 60 ° C for 5 minutes.

2. Soft etching (washing in the via hole)
The surface of the substrate D was roughened and treated with an aqueous solution of sodium persulfate sulfate at 30 ° C for 1 minute.

3. Pre-impregnation (charge adjustment of the surface of the insulating layer for Pd)
The surface of the roughened substrate D was treated with Pre. Dip Neoganth B (trade name) at room temperature for 1 minute.

4. Assign an activator (to the Pd of the surface of the insulating layer)
The surface of the substrate D was roughened and treated with Activator Neoganth 834 (trade name) at 35 ° C for 5 minutes.

5. Reduction (reduction of Pd imparted to the insulating layer)
The surface of the substrate D was roughened and treated with a mixture of Reducer Neoganth WA (trade name) and Reducer Acceralator 810 mod. (trade name) at 30 ° C for 5 minutes.

6. Electroless copper plating step (Cu is deposited on the surface of the insulating layer (Pd surface))
The surface of the substrate D is roughened, and a mixture of Basic Solution Printganth MSK-DK (trade name), Copper solution Printganth MSK (trade name), and Stabilizer Printganth MSK-DK (trade name) and Reducer Cu (trade name) is used. , treated at 35 ° C for 20 minutes. The thickness of the formed electroless copper plating layer was 0.8 μm.

(5-2) Electroplating step Next, a step of electroplating copper was carried out using a chemical solution manufactured by Atotech Japan Co., Ltd. under the condition that copper was filled in the via hole. Then, a resist pattern as a pattern for etching by etching is used: a land pattern of 1 mm in diameter which is electrically connected to the via hole and a circular conductor pattern of 10 mm in diameter which is not connected to the lower layer conductor, The surface of the insulating layer was formed with a conductor layer having a pad and a conductor pattern at a thickness of 10 μm. Next, annealing treatment was performed at 200 ° C for 90 minutes. This substrate serves as a "substrate E for insulation evaluation".

(6) Measurement of arithmetic mean roughness (Ra) and maximum height roughness (Rz) The roughened substrate D was subjected to a non-contact type surface roughness meter (WYKO NT3300 manufactured by Veeco Instruments Co., Ltd.), and was separated into contacts by VSI (Contact Mode), a 50-fold lens, and a measurement range of 121 μm × 92 μm, and the Ra value and the Rz value were obtained. They are measured by averaging 10 points of arbitrarily selected.

(7) Measurement of the thickness of the insulating layer between the conductor layers The insulating property evaluation substrate E was observed using a FIB-SEM composite device ("SMI3050SE" manufactured by SII NANOTECHNOLOGY Co., Ltd.). The detail is a section perpendicular to the direction of the surface of the conductor layer, and the thickness of the insulating layer between the conductor layers is measured by a cross-sectional SEM image by FIB (bundled ion beam) cutting. For each sample, a cross-sectional SEM image of five arbitrarily selected portions was observed, and this average value was used as the thickness (μm) of the insulating layer between the conductor layers as shown in the following table.

(8) Evaluation of Insulation Reliability (Insulation Property) of Insulating Layer The above-mentioned insulating evaluation substrate E has a circular conductor side of 10 mm in diameter as a + electrode, and a lattice conductor of an inner layer circuit substrate to which a pad having a diameter of 1 mm is connected The (copper) side was used as a -electrode, and a highly accelerated life tester ("PM422" manufactured by ETAC Co., Ltd.) was used, and an electrochemical migration test was performed under the conditions of 130 ° C, 85% relative humidity, and 3.3 V DC voltage. The device ("ECM-100" manufactured by J-RAS Co., Ltd.) measures the insulation resistance value after 200 hours. This measurement was performed 6 times, and all of the 6-point test pieces were evaluated as "○" when the resistance value was 10 ⁷ Ω or more. When one was less than 10 ⁷ Ω, the evaluation was "x", and the evaluation result and the insulation resistance value were evaluated. All are shown in the table below. The insulation resistance value described in the following table is the lowest value of the insulation resistance value of the test piece of 6 points.

<Modulation of substrate for laser processing evaluation>
(1) Formation of via hole For the substrate C, a CO ₂ laser processing machine (YB-HCS03T04) manufactured by Panasonic Welding Systems Co., Ltd. was used, and the insulating layer was opened under the condition of a pulse width of 8 μsec and a shock number of 3 at a frequency of 2000 Hz. After processing, a via hole having a top diameter (diameter) of 25 μm in the via hole in the surface of the insulating layer and a bottom of the via hole in the bottom surface of the insulating layer of 20 μm was formed.

(2) Step of roughening treatment The release PET was peeled off, and the insulating layer was subjected to desmear treatment as a roughening treatment. Further, the desmear treatment is carried out by the following wet desmear treatment.

Wet desmear treatment:
It was immersed for 5 minutes at 60 ° C in a swelling solution ("Swelling Dip Securiganth P" manufactured by Atotech Japan Co., Ltd., diethylene glycol monobutyl ether and sodium hydroxide), and then in an oxidizing agent solution (Concentrate, manufactured by Atotech Japan Co., Ltd.) Compact CP", an aqueous solution having a potassium permanganate concentration of about 6% and a sodium hydroxide concentration of about 4%, immersed at 80 ° C for 20 minutes, and finally neutralized liquid (Reduction solution Securiganth P, atotech Japan), sulfuric acid In the aqueous solution, after immersing at 40 ° C for 5 minutes, it was dried at 80 ° C for 15 minutes.

<Evaluation of laser processing property>
The periphery of the bottom of the via hole was observed by a scanning electron microscope (SEM), and the maximum residue length of the wall surface at the bottom of the via hole was measured from the obtained image. When the maximum residue length was less than 3 μm, the evaluation was "○", and when the maximum residue length was 3 μm or more, the evaluation was "x".

In Examples 1 to 5, it was confirmed that the difference between the case of the component (D) and the component (G) was not changed, but the results were the same as those of the above examples.

Fig. 1 is a cross-sectional view schematically showing a part of an example of a printed wiring board.

Claims (15)

A resin composition comprising a resin composition of (A) an epoxy resin, (B) an active ester compound, and (C) an inorganic filler, wherein a coefficient of variation of a particle size distribution of the component (C) is 30% or less, The average particle diameter is 0.01 μm or more and 5 μm or less. In the resin composition of claim 1, wherein the nonvolatile content in the resin composition is 100% by mass, the content of the component (C) is 50% by mass or more. The resin composition of claim 1, wherein the component (C) has an average particle diameter of 0.1 μm or more and 3 μm or less. The resin composition of claim 1, which is used for forming an insulating layer of a printed wiring board. The resin composition of claim 1 is formed by a circuit having a circuit width (L (μm)) and a width (S (μm)) between circuits (L/S) of 10 μm/10 μm or less. The resin composition of claim 1, which is a resin composition for forming an insulating layer having a surface having an arithmetic mean roughness (Ra) of 150 nm or less. The resin composition of claim 1, which is a resin composition for forming a via hole by laser irradiation. The resin composition of claim 1, which is selected from the cross section of the surface of the cured product at a temperature of 200 ° C and heat-hardened for 90 minutes, perpendicular to the surface of the cured product. When arbitrarily selected to be 100 μm wide and 5 μm deep, When the maximum particle diameter of the component (C) is R1 (μm) and the average particle diameter of the component (C) is R2 (μm), it satisfies R1 < 1.4 × R2 relationship. The resin composition of claim 1, which is selected from the cross section of the surface of the cured product at a temperature of 200 ° C and heat-hardened for 90 minutes, perpendicular to the surface of the cured product. When arbitrarily selected to be 100 μm wide and 5 μm deep, When the average particle diameter of the component (C) is R2 (μm), The number of particles having a particle diameter of (1.2 × R 2 ) μm or more is 4 or less. A resin sheet comprising a support and a resin composition layer comprising the resin composition according to any one of claims 1 to 9 provided on the support. The resin sheet of claim 10, wherein the resin composition layer has a thickness of 15 μm or less. A resin sheet comprising a support and a resin composition layer containing a resin composition containing (C) an inorganic filler provided on the support; When the non-volatile component in the resin composition is 100% by mass, the resin composition contains 50% by mass or more of (C) inorganic filler. Select any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe the arbitrarily selected width of 100 μm and depth of 5 μm. , (C) when the maximum particle diameter of the inorganic filler is R1 (μm), and (C) when the average particle diameter of the inorganic filler is R2 (μm), The relationship of R1 < 1.4 × R2 is satisfied. A resin sheet comprising a support and a resin composition layer containing a resin composition containing (C) an inorganic filler provided on the support; When the non-volatile component in the resin composition is 100% by mass, the resin composition contains 50% by mass or more of (C) inorganic filler. Select any 10 places on the surface of the cured product which is cured by heat-curing the resin composition at 200 ° C for 90 minutes, perpendicular to the cross-sectional view of the surface of the cured product, and observe the arbitrarily selected width of 100 μm and depth of 5 μm. , (C) When the maximum particle size of the inorganic filler is R2 (μm), The number of particles having a particle diameter of (1.2 × R 2 ) μm or more is 4 or less. A printed wiring board comprising a first conductor layer, a second conductor layer, and a printed wiring board formed of an insulating layer formed between the first conductor layer and the second conductor layer. The insulating layer is a cured product of the resin composition according to any one of claims 1 to 9. A semiconductor device comprising the printed wiring board of claim 14.