JP2023067987A - resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition that makes it possible to obtain an insulating layer having high adhesion to a conductor layer after an HAST test, and has a low melt viscosity; a resin sheet containing the resin composition; and a printed wiring board having an insulating layer formed with the resin composition, and a semiconductor device.

SOLUTION: A resin composition contains (A) an epoxy resin, and (B) a resin composition containing a maleimide compound, the (B) component having at least one of an alkyl group with 5 or more carbon atoms and an alkylene group with 5 or more carbon atoms.

SELECTED DRAWING: None

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to resin compositions. Furthermore, it relates to a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition.

2. Description of the Related Art As a technique for manufacturing printed wiring boards, a manufacturing method using a build-up method in which insulating layers and conductor layers are alternately stacked is known.

As insulating materials for printed wiring boards used for such insulating layers, for example, Patent Document 1 discloses a maleimide compound (A), an epoxy compound (B), and a cyanate ester compound (C) having a melting point of 40° C. or less. and a thermosetting resin composition containing an inorganic filler (D).

JP 2016-010964 A

It is desirable that the insulating layer has high adhesion to the conductor layer from the viewpoint of enabling the formation of fine pattern wiring, improving the mounting reliability of the printed wiring board, and improving the connection reliability of the printed wiring board. Therefore, in recent years, it has been demanded that the insulating layer should have high adhesion to the conductor layer. Further, in order to improve the long-term reliability of the printed wiring board, it is desirable that the insulating layer has high adhesion to the conductor layer even after the ultra-accelerated high-temperature, high-humidity life test (HAST test). It is also required to keep the melt viscosity low and improve the wiring embedding property.

As described above, Patent Document 1 discloses that a resin composition used for an insulating layer of a printed wiring board contains maleimide. However, Patent Document 1 does not discuss the adhesion and wiring embedding properties after the HAST test. The present inventors have found that the adhesion between the conductor layer and the insulating layer can be maintained even after the HAST test by using a predetermined maleimide compound in the resin composition. In addition, the inventors have found that the use of a predetermined maleimide compound in a resin composition results in excellent wiring embedding properties. As far as the present inventors know, there has been no prior art regarding the technical idea of obtaining an insulating layer capable of maintaining high adhesion after the HAST test by including a predetermined maleimide compound in the resin composition. It was not proposed.

An object of the present invention is to provide an insulating layer having high adhesion to a conductor layer after a HAST test and a resin composition having a low melt viscosity; a resin sheet containing the resin composition; To provide a printed wiring board and a semiconductor device having an insulating layer formed by using

In order to achieve the object of the present invention, the present inventors conducted intensive studies and found that the inclusion of a predetermined maleimide compound can maintain the adhesion between the conductor layer and the insulating layer even after the HAST test. I found In addition to the above adhesion, the inventors have also found that the smear removal property is excellent and the melt viscosity of the resin composition is lowered, leading to the completion of the present invention.

一般式（Ｂ－１）中、Ｒはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｌは単結合又は２価の連結基を表す。
［３］ （Ｂ）成分の含有量が、樹脂組成物中の不揮発成分を１００質量％とした場合、０．１質量％以上１０質量％以下である、［１］又は［２］に記載の樹脂組成物。
［４］ 更に、（Ｃ）活性エステル化合物を含む、［１］～［３］のいずれかに記載の樹脂組成物。
［５］ （Ｃ）成分の含有量が、樹脂組成物中の不揮発成分を１００質量％とした場合、５質量％以上である、［４］に記載の樹脂組成物。
［６］ 更に、（Ｄ）無機充填材を含む、［１］～［５］のいずれかに記載の樹脂組成物。
［７］ （Ｄ）成分の含有量が、５０質量％以上である、［６］に記載の樹脂組成物。
［８］ 一般式（Ｂ－１）中、Ｌは、酸素原子、置換基を有していてもよい炭素原子数６～２４のアリーレン基、置換基を有していてもよい炭素原子数が１～５０のアルキレン基、炭素原子数が５以上のアルキル基、フタルイミド由来の２価の基、ピロメリット酸ジイミド由来の２価の基、又はこれらの基の２以上の組み合わせからなる２価の基である、［１］～［７］のいずれかに記載の樹脂組成物。
［９］ （Ｂ）成分が、下記一般式（Ｂ－２）で表される、［１］～［８］のいずれかに記載の樹脂組成物。

一般式（Ｂ－２）中、Ｒ’はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ａはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基又は置換基を有していてもよい芳香環を有する２価の基を表す。ｎは１～１０の整数を表す。
［１０］ 一般式（Ｂ－２）中、Ａはそれぞれ独立に、置換基を有していてもよい炭素原子数が５以上の環状のアルキレン基；置換基を有していてもよいベンゼン環を有する２価の基；置換基を有していてもよいフタルイミド環を有する２価の基；又は置換基を有していてもよいピロメリット酸ジイミド環を有する２価の基を表す、［９］に記載の樹脂組成物。
［１１］ プリント配線板の絶縁層形成用である、［１］～［１０］のいずれかに記載の樹脂組成物。
［１２］ プリント配線板の層間絶縁層形成用である、［１］～［１１］のいずれかに記載の樹脂組成物。
［１３］ 支持体と、該支持体上に設けられた［１］～［１２］のいずれかに記載の樹脂組成物で形成された樹脂組成物層とを含む、樹脂シート。
［１４］ 樹脂組成物層の厚みが２５μｍ以下である、［１３］に記載の樹脂シート。
［１５］ 第１の導体層、第２の導体層、及び、第１の導体層と第２の導体層との間に形成された絶縁層を含むプリント配線板であって、
該絶縁層は、［１］～［１２］のいずれかに記載の樹脂組成物の硬化物である、プリント配線板。
［１６］ ［１５］に記載のプリント配線板を含む、半導体装置。 That is, the present invention includes the following contents.
[1] A resin composition containing (A) an epoxy resin and (B) a maleimide compound,
A resin composition in which component (B) contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.
[2] The resin composition according to [1], wherein component (B) is represented by the following general formula (B-1).

In general formula (B-1), each R independently represents an optionally substituted alkylene group having 5 or more carbon atoms, and L represents a single bond or a divalent linking group.
[3] The content of component (B) is 0.1% by mass or more and 10% by mass or less when the non-volatile component in the resin composition is 100% by mass, [1] or [2] Resin composition.
[4] The resin composition according to any one of [1] to [3], further comprising (C) an active ester compound.
[5] The resin composition according to [4], wherein the content of component (C) is 5% by mass or more when the non-volatile component in the resin composition is 100% by mass.
[6] The resin composition according to any one of [1] to [5], further comprising (D) an inorganic filler.
[7] The resin composition according to [6], wherein the content of component (D) is 50% by mass or more.
[8] In general formula (B-1), L is an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, and the number of carbon atoms which may have a substituent an alkylene group having 1 to 50 carbon atoms, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a combination of two or more of these groups The resin composition according to any one of [1] to [7], which is a group.
[9] The resin composition according to any one of [1] to [8], wherein component (B) is represented by the following general formula (B-2).

In general formula (B-2), R 'represents an alkylene group having 5 or more carbon atoms which may each independently have a substituent, and A each independently may have a substituent. represents an alkylene group having 5 or more carbon atoms or a divalent group having an optionally substituted aromatic ring; n represents an integer of 1-10.
[10] In general formula (B-2), each A is independently a cyclic alkylene group having 5 or more carbon atoms which may have a substituent; a benzene ring which may have a substituent a divalent group having a; a divalent group having a phthalimide ring which may have a substituent; or a divalent group having a pyromellitic diimide ring which may have a substituent, [ 9].
[11] The resin composition according to any one of [1] to [10], which is for forming an insulating layer of a printed wiring board.
[12] The resin composition according to any one of [1] to [11], which is used for forming an interlayer insulating layer of a printed wiring board.
[13] A resin sheet comprising a support and a resin composition layer formed of the resin composition according to any one of [1] to [12] provided on the support.
[14] The resin sheet according to [13], wherein the resin composition layer has a thickness of 25 µm or less.
[15] A printed wiring board comprising a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer,
A printed wiring board, wherein the insulating layer is a cured product of the resin composition according to any one of [1] to [12].
[16] A semiconductor device including the printed wiring board according to [15].

According to the present invention, a resin composition capable of obtaining an insulating layer having high adhesion to a conductor layer after a HAST test and having a low melt viscosity; a resin sheet containing the resin composition; It is possible to provide a printed wiring board and a semiconductor device comprising an insulating layer formed using

FIG. 1 is a partial cross-sectional view schematically showing an example of a printed wiring board.

Hereinafter, the resin composition, resin sheet, printed wiring board, and semiconductor device of the present invention will be described in detail.

[Resin composition]
The resin composition of the present invention comprises (A) an epoxy resin and (B) a maleimide compound, and component (B) is at least an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. including any

By including a maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms in the resin composition, even after the HAST test It is possible to obtain a cured product that can maintain adhesion and is also excellent in smear removability. In addition, by including the maleimide compound in the resin composition, it becomes possible to obtain a resin composition having a low melt viscosity. Generally, a cured product that can maintain high adhesion even after the HAST test can exhibit high adhesion over a long period of time.

In addition to components (A) to (B), the resin composition optionally contains (C) an active ester compound, (D) an inorganic filler, (E) a curing agent, (F) a curing accelerator, (G) ) a thermoplastic resin, and (H) optional additives. Each component contained in the resin composition of the present invention will be described in detail below.

<(A) Epoxy resin>
The resin composition contains (A) an epoxy resin. (A) Epoxy resins include, for example, bixylenol type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, and trisphenol type epoxy resins. Epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin , cresol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexane type epoxy resin, cyclohexane Examples include dimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin and the like. An epoxy resin may be used individually by 1 type, and may be used in combination of 2 or more type.

(A) The epoxy resin preferably has two or more epoxy groups in one molecule. When the non-volatile component of the epoxy resin is 100 mass %, at least 50 mass % or more of the epoxy resin preferably has two or more epoxy groups in one molecule. Among them, the resin composition is a combination of a liquid epoxy resin at a temperature of 20° C. (hereinafter also referred to as a “liquid epoxy resin”) and a solid epoxy resin at a temperature of 20° C. (also referred to as a “solid epoxy resin”). preferably included. The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups per molecule, more preferably an aromatic liquid epoxy resin having two or more epoxy groups per molecule. The solid epoxy resin is preferably a solid epoxy resin having 3 or more epoxy groups per molecule, more preferably an aromatic solid epoxy resin having 3 or more epoxy groups per molecule. In the present invention, the aromatic epoxy resin means an epoxy resin having an aromatic ring in its molecule.

Examples of liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolak type epoxy resin, ester skeleton. An alicyclic epoxy resin, a cyclohexane type epoxy resin, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a bisphenol A type epoxy resin and a bisphenol F type epoxy resin are more preferable. Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation, and "828US", "jER828EL", "825", and "Epikote" manufactured by Mitsubishi Chemical Corporation. 828EL” (bisphenol A type epoxy resin), “jER807”, “1750” (bisphenol F type epoxy resin), “jER152” (phenol novolac type epoxy resin), “630”, “630LSD” (glycidylamine type epoxy resin) , Nippon Steel & Sumikin Chemical Co., Ltd. "ZX1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin), Nagase ChemteX Co., Ltd. "EX-721" (glycidyl ester type epoxy resin), Daicel Co., Ltd. "Celoxide 2021P" (alicyclic epoxy resin having an ester skeleton), "PB-3600" (epoxy resin having a butadiene structure), "ZX1658" and "ZX1658GS" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. (liquid 1,4-glycidyl cyclohexane type epoxy resin), Mitsubishi Chemical Corporation "630LSD" (glycidylamine type epoxy resin), and the like. These may be used individually by 1 type, and may be used in combination of 2 or more type.

Solid epoxy resins include bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, tetraphenylethane type epoxy resin, and more preferably naphthalene type epoxy resin. Specific examples of solid epoxy resins include DIC's "HP4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), "N-690" ( cresol novolak type epoxy resin), "N-695" (cresol novolak type epoxy resin), "HP-7200" (dicyclopentadiene type epoxy resin), "HP-7200HH", "HP-7200H", "EXA-7311" ”, “EXA-7311-G3”, “EXA-7311-G4”, “EXA-7311-G4S”, “HP6000” (naphthylene ether type epoxy resin), “EPPN-502H” manufactured by Nippon Kayaku Co., Ltd. ( Trisphenol type epoxy resin), "NC7000L" (naphthol novolak type epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin), Nippon Steel & Sumikin Chemical Co., Ltd. "ESN475V" ( naphthalene type epoxy resin), "ESN485" (naphthol novolac type epoxy resin), Mitsubishi Chemical Corporation's "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixylenol type epoxy resin) , “YX8800” (anthracene type epoxy resin), “PG-100” and “CG-500” manufactured by Osaka Gas Chemicals Co., Ltd., “YL7760” manufactured by Mitsubishi Chemical Corporation (bisphenol AF type epoxy resin), “YL7800” (fluorene type epoxy resin), Mitsubishi Chemical Corporation's "jER1010" (solid bisphenol A type epoxy resin), "jER1031S" (tetraphenylethane type epoxy resin), and the like. These may be used individually by 1 type, and may be used in combination of 2 or more type.

When a liquid epoxy resin and a solid epoxy resin are used together as component (A), the ratio by weight (liquid epoxy resin: solid epoxy resin) is in the range of 1:1 to 1:20. preferable. By setting the amount ratio of the liquid epoxy resin to the solid epoxy resin in such a range, i) when used in the form of a resin sheet, moderate adhesiveness is provided, and ii) when used in the form of a resin sheet. iii) a cured product having sufficient breaking strength can be obtained. From the viewpoint of the above effects i) to iii), the mass ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is preferably in the range of 1:1 to 1:15. A range of 1:1 to 1:10 is more preferred.

From the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability, the content of component (A) in the resin composition is preferably 5 mass when the non-volatile component in the resin composition is 100 mass%. % or more, more preferably 10 mass % or more, and still more preferably 15 mass % or more. The upper limit of the epoxy resin content is not particularly limited as long as the effects of the present invention are exhibited, but is preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less.
In the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is 100% by mass, unless otherwise specified.

The epoxy equivalent of component (A) is preferably 50 to 5,000, more preferably 50 to 3,000, even more preferably 80 to 2,000, still more preferably 110 to 1,000. Within this range, the crosslink density of the cured product is sufficient, and an insulating layer with a small surface roughness can be obtained. The epoxy equivalent can be measured according to JIS K7236, and is the mass of a resin containing one equivalent of epoxy groups.

The weight average molecular weight of component (A) is preferably 100 to 5,000, more preferably 250 to 3,000, still more preferably 400 to 1,500. Here, the weight average molecular weight of the epoxy resin is the polystyrene equivalent weight average molecular weight measured by gel permeation chromatography (GPC).

<(B) maleimide compound>
The resin composition contains a maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. (B) The maleimide compound is a compound containing a maleimide group represented by the following formula (1) in the molecule.

(B) The maleimide compound contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. Moreover, the maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms has a flexible molecular structure due to the action of its long carbon chain. Therefore, it is possible to achieve a lower minimum melt viscosity than a maleimide compound containing an arylene group as a main constituent. Furthermore, since the maleimide group is easily dissolved in an alkaline solution, it is possible to obtain a cured product having excellent smear-removing properties. Alkyl groups with 5 or more carbon atoms and alkylene groups with 5 or more carbon atoms have long carbon chains and are therefore hydrophobic. Therefore, the (B) maleimide compound is less likely to deteriorate in a high-temperature and high-humidity environment, and can suppress delamination accompanied by breakdown of the insulating layer even after the HAST test. As a result, it is possible to obtain an insulating layer having high adhesion to the conductor layer after the HAST test.

The number of carbon atoms in the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, still more preferably 40 or less. This alkyl group may be linear, branched, or cyclic, with linear being preferred. Examples of such alkyl groups include pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. An alkyl group having 5 or more carbon atoms may be substituted for an alkylene group having 5 or more carbon atoms.

The number of carbon atoms in the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, still more preferably 40 or less. The alkylene group may be linear, branched, or cyclic, with linear being preferred. Here, the cyclic alkylene group is a concept that includes both a cyclic alkylene group and a linear alkylene group and a cyclic alkylene group. Examples of such alkylene groups include pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriacontylene, and octylene-cyclohexylene. a group having a structure, a group having an octylene-cyclohexylene-octylene structure, a group having a propylene-cyclohexylene-octylene structure, and the like.

In the maleimide compound (B), the alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms are preferably directly bonded to the nitrogen atom of the maleimide group. Here, "directly" means that there is no other group between the nitrogen atom of the maleimide group and the alkyl group or alkylene group. Thereby, the adhesiveness and minimum melt viscosity after the HAST test can be particularly improved.

(B) The maleimide compound contains both an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms from the viewpoint of obtaining an insulating layer having high adhesion to the conductor layer after the HAST test. preferably included.

An alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms may be bonded to each other to form a ring, and the ring structure includes a spiro ring and a condensed ring. Examples of the ring formed by bonding together include a cyclohexane ring and the like.

Alkyl groups with 5 or more carbon atoms and alkylene groups with 5 or more carbon atoms preferably have no substituents, but may have substituents. The substituents are not particularly limited, and examples thereof include halogen atoms, —OH, —O—C _1-6 alkyl groups, —N(C _1-10 alkyl groups) ₂ , C _1-10 alkyl groups, C _{6- 10} aryl group, —NH ₂ , —CN, —C(O)O—C _1-10 alkyl group, —COOH, —C(O)H, —NO ₂ and the like. Here, the term “C _p−q ” (where p and q are positive integers and satisfies p<q) means that the organic group described immediately after this term has p to q carbon atoms. represents something. For example, the phrase “C _1-10 alkyl group” indicates an alkyl group having 1 to 10 carbon atoms. These substituents may combine with each other to form a ring, and the ring structure includes spiro rings and condensed rings.

The substituents described above may further have a substituent (hereinafter sometimes referred to as a "secondary substituent"). As secondary substituents, unless otherwise specified, the same substituents as described above may be used.

The number of maleimide groups per molecule of the maleimide compound (B) may be 1, but is preferably 2 or more, preferably 10 or less, more preferably 6 or less, and particularly preferably 3 or less. . By using the (B) maleimide compound having two or more maleimide groups per molecule, it is possible to obtain an insulating layer having higher adhesion to the conductor layer after the HAST test.

(B) A maleimide compound may be used individually by 1 type, and may be used in combination of 2 or more type.

一般式（Ｂ－１）中、Ｒはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｌは単結合又は２価の連結基を表す。 (B) The maleimide compound may contain at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms, but after the HAST test, high adhesion to the conductor layer A maleimide compound represented by the following general formula (B-1) is preferable from the viewpoint of obtaining an insulating layer having properties.

In general formula (B-1), each R independently represents an optionally substituted alkylene group having 5 or more carbon atoms, and L represents a single bond or a divalent linking group.

Each R independently represents an optionally substituted alkylene group having 5 or more carbon atoms. R has the same definition as the above-described alkylene group having 5 or more carbon atoms, and the preferred range is also the same.

L represents a single bond or a divalent linking group. The divalent linking group includes an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -C(=O)-, -C(=O)-O-, -NR ⁰ - (R ⁰ is a hydrogen atom, carbon an alkyl group having 1 to 3 atoms), an oxygen atom, a sulfur atom, C(=O)NR ⁰ —, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, and two of these groups A divalent group consisting of a combination of the above and the like can be mentioned. A divalent group derived from phthalimide represents a divalent group derived from phthalimide, specifically a group represented by general formula (2). The bivalent group derived from pyromellitic diimide means a divalent group derived from pyromellitic diimide, specifically a group represented by general formula (3). In the formula, "*" represents a bond.

As the alkylene group, an alkylene group having 1 to 50 carbon atoms is preferable, an alkylene group having 1 to 45 carbon atoms is more preferable, and an alkylene group having 1 to 40 carbon atoms is particularly preferable. This alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include methylethylene, cyclohexylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriene, Examples thereof include a contylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

As the alkenylene group, an alkenylene group having 2 to 20 carbon atoms is preferable, an alkenylene group having 2 to 15 carbon atoms is more preferable, and an alkenylene group having 2 to 10 carbon atoms is particularly preferable. This alkenylene group may be linear, branched or cyclic. Examples of such alkenylene groups include a methylethylenylene group, a cyclohexenylene group, a pentenylene group, a hexenylene group, a heptenylene group and an octenylene group.

As the alkynylene group, an alkynylene group having 2 to 20 carbon atoms is preferable, an alkynylene group having 2 to 15 carbon atoms is more preferable, and an alkynylene group having 2 to 10 carbon atoms is particularly preferable. This alkynylene group may be linear, branched or cyclic. Examples of such alkynylene groups include methylethynylene, cyclohexynylene, pentynylene, hexynylene, heptynylene and octinylene groups.

As the arylene group, an arylene group having 6 to 24 carbon atoms is preferable, an arylene group having 6 to 18 carbon atoms is more preferable, an arylene group having 6 to 14 carbon atoms is further preferable, and an arylene group having 6 to 10 carbon atoms is preferable. Arylene groups are even more preferred. The arylene group includes, for example, a phenylene group, a naphthylene group, an anthracenylene group and the like.

The alkylene group, alkenylene group, alkynylene group, and arylene group, which are divalent linking groups, may have a substituent. The substituent is the same as the substituent that may be possessed by the alkyl group having 5 or more carbon atoms represented by R in general formula (B-1), preferably alkyl having 5 or more carbon atoms. is the base.

Examples of the divalent group consisting of a combination of two or more of these groups include, for example, an alkylene group, a divalent group derived from phthalimide and a divalent group consisting of a combination with an oxygen atom; a divalent group derived from phthalimide; A divalent group consisting of a combination of an oxygen atom, an arylene group and an alkylene group; a divalent group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; and the like. A divalent group consisting of a combination of two or more of these groups may form a ring such as a condensed ring by combining the respective groups. A divalent group consisting of a combination of two or more of these groups may be a repeating unit having 1 to 10 repeating units.

Among them, L in the general formula (B-1) is an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, and the number of carbon atoms which may have a substituent. an alkylene group having 1 to 50 carbon atoms, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a combination of two or more of these groups It is preferably a group. Among them, L is an alkylene group; a divalent group having a structure of an alkylene group-phthalimide-derived divalent group-oxygen atom-phthalimide-derived divalent group; an alkylene group-phthalimide-derived divalent group- Oxygen atom - arylene group - alkylene group - arylene group - oxygen atom - divalent group having the structure of a divalent group derived from phthalimide; groups are more preferred.

一般式（Ｂ－２）中、Ｒ’はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ａはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基又は置換基を有していてもよい芳香環を有する２価の基を表す。ｎは１～１０の整数を表す。 The maleimide compound represented by general formula (B-1) is preferably represented by general formula (B-2).

In general formula (B-2), R 'represents an alkylene group having 5 or more carbon atoms which may each independently have a substituent, and A each independently may have a substituent. represents an alkylene group having 5 or more carbon atoms or a divalent group having an optionally substituted aromatic ring; n represents an integer of 1-10.

Each R' independently represents an optionally substituted alkylene group having 5 or more carbon atoms. R' is the same as R in general formula (B-1).

Each A independently represents an optionally substituted alkylene group having 5 or more carbon atoms or an optionally substituted divalent group having an aromatic ring. However, when A represents an alkylene group, it excludes the case where it consists only of linear alkylene groups. When A represents an alkylene group, it may be branched or cyclic, and among these, a cyclic alkylene group having 5 or more carbon atoms which may have a substituent is preferred. The number of carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, still more preferably 40 or less. Examples of such an alkylene group include groups having an octylene-cyclohexylene structure, groups having an octylene-cyclohexylene-octylene structure, groups having a propylene-cyclohexylene-octylene structure, and the like.

Examples of the aromatic ring in the divalent group having an aromatic ring which may have a substituent include benzene ring, naphthalene ring, anthracene ring, phthalimide ring, pyromellitic acid diimide ring, and aromatic heterocyclic ring. A benzene ring, a phthalimide ring, and a pyromellitic diimide ring are preferred. That is, the divalent group having an aromatic ring includes a divalent group having an optionally substituted benzene ring, a divalent group having an optionally substituted phthalimide ring, a substituted A divalent group having a pyromellitic diimide ring which may have a group is preferred. The divalent group having an aromatic ring includes, for example, a group consisting of a combination of a divalent group derived from phthalimide and an oxygen atom; a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group and an alkylene group. a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; a divalent group derived from pyromellitic diimide; a group consisting of a combination of a divalent group derived from phthalimide and an alkylene group; mentioned. The above arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (B-1), and the preferred ranges are also the same.

A divalent group having an alkylene group and an aromatic ring represented by A may have a substituent. The substituents are the same as the substituents that the alkyl group having 5 or more carbon atoms represented by R in the general formula (B-1) may have.

Specific examples of the group represented by A include the following groups. In the formula, "*" represents a bond.

一般式（Ｂ－３）中、Ｒ^１はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｒ^２はそれぞれ独立に、酸素原子、アリーレン基、アルキレン基、又はこれらの基の２以上の組み合わせからなる２価の基を表す。ｎ１は１～１５の整数を表す。
一般式（Ｂ－４）中、Ｒ^３はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｒ^４はそれぞれ独立に置換基を有していてもよい芳香環を有する２価の基を表し、Ｒ^５はそれぞれ独立に炭素原子数が５以上のアルキル基を表す。ｎ２は０～１０の整数を表し、ｍはそれぞれ独立に０～４の整数を表す。 The maleimide compound represented by the general formula (B-1) is either a maleimide compound represented by the general formula (B-3) or a maleimide compound represented by the general formula (B-4). preferable.

In general formula (B-3), each R ¹ independently represents an optionally substituted alkylene group having 5 or more carbon atoms, and each R ² independently represents an oxygen atom, an arylene group, or an alkylene group. group, or a divalent group consisting of a combination of two or more of these groups. n1 represents an integer of 1-15.
In general formula (B-4), R ³ represents an alkylene group having 5 or more carbon atoms each independently optionally having a substituent, and R ⁴ each independently having a substituent It represents a divalent group having a good aromatic ring, and each R ⁵ independently represents an alkyl group having 5 or more carbon atoms. n2 represents an integer of 0 to 10, and each m independently represents an integer of 0 to 4.

Each R ¹ independently represents an optionally substituted alkylene group having 5 or more carbon atoms. R ¹ is the same as the alkylene group having 5 or more carbon atoms represented by R in general formula (B-1), and is preferably a hexatriacontylene group.

Each ^R2 independently represents an oxygen atom, an arylene group, an alkylene group, or a divalent group consisting of a combination of two or more of these groups. The arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (B-1), and the preferred ranges are also the same. R ² is preferably a divalent group consisting of a combination of two or more of these groups or an oxygen atom.

Divalent groups consisting of combinations of two or more of these groups include combinations of oxygen atoms, arylene groups, and alkylene groups. Specific examples of the divalent group consisting of a combination of two or more of these groups include the following groups. In the formula, "*" represents a bond.

Each R ³ independently represents an optionally substituted alkylene group having 5 or more carbon atoms. R ³ is the same as an alkylene group having 5 or more carbon atoms represented by R in general formula (B-1), preferably a hexylene group, a heptylene group, an octylene group, a nonylene group, or a decylene group, and an octylene group more preferred.

Each R ⁴ independently represents a divalent group having an aromatic ring which may have a substituent. R ⁴ is the same as the divalent group having an aromatic ring represented by A in the general formula (B-2), a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; derived from phthalimide; A group consisting of a combination of a divalent group and an alkylene group is preferred, and a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide is more preferred. The above arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (B-1), and the preferred ranges are also the same.

Specific examples of the group represented by R ⁴ include the following groups. In the formula, "*" represents a bond.

Each ^R5 independently represents an alkyl group having 5 or more carbon atoms. R ⁵ is the same as the above alkyl group having 5 or more carbon atoms, preferably hexyl group, heptyl group, octyl group, nonyl group or decyl group, more preferably hexyl group or octyl group.

m represents an integer of 0 to 4, preferably an integer of 1 to 3, more preferably 2.

(B) Specific examples of the maleimide compound include the following compounds (4) to (7). However, (B) the maleimide compound is not limited to these specific examples. In the formula, n represents an integer of 1-10.

(B) Specific examples of the maleimide compound include "BMI1500" (compound of formula (4)), "BMI1700" (compound of formula (5)), and "BMI3000J" (compound of formula (6)) manufactured by Designer Molecules. compound), "BMI689" (compound of formula (7)), and the like.

The molecular weight of the maleimide compound (B) is preferably 200 or more, more preferably 300 or more, still more preferably 400 or more, and preferably 100,000 or less, from the viewpoint of improving adhesion to the conductor layer after the HAST test. It is more preferably 80,000 or less, still more preferably 60,000 or less.

(B) The content of the maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and more preferably 1% by mass, when the non-volatile component in the resin composition is 100% by mass. That's it. The upper limit is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less or 3% by mass or less. By setting the content of the component (B) within such a range, the increase in the minimum melt viscosity of the resin composition is further suppressed, and the adhesion between the insulating layer and the conductor layer after the HAST test and the smear removal property It becomes possible to obtain an excellent cured product.

<(C) Active ester compound>
In one embodiment, the resin composition may contain (C) an active ester compound. It is known that the use of active ester compounds usually results in poor smear removal. However, since the resin composition of the present invention contains (B) a maleimide compound, the cured product of the resin composition has excellent smear removability. Therefore, even if an active ester compound is used, the smear removing property is not deteriorated.

The active ester compound is not particularly limited, but generally has an ester group with high reaction activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, esters of heterocyclic hydroxy compounds in one molecule. A compound having two or more is preferably used. The active ester compound is preferably obtained by a condensation reaction between a carboxylic acid compound and/or a thiocarboxylic acid compound and a hydroxy compound and/or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester compound obtained from a carboxylic acid compound and a phenol compound and/or a naphthol compound is more preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m- cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucine, Benzenetriol, dicyclopentadiene-type diphenol compound, phenol novolak, and the like. Here, the term "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

Specifically, an active ester compound containing a dicyclopentadiene type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of phenol novolac, and an active ester compound containing a benzoylated product of phenol novolak are preferred. Among them, an active ester compound containing a naphthalene structure and an active ester compound containing a dicyclopentadiene-type diphenol structure are more preferable. "Dicyclopentadiene-type diphenol structure" represents a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

Commercially available active ester compounds include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T" and "HPC-8000H-65TM" as active ester compounds containing a dicyclopentadiene type diphenol structure. , "EXB-8000L-65TM", "EXB-8150-65T" (manufactured by DIC), "EXB9416-70BK" (manufactured by DIC) as an active ester compound containing a naphthalene structure, an active ester containing an acetylated phenol novolac "DC808" (manufactured by Mitsubishi Chemical Corporation) as a compound, "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing a benzoylated phenol novolak, and "DC808" (Mitsubishi Chemical Corporation) as an active ester compound that is an acetylated phenol novolac (manufactured by Mitsubishi Chemical Corporation), and active ester-based curing agents that are benzoyl compounds of phenol novolak include "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation). .

When the resin composition contains (C) an active ester compound, the ratio of the epoxy resin to the active ester compound is [total number of epoxy groups in the epoxy resin]:[total number of reactive groups in the active ester compound]. The ratio is preferably in the range of 1:0.01 to 1:5, more preferably 1:0.05 to 1:3, even more preferably 1:0.1 to 1:1.5. Here, the reactive group of the active ester compound is an active ester group. In addition, the total number of epoxy groups in the epoxy resin is the sum of the values obtained by dividing the solid content mass of each epoxy resin by the epoxy equivalent for all epoxy resins, and the total number of reactive groups in the active ester compound is , is the value obtained by dividing the solid content mass of each active ester compound by the reactive group equivalent and totaling all the active ester compounds. By setting the amount ratio between the epoxy resin and the active ester compound within such a range, the heat resistance of the cured product of the resin composition is further improved.

When the resin composition contains (C) an active ester compound, the content of component (C) is preferably 1% by mass or more, more preferably 3% by mass, when the non-volatile component in the resin composition is 100% by mass. It is at least 5% by mass, more preferably at least 5% by mass. Also, the upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less. By setting the content of the component (C) within this range, the peel strength before and after the HAST test can be improved.

<(D) Inorganic filler>
In one embodiment, the resin composition may contain (D) an inorganic filler. (D) The material of the inorganic filler is not particularly limited as long as it is an inorganic compound, but examples include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, and zinc oxide. , hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, titanic acid Examples include magnesium, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. As silica, spherical silica is preferable. An inorganic filler may be used individually by 1 type, and may be used in combination of 2 or more type.

(D) Commercially available inorganic fillers include, for example, "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials; "YC100C", "YA050C" and "YA050C-MJE" manufactured by Admatechs. ”, “YA010C”; “UFP-30” manufactured by Denka; "SO-C4", "SO-C2", "SO-C1";

(D) The inorganic filler is usually contained in the resin composition in the form of particles. (D) The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, and particularly preferably 0.1 μm or more, from the viewpoint of significantly obtaining the desired effects of the present invention, It is preferably 5.0 μm or less, more preferably 2.0 μm or less, and still more preferably 1.0 μm or less. In addition, since the average particle size of the inorganic filler (D) is within the above range, it is usually possible to improve the circuit-embedding property of the resin composition layer and reduce the surface roughness of the insulating layer.

(D) The average particle size of the inorganic filler can be measured by a laser diffraction/scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler (D) is prepared on a volume basis using a laser diffraction scattering type particle size distribution measuring apparatus, and the median diameter thereof can be used as the average particle size for measurement. As the measurement sample, (D) inorganic filler dispersed in methyl ethyl ketone by ultrasonic waves can be preferably used. As the laser diffraction/scattering type particle size distribution analyzer, "LA-500" manufactured by Horiba Ltd., "SALD-2200" manufactured by Shimadzu Corporation, etc. can be used.

(D) The inorganic filler may be surface-treated with a surface treatment agent from the viewpoint of enhancing moisture resistance and dispersibility. Examples of surface treatment agents include aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate coupling agents. . Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Industry Co., Ltd. "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "SZ-31" ( Hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd. "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM-4803" (long-chain epoxy type silane coupling agent), Shin-Etsu Chemical Co., Ltd. "KBM- 7103” (3,3,3-trifluoropropyltrimethoxysilane). One type of surface treatment agent may be used alone, or two or more types may be used in combination.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the (D) inorganic filler. (D) The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, from the viewpoint of improving the dispersibility of the (D) inorganic filler. 0.2 mg/m ² or more is more preferable. On the other hand, from the viewpoint of suppressing the melt viscosity of the resin varnish and the melt viscosity in the sheet form, it is preferably 1 mg/m ² or less, more preferably 0.8 mg/m ² or less, and further preferably 0.5 mg/m ² or less. preferable.

The amount of carbon per unit surface area of the (D) inorganic filler can be measured after the surface-treated (D) inorganic filler is washed with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the (D) inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25° C. for 5 minutes. After removing the supernatant liquid and drying the solid content, the amount of carbon per unit surface area of the (D) inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horiba Ltd. can be used.

(D) The content of the inorganic filler is preferably 50% by mass or more, more preferably 55% by mass or more, when the non-volatile component in the resin composition is 100% by mass, from the viewpoint of lowering the coefficient of thermal expansion. More preferably, it is 60% by mass or more, or 65% by mass or more. The upper limit is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less. It is known that when a large amount of inorganic filler is blended, the adhesion strength decreases. However, in the present invention, even when the inorganic filler (D) is blended in a large amount, the reduction in adhesion strength can be effectively suppressed.

<(E) Curing agent>
In one embodiment, the resin composition may contain (E) a curing agent. However, (C) the active ester compound is not included in (E) the curing agent. The curing agent (E) is not particularly limited as long as it has a function of curing the component (A). Examples include phenol curing agents, naphthol curing agents, benzoxazine curing agents, and cyanate ester curing agents. and carbodiimide-based curing agents. Among them, from the viewpoint of improving insulation reliability, the (E) curing agent is preferably one or more of a phenol-based curing agent, a naphthol-based curing agent, a cyanate ester-based curing agent, and a carbodiimide-based curing agent. , more preferably contains a phenolic curing agent. A single curing agent may be used alone, or two or more curing agents may be used in combination.

As the phenolic curing agent and the naphtholic curing agent, a phenolic curing agent having a novolac structure or a naphtholic curing agent having a novolac structure is preferable from the viewpoint of heat resistance and water resistance. From the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenolic curing agent is preferable, and a triazine skeleton-containing phenolic curing agent is more preferable.

Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700", "MEH-7810" and "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., "NHN" manufactured by Nippon Kayaku Co., Ltd., "CBN", "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", "SN395" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. , "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500" manufactured by DIC.

Specific examples of the benzoxazine-based curing agent include "HFB2006M" manufactured by Showa High Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Kasei Kogyo Co., Ltd.

Examples of cyanate ester curing agents include bisphenol A dicyanate, polyphenolcyanate, oligo(3-methylene-1,5-phenylenecyanate), 4,4′-methylenebis(2,6-dimethylphenylcyanate), 4,4 '-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatophenylmethane), bis(4-cyanate-3,5-dimethyl Bifunctional cyanate resins such as phenyl)methane, 1,3-bis(4-cyanatophenyl-1-(methylethylidene))benzene, bis(4-cyanatophenyl)thioether, and bis(4-cyanatophenyl)ether, phenol Polyfunctional cyanate resins derived from novolacs, cresol novolaks, etc., and prepolymers obtained by partially triazine-forming these cyanate resins. Specific examples of cyanate ester curing agents include "PT30" and "PT60" (phenol novolac type polyfunctional cyanate ester resins), "ULL-950S" (polyfunctional cyanate ester resins) and "BA230" manufactured by Lonza Japan. , "BA230S75" (a prepolymer in which part or all of bisphenol A dicyanate is triazined to form a trimer), and the like.

Specific examples of carbodiimide curing agents include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co., Ltd., and the like.

When the resin composition contains (E) a curing agent, the amount ratio of the epoxy resin and the curing agent is [total number of epoxy groups in the epoxy resin]:[total number of reactive groups in the curing agent]. , preferably 1:0.01 to 1:2, more preferably 1:0.01 to 1:3, even more preferably 1:0.01 to 1:1.5. Here, the reactive group of the curing agent is an active hydroxyl group or the like, and varies depending on the type of curing agent. Further, the total number of epoxy groups in the epoxy resin is the sum of the values obtained by dividing the solid mass of each epoxy resin by the epoxy equivalent for all epoxy resins, and the total number of reactive groups in the curing agent is It is a value obtained by dividing the solid content mass of each curing agent by the reactive group equivalent and totaling all the curing agents. By setting the ratio between the epoxy resin and the curing agent within this range, the heat resistance of the cured product of the resin composition is further improved.

When the resin composition contains (C) an active ester compound and (E) a curing agent, the amount ratio of the epoxy resin and the active ester compound is [total number of epoxy groups in the epoxy resin]: [(C) and ( E) total number of reactive groups of component] is preferably in the range of 1:0.01 to 1:5, more preferably 1:0.01 to 1:3, and 1:0.01 to 1:1 .5 is more preferred. By setting the amount ratio of the epoxy resin to the components (C) and (E) in such a range, the heat resistance of the cured product of the resin composition is further improved.

When the resin composition contains (E) a curing agent, the content of (E) the curing agent is preferably 0.1% by mass or more when the non-volatile component in the resin composition is 100% by mass. It is preferably 0.3% by mass or more, more preferably 0.5% by mass or more. The upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less. (E) By setting the content of the curing agent within this range, the adhesion to the conductor layer after the HAST test can be improved.

<(F) Curing accelerator>
In one embodiment, the resin composition may contain (F) a curing accelerator. Examples of curing accelerators include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators. Curing accelerators, imidazole-based curing accelerators, and metal-based curing accelerators are preferred, and amine-based curing accelerators are more preferred. A hardening accelerator may be used individually by 1 type, and may be used in combination of 2 or more type.

Phosphorus curing accelerators include, for example, triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl)triphenylphosphonium thiocyanate. , tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate, and triphenylphosphine and tetrabutylphosphonium decanoate are preferred.

Examples of amine curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo (5,4,0)-undecene and the like, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred.

Examples of imidazole curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecyl imidazolyl-(1′)]-ethyl-s-triazine, 2,4-diamino-6-[2′-ethyl-4′-methylimidazolyl-(1′)]-ethyl-s-triazine, 2,4- Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate, 2-phenylimidazole isocyanurate, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline , 2-phenylimidazoline and the like, and adducts of imidazole compounds and epoxy resins, with 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole being preferred.

As the imidazole-based curing accelerator, a commercially available product may be used, such as "P200-H50" manufactured by Mitsubishi Chemical Corporation.

Guanidine curing accelerators include, for example, dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, Tetramethylguanidine, Pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0] Dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1 -allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide and the like, with dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene being preferred.

Metal-based curing accelerators include, for example, organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organocopper complexes such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. organic zinc complexes such as iron (III) acetylacetonate; organic nickel complexes such as nickel (II) acetylacetonate; organic manganese complexes such as manganese (II) acetylacetonate; Examples of organic metal salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

When the resin composition contains (F) a curing accelerator, the content of the curing accelerator is preferably 0.01% by mass or more, more preferably 100% by mass of non-volatile components in the resin composition. is 0.05% by mass or more, more preferably 0.1% by mass or more. The upper limit is preferably 3% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less. By setting the content of the curing accelerator within such a range, it is possible to obtain a cured product having excellent adhesion after the HAST test even when using an inorganic filler having a small average particle size.

<(G) Thermoplastic resin>
In one embodiment, the resin composition may contain (G) a thermoplastic resin. (G) Thermoplastic resins include, for example, phenoxy resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyimide resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, and polycarbonate resins. , polyetheretherketone resin, polyester resin, etc., and phenoxy resin is preferred. The thermoplastic resin may be used singly or in combination of two or more.

(G) The polystyrene equivalent weight average molecular weight of the thermoplastic resin is preferably 38,000 or more, more preferably 40,000 or more, and even more preferably 42,000 or more. The upper limit is preferably 100,000 or less, more preferably 70,000 or less, even more preferably 60,000 or less. (G) The polystyrene equivalent weight average molecular weight of the thermoplastic resin is measured by a gel permeation chromatography (GPC) method. Specifically, the polystyrene-equivalent weight-average molecular weight of the thermoplastic resin (G) is measured using LC-9A/RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P/K-804L manufactured by Showa Denko Co., Ltd. as a column. /K-804L can be calculated by using chloroform or the like as a mobile phase, measuring the column temperature at 40° C., and using a standard polystyrene calibration curve.

Examples of phenoxy resins include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, and terpene. and a phenoxy resin having one or more skeletons selected from the group consisting of a trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. A phenoxy resin may be used individually by 1 type, and may be used in combination of 2 or more type. Specific examples of phenoxy resins include Mitsubishi Chemical's "1256" and "4250" (both phenoxy resins containing bisphenol A skeleton), "YX8100" (phenoxy resin containing bisphenol S skeleton), and "YX6954" (bisphenolacetophenone). skeleton-containing phenoxy resin), and in addition, "FX280" and "FX293" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; ”, “YL6794”, “YL7213”, “YL7290” and “YL7482”.

Examples of polyvinyl acetal resins include polyvinyl formal resins and polyvinyl butyral resins, and polyvinyl butyral resins are preferred. Specific examples of polyvinyl acetal resins include Denka Butyral 4000-2, Denka Butyral 5000-A, Denka Butyral 6000-C, Denka Butyral 6000-EP, and Sekisui. S-lec BH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, BM series manufactured by Kagaku Kogyo Co., Ltd. may be mentioned.

Specific examples of the polyimide resin include "Ricacoat SN20" and "Ricacoat PN20" manufactured by Shin Nippon Rika. Specific examples of polyimide resins also include linear polyimides obtained by reacting bifunctional hydroxyl group-terminated polybutadiene, diisocyanate compounds and tetrabasic acid anhydrides (polyimides described in JP-A-2006-37083), and polysiloxane skeletons. Examples include modified polyimides such as polyimide containing (polyimides described in JP-A-2002-12667 and JP-A-2000-319386).

Specific examples of polyamide-imide resins include "VYLOMAX HR11NN" and "VYLOMAX HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamideimide resins include modified polyamideimides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamideimides) manufactured by Hitachi Chemical Co., Ltd.

Specific examples of the polyethersulfone resin include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd., and the like. Specific examples of the polyphenylene ether resin include oligophenylene ether/styrene resin "OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Company, Inc., and the like.

Specific examples of the polysulfone resin include polysulfone "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

Among them, the thermoplastic resin (G) is preferably a phenoxy resin or a polyvinyl acetal resin. Accordingly, in one preferred embodiment, the thermoplastic resin comprises one or more selected from the group consisting of phenoxy resins and polyvinyl acetal resins. Among them, a phenoxy resin is preferable as the thermoplastic resin, and a phenoxy resin having a weight average molecular weight of 40,000 or more is particularly preferable.

When the resin composition contains (G) a thermoplastic resin, the content of the (G) thermoplastic resin is preferably 0.1% by mass or more when the non-volatile component in the resin composition is 100% by mass, It is more preferably 0.2% by mass or more, still more preferably 0.3% by mass or more. The upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less. (G) By setting the content of the thermoplastic resin within such a range, even if an inorganic filler having a small average particle size is used, a cured product having excellent adhesion after the HAST test can be obtained.

<(H) Optional Additives>
In one embodiment, the resin composition may further contain other additives, such as flame retardants, organic fillers, organic copper compounds, organic Examples include organometallic compounds such as zinc compounds and organocobalt compounds, and resin additives such as thickeners, antifoaming agents, leveling agents, adhesion imparting agents, and coloring agents.

Examples of flame retardants include phosphazene compounds, organic phosphorus flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicone flame retardants, and metal hydroxides. Specific examples of the phosphazene compound include "SPH-100", "SPS-100", "SPB-100" and "SPE-100" manufactured by Otsuka Chemical Co., Ltd., "FP-100" manufactured by Fushimi Pharmaceutical Co., Ltd., "FP-110", "FP-300", "FP-400" and the like can be mentioned, and as flame retardants other than phosphazene compounds, commercially available products may be used, for example, "HCA-HQ" manufactured by Sanko Co., Ltd. , "PX-200" manufactured by Daihachi Chemical Industry Co., Ltd., and the like.

Any organic filler that can be used in forming the insulating layer of a printed wiring board may be used as the organic filler, and examples thereof include rubber particles, polyamide fine particles, silicone particles, and the like. Commercially available rubber particles may be used, and examples thereof include "EXL2655" manufactured by Dow Chemical Japan, "AC3401N" and "AC3816N" manufactured by Aica Kogyo Co., Ltd., and the like.

<Physical properties and applications of the resin composition>
A cured product obtained by thermally curing a resin composition at 100° C. for 30 minutes, 170° C. for 30 minutes, and then at 200° C. for 90 minutes usually has excellent copper foil peeling strength (peel strength) before the HAST test. show. That is, it provides an insulating layer with excellent adhesion before the HAST test. The peel strength before the HAST test is preferably 0.4 kgf/cm or more, more preferably 0.5 kgf/cm or more, and still more preferably 0.6 kgf/cm or more. Although the upper limit is not particularly limited, it may be 10 kgf/cm or less. The copper foil peel strength before the HAST test can be measured by the method described in Examples below.

A cured product obtained by thermally curing the resin composition at 100° C. for 30 minutes, 170° C. for 30 minutes, and then at 200° C. for 90 minutes usually exhibits excellent copper foil peel strength after the HAST test. show. That is, it provides an insulating layer that exhibits excellent adhesion after the HAST test and can exhibit high adhesion over a long period of time. The peel strength after the HAST test is preferably 0.15 kgf/cm or more, more preferably 0.2 kgf/cm or more, and still more preferably 0.3 kgf/cm or more. Although the upper limit is not particularly limited, it may be 10 kgf/cm or less. The peel strength after the HAST test can be measured by the method described in Examples below.

A cured product obtained by thermally curing the resin composition at 100° C. for 30 minutes and then at 170° C. for 30 minutes usually exhibits excellent smear removability. That is, even if a via hole is formed in the cured product, an insulating layer having a maximum smear length of 5 μm or less at the bottom of the via hole is obtained. The smear removability can be measured by the method described in Examples below.

The resin composition of the present invention exhibits a specific low minimum melt viscosity at 60-200°C. That is, a resin composition having excellent wiring embedding properties is obtained. The minimum melt viscosity of the resin composition at 60 to 200° C. is preferably 5000 poise or less, more preferably 4500 poise or less, still more preferably 4000 poise or less. The lower limit of the lowest melt viscosity is preferably 100 poise or more, more preferably 1000 poise or more, from the viewpoint of stably maintaining the thickness even if the resin composition layer is thin. The minimum melt viscosity can be measured by a dynamic viscoelasticity method, for example, according to the method described in Examples below.

INDUSTRIAL APPLICABILITY The resin composition of the present invention can provide an insulating layer that has excellent thin film insulating properties and can maintain adhesion to a conductor layer after a HAST test. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board). It can be used more preferably as a resin composition for forming an insulating layer (a resin composition for an interlayer insulating layer of a printed wiring board). Moreover, since the resin composition of the present invention provides an insulating layer having good part-embedding properties, it can be suitably used when the printed wiring board is a component-embedded circuit board.

[Resin sheet]
The resin sheet of the present invention includes a support and a resin composition layer formed of the resin composition of the present invention provided on the support.

The thickness of the resin composition layer is preferably 25 μm or less, more preferably 20 μm or less, and even more preferably 20 μm or less, from the viewpoint of thinning the printed wiring board and providing a cured product having excellent insulation even if it is a thin film. It is 15 μm or less, or 10 μm or less. Although the lower limit of the thickness of the resin composition layer is not particularly limited, it can be usually 1 μm or more, 1.5 μm or more, or 2 μm or more.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.

When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"). ), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylic such as polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketones, polyimides, and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. may be used.

The support may be subjected to matte treatment, corona treatment, or antistatic treatment on the surface to be bonded to the resin composition layer.

Further, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the release layer-attached support includes, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. . As the support with a release layer, a commercially available product may be used, for example, "SK-1" manufactured by Lintec Co., Ltd., "SK-1", " AL-5", "AL-7", Toray's "Lumirror T60", Teijin's "Purex", and Unitika's "Unipeel".

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. When a release layer-attached support is used, the thickness of the release layer-attached support as a whole is preferably within the above range.

In one embodiment, the resin sheet may further contain other layers as necessary. Such other layers include, for example, a protective film conforming to the support provided on the surface of the resin composition layer not bonded to the support (that is, the surface opposite to the support). be done. Although the thickness of the protective film is not particularly limited, it is, for example, 1 μm to 40 μm. By laminating the protective film, the surface of the resin composition layer can be prevented from being dusted or scratched.

For the resin sheet, for example, a resin varnish is prepared by dissolving a resin composition in an organic solvent, the resin varnish is applied onto a support using a die coater or the like, and dried to form a resin composition layer. It can be manufactured by

Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone; acetic acid esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate; cellosolve and butyl carbitol; carbitols; aromatic hydrocarbons such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone. An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more type.

Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer is dried so that the content of the organic solvent is 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% by mass to 60% by mass of the organic solvent, drying at 50 ° C. to 150 ° C. for 3 minutes to 10 minutes The resin composition layer can be formed.

The resin sheet can be wound into a roll and stored. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[Printed wiring board]
The printed wiring board of the present invention includes an insulating layer, a first conductor layer, and a second conductor layer formed from the cured resin composition of the present invention. The insulating layer is provided between the first conductor layer and the second conductor layer, and insulates the first conductor layer from the second conductor layer (the conductor layer is sometimes called a wiring layer). be).

The insulating layer is formed from a cured product of the resin composition of the present invention. The thickness of the insulating layer between the first and second conductor layers is preferably 6 μm or less, more preferably 5.5 μm or less, still more preferably 5 μm or less. Although the lower limit is not particularly limited, it may be 0.1 μm or more. The distance between the first conductor layer and the second conductor layer (the thickness of the insulating layer between the first and second conductor layers) is, as shown in FIG. 11 and the thickness t1 of the insulating layer 3 between the main surface 21 of the second conductor layer 2 . The first and second conductor layers are conductor layers adjacent to each other with an insulating layer interposed therebetween, and the main surfaces 11 and 21 face each other.

The thickness t2 of the entire insulating layer is preferably 15 μm or less, more preferably 13 μm or less, and even more preferably 10 μm or less. Although the lower limit is not particularly limited, it can be usually 1 μm or more, 1.5 μm or more, 2 μm or more, or the like.

A printed wiring board can be manufactured using the resin sheet described above by a method including the following steps (I) and (II).
(I) Step of laminating the resin composition layer of the resin sheet on the inner layer substrate such that the resin composition layer is bonded to the inner layer substrate (II) Step of thermally curing the resin composition layer to form an insulating layer

The "inner layer substrate" used in step (I) is a member that serves as a printed wiring board substrate, and includes, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. etc. The substrate may also have a conductor layer on one or both sides thereof, and the conductor layer may be patterned. An inner layer substrate having conductor layers (circuits) formed on one side or both sides of the substrate is sometimes referred to as an "inner layer circuit board." Further, an intermediate product on which an insulating layer and/or a conductor layer are to be further formed when manufacturing a printed wiring board is also included in the "inner layer substrate" as used in the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer board with built-in components can be used.

The lamination of the inner layer substrate and the resin sheet can be performed, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as "thermocompression bonding member") include heated metal plates (such as SUS end plates) and metal rolls (SUS rolls). Instead of pressing the thermocompression member directly onto the resin sheet, it is preferable to press through an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the uneven surface of the inner layer substrate.

Lamination of the inner layer substrate and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60° C. to 160° C., more preferably 80° C. to 140° C., and the thermocompression pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. .29 MPa to 1.47 MPa, and the heat pressing time is preferably 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions of 26.7 hPa or less.

Lamination can be done with a commercially available vacuum laminator. Commercially available vacuum laminators include, for example, a vacuum pressurized laminator manufactured by Meiki Seisakusho, a vacuum applicator manufactured by Nikko Materials, a batch vacuum pressurized laminator, and the like.

After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression bonding conditions for the lamination described above. Smoothing treatment can be performed with a commercially available laminator. Lamination and smoothing may be performed continuously using the above-mentioned commercially available vacuum laminator.

The support may be removed between steps (I) and (II) or after step (II).

In step (II), the resin composition layer is thermally cured to form an insulating layer.

The thermosetting conditions for the resin composition layer are not particularly limited, and conditions that are commonly used for forming insulating layers of printed wiring boards may be used.

For example, although the thermosetting conditions for the resin composition layer vary depending on the type of resin composition, etc., the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and still more preferably 170° C. to 200° C. °C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, even more preferably 15 minutes to 90 minutes.

Before thermosetting the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is cured at a temperature of 50° C. or higher and less than 120° C. (preferably 60° C. or higher and 115° C. or lower, more preferably 70° C. or higher and 110° C. or lower). Preheating may be performed for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, still more preferably 15 minutes to 100 minutes).

When manufacturing a printed wiring board, (III) the step of drilling holes in the insulating layer, (IV) the step of roughening the insulating layer, and (V) the step of forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art that are used in the manufacture of printed wiring boards. When the support is removed after step (II), the support may be removed between step (II) and step (III), between step (III) and step (IV), or step ( It may be carried out between IV) and step (V). If necessary, the steps (II) to (V) of forming the insulating layer and the conductor layer may be repeated to form a multilayer wiring board. In this case, the thickness of the insulating layer between the conductor layers (t1 in FIG. 1) is preferably within the above range.

Step (III) is a step of making holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. Step (III) may be performed using, for example, a drill, laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions that are commonly used in forming insulating layers of printed wiring boards can be employed. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralizing treatment with a neutralizing liquid in this order. The swelling liquid used in the roughening treatment is not particularly limited, but examples thereof include alkaline solutions, surfactant solutions, etc., preferably alkaline solutions, more preferably sodium hydroxide solutions and potassium hydroxide solutions. preferable. Examples of commercially available swelling liquids include "Swelling Dip Securigans P" and "Swelling Dip Securigans SBU" manufactured by Atotech Japan. The swelling treatment with the swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in the swelling liquid at 30.degree. C. to 90.degree. C. for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40° C. to 80° C. for 5 minutes to 15 minutes. The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60° C. to 80° C. for 10 to 30 minutes. Further, the permanganate concentration in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Security P" manufactured by Atotech Japan. Moreover, as a neutralization liquid used for the roughening treatment, an acidic aqueous solution is preferable, and as a commercial product, for example, "Reduction Solution Securigant P" manufactured by Atotech Japan Co., Ltd. can be mentioned. The treatment with the neutralizing solution can be carried out by immersing the treated surface roughened with the oxidizing agent in the neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the viewpoint of workability, etc., a method of immersing an object roughened with an oxidizing agent in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferable.

In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, and even more preferably 300 nm or less. Although the lower limit is not particularly limited, it is preferably 0.5 nm or more, more preferably 1 nm or more. The root mean square roughness (Rq) of the surface of the insulating layer after roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, and even more preferably 300 nm or less. Although the lower limit is not particularly limited, it is preferably 0.5 nm or more, more preferably 1 nm or more. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

Step (V) is a step of forming a conductor layer. When no conductor layer is formed on the inner layer substrate, the step (V) is a step of forming a first conductor layer, and when a conductor layer is formed on the inner layer substrate, the conductor layer becomes the first conductor layer. and step (V) is a step of forming a second conductor layer.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, a nickel-chromium alloy, a copper- nickel alloys and copper-titanium alloys). Among them, from the viewpoint of versatility of conductor layer formation, cost, ease of patterning, etc., single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, nickel-chromium alloys, copper- Nickel alloys and copper/titanium alloy alloy layers are preferred, and single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or nickel/chromium alloy alloy layers are more preferred, and copper single metal layers are preferred. A metal layer is more preferred.

The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer is generally between 3 μm and 35 μm, preferably between 5 μm and 30 μm, depending on the desired printed wiring board design.

In one embodiment, the conductor layer may be formed by plating. For example, a conductive layer having a desired wiring pattern can be formed by plating the surface of an insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method. It is preferably formed by a method. An example of forming a conductor layer by a semi-additive method is shown below.

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a portion of the plating seed layer corresponding to a desired wiring pattern. After forming a metal layer on the exposed plating seed layer by electroplating, the mask pattern is removed. After that, the unnecessary plating seed layer is removed by etching or the like, and a conductor layer having a desired wiring pattern can be formed.

Since the resin sheet of the present invention provides an insulating layer having good component embedding properties, it can be suitably used even when the printed wiring board is a component-embedded circuit board. A circuit board with a built-in component can be manufactured by a known manufacturing method.

A printed wiring board manufactured using the resin sheet of the present invention is provided with an insulating layer that is a cured product of the resin composition layer of the resin sheet, and an embedded wiring layer embedded in the insulating layer. good too.

[Semiconductor device]
A semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

Examples of semiconductor devices include various semiconductor devices used in electrical appliances (eg, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (eg, motorcycles, automobiles, trains, ships, aircraft, etc.).

The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. A "conducting part" is a "part where an electric signal is transmitted on a printed wiring board", and the place may be a surface or an embedded part. Also, the semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

The method of mounting a semiconductor chip when manufacturing a semiconductor device is not particularly limited as long as the semiconductor chip functions effectively. (BBUL) mounting method, anisotropic conductive film (ACF) mounting method, non-conductive film (NCF) mounting method, and the like. Here, "a mounting method using a build-up layer without bumps (BBUL)" means "a mounting method in which a semiconductor chip is directly embedded in a concave portion of a printed wiring board and the semiconductor chip and wiring on the printed wiring board are connected." is.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to Examples. The invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified.

[Example 1]
10 parts of bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169), and naphthol type epoxy resin ("ESN475V" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. , epoxy equivalent of about 330) was dissolved in 40 parts of solvent naphtha by heating with stirring. This was cooled to room temperature to prepare (A) a dissolved epoxy resin composition.

To this (A) epoxy resin solution composition, 5 parts of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone having a solid content of 30% by mass), a phenolic resin having a triazine skeleton and a novolac structure Curing agent ("LA-3018-50P" manufactured by DIC, active group equivalent of about 151, 2-methoxypropanol solution with a solid content of 50%) 5 parts, active ester curing agent ("HPC-8000-65T" manufactured by DIC) , Active group equivalent weight about 223, solid content 65 wt% toluene solution) 50 parts, curing accelerator (1-benzyl-2-phenylimidazole (1B2PZ), solid content 10 wt% MEK solution) 5 parts, amine-based alkoxy 250 parts of spherical silica (average particle size 0.77 μm, Admatechs “SO-C2”) surface-treated with a silane compound (“KBM573” manufactured by Shin-Etsu Chemical Co., Ltd.), and a maleimide compound (Designer Molecules Co., Ltd. "BMI3000J" manufactured by Kao Corporation, N-alkylbismaleimide having a skeleton derived from dimer diamine, and 25 parts of a 40% by mass toluene solution of the above formula (6)) are mixed and uniformly dispersed with a high-speed rotating mixer to form a resin varnish. made.

As a support, a polyethylene terephthalate film (“AL5” manufactured by Lintec Corporation, thickness 38 μm) provided with a release layer was prepared. The aforementioned resin varnish was uniformly coated on the release layer of this support so that the thickness of the resin composition layer after drying was 25 μm. Thereafter, the resin varnish was dried at 80° C. to 120° C. (average 100° C.) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

[Example 2]
In Example 1, 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI3000J" manufactured by Designer Molecules) was added to 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI1700" manufactured by Designer Molecules). changed. A resin varnish and a resin sheet were produced in the same manner as in Example 1 except for the above matters.

[Example 3]
In Example 1, 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI3000J" manufactured by Designer Molecules) was added to 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI1500" manufactured by Designer Molecules). changed. A resin varnish and a resin sheet were produced in the same manner as in Example 1 except for the above matters.

[Example 4]
In Example 1, 25 parts of a 40% by mass toluene solution of a maleimide compound (“BMI3000J” manufactured by Designer Molecules) was added to a maleimide compound (“BMI689” manufactured by Designer Molecules, N having a skeleton derived from dimer diamine). -Alkyl bismaleimide, 25 parts of a 40 mass% toluene solution of the above formula (7)). A resin varnish and a resin sheet were produced in the same manner as in Example 1 except for the above matters.

式中、Ｍｅはメチル基を表し、Ｅｔはエチル基を表す。 [Comparative Example 1]
In Example 1, 25 parts of a 40 mass% toluene solution of a maleimide compound (“BMI3000J” manufactured by Designer Molecules) was added to 40 mass of a maleimide compound (“BMI70” manufactured by K.I Kasei Co., Ltd.) represented by the following structural formula. % MEK solution was changed to 25 parts. A resin varnish and a resin sheet were produced in the same manner as in Example 1 except for the above matters.

In the formula, Me represents a methyl group and Et represents an ethyl group.

[Comparative Example 2]
In Example 2, the amount of spherical silica (average particle size 0.77 μm, “SO-C2” manufactured by Admatechs) surface-treated with an amine-based alkoxysilane compound (“KBM573” manufactured by Shin-Etsu Chemical Co., Ltd.) was added to 250 parts. to 240 parts, and the maleimide compound ("BMI3000J" manufactured by Designer Molecules) was not used. A resin varnish and a resin sheet were produced in the same manner as in Example 2 except for the above matters.

[Evaluation method]
The resin sheets obtained in Examples and Comparative Examples described above were evaluated by the following methods.

[Method for measuring peel strength]
<Preparation of substrate for adhesion evaluation>
(1) Surface treatment of interior substrate:
As an inner layer substrate, a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, “R1515A” manufactured by Panasonic Corporation) having copper foil on the surface was prepared. All the copper foil on the surface of this inner layer substrate was removed by etching. After that, drying was performed at 190° C. for 30 minutes.

(2) Lamination of resin sheets:
The resin sheets obtained in the above-described Examples and Comparative Examples are processed using a batch-type vacuum pressure laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer is the inner layer substrate. Both sides of the inner layer substrate were laminated so as to be bonded. This lamination was carried out by pressure bonding for 30 seconds at a temperature of 100° C. and a pressure of 0.74 MPa after reducing the pressure to 13 hPa or less for 30 seconds.

Then, the laminated resin sheet was hot-pressed for 60 seconds at 100° C. under atmospheric pressure and a pressure of 0.5 MPa for smoothing. After that, the support was peeled off to obtain an "intermediate multilayer body I" comprising a resin composition layer, an inner layer substrate and a resin composition layer in this order.

On the other hand, a copper foil with a glossy surface (thickness 35 μm, “3EC-III” manufactured by Mitsui Kinzoku Co., Ltd.) was prepared. The glossy surface of this copper foil was roughened by etching with a micro-etching agent (“CZ8101” manufactured by MEC Co., Ltd.) at a copper etching amount of 1 μm. The copper foil thus obtained is called "roughened copper foil".

This roughened copper foil was laminated on both surfaces of the intermediate multilayer body I so that the roughened surface of the roughened copper foil was bonded to the resin composition layer of the intermediate multilayer body I. This lamination was performed under the same conditions as the lamination of the resin sheet to the inner layer substrate described above. As a result, an "intermediate multi-layer body II" containing the surface-roughened copper foil, the resin composition layer, the inner layer substrate, the resin composition layer and the surface-roughened copper foil in this order was obtained.

This intermediate multilayer body II was placed in an oven at 100° C. and heated for 30 minutes, then transferred to an oven at 170° C. and heated for 30 minutes. Next, the intermediate multilayer body II was taken out from the oven under a room temperature atmosphere, and then placed in an oven at 200° C. for additional heating for 90 minutes. As a result, the resin composition layer is thermally cured, and the roughened copper foil, the insulating layer as a cured product of the resin composition layer, the inner layer substrate, the insulating layer as a cured product of the resin composition layer, and the rough An "evaluation board A" containing copper oxide foils in this order was obtained. In this evaluation substrate A, the roughened copper foil corresponds to the conductor layer.

<Measurement of peel strength before HAST test>
Using the evaluation board A described above, the peel strength between the roughened copper foil and the insulating layer was measured. The peel strength was measured according to JIS C6481. Specifically, the peel strength was measured by the following operation.

The surface-roughened copper foil of the evaluation substrate A was cut so as to surround a rectangular portion having a width of 10 mm and a length of 100 mm. One end of this rectangular portion was peeled off and gripped with a gripper (Autocom type testing machine "AC-50C-SL" manufactured by TSE Co., Ltd.). A range of 35 mm in length of the rectangular portion was peeled off in the vertical direction, and the load (kgf/cm) at the time of this peeling was measured as the peel strength. The peeling was performed at room temperature at a speed of 50 mm/min.

<Measurement of peel strength after HAST test>
After that, a HAST test was performed by placing the evaluation substrate A in an environment of 130° C. temperature and 85% RH for 100 hours. After the HAST test, the peel strength between the roughened copper foil and the insulating layer of the evaluation board A was measured by the same method as before the HAST test.

[Evaluation of smear removal]
(1) Surface treatment of interior substrate:
As an inner layer substrate, a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, “R1515A” manufactured by Panasonic Corporation) having copper foil on the surface was prepared. The copper foil on the surface of the inner layer substrate was roughened by etching with a microetching agent (“CZ8101” manufactured by MEC Co., Ltd.) at a copper etching amount of 1 μm. After that, drying was performed at 190° C. for 30 minutes.

(2) Lamination and curing of resin sheets:
The resin sheets obtained in the above-described Examples and Comparative Examples are processed using a batch-type vacuum pressure laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer is the inner layer substrate. Both sides of the inner layer substrate were laminated so as to be bonded. This lamination was carried out by pressure bonding for 30 seconds at a temperature of 100° C. and a pressure of 0.74 MPa after reducing the pressure to 13 hPa or less for 30 seconds.
Then, the laminated resin sheet was hot-pressed for 60 seconds at 100° C. under atmospheric pressure and a pressure of 0.5 MPa for smoothing. Further, this was placed in an oven at 100° C. and heated for 30 minutes, then transferred to an oven at 170° C. and heated for 30 minutes.

(3) Via hole formation:
Using a CO ₂ laser processing machine (LK-2K212/2C) manufactured by Via Mechanics Co., Ltd., the insulating layer is processed under the conditions of a frequency of 2000 Hz, a pulse width of 3 μs, an output of 0.95 W, and the number of shots of 3. A via hole having a top diameter (diameter) of 50 μm and a diameter of 50 μm at the bottom surface of the insulating layer was formed. After that, the support was peeled off to obtain a circuit board.

(4) Roughening Treatment The surface of the insulating layer of the circuit board was immersed in a swelling liquid, Swelling Dip Securigant P (Atotech Japan Co., Ltd.), at 60° C. for 10 minutes. Next, the surface of the insulating layer of the circuit board was immersed in a roughening liquid, Concentrate Compact P (KMnO ₄ : 60 g/L, NaOH: 40 g/L aqueous solution) from Atotech Japan at 80° C. for 25 minutes. Finally, the surface of the insulating layer of the circuit board was immersed in a neutralizing solution, Reduction Solution Securigant P (Atotech Japan Co., Ltd.), at 40° C. for 5 minutes.

(5) Evaluation of Residue at Bottom of Via Hole The periphery of the bottom of the via hole was observed with a scanning electron microscope (SEM), the maximum smear length from the wall surface of the bottom of the via hole was measured from the resulting image, and evaluated according to the following criteria.
○: The maximum smear length is less than 5 μm ×: The maximum smear length is 5 μm or more

[Measurement of minimum melt viscosity]
The melt viscosities of the resin composition layers in the resin sheets prepared in Examples and Comparative Examples were measured using a dynamic viscoelasticity measuring device ("Rheosol-G3000" manufactured by UBM Co., Ltd.). This measurement was performed on a 1 g sample taken from the resin composition layer using a parallel plate with a diameter of 18 mm. The measurement conditions were a starting temperature of 60° C. to 200° C., a temperature increase rate of 5° C./min, a measurement temperature interval of 2.5° C., and a vibration of 1 Hz/deg. The lowest melt viscosity was obtained from the measured values of the obtained melt viscosities.

[result]
The results of the examples and comparative examples described above are shown in the table below. In the table below, the amount of each component represents the non-volatile component equivalent amount. In the table below, abbreviations have the following meanings.
ESN475V: Naphthol-type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., epoxy equivalent of about 330
ZX1059: bisphenol type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169
BMI3000J: maleimide compound, manufactured by Designer Molecules BMI1700: maleimide compound, manufactured by Designer Molecules BMI1500: maleimide compound, manufactured by Designer Molecules BMI689: maleimide compound, manufactured by Designer Molecules BMI70: maleimide compound, silica・ Ai Chemical Co., Ltd. HPC-8000-65T: Active ester curing agent, manufactured by DIC, active group equivalent of about 223, solid content 65% by mass toluene solution SO-C2: Amine-based alkoxysilane compound (manufactured by Shin-Etsu Chemical Co., Ltd. "KBM573") surface-treated spherical silica, average particle size 0.5 μm, manufactured by Admatechs LA-3018-50P: Phenolic curing agent having a triazine skeleton and novolac structure, manufactured by DIC, active group equivalent of about 151 , 2-methoxypropanol solution with a solid content of 50% YX7553BH30: phenoxy resin, manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass 1B2PZ: curing accelerator, 1-benzyl-2-phenylimidazole, MEK solution with a solid content of 10% by mass

In Examples 1 to 4, it has been confirmed that even if the components (C) to (G) are not contained, the results are similar to those of the above examples, although there is a difference in degree.

1 First conductor layer 11 Main surface of first conductor layer 2 Second conductor layer 21 Main surface of second conductor layer 3 Insulating layer t1 Distance between first conductor layer and second conductor layer (first conductor layer) and the thickness of the insulating layer between the second conductor layers)
t2 thickness of the entire insulating layer

Claims (16)

A resin composition comprising (A) an epoxy resin, (B) a maleimide compound, and (G) a thermoplastic resin,
Component (B) contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms,
A resin composition in which the content of component (G) is 0.1% by mass or more and 5% by mass or less when the non-volatile component in the resin composition is taken as 100% by mass. The resin composition according to claim 1, wherein component (B) is represented by the following general formula (B-1).

In general formula (B-1), each R independently represents an optionally substituted alkylene group having 5 or more carbon atoms, and L represents a single bond or a divalent linking group. 3. The resin composition according to claim 1, wherein the content of component (B) is 0.1% by mass or more and 10% by mass or less when the non-volatile component in the resin composition is 100% by mass. 4. The resin composition according to any one of claims 1 to 3, further comprising (C) an active ester compound. 5. The resin composition according to claim 4, wherein the content of component (C) is 5% by mass or more when the non-volatile components in the resin composition are taken as 100% by mass. The resin composition according to any one of claims 1 to 5, further comprising (D) an inorganic filler. 7. The resin composition according to claim 6, wherein the content of component (D) is 50% by mass or more. In general formula (B-1), L is an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, and 1 to 50 carbon atoms which may have a substituent. alkylene group, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a divalent group consisting of a combination of two or more of these groups , The resin composition according to any one of claims 1 to 7. The resin composition according to any one of claims 1 to 8, wherein component (B) is represented by the following general formula (B-2).

In general formula (B-2), R 'represents an alkylene group having 5 or more carbon atoms which may each independently have a substituent, and A each independently may have a substituent. represents an alkylene group having 5 or more carbon atoms or a divalent group having an optionally substituted aromatic ring; n represents an integer of 1-10. In general formula (B-2), A is each independently a cyclic alkylene group having 5 or more carbon atoms which may have a substituent; 2 having a benzene ring which may have a substituent a divalent group having an optionally substituted phthalimide ring; or a divalent group having an optionally substituted pyromellitic diimide ring. The described resin composition. The resin composition according to any one of claims 1 to 10, which is used for forming an insulating layer of a printed wiring board. The resin composition according to any one of claims 1 to 11, which is used for forming an interlayer insulating layer of a printed wiring board. A resin sheet comprising a support and a resin composition layer formed of the resin composition according to any one of claims 1 to 12 provided on the support. 14. The resin sheet according to claim 13, wherein the resin composition layer has a thickness of 25 [mu]m or less. A printed wiring board comprising a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer,
A printed wiring board, wherein the insulating layer is a cured product of the resin composition according to any one of claims 1 to 12. A semiconductor device comprising the printed wiring board according to claim 15 .

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