TW201922414A - 研磨媒介及其製造方法、與鏡面研磨方法 - Google Patents
研磨媒介及其製造方法、與鏡面研磨方法 Download PDFInfo
- Publication number
- TW201922414A TW201922414A TW107124916A TW107124916A TW201922414A TW 201922414 A TW201922414 A TW 201922414A TW 107124916 A TW107124916 A TW 107124916A TW 107124916 A TW107124916 A TW 107124916A TW 201922414 A TW201922414 A TW 201922414A
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- grinding
- grinding medium
- polishing
- medium
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017156224A JP2020189340A (ja) | 2017-08-11 | 2017-08-11 | 研磨メディアおよびその製造方法、並びに鏡面研磨方法 |
JP2017-156224 | 2017-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201922414A true TW201922414A (zh) | 2019-06-16 |
Family
ID=65272372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107124916A TW201922414A (zh) | 2017-08-11 | 2018-07-19 | 研磨媒介及其製造方法、與鏡面研磨方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2020189340A (ja) |
TW (1) | TW201922414A (ja) |
WO (1) | WO2019031113A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3389193B2 (ja) * | 1999-04-26 | 2003-03-24 | 住友特殊金属株式会社 | リング状ボンド磁石空孔部の封孔処理方法および該方法により封孔処理されたリング状ボンド磁石 |
JP2003089054A (ja) * | 2001-09-18 | 2003-03-25 | Citizen Watch Co Ltd | 研磨メディア粉 |
JP4456145B2 (ja) * | 2007-09-27 | 2010-04-28 | 株式会社チップトン | 乾式バレル研磨方法 |
CN106132632A (zh) * | 2014-04-07 | 2016-11-16 | 新东工业株式会社 | 筒式研磨用介质及其制造方法 |
-
2017
- 2017-08-11 JP JP2017156224A patent/JP2020189340A/ja active Pending
-
2018
- 2018-07-03 WO PCT/JP2018/025241 patent/WO2019031113A1/ja active Application Filing
- 2018-07-19 TW TW107124916A patent/TW201922414A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2020189340A (ja) | 2020-11-26 |
WO2019031113A1 (ja) | 2019-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6376465B2 (ja) | バレル研磨方法 | |
Lee et al. | Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film | |
CN108214242A (zh) | 手机3d陶瓷后盖专用磨床及其研磨方法 | |
CN106363486B (zh) | 红外硫系玻璃预制小球的制备方法 | |
CN103648719A (zh) | 超精加工砂轮、使用该砂轮的超精加工方法和球轴承 | |
TW201922414A (zh) | 研磨媒介及其製造方法、與鏡面研磨方法 | |
JP2015069671A (ja) | 磁気ディスク用ガラス基板の製造方法 | |
JP6770719B2 (ja) | バレル研磨用の研磨体及びバレル研磨方法、並びにこの研磨体の製造方法 | |
CN110814928B (zh) | 一种高表面光洁度圆球加工方法 | |
JP2015009315A (ja) | 研削/研磨用キャリア及び磁気ディスク用ガラス基板の製造方法 | |
CN104710939B (zh) | 一种改善光学零件边缘面形的加工方法及复合磨粒抛光液 | |
JP5982427B2 (ja) | 両面加工装置に用いられるキャリアプレート | |
CN104641415B (zh) | 磁盘用玻璃基板的制造方法以及磁盘的制造方法 | |
JP5589427B2 (ja) | カップ型ドレッサ及びツルーイング・ドレッシング方法 | |
Cichosz et al. | of article:„Zaokrąglanie krawędzi skrawających ostrzy z węglików spiekanych”(“Rounding off of machine-cutting blades | |
US20150239094A1 (en) | Abrasive article and method of forming | |
CN107427985B (zh) | 金刚石表面的研磨方法及实施该研磨方法的装置 | |
JP2015064920A (ja) | 磁気ディスク用ガラス基板の製造方法 | |
JP6199047B2 (ja) | 磁気ディスク用ガラス基板の製造方法 | |
JP2011230201A (ja) | ガラス製光学素子の製造方法 | |
JP4197803B2 (ja) | 研削法 | |
Fukazawa et al. | Mirror grinding of silicon wafer with silica EPD pellets | |
KR20170087300A (ko) | 에지 그라인딩 장치 | |
JP6353524B2 (ja) | 基板の製造方法 | |
JP2015069665A (ja) | 磁気ディスク用ガラス基板の製造方法 |