TW201921545A - 基板處理系統及基板處理方法 - Google Patents

基板處理系統及基板處理方法

Info

Publication number
TW201921545A
TW201921545A TW107118366A TW107118366A TW201921545A TW 201921545 A TW201921545 A TW 201921545A TW 107118366 A TW107118366 A TW 107118366A TW 107118366 A TW107118366 A TW 107118366A TW 201921545 A TW201921545 A TW 201921545A
Authority
TW
Taiwan
Prior art keywords
substrate
daf
tape
frame
section
Prior art date
Application number
TW107118366A
Other languages
English (en)
Chinese (zh)
Inventor
田村武
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201921545A publication Critical patent/TW201921545A/zh

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW107118366A 2017-06-02 2018-05-30 基板處理系統及基板處理方法 TW201921545A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017110475A JP2018206936A (ja) 2017-06-02 2017-06-02 基板処理システム、基板処理方法
JP2017-110475 2017-06-02

Publications (1)

Publication Number Publication Date
TW201921545A true TW201921545A (zh) 2019-06-01

Family

ID=64958209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118366A TW201921545A (zh) 2017-06-02 2018-05-30 基板處理系統及基板處理方法

Country Status (2)

Country Link
JP (1) JP2018206936A (ja)
TW (1) TW201921545A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023042261A1 (ja) * 2021-09-14 2023-03-23

Also Published As

Publication number Publication date
JP2018206936A (ja) 2018-12-27

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