TW201919967A - Substrate handling device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method - Google Patents

Abstract

In order to shorten the time required for substrate replacement, this substrate handling device which conveys a substrate to the holding surface of a holding device comprises: a first holding portion which holds the substrate above the holding device; a second holding portion which holds part of the substrate held by the first holding portion; and a drive unit which moves the holding device, the second holding portion and the first holding portion relative to one another in a predetermined direction along the holding surface, in such a manner that the first holding portion is retracted from above the holding device. While the first holding portion is undergoing relative movement caused by the drive unit, the substrate is held in such a manner that the position in the vertical direction of the region of the substrate which is held by the first holding portion approaches the holding device.

Description

Substrate carrying device, exposure device, manufacturing method of flat panel display, component manufacturing method, substrate carrying method, and exposure method

The present invention relates to a substrate conveying device, an exposure device, a manufacturing method of a flat panel display, a component manufacturing method, a substrate conveying method, and an exposure method.

In the lithography step of manufacturing electronic components such as liquid crystal display devices and semiconductor devices, an exposure device has been used. The exposure device uses an energy beam to transfer a pattern formed on a mask (or reticle) to a substrate (made of glass). Or plastic substrates, semiconductor wafers, etc.).

In such an exposure device, the exposed substrate on the stage device holding the substrate is carried out, and the new substrate is carried on the stage device. A method for transferring a substrate is known, for example, the method described in Patent Document 1. [Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2013/150787

According to a first embodiment, a substrate transfer device is provided that transfers a substrate to a holding surface of a holding device, and includes: a first holding portion that holds the substrate above the holding device; and a second holding portion that holds a substrate. A portion of the substrate held by the first holding portion; and a driving portion that causes the holding device and the second holding portion to be separated from each other in such a manner that the first holding portion retracts from above the holding device. The first holding portion is relatively moved in a predetermined direction along the holding surface; and in the relative movement of the first holding portion by the driving portion, the first holding portion is held by the substrate through the first holding portion. The substrate is held in such a manner that the position in the vertical direction of the area is close to the holding device.

According to a second embodiment, there is provided an exposure apparatus including: the substrate conveying device; and an optical system that irradiates the substrate, which is conveyed to the holding device, with an energy beam to expose the substrate.

According to a third embodiment, a flat panel display manufacturing method is provided, which includes: exposing a substrate using the exposure device; and developing the substrate after the exposure.

According to a fourth embodiment, there is provided a device manufacturing method including: exposing a substrate using the exposure device; and developing the substrate after the exposure.

According to a fifth embodiment, a substrate transfer method is provided, which transfers a substrate to a holding surface of a holding device, and includes: holding the substrate by a first holding portion and a second holding portion above the holding device; and A manner in which the first holding portion retracts from above the holding device, causing the holding device and the second holding portion and the first holding portion to relatively move in a predetermined direction along the holding surface; and By the holding, during the relative movement, the first holding portion holds the substrate so that the position in the vertical direction of the region held by the first holding portion in the substrate approaches the holding device.

According to a sixth embodiment, there is provided an exposure method including: conveying the substrate to the holding device by the substrate conveying method; and irradiating the substrate with an energy beam to expose the substrate.

According to a seventh embodiment, there is provided a flat panel display manufacturing method including: exposing the substrate using the exposure method; and developing the exposed substrate.

According to an eighth embodiment, there is provided a device manufacturing method including: exposing the substrate using the exposure method; and developing the substrate after the exposure.

In addition, the configuration of the embodiment described below may be appropriately improved, and at least a part of it may be replaced with another configuration. Furthermore, the constituent elements which are not particularly limited in the arrangement are not limited to the arrangements disclosed in the embodiments, and may be arranged at positions where their functions can be achieved.

First Embodiment First, a first embodiment of the present invention will be described with reference to Figs. 1 to 8 (c).

FIG. 1 schematically shows a configuration of an exposure apparatus 10A according to the first embodiment. FIG. 2 is a plan view of the stage device 20A and the substrate transfer device 100A included in the exposure device 10A (partially omitted) of FIG. 1. 3 (a) is a plan view of the platform device 20A, FIG. 3 (b) is a side view of the platform device 20A, and FIG. 3 (c) is a cross-sectional view taken along the line A-A of FIG. 3 (a).

The exposure device 10A is, for example, a projection exposure method using a step and scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) is used as an exposure target. Device, so-called scanner.

As shown in FIG. 1, the exposure device 10A includes an illumination system 12, a mask stage 14 holding a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a surface (a surface facing the + Z side in FIG. 1). The platform device 20A, the substrate transfer device 100A, and the control system etc. of the substrate P on which the resist (inductive agent) is applied. Hereinafter, as shown in FIG. 1, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are set for the exposure device 10A so that the mask M and the substrate P are aligned along the X-axis direction with respect to the projection optical system 16 during exposure. A method of relative scanning and setting the Y axis in a horizontal plane will be described. In addition, the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. In addition, the positions related to the X-axis, Y-axis, and Z-axis directions will be described as X positions, Y positions, and Z positions, respectively.

The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331, and the like, and irradiates the mask M with illumination light (illumination light) IL for exposure. As the illumination light IL, for example, light including at least one of an i-ray (wavelength 365 nm), a g-ray (wavelength 436 nm), and an h-ray (wavelength 405 nm) can be used. In addition, the wavelength of the light source used in the lighting system 12 and the illumination light IL irradiated from the light source is not particularly limited, and may be, for example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm) Etc. UV light or F ₂ laser light (wavelength 157 nm) and other vacuum UV light.

The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is, for example, driven by a mask stage driving system (not shown) including a linear motor with a predetermined stroke at least in the scanning direction (X-axis direction). In addition, in order to adjust the relative position to at least one of the lighting system 12, the stage device 20A, and the projection optical system 16, the mask stage 14 is driven by a micro-motion driving system that moves the X position or the Y position by a stroke. The position information of the mask stage 14 is obtained by, for example, a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in US Pat. No. 6,552,775 and the like, and includes, for example, a plurality of optical systems that are telecentric on both sides forming an erect image. In addition, the projection optical system 16 may not be a multi-lens type. It may also be constituted by a single projection optical system used in a semiconductor exposure apparatus.

In the exposure device 10A, when the mask M located in a predetermined illumination area of the illumination light IL from the illumination system 12 is illuminated, the projection optical system 16 projects a projection image (partially) of the pattern of the mask M in the illumination area. A pattern image) is formed in the exposure area. In addition, the mask M is relatively moved in the scanning direction with respect to the illumination area (illumination light IL), and the substrate P is relatively moved in the scanning direction with respect to the exposure area. The pattern (the entire pattern corresponding to the scanning range of the mask M) on the mask M is transferred.

(Platform device 20A) The platform device 20A includes a fixed plate 22, a substrate table 24, a support device 26, and a substrate holder 28A.

The fixed plate 22 is composed of a rectangular plate-shaped member in a plan view (viewed from the + Z side) arranged so that the above surface (+ Z plane) is parallel to the XY plane, and is installed on the ground F via a vibration isolator (not shown). on. The supporting device 26 is mounted on the fixed plate 22 in a non-contact state, and supports the substrate stage 24 in a non-contact manner from below. The substrate holder 28A is disposed on the substrate stage 24, and the substrate stage 24 and the substrate holder 28A are integrally driven by a not-shown platform driving system included in the platform device 20A. The platform drive system includes: a coarse motion system, such as a linear motor, which can drive the substrate table 24 in the X-axis and Y-axis directions (along the upper surface of the fixed plate 22) with a predetermined stroke; and a micro-motion system, such as a The circle motor micro-drives the substrate stage 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions. In addition, the platform device 20A includes a platform measurement system, which includes, for example, an optical interferometer system or an encoder system, and is used to obtain the position information in the six degrees of freedom of the substrate stage 24.

As shown in FIG. 3 (a), the substrate P is placed on the upper surface TS (the surface on the + Z side) of the substrate holder 28A having a rectangular shape in a plan view. The aspect ratio of the upper surface TS is substantially the same as that of the substrate P. As an example, the lengths of the long and short sides of the upper surface TS are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively.

The upper surface TS of the substrate holder 28A is processed flat over the entire surface. In addition, on the upper surface of the substrate holder 28A, a plurality of minute holes (not shown) for air blowing and minute holes (not shown) for vacuum suction are formed. In addition, a common hole portion may be used in combination with the minute hole portion for air blowing and the minute hole portion for vacuum suction. The substrate holder 28A can suck the air between the upper surface and the substrate P through the plurality of holes using a vacuum suction force supplied from a vacuum device (not shown), so that the substrate P is adsorbed on the upper surface TS (performed by Plane correction). The substrate holder 28A is a so-called pin-clamp type holder, and a plurality of pins (very small pins having a diameter of, for example, about 1 mm in diameter) are arranged at substantially equal intervals. By having the plurality of pins, the substrate holder 28A can reduce the possibility of sandwiching garbage or foreign objects on the back surface of the substrate P to support it, and can reduce the possibility of deformation of the substrate P caused by the foreign object sandwiching. The substrate P is held (supported) on the upper surfaces of the plurality of pins. The XY plane formed by the upper surfaces of the plurality of pins is defined as the upper surface of the substrate holder 28A. In addition, the substrate holder 28A can supply a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface TS and the substrate P (supply air) through the hole portion, and thereby, The back surface of the substrate P adsorbed to the substrate holder 28A is separated from the upper surface TS (the substrate P is floated). In addition, by using each of the plurality of hole portions formed in the substrate holder 28A, a time difference is caused in the timing of supplying the pressurized gas, or the positions of the hole portions for vacuum suction and the holes for supplying the pressurized gas are appropriately replaced. Or, by appropriately changing the air pressure during suction and air supply, the grounding state of the substrate P can be controlled (for example, no air accumulation can occur between the back surface of the substrate P and the upper surface of the substrate holder 28A).

In addition, the substrate holder 28A may correct the surface of the substrate in a state of being lifted and supported without causing the substrate to be adsorbed on the upper surface TS. In this case, the substrate holder 28A supplies a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) to the back surface (gas supply) of the substrate P through the hole portion, thereby making the gas Interposed between the lower surface of the substrate P and the upper surface of the substrate holder 28A (ie, a gas film is formed). In addition, the substrate holder 28A sucks the gas between the substrate holder 28A and the substrate P through the hole for vacuum suction using a vacuum suction device, and causes a downward force (preload) in the direction of gravity. ) Acting on the substrate P to impart rigidity in the direction of gravity to the gas film. In addition, the substrate holder 28A can also hold (support) the substrate P in a non-contact manner while floating through a small gap in the Z-axis direction by balancing the pressure and flow of the pressurized gas with the vacuum suction force. One side causes a force controlling its flatness (for example, a force to correct or correct the flatness) to act on the substrate P. In addition, each hole portion may be formed by processing the substrate holder 28A, or the substrate holder 28A may be formed by using a porous material to supply or suck air. In addition, the upper surface TS of the substrate holder 28A that supports the substrate P is not a surface on which a hole portion is formed, and an imaginary surface located above the surface with the gap above, that is, a lower surface of the substrate after plane correction is set as Top surface TS.

In addition, as shown in FIG. 3 (a), the + X side end portion of the upper surface TS of the substrate holder 28A is spaced apart in the Y-axis direction to form, for example, two notches 28 b. As shown in FIG. 3 (c), the notches 28 b are respectively opened on the upper surface TS and the side surface on the + X side of the substrate holder 28A.

(Substrate Transfer Device 100A) As shown in FIG. 1, the substrate transfer device 100A includes a port portion 150A, a substrate transfer portion 160A, and a transfer device 180A. The port part 150A and the substrate conveyance part 160A are provided on the + X side with respect to the platform device 20A. For example, the transfer of the substrate P between an external device (not shown) such as a coater / developer and an exposure device is performed by the substrate transfer device 100A. The substrate transfer unit 160A is used to transfer the exposed substrate P (P1) from the substrate holder 28A to the port opening portion 150A, and to transfer a new substrate P (P2) to be exposed from the port opening portion 150A to the substrate holder 28A. In addition, the substrate P2 may be an unexposed (once or unexposed) substrate, or may be a substrate to be subjected to second and subsequent exposures.

In addition, the transfer of the substrate P between the external device and the exposure device 10A is performed by an external transfer device 300 which is disposed in the housing lighting system 12, the mask platform 14, the projection optical system 16, and the platform device. The outside of a chamber (not shown) such as 20A and the substrate transfer apparatus 100A. The external conveying device 300 has a fork-shaped robot arm, and can carry the placed substrate P from the external device to the port portion 150A in the exposure device 10A. As described above, the substrate transfer unit 160A transfers the substrate P from the port portion 150A to the substrate holder 28A. The external transfer device 300 can transfer the exposed substrate P transferred from the substrate transfer device 100A to the port portion 150A from the chamber to an external device.

As shown in FIG. 2, the port opening portion 150A includes a beam unit 152, and the beam unit 152 is composed of a plurality of (for example, eight) beams 153 arranged in the Y-axis direction at predetermined intervals. A plurality of minute holes (not shown) for air blowing are formed on the upper surface of each beam 153. The beam unit 152 can supply a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the back surface of the substrate P and the upper surface of the beam unit 152 (air supply) through the hole portion. While keeping the back surface of the substrate P away from the upper surface of the beam unit 152 (making the substrate P float). The intervals in the Y-axis direction of the plurality of beams 153 are set in such a manner that the substrate P can be supported from below by the beam unit 152, and when the robot arm of the external carrying device 300 and the beam unit 152 are arranged at the same height, the machine The plurality of fingers 310 included in the hand may be disposed between the plurality of beams 153 (plugged between the plurality of beams 153).

The length in the longitudinal direction (X-axis direction) of each beam 153 is slightly longer than the length in the longitudinal direction of the substrate P. The length in the width direction (Y-axis direction) is set to the length in the width direction of the substrate P, for example, 1 / About 50 or the thickness of the substrate P is, for example, about 10 to 50 times.

As shown in FIG. 1, a plurality of beams 153 (overlaid in the depth direction of the paper surface in FIG. 1) are located more inward than both ends in the X-axis direction by a plurality of (for example, two) rod-shaped feet 154 from below stand by. The respective lower end portions of the plurality of legs 154 supporting each of the cross beams 153 are connected to the base portion 157 via the joint portions 155a, and the upper end portions are connected to the cross beam 153 via the joint portions 155b. In the substrate transfer apparatus 100A, the position of the X-axis direction and the Z-axis direction of the beam unit 152 can be changed integrally by using a link mechanism composed of the beam 153, the leg 154, the joint portion 155a, the joint portion 155b, and the base portion 157. The link mechanism is configured such that when the beam unit 152 stops at the substrate transfer position with the substrate holder 28A, the upper surface TS of the substrate holder 28A, the upper surface of the offset beam 185a described later, and the upper of the beam unit 152 are stopped. The surfaces are roughly contained in the same plane.

Returning to FIG. 2, the substrate transfer unit 160A includes a fork-shaped hand 161A (hereinafter referred to as a substrate transfer hand 161A) similar to the external transfer device 300 (see FIGS. 1 and 2). The substrate carrying-in hand 161A has a plurality of (for example, seven in the first embodiment) finger portions 162A, and the plurality of finger portions 162A form a holding surface (hereinafter, referred to as a substrate holding surface) that holds the substrate P.

The vicinity of the + X side ends of the plurality of fingers 162A is connected to each other by a connection member 163A. On the other hand, the end portion on the −X side (the substrate holder 28A (see FIG. 2) side) of the plurality of finger portions 162A becomes a free end, and the adjacent finger portions 162A are vacated on the substrate holder 28A side.

As shown in FIG. 1, the substrate holding surface formed by the plurality of fingers 162A is inclined with respect to the holding surface (hereinafter referred to as the holder substrate holding surface) holding the substrate by the substrate holder 28A. That is, the substrate carrying-in hand 161A has a substrate holding surface that is inclined with respect to the holder substrate holding surface of the substrate holder 28A and holds the substrate P (P2). Therefore, the substrate carrying-in hand 161A holds the + X side end portion of the substrate P2 at a higher position (+ Z side) than the −X side end portion of the substrate P2. Regarding the Z position of the substrate carrying-in hand 161A, the −X side end portion of the substrate carrying-in hand 161A is closer to the substrate holder 28A than the + X side end portion. In addition, in the vicinity of the front end portion (-X side) of the plurality of finger portions 162A, the thickness of the finger portion 162A becomes thinner toward the front end portion. In other words, the finger portion 162A has a conical shape at the tip portion and has a conical shape. Since the plurality of finger portions 162A have a conical shape, the −X side end portion of the substrate P2 can be brought closer to the upper surface TS of the substrate holder 28A than when the thickness of the finger portions 162A is uniform. In addition, since the area where the Z position approaches the substrate holder 28A in the substrate carrying hand 161A can be reduced, the risk that the substrate carrying hand 161A comes in contact with the substrate holder 28A can be reduced.

Like the robot hand (see FIG. 2) of the external transfer device 300, each of the fingers 162A included in the substrate carrying-in hand 161A is in the Y-axis direction so as not to overlap with the beam 153 of the beam unit 152 in a plan view. Configuration. In addition, a plurality of support pads 164A for supporting the back surface of the substrate P are attached to each of the finger portions 162A, and the substrate holding surface of the substrate carrying hand 161A is formed by the support pads 164A. The entire surface of the substrate P may not be supported by the support pad 164A. The substrate holding surface is a surface that virtually connects the support surfaces of the support pad 164A.

As shown in FIG. 2, the connecting member 163A is formed by a hollow member having a rectangular shape and a thin thickness in a plan view, and extends in a direction in which a plurality of beams 153 are arranged, that is, in a Y-axis direction. Both ends of the connecting member 163A in the Y-axis direction are connected to a pair of X-axis driving devices 164 for moving the substrate carrying hand 161A in the X-axis direction. Furthermore, the pair of X-axis driving devices 164 may be driven independently, or may be mechanically connected by gears or belts and driven by one driving motor simultaneously. Alternatively, the connecting member 163A may be configured such that it is not limited to a pair in the Y-axis direction and is moved by only one X-axis driving device 164. The pair of X-axis driving devices 164 can be moved up and down by a Z-axis driving device (not shown). Thereby, the substrate carrying-in hand 161A can be moved between a position higher than the upper surface of the beam unit 152 (+ Z side) and a position lower than the beam unit 152 (-Z side).

In addition, the substrate transfer unit 160A includes one or more substrate transfer hands 170A (for example, two in the first embodiment). In the first embodiment, the two substrate carrying-out hands 170A are arranged away from each other in the Y-axis direction.

Each substrate carrying-out hand 170A includes a holding pad 171A. The holding pad 171A can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown).

The substrate carrying-out hand 170A is configured as, for example, a multi-joint robot or a parallel link robot, and the X position, Y position, and Z position of the holding pad 171A can be changed.

(Conveying Device 180A) The conveying device 180A is a device that cooperates with the substrate conveying section 160A when the substrate is replaced. In other words, in the exposure apparatus 10A, the substrate carrying unit 160A and the carrying apparatus 180A are used to carry in and out the substrate P of the substrate holder 28A. In addition, when the substrate P is placed on the substrate holder 28A, the carrying device 180A is also used for positioning the substrate P. The carrying device 180A will be described in detail using FIGS. 3 (a) to 3 (c).

As shown in FIGS. 3 (a) to 3 (c), the transfer device 180A includes a pair of substrate carry-in support devices 182A, a pair of substrate carry-out support devices 183A, and an offset beam portion 185.

As shown in FIG. 3 (b), the substrate carrying-in support device 182A includes a holding pad 184a, an X actuator 186x, and a Z actuator 186z.

The holding pad 184a is a plate-shaped member having a rectangular shape in a plan view, and can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown). In addition, as shown in FIG. 3 (b), the holding pad 184a can be driven in the Z-axis direction by a Z actuator 186z. The holding pad 184a and the Z actuator 186z can be integrally driven in the X-axis direction by the X actuator 186x mounted on the substrate stage 24.

As shown in FIG. 3 (c), the substrate carrying-out support device 183A includes a holding pad 184b, an X actuator 186x, and a Z actuator 186z. As shown in FIG. 3 (c), a part of the holding pad 184b of one (+ Y side) substrate carrying-out support device 183A is inserted into one of the two notches 28b (+ Y side) formed in the substrate holder 28A, for example. Within the notch 28b. In addition, a part of the holding pad 184b of the other (-Y side) substrate carrying-out support device 183A is inserted into the other (-Y side) notch 28b.

The holding pad 184 b is a plate-shaped member having a rectangular shape in a plan view, and can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown).

As shown in FIG. 3 (c), the holding pad 184b can be driven in the Z-axis direction by the Z actuator 186z. The holding pad 184b and the Z actuator 186z can be integrally driven in the X-axis direction by the X actuator 186x mounted on the substrate stage 24. The Z actuator 186z includes a post supporting the holding pad 184b, and the post is disposed outside the substrate holder 28A. The holding pad 184b is driven by the Z actuator 186z in the notch 28b, thereby being able to move between a position that can be held while contacting the lower surface of the substrate P and a position that is distant from the lower surface of the substrate P. In addition, the holding pad 184b can be moved between a position partially accommodated in the notch 28b and a position higher than the upper surface of the substrate holder 28A by the Z actuator 186z. In addition, the holding pad 184b is driven by the X actuator 186x integrally with the Z actuator 186z, thereby being movable in the X-axis direction.

The offset beam portion 185 includes a plurality of offset beams 185 a (for example, eight in the first embodiment) arranged at a predetermined interval in the Y-axis direction. The offset beam 185a is supported by a support member 185b mounted on the substrate stage 24, and is arranged such that the upper surface thereof is substantially included in the same plane as the upper surface TS of the substrate holder 28A. A plurality of minute holes (not shown) for air blowing are formed on the upper surface of the offset beam 185a. The offset beam 185 a supplies pressurized gas (air) supplied from a pressurized gas supply device (not shown) between the upper surface of the offset beam 185 a and the back surface of the substrate P (air supply) through the hole portion. Thereby, the back surface of the substrate P can be separated from the upper surface of the offset beam 185 a (the substrate P floats up).

The operation of the carrying device 180A will be described in detail below.

The configurations of the substrate carrying-in support device 182A and the substrate carrying-out support device 183A can be appropriately changed. For example, in this embodiment, each of the supporting devices 182A and 183A is mounted on the substrate table 24, but it is not limited to this. For example, it may be mounted on the substrate holder 28A or used to place the substrate table 24 on the XY plane. Internally driven XY stage device (not shown). In addition, the position and number of each of the supporting devices 182A and 183A are not limited to this, and may be mounted on the + Y side and the -Y side surface of the substrate stage 24, for example.

In the exposure apparatus 10A (refer to FIG. 1) configured as described above, the mask M on the mask platform 14 is managed by a mask loader (not shown) under the management of a main control device (not shown). The substrate is loaded and loaded into the substrate P on the substrate holder 28A by the substrate transfer device 100A. Then, the main control device performs an alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, a plurality of shot areas set on the substrate P are sequentially scanned in a stepwise scanning manner. Exposure action. This exposure operation is the same as the exposure operation of the step-and-scan method performed previously. Therefore, the X direction is set as the scanning direction. It should be noted that a detailed description of the exposure operation in the step-and-scan method is omitted. Subsequently, the substrate P (P1) whose exposure processing has been completed is carried out from the substrate holder 28A by the substrate carrying device 100A, and the other substrate P (P2) to be exposed is carried into the substrate holder 28A, thereby carrying out substrate holding. A series of exposure operations are performed on a plurality of substrates P by replacing the substrates P on the processor 28A.

(Substrate Replacement Operation) Hereinafter, the replacement operation of the substrate P on the substrate holder 28A of the exposure apparatus 10A will be described using FIGS. 4 (a) to 8 (c). The following substrate replacement operation is controlled by a main control device (not shown). In addition, in each of the side views of FIGS. 4 (a) to 8 (c) for explaining the substrate replacement operation, in order to easily understand the operation of the substrate carrying section 160A, illustrations of the X-axis driving device 164 and the like are appropriately omitted. .

In the following description, the exposed substrate P1 is placed on the substrate holder 28A of the platform device 20A, the exposed substrate P1 is carried out, and a substrate P2 different from the substrate P1 is placed on the substrate holder. The 28A loading operation will be described. In addition, in each of the drawings of FIGS. 4 (a) to 8 (c), for easy understanding, the operation directions of the constituent elements are schematically indicated by blank arrows. In addition, a group of black arrows schematically indicates a state of sucking gas or supplying gas (supply gas).

As shown in FIGS. 4 (a) and 4 (b), before the substrate P2 is transferred to the port portion 150A by the external transfer device 300, the upper surface of the substrate carrying hand 161A and the substrate carrying hand 161A are located on the beam unit 152. Move down the way. At this time, the port part 150A rotates and drives the leg 154 in the θy direction. Thereby, the board | substrate carrying-in hand 161A is arrange | positioned below the beam unit 152 in the Z direction, and the robot hand of the external carrying apparatus 300 can be arrange | positioned between the beam unit 152 and the board | substrate carrying-in hand 161A.

It should be noted that this position of the port portion 150A is a position where the substrate is transferred to the external transfer device 300.

The robot of the external transfer apparatus 300 holding the substrate P2 moves in the -X direction so that the substrate P2 is located above the beam unit 152 (+ Z side). At this time, the fingers of the fork-shaped robot hand included in the external conveying device 300 are located in the gap between the beam units 152 adjacent to each other in the Y-axis direction in a plan view. The Y position of the beam unit 152 is positioned.

Then, as shown in FIG. 4 (c), the robot of the external conveying device 300 is driven downward, and each finger of the robot hand passes through the gaps between the multiple beams of the beam unit 152, whereby the external conveying device 300 lifts the substrate P2 Transfer to beam unit 152. The Z position of the robot of the external transfer device 300 is controlled so as not to come into contact with the substrate transfer portion 160A waiting below the beam unit 152. Then, the robot hand of the external carrying device 300 is driven in the + X direction, thereby withdrawing from the exposure device 10A.

The substrate transfer unit 160A moves upward (moves in the + Z direction), so that the holding pad 171A of the substrate carrying hand 170A sucks and holds the lower surface of the substrate P2 on the beam unit 152. Then, as shown in FIG. 5 (a), pressurized gas is supplied to each of the plurality of beams 153 included in the beam unit 152 of the port portion 150A, and the pressurized gas flows from the upper surfaces of the plurality of beams 153 to the substrate P2 Air supply (spout) from the lower surface. Thereby, the substrate P2 is sucked and supported on the substrate conveyance portion 160A, and the substrate P2 floats up with a small (for example, several tens of micrometers to several hundreds of micrometers) gap with respect to the beam unit 152. In addition, the foot 154 of the port opening portion 150A is rotationally driven in the θy direction to move the beam unit 152 in the -X direction and the -Z direction.

The holding pad 171A holding the lower surface of the substrate P2 out of the hand is held in the holding pad 171A of the hand 170A, and is appropriately driven in the X-axis, Y-axis, and θz directions (three degrees of freedom in the horizontal plane). Adjust (align) the position of the substrate carrying-in hand 161A. The substrate P2 is supported by the beam unit 152 in a non-contact manner. Therefore, the position of the substrate P2 in a three-degree-of-freedom direction (a small amount of movement) can be adjusted in a low-friction state. In addition, the position adjustment (alignment) of the substrate P2 described herein can be omitted, and can also be controlled in a manner implemented as needed.

Then, the substrate transfer unit 160A is driven upward in the + Z direction to a position shown in FIG. 5 (b). Thereby, the substrate P2 on the beam unit 152 is transferred to the substrate carrying-in hand 161A. In other words, the substrate P2 on the beam unit 152 is picked up from below by the substrate carrying-in hand 161A.

The foot 154 is further rotated and driven in the θy direction, and the beam unit 152 is further driven in the -X direction, and is moved to the substrate transfer position for transferring the substrate P1 from the substrate holder 28A to the substrate holder 28A (FIG. 5 (C).

In addition, at the same time as the transfer operation (including an alignment operation as appropriate) of the substrate P2 via the port portion 150A from the external carrying device 300 to the substrate carrying hand 161A, the exposed device is placed in the platform device 20A. The substrate holder 28A of the substrate P1 is disposed at a predetermined substrate replacement position (a substrate transfer position with the port portion 150A), and moves the substrate stage 24 in the + X direction. In the first embodiment, the substrate replacement position of the substrate holder 28A is a position on the -X side with respect to the port portion 150A. For easy understanding, the substrate holder 28A is shown at the same position in FIGS. 4 (a) to 5 (b). However, during normal operation of the exposure device 10A, it is transported from the outside to the substrate P2. The handover operation of the device 161A into the substrate carrying hand 161A simultaneously performs the exposure operation on the substrate P1. At this time, the substrate holder 28A is appropriately moved in the X direction and the Y direction.

In addition, at the same time as the movement of the substrate holder 28A to the substrate replacement position, the pair of substrates are lifted out of the holding pads 184b of the holding device 183A. The holding pad 184b sucks and holds a portion of the substrate P1 (which is disposed in the notch 28b (see portions in FIGS. 3 (a) and 3 (c))) held on the upper surface of the substrate holder 28A by vacuum adsorption from the back surface.

Then, as shown in FIG. 5 (c), the substrate carrying-in hand 161A supporting the substrate P2 is moved in the −X direction. Thereby, the board | substrate carrying-in hand 161A moves to the space above the board | substrate holder 28A positioned in the board | substrate replacement position. On the other hand, the Z position of the upper surface of the beam unit 152 and the Z position of the upper surface of the substrate holder 28A are set to approximately the same height. When these are set to approximately the same height, the substrate holder 28A may be driven in the Z-axis direction to adjust the height.

In the offset beam portion 185, pressurized gas is ejected from the upper surface of the offset beam 185a.

In the stage device 20A, pressurized gas is supplied (ejected) from the upper surface of the substrate holder 28A to the lower surface of the substrate P1. Thereby, the substrate P1 floats from the upper surface TS of the substrate holder 28A, and the friction between the lower surface of the substrate P1 and the upper surface TS of the substrate holder 28A becomes a low friction state.

Furthermore, in the platform device 20A, the holding pad 184b of the substrate carrying-out support device 183A is slightly driven upward in the + Z direction to follow the upward movement of the substrate P1, and is in a state of holding a part of the substrate P1. Down, move in the + X direction (port 150A side) with a predetermined stroke. The movement amount of the holding pad 184b (that is, the substrate P1) is set to, for example, about 50 mm to 100 mm. Thereby, the + X side end portion of the substrate P1 is supported by the offset beam 185a in a non-contact manner, and the position of the substrate P1 is shifted from the substrate holder 28A to the + X direction side by a predetermined amount in the X direction.

Further, in the stage device 20A, the holding pad 184a of the pair of substrates carried into the receiving device 182A is moved in the + X direction with a predetermined stroke.

As shown in FIG. 6 (a), the substrate carrying-in hand 161A supporting the substrate P2 is arranged at a predetermined position above the substrate holder 28A. Thereby, the substrate P2 is positioned substantially directly above the substrate holder 28A positioned at the substrate replacement position. At this time, the substrate carrying-in hand 161A and the substrate holder 28A are positioned so that the Y position of the substrate P1 and the Y position of the substrate P2 substantially match. In contrast, the substrate P1 and the substrate P2 are arranged at different positions in the X direction. Specifically, because the substrate P1 is shifted from the substrate holder 28A to the + X side as described above, the X positions of the substrates P1 and P2 are relatively different, and the end portion of the -X side of the substrate P2 is disposed more than the substrate P1. The -X side end is closer to the -X side (protruding). Moreover, at this time, the substrate P2 on the substrate carrying-in hand 161A can be held by the substrate carrying-out hand 170A by suction, and can also be held by the fingers 162A or held by friction. Furthermore, the notch 28b may not be formed in the substrate holder 28A. As described above, when the lengths of the long and short sides of the upper surface of the substrate holder 28A are set to be slightly shorter than the lengths of the long and short sides of the substrate P, as long as the holding pad 184b can be used. The substrate P is extended from the substrate holder 28A to the + X axis while the substrate P is shifted from the upper surface TS of the substrate holder 28A to the + X side, but it may not be formed on the substrate holder 28A. Notch 28b. In this case, plane correction on the substrate holder 28A can also be performed on the end of the substrate P.

Thereafter, as shown in FIG. 6 (b), the substrate carrying-in hand 161A is driven in the -Z direction to a position where it does not contact the substrate holder 28A. The substrate carrying-in hand 161A brought the -X side end portion of the substrate P2 (a part of the substrate P2) into contact with the holding pad 184a of the substrate carrying-in support device 182A. Then, the holding pad 184a sucks and holds a part of the substrate P2 on the hand 161A from the bottom. The position of the holding pad 184a in the Z-axis direction is a position between the upper surface of the substrate holder 28A and the substrate holding surface of the substrate carrying-in hand 161A, and holds and holds a part of the substrate P2. When the holding pad 184a sucks and holds the substrate P2, the X position and the Y position of the substrate P2 are restricted. This prevents the substrate P2 from moving outside the substrate carrying-in hand 161A. The substrate carrying-in support device 182A holds the narrow area of the -X side end portion of the substrate P2. More specifically, it is an area to the extent that the entire substrate P2 cannot be supported when only the substrate is carried into the receiving device 182A. Furthermore, the X-direction dimension of the finger of the substrate-carrying hand 161A is described as being shorter than the X-direction dimension of the substrate P2, but it may be the same size or the X-direction of the finger of the substrate-carrying hand 161A. Long size. In this case, the holding pad 184a only needs to hold the substrate into the region between the finger and the finger of the hand 161A.

In addition, at the same time as the holding and holding operation of the substrate P2 by the holding pad 184a, the substrate carrying-out hand 170A that has released the holding of the substrate P2 is driven, and the portion of the holding substrate P1 that is offset from the substrate holder 28A to the + X side is driven lower surface. In addition, the beam unit 152 ejects a pressurized gas.

Then, as shown in FIG. 6 (c), in a state where the holding pad 184a of the substrate carrying-in support device 182A sucks and holds a part of the substrate P2 (-X side end portion), the substrate carrying portion 160A is moved in the carrying-out direction (+ X Direction). In addition, at this time, it is only necessary to supply (spray) pressurized gas to the lower surface of the substrate P2 from the finger 162A of the substrate carrying-in hand 161A to reduce contact friction.

The substrate carrying unit 160A is driven in the carrying-out direction (+ X direction), and the substrate carrying hand 170A holding the substrate P1 is driven in the + X direction. Thereby, the substrate P1 moves from the substrate holder 28A to the port opening portion 150A (the beam unit 152). At this time, since pressurized gas is sprayed from the upper surface of each of the beams 153 included in the beam unit 152, the substrate P1 is not in contact with the substrate holder 28A and the port opening portion 150A (the floating state) from the substrate. The holder 28A is carried out. In addition, each of the holding pads 184b of the pair of substrate carrying-out supporting devices 183A is partially accommodated in the notches 28b (see FIGS. 3 (a) and 3 (c)) of the substrate holder 28A in the -Z direction and- The X direction is driven.

In addition, as shown in FIGS. 6 (c) and 7 (a) to 7 (c), the substrate carrying-in hand 161A is moved in the + X direction, so that the substrate carrying-in hand 161A is held by a part of the holding pad 184 a with respect to the part The substrate P2 is relatively moved in the X direction. Then, as shown in FIG. 7 (c), the substrate carrying-in hand 161A is moved in the X direction to the + X side than the substrate holder 28A, thereby moving the substrate carrying-in hand 161A from above the substrate holder 28A (+ Z Space on the side) and below the substrate P2 (space on the -Z side). In other words, the substrate carrying-in hand 161A is moved closer to the + X side than the substrate holder 28A, thereby retreating from a space between the substrate P2 and the substrate holder 28A held by the holding pad 184a. When the substrate carrying-in hand 161A moves closer to the + X side than the substrate holder 28A, it moves above the substrate holder 28A, that is, the position of the Z position is higher than the upper surface of the substrate holder 28A. In this way, the substrate carrying hand 161A is retracted from the space between the substrate P2 and the substrate holder 28A, and the substrate P2 is transferred from the substrate carrying hand 161A to the substrate holder 28A. That is, the substrate P2 is carried in from the substrate carrying-in hand 161A to the substrate holder 28A. In the substrate P2, a region between the substrate carrying-in hand 161A and the holding pad 184a is held by the substrate holder 28A.

Here, the holding pad 184a sucks and holds a part of the substrate P2, and thereby fixes the relative position of the substrate P2 with respect to the substrate holder 28A in the X direction and the Y direction, or is limited to a predetermined minute movable range. The predetermined movable range is set by the driving range of the holding pad 184 a with respect to the substrate holder 28A (or the substrate table 24). Furthermore, as long as the holding pad 184 a has a function of setting the relative position (relative movable range) of the substrate P2 with respect to the substrate holder 28A in at least one of the X direction and the Y direction, it may not necessarily be provided on the substrate table 24. (Or the substrate holder 28A) may be a structure provided in a structure such as a column (not shown) of the exposure apparatus 10A and suspended from the substrate holder 28A. Moreover, in this case, the holding pad 184a can also hold the upper surface of the substrate P2.

As described above, the substrate carrying-in hand 161A relatively moves in the + X direction with respect to the substrate holder 28A, that is, in the direction along the substrate holding surface of the substrate holder 28A and in a direction parallel to the substrate holding surface of the substrate holder 28A. Withdrawing from the lower side of the substrate P2 by this, a part of the substrate P2 is gradually placed on the substrate holder 28A in this order from the -X side. At this time, the area of the substrate P2 held by the substrate carrying-in hand 161A decreases, and the area of the substrate P2 supported by the holder substrate holding surface of the substrate holder 28A increases. Thereby, the period from the front end portion of the -X side of the substrate carrying-in hand 161A to the + X side more than the substrate holder 28A (ie, the space between the substrate carrying-in hand 161A from the substrate holder 28A and the substrate P2). During at least a part of the period until the complete retreat), the substrate carrying-in hand 161A, the substrate holder 28A, and the holding pad 184a simultaneously support (or hold) mutually different portions of the substrate P2. In other words, during the at least part of the period, substantially the entire surface of the substrate P2 is supported by the substrate carrying hand 161A, the substrate holder 28A, and the holding pad 184a (by the substrate carrying hand 161A, the substrate holder 28A, and the holding pad 184a) Supports any part of the substrate P2). In addition, the support (or holding) of the substrate carrying hand 161A and the substrate holder 28A for the substrate P2 is not limited to a contact state, and may also be a support (or holding) in a non-contact state with a gas barrier (air gap).

In addition, during the period in which the front end portion of the -X side of the substrate carrying hand 161A moves to the + X side from the substrate holder 28A as described above, the Z-axis direction of the portion of the substrate P2 supported by the substrate carrying hand 161A The position (Z position) (in the direction perpendicular to the holder substrate holding surface of the substrate holder 28A) is higher than the Z position of the portion of the substrate P2 held by the holding pad 184a. In addition, as the substrate carrying-in hand 161A retracted from the space between the substrate P2 and the substrate holder 28A in the + X direction as described above, the position in the Z-axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A. (Z position) gradually decreases. Furthermore, when the flexibility of the substrate P2 is low (has rigidity and is difficult to flex), as the substrate is moved into the hand 161A, the portion held by the substrate P2 via the holding pad 184a is used as the axis in the θy direction. The drawing circular motion landed on the substrate holder 28A, but in this case, the Z position of the portion of the substrate P2 supported by the substrate carrying-in hand 161A also gradually decreased. Furthermore, the position (X position) in the X-axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A gradually moves in the + X direction.

In addition, as the substrate carrying-in hand 161A retreats from below the substrate P2 as described above, when the substrate P2 is gradually placed on the substrate holder 28A from the -X side, a position measuring device (not shown) is used. The position of the substrate P2 with respect to the substrate holder 28A is measured. Based on the measurement results, the holding pads 184 a of each of the pair of substrates carried into the holder 182A are driven in at least one of the X-axis direction and the Y-axis direction. Thereby, the position of the substrate P2 with respect to the X-axis direction position, the Y-axis direction position, and the θz direction of the substrate holder 28A is adjusted. When the rotation adjustment in the θz direction is performed, the holding pads 184 a may be driven only by different amounts from each other. The position measurement device (not shown) may be disposed on at least one of a structure such as a cylinder (not shown) included in the platform device 20A (for example, the substrate holder 28A and the substrate stage 24) or the exposure device 10A.

As shown in FIG. 8 (a), the substrate P2 handed over from the substrate carrying-in hand 161A to the substrate holder 28A is placed on the substrate holder 28A, except for the portion held by the holding pad 184a. Furthermore, the holding pad 184a may be driven in the Z-axis direction to assist the operation of transferring the substrate P2 to the substrate holder 28A. At this time, the supply (exhaust) of the pressurized gas from the substrate holder 28A becomes air resistance, which can prevent the substrate P2 from directly hitting the substrate holder 28A, and thus can prevent the substrate P2 from being damaged. In addition, even if the supply (spraying) of the pressurized gas from the substrate holder 28A is not performed, the air between the upper surface of the substrate holder 28A and the substrate P2 becomes air resistance, and the above-mentioned effect can be obtained. Then, the supply of the pressurized gas from the substrate holder 28A is stopped (ejecting), whereby the substrate P2 is landed on the upper surface TS of the substrate holder 28A and comes into contact with the upper surface TS. Thereby, the position of the substrate P2 with respect to the X-axis direction position, the Y-axis direction position, and the θz direction of the substrate holder 28A does not change.

In addition, the beam unit 152 stops ejecting the pressurized gas to the substrate P1. The substrate carrying-out hand 170A releases the holding of the substrate P1.

After the substrate carrying-out hand 170A releases the grip of the substrate P1, the substrate carrying section 160A is raised and driven. The beam unit 152 on which the substrate P1 is placed moves to a substrate transfer position with the external transfer device 300.

As shown in FIG. 8 (b), when the substrate P2 is placed on the substrate holder 28A, the holding pad 184 a releases the suction grip of the substrate P2 and moves in the −X direction so as to retract from the lower side of the substrate P2. Thereby, the portion of the substrate P2 held by the holding pad 184a is placed on the upper surface of the substrate holder 28A.

The robot of the external carrying device 300 is driven in the -X direction at a lower Z position than the beam unit 152 and is arranged below the beam unit 152.

Then, as shown in FIG. 8 (c), the stage device 20A moves to a predetermined exposure start position in a state where the substrate P2 is sucked and held by the substrate holder 28A. The operation of the stage device 20A during the exposure operation on the substrate P2 will not be described.

On the other hand, the robot of the external transfer device 300 moves up and picks up the substrate P1 on the beam unit 152 from below. The robot hand of the external transfer device 300 holding the exposed substrate P1 moves in the + X direction, and exits from the exposure device 10A.

Then, at the port portion 150A, in order to avoid contact with the substrate carrying-in hand 161A, the beam unit 152 is moved in the -X direction, and the substrate carrying-in hand 161A is moved in the + X direction.

After handing over the exposed substrate P1 to an external device (not shown) such as a coater / developer, the robot of the external transfer device 300 holds a predetermined substrate P3 to be exposed after the substrate P2 and forwards it to the port. The part 150A moves.

Then, as illustrated in FIG. 4 (a), before the new substrate P3 is transported to the port portion 150A by the external conveying device 300, the upper surface of the substrate carrying-in hand 161A is located closer to the lower surface of the beam unit 152 In the downward mode, the substrate transfer unit 160A is moved downward (moved in the -Z direction). As described above, by repeatedly performing the operations shown in FIGS. 4 (a) to 8 (c), it is possible to continuously perform an exposure operation or the like on a plurality of substrates P.

As described above in detail, the substrate P2 is changed from the state held by the substrate carrying-in hand 161A to the state held by the substrate carrying-in hand 161A and the holding pad 184a. Then, as the substrate carrying-in hand 161A moves relative to the substrate holder 28A, the substrate P2 is held by the substrate carrying-in hand 161A, the substrate carrying-in support device 182A, and the substrate holder 28A. Then, as shown in FIG. 7 (c), if the substrate carrying-in hand 161A moves to a position where the X-axis position of the substrate carrying-in hand 161A does not overlap with the substrate holder 28A, the substrate P2 is carried by the substrate carrying-in support device 182A and the substrate holding The holder 28A is held, and is finally supported only by the substrate holder 28A. The substrate P2 is carried into the substrate holder 28A in a state held by any of the substrate carrying hand 161A, the substrate holder 28A, and the holding pad 184a.

As described in detail above, at least a part of the operation of carrying out the substrate P1 from the substrate holder 28A and the operation of carrying the substrate P2 into the substrate holder 28A can be performed at the same time, so that the substrate replacement time of the substrate holder 28A can be shortened. In addition, when the substrate P2 is carried into the substrate holder 28A, the substrate carrying hand 161A moves above the substrate holder 28A (the space on the + Z side), so there is no interference on its moving path, and the substrate can be quickly driven into the hand. 161A. Thereby, since the operation of carrying in the substrate P2 into the substrate holder 28A can be performed quickly, the substrate replacement time can be shortened. In addition, by moving the substrate carrying hand 161A above the substrate holder 28A to the + X side, the substrate P1 can be carried out from the substrate holder 28A, and the substrate P2 can be carried facing the substrate holder 28A. That is, a common driving system is used when the substrate is carried in and when the substrate is carried out. Therefore, it is not necessary to provide separate driving systems when the substrate is carried in and when the substrate is carried out, and the number of driving systems can be reduced.

As described in detail above, according to the first embodiment, the substrate transfer device 100A that transfers the substrate P2 to the substrate holder 28A includes the substrate transfer hand 161A, which holds the substrate P2 above the substrate holder 28A, and the substrate transfer device. 182A, which holds a part of the substrate P2 held by the substrate carrying hand 161A; and X-axis driving device 164, which allows the substrate carrying hand 161A to retract from above the substrate holder 28A, and carries the substrate holder 28A and the substrate carrying support device One of the 182A and the substrate carrying-in hand 161A is relatively moved relative to the other; and the substrate holder 28A, the substrate carrying-in hand 161A, and the substrate carrying-in support device 182A hold the substrate during the relative movement by the X-axis driving device 164 P2. As a result, the substrate P2 is sequentially placed on the substrate holder 28A from the end of the -X side (the side opposite to the port opening portion 150A), so it is not easy to damage the substrate holder 28A or the substrate P2, and it is caused by contact. Dust reduction. In addition, it is difficult for air to accumulate between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, it is possible to prevent the substrate P2 from moving on the substrate holder 28A. Furthermore, it is possible to control the placement of the substrate holder 28A of the substrate P2 (for example, to stop the placement halfway) in accordance with the retreat status (speed, position) of the substrate carrying hand 161A. Therefore, it is not necessary to eject the pressurized gas to the substrate P2 from the substrate carrying hand 161A to reduce friction. In addition, a mechanism for driving the substrate into the receiving device 182A up and down can be omitted.

In addition, according to the first embodiment, the substrate transfer device 100A that transfers the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes a substrate carrying hand 161A provided above the holder substrate holding surface and holding the substrate P2. A portion of the substrate P2 having a shorter distance from the holder substrate holding surface than the other portion of the substrate P2 from the holder substrate holding surface; the substrate carrying-in holding device 182A holds the substrate P2 held by the substrate carrying hand 161A. Other parts; and the X-axis drive device 164, so that the substrate holding hand 161A withdraws from above the substrate holder 28A, the substrate holder 28A and the substrate holding support device 182A and the substrate holding hand 161A are held along the holder substrate The directions of the faces move relative. As a result, the substrate P2 can be gradually placed on the substrate holder 28A in order from the end of the -X side (the side opposite to the port opening portion 150A), so it is not easy to damage the substrate holder 28A or the substrate P2, and contact The resulting dust is reduced. In addition, it is difficult for air to accumulate between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, it is possible to prevent the substrate P2 from moving on the substrate holder 28A. Furthermore, it is possible to control the placement of the substrate holder 28A of the substrate P2 (for example, to stop the placement halfway) in accordance with the retreat status (speed, position) of the substrate carrying hand 161A. Therefore, it is not necessary to eject the pressurized gas to the substrate P2 from the substrate carrying hand 161A to reduce friction. In addition, a mechanism for moving the substrate into the receiving device 182A up and down can be omitted.

In addition, according to the first embodiment, the substrate transfer device 100A that transfers the substrate P2 to the holder substrate holding surface of the substrate holder 28A that can hold the substrate P2 includes a substrate carrying hand 161A, which is held above the substrate holder 28A. The substrate holding surface of the substrate P2; the substrate carrying-in support device 182A holds a part of the substrate P2 held by the substrate carrying-in hand 161A in a position between the substrate holding surface and the substrate holding surface of the holder in the up-down direction; and the X axis The driving device 164 moves the substrate holder 28A and the substrate holding device 182A and the substrate in a state in which the substrate holding hand 161A is retracted from above the substrate holder 28A while the substrate holding device 182A holds a part of the substrate P2. The carry-in hand 161A moves relatively. As a result, the substrate P2 can be gradually placed on the substrate holder 28A in order from the end of the -X side (the side opposite to the port opening portion 150A), so it is not easy to damage the substrate holder 28A or the substrate P2, and contact The resulting dust is reduced. In addition, it is difficult for air to accumulate between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, it is possible to prevent the substrate P2 from moving on the substrate holder 28A. Furthermore, it is possible to control the placement of the substrate holder 28A of the substrate P2 (for example, to stop the placement halfway) in accordance with the retreat status (speed, position) of the substrate carrying hand 161A. Therefore, it is not necessary to eject the pressurized gas from the substrate carrying-in hand 161A to the substrate P2 to reduce friction. In addition, a mechanism for moving the substrate into the receiving device 182A up and down can be omitted.

In addition, according to the first embodiment, the substrate transfer device 100A that transfers the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes a substrate transfer hand 161A that holds the substrate P2 above the substrate holder 28A; and the substrate transfer The holding device 182A holds a part of the substrate P2 held by the substrate carrying hand 161A; and the X-axis driving device 164 moves the substrate holding hand 28A and the substrate into the substrate holding hand 161A withdrawing from above the substrate holder 28A. The supporting device 182A and the substrate carrying-in hand 161A are relatively moved in a predetermined direction along the holder substrate holding surface; and the substrate carrying-in hand 161A is carried in the relative movement by the X-axis driving device 164 through the substrate P2 through the substrate carrying hand The position in the vertical direction of the region held by 161A holds the substrate P2 so as to be close to the substrate holder 28A. As a result, the substrate P2 can be gradually placed on the substrate holder 28A in order from the end of the -X side (the side opposite to the port opening portion 150A), so it is not easy to damage the substrate holder 28A or the substrate P2, and contact The resulting dust is reduced. In addition, it is difficult for air to accumulate between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, it is possible to prevent the substrate P2 from moving on the substrate holder 28A. Furthermore, it is possible to control the placement of the substrate holder 28A of the substrate P2 (for example, to stop the placement halfway) in accordance with the retreat status (speed, position) of the substrate carrying hand 161A. Therefore, it is not necessary to eject the pressurized gas from the substrate carrying-in hand 161A to the substrate P2 to reduce friction. In addition, a mechanism for moving the substrate into the receiving device 182A up and down can be omitted.

In the first embodiment, the substrate holding surface of the substrate carrying-in hand 161A is provided obliquely with respect to the holder substrate holding surface. Thereby, when the substrate carrying-in hand 161A is retracted from the substrate P2 and the substrate holder 28A, the substrate carrying-in hand 161A is away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2). ) On the back, so contact wear can be reduced.

In the first embodiment, the X-axis driving device 164 holds one of the substrate holder 28A and the substrate carry-in support device 182A and the substrate carry-in hand 161A toward the other along the substrate holder 28A. The direction of the holding surface of the substrate P2 is relatively moved. Thereby, the substrate carrying-in hand 161A retreats in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), so that contact wear can be reduced.

In the first embodiment, the X-axis driving device 164 moves the substrate carrying-in hand 161A in a direction parallel to the holder substrate holding surface of the substrate holder 28A. Thereby, the substrate carrying-in hand 161A retreats in a direction away from the lower surface of the inclined substrate P2 (a horizontal direction different from the wiring direction of the lower surface of the substrate P2), so that contact wear can be reduced.

(First Modification) The first modification is an example in which the configuration of the substrate transfer device is changed. Specifically, the substrate transfer apparatus 100B of the exposure apparatus 10B of the first modification includes a drive system that switches the state where the upper surface of the substrate carrying hand 161A is parallel to the substrate holding surface of the substrate holder 28A and the substrate The upper surface of the carry-in hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A.

A replacement operation of the substrate P on the substrate holder 28A using the substrate transfer apparatus 100B of the first modification will be described with reference to FIGS. 9 (a) to 9 (c).

In addition, the state of FIG. 9 (a) shows a state in which the stage device 20A is disposed at a position where the platform device 20A is transferred to the substrate of the port portion 150A after FIG. 5 (a) of the first embodiment.

As shown in FIG. 9 (a), a substrate P2 is placed on the substrate carrying-in hand 161A. At this time, the upper surface of the substrate carrying-in hand 161A is in a state parallel to the holder substrate holding surface of the substrate holder 28A.

Then, as shown in FIG. 9 (b), in a state where the upper surface of the holding substrate carrying hand 161A is substantially parallel to the holding substrate holding surface of the substrate holder 28A, the substrate holding hand P161 from below is carried into the hand 161A toward − X direction drive. The operations of the platform device 20A, the substrate carry-in support device 182A, the substrate carry-out support device 183A, and the offset beam 185a are the same as the operations described in FIG. 5 (c), and therefore description thereof will be omitted.

Then, the board | substrate 161A in which the board | substrate P2 which supports the board | substrate from below is carried is arrange | positioned at the predetermined position above the board | substrate holder 28A.

Next, as shown in FIG. 9 (c), the substrate is moved upward while being driven by the hand 161A, and the front end is driven so as to be inclined downward. That is, the substrate carrying-in hand 161A is driven so that the upper surface of the substrate carrying-in hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A. Thereby, the tip of the substrate P2 is brought into contact with the holding pad 184a of the substrate carrying-in support device 182A. The holding pad 184a sucks and holds the vicinity of the -X side end portion of the substrate P2. Furthermore, the substrate carrying-in hand 161A can be set as follows: Even if the front end of the substrate carrying hand is tilted downward, it is held at the Z position without the front end contacting the upper surface of the substrate holder 28A. The holder substrate 28A is moved in the -X direction while the holder substrate holding surfaces are parallel.

Subsequent operations are basically the same as those of the first embodiment, and therefore description thereof is omitted.

According to the first modification, when the port opening portion 150A and the substrate P2 of the substrate carrying hand 161A are handed over, the substrate P2 can be placed therefrom in a state where the substrate mounting surface of the port opening portion 150A is parallel to the upper surface of the substrate carrying hand 161A. Since one is handed over to the other, the possibility of breakage of the substrate P2 during the handover of the substrate can be reduced.

In addition, when the substrate carrying hand 161A supporting the substrate P2 from below is moved in the -X direction, the distance in the Z direction between the port opening portion 150A and the substrate holder 28A and the substrate carrying hand 161A can be extended. As a result, when the substrate carrying-in hand 161A is moved in the -X direction, the risk of the port opening portion 150A and / or the substrate holder 28A coming into contact with the substrate carrying-in hand 161A is reduced.

In addition, the inclination angle between the upper surface of the substrate carrying hand 161A and the substrate holding surface of the holder 28A of the substrate holder 28A may be gradually changed, while the substrate carrying hand 161A is relatively moved in the + X direction relative to the substrate holder 28A.

As in the first modification, the substrate holding hand 161A may be inclined, and the substrate holding surface of the substrate holding hand 161A may be inclined with respect to the holder substrate holding surface of the substrate holder 28A.

(Second Modification) The second modification is an example in which the shape of a finger of a board carrying hand is changed. FIG. 10 (a) is a perspective view of a substrate carrying-in hand 161C according to a second modification, and FIG. 10 (b) is a side view of a substrate carrying-in hand 161C according to a second modification.

As shown in FIGS. 10 (a) and 10 (b), in the substrate 161C of the second modified example, the finger portion 162C has an XZ with a thicker end portion on the + X side and a thinner XZ as it gets closer to the -X side end portion. Sectional triangle shape.

The operation of replacing the substrate on the substrate holder 28A is the same as that of the first embodiment, and therefore description thereof will be omitted.

As in the second modification, the shape of the fingers of the substrate carried into the hand may be an XZ cross-sectional triangular shape that is thicker at the + X side end portion and thinner toward the -X side end portion. Thereby, by increasing the rigidity of the fingers of the substrate carrying-in hand, it is possible to reduce the risk that the substrate carrying-in hand 161C shakes when the substrate carrying-in hand 161C is moved and that the substrate carrying-in hand 161C contacts the substrate holder 28A due to the shaking. In addition, the driving mechanism that tilts the substrate carrying-in hand 161A with respect to the substrate holder 28A as in the first modification (see FIG. 9 (c)) may be omitted.

(Third Modification) In the first embodiment, after the substrate carrying hand is moved to a predetermined position above the substrate holder 28A, the substrate is moved downward to move the tip of the substrate P2 and the holding pad 184a of the substrate holding device 182A. contact. In the third modification, the substrate carrying-out hand 170A is used to bring the tip of the substrate P2 into contact with the holding pad 184a of the substrate carrying-in support device 182A.

A replacement operation of the substrate P on the substrate holder 28A using the substrate transfer device 100D of the third modification will be described with reference to FIGS. 11 (a) and 11 (b). 11 (a) corresponds to the state of FIG. 6 (a) of the first embodiment, and FIG. 11 (b) corresponds to the state of FIG. 6 (b) of the first embodiment.

As shown in FIGS. 11 (a) and 11 (b), in the substrate transfer apparatus 100D of the third modification, the substrate transfer unit 160D includes a substrate transfer hand 161C and a substrate transfer hand 170A of the second modification.

As shown in FIG. 11 (a), in the third modification, the substrate transfer position of the substrate transfer hand 161C and the platform device 20A becomes closer to the + X side than the substrate transfer position of the substrate transfer hand 161A of FIG. 6 (a). position.

When the substrate carrying-in hand 161C reaches the substrate transfer position, as shown in FIG. 11 (b), the substrate carrying-out hand 170A holding the lower surface of the substrate P2 is driven to extend the arm. Thereby, the board | substrate P2 slides down along the board | substrate carrying-in hand 161C, and the front-end | tip of the board | substrate P2 comes into contact with the holding pad 184a of the board | substrate carrying-in receiving apparatus 182A.

Moreover, at this time, in order to make the substrate move smoothly, the support pad 164D mounted on the upper surface of the finger portion 162C of the substrate carrying-in hand 161C is preferably a rod shape extending in the extending direction of the finger portion 162C. In addition, when the substrate P2 is slid, a pressurized gas may be ejected from the support pad 164D.

The substrate transfer unit 160D may include a plurality of substrate carrying hands 170A. The front end of the substrate P2 may be brought into contact with the holding pad 184a by a part of the plurality of substrate carrying-out hands 170A, and the exposed substrate P1 on the substrate holder 28A may be held by the remaining substrate carrying-out hands 170A. Therefore, if the front end of the substrate P2 is held on the holding pad 184a and the exposed substrate P1 is held by the remaining substrate carrying hand 170A, the substrate carrying hand 161C can be moved in the + X direction, and the substrate carrying operation and the substrate can be performed at the same time. Move out action.

According to the third modified example, since the entire substrate carrying section 160D is not moved, and only the substrate P2 is lowered by the substrate carrying-out hand 170A, positioning can be performed more easily and accurately than when moving the entire substrate carrying section 160D. In addition, the stroke in the X-axis direction of the substrate transfer section 160D can be shortened. In addition, the substrate P2 is deflected by the action of gravity. Therefore, even if the X-axis movement distance of the substrate carrying hand 161C is shorter than the horizontal movement component of the substrate P2 caused by the gradient of the substrate carrying hand 161C, the substrate can also be made. The tip of P2 is close to the holding pad 184a of the substrate carrying-in support device 182A.

In the description of FIGS. 11 (a) and 11 (b), the substrate carrying hand 161C of the second modification is used, but the substrate carrying hand 161A of the first embodiment may be used.

(Fourth Modification) The fourth modification is an example in which the structure of the substrate carrying-in hand is changed. 12 (a) is a plan view of a substrate carrying-in hand 161E according to a fourth modification, and FIG. 12 (b) is a cross-sectional view taken along the line A-A of FIG. 12 (a).

As shown in FIG. 12 (a), among the plurality of finger portions 162E of the substrate carrying-in hand 161E, the finger portions 162E1 at both ends in the Y-axis direction include a belt portion 166. As shown in FIG. 12 (b), the belt portion 166 includes a belt 166a and a pair of pulleys 166b. The band 166a is in contact with the back surface of the substrate P2, and the upper surface of the band 166a and the upper surface of the support pad 164E provided on the finger portion 162E1 are formed on substantially the same plane, and are arranged substantially parallel to the upper surface of the finger portion 162E1. The belt 166a is made of a material with a high friction coefficient which is difficult to slide, for example, a material selected from stainless steel coated with a urethane or silicon dioxide, rubber, or soft polyvinyl chloride (Poly Vinyl Chloride, PVC). in.

FIGS. 13 (a) and 13 (b) are diagrams showing an operation of carrying the substrate P2 into the substrate holder 28A using the substrate carrying hand 161E.

As shown in FIG. 13 (a), after the front end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carrying support device 182A, the substrate carrying hand 161E is held with respect to the substrate while the holding pad 184a holds the front end of the substrate P2. 28A is relatively moved in the + X direction. Then, since the belt 166a is formed of a material having a large friction coefficient, as shown in FIG. 13 (b), as the substrate P2 moves relative to the substrate carrying hand 161E, the belt 166a in contact with the substrate P2 passes through a pair of pulleys. 166b while moving cyclically. With this, the belt 166a is held in a state of restricting the position in the Y-axis direction of the substrate P2 and is lowered obliquely on the substrate carrying-in hand 161E. Therefore, just before the entire substrate P2 leaves the substrate carrying-in hand 161E, the substrate P2 is carried into the substrate holder 28A in a state restrained by the belt 166a.

In the first embodiment and the first to third modification examples, the substrate carrying-in hand is moved in the + X direction with the holding pad 184a of the substrate carrying-in support device 182A holding the -X side end of the substrate P2. (Backoff) (eg, Figure 6 (c), etc.). At this time, the portion other than the -X side end portion of the substrate P2 is in a state in which movement in the Y-axis direction is not restricted until it is supported by the substrate holder 28A.

On the other hand, in the fourth modification, while the substrate carrying hand 161E is moved in the + X direction with the holding pad 184a holding the -X side end of the substrate P2, the substrate carrying hand 161E is held by + X. With the side end portion restraining the movement in the Y-axis direction, the substrate P2 is placed on the substrate holder 28A. Therefore, according to the fourth modification, the substrate P2 can be restrained immediately before the entire substrate P2 leaves the substrate carrying-in hand 161E, so that the placement deviation of the substrate P2 can be prevented.

The belt portion 166 may be controlled by a motor or the like. In this case, the tape 166a may be fed out in synchronization with the timing of retreating the substrate carrying-in hand 161E. In this case, the belt 166a may not be an endless belt. In addition, if the respective bands 166a included in the fingers 162E1 at both ends are independently moved, the relative position (alignment) of the substrate P2 with respect to the substrate holder 28A can be adjusted on the substrate carrying-in hand 161E.

(Fifth Modification) The fifth modification changes the configuration of the fingers of the substrate carrying hand. 14 (a) and 14 (b) are cross-sectional views schematically showing a substrate carrying-in hand 161F according to a fifth modification.

As shown in FIG. 14 (a), the finger portion 162F of the substrate carrying-in hand 161F includes a first finger portion 162F1 and a second finger portion 162F2. The first finger portion 162F1 is hollow, and a wire rope 169A for moving the second finger portion 162F2 is arranged inside. The second finger portion 162F2 is rotatably connected to the first finger portion 162F1 via a pin 169B or the like about the Y axis. A steel cable 169A is connected to the second finger portion 162F2. By moving the steel cable 169A with a driving device (not shown), the second finger portion 162F2 rotates around the Y axis with the pin 169B as a fulcrum. Thereby, only a part of the area of the substrate P2 held by the second finger portion 162F2 can be inclined with respect to the holder substrate holding surface of the substrate holder 28A.

The other configurations are the same as those of the first embodiment, and therefore descriptions thereof are omitted.

In addition, the substrate carrying-in hand 161F may not have a driving mechanism using the steel cable 169A, and the second finger portion 162F2 may be always inclined with respect to the first finger portion 162F1.

According to the fifth modification, the driving mechanism for tilting the substrate carrying-in hand 161A as in the first modification (see FIG. 9 (c)) can be omitted. In addition, the tip portion of the second finger portion 162F2 can be made thin.

<< Second Embodiment >> Next, an exposure apparatus according to a second embodiment will be described with reference to Figs. 15 (a) to 25 (b). The structure of the exposure apparatus 10G of the second embodiment is the same as that of the first embodiment except that a part of the structure and operation of the substrate conveying device are different. Therefore, only the differences will be described below. Elements having the same configuration and function are denoted by the same reference numerals as those of the first embodiment, and descriptions thereof will be omitted.

15 (a) and 15 (b) are a plan view and a side view, respectively, of an exposure apparatus 10G according to the second embodiment. 16 (a) and 16 (b) are perspective views of the substrate carrying-in hand 161G of the second embodiment.

(Platform device 20G) In the said 1st Embodiment, the board | substrate holder 28A is provided with the notch 28b (refer FIG. 3 (a) and FIG. 3 (c)) which accommodates the holding | maintenance pad 184b of the board | substrate carrying-out support device 183A. As shown in FIG. 15 (a), the substrate holder 28G according to the second embodiment includes a notch 28a in addition to the notch 28b, and a holding pad 184a for accommodating the substrate carrying-in support device 182G.

(Substrate Transfer Device 100G) In the substrate transfer device 100G of the second embodiment, the plurality of beams 153 included in the beam unit 152 are extended inwardly of the Z-axis direction at positions more inward than both ends in the X-axis direction. A plurality of (for example, two) rod-shaped feet 154 are supported from below. The vicinity of the respective lower end portions of the plurality of legs 154 supporting each beam 153 is connected by a base plate 156. In the substrate transfer apparatus 100G, the base plate 156 is moved in the X-axis direction by a predetermined stroke by an X actuator (not shown), whereby the beam unit 152 is integrally moved in the X-axis direction by a predetermined stroke. In addition, the base plate 156 is moved in the Z-axis direction by the Z actuator 158, whereby the beam unit 152 can be moved up and down in the Z-axis direction as a whole. In addition, in the plan views of FIG. 15 (a) and subsequent drawings, the illustration of the base plate 156 is omitted.

In the substrate conveyance unit 160G of the second embodiment, as shown in FIG. 15 (a), the substrate carry-in hand 161G has a plurality of (for example, eight in this embodiment) finger portions 162G. The vicinity of the −X side end portions of the plurality of finger portions 162G is connected to each other by a connection member 163G. The connection member 163G has a structure capable of supporting the substrate P by supplying gas (gas supply) to the back surface of the substrate P held by the substrate carrying hand 161G. On the other hand, the + X side end portions of the plurality of finger portions 162G become free ends, and adjacent finger portions 162G are vacated on the port opening portion 150G side. In addition, as shown in FIG. 15 (a), each finger portion 162G is disposed in such a manner that positions in the Y-axis direction do not overlap a plurality of beams included in the beam unit 152 in a plan view.

As shown in FIGS. 16 (a) and 16 (b), among the plurality of finger portions 162G, the finger portions 162G1 at both ends in the Y-axis direction have a thin thickness on the -X side (the substrate holder 28G side) when viewed from the side, + A triangular shape with a thicker X-side (150G port portion). On the other hand, the finger portion 162G2 on the inner side is thinner than the finger portion 162G1 on both sides, on the port side.

In addition, an arm 168 of the substrate carrying-in hand 161G is attached to the finger portions 162G1 at both ends of FIGS. 16 (a) and 16 (b). As shown in FIG. 15 (a), both ends of the arm 168 are connected to the X-axis driving device 164.

As shown in FIGS. 15 (a) and 15 (b), the substrate carrying-in hand 161G includes a pair of substrate picking hands 167G provided at the fingers 162G1 at both ends in the Y-axis direction. The substrate picking hand 167G can be moved with a predetermined stroke in the X-axis direction and the Z-axis direction by a driving device (not shown).

In addition, the substrate picking hand 167G can suck and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown).

(Transferring Device 180G) The substrate carrying-in support device 182G is different from the substrate carrying-in support device 182A in the first embodiment in that the X actuator 186x is omitted. As shown in FIG. 15 (b), the holding pad 184a of the substrate carrying-in support device 182G is moved in the notch 28a by the Z actuator 186z, thereby being able to contact the lower surface of the substrate P and the substrate. P's lower surface moves between positions. The holding pad 184a can be moved between a position partially accommodated in the notch 28a and a position higher than the upper surface of the substrate holder 28G by the Z actuator 186z.

(Substrate Replacement Operation) Hereinafter, the replacement operation of the substrate P on the substrate holder 28G of the exposure apparatus 10G of the second embodiment will be described with reference to FIGS. 17 (a) to 24 (b).

As shown in FIGS. 17 (a) and 17 (b), during the exposure process of the platform device 20G, the external conveying device 300 is moved in the −Z direction and the substrate P2 is placed on the beam unit 152. Then, the external carrying device 300 moves in the + X direction and exits from the exposure device.

The substrate carrying-in hand 161G is driven in the + X direction, and enters below the beam unit 152 from the -X side (the substrate holder 28G side).

Then, as shown in FIGS. 18 (a) and 18 (b), the stage device 20G that has finished the exposure processing is moved to the substrate transfer position with the substrate transfer unit 160G.

The Z-actuator 158 drives the beam unit 152 downward while driving the substrate P2 (driving in the -Z direction). At this time, a part of the substrate P2 on the beam unit 152 is in contact with the substrate pickup hand 167G of the substrate carrying-in hand 161G. The substrate picking hand 167G sucks and holds the lower surface of the substrate P2.

Thereafter, as shown in FIGS. 19 (a) and 19 (b), in the platform device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carrying-out support device 183A. At this time, the substrate holder 28G and the offset beam 185 a supply gas (gas supply) to the back surface of the substrate P1 so that the substrate P moves in a floating state.

Pressurized gas is ejected from each beam 153 of the beam unit 152. In addition, the beam unit 152 is gradually lowered continuously.

The substrate carrying-in hand 161G is slowly moved in the -X direction in a state where the substrate P2 on the beam unit 152 is held by the substrate picking hand 167G. The substrate P2 moves in the -X direction as the substrate carrying hand 161G moves in the -X direction.

Then, as shown in FIGS. 20 (a) and 20 (b), the substrate carrying-in hand 161G moves in the −X direction to an X position where the root of the finger 162G and the beam unit 152 do not overlap in a plan view.

The beam unit 152 descends and moves below the substrate carrying-in hand 161G, and completely transfers the new substrate P2 to the substrate carrying-in hand 161G. At this time, the relative position of the substrate P2 with respect to the substrate carrying-in hand 161G may be adjusted on the substrate carrying-in hand 161G by a pair of substrate picking hands 167G.

Thereafter, as shown in FIGS. 21 (a) and 21 (b), the substrate carrying-in hand 161G moves in the −X direction while holding the substrate P2 and is arranged at a predetermined position above the substrate holder 28G.

In the platform device 20G, the substrate is moved into the holding pad 184a of the holding device 182G by the Z actuator 186z and driven upward. The substrate carrying-in hand 161G pushes the substrate P2 obliquely downward with the substrate picking hand 167G. Thereby, the -X side end portion of the substrate P2 is brought into contact with the holding pad 184a. Thereby, the holding pad 184a contacts the substrate P2 on the substrate carrying hand 161G waiting above the substrate holder 28G from below, and holds and holds the vicinity of the end portion on the -X side of the substrate P2. Furthermore, at this timing, the substrate picking hand 167G may also adjust the position of the substrate P2 relative to the substrate holder 28G.

In addition, at the same time as the holding and holding operation of the substrate P2 by the holding pad 184a, the substrate carrying hand 170A is moved to suck and hold the lower surface of the portion of the substrate P1 that is offset from the substrate holder 28G to the + X side.

The beam unit 152 moves in the -X direction and the -Z direction, and stops at the substrate transfer position with the substrate holder 28G. In addition, pressurized gas is ejected from each beam 153 of the beam unit 152. Thereby, the beam unit 152 becomes a guide which supports the board | substrate P1 carried out from the board | substrate holder 28G.

Then, as shown in FIG. 22 (a) and FIG. 22 (b), the substrate picking hand 167G of the substrate carrying hand 161G releases the holding of the substrate P2. As shown in FIG. 22 (a) and FIG. In the state of the X-side end portion, the substrate conveyance unit 160G is driven in the unloading direction (+ X side). When the substrate carrying unit 160G is driven in the carrying-out direction (+ X side), the substrate carrying hand 170A holding the substrate P1 is also driven in the + X direction.

As a result, the substrate P1 moves from the substrate holder 28G to the port opening portion 150G (the beam unit 152). At this time, since the pressurized gas is sprayed from the upper surface of the beam unit 152, the substrate P1 is floated and transported on the substrate holder 28G and the port portion 150G in a non-contact state (except for the portion held by the substrate carrying-out hand 170A).

Then, as shown in FIGS. 23 (a) and 23 (b), the substrate carrying-out hand 170A releases the grip of the substrate P1 and moves in the −X direction together with the substrate carrying-in hand 161G. The port portion 150G moves in the + X direction while the substrate P2 is held on the beam unit 152.

In the platform device 20G, the substrate carrying-in support device 182G adjusts the position of the substrate P2 with respect to the substrate holder 28G, and then moves in the -Z direction by the Z actuator 186z, and a part thereof is accommodated in the notch 28a. Thereby, the substrate P2 is attracted to the holder substrate holding surface of the substrate holder 28G. In addition, the position adjustment (alignment) of the substrate P2 described herein can be omitted, and it can also be controlled in a manner of implementation as needed.

Thereafter, as shown in FIG. 24 (a) and FIG. 24 (b), if the substrate carrying-in hand 161G moves to a position where it does not interfere with the substrate P1, the beam unit 152 moves in the + Z direction, and moves to the external carrying device 300 substrate handover position.

The external transfer device 300 collects the substrate P1 on the beam unit 152 and then transfers the new substrate P3 to the port portion 150A.

As described above in detail, according to the second embodiment, the substrate is carried into the adjacent finger portion 162G of the hand 161G, and the port portion 150G side is left open. With this, the substrate carrying hand 161G can directly enter the lower side of the beam unit 152 from the substrate holder 28G side and be driven above the beam unit 152, thereby grabbing the substrate P2 on the beam unit 152 and moving to the substrate holder 28G side. Therefore, even when the substrate P2 is placed on the beam unit 152, the substrate carrying-in hand 161G can enter the lower portion of the substrate P2 in the X-axis direction with a short moving distance. That is, the substrate carrying-in hand 161G can accept the substrate P2 on the beam unit 152 without moving to the position on the + X side of the port opening portion 150G. In addition, the substrate carrying-in hand 161G can be transferred to the beam unit 152 without moving the exposed substrate P1 to the position on the + X side of the port opening portion 150G. That is, a series of operations of carrying in the substrate P2 and carrying out the substrate P1 can be performed without changing the positional relationship in the X direction of the external carrying device 300, the port portion 150G, the substrate carrying hand 161G, and the substrate holder 28G. Furthermore, since it is not necessary to install a chamber in such a way that the board carrying hand 161G moves to the position on the + X side of the port opening portion 150G, the footprint of the exposure device, that is, the installation of 10G of the exposure device can be reduced. area. In addition, when a defect occurs in the exposure device, or when an operation such as initial setting is performed, the substrate P can be carried out to the port portion 150G (beam unit 152) even if there is no external transfer device 300. It was transferred to the substrate carrying hand 161G again, and carried to the substrate holder 28G.

In addition, according to the second embodiment, the vicinity of the ends on the −X side (the substrate holder 28G side) of the plurality of finger portions 162G of the substrate carrying hand 161G is connected to each other by the connection member 163G. Thereby, compared with the substrate carrying-in hand 161A, the substrate carrying-in hand 161G of the second embodiment can set the substrate P2 on the substrate holder 28G without deformation.

Specifically, as shown in FIG. 25 (a), the substrate carrying-in hand 161A of the first embodiment is vacated between the −X-side finger portions 162A. Therefore, as shown in FIG. 25 (a), the -X side edge of the substrate P2 immediately before the substrate holder 28A may have an area supported by the finger portion 162A and an unsupported area, so there are slight fluctuations. It is difficult to install the substrate P2 on the substrate holder 28A without deformation. On the other hand, as shown in Figs. 16 (a) and 16 (b), the substrate of the second embodiment is carried into the hand 161G, and the fingers 162G adjacent to the -X side are continuous without being vacated. The surface form supports the -X side end of the substrate P2. Thereby, as shown in FIG. 25 (b), the -X side edge of the substrate P2 immediately before the substrate holder 28G is less likely to fluctuate. Therefore, compared with the substrate carrying-in hand 161A, the substrate carrying-in hand 161G of the second embodiment can set the substrate P2 on the substrate holder 28G without deformation.

In addition, according to the second embodiment, by moving the substrate transfer unit 160G (the substrate carrying hand 161G) and the platform device 20G (the substrate holder 28G) in opposite directions, the substrate carrying hand 161G is moved from the substrate P2 and the substrate holder. Retreat between 28G. Thereby, the carrying-in time of the board | substrate P2 to the board | substrate holder 28G can be shortened.

In addition, according to the second embodiment, among the finger portions 162G of the substrate carrying-in hand 161G, the inner finger portions 162G2 other than the finger portions 162G1 at both ends are thinner than the finger portions 162G1 at both ends ( See, for example, FIG. 16 (b)). This can reduce the weight of the substrate carrying-in hand 161G.

In addition, according to the second embodiment, the arm 168 of the substrate carrying-in hand 161G is mounted on the fingers 162G1 at both ends. Therefore, the substrate carrying-in hand 161G can support the central portion of the substrate P2 and the substrate carrying-in hand 161G can be reduced. Furthermore, since the arm 168 of the substrate carrying-in hand 161G is attached to the fingers 162G1 at both ends, the center of gravity of the entire substrate carrying-in hand 161G is supported, so that the substrate carrying-in hand 161G can be prevented from flexing.

(First Modification) In the second embodiment, the Z position (pass line) for transferring the substrate between the external carrying device 300 and the beam unit 152 of the port portion 150G is set to be held by the substrate. The upper surface of the device 28G is higher, but the height of the passing line can be set freely (there is no limit).

26 (a) and 26 (b) are diagrams for explaining a substrate replacement operation according to the first modification.

As shown in FIGS. 26 (a) and 26 (b), the external conveying device 300 places the substrate P2 on the beam unit 152 which is stopped at a position lower than the upper surface TS of the substrate holder 28G.

Then, as shown in Figs. 17 (a) and 17 (b) of the second embodiment, if the beam unit 152 is raised to a position higher than the highest part of the substrate carrying-in hand 161G, even if there is no In the case of a driving device that moves the substrate carrying-in hand 161G up and down, the substrate P2 may be transferred to the substrate carrying-in hand 161G. With this, for example, when a defect occurs in the exposure device, or when an initial setting operation is performed, etc., even if the external conveying device 300 does not exist, it can be carried out to the port opening 150G (beam unit 152). The substrate was transferred to the substrate carrying hand 161G again, and was transferred to the substrate holder 28G.

(Second Modification) The second modification is an example in which the configuration of the substrate transfer apparatus is changed.

In the substrate transfer apparatus 100I of the second modification, the substrate transfer unit 160I includes a drive system that rotates the substrate transfer hand 161I around the Y axis. That is, the substrate carrying-in hand 161I can incline the substrate holding surface about the Y axis by the driving system.

In the second modified example, as shown in FIG. 27 (a), the stroke of the substrate pickup hand 167I included in the substrate carrying-in hand 161I is longer than that of the substrate pickup hand 167G of the second embodiment. Furthermore, in the second modification, as shown in FIG. 27 (a), the distance from the -X side end of the substrate carrying hand 161I to the root of the finger 162I, that is, the width in the X-axis direction of the connecting member 163I It is longer than the connecting member 163G of the second embodiment.

A substrate replacement operation using the substrate transfer apparatus 100I of the second modification will be described with reference to FIGS. 27 (a) to 30 (b). The states of FIGS. 27 (a) and 27 (b) correspond to the states of FIGS. 17 (a) and 17 (b) of the second embodiment, respectively.

As shown in FIG. 27 (a) and FIG. 27 (b), during the exposure processing of the platform device 20G, the external conveying device 300 moves in the -Z direction, and a new substrate P2 is placed on the beam unit 152, and then toward + It moves in the X direction and exits from the exposure device 10I.

The substrate carrying-in hand 161I moves in the + X direction, and enters below the beam unit 152 from the -X side (the substrate holder 28G side). Then, the root of the finger 162I of the substrate carrying-in hand 161I and the -X side end of the beam unit 152 stop at positions that do not overlap in a plan view.

Then, as shown in FIGS. 28 (a) and 28 (b), the stage device 20G that has finished the exposure processing is moved to the substrate transfer position with the port portion 150G.

The substrate carrying-in hand 161I is rotationally driven around the Y axis so that the substrate holding surface of the substrate carrying-in hand 161I is substantially parallel to the substrate P2 on the beam unit 152. The beam unit 152 moves downward (moves in the -Z direction) while holding the substrate P2, and a part of the substrate P2 on the beam unit 152 comes into contact with the substrate pickup hand 167I of the substrate carrying hand 161I and stops. The substrate picking hand 167I sucks and holds the back surface of the substrate P2.

Then, as shown in FIGS. 29 (a) and 29 (b), in the platform device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carrying-out support device 183A.

The substrate pick-up hand 167I of the substrate carrying-in hand 161I moves in the -X direction while holding the substrate P2 on the beam unit 152. Thereby, the board | substrate P2 moves to the board | substrate carrying-in hand 161I in the state held by the board | substrate carrying-in hand 161I and the beam unit 152. At this time, pressurized gas is sprayed from the beam unit 152 and the substrate carrying-out hand 161I. The substrate picking hand 167I sucks and holds the substrate P2, so there is no possibility that the substrate P2 falls from the beam unit 152 or the substrate carrying out hand 161I. The substrate P2 is held by the substrate carrying-in hand 161I and the beam unit 152, and therefore, compared with the case where the substrate carrying-in hand 161I moves in the + Z direction relative to the beam unit 152 and the substrate P2 is placed on the substrate carrying-in hand 161I from the beam unit 152 The load on the substrate P2 is small. Therefore, when the substrate P2 is transferred between the substrate carrying-in hand 161I and the beam unit 152, the risk of damage to the substrate P2 can be reduced.

Then, as shown in FIGS. 30 (a) and 30 (b), the beam unit 152 is lowered and driven below the substrate carrying hand 161I, and the substrate P2 is completely transferred to the substrate carrying hand 161I. When the substrate P2 is placed on the substrate carrying hand 161I, the substrate carrying hand 161I is rotationally driven around the Y axis, and the substrate holding surface of the substrate carrying hand 161I is inclined with respect to the holder substrate holding surface of the substrate holder 28G ( Figure 27 (b)).

Subsequent operations are the same as those of the second embodiment, and therefore descriptions thereof are omitted.

According to the second modified example, the substrate carrying hand 161I is rotated around the Y axis so that the substrate holding surface of the substrate carrying hand 161I is substantially parallel to the substrate P2 on the beam unit 152, and the substrate P2 of the beam unit 152 is transferred to The substrate is carried into the hand 161I. Thereby, the substrate P2 can be reliably transferred to the substrate carrying-in hand 161I without being deflected.

In addition, according to the second modification, the width in the X-axis direction of the connection member 163I is wide. Thereby, the length of the finger portion 162I of the substrate carrying-in hand 161I can be shortened, and the rigidity of the entire substrate carrying-in hand 161I can be improved.

(Third Modification) In the second modification, the substrate P2 is moved from the beam unit 152 to the substrate carrying hand 161I by tilting the substrate carrying hand 161I, but in the third modification, the beam is moved by The unit 152 is inclined to move the substrate P2 from the beam unit 152 to the substrate carrying hand 161I.

As shown in FIG. 31 (a), in the substrate transfer apparatus 100J according to the third modified example, the port portion 150J includes feet 154 a and 154 b of the beam 153 whose upper ends are connected to the beam unit 152. In addition, the port opening portion 150J includes a Z actuator 158a and a Z actuator 158b that can extend and contract the feet 154a and 154b in the Z-axis direction independently. When the Z actuators 158a and Z actuators 158b change the amount of expansion and contraction of the legs 154a and 154b, the inclination of the upper surface of the beam unit 152 can be changed. Moreover, in FIG. 31 (a), the beam unit 152 arrange | positioned between the finger part 162I1 at both ends and the inner finger part 162I2 is shown.

Next, the transfer of the substrate P2 from the beam unit 152 to the substrate carrying hand 161I will be described.

FIG. 31 (a) shows a state where the substrate P2 has been set on the beam unit 152 by the external conveying device 300. At this time, the substrate carrying-in hand 161I moves from the -X side of the beam unit 152 to the + X direction, and the root portion of the finger portion 162G and the -X side end portion of the beam unit 152 stop at a position that does not overlap in plan view.

Next, as shown in FIG. 31 (b), the Z-actuator 158a and Z-actuator 158b change the amount of expansion and contraction of the feet 154a and 154b, and hold the upper surface of the beam unit 152 and the substrate of the substrate carrying hand 161I The beam unit 152 is inclined so that the surfaces form approximately the same surface.

Then, as the beam unit 152 descends, the substrate P2 held by the beam unit 152 is held by the substrate picking hand 167I, and the substrate position is transferred to the substrate loading hand 161I while the substrate picking hand 167I is moved.

As in the third modification, the substrate P2 can be moved from the beam unit 152 to the substrate carrying-in hand 161I by tilting the beam unit 152.

(Fourth Modification) The fourth modification is an example in which the configuration of the finger portion of the substrate carrying hand is changed.

As shown in FIGS. 32 (a) and 33 (a), the substrate carrying-in hand 161K of the fourth modified example has a finger portion 162K having a length substantially the same as the substrate size in the X-axis direction. In addition, as shown in FIG. 32 (b) and the like, the shape of the substrate carrying-in hand 161K has a sharp diamond-like shape at both ends when viewed from the side, and an arm 168 is attached to a thick portion of the central portion.

The transfer of the substrate from the beam unit 152 to the substrate carrying hand 161K according to the fourth modification will be described with reference to FIGS. 32 (a) to 33 (b).

As shown in FIGS. 32 (a) and 32 (b), the substrate carrying-in hand 161K is arranged at a position where the root of the finger 162K and the -X side end of the beam unit 152 do not overlap in a plan view.

Then, when the external carrying device 300 transfers the substrate P2 to the beam unit 152, the beam unit 152 moves in the -Z direction as shown in Figs. 33 (a) and 33 (b). Since the length of the finger 162K of the substrate carrying hand 161K is substantially the same as the length of the substrate P2, the substrate P2 is placed on the substrate carrying hand 161K by moving the beam unit 152 in the -Z axis direction. Thereafter, the substrate P2 is slid to the inclined surface side by the substrate pickup hand 167K. Thereby, a part of the substrate P2 is inclined with respect to the holder substrate holding surface of the substrate holder 28G. Subsequent operations are basically the same as those of the second embodiment, so detailed descriptions are omitted.

According to the fourth modification, the length of the finger 162K (length in the X-axis direction) of the substrate carrying hand 161K is substantially the same as the length of the substrate. Therefore, when the substrate carrying hand 161K receives the substrate P2 placed on the beam unit 152, The substrate P2 can be picked up only by passing the substrate carrying hand 161K upward from below the beam unit 152. Therefore, there is an effect that the operation is simple and it is difficult to cause damage to the substrate P2 or dust.

(Fifth Modification) A fifth modification is an example in which the substrate is directly transferred from the external carrying device 300 to the substrate carrying-in hand 161K.

In the fifth modification, as shown in FIG. 34 (a), the forks of the external conveying device 300 are arranged so that the positions in the Y-axis direction do not overlap the fingers 162K of the substrate carrying hand 161K in a plan view. The beam 153 of the beam unit 152 is arranged so as not to overlap with the fork of the external conveyance device 300 in a plan view. As a result, in the fifth modification, the finger 162K of the substrate carrying-in hand 161K and the beam 153 of the beam unit 152 are disposed at positions overlapping each other in a plan view.

Hereinafter, the substrate transfer from the external transfer device 300 to the substrate carrying hand 161K according to the fifth modification will be described with reference to FIGS. 34 (a) to 35 (b).

As shown in FIGS. 34 (a) and 34 (b), the substrate carrying-in hand 161K is driven in the + X direction to be disposed at the substrate transfer position with the external transfer device 300. The external transfer device 300 moves in the -X direction while holding the substrate P2 until it reaches the substrate transfer position with the substrate carrying hand 161K.

Then, as shown in FIGS. 35 (a) and 35 (b), the stage device 20G that has finished the exposure processing is moved to the substrate transfer position with the beam unit 152. In the platform device 20G, the substrate P1 on the substrate holder 28G is shifted in the + X direction by the substrate carrying-out support device 183A.

When the external carrying device 300 moves in the -Z direction, the lower surface of the substrate P2 is brought into contact with the substrate picker 167K. The substrate picking hand 167K sucks and holds the lower surface of the substrate P2.

The substrate picker 167K holding the lower surface of the substrate P2 is driven in the -X direction. Thereby, the board | substrate P2 on the external conveyance apparatus 300 moves to the board | substrate carrying hand 161K. When the external conveying device 300 keeps the substrate P2 completely transferred to the substrate carrying-in hand 161K through the lowering driving, it is driven out of the exposure device 10L by being driven in the + X direction.

The beam unit 152 moves in the -Z direction and the -X direction, and moves toward the handover position with the substrate of the stage device 20G.

Subsequent operations are basically the same as those of the second embodiment, so detailed descriptions thereof are omitted.

As described above, according to the fifth modification, when the substrate P2 is carried in, the substrate carrying hand 161K can directly receive the substrate P2 from the external carrying device 300 without passing through the port portion 150G. As a result, in contrast to the transfer of substrate P2 from the external transfer device 300 to the port portion 150G, and the transfer of the substrate P2 from the port portion 150G to the substrate 161K, these two transfer operations have only been performed from the outside. The device 161K transfers the hand to the substrate 161K. This transfer is sufficient to reduce the number of transfers of the substrate P2. Therefore, the time taken for the transfer of the substrate P2 can be shortened, and damage or dust to the substrate P2 can be prevented.

In the fifth modification, the substrate P1 is transferred (extracted) from the beam unit 152 to the external transfer device 300 in the same manner as in the second embodiment.

Furthermore, in the fifth modification, in order to prevent the fingers of the beam unit 152 and the robot hand of the external transfer device 300 from overlapping in plan view, the beam 153 of the beam unit 152 and the fingers 162K of the substrate carrying hand 161K They are arranged in an overlapping manner in a plan view, but are not limited thereto. The beam 153 of the beam unit 152 and the finger 162K of the substrate carrying hand 161K may not be overlapped in a plan view. In this case, the beam unit 152 may also be able to deviate from one finger 162K in the Y-axis direction. Thereby, the substrate which has been carried out from the substrate holder 28G to the port opening portion 150G can be taken again by the substrate carrying-in hand.

In the case of handing over the substrate, in order to prevent the cross beam 153 from overlapping with the finger 162K in a plan view, the external carrying device 300 may not be shifted in the Y axis direction without shifting the cross beam unit 152 in the Y axis direction, and the substrate may also be carried in. The hand 161K deviates in the Y-axis direction.

(Sixth Modified Example) The sixth modified example changes the configuration for carrying a substrate into a hand.

FIG. 36 is a perspective view showing a substrate carrying-in hand 161L according to a sixth modification. As shown in FIG. 36, the substrate carrying-in hand 161L includes a plate portion 263 having a triangular shape in the XZ cross section, and an arm portion 265 supporting the plate portion 263. The upper surface of the plate portion 263 is inclined with respect to the XY plane.

As shown in the sixth modified example, the substrate may be carried into the hand without a finger. In other words, the substrate may not have a fork shape when carried in the hand.

Furthermore, as shown in FIG. 37 (a), the upper surface of the plate portion 263 of the substrate carrying-in hand 161L may be bent. As described above, by bending the upper surface of the plate portion 263 (the holder substrate holding surface), the cross-sectional coefficient of the substrate can be increased. That is, the same effect as the thickness of the substrate with respect to the deflection of the substrate is actually several times to several hundred times larger.

With this setting, even if the substrate P is placed on the substrate carrying hand 161L with the -X end portion exposed as shown in FIG. 37 (b), it is possible to suppress the deflection (sag) at the -X end portion of the substrate P. . In addition, since the occurrence of deflection (sag) of the substrate P is suppressed, when the substrate P is brought into contact with the substrate holder, the substrate P can be brought into contact with the central portion in the Y-axis direction of the -X side, so that the substrate P can be -X-ends are less prone to wrinkles.

In addition, as shown in FIG. 38, the substrate conveyance sections 160A to 160L may be provided with a cover 199. By providing the cover 199, the garbage on the substrate P can be prevented from being attached, and the temperature of the substrate P can be set constant.

Furthermore, in the second embodiment and its modification, the platform device 20A of the first embodiment may be used instead of the platform device 20G. The platform device 20G can also be applied to the first embodiment and its modification.

In addition, as shown in FIG. 39 in the first embodiment and the second embodiment and its modification, it is possible to support the projection optical system 16 or the mask platform 14 without interfering with the substrate carrying hand. Partial chamfering (30a) is performed near the + X side end of the fixed plate 30 called an upper cylinder. In addition, FIG. 39 shows a case where the substrate carrying-in hand is the substrate carrying-in hand 161G of the second embodiment. Thereby, the height of the entire exposure apparatus can be reduced.

In addition, in the first and second embodiments and modifications thereof, as shown in FIGS. 40 (a) and 40 (b), the stage devices 20A and 20G include charges for detecting the edges of the substrate P. The coupling element (Charge-Coupled Device, CCD) camera 31x and CCD camera 31y (image processing edge detection) are used as the substrate position measuring device described above. The CCD camera 31x is arranged so that two places on the -X side of the substrate P placed in front of the substrate holders 28A and 28G can be observed. The CCD camera 31y is arranged so that one side of the -Y side (or + Y side) of the substrate P can be viewed from below. Thereby, the X position, Y position, and θz position of the substrate P with respect to the stage devices 20A and 20G can be known. These pieces of information can be used for platform control as the position correction of the substrate P2 before placement or the position information of the substrate P2 after placement. Further, for example, a well-known edge sensor including a light source and a light receiving section may be used instead of the CCD camera 31x and the CCD camera 31y that detect the edge of the substrate P. The light source is disposed at the same position as the CCD camera 31x and the CCD camera 31y, and the light receiving section is disposed so as to face the light source through the substrate P. The cross section orthogonal to the optical axis of the measurement light radiated from the light source is linear, and the light receiving section detects the end of the substrate P by receiving the measurement light. In this way, the X position, Y position, and θz position of the substrate P with respect to the platform devices 20A and 20G can also be detected based on the detection results of the end portions in the X-axis direction and the end portions in the Y-axis direction of the measurement substrate P.

In addition, in the above-mentioned first and second embodiments and modifications thereof, the platform device 20M shown in FIGS. 41 (a) to 41 (c) may be used.

In the platform device 20M, as shown in FIG. 41 (a), two substrate carrying-in support devices 182M are provided at the -X side end portion of the substrate holder 28M. As shown in FIG. 41 (b), the substrate carrying-in support device 182M is set in such a manner that a part of the substrate-carrying support device 182M is housed in a notch 28a formed at the -X side end portion of the substrate holder 28M, and the holding pad 184a The height of the upper surface becomes substantially the same as the upper surface of the substrate holder 28M. Therefore, even after the substrate P2 is placed, the holding pad 184a can be retracted from the substrate holder 28M without moving in the -X direction.

In addition, as shown in FIG. 41 (c), the substrate carrying-in support device 182M can be tilted so that the back surface of the substrate P2 that is carried in obliquely can be fixedly adsorbed and fixed. In addition, the substrate carrying-in supporting device 182M can move in the horizontal direction (X-axis direction, X-axis direction, and Y-axis direction) so that the relative position (alignment) of the substrate P2 with respect to the substrate holder 28M can be adjusted.

According to the platform device 20M, since the holding pad 184a can be tilted, the back surface of the fixed substrate P2 can be reliably sucked.

In addition, in the above-mentioned first and second embodiments and modifications thereof, the platform device 20N shown in Figs. 42 (a) and 42 (b) may be used.

The platform device 20N does not include the substrate carrying-in support device described in the first embodiment and the second embodiment which are independently moved. In the platform device 20N, one or more places near the -X side end surface of the substrate holder are provided with an adsorption area (supporting area) 187 for sucking and holding the front end portion of the substrate, so that the upper surface of the substrate holder 28N A part of the surface also functions as a holding pad 184a that holds and holds the front end of the substrate.

Furthermore, the platform device 20N does not have a substrate carrying support device that moves independently. Therefore, the relative position adjustment (alignment) of the carried substrate P with respect to the substrate holder 28N cannot be performed by the substrate carrying support device. Before the substrate is sucked in the supporting area 187, the position of the substrate P may be adjusted by using a pair of substrate carrying hands and the substrate carrying hands. In addition, when the substrate P is placed on the substrate holder 28N and the relative position adjustment (alignment) of the substrate P with respect to the substrate holder 28N is to be performed, it may be performed by using the substrate carrying-out support device 183A.

In addition, when the platform device does not have a substrate that can be moved independently into the supporting device, as shown in FIGS. 43 (a) to 43 (c), for example, the substrate carrying hand 161A can be moved from the substrate P to the substrate holder 28N. When the substrate P2 is placed on the substrate holder 28N, the substrate P2 is sucked into the substrate holder 28N to suck the substrate P2 on the substrate holding surface of the holder, thereby stably carrying in the substrate P2.

Furthermore, in the first and second embodiments and the modifications thereof, the support pads on the fingers of the substrate carrying hand may be omitted.

In addition, in each of the embodiments described above, the projection optical system 16 is an equal magnification system, but it is not limited to this, and a reduction system or an enlargement system may be used.

The use of the exposure device is not limited to an exposure device for a liquid crystal that transfers a pattern of a liquid crystal display device on a square glass plate. For example, the exposure device can be widely used to produce organic electro-luminescence (EL) panels. An exposure device for manufacturing, an exposure device for semiconductor manufacturing, a thin film magnetic head, a micromachine, and an exposure device such as a Deoxyribonucleic acid (DNA) wafer. In addition, not only micro-devices such as semiconductor devices, but also masks or photomasks used in the manufacture of light exposure devices, extreme ultraviolet (EUV) exposure devices, X-ray exposure devices, and electron beam exposure devices. An exposure device for transferring a circuit pattern onto a glass substrate, a silicon dioxide wafer, or the like.

The substrate to be exposed is not limited to a glass plate, and may be, for example, a wafer, a ceramic substrate, a film member, or other objects such as mask blanks. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, it also includes a film shape (a flexible sheet-like member). In addition, the exposure apparatus of this embodiment is particularly effective when a substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed. When the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape.

<< Element manufacturing method >> Next, the manufacturing method of the micro-element in the lithography process using the exposure apparatus 10A-10L of each said embodiment is demonstrated. By forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a substrate by using the exposure apparatus 10A to 10L of the embodiment, a liquid crystal display device as a micro-element can be obtained. <Pattern Forming Step> First, a so-called photolithography step of forming a pattern image on a photosensitive substrate (a glass substrate coated with a resist, etc.) using the exposure apparatus of each of the embodiments described above is performed. By this photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. Then, the exposed substrate is subjected to steps such as a development step, an etching step, and a resist peeling step, thereby forming a predetermined pattern on the substrate. <Color filter formation procedure> Next, a plurality of groups of three points corresponding to R (red), G (green), and B (blue) are arranged in a matrix or a plurality of R, G, and B are formed. A set of three striped filters arranged in a horizontal scanning line direction. <Cell Assembly Step> Next, a liquid crystal panel (liquid crystal cell) is assembled using a substrate having a predetermined pattern obtained in the pattern forming step, a color filter obtained in the color filter forming step, and the like. For example, liquid crystal is injected between a substrate having a predetermined pattern obtained in the pattern forming step and a color filter obtained in the color filter forming step to manufacture a liquid crystal panel (liquid crystal cell). <Module Assembly Procedure> Thereafter, various components such as a circuit and a backlight for causing the assembled liquid crystal panel (liquid crystal cell) to perform a display operation are mounted to complete a liquid crystal display device.

In this case, in the pattern forming step, the exposure device of each of the embodiments is used to expose the substrate with high yield and high accuracy, so that the productivity of the liquid crystal display device can be improved as a result.

The embodiment is a preferred embodiment of the present invention. However, the invention is not limited to this, and various modifications can be made without departing from the scope of the present invention.

10A ～ 10L‧‧‧Exposure device

12‧‧‧lighting system

14‧‧‧Mask Platform

16‧‧‧ projection optical system

20A, 20G, 20M, 20N‧‧‧platform device

22, 30‧‧‧ fixed

24‧‧‧ Substrate

26‧‧‧Support device

28A, 28G, 28M, 28N‧‧‧ substrate holder

28a, 28b‧‧‧ gap

30a‧‧‧Chamfered

31x, 31y‧‧‧CCD camera

100A ～ 100L‧‧‧ substrate handling device

150A, 150G, 150J‧‧‧Port mouth

152‧‧‧ beam unit

153‧‧‧ beam

154, 154a, 154b‧‧‧ feet

155a, 155b‧‧‧Joint Department

157‧‧‧base

158, 158a, 158b, 186z‧‧‧Z actuators

160A ～ 160L‧‧‧Substrate handling department

161A ～ 161L‧‧‧ substrate moving hands 162A, 162C, 162E, 162E1, 162F, 162G, 162G1, 162G2, 162I, 162I1, 162I2, 162K‧‧‧ finger

162F1‧‧‧First Finger

162F2‧‧‧ second finger

163A, 163G, 163I‧‧‧ connecting members

164‧‧‧X-axis drive

164A, 164D, 164E‧‧‧Support pad

166‧‧‧Belt

166a‧‧‧belt

166b‧‧‧ pulley

167G, 167I, 167K‧‧‧ substrate picker

168‧‧‧arm

169A‧‧‧Steel rope

169B‧‧‧pin

170A‧‧‧ substrate removed

171A, 184a, 184b‧‧‧

180A, 180G‧‧‧ handling device

182G, 182M‧‧‧ substrate moving into supporting device

182A‧‧‧ substrate moving into supporting device (supporting device)

183A‧‧‧ Substrate removal support device (support device)

185‧‧‧Offset beam section

185a‧‧‧offset beam

185b‧‧‧ supporting components

186x‧‧‧X actuator

187‧‧‧Support area (adsorption area)

199‧‧‧cover

263‧‧‧ Board

265‧‧‧arm

300‧‧‧External handling device

F‧‧‧ Ground

IL‧‧‧illumination light

M‧‧‧Mask

P1, P2, P3‧‧‧ substrate

P‧‧‧ Substrate (carried in)

TS‧‧‧ Top surface

156‧‧‧ substrate

FIG. 1 is a diagram schematically showing a configuration of an exposure apparatus according to a first embodiment. FIG. 2 is a plan view of a stage device and a substrate transfer device included in the exposure device (partially omitted) of FIG. 1. Fig. 3 (a) is a plan view of the platform device of the first embodiment, Fig. 3 (b) is a side view, and Fig. 3 (c) is a cross-sectional view taken along the line A-A of Fig. 3 (a). 4 (a) to 4 (c) are side views (part 1) of an exposure apparatus for explaining a substrate replacement operation of the first embodiment. 5 (a) to 5 (c) are side views (part 2) of an exposure apparatus for explaining a substrate replacement operation of the first embodiment. 6 (a) to 6 (c) are side views (No. 3) of the exposure apparatus for explaining the substrate replacement operation of the first embodiment. 7 (a) to 7 (c) are side views (part 4) of an exposure apparatus for explaining a substrate replacement operation of the first embodiment. 8 (a) to 8 (c) are side views (part 5) of an exposure apparatus for explaining a substrate replacement operation of the first embodiment. 9 (a) to 9 (c) are side views of an exposure apparatus for explaining a substrate replacement operation according to a first modification of the first embodiment. FIG. 10 (a) is a perspective view of a substrate carrying-in hand of a second modified example of the first embodiment, and FIG. 10 (b) is a side view. 11 (a) and 11 (b) are side views of an exposure apparatus for explaining a substrate replacement operation according to a third modification of the first embodiment. Fig. 12 (a) is a plan view of a substrate carrying-in hand according to a fourth modification of the first embodiment, and Fig. 12 (b) is a cross-sectional view taken along the line A-A of Fig. 12 (a). FIGS. 13 (a) and 13 (b) are diagrams for explaining a substrate carrying-in operation using a substrate carrying-in hand of a fourth modified example of the first embodiment. 14 (a) and 14 (b) are cross-sectional views schematically showing a substrate carrying-in hand of a fifth modified example of the first embodiment. 15 (a) and 15 (b) are a plan view and a side view, respectively, of an exposure apparatus according to a second embodiment. 16 (a) and 16 (b) are perspective views of a substrate carrying-in hand according to the second embodiment. 17 (a) and 17 (b) are a plan view and a side view (part 1) of an exposure apparatus for explaining a substrate replacement operation of the second embodiment. 18 (a) and 18 (b) are a plan view and a side view (part 2) of an exposure apparatus for explaining a substrate replacement operation of the second embodiment. 19 (a) and 19 (b) are a plan view and a side view (part 3) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment. 20 (a) and 20 (b) are a plan view and a side view (part 4) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment. 21 (a) and 21 (b) are a plan view and a side view (part 5) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment. 22 (a) and 22 (b) are a plan view and a side view (part 6) of an exposure apparatus for explaining a substrate replacement operation of the second embodiment. 23 (a) and 23 (b) are a plan view and a side view (part 7) of an exposure apparatus for explaining a substrate replacement operation of the second embodiment. 24 (a) and 24 (b) are a plan view and a side view (part 8) of an exposure apparatus for explaining a substrate replacement operation of the second embodiment. 25 (a) and 25 (b) are diagrams for explaining advantages of carrying a substrate into a hand according to the second embodiment. FIGS. 26 (a) and 26 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to a first modification of the second embodiment. FIGS. 27 (a) and 27 (b) are a plan view and a side view (part 1) of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment. FIGS. 28 (a) and 28 (b) are a plan view and a side view (part 2) of an exposure device for explaining a substrate replacement operation according to a second modification of the second embodiment. 29 (a) and 29 (b) are a plan view and a side view (part 3) of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment. FIGS. 30 (a) and 30 (b) are a plan view and a side view (part 4) of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment. FIGS. 31 (a) and 31 (b) are side views of a substrate transfer device for explaining a substrate transfer from a beam unit to a substrate carrying hand in a third modified example of the second embodiment. 32 (a) and 32 (b) are a plan view and a side view (part 1) of an exposure device for explaining a handover of a substrate carried from a beam unit to a substrate in a fourth modification of the second embodiment. . 33 (a) and 33 (b) are a plan view and a side view (part 2) of an exposure device for explaining a handover from a beam unit to a substrate carried in a substrate according to a fourth modification of the second embodiment. . FIGS. 34 (a) and 34 (b) are a plan view and a side view (part 1) of an exposure device for explaining the transfer of a substrate from an external carrying device to a substrate in a hand according to a fifth modification of the second embodiment; ). 35 (a) and 35 (b) are respectively a plan view and a side view of an exposure apparatus (second part) for explaining the transfer of the substrate from the external conveying device to the substrate in the fifth modification of the second embodiment; ). FIG. 36 is a perspective view showing a substrate carrying-in hand according to a sixth modified example of the second embodiment. 37 (a) and 37 (b) are diagrams illustrating a configuration example of a substrate carry-in hand. FIG. 38 is a diagram for explaining a configuration example of a substrate transfer section. FIG. 39 is a diagram for explaining a configuration example of a fixed plate. 40 (a) and 40 (b) are a plan view and a side view, respectively, showing a configuration of a platform device according to the first embodiment and the second embodiment and a modification thereof. Fig. 41 (a) is a plan view showing another example of the platform device, and Figs. 41 (b) and 41 (c) are A-A sectional views of Fig. 41 (a). Fig. 42 (a) is a plan view showing another example of the platform device, and Fig. 42 (b) is a sectional view taken along the line A-A of Fig. 42 (a). 43 (a) to 43 (c) are side views for explaining substrate placement on the stage device shown in Figs. 42 (a) and 42 (b).

Claims (33)

A substrate transporting device transports a substrate to a holding surface of a holding device, and includes: a first holding portion that holds the substrate above the holding device; a second holding portion that holds the substrate held by the first holding portion A part of the substrate; and a driving section that causes the first holding section to retract from above the holding device, and causes the holding device, the second holding section, and the first holding section to move along the first holding section; The holding surface is relatively moved in a predetermined direction; and in the relative movement of the first holding portion to the driving portion, the position of the substrate held by the first holding portion in the substrate in the up-down direction is approached The manner of the holding device holds the substrate. The substrate conveying device according to claim 1, wherein the first holding portion holds a distance between the part of the substrate and the holding surface longer than the other portion of the substrate and the holding surface. A shorter distance of the substrate. The substrate conveying device according to claim 1 or claim 2, wherein the driving portion causes the first holding portion to be held from the second holding portion with respect to the holding device and the second holding portion. One end side of the holding device that partially conveys a part of the substrate is relatively moved toward the other end side of the holding device. The substrate conveying device according to any one of claims 1 to 3, wherein the driving portion moves the first holding portion relative to the holding device above the holding device. . According to the substrate conveying device according to item 4 of the scope of patent application, the driving unit moves the first holding unit from above the holding unit in a state where the second holding unit holds a part of the substrate. The retreat mode moves to a position that does not overlap the holding device in the up-down direction. The substrate conveying device according to claim 4 or claim 5, wherein the holding device holds the released substrate by the first holding portion by the relative movement of the driving portion. region. The substrate conveying device according to any one of claims 4 to 6, wherein the first holding portion holds the substrate through the first portion during the relative movement of the driving portion. The substrate in which the position of the region held by the holding portion changes in the predetermined direction. The substrate conveying device according to any one of claims 1 to 7, wherein the second holding portion is provided on the holding device. The substrate conveying device according to item 8 of the scope of patent application, wherein the second holding portion is provided on the holding surface. The substrate conveying device according to any one of claims 1 to 9, wherein the second holding portion adjusts the substrate relative to the holding device in a state of holding a part of the substrate. s position. The substrate conveying device according to any one of claims 1 to 10 of the scope of patent application, comprising a carrying device for carrying out other substrates different from the substrate from the holding device, and the carrying device is driven by the driving device. During the relative movement of the holding device and the second holding portion and the first holding portion with the holding device and the second holding portion, the other substrate is carried out. The substrate conveying device according to item 11 of the scope of patent application, wherein the unloading device moves the other substrate to a position between the first holding portion and the holding device in the vertical direction. The substrate conveying device according to claim 11 or claim 12, wherein the unloading device is provided on the first holding portion, and the driving portion holds the first holding portion relative to the second holding portion. The part and the holding device are relatively moved, and the carrying-out device is moved. The substrate conveying device according to any one of claims 11 to 13, wherein the holding device has a suction hole for supplying a gas that floats the other substrate, and the carrying device is used for the The other substrate floating on the holding device moves along the holding surface of the holding device. An exposure device includes: the substrate conveying device according to any one of claims 1 to 14 of the scope of patent application; and an optical system that irradiates the substrate with the energy beam to the substrate conveyed to the holding device, The substrate is exposed. The exposure apparatus according to item 15 of the scope of patent application, wherein a length or a diagonal length of at least one side of the substrate is 500 mm or more, and is used for a flat panel display. A flat panel display manufacturing method includes: exposing a substrate using the exposure device described in item 16 of the scope of patent application; and developing the exposed substrate. A method for manufacturing a device, comprising: exposing a substrate using an exposure device according to item 15 or 16 of the scope of patent application; and developing the exposed substrate. A substrate transfer method, which transfers a substrate to a holding surface of a holding device, and includes: holding a substrate by a first holding portion and a second holding portion above the holding device; and using the first holding portion to hold the substrate by itself. In the manner in which the holding device retracts upward, the holding device, the second holding portion, and the first holding portion are relatively moved in a predetermined direction along the holding surface; and by the holding, In the relative movement, the first holding portion holds the substrate such that a position of the substrate held by the first holding portion in the up-down direction approaches the holding device. The substrate conveyance method according to claim 19, wherein the distance between the part of the substrate and the holding surface is greater than the distance between the other part of the substrate and the holding by the holding. The substrate in a state where the surface distance is shorter is held by the first holding portion. The substrate conveying method according to claim 19 or claim 20, wherein the first holding portion is moved relative to the holding device and the second holding portion by the relative movement. One end side of the holding device that the second holding portion conveys a part of the substrate is relatively moved to the other end side of the holding device. The substrate conveyance method according to any one of claims 19 to 21, wherein the first holding portion is caused to move relative to the holding device above the holding device by the relative movement. The device moves relatively. The substrate conveyance method according to item 22 of the scope of patent application, wherein the first holding portion is allowed to move freely while the second holding portion holds a part of the substrate by the relative movement. The upward retreating manner of the holding device is moved to a position that does not overlap the holding device in the up-down direction. The substrate conveyance method according to claim 22 or 23, wherein the area of the substrate whose release is held by the first holding portion is held by the holding and the relative holding is held by the relative movement. Mentioned holding section. The substrate conveying method according to any one of claims 22 to 24 in the scope of patent application, wherein the relative holding is performed by the holding and the substrate is held by the first holding portion during the relative movement. In a manner of changing the position in the predetermined direction, the substrate is held by the first holding portion. The substrate transport method according to any one of claims 19 to 25, including adjusting a position of the substrate with respect to the holding device in a state where the second holding portion holds a part of the substrate. position. The substrate conveyance method according to any one of claims 19 to 26 in the scope of patent application, which comprises moving other substrates different from the substrates from the holding device, and by carrying out the During the relative movement of the holding device and the second holding portion and the first holding portion, the other substrate is carried out. The substrate conveyance method according to item 27 of the scope of patent application, wherein the other substrate is moved to a position between the first holding portion and the holding device in the vertical direction by the carrying out. The substrate conveying method according to claim 27 or claim 28, wherein the first holding portion is moved relative to the second holding portion and the holding device by the relative movement, And the other substrate is carried out. The substrate conveyance method according to any one of claims 27 to 29 in the scope of patent application, wherein the other substrates floating on the holding device are moved along the holding device by the carrying out. The holding surface moves. An exposure method, comprising: transferring the substrate to the holding device by the substrate transfer method according to any one of claims 19 to 30 in a patent application scope; and irradiating the substrate with an energy beam, The substrate is exposed. A method for manufacturing a flat panel display includes: exposing the substrate using the exposure method described in item 30 of the scope of patent application; and developing the exposed substrate. A component manufacturing method includes: exposing the substrate using the exposure method described in item 31 of the scope of patent application; and developing the substrate after the exposure.