TW201918498A - Moisture-curable resin composition and assembled component - Google Patents

Abstract

The invention provides a moisture-curable resin composition which highly rapidly cures with moisture. Also provided is an assembled component including a cured object obtained from the moisture-curable resin composition. A moisture-curable resin composition contains a moisture-curable urethane resin. The moisture-curable resin composition comprises: an alkoxysilyl-containing moisture-curable urethane resin and/or an alkoxysilyl-containing compound that is not a moisture-curable urethane resin; a moisture-curing acceleration catalyst; and a silanol condensation catalyst.

Description

   Moisture hardening resin composition and combined parts   

The present invention relates to a moisture-curable resin composition which is excellent in rapid curing properties during moisture curing. The present invention also relates to a combined component of a hardened body having the moisture-curable resin composition.

In recent years, liquid crystal display elements, organic EL display elements, and the like have been widely used as display elements having characteristics such as thinness, light weight, and low power consumption. These display elements generally use a photocurable resin composition for sealing liquid crystal or a light-emitting layer, bonding various components such as a substrate, an optical film, and a protective film.

However, with the miniaturization of a display element, a photocurable resin composition may be applied to a portion where light does not sufficiently reach, and as a result, the photocurable resin composition applied to a portion where light does not reach may harden. It becomes insufficient. Therefore, a photothermosetting resin composition is also used as a resin composition that can be sufficiently cured even when it is applied to a portion where light does not reach, and is cured by light and heat, but it is heated at high temperature. It may cause adverse effects on components and the like.

Furthermore, in recent years, electronic components such as semiconductor wafers have been required to be highly integrated and miniaturized. For example, a plurality of thinner semiconductor wafers are bonded through an adhesive layer to form a laminated body of the semiconductor wafer. Such a laminated body of a semiconductor wafer is manufactured, for example, by a method of applying an adhesive on one semiconductor wafer, laminating another semiconductor wafer through the adhesive, and then curing the adhesive; A method of filling adhesive between semiconductor wafers at a certain interval and then curing the adhesive.

As an adhesive used for such electronic components, for example, Patent Document 1 discloses a thermosetting adhesive containing an epoxy compound having a number average molecular weight of 600 to 1,000. However, the thermosetting adhesive as disclosed in Patent Document 1 is not suitable for bonding electronic parts that may be damaged by heat.

As a method for curing the resin composition without heating at a high temperature, a method using a moisture-curable resin composition is being studied. For example, Patent Document 2 discloses a moisture-curable resin composition that is crosslinked and cured by reacting an isocyanate group in a resin with moisture (water) in the air or an adherend.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-178342

[Patent Document 2] Japanese Patent Laid-Open No. 2002-212534

An object of the present invention is to provide a moisture-curable resin composition excellent in rapid curing properties during moisture curing. The present invention also provides an assembled component having a cured body of the moisture-curable resin composition.

The present invention is a moisture-curable resin composition containing a moisture-curable urethane resin and an alkoxy silicon group-containing compound, a moisture-hardening accelerator, and a silanol condensation catalyst. The compound containing an alkoxysilyl group is a moisture-curable amine ester resin having an alkoxysilyl group and / or a non-moisture-curable amine ester resin.

The present invention is described in detail below.

The present inventors have studied moisture-curable resin compositions containing a moisture-curable urethane resin to improve the workability, etc., and have studied the incorporation of a moisture-curing accelerator to improve the rapid curing properties during moisture-curing. . However, it has been confirmed that although a certain degree of rapid hardenability improvement effect can be seen by incorporating a moisture hardening accelerator, it is not sufficient. If further improvement of the fast hardenability during moisture hardening is expected, Increasing the blending amount of the moisture hardening accelerating catalyst will decrease the initial adhesion. The present inventors believe that the reason for the decrease in initial adhesion is that although the moisture hardening accelerator promotes the moisture hardening reaction of the moisture hardening amine ester resin, the reaction with the interface of the bonding substrate becomes insufficient. As a result, It becomes prone to interface destruction.

Therefore, the inventors of the present inventors made further efforts, and as a result, found that by mixing a moisture-hardening resin composition containing a moisture-hardening amine ester resin and a moisture-hardening accelerating catalyst with an alkoxysilyl group-containing resin The compound is used as the moisture-curable urethane resin and / or other components, and further, a silanol condensation catalyst that acts on these alkoxysilyl groups is blended to obtain a moisture having excellent rapid curing properties during moisture curing. A curable resin composition; thus completing the present invention.

The moisture-curable resin composition of the present invention contains a moisture-curable urethane resin.

The moisture-curable urethane resin has an isocyanate group in the molecule. The isocyanate group in the molecule reacts with moisture in the air or the adherend, whereby the moisture-curable amine ester resin is cured. The moisture-curable urethane resin preferably has an isocyanate group at a molecular terminal. Further, the moisture-curable amine ester resin may further have an amine ester bond in the molecule.

The moisture-curable amine ester resin may have only one isocyanate group in one molecule, or may have two or more.

The moisture-curable amine ester resin can be obtained by reacting a polyol compound having two or more hydroxyl groups in one molecule and a polyisocyanate compound having two or more isocyanate groups in one molecule. obtain.

The reaction between the above-mentioned polyol compound and polyisocyanate compound is usually based on the molar ratio of hydroxyl group (OH) in the polyol compound to isocyanate group (NCO) in the polyisocyanate compound as [NCO] / [OH] = The range is from 2.0 to 2.5.

As the polyol compound used as a raw material of the moisture-curable urethane resin, a well-known polyol compound generally used in the production of polyurethane can be used, and examples thereof include polyester polyol, polyether polyol, and polyalkylene polyol. Alcohols, polycarbonate polyols, etc. These polyol compounds may be used alone or in combination of two or more kinds.

Examples of the polyester polyol include a polyester polyol obtained by a reaction of a polycarboxylic acid and a polyol, a polyε-caprolactone polyol obtained by ring-opening polymerization of ε-caprolactone, and the like. .

Examples of the polybasic acid used as a raw material of the polyester polyol include terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, succinic acid, and pentylene. Diacid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, decamethylene-dicarboxylic acid, dodecamethylene dicarboxylic acid, and the like.

Examples of the polyol that serves as a raw material for the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, and 1,5-pentanediol. , 1,6-hexanediol, diethylene glycol, cyclohexanediol and the like.

Examples of the polyether polyol include ethylene glycol, propylene glycol, ring-opening polymer of tetrahydrofuran, ring-opening polymer of 3-methyltetrahydrofuran, and random copolymers or block copolymers of these or their derivatives. And bisphenol-type polyoxyalkylene modifiers.

The above bisphenol-type polyoxyalkylene modification system allows alkylene oxides (such as ethylene oxide, propylene oxide, butylene oxide, isobutylene oxide, etc.) to be carried out on the active hydrogen portion of the bisphenol-type molecular skeleton. The polyether polyol obtained by the addition reaction may be a random copolymer or a block copolymer. The bisphenol-type polyoxyalkylene modified body is preferably one or two or more kinds of alkylene oxides added to both ends of the bisphenol-type molecular skeleton. The bisphenol type is not particularly limited, and examples thereof include A type, F type, and S type, and a bisphenol A type is preferred.

Examples of the polyalkylene polyol include polybutadiene polyol, hydrogenated polybutadiene polyol, and hydrogenated polyisoprene polyol.

Examples of the polycarbonate polyol include polyhexamethylene carbonate polyol, polycyclohexanedimethylene carbonate polyol, and the like.

Examples of the polyisocyanate compound used as a raw material of the moisture-curable urethane resin include diphenylmethane diisocyanate (MDI), liquid modification of diphenylmethane diisocyanate, polymerized MDI, toluene diisocyanate, Naphthalene-1,5-diisocyanate and the like. Among these, diphenylmethane diisocyanate and a modified product thereof are preferred in terms of low vapor pressure and toxicity, and easy handling. These polyisocyanate compounds may be used alone or in combination of two or more kinds.

The moisture-curable urethane resin is preferably obtained by using a polyol compound having a structure represented by the following formula (1). By using a polyhydric alcohol compound having a structure represented by the following formula (1), a composition having excellent adhesion and a hardened material having good ductility and good ductility can be obtained, which is in phase with a radical polymerizable compound to be described later. Capacitive.

Among them, a polyether polyol composed of propylene glycol, a ring-opening polymerization compound of a tetrahydrofuran (THF) compound, or a ring-opening polymerization compound of a tetrahydrofuran compound having a substituent such as a methyl group is preferably used.

In formula (1), R represents hydrogen, methyl, or ethyl, l is an integer of 0 to 5, m is an integer of 1 to 500, and n is an integer of 1 to 10. 1 is preferably 0 to 4, m is preferably 50 to 200, and n is preferably 1 to 5.

Furthermore, the case where l is 0 refers to the case where the carbon bonded to R is directly bonded to oxygen.

When the moisture-curable resin composition of the present invention does not contain the "alkoxysilyl-containing compound of a non-moisture-curable amine ester resin" described later, the moisture-curable resin composition of the present invention A moisture-curable urethane resin having an alkoxysilyl group must be contained as the moisture-curable urethane resin.

Examples of the alkoxysilyl group of the moisture-curable urethane resin having an alkoxysilyl group include trimethoxysilyl group, methyldimethoxysilyl group, and dimethylmethoxysilyl group. Methyl, triethoxysilyl, methyldiethoxysilyl, methyldimethoxyethoxysilyl, and the like. The moisture-curable amine ester resin having the above-mentioned alkoxysilyl group may have the above-mentioned alkoxysilyl group at the end of the main chain of the molecule, and may also have the above-mentioned alkoxysilyl group in the side chain of the molecule, but it is preferred For the end of the main chain of the molecule.

In a case where the moisture-curable resin composition of the present invention contains the moisture-curable amine ester resin having an alkoxysilyl group, 100 parts by weight of the moisture-curable amine ester resin has the alkoxysilicone. The lower limit of the content of the moisture-curable urethane resin of the base is preferably 5 parts by weight, and the upper limit is preferably 70 parts by weight. When the content of the moisture-curable urethane resin having the above-mentioned alkoxysilyl group is within this range, the effect of "both the rapid curing property during moisture curing and the adhesiveness after moisture curing" becomes more excellent. . A more preferable lower limit of the content of the moisture-curable urethane resin having an alkoxysilyl group is 20 parts by weight, and a more preferable upper limit is 60 parts by weight.

Further, the moisture-curable urethane resin may have a radical polymerizable functional group.

As the radical polymerizable functional group that the moisture-curable amine ester resin may have, a group having an unsaturated double bond is preferable, and in particular, a (meth) acrylfluorenyl group is more preferable in terms of reactivity.

The moisture-curable urethane resin having a radical polymerizable functional group is not included in a radical-polymerizable compound described below, and is used as a moisture-curable urethane resin.

The weight average molecular weight of the moisture-curable amine ester resin is not particularly limited, and a preferred lower limit is 800 and a preferred upper limit is 10,000. When the weight-average molecular weight of the moisture-curable urethane resin is within this range, the obtained moisture-curable resin composition becomes a crosslinked density that does not become excessively high and is more flexible when cured, and becomes Those with better coating properties. A more preferable lower limit of the weight-average molecular weight of the moisture-curable amine ester resin is 2000, a more preferable upper limit is 8000, a more preferable lower limit is 2500, and a more preferable upper limit is 6000.

In addition, in this specification, the said weight average molecular weight is a value measured by gel permeation chromatography (GPC), and calculated | required by polystyrene conversion. Examples of the column used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko). Examples of the solvent used in GPC include tetrahydrofuran.

A preferable lower limit of the content of the moisture-curable amine ester resin in 100 parts by weight of the moisture-curable resin composition of the present invention is 20 parts by weight, and a preferable upper limit is 90 parts by weight. When the content of the moisture-curable resin is within this range, the obtained moisture-curable resin composition becomes one that maintains excellent weatherability or the flexibility of the cured product and is more excellent in moisture-curability. A more preferable lower limit of the content of the moisture-curable amine ester resin is 30 parts by weight, and a more preferable upper limit is 75 parts by weight.

The moisture-curable resin composition of the present invention contains a moisture-curing promoting catalyst.

As said moisture hardening promotion catalyst, an amine catalyst is preferable at the point which is excellent in the effect which accelerates the moisture hardening reaction of the said moisture hardening amine ester resin. Among them, a tertiary amine catalyst is more preferable, and a tertiary amine catalyst having a morpholine skeleton is more preferable.

Examples of the amine catalyst include morpholine, 4-morpholinyl-1-cyclohexene, 1-morpholinyl-1-cyclopentene, and 2- (N-morpholinyl) ethanesulfonic acid. , 2,2'-dimorpholinyl diethyl ether, triethylamine, bis (2,6-dimethylmorpholinylethyl) ether, bis (2,6-diethylmorpholinylethyl) ether , 1,4-diazabicyclo [2.2.2] octane, 2,6,7-trimethyl-1,4-diazabicyclo [2.2.2] octane, etc.

With respect to 100 parts by weight of the moisture-curable amine ester resin, a preferable lower limit of the content of the moisture-hardening accelerating catalyst is 0.05 parts by weight, and a preferable upper limit is 3 parts by weight. When the content of the moisture-hardening-promoting catalyst is within this range, the effect becomes more excellent in that the moisture-hardening-type resin composition is promoted in a state where the excellent storage stability of the obtained moisture-hardening-type resin composition is maintained. Moisture hardening reaction of urethane resin. A more preferable lower limit of the content of the moisture hardening-promoting catalyst is 0.1 part by weight, and a more preferable upper limit is 2 parts by weight.

Examples of the "alkoxysilyl group-containing compound containing a non-moisture-curable urethane resin" include the same ones as the above-mentioned moisture-curable urethane resin having an alkoxysilyl group. By. The alkoxysilyl group-containing compound of the non-moisture-curable amine ester resin may have the alkoxysilyl group at the end of the main chain of the molecule, or may have the alkoxysilyl group in the side chain of the molecule, However, it is preferably provided at the end of the main chain of the molecule.

Examples of the alkoxysilyl group-containing compound of the non-moisture-curable urethane resin include a silane coupling agent.

Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and 3-glycidyloxy. Propylmethyldimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxy Silane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methylpropylene Ethoxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-propenyloxypropyltrimethoxysilane, N-2- (aminoethyl Group) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethylbutylene) propylamine, N-phenyl-3-aminopropyltrimethyl Oxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxy Alkane, 3-ureidopropyltriethoxysilan, 3-mercaptopropyltriethoxysilan, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatopropyl Triethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltrimethoxysilane Ethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane, trifluoropropyltrimethoxysilane, etc.

When the moisture-curable resin composition of the present invention contains the "alkoxysilyl-containing compound of the above-mentioned non-moisture-curable polyester resin", 100 parts by weight of the moisture-curable resin composition of the present invention, The preferable lower limit of the content of the alkoxysilyl-containing compound of the non-moisture-curable urethane resin is 0.05 parts by weight, and the preferable upper limit is 3 parts by weight. The content of the alkoxysilyl-based compound is within this range, and the obtained moisture-curable resin composition is more excellent in the effect of "both the rapid curing property during moisture curing and the adhesiveness after moisture curing". The more preferable lower limit of the content of the alkoxysilyl group-containing compound of the non-moisture-curable amine ester resin is 0.1 part by weight, and the more preferable upper limit is 2 parts by weight.

The moisture-curable resin composition of the present invention contains a silanol condensation catalyst.

As the silanol condensation catalyst, an organometallic catalyst is preferred.

Examples of the organic metal catalyst include organic titanium compounds, organic zirconium compounds, organic zinc compounds, organic tin compounds, organic aluminum compounds, and organic bismuth compounds. Among them, an organic titanium compound and / or an organic zirconium compound are preferable, and an organic zirconium compound is more preferable in that the obtained moisture-curable resin composition is more excellent in rapid curing properties during moisture curing.

Examples of the organic titanium compound include tetraisopropyl titanate, tetra-n-butyl titanate, butyl titanate dimer, tetraoctyl titanate, tetra-third butyl titanate, and tetra-hard titanate. Fatty esters, titanium acetate, etc.

Examples of the organic zirconium compound include n-propyl zirconate, zirconium ethyl acetate, zirconium tetraacetamidine, and the like.

In 100 parts by weight of the moisture-curable resin composition of the present invention, a preferable lower limit of the content of the silanol condensation catalyst is 0.01 part by weight, and a preferable upper limit is 3 parts by weight. When the content of the silanol condensation catalyst is within this range, the obtained moisture-curable resin composition becomes one that maintains excellent storage stability and is more excellent in rapid curing properties during moisture curing. A more preferable lower limit of the content of the silanol condensation catalyst is 0.05 part by weight, a more preferable upper limit is 2 parts by weight, and a more preferable lower limit is 0.1 part by weight.

The moisture-curable resin composition of the present invention may contain a radical polymerizable compound and a photo radical polymerization initiator.

By containing the above-mentioned radical polymerizable compound and the above-mentioned photoradical polymerization initiator, the moisture-curable resin composition of the present invention can be used as a light-moisture-curable resin composition having photo-curability and moisture-curability. It is particularly preferably used for a sealant for a display element.

The radical polymerizable compound is not particularly limited as long as it is a photopolymerizable radical polymerizable compound, and is a compound having a radical polymerizable functional group in the molecule, and preferably has an unsaturated group. The compound having a double bond as a radical polymerizable functional group is particularly preferably a compound having a (meth) acrylfluorenyl group (hereinafter also referred to as "(meth) acrylic compound") in terms of reactivity.

In addition, in the present specification, the "(meth) acrylfluorenyl" means acrylfluorenyl or methacrylfluorenyl, and the "(meth) acryl" refers to acrylic acid or methacrylic acid.

Examples of the (meth) acrylic compound include a (meth) acrylic acid ester compound obtained by reacting a compound having a hydroxyl group with (meth) acrylic acid, and a (meth) acrylic acid and epoxy resin. An epoxy (meth) acrylate obtained by reacting a compound, an amine (meth) acrylate obtained by reacting a (meth) acrylic acid derivative having a hydroxyl group with an isocyanate compound, and the like.

In addition, in this specification, the "(meth) acrylate" means an acrylate or a methacrylate. In addition, all the isocyanate groups of the isocyanate compound that is the raw material of the amine (meth) acrylate are used to form an amine ester bond, and the methacrylate (meth) acrylate does not have a residual isocyanate group.

Examples of the monofunctional compound in the (meth) acrylate compound include phthalimide acrylates such as N-acryloxyethylhexahydrophthalimide, and various fluorenes. Imine (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate , Third butyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, Isodecyl (meth) acrylate, lauryl (meth) acrylate, isomyristyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acrylic acid Isoamyl ester, dicyclopentenyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (meth) acrylic acid 2-hydroxybutyl ester, 4-hydroxybutyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2- (meth) acrylate Butoxyethyl, methoxyethyl Glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, ethyl carbitol (meth) acrylate, tetrahydrofuran methyl (meth) acrylate, (meth) acrylic acid 2 -Phenoxyethyl ester, phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate , 2,2,3,3-tetrafluoropropyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, (formyl) Diethylaminoethyl acrylate, 2- (meth) acryloxyethyl succinic acid, 2- (meth) acryloxyethyl hexahydrophthalic acid, phthalic acid 2- (meth) acryloxyethyl-2-hydroxypropyl, glycidyl (meth) acrylate, 2- (meth) acryloxyethyl phosphate, and the like.

Examples of the bifunctional compound in the (meth) acrylate compound include 1,3-butanediol di (meth) acrylate and 1,4-butanediol di (meth) acrylate. , 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, 2-n-butyl 2-ethyl-1,3-propanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (methyl) Base) acrylate, polyethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethylene oxide Alkane addition bisphenol A di (meth) acrylate, propylene oxide addition bisphenol A di (meth) acrylate, ethylene oxide addition bisphenol F di (meth) acrylate, bis (methyl) Group) Dimethylol dicyclopentadiene acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide modified isotricyanate di (meth) acrylate, (meth) acrylic acid 2-Hydroxy-3- (meth) propylene ethoxypropyl ester, carbonate diol di (meth) propylene Ester, polyether diol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone diol di (meth) acrylate, polybutadiene diol di (meth) ) Acrylate, etc.

In addition, examples of the tri- or more functional group in the (meth) acrylate compound include trimethylolpropane tri (meth) acrylate, and ethylene oxide-added trimethylolpropane tri (methyl) ) Acrylate, propylene oxide addition trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, neopentaerythritol tri (meth) acrylic acid Ester, ethylene oxide addition isotricyanate tri (meth) acrylate, glycerol tri (meth) acrylate, propylene oxide addition glycerol tri (meth) acrylate, phosphate tri (meth) acrylate Acrylic ethoxyethyl, di-trimethylolpropane tetra (meth) acrylate, neopentaerythritol tetra (meth) acrylate, dinepentaerythritol penta (meth) acrylate, dineopentyl Tetraol hexa (meth) acrylate and the like.

Examples of the epoxy (meth) acrylate include those obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a basic catalyst in accordance with a usual method.

Examples of the epoxy compound used as a raw material for synthesizing the aforementioned epoxy (meth) acrylate include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, 2 , 2'-diallyl bisphenol A epoxy resin, hydrogenated bisphenol epoxy resin, propylene oxide addition bisphenol A epoxy resin, resorcinol epoxy resin, biphenyl ring Oxygen resin, thioether type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin Resin, dicyclopentadiene novolac epoxy resin, biphenol novolac epoxy resin, naphthol novolac epoxy resin, glycidylamine epoxy resin, alkyl polyol epoxy resin, rubber Modified epoxy resin, glycidyl ester compound, bisphenol A episulfide resin, etc.

As marketers of the aforementioned epoxy (meth) acrylates, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3703, EBECRYL3800, EBECRYL6040, and EBECRYD Rcel63-182 ( (Manufactured by the company), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin Nakamura Chemical Industry Co., Ltd.), Epoxy Ester M-600A, Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA (all manufactured by Kyoeisha Chemical Co., Ltd.), Denacol Acrylate DA-141, Denacol Acrylate DA-314, Denacol Acrylate DA-911 (all manufactured by Nagase Kasei Corporation), and the like.

The (meth) acrylic acid amine ester can be obtained, for example, by reacting a (meth) acrylic acid derivative having a hydroxyl group with an isocyanate compound in the presence of a catalyst-based tin-based compound.

Examples of the isocyanate compound used as a raw material of the (meth) acrylic acid amine ester include isophorone diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, hexamethylene diisocyanate, and the like. Trimethylhexamethylene diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornanediol diisocyanate, methylene Aniline diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanatophenyl) thiophosphate, tetramethylxylylene Diisocyanate, 1,6,11-undecane triisocyanate, etc.

As the isocyanate compound, for example, ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone di may be used. A chain-extended isocyanate compound obtained by reacting a polyol such as an alcohol with an excessive amount of an isocyanate compound.

Examples of the (meth) acrylic acid derivative having a hydroxyl group as a raw material of the (meth) acrylic acid amine ester include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, and 1, Mono (meth) acrylates of diols such as 4-butanediol and polyethylene glycol, mono (meth) acrylates of diols such as trimethylolethane, trimethylolpropane, glycerol, or Di (meth) acrylate, epoxy (meth) acrylate such as bisphenol A type epoxy (meth) acrylate, and the like.

Examples of commercially available amine (meth) acrylates include M-1100, M-1200, M-1210, and M-1600 (all manufactured by Toa Kosei), EBCRYL230, EBCRYL270, EBCRYL4858, and EBCRYL8402. , EBECRYL8411, EBECRYL8412, EBECRYL8413, EBECRYL8804, EBECRYL8803, EBECRYL8807, EBECRYL9260, EBECRYL1290, EBECRYL5129, EBECRYL4842, EBECRYL210, EBECRYL4827, EBECRYL6700, ECECRYLex-220, EBECRYLHRM2K, KEBRMRYLMX2, KEB , Artresin UN-9000A, Artresin UN-7100, Artresin UN-1255, Artresin UN-330, Artresin UN-3320HB, Artresin UN-1200TPK, Artresin SH-500B (all manufactured by Kogen Industrial Co., Ltd.), U-2HA, U- 2PHA, U-3HA, U-4HA, U-6H, U-6LPA, U-6HA, U-10H, U-15HA, U-122A, U-122P, U-108, U-108A, U-324A, U-340A, U-340P, U-1084A, U-2061BA, UA-340P, UA-4100, UA-4000, UA-4200, UA-4400, UA-5201P, UA-7100, UA-7200, UA- W2A (all manufactured by Shin Nakamura Chemical Industry Co., Ltd.), AI-600, AH-600, AT-600, UA-101I, UA-101T, UA-306H, UA-3061 UA-306T (both manufactured by Kyoeisha Chemical Company) and so on.

Moreover, other radically polymerizable compounds other than the above may be used appropriately.

Examples of the other radically polymerizable compound include N, N-dimethyl (meth) acrylamide, N- (meth) acrylfluorenylmorpholine, and N-hydroxyethyl (methyl) Acrylamide, N, N-diethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide And other (meth) acrylamide compounds, vinyl compounds such as styrene, α-methylstyrene, N-vinyl-2-pyrrolidone, and N-vinyl-ε-caprolactam.

It is preferable that the said radically polymerizable compound contains a monofunctional radically polymerizable compound and a polyfunctional radically polymerizable compound from a viewpoint of adjusting hardenability. By containing the above-mentioned monofunctional radically polymerizable compound and the above-mentioned polyfunctional radically polymerizable compound, the obtained moisture-curable resin composition becomes more excellent in curability and viscosity. Among these, it is preferable to use amine (meth) acrylate in combination with the monofunctional radical polymerizable compound as the polyfunctional radical polymerizable compound. The polyfunctional radically polymerizable compound is preferably difunctional or trifunctional, and more preferably difunctional.

When the said radically polymerizable compound contains the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound, compared with the total of the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound 100 parts by weight, a preferred lower limit of the content of the polyfunctional radical polymerizable compound is 2 parts by weight, and a preferred upper limit is 45 parts by weight. When the content of the above-mentioned polyfunctional radically polymerizable compound is within this range, the obtained moisture-curable resin composition becomes more excellent in curability and viscosity. A more preferable lower limit of the content of the polyfunctional radical polymerizable compound is 5 parts by weight, and a more preferable upper limit is 35 parts by weight.

In 100 parts by weight of the moisture-curable resin composition of the present invention, a preferable lower limit of the content of the radical polymerizable compound is 10 parts by weight, and a preferable upper limit is 80 parts by weight. When the content of the radical polymerizable compound is within this range, the obtained moisture-curable resin composition becomes more excellent in both photo-curability and moisture-curability. A more preferable lower limit of the content of the radical polymerizable compound is 30 parts by weight, and a more preferable upper limit is 60 parts by weight.

Examples of the photoradical polymerization initiator include benzophenone-based compounds, acetophenone-based compounds, fluorenylphosphine oxide-based compounds, titanocene-based compounds, oxime ester compounds, benzoin ether-based compounds, 9 -Oxysulfur (thioxanthone), etc.

Examples of commercially available photoradical polymerization initiators include: IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, Lucirin TPO (all manufactured by BASF), benzoin Ether, benzoin ether, benzoin isopropyl ether (all manufactured by Tokyo Chemical Industry Co., Ltd.), and the like.

The preferable lower limit of the content of the photo-radical polymerization initiator relative to 100 parts by weight of the radical polymerizable compound is 0.01 parts by weight, and the preferable upper limit is 10 parts by weight. When the content of the photo-radical polymerization initiator is within this range, the obtained moisture-curable resin composition becomes one having more excellent photo-curability and storage stability. A more preferable lower limit of the content of the photoradical polymerization initiator is 0.1 part by weight, and a more preferable upper limit is 5 parts by weight.

The moisture-curable resin composition of the present invention preferably contains a filler.

By containing the above-mentioned filler, the moisture-curable resin composition of the present invention has good shake resistance and can sufficiently maintain the shape after coating.

Regarding the filler, a preferred lower limit of the primary particle diameter is 1 nm, and a preferred upper limit is 50 nm. When the primary particle diameter of the filler is within this range, the obtained moisture-curable resin composition becomes more excellent in coatability and shape retention after coating, and is particularly suitable for display elements with narrow edge designs. . The more preferable lower limit of the primary particle diameter of the filler is 5 nm, the more preferable upper limit is 30 nm, the more preferable lower limit is 10 nm, and the more preferable upper limit is 20 nm.

The primary particle diameter of the filler can be measured by dispersing the filler in a solvent (water, organic solvent, etc.) using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS).

In addition, the filler mentioned above may exist in the form of secondary particles (composed of a plurality of primary particles) in the moisture-curable resin composition of the present invention, and a preferable lower limit of the particle size of such secondary particles It is 5 nm, a preferable upper limit is 500 nm, a more preferable lower limit is 10 nm, and a more preferable upper limit is 100 nm. The particle diameter of the secondary particles of the filler can be measured by observing the moisture-curable resin composition of the present invention or a cured product thereof using a transmission electron microscope (TEM).

The filler is preferably an inorganic filler, and examples thereof include silicon dioxide, talc, titanium oxide, zinc oxide, and calcium carbonate. Among them, silicon dioxide is preferred in that the obtained moisture-curable resin composition is excellent in ultraviolet light transmittance. These fillers may be used alone or in combination of two or more kinds.

The filler is preferably subjected to a hydrophobic surface treatment. By the above-mentioned hydrophobic surface treatment, the obtained moisture-curable resin composition becomes more excellent in shape retention after coating.

Examples of the hydrophobic surface treatment include silicidation treatment, alkylation treatment, and epoxidation treatment. Among them, in terms of the effect of improving shape retention, a silicidation treatment is preferred, and a trimethylsilicidation treatment is more preferred.

Examples of the method for the hydrophobic surface treatment of the filler include a method of treating the surface of the filler with a surface treatment agent.

Specifically, for example, the above-mentioned trimethyl silylated silicon dioxide can be produced by, for example, the following methods: The silicon dioxide is synthesized by a method such as a sol-gel method, and the hexamethylene is sprayed while the silicon dioxide is flowing Method for surface treatment agents such as disilazane; after adding silicon dioxide to an organic solvent such as alcohol and toluene, and then adding a surface treatment agent such as hexamethyldisilazane and water, the water and the organic solvent are made by an evaporator Evaporation drying method.

In 100 parts by weight of the moisture-curable resin composition of the present invention, a preferable lower limit of the content of the filler is 1 part by weight, and a preferable upper limit is 20 parts by weight. When the content of the filler is within this range, the obtained moisture-curable resin composition becomes more excellent in coatability and shape retention after coating. The more preferable lower limit of the content of the filler is 2 parts by weight, the more preferable upper limit is 15 parts by weight, the more preferable lower limit is 3 parts by weight, the more preferable upper limit is 10 parts by weight, and the more preferable lower limit is 4 parts by weight.

The moisture-curable resin composition of the present invention may contain a light-shielding agent.

By containing the above-mentioned light-shielding agent, the moisture-curable resin composition of the present invention is excellent in light-shielding properties, and can prevent light leakage when used in a display device, for example. In addition, a display element made using the moisture-curable resin composition of the present invention in which the above-mentioned light-shielding agent is blended has the following properties: the moisture-curable resin composition has sufficient light-shielding properties, and the light is not leaked and has a relatively low High contrast and excellent image display quality.

In addition, in the present specification, the "shielding agent" refers to a material having the ability to make light in the visible light region difficult to penetrate. As long as the materials listed as the electromagnetic wave shielding material have such ability, the effects as the light-shielding agent can also be exhibited.

Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. The above-mentioned light-shielding agent may not be black. As long as the material is capable of making it difficult to penetrate light in the visible light region, materials such as silicon dioxide, talc, and titanium oxide as fillers are also included in the light-shielding agent. . Among these, titanium black is preferred.

The titanium black is a substance that has a higher light transmittance to the vicinity of the ultraviolet region, particularly to light having a wavelength of 370 to 450 nm, compared to the average light transmittance to light having a wavelength of 300 to 800 nm. That is, the above-mentioned titanium black is a light-shielding agent having properties such that light-shielding properties are provided to the moisture-curable resin composition of the present invention by sufficiently shielding light of wavelengths in the visible light region, and on the other hand, wavelengths in the vicinity of the ultraviolet region are reduced. Light penetrates. Therefore, by using light having a wavelength (370 to 450 nm) that can increase the light transmittance of the titanium black as a photoradical polymerization initiator, the moisture hardening type of the present invention can be further increased. Photocurability of the resin composition. On the other hand, as the light-shielding agent contained in the moisture-curable resin composition of the present invention, a substance having high insulation properties is preferred, and as a light-shielding agent having high insulation properties, titanium black is also preferred.

The titanium black-based optical density (OD value) is preferably 3 or more, and more preferably 4 or more. The titanium black-based blackness (L value) is preferably 9 or more, and more preferably 11 or more. The higher the light-shielding property of the titanium black, the better. The OD value of the titanium black does not have a particularly preferable upper limit, but it is usually 5 or less.

The above-mentioned titanium black series exhibits sufficient effects even without surface treatment, and the surface may be coated with an organic component such as a coupling agent or coated with an inorganic component such as silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconia, and magnesium oxide. Those who have surface-treated titanium black. Among these, in terms of the ability to further improve the insulation properties, those treated with an organic component are preferred.

As the marketer of the titanium black, for example, 12S, 13M, 13M-C, 13R-N (all manufactured by Mitsubishi Materials Corporation), Tilack D (made by Ako Chemical Co., Ltd.), and the like are mentioned.

The preferred lower limit of the specific surface area of the titanium black is 5 m ² / g, the preferred upper limit is 40 m ² / g, the more preferred lower limit is 10 m ² / g, and the more preferred upper limit is 25 m ² / g.

When mixed with resin (70% blended), the preferable lower limit of the sheet resistance of the titanium black is 10 ⁹ Ω / □, and the more preferable lower limit is 10 ¹¹ Ω / □.

In the moisture-curable resin composition of the present invention, the primary particle diameter of the above-mentioned light-shielding agent is appropriately selected depending on applications such as the distance between the substrates of the display element and the like, with a preferred lower limit of 30 nm and a preferred upper limit of 500 nm. When the primary particle diameter of the light-shielding agent is within this range, the viscosity and shake properties do not increase significantly, and the obtained moisture-curable resin composition becomes more excellent in coatability and workability on a substrate. A more preferable lower limit of the primary particle diameter of the above-mentioned sunscreen is 50 nm, and a more preferable upper limit is 200 nm.

The primary particle diameter of the light-shielding agent can be measured in the same manner as the average particle diameter of the metal particles.

In 100 parts by weight of the moisture-curable resin composition of the present invention, a preferable lower limit of the content of the light-shielding agent is 0.05 parts by weight, and a preferable upper limit is 10 parts by weight. When the content of the light-shielding agent is within this range, the obtained moisture-curable resin composition becomes a light-shielding property that is more excellent in a state that maintains excellent drawability, adhesion to a substrate, and the like, and strength after curing. . A more preferable lower limit of the content of the light-shielding agent is 0.1 part by weight, a more preferable upper limit is 2 parts by weight, and a more preferable upper limit is 1 part by weight.

The moisture-curable resin composition of the present invention may further contain additives such as a colorant, an ionic liquid, a solvent, metal-containing particles, and a reactive diluent, if necessary.

Examples of the method for producing the moisture-curable resin composition of the present invention include using a homomixer, a homomixer, a universal mixer, a planetary mixer, a kneader, a three-roll mill, or the like to remove moisture. Curable resin, or moisture-curable resin and non-moisture-curable urethane resin, alkoxysilyl-containing compound, moisture-curing accelerator, silanol condensation catalyst, and radical polymerization added as needed A method of mixing a neutral compound with a photoradical polymerization initiator or an additive.

The moisture-curable resin composition of the present invention preferably contains a water content of 100 ppm or less. When the moisture content is 100 ppm or less, the reaction between the moisture-curable resin and moisture during storage can be suppressed, and the moisture-curable resin composition becomes more excellent in storage stability. The water content is more preferably 80 ppm or less.

The moisture content can be measured by a Karl Fischer moisture measurement device.

The lower limit of the viscosity of the moisture-curable resin composition of the present invention measured at 25 ° C and 1 rpm using a cone-plate viscosity meter is 30 Pa. s, the preferred upper limit is 500Pa. s. When the viscosity is in this range, the workability when the moisture-curable resin composition is applied to an adherend such as a substrate becomes more excellent, and it is particularly suitable for a display device having a narrow edge design. The better lower limit of the above viscosity is 50Pa. s, the better upper limit is 300Pa. s.

When the viscosity of the moisture-curable resin composition of the present invention is too high, the coating properties can be improved by heating during coating.

A preferred lower limit of the shake index of the moisture-curable resin composition of the present invention is 1.2, and a preferred upper limit is 5.0. When the above-mentioned shake index is within this range, the obtained moisture-curable resin composition becomes more excellent in coatability and shape retention after coating. This shape-retaining property is, for example, a technically significant aspect in that the coating width can be maintained in a narrow-edge design. In addition, it is technically significant in terms of being able to maintain a state in which it does not ooze out from the bonding surface during the bonding of minute semiconductor wafers. The lower limit of the shake index is 1.3, and the upper limit is 4.0.

In addition, in the present specification, the above-mentioned shake index refers to a value obtained by dividing a viscosity measured using a cone-plate viscosity meter at 25 ° C and 1 rpm by a cone-plate viscosity meter at 25 ° C and 10 rpm. Viscosity value.

The moisture-curable resin composition of the present invention preferably has an optical density (OD value) of 1 or more of the cured material having a thickness of 1 mm after curing. With the above-mentioned OD value being 1 or more and having excellent light-shielding properties, when used in a display device, light leakage can be prevented and a high contrast can be obtained. The above OD value is more preferably 1.5 or more.

The higher the OD value is, the better it is. However, if the light-shielding agent is blended too much in order to increase the OD value, a decrease in workability due to thickening, etc. occurs. Therefore, in order to achieve a balance with the amount of the light-shielding agent, A preferable upper limit of the OD value of the hardened body is 4.

The OD value of the moisture-curable resin composition after curing can be measured using an optical densitometer.

The moisture-curable resin composition of the present invention is mainly used for bonding an adherend in an electronic component.

Examples of the adherend that can be adhered using the moisture-curable resin composition of the present invention include various adherends such as metal, glass, and plastic.

Examples of the shape of the adherend include a film shape, a sheet shape, a plate shape, a panel shape, a disk shape, a rod (rod shape) shape, a box shape, a frame shape, and the like.

Examples of the metal include steel, stainless steel, aluminum, copper, nickel, chromium, and alloys thereof.

Examples of the glass include alkali glass, alkali-free glass, and quartz glass.

Examples of the plastic include polyolefin resins such as high-density polyethylene, ultra-high molecular weight polyethylene, in-row polypropylene, opposite-row polypropylene, and ethylene-propylene copolymer resin, nylon 6 (N6), and nylon 66 (N66). ), Nylon 46 (N46), nylon 11 (N11), nylon 12 (N12), nylon 610 (N610), nylon 612 (N612), nylon 6/66 copolymer (N6 / 66), nylon 6/66/610 Polyamide resins such as copolymers (N6 / 66/610), nylon MXD6 (MXD6), nylon 6T, nylon 6 / 6T copolymer, nylon 66 / PP copolymer, nylon 66 / PPS copolymer, polyparaphenylene terephthalate Butyl formate (PBT), polyethylene terephthalate (PET), polyethylene isophthalate (PEI), PET / PEI copolymer, polyarylate (PAR), polybutylene naphthalate Aromatic polyester resins such as diester (PBN), liquid crystal polyester, polyoxyalkylene diimide diacid / polybutylene terephthalate copolymer, polyacrylonitrile (PAN), polymethyl Polyacrylonitrile resins such as acrylonitrile, acrylonitrile / styrene copolymer (AS), methacrylonitrile / styrene copolymer, methacrylonitrile / styrene / butadiene copolymer, polycarbonate, polymethyl Methyl acrylate (PMMA), polymethyl Polymethacrylate resins such as ethyl acrylate, ethylene / vinyl acetate copolymer (EVA), polyvinyl alcohol (PVA), vinyl alcohol / ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), Polyethylene resins such as polyvinyl chloride (PVC), vinyl chloride / vinylidene chloride copolymer, and vinylidene chloride / methacrylate copolymer.

Moreover, as the said adherend, the composite material which has a metal plating layer on the surface can also be mentioned, and as a base material of this composite material plating, the said metal, glass, plastic, etc. are mentioned, for example.

Further, examples of the adherend include a material in which a passive film is formed by subjecting a metal surface to a passive treatment. Examples of the passive treatment include heat treatment and anodization. In particular, in the case of an aluminum alloy such as the 6000 series, which is an international aluminum alloy material, the sulfuric acid-resistant alumite treatment or the phosphoric acid-method alumite treatment can be used as the passivation treatment to improve adhesion.

The present invention also relates to a combined component including a first substrate, a second substrate, and a cured body of the moisture-curable resin composition of the present invention. At least a part of the first substrate is passed through the moisture-curable resin. The hardened body of the composition is bonded to at least a part of the second substrate.

The first substrate and the second substrate preferably each include at least one electronic component.

According to the present invention, it is possible to provide a moisture-curable resin composition excellent in rapid curing properties during moisture curing. Furthermore, according to the present invention, it is possible to provide a combined component having a cured body of the moisture-curable resin composition.

1‧‧‧ aluminum substrate

2‧‧‧Moisture hardening resin composition

3‧‧‧ glass plate

FIG. 1 (a) is a schematic diagram showing a case where the sample for adhesion evaluation is viewed from above, and (b) is a schematic diagram showing a case where the sample for adhesion evaluation is viewed from the side.

Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

(Synthesis example 1 (production of moisture-curable urethane resin A))

100 parts by weight of polytetramethylene ether glycol (manufactured by Mitsubishi Chemical Corporation, "PTMG-2000") as a polyol compound, and 0.01 parts by weight of dibutyltin dilaurate were added to a separable 500 mL volume The flask was mixed under vacuum (20 mmHg or less) at 100 ° C. for 30 minutes. Thereafter, the pressure was adjusted to normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate (manufactured by Nissho Corporation, "Pure MDI") was added as a polyisocyanate compound, and the mixture was stirred at 80 ° C for 3 hours to perform a reaction to obtain a moisture-curable amine Ester resin A (weight average molecular weight: 2700).

(Synthesis example 2 (production of moisture-curable urethane resin B))

To a reaction vessel containing 100 parts by weight of the moisture-curable amine ester resin A obtained in the same manner as in Synthesis Example 1 was added 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Industry Co., Ltd., "KBM-803" ) 9.8 parts by weight, and stirred and mixed at 80 ° C. for 1 hour, thereby obtaining a moisture-curable amine ester resin B having a trimethoxysilyl group (weight average molecular weight: 3100).

(Examples 1 to 8, Comparative Examples 1 to 5)

According to the blending ratios described in Tables 1 and 2, each material was stirred by a planetary agitator (manufactured by Thinky, "Defoaming Stirred Taro"), and then uniformly mixed by a ceramic three-roll mill to obtain an implementation. Moisture-curable resin compositions of Examples 1 to 8 and Comparative Examples 1 to 5.

<Evaluation>

The following evaluations were performed on each moisture-curable resin composition obtained in the examples and comparative examples. The results are shown in Tables 1 and 2.

(Storage stability)

For each moisture-curable resin composition obtained in the examples and comparative examples, the initial viscosity immediately after manufacture and the viscosity at the time of storage at 25 ° C for one week were determined by (storage at 25 ° C for one week). The value represented by the following viscosity) / (initial viscosity) is taken as the viscosity change rate. A case where the viscosity change rate was less than 1.2 was evaluated as "○", a case where 1.2 or more and less than 1.5 was evaluated as "△", and a case where the viscosity change rate was 1.5 or more was evaluated as "x" to evaluate storage stability.

The viscosity was measured using a cone-plate viscometer (manufactured by Toki Sangyo Co., Ltd., "VISCOMETER TV-22") at 25 ° C with a rotation speed of 1 rpm.

(Adhesion (adhesion after 3 hours and 24 hours))

Each of the moisture-curable resin compositions obtained in the examples and comparative examples was coated on an aluminum substrate with a width of about 1 mm using a dispensing device, and UV-LEDs (wavelength: 365 nm) were used to irradiate 1000 mJ / cm ² of ultraviolet light. Then, light curing was performed, and then a glass plate was bonded to an aluminum substrate, and a weight of 100 g was placed and left for a specific period of time to perform moisture curing to obtain a sample for adhesion evaluation. Adhesiveness evaluation samples were made for self-loading weights and left for 3 hours, and for 24 hours. Fig. 1 shows a schematic view of a case where the sample for adhesion evaluation is viewed from above (Fig. 1 (a)), and a schematic view of a case where the sample for adhesion evaluation is viewed from the side (Fig. 1 (b)). For each sample for adhesiveness evaluation, the following measurement was performed immediately after the standing time elapsed.

Using a tensile tester ("Ez-Graph", manufactured by Shimadzu Corporation) at 25 ° C at a speed of 5 mm / sec in the shear direction, the produced adhesive evaluation sample was stretched to measure the peeling of the aluminum substrate from the glass plate. The intensity.

[Industrial availability]

According to the present invention, it is possible to provide a moisture-curable resin composition excellent in rapid curing properties during moisture curing. Furthermore, according to the present invention, it is possible to provide an assembled component having a cured body of the moisture-curable resin composition.

Claims (11)

    A moisture-curable resin composition containing a moisture-curable urethane resin, characterized in that it contains a compound containing an alkoxy silicon group, a moisture-hardening accelerator, and a silanol condensation catalyst. The compound containing an alkoxysilyl group is a moisture-curable amine ester resin having an alkoxysilyl group and / or a non-moisture-curable amine ester resin.         For example, the moisture-curable resin composition of the scope of application for the first item contains a silane coupling agent as an alkoxysilyl group-containing compound that is not a moisture-curable amine ester resin.         For example, the moisture-curable resin composition according to item 1 or 2 of the patent application scope, wherein the moisture-hardening promoting catalyst is an amine catalyst.         For example, the moisture-curable resin composition of the scope of patent application No. 1, 2 or 3, wherein the content of the moisture-curing promoting catalyst is 0.05 parts by weight or more and 3 weight relative to 100 parts by weight of the moisture-curing amine ester resin. The following.         For example, the moisture-curable resin composition of item 1, 2, 3, or 4 of the scope of patent application, wherein the silanol condensation catalyst is an organic titanium compound and / or an organic zirconium compound.         For example, the moisture-curable resin composition of item 1, 2, 3, 4 or 5 of the scope of application for a patent, wherein the content of the silanol condensation catalyst in 100 parts by weight of the moisture-curable resin composition is 0.01 parts by weight Above 3 parts by weight.         For example, the moisture-curable resin composition of the scope of application for patent No. 1, 2, 3, 4, 5, or 6 contains a radical polymerizable compound and a photo radical polymerization initiator.         For example, the moisture-curable resin composition of item 1, 2, 3, 4, 5, 6, or 7 of the scope of application for a patent contains a filler having a primary particle diameter of 1 nm or more and 50 nm or less.         For example, the moisture-curable resin composition of item 1, 2, 3, 4, 5, 6, 7, or 8 of the scope of application for a patent contains a sunscreen.         A composite part comprising a hardened body of a first substrate, a second substrate, and a moisture-curable resin composition of the scope of patent applications 1, 2, 3, 4, 5, 6, 7, 8, or 9; At least a part of the 1 substrate is bonded to at least a part of the second substrate via a cured body of the moisture-curable resin composition.         For example, the combined component of the scope of application for item 10, wherein the first substrate and the second substrate each have at least one electronic component.