JP6943837B2 - Moisture curable resin composition and assembly parts - Google Patents

Description

The present invention relates to a moisture-curable resin composition having excellent quick-curing property at the time of moisture-curing. The present invention also relates to an assembly part having a cured product of the moisture-curable resin composition.

In recent years, liquid crystal display elements, organic EL display elements, and the like have been widely used as display elements having features such as thinness, light weight, and low power consumption. In these display elements, a photocurable resin composition is usually used for sealing a liquid crystal display or a light emitting layer, adhering various members such as a substrate, an optical film, and a protective film.
However, with the miniaturization of the display element, the photocurable resin composition may be applied to a portion that is not sufficiently reachable by light, and as a result, the photocurable resin composition is applied to a portion that is not sufficiently reachable by light. Has a problem of insufficient curing. Therefore, a photothermosetting resin composition is used as a resin composition that can be sufficiently cured even when it is applied to a portion where light does not reach, and both photocuring and thermosetting are used in combination, but at a high temperature. There was a risk that heating would adversely affect the elements and the like.

Further, in recent years, electronic components such as semiconductor chips are required to be highly integrated and miniaturized. For example, a plurality of thin semiconductor chips may be joined via an adhesive layer to form a laminate of semiconductor chips. It is done. Such a laminate of semiconductor chips is, for example, a method of applying an adhesive on one semiconductor chip, laminating the other semiconductor chip via the adhesive, and then curing the adhesive. It is manufactured by a method of filling an adhesive between semiconductor chips held at intervals and then curing the adhesive.
As an adhesive used for adhering such electronic components, for example, Patent Document 1 discloses a thermosetting adhesive containing an epoxy compound having a number average molecular weight of 600 to 1000. However, the thermosetting adhesive as disclosed in Patent Document 1 is not suitable for adhering electronic components that may be damaged by heat.

As a method of curing the resin composition without heating at a high temperature, a method of using a moisture-curable resin composition has been studied. For example, Patent Document 2 discloses a moisture-curable resin composition in which an isocyanate group in a resin is crosslinked and cured by reacting with moisture (moisture) in the air or an adherend.

Japanese Unexamined Patent Publication No. 2000-178342 Japanese Unexamined Patent Publication No. 2002-212534

An object of the present invention is to provide a moisture-curable resin composition having excellent quick-curing property at the time of moisture-curing. The present invention also provides an assembly component having a cured product of the moisture-curable resin composition.

The present invention is a moisture-curable resin composition containing a moisture-curable urethane resin, which comprises a moisture-curable urethane resin having an alkoxysilyl group and / or an alkoxysilyl group-containing compound which is not a moisture-curable urethane resin, and moisture-curing. It is a moisture-curable resin composition containing an accelerating catalyst and a silanol condensation catalyst.
The present invention will be described in detail below.

The present inventors have stated that in a moisture-curable resin composition containing a moisture-curable urethane resin, a moisture-curing accelerating catalyst is blended for the purpose of improving workability and the like to improve the quick-curing property at the time of moisture curing. investigated. However, although the effect of improving the quick-curing property was observed to some extent by blending the moisture-curing accelerating catalyst, it was not sufficient, and the amount of the moisture-curing accelerating catalyst was increased in anticipation of further improvement of the quick-curing property at the time of moisture curing. On the contrary, it was confirmed that the initial adhesive strength decreased when the mixture was allowed to be used. The present inventors promoted the moisture-curing reaction of the moisture-curable urethane resin by the moisture-curing accelerating catalyst as the cause of the decrease in the initial adhesive strength, but the reaction with the adhesive substrate interface became insufficient, and as a result, the interface was destroyed. I thought that it was because it became easy to occur.
Therefore, as a result of further diligent studies, the present inventors have found that in a moisture-curable resin composition containing a moisture-curable urethane resin and a moisture-curing acceleration catalyst, an alkoxysilyl group is used as the moisture-curable urethane resin and / or other components. We have found that a moisture-curable resin composition having excellent quick-curing property at the time of moisture-curing can be obtained by blending the contained compound and further blending a silanol condensation catalyst that acts on these alkoxysilyl groups. Has been completed.

The moisture-curable resin composition of the present invention contains a moisture-curable urethane resin.
The moisture-curable urethane resin has an isocyanate group in the molecule. The isocyanate group in the molecule reacts with moisture in the air or the adherend and cures. The moisture-curable urethane resin preferably has an isocyanate group at the molecular end. The moisture-curable urethane resin may further have a urethane bond in the molecule.

The moisture-curable urethane resin may have only one isocyanate group in one molecule, or may have two or more isocyanate groups.

The moisture-curable urethane resin can be obtained by reacting a polyol compound having two or more hydroxyl groups in one molecule with a polyisocyanate compound having two or more isocyanate groups in one molecule.

The reaction between the polyol compound and the polyisocyanate compound is usually performed by the molar ratio of the hydroxyl group (OH) in the polyol compound and the isocyanate group (NCO) in the polyisocyanate compound [NCO] / [OH] = 2.0 to 2. It is done in the range of .5.

As the polyol compound which is a raw material of the moisture-curable urethane resin, a known polyol compound usually used in the production of polyurethane can be used, and for example, polyester polyol, polyether polyol, polyalkylene polyol, polycarbonate polyol. And so on. These polyol compounds may be used alone or in combination of two or more.

Examples of the polyester polyol include a polyester polyol obtained by reacting a polyvalent carboxylic acid with a polyol, a poly-ε-caprolactone polyol obtained by ring-opening polymerization of ε-caprolactone, and the like.

Examples of the polyvalent carboxylic acid used as a raw material for the polyester polyol include terephthalic acid, isophthalic acid, 1,5-naphthalic acid, 2,6-naphthalic acid, succinic acid, glutaric acid, adipic acid, pimeric acid, and suberin. Examples thereof include acids, azelaic acids, sebacic acids, decamethylene dicarboxylic acids and dodecamethylene dicarboxylic acids.

Examples of the polyol that is a raw material of the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, and 1,6-hexane. Examples thereof include diol, diethylene glycol, cyclohexanediol and the like.

Examples of the polyether polyol include ring-opening polymers of ethylene glycol, propylene glycol and tetrahydrofuran, ring-opening polymers of 3-methyl tetrahydrofuran, and random copolymers or block copolymers of these or derivatives thereof, bisphenols. Examples thereof include a type polyoxyalkylene modified product.

The bisphenol-type polyoxyalkylene-modified product is a polyether polyol obtained by adding an alkylene oxide (for example, ethylene oxide, propylene oxide, butylene oxide, isobutylene oxide, etc.) to the active hydrogen moiety of the bisphenol-type molecular skeleton. It may be a random copolymer or a block copolymer. The bisphenol-type polyoxyalkylene modified product preferably has one or more alkylene oxides added to both ends of the bisphenol-type molecular skeleton. The bisphenol type is not particularly limited, and examples thereof include A type, F type, and S type, and bisphenol A type is preferable.

Examples of the polyalkylene polyol include a polybutadiene polyol, a hydrogenated polybutadiene polyol, and a hydrogenated polyisoprene polyol.

Examples of the polycarbonate polyol include polyhexamethylene carbonate polyol and polycyclohexanedimethylene carbonate polyol.

Examples of the polyisocyanate compound used as a raw material for the moisture-curable urethane resin include diphenylmethane diisocyanate (MDI), liquid modified products of diphenylmethane diisocyanate, polypeptide MDI, tolylene diisocyanate, naphthalene-1,5-diisocyanate and the like. Of these, diphenylmethane diisocyanate and its modified products are preferable from the viewpoints of low vapor pressure, low toxicity, and ease of handling. The polyisocyanate compound may be used alone or in combination of two or more.

Further, the moisture-curable urethane resin is preferably obtained by using a polyol compound having a structure represented by the following formula (1). By using a polyol compound having a structure represented by the following formula (1), a composition having excellent adhesiveness and a cured product having flexibility and good elongation can be obtained, and a phase with a radically polymerizable compound described later. It has excellent solubility.
Of these, those using a polyether polyol composed of a ring-opening polymerization compound of propylene glycol or a tetrahydrofuran (THF) compound or a ring-opening polymerization compound of a tetrahydrofuran compound having a substituent such as a methyl group are preferable.

In the formula (1), R represents a hydrogen, a methyl group, or an ethyl group, l is an integer of 0 to 5, m is an integer of 1 to 500, and n is an integer of 1 to 10. l is preferably 0 to 4, m is preferably 50 to 200, and n is preferably 1 to 5.
The case where l is 0 means the case where the carbon bonded to R is directly bonded to oxygen.

When the moisture-curable resin composition of the present invention does not contain an alkoxysilyl group-containing compound that is not a moisture-curable urethane resin described later, the moisture-curable resin composition of the present invention contains an alkoxysilyl group as the moisture-curable urethane resin. It always contains the moisture-curable urethane resin that it has.

Examples of the alkoxysilyl group in the moisture-curable urethane resin having an alkoxysilyl group include a trimethoxysilyl group, a methyldimethoxysilyl group, a dimethylmethoxysilyl group, a triethoxysilyl group, a methyldiethoxysilyl group, and a methyldimethoxyethoxy. Examples thereof include a silyl group. The moisture-curable urethane resin having the alkoxysilyl group may have the alkoxysilyl group at the end of the main chain of the molecule or at the side chain of the molecule, but may have the alkoxysilyl group at the side chain of the molecule. It is preferable to have it at the end.

When the moisture-curable resin composition of the present invention contains the moisture-curable urethane resin having the alkoxysilyl group, the moisture-curable urethane resin having the alkoxysilyl group is contained in 100 parts by weight of the moisture-curable urethane resin. The preferred lower limit of the amount is 5 parts by weight, and the preferred upper limit is 70 parts by weight. When the content of the moisture-curable urethane resin having an alkoxysilyl group is within this range, the effect of achieving both quick curing during moisture curing and adhesiveness after moisture curing becomes excellent. The more preferable lower limit of the content of the moisture-curable urethane resin having an alkoxysilyl group is 20 parts by weight, and the more preferable upper limit is 60 parts by weight.

Further, the moisture-curable urethane resin may have a radically polymerizable functional group.
As the radically polymerizable functional group that the moisture-curable urethane resin may have, a group having an unsaturated double bond is preferable, and a (meth) acryloyl group is more preferable from the viewpoint of reactivity.
The moisture-curable urethane resin having a radical-polymerizable functional group is not included in the radical-polymerizable compound described later, and is treated as a moisture-curable urethane resin.

The weight average molecular weight of the moisture-curable urethane resin is not particularly limited, but the preferable lower limit is 800 and the preferable upper limit is 10,000. When the weight average molecular weight of the moisture-curable urethane resin is in this range, the obtained moisture-curable resin composition does not have an excessively high crosslink density at the time of curing and becomes more flexible and more excellent in coatability. It becomes a thing. The more preferable lower limit of the weight average molecular weight of the moisture-curable urethane resin is 2000, the more preferable upper limit is 8000, the further preferable lower limit is 2500, and the further preferable upper limit is 6000.
In the present specification, the weight average molecular weight is a value obtained by measuring by gel permeation chromatography (GPC) and converting into polystyrene. Examples of the column for measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko KK) and the like. Further, examples of the solvent used in GPC include tetrahydrofuran and the like.

The preferable lower limit of the content of the moisture-curable urethane resin in 100 parts by weight of the moisture-curable resin composition of the present invention is 20 parts by weight, and the preferable upper limit is 90 parts by weight. When the content of the moisture-curable resin is in this range, the obtained moisture-curable resin composition becomes more excellent in moisture-curable property while maintaining excellent weather resistance and flexibility of the cured product. The more preferable lower limit of the content of the moisture-curable urethane resin is 30 parts by weight, and the more preferable upper limit is 75 parts by weight.

The moisture-curable resin composition of the present invention contains a moisture-curing accelerating catalyst.
As the moisture curing accelerating catalyst, an amine catalyst is preferable because it is excellent in the effect of accelerating the moisture curing reaction of the moisture curing urethane resin. Of these, a tertiary amine catalyst is preferable, and a tertiary amine catalyst having a morpholine skeleton is particularly preferable. Examples of the amine catalyst include morpholine, 4-morpholino-1-cyclohexene, 1-morpholino-1-cyclopentene, 2- (N-morpholino) ethanesulfonic acid, 2,2'-dimorpholino diethyl ether, triethylamine, and di. (2,6-dimethylmorpholinoethyl) ether, di (2,6-diethylmorpholinoethyl) ether, 1,4-diazabicyclo [2.2.2] octane, 2,6,7-trimethyl-1,4-diazabicyclo [2.2.2] Octane and the like can be mentioned.

The preferable lower limit of the content of the moisture curing accelerating catalyst with respect to 100 parts by weight of the moisture-curable urethane resin is 0.05 parts by weight, and the preferable upper limit is 3 parts by weight. When the content of the moisture-curing accelerating catalyst is in this range, the effect of accelerating the moisture-curing reaction of the moisture-curing urethane resin while maintaining the excellent storage stability of the obtained moisture-curing resin composition is obtained. It will be excellent. The more preferable lower limit of the content of the moisture curing accelerating catalyst is 0.1 parts by weight, and the more preferable upper limit is 2 parts by weight.

Examples of the alkoxysilyl group in the alkoxysilyl group-containing compound other than the moisture-curable urethane resin include those similar to those in the above-mentioned wet-curable urethane resin having an alkoxysilyl group. The alkoxysilyl group-containing compound that is not the moisture-curable urethane resin may have the alkoxysilyl group at the end of the main chain of the molecule or at the side chain of the molecule, but may have the alkoxysilyl group at the side chain of the molecule. It is preferable to have it at the end of.

Examples of the alkoxysilyl group-containing compound that is not the moisture-curable urethane resin include a silane coupling agent.

Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxy. Propyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane , 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (Aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethylbutylidene) propylamine, N -Phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercapto Propyltrimethoxysilane, 3-isocyanuppropyltriethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxy Examples thereof include silane, decyltrimethoxysilane, and trifluoropropyltrimethoxysilane.

When the moisture-curable resin composition of the present invention contains an alkoxysilyl group-containing compound that is not the moisture-curable urethane resin, the alkoxysilyl that is not the moisture-curable urethane resin in 100 parts by weight of the moisture-curable resin composition of the present invention. The preferable lower limit of the content of the group-containing compound is 0.05 parts by weight, and the preferable upper limit is 3 parts by weight. When the content of the alkoxysilyl group-containing compound other than the moisture-curable urethane resin is within this range, the obtained moisture-curable resin composition has both quick curing during moisture curing and adhesiveness after moisture curing. The effect will be better. The more preferable lower limit of the content of the alkoxysilyl group-containing compound other than the moisture-curable urethane resin is 0.1 parts by weight, and the more preferable upper limit is 2 parts by weight.

The moisture-curable resin composition of the present invention contains a silanol condensation catalyst. As the silanol condensation catalyst, an organometallic catalyst is preferable. Examples of the organometallic catalyst include organic titanium compounds, organic zirconium compounds, organic zinc compounds, organotin compounds, organoaluminum compounds, and organobismus compounds. Among them, an organic titanium compound and / or an organic zirconium compound is preferable, and an organic zirconium compound is more preferable, because the obtained moisture-curable resin composition is more excellent in quick-curing property at the time of moisture curing. ..

Examples of the organic titanium compound include tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetraoctyl titanate, tetraterchary butyl titanate, tetradutearyl titanate, and titanium acetyl acetate.

Examples of the organic zirconium compound include normal propylzirconate, zirconium ethyl acetate, zirconium tetraacetylacetonate and the like.

The preferable lower limit of the content of the silanol condensation catalyst in 100 parts by weight of the moisture-curable resin composition of the present invention is 0.01 parts by weight, and the preferable upper limit is 3 parts by weight. When the content of the silanol condensation catalyst is in this range, the obtained moisture-curable resin composition is more excellent in quick-curing property at the time of moisture-curing while maintaining excellent storage stability. A more preferable lower limit of the content of the silanol condensation catalyst is 0.05 parts by weight, a further preferable lower limit is 0.1 parts by weight, and a more preferable upper limit is 2 parts by weight.

The moisture-curable resin composition of the present invention may contain a radically polymerizable compound and a photoradical polymerization initiator.
By containing the radical-polymerizable compound and the photoradical polymerization initiator, the moisture-curable resin composition of the present invention is particularly a display element as a photo-moisture-curable resin composition having photocurability and moisture-curability. It can be suitably used as a sealing agent.

The radically polymerizable compound may be any radically polymerizable compound having photopolymerizability, and is not particularly limited as long as it is a compound having a radically polymerizable functional group in the molecule, but the radically polymerizable functional group is unsaturated. A compound having a heavy bond is preferable, and a compound having a (meth) acryloyl group (hereinafter, also referred to as “(meth) acrylic compound”) is particularly preferable from the viewpoint of reactivity.
In the present specification, the above-mentioned "(meth) acryloyl" means acryloyl or methacryloyl, and the above-mentioned "(meth) acrylic" means acrylic or methacryl.

Examples of the (meth) acrylic compound include a (meth) acrylic acid ester compound obtained by reacting (meth) acrylic acid with a compound having a hydroxyl group, and a (meth) acrylic acid by reacting an epoxy compound. Examples thereof include the obtained epoxy (meth) acrylate and urethane (meth) acrylate obtained by reacting an isocyanate compound with a (meth) acrylic acid derivative having a hydroxyl group.
In addition, in this specification, the said "(meth) acrylate" means acrylate or methacrylate. Further, all the isocyanate groups of the isocyanate compound which is the raw material of the urethane (meth) acrylate are used for forming the urethane bond, and the urethane (meth) acrylate does not have a residual isocyanate group.

Among the above (meth) acrylic acid ester compounds, monofunctional ones include, for example, phthalimide acrylates such as N-acryloyloxyethyl hexahydrophthalimide, various imide (meth) acrylates, methyl (meth) acrylates, and ethyl (meth). Acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) Acrylate, isononyl (meth) acrylate, isodecil (meth) acrylate, lauryl (meth) acrylate, isomyristyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) ) Acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-methoxyethyl ( Meta) acrylate, 2-ethoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethylcarbitol (meth) acrylate, tetrahydrofurfuryl (meth) Meta) acrylate, 2-phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3- Tetrafluoropropyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinic acid, 2 -(Meta) acryloyloxyethyl hexahydrophthalic acid, 2- (meth) acryloyloxyethyl-2-hydroxypropylphthalate, glycidyl (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate and the like can be mentioned.

Among the above (meth) acrylic acid ester compounds, bifunctional ones include, for example, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, and 1,6-hexane. Didioldi (meth) acrylate, 1,9-nonane dioldi (meth) acrylate, 1,10-decanediol di (meth) acrylate, 2-n-butyl-2-ethyl-1,3-propanedioldi (meth) ) Acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) ) Acrylate, polypropylene glycol di (meth) acrylate, ethylene oxide-added bisphenol A di (meth) acrylate, propylene oxide-added bisphenol A di (meth) acrylate, ethylene oxide-added bisphenol F di (meth) acrylate, dimethylol dicyclopentadienyldi (Meta) acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide-modified isocyanurate di (meth) acrylate, 2-hydroxy-3- (meth) acryloyloxypropyl (meth) acrylate, carbonatediol di (meth) acrylate, Examples thereof include polyether diol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone diol di (meth) acrylate, and polybutadiene diol di (meth) acrylate.

Among the above (meth) acrylic acid ester compounds, those having trifunctionality or higher include, for example, trimetyl propanetri (meth) acrylate, ethylene oxide-added trimethyl propanetri (meth) acrylate, and propylene oxide-added trimethyl propantri (meth) acrylate. Meta) acrylate, caprolactone-modified trimethylol propantri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethylene oxide-added isocyanuric acid tri (meth) acrylate, glycerin tri (meth) acrylate, propylene oxide-added glycerin tri (meth) acrylate, Examples thereof include tris (meth) acryloyloxyethyl phosphate, ditrimethylolpropantetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol hexa (meth) acrylate.

Examples of the epoxy (meth) acrylate include those obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a basic catalyst according to a conventional method.

Examples of the epoxy compound used as a raw material for synthesizing the epoxy (meth) acrylate include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, and a 2,2'-diallyl bisphenol A type epoxy resin. , Hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol Novolac type epoxy resin, orthocresol novolac type epoxy resin, dicyclopentadiene novolac type epoxy resin, biphenyl novolac type epoxy resin, naphthalenephenol novolac type epoxy resin, glycidylamine type epoxy resin, alkyl polyol type epoxy resin, rubber modified epoxy resin , Glysidyl ester compound, bisphenol A type episulfide resin and the like.

Among the above epoxy (meth) acrylates, commercially available ones include, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3702, EBECRYL3702, EBECRYL370 ), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), Epoxy Ester M-600A, Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA (all manufactured by Kyoeisha Chemical Co., Ltd.), Denacol Acrylate DA-141 , Denacol acrylate DA-314, Denacol acrylate DA-911 (all manufactured by Nagase ChemteX Corporation) and the like.

The urethane (meth) acrylate can be obtained, for example, by reacting an isocyanate compound with a (meth) acrylic acid derivative having a hydroxyl group in the presence of a catalytic amount of a tin compound.

Examples of the isocyanate compound used as a raw material for the urethane (meth) acrylate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and diphenylmethane-4,4. '-Diisocyanate (MDI), hydrogenated MDI, polypeptide MDI, 1,5-naphthalenediocyanate, norbornan diisocyanate, trizine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanate) Phyl) thiophosphate, tetramethylxylylene diisocyanate, 1,6,11-undecantryisocyanate and the like can be mentioned.

The isocyanate compound is obtained by reacting a polyol such as ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, or polycaprolactone diol with an excess of isocyanate compound. A chain-extended isocyanate compound can also be used.

Examples of the (meth) acrylic acid derivative having a hydroxyl group, which is a raw material of the urethane (meth) acrylate, include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, and 1,4-butane. Mono (meth) acrylates of dihydric alcohols such as diols and polyethylene glycol, mono (meth) acrylates or di (meth) acrylates of trihydric alcohols such as trimethylolethane, trimethylolpropane and glycerin, and bisphenol A type. Examples thereof include epoxy (meth) acrylate such as epoxy (meth) acrylate.

Commercially available urethane (meth) acrylates include, for example, M-1100, M-1200, M-1210, M-1600 (all manufactured by Toagosei Co., Ltd.), EBECRYL230, EBECRYL270, EBECRYL4858, EBECRYL8402, EBECRYL8411, EBECRYL8412, EBECRYL8413, EBECRYL8804, EBECRYL8803, EBECRYL8807, EBECRYL9260, EBECRYL1290, EBECRYL5129, EBECRYL4842, EBECRYL210, EBECRYL4827, EBECRYL6700, EBECRYL220, EBECRYL2220, KRM7735, KRM-8295 (all manufactured by Daicel-Orunekusu Co., Ltd.), Art resin UN-9000H , Art Resin UN-9000A, Art Resin UN-7100, Art Resin UN-1255, Art Resin UN-330, Art Resin UN-3320HB, Art Resin UN-1200TPK, Art Resin SH-500B (all manufactured by Negami Kogyo Co., Ltd.) , U-2HA, U-2PHA, U-3HA, U-4HA, U-6H, U-6LPA, U-6HA, U-10H, U-15HA, U-122A, U-122P, U-108, U -108A, U-324A, U-340A, U-340P, U-1084A, U-2061BA, UA-340P, UA-4100, UA-4000, UA-4200, UA-4400, UA-5201P, UA-7100 , UA-7200, UA-W2A (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), AI-600, AH-600, AT-600, UA-101I, UA-101T, UA-306H, UA-306I, UA-306T (Both are manufactured by Kyoeisha Chemical Co., Ltd.) and the like.

In addition, other radically polymerizable compounds other than those described above can also be used as appropriate.
Examples of the other radically polymerizable compounds include N, N-dimethyl (meth) acrylamide, N- (meth) acryloylmorpholine, N-hydroxyethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, and N. -Isopropyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide and other (meth) acrylamide compounds, styrene, α-methylstyrene, N-vinyl-2-pyrrolidone, N-vinyl-ε-caprolactam and the like Examples include vinyl compounds.

The radically polymerizable compound preferably contains a monofunctional radically polymerizable compound and a polyfunctional radically polymerizable compound from the viewpoint of adjusting curability and the like. By containing the monofunctional radical polymerizable compound and the polyfunctional radical polymerizable compound, the obtained moisture-curable resin composition becomes more excellent in curability and tackiness. Among them, it is preferable to use urethane (meth) acrylate as the polyfunctional radical polymerizable compound in combination with the monofunctional radical polymerizable compound. Further, the polyfunctional radical polymerizable compound is preferably bifunctional or trifunctional, and more preferably bifunctional.

When the radical-polymerizable compound contains the monofunctional radical-polymerizable compound and the polyfunctional radical-polymerizable compound, the content of the polyfunctional radical-polymerizable compound is the monofunctional radical-polymerizable compound and the polyfunctional radical-polymerizable compound. The preferable lower limit is 2 parts by weight and the preferable upper limit is 45 parts by weight with respect to 100 parts by weight in total with the functional radical polymerizable compound. When the content of the polyfunctional radical polymerizable compound is in this range, the obtained moisture-curable resin composition is more excellent in curability and tackiness. The more preferable lower limit of the content of the polyfunctional radical polymerizable compound is 5 parts by weight, and the more preferable upper limit is 35 parts by weight.

The preferable lower limit of the content of the radically polymerizable compound in 100 parts by weight of the moisture-curable resin composition of the present invention is 10 parts by weight, and the preferable upper limit is 80 parts by weight. When the content of the radically polymerizable compound is in this range, the obtained moisture-curable resin composition is more excellent in both photocurability and moisture-curability. The more preferable lower limit of the content of the radically polymerizable compound is 30 parts by weight, and the more preferable upper limit is 60 parts by weight.

Examples of the photoradical polymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanosen compounds, oxime ester compounds, benzoin ether compounds, thioxanthone and the like.

Commercially available photoradical polymerization initiators include, for example, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, and Lucillin TPO. , Benzoin ethyl ether, benzoin isopropyl ether (all manufactured by Tokyo Chemical Industry Co., Ltd.) and the like.

Regarding the content of the photoradical polymerization initiator, the preferable lower limit is 0.01 part by weight and the preferable upper limit is 10 parts by weight with respect to 100 parts by weight of the radically polymerizable compound. When the content of the photoradical polymerization initiator is in this range, the obtained moisture-curable resin composition is more excellent in photocurability and storage stability. The more preferable lower limit of the content of the photoradical polymerization initiator is 0.1 parts by weight, and the more preferable upper limit is 5 parts by weight.

The moisture-curable resin composition of the present invention preferably contains a filler.
By containing the above filler, the moisture-curable resin composition of the present invention has suitable thixotropy and can sufficiently retain its shape after coating.

In the above filler, the preferable lower limit of the primary particle size is 1 nm, and the preferable upper limit is 50 nm. When the primary particle size of the filler is in this range, the obtained moisture-curable resin composition is superior in coatability and shape retention after coating, and is particularly suitable for a display element having a narrow frame design. It becomes. The more preferable lower limit of the primary particle size of the filler is 5 nm, the more preferable upper limit is 30 nm, the further preferable lower limit is 10 nm, and the further preferable upper limit is 20 nm.
The primary particle size of the filler can be measured by dispersing the filler in a solvent (water, organic solvent, etc.) using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS).
Further, the filler may be present as secondary particles (a collection of a plurality of primary particles) in the moisture-curable resin composition of the present invention, and the preferable lower limit of the particle size of such secondary particles is 5 nm, the preferred upper limit is 500 nm, the more preferred lower limit is 10 nm, and the more preferred upper limit is 100 nm. The particle size of the secondary particles of the filler can be measured by observing the moisture-curable resin composition of the present invention or a cured product thereof using a transmission electron microscope (TEM).

The filler is preferably an inorganic filler, and examples thereof include silica, talc, titanium oxide, zinc oxide, and calcium carbonate. Of these, silica is preferable because the obtained moisture-curable resin composition has excellent ultraviolet transmittance. These fillers may be used alone or in combination of two or more.

The filler preferably has a hydrophobic surface treatment. By the above hydrophobic surface treatment, the obtained moisture-curable resin composition becomes more excellent in shape retention after application.
Examples of the hydrophobic surface treatment include a silylation treatment, an alkylation treatment, and an epoxidation treatment. Among them, the silylation treatment is preferable, and the trimethylsilylation treatment is more preferable because the effect of improving the shape retention is excellent.

Examples of the method for treating the hydrophobic surface of the filler include a method of treating the surface of the filler with a surface treatment agent.
Specifically, for example, the above-mentioned trimethylsilylated silica is prepared by, for example, synthesizing silica by a method such as a sol-gel method and spraying a surface treatment agent such as hexamethyldisilazane in a state where the silica is flowing, alcohol, toluene. It can be produced by adding silica to an organic solvent such as, further, adding a surface treatment agent such as hexamethyldisilazane and water, and then evaporating and drying the water and the organic solvent with an evaporator.

The preferable lower limit of the content of the filler in 100 parts by weight of the moisture-curable resin composition of the present invention is 1 part by weight, and the preferable upper limit is 20 parts by weight. When the content of the filler is in this range, the obtained moisture-curable resin composition is excellent in coatability and shape retention after coating. A more preferable lower limit of the content of the filler is 2 parts by weight, a more preferable upper limit is 15 parts by weight, a further preferable lower limit is 3 parts by weight, a further preferable upper limit is 10 parts by weight, and a particularly preferable lower limit is 4 parts by weight. ..

The moisture-curable resin composition of the present invention may contain a light-shielding agent.
By containing the above-mentioned light-shielding agent, the moisture-curable resin composition of the present invention has excellent light-shielding properties, and can prevent light leakage when used in a display element, for example. Further, in the display element manufactured by using the moisture-curable resin composition of the present invention containing the above-mentioned light-shielding agent, the moisture-curable resin composition has sufficient light-shielding properties, so that light does not leak and high contrast is achieved. It has excellent image display quality.
In the present specification, the above-mentioned "light-shielding agent" means a material having an ability to hardly transmit light in the visible light region. If the material listed as the electromagnetic wave shielding material also has such an ability, the effect as the light shielding agent can be exhibited.

Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. Further, the light-shielding agent does not have to be black, and if it is a material having an ability to hardly transmit light in the visible light region, silica, talc, titanium oxide, etc., and materials mentioned as fillers can also be used. Included in the light-shielding agent. Of these, titanium black is preferable.

The titanium black is a substance having a higher transmittance in the vicinity of the ultraviolet region, particularly in light having a wavelength of 370 to 450 nm, as compared with the average transmittance for light having a wavelength of 300 to 800 nm. That is, the titanium black has a property of imparting light-shielding property to the moisture-curable resin composition of the present invention by sufficiently blocking light having a wavelength in the visible light region, while transmitting light having a wavelength in the vicinity of the ultraviolet region. It is a light-shielding agent. Therefore, by using a photoradical polymerization initiator that can initiate the reaction with light having a wavelength (370 to 450 nm) at which the transmittance of titanium black is high, the photocurable resin composition of the present invention is photocured. The sex can be further increased. On the other hand, as the light-shielding agent contained in the moisture-curable resin composition of the present invention, a substance having high insulating properties is preferable, and titanium black is also preferable as the light-shielding agent having high insulating properties.
The titanium black has an optical density (OD value) of preferably 3 or more, and more preferably 4 or more. Further, the titanium black preferably has a blackness (L value) of 9 or more, and more preferably 11 or more. The higher the light-shielding property of the titanium black, the better, and the OD value of the titanium black has no particular preferable upper limit, but is usually 5 or less.

The above titanium black exerts a sufficient effect even if it is not surface-treated, but the surface is treated with an organic component such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconium oxide. , Titanium black surface-treated, such as those coated with an inorganic component such as magnesium oxide, can also be used. Among them, those treated with an organic component are preferable in that the insulating property can be further improved.

Examples of commercially available titanium blacks include 12S, 13M, 13M-C, 13RN (all manufactured by Mitsubishi Materials Co., Ltd.), Tilak D (manufactured by Ako Kasei Co., Ltd.), and the like.

The preferable lower limit of the specific surface area of the titanium black is 5 m ² / g, the preferable upper limit is 40 m ² / g, the more preferable lower limit is 10 m ² / g, and the more preferable upper limit is 25 m ² / g. Moreover, the preferable lower limit of the sheet resistance of the titanium black, when mixed with the resin (70% formulation), 10 ⁹ Ω / □ and a more preferred lower limit is 10 ¹¹ Ω / □.

In the moisture-curable resin composition of the present invention, the primary particle size of the light-shielding agent is appropriately selected depending on the application such as the distance between the substrates of the display element or less, but the preferable lower limit is 30 nm and the preferable upper limit is 500 nm. be. When the primary particle size of the light-shielding agent is in this range, the obtained moisture-curable resin composition is excellent in coatability and workability on a substrate without significantly increasing the viscosity and thixotropy. The more preferable lower limit of the primary particle size of the light-shielding agent is 50 nm, and the more preferable upper limit is 200 nm.
The primary particle size of the light-shielding agent can be measured in the same manner as the average particle size of the metal particles.

The preferable lower limit of the content of the light-shielding agent in 100 parts by weight of the moisture-curable resin composition of the present invention is 0.05 parts by weight, and the preferable upper limit is 10 parts by weight. When the content of the light-shielding agent is within this range, the obtained moisture-curable resin composition is excellent in light-shielding property while maintaining excellent drawing property, adhesiveness to a substrate and the like, and strength after curing. It becomes a thing. The more preferable lower limit of the content of the light-shielding agent is 0.1 parts by weight, the more preferable upper limit is 2 parts by weight, and the further preferable upper limit is 1 part by weight.

The moisture-curable resin composition of the present invention may further contain additives such as a colorant, an ionic liquid, a solvent, metal-containing particles, and a reactive diluent, if necessary.

As a method for producing the moisture-curable resin composition of the present invention, for example, a moisture-curable resin or a moisture-curable resin using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, or three rolls is used. , An alkoxysilyl group-containing compound that is not a moisture-curable resin or a moisture-curable urethane resin, a moisture-curing acceleration catalyst, a silanol condensation catalyst, a radical-polymerizable compound to be added as needed, and a photoradical polymerization initiator or additive. Examples include a method of mixing.

The moisture-curable resin composition of the present invention preferably contains 100 ppm or less of water. When the water content is 100 ppm or less, the reaction between the moisture-curable resin and the moisture during storage can be suppressed, and the moisture-curable resin composition becomes more excellent in storage stability. The water content is more preferably 80 ppm or less.
The water content can be measured by a Karl Fischer titer measuring device.

In the moisture-curable resin composition of the present invention, the preferable lower limit of the viscosity measured at 25 ° C. and 1 rpm using a cone plate type viscometer is 30 Pa · s, and the preferable upper limit is 500 Pa · s. When the viscosity is in this range, the workability when the moisture-curable resin composition is applied to an adherend such as a substrate becomes excellent, and it is particularly suitable for a display element having a narrow frame design. The more preferable lower limit of the viscosity is 50 Pa · s, and the more preferable upper limit is 300 Pa · s.
If the viscosity of the moisture-curable resin composition of the present invention is too high, the coatability can be improved by heating at the time of coating.

The preferred lower limit of the thixotropic index of the moisture-curable resin composition of the present invention is 1.2, and the preferred upper limit is 5.0. When the thixotropic index is in this range, the obtained moisture-curable resin composition is excellent in coatability and shape retention after coating. This shape retention has great technical significance in that the coating width can be maintained, for example, in a narrow frame design. Further, in the bonding of fine semiconductor chips, it is of great technical significance in that it can maintain a state in which it does not protrude from the bonding surface. The more preferable lower limit of the thixotropic index is 1.3, and the more preferable upper limit is 4.0.
In the present specification, the above-mentioned thixotropic index is a viscosity measured under the condition of 25 ° C. and 1 rpm using a cone plate type viscometer, and measured under the condition of 25 ° C. and 10 rpm using a cone plate type viscometer. It means the value divided by the viscosity.

The moisture-curable resin composition of the present invention preferably has an optical density (OD value) of 1 or more for a cured product having a thickness of 1 mm after curing. When the OD value is 1 or more, the light-shielding property is excellent, light leakage can be prevented when used in a display element, and high contrast can be obtained. The OD value is more preferably 1.5 or more.
The higher the OD value, the better, but if too much light-shielding agent is added to increase the OD value, workability will be reduced due to thickening. The preferable upper limit of the OD value of the cured product is 4.
The OD value of the moisture-curable resin composition after curing can be measured using an optical densitometer.

The moisture-curable resin composition of the present invention is mainly used for adhesion of adherends in electronic components.
Examples of the adherend that can be adhered using the moisture-curable resin composition of the present invention include various adherends such as metal, glass, and plastic.
Examples of the shape of the adherend include a film shape, a sheet shape, a plate shape, a panel shape, a tray shape, a rod shape, a box shape, a housing shape, and the like.

Examples of the metal include steel, stainless steel, aluminum, copper, nickel, chromium or an alloy thereof.
Examples of the glass include alkaline glass, non-alkali glass, quartz glass and the like.
Examples of the plastic include polyolefin resins such as high-density polyethylene, ultra-high molecular weight polyethylene, isotactic polypropylene, syndiotactic polypropylene, and ethylene propylene copolymer resin, nylon 6 (N6), nylon 66 (N66), and the like. Nylon 46 (N46), Nylon 11 (N11), Nylon 12 (N12), Nylon 610 (N610), Nylon 612 (N612), Nylon 6/66 copolymer (N6 / 66), Nylon 6/66/610 Polymer (N6 / 66/610), Nylon MXD6 (MXD6), Nylon 6T, Nylon 6 / 6T copolymer, Nylon 66 / PP copolymer, Nylon 66 / PPS copolymer and other polyamide-based resins, polybutylene Telephthalate (PBT), polyethylene terephthalate (PET), polyethylene isophthalate (PEI), PET / PEI copolymer, polyarylate (PAR), polybutylene naphthalate (PBN), liquid crystal polyester, polyoxyalkylene diimide diic acid / poly Aromatic polyester resins such as butylene terephthalate copolymer, polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile / styrene copolymer (AS), methacrylonitrile / styrene copolymer, methacrylonitrile / styrene / butadiene Polynitrile-based resins such as copolymers, polycarbonate, polymethacrylate-based resins such as polymethylmethacrylate (PMMA), polyethyl methacrylate, ethylene / vinyl acetate copolymers (EVA), polyvinyl alcohol (PVA), vinyl alcohol / Examples thereof include polyvinyl-based resins such as ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), polyvinyl chloride (PVC), vinyl chloride / vinylidene chloride copolymer, and vinylidene chloride / methylacrylate copolymer.

Further, examples of the adherend include a composite material having a metal plating layer on the surface, and examples of the base material for plating the composite material include the above-mentioned metal, glass, plastic and the like.
Further, as the adherend, a material in which a passivation film is formed by passivating a metal surface can be mentioned, and examples of the passivation treatment include heat treatment and anodic oxidation treatment. .. In particular, in the case of an aluminum alloy or the like whose international aluminum alloy name is in the 6000 series, the adhesiveness can be improved by performing an alumite sulfate treatment or an alumite phosphate treatment as the immobilization treatment.

Further, it has a first substrate, a second substrate, and a cured product of the moisture-curable resin composition of the present invention, and at least a part of the first substrate is at least a part of the second substrate. And the assembly parts joined via the cured body of the moisture-curable resin composition are also one of the present inventions.
It is preferable that the first substrate and the second substrate each have at least one electronic component.

According to the present invention, it is possible to provide a moisture-curable resin composition having excellent quick-curing property at the time of moisture-curing. Further, according to the present invention, it is possible to provide an assembly part having a cured product of the moisture-curable resin composition.

(A) is a schematic view showing a case where the adhesiveness evaluation sample is viewed from above, and (b) is a schematic view showing a case where the adhesiveness evaluation sample is viewed from the side.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

(Synthesis Example 1 (Production of Moisture Curable Urethane Resin A))
As a polyol compound, 100 parts by weight of polytetramethylene ether glycol (manufactured by Mitsubishi Chemical Corporation, "PTMG-2000") and 0.01 parts by weight of dibutyltin dilaurate are placed in a 500 mL separable flask and placed under vacuum (20 mmHg). Below), stirred at 100 ° C. for 30 minutes and mixed. After that, the pressure was adjusted to normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate (“Pure MDI” manufactured by Nippon Soda Corporation) was added as a polyisocyanate compound, and the mixture was stirred at 80 ° C. for 3 hours to react, and then the moisture-curable urethane resin A (weight). An average molecular weight of 2700) was obtained.

(Synthesis Example 2 (Production of Moisture Curable Urethane Resin B))
In a reaction vessel containing 100 parts by weight of the moisture-curable urethane resin A obtained in the same manner as in Synthesis Example 1, 9.8 parts by weight of 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-803"). Was added, and the mixture was stirred and mixed at 80 ° C. for 1 hour to obtain a moisture-curable urethane resin B (weight average molecular weight 3100) having a trimethoxysilyl group.

(Examples 1 to 8 and Comparative Examples 1 to 5)
According to the compounding ratios shown in Tables 1 and 2, each material is stirred with a planetary stirrer (Sinky, "Awatori Rentaro"), and then uniformly mixed with three ceramic rolls. The moisture-curable resin compositions of Examples 1 to 8 and Comparative Examples 1 to 5 were obtained.

<Evaluation>
The following evaluations were carried out for each moisture-curable resin composition obtained in Examples and Comparative Examples. The results are shown in Tables 1 and 2.

(Storage stability)
For each moisture-curable resin composition obtained in Examples and Comparative Examples, the initial viscosity immediately after production and the viscosity when stored at 25 ° C. for 1 week were measured (25 ° C. after storage for 1 week). The value represented by (viscosity) / (initial viscosity) was determined as the rate of change in viscosity. Storage stability is defined as "○" when the viscosity change rate is less than 1.2, "△" when it is 1.2 or more and less than 1.5, and "×" when it is 1.5 or more. Was evaluated.
The viscosity was measured using a cone plate type viscometer (manufactured by Toki Sangyo Co., Ltd., [VISCOMETER TV-22]) under the condition of a rotation speed of 1 rpm at 25 ° C.

(Adhesiveness (adhesive strength after leaving for 3 hours and after leaving for 24 hours))
Each moisture-curable resin composition obtained in Examples and Comparative Examples was applied to an aluminum substrate with a width of about 1 mm using a dispensing device, and ultraviolet rays were applied to 1000 mJ / by using a UV-LED (wavelength 365 nm). After photo-curing by irradiating with cm ² , a glass plate was attached to an aluminum substrate, a weight of 100 g was placed, and the mixture was left to stand for a predetermined time to be moisture-cured to obtain a sample for adhesiveness evaluation. As the adhesiveness evaluation sample, a sample left for 3 hours and a sample left for 24 hours after the weight was placed were prepared. FIG. 1 is a schematic view showing a case where the adhesiveness evaluation sample is viewed from above (FIG. 1 (a)) and a schematic view showing a case where the adhesiveness evaluation sample is viewed from the side (FIG. 1 (b)). showed that. The following measurements were carried out for each adhesiveness evaluation sample immediately after the elapse of the standing time.
The prepared sample for adhesiveness evaluation is pulled at a speed of 5 mm / sec in the shearing direction using a tensile tester (manufactured by Shimadzu Corporation, "Ez-Graph") at 25 ° C., and the aluminum substrate and the glass plate are peeled off. The strength of the edge was measured.

According to the present invention, it is possible to provide a moisture-curable resin composition having excellent quick-curing property at the time of moisture-curing. Further, according to the present invention, it is possible to provide an assembly part having a cured product of the moisture-curable resin composition.

1 Aluminum substrate 2 Moisture-curable resin composition 3 Glass plate

Claims (8)

A moisture-curable resin composition containing a moisture-curable urethane resin, a radically polymerizable compound, and a photoradical polymerization initiator.
It contains an alkoxysilyl group-containing compound that is not a moisture-curable urethane resin and / or a moisture-curable urethane resin having an alkoxysilyl group, a moisture-curing acceleration catalyst, and a silanol condensation catalyst .
The content of the moisture curing accelerating catalyst is 0.05 parts by weight or more and 3 parts by weight or less with respect to 100 parts by weight of the moisture curing urethane resin.
A moisture-curable resin composition characterized in that the content of the silanol condensation catalyst is 0.01 parts by weight or more and 3 parts by weight or less in 100 parts by weight of the moisture-curable resin composition. The moisture-curable resin composition according to claim 1, wherein the alkoxysilyl group-containing compound, which is not a moisture-curable urethane resin, contains a silane coupling agent. The moisture-curable resin composition according to claim 1 or 2, wherein the moisture-curing accelerating catalyst is an amine catalyst. The moisture-curable resin composition according to claim 1, 2 or 3 , wherein the silanol condensation catalyst is an organic titanium compound and / or an organic zirconium compound. The moisture-curable resin composition according to claim 1, 2, 3 or 4 , which contains a filler having a primary particle size of 1 nm or more and 50 nm or less. The moisture-curable resin composition according to claim 1, 2, 3, 4 or 5, which contains a light-shielding agent. It has a first substrate, a second substrate, and a cured product of the moisture-curable resin composition according to claim 1, 2, 3, 4, 5 or 6.
An assembly component characterized in that at least a part of the first substrate is bonded to at least a part of the second substrate via a cured body of the moisture-curable resin composition. The assembled component according to claim 7 , wherein each of the first substrate and the second substrate has at least one electronic component.

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