CN109071749A - Moisture-curable resin combination and assembling parts - Google Patents
Moisture-curable resin combination and assembling parts Download PDFInfo
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- CN109071749A CN109071749A CN201780026226.0A CN201780026226A CN109071749A CN 109071749 A CN109071749 A CN 109071749A CN 201780026226 A CN201780026226 A CN 201780026226A CN 109071749 A CN109071749 A CN 109071749A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/302—Water
- C08G18/307—Atmospheric humidity
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3893—Low-molecular-weight compounds having heteroatoms other than oxygen containing silicon
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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Abstract
A kind of moisture-curable resin combination of having excellent fast curing when the present invention provides moisture-curable.Further it is provided that the assembling parts of the solidfied material with the moisture-curable resin combination.A kind of moisture-curable resin combination, it is the moisture-curable resin combination containing moisture-curable carbamate resins, is contained: the compound containing alkoxysilyl, the moisture-curable of moisture-curable carbamate resins and/or non-moisture-curable carbamate resins with alkoxysilyl promote catalyst and silanol condensation catalyst.
Description
Technical field
The present invention relates to the moisture-curable resin combinations of having excellent fast curing when moisture-curable.In addition, this hair
It is bright to be related to the assembling parts of the solidfied material with the moisture-curable resin combination.
Background technique
In recent years, as having many characteristics, such as the low display element of thin volume, light weight, power consumption, liquid crystal is utilized extensively
Show element, organic EL display element etc..For these display elements, usually in the sealing of liquid crystal or luminescent layer, substrate, optics
Photocurable resin composition is used in bonding of the various parts such as film, protective film etc..
However, the part reached will be unable to fully in light by, which having, is coated with light-cured type tree with the miniaturization of display element
The case where oil/fat composition, as a result, the solidification in the presence of the photocurable resin composition for being applied to the part that light can not reach becomes
Obtain insufficient problem.Thus, also carry out operations described below: even if as in the case where being applied to the part that light can not reach
Also can sufficiently cured resin combination and use photo-thermal curing type resin combination, photocuring and heat cure are carried out simultaneously
With, but have and dysgenic worry is caused to element etc. because of the heating under high temperature.
In addition, in recent years, highly integrated, miniaturization is required to electronic components such as semiconductor chips, for example, carried out by
The operation for the laminated body that semiconductor chip is made in multiple thin semiconductor core chip bondings by adhesive layer.Such semiconductor core
The laminated body of piece is for example manufactured by following methods etc.: on a semiconductor chip in a after coating adhesive, by the bonding
Another semiconductor chip is laminated in agent, thereafter, makes the cured method of bonding agent；In the semiconductor for separating certain intervals and keeping
Bonding agent is filled between chip, thereafter, makes the cured method of bonding agent.
As bonding agent used in the bonding in such electronic component, For example, Patent Document 1 discloses numbers to divide equally
The heat curable adhesive containing epoxide that son amount is 600~1000.However, disclosing such heat in patent document 1
Curing type bonding agent is unsuitable for being possible to the bonding of the electronic component damaged by heat.
It can make the cured method of resin combination as without the heating under high temperature, have studied using moisture-curable
The method of resin combination.For example, Patent Document 2 discloses by making in isocyanate group and the air in resin or being glued
Moisture (moisture) in object reacts and carries out the moisture-curable resin combination of crosslinking curing.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-178342 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2002-212534 bulletin
Summary of the invention
Problems to be solved by the invention
The object of the present invention is to provide the moisture-curable resin combinations of having excellent fast curing when moisture-curable
Object.In addition, the present invention provides the assembling parts with the solidfied material of the moisture-curable resin combination.
The solution to the problem
The present invention is a kind of moisture-curable resin combination, to contain the wet of moisture-curable carbamate resins
Curing type resin combination, contains: with the moisture-curable carbamate resins of alkoxysilyl and/or non-
The compound containing alkoxysilyl of moisture-curable carbamate resins；Moisture-curable promotes catalyst；And silicon
Alkanol condensation catalyst.
The present invention described below.
The inventors of the present invention are had studied for the purpose of improving workability etc. to containing moisture-curable carbamate resins
It is compounded moisture-curable in moisture-curable resin combination and promotes catalyst, so that rapidly-curable when making moisture-curable mentions
It is high.Although however, by compounding moisture-curable promote catalyst observe to a certain degree raising rapidly-curable effect,
But still insufficient, moisturizing to solidify if expecting the further increasing for rapidly-curable when moisture-curable promotes catalyst
Compounding amount then confirms the phenomenon that initial bonding force reduces instead.The inventors of the present invention think: the reason of initial bonding force reduces exists
In, although moisture-curable promotes catalyst to promote the moisture-curable reactions of moisture-curable carbamate resins, its with it is viscous
The reaction for connecing substrate interface becomes inadequate, as a result, being easy to happen interfacial failure.
Thus, the inventors of the present invention carried out deeper into research, as a result, it has been found that: contain moisture-curable carbamate
Resin and moisture-curable promote in the moisture-curable resin combination of catalyst, as the moisture-curable carbamate tree
Rouge and/or other ingredients and be compounded the compound containing alkoxysilyl, and then be compounded act on these alkoxy silicanes
The silanol condensation catalyst of base, thus, it is possible to the moisture-curable resin groups of having excellent fast curing when obtaining moisture-curable
Object is closed, so as to complete the present invention.
Moisture-curable resin combination of the invention contains moisture-curable carbamate resins.
Above-mentioned moisture-curable carbamate resins have isocyanate group in the molecule.The isocyanic acid of above-mentioned intramolecular
Ester group is cured with the reaction of moisture in air or in adherend.Above-mentioned moisture-curable carbamate resins preferably exist
Molecular end has isocyanate group.Above-mentioned moisture-curable carbamate resins can further have amino in the molecule
Formic acid ester bond.
Above-mentioned moisture-curable carbamate resins can only have 1 isocyanate group in 1 molecule, can also have
There are 2 or more.
Above-mentioned moisture-curable carbamate resins can be by making the polynary alcoholization in 1 molecule with 2 or more hydroxyls
Close object, reacting with the polyisocyanate compound in 1 molecule with 2 or more isocyanate group obtains.
Above-mentioned polyol compound reacts usually with polyisocyanate compound with the hydroxyl in polyol compound
(OH) model of the molar ratio computing of the isocyanate group (NCO) and in polyisocyanate compound in [NCO]/[OH]=2.0~2.5
It encloses to carry out.
As the polyol compound for the raw material for becoming above-mentioned moisture-curable carbamate resins, can be used poly-
Usually used well known polyol compound in the manufacture of urethane can enumerate such as polyester polyol, polyether polyol, gather
Alkylidene polyol, polycarbonate polyol etc..These polyol compounds may be used alone, can also be used in combination two kinds
More than.
As above-mentioned polyester polyol, such as polyester as obtained from the reacting of polybasic carboxylic acid and polyalcohol can be enumerated
Polyalcohol makes 6-caprolactone carry out poly- 6-caprolactone polyalcohol obtained from ring-opening polymerisation etc..
As become above-mentioned polyester polyol raw material above-mentioned polybasic carboxylic acid, can enumerate such as terephthalic acid (TPA),
Phthalic acid, 1,5- naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid,
Decanedioic acid, decamethylene dioctyl phthalate, ten dimethylene dioctyl phthalate etc..
As the above-mentioned polyalcohol for the raw material for becoming above-mentioned polyester polyol, such as ethylene glycol, propylene glycol, 1 can be enumerated,
3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-PD, 1,6- hexylene glycol, diethylene glycol, cyclohexanediol etc..
As above-mentioned polyether polyol, such as ethylene glycol, propylene glycol, the ring-opening polymerization polymer of tetrahydrofuran, 3- can be enumerated
The ring-opening polymerization polymer of methyltetrahydrofuran and they or derivatives thereof random copolymer or block copolymer, bisphenol type
Polyoxyalkylene-modified body etc..
The polyoxyalkylene-modified body of above-mentioned bisphenol type is to make epoxyalkane (such as ethylene oxide, propylene oxide, epoxy fourth
Alkane, epoxy iso-butane etc.) with the active hydrogen moieties of bisphenol type molecular skeleton polyether polyol obtained from addition reaction occurs, it can
Think random copolymer, or block copolymer.The polyoxyalkylene-modified body of above-mentioned bisphenol type is preferably in bisphenol type molecule
Two terminal additions of skeleton have one kind or two or more epoxyalkane.As bisphenol type, be not particularly limited, can enumerate A type,
F type, S type etc., preferably bisphenol A-type.
As above-mentioned polyalkylene polyol, can enumerate for example polybutadiene polyol, hydrogenated butadiene polymer polyalcohol,
Hydrogenated polyisoprene polyalcohol etc..
As above-mentioned polycarbonate polyol, such as polyhexamethylene carbonate polyol, polycyclic hexane two can be enumerated
Carbonate polyalcohol etc..
As the polyisocyanate compound for the raw material for becoming above-mentioned moisture-curable carbamate resins, can enumerate
Such as liquid modified object, polymeric MDI, the toluene two of methyl diphenylene diisocyanate (MDI), methyl diphenylene diisocyanate
Isocyanates, naphthalene -1,5- diisocyanate etc..Wherein, go out from the viewpoint of the low viewpoint of steam pressure and toxicity, processing easness
Hair, preferably methyl diphenylene diisocyanate and its modifier.Above-mentioned polyisocyanate compound can be used alone, can also
It is two or more to be applied in combination.
In addition, it is preferable to use with the polynary of structure shown in following formula (1) for above-mentioned moisture-curable carbamate resins
Alcoholic compound and obtain.By using the polyol compound with structure shown in following formula (1), can obtain excellent in adhesion
Composition and the soft and good solidfied material of elongation, become with the compatibility of aftermentioned free-radical polymerised compound
It is excellent.
Wherein, it is preferable to use by propylene glycol, the ring opening polymerizable compound of tetrahydrofuran (THF) compound or with first
The polyether polyol that the ring opening polymerizable compound of the tetrahydrofuran-compound of the substituent groups such as base is formed.
In formula (1), R indicates hydrogen, methyl or ethyl, the integer that l is 0~5, the integer that m is 1~500, n be 1~10 it is whole
Number.It is preferably 50~200, n is preferably 1~5 that l, which is preferably 0~4, m,.
It should be noted that l refers to the directly oxygen-bonded situation of the carbon being bonded with R the case where being 0.
Moisture-curable resin combination of the invention is without containing aftermentioned non-moisture-curable carbamate resins
When compound containing alkoxysilyl, in moisture-curable resin combination of the invention, as above-mentioned moisture-curable
Carbamate resins and must containing with alkoxysilyl moisture-curable carbamate resins.
As the alkoxy first silicon in the above-mentioned moisture-curable carbamate resins with alkoxysilyl
Alkyl, can enumerate for example trimethoxysilyl, methyl dimethoxy oxygroup silicyl, dimethylmethoxysilylgroups groups,
Triethoxysilyl, methyl diethoxy silicyl, methyl dimethoxy oxygroup triethoxysilyl etc..It is above-mentioned that there is alkane
The moisture-curable carbamate resins of oxygroup silicyl can have above-mentioned alkoxy first silicon in the main chain terminal of molecule
Alkyl can also have above-mentioned alkoxysilyl in the side chain of molecule, preferably have above-mentioned alkane in the main chain terminal of molecule
Oxygroup silicyl.
Moisture-curable resin combination of the invention contains the above-mentioned moisture-curable ammonia with alkoxysilyl
It is above-mentioned that there is alkoxysilyl in above-mentioned 100 parts by weight of moisture-curable carbamate resins when carbamate resin
Moisture-curable carbamate resins content preferred lower limit be 5 parts by weight, preferred upper limit is 70 parts by weight.By making
The content of the above-mentioned moisture-curable carbamate resins with alkoxysilyl is the range, so that it is solid to take into account moisture
The effect of the cementability after rapidly-curable and moisture-curable when change becomes more excellent.It is above-mentioned with alkoxysilyl
The more preferable lower limit of the content of moisture-curable carbamate resins is 20 parts by weight, the more preferable upper limit is 60 parts by weight.
In turn, above-mentioned moisture-curable carbamate resins can have free-radical polymerised functional group.
As the free-radical polymerised functional group that above-mentioned moisture-curable carbamate resins can have, preferably have
There is the group of unsaturated double-bond, especially from reactive aspect, more preferably (methyl) acryloyl group.
It should be noted that with free-radical polymerised functional group moisture-curable carbamate resins not included in
In aftermentioned free-radical polymerised compound, but handled as moisture-curable carbamate resins.
The weight average molecular weight of above-mentioned moisture-curable carbamate resins is not particularly limited, preferred lower limit be 800,
The preferred upper limit is 10,000.By making the weight average molecular weight of the above-mentioned moisture-curable carbamate resins range, thus institute
The moisture-curable resin combination obtained crosslink density in solidification will not become excessively high, and flexibility becomes more excellent, and is coated with
Property becomes more excellent.The more preferable lower limit of the weight average molecular weight of above-mentioned moisture-curable carbamate resins be 2000, it is more excellent
It chooses and is limited to 8000, further preferred lower limit is 2500, the further preferred upper limit is 6000.
It should be noted that above-mentioned weight average molecular weight is surveyed using gel permeation chromatography (GPC) in this specification
Value that is fixed, and being found out using polystyrene conversion.It is converted as using GPC based on polystyrene come when measuring weight average molecular weight
Column, can enumerate such as Shodex LF-804 (Showa Denko K. K's system).In addition, as molten used in GPC
Agent can enumerate tetrahydrofuran etc..
In 100 parts by weight of moisture-curable resin combination of the invention, above-mentioned moisture-curable carbamate resins
Content preferred lower limit be 20 parts by weight, preferred upper limit is 90 parts by weight.By the content for making above-mentioned moisture-curable resin
For the range, so that resulting moisture-curable resin combination can maintain excellent weatherability, the flexibility of solidfied material, and wet
Curing property becomes more excellent.The more preferable lower limit of the content of above-mentioned moisture-curable carbamate resins be 30 parts by weight,
The more preferable upper limit is 75 parts by weight.
Moisture-curable resin combination of the invention contains moisture-curable and promotes catalyst.
Promote catalyst as above-mentioned moisture-curable, due to promoting the moisture of above-mentioned moisture-curable carbamate resins
The excellent effect of curing reaction, thus preferably amine catalyst.Wherein, preferably tertiary amine catalyst particularly preferably has
The tertiary amine catalyst of quinoline skeleton.As above-mentioned amine catalyst, such as morpholine, 4- morpholinyl -1- cyclohexene, 1- morpholine can be enumerated
Base -1- cyclopentene, 2- (N- morpholinyl) ethane sulfonic acid, 2,2 '-dimorpholine base Anaesthetie Ethers, triethylamine, two (2,6- dimethyl
Quinoline base ethyl) ether, two (2,6- diethyl morpholinyl ethyl) ethers, Isosorbide-5-Nitrae-diazabicyclo [2.2.2] octane, 2,6,7- front threes
Base-Isosorbide-5-Nitrae-diazabicyclo [2.2.2] octane etc..
Relative to above-mentioned 100 parts by weight of moisture-curable carbamate resins, above-mentioned moisture-curable promotes catalyst
The preferred lower limit of content is 0.05 parts by weight, preferred upper limit is 3 parts by weight.By making above-mentioned moisture-curable promote containing for catalyst
Amount is the range, thus while maintaining the excellent storage stability of resulting moisture-curable resin combination, in promotion
The effect for stating the moisture-curable reaction of moisture-curable carbamate resins becomes more excellent.Above-mentioned moisture-curable promotes catalysis
The more preferable lower limit of the content of agent is 0.1 parts by weight, the more preferable upper limit is 2 parts by weight.
As the alkane in the compound containing alkoxysilyl of above-mentioned non-moisture-curable carbamate resins
Oxygroup silicyl can enumerate and the base in the above-mentioned moisture-curable carbamate resins with alkoxysilyl
The identical group of group.The compound containing alkoxysilyl of above-mentioned non-moisture-curable carbamate resins can divide
The main chain terminal of son has above-mentioned alkoxysilyl, can also have above-mentioned alkoxysilyl in the side chain of molecule,
It is preferred that the main chain terminal in molecule has above-mentioned alkoxysilyl.
As the compound containing alkoxysilyl of above-mentioned non-moisture-curable carbamate resins, can enumerate
Such as silane coupling agent.
As above-mentioned silane coupling agent, can enumerate for example vinyltrimethoxysilane, vinyltriethoxysilane,
2- (3,4- epoxycyclohexyl) ethyl trimethoxy silane, 3- epoxy propoxy propyl methyl dimethoxysilane, 3- epoxy third
Oxygroup propyl trimethoxy silicane, 3- glycidoxypropyl diethoxy silane, three ethoxy of 3- glycidoxypropyl group
Base silane, to styryltrimethoxysilane, 3- methacryloxypropylmethyl dimethoxysilane, 3- metering system
Acryloxypropylethoxysilane trimethoxy silane, 3- methacryloxypropyl methyl diethoxysilane, 3- methacryloxy
Propyl-triethoxysilicane, 3- acryloyloxypropyltrimethoxysilane, N-2- (amino-ethyl) -3- amino propyl methyl two
Methoxy silane, N-2- (amino-ethyl) -3- TSL 8330,3- TSL 8330,3- ammonia
Base propyl-triethoxysilicane, 3- triethoxysilyl-N- (1,3- dimethyl butane) propylamine, N- phenyl -3- amino
Propyl trimethoxy silicane, N- (vinyl benzyl) -2- amino-ethyl -3- TSL 8330,3- ureido-propyl
Triethoxysilane, 3- mercapto propyl methyl dimethoxy silane, 3-mercaptopropyi trimethoxy silane, 3- isocyanate group third
Ethyl triethoxy silicane alkane, methyltrimethoxysilane, dimethyldimethoxysil,ne, phenyltrimethoxysila,e, three second of methyl
Oxysilane, dimethyl diethoxysilane, phenyl triethoxysilane, hexyl trimethoxysilane, hexyl triethoxysilicane
Alkane, ruthenium trimethoxysilane, trifluoro propyl trimethoxy silane etc..
Moisture-curable resin combination of the invention contain above-mentioned non-moisture-curable carbamate resins containing alkane
When the compound of oxygroup silicyl, in 100 parts by weight of moisture-curable resin combination of the invention, above-mentioned non-moisture-curable
The preferred lower limit of the content of the compound containing alkoxysilyl of type carbamate resins be 0.05 parts by weight, preferably on
It is limited to 3 parts by weight.By the compound containing alkoxysilyl for making above-mentioned non-moisture-curable carbamate resins
Content is the range, thus the rapidly-curable and moisture when taking into account moisture-curable of resulting moisture-curable resin combination
The effect of cementability after solidification becomes more excellent.Above-mentioned non-moisture-curable carbamate resins contain alkoxy silicane
The more preferable lower limit of the content of the compound of base is 0.1 parts by weight, the more preferable upper limit is 2 parts by weight.
Moisture-curable resin combination of the invention contains silanol condensation catalyst.It is urged as above-mentioned silanol condensation
Agent, preferably organo-metallic catalyst.As above-mentioned organo-metallic catalyst, such as organic titanic compound can be enumerated, had
Machine zirconium compounds, organic zinc compound, organo-tin compound, organo-aluminum compound, bismuth organic compound etc..Wherein, by institute
The rapidly-curable when moisture-curable of the moisture-curable resin combination obtained becomes more excellent, therefore preferably organic titanizing
Close object and/or organic zirconate, further preferably organic zirconate.
As above-mentioned organic titanic compound, such as tetraisopropyl titanate, tetra-n-butyl titanate, butyl titanate two can be enumerated
Polymers, four monooctyl ester of metatitanic acid, four tert-butyl ester of metatitanic acid, four stearyl ester of metatitanic acid (テ foretells ラ ヅ テ ア リ Le チ タ ネ mono- and foretells), acetoacetate titanium
Deng.
As above-mentioned organic zirconate, such as zirconium-n-propylate, ethyl acetic acid zirconium, four acetylacetone,2,4-pentanedione zirconiums can be enumerated
Deng.
In 100 parts by weight of moisture-curable resin combination of the invention, the content of above-mentioned silanol condensation catalyst
Preferred lower limit is 0.01 parts by weight, preferred upper limit is 3 parts by weight.By making the content of the above-mentioned silanol condensation catalyst model
It encloses, so that resulting moisture-curable resin combination can maintain excellent storage stability, and quick solid when moisture-curable
The property changed becomes more excellent.The more preferable lower limit of the content of above-mentioned silanol condensation catalyst is 0.05 parts by weight, further preferably
Lower limit is 0.1 parts by weight, and the more preferable upper limit is 2 parts by weight.
Moisture-curable resin combination of the invention can polymerize containing free-radical polymerised compound and optical free radical
Initiator.
By containing above-mentioned free-radical polymerised compound and above-mentioned optical free radical polymerization initiator, moisture of the invention is solid
Change type resin combination can be used as the light moisture-curable resin combination with photo-curable and moisture-curable and especially fit
It closes ground and is used for display element sealant.
As above-mentioned free-radical polymerised compound, as long as the free-radical polymerised compound with optical polymerism is
Can, as long as with the compound of free-radical polymerised functional group in molecule, there is no particular limitation, be suitably for that there is unsaturation
Compound of the double bond as free-radical polymerised functional group is particularly suitable for from reactive aspect as with (methyl) third
The compound (hereinafter also referred to " (methyl) acrylic compounds ") of enoyl-.
It should be noted that above-mentioned " (methyl) acryloyl group " refers to acryloyl group or methacryl in this specification
Base, above-mentioned " (methyl) acrylic compounds " refer to acrylic compounds or methacrylic.
As above-mentioned (methyl) acrylic compounds, can enumerate for example by making the compound with hydroxyl and (first
Base) acrylic acid react obtained from (methyl) acrylate compounds, by making (methyl) acrylic acid and epoxide
Epoxy obtained from reacting (methyl) acrylate, by making (methyl) acrylic acid derivative with hydroxyl and isocyanic acid
Carbamate obtained from ester compounds react (methyl) acrylate etc..
It should be noted that above-mentioned " (methyl) acrylate " refers to acrylate or methacrylic acid in this specification
Ester.In addition, becoming the isocyanate group in the isocyanate compound of the raw material of above-mentioned carbamate (methyl) acrylate
It is completely used for the formation of urethane bond, above-mentioned carbamate (methyl) acrylate does not have remaining isocyanates
Base.
As the monofunctional compound among above-mentioned (methyl) acrylate compounds, such as N- acryloyl-oxy can be enumerated
The phthalimides esters of acrylic acid such as base ethyl hexahydrophthalic phthalimide, various acid imides (methyl) acrylate,
(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) n-butyl acrylate, (methyl)
Isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) n-octyl, (methyl) Isooctyl acrylate monomer, (methyl)
2-EHA, the different nonyl ester of (methyl) acrylic acid, (methyl) isodecyl acrylate, (methyl) lauryl acrylate, (first
Base) the different myristin of acrylic acid, (methyl) stearyl acrylate, (methyl) cyclohexyl acrylate, (methyl) isobomyl acrylate
Ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) benzyl acrylate, (methyl) acrylic acid 2- hydroxy methacrylate, (methyl) third
Olefin(e) acid 2- hydroxy propyl ester, (methyl) acrylic acid 2- hydroxybutyl, (methyl) acrylic acid 4- hydroxybutyl, (methyl) acrylic acid 2- first
Oxygroup ethyl ester, (methyl) acrylic acid 2- ethoxy ethyl ester, (methyl) acrylic acid 2- butoxyethyl, methoxy ethyl glycol (methyl)
Acrylate, methoxy poly (ethylene glycol) (methyl) acrylate, ethyl carbitol (methyl) acrylate, (methyl) acrylic acid four
Hydrogen chaff ester, (methyl) acrylic acid 2- phenoxy ethyl, phenoxy group diethylene glycol (methyl) acrylate, phenoxy group polyethylene glycol
(methyl) acrylate, (methyl) acrylic acid 2,2,2- trifluoro ethyl ester, 2,2,3,3- tetrafluoro propyl ester of (methyl) acrylic acid, (methyl)
Acrylic acid 1H, 1H, 5H- octafluoro pentyl ester, (methyl) dimethylaminoethyl acrylate, (methyl) diethylaminoethyl acrylate, 2-
(methyl) acryloyl-oxyethyl succinic acid, 2- (methyl) acryloyl-oxyethyl hexahydrophthalic acid, 2- (methyl) propylene
Trimethylammonium -2- hydroxypropyl phthalate, (methyl) glycidyl acrylate, 2- (methyl) acryloxy second
Base phosphate etc..
In addition, closing object as the difunctional among above-mentioned (methyl) acrylate compounds, such as 1,3- can be enumerated
Butanediol two (methyl) acrylate, 1,4-butanediol two (methyl) acrylate, 1,6- hexylene glycol two (methyl) acrylate,
1,9- nonanediol two (methyl) acrylate, 1,10- decanediol two (methyl) acrylate, 2- normal-butyl -2- ethyl -1,3- third
Glycol two (methyl) acrylate, ethylene glycol two (methyl) acrylate, diethylene glycol two (methyl) acrylate, tetraethylene glycol
Two (methyl) acrylate, polyethylene glycol two (methyl) acrylate, dipropylene glycol two (methyl) acrylate, tripropylene glycol two
(methyl) acrylate, polypropylene glycol two (methyl) acrylate, ethyleneoxide addition bisphenol-A two (methyl) acrylate, ring
Ethylene Oxide addition bisphenol-A two (methyl) acrylate, ethyleneoxide addition Bisphenol F two (methyl) acrylate, dihydroxymethyl two
Cyclopentadienyl group two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, two (first of ethylene-oxide-modified isocyanuric acid
Base) acrylate, 2- hydroxyl -3- (methyl) acryloxypropyl (methyl) acrylate, carbonate diol two (methyl) third
Olefin(e) acid ester, polyetherdiol two (methyl) acrylate, polyester-diol two (methyl) acrylate, polycaprolactone glycol two (methyl)
Acrylate, polybutadiene diol two (methyl) acrylate etc..
In addition, example can be enumerated as the compound more than trifunctional among above-mentioned (methyl) acrylate compounds
Such as trimethylolpropane tris (methyl) acrylate, ethyleneoxide addition trimethylolpropane tris (methyl) acrylate, epoxy
Propane addition trimethylolpropane tris (methyl) acrylate, caprolactone modification trimethylolpropane tris (methyl) acrylate,
Pentaerythrite three (methyl) acrylate, ethyleneoxide addition isocyanuric acid three (methyl) acrylate, glycerol three (methyl) third
Olefin(e) acid ester, propylene oxide addition glycerol three (methyl) acrylate, three (methyl) acryloyl-oxyethyl phosphates, two (three hydroxyls
Methyl) propane four (methyl) acrylate, pentaerythrite four (methyl) acrylate, dipentaerythritol five (methyl) acrylic acid
Ester, dipentaerythritol six (methyl) acrylate etc..
As above-mentioned epoxy (methyl) acrylate, can enumerate for example by conventionally make epoxide with
Epoxy (methyl) acrylate etc. obtained from (methyl) acrylic acid reacts in the presence of basic catalyst.
As the epoxide become for synthesizing the raw material of above-mentioned epoxy (methyl) acrylate, can enumerate for example
Bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, 2,2 '-diallyl bisphenol type epoxy resin,
A Hydrogenated Bisphenol A type epoxy resin, propylene oxide addition bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy
Resin, thioether-type epoxy resin, diphenyl ether type epoxy, dicyclopentadiene-type epoxy resin, naphthalene type epoxy resin, phenol
Phenol aldehyde type epoxy resin, o-cresol phenol aldehyde type epoxy resin, dicyclopentadiene phenolic type epoxy resin, biphenyl phenolic epoxy tree
Rouge, naphthol novolac type epoxy resin, glycidyl amine type epoxy resin, alkyl polyols type epoxy resin, modified rubber type ring
Oxygen resin, epihydric alcohol ester compound, bisphenol A-type episulfide resin etc..
As the commercially available product among above-mentioned epoxy (methyl) acrylate, can enumerate such as EBECRYL860,
EBECRYL3200、EBECRYL3201、EBECRYL3412、EBECRYL3600、EBECRYL3700、EBECRYL3701、
EBECRYL3702, EBECRYL3703, EBECRYL3800, EBECRYL6040, EBECRYL RDX63182 (are DAICEL-
ALLNEX corporation)；EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (are the village Xin Zhong chemistry
Industrial group's system)；EPOXY ESTER M-600A,EPOXY ESTER 40EM,EPOXY ESTER 70PA,EPOXY ESTER
200PA、EPOXY ESTER 80MFA、EPOXY ESTER 3002M、EPOXY ESTER 3002A、EPOXY ESTER
1600A、EPOXY ESTER 3000M、EPOXY ESTER 3000A、EPOXY ESTER 200EA、EPOXY ESTER 400EA
(being chemical company of common prosperity society system)；DENACOL ACRYLATE DA-141,DENACOL ACRYLATE DA-314,
DENACOL ACRYLATE DA-911 (being Nagase ChemteX corporation) etc..
Above-mentioned carbamate (methyl) acrylate can be for example, by the presence of the tin based compound of catalytic amount
(methyl) acrylic acid derivative with hydroxyl is set to react and obtain with isocyanate compound.
As the isocyanate compound for the raw material for becoming above-mentioned carbamate (methyl) acrylate, example can be enumerated
Such as isophorone diisocyanate, 2,4- toluene di-isocyanate(TDI), 2,6- toluene di-isocyanate(TDI), hexa-methylene diisocyanate
Ester, trimethyl hexamethylene diisocyanate, 4,4 '-diisocyanate (MDI) of diphenyl methane-, hydrogenation MDI, polymeric MDI,
1,5- naphthalene diisocyanate, norbornene alkyl diisocyanate, tolidine diisocyanate, benzene dimethylene diisocyanate
(XDI), XDI, lysine diisocyanate, triphenylmethane triisocyanate, three (isocyanatophenyi) thio phosphorus are hydrogenated
Acid esters, tetramethylxylylene diisocyanate, 1,6,11- hendecane triisocyanates etc..
In addition, also can be used for example as above-mentioned isocyanate compound through ethylene glycol, propylene glycol, glycerol, sorb
The polyalcohols such as sugar alcohol, trimethylolpropane, carbonate diol, polyetherdiol, polyester-diol, polycaprolactone glycol with it is excessive different
Through the isocyanate compound of chain elongation obtained from the reaction of cyanate esters.
(methyl) acrylic acid with hydroxyl as the raw material for becoming above-mentioned carbamate (methyl) acrylate spreads out
Biology can enumerate two such as ethylene glycol, propylene glycol, 1,3-PD, 1,3-BDO, 1,4-butanediol, polyethylene glycol
List (methyl) acrylate of first alcohol；List (methyl) acrylic acid of the trihydroxylic alcohols such as trimethylolethane, trimethylolpropane, glycerol
Ester or two (methyl) acrylate；Bisphenol type epoxy (methyl) acrylate etc. epoxies (methyl) acrylate etc..
As the commercially available product among above-mentioned carbamate (methyl) acrylate, such as M-1100, M- can be enumerated
1200, M-1210, M-1600 (being East Asia Synesis Company system)；EBECRYL230,EBECRYL270,EBECRYL4858,
EBECRYL8402、EBECRYL8411、EBECRYL8412、EBECRYL8413、EBECRYL8804、EBECRYL8803、
EBECRYL8807、EBECRYL9260、EBECRYL1290、EBECRYL5129、EBECRYL4842、EBECRYL210、
EBECRYL4827, EBECRYL6700, EBECRYL220, EBECRYL2220, KRM7735, KRM-8295 (are DAICEL-
ALLNEX corporation)；Art Resin UN-9000H,Art Resin UN-9000A,Art Resin UN-7100,Art
Resin UN-1255、Art Resin UN-330、Art Resin UN-3320HB、Art Resin UN-1200TPK、Art
Resin SH-500B (being Gen Shang industrial group system)；U-2HA,U-2PHA,U-3HA,U-4HA,U-6H,U-6LPA,U-6HA,
U-10H、U-15HA、U-122A、U-122P、U-108、U-108A、U-324A、U-340A、U-340P、U-1084A、U-
2061BA、UA-340P、UA-4100、UA-4000、UA-4200、UA-4400、UA-5201P、UA-7100、UA-7200、UA-
W2A (being chemical industrial company of the village Xin Zhong system)；AI-600,AH-600,AT-600,UA-101I,UA-101T,UA-306H,
UA-306I, UA-306T (being chemical company of common prosperity society system) etc..
In addition it is also possible to suitably using other free-radical polymerised compounds in addition to that mentioned above.
As above-mentioned other free-radical polymerised compounds, such as N, N- dimethyl (methyl) acryloyl can be enumerated
Amine, N- (methyl) acryloyl morpholine, N- hydroxyethyl (methyl) acrylamide, N, N- diethyl (methyl) acrylamide, N-
Isopropyl (methyl) acrylamide, N, (methyl) acrylamide compound such as N- dimethylaminopropyl (methyl) acrylamide；
Vinyl compounds such as styrene, α-methylstyrene, n-vinyl-2-pyrrolidone, N- vinyl-Epsilon-caprolactam etc..
From the viewpoint of adjustment curability etc., it is poly- that above-mentioned free-radical polymerised compound preferably comprises monofunctional free radical
Conjunction property compound and multifunctional free-radical polymerised compound.By containing above-mentioned monofunctional free radical's polymerizable compound and upper
Multifunctional free-radical polymerised compound is stated, the curability and adhesiveness of resulting moisture-curable resin combination become more excellent
It is different.Wherein, preferably by as carbamate (methyl) acrylate of above-mentioned multifunctional free-radical polymerised compound with it is upper
Monofunctional free radical's polymerizable compound is stated to be applied in combination.In addition, above-mentioned multifunctional free-radical polymerised compound is preferably two
Function or trifunctional, more preferably two functions.
Above-mentioned free-radical polymerised compound contain above-mentioned monofunctional free radical's polymerizable compound and it is above-mentioned it is multifunctional from
When by base polymerizable compound, relative to above-mentioned monofunctional free radical's polymerizable compound with it is above-mentioned multifunctional free-radical polymerised
Total 100 parts by weight of compound, the preferred lower limit of the content of above-mentioned multifunctional free-radical polymerised compound be 2 parts by weight,
Preferred upper limit is 45 parts by weight.It is resulting wet by making the content of the above-mentioned multifunctional free-radical polymerised compound range
The curability and adhesiveness of curing type resin combination become more excellent.Above-mentioned multifunctional free-radical polymerised compound contains
The more preferable lower limit of amount is 5 parts by weight, the more preferable upper limit is 35 parts by weight.
In 100 parts by weight of moisture-curable resin combination of the invention, the content of above-mentioned free-radical polymerised compound
Preferred lower limit be 10 parts by weight, preferred upper limit is 80 parts by weight.By the content for making above-mentioned free-radical polymerised compound
The range, both photo-curable and moisture-curable of resulting moisture-curable resin combination become more excellent.It is above-mentioned
The more preferable lower limit of the content of free-radical polymerised compound is 30 parts by weight, the more preferable upper limit is 60 parts by weight.
As above-mentioned optical free radical polymerization initiator, such as benzophenone based compound, acetophenone system chemical combination can be enumerated
Object, acylphosphine oxide compound, titanocenes based compound, oxime ester based compound, benzoin ether based compound, thioxanthones etc..
As the commercially available product among above-mentioned optical free radical polymerization initiator, can enumerate such as IRGACURE184,
IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE784、IRGACURE819、IRGACURE907、
IRGACURE2959, IRGACURE OXE01, Lucirin TPO (being BASF AG's system)；Benzoin methylether, benzoin second
Ether, benzoin iso-propylether (being Tokyo chemical conversion industry corporation) etc..
Relative to above-mentioned 100 parts by weight of free-radical polymerised compound, the content of above-mentioned optical free radical polymerization initiator
Preferred lower limit is 0.01 parts by weight, preferred upper limit is 10 parts by weight.By the content for making above-mentioned optical free radical polymerization initiator
The range, the photo-curable and storage stability of resulting moisture-curable resin combination become more excellent.Above-mentioned light is free
The more preferable lower limit of the content of base polymerization initiator is 0.1 parts by weight, the more preferable upper limit is 5 parts by weight.
Moisture-curable resin combination of the invention preferably comprises filler.
By containing above-mentioned filler, moisture-curable resin combination of the invention has suitable thixotropy, can
Fully keep the shape after coating.
The preferred lower limit of the primary particle size of above-mentioned filler is 1nm, preferred upper limit 50nm.By making above-mentioned filler
Primary particle size is the range, so that the coating of resulting moisture-curable resin combination and the shape retention after coating become
Obtain more excellent, the display element particularly suitable for narrow frame design.The more preferable lower limit of the primary particle size of above-mentioned filler is
5nm, the more preferable upper limit are 30nm, and further preferred lower limit is 10nm, the further preferred upper limit is 20nm.
It should be noted that NICOMP 380ZLS (PARTICLE can be used in the primary particle size of above-mentioned filler
SIZING SYSTEMS corporation), and above-mentioned filler is made to be scattered in solvent (water, organic solvent etc.) to measure.
In addition, above-mentioned filler is sometimes in moisture-curable resin combination of the invention with offspring (multiple one
Particle made of secondary particle buildup) form exist, the preferred lower limit of the partial size of such offspring is 5nm, preferred upper limit
For 500nm, more preferable lower limit is 10nm, the more preferable upper limit is 100nm.The partial size of the offspring of above-mentioned filler can be by making
Moisture-curable resin combination or its solidfied material of the invention are observed with transmission electron microscope (TEM) to survey
It is fixed.
As above-mentioned filler, preferably inorganic filler, can enumerate such as silica, talcum, titanium oxide, oxidation
Zinc, calcium carbonate etc..Wherein, since the UV transmissive of resulting moisture-curable resin combination becomes excellent thus excellent
It is selected as silica.These fillers may be used singly or in combination of two or more.
Above-mentioned filler has preferably carried out hydrophobic surface treatments.By above-mentioned hydrophobic surface treatments, resulting moisture
Shape retention after the coating of curable resin composition becomes more excellent.
As above-mentioned hydrophobic surface treatments, silylated processing, alkylation processing, epoxidation processing can be enumerated
Deng.Wherein, due to improving the excellent effect of shape retention, thus preferably silylated processing, more preferably trimethyl
Silylated processing.
As the method for carrying out hydrophobic surface treatments to above-mentioned filler, can enumerate for example using surface treating agent pair
The method etc. that the surface of filler is handled.
Specifically, above-mentioned trimethylsilylation processing silica can be made for example, by following methods:
For example, spraying two silicon of hexamethyl in the state of making silica flow using the methods of sol-gal process synthetic silica
The method of the surface treating agents such as azane；Silica is added into organic solvents such as alcohol, toluene, further adds two silicon of hexamethyl
After the surface treating agents such as azane and water, water and organic solvent is set to be evaporated dry method etc. using evaporator.
In 100 parts by weight of moisture-curable resin combination of the invention, the preferred lower limit of the content of above-mentioned filler is 1
Parts by weight, preferred upper limit are 20 parts by weight.By making the content of the above-mentioned filler range, resulting moisture-curable resin
The coating of composition and the shape retention after coating become more excellent.The more preferable lower limit of the content of above-mentioned filler is 2
Parts by weight, the more preferable upper limit are 15 parts by weight, and further preferred lower limit is 3 parts by weight, the further preferred upper limit is 10 parts by weight,
Particularly preferred lower limit is 4 parts by weight.
Moisture-curable resin combination of the invention can contain opacifier.
Become excellent by the light-proofness containing above-mentioned opacifier, moisture-curable resin combination of the invention, such as
Light leakage can be prevented when for display element.Further, since moisture-curable resin combination has sufficient light-proofness, thus
The display element manufactured using the moisture-curable resin combination of the invention compounded with above-mentioned opacifier will not light leakage, tool
There is high contrast, there is excellent display quality of image.
It should be noted that above-mentioned " opacifier ", which refers to, has the light transmission for being difficult to make visible light region in this specification
The material of this ability.If the material enumerated as above-mentioned electromagnetic shielding material also has having the capability that, can
Play the effect as above-mentioned opacifier.
As above-mentioned opacifier, black such as iron oxide, titanium, nigrosine, Cyanine Black, fullerene, carbon black, resin can be enumerated
Cover type carbon black etc..In addition, black can not be presented in above-mentioned opacifier, as long as having the light transmission for being difficult to make visible light region
The material of this ability, then material enumerated as filler such as silica, talcum, titanium oxide etc. is also included within above-mentioned
In opacifier.Wherein, preferably titanium is black.
Above-mentioned titanium is black be compared with the average transmittance of the light for 300~800nm of wavelength, it is attached for ultraviolet range
Closely, the higher substance of the transmissivity of the especially light of 370~450nm of wavelength.That is, above-mentioned titanium is black to be had by the way that sufficiently masking can
The light of the wavelength in light-exposed region and assign light-proofness to moisture-curable resin combination of the invention, but keep ultraviolet range attached
The opacifier of this property of the light transmission of close wavelength.Therefore, as optical free radical polymerization initiator, by using can be because upper
The polymerization initiator for stating the light for the wavelength (370~450nm) that the black transmissivity of titanium is got higher and initiation reaction, can make of the invention
The photo-curable of moisture-curable resin combination further increases.On the other hand, as moisture-curable resin of the invention
The high substance of the opacifier contained in composition, preferably insulating properties, the opacifier high as insulating properties, it is black to be also suitably for titanium.
The black optical density of above-mentioned titanium (OD value) is preferably 3 or more, more preferably 4 or more.In addition, the degree of blackness that above-mentioned titanium is black
(L value) is preferably 9 or more, more preferably 11 or more.The higher the better for the black light-proofness of above-mentioned titanium, and the black OD value of above-mentioned titanium is without spy
The not preferred upper limit, generally reaches 5 or less.
Above-mentioned titanium is black to play sufficient effect non-surface treated, and surface also can be used to be had through coupling agent etc.
The processed titanium of machine ingredient is black；It is oxidized the covering of the inorganic constituents such as silicon, titanium oxide, germanium oxide, aluminium oxide, zirconium oxide, magnesia
Titanium is black etc. that surface treated titanium is black.Wherein, from the viewpoint of it can further increase insulating properties, preferably through it is organic at
Divide processed titanium black.
As above-mentioned titanium it is black among commercially available product, can enumerate such as 12S, 13M, 13M-C, 13R-N (is Mitsubishi Materials
Corporation)；Tilack D (red fringe chemical conversion corporation) etc..
The preferred lower limit of the black specific surface area of above-mentioned titanium is 5m2/ g, preferred upper limit 40m2/ g, more preferable lower limit are 10m2/
G, the more preferable upper limit is 25m2/g.In addition, the case where being mixed with resin under (proportion is 70%), the black thin-layer electric of above-mentioned titanium
The preferred lower limit of resistance is 109Ω/, more preferable lower limit are 1011Ω/□。
In moisture-curable resin combination of the invention, the primary particle size of above-mentioned opacifier selects depending on the application and suitably
Distance between the substrate of display element is such as the following, preferred lower limit 30nm, preferred upper limit 500nm.By making above-mentioned shading
The primary particle size of agent is the range, so that viscosity and thixotropy will not substantially increase, resulting moisture-curable resin combination
Coating and workability on substrate become more excellent.The more preferable lower limit of the primary particle size of above-mentioned opacifier is 50nm, more
Preferred upper limit is 200nm.
It should be noted that the primary particle size of above-mentioned opacifier same as the average grain diameter of above-mentioned metallic can operate
To measure.
In 100 parts by weight of moisture-curable resin combination of the invention, the preferred lower limit of the content of above-mentioned opacifier is
0.05 parts by weight, preferred upper limit are 10 parts by weight.By making the content of the above-mentioned opacifier range, so that resulting moisture is solid
Change type resin combination can maintain excellent illustrative, for the intensity after the cementability of substrate etc. and solidification, and light-proofness becomes
It obtains more excellent.The more preferable lower limit of the content of above-mentioned opacifier is 0.1 parts by weight, the more preferable upper limit is 2 parts by weight, further excellent
It chooses and is limited to 1 parts by weight.
Moisture-curable resin combination of the invention can according to need and further containing colorant, ionic liquid,
The additives such as solvent, metalliferous particle, reactive diluent.
As the method for manufacturing moisture-curable resin combination of the invention, can enumerate for example using homogenous disperse
The mixing machines such as device, mixer for well-distribution, omnipotent mixer, epicyclic mixer, kneader, triple-roller mill, by moisture-curable resin or
The compound containing alkoxysilyl of person's moisture-curable resin and non-moisture-curable carbamate resins and wet
It is curing to promote catalyst, silanol condensation catalyst, the as needed free-radical polymerised compound of addition and light freedom
The method etc. that base polymerization initiator, additive are mixed.
Amount of moisture contained by moisture-curable resin combination of the invention is preferably 100ppm or less.It is above-mentioned by making
Amount of moisture is 100ppm hereinafter, so as to inhibit reacting for above-mentioned moisture-curable resin and moisture in saving, and moisture is solid
The storage stability of change type resin combination becomes more excellent.Above-mentioned amount of moisture is more preferably 80ppm or less.
It should be noted that above-mentioned amount of moisture can be measured by karl Fischer moisture content determining device.
The use cone plate type viscometer of moisture-curable resin combination of the invention measures under conditions of 25 DEG C, 1rpm
Viscosity preferred lower limit be 30Pas, preferred upper limit 500Pas.By making the above-mentioned viscosity range, moisture is consolidated
Workability when change type resin combination is coated on the adherends such as substrate becomes more excellent, particularly suitable for the aobvious of narrow frame design
Show element.The more preferable lower limit of above-mentioned viscosity is 50Pas, the more preferable upper limit is 300Pas.
It should be noted that when the viscosity of moisture-curable resin combination of the invention is excessively high, it can be by coating
It is heated to improve coating.
The preferred lower limit of the thixotropic index of moisture-curable resin combination of the invention is 1.2, preferred upper limit 5.0.
By making the above-mentioned thixotropic index range, the coating of resulting moisture-curable resin combination and the shape after coating are protected
Holding property becomes more excellent.From being able to maintain coating width aspect, the shape retention is in such as narrow frame design
Technical meaning is very big.In addition, not exposing this state aspect from bonding plane from being able to maintain, in fine semiconductor chip
Bonding in technical meaning it is very big.The more preferable lower limit of above-mentioned thixotropic index is 1.3, the more preferable upper limit is 4.0.
It should be noted that in this specification, above-mentioned thixotropic index refers to using cone plate type viscometer in 25 DEG C, 1rpm
Under the conditions of the viscosity that measures divided by value obtained by the viscosity for using cone plate type viscometer to measure under conditions of 25 DEG C, 10rpm.
The optical density (OD value) of the solidfied material of 1mm thickness after the solidification of moisture-curable resin combination of the invention is preferred
It is 1 or more.It, can by making above-mentioned 1 or more OD value that can prevent light leakage when for display element so that light-proofness is excellent
Obtain high contrast.Above-mentioned OD value is more preferably 1.5 or more.
The higher the better for above-mentioned OD value, if but be compounded excessive opacifier to improve above-mentioned OD value, it is sent out because of thickening
The reduction etc. of raw workability, therefore, in order to obtain the balance with the compounding amount of opacifier, the OD value of above-mentioned solidfied material it is preferred on
It is limited to 4.
It should be noted that the OD value after the solidification of above-mentioned moisture-curable resin combination can be used opacimeter into
Row measurement.
Moisture-curable resin combination of the invention is mainly used for the bonding of adherend in electronic component.
As the adherend for being able to use moisture-curable resin combination of the invention and being bonded, gold can be enumerated
The various adherends such as category, glass, plastics.
As the shape of above-mentioned adherend, it is (rodlike that for example membranaceous, sheet, plate, panel shape, hypocrateriform, bar can be enumerated
Body) shape, case shape, housing shape etc..
As above-mentioned metal, can enumerate such as steel, stainless steel, aluminium, copper, nickel, chromium or its alloy.
As above-mentioned glass, can enumerate such as alkali glass, alkali-free glass, quartz glass.
As above-mentioned plastics, such as high density polyethylene (HDPE), ultra-high molecular weight polyethylene, isotactic poly third can be enumerated
The polyolefin-based resins such as alkene, syndiotactic polypropylene, ethylene propylene copolymer resin；Nylon 6 (N6), nylon66 fiber (N66), nylon
46 (N46), nylon 11 (N11), nylon 12 (N12), nylon 610 (N610), nylon 612 (N612), nylon 6/66 copolymer
(N6/66), 6/66/610 copolymer of nylon (N6/66/610), nylon MXD 6 (MXD6), nylon 6T, nylon 6/6T copolymer, Buddhist nun
The polyamide resins such as imperial 66/PP copolymer, nylon66 fiber/PPS copolymer；Polybutylene terephthalate (PBT) (PBT) gathers to benzene
Naphthalate (PET), polyethylene glycol isophthalate (PEI), PET/PEI copolymer, polyarylate (PAR), poly- naphthalene
Dioctyl phthalate butanediol ester (PBN), liquid crystal polyester, polyoxalkylene diimide diacid/polybutylene terephthalate (PBT) copolymerization
The aromatic polyester resins such as object；Polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile/styrol copolymer (AS), methyl
The polynitriles system such as acrylonitrile/styrol copolymer, methacrylonitrile/styrene/butadiene copolymers resin；Polycarbonate, poly- first
The polymethacrylates systems resins such as base methyl acrylate (PMMA), polyethyl methacrylate；Ethylene/vinyl acetate copolymerization
Object (EVA), polyvinyl alcohol (PVA), vinyl alcohol/ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), polyvinyl chloride
(PVC), polyethylene-based resins such as vinyl chloride/vinylidene chloride copolymer, vinylidene chloride/methyl acrylate copolymer etc..
In addition, the composite material that there is the coat of metal on surface can also be enumerated as above-mentioned adherend, it is compound as this
The base material of the coating of material can enumerate metal as escribed above, glass, plastics etc..
In turn, as above-mentioned adherend, can also enumerate by metal surface carry out passive state processing and be formed with it is blunt
The material of state overlay film can be enumerated such as heat treatment, anodized as passive stateization processing.Especially, in state
In the case where aluminium alloy of material of entitled 6000 series of border aluminium alloy etc., sulfuric acid anode is carried out as the processing of above-mentioned passive stateization
Change processing or phosphoric acid processing, thus, it is possible to improve cementability.
In addition, the solidfied material with first substrate, the second substrate and moisture-curable resin combination of the invention, and on
At least part of first substrate and at least part of above-mentioned the second substrate are stated by above-mentioned moisture-curable resin combination
Solidfied material engaged obtained by assembling parts be also one of present invention.
Above-mentioned first substrate and above-mentioned the second substrate are preferably respectively provided at least one electronic component.
Invention effect
In accordance with the invention it is possible to the moisture-curable resin combination of having excellent fast curing when providing moisture-curable.
In addition, in accordance with the invention it is possible to providing the assembling parts of the solidfied material with the moisture-curable resin combination.
Detailed description of the invention
(a) of Fig. 1 is schematic diagram when showing cementability sample for evaluation viewed from above, and (b) of Fig. 1 is shown from side
Observe schematic diagram when cementability sample for evaluation in face.
Specific embodiment
Hereinafter, enumerating embodiment is described in more detail the present invention, but the present invention is not only limited to these embodiments.
(synthesis example 1 (production of moisture-curable carbamate resins A))
By 100 parts by weight polytetramethylene ether diol (Mitsubishi Chemical Ind's systems, " PTMG- as polyol compound
2000 ") it is put into the separable flask for being 500mL to volume with 0.01 parts by weight dibutyl tin dilaurate, under vacuum
(20mmHg or less) is stirred 30 minutes with 100 DEG C, is mixed.Thereafter it is set as normal pressure, investment is used as polyisocyanate compound
Methyl diphenylene diisocyanate (Cao Itochu system, " Pure MDI ") 26.5 parts by weight, stirred with 80 DEG C makes for 3 hours
It is reacted, and obtains moisture-curable carbamate resins A (weight average molecular weight 2700).
(synthesis example 2 (production of moisture-curable carbamate resins B))
To the reaction vessel equipped with the moisture-curable carbamate resins A100 parts by weight being similarly obtained with synthesis example 1
9.8 parts by weight of middle addition 3-mercaptopropyi trimethoxy silane (chemical industrial company of SHIN-ETSU HANTOTAI system, " KBM-803 "), are stirred with 80 DEG C
Mixing 1 hour is mixed, to obtain the moisture-curable carbamate resins B (Weight-average molecular with trimethoxysilyl
3100) amount is.
(Examples 1 to 8, the Comparative Examples 1 to 5)
According to the mix ratio recorded in table 1,2, using planetary agitating device, (THINKY corporation, " Taro is practiced in deaeration
(あわとりTaro) ") each material is stirred after, uniformly mixed using ceramic triple-roller mill, obtain Examples 1 to 8, ratio
Compared with the moisture-curable resin combination of example 1~5.
<evaluation>
For each moisture-curable resin combination obtained in embodiment and comparative example, following evaluations are carried out.By result
It is shown in table 1,2.
(storage stability)
For each moisture-curable resin combination obtained in embodiment and comparative example, find out to first after just manufacturing
Use (with 25 DEG C of viscosity after keeping 1 week)/(initial viscosity) when beginning viscosity and viscosity when with 25 DEG C keeping 1 week are measured
The value of expression is as rate of change in viscosity.Be denoted as "○" when rate of change in viscosity is less than 1.2, rate of change in viscosity be 1.2 more than and less than
It is denoted as when 1.5 " △ ", rate of change in viscosity is denoted as "×" when being 1.5 or more, evaluate storage stability.
It should be noted that viscosity uses cone plate type viscometer (Dong Ji industry companies system, " VISCOMETER TV-22 "),
25 DEG C, rotation speed be 1rpm under conditions of be measured.
(cementability (bonding force after placing 3 hours and after placing 24 hours))
Using distributor, by each moisture-curable resin combination obtained in embodiment and comparative example with about 1mm's
Width is coated on aluminum substrate, irradiates 1000mJ/cm using UV-LED (wavelength 365nm)2Ultraviolet light and after making its photocuring, to
Aluminum substrate is bonded glass plate, places the weight of 100g, and place the stipulated time, thus makes its moisture-curable, obtains cementability and comment
Valence sample.About cementability sample for evaluation, making respectively placed 3 hours samples from placing weight and placed 24
The sample of hour.Schematic diagram (Fig. 1 (a)) when illustrating that cementability sample for evaluation viewed from above in Fig. 1 and indicate from
Observe the schematic diagram (Fig. 1 (b)) when cementability sample for evaluation in side.About each cementability sample for evaluation, by placing
Following measurements are carried out after time immediately.
Cupping machine (Shimadzu Seisakusho Ltd.'s system, " Ez-Graph ") is used at 25 DEG C, made cementability is evaluated and is used
Sample is stretched on shear direction with the speed of 5mm/sec, intensity when measurement aluminum substrate and glass plate are peeling-off.
[table 1]
[table 2]
Industrial availability
In accordance with the invention it is possible to the moisture-curable resin combination of having excellent fast curing when providing moisture-curable.
In addition, in accordance with the invention it is possible to providing the assembling parts of the solidfied material with the moisture-curable resin combination.
Description of symbols
1 aluminum substrate
2 moisture-curable resin combinations
3 glass plates
Claims (11)
1. a kind of moisture-curable resin combination, which is characterized in that it is to contain moisture-curable carbamate resins
Moisture-curable resin combination, contains:
Moisture-curable carbamate resins and/or non-moisture-curable carbamate tree with alkoxysilyl
The compound containing alkoxysilyl of rouge；
Moisture-curable promotes catalyst；And
Silanol condensation catalyst.
2. moisture-curable resin combination according to claim 1, which is characterized in that as non-moisture-curable amino
The compound containing alkoxysilyl of formate resin, contains silane coupling agent.
3. moisture-curable resin combination according to claim 1 or 2, which is characterized in that moisture-curable promotes catalysis
Agent is amine catalyst.
4. moisture-curable resin combination according to claim 1,2 or 3, which is characterized in that moisture-curable promotion is urged
The content of agent relative to 100 parts by weight of moisture-curable carbamate resins be 0.05 parts by weight more than and 3 parts by weight with
Under.
5. moisture-curable resin combination according to claim 1,2,3 or 4, which is characterized in that silanol condensation is urged
Agent is organic titanic compound and/or organic zirconate.
6. according to claim 1, moisture-curable resin combination described in 2,3,4 or 5, which is characterized in that silanol condensation
The content of catalyst is in 100 parts by weight of moisture-curable resin combination for more than 0.01 parts by weight and below 3 parts by weight.
7. according to claim 1, moisture-curable resin combination described in 2,3,4,5 or 6, which is characterized in that it contains certainly
By base polymerizable compound and optical free radical polymerization initiator.
8. moisture-curable resin combination according to claim 1,2,3,4,5,6 or 7, which is characterized in that it contains
Primary particle size is 1nm or more and 50nm filler below.
9. according to claim 1, moisture-curable resin combination described in 2,3,4,5,6,7 or 8, which is characterized in that it contains
There is opacifier.
10. a kind of assembling parts, which is characterized in that its with first substrate, the second substrate and claim 1,2,3,4,5,
6, the solidfied material of moisture-curable resin combination described in 7,8 or 9,
At least part of at least part of the first substrate and the second substrate is by the moisture-curable resin
The solidfied material of composition is engaged.
11. assembling parts according to claim 10, which is characterized in that first substrate and the second substrate are respectively provided at least
1 electronic component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-221602 | 2016-11-14 | ||
| JP2016221602 | 2016-11-14 | ||
| PCT/IB2017/057117 WO2018087743A1 (en) | 2016-11-14 | 2017-11-14 | Moisture-curable resin composition and assembled component |
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|---|---|
| CN109071749A true CN109071749A (en) | 2018-12-21 |
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|---|---|
| JP (1) | JP6943837B2 (en) |
| KR (1) | KR102458390B1 (en) |
| CN (1) | CN109071749A (en) |
| TW (1) | TWI749103B (en) |
| WO (1) | WO2018087743A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190077243A (en) | 2019-07-03 |
| TW201918498A (en) | 2019-05-16 |
| TWI749103B (en) | 2021-12-11 |
| WO2018087743A1 (en) | 2018-05-17 |
| JPWO2018087743A1 (en) | 2019-09-26 |
| JP6943837B2 (en) | 2021-10-06 |
| KR102458390B1 (en) | 2022-10-24 |
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