KR102458390B1 - Moisture-curable resin composition and assembly parts - Google Patents

Abstract

(Project) To provide a moisture-curable resin composition excellent in quick curing properties during moisture curing. Moreover, the assembly part which has the hardening body of this moisture-curable resin composition is provided.
(Solution) A moisture-curable resin composition containing a moisture-curable urethane resin, the moisture-curable urethane resin having an alkoxysilyl group and/or an alkoxysilyl group-containing compound that is not a moisture-curable urethane resin, a moisture curing accelerator, and a silanol condensation A moisture-curable resin composition containing a catalyst.

Description

Moisture-curable resin composition and assembly parts

The present invention relates to a moisture-curable resin composition excellent in quick-setting properties at the time of moisture curing. Moreover, this invention relates to the assembled component which has the hardening body of this moisture-curable resin composition.

In recent years, a liquid crystal display element, an organic electroluminescent display element, etc. are widely used as a display element which has characteristics, such as thin shape, light weight, and low power consumption. In these display elements, the photocurable resin composition is normally used for sealing of a liquid crystal or a light emitting layer, adhesion|attachment of various members, such as a board|substrate, an optical film, a protective film, etc.

However, with downsizing of a display element, the photocurable resin composition may be apply|coated to the part which light does not fully reach|attain, As a result, hardening of the photocurable resin composition apply|coated to the part which light does not reach becomes insufficient. had a problem. Therefore, using a photothermal curing resin composition as a resin composition that can be sufficiently cured even when applied to a portion where light does not reach, using a photothermal curing type resin composition in combination with photocuring and thermal curing is also carried out. There was a risk of adverse effects.

Moreover, in recent years, in electronic components, such as a semiconductor chip, high integration and miniaturization are calculated|required, For example, bonding several thin semiconductor chips through an adhesive bond layer to make a laminated body of a semiconductor chip is performed. In such a semiconductor chip laminate, for example, an adhesive is applied on one semiconductor chip, the other semiconductor chip is laminated through the adhesive, and then the adhesive is cured by a method, a fixed interval. It is manufactured by the method of filling an adhesive agent between the placed and held semiconductor chips, and hardening the adhesive agent after that.

As an adhesive agent used for adhesion|attachment of such an electronic component, the thermosetting adhesive agent containing the epoxy compound whose number average molecular weights are 600-1000 is disclosed by patent document 1, for example. However, the thermosetting adhesive as disclosed in Patent Document 1 is not suitable for bonding electronic components that may be damaged by heat.

As a method of hardening a resin composition without heating at high temperature, the method of using a moisture-curable resin composition is examined. For example, Patent Document 2 discloses a moisture-curable resin composition in which an isocyanate group in the resin reacts with moisture (moisture) in the air or in an adherend, thereby crosslinking and curing.

Japanese Laid-Open Patent Publication No. 2000-178342 Japanese Patent Laid-Open No. 2002-212534

An object of the present invention is to provide a moisture-curable resin composition excellent in quick curing at the time of moisture curing. Moreover, this invention provides the assembly component which has the hardening body of this moisture-curable resin composition.

The present invention relates to a moisture-curable resin composition containing a moisture-curable urethane resin, a moisture-curable urethane resin having an alkoxysilyl group and/or an alkoxysilyl group-containing compound that is not a moisture-curable urethane resin, a moisture curing accelerating catalyst, and a silanol condensation It is a moisture-curable resin composition containing a catalyst.

Hereinafter, the present invention will be described in detail.

MEANS TO SOLVE THE PROBLEM The present inventors investigated the moisture hardening type resin composition containing a moisture hardening type urethane resin WHEREIN: For the purpose of workability improvement etc., mix|blending a moisture hardening acceleration catalyst and improving the fast curing property at the time of moisture hardening. However, the effect of improving rapid curing to a certain extent was observed by the formulation of the moisture curing accelerating catalyst, but it was not sufficient. Conversely, if the compounding amount of the moisture curing accelerating catalyst is increased in anticipation of further improvement of the rapid curing during moisture curing, the initial adhesion strength is decreased. A decrease was confirmed. The present inventors believe that the cause of the decrease in initial adhesive strength is that the moisture curing accelerating catalyst accelerates the moisture curing reaction of the moisture curing type urethane resin, but the reaction with the adhesive substrate interface becomes insufficient, and as a result, the interface breakage tends to occur. I thought.

Therefore, as a result of further intensive studies, the present inventors have compounded an alkoxysilyl group-containing compound as the moisture-curable urethane resin and/or other components in the moisture-curable resin composition containing the moisture-curable urethane resin and the moisture-curing-accelerating catalyst, Furthermore, by mix|blending the silanol condensation catalyst which acts on these alkoxysilyl groups, it discovered that the moisture-curable resin composition excellent in the quick-setting property at the time of moisture hardening can be obtained, and it came to complete this invention.

The moisture-curable resin composition of this invention contains a moisture-curable urethane resin.

The said moisture-curable urethane resin has an isocyanate group in a molecule|numerator. The isocyanate group in the molecule reacts with moisture in the air or in the adherend to be cured. It is preferable that the said moisture-curable urethane resin has an isocyanate group at the molecular terminal. The said moisture-curable urethane resin may have a urethane bond in a molecule|numerator further.

The said moisture-curable urethane resin may have only one isocyanate group in 1 molecule, and may have it two or more.

The said moisture-curable urethane resin can be obtained by making the polyol compound which has 2 or more hydroxyl groups in 1 molecule react with the polyisocyanate compound which has 2 or more isocyanate groups in 1 molecule.

The reaction of the polyol compound and the polyisocyanate compound is usually carried out in a molar ratio of the hydroxyl group (OH) in the polyol compound and the isocyanate group (NCO) in the polyisocyanate compound in the range of [NCO]/[OH] = 2.0 to 2.5. .

As the polyol compound used as a raw material of the moisture-curable urethane resin, a known polyol compound commonly used for the production of polyurethane can be used, for example, polyester polyol, polyether polyol, polyalkylene polyol, poly Carbonate polyol etc. are mentioned. These polyol compounds may be used independently and may be used in combination of 2 or more type.

As said polyester polyol, the polyester polyol obtained by reaction of polyhydric carboxylic acid and a polyol, poly-epsilon-caprolactone polyol obtained by ring-opening polymerization of epsilon caprolactone, etc. are mentioned, for example.

As said polyhydric carboxylic acid used as the raw material of the said polyester polyol, For example, terephthalic acid, isophthalic acid, 1,5-naphthalic acid, 2,6-naphthalic acid, succinic acid, glutaric acid, adipic acid, p and melic acid, suberic acid, azelaic acid, sebacic acid, decamethylene dicarboxylic acid, and dodecamethylene dicarboxylic acid.

Examples of the polyol used as the raw material of the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6 - hexanediol, diethylene glycol, cyclohexanediol, etc. are mentioned.

Examples of the polyether polyol include a ring-opening polymer of ethylene glycol, propylene glycol, and tetrahydrofuran, a ring-opening polymer of 3-methyltetrahydrofuran, and a random copolymer or block copolymer of these or derivatives thereof, bisphenol The polyoxyalkylene modified product of the type, etc. are mentioned.

The bisphenol-type polyoxyalkylene-modified product is obtained by adding an alkylene oxide (eg, ethylene oxide, propylene oxide, butylene oxide, isobutylene oxide, etc.) to the active hydrogen portion of the bisphenol-type molecular skeleton. It is a polyether polyol, and a random copolymer may be sufficient and a block copolymer may be sufficient. As for the said bisphenol-type polyoxyalkylene modified body, it is preferable that 1 type, or 2 or more types of alkylene oxides are added to both terminals of a bisphenol type molecular skeleton. It does not specifically limit as a bisphenol type, A type, F type, S type, etc. are mentioned, Preferably it is a bisphenol A type.

As said polyalkylene polyol, polybutadiene polyol, hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol, etc. are mentioned, for example.

As said polycarbonate polyol, polyhexamethylene carbonate polyol, polycyclohexane dimethylene carbonate polyol, etc. are mentioned, for example.

As the polyisocyanate compound used as a raw material of the moisture-curable urethane resin, for example, diphenylmethane diisocyanate (MDI), a liquid modified product of diphenylmethane diisocyanate, polymeric MDI, tolylene diisocyanate, naphthalene-1, 5-diisocyanate etc. are mentioned. Among them, diphenylmethane diisocyanate and a modified product thereof are preferred from the viewpoint of low vapor pressure and toxicity and ease of handling. The said polyisocyanate compound may be used independently and may be used in combination of 2 or more type.

Moreover, it is preferable that the said moisture-curable urethane resin is a thing obtained using the polyol compound which has a structure represented by following formula (1). By using the polyol compound having a structure represented by the following formula (1), it is possible to obtain a composition excellent in adhesiveness, and a flexible and elongated cured product, which is excellent in compatibility with a radically polymerizable compound described later. .

Among them, it is preferable to use a polyether polyol composed of propylene glycol, a ring-opening polymerization compound of a tetrahydrofuran (THF) compound, or a ring-opening polymerization compound of a tetrahydrofuran compound having a substituent such as a methyl group.

[Formula 1]

In formula (1), R represents hydrogen, a methyl group, or an ethyl group, l is an integer of 0-5, m is an integer of 1-500, n is an integer of 1-10. It is preferable that l is 0-4, It is preferable that m is 50-200, It is preferable that n is 1-5.

In addition, the case where l is 0 means the case where the carbon couple|bonded with R is couple|bonded with oxygen directly.

When the moisture curable resin composition of the present invention does not contain an alkoxysilyl group-containing compound other than the moisture curable urethane resin described later, the moisture curable resin composition of the present invention is a moisture curable urethane resin having an alkoxysilyl group as the moisture curable urethane resin. must contain

Examples of the alkoxysilyl group in the moisture-curable urethane resin having an alkoxysilyl group include a trimethoxysilyl group, a methyldimethoxysilyl group, a dimethylmethoxysilyl group, a triethoxysilyl group, and a methyldiethoxysilyl group. group, and a methyldimethoxyethoxysilyl group. Although the moisture-curable urethane resin which has the said alkoxysilyl group may have the said alkoxysilyl group at the terminal of the main chain of a molecule|numerator, and may have it in the side chain of a molecule, it is preferable to have it at the terminal of the main chain of a molecule|numerator.

When the moisture-curable resin composition of the present invention contains the moisture-curable urethane resin having an alkoxysilyl group, the preferable lower limit of the content of the moisture-curable urethane resin having an alkoxysilyl group in 100 parts by weight of the moisture-curable urethane resin is 5 weight parts, and a preferable upper limit is 70 parts by weight. When content of the moisture-curable urethane resin which has the said alkoxysilyl group is this range, the effect which makes the adhesiveness after moisture hardening and the quick-hardening at the time of moisture hardening compatible becomes more excellent. The minimum with more preferable content of the moisture-curable urethane resin which has the said alkoxysilyl group is 20 weight part, and a more preferable upper limit is 60 weight part.

Moreover, the said moisture-curable urethane resin may have a radically polymerizable functional group.

As a radically polymerizable functional group which the said moisture-curable urethane resin may have, group which has an unsaturated double bond is preferable, and a (meth)acryloyl group is more preferable especially from a reactive point.

In addition, the moisture-curable urethane resin which has a radically polymerizable functional group is not included in the radically polymerizable compound mentioned later, but is handled as a moisture-curable urethane resin.

Although the weight average molecular weight of the said moisture-curable urethane resin is not specifically limited, A preferable minimum is 800, and a preferable upper limit is 10,000. When the weight average molecular weight of the moisture-curable urethane resin is within this range, the obtained moisture-curable resin composition does not have an excessively high crosslinking density during curing, and thus has more excellent flexibility and more excellent applicability. A more preferable lower limit of the weight average molecular weight of the moisture-curable urethane resin is 2000, a more preferable upper limit is 8000, a more preferable lower limit is 2500, and a still more preferable upper limit is 6000.

In addition, in this specification, the said weight average molecular weight is a value calculated|required by polystyrene conversion by measuring by gel permeation chromatography (GPC). As a column at the time of measuring the weight average molecular weight by polystyrene conversion by GPC, Shodex LF-804 (made by Showa Denko Co., Ltd.) etc. are mentioned, for example. Moreover, tetrahydrofuran etc. are mentioned as a solvent used by GPC.

The minimum with preferable content of the said moisture-curable urethane resin in 100 weight part of moisture-curable resin compositions of this invention is 20 weight part, and a preferable upper limit is 90 weight part. When content of the said moisture curable resin is this range, moisture hardenability becomes more excellent, maintaining the weather resistance excellent in the moisture curable resin composition obtained, and the softness|flexibility of hardened|cured material. A more preferable lower limit of content of the said moisture-curable urethane resin is 30 weight part, and a more preferable upper limit is 75 weight part.

The moisture curable resin composition of this invention contains a moisture hardening acceleration catalyst.

As the moisture curing accelerating catalyst, an amine catalyst is preferable because it is excellent in the effect of accelerating the moisture curing reaction of the moisture curing type urethane resin. Among these, a tertiary amine catalyst is preferable, and a tertiary amine catalyst having a morpholine skeleton is particularly preferable. Examples of the amine catalyst include morpholine, 4-morpholino-1-cyclohexene, 1-morpholino-1-cyclopentene, 2-(N-morpholino)ethanesulfonic acid, 2,2 '-dimorpholinodiethyl ether, triethylamine, di(2,6-dimethylmorpholinoethyl)ether, di(2,6-diethylmorpholinoethyl)ether, 1,4-diazabicyclo[ 2.2.2]octane, 2,6,7-trimethyl-1,4-diazabicyclo[2.2.2]octane, etc. are mentioned.

A preferable lower limit of the content of the moisture curing accelerating catalyst with respect to 100 parts by weight of the moisture-curable urethane resin is 0.05 parts by weight, and a preferable upper limit thereof is 3 parts by weight. When content of the said moisture hardening acceleration catalyst is this range, the effect which accelerates|stimulates the moisture hardening reaction of the said moisture hardening type urethane resin becomes more excellent, maintaining the outstanding storage stability of the moisture hardening type resin composition obtained. A more preferable lower limit of the content of the moisture curing promoting catalyst is 0.1 parts by weight, and a more preferable upper limit thereof is 2 parts by weight.

Examples of the alkoxysilyl group in the alkoxysilyl group-containing compound other than the moisture-curable urethane resin include the same as those in the moisture-curable urethane resin having an alkoxysilyl group described above. The alkoxysilyl group-containing compound other than the moisture-curable urethane resin may have the alkoxysilyl group at the terminal of the main chain of the molecule or may have the side chain of the molecule, but it is preferable to have it at the terminal of the main chain of the molecule.

As an alkoxysilyl group containing compound which is not the said moisture-curable urethane resin, a silane coupling agent is mentioned, for example.

Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyl Dimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2 -(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane , 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3- Aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, methyltrimethoxy Silane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane, trifluoro lopropyltrimethoxysilane etc. are mentioned.

When the moisture-curable resin composition of the present invention contains an alkoxysilyl group-containing compound other than the moisture-curable urethane resin, an alkoxysilyl group-containing compound that is not the moisture-curable urethane resin in 100 parts by weight of the moisture-curable resin composition of the present invention A preferable lower limit of the content is 0.05 parts by weight, and a preferable upper limit thereof is 3 parts by weight. When the content of the alkoxysilyl group-containing compound other than the moisture-curable urethane resin is within this range, the moisture-curable resin composition obtained is more excellent in the effect of making both the quick curing at the time of moisture curing and the adhesiveness after moisture curing compatible. The minimum with more preferable content of the alkoxysilyl group containing compound which is not the said moisture-curable urethane resin is 0.1 weight part, and a more preferable upper limit is 2 weight part.

The moisture-curable resin composition of the present invention contains a silanol condensation catalyst. As said silanol condensation catalyst, an organometallic catalyst is preferable. As said organometallic catalyst, an organotitanium compound, an organozirconium compound, an organozinc compound, an organotin compound, an organoaluminum compound, an organobismuth compound, etc. are mentioned, for example. Especially, it is preferable that it is an organic titanium compound and/or an organic zirconium compound, and it is still more preferable that it is an organic zirconium compound at the point which the moisture-curable resin composition obtained becomes a thing excellent in the quick-curing property at the time of moisture hardening.

Examples of the organic titanium compound include tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetraoctyl titanate, tetratertiary butyl titanate, tetrastearyl titanate, titanium acetyl acetate, and the like. can be heard

As said organic zirconium compound, normal propyl zirconate, zirconium ethyl acetate, zirconium tetraacetylacetonate, etc. are mentioned, for example.

The minimum with preferable content of the said silanol condensation catalyst in 100 weight part of moisture-curable resin compositions of this invention is 0.01 weight part, and a preferable upper limit is 3 weight part. When content of the said silanol condensation catalyst is this range, while maintaining the storage stability excellent in the moisture hardening type resin composition obtained, it becomes the thing excellent in the quick-hardening at the time of moisture hardening. A more preferable lower limit of the content of the silanol condensation catalyst is 0.05 parts by weight, a more preferable lower limit is 0.1 parts by weight, and a more preferable upper limit is 2 parts by weight.

The moisture-curable resin composition of the present invention may contain a radical polymerizable compound and a radical photopolymerization initiator.

By containing the said radically polymerizable compound and the said radical photopolymerization initiator, the moisture curable resin composition of this invention can be used suitably especially for the sealing agent for display elements as an optical moisture hardening type resin composition which has photocurability and moisture curability.

The radical polymerizable compound is not particularly limited as long as it is a radical polymerizable compound having photopolymerizability and is a compound having a radical polymerizable functional group in the molecule, but a compound having an unsaturated double bond as the radical polymerizable functional group is preferable, In particular, a compound having a (meth)acryloyl group (hereinafter, also referred to as a "(meth)acryl compound") is preferable from the point of reactivity.

In addition, in this specification, the said "(meth)acryloyl" means acryloyl or methacryloyl, and the said "(meth)acryl" means acryl or methacryl.

As said (meth)acrylic compound, for example, (meth)acrylic acid ester compound obtained by reacting (meth)acrylic acid with a compound having a hydroxyl group, and epoxy (meth)acrylate obtained by reacting (meth)acrylic acid with an epoxy compound and urethane (meth)acrylates obtained by reacting an isocyanate compound with a (meth)acrylic acid derivative having a hydroxyl group.

In addition, in this specification, the said "(meth)acrylate" means an acrylate or a methacrylate. Moreover, all isocyanate groups of the isocyanate compound used as the raw material of the said urethane (meth)acrylate are used for formation of a urethane bond, and the said urethane (meth)acrylate does not have a residual isocyanate group.

As a monofunctional thing among the said (meth)acrylic acid ester compound, For example, phthalimide acrylates, such as N-acryloyloxyethyl hexahydrophthalimide, various imide (meth)acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, n-octyl ( Meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, isomyristyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, benzyl (meth) acrylate, 2- Hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-methoxyethyl (meth) Acrylate, 2-ethoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, ethyl carbitol (meth) ) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, 2,2,2 -Trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, 1H,1H,5H-octafluoro pentyl (meth)acrylate, dimethylaminoethyl (meth) ) acrylate, diethylaminoethyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethylhexahydrophthalic acid, 2-(meth)acryloyloxyethyl -2-hydroxypropyl phthalate, glycidyl (meth)acrylate, 2-(meth)acryloyloxyethyl phosphate, and the like.

Moreover, as a bifunctional thing among the said (meth)acrylic acid ester compound, 1, 3- butanediol di (meth) acrylate, 1, 4- butanediol di (meth) acrylate, and 1, 6- hexanediol are, for example. Di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 2-n-butyl-2-ethyl-1,3-propanedioldi (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate ) acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethylene oxide addition bisphenol A di(meth)acrylate, propylene oxide addition bisphenol A di(meth)acrylate, ethylene oxide Additional bisphenol F di(meth)acrylate, dimethyloldicyclopentadienyldi(meth)acrylate, neopentylglycol di(meth)acrylate, ethylene oxide-modified isocyanuric acid di(meth)acrylate, 2-hydroxy- 3- (meth) acryloyloxypropyl (meth) acrylate, carbonate diol di (meth) acrylate, polyether diol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone diol di (meth)acrylate, polybutadienediol di(meth)acrylate, etc. are mentioned.

Moreover, as a trifunctional or more than trifunctional thing among the said (meth)acrylic acid ester compound, trimethylol propane tri(meth)acrylate, ethylene oxide addition trimethylol propane tri(meth)acrylate, propylene oxide addition trimethylol propane tri (meth)acrylate, caprolactone-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethylene oxide-added isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate , propylene oxide-added glycerin tri (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta ( Meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. are mentioned.

As said epoxy (meth)acrylate, the thing obtained by making an epoxy compound and (meth)acrylic acid react in presence of a basic catalyst according to a conventional method, etc. are mentioned, for example.

As an epoxy compound used as a raw material for synthesizing the said epoxy (meth)acrylate, For example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, 2,2'- diallyl bisphenol A Type epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type Epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, dicyclopentadiene novolak type epoxy resin, biphenyl novolak type epoxy resin, naphthalenephenol novolak type epoxy resin, gly Cydylamine type epoxy resin, alkyl polyol type epoxy resin, rubber-modified type epoxy resin, glycidyl ester compound, bisphenol A type episulfide resin, etc. are mentioned.

Among the above-mentioned epoxy (meth) acrylates, commercially available ones include, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3702, EBECRYL3703, Manufactured), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin-Nakamura Chemical Co., Ltd.), Epoxy Ester M-600A, Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA (all manufactured by Kyoeisha Chemical Company), Denacol Acrylate DA-141 , denacol acrylate DA-314, denacol acrylate DA-911 (all manufactured by Nagase Chemtex), and the like.

The urethane (meth)acrylate can be obtained by, for example, reacting a (meth)acrylic acid derivative having a hydroxyl group with an isocyanate compound in the presence of a tin-based compound in a catalytic amount.

As an isocyanate compound used as a raw material of the said urethane (meth)acrylate, For example, isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene di Isocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), Hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanate phenyl) thiophosphate, tetramethylxylylene diisocyanate, 1,6,11- undecane triisocyanate, etc. are mentioned.

Moreover, as said isocyanate compound, For example, polyol, such as ethylene glycol, propylene glycol, glycerol, sorbitol, trimethylol propane, carbonate diol, polyether diol, polyester diol, polycaprolactone diol, and an excess isocyanate compound A chain-extended isocyanate compound obtained by the reaction can also be used.

As the (meth)acrylic acid derivative having a hydroxyl group, which is a raw material for the urethane (meth)acrylate, for example, ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4- Mono(meth)acrylates of dihydric alcohols such as butanediol and polyethylene glycol, mono(meth)acrylates or di(meth)acrylates of trihydric alcohols such as trimethylolethane, trimethylolpropane, and glycerin, and bisphenol A Epoxy (meth)acrylates, such as a type|mold epoxy (meth)acrylate, etc. are mentioned.

Among the urethane (meth) acrylates, commercially available ones include, for example, M-1100, M-1200, M-1210, M-1600 (all manufactured by Toa Synthetic Corporation), EBECRYL230, EBECRYL270, EBECRYL4858, EBECRYL8402, EBECRYL8411, EBECRYL8412, EBECRYL8413, EBECRYL8804, EBECRYL8803, EBECRYL8807, EBECRYL9260, EBECRYL1290, EBECRYL5129, EBECRYL4842, EBECRYL220, Alls, Inc., EBECRYL210, EBECRY EBECRYL4827, EBECRYL6295, all manufactured by Artisan Inc. Art Resin UN-9000A, Art Resin UN-7100, Art Resin UN-1255, Art Resin UN-330, Art Resin UN-3320HB, Art Resin UN-1200TPK, Art Resin SH-500B (all manufactured by Negami Industries), U -2HA, U-2PHA, U-3HA, U-4HA, U-6H, U-6LPA, U-6HA, U-10H, U-15HA, U-122A, U-122P, U-108, U-108A , U-324A, U-340A, U-340P, U-1084A, U-2061BA, UA-340P, UA-4100, UA-4000, UA-4200, UA-4400, UA-5201P, UA-7100, UA -7200, UA-W2A (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), AI-600, AH-600, AT-600, UA-101I, UA-101T, UA-306H, UA-306I, UA-306T (all Kyoe) Isha Chemical Co., Ltd. make) etc. are mentioned.

Moreover, other radically polymerizable compounds other than what was mentioned above can also be used suitably.

Examples of the other radically polymerizable compound include N,N-dimethyl (meth)acrylamide, N-(meth)acryloylmorpholine, N-hydroxyethyl (meth)acrylamide, N,N - (meth)acrylamide compounds such as diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N,N-dimethylaminopropyl (meth)acrylamide, styrene, α-methylstyrene, N-vinyl Vinyl compounds, such as -2-pyrrolidone and N-vinyl-epsilon-caprolactam, etc. are mentioned.

It is preferable that the said radically polymerizable compound contains a monofunctional radically polymerizable compound and a polyfunctional radically polymerizable compound from a viewpoint of adjusting sclerosis|hardenability. By containing the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound, the moisture-curable resin composition obtained becomes the thing excellent in sclerosis|hardenability and tackiness. Especially, it is preferable to use urethane (meth)acrylate in combination with the said monofunctional radically polymerizable compound as said polyfunctional radically polymerizable compound. Moreover, it is preferable that it is bifunctional or trifunctional, and, as for the said polyfunctional radically polymerizable compound, it is more preferable that it is bifunctional.

When the said radically polymerizable compound contains the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound, content of the said polyfunctional radically polymerizable compound is the said monofunctional radically polymerizable compound and the said polyfunctional radical With respect to a total of 100 weight part of a polymeric compound, a preferable minimum is 2 weight part, and a preferable upper limit is 45 weight part. When content of the said polyfunctional radically polymerizable compound is this range, the moisture-curable resin composition obtained becomes the thing excellent in sclerosis|hardenability and tackiness. A more preferable minimum of content of the said polyfunctional radically polymerizable compound is 5 weight part, and a more preferable upper limit is 35 weight part.

The minimum with preferable content of the said radically polymerizable compound in 100 weight part of moisture-curable resin compositions of this invention is 10 weight part, and a preferable upper limit is 80 weight part. When content of the said radically polymerizable compound is this range, the moisture hardening type resin composition obtained becomes the thing more excellent in both photocurability and moisture sclerosis|hardenability. A more preferable minimum of content of the said radically polymerizable compound is 30 weight part, and a more preferable upper limit is 60 weight part.

Examples of the radical photopolymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, thioxanthone, and the like. can

Among the radical photopolymerization initiators, commercially available ones include, for example, IRGACURE184, IRGACURE369, IRGACURE379, IRGACURE651, IRGACURE784, IRGACURE819, IRGACURE907, IRGACURE2959, IRGACURE OXE01, Lucirin TPO (all manufactured by BASF Corporation), benzoin methyl ether, benzoin Benzoin ethyl ether, benzoin isopropyl ether (all are the Tokyo Chemical Industry make), etc. are mentioned.

As for content of the said radical photopolymerization initiator, with respect to 100 weight part of said radically polymerizable compounds, a preferable minimum is 0.01 weight part, and a preferable upper limit is 10 weight part. When content of the said radical photopolymerization initiator is this range, the moisture-curable resin composition obtained becomes a thing more excellent in photocurability and storage stability. A more preferable minimum of content of the said radical radical polymerization initiator is 0.1 weight part, and a more preferable upper limit is 5 weight part.

It is preferable that the moisture-curable resin composition of this invention contains a filler.

By containing the said filler, the moisture-curable resin composition of this invention becomes what has preferable thixotropy, and can fully maintain the shape after application|coating.

As for the said filler, a preferable lower limit of a primary particle diameter is 1 nm, and a preferable upper limit is 50 nm. When the primary particle diameter of the said filler is this range, the moisture-curable resin composition obtained becomes a thing more excellent in applicability|paintability and shape retentivity after application|coating, and it becomes a thing suitable for the display element of a frame narrow design especially. The more preferable lower limit of the primary particle diameter of the filler is 5 nm, the more preferable upper limit is 30 nm, the more preferable lower limit is 10 nm, and the more preferable upper limit is 20 nm.

In addition, the primary particle diameter of the said filler can be measured by dispersing the said filler in a solvent (water, an organic solvent, etc.) using NICOMP 380ZLS (made by PARTICLE SIZING SYSTEMS).

Moreover, the said filler may exist as secondary particles (a collection of a plurality of primary particles) in the moisture-curable resin composition of the present invention, and a preferable lower limit of the particle diameter of such secondary particles is 5 nm, and a preferable upper limit Silver is 500 nm, a more preferable lower limit is 10 nm, and a more preferable upper limit is 100 nm. The particle diameter of the secondary particle of the said filler can be measured by observing the moisture-curable resin composition of this invention, or its hardened|cured material using a transmission electron microscope (TEM).

As said filler, an inorganic filler is preferable, For example, silica, a talc, titanium oxide, zinc oxide, calcium carbonate, etc. are mentioned. Especially, since the moisture-curable resin composition obtained becomes a thing excellent in ultraviolet transmittance, a silica is preferable. These fillers may be used independently and may be used in combination of 2 or more type.

It is preferable that the said filler is given hydrophobic surface treatment. By the said hydrophobic surface treatment, the moisture-curable resin composition obtained becomes a thing more excellent in shape retention after application|coating.

Examples of the hydrophobic surface treatment include silylation treatment, alkylation treatment, and epoxidation treatment. Especially, since it is excellent in the effect of improving shape retentivity, a silylation process is preferable and a trimethylsilylation process is more preferable.

Examples of the method for treating the hydrophobic surface of the filler include a method of treating the surface of the filler using a surface treatment agent.

Specifically, for example, the trimethylsilylation-treated silica is synthesized by a method such as a sol-gel method, for example, a method of spraying a surface treatment agent such as hexamethyldisilazane in a state in which silica is flowed; It can be produced by adding silica in an organic solvent such as alcohol or toluene, further adding a surface treating agent such as hexamethyldisilazane and water, and then evaporating the water and the organic solvent to dryness with an evaporator. .

The minimum with preferable content of the said filler in 100 weight part of moisture-curable resin compositions of this invention is 1 weight part, and a preferable upper limit is 20 weight part. When content of the said filler is this range, the moisture-curable resin composition obtained becomes more excellent in applicability|paintability and shape retentivity after application|coating. A more preferable lower limit of the content of the filler is 2 parts by weight, a more preferable upper limit is 15 parts by weight, a more preferable lower limit is 3 parts by weight, a more preferable upper limit is 10 parts by weight, and a particularly preferable lower limit is 4 parts by weight.

The moisture-curable resin composition of the present invention may contain a light-shielding agent.

By containing the said light-shielding agent, when the moisture-curable resin composition of this invention becomes the thing excellent in light-shielding property, for example, when it uses for a display element, light leakage can be prevented. In addition, the display element manufactured using the moisture-curable resin composition of the present invention in which the light-shielding agent is blended has high contrast without light leakage because the moisture-curable resin composition has sufficient light-shielding properties, and excellent image display quality is obtained. becomes to have

In addition, in this specification, the said "light-shielding agent" means a material which has the ability to hardly transmit light in a visible region. If the material exemplified as the electromagnetic wave shielding material also has such an ability, the effect as the light shielding agent can be exhibited.

Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. In addition, the light-shielding agent does not need to be black, and as long as it is a material having the ability to hardly transmit light in the visible region, materials exemplified as fillers such as silica, talc, titanium oxide, etc. are also included in the light-shielding agent. . Especially, titanium black is preferable.

The titanium black is a substance having a higher transmittance in the vicinity of the ultraviolet region, particularly, in the light having a wavelength of 370 to 450 nm, compared with the average transmittance for light having a wavelength of 300 to 800 nm. That is, the titanium black is a light-shielding agent having a property of providing light-shielding properties to the moisture-curable resin composition of the present invention by sufficiently shielding light having a wavelength in the visible region, while transmitting light having a wavelength in the vicinity of an ultraviolet region. Therefore, the photocurability of the moisture-curable resin composition of the present invention can be further increased by using a radical photopolymerization initiator that can initiate a reaction with light having a wavelength (370 to 450 nm) at which the transmittance of the titanium black becomes high. . On the other hand, as a light-shielding agent contained in the moisture-curable resin composition of this invention, a substance with high insulation is preferable, and titanium black is preferable also as a light-shielding agent with high insulation.

It is preferable that it is 3 or more, and, as for the said titanium black, it is more preferable that it is 4 or more of optical density (OD value). Moreover, it is preferable that blackness (L value) is 9 or more, and, as for the said titanium black, it is more preferable that it is 11 or more. The higher the light-shielding property of the titanium black, the better.

The titanium black exhibits a sufficient effect even if it is not surface-treated, but the surface is treated with an organic component such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconium oxide, magnesium oxide, etc. Surface-treated titanium black, such as one coated with an inorganic component of Especially, the thing processed with the organic component is preferable at the point which can improve insulation more.

As what is marketed among the said titanium black, 12S, 13M, 13M-C, 13R-N (all are made by Mitsubishi Materials), T-rac D (made by Ako Chemical Corporation), etc. are mentioned, for example.

A preferable lower limit of the specific surface area of the titanium black is 5 m2/g, a preferable upper limit is 40 m2/g, a more preferable lower limit is 10 m2/g, and a more preferable upper limit is 25 m2/g. In addition, the preferable lower limit of the sheet resistance of the titanium black is 10 ⁹ Ω/square when mixed with a resin (70% blending), and a more preferable lower limit is 10 ¹¹ Ω/square.

In the moisture-curable resin composition of the present invention, the primary particle diameter of the light-shielding agent is appropriately selected depending on the application, such as the distance between the substrates of the display element or less, and a preferable lower limit is 30 nm and a preferable upper limit is 500 nm. When the primary particle diameter of the said light-shielding agent is this range, a viscosity and thixotropy do not increase significantly, but the moisture-curable resin composition obtained becomes a thing excellent in the applicability|paintability with respect to a board|substrate, and workability|operativity. A more preferable lower limit of the primary particle diameter of the light-shielding agent is 50 nm, and a more preferable upper limit thereof is 200 nm.

In addition, the primary particle diameter of the said light-shielding agent can be carried out similarly to the average particle diameter of the said metal particle, and can be measured.

The minimum with preferable content of the said light-shielding agent in 100 weight part of moisture-curable resin compositions of this invention is 0.05 weight part, and a preferable upper limit is 10 weight part. When content of the said light-shielding agent is this range, the moisture-curable resin composition obtained maintains the outstanding drawing property, the adhesiveness to a board|substrate etc., and the intensity|strength after hardening, It becomes a thing excellent in light-shielding property. A more preferable lower limit of content of the said light-shielding agent is 0.1 weight part, a more preferable upper limit is 2 weight part, and a more preferable upper limit is 1 weight part.

The moisture-curable resin composition of the present invention may further contain additives such as colorants, ionic liquids, solvents, metal-containing particles and reactive diluents as needed.

As a method for producing the moisture-curable resin composition of the present invention, for example, using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, a three-roll, a moisture-curable resin, or , A method of mixing an alkoxysilyl group-containing compound that is not a moisture-curable resin and moisture-curable urethane resin, a moisture curing accelerating catalyst, a silanol condensation catalyst, a radically polymerizable compound and a radical photopolymerization initiator or additives added as needed and the like.

It is preferable that the moisture content to contain in the moisture-curable resin composition of this invention is 100 ppm or less. When the said moisture content is 100 ppm or less, reaction of the said moisture-curable resin and water|moisture content during storage can be suppressed, and a moisture-curable resin composition becomes the thing excellent in storage stability more. It is more preferable that the said moisture content is 80 ppm or less.

In addition, the said moisture content can be measured with a Karl Fischer moisture measuring apparatus.

In the moisture-curable resin composition of the present invention, a preferable lower limit of the viscosity measured at 25°C and 1 rpm using a cone plate viscometer is 30 Pa·s, and a preferable upper limit is 500 Pa·s. When the said viscosity is this range, it becomes a thing more excellent in workability|operativity at the time of apply|coating a moisture-curable resin composition to to-be-adhered bodies, such as a board|substrate, It becomes a thing preferable especially for the display element of a frame narrow design. A more preferable lower limit of the viscosity is 50 Pa·s, and a more preferable upper limit thereof is 300 Pa·s.

Moreover, when the viscosity of the moisture-curable resin composition of this invention is too high, applicability|paintability can be improved by heating at the time of application|coating.

A preferable lower limit of the thixotropic index of the moisture-curable resin composition of the present invention is 1.2, and a preferable upper limit thereof is 5.0. When the said thixotropic index is this range, the moisture-curable resin composition obtained becomes a thing more excellent in applicability|paintability and shape retentivity after application|coating. This shape-retaining property has great technical significance in that the application width can be maintained, for example, in a frame narrow design. Further, in the bonding of fine semiconductor chips, the technical significance is great in that a state not to be exceeded from the bonding surface can be maintained. A more preferable lower limit of the thixotropic index is 1.3, and a more preferable upper limit is 4.0.

In addition, in the present specification, the thixotropic index refers to the viscosity measured at 25° C. and 1 rpm using a cone plate viscometer, and the viscosity measured at 25° C. and 10 rpm using a cone plate viscometer. is the value divided by

It is preferable that the optical density (OD value) of the 1 mm-thick hardened|cured material after hardening of the moisture curable resin composition of this invention is 1 or more. When the said OD value is 1 or more, it is excellent in light-shielding property, when it uses for a display element, light leakage can be prevented and high contrast can be obtained. It is more preferable that the said OD value is 1.5 or more.

The higher the OD value is, the better, but if too much of a light-shielding agent is blended in order to increase the OD value, a decrease in workability due to thickening occurs. A preferred upper limit is 4.

In addition, the OD value after hardening of the said moisture-curable resin composition can be measured using an optical densitometer.

The moisture-curable resin composition of this invention is mainly used for adhesion|attachment of a to-be-adhered body in an electronic component.

Various types of adherends, such as metal, glass, and plastic, can be mentioned as a to-be-adhered body which can be adhere|attached using the moisture-curable resin composition of this invention.

Examples of the shape of the adherend include film, sheet, plate, panel, tray, rod (rod) shape, box shape, casing shape, and the like.

As said metal, steel, stainless steel, aluminum, copper, nickel, chromium, or its alloy etc. are mentioned, for example.

As said glass, alkali glass, alkali free glass, quartz glass etc. are mentioned, for example.

Examples of the plastic include polyolefin resins such as high-density polyethylene, ultra-high molecular weight polyethylene, isotactic polypropylene, syndiotactic polypropylene, ethylene propylene copolymer resin, nylon 6 (N6), nylon 66 (N66), Nylon 46 (N46), Nylon 11 (N11), Nylon 12 (N12), Nylon 610 (N610), Nylon 612 (N612), Nylon 6/66 Copolymer (N6/66), Nylon 6/66/610 Copolymer (N6/66/610), nylon MXD6 (MXD6), nylon 6T, nylon 6/6T copolymer, nylon 66/PP copolymer, nylon 66/PPS copolymer, polyamide-based resin, polybutylene terephthalate ( PBT), polyethylene terephthalate (PET), polyethylene isophthalate (PEI), PET/PEI copolymer, polyarylate (PAR), polybutylene naphthalate (PBN), liquid crystal polyester, polyoxyalkylenediimide diacid/ Aromatic polyester resins such as polybutylene terephthalate copolymer, polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile/styrene copolymer (AS), methacrylonitrile/styrene copolymer, meta Polynitrile-based resin such as acrylonitrile/styrene/butadiene copolymer, polycarbonate, polymethyl methacrylate (PMMA), polymethacrylate-based resin such as polyethyl methacrylate, ethylene/vinyl acetate copolymer (EVA) ), polyvinyl alcohol (PVA), vinyl alcohol/ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), polyvinyl chloride (PVC), vinyl chloride/vinylidene chloride copolymer, vinylidene chloride/methyl acrylate Polyvinyl-type resin, such as a copolymer, etc. are mentioned.

Moreover, as said to-be-adhered body, the composite material which has a metal plating layer on the surface is also mentioned, As a base material for plating of this composite material, For example, the above-mentioned metal, glass, plastic, etc. are mentioned. can

Moreover, as said to-be-adhered body, the material which formed the passivation film by passivating the metal surface is also mentioned, The passivation process includes, for example, heat treatment, anodization treatment, etc. In particular, when the international aluminum alloy name is an aluminum alloy of the 6000 range, the adhesiveness can be improved by performing an anodizing sulfate treatment or an anodizing phosphate treatment as the passivation treatment.

Further, it has a first substrate, a second substrate, and a cured product of the moisture-curable resin composition of the present invention, wherein at least a portion of the first substrate includes at least a portion of the second substrate and a cured product of the moisture-curable resin composition. Assembled parts joined together are also part of the present invention.

It is preferable that the said 1st board|substrate and the said 2nd board|substrate each have at least 1 electronic component.

ADVANTAGE OF THE INVENTION According to this invention, the moisture-curable resin composition excellent in the quick-setting property at the time of moisture hardening can be provided. Moreover, according to this invention, the assembly component which has the hardening body of this moisture-curable resin composition can be provided.

Fig.1 (a) is a schematic diagram which shows the case where the sample for adhesive evaluation is viewed from above, (b) is a schematic diagram which shows the case where the sample for adhesive evaluation is seen from the side.

The present invention will be described in more detail below with reference to Examples, but the present invention is not limited only to these Examples.

(Synthesis Example 1 (Preparation of moisture-curable urethane resin A))

As a polyol compound, 100 parts by weight of polytetramethylene ether glycol (manufactured by Mitsubishi Chemical Corporation, "PTMG-2000") and 0.01 parts by weight of dibutyltin dilaurate were placed in a separable flask with a capacity of 500 ml, and placed under vacuum (20 mmHg or less). ), stirred at 100° C. for 30 minutes, and mixed. After that, the pressure is set to normal pressure, and 26.5 parts by weight of diphenylmethane diisocyanate (manufactured by Nisso Corporation, "Pure MDI") as a polyisocyanate compound is added, stirred at 80° C. for 3 hours to react, and moisture-curable urethane resin A (weight average molecular weight) 2700) was obtained.

(Synthesis Example 2 (Production of Moisture Curable Urethane Resin B))

To a reaction vessel containing 100 parts by weight of the moisture-curable urethane resin A obtained in the same manner as in Synthesis Example 1, 9.8 parts by weight of 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-803") was added, and 80 ° C. Moisture-curable urethane resin B (weight average molecular weight 3100) which has a trimethoxysilyl group was obtained by stirring and mixing for 1 hour.

(Examples 1 to 8, Comparative Examples 1 to 5)

According to the blending ratios shown in Tables 1 and 2, each material was stirred with a planetary stirring device (manufactured by Thinkki, “Awatori Rentaro”), and then uniformly mixed with three ceramic rolls to compare Examples 1 to 8, Moisture-curable resin compositions of Examples 1 to 5 were obtained.

<Evaluation>

The following evaluation was performed about each moisture-curable resin composition obtained by the Example and the comparative example. The results are shown in Tables 1 and 2.

(Storage stability)

For each moisture-curable resin composition obtained in Examples and Comparative Examples, when the initial viscosity immediately after production and the viscosity when stored at 25 ° C. for 1 week were measured (25 ° C., viscosity after 1 week storage) / (initial) Viscosity) was calculated|required as a viscosity change rate. Storage stability was evaluated as "○" when the viscosity change rate was less than 1.2, "(triangle|delta)" when it was 1.2 or more and less than 1.5, and "x" when it was 1.5 or more.

In addition, the viscosity was measured on the conditions of the rotation speed of 1 rpm at 25 degreeC using the cone plate type viscometer (The Toki Sangyo company make, "VISCOMETER TV-22").

(Adhesiveness (adhesion after 3 hours left and 24 hours left))

Each moisture-curable resin composition obtained in Examples and Comparative Examples was applied to an aluminum substrate with a width of about 1 mm using a dispensing device, and UV-LED (wavelength 365 nm) was used to emit ultraviolet rays at 1000 mJ/cm 2 After photocuring by irradiating, a glass plate was bonded together to an aluminum substrate, a 100 g weight was put, and it was made to moisture harden by leaving it to stand for predetermined time, and the sample for adhesive evaluation was obtained. The sample for adhesive evaluation produced what was left to stand for 3 hours and what was left to stand for 24 hours, respectively, after placing a weight. The schematic diagram (FIG. 1(a)) which shows the case where the sample for adhesive evaluation is viewed from above in FIG. 1, and the schematic diagram (FIG. 1(b)) which shows the case where the sample for adhesive evaluation is seen from the side was shown. About each sample for adhesive evaluation, the following measurement was implemented immediately after leaving-to-stand time.

The produced sample for adhesive evaluation was pulled at a rate of 5 mm/sec in the shearing direction using a tensile tester (manufactured by Shimadzu Corporation, "Ez-Graph") at 25°C, and the aluminum substrate and the glass plate were peeled off. The strength at the time was measured.

ADVANTAGE OF THE INVENTION According to this invention, the moisture-curable resin composition excellent in the quick-setting property at the time of moisture hardening can be provided. Moreover, according to this invention, the assembly component which has the hardening body of this moisture-curable resin composition can be provided.

1: aluminum substrate
2: Moisture curable resin composition
3: glass plate

Claims (11)

A moisture curable resin composition comprising a moisture curable urethane resin, a radical polymerizable compound, and a radical photopolymerization initiator, comprising:
A moisture-curable urethane resin having an alkoxysilyl group and/or an alkoxysilyl group-containing compound that is not a moisture-curable urethane resin, a moisture curing accelerating catalyst, and a silanol condensation catalyst,
The content of the moisture curing accelerating catalyst is 0.05 parts by weight or more and 3 parts by weight or less with respect to 100 parts by weight of the moisture curing type urethane resin,
The content of the silanol condensation catalyst is 0.01 parts by weight or more and 3 parts by weight or less in 100 parts by weight of the moisture-curable resin composition. The method of claim 1,
A moisture-curable resin composition comprising an alkoxysilyl group-containing compound, not a moisture-curable urethane resin, and a silane coupling agent. 3. The method according to claim 1 or 2,
The moisture curing accelerating catalyst is an amine catalyst. delete 3. The method according to claim 1 or 2,
The silanol condensation catalyst is an organic titanium compound and/or an organic zirconium compound, The moisture curable resin composition characterized by the above-mentioned. delete delete 3. The method according to claim 1 or 2,
A moisture-curable resin composition comprising a filler having a primary particle diameter of 1 nm or more and 50 nm or less. 3. The method according to claim 1 or 2,
A moisture-curable resin composition comprising a light-shielding agent. It has a 1st board|substrate, a 2nd board|substrate, and the hardening body of the moisture-curable resin composition of Claim 1 or 2,
At least a portion of the first substrate is bonded to at least a portion of the second substrate through a cured body of the moisture-curable resin composition. 11. The method of claim 10,
An assembly component, wherein the first substrate and the second substrate each have at least one electronic component.

Images