TW201917742A - Electric wire for high-frequency coil, and electronic component - Google Patents

Abstract

To provide: an electric wire which is for a high-frequency coil and with which the reliability of a soldered joint is assured and AC resistance at high frequencies can be reduced; and an electronic component having the electric wire for a high-frequency coil. The problem is solved by using this electric wire 20 for a high-frequency coil, the electric wire being configured from at least: a core wire 10 having a copper conductor 1 and a ferromagnetic layer 4 provided on the outer circumference of the copper conductor 1, and an insulating covering layer 4 provided on the core wire 10, wherein the ferromagnetic layer 4 has a gap G in a radial direction X, the wetting stress during soldering is at least 3.4 mN, and the zero-cross time is not more than 0.4 seconds.

Description

Electric wires and electronic parts for high-frequency coils

The present invention relates to electric wires and electronic parts for high-frequency coils. More specifically, the present invention relates to electronic parts used in various high-frequency coils and the like, and high-frequency coil wires that can reduce the high-frequency AC impedance, and electronic parts using the high-frequency coil wires.

Patent Document 1 proposes an enamel-insulated electric wire in which a conductor coated with a ferromagnetic material such as pure iron is applied to a copper wire as a core wire, and it is described that the high-frequency gain Q is increased by a factor of 10%. The improvement of this characteristic is considered to be based on the reduction of the high-frequency AC impedance, and it is considered that when a strong magnetic layer is applied to the outer periphery of the conductor, the external magnetic field is shielded, and the external magnetic field that penetrates into the interior through incomplete shielding is reduced. When the eddy current suppresses the loss through the proximity effect, the increase in the AC impedance is suppressed. In addition, Patent Document 1 also describes that a nickel plating layer is better than a copper plating layer as a plating layer provided on a ferromagnetic layer in order to improve soldering characteristics.

In addition, for the purpose of improving the solderability of Patent Document 2, it is proposed that an iron plating layer be provided on the outer periphery of the conductor, and a nickel plating layer having a thickness of 0.03 to 0.1 μm is provided in order to ensure weldability. A method for applying an enamel insulating resin layer formed by firing a polyurethane insulating coating before oxidation. Prior Art Literature Patent Literature

Patent Document 1: Japanese Patent Publication No. 42-1339 Patent Document 2: Japanese Patent Publication No. 62-151594

Problems to be solved by the invention

In the insulated coated wire used for coil parts, as a enamel insulation layer, a polyurethane coating is generally applicable. However, the operating environment of electronic equipment parts such as coil parts is shifted to a higher temperature side, and the enamel insulation layer constituting the insulated covered electric wires also requires increased heat resistance. The heat resistance of the insulating resin constituting the insulation coating layer is represented by the heat resistance levels and allowable maximum temperatures of A, E, B, F, and H types. The polyurethane system forming the polyurethane coating layer is equivalent to the temperature index. Type E 120 ° C. Recently, there is a demand for highly heat-resistant resins such as denatured polyurethanes or polyesters with a temperature index F of 155 ° C, and polyurethanes with a temperature index H of 180 ° C, and it is carried out below 360 ° C. The welding temperature of the operation becomes 420 ° C in the F grade and 460 ° C in the H grade.

As the soldering temperature becomes higher, the cross section of the solder erosion through the lead wire (copper conductor, etc.) is likely to decrease, and the reliability of the connection strength becomes a problem. In a short time, it is better to solder the lead wire. That is, the higher the wetting stress and the shorter the zero-crossing time, the more reliable the solder connection can be guaranteed.

In addition, along with the miniaturization and high frequency of coil components, many insulated covered electric wires have been twisted, and thinning has progressed. In particular, as the wire system becomes thinner, problems such as solder erosion tend to occur.

In the welding of enamel wires described in Patent Document 2, in an environment where the welding temperature is high, the nickel plating layer and the tin in the solder react and diffuse instantly, but actually the iron plating layer and the solder that become the base Material bonding. However, since the intermetallic compound of iron and tin is not easily formed, the wetting stress (that is, the bonding strength) is low, and the reliability for bonding is poor. When the thickness of nickel is required to be thicker, the effect of iron, which is a ferromagnetic material, is gradually weakened, and the high frequency loss through the proximity effect is not suppressed.

An object of the present invention is to provide a high-frequency coil electric wire and an electronic component using the high-frequency coil electric wire while ensuring the reliability of solder bonding and reducing the AC impedance at a high frequency. Means to solve the problem

(1) An electric wire for high-frequency coils is an electric wire for high-frequency coils composed of at least a core wire having a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating coating provided on the core wire. , Characterized in that the aforementioned ferromagnetic layer has a gap in the radial direction. According to this invention, since the ferromagnetic layer has a gap in the radial direction, tin in the solder during soldering can easily reach the copper conductor. As a result, when intermetallic bonding occurs between copper and tin in the solder, the wetting stress becomes high, and a strong solder joint can be obtained.

In the electric wire for a high-frequency coil according to the present invention, the ferromagnetic layer preferably includes an iron layer and a nickel layer provided on the outer periphery of the iron layer.

In the electric wire for a high-frequency coil according to the present invention, the number of the gaps is a number that can be seen on the surface of the core wire, and the imaginary line and the radial direction imaginary line are the same length as the diameter D of the core wire. The number of squares formed is preferably in the range of 2 or more and 30 or less. According to this invention, since the number of gaps that can be seen in the square falls within the above range, the solder during soldering easily reaches the copper conductor.

In the high-frequency coil electric wire according to the present invention, it is preferable that the gap has a coil in a range of a width of 0.3 μm or more and 5 μm or less.

In the high-frequency coil electric wire according to the present invention, the copper conductor is preferably selected from fine copper, oxygen-free copper, copper-tin alloy, copper-silver alloy, copper-nickel alloy, copper-clad aluminum, and copper-clad magnesium . For example, according to the present invention, the above-mentioned copper conductive system is not easily susceptible to copper because the metal with the main body is located in the outermost layer because of the good electrical conductivity with a low impedance of 60% IACS or more. Oxidation can improve the reliability of welding joints.

(2) The electronic component according to the present invention is characterized by using the electric wire for a high-frequency coil according to the present invention. Examples of the electronic component include a coiled component such as a high-frequency coil, and a circuit board including a coiled component such as a high-frequency coil.

(3) The electric wire for a high-frequency coil according to the present invention is a high-frequency circuit composed of at least a core wire having a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating coating provided on the core wire. The coil wire is characterized in that the wetting stress during welding is 3.4 mN or more, and the zero-cross time is 0.4 seconds or less. According to the present invention, the wetting stress becomes high, and a strong welded joint can be obtained.

In the high-frequency coil electric wire according to the present invention, the diameter of the copper conductor is preferably within a range of 0.02 to 0.40 mm.

In the high-frequency coil electric wire according to the present invention, it is preferable that the above-mentioned wetting stress is 3.7 mN or more and the zero-cross time is 0.2 seconds or less.

In the electric wire for a high-frequency coil according to the present invention, the ferromagnetic layer includes an iron layer and a nickel layer provided on an outer periphery of the iron layer. The Vickers hardness of the iron layer is preferably 200 HV.

In the electric wire for a high-frequency coil according to the present invention, the ferromagnetic layer includes an iron layer and a nickel layer provided on an outer periphery of the iron layer. The thickness of the iron layer is preferably 0.2 μm or more and 3.0 μm or less.

(4) The electronic component according to the present invention is characterized in that the electric wire for a high-frequency coil according to the present invention is connected by soldering. Examples of the electronic component include a coiled component such as a high-frequency coil, and a circuit board including a coiled component such as a high-frequency coil. Invention effect

According to the present invention, it is possible to provide an electric wire for a high-frequency coil capable of ensuring the reliability of the solder joint and reducing the AC impedance at a high frequency.

Embodiments of the high-frequency coil electric wire and electronic component according to the present invention will be described with reference to the drawings. However, the present invention includes the inventors having the same technical ideas as the embodiments described below and the forms described in the drawings, and the technical scope of the present invention is not limited to the descriptions of the embodiments or the drawings. .

As shown in FIGS. 1 and 2, a high-frequency coil electric wire 20 according to the present invention includes at least a core wire 10 having a copper conductor 1 and a ferromagnetic layer 4 provided on the outer periphery of the copper conductor 1, and a core wire 10 provided thereon. It is constituted by an insulating coating layer 5 on the upper surface. As shown in FIGS. 3A and 3B, the ferromagnetic layer 4 is characterized by having a gap G in the radial direction X. The ferromagnetic layer 4 is preferably formed of an iron layer 2 and a nickel layer 3 provided on the outer periphery of the iron layer 2.

In the high-frequency coil electric wire 20, the ferromagnetic layer 4 constituting the core wire 10 has a gap G in the radial direction X, and the solder during soldering easily reaches the copper conductor 1. As a result, when intermetallic bonding occurs between copper and tin in the solder, the wetting stress becomes high, and a strong solder joint can be obtained. However, the gap G is a form penetrating the ferromagnetic layer 4 (for example, the nickel layer 3 and the iron layer 2). In the case where there is no gap G, the tin in the system solder becomes a bonder with nickel, but in the case where the thickness of the nickel layer is extremely thin, nickel is diffused in the solder instantaneously. As a result, it actually becomes a joint with iron, the wetting stress becomes low, and a good joint strength can be obtained.

Hereinafter, components of the high-frequency coil electric wire will be described.

<Core Wire> The core wire 10 includes a copper conductor 1 and a ferromagnetic layer 4 provided on the outer periphery of the copper conductor 1. The high-frequency coil electric wire 20 is composed of at least a core wire 10 and an insulating coating 5 provided on the core wire 10.

(Copper conductor) Copper conductor 1 contains copper or copper alloy as the main constituent metal, and in this application, it is selected from fine copper, oxygen-free copper, copper-tin alloy, copper-silver alloy, copper-nickel alloy, Copper-clad aluminum, copper-clad magnesium, etc. These conductive systems can improve the conductivity of 60% IACS with low impedance and good conductivity, even if the conductor diameter is thinned, because the metal with copper as the main body is located in the outermost layer, it is not easy to be oxidized, and can be improved. Reliable for welding joints. However, among copper-tin alloys, copper-silver alloys, copper-nickel alloys, copper-clad aluminum, copper-clad magnesium, etc., the electrical conductivity 20 (higher than 60% IACS) as the high-frequency coil electric wire 20 is desirable. In the case of copper alloy, it is better to adjust its alloy composition, while in the case of cladding, it is better to adjust the material of the core material or the ratio of the cladding material to the core material.

The diameter of the copper conductor 1 is not particularly limited, but it is preferable that the reliability of connection strength in an environment where the soldering temperature is high is a problematic fineness, for example, in the range of about 0.02 to 0.40 mm.

(Ferromagnetic layer) The ferromagnetic layer 4 is provided on the copper conductor 1, and the obtained core wire 10 is used as the high-frequency coil electric wire 20 in the case of using the high-frequency coil to reduce the AC impedance and high frequency characteristics. Lifting ground works. The constituent material of the ferromagnetic layer 4 is not particularly limited, and examples thereof include iron, cobalt, nickel, a high magnetic permeability alloy (Ni78-Fe22), a high magnetic permeability alloy (Ni45-Fe55), and a superconductive magnetic alloy ( Ni75-Cu5-Fe20), Co-Ni-Fe (Co20-Ni40-Fe40), and the like. The method for forming the ferromagnetic layer 4 is not particularly limited, but as a method for forming the ferromagnetic layer 4, a plating method is preferable. However, each of the above-mentioned constituents can be formed by electroplating, which is desirable. use. The high-frequency coil electric wire 20 according to the present invention is characterized in that a gap G described later is formed in the ferromagnetic layer 4.

In the following, the ferromagnetic layer 4 is composed of an iron layer 2 and a nickel layer 3 as an example. The ferromagnetic layer 4 composed of a structure other than the iron layer 2 and the nickel layer 3 has slightly different high-frequency characteristics through its composition, but the effects of the gap G, thickness, and welding are the same.

(Iron layer) The hafnium layer 2 is provided on the copper conductor 1 and forms the ferromagnetic layer 4 at the same time as the nickel layer 3. The thickness of the iron layer 2 is preferably set in a range of 0.2 μm to 3.0 μm. When used in a high-frequency coil, etc., the AC impedance is reduced, and the high-frequency characteristics are improved. In particular, pure iron plating is ideally used because it is ferromagnetic. However, as long as the effect of reducing the AC impedance and the like is not hindered, the iron layer 2 may contain other elements (for example, nickel, cobalt, phosphorus, boron, etc.).

The iron layer 2 can improve the high frequency characteristics, and also has the effect of preventing solder erosion during welding. However, in the case where the iron layer 2 is formed on the copper conductor 1 to prevent solder erosion, it means that it is not easy to form an intermetallic compound of tin and iron in the solder. It is not easy to achieve the formation of such intermetallic compounds, which hinders the combination of copper and tin in solder, but has low wetting stress (that is, joint strength), poor connection reliability, and cannot correspond to short-term solderability requirements. Situation.

This invention is characterized in that the ferromagnetic layer 4 formed of the iron layer 2 and the nickel layer 3 has a gap G in the radial direction X. When there is such a gap G, the tin in the solder during soldering can easily reach the copper conductor 1. As a result, when intermetallic bonding occurs between copper and tin in the solder, the wetting stress becomes high, and a strong solder joint can be obtained. The gap G is a form that penetrates from the nickel layer 3 to one of the iron layers 2.

The number of the gap G is the number that can be seen on the surface of the core wire 10, and may be in a square (Y1 × X1) formed by the imaginary line Y1 in the axial direction and the imaginary line X1 in the radial direction with the same length as the diameter D of the core wire 10. See the number. The number of gaps G is preferably within a range of 2 or more and 30 or less. When it is within such a range, the solder during soldering easily reaches the copper conductor. As a result, when intermetallic bonding occurs between copper and tin in the solder, a good wetting stress is obtained and a strong solder joint is obtained. When the number of the gaps G is less than two, the bonding between tin and iron in the solder is the main reason, the wetting stress is low, and it is difficult to obtain good bonding strength. On the other hand, when the number of gaps G exceeds 30, tin and copper in the solder are instantaneously bonded, solder erosion proceeds, and the cross-sectional area of the conductor is likely to be reduced, and the bonding strength may be reduced. The width of the gap G is preferably within a range from 0.3 μm to 5 μm, and more preferably from 0.5 μm to 2.0 μm. Through this gap G, the solder during soldering easily reaches the copper conductor. As a result, when intermetallic bonding occurs between copper and tin in the solder, a good wetting stress is obtained and a strong solder joint is obtained. However, when the width of the gap G exceeds 5 μm, there is a possibility of becoming a pinhole.

The gap G is formed by controlling the mechanical characteristics (tensile strength, elongation) of the copper conductor 1 or the size and angle of the pulley as shown in the examples described later. In addition, when an additive is added to the iron plating solution and the plating conditions are controlled, when the hardness of the iron layer 2 is increased to 200 HV or more by Vickers hardness, a gap G can be formed.

Examples of the additive system include thiourea, saccharin, benzothiazole, JGB (Gena Green B), benzylideneacetone, gelatin, polyethylene glycol, butynediol, and coumarin. In the case of several 10 ppm, molecules or ions can be adsorbed and deposited alone at the precipitation position. In addition, iron complexes are formed by these additives, and the complexes can be adsorbed and precipitated at the precipitation position. Through the effect of the additive, fine and hard crystal grains can be obtained, and an iron layer 2 having a Vickers hardness of about 250 HV can be formed. When the thickness of the iron layer 2 is set to 0.5 μm or more, and preferably 1 μm or more, the electrical stress increases, and a gap G exists in the iron layer 2.

As the plating conditions, for example, when the temperature of the plating solution is lowered from 30 ° C to 20 ° C and the pH is lowered from 3 to 2, fine and hard crystal grains can be obtained, and a Vickers hardness of 300 HV can be formed. Level of iron 2 people. When the thickness of the iron layer 2 is set to 0.5 μm or more, and preferably 1 μm or more, the electrical stress increases, and a gap G exists in the iron layer 2.

The iron layer 2 is preferably formed by electroplating, and can be formed by supplying electricity to the copper conductor 1 in an iron electrolyte. The plating solution is generally not particularly limited as long as it is an inorganic salt having at least iron and a supporting electrolyte. For example, a ferric sulfate plating solution or a ferric chloride plating solution can be applied. The plating solution may contain various additives such as a surfactant, a glossing agent, and the like, as long as the effects of the present invention are not hindered.

(Nickel layer) The samarium-nickel layer 3 is provided on the iron layer 2 and forms the ferromagnetic layer 4 simultaneously with the iron layer 2. The thickness of this nickel layer 3 is preferably set within the range of 0.01 μm to 1.0 μm. When the weldability is improved, the high-frequency coil and the iron layer 2 are used at the same time, which can reduce the AC impedance. To improve the high frequency characteristics. When the nickel layer 3 is too thick, the effect of iron of the ferromagnetic body becomes weaker, and the high frequency loss through the proximity effect is not suppressed. On the other hand, when the nickel layer 3 is too thin, in an environment where the soldering temperature is high, the nickel layer 3 and the tin in the solder react and diffuse instantly. In fact, it is the bonding between the iron layer 2 that becomes the base and the solder material. Therefore, the wetting stress is low and it is difficult to obtain good bonding strength.

The nickel layer 3 and the iron layer 2 constitute the ferromagnetic layer 4 at the same time. The ferromagnetic layer 4 has the gap G in the radial direction X as described above. However, since the gap G has already been described, its explanation is omitted here.

The nickel layer 3 is preferably formed by electroplating, and can be formed by supplying electricity to a copper conductor 1 provided with an iron layer 2 in a nickel electrolyte. The plating solution is generally not particularly limited as long as it is an inorganic salt having at least nickel and a supporting electrolyte. For example, a nickel sulfate plating solution or a nickel chloride plating solution can be applied. The plating solution may contain various additives such as a surfactant, a glossing agent, and the like, as long as the effects of the present invention are not hindered.

<Insulation Coating Layer> As shown in FIG. 2, the insulation coating layer 5 is provided on the ferromagnetic layer 4. When the insulating coating layer 5 is provided, the high-frequency coil electric wire 20 can be used as various high-frequency coils, and high-frequency coil electric wires (integrated stranded wires are insulated through the insulation coating, and the outer periphery of the collected bare wires is insulated. Electric wires, etc.). The insulating coating layer 5 is formed on the outer periphery of the core wire 10 after the ferromagnetic layer 4 is formed, and is coated and fired to form a solderable insulating enamel film, or a solderable insulating enamel film and a fused enamel film. Welding possible insulating enamel coatings are, for example, enamel coatings that can be coated and fired to form universal polyurethanes, denatured polyurethanes, and polyurethanes. In addition, for example, a fused enamel coating film system formed on the outer periphery thereof can be applied to form a fused enamel coating such as nylon or epoxy. These coating systems can be manufactured using a common enamel line manufacturing apparatus. However, in the case where an insulating coating layer 5 (polyimide, polyimide, polyester, etc.) is provided which cannot be welded, it is good to peel off the insulating coating layer 5 mechanically and / or chemically. Ground welding.

The high-frequency coil electric wire 20 according to the present invention provided with the insulating coating layer 5 can be used as a constituent wire of a litz wire, a constituent wire of a three-layer insulated wire, or the like even for a high-frequency coil. In addition, these others are used as the core wire 10 before the insulating coating layer 5 is provided, or the surface of the core wire 10 is provided with a protective film such as an imidazole complex, and these are twisted as a twisted wire or as a The assembled wire may be a high-frequency insulated wire integrated with the outer periphery of the stranded wire or the assembled wire by pressing, winding, burning, etc.

<Electronic component> (1) The electronic component according to the present invention is configured using the high-frequency coil electric wire 20 of the present invention described above. Examples of the electronic component include a coiled component such as a high-frequency coil, and a circuit board including a coiled component such as a high-frequency coil. Examples

Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples.

[Example 1] (1) A 0.1 mm diameter annealed material (ACW, tensile strength: 240 MPa, elongation: 27%) was annealed with a 0.1 mm diameter hard copper wire (HCW) annealed in an inert gas environment at 360 ° C. Conductor 1 is used. After surface degreasing and acid activation treatment, an iron layer 2 having a thickness of 1 μm is formed by an electroplating method, and then a nickel layer 3 having a thickness of 0.03 μm is formed by an electroplating method to obtain a ferromagnetic layer 4 (iron layer). 2 and the core layer 10 of the nickel layer 3). Iron plating uses a ferric sulfate plating solution (ferrous sulfate 250g / L, ferric chloride 50g / L, ammonium chloride 30g / L), and nickel plating uses a nickel sulfate plating solution (nickel sulfate 250g / L , Nickel chloride 30g / L, boric acid 15g / L). The obtained core wire 10 was brought into contact with a pulley having a diameter of 350 times at an angle of 120 ° while being wound, and a gap G was set in the radial direction X of the ferromagnetic layer 4. In this way, a core wire 10 having a gap G is obtained.

[Example 2] The thickness of the iron layer 2 was 2 μm. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 3] The thickness of the iron layer 2 was 3 μm. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 4] As the copper conductor 1, an annealed material (ACAW, tensile strength: 330MPa) with a diameter of 0.1mm, which was annealed a hard copper-silver alloy wire (HCAW) with a diameter of 0.1mm, in an inert gas environment at 650 ° C, was used. , Extension: 24%). Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 5] As the copper conductor 1, an annealed material (ACSW, tensile strength: 300 MPa) with a diameter of 0.1 mm was used to anneal a hard copper-tin alloy wire (HCSW) with a diameter of 0.1 mm in an inert gas environment at 600 ° C. , Extension: 25%). Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 6] (2) A pulley having a diameter of 300 times was used. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 7] (2) A pulley having a diameter of 200 times was used. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Embodiment 8] (1) A pulley having a diameter of 100 times was used. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 9] Annealed in an inert gas environment at 300 ° C. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10. Annealed material (ACW) based tensile strength: 280 MPa, elongation: 15%.

[Example 10] Annealed in an inert gas environment at 280 ° C. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10. Annealed material (ACW) based tensile strength: 300 MPa, elongation: 5%.

[Embodiment 11] 使其 It was wound while being brought into contact with a pulley at an angle of 90 °. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 12] (1) A pulley having a diameter 100 times as large as that of the pulley was wound while being brought into contact with the pulley at an angle of 90 °. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 13] 0.05 Annealed material (ACW, tensile strength: 280 MPa, elongation: 18%) of 0.05 mm diameter annealed material (ACW, tensile strength: 280 MPa, elongation: 18%) was used as copper for a hard copper wire (HCW) having a diameter of 0.05 mm and annealed in an inert gas environment at 360 ° C. Conductor 1. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 14] 0.0 Annealed material (ACW, tensile strength: 260 MPa, elongation: 22%) with a diameter of 0.08 mm and a hard copper wire (HCW) having a diameter of 0.08 mm and annealed in an inert gas environment at 360 ° C was used as copper. Conductor 1. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Example 15] (1) A 0.12 mm diameter annealed material (ACW, tensile strength: 240 MPa, elongation: 28%) was annealed with a hard copper wire (HCW) having a diameter of 0.12 mm and annealed in an inert gas environment at 360 ° C. Conductor 1. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Comparative Example 1] Rhenium was not annealed in an inert gas atmosphere. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10. Hard copper wire (HCW) without annealing is tensile strength: 400 MPa, elongation: 2%.

[Comparative Example 2] (2) The thickness of the iron layer 2 was 2 μm. Except for this, the same procedure as in Comparative Example 1 was performed to obtain a core wire 10.

[Comparative Example 3] The thickness of the iron layer 2 was made 3 μm. Except for this, the same procedure as in Comparative Example 1 was performed to obtain a core wire 10.

[Comparative Example 4] 退火 Annealing was performed in an inert gas environment at 280 ° C, and a pulley having a diameter of 400 times was used. Except for this, the same operation as in Example 1 was performed to obtain a high-frequency coil electric wire. Annealed material (ACW) based tensile strength: 300 MPa, elongation: 5%.

[Comparative Example 5] 退火 Annealed in an inert gas environment at 280 ° C, and wound on a pulley having a diameter 400 times that of the pulley at an angle of 90 °. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10. Annealed material (ACW) based tensile strength: 300 MPa, elongation: 5%.

[Comparative Example 6] As the copper conductor 1, an annealed material (ACSW, tensile strength: 300 MPa) with a diameter of 0.1 mm, which was annealed a hard copper-tin alloy wire (HCSW) with a diameter of 0.1 mm, in an inert gas atmosphere at 600 ° C, was used. , Extension: 25%). Furthermore, a pulley having a diameter of 400 times was wound while being brought into contact with it at an angle of 120 °. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10.

[Comparative Example 7] 退火 Annealed in an inert gas environment at 300 ° C, and wound on a pulley having a diameter 350 times that of the pulley at an angle of 160 °. Except for this, the same operation as in Example 1 was performed to obtain a core wire 10. Annealed material (ACW) based tensile strength: 240 MPa, elongation: 15%.

[Measurement and Results] (Gap and Welding Characteristics) Table 1 shows the elements of the core wire 10 obtained in Examples and Comparative Examples. The gap G of each core wire 10 is measured with a microscope (manufactured by Keyence Corporation, VX600 type, 500 times). The measurement system measures the number of gaps G that can be seen in a square (0.1 mm angle) formed by an imaginary line Y1 in the axial direction and an imaginary line X1 in the radial direction, and measures the average width of the gap G. The number of gaps G is measured by counting the length of the imaginary line X1 (= the diameter of the core wire) in the radial direction by a length of 1/4 or more. The case where the branches can be continuous or discontinuous and have a gap G is considered to be related to the same (one) gap G. The results are shown in Table 2.

The wetting stress (mN) and the zero-crossing time (seconds) during welding were measured with a mobile wetting tester (manufactured by RHESCA, WET-6100). The solder was tested at a temperature of 380 ° C using Sn-3Ag-0.5Cu (manufactured by Senju Metal Industry Co., Ltd.). The results are shown in Table 2.

From the results of Tables 1 and 2, for a case where the wetting stress is 3.4 mN or more and the zero crossing time is 0.4 seconds or less, the number of gaps G is 6 or more, and the product of the number of gaps G and the width is 6 or more. As a particularly desirable configuration, when the wetting stress is 3.7 mN or more and the zero-crossing time is 0.2 seconds or less, the number of gaps G is 12 or more, and the product of the number of gaps G and the width is 12 or more. Such a result is mainly achieved when the product of the number of gaps G and the width is 12 or more. Such a gap G is formed by the manufacturing conditions shown in Table 1.

The core wires 10 of Examples 13 to 15 having different diameters of the copper conductor 1 were measured in the same manner as in Example 1 (wetting stress, zero crossing time, and number of gaps). In Example 13 (conductor diameter: 0.05 mm), wetting stress: 1.8 mN, zero crossing time: 0.2 seconds, number of gaps G: 25, width of gap G: 1.5 mm, and product of number and width: 37.5. In Example 14 (conductor diameter: 0.08 mm), wetting stress: 2.9 mN, zero crossing time: 0.2 seconds, number of gaps G: 19, width of gap G: 1.0 mm, and product of number and width: 19. In Example 15 (conductor diameter: 0.12 mm), wetting stress: 4.3 mN, zero crossing time: 0.2 seconds, number of gaps G: 12, width of gap G: 1.0 mm, and product of number and width: 12. As a result, the infiltration stress (mN) was divided and compared per unit surface area. Examples 1 (conductor diameter: 0.10 mm), Example 13 (conductor diameter: 0.05 mm), and Example 14 ( Conductor diameter: 0.08 mm) and Example 15 (conductor diameter: 0.12 mm) are all around 5.7 mN / mm ² .

(High-frequency characteristics) 高 The high-frequency characteristics were measured with an LCR meter (precision LCR meter, 4284A, 20Hz to 1MHz, manufactured by Agilent Corporation). Measurement system sample length: 1.50m, dedicated bobbin: inner diameter φ67mm, rotation number: 5 turns, solder is attached to both ends of the terminal system, and connected to the fabric for measurement. The measurements were performed using samples 1 to 3 (high-frequency coil electric wires 20) described below in which two types of urethane were used as the insulating coating layer 5 and the frequency was changed to 1 kHz to 1 MHz.

Sample 1: Two kinds of urethane-coated enamel-coated copper-plated stranded wires (21 pieces / φ0.10mm) Sample 2: Two kinds of urethane-coated enamel-coated iron-plated stranded wires (21 pieces / φ0.10mm), gap G: None, iron plating solution (same iron plating solution as in Example, without additives), nickel plating solution (same nickel plating solution as in Example 1), thickness of Fe layer: 0.8 μm, Ni Layer thickness: 0.05 μm Sample 3: Two types of urethane-coated enamel iron plating stranded wires (21 pieces / φ0.10mm), gap G: Yes, iron plating solution (same iron plating as in Example 1) Liquid, additive: saccharin 2m / L), nickel plating solution (the same nickel plating solution as in Example 1), the thickness of the Fe layer: 0.8 μm, and the thickness of the Ni layer: 0.05 μm.

FIG. 3 (A) is a surface photograph of a urethane-coated enamel magnetic plating strand of sample 3. FIG. Figure 3 (B) is a photograph of the surface of two urethane-coated enamel magnetic plating strands of sample 2. FIG. 3 (C) is a photograph of the surface of two kinds of urethane-coated enamel-coated copper strands of sample 1. FIG.

Table 3 is the result of impedance, and Table 4 is the result of impedance loss. It is understood from Tables 3 and 4 that for the case where the ferromagnetic layer 4 is provided, there is no relation to the presence or absence of the gap G, but the same high-frequency characteristics are apparent, and the existence of the gap G does not reduce the high-frequency characteristics. Situation.

1‧‧‧copper conductor

2‧‧‧ iron layer

3‧‧‧ nickel layer

4‧‧‧ ferromagnetic layer

5‧‧‧ insulation coating

10‧‧‧ core wire

20‧‧‧Wire for high frequency coil

11‧‧‧ square

12‧‧‧circle

G‧‧‧ Clearance

W‧‧‧Width of the gap

X‧‧‧ diameter direction

X1‧‧‧ imaginary line in radial direction

Y‧‧‧ axis direction

Y1‧‧‧axis imaginary line

Fig. 1 is a cross-sectional view showing an example of a core wire constituting a high-frequency coil electric wire according to the present invention. Fig. 2 is a sectional view showing an example of a high-frequency coil electric wire according to the present invention. Fig. 3 is an electron microscope photograph of the surface of the ferromagnetic layer of the core wire obtained in the example. (A) is a case where there is a gap. (B) When there are few gaps. (C) is a case where there is almost no gap.

Claims (12)

A high-frequency coil electric wire is a high-frequency coil electric wire composed of a core wire having at least a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating coating provided on the core wire. The ferromagnetic layer has a gap in the radial direction. The high-frequency coil electric wire according to item 1 of the patent application scope, wherein the ferromagnetic layer includes an iron layer and a nickel layer provided on the outer periphery of the iron layer. For example, the electric wire for high-frequency coils described in item 1 or 2 of the scope of the patent application, wherein the number of the gap is a number that can be seen on the surface of the core wire, and can be equal to the length of the same diameter as the diameter D of the core wire. The number seen in the square formed by the axial imaginary line and the radial imaginary line is in the range of 2 or more and 30 or less. The electric wire for a high-frequency coil according to any one of claims 1 to 3, wherein the gap is in a range of 0.5 μm or more and 5 μm or less. The high-frequency coil electric wire according to any one of claims 1 to 4, wherein the aforementioned copper conductor is selected from fine copper, oxygen-free copper, copper-tin alloy, copper-silver alloy, and copper-nickel Alloy, copper-clad aluminum, copper-clad magnesium. An electronic component characterized in that it is constructed using a high-frequency coil electric wire as described in any one of claims 1 to 5 of the scope of patent application. A high-frequency coil electric wire is a high-frequency coil electric wire composed of a core wire having at least a copper conductor and a ferromagnetic layer provided on the outer periphery of the copper conductor, and an insulating coating provided on the core wire. For welding, the wetting stress is 3.4mN or more, and the zero crossing time is 0.4s or less. For example, the electric wire for high-frequency coils described in item 7 of the scope of patent application, wherein the diameter of the aforementioned copper conductor is in the range of 0.02 to 0.40 mm. For example, the electric wire for high-frequency coils described in item 7 or item 8 of the patent application range, wherein the above-mentioned wetting stress is 3.7 mN or more and the zero-cross time is 0.2 seconds or less. For example, the high-frequency coil electric wire according to any one of claims 7 to 9, wherein the ferromagnetic layer has an iron layer and a nickel layer provided on the outer periphery of the iron layer, and the dimension of the iron layer is Those with a hardness of 200 HV. The high-frequency coil electric wire according to any one of claims 7 to 9 in the scope of the patent application, wherein the ferromagnetic layer has an iron layer, a nickel layer provided on the outer periphery of the iron layer, and the thickness of the iron layer. It is 0.2 μm or more and 3.0 μm or less. An electronic component characterized in that the electric wire for a high-frequency coil as described in any one of claims 7 to 11 of the scope of patent application is connected by welding.