JP2003073883A - Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these - Google Patents

Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these

Info

Publication number
JP2003073883A
JP2003073883A JP2001269761A JP2001269761A JP2003073883A JP 2003073883 A JP2003073883 A JP 2003073883A JP 2001269761 A JP2001269761 A JP 2001269761A JP 2001269761 A JP2001269761 A JP 2001269761A JP 2003073883 A JP2003073883 A JP 2003073883A
Authority
JP
Japan
Prior art keywords
iron
film
high frequency
nickel
electrodeposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001269761A
Other languages
Japanese (ja)
Inventor
Hiroshi Kitazawa
弘 北沢
Takashi Miyazawa
貴志 宮沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
Original Assignee
Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to JP2001269761A priority Critical patent/JP2003073883A/en
Publication of JP2003073883A publication Critical patent/JP2003073883A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Insulated Conductors (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

PROBLEM TO BE SOLVED: To prepare an electrodeposited iron film for high-frequency, having a small high-frequency resistance loss, to provide an insulated wire for a high-frequency coil, which can form a coil for high-frequency having a small high-frequency resistance loss and high Q, and provide manufacturing methods therefor. SOLUTION: An alternatingly electrodeposited film (the electrodeposited iron film for high-frequency) 8 comprising six layers in total consisting of three iron layers (2, 4, and 6) of 0.03 μm thick for each, and three nickel layers (3, 5, and 7) of 0.02 μm thick for each, is prepared on a perimeter of a copper conductor 1 by means of alternately electrodepositing iron and nickel. The polyurethane copper wire for the high-frequency coil (the insulated wire for the high-frequency coil) 10 is then manufactured by means of applying a polyurethane lacquer on the above electrodeposited film and baking it, to provide a polyurethane film 9 with thickness of 5 μm.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、高周波用鉄電析
膜、高周波コイル用絶縁電線およびこれらの製造方法に
関し、更に詳しくは、高周波抵抗損失が小さい高周波用
鉄電析膜、高周波抵抗損失が小さく、且つ高い高周波利
得Q値(以下、高Q値と略記する)を具備した高周波用コイ
ルの作成が可能な高周波コイル用絶縁電線およびこれら
の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency iron electrodeposition film, a high-frequency coil insulated wire, and a method for producing the same, and more particularly to a high-frequency iron electrodeposition film having a low high-frequency resistance loss and a high-frequency resistance loss. The present invention relates to an insulated wire for a high-frequency coil, which is capable of producing a high-frequency coil having a small and high high-frequency gain Q value (hereinafter abbreviated as high Q value), and a manufacturing method thereof.

【0002】[0002]

【従来の技術】近時、電子機器の軽薄短小化および高性
能化に伴い、これらに使用されるマイクロ磁気デバイス
やバルク磁気デバイスのコイル部品に関する高周波化が
急速に高まっている。前記コイル部品に、銅導体の外周
に鉄などの強磁性体材料を電析させ、更にその外周にエ
ナメル塗料を塗布焼き付けした絶縁被覆電線を使用する
と高Q値が得られることが知られている。また、鉄など
の強磁性体材料を電析させた後、その外周にニッケル電
析膜を施し、更にその外周にはんだ付け性を有するエナ
メル塗料を塗布焼付けした絶縁被覆電線は、はんだ付け
性を兼ね備えた高周波コイル用の磁性めっき線として実
用に供されている。(実公昭42-1339号公報、特
開昭62-151594号公報)
2. Description of the Related Art Recently, as electronic devices have become lighter, thinner, shorter, smaller, and have higher performance, the frequency of coil components of micro magnetic devices and bulk magnetic devices used therein has been rapidly increasing. It is known that a high Q value can be obtained by using an insulation-coated electric wire in which a ferromagnetic material such as iron is electrodeposited on the outer periphery of a copper conductor, and an enamel paint is applied and baked on the outer periphery of the coil component. . In addition, after electrolytically depositing a ferromagnetic material such as iron, a nickel electrodeposited film is applied to the outer periphery, and an enamel paint having solderability is applied and baked on the outer periphery. It is put to practical use as a magnetic plated wire for a high-frequency coil that also has this function. (Jpn. Pat. Appln. KOKAI Sho 42-1339, JP 62-151594 A)

【0003】[0003]

【発明が解決しようとする課題】然しながら、上述した
磁性めっき線は強磁性体層の膜厚を調整し高周波化に対
応するものの、該強磁性体層(膜)が単層膜から成るこ
とより、10MHz迄の周波数帯域に於ける軽薄短小化や
高性能化が限界であるという問題点があった。また、磁
性めっき線を高周波帯域で用いる場合、必然的に強磁性
体膜の薄膜化が考えられるが単層膜では出力が小さいた
め、デバイスとしての電気的特性を満たすためには薄膜
磁性材料を積層することが必要である。そのために、強
磁性材料と非磁性材料とを積層させた多層膜が多く研究
されてきた。また多層膜化の意図するところは、非磁性
層を挟んだ上下の磁性層間の磁気的相互作用により磁性
膜の磁区が単純化し磁性膜としての軟磁気特性が向上す
ることにある。更に、磁性層を薄膜化することによりう
ず電流損失が小さくなり、透磁率が高周波帯域まで延び
ることにあるものの何れも磁気素子としての研究であ
り、コイル部品などとしての研究は皆無に等しいもので
あった。その結果、当然のことながらその詳細な説明は
なされていないという問題点があった。
However, although the above-described magnetic plating wire adjusts the film thickness of the ferromagnetic material layer to cope with high frequency, it is possible that the ferromagnetic material layer (film) is composed of a single layer film. However, there is a problem that the miniaturization, lightness, shortness and high performance in the frequency band up to 10 MHz are limited. In addition, when using the magnetic plating wire in the high frequency band, it is inevitable that the ferromagnetic film will be made thinner, but since the output is small with a single layer film, a thin film magnetic material should be used to satisfy the electrical characteristics of the device. It is necessary to laminate. Therefore, many studies have been conducted on multilayer films in which a ferromagnetic material and a non-magnetic material are laminated. The intention of forming a multilayer film is to simplify the magnetic domain of the magnetic film by the magnetic interaction between the upper and lower magnetic layers sandwiching the non-magnetic layer and improve the soft magnetic characteristics of the magnetic film. Furthermore, thinning of the magnetic layer reduces eddy current loss, and the magnetic permeability extends to the high frequency band.These are all researches on magnetic elements, and research on coil parts is completely nonexistent. there were. As a result, as a matter of course, there is a problem that the detailed explanation is not given.

【0004】本発明は、上記従来技術が有する各種問題
点を解決するために成されたものであり、高周波抵抗損
失が小さい高周波用鉄電析膜、および高周波抵抗損失が
小さく、且つ高Q値を具備した高周波用コイルの作成が
可能な高周波コイル用絶縁電線およびこれらの製造方法
を提供することを目的とする。
The present invention has been made in order to solve various problems of the above-mentioned prior art, and has a high-frequency iron electrodeposition film having a small high-frequency resistance loss and a high-frequency resistance loss and a high Q value. It is an object of the present invention to provide an insulated wire for a high frequency coil, which is capable of producing a high frequency coil having the above, and a method for manufacturing these.

【0005】[0005]

【課題を解決するための手段】第1の観点として本発明
は、銅導体の外周に鉄とニッケルを交互に電析させ、鉄
−ニッケル交互電析層を形成させた高周波用鉄電析膜であっ
て、前記鉄−ニッケル交互電析層(膜)(以下、交互電析層
(膜)と略記する)が、6層以上12層以下から構成されて
成ることを特徴とする高周波用鉄電析膜にある。上記第
1観点の高周波用鉄電析膜では、銅導体の外周に鉄とニ
ッケルを交互に電析させた高周波用鉄電析膜に於いて、
当該交互電析層が、6層以上12層以下から構成されて成
る高周波用鉄電析膜なので、高周波抵抗損失が小さい鉄
電析膜となる。なお、前記交互電析層が6層より小さい
場合は、非磁性層を挟んだ上下の磁性層間の磁気的相互
作用が得られ難く磁性膜としての軟磁気特性が向上され
ない。また、前記交互電析層が12層より大きい場合は、
軟磁気特性は向上されるものの多層化の持つ特性が飽和
してしまうとともに、製造工数も増すためコストを押し
上げる要因となり好ましくない。
As a first aspect, the present invention is a high frequency iron electrodeposition film in which iron and nickel are alternately electrodeposited on the outer periphery of a copper conductor to form an iron-nickel alternate electrodeposition layer. The iron-nickel alternating electrodeposition layer (film) (hereinafter abbreviated as alternating electrodeposition layer (film)) is composed of 6 or more and 12 or less layers It is on the electrodeposition film. In the high frequency iron electrodeposition film of the first aspect, in the high frequency iron electrodeposition film in which iron and nickel are alternately deposited on the outer periphery of the copper conductor,
Since the alternating electrodeposition layer is a high frequency iron electrodeposited film composed of 6 to 12 layers, the iron electrodeposited film has a small high frequency resistance loss. When the alternating electrodeposition layers are smaller than 6, the magnetic interaction between the upper and lower magnetic layers sandwiching the non-magnetic layer is hard to be obtained, and the soft magnetic characteristics of the magnetic film are not improved. When the alternating electrodeposition layer is larger than 12 layers,
Although the soft magnetic characteristics are improved, the characteristics of the multi-layered structure are saturated, and the number of manufacturing steps is increased, which causes an increase in cost, which is not preferable.

【0006】第2の観点として本発明は、前記鉄−ニッケル
交互電析層の鉄膜厚X(μm)が0.02≦X≦0.0
5、ニッケル膜厚y(μm)が0.01≦y≦0.03
から構成されて成ることを特徴とする高周波用鉄電析膜
にある。上記第2観点の高周波用鉄電析膜では、鉄とニ
ッケルを交互に電析させた高周波用鉄電析膜に於いて、
当該交互電析層の鉄膜厚X(μm)は0.02≦X≦0.
05の範囲が好ましい。なお、鉄膜厚Xが0.02μm
より小さい膜厚では素地銅表面による凹凸等から外周を
完全に覆うことに困難を擁し、そのため高周波特性の向
上が得られない。また、鉄膜厚Xが0.05μmより厚
い膜厚では、透磁率が高周波帯域まで延び難いことと、
得られる鉄電析膜が比較的硬いことにより可とう性に乏
しく微細なクラック等欠陥が生じ易く、高周波特性の向
上が得られない。更に、ニッケル膜厚y(μm)は0.
01≦y≦0.03の範囲がはんだ付け性、高周波特性
上好ましい。なお、ニッケル膜厚yが、0.01μmよ
り小さい膜厚では充分なはんだ付け接合が得られず、ま
た0.03μmより大きい膜厚では鉄の磁気特性を阻害
し、良好な高周波特性が得られない。
As a second aspect of the present invention, the iron film thickness X (μm) of the iron-nickel alternating electrodeposition layer is 0.02 ≦ X ≦ 0.0.
5, nickel film thickness y (μm) is 0.01 ≦ y ≦ 0.03
It is an iron electrodeposited film for high frequencies, characterized in that it is composed of In the high frequency iron electrodeposition film of the second aspect, in the high frequency iron electrodeposition film in which iron and nickel are alternately deposited,
The iron film thickness X (μm) of the alternating electrodeposition layer was 0.02 ≦ X ≦ 0.
The range of 05 is preferable. The iron film thickness X is 0.02 μm
If the film thickness is smaller, it is difficult to completely cover the outer circumference due to irregularities due to the surface of the base copper, etc. Therefore, improvement in high frequency characteristics cannot be obtained. Further, when the iron film thickness X is thicker than 0.05 μm, it is difficult to extend the magnetic permeability to the high frequency band.
Since the obtained iron electrodeposited film is relatively hard, it has poor flexibility, and defects such as fine cracks are likely to occur, and improvement in high frequency characteristics cannot be obtained. Further, the nickel film thickness y (μm) is 0.
The range of 01 ≦ y ≦ 0.03 is preferable in terms of solderability and high frequency characteristics. When the nickel film thickness y is smaller than 0.01 μm, sufficient soldering joint cannot be obtained, and when the nickel film thickness y is larger than 0.03 μm, the magnetic properties of iron are impaired and good high frequency properties are obtained. Absent.

【0007】第3の観点として本発明は、前記高周波用
鉄電析膜が、300℃から800℃の温度で熱処理さ
れ、電着応力が緩和されていることを特徴とする高周波
用鉄電析膜にある。上記第3観点の高周波用鉄電析膜で
は、300℃から800℃の温度範囲で熱処理し電着応
力を緩和せしめることにより、電析時に共析する水素な
どの不純物によるめっき応力が緩和されことによって軟
磁気特性が向上される。なお、800℃を超える高温中
で例えば2時間などの長時間を有する熱処理では、鉄と
ニッケルの熱拡散反応が促進され単層合金層になるため
特性上劣る。また300℃より低温での熱処理は短時間
での水素除去が困難なため応力緩和されない。
As a third aspect, the present invention is characterized in that the high frequency iron electrodeposited film is heat-treated at a temperature of 300 ° C. to 800 ° C. to relax the electrodeposition stress. On the membrane. In the high-frequency iron electrodeposited film according to the third aspect, heat treatment in a temperature range of 300 ° C. to 800 ° C. to relax the electrodeposition stress can relax the plating stress due to impurities such as hydrogen co-deposited during electrodeposition. Thereby, the soft magnetic characteristics are improved. It should be noted that heat treatment having a long time such as 2 hours at a high temperature of more than 800 ° C. promotes the thermal diffusion reaction of iron and nickel to form a single-layer alloy layer, resulting in poor properties. Further, heat treatment at a temperature lower than 300 ° C. makes it difficult to remove hydrogen in a short time, so that stress is not relaxed.

【0008】第4の観点として本発明は、前記高周波用
鉄電析膜の外周にはんだ付け性を有するエナメル絶縁樹
脂層を設けたことを特徴とする高周波コイル用絶縁電線
にある。上記第4観点の高周波コイル用絶縁電線では、
前記高周波用鉄電析膜の外周にはんだ付け性を有するエ
ナメル絶縁樹脂層(以下、はんだ付け性エナメル絶縁樹
脂層と略記する)を設けることによって、良好な電気絶
縁性とはんだ付け性が得られるため高周波コイル用線材
として好適に使用できる。
A fourth aspect of the present invention is the insulated wire for a high frequency coil, characterized in that an enamel insulating resin layer having solderability is provided on the outer periphery of the high frequency iron electrodeposited film. In the insulated wire for a high frequency coil according to the fourth aspect,
By providing an enamel insulating resin layer having solderability on the outer periphery of the high frequency iron electrodeposited film (hereinafter, abbreviated as solderability enamel insulating resin layer), good electrical insulation and solderability can be obtained. Therefore, it can be suitably used as a wire material for a high frequency coil.

【0009】第5の観点として本発明は、前記第1観点
に記載の高周波用鉄電析膜の製造方法であって、銅導体
の外周に電気めっきにより鉄とニッケルを交互に電析さ
せ、鉄−ニッケル交互電析層を6層以上12層以下設けること
を特徴とする高周波用鉄電析膜の製造方法にある。上記
第5観点の高周波用鉄電析膜の製造方法では、電気めっ
きにより鉄とニッケルを交互に電析させ、鉄−ニッケル交互
電析層を6層以上12層以下設けることにより、前記第1
観点の高周波用鉄電析膜を効率良く製造することができ
る。
A fifth aspect of the present invention is the method for producing a high frequency iron electrodeposited film according to the first aspect, wherein iron and nickel are alternately electrodeposited on the outer periphery of the copper conductor by electroplating, A method for producing a high-frequency iron electrodeposited film is characterized in that the iron-nickel alternating electrodeposition layers are provided in the range of 6 to 12 layers. In the method for producing a high frequency iron electrodeposited film according to the fifth aspect, iron and nickel are alternately electrodeposited by electroplating, and 6 to 12 iron-nickel electrodeposited layers are provided.
The iron deposition film for high frequency from the viewpoint can be efficiently manufactured.

【0010】第6の観点として本発明は、前記第2観点
に記載の高周波用鉄電析膜の製造方法であって、電気め
っきにより前記鉄−ニッケル交互電析層の鉄膜厚X(μm)
を0.02≦X≦0.05、ニッケル膜厚y(μm)を
0.01≦y≦0.03設けることを特徴とする高周波
用鉄電析膜の製造方法にある。上記第6観点の高周波用
鉄電析膜の製造方法では、電気めっきにより前記鉄−ニッ
ケル交互電析層の鉄膜厚X(μm)を0.02≦X≦0.0
5、ニッケル膜厚y(μm)を0.01≦y≦0.03
設けることにより、前記第2観点の高周波用鉄電析膜を
効率良く製造することができる。
A sixth aspect of the present invention is the method for producing a high frequency iron electrodeposited film according to the second aspect, wherein the iron film thickness X (μm) of the iron-nickel alternating electrodeposition layer is formed by electroplating. )
Is set to 0.02 ≦ X ≦ 0.05, and a nickel film thickness y (μm) is set to 0.01 ≦ y ≦ 0.03. In the method for producing a high frequency iron electrodeposited film according to the sixth aspect, the iron film thickness X (μm) of the iron-nickel alternating electrodeposition layer is 0.02 ≦ X ≦ 0.0 by electroplating.
5, nickel film thickness y (μm) 0.01 ≦ y ≦ 0.03
By providing, the high-frequency iron electrodeposited film of the second aspect can be efficiently manufactured.

【0011】第7の観点として本発明は、前記第3観点
に記載の高周波用鉄電析膜の製造方法であって、前記高
周波用鉄電析膜を、非酸化性ガス雰囲気中で300℃か
ら800℃の温度で熱処理し、電着応力を緩和すること
を特徴とする高周波用鉄電析膜の製造方法にある。前記
非酸化性ガスとしては、窒素ガス、水素ガス等が挙げら
れる。上記第7観点の高周波用鉄電析膜の製造方法で
は、前記第3観点に記載の高周波用鉄電析膜を効率良く
製造することができる。前記高周波用鉄電析膜を、非酸
化性ガス雰囲気中で300℃から800℃の温度で熱処
理することにより電着応力が緩和され、電析時に共析す
る水素などの不純物によるめっき応力が緩和されことに
よって軟磁気特性が向上される。なお、800℃を超え
る高温中で例えば2時間などの長時間を有する熱処理で
は、鉄とニッケルの熱拡散反応が促進され単層合金層に
なるため特性上劣る。また300℃より低温での熱処理
は短時間での水素除去が困難なため応力緩和されない。
また非酸化性ガスを用いることにより、鉄電析膜表面の
酸化が防止される。
A seventh aspect of the present invention is the method for producing a high frequency iron electrodeposited film according to the third aspect, wherein the high frequency iron electrodeposited film is 300 ° C. in a non-oxidizing gas atmosphere. It is a method for producing an iron electrodeposited film for high frequency, which is characterized in that the electrodeposition stress is relaxed by heat treatment at a temperature of 1 to 800 ° C. Examples of the non-oxidizing gas include nitrogen gas and hydrogen gas. In the method for producing a high frequency iron electrodeposited film according to the seventh aspect, the high frequency iron electrodeposited film according to the third aspect can be efficiently produced. By heat-treating the high frequency iron electrodeposited film in a non-oxidizing gas atmosphere at a temperature of 300 ° C. to 800 ° C., electrodeposition stress is relaxed, and plating stress due to impurities such as hydrogen co-deposited during electrodeposition is relaxed. As a result, the soft magnetic characteristics are improved. It should be noted that heat treatment having a long time such as 2 hours at a high temperature of more than 800 ° C. promotes the thermal diffusion reaction of iron and nickel to form a single-layer alloy layer, resulting in poor properties. Further, heat treatment at a temperature lower than 300 ° C. makes it difficult to remove hydrogen in a short time, so that stress is not relaxed.
Further, by using a non-oxidizing gas, the surface of the iron electrodeposited film is prevented from being oxidized.

【0012】第8の観点として本発明は、前記第4観点
に記載の高周波コイル用絶縁電線の製造方法であって、
前記第5から第7観点の何れかに記載の高周波用鉄電析
膜の製造方法により得られた高周波用鉄電析膜の外周
に、はんだ付け性を有するエナメル塗料を塗布焼付けし
てはんだ付け性エナメル絶縁樹脂層を設け、高周波コイ
ル用絶縁電線とすることを特徴とする高周波コイル用絶
縁電線の製造方法にある。上記第8観点の高周波コイル
用絶縁電線の製造方法では、高周波用鉄電析膜の外周
に、はんだ付け性を有するエナメル塗料を塗布焼付けす
ることにより、前記第4観点に記載の高周波コイル用絶
縁電線を効率良く製造することができる。
As an eighth aspect, the present invention provides a method for manufacturing an insulated wire for a high frequency coil according to the fourth aspect,
The enamel coating having solderability is applied and baked on the outer periphery of the high-frequency iron electrodeposited film obtained by the method for producing a high-frequency iron electrodeposited film according to any one of the fifth to seventh aspects, and then soldered. A method for producing an insulated wire for a high-frequency coil, characterized in that a insulated enamel insulating resin layer is provided to provide an insulated wire for a high-frequency coil. In the method for producing an insulated wire for a high frequency coil according to the eighth aspect, the insulating material for a high frequency coil according to the fourth aspect is formed by applying and baking an enamel coating having solderability to the outer periphery of a high frequency iron electrodeposited film. The electric wire can be efficiently manufactured.

【0013】[0013]

【発明の実施の形態】以下、本発明の内容を、図に示す
実施の形態により更に詳細に説明する。なお、これによ
り本発明が限定されるものではない。図1は、本発明の
高周波用鉄電析膜および高周波コイル用絶縁電線の一例
を示す断面図である。図2は鉄−ニッケル交互電析層形成条
件および熱処理条件を示す図表である。図3は、空芯コ
イルの高周波抵抗損失と周波数の関係を示す図表であ
る。また図4は、空芯コイルのQ値と周波数の関係を示
す図表である。これらの図において、1は銅導体(銅
線)、2、4、6は鉄電析膜(鉄膜)、3、5、7はニッ
ケル電析膜(ニッケル膜)、8は高周波用鉄電析膜(鉄−
ニッケル交互電析膜)、9はポリウレタン皮膜(はんだ付け
性エナメル絶縁樹脂層)、また10は高周波コイル用ポ
リウレタン銅線(高周波コイル用絶縁電線)である。
BEST MODE FOR CARRYING OUT THE INVENTION The contents of the present invention will be described below in more detail with reference to the embodiments shown in the drawings. The present invention is not limited to this. FIG. 1 is a cross-sectional view showing an example of a high frequency iron electrodeposited film and a high frequency coil insulated wire of the present invention. FIG. 2 is a chart showing iron-nickel alternating electrodeposition layer forming conditions and heat treatment conditions. FIG. 3 is a chart showing the relationship between the high frequency resistance loss of the air core coil and the frequency. Further, FIG. 4 is a chart showing the relationship between the Q value of the air-core coil and the frequency. In these figures, 1 is a copper conductor (copper wire), 2, 4 and 6 are iron electrodeposited films (iron film), 3, 5 and 7 are nickel electrodeposited films (nickel film), 8 is high frequency iron electrode. Deposition film (iron-
Nickel alternating electrodeposition film), 9 is a polyurethane film (solderable enamel insulating resin layer), and 10 is a polyurethane copper wire for high frequency coils (insulated electric wire for high frequency coils).

【0014】−第1の実施の形態(実施例1)− 実施例1について図1および図表2を用いて説明する。
なお、炉、めっき槽等の装置については図示しない。外
径φ0.10mmの銅線(銅99.9%)を走行させて
炉中で焼鈍し、次いで電解脱脂し(主成分:NaOH、40
℃)、更に酸洗い(主成分:硫酸、25℃)して銅導体
1とした。次に、前記銅導体1を走行させて鉄めっき槽
中に浸漬し、通電させ、0.03μm厚さの鉄電析膜
(以下、鉄膜と略記する)2を得た。次に、鉄膜2の形成
された銅導体1を走行させてニッケルめっき槽中に浸漬
し、通電させ、0.02μm厚さのニッケル電析膜(以
下、ニッケル膜と略記する)3を得た。ニッケルめっき
後案内滑車を用いて鉄めっき槽に戻し、0.03μm厚
さの鉄膜4を電析させ、続いて0.02μm厚さのニッ
ケル膜5を電析させた。続いて、前記と同様にして、
0.03μm厚さの鉄膜6を電析させ、続いて0.02
μm厚さのニッケル膜7を電析させた。そして、鉄−ニッ
ケルの交互電析によって、鉄層3層(2,4,6)/ニッ
ケル層3層(3,5,7)の合計6層の交互電析膜(高
周波用鉄電析膜)8を得た。続いて、交互電析膜8の外
周にポリウレタン塗料を塗布焼き付けして、5μm厚さ
のポリウレタン皮膜(はんだ付け性エナメル絶縁樹脂
層)9を設け、高周波コイル用ポリウレタン銅線10
(高周波コイル用絶縁電線)を製造した。前記鉄の電気
めっきには、pH3に調整した硫酸第一鉄と塩化第一鉄
の混合液で、液温25℃のめっき液を用い、陽極には高
純度鉄を用いた。また、前記ニッケルの電気めっきに
は、pH4に調整した硫酸ニッケルと塩化ニッケルの混
合液で、液温40℃のめっき液を用い、陽極には白金被
覆チタン電極を使用した。
-First Embodiment (Example 1) -Example 1 will be described with reference to FIG. 1 and Table 2.
Devices such as a furnace and a plating tank are not shown. A copper wire with an outer diameter of 0.10 mm (copper 99.9%) is run, annealed in a furnace, and then electrolytically degreased (main component: NaOH, 40
C.) and further pickled (main component: sulfuric acid, 25.degree. C.) to obtain a copper conductor 1. Next, the copper conductor 1 is run, immersed in an iron plating tank, energized, and an iron electrodeposition film having a thickness of 0.03 μm is obtained.
(Hereinafter, abbreviated as iron film) was obtained. Next, the copper conductor 1 on which the iron film 2 is formed is run, immersed in a nickel plating bath, and energized to obtain a nickel electrodeposition film (hereinafter abbreviated as nickel film) 3 having a thickness of 0.02 μm. It was After nickel plating, it was returned to the iron plating tank using a guide pulley, and an iron film 4 having a thickness of 0.03 μm was electrodeposited, and then a nickel film 5 having a thickness of 0.02 μm was electrodeposited. Then, in the same way as above,
An iron film 6 having a thickness of 0.03 μm is electrodeposited, followed by 0.02
A nickel film 7 having a thickness of μm was electrodeposited. Then, by alternating electrodeposition of iron-nickel, a total of 6 layers of the iron layer 3 layers (2, 4, 6) / nickel layer 3 layers (3, 5, 7) (high-frequency iron electrodeposition film) ) 8 was obtained. Subsequently, a polyurethane paint is applied and baked on the outer periphery of the alternate electrodeposition film 8 to form a polyurethane film (solderable enamel insulating resin layer) 9 having a thickness of 5 μm, and a polyurethane copper wire 10 for a high frequency coil 10 is formed.
(Insulated wire for high frequency coil) was manufactured. For the electroplating of iron, a mixed solution of ferrous sulfate and ferrous chloride adjusted to pH 3 with a liquid temperature of 25 ° C. was used, and high-purity iron was used for the anode. For the electroplating of nickel, a mixed solution of nickel sulfate and nickel chloride adjusted to pH 4 with a solution temperature of 40 ° C. was used, and a platinum-coated titanium electrode was used as the anode.

【0015】−第2の実施の形態(実施例2)− 実施例1と同様の方法および図表2に詳細を示した条件
によって、鉄層4層/ニッケル層4層の合計8層の交互
電析膜(高周波用鉄電析膜)を得た。続いて、交互電析
膜の外周にポリウレタン塗料を塗布焼き付けして、5μ
m厚さのポリウレタン皮膜を設け、高周波コイル用ポリ
ウレタン銅線(高周波コイル用絶縁電線)を製造した。
-Second Embodiment (Example 2) -According to the same method as in Example 1 and the conditions shown in detail in FIG. 2, a total of 8 alternating layers of 4 iron layers / 4 nickel layers. A deposited film (iron high frequency electrodeposition film) was obtained. Then, apply polyurethane paint on the outer periphery of the alternating electrodeposition film and bake it to 5 μm.
A polyurethane film having a thickness of m was provided to produce a polyurethane copper wire for a high frequency coil (insulated electric wire for a high frequency coil).

【0016】−第3の実施の形態(実施例3)− 実施例1と同様の方法および図表2に詳細を示した条件
によって、鉄層5層/ニッケル層5層の合計10層の交
互電析膜(高周波用鉄電析膜)を得た。続いて、交互電
析膜の外周にポリウレタン塗料を塗布焼き付けして、5
μm厚さのポリウレタン皮膜を設け、高周波コイル用ポ
リウレタン銅線(高周波コイル用絶縁電線)を製造し
た。
-Third Embodiment (Example 3) -According to the same method as in Example 1 and the conditions shown in detail in FIG. 2, a total of 10 alternating layers of 5 iron layers / 5 nickel layers. A deposited film (iron high frequency electrodeposition film) was obtained. Subsequently, the outer periphery of the alternating electrodeposition film was coated with polyurethane paint and baked,
By providing a polyurethane film having a thickness of μm, a polyurethane copper wire for high frequency coil (insulated electric wire for high frequency coil) was manufactured.

【0017】−第4の実施の形態(実施例4)− 実施例1と同様の方法および図表2に詳細を示した条件
によって、鉄層6層/ニッケル層6層の合計12層の交
互電析膜(高周波用鉄電析膜)を得た。続いて、交互電
析膜の外周にポリウレタン塗料を塗布焼き付けして、5
μm厚さのポリウレタン皮膜を設け、高周波コイル用ポ
リウレタン銅線(高周波コイル用絶縁電線)を製造し
た。
Fourth Embodiment (Example 4) -According to the same method as in Example 1 and the conditions shown in detail in Table 2, a total of 12 layers of 6 iron layers / 6 nickel layers are alternately charged. A deposited film (iron high frequency electrodeposition film) was obtained. Subsequently, the outer periphery of the alternating electrodeposition film was coated with polyurethane paint and baked,
By providing a polyurethane film having a thickness of μm, a polyurethane copper wire for high frequency coil (insulated electric wire for high frequency coil) was manufactured.

【0018】−第5の実施の形態(実施例5)− 実施例1と同様の方法および図表2に詳細を示した条件
によって、鉄層3層/ニッケル層3層の合計6層の交互
電析膜を得た。続いて、水素ガス雰囲気中で熱処理温度
400℃、5分の条件によって熱処理し応力緩和した。
続いて、応力緩和した交互電析膜の外周にポリウレタン
塗料を塗布焼き付けして、5μm厚さのポリウレタン皮
膜を設け、高周波コイル用ポリウレタン銅線(高周波コ
イル用絶縁電線)を製造した。
-Fifth Embodiment (Example 5) -According to the same method as in Example 1 and the conditions detailed in Table 2, a total of 6 layers of three iron layers / three nickel layers of alternating current. A deposited film was obtained. Then, heat treatment was performed in a hydrogen gas atmosphere at a heat treatment temperature of 400 ° C. for 5 minutes to relax the stress.
Subsequently, a polyurethane coating was applied and baked on the outer periphery of the stress-relaxed alternating electrodeposition film to form a polyurethane film having a thickness of 5 μm, and a polyurethane copper wire for a high frequency coil (insulated electric wire for a high frequency coil) was manufactured.

【0019】−第6の実施の形態(実施例6)− 実施例1と同様の方法および図表2に詳細を示した条件
によって、鉄層3層/ニッケル層3層の合計6層の交互
電析膜を得た。続いて、水素ガス雰囲気中で熱処理温度
800℃、2秒の条件によって熱処理し応力緩和した。
続いて、応力緩和した交互電析膜の外周にポリウレタン
塗料を塗布焼き付けして、5μm厚さのポリウレタン皮
膜を設け、高周波コイル用ポリウレタン銅線(高周波コ
イル用絶縁電線)を製造した。
-Sixth Embodiment (Example 6) -According to the same method as in Example 1 and the conditions detailed in Table 2, a total of 6 layers of iron layers / 3 layers of nickel are alternately charged. A deposited film was obtained. Then, heat treatment was performed in a hydrogen gas atmosphere under the conditions of a heat treatment temperature of 800 ° C. for 2 seconds to relax the stress.
Subsequently, a polyurethane coating was applied and baked on the outer periphery of the stress-relaxed alternating electrodeposition film to form a polyurethane film having a thickness of 5 μm, and a polyurethane copper wire for a high frequency coil (insulated electric wire for a high frequency coil) was manufactured.

【0020】−その他の実施の形態(実施例7〜12)
− 前記実施例1の方法に準拠し、また図表2に詳細を示し
た条件によって、鉄層、ニッケル層厚さおよび層数、お
よび熱処理時間、温度を調整して得られた交互電析膜の
外周にポリウレタン塗料を塗布焼き付けして、5μm厚
さのポリウレタン皮膜を設け、高周波コイル用ポリウレ
タン銅線(高周波コイル用絶縁電線)を製造した。
-Other embodiments (Examples 7 to 12)
Of an alternating electrodeposition film obtained by adjusting the iron layer, the nickel layer thickness and the number of layers, the heat treatment time and the temperature according to the conditions detailed in Table 2 according to the method of Example 1 above. A polyurethane coating was applied and baked on the outer periphery to form a polyurethane film having a thickness of 5 μm, and a polyurethane copper wire for a high frequency coil (insulated electric wire for a high frequency coil) was manufactured.

【0021】―比較例(比較例1〜8)― 前記実施例1の方法に準拠し、また図表2に詳細を示し
た条件によって、鉄層、ニッケル層厚さおよび層数、お
よび熱処理時間、温度を調整して得られた交互電析膜の
外周にポリウレタン塗料を塗布焼き付けして、5μm厚
さのポリウレタン皮膜を設け、ポリウレタン銅線を製造
した。なお、比較例8は銅線のみにポリウレタン皮膜を
設けたものである。
-Comparative Examples (Comparative Examples 1 to 8) -The iron layer, the nickel layer thickness and the number of layers, and the heat treatment time according to the method of Example 1 and under the conditions shown in Table 2 in detail, A polyurethane coating was applied and baked on the outer periphery of the alternating electrodeposition film obtained by adjusting the temperature to form a polyurethane film having a thickness of 5 μm, and a polyurethane copper wire was manufactured. In Comparative Example 8, a polyurethane film is provided only on the copper wire.

【0022】―コイル巻線および高周波特性試験― 図表2による各種条件およびポリウレタン塗料を塗布焼
き付けすることによって得られた実施例および比較例の
ポリウレタン銅線(コイル用絶縁電線)を、φ5.2m
mのプラスチックボビンに23回単層密着巻きさせて空
芯コイルを作製した(実施例1c〜12cおよび比較例
1c〜8c)。次に、これら実施例および比較例の空芯
コイルをインピーダンスアナライザー(HP製)により高
周波特性を試験し、周波数帯域(1〜100MHz)に於
ける高周波抵抗損失と周波数の関係を図表3に、またQ
値と周波数の関係を図表4に示した。図表3および図表
4より明らかなように、本発明の高周波コイル用絶縁電
線を用いた空芯コイルは、10MHzを超える高周波帯域
においても高周波抵抗損失が少なく、またQ値が高く高
周波特性が良好であった。
—Coil Winding and High Frequency Characteristic Test— Polyurethane copper wires (insulated electric wires for coils) of Examples and Comparative Examples obtained by applying and baking various conditions shown in FIG.
A single layer was wound tightly around a plastic bobbin of m 23 times to produce air core coils (Examples 1c to 12c and Comparative Examples 1c to 8c). Next, the air-core coils of these examples and comparative examples were tested for high frequency characteristics with an impedance analyzer (made by HP), and the relationship between high frequency resistance loss and frequency in the frequency band (1 to 100 MHz) is shown in Table 3 and Q
Figure 4 shows the relationship between values and frequencies. As is clear from FIGS. 3 and 4, the air-core coil using the insulated wire for a high-frequency coil of the present invention has a low high-frequency resistance loss even in a high-frequency band exceeding 10 MHz, has a high Q value, and has excellent high-frequency characteristics. there were.

【0023】[0023]

【発明の効果】本発明の高周波用鉄電析膜、高周波コイ
ル用絶縁電線およびこれらの製造方法によれば、高周波
抵抗損失が小さい鉄電析膜を製造しうる高周波用鉄電析
膜、および高周波抵抗損失が小さく、且つ高Q値を具備
した高周波用コイルの作成可能な高周波コイル用絶縁電
線の製造が可能になった。従って、各種電子機器部品の
高性能化が図れるため、産業上寄与する効果は極めて大
となる。
According to the high-frequency iron electrodeposited film, the high-frequency coil insulated wire and the method for producing the same of the present invention, a high-frequency iron electrodeposited film capable of producing an iron electrodeposited film with a small high-frequency resistance loss, and It has become possible to manufacture insulated wires for high-frequency coils that can produce high-frequency coils with low high-frequency resistance loss and high Q values. Therefore, the performance of various electronic device parts can be improved, and the effect of contributing to the industry is extremely large.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の高周波用鉄電析膜および高周波コイル
用絶縁電線の一例を示す断面図である。
FIG. 1 is a cross-sectional view showing an example of a high frequency iron electrodeposited film and an insulated wire for a high frequency coil according to the present invention.

【図2】鉄−ニッケル交互電析層形成条件および熱処理条件
を示す図表である。
FIG. 2 is a table showing iron-nickel alternating electrodeposition layer forming conditions and heat treatment conditions.

【図3】空芯コイルの高周波抵抗損失と周波数の関係を
示す図表である。
FIG. 3 is a table showing the relationship between high frequency resistance loss of an air core coil and frequency.

【図4】空芯コイルのQ値と周波数の関係を示す図表で
ある。
FIG. 4 is a chart showing the relationship between the Q value and the frequency of the air-core coil.

【符号の説明】[Explanation of symbols]

1 銅導体(銅線) 2、4、6 鉄電析膜(鉄膜) 3、5、7 ニッケル電析膜(ニッケル膜) 8 高周波用鉄電析膜(鉄−ニッケル交互電析膜) 9 ポリウレタン皮膜(はんだ付け性エナメル絶縁樹脂
層) 10 高周波コイル用ポリウレタン銅線(高周波コイル
用絶縁電線)
1 Copper conductor (copper wire) 2, 4, 6 Iron electrodeposition film (iron film) 3, 5, 7 Nickel electrodeposition film (nickel film) 8 High frequency iron electrodeposition film (iron-nickel alternate electrodeposition film) 9 Polyurethane film (solderable enamel insulating resin layer) 10 Polyurethane copper wire for high frequency coil (insulated wire for high frequency coil)

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01B 7/02 H01B 7/02 A 5G325 13/00 517 13/00 517 13/16 13/16 B H01F 27/00 H01F 27/28 L 27/28 15/00 A Fターム(参考) 4K024 AA03 AA04 AB04 BA09 BC03 CA01 CA03 CB06 CB07 DA03 DA04 DB01 4K044 AA06 AB04 BA06 BA21 BB06 BC14 CA04 CA18 CA53 CA62 5E043 AA01 AB01 AB09 5E070 AB06 CA02 CA03 5G309 CA06 LA04 LA06 MA08 5G325 KA01 KC01 KC05 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01B 7/02 H01B 7/02 A 5G325 13/00 517 13/00 517 13/16 13/16 B H01F 27 / 00 H01F 27/28 L 27/28 15/00 AF term (reference) 4K024 AA03 AA04 AB04 BA09 BC03 CA01 CA03 CB06 CB07 DA03 DA04 DB01 4K044 AA06 AB04 BA06 BA21 BB06 BC14 CA04 CA18 CA53 CA62 5E043 AA01 AB01 CA02 5E070 AB CA03 5G309 CA06 LA04 LA06 MA08 5G325 KA01 KC01 KC05

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 銅導体の外周に鉄とニッケルを交互に電
析させ、鉄−ニッケル交互電析層を形成させた高周波用鉄電
析膜であって、前記鉄−ニッケル交互電析層が、6層以上12
層以下から構成されて成ることを特徴とする高周波用鉄
電析膜。
1. A high-frequency iron electrodeposition film in which iron and nickel are alternately deposited on the outer periphery of a copper conductor to form an iron-nickel alternate electrodeposition layer, wherein the iron-nickel alternate electrodeposition layer is formed. , 6 layers or more 12
An iron electrodeposited film for high frequencies, which is composed of layers and below.
【請求項2】 前記鉄−ニッケル交互電析層の鉄膜厚X(μ
m)が0.02≦X≦0.05、ニッケル膜厚y(μ
m)が0.01≦y≦0.03から構成されて成ること
を特徴とする請求項1記載の高周波用鉄電析膜。
2. The iron film thickness X (μ
m) is 0.02 ≦ X ≦ 0.05, nickel film thickness y (μ
2. The high frequency iron electrodeposited film according to claim 1, wherein m) is composed of 0.01 ≦ y ≦ 0.03.
【請求項3】 前記高周波用鉄電析膜が、300℃から
800℃の温度で熱処理され、電着応力が緩和されてい
ることを特徴とする請求項1または2記載の高周波用鉄
電析膜。
3. The high frequency iron electrodeposited film according to claim 1, wherein the high frequency iron electrodeposited film is heat-treated at a temperature of 300 ° C. to 800 ° C. to relieve the electrodeposition stress. film.
【請求項4】 請求項1から3の何れかに記載の高周波
用鉄電析膜の外周にはんだ付け性を有するエナメル絶縁
樹脂層を設けたことを特徴とする高周波コイル用絶縁電
線。
4. An insulated wire for a high frequency coil, comprising an enamel insulating resin layer having solderability provided on the outer periphery of the high frequency iron electrodeposited film according to any one of claims 1 to 3.
【請求項5】 請求項1記載の高周波用鉄電析膜の製造
方法であって、銅導体の外周に電気めっきにより鉄とニ
ッケルを交互に電析させ、鉄−ニッケル交互電析層を6層以
上12層以下設けることを特徴とする高周波用鉄電析膜の
製造方法。
5. The method for producing a high frequency iron electrodeposited film according to claim 1, wherein iron and nickel are alternately electrodeposited on the outer periphery of the copper conductor by electroplating to form an iron-nickel alternate electrodeposition layer. A method for producing a high frequency iron electrodeposited film, characterized in that the number of layers is 12 or more and 12 or less.
【請求項6】 請求項2記載の高周波用鉄電析膜の製造
方法であって、電気めっきにより前記鉄−ニッケル交互電析
層の鉄膜厚X(μm)を0.02≦X≦0.05、ニッケ
ル膜厚y(μm)を0.01≦y≦0.03設けること
を特徴とする高周波用鉄電析膜の製造方法。
6. The method for producing a high frequency iron electrodeposited film according to claim 2, wherein the iron film thickness X (μm) of the iron-nickel alternating electrodeposition layer is 0.02 ≦ X ≦ 0 by electroplating. .05, and a nickel film thickness y (μm) of 0.01 ≦ y ≦ 0.03 is provided.
【請求項7】 請求項3記載の高周波用鉄電析膜の製造
方法であって、前記高周波用鉄電析膜を、非酸化性ガス
雰囲気中で300℃から800℃の温度で熱処理し、電
着応力を緩和することを特徴とする高周波用鉄電析膜の
製造方法。
7. The method for producing a high frequency iron electrodeposited film according to claim 3, wherein the high frequency iron electrodeposited film is heat-treated at a temperature of 300 ° C. to 800 ° C. in a non-oxidizing gas atmosphere, A method for producing a high-frequency iron electrodeposited film, characterized by relaxing electrodeposition stress.
【請求項8】 請求項4記載の高周波コイル用絶縁電線
の製造方法であって、請求項5から7の何れかに記載の
高周波用鉄電析膜の製造方法により得られた高周波用鉄
電析膜の外周にはんだ付け性を有するエナメル塗料を塗
布焼付けしてはんだ付け性エナメル絶縁樹脂層を設け、
高周波コイル用絶縁電線とすることを特徴とする高周波
コイル用絶縁電線の製造方法。
8. A method for producing an insulated wire for a high frequency coil according to claim 4, wherein the high frequency iron electrode is obtained by the method for producing a high frequency iron electrodeposited film according to any one of claims 5 to 7. Enamel paint having solderability is applied to the outer periphery of the deposited film and baked to form a solderable enamel insulating resin layer,
A method for producing an insulated wire for a high frequency coil, which is an insulated wire for a high frequency coil.
JP2001269761A 2001-09-06 2001-09-06 Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these Pending JP2003073883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001269761A JP2003073883A (en) 2001-09-06 2001-09-06 Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001269761A JP2003073883A (en) 2001-09-06 2001-09-06 Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these

Publications (1)

Publication Number Publication Date
JP2003073883A true JP2003073883A (en) 2003-03-12

Family

ID=19095519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001269761A Pending JP2003073883A (en) 2001-09-06 2001-09-06 Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these

Country Status (1)

Country Link
JP (1) JP2003073883A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010268A (en) * 2007-06-29 2009-01-15 Asahi Kasei Electronics Co Ltd Planal coil and manufacturing method therefor
JP2009021325A (en) * 2007-07-11 2009-01-29 Murata Mfg Co Ltd Winding type common mode choke coil
WO2009071016A1 (en) * 2007-11-19 2009-06-11 Gang Liu A manufacturing method of a copper clad permeability material conductor
JP2010093145A (en) * 2008-10-10 2010-04-22 Totoku Electric Co Ltd Alpha-winding coil
JP2010242117A (en) * 2009-04-01 2010-10-28 Alps Electric Co Ltd Electrical contact and method for manufacturing the same
JP2011114085A (en) * 2009-11-25 2011-06-09 Furukawa Electric Co Ltd:The Magnetic wire material and inductor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010268A (en) * 2007-06-29 2009-01-15 Asahi Kasei Electronics Co Ltd Planal coil and manufacturing method therefor
JP2009021325A (en) * 2007-07-11 2009-01-29 Murata Mfg Co Ltd Winding type common mode choke coil
WO2009071016A1 (en) * 2007-11-19 2009-06-11 Gang Liu A manufacturing method of a copper clad permeability material conductor
JP2010093145A (en) * 2008-10-10 2010-04-22 Totoku Electric Co Ltd Alpha-winding coil
JP2010242117A (en) * 2009-04-01 2010-10-28 Alps Electric Co Ltd Electrical contact and method for manufacturing the same
JP2011114085A (en) * 2009-11-25 2011-06-09 Furukawa Electric Co Ltd:The Magnetic wire material and inductor

Similar Documents

Publication Publication Date Title
US10867748B2 (en) Method for preparing a composite wire and a power inductor
KR20160148459A (en) Method for manufacturing ceramic electronic component, and ceramic electronic component
US20170053728A1 (en) Electromagnetic device having layered magnetic material components and methods for making same
US8373250B2 (en) On-chip inductor structure and method for manufacturing the same
JP2003073883A (en) Electrodeposited iron film for high-frequency, insulated wire for high-frequency coil, and manufacturing method for these
US20150014899A1 (en) Method for manufacturing laminated coil component
KR101803308B1 (en) A HIGH CURRENT MULTILAYER INDUCTOR APPLICABLE FREQUENCY 5MHz BAND
US11854727B2 (en) Powder magnetic core with terminal and method for manufacturing the same
JP2004111072A (en) Flat angular ferromagnetic conductor and its manufacturing method, enamel-coated flat angular ferromagnetic wire, self-fusible enamel-coated flat angular ferromagnetic wire and ferromagnetic flat cable using the conductor
RU2648996C2 (en) Method of forming insulated electric conductor
JPH10237674A (en) Plated aluminum electric wire, insulating plated aluminum electric wire and their production
JP7146449B2 (en) Wires and coils for high frequency coils
JPS6014416A (en) Manufacture of electronic component
JP3089428B2 (en) Method for producing insulating high magnetic permeability alloy
JPS63283004A (en) Flat surface inductor and manufacture thereof
JP2002231060A (en) Magnetic wire
JPH11111067A (en) Laminated insulated flat wire for high frequency
CN213277491U (en) Inductance enameled wire
JPH10237673A (en) Plated aluminum electric wire, insulating plated aluminum electric wire and their production
JP2003077719A (en) High frequency coil enameled wire
JPS63278315A (en) Lamination type inductor and its manufacture
JPS62151594A (en) Production of insulated electric wire for high-frequency coil
JP2002299120A (en) Planar magnetic element
JPS63268210A (en) Laminated inductor and manufacture thereof
JP2005019511A (en) Micro inductor and its manufacturing method