TW201914082A - a method for processing a plurality of masks in a vacuum coating process, a method for processing a plurality of substrates by depositing a plurality of different material layers, and a device for coating a plurality of substrates - Google Patents
a method for processing a plurality of masks in a vacuum coating process, a method for processing a plurality of substrates by depositing a plurality of different material layers, and a device for coating a plurality of substrates Download PDFInfo
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- TW201914082A TW201914082A TW107128715A TW107128715A TW201914082A TW 201914082 A TW201914082 A TW 201914082A TW 107128715 A TW107128715 A TW 107128715A TW 107128715 A TW107128715 A TW 107128715A TW 201914082 A TW201914082 A TW 201914082A
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- 238000000576 coating method Methods 0.000 title claims abstract description 343
- 239000011248 coating agent Substances 0.000 title claims abstract description 326
- 238000000034 method Methods 0.000 title claims abstract description 74
- 230000008569 process Effects 0.000 title claims abstract description 25
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 5
- 239000000758 substrate Substances 0.000 title claims description 147
- 238000000151 deposition Methods 0.000 title claims description 68
- 239000000463 material Substances 0.000 title claims description 49
- 238000012545 processing Methods 0.000 title claims description 29
- 238000012546 transfer Methods 0.000 claims description 41
- 238000003795 desorption Methods 0.000 claims description 28
- 230000000873 masking effect Effects 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000007717 exclusion Effects 0.000 claims description 2
- 238000013022 venting Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 description 54
- 230000007704 transition Effects 0.000 description 44
- 239000010410 layer Substances 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 9
- 238000005137 deposition process Methods 0.000 description 9
- 239000011368 organic material Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 238000005339 levitation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004680 force modulation microscopy Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000013086 organic photovoltaic Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
Description
本揭露之數個實施例是有關於數種處理數個遮罩之方法,特別是具有不同塗佈應用時間之數個遮罩。本揭露之數個實施例亦有關於處理數個基板,特別是用以沈積兩種、三種或更多種不同材料於數個基板上。再者,本揭露之數個實施例係有關於數個用以塗佈數個基板之設備。數個實施例特別是有關於數個用以處理數個基板之方法,及數個用以塗佈數個基板之設備,其中數個遮罩係使用於沈積一預定結構於此些基板上。The embodiments of the present disclosure are related to several methods for processing several masks, in particular, several masks with different coating application times. The embodiments of the present disclosure are also related to processing several substrates, especially for depositing two, three or more different materials on several substrates. Furthermore, the embodiments of the present disclosure relate to several devices for coating several substrates. Several embodiments are particularly related to a number of methods for processing a number of substrates and a number of devices for coating a number of substrates, wherein a number of masks are used to deposit a predetermined structure on these substrates.
使用有機材料之光電裝置係因為一些理由而變得受歡迎。使用以製造此些裝置的許多材料係相對便宜,所以有機光電裝置相對於無機裝置係具有成本優勢的潛力。有機材料之固有性質例如是有機材料的撓性,可對於例如是沈積於撓性或非撓性基板上之應用為有利的。有機光電裝置之例子可包括有機發光二極體裝置、有機光電晶體、有機光伏電池、及有機光偵測器。Optoelectronic devices using organic materials have become popular for several reasons. Many of the material systems used to make these devices are relatively inexpensive, so organic optoelectronic devices have the potential for cost advantages over inorganic device systems. The inherent properties of organic materials, such as the flexibility of organic materials, may be advantageous for applications such as deposition on flexible or non-flexible substrates. Examples of organic photovoltaic devices may include organic light emitting diode devices, organic photovoltaic crystals, organic photovoltaic cells, and organic light detectors.
有機發光二極體(OLED)裝置之有機材料可相對於傳統材料具有性能上的優勢。舉例來說,有機發光層發光之波長可利用適當的摻雜劑輕易地調整。當電壓供應至裝置時,OLED裝置係應用發光之薄有機膜。OLED裝置係變成更令人感興趣的技術來用於例如是平板顯示器、發光、及背光之應用中。Organic materials of organic light emitting diode (OLED) devices can have performance advantages over traditional materials. For example, the wavelength of light emitted by the organic light-emitting layer can be easily adjusted with an appropriate dopant. When voltage is supplied to the device, the OLED device is a thin organic film that emits light. OLED devices are becoming more interesting technologies for applications such as flat panel displays, light emitting, and backlighting.
材料一般係沈積於設備中之基板上,用以在次大氣壓力(sub-atmospheric pressure)下塗佈基板,此材料特別是有機材料。在沈積期間,遮罩可配置於基板之前方,其中遮罩可具有至少一開孔或數個開孔。此至少一開孔或此些開孔係定義開孔圖案,對應於舉例為藉由蒸發之將沈積於基板上的材料圖案。基板一般係在沈積期間配置於遮罩之後方,且相對於遮罩對準。舉例來說,遮罩載體可使用以傳送遮罩至真空處理系統之塗佈腔室中,及基板載體可使用以傳送基板至塗佈腔室中來配置基板於遮罩之後方。The material is generally deposited on a substrate in a device for coating the substrate under sub-atmospheric pressure. This material is especially an organic material. During the deposition period, the mask may be disposed in front of the substrate, wherein the mask may have at least one opening or several openings. The at least one opening or openings define an opening pattern, corresponding to an example of a material pattern to be deposited on a substrate by evaporation. The substrate is generally disposed behind the mask during the deposition period and is aligned with the mask. For example, a mask carrier can be used to transfer the mask to the coating chamber of the vacuum processing system, and a substrate carrier can be used to transfer the substrate to the coating chamber to configure the substrate behind the mask.
一般來說,兩種、三種、五種、十種或多種材料可接續地沈積於基板上而具有不同沈積厚度,舉例為用以製造彩色顯示器。在此製程期間,不但基板係進行塗佈,且材料亦沈積於遮罩上。所以,當遮罩的開孔開始阻塞時,遮罩必須不時地更換。用於塗佈基板之大設備的專用遮罩處理方法係提高整體製程效率,及塗佈品質會為有利的。同時,在考慮用於塗佈基板之大設備中有效之遮罩處理的需求下,用於塗佈之處理方法及設備會為有利的,而用以製造高品質塗佈層,特別是用以製造OLED裝置。Generally, two, three, five, ten, or more materials can be successively deposited on a substrate with different deposition thicknesses, for example, for manufacturing a color display. During this process, not only the substrate is coated, but the material is also deposited on the mask. Therefore, when the openings of the mask begin to block, the mask must be replaced from time to time. The special mask processing method for large equipment for coating substrates is to improve the overall process efficiency, and the coating quality will be advantageous. At the same time, considering the need for effective mask processing in large equipment for coating substrates, the processing method and equipment for coating will be advantageous, and used to manufacture high-quality coating layers, especially for Manufacturing of OLED devices.
有鑑於上述,提出數種操作用以塗佈數個基板之數個設備之方法,及數個用以塗佈數個基板之設備,而用以沈積不同材料於數個基板上。In view of the foregoing, several methods for operating several devices for coating several substrates, and several devices for coating several substrates are proposed to deposit different materials on several substrates.
根據本揭露之一方面,提出一種用以於一真空塗佈製程中處理數個遮罩之方法。各遮罩係裝配以於一塗佈製程中使用一預定塗佈應用時間。方法包括提供數個匣,各具有數個遮罩槽,及根據各遮罩之塗佈應用時間,分類此些遮罩成至少二個群集群組。方法更包括分配此至少二個群集群組至此些匣之一或多者,以及根據分配,儲存此些遮罩於此些匣中。According to one aspect of the present disclosure, a method for processing several masks in a vacuum coating process is proposed. Each mask is assembled to use a predetermined coating application time in a coating process. The method includes providing a plurality of cassettes, each having a plurality of mask slots, and classifying the masks into at least two cluster groups according to the application time of the masks. The method further includes allocating the at least two cluster groups to one or more of the bins, and storing the masks in the bins according to the assignment.
根據本揭露之其他方面,提出一種用以藉由沈積數個不同材料層來處理數個基板的方法。此方法包括如此處所述之用以處理數個遮罩之方法。此方法更包括傳送一第一匣中之此些遮罩之一第一遮罩至一第一塗佈腔室,及較佳地在相同時間點傳送第一匣中之此些遮罩之一第二遮罩至一第二塗佈腔室。此方法更包括藉由第一遮罩之使用於第一塗佈腔室中沈積一第一材料,及藉由第二遮罩之使用於第二塗佈腔室中沈積一第二材料 。According to other aspects of the present disclosure, a method for processing a plurality of substrates by depositing a plurality of different material layers is proposed. This method includes a method for processing several masks as described herein. The method further includes transmitting a first mask of the masks in a first cassette to a first coating chamber, and preferably transmitting one of the masks in the first cassette at the same time point. The second mask is connected to a second coating chamber. The method further includes depositing a first material in the first coating chamber by using the first mask, and depositing a second material in the second coating chamber by using the second mask.
根據本揭露之一方面,提出一種用以塗佈數個基板之設備。設備包括數個塗佈腔室,各包括數個遮罩槽;以及一第一匣,包括數個遮罩槽。第一匣裝配以供應數個遮罩至此些塗佈腔室之一預定次組合。第一匣之數個遮罩槽之數量係大於或小於此些塗佈腔室之預定次組合之數個遮罩槽之數量。According to one aspect of the present disclosure, a device for coating a plurality of substrates is proposed. The apparatus includes a plurality of coating chambers each including a plurality of masking grooves; and a first cassette including a plurality of masking grooves. The first cassette is assembled to supply a number of masks to a predetermined number of combinations of one of these coating chambers. The number of masking slots in the first box is greater than or less than the number of masking slots in a predetermined combination of the coating chambers.
本揭露之其他方面、優點及特徵係透過說明及所附之圖式更為清楚。為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:Other aspects, advantages, and features of this disclosure will become clearer through the description and accompanying drawings. In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:
詳細的參照將以數種實施例達成,數種實施例的一或多個例子係繪示於圖式中。各例子係藉由說明的方式提供且不意味為一限制。舉例來說,所說明或敘述而做為一實施例之部份之特徵可用於任何其他實施例或與任何其他實施例結合,以取得再其他實施例。此意指本說明包括此些調整及變化。Detailed reference will be made in several embodiments, one or more examples of which are shown in the drawings. The examples are provided by way of illustration and are not meant to be limiting. For example, features illustrated or described as part of one embodiment may be used in or combined with any other embodiment to obtain yet other embodiments. This means that this description includes such adjustments and changes.
在下方圖式之說明中,相同參考編號係意指相同或類似的元件。一般來說,僅有有關於個別實施例之相異處係進行說明。除非另有說明,一實施例中之一部份或方面之說明係亦應用於另一實施例中之對應部份或方面。In the description of the drawings below, the same reference numerals refer to the same or similar elements. Generally, only the differences between the individual embodiments are described. Unless stated otherwise, the description of one part or aspect in one embodiment is also applied to the corresponding part or aspect in another embodiment.
第1圖繪示用以塗佈基板之設備100的佈局示意圖,用以塗佈基板之設備100係裝配以根據此處所述之方法操作。Figure 1 shows a schematic layout of a device 100 for coating a substrate. The device 100 for coating a substrate is assembled to operate according to the method described herein.
用以塗佈基板之設備100可包括一或多個過渡模組,舉例為第1圖中所範例性繪示之六個過渡模組。其中,第一過渡模組T1、第二過渡模組T2、第三過渡模組T3、第四過渡模組T4、第五過渡模組T5、及第六過渡模組T6係繪示。用以塗佈基板之設備可更包括一或多個旋轉模組,舉例為第1圖中範例性所示之六個旋轉模組。其中,第一旋轉模組R1、第二旋轉模組R2、第三旋轉模組R3、第四旋轉模組R4、第五旋轉模組R5及第六旋轉模組R6係繪示。The apparatus 100 for coating a substrate may include one or more transition modules, for example, the six transition modules shown by way of example in FIG. 1. Among them, the first transition module T1, the second transition module T2, the third transition module T3, the fourth transition module T4, the fifth transition module T5, and the sixth transition module T6 are shown. The device for coating the substrate may further include one or more rotating modules, for example, the six rotating modules shown in FIG. 1 as an example. The first rotation module R1, the second rotation module R2, the third rotation module R3, the fourth rotation module R4, the fifth rotation module R5, and the sixth rotation module R6 are shown.
此一或多個過渡模組及/或此一或多個旋轉模組可沿著主傳送方向Z配置。其他過渡模組及/或其他旋轉模組可藉由交替配置來沿著主傳送路徑設置。特別是,此一或多個過渡模組、第一旋轉模組R1及選擇之其他旋轉模組可沿著一方向配置成本質上線性設置,此方向可為用以塗佈基板之設備100的主傳送方向Z。The one or more transition modules and / or the one or more rotation modules may be arranged along the main transmission direction Z. Other transition modules and / or other rotation modules can be arranged along the main transmission path by alternate configurations. In particular, the one or more transition modules, the first rotation module R1, and other selected rotation modules can be arranged along a direction and be linearly arranged in quality. This direction can be used by the device 100 for coating a substrate Main transmission direction Z.
於一些實施例中,三個、四個、五個、六個或更多個旋轉模組係沿著主傳送方向Z配置。二或多個塗佈腔室可相鄰於各旋轉模組配置,舉例為傳送路徑51及52之第一側邊上及第二側邊上。旋轉模組可裝配,以用於從傳送路徑依循路徑傳送基板及/或遮罩至二或多個塗佈腔室中,此二或多個塗佈腔室可配置於旋轉模組之側邊上。In some embodiments, three, four, five, six or more rotating modules are arranged along the main transmission direction Z. Two or more coating chambers may be arranged adjacent to each of the rotating modules, for example, on the first side and the second side of the conveying paths 51 and 52. The rotary module can be assembled for transferring the substrate and / or the mask from the transfer path to the two or more coating chambers. The two or more coating chambers can be arranged on the side of the rotary module. on.
使用於塗佈製程之遮罩可沿著傳送路徑51及52傳送,舉例為從第一過渡模組T1在第二過渡模組T2等之方向中經由第一旋轉模組R1傳送。此外,將塗佈之基板可沿著傳送路徑51及52傳送。The mask used in the coating process can be transferred along the transfer paths 51 and 52, for example, from the first transition module T1 in the direction of the second transition module T2, etc., via the first rotation module R1. In addition, the coated substrate can be transferred along the transfer paths 51 and 52.
第一裝載腔室可舉例為配置在第一過渡模組T1之上游,舉例為在主傳送路徑之第一端上。第一裝載腔室用以裝載將塗佈之基板至用以塗佈基板之設備中。或者,第一裝載腔室可直接地配置於第一旋轉模組之上游。第一裝載腔室可使用於裝載新基板。第一裝載腔室可替代地或額外地用於裝載新遮罩至用以塗佈基板之設備中。一或多個匣可替代地或額外地設置有裝載腔室,而允許直接地裝載遮罩至此一或多個匣中,及直接地從此一或多個匣卸載遮罩。The first loading chamber may be configured upstream of the first transition module T1, for example, on the first end of the main transfer path. The first loading chamber is used to load the coated substrate into a device for coating the substrate. Alternatively, the first loading chamber may be directly disposed upstream of the first rotation module. The first loading chamber can be used for loading a new substrate. The first loading chamber may alternatively or additionally be used to load a new mask into a device for coating a substrate. One or more cassettes may alternatively or additionally be provided with a loading chamber, allowing the masks to be loaded directly into and unloaded from the one or more cassettes.
第二裝載腔室可設置,用以從用以塗佈基板的設備卸載已塗佈基板。在基板僅於一方向中傳送及處理之實施例中,第二裝載腔室可位在有關於主傳送路徑中之最後的旋轉或過渡模組之下游,舉例為第六旋轉模組或第六過渡模組之下游。A second loading chamber may be provided to unload the coated substrate from the equipment for coating the substrate. In an embodiment in which the substrate is transferred and processed in only one direction, the second loading chamber may be located downstream of the last rotation or transition module in the main transfer path, for example a sixth rotation module or a sixth Downstream of the transition module.
於一些實施例中,可設置回送軌道(舉例為第2圖中之第二載體軌道32),用以在相反於主傳送方向Z之方向中回送已使用遮罩、已塗佈基板及/或空的載體。因此,第一裝載腔室可裝配以用於基板之裝載及卸載兩者。為了圖式之簡潔性,圖式中係沒有繪示裝載腔室。In some embodiments, a return track (for example, the second carrier track 32 in FIG. 2) may be provided to return the used mask, the coated substrate, and / or the direction opposite to the main conveying direction Z. Empty vector. Therefore, the first loading chamber can be assembled for both loading and unloading of substrates. For simplicity of the drawing, the loading chamber is not shown in the drawing.
過渡模組可理解為位於此至少兩個其他真空模組或真空腔室之間的一真空模組或真空腔室,舉例為位於兩個旋轉模組之間的一真空模組或真空腔室。載體舉例為遮罩載體及/或基板載體,可在過渡模組之長度方向中傳送通過過渡模組。過渡模組之長度方向可對應於真空處理系統之傳送路徑的定向。如此處所使用,如果遮罩或基板係說明為進行傳送,此應通常理解為運載遮罩或基板之載體係分別移動。The transition module can be understood as a vacuum module or vacuum chamber located between the at least two other vacuum modules or vacuum chambers, for example, a vacuum module or vacuum chamber located between two rotating modules . Examples of the carrier are a mask carrier and / or a substrate carrier, which can be transmitted through the transition module in the length direction of the transition module. The length direction of the transition module may correspond to the orientation of the conveying path of the vacuum processing system. As used herein, if the mask or substrate is described as being transported, this should generally be understood as the carrier carrying the mask or substrate moving separately.
於一些實施例中,用以導引載體通過過渡模組之二或多個軌道可設置於過渡模組及/或旋轉模組中。舉例來說,用以傳送基板載體之兩個基板載體軌道及用以傳送遮罩載體之兩個遮罩載體軌道可延伸通過過渡模組。於一些實施例中,一或多個載體可短暫地停止或「停放(parked)」於過渡模組中,直到此一或多個載體沿著主傳送路徑傳送通過相鄰之旋轉模組可繼續。遮罩在過渡模組中之停止或停放係增加遮罩之脫附時間,及本揭露之方法係在分類遮罩成個別之群集群組時,可將在停放狀況中的脫附時間列入考慮。In some embodiments, two or more tracks for guiding the carrier through the transition module may be provided in the transition module and / or the rotation module. For example, two substrate carrier tracks for transferring a substrate carrier and two mask carrier tracks for transferring a mask carrier may extend through the transition module. In some embodiments, one or more carriers may be temporarily stopped or “parked” in the transition module until the one or more carriers are transmitted along the main transport path through the adjacent rotation module and may continue . The stopping or parking of the mask in the transition module increases the desorption time of the mask, and the method of this disclosure is that when the mask is classified into individual cluster groups, the desorption time in the parking situation can be included consider.
旋轉模組(此處亦意指為「依循路徑傳送模組(routing module)」或「依循路徑傳送腔室(routing chamber)」可理解為裝配以用於改變一或多個載體之定向的真空腔室。特別是,此一或多個載體之傳送方向可藉由旋轉位於旋轉模組中之軌道上的一或多個載體來改變。舉例來說,旋轉模組可包括旋轉裝置。旋轉裝置係裝配以用於旋轉軌道。軌道係裝配以用於繞著旋轉軸支撐載體。於一些實施例中,旋轉模組包括至少兩個軌道(第1圖中之傳送路徑51及傳送路徑52),此至少兩個軌道可繞著旋轉軸旋轉。傳送路徑51可配置於旋轉軸之第一側邊上,特別是第一遮罩載體軌道可配置於旋轉軸之第一側邊上,及傳送路徑52可配置於旋轉軸之第二側邊上,特別是第二遮罩載體軌道可配置於旋轉軸之第二側邊上。在過渡模組及/或旋轉模組中之兩個軌道的數量係有利地與塗佈腔室交互作用,塗佈腔室根據本揭露係通常亦具有兩個軌道。Rotary module (also referred to herein as a `` routing module '' or `` routing chamber '' can be understood as a vacuum assembled to change the orientation of one or more carriers Chamber. In particular, the transport direction of the one or more carriers can be changed by rotating one or more carriers located on a track in the rotation module. For example, the rotation module may include a rotation device. A rotation device Is mounted for a rotating track. The track is mounted for supporting a carrier around a rotation axis. In some embodiments, the rotation module includes at least two tracks (transmission path 51 and transmission path 52 in FIG. 1), These at least two tracks can rotate around the rotation axis. The transfer path 51 can be arranged on the first side of the rotation axis, in particular the first mask carrier track can be arranged on the first side of the rotation axis, and the transfer path 52 can be arranged on the second side of the rotation axis, in particular the second mask carrier track can be arranged on the second side of the rotation axis. The number of two tracks in the transition module and / or the rotation module Favorably interacts with the coating chamber Function, the coating chamber usually also has two tracks according to the present disclosure.
根據數個實施例,旋轉模組係裝配以用於遮罩處理及/或基板處理。於一些實施例中,旋轉模組包括四個軌道,特別是 可繞著旋轉軸旋轉之兩個遮罩載體軌道及兩個基板載體軌道。為了圖式之簡潔性,只有遮罩軌道係繪示於圖式中。According to several embodiments, the rotation module is assembled for mask processing and / or substrate processing. In some embodiments, the rotation module includes four tracks, in particular two mask carrier tracks and two substrate carrier tracks that can be rotated about a rotation axis. For the sake of simplicity, only the mask track is shown in the diagram.
當旋轉模組旋轉x°的角度,且x°的角度舉例為90°時,配置於軌道上之一或多個載體的傳送方向可改變x°之角度,且x°的角度舉例為90°。如圖式中所示,轉動遮罩載體90°一般係提供遮罩之供給至對應的塗佈腔室。舉例來說,亦如同第1圖之範例性設計中所示,旋轉模組係裝配以旋轉遮罩及/或基板,使得遮罩及/或基板可供給至聯接之塗佈腔室。When the rotation module rotates by an angle of x ° and the angle of x ° is 90 °, the conveyance direction of one or more carriers arranged on the track can change the angle of x °, and the angle of x ° is 90 ° . As shown in the figure, rotating the mask carrier 90 ° generally provides the supply of the mask to the corresponding coating chamber. For example, as shown in the exemplary design of FIG. 1, the rotating module is assembled to rotate the mask and / or the substrate, so that the mask and / or the substrate can be supplied to the coupled coating chamber.
根據此處所述實施例之用以塗佈基板之設備可更包括載體傳送系統,載體傳送系統一般係裝配以用於沿著主傳送方向Z傳送載體,及選擇地在相反方向中傳送載體。相反方向於此可意指為「回送方向」。載體傳送系統可包括支承系統及驅動系統。支承系統舉例為磁性懸浮系統,用以升舉及支承載體。驅動系統用以沿著軌道移動載體,軌道係沿著載體傳送路徑。The apparatus for coating a substrate according to the embodiments described herein may further include a carrier transfer system. The carrier transfer system is generally assembled for transferring the carrier along the main transfer direction Z, and selectively transferring the carrier in the opposite direction. The opposite direction may be referred to herein as the "loopback direction". The carrier transfer system may include a support system and a drive system. An example of a supporting system is a magnetic levitation system for lifting and supporting a carrier. The driving system is used to move the carrier along the track, and the track is along the carrier conveying path.
如此處所使用之名稱「載體」可特別是意指「遮罩載體」,裝配以在傳送期間支承遮罩,特別是在匣及塗佈腔室之間的傳送期間,及反之亦然。特別是,如此處所述,遮罩可在非水平定向中支承於載體,特別是在本質上垂直定向中支承於載體。於本揭露之數個實施例中所使用的垂直定向係特別有利的,因為遮罩之傳送活動可大於已知方法中之遮罩的傳送活動時,將更詳細說明於下方。The term "carrier" as used herein may particularly mean a "mask carrier", assembled to support a mask during transfer, particularly during transfer between a cassette and a coating chamber, and vice versa. In particular, as described herein, the mask may be supported on the carrier in a non-horizontal orientation, and in particular in a substantially vertical orientation. The vertical orientation used in the several embodiments of the present disclosure is particularly advantageous, because the transfer activity of the mask can be greater than the transfer activity of the mask in the known method, which will be described in more detail below.
載體可包括具有支承表面的載體主體,裝配以特別是在非水平定向中,更特別是在本質上垂直定向中支承基板或遮罩。於一些實施例中,載體主體可包括導引部,裝配以沿著載體傳送路徑導引。舉例來說,載體可舉例為藉由磁性懸浮系統由支承裝置支承,及載體可舉例為沿著遮罩載體軌道或沿著基板載體軌道由驅動裝置移動,驅動裝置例如是由一系列之線性馬達。The carrier may include a carrier body having a support surface, assembled to support a substrate or mask, particularly in a non-horizontal orientation, and more particularly in a substantially vertical orientation. In some embodiments, the carrier body may include a guide portion that is assembled to guide along the carrier transfer path. For example, the carrier may be supported by a supporting device by a magnetic suspension system, and the carrier may be moved by a driving device along a shield carrier track or a substrate carrier track, for example, a series of linear motors .
如此處所使用之「傳送」、「移動」、「依循路線傳送」或「旋轉」基板或遮罩可意指為支承基板或遮罩於載體之支承部份的載體之個別運動,特別是在非水平定向中,更特別是在本質上垂直定向中。As used herein, "transporting", "moving", "following a route" or "rotating" a substrate or mask can mean individual movements of a carrier that is a support substrate or masked on a support portion of a carrier, especially in In horizontal orientation, and more particularly in essentially vertical orientation.
如此處所使用之「本質上垂直定向」可理解為從垂直定向具有10°或更少,特別是5°或更少之偏差的定向。垂直定向也就是重力向量。舉例來說,基板(或遮罩)之主表面及重力向量之間的角度可為+10°及-10°之間,特別是0°及-5之間。於一些實施例中,基板(或遮罩)之定向可在傳送期間及/或沈積期間不為準確垂直,但相對於垂直軸略微地傾斜,舉例為傾斜0°及-5°之間的傾斜角,特別是傾斜-1°及-5°之間的傾斜角。負角度意指基板或遮罩之一定向,其中基板或遮罩係向下傾斜。在沈積期間從重力向量之基板定向的偏差可為有利的且可產生更穩定的沈積製程,或在沈積期間面向下之定向可適用於減少基板上的粒子。然而,在傳送期間及/或沈積期間之準確垂直定向(+/-1°)亦為可行的。As used herein, "substantially vertical orientation" can be understood as an orientation with a deviation of 10 ° or less, especially 5 ° or less, from the vertical orientation. Vertical orientation is also the gravity vector. For example, the angle between the main surface of the substrate (or the mask) and the gravity vector may be between + 10 ° and -10 °, especially between 0 ° and -5. In some embodiments, the orientation of the substrate (or mask) may not be exactly vertical during transfer and / or deposition, but may be slightly tilted relative to the vertical axis, for example tilts between 0 ° and -5 ° Angle, especially a tilt angle between -1 ° and -5 °. Negative angle means the orientation of one of the substrate or the mask, where the substrate or the mask is tilted downward. Deviations in the orientation of the substrate from the gravity vector during deposition can be advantageous and can result in a more stable deposition process, or orientation facing down during deposition can be used to reduce particles on the substrate. However, accurate vertical orientation (+/- 1 °) is also possible during transfer and / or during deposition.
於一些實施例中,在傳送期間及/或沈積期間,重力向量及基板(或遮罩)之間的較大之角度係可行的。0°及+/-80°之間的角度可理解為此處所使用之「遮罩的非水平定向」。於非水平定向中傳送遮罩可節省空間及允許較小之真空腔室。再者,在傳送期間,基板或遮罩之水平定向可為可行的。In some embodiments, a larger angle between the gravity vector and the substrate (or mask) is possible during transfer and / or deposition. The angle between 0 ° and +/- 80 ° can be understood as the "non-horizontal orientation of the mask" as used herein. Transmitting the mask in a non-horizontal orientation saves space and allows smaller vacuum chambers. Moreover, during the transfer, horizontal orientation of the substrate or mask may be feasible.
如此處所述,用以塗佈基板之設備可包括遮罩傳送系統,遮罩傳送系統用以從匣傳送遮罩至塗佈腔室,及反之亦然。如此處所述之遮罩傳送系統一般係裝配,其中各塗佈腔室可從各匣供應新遮罩。遮罩傳送系統可包括磁性懸浮系統,磁性懸浮系統有利地避免因典型軸承之滾軸及摩擦效應而產生粒子於真空中。如此處所使用,名稱「新遮罩」及「未使用遮罩」等意指還沒有在塗佈腔室中經歷塗佈製程的遮罩。相較於其,名稱「已塗佈遮罩」或「已使用遮罩」等意指已經經歷塗佈腔室中之塗佈製程的遮罩。As described herein, the apparatus for coating a substrate may include a mask transfer system for transferring a mask from a cassette to a coating chamber, and vice versa. A mask delivery system as described herein is generally assembled in which each coating chamber can supply a new mask from each cassette. The mask transfer system may include a magnetic levitation system, which advantageously avoids the generation of particles in a vacuum due to the rollers and friction effects of typical bearings. As used herein, the names "new mask" and "unused mask" mean masks that have not yet undergone a coating process in a coating chamber. In contrast, the names "coated mask" or "used mask" mean a mask that has undergone a coating process in a coating chamber.
於匣中,遮罩一般儲存於遮罩槽中。名稱「儲存」可亦理解為此處所述之「暫存(buffer)」。本實施例之匣可具有一些遮罩槽來儲存新遮罩,一些遮罩槽舉例為至少四個遮罩槽,及特別是至少六個遮罩槽。匣可額外地提供而用於已使用遮罩的儲存。也就是說,當遮罩已經經歷塗佈製程且必須由新遮罩替換時,已使用遮罩可先傳送到匣。一旦匣係排氣,已使用遮罩可接著卸載。然而,如此處所使用,匣之名稱「遮罩槽」一般意指為用於匣中之新遮罩的槽。此處所使用之匣可包括裝載腔室。匣可包括一或多個遮罩處理組件,舉例為機器人裝置,用以貼附及/或從遮罩載體拆開遮罩。In the box, the mask is generally stored in a mask slot. The name "storage" can also be understood as "buffer" as described herein. The cassette of this embodiment may have some mask slots to store new masks. Some mask slots are, for example, at least four mask slots, and in particular at least six mask slots. Cassettes can be additionally provided for storage of used masks. That is, when the mask has undergone the coating process and must be replaced with a new mask, the used mask can be transferred to the cassette first. Once the cassette is vented, the used mask can then be unloaded. However, as used herein, the name of the box "mask slot" generally means a slot for a new mask in the box. A cassette as used herein may include a loading chamber. The cassette may include one or more mask processing components, such as a robotic device, for attaching and / or detaching the mask from the mask carrier.
針對於塗佈腔室中之沈積製程且塗佈腔室例如是第1圖之塗佈腔室D1至D9來說,遮罩11一般係位於基板12及沈積源35之間。塗佈腔室中之遮罩的位置應亦意指為此處之塗佈腔室的遮罩槽。為了圖式之簡潔性,遮罩11及基板12之參考編號在第1圖中之各塗佈腔室D1至D9係不重複。For the deposition process in the coating chamber and the coating chambers are, for example, the coating chambers D1 to D9 in FIG. 1, the mask 11 is generally located between the substrate 12 and the deposition source 35. The position of the mask in the coating chamber shall also mean the mask groove of the coating chamber here. For simplicity of the drawings, the reference numbers of the mask 11 and the substrate 12 in the coating chambers D1 to D9 in FIG. 1 are not repeated.
於數個實施例中,裝配而用於供應遮罩至個別塗佈腔室的匣之遮罩槽的數量係小於個別塗佈腔室中之遮罩槽的數量。也就是說,本實施例係提供遮罩組織,允許比所供應的塗佈腔室中所需之遮罩還要少的匣中之遮罩槽。In several embodiments, the number of the mask grooves of the cassette assembled for supplying the mask to the individual coating chamber is smaller than the number of the mask grooves in the individual coating chamber. That is, the present embodiment is to provide a masking tissue, allowing a masking slot in a cassette to be smaller than a masking required in the supplied coating chamber.
如第1圖中範例性所示,用於塗佈基板之設備100包括塗佈腔室D1,用以沈積第一材料。塗佈腔室D1係相鄰於第一旋轉模組R1範例性配置,而位於主傳送方向Z之第一側邊上。設備更包括塗佈腔室D2,用以沈積第二材料。塗佈腔室D2相鄰於第一旋轉模組R1範例性配置,而位於主傳送方向Z之第二側邊上,第二側邊相反於第一側邊。再者,用以塗佈基板之設備100更包括塗佈腔室D3,用以沈積第三材料。塗佈腔室D3係相鄰於主傳送路徑之第二旋轉模組R2範例性配置。As exemplarily shown in FIG. 1, the apparatus 100 for coating a substrate includes a coating chamber D1 for depositing a first material. The coating chamber D1 is an exemplary configuration adjacent to the first rotary module R1 and is located on the first side of the main conveying direction Z. The apparatus further includes a coating chamber D2 for depositing a second material. The coating chamber D2 is adjacent to the first rotary module R1 in the exemplary configuration, and is located on the second side of the main conveying direction Z, and the second side is opposite to the first side. Furthermore, the apparatus 100 for coating a substrate further includes a coating chamber D3 for depositing a third material. The coating chamber D3 is an exemplary configuration of the second rotation module R2 adjacent to the main transfer path.
如第1圖中所示,匣M1係繪示在相反於塗佈腔室D3之位置。此處所理解之「匣」係意指為用以儲存遮罩之腔室。特別是,匣可使用以支承可使用之新遮罩,其中匣一般係額外地裝配以允許脫附儲存之遮罩。此處所理解之匣可提供而具有與真空系統之連接,真空系統提供匣中之真空。As shown in the first figure, the cassette M1 is shown in a position opposite to the coating chamber D3. As used herein, a "box" means a chamber used to store a mask. In particular, the cassettes can be used to support new masks that can be used, where the cassettes are generally additionally fitted to allow desorption of the masks for storage. The cassette as understood herein can be provided with a connection to a vacuum system which provides the vacuum in the cassette.
如第1圖中所示,可設置數個匣及數個沈積腔室。根據本實施例之一方面,相較於本技術領域中之塗佈腔室,匣之數量與塗佈腔室之數量的比可減少且將更詳細說明於下。As shown in Figure 1, several cassettes and several deposition chambers can be provided. According to one aspect of this embodiment, compared with the number of coating chambers in the art, the ratio of the number of cassettes to the number of coating chambers can be reduced and will be described in more detail below.
回到第1圖中所示之特定及範例設置,繪示以n=2,…,6之其他過渡模組Tn及旋轉模組Rn,以及以i=4,…,9之其他塗佈腔室Di。第1圖之實施例包括三個遮罩匣,也就是匣M1、M2、及M3。Returning to the specific and example settings shown in Figure 1, other transition modules Tn and rotation modules Rn with n = 2, ..., 6 and other coating chambers with i = 4, ..., 9 are shown. Room Di. The embodiment of FIG. 1 includes three mask boxes, that is, boxes M1, M2, and M3.
將理解的是,第1圖僅可繪示出根據此處所述數個實施例之用以塗佈基板之設備的一部份。其他旋轉模組、其他塗佈腔室、其他過渡模組、及/或其他匣可設置。於一些實施例中,用以塗佈基板之設備100可裝配以用於沈積層堆疊於基板上,層堆疊可包括舉例為五、六或更多接續沈積之層,舉例為10層或更多層或15層或更多層。於其他實施例中,用以塗佈基板之設備可具有少於第1圖中所示之塗佈腔室、過渡模組、旋轉模組及/或匣。It will be understood that FIG. 1 can only depict a portion of an apparatus for coating a substrate according to several embodiments described herein. Other rotating modules, other coating chambers, other transition modules, and / or other cassettes can be provided. In some embodiments, the apparatus 100 for coating a substrate may be assembled for depositing a layer stack on the substrate. The layer stack may include, for example, five, six, or more successively deposited layers, for example, 10 or more layers. Layers or 15 or more layers. In other embodiments, the device for coating the substrate may have fewer coating chambers, transition modules, rotating modules, and / or cassettes than those shown in FIG. 1.
此處所使用之「塗佈腔室」可理解為用以塗佈基板之設備的區段或腔室,其中材料可舉例為藉由蒸發之方式沈積於一或多個基板上。根據此處所述實施例所應用之塗佈腔室一般係裝配,以用於遮蔽沈積於基板上之材料。名稱「沈積」及「塗佈」係以可交換之方式於此使用。As used herein, a "coating chamber" can be understood as a section or chamber of a device used to coat substrates, where materials can be deposited on one or more substrates by evaporation, for example. The coating chamber applied according to the embodiments described herein is generally assembled for shielding material deposited on a substrate. The names "deposition" and "coating" are used herein interchangeably.
在此處所述之實施例之應用中,可沈積不同材料。第一材料可為像素陣列之第一顏色材料,舉例為藍色材料,及/或第二材料可為像素陣列之第二顏色材料,舉例為紅色材料。舉例為綠色材料之像素陣列的第三顏色材料可已經預先沈積或將接續地沈積。特別是,其他材料可在相同真空處理腔室中比第一及第二材料先沈積於基板上或接續第一及第二材料沈積於基板上。至少一些材料可為有機材料,舉例為第一材料及第二材料可為有機材料。至少一材料可為金屬。舉例來說,下述金屬之一或多者可於一些塗佈腔室中進行沈積:鋁(Al)、金(Au)、銀(Ag)、銅(Cu)。至少一材料可為透明導電氧化物材料,舉例為氧化銦錫(ITO)。至少一材料可為透明材料。In the application of the embodiments described herein, different materials can be deposited. The first material may be a first color material of the pixel array, such as a blue material, and / or the second material may be a second color material of the pixel array, such as a red material. A third color material, such as a pixel array of green material, may have been previously deposited or will be deposited successively. In particular, other materials may be deposited on the substrate before or after the first and second materials in the same vacuum processing chamber. At least some materials may be organic materials, for example, the first material and the second material may be organic materials. At least one material may be a metal. For example, one or more of the following metals may be deposited in some coating chambers: aluminum (Al), gold (Au), silver (Ag), copper (Cu). At least one material may be a transparent conductive oxide material, such as indium tin oxide (ITO). At least one material may be a transparent material.
一或多個沈積源35(「蒸發器」)可配置於各塗佈腔室中。此一或多個沈積源35舉例為一或多個蒸汽源,裝配以用於導引已蒸發材料朝向一或多個基板。沈積源可沿著源傳送軌道為可移動的,源傳送軌道可設置於塗佈腔室中。此一或多個沈積源35可在導引已蒸發材料朝向此一或多個基板時沿著源傳送軌道線性移動。在沈積期間,遮罩一般配置於基板之前方的固定位置處。One or more deposition sources 35 ("evaporators") may be disposed in each coating chamber. The one or more deposition sources 35 are exemplified by one or more steam sources, which are assembled for guiding the evaporated material toward one or more substrates. The deposition source may be movable along the source transfer track, and the source transfer track may be disposed in the coating chamber. The one or more deposition sources 35 may move linearly along the source transfer track as the evaporated material is directed toward the one or more substrates. During the deposition period, the mask is generally arranged at a fixed position in front of the substrate.
於一些實施例中,塗佈腔室可包括兩個沈積區域,也就是第一沈積區域36及第二沈積區域37。第一沈積區域36用以配置第一基板和第一遮罩,第二沈積區域37用以配置第二基板及第二遮罩。第一沈積區域36可配置在塗佈腔室中而相反於第二沈積區域37。沈積源35可裝配,以接續地導引已蒸發材料朝向配置於第一沈積區域36中的第一基板及朝向配置於第二沈積區域37中的第二基板。舉例來說,沈積源之蒸發方向舉例為藉由旋轉至少一部份之沈積源35可為可反向的,舉例為旋轉180°之角度。In some embodiments, the coating chamber may include two deposition regions, that is, a first deposition region 36 and a second deposition region 37. The first deposition region 36 is used to configure the first substrate and the first mask, and the second deposition region 37 is used to configure the second substrate and the second mask. The first deposition region 36 may be disposed in the coating chamber instead of the second deposition region 37. The deposition source 35 can be assembled to successively guide the evaporated material toward the first substrate disposed in the first deposition region 36 and toward the second substrate disposed in the second deposition region 37. For example, the evaporation direction of the deposition source may be reversible by rotating at least a part of the deposition source 35, for example, by an angle of 180 °.
在沈積配置在塗佈腔室之第一沈積區域36中的第一基板上之期間,第二沈積區域37可使用於下述之至少一或多者:移動將塗佈之第二基板至第二沈積區域中;移動已塗佈之第二基板離開第二沈積區域;在第二沈積區域中舉例為相對於設置在第二沈積區中的遮罩對齊第二基板;以及利用新遮罩替換已使用遮罩。因此,藉由提供兩個沈積區域(舉例為第一沈積區域36及第二沈積區域37)於塗佈腔室中,在給定時段中所塗佈之基板12的數量可增加。再者,沈積源之閒置時間(idle time)可減少,舉例來說,因為沈積源可在將塗佈之基板12相對於遮罩11對準期間不位於閒置位置,但可使用於沈積另一個基板12。During the deposition on the first substrate in the first deposition region 36 of the coating chamber, the second deposition region 37 may be used for at least one or more of the following: moving the second substrate to be coated to the first In the second deposition area; moving the coated second substrate away from the second deposition area; in the second deposition area, for example, aligning the second substrate with respect to a mask provided in the second deposition area; and replacing with a new mask Mask used. Therefore, by providing two deposition regions (for example, a first deposition region 36 and a second deposition region 37) in the coating chamber, the number of substrates 12 coated in a given period of time can be increased. Furthermore, the idle time of the deposition source can be reduced, for example, because the deposition source can not be in an idle position during the alignment of the coated substrate 12 relative to the mask 11, but can be used to deposit another Substrate 12.
在沈積各材料之後,基板12可移動回到主傳送路徑中,以分別經由一或多個過渡模組及旋轉模組導引至接續的塗佈腔室中。此係以基板12在過渡模組T1中來範例性說明。根據預定之處理,基板上的預期層厚可本質上不同。舉例來說,可能需要1 nm及100 nm之層厚。沈積層之所需厚度本質上影響各塗佈腔室中之沈積時間。舉例來說,舉例為少於五秒的沈積時間可使用於沈積一些奈米之薄層,至少一分鐘的沈積時間可用於沈積較厚之層。After depositing each material, the substrate 12 can be moved back into the main conveying path to be guided into the successive coating chambers via one or more transition modules and rotary modules, respectively. This is exemplified by the substrate 12 in the transition module T1. The expected layer thickness on the substrate may be substantially different depending on the predetermined processing. For example, layer thicknesses of 1 nm and 100 nm may be required. The required thickness of the deposited layer essentially affects the deposition time in each coating chamber. For example, a deposition time of less than five seconds can be used to deposit thin layers of some nanometers, and a deposition time of at least one minute can be used to deposit thicker layers.
類似地,第1圖範例性繪示遮罩11之傳送,如在第二過渡模組T2、第四過渡模組T4及第六過渡模組T6中之遮罩11所示。其他遮罩11係範例性繪示成目前在第二旋轉模組R2及第三旋轉模組R3中傳送。遮罩11及基板12可在相同軌道上或不同軌道上移動。Similarly, FIG. 1 exemplarily illustrates the transmission of the mask 11 as shown by the mask 11 in the second transition module T2, the fourth transition module T4, and the sixth transition module T6. The other masks 11 are exemplarily shown as being transmitted in the second rotation module R2 and the third rotation module R3. The mask 11 and the substrate 12 can be moved on the same track or on different tracks.
遮罩可包括形成圖案的數個開孔,且裝配以藉由遮蔽沈積製程來形成對應之材料圖案於基板上。在沈積期間,遮罩可配置於基板之前方的近距離處,或直接接觸基板的前表面。作為一個準則而言,基板上需要較厚層之處在沈積製程期間所使用的遮罩亦比沈積較薄層期間進行更多的塗佈。由於遮罩之開孔越來越小且最終阻塞,在遮罩上的材料沈積係明顯地導致遮罩的品質惡化。開孔的尺寸已經減少太多之遮罩可能不再使用於沈積製程且需由新遮罩替換。遮罩之名稱「塗佈應用時間」可理解為遮罩裝配以進行個別塗佈製程直到遮罩需要替換之時間,因為否則塗佈品質會變得不可接受。名稱「塗佈應用時間」有時亦意指為相對於特定塗佈製程之遮罩的壽命。遮罩之塗佈應用時間可因而決定於遮罩的結構(例如是為精密線金屬遮罩(fine line metal mask)等)。塗佈應用時間可更決定於遮罩所預定使用於其中的特定製程。The mask may include a plurality of openings forming a pattern, and is assembled to form a corresponding material pattern on the substrate by a mask deposition process. During the deposition, the mask can be placed at a short distance in front of the substrate or directly contact the front surface of the substrate. As a guideline, where thicker layers are needed on the substrate, the mask used during the deposition process is also coated more than during the deposition of the thinner layer. As the openings of the mask become smaller and eventually blocked, the material deposition on the mask obviously causes the quality of the mask to deteriorate. Masks whose openings have been reduced in size too much may no longer be used in the deposition process and need to be replaced with new masks. The name of the mask "coating application time" can be understood as the time that the mask is assembled for the individual coating process until the mask needs to be replaced, because otherwise the coating quality will become unacceptable. The name "coating application time" sometimes also means the life of the mask relative to a particular coating process. The application time of the mask can be determined by the structure of the mask (for example, it is a fine line metal mask, etc.). The application time of the coating may further depend on the specific process in which the mask is intended to be used.
舉例來說,遮罩可為具有數個開孔之精密金屬遮罩(fine metal mask,FMM),舉例為100,000個開孔或更多個開孔。舉例來說,有機像素之圖案可利用此種遮罩沈積於基板上。此種形式的遮罩可僅使用於一些沈積,直到遮罩需利用新遮罩替換。一般來說,FMM之塗佈應用時間可能少於10個沈積。有鑑於時間,FMM之塗佈應用時間可能少於120 min,或甚至少於100 min或更少。For example, the mask may be a fine metal mask (FMM) with several openings, for example, 100,000 openings or more. For example, patterns of organic pixels can be deposited on a substrate using such a mask. This form of mask can only be used for some deposits until the mask needs to be replaced with a new mask. In general, the coating application time of FMM may be less than 10 deposits. In view of time, the coating application time of FMM may be less than 120 minutes, or even less than 100 minutes or less.
根據此處所述數個實施例之其他形式的遮罩可應用於沈積製程中,其他形式的遮罩舉例為邊緣排除遮罩(edge exclusion masks,EEM)。EEM可不設置有具有數個開孔之格子。取而代之,EEM可理解為裝配以僅遮蔽基板之邊緣的遮罩。也就是說,EEM可僅具有一個開孔,此開孔對應於基板上之塗佈區域。雖然EEM之開孔不因開孔之尺寸阻塞,EEM之邊緣區域在高數量的塗佈後變得不精準。然而,相較於FMM,EEM可能經歷本質上更多的沈積,直到遮罩需要由新遮罩進行替換。舉例來說,EEM一般可具有至少500 min或至甚至至少800 min之塗佈應用時間。於數個實施例中,一個匣可僅填充有數個EEMs,及另一個匣可僅填充有數個FMMs。甚至更特別的是,於本揭露之一些實施例中,沒有匣係填充FMMs及EEMs兩者,且沒有匣係預定填充FMMs及EEMs兩者。取而代之,於此些實施例中,全部之匣係填充有FMMs或EEMs。Other types of masks according to the embodiments described herein can be used in the deposition process. Examples of other types of masks are edge exclusion masks (EEM). The EEM may not be provided with a grid having several openings. Instead, EEM can be understood as a mask assembled to cover only the edges of the substrate. That is, the EEM may have only one opening, and this opening corresponds to a coating area on the substrate. Although the openings of the EEM are not blocked by the size of the openings, the edge area of the EEM becomes inaccurate after a high number of coatings. However, EEM may experience substantially more deposition than FMM until the mask needs to be replaced by a new mask. For example, EEMs can generally have a coating application time of at least 500 minutes or even at least 800 minutes. In several embodiments, one cassette may be filled with only a few EEMs, and the other cassette may be filled with only a few FMMs. Even more particularly, in some embodiments of the present disclosure, no cassette is filled with both FMMs and EEMs, and no cassette is scheduled with both FMMs and EEMs. Instead, in these embodiments, all the boxes are filled with FMMs or EEMs.
根據數個實施例,遮罩實際上使用於塗佈製程中的時間係小於遮罩的塗佈應用時間。也就是說,塗佈應用時間表示遮罩在仍產生所需之塗佈品質下可使用於塗佈製程中的時間。然而,如果遮罩係為了整體製程效率而應用較短於塗佈應用時間的時間時,由於根據本揭露之數個實施例之提出,此係不會改變遮罩之塗佈應用時間。According to several embodiments, the time during which the mask is actually used in the coating process is less than the coating application time of the mask. That is, the coating application time represents the time that the mask can be used in the coating process while still producing the required coating quality. However, if the mask is applied for a shorter time than the coating application time for overall process efficiency, the application time of the mask will not be changed due to the proposal of several embodiments of the disclosure.
遮罩可包括遮罩及遮罩框架。遮罩框架可裝配以穩定遮罩。舉例來說,遮罩框架可以框架的形式圍繞遮罩。遮罩可舉例為藉由銲接之方式永久地固定於遮罩框架,或遮罩可為可釋放地固定於遮罩框架。遮罩之周圍邊緣可固定於遮罩框架。遮罩可至少部份地以金屬製成,舉例為以具有小的熱膨脹係數之金屬製成,例如是銦鋼(invar)。遮罩可包括磁性材料,使得遮罩可在沈積期間朝向基板磁性吸引。遮罩框架可替代地或額外地包括磁性材料,使得遮罩可經由磁力吸引至遮罩載體。The mask may include a mask and a mask frame. The mask frame can be fitted to stabilize the mask. For example, the mask frame may surround the mask in the form of a frame. The mask may be, for example, permanently fixed to the mask frame by welding, or the mask may be releasably fixed to the mask frame. The peripheral edge of the mask can be fixed to the mask frame. The mask can be made at least partially of metal, for example a metal with a small coefficient of thermal expansion, such as invar. The mask may include a magnetic material so that the mask may be magnetically attracted toward the substrate during deposition. The mask frame may alternatively or additionally include a magnetic material so that the mask can be attracted to the mask carrier via magnetic force.
遮罩可具有0.5 m2 或更多之面積,特別是1 m2 或更多之面積。舉例來說,遮罩之高度可為0.5 m或更多,特別是1 m或更多,及/或遮罩之寬度可為0.5 m或更多,特別是1 m或更多。遮罩之厚度可為1 cm或更少。遮罩框架可比遮罩厚。The mask may have an area of 0.5 m 2 or more, especially an area of 1 m 2 or more. For example, the height of the mask may be 0.5 m or more, especially 1 m or more, and / or the width of the mask may be 0.5 m or more, especially 1 m or more. The thickness of the mask can be 1 cm or less. The mask frame can be thicker than the mask.
遮罩可在用以塗佈基板之設備100中之傳送期間由遮罩載體支承。舉例來說,支承遮罩之遮罩載體可在用以塗佈基板之設備100中沿著主傳送方向Z傳送。於一些實施例,遮罩載體可沿著遮罩載體軌道導引通過用以塗佈基板之設備。舉例來說,遮罩載體可包括導引部,導引部係裝配以沿著遮罩載體軌道導引。於圖式中,為了簡潔性,載體係沒有單獨地繪示。The mask may be supported by a mask carrier during transfer in the apparatus 100 for coating a substrate. For example, a mask carrier supporting a mask may be transferred in the main transfer direction Z in the apparatus 100 for coating a substrate. In some embodiments, the mask carrier may be guided along the mask carrier track through a device for coating a substrate. For example, the mask carrier may include a guide portion that is assembled to guide along the mask carrier track. In the drawings, for simplicity, the carrier system is not shown separately.
於一些實施例中,遮罩載體係藉由傳送系統傳送,傳送系統可包括磁性懸浮系統。舉例來說,磁性懸浮系統可設置,使得遮罩載體之重量的至少一部份可由磁性懸浮系統運載。遮罩載體可接著沿著遮罩載體軌道本質上非接觸地導引通過真空處理系統。驅動器可設置,用以沿著遮罩載體軌道移動載體。In some embodiments, the mask carrier is transported by a transport system, which may include a magnetic levitation system. For example, a magnetic levitation system can be provided such that at least a portion of the weight of the mask carrier can be carried by the magnetic levitation system. The mask carrier can then be guided essentially non-contact along the mask carrier track through the vacuum processing system. The driver may be provided to move the carrier along the mask carrier track.
為了交換已使用遮罩,已使用遮罩可從塗佈腔室依循路徑傳送回到匣,及新遮罩可從匣依循路徑傳送至塗佈腔室。依循路徑傳送可特別是包括在旋轉模組中旋轉及在過渡模組中傳送之至少一者。In exchange for used masks, used masks can be transferred from the coating chamber back to the cassette following a path, and new masks can be transferred from the cassette to the coating chamber via a path. Following the path may include, in particular, at least one of rotating in a rotating module and transmitting in a transition module.
舉例來說,新遮罩可在其中一個遮罩載體軌道上沿著主傳送方向Z傳送。遮罩可不時地相鄰於基板傳送及/或與基板同步傳送,基板可於其中一個基板載體軌道上並行地傳送。新遮罩及基板可一起旋轉及/或一起移動至個別之旋轉模組中。For example, a new mask may be transferred along one of the mask carrier tracks along the main transfer direction Z. The mask may be transferred from time to time adjacent to the substrate and / or synchronized with the substrate, and the substrate may be transferred in parallel on one of the substrate carrier tracks. The new mask and substrate can be rotated together and / or moved into separate rotation modules.
通常係在匣之下一個排氣期間,已使用遮罩一般係從接著裝載遮罩之匣依循路徑傳送至一匣。於本揭露之數個實施例中,一個匣可具有兩個隔室,一個隔室用於已使用遮罩,及一個隔室用於新遮罩。於數個實施例中,新遮罩係儲存於第二隔室中,及已使用遮罩係儲存於第一隔室中。Usually during a degassing period under the box, the used mask is generally transferred from the box that is subsequently loaded with the mask to a box. In several embodiments of the present disclosure, a cassette may have two compartments, one compartment for the used mask, and one compartment for the new mask. In several embodiments, the new mask is stored in the second compartment, and the used mask is stored in the first compartment.
根據此處所述之實施例,遮罩係根據遮罩之塗佈應用時間分類至不同匣中。此係有利的而將概述於下方。According to the embodiment described herein, the masks are classified into different cassettes according to the application time of the masks. This is advantageous and will be outlined below.
儲存遮罩於匣中不僅是有助於維持個別遮罩可用於下次塗佈腔室需要新遮罩的目標。如此處所述,匣中之暫存時間係使用於脫附遮罩。也就是說,匣中之遮罩的暫存時間本質上有助於針對下述理由而準備高品質沈積之遮罩。Storing the masks in the box is not only helpful in maintaining the individual masks for the purpose of requiring new masks in the next coating chamber. As described herein, the temporary storage time in the box is used for the desorption mask. That is, the temporary storage time of the masks in the box essentially helps to prepare high-quality deposited masks for the following reasons.
於環境壓力中,較高數量之水分子係貼附於遮罩之表面。根據數個實施例,遮罩一般係直接地從環境壓力舉例為經由裝載腔室裝載至匣中。一旦真空係於匣中產生時,遮罩上剩餘的水係開始脫附。然而,由於事實證明脫附基本上僅為時間及溫度的函數,增加匣中的真空並非必要提供來取得更有效的脫附。Under ambient pressure, a higher number of water molecules are attached to the surface of the mask. According to several embodiments, the mask is generally loaded into the cassette directly from the ambient pressure, for example, via a loading chamber. Once the vacuum is generated in the box, the remaining water on the mask begins to desorb. However, as it turns out that desorption is basically only a function of time and temperature, increasing the vacuum in the cassette is not necessary to provide more effective desorption.
如果一旦進入塗佈腔室之高度脫附的環境中,則太多水分子仍在遮罩上,遮罩將產生濕氣雲(moisture cloud)於塗佈腔室中,而具有壓力將戲劇化上升及危害的效應,或至少使沈積品質惡化。為了高品質之塗佈製程,各遮罩在塗佈製程進行之前自水充分地脫附係有利的。If once in the highly desorbed environment of the coating chamber, too many water molecules are still on the mask, the mask will generate a moisture cloud in the coating chamber, and the pressure will be dramatic Rising and harmful effects, or at least deteriorate the quality of the deposit. For high-quality coating processes, it is advantageous that each mask is sufficiently desorbed from water before the coating process is performed.
增加真空中之暫存時間本質上對改善脫附有所貢獻。然而,在截至目前為止已知之用以塗佈基板之設備的情況下,增加儲存時間亦減慢塗佈製程,而對經濟製程來說係為不可接受的。Increasing the holding time in the vacuum essentially contributes to improving desorption. However, in the case of devices for coating substrates known so far, increasing the storage time also slows down the coating process, which is unacceptable for economic processes.
此外,排氣匣來供給一或多個新遮罩至匣中係破壞在排氣之前已經開始的脫附製程。舉例來說,如果匣係容納已經儲存於高度真空一些時間的許多遮罩,及匣係短暫地排氣來裝載另一個遮罩至匣中時,在匣中的全部遮罩必須重新開始脫附。因此,根據本揭露之一方面,個別裝載遮罩至匣中係避免。In addition, the supply of one or more new masks into the box by the exhaust box destroys the desorption process that has been started before the exhaust. For example, if the cassette system contains many masks that have been stored in a high vacuum for some time, and if the cassette system is briefly vented to load another mask into the cassette, all masks in the cassette must begin to detach again. . Therefore, according to one aspect of the present disclosure, individual loading of the mask into the box is avoided.
根據此處所述之數個實施例,在裝載遮罩至匣中(及可能卸載已使用遮罩)之後,脫附製程係在本實施例之此些匣中執行。一般來說,此處所理解的裝載新遮罩至匣中包括通常在遮罩從非真空環境供應時排氣匣。在裝載匣之後,匣係關閉及匣中之真空係產生而允許脫附遮罩。值得注意的是,根據後續之塗佈製程,此些匣之各者或部份可在不同時間點裝載遮罩及/或卸載已使用遮罩。According to several embodiments described herein, after the mask is loaded into the cassette (and the used mask may be unloaded), the desorption process is performed in these cassettes of this embodiment. In general, loading a new mask into a cassette as understood herein includes venting the cassette usually when the mask is supplied from a non-vacuum environment. After loading the cassette, the cassette is closed and the vacuum in the cassette is created to allow the mask to be detached. It is worth noting that, according to the subsequent coating process, each or part of these boxes can be loaded with masks and / or unloaded used masks at different points in time.
根據數個實施例,當匣係裝載新遮罩時,匣之全部遮罩槽提供有新遮罩係理解的。也就是說,如果匣需要排氣以裝載新遮罩時,此些實施例之製程係預期匣的全部遮罩槽在此時填充新遮罩。因此,根據此處所述數個實施例之製程係避免僅因有m個遮罩必須裝載而排氣匣(通常與裝載一起進行),其中m小於匣中之遮罩槽的數量。取而代之,各裝載周期中,匣之全部遮罩槽一般係填充有新遮罩。According to several embodiments, when the cassette is loaded with a new mask, all the mask slots of the cassette are provided with the new mask. That is, if the cassette needs to be vented to load a new mask, the processes of these embodiments expect that all mask slots of the cassette are filled with the new mask at this time. Therefore, the process according to the several embodiments described herein avoids exhausting the cassette (usually with loading) because only m masks must be loaded, where m is less than the number of mask slots in the cassette. Instead, in each loading cycle, all the mask slots of the cassette are generally filled with new masks.
於數個實施例中,各匣包括第一隔室及第二隔室。一般來說,新遮罩儲存於第一隔室中,及已使用遮罩儲存第二隔室中。In several embodiments, each cassette includes a first compartment and a second compartment. Generally, new masks are stored in the first compartment and used masks are stored in the second compartment.
根據此處所述實施例,需用於沈積製程之此些遮罩係分類成至少兩個群集群組,特別是分類成三個或更多個群集群組。遮罩分配至群集群組係由遮罩之塗佈應用時間所驅使。群集群組一般係可分離的(disjunctive),也就是說,遮罩之塗佈應用時間明確地指示遮罩分屬於哪一個群集群組。According to the embodiments described herein, the masks required for the deposition process are classified into at least two cluster groups, and particularly into three or more cluster groups. The assignment of a mask to a cluster group is driven by the application time of the mask. Cluster groups are generally disjunctive, that is, the application time of the mask clearly indicates which cluster group the mask belongs to.
於數個實施例中,各群集群組係分配至一個匣。在此情況中,群集群組的數量對應於匣的數量。In several embodiments, each cluster group is assigned to a cassette. In this case, the number of cluster groups corresponds to the number of cassettes.
舉例來說,群集群組的數量可為三個。因此,匣之數量可為三個。第一群集群組可由具有在第一塗佈應用時段中之塗佈應用時間之遮罩所組成。第二群集群組可由具有在第二塗佈應用時段中之塗佈應用時間之遮罩所組成。第三群集群組可由具有在第三塗佈應用時段中之塗佈應用時間之遮罩所組成。於實施例中,分配至群集群組係明確的。也就是說,第一塗佈應用時段、第二塗佈應用時段及第三塗佈應用時段係不重疊。For example, the number of cluster groups may be three. Therefore, the number of cassettes can be three. The first cluster group may be composed of a mask having a coating application time during the first coating application period. The second cluster group may be composed of a mask having a coating application time in the second coating application period. The third cluster group may be composed of a mask having a coating application time in the third coating application period. In the embodiment, the assignment to the cluster group is explicit. That is, the first coating application period, the second coating application period, and the third coating application period do not overlap.
更佳了解本揭露之兩個群集群組的簡化例子中,第一群集群組可由具有90 min及110 min之間的塗佈應用時間之遮罩所組成,及第二群集群組可由具有多於500 min之塗佈應用時間之遮罩所組成。明顯可見,於此製程中,沒有使用具有110 min及500 min之間的塗佈應用時間的遮罩。屬於第一群集群組之遮罩係儲存於第一匣中,及屬於第二群集群組之遮罩係儲存於第二匣中。To better understand the simplified example of the two cluster groups disclosed in this disclosure, the first cluster group may consist of a mask with a coating application time between 90 min and 110 min, and the second cluster group may consist of multiple A mask consisting of a coating application time of 500 min. Obviously, in this process, a mask having a coating application time between 110 min and 500 min is not used. Masks belonging to the first cluster group are stored in the first box, and masks belonging to the second cluster group are stored in the second box.
於其他實施例中,各群集群組可分配到多於一個匣。舉例來說,第一群集群組可分配到第一及第二匣,及第二群集群組可分配到第三匣。In other embodiments, each cluster group may be assigned to more than one bin. For example, the first cluster group may be assigned to the first and second boxes, and the second cluster group may be assigned to the third box.
舉例來說,參照第1圖,第一群集群組可由具有90 min之塗佈應用時間的遮罩(預期於塗佈腔室D2中使用)、具有100 min之塗佈應用時間的遮罩(預期於塗佈腔室D4中使用)、及具有110 min之塗佈應用時間的遮罩(預期於塗佈腔室D6中使用)所組成。第二群集群組可由具有600 min之塗佈應用時間的遮罩(預期於塗佈腔室D1及D9中使用)、具有650 min之塗佈應用時間的遮罩(預期於塗佈腔室D3中使用)、具有700 min之塗佈應用時間的遮罩(預期於塗佈腔室D5中使用)、及具有800 min之塗佈應用時間的遮罩(預期於塗佈腔室D7及D8中使用)所組成。For example, referring to Figure 1, the first cluster group may be a mask with a coating application time of 90 min (expected to be used in the coating chamber D2), a mask with a coating application time of 100 min ( Expected to be used in the coating chamber D4), and a mask (expected to be used in the coating chamber D6) with a coating application time of 110 min. The second cluster group can be a mask with a coating application time of 600 min (expected to be used in the coating chambers D1 and D9), a mask with a coating application time of 650 min (expected to be in the coating chamber D3) Use), a mask with a coating application time of 700 min (expected to be used in the coating chamber D5), and a mask with a coating application time of 800 min (expected in the coating chambers D7 and D8) Use).
為了最佳化整體沈積製程的效率,來自第一群集群組之遮罩可分配至匣M1及匣M2,及來自第二群集群組之遮罩可配置於匣M3。因此,匣M1及M2係裝配以供應新遮罩至塗佈腔室D2、D4、及D6,及匣M3係裝配以供應新遮罩至塗佈腔室D1、D3、D5、D7、D8及D9。In order to optimize the efficiency of the overall deposition process, the masks from the first cluster group may be allocated to the boxes M1 and M2, and the masks from the second cluster group may be allocated to the box M3. Therefore, the cassettes M1 and M2 are assembled to supply new masks to the coating chambers D2, D4, and D6, and the cassette M3 is assembled to supply new masks to the coating chambers D1, D3, D5, D7, D8, and D9.
於此例子中,各匣M1至M3可具有六個遮罩槽。各塗佈腔室D1至D9可具有兩個遮罩槽。於此例子中,匣M3供給新遮罩至塗佈腔室D1、D3、D5、D7、D8及D9。然而,當使用於沈積之此些遮罩的數量係因而為12個而其中匣M3可僅儲存六個遮罩時,匣M3係操作,使得在各替換周期係僅有塗佈腔室D1、D3、D5、 D7、D8及D9中之一半的遮罩係進行替換。換言之,及不限於此實施例但一般可適用的來說,匣之替換周期時間可為匣中之全部遮罩的最短塗佈應用時間的二分之一。也就是說,在所提供的特定例子中,匣M3中之遮罩具有600 min、650 min、700 min及800 min之塗佈應用時間。因此,最短塗佈應用時間明顯地為600 min,且其二分之一係為300 min。因此,在此特定例子中,匣M3係每300 min使用,以替換塗佈腔室D1、D3、D5、D7、D8及D9之一半的遮罩。之後,新遮罩裝載至匣M3來用以於此儲存,及同時用以進行沈積製程。在接續之300 min之後,塗佈腔室D1、D3、D5、D7、D8及D9中之另一半的遮罩係進行替換。In this example, each of the cassettes M1 to M3 may have six mask slots. Each of the coating chambers D1 to D9 may have two masking grooves. In this example, the cassette M3 supplies a new mask to the coating chambers D1, D3, D5, D7, D8, and D9. However, when the number of such masks used for deposition is thus 12 and the cassette M3 can store only six masks, the cassette M3 is operated so that only the coating chamber D1 is used in each replacement cycle. One half of the masks D3, D5, D7, D8 and D9 are replaced. In other words, and not limited to this embodiment but generally applicable, the replacement cycle time of the cartridge may be one half of the shortest application time of all the masks in the cartridge. That is, in the specific example provided, the mask in the cassette M3 has a coating application time of 600 min, 650 min, 700 min, and 800 min. Therefore, the minimum coating application time is obviously 600 minutes, and one half of it is 300 minutes. Therefore, in this specific example, the cassette M3 is used every 300 minutes to replace the half of the mask of the coating chambers D1, D3, D5, D7, D8, and D9. The new mask is then loaded into the cassette M3 for storage there, and at the same time for the deposition process. After the next 300 minutes, the other half of the coating chambers D1, D3, D5, D7, D8, and D9 were replaced with masks.
從此例子較為明瞭的是,所述的生產時程(schedule)係提供300 min的較長脫附時間,而產生高處理品質。再者,此生產時程係提供而僅使用具有6個遮罩槽之一個匣來用於需要12個遮罩之塗佈腔室。此反而係本質上減少真空處理系統的佔地面積。It is clear from this example that the production schedule provides a longer desorption time of 300 min, resulting in high processing quality. Furthermore, this production schedule is provided and only one box with 6 mask slots is used for a coating chamber requiring 12 masks. Instead, this essentially reduces the footprint of the vacuum processing system.
因此,本實施例係提供一種設備,其中匣中之遮罩槽的數量係少於匣供給至塗佈腔室中所需的遮罩。由特定匣供給之塗佈腔室亦意指為此處的「此些塗佈腔室之預定次組合」。一個匣中之遮罩槽的數量可僅為由此匣供應之塗佈腔室中所需之遮罩的一半或更少。與此處所述之供給此些塗佈腔室之匣的數量相關的塗佈腔室的數量可因而大於3個,於數個實施例中甚至是大於4個。舉例來說,匣之數量係為3個,及/或塗佈腔室之數量係為10個或更多個。Therefore, the present embodiment provides a device in which the number of the mask grooves in the cassette is less than the mask required for the cassette to be supplied into the coating chamber. The coating chamber supplied by a particular cassette is also referred to herein as "a predetermined combination of such coating chambers". The number of mask slots in a cassette may be only half or less than the masks required in the coating chamber supplied by this cassette. The number of coating chambers related to the number of cassettes supplied to such coating chambers described herein may thus be greater than three, and even greater than four in several embodiments. For example, the number of cassettes is three, and / or the number of coating chambers is ten or more.
回到參照第1圖概述之特定例子,匣M1及M2儲存具有較短之塗佈應用時間的遮罩11,也就是具有90 min、100 min及110 min之塗佈應用時間的遮罩。匣M1及M2兩者各可具有六個遮罩槽。塗佈腔室D2、D4、及D6可各具有兩個遮罩槽。也就是說,在塗佈腔室D2、D4、及D6共需要六個遮罩之情況下,兩個匣各具有六個遮罩係裝配,以供應塗佈腔室D2、D4及D6。兩個匣各具有六個遮罩也就是一共有12個遮罩。Returning to the specific example outlined with reference to FIG. 1, the cassettes M1 and M2 store masks 11 having shorter coating application times, that is, masks having coating application times of 90 minutes, 100 minutes, and 110 minutes. Each of the cassettes M1 and M2 may have six mask slots. The coating chambers D2, D4, and D6 may each have two masking grooves. That is, in the case where the coating chambers D2, D4, and D6 require a total of six masks, each of the two cassettes has six mask systems to supply the coating chambers D2, D4, and D6. The two boxes each have six masks, that is, a total of 12 masks.
在此實施例之方法中,匣M1之全部遮罩可在相同時間點使用,以替換塗佈腔室D2、D4及D6中之已使用遮罩。因此,整個匣M1變成沒有新遮罩,及此三個塗佈腔室D2、D4及D6中之全部遮罩係在相同時間點替換。替換係由匣M1及M2中之全部遮罩的最短塗佈應用時間所開始。既然匣M1及M2中之遮罩具有90 min、100 min及110 min之塗佈應用時間,最短塗佈應用時間係因而為90 min。因此,替換係在90 min之後開始。接著,匣M1係排氣且再度填充有新遮罩來進行脫附製程。In the method of this embodiment, all the masks of the cassette M1 can be used at the same time point to replace the used masks in the coating chambers D2, D4, and D6. Therefore, the entire cassette M1 becomes no new mask, and all the masks in the three coating chambers D2, D4, and D6 are replaced at the same time point. Replacement begins with the shortest application time for all masks in the cassettes M1 and M2. Since the masks in the boxes M1 and M2 have coating application times of 90 min, 100 min, and 110 min, the minimum coating application time is therefore 90 min. Therefore, the replacement system started after 90 min. Next, the cartridge M1 is vented and refilled with a new mask to perform the desorption process.
於是,在下一個90 min之後,也就是再度對應於匣M1及M2中之全部遮罩的最短塗佈應用時間,塗佈腔室D2中之遮罩需要進行替換。塗佈腔室D2中需進行遮罩之替換係啟動塗佈腔室D2、D4及D6中之全部遮罩的替換。然而,此次塗佈腔室D2、D4及D6中之全部遮罩係利用來自匣M2之新遮罩替換。之後,匣M2係排氣及再度填充有新遮罩。Therefore, after the next 90 minutes, which is the shortest coating application time corresponding to all the masks in the cassettes M1 and M2 again, the masks in the coating chamber D2 need to be replaced. The replacement of the masks in the coating chamber D2 is to start the replacement of all the masks in the coating chambers D2, D4, and D6. However, all the masks in the coating chambers D2, D4, and D6 were replaced with new masks from the cassette M2 this time. After that, the box M2 was vented and refilled with a new mask.
在下一個90 min之後,也就是再度對應於匣M1及M2中之全部遮罩的最短塗佈應用時間,塗佈腔室D2中之遮罩需要進行替換。此係再度啟動塗佈腔室D2、D4及D6中之全部遮罩的替換,且此次塗佈腔室D2、D4及D6中之全部遮罩係再度利用來自匣M1之新遮罩替換。之後,匣M1係排氣及再度填充有新遮罩。此製程可在需要時以類似此處之方式繼續。After the next 90 minutes, which is the shortest coating application time corresponding to all the masks in the cassettes M1 and M2 again, the masks in the coating chamber D2 need to be replaced. This is to start the replacement of all the masks in the coating chambers D2, D4, and D6 again, and all the masks in the coating chambers D2, D4, and D6 are replaced again with a new mask from the cassette M1. After that, the box M1 was vented and refilled with a new mask. This process can be continued in a manner similar to this when needed.
當執行此製程,及儘管塗佈應用時間為90分鐘,遮罩之脫附時間可維持在180 min係很明顯的,因為各匣M1及M2係僅在每隔一個替換周期中用於替換已使用遮罩。如此例子中範例性說明的觀念係有利的,因為此觀念甚至在遮罩之短塗佈應用時間的情況中提供足夠長的脫附時間。When this process is performed, and although the application time of the coating is 90 minutes, it is obvious that the desorption time of the mask can be maintained at 180 minutes, because the cassettes M1 and M2 are only used to replace the Use a mask. The concept exemplified in such an example is advantageous because it provides a sufficiently long desorption time even in the case of short application times of the mask.
更特別是,根據可與此處所述全部其他實施例結合之數個實施例,此方法可包括在數個時段中填充新遮罩至匣,此些時段係大於使用於填充匣之新遮罩的最短塗佈應用時間。甚至更特別的是,此方法可包括在數個時段中填充新遮罩至匣,此些時段係大於使用於填充匣之全部新遮罩的塗佈應用時間。More specifically, according to several embodiments that can be combined with all the other embodiments described herein, this method may include filling a new mask to the box in a number of periods, these periods being greater than the new mask used to fill the box Minimum coating application time for the hood. Even more particularly, this method may include filling the new mask to the cassette in several periods, these periods being greater than the application time of the coating of all the new masks used to fill the cassette.
根據本揭露之數個實施例且不限於第1圖之例子,全部匣中之遮罩係進行多於90 min,或甚至更特別是多於120 min之脫附製程。此處所理解之用語「遮罩進行x min之脫附製程」或「遮罩係脫附x min」係意指儲存遮罩在不中斷真空x min的環境中。特別是,此處所理解之用語「遮罩進行x min之脫附製程」或「遮罩係脫附x min」可意指儲存遮罩於匣中。According to several embodiments of the present disclosure and not limited to the example of FIG. 1, the masks in all the boxes are subjected to a desorption process of more than 90 minutes, or even more particularly more than 120 minutes. As used herein, the term "mask desorption process x min" or "mask desorption x min" means that the mask is stored in an environment that does not interrupt the vacuum x min. In particular, the terms "mask desorption process x min" or "mask desorption x min" as understood herein may mean that the mask is stored in a cassette.
根據本實施例之數個方面,遮罩係分類,使得僅有相同或類似塗佈應用時間之遮罩係儲存於各匣中。此內容中之「類似」可理解為意指+/-20%之偏差。特別是,在典型實施例中,具有多於50 %之時間差異的個別之塗佈應用時間的遮罩係不預定儲存於相同匣中。According to several aspects of this embodiment, the masks are classified such that masks with only the same or similar coating application time are stored in each box. "Similar" in this context is understood to mean a deviation of +/- 20%. In particular, in typical embodiments, masks with individual coating application times having a time difference of more than 50% are not intended to be stored in the same cassette.
如此處所述,由於分類成群集群組,遮罩可在個別之遮罩的塗佈應用時間結束前的時間點替換(也就是說,取出塗佈腔室)。特別是,匣之全部遮罩可在相同時間點傳送到個別之塗佈腔室。有鑑於本實施例之允許較長的脫附時間及可能較少需要匣之勝過缺點的優點,減少遮罩之使用時間的缺點係得以接受。As described herein, the masks can be replaced at a point in time before the end of the coating application time of the individual masks (that is, the coating chambers are taken out) because they are classified into cluster groups. In particular, the entire mask of the cassette can be transferred to individual coating chambers at the same time. In view of the advantages of this embodiment that allow a longer desorption time and may require less than the disadvantages of the cassette, the disadvantage of reducing the use time of the mask is accepted.
從匣傳送遮罩到全部塗佈腔室的分配次組合一般係在對應於此匣中之全部遮罩的最短塗佈應用時間的時間點啟動。也就是說,匣中之具有較短塗佈應用時間之遮罩係定義用於匣之全部遮罩的替換周期。也就是說,替換周期時間可對應於匣中之全部遮罩的最短塗佈應用時間。此處的替代周期時間應稱為「完整之塗佈應用時間周期」。因此,在每個替代周期之後,匣之全部遮罩係假設已經進行足夠的脫附,及傳送至個別的塗佈腔室。來自塗佈腔室之已使用遮罩可傳送回到匣來從匣接續地卸載已使用遮罩。之後,新遮罩係裝載至匣來進行脫附製程。The distribution sub-combination from the cassette transfer mask to all coating chambers is generally initiated at a point in time corresponding to the shortest coating application time for all masks in this cassette. That is, a mask with a shorter coating application time in the cassette defines a replacement cycle for the entire mask of the cassette. That is, the replacement cycle time may correspond to the shortest coating application time of all the masks in the cassette. The alternative cycle time here shall be referred to as the "complete coating application time cycle". Therefore, after each replacement cycle, the full mask of the cassette is assumed to have been sufficiently desorbed and transferred to the individual coating chamber. The used mask from the coating chamber can be transferred back to the cassette to successively unload the used mask from the cassette. After that, a new mask is loaded into the box to perform the desorption process.
在可明確地結合額外具有用於至少一匣之完整塗佈應用時間周期之數個實施例的其他實施例中,至少一匣之塗佈應用時間周期係由匣中之全部遮罩的最短塗佈應用時間的二分之一決定。此於此處應稱為「一半之塗佈應用時間周期」。也就是說,傳送遮罩至個別之塗佈腔室係在對應於匣中之全部遮罩的最短塗佈時間的一半之時間點啟動。因此,匣中具有最短塗佈應用時間之遮罩係定義用於匣之全部遮罩的替換周期,及替代周期時間對應於匣中之全部遮罩之最短塗佈應用時間的二分之一。因此,在每個替代周期之後,匣之全部遮罩係假設已經進行足夠的脫附,及傳送到由此匣供應之塗佈腔室之次組合。In other embodiments that can explicitly incorporate several additional embodiments having a complete coating application time period for at least one box, the coating application time period of at least one box is the shortest coating by all masks in the box The cloth application time is decided by half. This should be referred to herein as "half the coating application time period". That is, the transfer of the mask to the individual coating chamber is started at a time point corresponding to half of the shortest coating time of all the masks in the cassette. Therefore, the mask with the shortest coating application time in the box defines a replacement cycle for all the masks in the box, and the replacement cycle time corresponds to one half of the shortest coating application time for all the masks in the box. Therefore, after each replacement cycle, the full mask of the cassette is assumed to have undergone sufficient desorption and a sub-combination transferred to the coating chamber supplied by this cassette.
如有關於第1圖之實施例已經說明,完整之塗佈應用時間周期之數個實施例可結合具有一半之塗佈應用時間周期之實施例。更特別的是,根據此處所揭露之方法的數個典型實施例,一或多個匣係根據完整的塗佈應用時間周期操作,及一、二或多個匣係根據一半之塗佈應用時間周期操作。在前面結合第1圖詳細提供之例子中,此兩個匣M1及M2係根據完整的塗佈應用時間周期操作,及匣M3係根據一半之塗佈應用時間周期操作。從中將明顯得知,一半之塗佈應用時間周期係有利的,相較於負責的匣中的遮罩槽而言,更多塗佈腔室可由負責之匣供應。完整的塗佈應用時間周期可允許藉由二或多個匣供應相同組之塗佈腔室。也就是說,根據此些實施例,二或多個匣係使用,以通常利用交替方式供應遮罩至相同的塗佈腔室。儘管遮罩之低塗佈應用時間,此係提供高脫附時間。If the embodiment of FIG. 1 has already been explained, several embodiments of the complete coating application time period may be combined with the embodiment having half of the coating application time period. More specifically, according to several exemplary embodiments of the method disclosed herein, one or more cassettes are operated based on a complete coating application time period, and one, two or more cassettes are operated based on half of a coating application time Cycle operation. In the example provided in detail in conjunction with FIG. 1 above, the two cartridges M1 and M2 are operated according to a complete coating application time period, and the cartridge M3 is operated according to half of the coating application time period. It will be apparent from this that half of the coating application time period is advantageous, and that more coating chambers can be supplied by the responsible magazine than by the mask slot in the responsible magazine. A complete coating application time period may allow the same set of coating chambers to be supplied by two or more cassettes. That is, according to these embodiments, two or more cassettes are used, supplying the masks to the same coating chamber, usually in an alternating manner. Despite the low coating application time of the mask, this series provides high desorption time.
一般來說,在特別有關於具有長塗佈應時間(例如是多於600 min)之遮罩的情況下,不僅是二分之一的塗佈應用時間周期可使用,三分之一之塗佈應用時間周期及/或四分之一之塗佈應用時間周期亦可使用。在三分之一之塗佈應用時間周期中,遮罩在對應於匣中之全部遮罩之最短塗佈應用時間之三分之一的時間點進行替換。在四分之一之塗佈應用時間周期中,遮罩在對應於匣中之全部遮罩之最短塗佈應用時間之四分之一的時間點進行替換。萬一替換周期之三分之一或四分之一仍提供足夠的脫附時間,此些替代周期甚至更有利,因為此些替代周期更允許減少所需用於供應不同塗佈腔室之匣的數量,而沈積品質可同時維持。In general, in the case of a mask having a long application time (for example, more than 600 min), not only one-half of the application time period can be used, but one-third of the application can be used. A cloth application time period and / or a quarter of a coating application time period can also be used. In one third of the coating application time period, the mask is replaced at a time point corresponding to one third of the shortest coating application time of all masks in the cassette. In a quarter of the coating application time period, the mask is replaced at a point in time corresponding to a quarter of the shortest coating application time of all masks in the box. In the event that one-third or one-fourth of the replacement cycle still provides sufficient desorption time, these replacement cycles are even more advantageous as these replacement cycles allow for a reduction in the number of cassettes required to supply different coating chambers The quantity, while the deposition quality can be maintained at the same time.
用語「匣係填充新遮罩」一般係於此理解為此匣之所有遮罩槽係在相同時間點填充。更特別的是,各匣可在相同時間點完全地填充。然而,用以填充不同匣之時間點可相異。各匣或匣之至少各次組合可具有不同的替換周期,不同的替換周期係完全地獨立於其他匣之替換周期。The term "box is filled with a new mask" is generally understood here as all mask slots for this box are filled at the same time. More specifically, each cassette can be completely filled at the same point in time. However, the time points used to fill different cassettes can be different. Each cassette or at least each combination of cassettes may have different replacement cycles, and the different replacement cycles are completely independent of the replacement cycles of other cassettes.
如此處所使用,「相同時間點」係理解為「在相同之行動過程中」及應特別包括相繼之遮罩處理,也就是處理一個接著一個的遮罩。在相同時間點匣係填充新遮罩的內容中,用語「相同時間點」可理解為意指一致的排氣製程。於相同時間點從匣傳送遮罩至個別之塗佈腔室的內容中,用語「相同時間點」可理解為相繼傳送離開匣,也就是一個遮罩接著另一個遮罩係傳送至塗佈腔室。As used herein, "same point in time" is understood as "in the same course of action" and should specifically include successive mask processing, that is, processing one mask after another. In the case that the box is filled with a new mask at the same time, the term "same time" can be understood to mean a consistent exhaust process. At the same time point, when the mask is transmitted from the box to the individual coating chamber, the term "same time point" can be understood as the successive transmission from the box. room.
於數個實施例中,此些匣之一或多個匣包括數個遮罩槽,此些遮罩槽多於由此一或多個匣供應之塗佈腔室之次組合中的遮罩槽之數量。在額外或替代之實施例中,此一或多個匣包括數個遮罩槽,此些遮罩槽少於此一或多個匣供應之塗佈腔室之次組合中之遮罩槽的數量(由匣供應之塗佈腔室之次組合亦意指為「分配之塗佈腔室」)。In several embodiments, one or more of the cassettes include a plurality of masking slots, the masking slots being more than the masks in the sub-combination of the coating chambers supplied by the one or more cassettes. Number of slots. In additional or alternative embodiments, the one or more cassettes include a plurality of masking grooves, which are less than the masking grooves in the sub-assembly of the coating chamber supplied by the one or more cassettes Quantity (the sub-combination of coating chambers supplied by the cassette also means "dispensing coating chambers").
一般來說,在匣具有數個遮罩槽,且此些遮罩槽多於分配之塗佈腔室中之遮罩槽的數量的情況中,匣根據全部塗佈應用時間周期操作。再者,在此種狀況中,一般係至少兩個匣供應相同組合之塗佈腔室。舉例來說,各具有六個遮罩槽之兩個匣可使用,以提供遮罩至各具有兩個遮罩槽之一組三個塗佈腔室。此兩個匣係在全部塗佈應用時間周期準則下進行操作,及此兩個匣之各匣係每隔一段時間使用來替換遮罩,塗佈腔室中的遮罩係全部替換。也就是說,匣係以交替方式清空(及裝載新遮罩)。Generally, in the case where the cassette has several mask grooves, and these mask grooves are more than the number of mask grooves in the allocated coating chamber, the cassette operates according to the entire coating application time period. Moreover, in this case, at least two cassettes generally supply the same combination of coating chambers. For example, two cassettes each having six mask slots can be used to provide a mask to a set of three coating chambers each having two mask slots. The two cassettes are operated under the time principle of full coating application, and each of the two cassettes is used at intervals to replace the mask, and the masks in the coating chamber are all replaced. That is, the cassettes are emptied (and loaded with new masks) in an alternating manner.
於一或多個匣包括數個遮罩槽,且此些遮罩槽少於分配之塗佈腔室中之遮罩槽之數量的數個實施例中,匣可根據二分之一的塗佈應用時間周期、三分之一的塗佈應用時間周期或甚至是四分之一的塗佈應用時間周期操作。In embodiments where the one or more cassettes include several masking grooves and the number of such masking grooves is less than the number of masking grooves in the dispensing coating chamber, the cassettes may be Cloth application time period, one-third application time period, or even one quarter application time period operation.
相反於目前此技術領域中所知的處理方法,本揭露之數個實施例增加遮罩之脫附時間,減少匣之需求,及/或由於較佳(也就是較長)之脫附而增加處理品質。在目前所知的處理方法中,舉例為三個之一些塗佈腔室係從一個匣提供遮罩。此一個匣包括於此三個塗佈腔室中所有需用於處理的遮罩。舉例來說,如果在一個塗佈腔室中處理係產生90 min之遮罩的塗佈應用時間,而在另一塗佈腔室中處理係產生600 min之塗佈應用時間,雖然具有600 min之塗佈應用時間會具有更多時間來用於脫附,在具有90 min之塗佈應用時間的遮罩係替換時,匣中之所有遮罩係每90 min排氣。此種不良情況可藉由本揭露之實施例避免。In contrast to the processing methods currently known in this technical field, several embodiments of the present disclosure increase the desorption time of the mask, reduce the need for cassettes, and / or increase due to better (that is, longer) desorption. Processing quality. In the currently known processing methods, for example, some of the three coating chambers are provided with a mask from one cassette. This one box contains all the masks for processing in the three coating chambers. For example, if a processing system in one coating chamber produces a coating application time of 90 minutes, and a processing system in another coating chamber produces a coating application time of 600 minutes, although it has 600 minutes The coating application time will have more time for desorption. When the mask system with a coating application time of 90 minutes is replaced, all the masks in the box are vented every 90 minutes. Such a bad situation can be avoided by the embodiments of the present disclosure.
特別是,根據此處所述之數個實施例,遮罩分配至匣不只是因為需要遮罩之塗佈腔室係位在相對於匣之特定的位置中,例如是接近匣的位置。有鑑於遮罩之塗佈應用時間,遮罩反而單獨地分配至特定之匣。用以塗佈基板之設備一般包括傳送系統,其中來自全部匣之遮罩會主要傳送至全部塗佈腔室。In particular, according to several embodiments described herein, the mask is assigned to the cassette not only because the coating chamber that needs to be masked is located in a specific position relative to the cassette, such as a position close to the cassette. In view of the application time of the mask, the mask is allocated to a specific box separately. The equipment for coating substrates generally includes a transfer system, where the masks from all the cassettes are mainly transferred to all the coating chambers.
根據此處所述之一些實施例的用以塗佈基板之設備可為單線系統。舉例來說,第1圖之用以塗佈基板之設備100係為此種單線系統。其中,基板及各接續之將塗佈的基板係在相同排序中移動到相同塗佈腔室中。所述的排序可在預定時段後為了後續的基板分別開始,特別是在對應於系統之節拍間隔(tact interval)的本質上固定時段後。舉例來說,基板及各後續之將塗佈的基板可以預定的排序移動至各塗佈腔室中,塗佈腔室配置於主傳送路徑之側邊上。各後續之將塗佈的基板可在相同之預定排序中移動通過塗佈腔室。簡潔之用以塗佈基板的設備可提供。The apparatus for coating a substrate according to some embodiments described herein may be a single wire system. For example, the apparatus 100 for coating a substrate in FIG. 1 is such a single-line system. Among them, the substrate and each successively moved coated substrate are moved to the same coating chamber in the same order. The sorting can be started after a predetermined period for subsequent substrates, especially after an essentially fixed period corresponding to the tact interval of the system. For example, the substrate and each subsequent substrate to be coated can be moved to each coating chamber in a predetermined sequence, and the coating chamber is disposed on the side of the main conveying path. Each subsequent substrate to be coated can be moved through the coating chamber in the same predetermined sequence. Simple equipment for coating substrates is available.
在其他實施例中,多線系統係設置,舉例為第2圖中範例性所示之雙線系統。其中,第一基板係以第一序列移動至第一次組合之塗佈腔室中,及接續之將塗佈的基板係以第二序列移動至第二次組合之塗佈腔室中。在雙線系統中,第二個接續之將塗佈的基板係再度以第一序列移動到第一次組合之塗佈腔室中,及第三個接續之將塗佈的基板係再度以第二序列移動到第二次組合之塗佈腔室中。也就是說,兩個塗佈線(第一塗佈線及第二塗佈線)係提供於相同之用以塗佈基板的設備中,用以交替地塗佈接續之基板。In other embodiments, the multi-line system is provided, such as the two-line system exemplarily shown in FIG. 2. Wherein, the first substrate is moved into the coating chamber of the first combination in a first sequence, and the coated substrate is moved into the coating chamber of the second combination in a second sequence in succession. In the two-line system, the second one moves the coated substrate system again into the coating chamber of the first combination in the first sequence, and the third one moves the coated substrate system again in the first sequence. The two sequences are moved into the coating chamber of the second combination. That is, two coating lines (a first coating line and a second coating line) are provided in the same equipment for coating substrates, and are used to alternately coat successive substrates.
在多線系統中,基板12係僅移動到塗佈腔室之一部份中來進行塗佈,特別是僅進入一半之塗佈腔室中,及接續的基板係僅移動到塗佈腔室之另一部份中來進行塗佈,特別是進入另一半之塗佈腔室中。利用新遮罩替換遮罩係如此處所述之根據遮罩之塗佈應用時間而為有組織的。In the multi-line system, the substrate 12 is moved to only a part of the coating chamber for coating, especially to enter only half of the coating chamber, and the continuous substrate system is only moved to the coating chamber. Coating in the other part, especially in the coating chamber of the other half. Replacing a mask with a new mask is organized as described herein based on the application time of the mask.
如第2圖中之個別箭頭所示,數個基板12及/或遮罩11可沿著主傳送方向Z移動。如第1圖中所示,T1意指為第一過渡模組,及T2意指為第二過渡模組。舉例來說,配置於第一載體軌道31上之基板載體及/或遮罩載體可於主傳送方向Z中同步移動至個別之相鄰模組中,及/或配置於第二載體軌道32(亦意指為「回送軌道」)上之遮罩載體及/或基板載體可於相反方向中(亦於此意指為「回送方向」)移動至個別之相鄰模組中。用以塗佈基板之設備200可更包括塗佈腔室D1及塗佈腔室D2。塗佈腔室D1用以沈積第一材料,塗佈腔室D1相鄰於第一旋轉模組R1配置,而位於主傳送方向Z之第一側邊S1上。塗佈腔室D2用以沈積第二材料,塗佈腔室D2相鄰於第一旋轉模組R1配置,而位於主傳送方向Z之第二側邊S2上。第二側邊S2相反於第一側邊S1。As shown by the individual arrows in FIG. 2, the plurality of substrates 12 and / or the masks 11 can move along the main transfer direction Z. As shown in Figure 1, T1 means the first transition module, and T2 means the second transition module. For example, the substrate carrier and / or the mask carrier arranged on the first carrier track 31 can be moved synchronously to individual adjacent modules in the main transfer direction Z, and / or arranged on the second carrier track 32 ( The mask carrier and / or substrate carrier on the "back loop" also can be moved in the opposite direction (also referred to herein as the "back loop direction") to individual adjacent modules. The apparatus 200 for coating a substrate may further include a coating chamber D1 and a coating chamber D2. The coating chamber D1 is used to deposit the first material. The coating chamber D1 is disposed adjacent to the first rotary module R1 and is located on the first side S1 of the main conveying direction Z. The coating chamber D2 is used to deposit a second material. The coating chamber D2 is disposed adjacent to the first rotary module R1 and is located on the second side S2 of the main conveying direction Z. The second side S2 is opposite to the first side S1.
塗佈腔室D1及塗佈腔室D2可相反於彼此配置在第一旋轉模組R1之不同側邊上,也就是位在相對於第一旋轉模組R1之旋轉軸的180°之角度處。因此,第一旋轉模組R1之第一軌道X1及第二軌道X2可在第一旋轉模組之至少一旋轉位置中連接塗佈腔室D1及塗佈腔室D2之沈積區域。The coating chamber D1 and the coating chamber D2 may be arranged on different sides of the first rotation module R1 opposite to each other, that is, at an angle of 180 ° with respect to the rotation axis of the first rotation module R1 . Therefore, the first orbit X1 and the second orbit X2 of the first rotary module R1 can connect the deposition areas of the coating chamber D1 and the coating chamber D2 in at least one rotation position of the first rotary module.
如第2圖中所示,用以沈積第一材料之第二線的塗佈腔室D1’可相鄰於第一旋轉模組R1配置,而位於主傳送方向Z之第二側邊S2上(或者,取代地位在第一側邊S1上)。再者,用以沈積第二材料之第二線之塗佈腔室D2’可相鄰於第一旋轉模組R1配置,而位在主傳送方向Z之第一側邊S1上(或者,取代地位在第二側邊S2上)。As shown in FIG. 2, the coating chamber D1 ′ for depositing the second line of the first material may be disposed adjacent to the first rotary module R1 and located on the second side S2 of the main conveying direction Z. (Alternatively, the replacement position is on the first side S1). Furthermore, the coating chamber D2 'for depositing the second line of the second material may be disposed adjacent to the first rotary module R1 and located on the first side S1 of the main conveying direction Z (or, instead of Status on the second side S2).
第二線之塗佈腔室D1’及第二線之塗佈腔室D2’可相反於彼此配置在第一旋轉模組R1之不同側邊上,也就是位在相對於第一旋轉模組R1之旋轉軸的180°之角度處。因此,第一旋轉模組R1之第一軌道X1及第二軌道X2可在第一旋轉模組之至少一旋轉位置中連接第二線之塗佈腔室D1’及第二線之塗佈腔室D2’之沈積區域。The coating chamber D1 'of the second line and the coating chamber D2' of the second line may be arranged on different sides of the first rotation module R1 opposite to each other, that is, opposite to the first rotation module 180 ° of the rotation axis of R1. Therefore, the first track X1 and the second track X2 of the first rotary module R1 can be connected to the coating chamber D1 ′ of the second line and the coating chamber of the second line in at least one rotation position of the first rotary module. The deposition area of the chamber D2 '.
繪示於第2圖中之用以塗佈基板的設備200包括匣M1及M2。將使用於塗佈腔室D1、D1’、D2、D2’、D3、D3’及可能之其他塗佈腔室(未繪示於第2圖中)中的遮罩11可從用以塗佈基板之設備的環境裝載至匣中,以傳送至塗佈腔室。已使用遮罩可從塗佈腔室傳送至匣,以舉例為經由裝載腔室從用以塗佈基板之設備卸載。The apparatus 200 for coating a substrate shown in FIG. 2 includes cassettes M1 and M2. The mask 11 used in the coating chambers D1, D1 ', D2, D2', D3, D3 ', and possibly other coating chambers (not shown in Figure 2) can be used for coating The environment of the substrate's equipment is loaded into a cassette for transfer to the coating chamber. The used mask can be transferred from the coating chamber to the cassette, for example, unloading from a device for coating a substrate via a loading chamber.
為了簡潔性,其他塗佈腔室、過渡模組、旋轉模組、匣等係不明確地繪示於第2圖中,但可根據所需之塗佈製程設置。再者,具有相鄰基板之此些遮罩係僅於第2圖中繪示成一個方塊。For simplicity, other coating chambers, transition modules, rotary modules, and boxes are not explicitly shown in Figure 2, but can be set according to the required coating process. Moreover, the masks with adjacent substrates are shown as a square in FIG. 2 only.
用以塗佈基板之設備200可根據前述之方法操作,使得參照可以上述實施例達成而不於此重複。The apparatus 200 for coating a substrate can be operated according to the aforementioned method, so that the reference can be achieved in the above embodiment without repeating it.
參照第3圖,繪示出本實施例之方法。更詳細來說,此方法包括於方塊301中提供數個匣,其中各具有數個遮罩槽。此方法更包括於方塊302中根據各遮罩之塗佈應用時間,分類此些遮罩成至少兩個群集群組。此方法更包括於方塊303中分配此至少兩個群集群組之各者至此些匣之一或多者。再者,此方法更包括於方塊304中根據此分配,儲存此些遮罩於此些匣中。Referring to FIG. 3, the method of this embodiment is illustrated. In more detail, the method includes providing a plurality of cassettes in block 301, each of which has a plurality of mask slots. The method further includes, in block 302, classifying the masks into at least two cluster groups according to the application time of the masks. The method further includes allocating each of the at least two cluster groups to one or more of the bins in block 303. Furthermore, the method further includes storing the masks in the boxes according to the allocation in block 304.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
11‧‧‧遮罩11‧‧‧Mask
12‧‧‧基板12‧‧‧ substrate
31‧‧‧第一載體軌道31‧‧‧ First carrier track
32‧‧‧第二載體軌道32‧‧‧ second carrier track
35‧‧‧沈積源35‧‧‧ sedimentary source
36‧‧‧第一沈積區域36‧‧‧ first sedimentary area
37‧‧‧第二沈積區域37‧‧‧Second deposition area
51、52‧‧‧傳送路徑51, 52‧‧‧ Transmission path
100、200‧‧‧設備100, 200‧‧‧ equipment
301、302、303、304‧‧‧方塊301, 302, 303, 304‧‧‧ blocks
D1-D9、D1’、D2’、D3’‧‧‧塗佈腔室D1-D9, D1 ’, D2’, D3’‧‧‧ Coating chamber
M1-M3‧‧‧匣M1-M3‧‧‧Box
R1‧‧‧第一旋轉模組R1‧‧‧First Rotary Module
R2‧‧‧第二旋轉模組R2‧‧‧Second Rotary Module
R3‧‧‧第三旋轉模組R3‧‧‧Third Rotation Module
R4‧‧‧第四旋轉模組R4‧‧‧Fourth rotation module
R5‧‧‧第五旋轉模組R5‧‧‧ fifth rotation module
R6‧‧‧第六旋轉模組R6‧‧‧Sixth rotation module
S1‧‧‧第一側邊S1‧‧‧First side
S2‧‧‧第二側邊S2‧‧‧Second side
T1‧‧‧第一過渡模組T1‧‧‧First Transition Module
T2‧‧‧第二過渡模組T2‧‧‧Second Transition Module
T3‧‧‧第三過渡模組T3‧‧‧The third transition module
T4‧‧‧第四過渡模組T4‧‧‧ Fourth Transition Module
T5‧‧‧第五過渡模組T5‧‧‧ fifth transition module
T6‧‧‧第六過渡模組T6‧‧‧ Sixth Transition Module
X1‧‧‧第一軌道X1‧‧‧First track
X2‧‧‧第二軌道X2‧‧‧Second Track
Z‧‧‧主傳送方向Z‧‧‧ Main Teleportation
為了使本揭露的上述特徵可詳細地瞭解,簡要摘錄於上之本揭露之更特有的說明可參照數個實施例。所附之圖式係有關於本揭露之數個實施例且說明於下文中。典型實施例係繪示於圖式中及詳細解釋於下方說明中。 第1圖繪示根據此處所述實施例之用以塗佈基板之設備之佈局示意圖; 第2圖繪示根據此處所述實施例之用以塗佈基板之設備的佈局示意圖;以及 第3圖繪示根據此處所述實施例之用以於真空塗佈製程中處理遮罩之方法的示意圖。In order to make the above features of the present disclosure understandable in detail, a more specific description, which is briefly extracted from the above disclosure, may refer to several embodiments. The attached drawings relate to several embodiments of the present disclosure and are described below. Exemplary embodiments are shown in the drawings and explained in detail in the following description. FIG. 1 illustrates a schematic layout of a device for coating a substrate according to an embodiment described herein; FIG. 2 illustrates a schematic layout of a device for coating a substrate according to an embodiment described herein; and FIG. FIG. 3 is a schematic diagram of a method for processing a mask in a vacuum coating process according to an embodiment described herein.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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??PCT/EP2017/070847 | 2017-08-17 | ||
PCT/EP2017/070847 WO2019034255A1 (en) | 2017-08-17 | 2017-08-17 | Method for handling several masks, method for processing substrates and apparatus for coating substrates |
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TW201914082A true TW201914082A (en) | 2019-04-01 |
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TW107128715A TW201914082A (en) | 2017-08-17 | 2018-08-17 | a method for processing a plurality of masks in a vacuum coating process, a method for processing a plurality of substrates by depositing a plurality of different material layers, and a device for coating a plurality of substrates |
Country Status (5)
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JP (1) | JP2019528370A (en) |
KR (1) | KR20190087992A (en) |
CN (1) | CN109673158B (en) |
TW (1) | TW201914082A (en) |
WO (1) | WO2019034255A1 (en) |
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CN114144872A (en) * | 2019-07-25 | 2022-03-04 | 应用材料公司 | System and method for vapor plating an OLED layer stack in a vertical orientation |
KR102580147B1 (en) * | 2021-02-05 | 2023-09-19 | 주식회사 야스 | Mask carry-in and out system for evaporation system |
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KR101316768B1 (en) * | 2006-11-29 | 2013-10-10 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus |
US9353436B2 (en) * | 2008-03-05 | 2016-05-31 | Applied Materials, Inc. | Coating apparatus with rotation module |
KR101119853B1 (en) * | 2009-05-07 | 2012-02-28 | 에스엔유 프리시젼 주식회사 | Apparatus for depositing film and system for depositing film having the same |
CN101956175B (en) * | 2010-05-25 | 2012-10-17 | 东莞宏威数码机械有限公司 | Vacuum continuous coating system and method for assembling and disassembling masks by using same |
WO2012039383A1 (en) * | 2010-09-22 | 2012-03-29 | 株式会社アルバック | Vacuum processing apparatus and method for forming organic thin film |
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2017
- 2017-08-17 KR KR1020187026200A patent/KR20190087992A/en not_active Application Discontinuation
- 2017-08-17 WO PCT/EP2017/070847 patent/WO2019034255A1/en active Application Filing
- 2017-08-17 JP JP2018544065A patent/JP2019528370A/en active Pending
- 2017-08-17 CN CN201780029724.0A patent/CN109673158B/en active Active
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CN109673158A (en) | 2019-04-23 |
CN109673158B (en) | 2021-04-02 |
WO2019034255A1 (en) | 2019-02-21 |
JP2019528370A (en) | 2019-10-10 |
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