KR20130074307A - Evaporation device for manufacturing of oled having apparatus for chucking and dechucking - Google Patents

Abstract

PURPOSE: An organic light emitting device production system having a chucking and a dechucking device is provided to produce a large area organic light emitting device by organically connecting the chucking device part, and a deposition part, and a dechucking device part. CONSTITUTION: A chucking device part (120) chucks an object substrate with a chuck plate. A deposition part (130) performs a thin film deposition process on a chucked substrate transferred from the chucking device part. A dechucking device (150) dechucks a deposited substrate transferred from the deposition part. The dechucking device discharges a processed substrate to the outside. The dechucking device part moves a separated chuck plate to the chucking device again.

Description

Organic light emitting device mass production system having chucking and dechucking device unit {evaporation device for manufacturing of OLED having apparatus for chucking and dechucking}

The present invention relates to a system for mass production of an organic light emitting device, and more particularly, an apparatus for chucking a substrate, an evaporation unit for depositing a thin film on the substrate, and an apparatus for dechucking the substrate are organically connected. It relates to an organic light emitting device mass production system having a chucking and dechucking device portion capable of mass production.

In general, an organic light emitting device (OLED) refers to a self-emitting deposition material that emits light by using an electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound.

The display device using the organic light emitting device can be driven at low voltage, can be made into a thin film, and has a wide viewing angle and fast response speed, unlike the general LCD, the image quality does not change even when viewed from the side, and afterimages remain on the screen. In addition, the small screen has an advantageous price competitiveness due to the image quality and simple manufacturing process than the LCD, attracting attention as a next-generation display device.

Evaporation equipment for manufacturing organic light emitting devices is an absolutely necessary equipment for making displays of TVs or mobile phones or producing lighting equipment using organic light emitting devices.

Deposition equipment for manufacturing an organic light emitting device is a device used to form a thin film by depositing a deposition material, such as organic material on the substrate to be processed, is a key equipment for the production of an organic light emitting device.

As a deposition equipment for manufacturing an organic light emitting device, a vacuum evaporation system is mainly used. That is, the organic light emitting device is mainly deposited in the deposition chamber by a thermal deposition process.

1 shows a conventional deposition apparatus for manufacturing a conventional organic light emitting device, as shown in the upper portion of the deposition chamber 10, the substrate S is disposed, the evaporation source 20 is installed at the bottom, the evaporation source The powder deposition material 22a contained in the crucible 22 in the 20 is evaporated in the deposition chamber 10, so that the thin film is deposited while contacting and solidifying the upper surface of the substrate S to be processed.

Here, the crucible 22 containing the vapor deposition material 22a is installed in the evaporation source 20, and the hot wire device 24 is provided around the crucible 22 to supply electricity to the hot wire device 24. As a result, the heating wire is heated by resistance to emit a lot of radiant heat. The crucible 22 is heated by the radiant heat to evaporate the deposition material 22a therein.

On the other hand, in order to control the thickness of the thin film deposited on the substrate S to be processed, the shutter 30 is opened or closed between the feature substrate S and the evaporation source 20. That is, the shutter 30 is opened when the deposition material is deposited on the substrate S, and when the deposition material deposition is completed or suspended, the shutter 30 is closed so that the deposition material is no longer the substrate S. It is responsible for preventing the deposition on the surface.

Meanwhile, when the thin film is deposited on the substrate S in order to manufacture the organic light emitting device, a plurality of organic light emitting devices may be manufactured at the same time or a plurality of organic light emitting devices may be manufactured at the same time, but various kinds of deposition materials may be sequentially deposited. In order to achieve this, there is provided a cluster type deposition apparatus comprising one or more deposition chambers and a transfer chamber as one module.

The substrate to be processed is deposited in a state in which the substrate is bonded to the mask, and only the substrate to be processed is placed under the condition that the mask is set in the deposition chamber, and the substrate and the mask are put together in the deposition chamber outside the deposition chamber. And the like.

In any case, the substrate to be processed is generally introduced into the deposition chamber while being chucked to the support module to prevent sag.

There are several ways to set the substrate to be supported on the support module, one of which uses an adhesive plate, which is placed in the deposition chamber with the substrate to be fixed to the adhesive plate, in a high vacuum environment in the deposition chamber. The organic material is deposited on the substrate.

The method of chucking / dechucking a substrate to be processed using such an adhesive plate is increasingly required as the substrate is enlarged.

However, the method of chucking a supporting module, such as an adhesive plate, to a substrate to be processed and then dechucking the supporting module again after a deposition process in a deposition apparatus is very cumbersome, so that only individual substrates can be deposited. Only in this case, there was a problem that is difficult to apply to the mass production method of continuously depositing a plurality of substrates to be processed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an apparatus unit for chucking a substrate, a deposition unit for depositing a thin film on a substrate, and an apparatus unit for dechucking a substrate are organically connected to mass-produce an organic light emitting device. An object of the present invention is to provide an organic light emitting device mass production system having a chucking and dechucking device.

An organic light emitting device mass production system having a chucking and dechucking device unit according to the present invention for achieving the above object is a pre-treatment unit of the substrate to be processed; A chucking device unit for chucking the substrate to be processed transferred from the pretreatment unit with the chuck plate; A deposition unit performing a thin film deposition process on the chucking substrate transferred from the chucking unit; After dechucking the deposited chucking substrate transferred from the deposition unit, the processing substrate may be discharged to the outside and the separated chuck plate may include a dechucking device unit for transferring back to the chucking device unit.

Here, the pretreatment unit, a loading chamber for loading the substrate to be processed individually; One or more heating chambers for heating the substrate to be processed; The loading chamber and the heating chamber may be configured to include a transfer chamber for carrying in, out the substrate to be processed.

In particular, the loading chamber and the heating chamber are provided on a circumferential surface of the conveyance chamber, and a circumferential surface of the conveyance chamber is temporarily provided with a cooling chamber, a damaged substrate chamber into which a damaged substrate is to be loaded, and a substrate to be stacked. At least one of the storage chambers for storing may be further installed.

The chucking device may further include at least one chucking chamber into which the chuck plate is carried in or out, and chucks the substrate to be processed and the chuck plate transferred from the pretreatment unit; Preferably, the chucking chamber is provided at a circumferential surface thereof and includes a transfer chamber for carrying in and carrying out the chuck plate, the substrate to be processed, and the chucking substrate to the chucking chamber.

The deposition unit may include one or more deposition chambers for performing a thin film deposition process on the chucking substrate transferred from the chucking unit; More preferably, the deposition chamber is provided at a circumferential surface thereof and includes a transport chamber for carrying in and carrying out the chucking substrate to the deposition chamber.

In this case, it is preferable that at least one mask chamber for supplying a mask to the deposition chamber is provided on the transfer chamber circumferential surface of the deposition unit.

On the other hand, the chucking device and the deposition unit is connected by a buffer chamber, the buffer chamber is preferably provided with a first inverting portion for inverting the chucking substrate by 180 degrees.

The dechucking apparatus may further include one or more dechucking chambers for dechucking the deposited chucking substrate transferred from the deposition unit to a processing substrate and a chuck plate; The dechucking chamber may be installed at a circumferential surface thereof, and may include a transport chamber for carrying in and carrying out a chucking substrate or a dechucked processing substrate and a chuck plate into the dechucking chamber.

In this case, it is preferable that a spare chuck chamber in which an extra chuck plate is stacked is provided on the circumferential surface of the transfer chamber.

On the other hand, the deposition unit and the dechucking device unit is connected by a buffer chamber, the buffer chamber is preferably provided with a second inverting unit for inverting the deposited chucking substrate 180 degrees.

The dechucking device unit and the chucking device unit may be connected by a transfer line, and the chucking plate dechucked by the dechucking device unit may be sequentially transferred to the chucking device unit.

For reference, the one or more deposition chambers and the transfer chamber is composed of a single module, at least one module is provided, the modules are connected by a buffer chamber may be composed of a multi-stage module.

As described above, according to the organic light emitting device mass production system having the chucking and dechucking device unit according to the present invention, the substrate to be processed has been chucked with the chuck plate, the chucking substrate is inverted and the thin film deposition process in the deposition unit is performed. After the deposition, the deposited chucking substrate is inverted again and dechucked, and then the processing substrate is discharged to the outside and the chuck plate is organically continued so as to be chucked with the substrate to be processed again, thereby chucking and dechucking a large area. The effect of allowing mass production of the organic light emitting device is provided.

Figure 1 is a schematic diagram showing the internal configuration of a conventional thin film deposition equipment.
Figure 2 is a block diagram of an organic light emitting device mass production system having a chucking and dechucking device according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a block diagram of an organic light emitting device mass production system having a chucking and dechucking device according to the present invention.

As shown, the organic light emitting device mass production system 100 having the chucking and dechucking device unit according to the present invention includes a pretreatment unit 110 of the substrate to be processed.

The pretreatment unit 110 is configured to include a loading chamber 111 for loading each of the plurality of substrates to be processed, and a heating chamber 112 for heating the substrates to be loaded individually. .

Here, one or more heating chambers 112 may be installed. The loading chambers 111 and the heating chambers 112 may be installed on the circumferential surface of the transfer chamber 116 for carrying in and out of the substrate. consist of.

On the circumferential surface of the transfer chamber 116 of the pretreatment unit 110, a cooling chamber 113 for cooling the substrate to be processed, and a damaged substrate chamber 114 for carrying in the damaged substrate to be discharged to the outside, and accumulated A storage chamber 115 for temporarily storing a substrate to be processed may also be installed.

As such, the pretreatment unit 110 includes the transfer chamber 116, one or more heating chambers 112, a cooling chamber 113, a damaged substrate chamber 114, a storage chamber 115, a loading chamber 111, and the like. Is connected to the chucking device unit 120 by the buffer chamber 117.

The chucking device part 120 is a device part for chucking the chuck plate P conveyed from the dechucking device part 150 mentioned later and the to-be-processed substrate conveyed from the preprocessing part 110, The chuck plate P Is carried in and out, one or more chucking chambers 122 for chucking the substrate to be transferred from the pretreatment unit 110 and the chuck plate P, and the chucking chambers 122 are installed on the circumferential surface thereof, The chucking chamber 122 includes a chuck plate or a transfer chamber 124 for carrying in and out of the chuck plate and the chucking substrate.

Here, one or more chucking chambers 122 are also installed on the circumferential surface of the transfer chamber 124 to form a cluster type.

In this manner, the chucking device unit 120 including the transfer chamber 124 and the plurality of chucking chambers 122 is connected to the deposition unit 130 by the buffer chamber 126.

The buffer chamber 126 connecting the chucking device 120 and the deposition unit 130 is provided with a first inverter 128 for rotating the chucking substrate by 180 degrees.

That is, in the chucking device unit 120, the chucking is performed such that the substrate to be processed is positioned in the upper state while the chuck plate is placed in the lower portion, whereas in the deposition unit 130, the substrate to be processed is to be positioned in the lower portion, so that the chucking device unit The first chamber 128 is installed in the buffer chamber 126 connecting the 120 and the deposition unit 130 to invert the chucking substrate.

The deposition unit 130 includes a deposition chamber 132 for performing a thin film deposition process in a state in which the chucking substrate transferred from the chucking device unit 120 is bonded to a mask, and the deposition chamber 132 is installed on a circumferential surface thereof. And a transfer chamber 134 for carrying in and carrying out the chucking substrate to the deposition chamber 132.

Here, at least one deposition chamber 132 is also provided on the circumferential surface of the transfer chamber 134 to form a cluster type, and a mask is stored on the circumferential surface of the transfer chamber 134 and then masked by the deposition chamber 132. One or more mask chambers 136 may be installed.

As such, when the mask chamber 136 is installed, the chucking substrate and the mask may be simultaneously brought into the deposition chamber 132 into the deposition chamber 132, and the mask may be masked into the deposition chamber 132 regardless of the chucking substrate. Can also be loaded by loading in advance.

On the other hand, the cluster type deposition unit 130 having the configuration described above, the deposition chamber 132 and the transfer chamber 134 is composed of one module, at least one such module is provided, the modules are buffered Connected by a chamber (not shown) it can be configured as a multi-stage module.

When the module is configured in multiple stages, among the modules of the multiple stages, a circumferential side of the transfer chamber of the module located at the front end is connected to the buffer chamber 126 in which the chucking device unit 120 and the first reversing unit 128 are installed. On the periphery of the transfer chamber of the module located at the rear end, the chucking substrate on which deposition is finally completed is connected to the buffer chamber 140 provided with the dechucking device unit 150 and the second reversing unit 142 which will be described later.

As such, when the module is configured in multiple stages, it is very useful to deposit various kinds of deposition materials on a substrate to be processed.

For example, among the multi-stage modules, first and / or second deposition materials are deposited on any one of the substrates in the module located at the front end, and the second and next deposition materials are deposited in the module located at the rear end. And various kinds of deposition materials can be deposited.

For reference, in the exemplary embodiment of the present invention, the modules (organic light emitting device mass production cluster type deposition unit 130) are shown as being connected and installed by a plurality of buffer chambers, but the modules are a plurality of buffer chambers. Can be connected and installed in multiple stages.

On the other hand, when the deposition unit 130 is formed of a multi-stage module, the deposition unit 130 located at the rear end is connected to the dechucking device unit 150 by the buffer chamber 140 as described above.

In the buffer chamber 140 connecting the deposition unit 130 and the dechucking device unit 150, a second inverter 142 is rotated 180 degrees so that the deposited chucking substrate is inverted.

That is, in the deposition unit 130, the processing substrate is chucked so that the processing substrate is positioned at the lower state while the chuck plate is placed on the upper side, whereas in the dechucking device unit 150, the chuck plate and the processing substrate are dechucked to dechuck. Since the upper portion is located at the top, the second chamber 142 is installed in the buffer chamber 140 connecting the deposition unit 130 and the dechucking device unit 150 to invert the deposited chucking substrate.

The dechucking device unit 150 includes a dechucking chamber 152 for dechucking the processing substrate and the chuck plate from the deposited chucking substrate transferred from the deposition unit 130, and the dechucking chamber 152 has a circumferential surface thereof. It is installed in the, the dechucking chamber 152 is configured to include a conveying chamber 156 for carrying in and out the deposited chucking substrate or processing substrate or chuck plate.

Here, one or more dechucking chambers 152 may be installed. The dechucking chamber 152 may be installed on the circumferential surface of the transfer chamber 156 to form a cluster type.

A spare chuck chamber 154 for storing a plurality of chuck plates may also be installed on the circumferential surface of the transfer chamber 156 of the dechucking chamber 152.

Meanwhile, the dechucking device unit 150 and the chucking device unit 120 are connected to the transfer line 160, and the dechucking device unit 150 is dechucked with the processing substrate in the dechucking device unit 150 through the transfer line 160. The plate is transferred to the chucking device portion 120 for the next process.

Referring to the operational relationship of the organic light emitting device mass production system 100 having the chucking and dechucking device portion made of the above configuration as follows.

First, the substrates to be individually loaded through the loading chamber 111 of the pretreatment unit 110 are subjected to the pretreatment process through the heating chamber 112 and the cooling chamber 113 sequentially by the transfer chamber 116. Then, it is transferred to the chucking device unit 120 through the buffer chamber 117.

At this time, of the substrates subjected to the pretreatment by the transfer chamber 116, the damaged substrates are discharged to the outside through the damaged substrate chamber 114, and the substrates stacked during the pretreatment process are stored in the storage chamber. After the temporary loading into the 115, if the substrate to be loaded from the loading chamber 111 is missing or reduced, it is again taken out and subjected to a pretreatment process.

The pre-processed substrate is transferred to the chucking unit 120 by the buffer chamber 117, and the transfer chamber 124 of the chucking unit 120 transfers the substrate to each chucking chamber 122. Bring in.

In each chucking chamber 122, the chuck plate and the substrate to be processed are chucked, and the chucking substrate is transferred back to the deposition unit 130 through the buffer chamber 126. In this case, the chucking substrate is inverted by being rotated 180 degrees by the first inverter 128 installed in the buffer chamber 126, that is, the substrate to be processed is located below and the chuck plate is inverted. Are then transported.

As such, the chucking substrate that is inverted and transferred is carried into the deposition chamber 132 by the transfer chamber 134 of the deposition unit 130.

Here, the mask supplied from the mask chamber 136 is loaded in the deposition chamber 132, and the chucking substrate is deposited with the mask in a state where the thin film is deposited.

As described above, the deposition unit 130 may be configured as a multi-stage module, and may continuously perform the deposition process of various kinds of deposition materials. It is possible to deposit a large amount of the substrate to be processed.

The chucking substrate on which deposition is completed in the subsequent deposition unit 130 passes through the buffer chamber 140 and is transferred to the dechucking device unit 150. At this time, the chucking substrate which has been deposited by the second inverter 142 installed in the buffer chamber 140 is inverted by being rotated 180 degrees, that is, the processing substrate is positioned at the top and the chuck plate is inverted. Is then transported.

As such, the deposited chucking substrate transferred to the dechucking device unit 150 is carried into each dechucking chamber 152 by the transfer chamber 156, and the processing substrate is removed from the chuck plate in the dechucking chamber 152. Dechucking is carried out to the conveying chamber 156 again.

Accordingly, the transfer chamber 156 discharges the processed substrate after the deposition process is completed, and the chuck plate P is transferred back to the chucking device unit 120 through the transfer line 160, whereby chucking and dechucking are performed. Continuous production, or mass production, of the organic light emitting device is achieved.

At this time, when the process of dechucking in the dechucking chamber 152 is delayed and it is delayed to transfer the chuck plate P to the chucking device 120, the extra chuck plate loaded in the spare chuck chamber 154 is It may be taken out and transferred to the chucking device unit 120 through the transfer line 160.

For reference, in the exemplary embodiment of the present invention, the chuck plate in which the substrate is chucked or dechucked is applicable to any conventional chuck, such as an electrostatic chuck or an adhesive chuck.

Technical ideas described in the embodiments of the present invention as described above may be implemented independently, or may be implemented in combination with each other. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. It is possible. Accordingly, the technical scope of the present invention should be determined by the appended claims.

100: mass production system of organic light emitting device 110: pretreatment unit
111: loading chamber 112: heating chamber
113: cooling chamber 114: damaged substrate chamber
115: storage chamber 116: conveying chamber
117: buffer chamber 120: chucking device
122: chucking chamber 124: conveying chamber
126: buffer chamber 128: first semi-circular
130: deposition unit 132: deposition chamber
134: conveying chamber 136: mask chamber
140: buffer chamber 142: second semi-circuit
150 dechucking device unit 152 dechucking chamber
154: spare chuck chamber 156: conveying chamber
160: transfer line P: chuck plate

Claims (12)

A pretreatment unit of the substrate to be processed;
A chucking device unit for chucking the substrate to be processed transferred from the pretreatment unit with the chuck plate;
A deposition unit performing a thin film deposition process on the chucking substrate transferred from the chucking unit;
After dechucking the deposited chucking substrate transferred from the deposition unit, the chucking and dechucking device comprises a dechucking device unit for discharging the processed substrate to the outside and separating the chuck plate back to the chucking device unit. An organic light emitting device mass production system having a portion.
The method of claim 1,
The pre-
A loading chamber which individually loads the substrate to be processed;
One or more heating chambers for heating the substrate to be processed;
An organic light emitting device mass production system having a chucking and dechucking device, characterized in that it comprises a transfer chamber for carrying in and out of the substrate to be processed in the loading chamber and the heating chamber.
The method of claim 2,
The loading chamber and the heating chamber are installed on a circumferential surface of the transfer chamber, and a circumferential surface of the transfer chamber temporarily stores a cooling chamber, a damaged substrate chamber into which a damaged substrate is to be processed, and a stacked substrate to be stored. At least one of the storage chamber, the organic light emitting device mass production system having a chucking and dechucking device, characterized in that further installed.
The method of claim 1,
The chucking device unit,
At least one chucking chamber into which the chuck plate is loaded and unloaded, and which chucks the substrate to be processed and the chuck plate transferred from the pretreatment unit;
The chucking chamber is installed on the circumferential surface thereof, the organic light emitting device mass production system having a chucking and dechucking device portion, characterized in that it comprises a conveying chamber for carrying in and out of the chuck plate, the substrate to be processed, the chucking substrate to the chucking chamber. .
The method of claim 1,
The deposition unit,
At least one deposition chamber configured to perform a thin film deposition process on the chucking substrate transferred from the chucking unit;
The deposition chamber is installed on the circumferential surface, the organic light emitting device mass production system having a chucking and dechucking device portion, characterized in that it comprises a conveying chamber for carrying in and out the chucking substrate to the deposition chamber.
6. The method of claim 5,
At least one mask chamber for supplying a mask to the deposition chamber is provided on the circumferential surface of the transfer chamber of the deposition unit, the organic light emitting device mass production system having a chucking and dechucking device.
The method of claim 1,
The chucking device unit and the deposition unit are connected by a buffer chamber, and the buffer chamber is provided with a first inverting unit for inverting the chucking substrate by 180 degrees. .
The method of claim 1,
The dechucking device unit,
At least one dechucking chamber for dechucking the deposited chucking substrate transferred from the deposition unit to a processing substrate and a chuck plate;
The dechucking chamber is disposed on a circumferential surface thereof, the organic material having a chucking and dechucking device portion, characterized in that it comprises a conveying chamber for carrying in and out of the chucking substrate or dechucked processing substrate and the chuck plate. Light emitting device mass production system.
The method of claim 8,
And a spare chuck chamber in which an extra chuck plate is stacked on the circumferential surface of the transfer chamber.
The method of claim 1,
The deposition unit and the dechucking device unit are connected by a buffer chamber, and the buffer chamber is provided with a second inverting unit for inverting the deposited chucking substrate by 180 degrees. Device mass production system.
The method of claim 1,
The dechucking device part and the chucking device part are connected by a transfer line, and the chuck plate dechucked by the dechucking device part is sequentially transferred to the chucking device part. Device mass production system.
6. The method of claim 5,
The one or more deposition chambers and the transfer chamber is composed of one module, the module is provided with at least one, chucking and dechucking characterized in that the modules are connected by a buffer chamber is composed of a multi-stage module Organic light emitting device mass production system having a device unit.

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