TW201908064A - Device for grinding, polishing and/or cutting device an article - Google Patents

Abstract

A device for grinding, polishing and/or cutting an article comprising: a circular substrate; and a plurality of grinding particles disposed on a surface of the circular substrate, wherein a portion of each of the grinding particles protrude from the surface of the circular substrate; wherein the plurality of the grinding particles may be disposed on the surface of the circular substrate in a different arrangement as desired.

Description

Device for grinding, polishing and/or cutting articles

The present disclosure relates to devices that can be used to grind, polish, and/or cut articles. In particular, the present disclosure relates to specific alignment variations of abrasive particles for devices for grinding, polishing, and/or cutting articles.

In conventional grinding or cutting operations, the operator must select different coarse-grained grinding wheels or saw blades for different materials or different processing conditions (wherein the saw blade usually contains abrasive particles compared to a single surface grinding wheel). The two surfaces). At this point, the choice of grinding wheel / saw blade is a very important topic. For example, to achieve higher grinding efficiency, choose a grinding wheel with a coarse grain size; to achieve precision grinding and a finer surface of the object, choose a grinding wheel with a fine grain size. Moreover, if the contact area of the object is small, a grinding wheel having a fine particle size is selected; if the contact area of the object is large, a grinding wheel having a coarse grain size is selected. In other words, depending on the nature of the object, the purpose of the processing, the processing conditions, etc., it is necessary to select and replace different grinding wheels for processing. However, the process of selection and replacement is not only time consuming, but finding the right wheel/saw blade is even more difficult. Therefore, the conventional grinding wheel/saw blade has at least the following disadvantages: (1) the effect is not good; (2) it cannot be changed according to the conditions of different objects; (3) there is no regular arrangement of abrasive particles. Therefore, the conventional grinding wheel/saw blade has a severe limitation on the grinding effect and the grinding time.

Based on the above-mentioned problems of the prior art, it is necessary to provide an improved apparatus for grinding, polishing and/or cutting articles in the industry to achieve a multi-variable and efficient grinding, polishing and/or cutting operation. An embodiment of the present disclosure provides an apparatus for grinding, polishing, and/or cutting an object, comprising: a circular substrate; and a plurality of abrasive particles disposed on a surface of the circular substrate, wherein each A portion of the abrasive particles protrudes from the surface of the circular substrate; wherein the plurality of abrasive particles are disposed on the surface of the circular substrate in a different arrangement as needed. In an embodiment of the present disclosure, the circular substrate has a center, and the plurality of abrasive particles may be aligned from the center of the circle in a radial direction. In an embodiment of the present disclosure, the plurality of abrasive particles may form a plurality of circular arrangements in a concentric manner centering on the center of the circle. In an embodiment of the present disclosure, the plurality of abrasive particles may form an arrangement of a plurality of quadrangles around the center of the circle. In one embodiment of the present disclosure, the plurality of abrasive particles can form a plurality of hexagonal arrangements around the center of the circle. In an embodiment of the present disclosure, the plurality of abrasive particles may form an arrangement of a plurality of polygons around the center of the circle. In an embodiment of the present disclosure, the plurality of abrasive particles may be arranged in a straight line. In an embodiment of the present disclosure, the plurality of abrasive particles may be continuously arranged in a row or more along a circumference of one of the circular substrates. In one embodiment of the present disclosure, the plurality of abrasive particles may be arranged discontinuously in one row or more along a circumference of one of the circular substrates. In one embodiment of the present disclosure, the plurality of abrasive particles may be arranged in a row or more along a circumference of one of the circular substrates, and may be arranged in a line. In an embodiment of the present disclosure, the surface of the circular substrate may be divided into a plurality of regions by regular or irregular regions, and wherein the plurality of abrasive particles in the regions are arranged differently. In an embodiment of the present disclosure, the plurality of abrasive particles are disposed on the circular substrate at the same pitch. In an embodiment of the present disclosure, the plurality of abrasive particles are disposed on the circular substrate at different intervals. In one embodiment of the present disclosure, one of the plurality of abrasive particles is regularly disposed on the circular substrate at different intervals. In an embodiment of the present disclosure, the plurality of abrasive particles protrude from the same portion of the surface of the circular substrate to have the same height. In an embodiment of the present disclosure, the plurality of abrasive particles protrude from a height of the portion of the surface of the circular substrate. In an embodiment of the present disclosure, the portion of the plurality of abrasive particles protruding from the surface of the circular substrate regularly presents different heights. In an embodiment of the present disclosure, the plurality of abrasive particles comprise sharp abrasive particles, linear abrasive particles, and planar abrasive particles, wherein the sharp abrasive particles are the abrasive particles protruding from the circular substrate. The portion of the surface is configured to be in point contact with the article to be abraded, wherein the linear abrasive particles are configured such that the portion of the abrasive particle that protrudes from the surface of the circular substrate is configured such that And contacting the object to be ground in line, wherein the planar abrasive particle is such that the portion of the abrasive particle protruding from the surface of the circular substrate is configured to be in contact with the object to be ground Face contact. In one embodiment of the present disclosure, the ratio of the number of the pointed abrasive particles, the linear abrasive particles, and the planar abrasive particles to each other can be adjusted as needed. In one embodiment of the present disclosure, the pointed abrasive particles, the linear abrasive particles, and the planar abrasive particles may be disposed on the surface of the circular substrate in different arrangements. In one embodiment of the present disclosure, the linear abrasive particles can be configured to be in line contact with the article to be abraded in a different direction. In an embodiment of the present disclosure, the surface of the circular substrate may be divided into a plurality of regions by regular or irregular regions, and the pointed abrasive particles, the linear abrasive particles and the planar shape in each region The ratio of the number of abrasive particles to each other is different. In an embodiment of the present disclosure, the material of the plurality of abrasive particles comprises alumina, tantalum carbide, ceramic, diamond, and cubic boron nitride, and the shape, size, proportion, and material of the plurality of abrasive particles may be Adjustment. In one embodiment of the present disclosure, the plurality of abrasive particles are disposed in a stacked manner by a filler. In one embodiment of the present disclosure, the apparatus for grinding, polishing, and/or cutting an object further includes another set of plurality of abrasive particles disposed on the other surface of the circular substrate, wherein the other And constituting each of the plurality of abrasive particles to protrude from the other surface of the circular substrate; wherein the other plurality of abrasive particles may be disposed on the circular substrate in different arrangements as needed On the other surface. With the above arrangement, the apparatus of the present disclosure provides a variety of varied and efficient grinding, polishing and/or cutting operations.

Embodiments of the present disclosure, including various embodiments, are described in detail below with reference to the drawings. It should be noted that the content of the embodiments of the present invention is only used to illustrate one specific aspect of the disclosure, and is not intended to limit the scope of the disclosure. Figure 1 shows a top view of a first embodiment of the present disclosure. The first embodiment is a device 1 (such as a grinding wheel) for grinding an object (such as glass, diamond, sapphire, stone, building, wafer, etc.; not shown), which can be combined with a conventional fixed electric Grinding machines or hand-held electric grinders work together. The device 1 includes a circular substrate 10 (in another embodiment, the substrate can also be of any shape) and a plurality of abrasive particles 12. The abrasive particles 12 can be disposed on the surface 102 of the circular substrate 10 by adhesive, inlay, electroplating, sintering, or any fixed means. One portion of the abrasive particles 12 protrudes from the surface 102 of the circular substrate 10 for grinding, cutting, polishing or drilling with the object, and another portion of the abrasive particles 12 is bonded, inlaid, plated or sintered. It is fixed on the circular substrate 10. In another embodiment, the entirety of the abrasive particles 12 is projecting and secured to the circular substrate 10 (ie, not embedded in the circular substrate 10). The circular substrate 10 has a center C, and the abrasive particles 12 can be aligned from the center C in the radial direction D. Preferably, the abrasive particles 12 are based on conditions of different articles (such as hardness, texture, type, shape and size). Different configurations are provided on the surface 102 of the circular substrate 10. One of the focuses of the present disclosure is the "various variations" in the arrangement (contact area, arrangement and ratio) of the abrasive particles 12, as detailed below. [ Contact Area] Please refer to both FIG. 1 and FIG. 2, wherein FIG. 2 is a view that the abrasive particles 12 disposed on the surface 102 of the circular substrate 10 may be configured as sharp abrasive particles 121, linear abrasive particles 123 or The particles 125 are surface-polished. The term "pointed abrasive particles 121" means that the abrasive particles 12 disposed on the circular substrate 10 are partially protruded from the surface 102 of the circular substrate 10 to be in point contact with the object to be polished, wherein the protrusions are Portions of the surface 102 of the circular substrate 10 can be conical, pyramidal or any shape that is in point contact with the article. Further, regardless of the shape of the abrasive particles 12 that can be formed into the sharp abrasive particles 121, it only needs to be disposed to protrude from the surface 102 of the circular substrate 10 to be related to the object to be polished. In point contact, it is a pointed abrasive particle 121. Since the area of the sharp abrasive particles 121 in contact with the object is small, a finer and smaller range of grinding efficiency can be achieved. By linear abrasive particles 123 is meant that the abrasive particles 12 disposed on the circular substrate 10 are configured to protrude from the surface 102 of the circular substrate 10 to be in line contact with the article to be abraded. Further, regardless of the shape of the abrasive particles 12 that can be formed into the sharp abrasive particles 123, it only needs to be disposed to protrude from the surface 102 of the circular substrate 10 to be related to the object to be polished. In line contact, it is a linear abrasive particle 123. In particular, the linear abrasive particles 123 are directional, that is, the linear abrasive particles 123 may be configured such that they have line contact with the object to be ground in a different direction, in particular, the directionality may be Set or adjust. For example, the user can adjust the linear abrasive particles 123 in the region G2 to a specific direction. For example, the linear direction of the linear abrasive particles 123 can be adjusted to be parallel to the radial direction D of the circular substrate 10. Or, the linear direction of a portion of the linear abrasive particles 123 is adjusted to be offset from the radial direction D of the circular substrate 10 by 0 to 180 degrees (for example, 20 degrees) to achieve a specific desired abrasive effect. By the surface-grinding particles 125, the abrasive particles 12 disposed on the circular substrate 10 are partially protruded from the surface 102 of the circular substrate 10 to be in surface contact with the object to be polished, wherein the protrusions are The portion of the surface 102 of the circular substrate 10 may be rounded, embossed, or any shape that is in surface contact with the article. Further, regardless of the shape of the abrasive particles 12 that can be formed into the planar abrasive particles 125, they only need to be disposed to protrude from the surface 102 of the circular substrate 10 to be related to the object to be polished. In surface contact, it is a planar abrasive particle 125. The contact area of the planar abrasive particles 125 is large, so that a faster and wider range of polishing effects can be achieved. In general, the sharp abrasive particles 121 are suitable for use in cutting operations, while the linear abrasive particles 123 and the planar abrasive particles 125 are suitable for use in polishing and grinding operations. For purposes of the present disclosure, the ratio of the number of sharp abrasive particles 121, linear abrasive particles 123, and planar abrasive particles 125 can be adjusted as desired. In an embodiment, the ratio of the number of the sharp abrasive particles 121, the linear abrasive particles 123, and the planar abrasive particles 125 may be (but is not limited to) 3:1:6 or 3:2:5 or 6:4:0. . In addition, the sharp abrasive particles 121, the linear abrasive particles 123, and the planar abrasive particles 125 may be respectively disposed on different portions of the circular substrate 10 as needed; referring to FIG. 1, the surface 102 of the circular substrate 10 may be regularly Or irregular areas are divided into multiple areas G1, G2 and G3. The region G1 is provided with sharp abrasive particles 121, the region G2 is provided with linear abrasive particles 123, and the region G3 is provided with planar abrasive particles 125. Further, the ranges of the respective regions each having the sharp abrasive particles 121, the linear abrasive particles 123, and the planar abrasive particles 125 may vary depending on the conditions of different articles, for example, the region including the sharp abrasive particles 123 is placed close to each other. In the center C, the region including the planar abrasive grains 125 is disposed close to the circumference of the circular substrate 10 as the region G3, and the region including the linear abrasive particles 123 is disposed therebetween, so that the polishing on the circular substrate 10 is performed. The particles 12 have a regular change in contact area. Regarding the size of the abrasive particles 12, the plurality of abrasive particles 12 can be, but are not limited to, particles of 0.3 mm to 5 mm, and the particle shape can be circular, square, or any shape. In a preferred embodiment, the abrasive particles 12 can be, but are not limited to, circular particles of 0.5 mm. In one embodiment, the plurality of abrasive particles 12 can be configured such that they protrude from the surface 102 of the circular substrate 10 to the same height, such as, but not limited to, 0.5 mm. In another embodiment, the plurality of abrasive particles 12 can be configured such that the height of the portion of the surface 102 of the circular substrate 10 is different, for example, the abrasive particles 12 in the region G1 can be set such that they protrude The height of the portion of the surface 102 of the circular substrate 10 is, but not limited to, 0.5 mm, and the abrasive particles 12 in the region G2 may be disposed such that the height of the portion of the surface 102 of the circular substrate 10 is ( However, without limitation, 0.4 mm, the abrasive particles 12 in the region G3 may be disposed such that the height of a portion thereof protruding from the surface 102 of the circular substrate 10 is, but not limited to, 0.6 mm. In another embodiment, the plurality of abrasive particles 12 can be disposed such that they protrude from the surface 102 of the circular substrate 10 to "regularly" exhibit different heights, for example, a plurality of abrasive particles 12 can be The height of the portion protruding from the surface 102 of the circular substrate 10 gradually increases from the center C in the radial direction D, becomes smaller, or exhibits a gradual change in wave shape. Or, the height of a portion of the array of abrasive particles 12 protruding from the surface 102 of the circular substrate 10 is set to, but not limited to, 0.5 mm, and the abrasive particles 12 arranged adjacent to the circle protrude from the circular substrate 10. The height of the portion of the surface 102 is set to, but not limited to, 0.4 mm, i.e., the abrasive particles 12 arranged in the circle are arranged in a high circle, and the arrangement of the rings is low, and the height variation is exhibited by the specific rule. It should be emphasized that the regular height variations of the present disclosure can contribute to different grinding efficiencies. Regarding the material of the abrasive particles, the material of the abrasive particles 12 may comprise alumina, tantalum carbide, ceramic, diamond, and cubic boron nitride. Likewise, the ratio of the material of the abrasive particles 12 can be adjusted as needed. In addition, the shape, size, proportion, and material of the abrasive particles 12 can be adjusted or mixed as needed to exhibit different variations. [ Arrangement] The arrangement of the abrasive particles 12 on the surface 102 of the circular substrate 10 and the shape of the arrangement thereof may be varied as needed. Hereinafter, several abrasive grains 12 of the present disclosure are exemplarily illustrated in a circle. The arrangement of the surface 102 of the substrate 10 may be arranged. In fact, the arrangement of the abrasive particles 12 of the present disclosure may not be limited to those presented below, which may have other changed arrangement shapes according to the needs of the user. . Please refer to FIG. 1 to FIG. 9 at the same time. 1 shows a plan view of a first embodiment of the present disclosure, in which a plurality of abrasive particles 12 are formed in a concentric manner around a center C, forming a plurality of circular arrays E1, E2, etc. (for convenience of explanation, the arrays E1 and E2 are The arrangement of the abrasive particles 12, the figure does not indicate other repetitively arranged component symbols). The density of the arrangement of the abrasive particles 12 may gradually change from the center C in the radial direction D (becoming larger or smaller or in other regular variations), and may be disposed on the circular substrate 10 at different pitch variations. 3 shows a plan view of a second embodiment of the present disclosure, in which a plurality of abrasive particles 12 are formed in a concentric manner around a center C, forming a plurality of circular arrays M1, M2, and the like. 4 shows a top view of a third embodiment of the present disclosure, in which a plurality of abrasive particles 12 can form a plurality of quadrilateral arrangements N1, N2, etc. around the center C. Among them, the plurality of abrasive particles 12 may be disposed on the circular substrate 10 at the same pitch (for example, 5-10 mm). 5 shows a top view of a fourth embodiment of the present disclosure, in which a plurality of abrasive particles 12 can form a plurality of hexagonal arrangements P1, P2, etc. around the center C. In another embodiment, the plurality of abrasive particles 12 may form an arrangement of a plurality of polygons around the center C. The polygons may be, but are not limited to, a trigon, a pentagon, and an octagon (not shown). 6 shows a plan view of a fifth embodiment of the present disclosure, in which a plurality of abrasive particles 12 may be arranged in a straight line Q1, Q1', Q1'', and the like. The angle θ1 between the arrangement Q1 and the arrangement Q1' is 60 degrees, and the angle θ2 between the arrangement Q1' and the arrangement Q1'' is 60 degrees. Therefore, the abrasive particles 12 of the fifth embodiment substantially assume a radial star shape. 7 shows a plan view of a sixth embodiment of the present disclosure, in which a plurality of abrasive particles 12 are continuously arranged in a row or rows (eg, three rows) of S1, S2, etc. along the circumference of the circular substrate 10. That is, the abrasive particles 12 of the sixth embodiment substantially abut against the circumference of the circular substrate 10. 8 shows a top view of a seventh embodiment of the present disclosure, in which a plurality of abrasive particles 12 may be discontinuously arranged in one or more rows (eg, three rows) of T1, T2, etc. along one circumference of the circular substrate 10. Briefly, the seventh embodiment removes the partially ground particles 12 of the sixth embodiment to form discontinuous alignments T1, T2, and the like. 9 is a plan view showing an eighth embodiment of the present disclosure, in which a plurality of abrasive particles 12 may be arranged in a row or more rows along the circumference of one of the circular substrates 10, X1, X2, etc., and may be arranged in a straight line, Y1, Y2, etc. . In brief, the eighth embodiment is a combination of the fifth embodiment and the sixth embodiment. It should be noted that the pitch, density, height, size and number of the abrasive particles 12 of FIGS. 1 , 3 to 9 can be varied in a specific manner, for example, the number of abrasive particles 12 gradually decreases from the center C in the radial direction D. . Further, as described above, the variations in the number and proportion of the sharp abrasive particles 121, the linear abrasive particles 123, and the planar abrasive particles 125 are applicable to the apparatus 1 of FIGS. 3 to 9. [ Laminated Grinding Particles] The embodiments of FIGS. 1 to 9 can also be fabricated as laminated abrasive particles. Referring to a partial cross-sectional view of the circular substrate 10 shown in FIG. Specifically, after the abrasive particles 12 are used a plurality of times, there is a possibility of wear and fall off. In order to achieve long-term use of the apparatus for grinding, polishing and/or cutting articles of the present disclosure without periodically updating the abrasive particles 12, the circular substrate 10 of the present disclosure is provided with abrasive particles 12 in a stacked manner, as shown in FIG. The particles may be disposed in a stacked manner on the first layer 131, the second layer 132, and the third layer 133, respectively, wherein the abrasive particles 12 of the different layers are fixed by a filler 134 (for example, an organic material). In this way, if the surface of the abrasive particles 12 is passivated and detached after repeated use, the underlying abrasive particles 12 immediately adjacent to the surface abrasive particles 12 can be exposed on the surface 102 of the circular substrate 10 as a basis for subsequent abrasive polishing. For example, if the abrasive particles 12 disposed on the first layer 131 are passivated and detached after being used multiple times, the abrasive particles 12 of the second layer 132 may be between the first layer 131 and the second layer 132. After the filler 134 is abraded, it is exposed on the surface 102 of the circular substrate 10, and further serves as a basis for the subsequent polishing and polishing. Similarly, if the abrasive particles 12 disposed in the second layer 132 are used repeatedly, passivation and shedding Then, the abrasive particles 12 of the third layer 133 can be exposed on the surface 102 of the circular substrate 10 after the filler 134 between the second layer 132 and the third layer 133 is worn, and then used as a subsequent polishing and polishing. Cutting basis. [ Double-side grinding , polishing , cutting device] The above devices can be used for grinding, polishing and cutting. In order to further improve the efficiency of the grinding and polishing cutting operation (especially the efficiency of the cutting operation), the other surface of the circular substrate of the device for polishing, polishing and/or cutting the object of the present disclosure may be provided with another plurality of surfaces. The abrasive particles (not shown), that is, the two surfaces (front and back) of the circular substrate are provided with abrasive particles. As such, when the device for grinding, polishing, and/or cutting the article is in contact with the surface of the article at an angle (eg, 90 degrees), two of the circular substrates of the device for grinding, polishing, and/or cutting the article Surfaces can be ground, polished and cut with objects. Another configuration of the plurality of abrasive particles of the other surface of the circular substrate may be arranged in accordance with the arrangement of the abrasive particles 12 of the embodiment of FIGS. 1 to 9 and will not be described again. It should be understood that the present disclosure is not limited to the specific structures or arrangements disclosed herein. It is understood by those of ordinary skill in the art that, in light of the present disclosure, the structures and arrangements disclosed herein are to some extent It can be changed or replaced. It is also to be understood that the terms of the description and the description of the invention are intended to And its equivalent setting is limited.

1‧‧‧ device

10‧‧‧Circular substrate

12‧‧‧Abrasive particles

102‧‧‧ surface

121‧‧‧ pointed abrasive particles

123‧‧‧Wire-shaped abrasive particles

125‧‧‧Surface abrasive particles

131‧‧‧ first floor

132‧‧‧ second floor

133‧‧‧ third floor

134‧‧‧Filling

C‧‧‧ Center

D‧‧‧ radial direction

E1, E2, M1, M2, N1, N2‧‧‧

G1, G2, G3‧‧‧ areas

P1, P2, Q1, Q1', Q1'', S1, S2‧‧‧

T1, T2, X1, X2, Y1, Y2‧‧‧

Θ1, θ2‧‧‧ angle

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the disclosure in any way. Figure 1 shows a top view of a first embodiment of the present disclosure. 2 shows a schematic view of the pointed abrasive particles, linear abrasive particles, and planar abrasive particles. Figure 3 shows a top view of a second embodiment of the present disclosure. Figure 4 shows a top view of a third embodiment of the present disclosure. Figure 5 shows a top view of a fourth embodiment of the present disclosure. Figure 6 shows a top view of a fifth embodiment of the present disclosure. Figure 7 shows a top view of a sixth embodiment of the present disclosure. Figure 8 shows a top view of a seventh embodiment of the present disclosure. Figure 9 shows a top view of an eighth embodiment of the present disclosure. Figure 10 shows a partial cross-sectional view of the circular substrate of the present disclosure.

Claims (25)

An apparatus for grinding, polishing, and/or cutting an object, comprising: a circular substrate; and a plurality of abrasive particles disposed on a surface of the circular substrate, wherein portions of each of the abrasive particles are protruded from The surface of the circular substrate; wherein the plurality of abrasive particles can be disposed on the surface of the circular substrate in different arrangements as needed. The apparatus of claim 1, wherein the circular substrate has a center, and the plurality of abrasive particles are aligned from the center of the circle in a radial direction. The device of claim 2, wherein the plurality of abrasive particles are centered on the center of the circle to form a plurality of circular arrangements in a concentric manner. The device of claim 2, wherein the plurality of abrasive particles form an arrangement of a plurality of quadrangles around the center of the circle. The device of claim 2, wherein the plurality of abrasive particles form an arrangement of a plurality of hexagons around the center. The device of claim 2, wherein the plurality of abrasive particles form an arrangement of a plurality of polygons around the center of the circle. The device of claim 1, wherein the plurality of abrasive particles are arranged in a straight line. The device of claim 1, wherein the plurality of abrasive particles are continuously arranged in a row or more along a circumference of one of the circular substrates. The device of claim 1, wherein the plurality of abrasive particles are arranged discontinuously in one row or more along a circumference of one of the circular substrates. The device of claim 1, wherein the plurality of abrasive particles are arranged in a row or more along a circumference of one of the circular substrates, and may be arranged in a line. The device of claim 1, wherein the surface of the circular substrate is divided into a plurality of regions by regular or irregular regions, and wherein the plurality of abrasive particles in the regions are arranged differently. The device of claim 1, wherein the plurality of abrasive particles are disposed on the circular substrate at the same pitch. The device of claim 1, wherein the plurality of abrasive particles are disposed on the circular substrate at different pitches. The device of claim 1, wherein one of the plurality of abrasive particles is regularly disposed on the circular substrate at different intervals. The device of claim 1, wherein the plurality of abrasive particles protrude from the portion of the surface of the circular substrate at the same height. The device of claim 1, wherein the plurality of abrasive particles protrude from a height of the portion of the surface of the circular substrate. The device of claim 1, wherein the portion of the plurality of abrasive particles that protrude from the surface of the circular substrate regularly exhibits different heights. The apparatus of claim 1, wherein the plurality of abrasive particles comprise sharp abrasive particles, linear abrasive particles, and planar abrasive particles, wherein the sharp abrasive particles are the surface of the abrasive particles protruding from the circular substrate The portion is configured to be in point contact with the article to be abraded, wherein the linear abrasive particles are configured such that the portion of the abrasive particle that protrudes from the surface of the circular substrate is configured to In line contact with the article to be ground, wherein the planar abrasive particle is such that the portion of the abrasive particle protruding from the surface of the circular substrate is configured to face the object to be polished contact. The apparatus of claim 18, wherein the ratio of the number of the pointed abrasive particles, the linear abrasive particles, and the planar abrasive particles to each other is adjusted as needed. The device of claim 18, wherein the pointed abrasive particles, the linear abrasive particles, and the planar abrasive particles are respectively disposed on the surface of the circular substrate in a different arrangement. The device of claim 18, wherein the linear abrasive particles are conformable such that they are in line contact with the article to be abraded in a different direction. The device of claim 18, wherein the surface of the circular substrate is divided into a plurality of regions by regular or irregular regions, and wherein the pointed abrasive particles, the linear abrasive particles, and the planar polishing in each region The ratio of the number of particles to each other is different. The device of claim 1, wherein the material of the plurality of abrasive particles comprises alumina, tantalum carbide, ceramic, diamond and cubic boron nitride, and the shape, size, proportion and material of the plurality of abrasive particles can be adjusted as needed . The device of claim 1, wherein the plurality of abrasive particles are disposed in a stacked manner by a filler. The apparatus of claim 1, further comprising: another set of plurality of abrasive particles disposed on the other surface of the circular substrate, wherein a portion of each of the other plurality of abrasive particles protrudes from The other surface of the circular substrate; wherein the other plurality of abrasive particles are disposed on the other surface of the circular substrate in a different arrangement as needed.