TW201826439A - Wafer supporting device and wafer processing device preventing the invasion of chemical liquid into a table, and the sputtering caused by wafer slip - Google Patents
Wafer supporting device and wafer processing device preventing the invasion of chemical liquid into a table, and the sputtering caused by wafer slip Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
Description
本發明關於晶圓支承裝置以及晶圓處理裝置。The present invention relates to a wafer support device and a wafer processing device.
在供給藥液至晶圓的表面並同時使晶圓旋轉的旋轉洗淨處理等的單片式的濕式處理中，使用的是能支承晶圓並同時使晶圓旋轉的晶圓支承裝置（參考專利文獻1）。例如，如圖6所示地，一般的晶圓支承裝置101具備有桌台104，其中桌台104係由支承晶圓W於上方的上桌台102、及自下方支撐上桌台的桌台本體103所構成。In a single-chip wet process such as a spin cleaning process that supplies a chemical solution to the surface of a wafer and rotates the wafer at the same time, a wafer support device (which supports the wafer and rotates the wafer at the same time) is used ( Refer to Patent Document 1). For example, as shown in FIG. 6, a general wafer supporting apparatus 101 includes a table 104. The table 104 is an upper table 102 that supports the wafer W above and a table that supports the upper table from below. The main body 103 is composed.
再者，晶圓支承裝置101於上桌台102的上表面，具備能自側面支承晶圓W的複數支夾持銷105。此些複數支夾持銷105如圖7的俯視圖所示地以圍繞晶圓W的方式而配置。再者，複數支夾持銷105分別由夾持銷旋轉機構106自下方支撐，且藉由夾持銷旋轉機構106自轉的情形下夾持栓105在夾持銷旋轉機構106的自轉軸的周圍公轉的方式而偏心地設置。藉此公轉，複數支夾持銷105接觸晶圓W的側面而得以支承晶圓W的側面，並藉由使夾持銷旋轉機構106逆向旋轉，令夾持銷105與晶圓W為非接觸狀態，而得以放開晶圓W。另外，夾持銷旋轉機構106如圖6所示地，能為具有與傳達動力的圓環狀傳動齒輪107的外齒相嚙合的夾持驅動齒輪108的機構。在此般機構中，傳動齒輪107的旋轉透過夾持驅動齒輪108傳遞而使夾持銷旋轉機構106自轉。In addition, the wafer supporting device 101 includes a plurality of holding pins 105 on the upper surface of the upper table 102 that can support the wafer W from the side. The plurality of clamping pins 105 are arranged so as to surround the wafer W as shown in a plan view of FIG. 7. Furthermore, the plurality of clamping pins 105 are supported by the clamping pin rotation mechanism 106 from below, and the clamping pin 105 is around the rotation axis of the clamping pin rotation mechanism 106 when the clamping pin rotation mechanism 106 rotates. The way of revolution is set eccentrically. By this revolution, the plurality of clamping pins 105 contact the side surface of the wafer W to support the side surface of the wafer W, and the clamping pin rotation mechanism 106 is rotated in the reverse direction to make the clamping pin 105 and the wafer W non-contact. State, and the wafer W can be released. In addition, as shown in FIG. 6, the clamp pin rotation mechanism 106 can be a mechanism having a clamp drive gear 108 that meshes with the external teeth of a ring-shaped transmission gear 107 that transmits power. In such a mechanism, the rotation of the transmission gear 107 is transmitted through the clamp driving gear 108 to cause the clamp pin rotation mechanism 106 to rotate.
然後，在旋轉洗淨處理等的製程處理時，透過支承晶圓W並同時使桌台104以桌台支撐軸109來旋轉，而得以在使所支承的晶圓W旋轉的同時進行洗淨處理。 ［先前技術文獻］ ［專利文獻］Then, during a process such as a spin cleaning process, the wafer W is supported and the table 104 is rotated by the table support shaft 109 at the same time, so that the supported wafer W can be cleaned while being rotated. . [Prior Art Literature] [Patent Literature]
［專利文獻1］日本特開2002-367946號公報[Patent Document 1] Japanese Patent Laid-Open No. 2002-367946
［發明所欲解決之問題］ 在如圖6這樣一般的晶圓支承裝置101中，無論如何在夾持銷105部分的封口構造都有著弱點，有著洗淨液等藥液侵入桌台的內部而使機構的金屬零件腐蝕的故障發生的問題。[Problems to be Solved by the Invention] In a general wafer supporting device 101 as shown in FIG. 6, the sealing structure of the clamping pin 105 part has a weak point no matter, and a medicinal solution such as a cleaning solution penetrates into the interior of the table. Problems that cause corrosion of metal parts of the mechanism occur.
如圖8所示，這是由於挾持銷旋轉機構106穿透上桌台102，並與夾持銷105連接，導致上桌台102存在穿透孔，藥液自此穿透孔而侵入桌台104的內部之故。其結果，不只必須頻繁的裝置維護導致高成本，也為處理的晶圓品質帶來壞影響。As shown in FIG. 8, this is because the holding pin rotation mechanism 106 penetrates the upper table 102 and is connected to the clamping pin 105, resulting in a penetration hole in the upper table 102, and the medicinal solution penetrates the table from the hole. The internal cause of 104. As a result, not only must frequent device maintenance lead to high costs, but also a bad influence on the quality of the processed wafers.
再者，在如圖6這樣的一般的晶圓支承裝置101中，所有的夾持銷旋轉機構106與一個傳動齒輪107相嚙合。故，以同心圓狀配置的複數支夾持銷105的同心圓的真圓度的調整非常重要。亦即，若在真圓度低，複數支夾持銷105之中那怕有一支先接觸到晶圓W的側面的情況下，該時間點起傳動齒輪107的自轉便會受阻礙，除了已接觸的夾持銷以外的其他仍未到達恰當的夾持位置的夾持銷的公轉移動亦會受阻礙。Furthermore, in a general wafer support device 101 as shown in FIG. 6, all the clamping pin rotation mechanisms 106 mesh with one transmission gear 107. Therefore, it is very important to adjust the roundness of the concentric circles of the plurality of clamp pins 105 arranged in a concentric circle. That is, if the roundness is low, even if one of the plurality of clamping pins 105 first contacts the side of the wafer W, the rotation of the transmission gear 107 will be hindered from that point of time, except that Orbital movement of the clamping pin other than the contacting clamping pin, which has not reached the proper clamping position, is also hindered.
其結果，便是無法產生夾持銷105本來的支承壓力，使晶圓W的支承產生不平衡。在此狀態下，若於濕式處理時使桌台旋轉，以複數支夾持銷105所支承的晶圓W會發生空轉的晶圓滑移，如此一來便會有發生藥液噴濺的問題。一旦發生藥液噴濺，便會發生例如，在旋轉洗淨處理之中晶圓W的洗淨不良等狀況。實際上要讓同心圓為真圓相當困難，習知上有著發生藥液噴濺的問題。As a result, the original supporting pressure of the clamping pin 105 cannot be generated, and the wafer W is unbalancedly supported. In this state, if the table is rotated during wet processing, the wafer W supported by the plurality of clamping pins 105 will slip and slip, and as a result, chemical liquid splashes may occur. problem. When the chemical liquid is sprayed, for example, the wafer W is not cleaned well during the spin cleaning process. In fact, it is quite difficult to make the concentric circles true circles, and there is a problem in that the spray of the liquid medicine occurs.
鑒於前述這樣的問題，本發明的目的在於提供一種晶圓支承裝置以及晶圓處理裝置，能防止藥液對桌台內部的侵入，再者，能防止因晶圓滑移所產生的噴濺。 ［解決問題之技術手段］In view of the foregoing problems, an object of the present invention is to provide a wafer support device and a wafer processing device, which can prevent the intrusion of a chemical solution into the inside of a table, and furthermore, can prevent splashing due to wafer slippage. [Technical means to solve problems]
為了達成上述目的，本發明提供一種晶圓支承裝置，係水平地支承晶圓，並使所支承的該晶圓旋轉，該晶圓支承裝置包含：桌台，包括將該晶圓支承於上方的上桌台以及自下方支撐該上桌台的桌本體；複數支夾持銷，於該上桌台的上表面以圍繞該晶圓的方式而配置，且得以與該晶圓的側面接觸，自側面支承該晶圓；以及桌台支撐軸，自下方支撐該桌台，得以使該桌台旋轉，其中該夾持銷相對於回轉軸而偏心地立設於可旋轉的夾持從動部之上，該夾持從動部收納在該上桌台的內部，且於內部收納有磁鐵，該夾持從動部按照夾持驅動部的旋轉，根據磁鐵間的引力而依循旋轉，該夾持驅動部係與該夾持從動部非接觸地收納在對應於該桌台本體內的該夾持從動部的下方的位置，藉由該夾持從動部依循該夾持驅動部的旋轉而旋轉，偏心地設置在該夾持從動部的複數支夾持銷以接觸該晶圓的側面的方式，繞該夾持從動部的回轉軸公轉移動，而自側面支承該晶圓。In order to achieve the above object, the present invention provides a wafer supporting device for horizontally supporting a wafer and rotating the supported wafer. The wafer supporting device includes a table including a table supporting the wafer above. An upper table and a table body supporting the upper table from below; a plurality of clamping pins are arranged on the upper surface of the upper table so as to surround the wafer, and can be in contact with the side of the wafer, since The wafer is supported on the side; and a table support shaft supports the table from below, so that the table can be rotated, wherein the clamping pin is eccentrically disposed on the rotatable clamping follower relative to the rotation axis. In the above, the clamping follower is housed inside the table, and a magnet is stored therein. The clamping follower rotates in accordance with the rotation of the clamping drive section and according to the attraction between the magnets. The driving unit is housed in a non-contact position with the clamping follower at a position corresponding to the lower portion of the clamping follower within the table body, and the clamping follower follows the rotation of the clamping drive by Rotate and set eccentrically on this clamping follower A plurality of support holding the contact pin in a side surface of the wafer, the clamping of the driven around the rotary shaft portion of the revolving movement of the self-supporting side wafer.
如此一來，藉由夾持從動部被收納於上桌台的內部，且夾持驅動部以與該夾持從動部非接觸地收納於桌台本體內，夾持銷與夾持從動部與桌台本體的內部隔絕，故不必如習知般於上桌台設置穿透孔，而得以防止藥液對桌台的內部、特別是對驅動部的侵入。再者，由於直接支撐夾持銷的夾持從動部係以與夾持驅動部非接觸地，透過磁鐵間的引力所驅動，機械性地分隔開之故，即便一部分的夾持銷比其它夾持銷更早接觸晶圓，也不會阻礙其它夾持銷的夾持驅動部及夾持從動部的旋轉，所有的夾持銷皆能移動至恰當的夾持位置，平衡良好地支承晶圓。故，能防止晶圓滑移，並防止噴濺。In this way, the clamping follower is stored inside the table top, and the clamping driving part is stored in the table body without contact with the clamping follower, and the clamping pin and the clamping follower The part is isolated from the inside of the table body, so it is not necessary to provide a penetration hole in the upper table as is conventional, so that the intrusion of the medicinal solution into the inside of the table, especially the driving part can be prevented. Furthermore, the clamping follower directly supporting the clamping pin is mechanically separated by being driven by the attraction force between the magnets without contact with the clamping driving portion. Other clamping pins contact the wafer earlier, and it will not hinder the rotation of the clamping driving part and the clamping follower of other clamping pins. All the clamping pins can be moved to the proper clamping position, which is well balanced. Support wafer. Therefore, the wafer can be prevented from slipping and splashing can be prevented.
此時，本發明的晶圓支承裝置，以於該桌台內具備能制動該夾持驅動部的旋轉的制動機構更佳。In this case, it is more preferable that the wafer supporting device of the present invention is provided with a braking mechanism capable of braking the rotation of the grip driving unit in the table.
若具備如此的制動機構，即能防止非本意的夾持驅動部的旋轉，例如，因開始桌台旋轉時的加速時或停止桌台旋轉時的減速時的離心力等所導致者。因此，得以將所有的夾持銷固定於正確的夾持位置，確實地防止噴濺。If such a braking mechanism is provided, it is possible to prevent an unintended rotation of the grip driving unit, for example, due to centrifugal force during acceleration when starting the rotation of the table or deceleration when stopping the rotation of the table. Therefore, all the clamping pins can be fixed in the correct clamping position, and splashing can be reliably prevented.
再者，此時該夾持驅動部，以具有與配設於該桌台本體內的傳動齒輪相嚙合的夾持驅動齒輪，藉由該傳動齒輪的旋轉令該夾持驅動齒輪旋轉，而使該夾持驅動部旋轉為佳。Moreover, at this time, the grip driving unit has a grip driving gear that meshes with a transmission gear arranged in the table body, and the grip driving gear is rotated by the rotation of the transmission gear, so that the grip driving gear is rotated. It is preferable that the grip driving portion rotates.
本發明的晶圓支承裝置能如此地使夾持驅動部旋轉，沒有因藥液等的侵入而導致腐蝕等的疑慮。The wafer support device of the present invention can rotate the chuck driving unit in this manner, and there is no doubt that corrosion or the like is caused by the intrusion of a chemical solution or the like.
再者，以該傳動齒輪具有孔洞，且該制動機構藉由制動銷穿入至該傳動齒輪的孔洞，而固定該傳動齒輪，制動該夾持驅動部的旋轉者為佳。Furthermore, it is preferable that the transmission gear has a hole, and the braking mechanism penetrates the hole of the transmission gear through a braking pin to fix the transmission gear and brake the rotation of the clamping and driving portion.
若為如此者，能簡單並且確實地防止傳動齒輪非本意的旋轉，如此一來，即能制動夾持驅動部與夾持從動部的自轉、及夾持銷的非本意的公轉。If this is the case, unintentional rotation of the transmission gear can be simply and surely prevented. In this way, the rotation of the clamping driving portion and the clamping driven portion, and the unintentional revolution of the clamping pin can be braked.
再者，為了達成上述目的，本發明提供了一種晶圓處理裝置，具有腔室，其中上述之晶圓支承裝置的該桌台係容納在腔室的內部。Furthermore, in order to achieve the above object, the present invention provides a wafer processing apparatus having a chamber, wherein the table of the wafer supporting apparatus described above is housed inside the chamber.
若為根據本發明的晶圓支承裝置的桌台而支承旋轉晶圓者，即能成為不易發生對該上桌台內的藥液侵入以及晶圓滑移的晶圓處理裝置。A person who supports a rotating wafer for the table of the wafer supporting apparatus according to the present invention can be a wafer processing apparatus that is less prone to ingress of chemical liquid into the upper table and slippage of the wafer.
再者，該晶圓處理裝置以單片旋轉式的濕式處理裝置為佳。The wafer processing apparatus is preferably a single-chip rotary wet processing apparatus.
本發明的晶圓處理裝置，適用於單片旋轉式的濕式處理。The wafer processing apparatus of the present invention is suitable for a single-chip rotary wet processing.
再者，該晶圓處理裝置以晶圓的洗淨處理裝置、旋轉蝕刻處理裝置、旋轉塗覆處理裝置、光阻剝離處理裝置及聚合物移除處理裝置中任一者為佳。The wafer processing apparatus is preferably any one of a wafer cleaning process apparatus, a spin etching process apparatus, a spin coating process apparatus, a photoresist peeling process apparatus, and a polymer removal process apparatus.
本發明的晶圓處理裝置，具體來說，特別適用於這些類型的處理。 ［對照先前技術之功效］The wafer processing apparatus of the present invention is particularly suitable for these types of processing. [Contrast with the effect of the prior art]
若為本發明的晶圓支承裝置以及晶圓處理裝置，即能防止藥液對桌台內部的侵入，且能實現降低維護的頻繁程度所帶來的低成本化以及裝置壽命的長期化的企圖，並同時亦能防止對所支承之晶圓的汙染。再者，能防止基於晶圓支承不良的晶圓滑移所產生的噴濺，並同時亦能防止因晶圓滑移而與上桌台或夾持物摩擦所產生的晶圓的傷痕的發生。According to the wafer supporting device and the wafer processing device of the present invention, it is possible to prevent the intrusion of the chemical liquid into the table, and to reduce the cost of maintenance and the long-term life of the device. At the same time, it can also prevent the contamination of the supported wafer. Furthermore, it is possible to prevent splashing caused by wafer slip due to poor wafer support, and at the same time to prevent the occurrence of scratches on the wafer due to wafer slip caused by friction with an upper table or a holder.
以下，將說明本發明的實施方式，但本發明不限於此。Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.
首先，將對本發明的晶圓支承裝置做說明。本發明的晶圓支承裝置，能水平地支承晶圓，並使所支承的該晶圓旋轉。如圖1所示，本發明的晶圓支承裝置1具備桌台4，該桌台4係由將晶圓W支承於上方的上桌台2、及自下方支撐上桌台2的桌台本體3所構成。再者，此桌台4係藉由能使桌台4旋轉的桌台支撐軸9自下方支撐。First, the wafer supporting apparatus of the present invention will be described. The wafer supporting device of the present invention can horizontally support a wafer and rotate the supported wafer. As shown in FIG. 1, the wafer support device 1 of the present invention includes a table 4 which is an upper table 2 that supports a wafer W above and a table body that supports the upper table 2 from below. 3 composition. The table 4 is supported from below by a table support shaft 9 capable of rotating the table 4.
再者，晶圓支承裝置1於上桌台2的上表面，具備能接觸晶圓W的側面，並支承晶圓W的側面的複數支夾持銷5。這些複數支夾持銷5如圖2的晶圓支承裝置1的俯視圖所示地，以圍繞晶圓W的方式而配置。The wafer supporting device 1 includes a plurality of clamping pins 5 on the upper surface of the upper table 2 and capable of contacting the side surface of the wafer W and supporting the side surface of the wafer W. As shown in the plan view of the wafer support device 1 of these wafer holding devices 1, these plural clamping pins 5 are arranged so as to surround the wafer W.
再者，如圖1、2，夾持銷5相對於夾持從動部11的回轉軸而偏心地立設於可旋轉的夾持從動部11之上。再者，在本發明中，夾持從動部11被收納於上桌台2的內部。此外，夾持從動部11內部收納有從動側的磁鐵12。Further, as shown in FIGS. 1 and 2, the clamping pin 5 is eccentrically disposed on the rotatable clamping driven portion 11 with respect to the rotation axis of the clamping driven portion 11. Furthermore, in the present invention, the clamping follower 11 is housed inside the table top 2. A driven-side magnet 12 is housed inside the clamped driven portion 11.
於對應於桌台本體3內的夾持從動部11的下方的位置，以與夾持從動部11非接觸地收納有夾持驅動部13。再者，於夾持驅動部13的內部收納有驅動側的磁鐵14。藉由此驅動側的磁鐵14與從動側的磁鐵12之間的引力，夾持從動部11會依循夾持驅動部13的旋轉而旋轉。A grip driving portion 13 is housed at a position corresponding to a position below the gripping follower 11 in the table body 3 so as to be non-contact with the gripping follower 11. In addition, a driving-side magnet 14 is housed inside the clamp driving unit 13. Due to the attractive force between the drive-side magnet 14 and the driven-side magnet 12, the clamp driven portion 11 rotates in accordance with the rotation of the clamp drive portion 13.
再者，關於夾持驅動部13的旋轉，雖然並無特別限制，例如，若夾持驅動部13為具有與配設於桌台本體3內的傳動齒輪7相嚙合的夾持驅動齒輪者，藉由該傳動齒輪7的旋轉，夾持驅動齒輪8旋轉，而使該夾持驅動部13旋轉。In addition, although the rotation of the grip driving portion 13 is not particularly limited, for example, if the grip driving portion 13 is a grip driving gear that has a transmission gear 7 disposed in the table body 3, By the rotation of the transmission gear 7, the clamp driving gear 8 is rotated, and the clamp driving portion 13 is rotated.
然後，藉由夾持驅動部13的旋轉所導致之夾持從動部11的旋轉，偏心地立設於夾持從動部11的夾持銷5以接觸晶圓W的側面的方式，繞夾持從動部11的回轉軸公轉移動，而自側面支承晶圓W。Then, the rotation of the clamping follower 11 caused by the rotation of the clamping driving section 13 causes the clamping pin 5 eccentrically set on the clamping follower 11 to be wound around the side of the wafer W so as to contact the side of the wafer W. The rotation axis of the clamped follower 11 is revolved, and the wafer W is supported from the side.
如此一來，藉由利用驅動側的磁鐵14與從動側的磁鐵12的磁力進行夾持銷5的公轉驅動，夾持從動部11與夾持驅動部13得以達到非接觸，而不必使其機械性地接觸。因此，本發明中，如圖3，夾持從動部11收納在上桌台2的內部，夾持驅動部13收納在桌台本體3的內部，夾持從動部11與夾持銷5能相對於桌台4的內部而隔絕，故不必擔心藥液會侵入至桌台4的內部，特別是驅動部。In this way, by using the magnetic force of the magnet 14 on the driving side and the magnet 12 on the driven side to drive the revolution of the clamping pin 5, the clamping driven portion 11 and the clamping driving portion 13 can be brought into non-contact without having to make It makes mechanical contact. Therefore, in the present invention, as shown in FIG. 3, the clamping follower 11 is housed inside the table top 2, the clamping drive part 13 is housed inside the table body 3, and the follower part 11 and the clamping pin 5 are housed It can be isolated from the inside of the table 4, so there is no need to worry about the chemical liquid entering the inside of the table 4, especially the driving part.
再者，如本發明般，若為使用磁力使夾持從動部11依循夾持驅動部13而旋轉的機構，即能透過調整夾持驅動部13的旋轉角度，使複數支夾持銷5全部確實地公轉移動至恰當的夾持位置。Furthermore, as in the present invention, if a mechanism is used to rotate the clamping driven portion 11 in accordance with the clamping driving portion 13 using magnetic force, the plurality of clamping pins 5 can be adjusted by adjusting the rotation angle of the clamping driving portion 13 All are revolved and moved to the proper clamping position.
亦即，在使夾持銷5接觸晶圓W的側面時，由於夾持銷的配置或晶圓本身難為完美的真圓之故，各夾持銷所必要的公轉移動的距離（亦即，夾持從動部11的旋轉角度），在每支夾持銷多半存在著若干的差異。如上述所言，在所有的夾持銷旋轉機構皆與同1片傳動齒輪嚙合的情況下，在以往，一旦一部分的夾持銷比其它夾持銷更早接觸晶圓，則會阻礙其它仍未接觸晶圓的夾持銷的公轉移動。然而，本發明中即便一部分的夾持銷比其它夾持銷更早接觸晶圓，但由於各個夾持銷皆是透過磁力旋轉，因此不會阻礙其它仍未接觸晶圓的夾持銷的公轉移動。That is, when the pin 5 is brought into contact with the side surface of the wafer W, the distance required for the orbital movement of each pin (i.e., Most of the rotation angles of the clamping follower 11 are different in each clamping pin. As mentioned above, in the case where all the clamping pin rotation mechanisms are engaged with the same transmission gear, in the past, once some of the clamping pins contacted the wafer earlier than other clamping pins, other The revolving movement of the clamping pin that is not in contact with the wafer. However, even if some of the clamping pins contact the wafer earlier than other clamping pins in the present invention, since each clamping pin is rotated by magnetic force, it does not hinder the revolution of other clamping pins that are not in contact with the wafer. mobile.
例如，若使夾持從動部順時針旋轉約30∘則所有的夾持銷即移動至與晶圓W接觸的位置，例如，如圖4，只要使夾持驅動部13與驅動側的磁鐵14一同順時針旋轉45∘即可。在圖4所示的情況下，在夾持從動部11依循夾持驅動部13的旋轉而旋轉了30∘的時間點，夾持銷5會接觸晶圓W，而夾持從動部11的旋轉與夾持銷5的公轉會停止。這時，夾持驅動部13繼續旋轉。再者，若還有所支撐的夾持銷仍未接觸晶圓的夾持銷從動部存在，則該夾持從動部依循夾持驅動部的旋轉，繼續旋轉直到所支撐的夾持銷接觸晶圓為止（亦即，能旋轉30∘以上）。如此一來，所有的夾持銷便都移動至接觸晶圓W的位置。再者，藉由調整夾持驅動部13的旋轉角度或磁鐵的磁力，即能調節晶圓W的支承壓力。For example, if the clamping follower is rotated clockwise by about 30∘, all the clamping pins are moved to the position in contact with the wafer W. For example, as shown in FIG. 4, as long as the clamping driving portion 13 and the driving side magnet 14 Turn clockwise 45∘ together. In the case shown in FIG. 4, at a point in time when the clamping follower 11 is rotated by 30 ° in accordance with the rotation of the clamping drive section 13, the clamping pin 5 contacts the wafer W, and the clamping follower 11 The rotation and the revolution of the clamping pin 5 will stop. At this time, the grip driving section 13 continues to rotate. Furthermore, if there is a supported clamping pin follower that does not contact the wafer with the supported clamping pin, the clamping follower continues to rotate until the supported clamping pin follows the rotation of the clamping drive. Until touching the wafer (that is, it can rotate more than 30 °). As a result, all the clamping pins are moved to the position where they contact the wafer W. Furthermore, the supporting pressure of the wafer W can be adjusted by adjusting the rotation angle of the clamp driving portion 13 or the magnetic force of the magnet.
再者，解除晶圓W之支承的夾持解除時，如圖4，使夾持驅動部13逆時針旋轉45°，則解除所有的夾持銷與晶圓W的接觸。In addition, when the clamp release of the support of the wafer W is released, as shown in FIG. 4, the clamp drive unit 13 is rotated counterclockwise by 45 ° to release all the clamp pins from contact with the wafer W.
再者，本發明的晶圓支承裝置1，如圖1，以於桌台4內具備能制動夾持驅動部13的旋轉的制動機構20為佳。若具備制動機構20，即能防止非本意的夾持驅動部13的旋轉，例如，因開始桌台旋轉時的加速時或停止桌台旋轉時的減速時的離心力等所導致者。因此，得以將所有的夾持銷固定於恰當的夾持位置，能更確實地防止晶圓滑移所導致的噴濺或晶圓的傷痕的發生。In addition, as shown in FIG. 1, the wafer supporting device 1 of the present invention is preferably provided with a braking mechanism 20 capable of braking the rotation of the clamp driving unit 13 in the table 4. If the braking mechanism 20 is provided, it is possible to prevent unintended rotation of the grip driving unit 13, for example, due to centrifugal force during acceleration when starting the rotation of the table or deceleration when stopping the rotation of the table. Therefore, all the clamping pins can be fixed at the proper clamping position, and it is possible to more surely prevent the occurrence of splash or wafer damage due to wafer slippage.
如此的制動機構20，為能藉由制動機構20的制動銷22穿入至傳動齒輪7的孔洞21，而固定傳動齒輪7，制動夾持驅動部13的旋轉者為佳。此外，以具有能藉由制動銷22自孔洞21的下方向上頂，而自孔洞21移除的上頂銷23為佳，若為如此者，透過上頂銷23，即能在晶圓W的夾持及夾持解除時，解除夾持銷5的固定。再者，為了晶圓W的處理的桌台旋轉時，若使上頂銷23下降，即能將制動銷22穿入至孔洞21。另外，上頂銷23的上下移動能透過汽缸24進行。Such a braking mechanism 20 is preferred to allow the brake pin 22 of the braking mechanism 20 to penetrate into the hole 21 of the transmission gear 7 to fix the transmission gear 7 and to brake the rotation of the clamp driving unit 13. In addition, it is preferable to have an upper ejector pin 23 that can be pushed up from below the hole 21 by the brake pin 22 and removed from the hole 21. If so, through the upper ejector pin 23, the wafer W When clamping and clamping are released, the fixing of the clamping pin 5 is released. In addition, when the table for processing of the wafer W is rotated, if the upper pin 23 is lowered, the brake pin 22 can be inserted into the hole 21. The vertical movement of the upper ejector pin 23 can be performed through the cylinder 24.
接著，將針對本發明的晶圓處理裝置做說明。如圖5，本發明的晶圓處理裝置30具有腔室，其中上述本發明之晶圓支承裝置1的桌台4係容納在腔室31的內部。另外，亦可於腔室31的內部容納複數個晶圓支承裝置1的桌台4。若為如此的晶圓處理裝置30，其支承晶圓W的桌台4部分的內部機構不易腐蝕，再者，能防止晶圓滑移的發生。Next, a wafer processing apparatus of the present invention will be described. As shown in FIG. 5, the wafer processing apparatus 30 of the present invention has a chamber, wherein the table 4 of the wafer support apparatus 1 of the present invention is housed inside the chamber 31. In addition, a plurality of tables 4 of the wafer support device 1 may be housed inside the chamber 31. In such a wafer processing apparatus 30, the internal mechanism of the table 4 portion supporting the wafer W is not easily corroded, and further, the occurrence of wafer slippage can be prevented.
如此的晶圓處理裝置30，例如，能為單片旋轉式的濕式處理裝置。例如，能在自噴嘴32供給濕式處理用的藥液至晶圓W的同時，水平地支承晶圓W並使其旋轉，且同時進行既定的處理。Such a wafer processing apparatus 30 can be, for example, a single-chip rotary wet processing apparatus. For example, while the chemical solution for wet processing is supplied from the nozzle 32 to the wafer W, the wafer W can be horizontally supported and rotated, and a predetermined process can be performed at the same time.
例如，能適用本發明的晶圓支承裝置的晶圓處理裝置30雖然能為晶圓的洗淨處理裝置、旋轉蝕刻處理裝置、旋轉塗覆處理裝置、光阻剝離處理裝置及聚合物移除處理裝置中任一者，但並不限定於此。 另外，關於被支承、處理的晶圓雖無特別限制，但例如，能提出矽晶圓、SiC晶圓、GaN晶圓，石英基板等。 ［實施例］For example, the wafer processing apparatus 30 to which the wafer supporting apparatus of the present invention can be applied can be a wafer cleaning process apparatus, a spin etching process apparatus, a spin coating process apparatus, a photoresist peeling process apparatus, and a polymer removal process. Any one of the devices is not limited thereto. In addition, although there are no particular restrictions on the wafers to be supported and processed, for example, silicon wafers, SiC wafers, GaN wafers, quartz substrates, etc. can be proposed. [Example]
以下，將呈現本發明的實施例及比較例對本發明做更具體的說明，但本發明並不限定於實施例。Hereinafter, the present invention will be described more specifically by presenting examples and comparative examples, but the present invention is not limited to the examples.
（實施例） 如圖1所示，使用具備了本發明的晶圓支承裝置的旋轉洗淨處理裝置，以單片式並使用混合酸洗淨100片直徑300 nm的矽晶圓。(Example) As shown in FIG. 1, 100 silicon wafers with a diameter of 300 nm were cleaned in a single chip type using a rotary cleaning processing apparatus provided with a wafer support device of the present invention using a mixed acid.
確認完旋轉洗淨後的矽晶圓的表面的潔淨度的結果，所有的矽晶圓都獲得足夠的潔淨度，根據光學顯微鏡的檢查，及根據不純物分析的檢查兩者，能確認並未發生洗淨不良。從此一結果，可以想見在旋轉洗淨中並未發生晶圓滑移所導致的噴濺或裝置的腐蝕。As a result of confirming the cleanliness of the surface of the silicon wafer after the spin-cleaning, all the silicon wafers obtained sufficient cleanliness. According to the inspection of the optical microscope and the inspection based on the analysis of the impurities, it can be confirmed that it did not occur. Poor cleaning. From this result, it is conceivable that no spatter or device corrosion caused by wafer slippage occurred during the spin cleaning.
再者，旋轉洗淨結束後，經調查晶圓支承裝置的桌台內部後確認，並未發生洗淨液的侵入，並能防止洗淨液所導致的腐蝕。In addition, after the spin-cleaning was completed, the interior of the table of the wafer support device was investigated, and it was confirmed that no intrusion of the cleaning solution occurred, and the corrosion caused by the cleaning solution was prevented.
（比較例） 除了使用具備如圖6般的習知的晶圓支承裝置的旋轉洗淨處理裝置以外，在與實施例相同的條件下，以單片式旋轉洗淨100片矽晶圓。(Comparative example) A 100-piece silicon wafer was spin-cleaned in a single-chip manner under the same conditions as in the example, except that a spin-cleaning processing apparatus provided with a conventional wafer support device as shown in FIG. 6 was used.
與實施例相同地，確認完旋轉洗淨後的晶圓的表面的潔淨度的結果，在一部分的矽晶圓，晶圓表面產生了輝點，且有重金屬濃度值高者，而發生了洗淨不良。從此結果可以想見，旋轉洗淨中產生了晶圓滑移所導致的噴濺或裝置的腐蝕。As in the example, as a result of confirming the cleanliness of the surface of the wafer after the spin cleaning, a bright spot was generated on the surface of the wafer on a part of the silicon wafer, and there was a high concentration of heavy metals in the wafer. Net bad. From this result, it is conceivable that spatter caused by wafer slip or corrosion of the device occurred during the spin cleaning.
再者，旋轉洗淨結束後，經調查晶圓支承裝置的桌台的內部後確認，在夾持銷的驅動部中發生了洗淨液的侵入，習知的晶圓支承裝置無法防止洗淨液所導致的零件的腐蝕。Furthermore, after the spin cleaning was completed, the interior of the table of the wafer support device was investigated, and it was confirmed that the infiltration of the cleaning liquid occurred in the driving part of the clamping pin, and the conventional wafer support device cannot prevent the cleaning. Corrosion of parts caused by fluids.
另外，本發明並不限定於上述的實施型態。上述實施型態為舉例說明，凡具有與本發明的申請專利範圍所記載之技術思想實質上同樣之構成，產生相同的功效者，不論為何物皆包含在本發明的技術範圍內。The present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiment is an example, and anyone who has substantially the same structure and produces the same effect as the technical idea described in the patent application scope of the present invention is included in the technical scope of the present invention no matter what.
1‧‧‧晶圓支承裝置1‧‧‧ wafer support device
2‧‧‧上桌台2‧‧‧ on the table
3‧‧‧桌台本體3‧‧‧table body
4‧‧‧桌台4‧‧‧ table
5‧‧‧夾持銷5‧‧‧ clamping pin
7‧‧‧傳動齒輪7‧‧‧ transmission gear
8‧‧‧夾持驅動齒輪8‧‧‧ clamping drive gear
9‧‧‧桌台支撐軸9‧‧‧ table support shaft
11‧‧‧夾持從動部11‧‧‧ clamping follower
12‧‧‧從動側的磁鐵12‧‧‧ Magnet on the driven side
13‧‧‧夾持驅動部13‧‧‧Clamp drive
14‧‧‧驅動側的磁鐵14‧‧‧ Magnet on the drive side
20‧‧‧制動機構20‧‧‧Brake mechanism
21‧‧‧孔洞21‧‧‧ Hole
22‧‧‧制動銷22‧‧‧brake pin
23‧‧‧上頂銷23‧‧‧ Upper pin
24‧‧‧汽缸24‧‧‧ Cylinder
30‧‧‧晶圓處理裝置30‧‧‧ Wafer processing equipment
31‧‧‧腔室31‧‧‧ chamber
32‧‧‧噴嘴32‧‧‧ Nozzle
101‧‧‧晶圓支承裝置101‧‧‧ Wafer support device
102‧‧‧上桌台102‧‧‧ on the table
103‧‧‧桌台本體103‧‧‧table body
104‧‧‧桌台104‧‧‧table
105‧‧‧夾持銷105‧‧‧Clamping pin
106‧‧‧夾持銷旋轉機構106‧‧‧Clamping pin rotation mechanism
107‧‧‧傳動齒輪107‧‧‧ transmission gear
108‧‧‧夾持驅動齒輪108‧‧‧ clamping drive gear
109‧‧‧桌台支撐軸109‧‧‧table support shaft
W‧‧‧晶圓 W‧‧‧ Wafer
圖1係呈現本發明的晶圓支承裝置之概略的側面剖面圖。 圖2係呈現本發明的晶圓支承裝置之概略的俯視圖。 圖3係呈現本發明的晶圓支承裝置的夾持銷的驅動機構之概略的放大圖。 圖4係說明本發明的晶圓支承裝置的夾持銷的驅動機構之旋轉的圖。 圖5係呈現本發明的晶圓處理裝置的一範例的示意圖。 圖6係呈現習知的晶圓支承裝置之概略的側面剖面圖。 圖7係呈現習知的晶圓支承裝置之概略的俯視圖。 圖8係呈現習知的晶圓支承裝置的夾持銷旋轉機構之概略的放大圖。FIG. 1 is a schematic side sectional view showing a wafer supporting apparatus according to the present invention. FIG. 2 is a schematic plan view showing a wafer supporting apparatus according to the present invention. FIG. 3 is an enlarged view showing an outline of a driving mechanism of a chucking pin of the wafer supporting device of the present invention. FIG. 4 is a diagram illustrating rotation of a driving mechanism of a chucking pin of the wafer support device of the present invention. FIG. 5 is a schematic diagram showing an example of a wafer processing apparatus according to the present invention. FIG. 6 is a schematic side sectional view showing a conventional wafer supporting device. FIG. 7 is a schematic plan view showing a conventional wafer supporting device. FIG. 8 is an enlarged view schematically showing a conventional pin-pin rotating mechanism of a wafer supporting device.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016207021A JP6322255B2 (en) | 2016-10-21 | 2016-10-21 | Wafer holding apparatus and wafer processing apparatus |
| JPJP2016-207021 | 2016-10-21 |
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| Publication Number | Publication Date |
|---|---|
| TW201826439A true TW201826439A (en) | 2018-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW106135802A TW201826439A (en) | 2016-10-21 | 2017-10-19 | Wafer supporting device and wafer processing device preventing the invasion of chemical liquid into a table, and the sputtering caused by wafer slip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6322255B2 (en) |
| KR (1) | KR20180044204A (en) |
| CN (1) | CN107978551A (en) |
| TW (1) | TW201826439A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102649391B1 (en) * | 2019-05-20 | 2024-03-22 | 주식회사 제우스 | Substrate processing device |
| JP7370201B2 (en) * | 2019-09-20 | 2023-10-27 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| CN114290563A (en) * | 2021-12-15 | 2022-04-08 | 江士英 | Raw material treatment process applied to plastic film manufacturing |
| CN114653660B (en) * | 2022-05-20 | 2022-09-16 | 智程半导体设备科技(昆山)有限公司 | Magnetic clamping block and semiconductor substrate cleaning device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3695772B2 (en) * | 1994-03-31 | 2005-09-14 | エム・セテック株式会社 | Dry scrubber |
| JPH11233474A (en) * | 1997-10-22 | 1999-08-27 | Hitachi Ltd | Device for fluid treatment of sheet parts |
| JP2001250859A (en) * | 2000-03-03 | 2001-09-14 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JP2002367947A (en) * | 2001-06-08 | 2002-12-20 | Rix Corp | Method and equipment for cleaning flux and foreign matter of wafer |
| JP3956350B2 (en) * | 2002-03-25 | 2007-08-08 | 東京エレクトロン株式会社 | Substrate processing apparatus having positioning function and substrate processing method having positioning function |
| JP2010073825A (en) * | 2008-09-17 | 2010-04-02 | Realize Advanced Technology Ltd | Wafer stage |
| TWI538094B (en) * | 2009-03-31 | 2016-06-11 | 蘭研究公司 | Device for treating disc-like articles |
| US9147593B2 (en) * | 2012-10-10 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
| JP6400977B2 (en) * | 2013-09-25 | 2018-10-03 | 芝浦メカトロニクス株式会社 | Spin processing device |
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2016
- 2016-10-21 JP JP2016207021A patent/JP6322255B2/en active Active
-
2017
- 2017-10-19 KR KR1020170135837A patent/KR20180044204A/en unknown
- 2017-10-19 CN CN201710974346.5A patent/CN107978551A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107978551A (en) | 2018-05-01 |
| JP6322255B2 (en) | 2018-05-09 |
| JP2018067683A (en) | 2018-04-26 |
| KR20180044204A (en) | 2018-05-02 |
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