TW201822611A - Manufacturing method of electrical conduction contact for forming electronic product housing to increase the contact bonding force and Fineness, increase the manufacturing efficiency, conform to the environmental protection regulations, and eliminate the related cost of the shielding jig required by the housing - Google Patents

Abstract

A manufacturing method of electrical conduction contact for forming electronic product housing is disclosed, which includes planing a local position on the inner side surface of electronic product housing as the contact forming region; integrally coating a water-soluble low temperature curing or high-temperature curing peelable plastic film on the inner side surface of the housing and the contact forming region, and then drying and shaping; removing the peelable plastic film on the surface of the contact forming region of housing by laser beam; continuously using laser beam to process the surface of the contact forming region into a rough surface; blowing and sending a molten metal by pressurized air to form metal particles by the air pressure thermal spraying method at room temperature, so as to spray and fix the metal particles to the rough surface to form a metal thermal spraying layer, and suddenly cooling the metal thermal spraying layer to an electrical conduction contact; finally peeling off and removing the peelable plastic film on the inner side surface of housing. In this way, the manufacturing method of electrical conduction contact for forming electronic product housing can increase the contact bonding force, fineness, manufacturing efficiency, conform to the environmental protection regulations, and eliminate the related cost of the shielding jig required by the housing, saving man-power, material resources, and working hour, and further save the cost.

Description

   Manufacturing method for forming electric conduction contact of electronic product shell   

The invention relates to a method for manufacturing an electrically conductive contact forming a casing of an electronic product, and more particularly to a method for manufacturing an electrically conductive contact forming a casing for an intelligent mobile device, a personal digital assistant, a mobile phone, and the like.

According to the current electronic products, smart mobile devices, personal digital assistants, mobile phones, etc., mostly use plastic or magnesium aluminum alloy as the shell, and the inner and outer surfaces of the plastic shell can be covered with an anode treatment layer. To improve aesthetics.

At present, most of the current electronic product shells are provided with a plurality of copper foil gold-plated contacts on the inner surface to conduct the relevant electronic circuits and electronic components inside the electronic product. However, most of the gold-plated copper foil contacts are individually bonded to the rough surface of the casing by laser, which not only slows down the processing speed but also wastes manpower, material resources and man-hours.

That is to say, the inventors have previously used ordinary temperature air pressure spraying method to make an electrically conductive contact by spraying metal on the inner surface of an electronic product casing. When the metal particles are sprayed by air pressure spraying, a masking fixture must be installed on the non-processed area of the surface of the electronic product shell to prevent the metal particles from spraying and fixing on the surface of the non-processed area. However, the production, assembly, and disassembly of the shielding jig are inconvenient, which wastes manpower, material resources, and man-hours. Therefore, how to solve the above problems is the subject that this industry's related industry is eager to study.

The main purpose of the present invention is to use a low-temperature hardening or high-temperature hardening peelable adhesive film to spray cover the non-processed area inside the electronic product shell, and then use laser to roughen the contact molding area, and then perform spray coating. Consolidation of the metal to form an electrically conductive contact can increase the bonding force and fineness of the contact, improve manufacturing efficiency, comply with environmental protection standards, and omit the costs associated with the shielding fixture required for the conventional shell, saving labor and material resources. And working hours, while reducing costs.

In order to achieve the above object, the method for manufacturing an electrically conductive contact of an electronic product casing of the present invention includes the following steps: (a) planning the local position of the inner side surface of the electronic product casing as a contact molding area; (b) the casing The inner side of the body and the contact molding area are coated with a low-temperature hardening or high-temperature hardening peelable adhesive film, and then dried and shaped; (c) the laser beam is used to remove the peelable surface of the contact molding area of the housing. Adhesive film; (d) continue to process the surface of the contact forming area into a rough surface by laser beam; (e) use normal temperature air pressure spraying method to blow molten metal with pressurized gas to form metal particles, and spray and fix the metal particles on the surface A metal spray coating is formed on the rough surface of the contact forming area, and the metal spray coating is instantly cooled to become an electrically conductive contact; (f) the peelable adhesive film on the inner side of the shell is peeled off and removed.

The aforementioned method for manufacturing an electrically conductive contact of an electronic product case, wherein the case in the step (a) is a metal body, a carbon dioxide laser is used in the step (c), and red light is used in the step (d). Laser.

The aforementioned method for manufacturing an electrically conductive contact of an electronic product casing, wherein the casing in step (a) is a plastic body, a carbon dioxide laser is used in step (c), and red light is used in step (d) Laser.

The aforementioned method for manufacturing an electrically conductive contact of an electronic product casing, wherein the casing in step (a) is a glass body, a carbon dioxide laser is used in step (c), and a purple laser is used in step (d). .

The aforementioned method for manufacturing an electrically conductive contact of an electronic product case, wherein the case in the step (a) is a ceramic body, a carbon dioxide laser is used in the step (c), and it is sequentially used in the step (d) Red laser and green laser.

In the foregoing method for manufacturing an electrically conductive contact of an electronic product case, wherein the case in the step (a) is a plastic body, a glass body, or a ceramic body, and an inner surface of the case is an anodized layer.

The aforementioned method for manufacturing an electrically conductive contact of an electronic product case, wherein the peelable adhesive film component in step (b) includes ethoxy triacrylate propane trimethoxide, polyacrylic acid, polypropylene glycol monobutyl ether, and water. , And the temperature required for drying and setting is 45 to 65 degrees Celsius.

In the aforementioned method for manufacturing an electrically conductive contact of an electronic product casing, the peelable adhesive film in step (b) is water-soluble, and the water-soluble dissolution temperature is 50 to 60 degrees Celsius.

In the aforementioned method for manufacturing an electrically conductive contact of an electronic product casing, the laser engraving angle of the laser beam in step (c) on the peelable adhesive film is 70 to 73 degrees.

The aforementioned method for manufacturing an electrically conductive contact of an electronic product case, wherein the metal spraying coating in the step (e) is selected from the group consisting of zinc, copper, nickel, cadmium, zinc-copper alloy, and copper-nickel alloy. One of the groups.

1‧‧‧shell

11‧‧‧shell edge

12‧‧‧ inside

13‧‧‧ outside

14‧‧‧Contact forming area

15‧‧‧ rough surface

2‧‧‧ Peelable Adhesive Film

3‧‧‧ Electrical contact

31‧‧‧Metal spray coating

The first figure is a front view of the electrical contact formed in the casing of the electronic product according to the embodiment of the present invention; the second figure is an enlarged cross-sectional view taken along the line A-A of the first figure; the third figure is an embodiment of the present invention The front view of the inner side of the casing before processing; the fourth view is a front view of a peelable adhesive film coated on the inner side of the embodiment of the present invention; the fifth view is a method of removing the surface of the contact forming area by laser in the embodiment of the present invention The front view before peeling the adhesive film; the sixth view is an enlarged cross-sectional view taken along the line B-B of the fifth view; the seventh view is a front view of the surface of the contact forming area processed into a rough surface in the embodiment of the present invention; the eighth view It is a front view of the embodiment of the present invention in which the electrical contact is formed by spraying and spraying in the contact forming area; the ninth figure is an enlarged cross-sectional view taken along the line C-C of the eighth figure.

Regarding the technical means adopted by the present invention to achieve the above-mentioned objectives, and their effects, viable embodiments are given, and illustrated with drawings as follows: First, please refer to the first to ninth figures, which can be clearly seen from the figures. It can be seen that the present invention mainly forms an electrical conductive contact 3 in the housing 1 of an electronic product. The electronic product includes a smart mobile device, a personal digital assistant, a mobile phone, etc., and the housing 1 of the electronic product may A plastic body, a glass body, a ceramic body, or a magnesium-aluminum alloy metal body is provided. The casing 1 has a peripheral edge 11, an inner side surface 12, and an opposite outer side surface 13.

The invention relates to a method for manufacturing an electrically conductive contact 3 of a casing 1 of an electronic product, which includes the following steps: (a) planning most of the local positions of the inner side 12 of the casing 1 of the electronic product as contacts Molding area 14 (see the third figure); (b) The inner side surface 12 of the housing 1 and the contact molding area 14 are integrally spray-coated with a low-temperature hardening or high-temperature-curable peelable adhesive film 2 (see the fourth figure) ), Then dry-setting and subsequent standing; peelable adhesive film 2 complies with environmental protection standards, and its components include ethoxy triacrylate propane trimethoxide, polyacrylic acid, polypropylene glycol monobutyl ether, water, and drying The temperature required for styling is 45 ~ 65 ° C, the ambient temperature is 20 ° C ± 5 ° C, the ambient humidity is 40% RH ± 5% RH; the peelable adhesive film 2 is water-soluble, and the water-soluble dissolution temperature is 50 ~ 60 degrees; (c) using a laser beam to remove the peelable adhesive film 2 on the upper surface of the contact forming area 14 of the housing 1, and the optimal angle for the laser engraving of the peelable adhesive film 2 by the laser beam is 70 to 73 Degrees to reveal the surface of the inner side surface 12 and its surroundings within the contact forming area 14 (see the fifth and sixth figures); (d) Continue to process the surface of the inner side surface 12 within the contact forming area 14 into a rough surface 15 (see the seventh figure) with a laser beam; (e) Use normal temperature air pressure spraying to blow and melt with pressurized gas. The metal is formed into metal particles, and the metal particles are sprayed and fixed on the rough surface 15 of each contact forming area 14 to form a metal spray-spray coating layer 31 (see FIGS. 8 and 9), and each metal spray-spray coating The layer 31 instantly cools down to become an electrically conductive contact 3. The metal spray coating layer 31 may be selected from one of the group consisting of zinc, copper, nickel, cadmium, zinc-copper alloy, and copper-nickel alloy, so that the electrical conductive contact 3 can be used to conduct electronic products. Relevant internal electronic circuits and electronic components; (f) Finally, the peelable adhesive film 2 on the inner side 12 of the housing 1 is quickly peeled off and removed, so that the inner side 12 of the housing 1 and the electrical conductive contacts 3 ( (See figures 1 and 2).

According to the present invention, the low-temperature hardening or high-temperature hardening peelable adhesive film 2 is mainly used for spraying to cover the non-processed area inside the electronic product housing 1, and then the contact forming area 14 is roughened with the laser, and then the thermal spraying is performed. The metal-clad consolidation forms an electrically conductive contact 3, which can improve contact bonding force and fineness, improve manufacturing efficiency, meet environmental protection standards, and can omit the related costs of the shielding fixture required for the housing 1, saving labor, Material resources and man-hours while reducing costs.

When the case 1 of the present invention is a metal or plastic body in step (a), a carbon dioxide laser is used in step (c), and a red laser is used in step (d). When the case 1 in step (a) is a glass body, a carbon dioxide laser is used in step (c), and a purple laser is used in step (d). Furthermore, when the case 1 in step (a) is a ceramic body, a carbon dioxide laser is used in step (c), and a red laser and a green laser are sequentially used in step (d). In addition, the inner surface 12 of the plastic, glass or ceramic casing 1 can be set as an anodizing layer, and then steps (a), (b), (c), and (d) are sequentially performed to The laser beam processes the surface of the inner surface 12 in the contact forming area 14 into a rough surface 15 (see the seventh figure), and then performs steps (e) and (f) to spray and fix the metal particles on the surface. On the rough surface 15 of each contact forming area 14 to form a metal spray shot coating layer 31 (see FIGS. 8 and 9), and each metal spray shot coating layer 31 is instantly cooled down to become electrically conductive contact 3, and finally The peelable adhesive film 2 on the inner surface 12 of the casing 1 is directly peeled off and removed.

In the step (e) of the present invention, the metal particles are sprayed and fixed on the rough surface 15 of each contact forming area 14 by using the normal temperature air pressure spraying method to form a metal spraying coating layer 31 (see the eighth and ninth). (Figure), and each metal spray-sprayed coating layer 31 is instantaneously cooled to become the electrical conducting contact 3. The spraying air pressure used by the normal temperature air pressure spraying method is 3 ~ 12Bars. The spraying machine used can adjust the melting temperature according to different conductive materials. The voltage of the spraying machine is 20 ~ 50V and the current is 185 ~ 295 amps, the metal is melted by the arc method, and then pressurized gas is blown to form metal particles. The metal particles are sprayed and fixed on the rough surface 15 to form a metal spray coating layer 31, and the temperature of the metal particles is instantly reduced to normal temperature. It is about 24 to 40 degrees Celsius, and the electrical conducting contact 3 is formed. Furthermore, the adhesion force of the metal spray coating layer 31 on the rough surface 15 is 99.8 kgf / cm2 to 150 kgf / cm2, and the porosity of the metal spray coating layer 31 is 1 to 5% to improve the bonding force. And meticulousness.

The above-mentioned embodiments are only used to facilitate the description of the present invention, but not to limit it. Without departing from the spirit of the present invention, various simple changes and modifications that can be made by those skilled in this industry should still be included in the following patent applications In range.

Claims (10)

    A method for manufacturing an electrically conductive contact for forming an electronic product case includes the following steps: (a) planning the local position of the inner side surface of the electronic product case as a contact forming area; (b) connecting the inner side surface of the case with the contact Low-temperature hardening or high-temperature hardening peelable adhesive film is integrally coated on the point forming area, and then drying and shaping is performed; (c) The laser beam is used to remove the peelable adhesive film on the surface of the contact forming area of the shell; (d) Continue to process the surface of the contact forming area into a rough surface with a laser beam; (e) Use a normal temperature air pressure spray method to blow the molten metal with pressurized gas to form metal particles, and spray the metal particles to fix the rough surface of the contact forming area. A metal spray-spray coating is formed on the surface, and the metal spray-spray coating is instantly cooled to become an electrical conductive contact; (f) the peelable adhesive film on the inner side of the shell is peeled off and removed.         As described in the method for manufacturing an electrically conductive contact of an electronic product case described in item 1 of the scope of patent application, wherein the case in the step (a) is a metal body, a carbon dioxide laser is used in the step (c), and (d) A red laser is used in step.         According to the method for manufacturing an electrically conductive contact of an electronic product case described in item 1 of the scope of patent application, wherein the case in the step (a) is a plastic body, a carbon dioxide laser is used in the step (c), and (d) A red laser is used in step.         According to the method for manufacturing an electrically conductive contact of an electronic product case described in item 1 of the scope of the patent application, wherein the case in the step (a) is a glass body, a carbon dioxide laser is used in the step (c), and ( d) A violet laser is used in step.         According to the method for manufacturing an electrically conductive contact of an electronic product casing as described in item 1 of the scope of patent application, wherein the casing in the step (a) is a ceramic body, a carbon dioxide laser is used in the step (c), and In step (d), a red laser and a green laser are sequentially used.         The method for manufacturing an electrically conductive contact of an electronic product case according to item 1 of the scope of patent application, wherein the case in the step (a) is a plastic body, a glass body, or a ceramic body, and the inner side of the case is an anode Processing layer.         The method for manufacturing an electrically conductive contact of an electronic product case according to item 1 of the scope of the patent application, wherein the peelable adhesive film component in step (b) includes ethoxytriacrylate, propanetrimethylolate, and polyacrylic acid. , Polypropylene glycol monobutyl ether, water, and the temperature required for drying and setting is 45 to 65 degrees Celsius.         According to the method for manufacturing an electrically conductive contact of an electronic product case as described in item 7 of the scope of patent application, wherein the peelable adhesive film in step (b) is water-soluble, and the water-soluble dissolution temperature is 50 to 60 degrees Celsius .         According to the method for manufacturing an electrically conductive contact of an electronic product housing as described in item 1 of the scope of the patent application, wherein the laser engraving angle of the laser beam in step (c) for the peelable adhesive film is 70 to 73 degrees.         The method for manufacturing an electrically conductive contact of an electronic product case according to item 1 of the scope of patent application, wherein the metal spraying coating in step (e) is selected from the group consisting of zinc, copper, nickel, cadmium, and zinc One of the groups consisting of a copper alloy and a copper-nickel alloy.