TWI628994B - Electronic product housing molding electrical conduction contact manufacturing method - Google Patents

Electronic product housing molding electrical conduction contact manufacturing method Download PDF

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TWI628994B
TWI628994B TW106139820A TW106139820A TWI628994B TW I628994 B TWI628994 B TW I628994B TW 106139820 A TW106139820 A TW 106139820A TW 106139820 A TW106139820 A TW 106139820A TW I628994 B TWI628994 B TW I628994B
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casing
electronic product
manufacturing
contact
laser
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TW106139820A
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TW201822611A (en
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張有諒
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深圳市光鼎超導精密技術有限公司
王上鼎
張有諒
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Abstract

一種電子產品殼體成型電性導通接點製造方法,係將電子產品之殼體內側面局部位置規劃為接點成型區;於殼體之內側面與接點成型區上一體塗佈有水溶性低溫硬化或高溫硬化型可剝離膠膜,再實施烘乾定型;以雷射光束去除殼體之接點成型區表面之可剝離膠膜;繼續以雷射光束將接點成型區表面加工成粗糙面;利用常溫氣壓熔射法以加壓氣體吹送熔融金屬形成金屬粒子,將金屬粒子噴覆固著於粗糙面上形成金屬熔射噴覆層,且金屬熔射噴覆層瞬間降溫成電性導通接點;最後將殼體內側面之可剝離膠膜剝離去除;從而本發明在電子產品殼體成型電性導通接點的製造方法,能夠增進接點鍵合力及細緻度,提高製造效率,符合環保規範,並且可省略殼體所需的遮蔽用治具之相關費用,節省人力、物力及工時,而更降低成本。 The invention discloses a method for manufacturing an electrical conduction contact of an electronic product casing, which is to plan a local position of the inner side of the casing of the electronic product as a contact forming zone; and integrally coating the water-soluble low temperature on the inner side surface of the casing and the joint forming zone; Hardening or high temperature hardening peelable film, then drying and setting; removing the peelable film on the surface of the joint forming area of the shell by laser beam; continuing to process the surface of the joint forming area into a rough surface by laser beam The molten metal is blown by a pressurized gas to form metal particles by a normal temperature air pressure spraying method, and the metal particles are sprayed and fixed on the rough surface to form a metal spray coating layer, and the metal spray coating layer is instantly cooled to become electrically conductive. Finally, the peelable adhesive film on the inner side of the casing is peeled off; thus, the manufacturing method of forming the electrical conductive contact in the electronic product casing can improve the joint bonding force and the fineness, improve the manufacturing efficiency, and meet the environmental protection. The specification and the cost associated with the mask for the housing can be omitted, saving manpower, material and man-hours, and reducing costs.

Description

電子產品殼體成型電性導通接點製造方法 Electronic product housing molding electrical conduction contact manufacturing method

本發明有關於一種電子產品殼體成型電性導通接點製造方法,尤指一種用於智慧型行動裝置、個人數位助理、行動電話等殼體成型電性導通接點的製造方法。 The invention relates to a method for manufacturing an electrical conductive contact for forming an electronic product casing, in particular to a manufacturing method for forming a mechanical conductive contact of a smart mobile device, a personal digital assistant, a mobile phone and the like.

按,目前的電子產品中之智慧型行動裝置、個人數位助理、行動電話…等,大多使用塑膠材質或鎂鋁合金材質作為外殼,而塑膠材質外殼之內外表面更可包覆設有陽極處理層,以提高美觀性。 According to the current intelligent electronic devices, personal digital assistants, mobile phones, etc., most of them use plastic materials or magnesium-aluminum alloy as the outer casing, and the inner and outer surfaces of the plastic outer casing can be covered with an anodized layer. To improve the aesthetics.

而目前的電子產品外殼在內表面大多設有多數個銅箔鍍金接點,以導通電子產品內部之相關電子線路及電子元件。惟此多數個銅箔鍍金接點係採用雷射方式逐個分別黏接於外殼之粗糙面上,不僅是加工速度慢,並且浪費人力、物力及工時。 At present, most of the outer casings of electronic products are provided with a plurality of copper-plated gold-plated contacts on the inner surface to turn on related electronic circuits and electronic components inside the electronic products. However, most of the copper-plated gold-plated contacts are laser-bonded to the rough surface of the outer casing one by one, which is not only slow in processing speed, but also wastes manpower, material resources and man-hours.

爰是,本發明人之前即利用常溫氣壓熔射法,以在電子產品外殼之內表面熔射噴覆金屬製成電性導通接點。在實施氣壓熔射噴覆金屬粒子時,必須先在電子產品外殼表面之非加工區上裝設遮蔽用治具,以避免金屬粒子噴覆固著於非加工區表面。惟此遮蔽用治具之相關製作、組裝、拆卸不便,浪費人力、物力及工時 。因此要如何解決上述問題,即為此行業相關業者所亟欲研究之課題所在。 Therefore, the inventors previously used a normal temperature air pressure spraying method to melt the sprayed metal on the inner surface of the outer casing of the electronic product to form an electrical conduction contact. When performing the air-spraying and spraying of the metal particles, it is necessary to install a shielding jig on the non-processing area on the surface of the outer casing of the electronic product to prevent the metal particles from being sprayed and fixed on the surface of the non-processing area. However, it is inconvenient to make, assemble, and disassemble the masking jig, wasting manpower, material resources and working hours. . Therefore, how to solve the above problems is the subject of research that the relevant industry players are eager to study.

本發明之主要目的在於,利用低溫硬化或高溫硬化型可剝離膠膜噴塗遮蔽於電子產品殼體內側之非加工區上,再配合雷射進行接點成型區粗糙化,然後實施熔射噴覆金屬固結形成電性導通接點,能夠增進接點鍵合力及細緻度,提高製造效率,符合環保規範,並且可省略習知殼體所需的遮蔽用治具之相關費用,節省人力、物力及工時,而更降低成本。 The main object of the present invention is to use a low-temperature hardening or high-temperature hardening type peelable film to spray the non-processing area shielded on the inner side of the electronic product casing, and then perform the roughening of the contact forming area with the laser, and then perform the spray coating. The metal is consolidated to form an electrical conduction contact, which can improve the bonding force and the fineness of the joint, improve the manufacturing efficiency, meet the environmental protection regulations, and omit the cost associated with the shielding fixture required for the conventional housing, saving manpower and material resources. And working hours, but to reduce costs.

為達上述目的,本發明之電子產品殼體成型電性導通接點製造方法係包含有以下步驟:(a)將電子產品之殼體內側面局部位置規劃為接點成型區;(b)於殼體之內側面與接點成型區上一體塗佈有低溫硬化或高溫硬化型可剝離膠膜,再實施烘乾定型;(c)以雷射光束去除殼體之接點成型區表面之可剝離膠膜;(d)繼續以雷射光束將接點成型區表面加工成粗糙面;(e)利用常溫氣壓熔射法以加壓氣體吹送熔融金屬形成金屬粒子,將金屬粒子噴覆固著於接點成型區之粗糙面上形成金屬熔射噴覆層,且金屬熔射噴覆層瞬間降溫成電性導通接點;(f)將殼體內側面之可剝離膠膜剝離去除。 In order to achieve the above object, the electronic product housing forming electrical conduction contact manufacturing method of the present invention comprises the following steps: (a) planning the local position of the inner side of the electronic product housing as a contact forming area; (b) The inner side surface of the body and the joint forming area are integrally coated with a low-temperature hardening or high-temperature hardening type peelable adhesive film, and then dried and shaped; (c) the laser beam is removed to remove the surface of the joint forming region of the shell. (d) continuing to process the surface of the contact forming region into a rough surface by a laser beam; (e) blowing a molten metal to form a metal particle by a normal temperature air pressure spraying method, and spraying the metal particle on the metal particle A molten metal spray coating layer is formed on the rough surface of the joint forming region, and the metal spray spray coating layer is instantly cooled to become an electrical conductive contact; (f) the peelable adhesive film on the inner side surface of the casing is peeled off.

前述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為金屬體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紅光雷射。 The above-mentioned electronic product casing molding electrical conduction contact manufacturing method, wherein the casing in the step (a) is a metal body, a carbon dioxide laser is used in the step (c), and red light is used in the (d) step. Laser.

前述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為塑膠體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紅光雷射。 The above-mentioned electronic product housing molding electrical conduction contact manufacturing method, wherein the housing in the step (a) is a plastic body, a carbon dioxide laser is used in the step (c), and red light is used in the (d) step. Laser.

前述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為玻璃體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紫光雷射。 The foregoing electronic product housing molding electrical conduction contact manufacturing method, wherein the housing in the (a) step is a glass body, a carbon dioxide laser is used in the step (c), and a violet laser is used in the (d) step. .

前述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為陶瓷體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中依序使用紅光雷射、綠光雷射。 The above electronic product housing molding electrical conduction contact manufacturing method, wherein the housing in the (a) step is a ceramic body, the carbon dioxide laser is used in the step (c), and the step (d) is used sequentially. Red laser, green laser.

前述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為塑膠體、玻璃體或陶瓷體,且殼體之內側面為陽極處理層。 In the above method for manufacturing an electrical contact of an electronic product casing, the casing in the step (a) is a plastic body, a glass body or a ceramic body, and an inner side surface of the casing is an anodized layer.

前述之電子產品殼體成型電性導通接點製造方法,其中該(b)步驟中之可剝離膠膜成分包含有乙氧基三丙烯酸丙烷三甲醇酯、聚丙烯酸、聚丙二醇單丁醚、水,且其烘乾定型所需溫度為攝氏45~65度。 The above-mentioned electronic product casing molding electrical conduction contact manufacturing method, wherein the peelable adhesive film component in the step (b) comprises propane trimethyl methacrylate, polyacrylic acid, polypropylene glycol monobutyl ether, water And the temperature required for drying and setting is 45 to 65 degrees Celsius.

前述之電子產品殼體成型電性導通接點製造方法,其中該(b)步驟中之可剝離膠膜為水溶性,且水溶性溶解溫度為攝氏50~60度。 The method for manufacturing an electrical continuity contact of the electronic product casing, wherein the peelable film in the step (b) is water-soluble, and the water-soluble dissolution temperature is 50 to 60 degrees Celsius.

前述之電子產品殼體成型電性導通接點製造方法,其中該(c)步驟中之雷射光束對於可剝離膠膜進行雷射雕刻角度為70~73度。 The above-mentioned electronic product casing molding electrical conduction contact manufacturing method, wherein the laser beam in the step (c) is subjected to a laser engraving angle of 70 to 73 degrees for the peelable film.

前述之電子產品殼體成型電性導通接點製造方法,其中該(e)步驟中之金屬熔射噴覆層係選自於鋅、銅、鎳、鎘、鋅銅合金及銅鎳合金所組成之群組之其中之一者。 The method for manufacturing an electrical contact joint of the electronic product casing, wherein the metal spray coating layer in the step (e) is selected from the group consisting of zinc, copper, nickel, cadmium, zinc-copper alloy and copper-nickel alloy. One of the groups.

1‧‧‧殼體 1‧‧‧shell

11‧‧‧殼邊 11‧‧‧ Shell side

12‧‧‧內側面 12‧‧‧ inside

13‧‧‧外側面 13‧‧‧Outside

14‧‧‧接點成型區 14‧‧‧Contact molding area

15‧‧‧粗糙面 15‧‧‧Rough surface

2‧‧‧可剝離膠膜 2‧‧‧ peelable film

3‧‧‧電性導通接點 3‧‧‧Electrical conduction contacts

31‧‧‧金屬熔射噴覆層 31‧‧‧Metal spray coating

第一圖係本發明實施例之電子產品殼體成型電性導通接點之前視圖;第二圖係沿著第一圖之A~A剖線之剖面放大圖;第三圖係本發明實施例之殼體內側面在加工前之前視圖;第四圖係本發明實施例在殼體內側面塗佈可剝離膠膜之前視圖;第五圖係本發明實施例以雷射去除接點成型區表面之可剝離膠膜之前視圖;第六圖係沿著第五圖之B~B剖線之剖面放大圖;第七圖係本發明實施例將接點成型區表面加工成粗糙面之前視圖;第八圖係本發明實施例在接點成型區熔射噴覆形成電性導通接點之前視圖;第九圖係沿著第八圖之C~C剖線之剖面放大圖。 1 is a front view of an electrical product connection of an electronic product casing according to an embodiment of the present invention; the second drawing is an enlarged cross-sectional view taken along line A-A of the first figure; and the third figure is an embodiment of the present invention. The front side of the casing is in front view before processing; the fourth figure is a front view of the embodiment of the present invention in which the peelable film is coated on the inner side of the casing; the fifth figure is the embodiment of the invention to remove the surface of the joint forming zone by laser The front view of the peeling film; the sixth drawing is a cross-sectional enlarged view along the line B-B of the fifth figure; the seventh figure is the front view of the surface of the contact forming area processed into a rough surface according to the embodiment of the present invention; In the embodiment of the present invention, a front view of the contact forming area is sprayed to form an electrical conduction contact; and the ninth drawing is an enlarged cross-sectional view along the line C-C of the eighth figure.

有關本發明為達成上述目的,所採用之技術手段及其功效,茲舉出可行實施例,並且配合圖式說明如下:首先,請參閱第一圖至第九圖所示,由圖中可清楚看出,本發明主要在電子產品之殼體1內部成型電性導通接點3,電子產品包括有智慧型行動裝置、個人數位助理、行動電話...等,而電 子產品之殼體1可設為塑膠體、玻璃體、陶瓷體或鎂鋁合金材質金屬體,殼體1具有四周緣殼邊11、內側面12以及相對之外側面13。 With regard to the technical means and the effects of the present invention for achieving the above object, a feasible embodiment is given, and the following description is given with reference to the following figures: First, please refer to the first to the ninth figures, which can be clearly seen from the figure. It can be seen that the present invention mainly forms an electrical conduction contact 3 inside the casing 1 of the electronic product, and the electronic product includes a smart mobile device, a personal digital assistant, a mobile phone, etc., and the like. The casing 1 of the sub-product may be a plastic body, a glass body, a ceramic body or a metal body of magnesium-aluminum alloy, and the casing 1 has a peripheral edge 11 and an inner side 12 and an opposite outer side 13.

本發明係有關於電子產品之殼體1成型電性導通接點3的製造方法,其包含有以下步驟:(a)將電子產品之殼體1之內側面12多數局部位置各規劃為接點成型區14(參閱第三圖);(b)於殼體1之內側面12與接點成型區14上一體噴覆塗佈有低溫硬化或高溫硬化型可剝離膠膜2(參閱第四圖),再實施烘乾定型與後續靜置;可剝離膠膜2符合環保規範,其成分包含有乙氧基三丙烯酸丙烷三甲醇酯、聚丙烯酸、聚丙二醇單丁醚、水,且其烘乾定型所需溫度為攝氏45~65度,環境溫度為攝氏20度±5度,環境濕度為40%RH±5%RH;可剝離膠膜2為水溶性,且水溶性溶解溫度為攝氏50~60度;(c)利用雷射光束去除殼體1在接點成型區14上表面之可剝離膠膜2,且雷射光束對於可剝離膠膜2進行雷射雕刻最佳角度為70~73度,以顯現露出內側面12於各接點成型區14範圍內之表面與其周邊(參閱第五及六圖);(d)繼續以雷射光束將內側面12於各接點成型區14範圍內之表面加工成粗糙面15(參閱第七圖);(e)利用常溫氣壓熔射法以加壓氣體吹送熔融金屬形成金屬粒子,將金屬粒子噴覆固著於各接點成型區14之粗糙面15上, 以形成金屬熔射噴覆層31(參閱第八及九圖),且各金屬熔射噴覆層31瞬間降溫成電性導通接點3。而金屬熔射噴覆層31可選自於鋅、銅、鎳、鎘、鋅銅合金及銅鎳合金所組成之群組之其中之一者,使電性導通接點3可用於導通電子產品內部之相關電子線路及電子元件;(f)最後將殼體1內側面12之可剝離膠膜2迅速剝離去除,以完全顯現出殼體1之內側面12與各電性導通接點3(參閱第一及二圖)。 The present invention relates to a method of manufacturing a molded electrical contact 3 for a housing 1 of an electronic product, comprising the steps of: (a) planning a plurality of partial positions of the inner side surface 12 of the housing 1 of the electronic product as contacts Forming zone 14 (refer to the third figure); (b) integrally spraying the low-temperature hardening or high-temperature hardening peelable film 2 on the inner side surface 12 of the casing 1 and the joint forming zone 14 (see the fourth figure) ), and then perform drying and setting and subsequent standing; the peelable film 2 conforms to environmental protection regulations, and its composition contains ethoxy triacrylate propane trimethyl methacrylate, polyacrylic acid, polypropylene glycol monobutyl ether, water, and it is dried. The required temperature for setting is 45-65 degrees Celsius, the ambient temperature is 20 degrees Celsius ± 5 degrees, the ambient humidity is 40% RH ± 5% RH; the peelable film 2 is water-soluble, and the water-soluble dissolution temperature is 50 ° Celsius. 60 degrees; (c) using the laser beam to remove the peelable film 2 of the casing 1 on the upper surface of the joint forming region 14, and the laser beam is laser-engraved for the peelable film 2 at an optimum angle of 70-73 Degrees to reveal the surface of the inner side surface 12 in the range of each of the contact forming regions 14 and its periphery (see Figures 5 and 6); (d) continuing to machine the surface of the inner side surface 12 in the range of each of the contact forming regions 14 into a rough surface 15 by a laser beam (see the seventh drawing); (e) blowing and melting the pressurized gas by a normal temperature air pressure spraying method. The metal forms metal particles, and the metal particles are sprayed and fixed on the rough surface 15 of each contact forming region 14, The metal spray coating layer 31 is formed (see FIGS. 8 and 9), and each of the metal spray coating layers 31 is instantaneously cooled to form an electrical conduction contact 3. The metal spray coating 31 may be selected from one of the group consisting of zinc, copper, nickel, cadmium, zinc-copper alloy and copper-nickel alloy, so that the electrical conduction contact 3 can be used to turn on the electronic product. Internally related electronic circuit and electronic components; (f) Finally, the peelable film 2 of the inner side 12 of the casing 1 is quickly peeled off to completely reveal the inner side surface 12 of the casing 1 and the electrical conductive contacts 3 ( See Figures 1 and 2).

藉上,本發明主要利用低溫硬化或高溫硬化型可剝離膠膜2噴塗遮蔽於電子產品殼體1內側之非加工區,再配合雷射進行接點成型區14粗糙化,然後實施熔射噴覆金屬固結形成電性導通接點3,能夠增進接點鍵合力及細緻度,提高製造效率,符合環保規範,並且可省略殼體1所需的遮蔽用治具之相關費用,節省人力、物力及工時,而更降低成本。 By the way, the present invention mainly uses a low-temperature hardening or high-temperature hardening type peelable film 2 to spray a non-processing area which is shielded inside the electronic product casing 1, and is further roughened by a laser to form a contact forming zone 14, and then a spray spray is applied. The metal-clad consolidation forms the electrical conduction contact 3, which can improve the bonding force and the fineness of the contact, improve the manufacturing efficiency, meet the environmental protection regulations, and omit the cost associated with the shielding fixture required for the housing 1, saving manpower, Material and working hours, and lower costs.

當本發明在(a)步驟中之殼體1為金屬體或塑膠體時,即在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紅光雷射。而當(a)步驟中之殼體1為玻璃體時,則在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紫光雷射。再者,當(a)步驟中之殼體1為陶瓷體時,即在(c)步驟中使用二氧化碳雷射,且在(d)步驟中依序使用紅光雷射、綠光雷射。除此之外,塑膠、玻璃或陶瓷材質殼體1之內側面12可設為陽極處理層,再依序進行(a)步驟、(b)步驟、(c)步驟及(d)步驟,以雷射光 束將內側面12於各接點成型區14範圍內之表面加工成粗糙面15(參閱第七圖),然後實施(e)步驟及(f)步驟,將金屬粒子噴覆固著於各接點成型區14之粗糙面15上,以形成金屬熔射噴覆層31(參閱第八及九圖),且各金屬熔射噴覆層31瞬間降溫成電性導通接點3,最後將殼體1內側面12之可剝離膠膜2直接剝離去除。 When the casing 1 of the present invention in the step (a) is a metal body or a plastic body, a carbon dioxide laser is used in the step (c), and a red laser is used in the step (d). When the casing 1 in the step (a) is a glass body, a carbon dioxide laser is used in the step (c), and a violet laser is used in the step (d). Further, when the casing 1 in the step (a) is a ceramic body, the carbon dioxide laser is used in the step (c), and the red laser and the green laser are sequentially used in the step (d). In addition, the inner side surface 12 of the plastic, glass or ceramic material case 1 can be set as an anodized layer, and then steps (a), (b), (c) and (d) are sequentially performed to laser The beam processes the surface of the inner side surface 12 in the range of each of the contact forming regions 14 into a rough surface 15 (see the seventh figure), and then performs the steps (e) and (f) to spray the metal particles to each other. The rough surface 15 of the forming region 14 is formed to form a metal spray coating layer 31 (see FIGS. 8 and 9), and each of the metal spray coating layers 31 is instantaneously cooled to become an electrical conduction contact 3, and finally the shell is The peelable film 2 of the inner side 12 of the body 1 is directly peeled off.

本發明在(e)步驟係利用常溫氣壓熔射法,將金屬粒子噴覆固著於各接點成型區14之粗糙面15上,以形成金屬熔射噴覆層31(參閱第八及九圖),且各金屬熔射噴覆層31瞬間降溫成電性導通接點3。而常溫氣壓熔射法所使用之噴塗氣壓為3~12Bars,使用之熔射機器能依據不同之導電性材料而調整熔融溫度,熔射機器使用之電壓為20~50V,使用之電流為185~295安培,以利用電弧方式熔融金屬,再利用加壓氣體吹送形成金屬粒子,使金屬粒子噴覆固著於粗糙面15形成金屬熔射噴覆層31,並且金屬粒子溫度瞬間降低為常溫,也就是攝氏約24~40度,而形成電性導通接點3。再者,金屬熔射噴覆層31附著於粗糙面15上之附著力為99.8kgf/cm2~150kgf/cm2,並且金屬熔射噴覆層31之孔隙率為1~5%,以提高鍵合力及細緻度。 In the step (e), the metal particles are sprayed and fixed on the rough surface 15 of each contact forming portion 14 by a normal temperature air pressure spraying method to form a metal spray coating layer 31 (see eighth and ninth). FIG. 4), and each of the metal spray coating layers 31 is instantaneously cooled to become an electrical conduction contact 3. The spraying pressure used in the normal temperature air pressure spraying method is 3~12 Bars, and the spraying machine can adjust the melting temperature according to different conductive materials. The voltage used in the spraying machine is 20~50V, and the current used is 185~ 295 amps, the metal is melted by an arc method, and then metal particles are blown by a pressurized gas, and the metal particles are sprayed and fixed on the rough surface 15 to form a metal spray coating layer 31, and the temperature of the metal particles is instantly lowered to normal temperature. It is about 24 to 40 degrees Celsius, and the electrical conduction contact 3 is formed. Furthermore, the adhesion of the metal spray coating layer 31 to the rough surface 15 is 99.8 kgf/cm 2 to 150 kgf/cm 2 , and the porosity of the metal spray coating layer 31 is 1 to 5% to improve the bonding force. And meticulousness.

以上所舉實施例僅用為方便說明本發明,而並非加以限制,在不離本發明精神範疇,熟悉此一行業技藝人士所可作之各種簡易變化與修飾,均仍應含括於以下申請專利範圍中。 The above embodiments are intended to be illustrative of the present invention and are not intended to be limiting, and the various modifications and modifications which may be made by those skilled in the art are still included in the following claims. In the scope.

Claims (10)

一種電子產品殼體成型電性導通接點製造方法,係包含有以下步驟:(a)將電子產品之殼體內側面局部位置規劃為接點成型區;(b)於殼體之內側面與接點成型區上一體塗佈有低溫硬化或高溫硬化型可剝離膠膜,再實施烘乾定型;(c)以雷射光束去除殼體之接點成型區表面之可剝離膠膜;(d)繼續以雷射光束將接點成型區表面加工成粗糙面;(e)利用常溫氣壓熔射法以加壓氣體吹送熔融金屬形成金屬粒子,將金屬粒子噴覆固著於接點成型區之粗糙面上形成金屬熔射噴覆層,且金屬熔射噴覆層瞬間降溫成電性導通接點;(f)將殼體內側面之可剝離膠膜剝離去除。 The invention relates to a method for manufacturing an electrical conduction joint of an electronic product casing, which comprises the following steps: (a) planning a local position of the inner side of the casing of the electronic product as a contact forming zone; (b) connecting the inner side of the casing The point forming zone is integrally coated with a low temperature hardening or high temperature hardening peelable film, and then dried and shaped; (c) a laser beam is used to remove the peelable film on the surface of the joint forming portion of the casing; (d) Continue to process the surface of the contact forming area into a rough surface with a laser beam; (e) use a normal temperature air pressure spraying method to blow the molten metal to form a metal particle by a pressurized gas, and spray the metal particles to the roughness of the joint forming region. A metal spray coating layer is formed on the surface, and the metal spray coating layer is instantaneously cooled to become an electrical conduction contact; (f) the peelable adhesive film on the inner side surface of the casing is peeled off. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為金屬體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紅光雷射。 The manufacturing method of forming an electrical continuity contact for an electronic product casing according to claim 1, wherein the casing in the step (a) is a metal body, and the carbon dioxide laser is used in the step (c), and (d) A red laser is used in the step. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為塑膠體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中使用紅光雷射。 The method for manufacturing an electrical continuity contact for an electronic product casing according to claim 1, wherein the casing in the step (a) is a plastic body, and the carbon dioxide laser is used in the step (c), and (d) A red laser is used in the step. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為玻璃體,在(c)步驟中使 用二氧化碳雷射,且在(d)步驟中使用紫光雷射。 The method for manufacturing an electrical continuity contact of an electronic product casing according to claim 1, wherein the casing in the step (a) is a glass body, and in the step (c) Use a carbon dioxide laser and use a violet laser in step (d). 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為陶瓷體,在(c)步驟中使用二氧化碳雷射,且在(d)步驟中依序使用紅光雷射、綠光雷射。 The method for manufacturing an electrical contact of an electronic product case according to claim 1, wherein the casing in the step (a) is a ceramic body, and the carbon dioxide laser is used in the step (c), and (d) The red laser and green laser are used in sequence. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(a)步驟中之殼體為塑膠體、玻璃體或陶瓷體,且殼體之內側面為陽極處理層。 The manufacturing method of forming an electrical conduction contact for an electronic product case according to the invention of claim 1, wherein the housing in the step (a) is a plastic body, a glass body or a ceramic body, and an inner side of the housing is an anode. Processing layer. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(b)步驟中之可剝離膠膜成分包含有乙氧基三丙烯酸丙烷三甲醇酯、聚丙烯酸、聚丙二醇單丁醚、水,且其烘乾定型所需溫度為攝氏45~65度。 The method for manufacturing an electrical contact of an electronic product case according to the invention of claim 1, wherein the peelable film component in the step (b) comprises propylene triacetate propylene trimethacrylate and polyacrylic acid. , polypropylene glycol monobutyl ether, water, and the temperature required for drying and setting is 45 to 65 degrees Celsius. 如申請專利範圍第7項所述之電子產品殼體成型電性導通接點製造方法,其中該(b)步驟中之可剝離膠膜為水溶性,且水溶性溶解溫度為攝氏50~60度。 The method for manufacturing an electrical contact of an electronic product case according to claim 7, wherein the peelable film in the step (b) is water-soluble, and the water-soluble dissolution temperature is 50 to 60 degrees Celsius. . 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(c)步驟中之雷射光束對於可剝離膠膜進行雷射雕刻角度為70~73度。 The method for manufacturing an electrical continuity contact of an electronic product casing according to claim 1, wherein the laser beam in the step (c) is subjected to a laser engraving angle of 70 to 73 degrees for the peelable film. 如申請專利範圍第1項所述之電子產品殼體成型電性導通接點製造方法,其中該(e)步驟中之金屬熔射噴覆層係選自於鋅、銅、鎳、鎘、鋅銅合金及銅鎳合金所組成之群組之其中之一者。 The method for manufacturing an electrical contact joint for molding an electronic product case according to claim 1, wherein the metal spray coating layer in the step (e) is selected from the group consisting of zinc, copper, nickel, cadmium, and zinc. One of a group of copper alloys and copper-nickel alloys.
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TWI515333B (en) * 2014-03-17 2016-01-01 柯惠蘭 Method for forming protective coating layer of magnesium alloy and protective coating layer of magnesium alloy therefrom
TWI532246B (en) * 2011-09-19 2016-05-01 青島長弓塑模有限公司 Method for forming a circuit on a housing by spraying or laser engraving
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TWI532246B (en) * 2011-09-19 2016-05-01 青島長弓塑模有限公司 Method for forming a circuit on a housing by spraying or laser engraving
TWI515333B (en) * 2014-03-17 2016-01-01 柯惠蘭 Method for forming protective coating layer of magnesium alloy and protective coating layer of magnesium alloy therefrom
CN106210201A (en) * 2016-08-26 2016-12-07 广东欧珀移动通信有限公司 Phone housing processing technique, phone housing and mobile phone

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