TW201816893A - Substrate processing apparatus and the method of substrate processing - Google Patents

Abstract

A substrate processing apparatus in accordance with an exemplary embodiment includes a seat on which a substrate is seated, a stage configured to support the seat, a processing chamber disposed on the stage to accommodate the seat therein, and a substrate moving unit disposed outside the processing chamber to support a lower portion of the stage and horizontally move the stage. Accordingly, in accordance with an exemplary embodiment, during a substrate heat treatment process, impurity particles generated by operation of a unit for moving the substrate may not be introduced into the processing chamber, and thus, the substrate may be prevented from being contaminated by the impurity particles.

Description

Substrate processing equipment and substrate processing method

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of reducing substrate contamination caused by impurity particles.

When manufacturing a liquid crystal display device, a solar energy device, or the like, a heat treatment process for crystallizing an amorphous polycrystalline film (for example, an amorphous polycrystalline silicon film) is accompanied. Here, when glass is used as a substrate, the amorphous polycrystalline thin film is preferably crystallized by laser.

FIG. 1 is a schematic diagram of a laser heat treatment apparatus. Referring to FIG. 1, a laser heat treatment apparatus includes: a processing chamber 10 having an internal space of a processing substrate 1; a transmission window 40 provided on an upper portion of the processing chamber 10 to allow a laser 8 to transmit therethrough; a substrate A mobile device 20 is disposed in the processing chamber 10 under a corresponding emission window 40 and vertically moves and rotates the substrate 1 located thereon; and a light source 30 is disposed above the transmission window 40 outside the processing chamber 10 To output laser 8. According to the laser heat treatment apparatus described above, the laser 8 output from the light source 30 is transmitted through the transmission window 40 and radiated to the substrate 1 which is moved horizontally.

FIG. 2 is a view for explaining a shape of a laser beam radiated from the light source 30 in FIG. 1, and FIG. 2 (a) is a view illustrating a substrate viewed therefrom. As illustrated in FIG. 2, the laser beam 8 is radiated onto the substrate 1 in a linear shape. As the substrate 1 moves horizontally in a direction (arrow direction) perpendicular to the line of the laser beam 8.

The substrate moving device for moving the substrate includes a guide part extending in the X-axis direction and including an LM guide rail, and a first axial moving platform in a direction crossing the guide part (ie, Y Axis direction) to move horizontally along the guide part; a first air bearing mounted on the lower portion of the first axial moving platform; a second axial moving platform mounted on the first The axially moving platform moves along the extending direction of the first axially moving platform; and a second air bearing is mounted on a lower portion of the upper second axially moving platform. In addition, a rotation shaft guide provided on an inner center portion of the first moving platform is provided, and a carrier on which a base is located is provided on the rotation shaft guide. Here, each of the first and second bearings is a unit that sprays air downward to float in a non-contact state by air pressure.

According to the substrate moving device described above, when the substrate is seated on the stage, the first axial moving platform moves horizontally in the X-axis direction along the guide part (ie, the LM guide), and the second shaft moves horizontally. The platform moves horizontally in the Y-axis direction (that is, the extension direction of the first moving platform). And, the second horizontal moving platform is rotated by a rotation shaft guide.

At the same time, each of the first and first moving platforms is moved by an air bearing, and, at this time, the substrate is contaminated because the particles are attached to the substrate due to the sprayed air pressure being blown to the surroundings.

However, the processing chamber covers at least the entire substrate moving device. Therefore, particles generated by the air bearing that drives the substrate moving device are blown through the entire processing chamber, and therefore, the particles are seated on the substrate and contaminate the substrate.

[Prior Documents] [Patent Documents] (Patent Document 1) Korean Published Patent No. 2011-0010252

The present disclosure provides a substrate processing apparatus capable of reducing substrate contamination caused by particles in a chamber.

This disclosure also provides a substrate processing apparatus capable of reducing an increase in manufacturing costs due to the weight of the entire apparatus of the chamber.

The disclosure also provides a simplified substrate processing apparatus.

According to an exemplary embodiment, a substrate processing apparatus includes: a base on which a substrate sits; a carrier configured to support the base; and a processing chamber provided on the carrier to receive the substrate therein. A base; and a base moving unit that is disposed outside the processing chamber to support a lower portion of the carrier and move the carrier horizontally.

The substrate moving unit may include: a guide portion provided outside the processing chamber and extending in one direction to provide a horizontal moving force; and a transfer portion on which the stage is provided and coupled to The guide portion moves horizontally in an extending direction of the guide portion.

The substrate processing apparatus may further include a substrate disposed under the guide portion and the transfer portion to support the guide portion.

The guide portion may include a pair of guide portions, each of which extends in one direction and is spaced apart from each other in parallel, and the transfer portion may be spaced apart from each other along the pair of guide portions. The processing chamber may be disposed between the pair of guide portions.

The transfer portion may include a transfer platform extending in the direction along which the pair of guide portions are spaced apart from each other, and having one end and the other end connected to the pair of guide portions, To move horizontally in the extension direction of the pair of guide parts, and the stage is mounted thereon; and a first air bearing installed to the transfer provided outside the processing chamber The platform is sprayed with air toward the substrate, so that the transfer platform floats from the substrate and moves in a sliding manner.

The substrate processing apparatus may further include a second air bearing installed on the transfer platform provided outside the processing chamber to spray air toward the guide part, so that the transfer platform is guided from the guide The pieces float to move in a sliding manner.

The transfer portion may have an extended length in a direction corresponding to the guide portion, which is smaller than the extended length of the guide portion, and the stage may have an extended length in the pair of guides. In the direction along which the parts are spaced apart from each other, the extension length of the carrier is smaller than the extension length of the transfer part, and in the direction corresponding to the guide part, the extension length of the carrier is equal to or An extension length smaller than the extension length of the transfer portion.

The processing chamber may have a surface area smaller than a surface area of the transfer portion and equal to or larger than a surface area of the stage.

The substrate processing apparatus may further include a pipe portion having one end provided in the processing chamber and the other end extending to be connected to a pump to adjust the processing by using a suction force of the pump Internal pressure of the chamber.

The pipeline portion may include: a first extension portion extending downward from the inside of the processing chamber; and a first pipeline member extending in a direction corresponding to the guide portion, and having One end connected to the first extension portion and the other end connected to the pump are extended and contracted by a force transmitted from the outside to change its length or shape.

The pipeline part may include a second pipeline part connected to the first pipeline part, and each of the first pipeline part and the second pipeline part may be provided in plurality, The first pipeline part and the second pipeline part are arranged alternately several times.

The second pipeline part may include bellows.

According to another exemplary embodiment, a substrate processing method includes: arranging a substrate on a base disposed in a processing chamber; radiating light toward the substrate; and horizontally moving the substrate outside the processing chamber to support the substrate. The processing chamber and the carrier of the base to move the processing chamber and the base horizontally together with the carrier.

The carrier can be moved horizontally along a guide portion provided outside the processing chamber and extending in one direction by operating a transfer portion installed below the carrier to execute the carrier. The table moves horizontally.

An air bearing configured to spray air toward each of the base and the guide portion provided below the transfer portion may be made by floating the stage from a base and a guide portion Horizontal movement to perform the horizontal movement of the stage.

The substrate processing method may further include adjusting the internal pressure of the processing chamber while radiating light to the substrate and horizontally moving the processing chamber and the base, wherein suction can be performed by operating a pump A manner of extending at one end of a pipe portion inside the processing chamber to perform the adjustment of the internal pressure of the processing chamber, and when the processing chamber and the base move horizontally, The pipeline portion extends or contracts in a horizontal moving direction of the processing chamber and the base.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

Hereinafter, embodiments of the present invention will be described in detail. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and these embodiments will fully convey the scope of the invention to those skilled in the art.

FIG. 3 is a three-dimensional view illustrating a substrate processing apparatus including a processing chamber and an atmosphere creating part according to an exemplary embodiment. FIG. 4 is a cross-sectional view taken from a direction in which the transfer portion moves along the guide portion (ie, a scanning direction). FIG. 5 is a cross-sectional view taken from a direction crossing the scanning direction or the extending direction of the transfer portion. FIG. 6 is a top view illustrating a main part of a substrate processing apparatus according to an exemplary embodiment.

The substrate processing apparatus according to an exemplary embodiment is a heat treatment apparatus for heat-treating a substrate by radiating laser light on the substrate, or a thin film provided on the substrate. In more detail, the substrate processing apparatus according to an exemplary embodiment is a laser crystallization apparatus for radiating laser light on an amorphous thin film provided on a substrate to crystallize the amorphous thin film.

Hereinafter, a substrate processing apparatus according to an exemplary embodiment will be described in detail with reference to FIGS. 3 to 6.

3 to 6, a substrate processing apparatus according to an exemplary embodiment includes: a base 300 on which a substrate S sits; a stage 500 that supports the base 300 disposed thereon; and a substrate moving unit 400 that is horizontal The stage 500 is moved in the direction and is moved while the stage 500 is rotated; the processing chamber 200 has a thin container shape with an internal space and is disposed on the stage 500 to surround the base 300; the light source 700, which is provided Over the processing chamber 200 to radiate a laser in a direction toward the base 300; an atmosphere creating unit 600 extending to the inside of the processing chamber 200 to create an atmosphere for processing a substrate in the processing chamber 200; and the substrate 100 It is provided to support a lower portion of the substrate moving unit 400.

The substrate 100 is provided to support a lower portion of the substrate moving unit 400. Here, the substrate 100 has a surface area equal to or larger than the entire surface area of the substrate moving unit 400, so that the substrate 100 can stably support all the substrate moving units 400 provided thereon. Although the substrate 100 according to the exemplary embodiment has a substantially rectangular or plate cross-sectional shape, the exemplary embodiment is not limited thereto. For example, the substrate 100 may have any shape capable of supporting the substrate moving unit 400.

And, a groove 110 (hereinafter referred to as an insertion groove) into which a part of the atmosphere creation unit 600 described later is inserted is defined in the substrate 100. Here, the insertion groove 110 extends horizontally in a scanning direction or a direction along which the substrate S is moved for the heat treatment.

The substrate moving unit 400 according to the exemplary embodiment allows the stage 500 and the processing chamber 200 provided on the stage 500 to move and rotate horizontally. The substrate moving unit 400 described above includes: a pair of guide portions 410, each of which extends in one direction (eg, the Y-axis direction) and faces each other; and a transfer portion 420, which is in contact with the guide The portions 410 cross in a direction (for example, the X-axis direction) and have one end and the other end respectively connected to the guide portion 410 so as to be movable in the extending direction of the guide portion 410.

Each of the pair of guide portions 410 extends in a direction (for example, a Y-axis direction) along which the substrate S is horizontally moved for heat treatment. And, the pair of guide portions 410 are spaced apart from each other in the X-axis direction to face each other. Here, as described above, during the heat treatment process, the substrate S extends in the extending direction of the pair of guide portions 410, which can be marked by "scanning movement". And, the extending direction of the guide portion (that is, the direction extending in the Y-axis direction) can be indicated by the scanning direction.

Each of the pair of guide portions 410 according to an exemplary embodiment has an extension length in the Y-axis direction, which corresponds to the extension length of the substrate 100 or a predetermined length smaller than the extension length.

The guide portion 410 includes a guide main body 411 extending in the Y-axis direction, and a guide member 412 extending on the guide main body 411 in an extending direction of the guide main body 411 to guide will be described later The moving part of the shift.

The guide member 412 is provided on the guide body 411 to provide a horizontal moving force of the transfer portion 420. The guide member 412 includes a coil (not shown), and a transfer platform 421 that is horizontally moved by a current supplied to the coil, which will be described later.

The transfer portion 420 extends in a direction (ie, the X-axis direction) along which the pair of guide portions are spaced apart from each other and is coupled to be connected to the pair of guide portions 410 to be in the guide portions 410. Move horizontally in the direction of extension. The transfer portion 420 includes: a transfer platform 421 that extends in the X-axis direction; and a movable body 422 that is provided on each of both ends (both ends in the X-axis extension direction) of the transfer platform 421 to have A driving force for moving along the guide member 412; a first air bearing 423a mounted on the transfer platform 421 to spray air in a direction toward the substrate 100; and a second air bearing 423b mounted on the transfer platform 421 The upper part is sprayed with air in a direction toward the guide member 412.

The transfer platform 421 has a predetermined surface area on which the stage 500 can be seated and extend in the X-axis direction (that is, a direction along which the pair of guide portions 410 are spaced apart from each other). And, the transfer platform 421 has one end connected to one of the pair of guide portions 410 and the other end connected to the other of the pair of guide portions 410. Here, in the exemplary embodiment, the transfer platform 421 has one end and the other end placed or placed on the upper portion of the guide body 411 and coupled to the guide body 411. And, the transfer platform 421 may have a lower portion spaced apart from the substrate 100 by a predetermined distance.

The movable body 422 extends in an extension direction of the transfer platform 421 or an extension direction of the guide member to move horizontally along the guide member 412. The movable body 422 described above is coupled to the guide member 412 to have at least a portion inserted into the guide member 412. For example, a magnet portion in which N-pole magnets and S-pole magnets are alternately disposed multiple times is mounted on the movable body 422.

According to the movable body 422 and the guide member 412, when an alternating current is applied to a coil provided on the guide member 412, the movable body 422 moves back and forth along the guide member 412 by a signal.

In the above, it is described that the coil is provided on the guide member, and the N pole and the S pole are alternately provided in the movable body. However, the exemplary embodiment is not limited thereto. For example, various units capable of horizontally moving the transfer platform can be applied as a guide member and a movable body. For example, the guide member is an LM guide, and the movable body may be a unit capable of sliding along the LM guide, such as a linear motor.

The first air bearing 423a allows the transfer platform 421 to float from the substrate in a non-contact state, and is mounted on the transfer platform 421 to face the substrate 100. For example, a plurality of first air bearings 423a may be provided and disposed on a side surface in the Y-axis extension direction of the transfer platform. Each of the plurality of first air bearings 423a sprays air downward. Here, the top surface of the substrate 100 is an air-sprayed surface, and the transfer portion 420 floats from the top surface of the substrate 100 by the pressure (ie, air pressure) of the air sprayed onto the top surface of the substrate 100.

The second air bearing 423b allows the transfer platform 421 to float from the guide member 412 and is mounted on the transfer platform 421 to face the guide member 412. The second air bearing 423b is provided on each of two side surfaces of the transfer platform 421 in the X-axis extension direction to spray air toward the guide member 412. Here, the side surface of the guide member 412 is an air sprayed surface, and the transfer platform 421 floats from the side surface of the guide member 412 by the pressure of the air sprayed on the side surface of the guide member 412.

When the movable body 422 is operated in a state where air is sprayed from the first air bearing 423a and the second air bearing 423b, the above-described transfer platform 421 moves horizontally along the guide portion.

The stage 500 is provided on the transfer portion 420 to move horizontally in the scanning direction (ie, the Y-axis direction) together with the transfer portion 420 in a state where the processing chamber 200 and the base 300 are provided thereon. The stage 500 described above includes the rotating body 520 mounted on the transfer portion 420 and capable of rotating, and the support 510 provided on the rotating body 520 and having an upper portion supporting and mounting the base 300 and the processing chamber 200 thereon. .

The rotating body 520 is provided on the transfer portion 420 to rotate, and can be horizontally moved by an operation of the transfer portion 420. The rotating body 520 described above may have a hollow plate shape having an opened central portion and an upper portion on which the support 510 is mounted. The rotating body 520 has an opening through which the pipe section 420 of the atmosphere creating unit 600 will be described later.

Although the rotating body 520 according to the exemplary embodiment is rotated in a cross-roller guide manner, the exemplary embodiment is not limited thereto. For example, various units capable of rotating a base can be applied as a rotating body.

The support 510 mounted on the rotating body 520 can be rotated by the rotating body 520 and horizontally moved by the transfer portion 420. Also, the support 510 moves horizontally with the transfer portion 420 in the scanning direction, and simultaneously mounts and mounts the base 300 and the processing chamber above the support plate 510. According to an exemplary embodiment, the supporter 510 has a hollow plate shape having an opening through which the pipe portion 420 passes, and a surface area larger than that of the rotating body 520. Alternatively, the support 510 may have a surface area equal to or smaller than the surface area of the rotating body.

And, the supporter 510 according to the exemplary embodiment is installed above or inserted into the transfer platform 421.

As described above, the carrier 500 described above is mounted on the transfer portion 420. The stage 500 according to the exemplary embodiment has a surface area smaller than that of the transfer portion 420. That is, the transfer portion 420 extends in the interval direction of the pair of guide members spaced apart from each other. Therefore, the transfer portion 420 extends at least as much as the separation distance (X-axis direction) between the pair of guide members 412 and is smaller than the Y-axis extension length of the guide portion 410.

The stage 500 is mounted on the transfer portion 420 and has a surface area smaller than the surface area of the transfer portion 420. That is, the stage 500 is smaller in the X-axis direction than the extended length of the transfer portion, and smaller than the extended length of the guide member 412 in the Y-axis direction. Here, the stage 500 may have a Y-axis extension length equal to or smaller than a Y-axis extension length of the transfer portion 420.

The stage 500 according to an exemplary embodiment may include a rotating body 520 and a supporter 510 installed on the rotating body 520, and the supporter 510 may have a surface area larger than a surface area of the rotating body.

A state where the stage 500 has a surface area smaller than the surface area of the transfer portion 420 may indicate that the X-axis extension length of the support 510 is smaller than the X-axis extension length of the transfer portion 420, and the Y-axis extension length of the support 510 is equal to or smaller than that of the transfer portion 420. Y-axis extension length.

Alternatively, the Y-axis extension length of the support member 510 may be larger than the Y-axis extension length of the transfer portion 420 and smaller than the Y-axis extension length of the guide portion 410.

The base 300 is mounted on the stage 500, has a top surface supporting the base S, and moves or rotates horizontally with the stage 500. The base 300 extends in a direction corresponding to the base S and includes a base member 310 spaced upward from the support 510 and interconnects the base member 310 and the support 510 to support the base member 310 so that the base member 310 is disposed on the support. Piece 510 above the support member 320. The base member 310 is disposed below the window W to correspond thereto, and the base member 310 has a surface area equal to or larger than that of the substrate S. The base member 310 and the stage 500 are spaced upward from the support member 320. Here, the reason why the base member 310 is spaced upward from the stage 500 is that a part of the atmosphere creation unit 600 which will be described later is inserted into the space between the stage 500 and the base member 310.

As described above, the base 300 is seated on the stage 500 and has a surface area smaller than the surface area of the stage 500. In more detail, the base 300 has a surface area smaller than that of the support 510. Naturally, the base 300 may have a surface area larger than that of the support.

When comparing the surface area of the base 300 with the surface area of the transfer portion 420, the base 300 may have an X-axis extension length that is less than the X-axis extension length of the transfer portion 420 and equal to or less than the Y-axis extension length of the transfer portion 420.

The processing chamber 200 is disposed on the stage 500 to cover the base 300. For example, the processing chamber 200 is fixed on the support 510 and moves horizontally along the scanning direction according to the operation of the transfer portion 420.

The processing chamber 200 has a container shape having an internal space, and a window W (light (for example, laser) emitted from the light source can be transmitted through the window W) is provided between the light source and the base member 310. In other words, a window is installed above the base 300 on the processing chamber 200 to correspond to the base 300. And, a door 210 through which the substrate S can be inserted and removed is defined in the processing chamber 200.

The processing chamber 200 is manufactured to have an extension length equal to or smaller than the extension length of the stage 500 in each of the X-axis and Y-axis directions. In detail, the processing chamber 200 is mounted on the support 510 instead of the stage 500.

Therefore, regarding the processing chamber 200, at least a portion of the transfer portion 420 and each of the pair of guide portions 410 are provided outside the processing chamber 200. Also, the first air bearing 423 a and the second air bearing 423 b of the transfer portion 420 and the movable body 422 moving along the guide portion 410 are disposed outside the processing chamber 200. Therefore, the processing chamber 200 according to the exemplary embodiment is mounted on a stage 500 of a movable body that is horizontally moved, and has a small size to compactly cover the base and the top surface of the stage 500.

Compared to a conventional processing chamber, the processing chamber 200 described above according to an exemplary embodiment has little or no factors for generating particles. That is, although the processing chamber 200 according to the exemplary embodiment is fixed on the stage 500 and houses the base 300 therein, since the first air bearing 423a and the second air bearing 423b and the movable body 422 that allow the stage to move horizontally Since the guide member 412 is provided outside the processing chamber 200, particles are less generated by a component (for example, an air bearing) for horizontal movement compared to a conventional processing chamber.

Also, since the processing chamber 200 according to the exemplary embodiment has an inner volume smaller than that of a conventional processing chamber, the amount of particles may be reduced by as much as a reduced volume.

According to the substrate processing apparatus according to the exemplary embodiment, it is possible to prevent the substrate from being contaminated by particles in the processing chamber, which is different from a conventional processing chamber.

The atmosphere creation unit 600 is a unit for creating process conditions (ie, a vacuum atmosphere) for performing a heat treatment process in the processing chamber 200. The atmosphere creation unit 600 includes: a pump 610 that provides a suction force for creating a vacuum, and a pipe portion 620 that extends to have one end connected to the processing chamber 200 and the other end connected to the pump 610, thereby The suction force of the pump 610 is transmitted to the processing chamber 200; and a feed-through is provided around the other end of the pipe portion 620 in the processing chamber 200.

The pump 610 is disposed outside or on the substrate 100. Although the substrate according to the exemplary embodiment is a rotary pump, the exemplary embodiment is not limited thereto, and various units having a suction force to create a vacuum atmosphere by absorbing the inside of the processing chamber 200 may be applied.

The pipe portion 620 extends such that the other end thereof is connected to the pump, and one end thereof passes through the substrate 100, the transfer portion 420, and the stage 500 and is disposed in the processing chamber 200. Here, the pipe portion 620 according to the exemplary embodiment has one end provided at a position in the processing chamber 200 corresponding to a space between the base member 310 and the stage 500.

Although one end of the pipeline portion 620 is disposed at a position corresponding to a space between the base member 310 and the stage 500, the exemplary embodiment is not limited thereto, and one end of the pipeline portion 620 may be disposed in the processing chamber At any position in 200, for example, provided outside the base 300 in the processing chamber 200.

As described above, the pipeline portion 620 extends so that at least a part of it is disposed in the processing chamber 200, and the processing chamber 200 moves horizontally together with the stage 500 in a state where the processing chamber 200 is mounted on the stage 500. Therefore, it is necessary for the pipeline portion 620 to be provided so as not to prevent the movement of the processing chamber 200 during the movement of the processing chamber 200.

The pipe portion 620 according to an exemplary embodiment extends vertically from the inside of the processing chamber 200 to the substrate 100 and includes a first extension portion 621 (including one end of the pipe portion 620) and a second extension portion 622, the second The extension portion extends in a direction (ie, the Y-axis direction) corresponding to the scanning direction of the stage to have one end connected to the first extension portion 621 and the other end connected to the pump 610.

The first extension portion extends from the inside of the processing chamber 200 to vertically pass through the stage 500 and a portion of the substrate 100. In more detail, the first extension portion 621 extends from the inside of the processing chamber 200 to vertically pass through the support 510, the rotating body 520, the transfer platform 421, and the portion of the substrate 100. For this, an insertion groove through which the first extension portion 621 can be inserted to be passed may be defined in each of the support 510, the rotating body 520, the transfer platform 421, and the base 100, and may be concentrically defined respectively defined in the support The member 510, the rotating body 520, the transfer platform 421, and the insertion groove in the base 100.

The first extension 621 described above is a pipe having an internal space through which a gas moves, which may be a pipe or a pipe made of, for example, a metal material (for example, stainless steel). Here, the first extension portion 621 is a pipe that cannot extend or contact or does not change in length or shape.

Also, the first extension portion 621 has one end corresponding to one end of the pipe portion 620, and one end of the first extension portion 621 is disposed in a space between the base member 310 and the rotating body 520. Here, the feedthrough 630 may be disposed around an end of the first extension portion 621 provided in the processing chamber 200 so that the first extension portion 621 can be stably installed, and the feedthrough 630 is installed on the base member 310 and the rotating body The rotating body 520 between 520 has a hollow shape, and the hollow shape has an opening through which the first extension portion 621 passes.

The second extension portion 622 extends in the scanning direction (ie, the Y-axis direction) of the stage 500 and has one end connected to the other end of the first extension portion 621 and the other end connected to the pump. Here, desirably, at least a region of the second extension portion 622 installed inside the substrate 100 extends in the Y-axis direction. Alternatively, all the second extending portions 622 may extend in the Y-axis direction.

The extension direction of the second extension portion 622 is the direction along which the stage 500 moves horizontally during the heat treatment process, and the second extension portion 622 needs to be flexible to the movement of the stage 500. Therefore, in the exemplary embodiment, the second extension portion 622 is configured to have flexibility with respect to the moving direction of the stage 500.

That is, the second extension portion 622 has a configuration that provides a first pipe member 622a and a second pipe member 622b (each of which has an internal space and gas can pass through the pipe member), and the first pipe member 622a and the second pipe member 622b are alternately provided several times. Here, the second extension portion 622b is a pipe that cannot extend or contact or does not change in length or shape. Meanwhile, the first pipe part 622a may be a pipe that is extended and contracted by a force transmitted from the outside, so that the length or shape thereof is changed, for example, a bellows-type pipe or bellows made of metal.

As described above, because the second extension portion 622 extends in the Y-axis direction and includes the first pipe member 622 that can be extended and contacted, when the processing chamber 200 and the stage 500 move in the Y-axis direction, the atmosphere is created The unit 600 may not interrupt the movement of the processing chamber 200 and the stage.

That is, when the processing chamber 200 and the stage 500 are moved in the scanning direction (Y-axis direction) during the substrate heat treatment process, the second extension portion 622 of the pipe portion 620 contacts or extends accordingly. In other words, the pipe portion 620 is extended or contracted according to the moving and moving distance of the processing chamber 200 and the stage 500 in the scanning direction (Y-axis direction) to have a flexible total length that will change. Therefore, the pipeline portion 620 may flexibly correspond to the movement of the processing chamber 200 to create or maintain the inside of the processing chamber 200 under the pressure of the substrate processing atmosphere.

Although the second extension portion 622 is configured by alternately mounting the first pipeline member 622a and the second pipeline member 622b several times as described above, the second extension portion 622 may include only the first pipeline member 622a.

Also, although the second extension portion 622 includes the first pipeline member 622a and the second pipeline member 622b as described above, the exemplary embodiment is not limited thereto, and the first extension portion 621 may include the first pipeline member 622a And the second pipe member 622b. Alternatively, the first extension portion 621 may include only the first pipe part.

As described above, at least a portion of the first extension portion 621 and at least a portion of the second extension portion 622 are inserted into the substrate. Accordingly, the insertion groove 110 is defined in the base so that at least the portion of the first extension portion 621 and at least a portion of the second extension portion 622 can be inserted.

Hereinafter, operations of a substrate processing apparatus and a substrate processing method according to an exemplary embodiment will be described with reference to FIGS. 3 to 6. Here, the substrate on which the amorphous silicon thin film is formed will be described as an example of an object to be processed.

First, the substrate S to be heat-treated is inserted through the door 210 of the processing chamber 200 and sits on the base 300. Thereafter, the transfer portion 420 moves horizontally, for example, scans along the guide portion 410 while radiating a laser from the light source 700 toward the substrate S. The laser emitted from the light source 700 passes through the window W and is radiated to the substrate provided in the processing chamber 200 to crystallize the amorphous thin film by sequentially radiating the laser according to the scanning movement of the substrate S.

The base 300 on which the base S sits is seated on the stage 500 to move horizontally with the stage 500. In addition, since the processing chamber 200 is mounted on the stage 500, the base 300 is accommodated in the processing chamber 200. Therefore, when the stage 500 is transferred by the transfer portion 420, the processing chamber 200 moves horizontally together with the stage 500.

In addition, the stage 500 is transferred in the scanning direction by the transfer portion 420, and a guide portion, a movable body, and first and second air bearings 423a and 423b of the transfer and transfer portion 420 are installed outside the processing chamber 200.

That is, when the substrate is horizontally moved for the heat treatment process, a unit for generating a driving force for horizontally moving the substrate S is disposed outside the processing chamber 200 and is not disposed in the processing chamber 200. In other words, the processing chamber 200 covers the base 300 on which the substrate S is seated, and the first air bearing 423a and the second air bearing 423b for horizontally moving the base 300 are disposed outside the processing chamber 200.

Therefore, during the substrate heat treatment process, the foreign particles generated by the first air bearing 423a and the second air bearing 423b are not introduced into the processing chamber 200, and therefore, the substrate S is prevented from being contaminated by the foreign particles.

Also, since the processing chamber has a volume smaller than that of a conventional processing chamber, the total weight of the heat treatment equipment is reduced. In addition, since the processing chambers are coupled to each other on the stage 500 in a method such as welding, the cost for coupling the processing chamber 200 and the stage 500 to each other is reduced by as much as a reduced volume.

Also, conventionally, an oxygen partial degassing module for removing oxygen around the substrate is installed to prevent oxidation that occurs when laser is radiated to the substrate, and the oxygen partial degassing module is installed in a window in the processing chamber. And the base.

However, according to an exemplary embodiment, since the processing chamber 200 is reduced in volume as compared to a conventional processing chamber, an oxygen partial degassing module (OPDM) may be omitted, and thus, it may be reduced cost.

Although the substrate processing apparatus has been described with reference to specific embodiments, it is not limited thereto. Therefore, those having ordinary knowledge in the technical field will readily understand that various modifications and changes can be made to it without departing from the spirit and scope of the invention as defined by the scope of the appended application patents.

1‧‧‧ substrate

8‧‧‧ laser

10‧‧‧Processing chamber

30‧‧‧ light source

40‧‧‧ transmission window

100‧‧‧ substrate

110‧‧‧ Insertion groove

200‧‧‧ treatment chamber

300‧‧‧ base

310‧‧‧base parts

320‧‧‧ support parts

400‧‧‧ base movement unit

410‧‧‧Guide

411‧‧‧Guide body

412‧‧‧Guide parts

420‧‧‧ transfer part

421‧‧‧ transfer platform

422‧‧‧movable subject

423a‧‧‧first air bearing

423b‧‧‧Second Air Bearing

500‧‧‧ carrier

510‧‧‧Support

520‧‧‧rotating subject

600‧‧‧ Atmospheric Creation Unit

610‧‧‧Pu

620‧‧‧Piping section

621‧‧‧First extension

622‧‧‧second extension

622a‧‧‧first pipeline component

622b‧‧‧Second pipeline component

700‧‧‧ light source

S‧‧‧ substrate

W‧‧‧ window

Exemplary embodiments can be understood in more detail through the following description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a view for explaining a conventional laser heat treatment apparatus. FIG. 2 is a view for explaining a shape of a laser beam radiated from the light source in FIG. 1. FIG. 3 is a three-dimensional view illustrating a substrate processing apparatus including a processing chamber and an atmosphere creating portion according to an exemplary embodiment. FIG. 4 is a cross-sectional view taken from a direction in which the transfer portion moves along the guide portion (ie, a scanning direction). FIG. 5 is a cross-sectional view taken from a direction crossing the scanning direction or the extending direction of the transfer portion. FIG. 6 is a top view illustrating a main part of a substrate processing apparatus according to an exemplary embodiment.

Claims (16)

A substrate processing apparatus includes: a base, the substrate is seated on the base; a carrier configured to support the base; a processing chamber provided on the carrier to accommodate a housing in the processing chamber; The base; and a base moving unit, which is disposed outside the processing chamber to support a lower portion of the carrier and to move the carrier horizontally. The substrate processing apparatus according to item 1 of the scope of patent application, wherein the substrate moving unit includes: a guide portion provided outside the processing chamber and extending in one direction to provide a horizontal moving force; and a transfer portion The stage is disposed on the transfer portion, and is coupled to the guide portion to move horizontally in an extending direction of the guide portion. The substrate processing apparatus according to item 2 of the scope of patent application, further comprising a substrate provided below the guide portion and the transfer portion to support the guide portion. The substrate processing apparatus according to item 3 of the patent application scope, wherein the guide portion includes a pair of guide portions, each of the pair of guide portions extending in one direction and in parallel with each other Spaced apart, the transfer portions extend in a direction along which the pair of guide portions are spaced apart from each other, and the processing chamber is disposed between the pair of guide portions. The substrate processing apparatus according to item 4 of the scope of patent application, wherein the transfer portion includes: a transfer platform extending in the direction along which the pair of guide portions are spaced apart from each other, and Having one end and the other end connected to the pair of guide portions to move horizontally in the extending direction of the pair of guide portions, and the stage is mounted on the transfer platform; and A first air bearing is installed on the transfer platform disposed outside the processing chamber to spray air toward the substrate, so that the transfer platform floats from the substrate and moves in a sliding manner. The substrate processing apparatus according to item 5 of the scope of patent application, further comprising a second air bearing installed on the transfer platform provided outside the processing chamber to spray air toward the guide part, so that The transfer platform floats from the guide part and moves in a sliding manner. The substrate processing apparatus according to item 2 of the scope of patent application, wherein the transfer portion has an extended length in a direction corresponding to the guide portion, and the extended length of the transfer portion is smaller than that of the guide portion An extension length, and the stage has an extension length, in a direction along which the pair of guide portions are spaced apart from each other, the extension length of the stage is smaller than that of the transfer portion, and corresponds to In the direction of the guide portion, an extension length of the stage is equal to or smaller than an extension length of the transfer portion. The substrate processing apparatus according to item 7 of the patent application scope, wherein the processing chamber has a surface area smaller than a surface area of the transfer portion and equal to or larger than a surface area of the stage. The substrate processing apparatus according to any one of claims 3 to 8 of the scope of patent application, further comprising a pipeline portion having one end provided in the processing chamber and extending to be connected to a helper. The other end of the pump to adjust the internal pressure of the processing chamber by using the pumping force of the pump. The substrate processing apparatus according to item 9 of the scope of patent application, wherein the pipeline portion includes: a first extension portion that extends downward from the inside of the processing chamber; and a first pipeline Component, the first pipeline component extends in a direction corresponding to the guide portion, and has one end connected to the first extension portion and the other end connected to the pump, and passes from the outside The transmitted force extends and contracts to change the length or shape of the first pipe part. The substrate processing apparatus according to claim 10, wherein the pipeline portion includes a second pipeline component connected to the first pipeline component, and the first pipeline component and the first pipeline component Each of the two pipeline members is provided in plural, so that the first pipeline member and the second pipeline member are alternately provided several times. The substrate processing apparatus according to item 11 of the patent application scope, wherein the second pipeline component includes a bellows. A substrate processing method includes: arranging a substrate on a base provided in a processing chamber; radiating light toward the substrate; and horizontally moving and disposed outside the processing chamber to support the processing chamber and the substrate A carrier on a base to horizontally move the processing chamber and the base together with the carrier. The substrate processing method according to item 13 of the scope of patent application, wherein the carrier is arranged along the outside of the processing chamber and in one direction by operating a transfer portion installed below the carrier. The extended guide portion is moved horizontally to perform the horizontal movement of the stage. The substrate processing method according to item 14 of the scope of patent application, wherein the substrate is floated from the substrate and the guide portion so as to be arranged to face the substrate and the substrate installed below the transfer portion. Each of the air-sprayed air bearings in the guide portion moves horizontally to perform the horizontal movement of the stage. The substrate processing method according to item 14 of the scope of patent application, further comprising adjusting the internal pressure of the processing chamber while radiating light to the substrate and horizontally moving the processing chamber and the base, wherein The pressure of the processing chamber is adjusted by suctioning one end of a pipe portion provided inside the processing chamber by operating a pump to perform the adjustment of the internal pressure of the processing chamber. And when the processing chamber and the base move horizontally, the pipeline portion extends or contracts in the horizontal movement direction of the processing chamber and the base.