TW201816518A - Method for forming coating film, apparatus for forming coating film and computer-readable recording medium - Google Patents

Method for forming coating film, apparatus for forming coating film and computer-readable recording medium Download PDF

Info

Publication number
TW201816518A
TW201816518A TW106124476A TW106124476A TW201816518A TW 201816518 A TW201816518 A TW 201816518A TW 106124476 A TW106124476 A TW 106124476A TW 106124476 A TW106124476 A TW 106124476A TW 201816518 A TW201816518 A TW 201816518A
Authority
TW
Taiwan
Prior art keywords
liquid
nozzle
heating
coating film
coating
Prior art date
Application number
TW106124476A
Other languages
Chinese (zh)
Other versions
TWI775762B (en
Inventor
岡本芳樹
宮本哲嗣
大村和久
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201816518A publication Critical patent/TW201816518A/en
Application granted granted Critical
Publication of TWI775762B publication Critical patent/TWI775762B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02Spray pistols; Apparatus for discharge
    • B05B7/04Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • B05B7/22Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed electrically, magnetically or electromagnetically, e.g. by arc
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Abstract

This method for producing a coating film comprises: a first step for heating a body W to be processed, which comprises a substrate W1 and a projected part W2 provided on the surface of the substrate W1; a second step for obtaining a heated liquid by heating a coating liquid; and a third step for spraying the heated liquid in the form of droplets from a nozzle N onto the surface of the body W to be processed, which has been heated in the first step.

Description

塗佈膜形成方法、塗佈膜形成裝置及電腦可讀取的記錄媒體Coating film forming method, coating film forming apparatus, and computer-readable recording medium

[0001] 本揭示係關於塗佈膜形成方法、塗佈膜形成裝置及電腦可讀取的記錄媒體。[0001] The present disclosure relates to a coating film forming method, a coating film forming apparatus, and a computer-readable recording medium.

[0002] 專利文獻1揭示對在基板(晶圓)之表面設置凸部(突起、突條等)之被處理體,形成塗佈液(例如,抗蝕膜)之方法。該方法包含邊在被處理體之表面之上方使噴嘴蛇行移動,邊從噴嘴噴霧塗佈液液滴之時,藉由加熱手段加熱被處理體。 [先前技術文獻] [專利文獻]   [0003]   [專利文獻1]日本特開2005-019560號公報[0002] Patent Document 1 discloses a method of forming a coating liquid (for example, a resist film) on a processed object having convex portions (protrusions, ridges, etc.) provided on a surface of a substrate (wafer). This method includes heating the object to be treated by heating while spraying the coating liquid droplets from the nozzle while meandering the nozzle above the surface of the object to be treated. [Prior Art Document] [Patent Document] [0003] [Patent Document 1] Japanese Patent Laid-Open No. 2005-019560

[發明所欲解決之課題]   [0004] 專利文獻1所揭示之方法並非以塗佈液材料掩埋凸部彼此之間的空間,而係以沿著被處理體之表面(包含凸部之表面)而略均勻地形成塗佈膜為目的。但是,若藉由該方法時,能對被處理體之表面中隨著噴嘴之移動使得噴霧區域重疊之區域,在塗佈液之溶劑還未完全揮發之時,噴霧下一個塗佈液。因此,即使藉由加熱手段加熱被處理體,亦有塗佈液液滴之溶質(塗佈液材料粒子)定著於凸部之側壁面之前,塗佈液液滴(溶劑)流動,在凸部之基端側,尤其塗佈膜之膜厚變大之情形。   [0005] 在此,本揭示係說明能夠沿著包含凸部之被處理體之表面而更均勻地形成塗佈膜之塗佈膜形成方法、塗佈膜形成裝置及電腦可讀取的記錄媒體。 [用以解決課題之手段]   [0006] 與本揭示之一個的觀點有關的塗佈膜形成方法包含:第1工程,其係對包含基板和被設置在基板之表面的凸部之被處理體進行加熱;第2工程,其係對加熱塗佈液而取得第1加熱液體;及第3工程,其係對在第1工程中被加熱之後的被處理體之表面,在液滴之狀態下從噴嘴噴吹第1加熱液體。   [0007] 在本揭示之一個觀點有關的塗佈膜形成方法中,對被處理體之表面噴吹塗佈液之時,在第2工程中,加熱塗佈液使成為第1加熱液體。因此,因當第1加熱液體從噴嘴噴出時,緊接著溶媒(溶劑)揮發,塗佈液中之材料粒子(溶質)之濃度變高,故成為塗佈液(第1加熱液體)之流動性下降之狀態。因此,在被處理體之表面(凹凸面)中,液滴彼此凝聚而流動之情形被抑制。其結果,塗佈液之材料粒子容易均勻地附著於被處理體之表面。藉由上述,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0008] 除此之外,與本揭示之一個觀點有關之塗佈膜形成方法中,在第3工程中,對在第1工程中被加熱之後的被處理體之表面,在液滴之狀態下從噴嘴噴吹第1加熱液體。因此,因於第3工程之前,被處理體被加熱,故在被處理體之表面全體,在第3工程中被噴吹之塗佈液之溶媒(溶劑)受到來自被處理體之熱而揮發。因此,在被處理體之表面(凹凸面)中,液滴彼此凝聚而流動之情形更被抑制。因此,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0009] 即使在第2工程中加熱塗佈液,以使噴嘴之出口中之第1加熱液體的溫度成為塗佈液所含之溶劑之沸點的1/2以下亦可。塗佈液之溶媒(溶劑)溫度越高越促進揮發,但是當揮發量增加太多時,從噴嘴被噴出之液滴到達至被處理體之表面之前會固化。另外,當加熱塗佈液使噴嘴之出口中之第1加熱液體之溫度成為塗佈液所含之溶劑之沸點之1/2以下時,從噴嘴被噴吹之液滴到達至被處理體之表面之前變得難固化。   [0010] 即使在第2工程中,加熱塗佈液使噴嘴之出口中的第1加熱液體之溫度成為35℃~60℃亦可。在此情況下,從噴嘴被噴吹之液滴到達至被處理體之表面前變得更難固化。   [0011] 即使在第2工程中,藉由在噴嘴內混合塗佈液和被加熱之氣體,加熱塗佈液而取得第1加熱液體亦可。在此情況下,直至塗佈液從噴嘴即將被吐出之前,塗佈液之流動性維持在高的狀態。因此,變得容易在液滴之狀態下從噴嘴噴吹塗佈液。因此,可以以簡單之方法因應在從噴嘴吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體之表面這樣的相反要求。   [0012] 即使在第2工程中,在較噴嘴上游側,藉由加熱器加熱塗佈液而取得第1加熱液體亦可。在此情況下,直至塗佈液從噴嘴即將被吐出之前,能維持塗佈液之流動性。因此,變得容易在液滴之狀態下從噴嘴噴吹塗佈液。因此,可以以簡單之方法因應在從噴嘴吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體之表面這樣的相反要求。   [0013] 與本揭示之一個的觀點有關的塗佈膜形成方法即使進一步包含:第4工程,其係於第3工程之後,加熱塗佈液而取得第2加熱液體;第5工程,其係於第4工程之後,對形成有塗佈膜之被處理體之表面,在液滴之狀態下從噴嘴噴吹第2加熱液體,第4工程中之第2加熱液體之溫度被設定成高於第2工程中之第1加熱液體之溫度亦可。在此情況下,因有第1加熱液體之溫度相對性低,並且從噴嘴被噴吹之液滴的流動性高的傾向,故在第3工程中被噴吹至被處理體之表面的液滴容易進入至被處理體中狹隘的凹部。另外,因有第2加熱液體之溫度相對性高,並且從噴嘴被噴吹之液滴的流動性低的傾向,故在第5工程中被噴吹至被處理體之表面的液滴容易附著於被處理體之凸部之側面。因此,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0014] 即使在第3工程中,對被處理體之表面從噴嘴噴吹液滴,並且邊使與噴嘴不同的氣體噴嘴追隨著噴嘴,邊從氣體噴嘴對被處理體之表面中液滴之噴吹處噴吹被加熱的氮氣亦可。在此情況下,因在液滴之噴吹中進行溶劑之乾燥,故可以縮短在被處理體之表面形成塗佈膜所需之時間。   [0015] 與本揭示之其他觀點有關之塗佈膜形成裝置具備:第1加熱部,其係被構成加熱塗佈液;第2加熱部,其係被構成加熱包含基板和被設置在基板之表面的凸部之被處理體;供給部,其具有噴嘴;及控制部,控制部實行第1處理,其係控制第2加熱部而加熱被處理體,和第2處理,其係控制第1加熱部及供給部,對藉由第1處理而被加熱之後的被處理體之表面,在液滴之狀態下從噴嘴噴出藉由第1加熱部被加熱之塗佈液亦即第1加熱液體。   [0016] 在本揭示之其他觀點有關的塗佈膜形成裝置中,對被處理體之表面噴吹塗佈液之時,控制部實行加熱塗佈液使成為第1加熱液體的第2處理。因此,因當第1加熱液體從噴嘴噴出時,緊接著溶媒(溶劑)揮發,塗佈液中之材料粒子(溶質)之濃度變高,故成為塗佈液(第1加熱液體)之流動性下降之狀態。因此,在被處理體之表面(凹凸面)中,液滴彼此凝聚而流動之情形被抑制。其結果,塗佈液之材料粒子變得容易均勻地附著於被處理體之表面。藉由上述,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0017] 除此之外,在與本揭示之其他觀點有關之塗佈膜形成裝置中,控制部在第2處理中,控制第1加熱部及供給部,從噴嘴對藉由第1處理被加熱之後的被處理體之表面噴吹液滴。因此,因於第2處理之前,被處理體被加熱,故在被處理體之表面全體,在第2處理中被噴吹之塗佈液之溶媒(溶劑)受到來自被處理體之熱而揮發。因此,在被處理體之表面(凹凸面)中,液滴彼此凝聚而流動之情形被抑制。因此,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0018] 即使在第1加熱部加熱塗佈液,以使噴嘴之出口中之第1加熱液體的溫度成為塗佈液所含之溶劑之沸點的1/2以下亦可。塗佈液之溶媒(溶劑)溫度越高越促進揮發,但是當揮發量增加太多時,從噴嘴被噴出之液滴到達至被處理體之表面之前會固化。另外,當加熱塗佈液使噴嘴之出口中之第1加熱液體之溫度成為塗佈液所含之溶劑之沸點之1/2以下時,從噴嘴被噴吹之液滴到達至被處理體之表面之前變得難固化。   [0019] 即使第1加熱部加熱塗佈液使噴嘴之出口中的第1加熱液體之溫度成為35℃~60℃亦可。在此情況下,從噴嘴被噴吹之液滴到達至被處理體之表面前變得更難固化。   [0020] 即使第1加熱部被構成藉由對噴嘴供給被加熱之氣體而在噴嘴內混合氣體和塗佈液,加熱塗佈液亦可。在此情況下,直至塗佈液從噴嘴即將被吐出之前,塗佈液之流動性維持在高的狀態。因此,變得容易在液滴之狀態下從噴嘴噴吹塗佈液。因此,可以以簡單之方法因應在從噴嘴吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體之表面這樣的相反要求。   [0021] 即使第1加熱部係在較噴嘴上游側加熱塗佈液的加熱器亦可。在此情況下,直至塗佈液從噴嘴即將被吐出之前,能維持塗佈液之流動性。因此,變得容易在液滴之狀態下從噴嘴噴吹塗佈液。因此,可以以簡單之方法因應在從噴嘴吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體之表面這樣的相反要求。   [0022] 即使控制部於第2處理後,進一步實行第3處理,其係控制第1加熱部及供給部,對被處理體之表面,在液滴之狀態下從噴嘴噴吹藉由第1加熱部被加熱之塗佈液亦即第2加熱液體,第3處理中之第2加熱液體之溫度被設定成較第2處理中之第1加熱液體之溫度高亦可。在此情況下,因有第1加熱液體之溫度相對性低,並且從噴嘴被噴吹之液滴的流動性高的傾向,故在第2處理中被噴吹至被處理體之表面的液滴容易進入至被處理體中狹隘的凹部。另外,因有第2加熱液體之溫度相對性高,並且從噴嘴被噴吹之液滴的流動性低的傾向,故在第3處理中被噴吹至被處理體之表面的液滴容易附著於被處理體之凸部之側面。因此,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。   [0023] 與本揭示之其他觀點有關之塗佈膜形成裝置即使進一步具備被構成使被加熱之氮氣從氣體噴嘴吐出之氣體供給部,控制部在第2處理中,控制第1加熱部及供給部,從噴嘴噴吹液滴,同時控制氣體供給部,邊使氣體噴嘴追隨噴嘴,邊從氣體噴嘴對被處理體之表面中液滴之噴吹處噴吹被加熱的氮氣亦可。在此情況下,因在液滴之噴吹中進行溶劑之乾燥,故可以縮短在被處理體之表面形成塗佈膜所需之時間。   [0024] 與本揭示之其他觀點有關之電腦可讀取的記錄媒體記錄用以使塗佈膜形成裝置實行上述塗佈膜形成方法之程式。與本揭示之其他觀點有關之電腦可讀取的記錄媒體中,與上述塗佈膜形成方法相同,能沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。在本說明書中,電腦可讀取的記錄媒體包含非暫時的有形媒體(non-transitory computer recording medium)(例如,各種主記憶裝置或輔助記憶裝置),或傳播訊號(transitory computer recording medium)(例如,可經由網路提供的資料訊號)。 [發明效果]   [0025] 若藉由與本揭示有關之塗佈膜形成方法、塗佈膜形成裝置及電腦可讀取的記錄媒體時,能夠沿著包含凸部之被處理體之表面更均勻地形成塗佈膜。[Problems to be Solved by the Invention] [0004] The method disclosed in Patent Document 1 does not bury the space between the convex portions with the coating liquid material, but rather follows the surface of the object to be treated (the surface including the convex portions). The objective is to form a coating film evenly. However, if this method is used, the next coating liquid can be sprayed on the area of the surface of the object to be processed where the spraying area overlaps with the movement of the nozzle. When the solvent of the coating liquid has not completely evaporated. Therefore, even if the object to be processed is heated by heating means, the solute (coating material particles) of the coating liquid droplets is fixed on the side wall surface of the convex portion, and the coating liquid droplets (solvent) flow and the The base end side of the film is particularly thick when the thickness of the coating film is large. [0005] Here, the present disclosure describes a coating film forming method, a coating film forming apparatus, and a computer-readable recording medium capable of forming a coating film more uniformly along the surface of a processing object including a convex portion. . [Means to Solve the Problem] [0006] A method for forming a coating film according to one aspect of the present disclosure includes a first process for a processed object including a substrate and a convex portion provided on a surface of the substrate. Heating; the second process is to obtain the first heating liquid by heating the coating liquid; and the third process is to subject the surface of the object to be processed after being heated in the first process in the state of droplets The first heating liquid is sprayed from the nozzle. [0007] In the coating film forming method according to one aspect of the present disclosure, when the coating liquid is sprayed on the surface of the object to be processed, in the second process, the coating liquid is heated to become the first heating liquid. Therefore, when the first heating liquid is ejected from the nozzle, immediately after the solvent (solvent) evaporates, the concentration of material particles (solutes) in the coating liquid becomes high, so it becomes the fluidity of the coating liquid (first heating liquid) A state of decline. Therefore, on the surface (concavo-convex surface) of the object to be treated, the liquid droplets are condensed and flowed with each other. As a result, the material particles of the coating liquid easily adhere to the surface of the object to be treated uniformly. According to the above, the coating film can be formed more uniformly along the surface of the object including the convex portion. [0008] In addition, in the coating film forming method related to one aspect of the present disclosure, in the third process, the surface of the object to be processed after being heated in the first process is in a state of droplets. The first heating liquid is sprayed from below the nozzle. Therefore, since the object to be treated was heated before the third process, the solvent (solvent) of the coating liquid sprayed in the third process was volatilized by the object to be treated on the entire surface of the object to be treated. . Therefore, on the surface (concavo-convex surface) of the object to be treated, droplets are condensed and flow to each other. Therefore, a coating film can be formed more uniformly along the surface of a to-be-processed body including a convex part. [0009] It is acceptable to heat the coating liquid in the second process so that the temperature of the first heating liquid at the nozzle outlet becomes ½ or less of the boiling point of the solvent contained in the coating liquid. The higher the temperature of the solvent (solvent) of the coating liquid, the more the volatilization is promoted, but when the volatilization amount is increased too much, the droplets ejected from the nozzle will solidify before reaching the surface of the object to be processed. In addition, when the temperature of the first heating liquid at the outlet of the nozzle is heated to be less than 1/2 of the boiling point of the solvent contained in the coating liquid, the liquid droplets sprayed from the nozzle reach the object to be treated. The surface became difficult to cure before. [0010] Even in the second process, the coating liquid may be heated so that the temperature of the first heating liquid at the outlet of the nozzle becomes 35 ° C to 60 ° C. In this case, it becomes more difficult for the droplets sprayed from the nozzle to reach the surface of the object to be cured. [0011] Even in the second process, the first heating liquid may be obtained by mixing the coating liquid and the heated gas in the nozzle and heating the coating liquid. In this case, the fluidity of the coating liquid is maintained in a state immediately before the coating liquid is discharged from the nozzle. Therefore, it becomes easy to spray the coating liquid from the nozzle in the state of a droplet. Therefore, it is possible to generate droplets in a simple manner in response to the fluidity of the coating liquid before being ejected from the nozzle, and to reduce the fluidity of the coating liquid after being ejected from the nozzle. The opposite requirement is that the material particles adhere uniformly to the surface of the object to be treated. [0012] Even in the second process, the first heating liquid may be obtained by heating the coating liquid with a heater on the upstream side of the nozzle. In this case, the fluidity of the coating liquid can be maintained until immediately before the coating liquid is discharged from the nozzle. Therefore, it becomes easy to spray the coating liquid from the nozzle in the state of a droplet. Therefore, it is possible to generate droplets in a simple manner in response to the fluidity of the coating liquid before being ejected from the nozzle, and to reduce the fluidity of the coating liquid after being ejected from the nozzle. The opposite requirement is that the material particles adhere uniformly to the surface of the object to be treated. [0013] The coating film forming method related to one aspect of the present disclosure further includes a fourth process, which is after the third process, and the coating liquid is heated to obtain a second heating liquid; and a fifth process, which is a system After the 4th process, the second heating liquid is sprayed from a nozzle on the surface of the object to be coated with the coating film, and the temperature of the second heating liquid in the 4th process is set to be higher than The temperature of the first heating liquid in the second process is also acceptable. In this case, since the temperature of the first heating liquid is relatively low and the fluidity of the droplets sprayed from the nozzle is high, the liquid sprayed onto the surface of the object to be processed in the third process Drops easily enter the narrow recesses in the object. In addition, since the temperature of the second heating liquid is relatively high and the fluidity of the droplets sprayed from the nozzle is low, the droplets sprayed onto the surface of the object to be treated in the fifth process are likely to adhere. On the side of the convex part of the object. Therefore, a coating film can be formed more uniformly along the surface of a to-be-processed body including a convex part. [0014] Even in the third process, the droplets are sprayed from the nozzle on the surface of the object to be treated, and the gas nozzles different from the nozzles are caused to follow the nozzles, while the liquid droplets It is also possible to spray heated nitrogen gas at the spraying place. In this case, since the solvent is dried during the blowing of the droplets, the time required to form a coating film on the surface of the object can be shortened. [0015] A coating film forming apparatus related to another aspect of the present disclosure includes: a first heating section configured to heat a coating liquid; and a second heating section configured to heat a substrate including a substrate and a substrate provided thereon. The object to be processed on the convex portion of the surface; the supply unit having a nozzle; and the control unit, the control unit performs the first process, which controls the second heating unit to heat the object, and the second process, which controls the first The heating portion and the supply portion spray the liquid on the surface of the object heated by the first treatment from the nozzle in the state of droplets, and the first heating liquid is the coating liquid heated by the first heating portion. . [0016] In the coating film forming apparatus according to another aspect of the present disclosure, when the coating liquid is sprayed on the surface of the object to be processed, the control unit performs a second process of heating the coating liquid to become the first heating liquid. Therefore, when the first heating liquid is ejected from the nozzle, immediately after the solvent (solvent) evaporates, the concentration of material particles (solutes) in the coating liquid becomes high, so it becomes the fluidity of the coating liquid (first heating liquid). A state of decline. Therefore, on the surface (concavo-convex surface) of the object to be treated, the liquid droplets are condensed and flowed with each other. As a result, the material particles of the coating liquid easily adhere to the surface of the object to be treated uniformly. According to the above, the coating film can be formed more uniformly along the surface of the object including the convex portion. [0017] In addition, in the coating film forming apparatus related to another aspect of the present disclosure, the control unit controls the first heating unit and the supply unit in the second process, and is controlled from the nozzle pair by the first process. Liquid droplets are sprayed on the surface of the object after heating. Therefore, since the object to be treated is heated before the second treatment, the solvent (solvent) of the coating liquid sprayed in the second treatment is volatilized by the object to be treated on the entire surface of the object to be treated. . Therefore, on the surface (concavo-convex surface) of the object to be treated, the liquid droplets are condensed and flowed with each other. Therefore, a coating film can be formed more uniformly along the surface of a to-be-processed body including a convex part. [0018] Even if the coating liquid is heated in the first heating section, the temperature of the first heating liquid at the nozzle outlet may be made equal to or less than 1/2 of the boiling point of the solvent contained in the coating liquid. The higher the temperature of the solvent (solvent) of the coating liquid, the more the volatilization is promoted, but when the volatilization amount is increased too much, the droplets ejected from the nozzle will solidify before reaching the surface of the object to be processed. In addition, when the temperature of the first heating liquid at the outlet of the nozzle is heated to be less than 1/2 of the boiling point of the solvent contained in the coating liquid, the liquid droplets sprayed from the nozzle reach the object to be treated. The surface became difficult to cure before. [0019] Even if the first heating part heats the coating liquid so that the temperature of the first heating liquid at the nozzle outlet becomes 35 ° C to 60 ° C. In this case, it becomes more difficult for the droplets sprayed from the nozzle to reach the surface of the object to be cured. [0020] Even if the first heating section is configured to supply the heated gas to the nozzle, and the gas and the coating liquid are mixed in the nozzle, the coating liquid may be heated. In this case, the fluidity of the coating liquid is maintained in a state immediately before the coating liquid is discharged from the nozzle. Therefore, it becomes easy to spray the coating liquid from the nozzle in the state of a droplet. Therefore, it is possible to generate droplets in a simple manner in response to the fluidity of the coating liquid before being ejected from the nozzle, and to reduce the fluidity of the coating liquid after being ejected from the nozzle. The opposite requirement is that the material particles adhere uniformly to the surface of the object to be treated. [0021] Even if the first heating section is a heater that heats the coating liquid on the upstream side of the nozzle. In this case, the fluidity of the coating liquid can be maintained until immediately before the coating liquid is discharged from the nozzle. Therefore, it becomes easy to spray the coating liquid from the nozzle in the state of a droplet. Therefore, it is possible to generate droplets in a simple manner in response to the fluidity of the coating liquid before being ejected from the nozzle, and to reduce the fluidity of the coating liquid after being ejected from the nozzle. The opposite requirement is that the material particles adhere uniformly to the surface of the object to be treated. [0022] Even if the control unit further performs the third process after the second process, the control unit controls the first heating unit and the supply unit, and sprays the surface of the object to be treated from the nozzle in the state of liquid droplets through the first The coating liquid that is heated by the heating portion is the second heating liquid, and the temperature of the second heating liquid in the third process may be set higher than the temperature of the first heating liquid in the second process. In this case, since the temperature of the first heating liquid is relatively low and the fluidity of the droplets sprayed from the nozzle is high, the liquid sprayed onto the surface of the object to be processed in the second process Drops easily enter the narrow recesses in the object. In addition, because the temperature of the second heating liquid is relatively high and the fluidity of the droplets sprayed from the nozzle is low, the droplets sprayed onto the surface of the object to be treated in the third process are liable to adhere. On the side of the convex part of the object. Therefore, a coating film can be formed more uniformly along the surface of a to-be-processed body including a convex part. [0023] Even if the coating film forming apparatus related to another aspect of the present disclosure further includes a gas supply unit configured to discharge heated nitrogen gas from a gas nozzle, the control unit controls the first heating unit and the supply in a second process. It is also possible to spray liquid droplets from the nozzles and control the gas supply unit at the same time, while blowing the heated nitrogen gas from the gas nozzles on the surface of the object to be sprayed while the gas nozzles follow the nozzles. In this case, since the solvent is dried during the blowing of the droplets, the time required to form a coating film on the surface of the object can be shortened. [0024] A computer-readable recording medium related to other aspects of the present disclosure records a program for causing a coating film forming apparatus to execute the coating film forming method described above. In the computer-readable recording medium related to the other aspects of the present disclosure, the coating film can be formed more uniformly along the surface of the object to be processed including the convex portion in the same manner as the coating film forming method described above. In this manual, computer-readable recording media include non-transitory computer recording medium (for example, various main memory devices or auxiliary memory devices), or transmission computer (recording medium) (for example, , Data signals that can be provided via the Internet). [Inventive Effect] [0025] If a coating film forming method, a coating film forming apparatus, and a computer-readable recording medium related to the present disclosure are used, it is possible to make the surface more uniform along the surface of the object including the convex portion. A coating film is formed.

[0027] 因與以下說明之本揭示有關的實施型態為用以說明本發明之例示,本發明不應限定於以下之內容。在以下之說明中,對具有相同要素或相同機能之要素,使用相同符號,省略重複說明。   [0028] [塗佈膜形成裝置]   首先,針對塗佈膜形成裝置1之概要予以說明。塗佈膜形成裝置1係在被處理體W(參照圖6等)之表面上形成塗佈膜R(參照同圖等)的裝置。   [0029] 在此,被處理體W如圖6等所示般,具有基板(晶圓)W1和至少一個凸部W2。基板W1即使呈現圓板狀亦可,即使圓形之一部分被切除亦可,即使呈現多角形等之圓形以外的形狀亦可。基板W1即使為例如半導體基板、玻璃基板、遮罩基板、FPD(Flat Panel Display)基板其他之各種基板亦可。凸部W2被設置在基板W1之表面W1a上。凸部W2若從基板W1之表面W1a朝外方突出即可。凸部W2之形狀即使為長方體形狀其他各種的形狀亦可,不受任何限制。凸部W2之材質若可以在凸部W2之表面W2a(露出於外部之上面及外周面)形成塗佈膜R時,即使為有機材料或無機材料亦可,不受任何限制。另外,在本說明書中,「被處理體W之表面」係指基板W1之表面W1a及凸部W2之表面W2a合併的面。   [0030] 塗佈膜R係藉由塗佈膜形成裝置1被形成在被處理體W之表面。作為構成塗佈膜R之材料,即使為光阻材料、彩色光阻材料、聚醯亞胺材料、SOC(Spin On Carbon)材料、金屬硬遮罩材料其他材料亦可,不受任何限制。作為光阻材料,即使為樹脂材料其他材料亦可,不受任何限定。光阻材料即使為例如特定波長之光線表示感光性的感光性材料亦可。該感光性材料即使為負型亦可,即使為正型亦可。   [0031] 塗佈膜形成裝置1如圖1~圖3所示般,具備載體區塊2、處理區塊3和控制器(控制部)CU。   [0032] 載體區塊2具有載體站21和搬入搬出部22。載體站21支撐複數載體10。載體10係在密封狀態下收容至少一個被處理體W。在載體10之側面10a設置用以取出放被處理體W之開關門(無圖示)。   [0033] 搬入搬出部22係位於載體站21及處理區塊3之間。搬入搬出部22如圖2所示般,具有複數開關門22a。在載體站21上載置載體10之時,成為載體10之開關門面對開關門22a之狀態。藉由同時開放開關門22a及側面10a之開關門,載體10內和搬入搬出部22內連通。搬入搬出部22內置收授臂A1。收授臂A1從載體10取出被處理體W而交給處理區塊3,從處理區塊3接取被處理體W而返回至載體10內。   [0034] 處理區塊3如圖2及圖3所示般,內置複數處理模組31、32、棚架部33及搬運臂A2。處理模組31、32例如圖2所示般,配置成沿著搬運臂A2之移動方向排列。   [0035] 處理模組31如圖3所示般,具有在上下方向排列之複數液處理單元U1、塗佈液源B1和氮氣源B2。液處理單元U1被構成在被處理體W之表面塗佈塗佈膜R之形成用的液體。塗佈液源B1及氮氣源B2被配置在液處理單元U1之下部。塗佈液源B1及氮氣源B2分別收容用以供給至液處理單元U1之塗佈液及氮氣(N2 氣體)。另外,塗佈液源B1收容的塗佈液係以溶劑(溶媒)稀釋塗佈液之材料粒子(溶質)者。作為該溶劑,若為適用於塗佈液材料粒子之稀釋的眾知者,則不受限制,例如即使使用異丙醇(以下,也稱為IPA)、丙二醇單甲基醚乙酸酯(以下,也稱為PGMEA)、γ-丁內酯(以下,也稱為GBL)等亦可。IPA之沸點為82.4℃。PGMEA之沸點為146℃。GBL之沸點為204℃。   [0036] 處理模組32如圖3所示般,具有在上下方向排列的複數熱處理單元U2(第2加熱部)。熱處理單元U2被構成每形成塗佈膜R,對被處理體W進行熱處理。作為熱處理之具體例,可舉出用以使塗佈液之溶劑揮發,或使塗佈液材料硬化之加熱處理等。   [0037] 棚架部33如圖2所示般,被配置在處理區塊3內之載體區塊2側。棚架部33係暫時性地收容被處理體W者,用於在收授臂A1和處理區塊3之間的被處理體W之收授。搬運臂A2係在棚架部33和處理模組31、32之間及處理模組31、32彼此之間搬運被處理體W。   [0038] 控制器CU部分性地或全體性地控制塗佈膜形成裝置1。控制器CU係如圖4所示般,作為機能模組,具有讀取部M1、記憶部M2、處理部M3和指示部M4。該些機能模組只不過係為了方便將控制器CU之機能區隔複數模組而已,不一定意味著構成控制器CU之硬體被分成如此的模組。各機能模組並不限定於藉由程式之實行而被實現者,即使為藉由專用之電路(例如邏輯電路)或將此予以積體之積體電路(ASIC:Application Specific Integrated Circuit)而實現者亦可。   [0039] 讀取部M1從電腦可讀取之記錄媒體200讀取程式。記錄媒體200記錄使塗佈膜形成裝置1實行各種動作之程式。作為記錄媒體200,即使為例如半導體記憶體、光記錄碟片、磁性記錄碟片、光磁性記錄碟片亦可。   [0040] 記憶部M2記憶各種資料。記憶部M2除了在例如讀取部M1中被讀取之程式之外,例如經由外部輸入裝置(無圖示)而記憶從操作員輸入之設定資料等。   [0041] 處理部M3處理各種資料。處理部M3係根據例如被記憶於記憶部M2之各種資料,生成用以使液處理單元U1及熱處理單元U2動作之訊號。   [0042] 指示部M4係將在處理部M3中生成之訊號發送至液處理單元U1或熱處理單元U2。   [0043] 控制器CU之硬體藉由例如一個或複數控制用之電腦所構成。控制器CU,就硬體上之構成而言,具有例如圖5所示之電路CU1。電路CU1即使由電路要素(circuitry)所構成亦可。電路CU1具體上具有處理器CU2、記憶體CU3、儲存器CU4、驅動器CU5和輸入輸出埠CU6。處理器CU2與記憶體CU3及儲存器CU4之至少一方協同作用而實行程式,實行經由輸入輸出埠CU6之訊號的輸入輸出,依此構成上述各機能模組。驅動器CU5係分別驅動塗佈膜形成裝置1之各種裝置的電路。輸入輸出埠CU6係在驅動器CU5和塗佈膜形成裝置1之各種裝置之間進行訊號之輸入輸出。   [0044] 在本實施型態中,雖然塗佈膜形成裝置1具備一個控制器CU,但是即使具備以複數之控制器CU所構成之控制群(控制部)亦可。於塗佈膜形成裝置1具備控制器群之情況下,即使上述機能模組分別藉由一個控制器CU實現亦可,即使藉由2個以上之控制器CU之組合實現亦可。在控制器CU由複數電腦(電路CU1)所構成之情況下,上述機能模組分別藉由一個電腦(電路CU1)實現亦可,即使藉由兩個以上電腦(電路CU1)之組合實現亦可。控制器CU即使具有複數處理器CU2亦可。在此情況下,即使上述機能模組分別藉由一個處理器CU2實現亦可,即使藉由兩個以上之處理器CU2之組合實現亦可。   [0045] [液處理單元之構成]   接著,參照圖6及圖7,針對液處理單元U1更詳細說明。液處理單元U1係如圖6所示般,具備旋轉保持部40、驅動部50、泵浦P、閥V、加熱器71和隔熱材72。   [0046] 旋轉保持部40具有旋轉部41和保持部42。旋轉部41具有突出至上方的轉軸43。旋轉部41係以例如電動馬達等作為動力源而使轉軸43旋轉。保持部42被設置在轉軸43之前端部。在保持部42上配置被處理體W。保持部42係藉由例如吸附等將被處理體W保持略水平。即是,旋轉保持部40係在被處理體W之姿勢略水平之狀態下,以被處理體W在對被處理體W之表面(基板W1之表面W1a)垂直的軸(旋轉軸)附近旋轉。在本實施型態中,因旋轉軸通過呈圓形狀之被處理體W(基板W1)之中心,故也係中心軸。在本實施型態中,如圖6所示般,旋轉保持部20係從上方觀看順時鐘旋轉使被處理體W旋轉。   [0047] 驅動部50被構成驅動噴嘴N。驅動部50具有導軌51、滑塊52和機械臂53。導軌51係在旋轉保持部40(被處理體W)之上方沿著水平方向延伸。滑塊52係以沿著導軌51能在水平方向移動之方式,被連接於導軌51。機械臂53係以成為能夠在上下方向移動之方式,被連接於滑塊52。在機械臂53之下端連接噴嘴N。在機械臂53內,形成塗佈液能夠流通之流路。該流路經由泵浦P而與塗佈液源B1連接。   [0048] 驅動部50係藉由例如電動馬達等之動力源(無圖示),使滑塊52及機械臂53移動,依此使噴嘴N移動。在俯視觀看下,噴嘴N係在塗佈液之吐出時,在與被處理體W之旋轉軸正交之直線上沿著被處理體W之徑向移動。   [0049] 噴嘴N係朝被處理體W之表面朝下方開口。噴嘴N即使為例如內部混合式之2流體噴嘴亦可,即使為外部混合式之2流體噴嘴亦可,即使為1流體噴嘴亦可。在本說明書中,以內部混合式之2流體噴嘴為例,邊參照圖7邊說明噴嘴N之構造。噴嘴N為具有呈略圓柱狀之本體N1和被連接於本體N1之側面的配管N2。配管N2係經由閥V及加熱器71而與氮氣源B2連接。   [0050] 在本體N1之內部形成流路N3、N4。流路N3係與被形成在機械臂53之內部的塗佈液之流路連通。流路N3係在本體N1內在上下方向延伸,下端與噴嘴N之吐出口N5連通。流路N4與配管N2連通。流路N4係在本體N1內從本體N1之外周面延伸至流路N3之下端附近。在流路N4與流路N3合流之合流部N6中,在流路N3流通之塗佈液和在流路N4流通之氮氣衝突被混合,生成塗佈液之微小的液滴(塗佈液液滴)。該液滴從吐出口N5朝向被處理體W之表面被噴吹(被噴霧)。離吐出口N5之被處理體W之表面的高度位置(在垂直方向之吐出口N5和被處理體W之表面的直線距離),雖然係依據被處理體W之大小、塗佈液之流量、塗佈液之流速、塗佈液之加熱溫度(詳細後述)等而適當設定,但是即使為例如50mm~100mm左右亦可,即使為65mm~80mm左右亦可,70mm~75mm左右亦可。   [0051] 泵浦P係如圖6所示般,接受來自控制器CU之控制訊號,將塗佈液從塗佈液源B1送出至噴嘴N。泵浦P、機械臂53、噴嘴N(流路N3)及塗佈液源B1係如圖7所示般,構成用以對被處理體W供給塗佈液之供給部60。   [0052] 閥V係如圖6所示般,接受來自控制器CU之控制訊號,將氮氣從氮氣源B2送出至噴嘴N。   [0053] 加熱器71係接受來自控制器CU之控制訊號,將從氮氣源B2被送出之氮氣加熱至特定溫度(較室溫高的溫度)。因此,當藉由加熱器71被加熱之氮氣在合流部N6與塗佈液合流時,塗佈液被加熱而成為加熱液體。即是,加熱液體在液滴之狀態下從噴嘴N之吐出口N5被噴吹。   [0054] 在此,即使以在噴嘴N之吐出口N5之加熱液體(塗佈液之液滴)之溫度成為塗佈液之溶媒(溶劑)之沸點之1/2以下之方式,設定加熱器71所致的氮氣之加熱量亦可(第1溫度範圍)。具體而言,在吐出口N5之加熱液體之溫度在溶劑為IPA之時,即使為41.2℃以下亦可,在溶劑為PGMEA之時,即使為73℃以下亦可,溶劑為GBL之時,即使為102℃以下亦可。在此情況下,因與被加熱之氮氣混合之後的塗佈液難成為高溫,故溶媒(溶劑)之揮發量變得太多之情形被抑制,從噴嘴N被噴吹之液滴到達至被處理體W之表面之前難固化。   [0055] 或是,即使以在噴嘴N之吐出口N5之加熱液體(塗佈液之液滴)之溫度成為35℃~60℃之方式,設定加熱器71所致的氮氣之加熱量亦可(第2溫度範圍)。在此情況下,也係從噴嘴被噴吹之液滴到達至被處理體之表面前變得難固化。或是,即使以在噴嘴N之吐出口N5之加熱液體(塗佈液之液滴)之溫度滿足上述第1及第2溫度範圍之雙方之方式,設定加熱器71所致的氮氣之加熱量亦可(第3溫度範圍)。   [0056] 隔熱材72被配置在配管N2之周圍,在配管N2之內外抑制熱的移動。因此,隔熱材72係在藉由加熱器71被加熱之塗佈液(加熱液體)從吐出口N5吐出為止之期間,抑制加熱液體之溫度的下降。   [0057] 閥V、配管N2、噴嘴N(流路N4)、氮氣源B2及加熱器71構成用以將被加熱之氮氣供給至噴嘴N,同時藉由被加熱之氮氣加熱塗佈液的加熱供給部70(第1加熱部)。   [0058] [熱處理單元之構成]   接著,參照圖8及圖9,針對熱處理單元U2之構成予以說明。熱處理單元U2在框體100內具有加熱被處理體W之加熱室110,和搬運被處理體W之搬運機構120。在框體100中與搬運機構120對應之部分的兩側壁,形成用以將被處理體W搬入至框體100之內部,同時將被處理體W搬出至框體100外的搬入搬出口101。   [0059] 加熱室110具有蓋部111和熱板收容部112。蓋部111位於熱板收容部112之上方,能夠在從熱板收容部112間隔開之上方位置和被載置於熱板收容部112之下方位置之間上下移動。蓋部111在位於下方位置之時,與熱板收容部112同時構成處理室PR。在蓋部111之中央設置有排氣部111a。排氣部111a被使用於從處理室PR排出氣體。   [0060] 熱板收容部112呈圓筒狀,在其內部收容熱板113。熱板113之外周部藉由支撐構件114被支撐。支撐構件114之外周藉由呈筒狀之支撐環115被支撐。在支撐環115之上面,形成朝上方開口之氣體供給口115a。氣體供給口115a係對處理室PR內噴出惰性氣體。   [0061] 熱板113係如圖9所示般,為呈圓形狀之平板。熱板113之外形即使大於被處理體W之外形。在熱板113形成3個在其厚度方向貫通而延伸的貫通孔HL(參照圖9)。在熱板113之上面,豎立設置支撐被處理體W之6個支撐銷113a(參照圖8)。支撐銷113a之高度即使為例如100μm程度亦可。   [0062] 返回圖8,在熱板113之下面配置加熱器116。加熱器116被連接於控制器CU,根據來自控制器CU之指示訊號被控制。   [0063] 在熱板113之下方配置有升降機構119。升降機構119具有被配置在框體100外之馬達119a,和藉由馬達119a上下移動之3個升降銷119b。升降銷119b分別構成能夠通過對應的貫通孔HL。當控制器CU發送上升訊號或下降訊號至馬達119a時,升降銷119b邊在對應的貫通孔HL內移動邊上升下降。在升降銷119b之前端突出至熱板113之上方之情況下,能在升降銷119b之前端上載置被處理體W。被載置於升降銷119b之前端上之被處理體W隨著升降銷119b之上下移動而升降。   [0064] 搬運機構120與加熱室110鄰接設置。搬運機構120具有載置被處理體W之搬運板121。搬運板121係如圖9所示般,為呈矩形狀之平板。搬運板121中加熱室110側之端部呈現朝向加熱室110突出的圓弧狀。   [0065] 搬運板121被安裝在朝向加熱室110側延伸之軌道122。搬運板121係藉由驅動部123被驅動,能在軌道122上水平移動。被移動至加熱室110側之搬運板121位於熱板113之上方。   [0066] 在搬運板121形成沿著軌道122之延伸方向延伸的兩條縫隙124。縫隙124被形成在搬運板121中從加熱室110側之端部延伸至搬運板121之中央部附近。藉由縫隙124,防止移動至加熱室110側之搬運板121和突出至熱板113上之升降銷119b的干擾。   [0067] 如圖8所示般,在搬運板121之下方配置升降機構125。升降機構125具有被配置在框體100外之馬達125a,和藉由馬達125a上下移動之3個升降銷125b。升降銷125b分別被構成能夠通過縫隙124。當控制器CU發送上升訊號或下降訊號至馬達125a時,升降銷125b邊在縫隙124內移動邊上升下降。在升降銷125b之前端突出至搬運板121之上方之情況下,能在升降銷125b之前端上載置被處理體W。被載置於升降銷125b之前端上之被處理體W隨著升降銷125b之上下移動而升降。   [0068] [塗佈膜之形成方法]   接著,針對在被處理體W之表面形成塗佈膜R之方法(塗佈膜形成方法),參照圖10及圖11予以說明。首先,控制器CU控制收授臂A1,藉由收授臂A1將載體10內之被處理體W搬運至棚架部33。接著,控制器CU控制搬運臂A2,藉由搬運臂A2從棚架部33取出被處理體W,搬運至熱處理單元U2。在熱處理單元U2中,控制器CU控制搬運機構120(搬運板121),被處理體W被搬運至加熱室110內(步驟S1)。當被處理體W被載置於熱板113上時,控制器CU控制升降機構119,藉由升降機構119使蓋部111下降至下方位置。依此,被處理體W被收容至以蓋部111和熱板收容部112所構成之處理室PR內。   [0069] 接著,控制器CU控制加熱室110,藉由加熱室110將被處理體W加熱至特定溫度(步驟S2:第1工程;第1處理)。在加熱室110中之被處理體W之加熱溫度即使為被設定成較液滴所含之溶劑之沸點低0℃~30℃的溫度亦可。當加熱室110所致之被處理體W的加熱溫度為較液滴所含的溶劑之沸點低30℃的溫度以上時,變得容易促進在後述的步驟S5中被噴吹之液滴的溶劑之揮發。因此,液滴滯留在被處理體W之凹部(凸部W2之間),在凸部W2之基端側,尤其塗佈膜R之膜厚變大之情形被抑制。當加熱室110所致之被處理體W之加熱溫度為較液滴所含之溶劑之沸點低0℃的溫度(即是,與沸點相等之溫度)以下時,在後述之步驟S5被噴吹之液滴到達至被處理體W之表面之前,液滴之溶劑幾乎揮發的事態難以發生。因此,塗佈液液滴所含之塗佈液材料粒子在保持其形狀之原樣下逐次堆積於被處理體W之表面之情形被抑制。   [0070] 於塗佈液之溶劑為IPA之情況下,由於IPA之沸點為82.4℃,故即使在加熱室110中之被處理體W之加熱溫度被設定成55℃~85℃程度亦可。於塗佈液之溶劑為PGMEA之情況下,由於PGMEA之沸點為146℃,故即使在加熱室110中之被處理體W之加熱溫度被設定成110℃~150℃程度亦可。於塗佈液之溶劑為GBL之情況下,由於GBL之沸點為204℃,故即使在加熱室110中之被處理體W之加熱溫度被設定成150℃~205℃程度亦可。   [0071] 接著,控制器CU控制升降機構119及搬運機構120,從加熱室110搬出被加熱之被處理體W。接著,控制器CU控制搬運臂A2,藉由搬運臂A2從熱處理單元U2取出被處理體W,搬運至液處理單元U1(步驟S3)。被處理體W藉由加熱室110被加熱後搬運至液處理單元U1為止所需之時間為例如數秒~10秒程度。該搬運之時,被加熱的被處理體W之溫度能下降例如20℃~30℃程度。   [0072] 當被處理體W被搬運至液處理單元U1,保持在旋轉保持部40之保持部42時,控制器CU控制旋轉部41,使被處理體W旋轉驅動(步驟S4)。在該狀態下,控制器CU控制驅動部50、泵浦P、閥V及加熱器71,一面使噴嘴N在與被處理體W之旋轉軸正交之直線上沿著被處理體W之徑向移動,一面從噴嘴N之吐出口N5對旋轉之被處理體W之表面噴吹被加熱之塗佈液之液滴(加熱液體之液滴)(步驟S5;參照圖11(a);第3工程;第2處理)。   [0073] 此時,藉由加熱器71被加熱之氮氣被供給至噴嘴N,與塗佈液混合而形成加熱液體(第1加熱液體)(第2工程;第2處理)。因此,如圖11(a)所示般,液滴剛從噴嘴N被噴吹之後,液滴之溶劑揮發,液滴(塗佈液)之流動性下降。再者,此時,在步驟S2中被處理體W被加熱,被處理體W之表面成為特定溫度。因此,即將附著於被處理體W之前的液滴或附著於被處理體W之液滴之溶劑從被處理體W接受熱而揮發。依此,液滴之材料粒子(塗佈液材料)附著於被處理體W之表面(參照圖11(b))。藉由噴嘴N在被處理體W之表面移動一次或複數次來回移動,在被處理體W之表面上形成特定厚度的塗佈膜(參照圖11(c))。   [0074] 接著,控制器CU控制搬運臂A2,藉由搬運臂A2從液處理單元U1取出被處理體W,於被處理體W冷卻至特定溫度之後,搬運至棚架部33。此時,即使使用冷卻板等之冷卻機構而強制性地冷卻被處理體W亦可,即使為自然冷卻亦可。之後,控制器CU控制收授臂A1,藉由收授臂A1將被處理體W從棚架部33返回至載體10內(步驟S6)。依此,完成塗佈膜R之形成處理。   [0075] [作用]   在以上般之本實施型態中,將塗佈液噴吹於被處理體W之表面之時,加熱塗佈液使成為加熱液體。因此,因當加熱液體從噴嘴N噴出時,緊接著溶媒(溶劑)揮發,塗佈液中之材料粒子(溶質)之濃度變高,故成為塗佈液(加熱液體)之流動性下降之狀態。因此,在被處理體W之表面(凹凸面)中,液滴彼此凝聚而流動之情形被抑制。其結果,塗佈液之材料粒子變得容易均勻地附著於被處理體W之表面。藉由上述,能夠沿著包含凸部W2之被處理體W之表面更均勻地形成塗佈膜R。   [0076] 除此之外,因加熱液體剛從噴嘴N被噴吹之後,溶媒(溶劑)之揮發被促進,故為了使到達至被處理體W之表面的液滴之溶媒(溶劑)完全揮發,無須將被處理體W搬運至熱處理單元U2。因此,為了在被處理體W之表面形成期望之厚度的塗佈膜R,無須使被處理體W在液處理單元U1和熱處理單元U2之間來回。因此,能夠極縮短在被處理體W形成塗佈膜R之時間。   [0077] 在本實施型態中,於對被處理體W之表面噴吹液滴之前,在步驟S2中,在熱處理單元U2中加熱被處理體W。因此,在被處理體W之表面全體,在步驟S5中被噴吹之塗佈液之溶媒(溶媒)受到來自被處理體W之熱而揮發。因此,在被處理體W之表面(凹凸面)中,液滴彼此凝聚而流動之情形更被抑制。因此,能夠沿著包含凸部W2之被處理體W之表面更均勻地形成塗佈膜R。   [0078] 在本實施型態中,藉由在噴嘴N內,混合塗佈液和被加熱之氮氣,加熱塗佈液而取得加熱液體。因此,直至塗佈液從噴嘴N即將被吐出之前,塗佈液之流動性維持在高的狀態。因此,變得容易在液滴之狀態下從噴嘴N噴吹塗佈液。其結果,可以以簡單之方法因應在從噴嘴N吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴N吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體W之表面這樣的相反要求。   [0079] 在本實施型態中,在步驟S5中,在使被處理體W旋轉之狀態下,從噴嘴N對被處理體W之表面噴吹液滴。因此,比起在靜止的被處理體W之表面上一面使噴嘴N蛇行一面從噴嘴N對被處理體W之表面噴吹液滴之時,難對被處理體W之表面重複噴吹來自噴嘴N之液滴。因此,能夠沿著包含凸部W2之被處理體W之表面更加均勻地形成塗佈膜R。   [0080] [其他實施型態]   以上,雖然針對與本揭示有關之實施型態予以詳細說明,但是即使在本發明之主旨範圍內在上述實施型態追加各種變形亦可。例如,在本實施型態中,雖然藉由在熱處理單元U2進行藉由加熱室110加熱被處理體W之處理(步驟S2),在液處理單元U1進行從噴嘴N對被處理體W之表面噴吹塗佈液液滴之處理(步驟S5),但是即使使用具有液處理單元U1及熱處理單元U2之雙方之構成的處理室,在該處理室進行雙方之處理亦可。在此情況下,於加熱被處理體W之時,先使被處理體W之旋轉停止即可。   [0081] 在基板W1之徑向存在複數凸部W2之情況下,因越接近基板W1之旋轉軸,離心力越小,故當液滴在被處理體W之表面凝聚時,越靠近該旋轉軸的凸部W2凝聚的塗佈液越容易滯留。因此,當噴嘴N位於該旋轉軸之附近時,即使加快噴嘴N之移動速度亦可。在此情況下,在被處理體W之表面中,於該旋轉軸附近,因液滴之噴吹量變少,故塗佈液液滴變得難凝聚。   [0082] 控制器CU即使以噴嘴N之位置越接近基板W1之旋轉軸,越增大被處理體W之旋轉數之方式,控制旋轉部41亦可。此時,控制器CU即使控制旋轉部41,使不論噴嘴N之位置如何,噴嘴N之正下方的被處理體W之移動速度(線速度)皆成為一定亦可。控制器CU即使組合實行噴嘴N之位置越接近基板W1之旋轉軸,越增大被處理體W之旋轉數的控制,和噴嘴N越位於該旋轉軸之附近,越加快噴嘴N之移動速度的控制亦可。控制器CU即使控制旋轉部41,使不論噴嘴N對基板W1的位置如何,被處理體W之旋轉數皆成為一定亦可。   [0083] 在來自噴嘴N之液滴的噴吹區域為被處理體W之表面之大小以上等之情況下,即使不使噴嘴N移動亦可,即使不使被處理體W旋轉亦可。   [0084] 除了步驟S2之外,即使在將液滴從噴嘴N噴吹至被處理體W之表面的處理(步驟S5)時,加熱被處理體W亦可。或是,即使不進行事先加熱被處理體W之步驟S2的處理亦可。   [0085] 例如,如圖12所示般,即使液處理單元U1進一步具有被構成對被處理體W之表面噴吹被加熱之氮氣(高溫氮氣)的氣體噴嘴GN,根據來自控制器CU之指示而藉由氣體供給部控制氣體噴嘴GN之動作亦可。具體而言,在步驟S5中,即使控制部CU控制氣體供給部,邊使氣體噴嘴GN追隨噴嘴N,邊對被處理體W之表面中液滴之噴吹處,從氣體噴嘴GN噴吹高溫氮氣亦可。在此情況下,因在液滴之噴吹中,藉由來自氣體噴嘴GN之高溫氮氣而進行溶劑之乾燥,故可以縮短在被處理體W之表面形成塗佈膜R所需之時間。另外,該高溫氮氣之溫度即使為50℃~150℃程度亦可。   [0086] 在上述實施型態中,雖然藉由加熱器71加熱氮氣,藉由加熱的氮氣加熱塗佈液,但是即使如圖13所示般,在泵浦P之下游側並且機械臂53之上游側設置加熱器81而直接加熱塗佈液,以取代加熱器71亦可。在此情況下,直至塗佈液從噴嘴N即將被吐出之前,能維持塗佈液之流動性。因此,變得容易在液滴之狀態下從噴嘴N噴吹塗佈液。因此,可以以簡單之方法因應在從噴嘴N吐出前,欲提高塗佈液之流動性而生成液滴,另一方面在從噴嘴N吐出之後,欲降低塗佈液之流動性而使塗佈液之材料粒子均勻附著於被處理體W之表面這樣的相反要求。   [0087] 如圖14所示般,進一步設置連接閥V之上游側和加熱器71之下游側之旁通流路,同時在該旁通流路設置閥73亦可。在此情況下,藉由控制器CU控制閥V、73,可以選擇性地對噴嘴N供給藉由加熱器71被加熱的氮氣,和不藉由加熱器71被加熱的氮氣(常溫的氮氣)。具體而言,在對被處理體W之表面噴吹液滴的處理為第一次的情況下,即使藉由控制器CU閉鎖閥V,並且開啟閥73,相對性地降低加熱液體(第1加熱液體)之溫度亦可。另外,在對被處理體W之表面噴吹液滴的處理為第二次的情況下,即使藉由控制器CU開啟閥V,並且閉鎖閥73,相對性地提高加熱液體(第2加熱液體)之溫度亦可(第4工程;第3處理)。如此一來,第一次對處理體W之表面噴吹的液滴(第3工程;第2處理)因有流動性高之傾向,故容易進入至被處理體W中狹隘的凹部(凸部W2之間)。另外,因第二次以後對被處理體W之表面噴吹的液滴(第5工程;第3處理)有流動性低之傾向,故容易附著於被處理體W之凸部W2之側面。因此,能夠沿著包含凸部W2之被處理體W之表面更均勻地形成塗佈膜R。再者,為了抑制塗佈液之材料粒子在噴嘴N內固化,且噴嘴N堵塞,即使於進行來自噴嘴N之液滴的噴吹處理之後,藉由控制器CU閉鎖閥V,並且開啟閥73,對噴嘴N供給常溫之氮氣,冷卻噴嘴N亦可。   [0088] 如圖15所示般,為了抑制塗佈液之材料粒子在噴嘴N內固化,且噴嘴N堵塞,即使液處理單元U1進一步具有噴嘴N之洗淨部82亦可。洗淨部82係貯留例如溶劑的容器。藉由將進行液滴之噴吹處理的噴嘴N浸漬於洗淨部82內之溶劑,進行噴嘴N之冷卻及洗淨。   [0089] 作為被混合至塗佈液的氣體,即使使用氮氣以外之各種氣體(例如,惰性氣體、空氣等)亦可。 [實施例]   [0090] 於使用與本實施型態有關之塗佈膜形成裝置1而在被處理體W之表面形成塗佈膜R之情況下,因確認可以沿著包含凸部W2之被處理體W之表面均勻地形成塗佈膜R,故進行下述試驗。   [0091] 準備在直徑150mm之圓板狀之基板W1上設置複數凸部W2之被處理體W。再者,準備以PGMEA稀釋正型光阻的光阻液。   [0092] 接著,藉由熱處理單元U2以120℃在60秒期間加熱被處理體W。接著,將加熱後之被處理體W搬運至液處理單元U1,將所準備之光阻液從2流體噴嘴之噴嘴N噴吹至被處理體W之表面。此時,以在噴嘴N之正下方的被處理體W之移動速度(線速度)成為一定之方式,使旋轉保持部40所致的被處理體W之旋轉數在60rpm~600rpm之範圍內變動。再者,噴嘴N之移動速度為10mm/秒~150mm/秒。另外,在被處理體W之表面使噴嘴N來回14次。藉由上述,在被處理體W之表面形成光阻膜(塗佈膜R)。   [0093] 接著,針對任意的兩個凸部W2,以電子顯微鏡觀察剖面之樣子。在圖16(a)、(b)中,示意性地表示該兩個凸部W2之電子顯微鏡照片。確認出在任一的凸部W2,皆沿著包含凸部W2之被處理體W之表面而極均勻地形成光阻膜(塗佈膜R)。[0027] Since the embodiments related to the present disclosure described below are examples for explaining the present invention, the present invention should not be limited to the following. In the following description, the same reference numerals are used for elements having the same elements or the same functions, and redundant descriptions are omitted. [Coated Film Forming Apparatus] First, the outline of the coated film forming apparatus 1 will be described. The coating film forming apparatus 1 is an apparatus that forms a coating film R (see the same figure and the like) on the surface of the object to be processed W (see FIG. 6 and the like). [0029] Here, as shown in FIG. 6 and the like, the object to be processed W has a substrate (wafer) W1 and at least one convex portion W2. The substrate W1 may have a circular plate shape, a portion of a circle may be cut out, or a shape other than a circle such as a polygon. The substrate W1 may be, for example, various other substrates such as a semiconductor substrate, a glass substrate, a mask substrate, and a FPD (Flat Panel Display) substrate. The convex portion W2 is provided on the surface W1a of the substrate W1. It is sufficient if the convex portion W2 protrudes outward from the surface W1a of the substrate W1. The shape of the convex portion W2 may be any other shape, such as a rectangular parallelepiped shape, without any limitation. When the material of the convex portion W2 can form the coating film R on the surface W2a (the upper surface and the outer peripheral surface exposed to the outside) of the convex portion W2, even if it is an organic material or an inorganic material, there is no restriction. In addition, in this specification, "the surface of the to-be-processed object W" means the surface where the surface W1a of the board | substrate W1, and the surface W2a of the convex part W2 merge. [0030] The coating film R is formed on the surface of the object to be processed W by the coating film forming apparatus 1. As a material constituting the coating film R, any material such as a photoresist material, a color photoresist material, a polyimide material, a SOC (Spin On Carbon) material, and a metal hard mask material may be used without any restrictions. The photoresist material is not limited in any way, even if it is a resin material. The photoresist material may be, for example, a photosensitive material that exhibits light sensitivity with light of a specific wavelength. This photosensitive material may be a negative type or a positive type. [0031] As shown in FIGS. 1 to 3, the coating film forming apparatus 1 includes a carrier block 2, a processing block 3, and a controller (control unit) CU. [0032] The carrier block 2 includes a carrier station 21 and a loading / unloading unit 22. The carrier station 21 supports a plurality of carriers 10. The carrier 10 accommodates at least one object to be processed W in a sealed state. An opening / closing door (not shown) for taking out and placing the object to be processed W is provided on the side surface 10 a of the carrier 10. [0033] The loading / unloading unit 22 is located between the carrier station 21 and the processing block 3. As shown in FIG. 2, the loading / unloading unit 22 includes a plurality of opening / closing doors 22 a. When the carrier 10 is placed on the carrier station 21, it is in a state where the opening / closing surface of the carrier 10 faces the opening / closing door 22a. By opening the opening / closing door 22a and the opening / closing door at the side 10a at the same time, the inside of the carrier 10 and the inside of the carry-in / out portion 22 communicate with each other. The loading / unloading unit 22 has a receiving arm A1 built therein. The receiving arm A1 takes out the object W from the carrier 10 and delivers it to the processing block 3, and receives the object W from the processing block 3 and returns it to the carrier 10. [0034] As shown in FIGS. 2 and 3, the processing block 3 includes a plurality of processing modules 31 and 32, a shelf portion 33, and a transfer arm A2. As shown in FIG. 2, the processing modules 31 and 32 are arranged along the moving direction of the conveying arm A2. [0035] As shown in FIG. 3, the processing module 31 includes a plurality of liquid processing units U1, a coating liquid source B1, and a nitrogen source B2 arranged in the vertical direction. The liquid processing unit U1 is configured to apply a liquid for forming a coating film R to the surface of the object W to be processed. The coating liquid source B1 and the nitrogen source B2 are arranged below the liquid processing unit U1. The coating liquid source B1 and the nitrogen source B2 respectively contain a coating liquid and nitrogen (N 2 gas) to be supplied to the liquid processing unit U1. The coating liquid contained in the coating liquid source B1 is a material (solute) that dilutes the material of the coating liquid with a solvent (solvent). The solvent is not limited as long as it is known to be suitable for the dilution of coating liquid material particles. For example, even if isopropyl alcohol (hereinafter, also referred to as IPA), propylene glycol monomethyl ether acetate (hereinafter (Also referred to as PGMEA), γ-butyrolactone (hereinafter, also referred to as GBL), and the like. The boiling point of IPA is 82.4 ° C. PGMEA has a boiling point of 146 ° C. The boiling point of GBL is 204 ° C. [0036] As shown in FIG. 3, the processing module 32 includes a plurality of heat treatment units U2 (second heating sections) arranged in the up-down direction. The heat treatment unit U2 is configured to perform heat treatment on the object to be processed W every time the coating film R is formed. Specific examples of the heat treatment include heat treatment to volatilize the solvent of the coating liquid, or to harden the material of the coating liquid. [0037] As shown in FIG. 2, the shelf unit 33 is arranged on the carrier block 2 side in the processing block 3. The scaffolding unit 33 temporarily accommodates the person to be processed W, and is used for receiving and receiving the object W between the receiving arm A1 and the processing block 3. The transfer arm A2 transfers the object to be processed W between the shelf portion 33 and the processing modules 31 and 32 and between the processing modules 31 and 32. [0038] The controller CU controls the coating film forming apparatus 1 partially or collectively. As shown in FIG. 4, the controller CU includes a reading unit M1, a memory unit M2, a processing unit M3, and an instruction unit M4 as a function module. These functional modules are just for the purpose of conveniently separating the functions of the controller CU from a plurality of modules, and do not necessarily mean that the hardware constituting the controller CU is divided into such modules. Each functional module is not limited to being implemented by the execution of a program, even if it is implemented by a dedicated circuit (such as a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates this. Anyone can. [0039] The reading unit M1 reads a program from a computer-readable recording medium 200. The recording medium 200 records programs for causing the coating film forming apparatus 1 to perform various operations. The recording medium 200 may be, for example, a semiconductor memory, an optical recording disc, a magnetic recording disc, or a magneto-optical recording disc. [0040] The memory unit M2 stores various data. The memory unit M2 stores, for example, a program read by the reading unit M1, for example, stores setting data input from an operator via an external input device (not shown). [0041] The processing unit M3 processes various materials. The processing unit M3 generates signals for operating the liquid processing unit U1 and the heat treatment unit U2 based on various data stored in the memory unit M2, for example. [0042] The instruction unit M4 sends the signal generated in the processing unit M3 to the liquid processing unit U1 or the heat treatment unit U2. [0043] The hardware of the controller CU is constituted by, for example, a computer for plural control. The controller CU includes a circuit CU1 shown in FIG. 5 in terms of hardware configuration. The circuit CU1 may be composed of circuit elements. The circuit CU1 specifically includes a processor CU2, a memory CU3, a storage CU4, a driver CU5, and an input / output port CU6. The processor CU2 cooperates with at least one of the memory CU3 and the storage CU4 to execute a program, and executes the input and output of signals through the input / output port CU6, thereby constituting the above-mentioned functional modules. The driver CU5 is a circuit that drives various devices of the coating film forming apparatus 1 respectively. The input / output port CU6 is used for inputting and outputting signals between the driver CU5 and various devices of the coating film forming apparatus 1. [0044] In this embodiment, although the coating film forming apparatus 1 includes one controller CU, it may include a control group (control unit) composed of a plurality of controller CUs. In the case where the coating film forming apparatus 1 includes a controller group, even if the above-mentioned function modules are respectively implemented by one controller CU, even if it is implemented by a combination of two or more controller CUs. In the case where the controller CU is constituted by a plurality of computers (circuit CU1), the above functional modules may be implemented by one computer (circuit CU1) respectively, even if it is implemented by a combination of two or more computers (circuit CU1). . The controller CU may have a plurality of processors CU2. In this case, even if the above-mentioned function modules are implemented by one processor CU2, respectively, even by a combination of two or more processors CU2. [Configuration of Liquid Processing Unit] Next, the liquid processing unit U1 will be described in more detail with reference to FIGS. 6 and 7. As shown in FIG. 6, the liquid processing unit U1 includes a rotation holding unit 40, a driving unit 50, a pump P, a valve V, a heater 71, and a heat insulator 72. [0046] The rotation holding portion 40 includes a rotation portion 41 and a holding portion 42. The rotating portion 41 includes a rotation shaft 43 protruding upward. The rotating portion 41 rotates the rotating shaft 43 using, for example, an electric motor or the like as a power source. The holding portion 42 is provided at the front end portion of the rotating shaft 43. The object to be processed W is arranged on the holding portion 42. The holding portion 42 holds the object W to be treated slightly by, for example, adsorption. That is, the rotation holding unit 40 rotates around the axis (rotation axis) perpendicular to the surface of the processing object W (the surface W1a of the substrate W1) in a state where the posture of the processing object W is slightly horizontal. . In this embodiment, the rotation axis passes through the center of the object to be processed W (substrate W1) having a circular shape, so it is also the center axis. In this embodiment, as shown in FIG. 6, the rotation holding unit 20 rotates the object W to be rotated clockwise as viewed from above. [0047] The driving unit 50 is configured to drive the nozzle N. The driving unit 50 includes a guide rail 51, a slider 52, and a robot arm 53. The guide rail 51 extends in a horizontal direction above the rotation holding portion 40 (the object to be processed W). The slider 52 is connected to the guide rail 51 so that it can move horizontally along the guide rail 51. The robot arm 53 is connected to the slider 52 so that it can move to an up-down direction. A nozzle N is connected to the lower end of the robot arm 53. A flow path through which the coating liquid can flow is formed in the robot arm 53. This flow path is connected to the coating liquid source B1 via a pump P. [0048] The driving unit 50 moves the slider 52 and the robot arm 53 by a power source (not shown) such as an electric motor, and thereby moves the nozzle N. In a plan view, the nozzle N moves along the radial direction of the processing object W on a straight line orthogonal to the rotation axis of the processing object W when the coating liquid is discharged. [0049] The nozzle N opens downward toward the surface of the object to be processed W. The nozzle N may be, for example, a two-fluid nozzle of an internal mixing type, or may be a two-fluid nozzle of an external mixing type, or may be a one-fluid nozzle. In this specification, the structure of the nozzle N will be described with reference to FIG. 7 by taking an internal mixed type two-fluid nozzle as an example. The nozzle N has a body N1 having a substantially cylindrical shape and a pipe N2 connected to a side surface of the body N1. The piping N2 is connected to the nitrogen source B2 via the valve V and the heater 71. [0050] Flow paths N3 and N4 are formed inside the body N1. The flow path N3 communicates with the flow path of the coating liquid formed inside the robot arm 53. The flow path N3 extends vertically in the body N1, and the lower end communicates with the discharge port N5 of the nozzle N. The flow path N4 communicates with the pipe N2. The flow path N4 extends from the outer peripheral surface of the body N1 to the vicinity of the lower end of the flow path N3 within the body N1. In the confluence portion N6 where the flow path N4 and the flow path N3 merge, the coating liquid flowing through the flow path N3 and the nitrogen flowing through the flow path N4 are conflicted and mixed to generate minute droplets of the coating liquid (the coating liquid drop). The liquid droplets are sprayed (sprayed) from the discharge port N5 toward the surface of the treatment object W. The height position from the surface of the object W to be discharged N5 (the straight line distance between the surface of the object N to be discharged N5 and the surface of the object W) depends on the size of the object W, the flow rate of the coating solution, The flow velocity of the coating liquid, the heating temperature of the coating liquid (to be described in detail later), and the like are appropriately set, but it may be, for example, about 50 mm to 100 mm, even about 65 mm to 80 mm, or about 70 mm to 75 mm. [0051] As shown in FIG. 6, the pump P receives the control signal from the controller CU, and sends the coating liquid from the coating liquid source B1 to the nozzle N. As shown in FIG. 7, the pump P, the robot arm 53, the nozzle N (the flow path N3), and the coating liquid source B1 constitute a supply unit 60 for supplying a coating liquid to the object W to be processed. [0052] As shown in FIG. 6, the valve V receives a control signal from the controller CU, and sends nitrogen from the nitrogen source B2 to the nozzle N. [0053] The heater 71 receives a control signal from the controller CU, and heats the nitrogen sent from the nitrogen source B2 to a specific temperature (a temperature higher than room temperature). Therefore, when the nitrogen gas heated by the heater 71 merges with the coating liquid at the merging portion N6, the coating liquid is heated to become a heating liquid. That is, the heated liquid is sprayed from the discharge port N5 of the nozzle N in a droplet state. [0054] Here, the heater is set such that the temperature of the heating liquid (droplet of the coating liquid) at the discharge port N5 of the nozzle N becomes less than 1/2 of the boiling point of the solvent (solvent) of the coating liquid. The heating amount of nitrogen gas due to 71 may also be used (first temperature range). Specifically, the temperature of the heating liquid at the outlet N5 may be 41.2 ° C or lower when the solvent is IPA, or 73 ° C or lower when the solvent is PGMEA, or even when the solvent is GBL. It may be 102 ° C or lower. In this case, since the coating liquid after being mixed with the heated nitrogen gas is unlikely to become high temperature, the volatile amount of the solvent (solvent) becomes too large, which is suppressed, and the droplets sprayed from the nozzle N reach the processing target. The surface of the body W was difficult to cure before. [0055] Alternatively, even if the temperature of the heating liquid (droplet of the coating liquid) at the discharge port N5 of the nozzle N becomes 35 ° C to 60 ° C, the heating amount of nitrogen gas caused by the heater 71 may be set. (Second temperature range). In this case, it also becomes difficult for the droplets sprayed from the nozzle to reach the surface of the object to be cured. Alternatively, even if the temperature of the heating liquid (droplet of the coating liquid) at the discharge port N5 of the nozzle N satisfies both the first and second temperature ranges, the heating amount of nitrogen gas by the heater 71 is set. Also possible (third temperature range). [0056] The heat insulator 72 is arranged around the pipe N2, and suppresses the movement of heat inside and outside the pipe N2. Therefore, the heat-insulating material 72 suppresses a decrease in the temperature of the heating liquid while the coating liquid (heating liquid) heated by the heater 71 is discharged from the discharge port N5. [0057] The valve V, the piping N2, the nozzle N (the flow path N4), the nitrogen source B2, and the heater 71 are configured to supply the heated nitrogen to the nozzle N, and at the same time, the coating liquid is heated by the heated nitrogen. Supply section 70 (first heating section). [Configuration of Heat Treatment Unit] Next, the configuration of the heat treatment unit U2 will be described with reference to FIGS. 8 and 9. The heat treatment unit U2 includes a heating chamber 110 that heats the object to be processed W, and a transport mechanism 120 that transports the object to be processed W in the housing 100. On both side walls of a portion of the housing 100 corresponding to the conveyance mechanism 120, a loading / unloading port 101 is formed to carry the processed body W into the housing 100 and to move the processed body W to the outside of the housing 100. [0059] The heating chamber 110 includes a cover portion 111 and a hot plate accommodation portion 112. The cover portion 111 is located above the hot plate accommodation portion 112 and can be moved up and down between an upper position spaced from the hot plate accommodation portion 112 and a position placed below the hot plate accommodation portion 112. When the cover portion 111 is located at a lower position, the cover portion 111 and the hot plate storage portion 112 constitute a processing chamber PR at the same time. An exhaust portion 111 a is provided in the center of the cover portion 111. The exhaust unit 111a is used to exhaust gas from the processing chamber PR. [0060] The hot plate housing portion 112 is cylindrical, and houses the hot plate 113 therein. The outer peripheral portion of the hot plate 113 is supported by a support member 114. The outer periphery of the support member 114 is supported by a cylindrical support ring 115. A gas supply port 115a is formed on the support ring 115 so as to open upward. The gas supply port 115a ejects an inert gas into the processing chamber PR. [0061] As shown in FIG. 9, the hot plate 113 is a flat plate having a circular shape. The outer shape of the hot plate 113 is larger than the outer shape of the object W to be processed. The hot plate 113 is formed with three through holes HL (see FIG. 9) that extend in the thickness direction. On the hot plate 113, six support pins 113a (see FIG. 8) supporting the object W to be processed are erected. The height of the support pin 113a may be, for example, about 100 μm. [0062] Returning to FIG. 8, a heater 116 is disposed below the hot plate 113. The heater 116 is connected to the controller CU, and is controlled according to an instruction signal from the controller CU. [0063] A lifting mechanism 119 is arranged below the hot plate 113. The elevating mechanism 119 includes a motor 119a disposed outside the housing 100, and three elevating pins 119b that move up and down by the motor 119a. The lift pins 119b are configured to pass through the corresponding through holes HL, respectively. When the controller CU sends a rising signal or a falling signal to the motor 119a, the lifting pin 119b moves up and down while moving in the corresponding through hole HL. When the front end of the lifting pin 119b protrudes above the hot plate 113, the object to be processed W can be placed on the front end of the lifting pin 119b. The object W placed on the front end of the lift pin 119b moves up and down as the lift pin 119b moves up and down. [0064] The conveyance mechanism 120 is provided adjacent to the heating chamber 110. The conveyance mechanism 120 includes a conveyance plate 121 on which the object to be processed W is placed. The conveying plate 121 is a rectangular flat plate as shown in FIG. 9. An end portion on the heating chamber 110 side of the conveying plate 121 has an arc shape protruding toward the heating chamber 110. [0065] The conveying plate 121 is mounted on a rail 122 extending toward the heating chamber 110 side. The conveying plate 121 is driven by the driving unit 123 and can move horizontally on the rail 122. The transfer plate 121 moved to the heating chamber 110 side is located above the hot plate 113. [0066] Two slits 124 extending along the extending direction of the rail 122 are formed in the conveying plate 121. The slit 124 is formed in the conveying plate 121 from an end portion on the heating chamber 110 side to a vicinity of a central portion of the conveying plate 121. The gap 124 prevents interference between the carrying plate 121 moved to the heating chamber 110 side and the lifting pin 119b protruding to the hot plate 113. [0067] As shown in FIG. 8, a lifting mechanism 125 is disposed below the conveying plate 121. The elevating mechanism 125 includes a motor 125a disposed outside the housing 100, and three elevating pins 125b that move up and down by the motor 125a. The lift pins 125b are each configured to pass through the slits 124. When the controller CU sends a rising signal or a falling signal to the motor 125a, the lifting pin 125b moves up and down while moving in the gap 124. When the front end of the lifting pin 125b protrudes above the conveying plate 121, the object to be processed W can be placed on the front end of the lifting pin 125b. The object W placed on the front end of the lifting pin 125b moves up and down as the lifting pin 125b moves up and down. [0068] [Method for Forming Coating Film] Next, a method (coating film formation method) for forming a coating film R on the surface of the object to be processed W will be described with reference to FIGS. 10 and 11. First, the controller CU controls the receiving arm A1, and the object W in the carrier 10 is transferred to the shelf portion 33 by the receiving arm A1. Next, the controller CU controls the conveying arm A2, and the object W to be processed is taken out from the rack portion 33 by the conveying arm A2, and is conveyed to the heat treatment unit U2. In the heat treatment unit U2, the controller CU controls the conveyance mechanism 120 (conveyance plate 121), and the to-be-processed object W is conveyed into the heating chamber 110 (step S1). When the object to be processed W is placed on the hot plate 113, the controller CU controls the lifting mechanism 119, and the cover 111 is lowered to the lower position by the lifting mechanism 119. According to this, the object to be processed W is housed in the processing chamber PR constituted by the cover portion 111 and the hot plate housing portion 112. [0069] Next, the controller CU controls the heating chamber 110, and the object to be processed W is heated to a specific temperature by the heating chamber 110 (step S2: first process; first process). The heating temperature of the processing object W in the heating chamber 110 may be set to a temperature lower than the boiling point of the solvent contained in the droplet by 0 ° C to 30 ° C. When the heating temperature of the object W caused by the heating chamber 110 is higher than or equal to 30 ° C. lower than the boiling point of the solvent contained in the droplets, it becomes easy to promote the solvent of the droplets sprayed in step S5 described later Of volatility. Therefore, the liquid droplets are retained in the concave portions (between the convex portions W2) of the object to be treated W, and the base portion side of the convex portions W2, in particular, the film thickness of the coating film R becomes suppressed. When the heating temperature of the treatment object W caused by the heating chamber 110 is lower than the temperature 0 ° C (that is, the temperature equal to the boiling point) of the boiling point of the solvent contained in the droplet, it is blown in step S5 described later Before the droplet reaches the surface of the object to be processed W, it is difficult for the solvent of the droplet to volatilize. Therefore, the coating liquid material particles contained in the coating liquid droplets are successively deposited on the surface of the object to be treated W while maintaining its shape. [0070] When the solvent of the coating liquid is IPA, since the boiling point of IPA is 82.4 ° C, the heating temperature of the object W in the heating chamber 110 may be set to approximately 55 ° C to 85 ° C. When the solvent of the coating liquid is PGMEA, since the boiling point of PGMEA is 146 ° C, the heating temperature of the object W in the heating chamber 110 may be set to about 110 ° C to 150 ° C. When the solvent of the coating liquid is GBL, since the boiling point of GBL is 204 ° C, the heating temperature of the object W in the heating chamber 110 may be set to approximately 150 ° C to 205 ° C. [0071] Next, the controller CU controls the elevating mechanism 119 and the conveying mechanism 120 to carry out the heated object W from the heating chamber 110. Next, the controller CU controls the transfer arm A2, takes out the to-be-processed object W from the heat processing unit U2 by the transfer arm A2, and conveys it to the liquid processing unit U1 (step S3). The time required for the object W to be heated after being heated by the heating chamber 110 to the liquid processing unit U1 is, for example, several seconds to 10 seconds. During this transportation, the temperature of the heated object W can be reduced, for example, by about 20 ° C to 30 ° C. [0072] When the object to be processed W is transferred to the liquid processing unit U1 and held by the holding portion 42 of the rotation holding portion 40, the controller CU controls the rotating portion 41 to rotate and drive the object to be processed W (step S4). In this state, the controller CU controls the driving unit 50, the pump P, the valve V, and the heater 71 so that the nozzle N follows the diameter of the processing object W on a straight line orthogonal to the rotation axis of the processing object W Moving, the droplets of the heated coating liquid (liquid droplets of the heating liquid) are sprayed onto the surface of the rotating processing object W from the discharge outlet N5 of the nozzle N (step S5; refer to FIG. 11 (a); 3 works; second treatment). [0073] At this time, the nitrogen gas heated by the heater 71 is supplied to the nozzle N and mixed with the coating liquid to form a heating liquid (first heating liquid) (second process; second process). Therefore, as shown in FIG. 11 (a), immediately after the droplet is sprayed from the nozzle N, the solvent of the droplet is volatilized, and the fluidity of the droplet (coating liquid) is reduced. Furthermore, at this time, the object to be processed W is heated in step S2, and the surface of the object to be processed W becomes a specific temperature. Therefore, the solvent immediately before the liquid droplet adhering to the processing object W or the liquid droplet adhering to the processing object W receives heat from the processing object W and volatilizes. According to this, the material particles (coating liquid material) of the liquid droplets adhere to the surface of the object to be processed W (see FIG. 11 (b)). The nozzle N is moved once or multiple times on the surface of the object W to form a coating film having a specific thickness on the surface of the object W (see FIG. 11 (c)). [0074] Next, the controller CU controls the transfer arm A2, takes out the processed object W from the liquid processing unit U1 by the transferred arm A2, and after the processed object W is cooled to a specific temperature, transfers it to the shelf portion 33. At this time, even if the object to be processed W is forcibly cooled using a cooling mechanism such as a cooling plate, it may be natural cooling. After that, the controller CU controls the receiving arm A1 and returns the object to be processed W from the rack portion 33 to the carrier 10 by the receiving arm A1 (step S6). With this, the formation process of the coating film R is completed. [Action] In the above-mentioned embodiment, when the coating liquid is sprayed on the surface of the object to be processed W, the coating liquid is heated to become a heating liquid. Therefore, when the heating liquid is ejected from the nozzle N, immediately after the solvent (solvent) is volatilized, the concentration of the material particles (solute) in the coating liquid becomes high, so that the fluidity of the coating liquid (heating liquid) is reduced. . Therefore, on the surface (concavo-convex surface) of the object to be processed W, the droplets are condensed and flowed with each other. As a result, the material particles of the coating liquid tend to adhere to the surface of the object W to be treated uniformly. As described above, the coating film R can be formed more uniformly along the surface of the object to be processed W including the convex portion W2. [0076] In addition, since the evaporation of the solvent (solvent) is promoted immediately after the heated liquid is sprayed from the nozzle N, in order to completely evaporate the solvent (solvent) of the droplets reaching the surface of the object to be treated W It is not necessary to transport the object to be processed W to the heat treatment unit U2. Therefore, in order to form a coating film R having a desired thickness on the surface of the object to be processed W, it is not necessary to cause the object to be processed W to and fro between the liquid processing unit U1 and the heat treatment unit U2. Therefore, the time for forming the coating film R on the object to be processed W can be extremely shortened. [0077] In this embodiment, before the droplets are sprayed on the surface of the object to be processed W, the object to be processed W is heated in the heat treatment unit U2 in step S2. Therefore, on the entire surface of the object to be processed W, the solvent (solvent) of the coating liquid sprayed in step S5 is volatilized by the heat from the object to be processed W. Therefore, on the surface (concave-convex surface) of the object to be processed W, the droplets are condensed and flowed, which is more suppressed. Therefore, the coating film R can be formed more uniformly along the surface of the processing object W including the convex portion W2. [0078] In this embodiment, the coating liquid and the heated nitrogen are mixed in the nozzle N to heat the coating liquid to obtain a heating liquid. Therefore, the fluidity of the coating liquid is maintained high until the coating liquid is discharged from the nozzle N. Therefore, it becomes easy to spray the coating liquid from the nozzle N in a droplet state. As a result, it is possible to generate liquid droplets in a simple manner in response to an increase in the fluidity of the coating liquid before being ejected from the nozzle N. On the other hand, after an ejection from the nozzle N, the fluidity of the coating liquid is to be reduced to make the coating The opposite requirement is that the material particles of the cloth liquid adhere uniformly to the surface of the object W to be processed. [0079] In this embodiment, in step S5, while the object to be processed W is being rotated, droplets are sprayed from the nozzle N to the surface of the object to be processed W. Therefore, it is more difficult to repeatedly spray the surface of the object to be processed W from the nozzle when the nozzle N is meandering on the surface of the object to be processed W while meandering from the nozzle N to the surface of the object to be processed W. Droplets of N. Therefore, the coating film R can be formed more uniformly along the surface of the processing object W including the convex portion W2. [Other Embodiments] Although the embodiments related to the present disclosure have been described in detail above, various modifications may be added to the above-mentioned embodiments within the scope of the gist of the present invention. For example, in the present embodiment, although the treatment of the object W is heated by the heating chamber 110 in the heat treatment unit U2 (step S2), the surface of the object W to be processed from the nozzle N to the object W is performed in the liquid processing unit U1. The process of spraying the coating liquid droplets is performed (step S5), but even if a processing chamber having both a liquid processing unit U1 and a heat processing unit U2 is used, both processes may be performed in the processing chamber. In this case, when the object to be processed W is heated, the rotation of the object to be processed W may be stopped first. [0081] In the case where a plurality of convex portions W2 exist in the radial direction of the substrate W1, the closer to the rotation axis of the substrate W1, the smaller the centrifugal force. Therefore, when the droplets condense on the surface of the object to be processed W, the closer to the rotation axis The more easily the coating liquid agglomerated in the convex portion W2 is retained. Therefore, when the nozzle N is located near the rotation axis, the moving speed of the nozzle N may be increased. In this case, on the surface of the object to be processed W, the spraying amount of the liquid droplets is reduced in the vicinity of the rotation axis, so that the coating liquid droplets are hardly aggregated. [0082] The controller CU may control the rotating section 41 even if the position of the nozzle N is closer to the rotation axis of the substrate W1, and the number of rotations of the object W is increased. At this time, even if the controller CU controls the rotating section 41, the moving speed (linear speed) of the processing object W immediately below the nozzle N may be constant regardless of the position of the nozzle N. Even if the controller CU implements the control in which the position of the nozzle N is closer to the rotation axis of the substrate W1, the control of the number of rotations of the object W is increased, and the more the nozzle N is located near the rotation axis, the faster the movement speed of the nozzle N is. Control is also available. Even if the controller CU controls the rotation part 41, the rotation number of the to-be-processed body W may be constant regardless of the position of the nozzle N with respect to the board | substrate W1. [0083] In a case where the spray area of the droplets from the nozzle N is equal to or larger than the size of the surface of the object to be processed W, the nozzle N may not be moved, and the object to be processed W may not be rotated. [0084] In addition to step S2, even when the liquid droplets are sprayed from the nozzle N to the surface of the object W to be processed (step S5), the object W to be processed may be heated. Alternatively, the process in step S2 of heating the object W in advance may not be performed. [0085] For example, as shown in FIG. 12, even if the liquid processing unit U1 further has a gas nozzle GN configured to inject heated nitrogen (high-temperature nitrogen) onto the surface of the object to be processed W, according to an instruction from the controller CU Alternatively, the operation of the gas nozzle GN may be controlled by the gas supply unit. Specifically, in step S5, even if the control unit CU controls the gas supply unit, while the gas nozzle GN follows the nozzle N, the high temperature is blown from the gas nozzle GN to the spraying point of the liquid droplet on the surface of the object W to be processed Nitrogen is also available. In this case, since the solvent is dried by the high-temperature nitrogen gas from the gas nozzle GN during the droplet spraying, the time required to form the coating film R on the surface of the object to be processed W can be shortened. The temperature of the high-temperature nitrogen gas may be about 50 ° C to 150 ° C. [0086] In the above embodiment, although the nitrogen gas is heated by the heater 71 and the coating liquid is heated by the heated nitrogen gas, even as shown in FIG. A heater 81 may be provided on the upstream side to directly heat the coating liquid instead of the heater 71. In this case, the fluidity of the coating liquid can be maintained until immediately before the coating liquid is discharged from the nozzle N. Therefore, it becomes easy to spray the coating liquid from the nozzle N in a droplet state. Therefore, it is possible to generate liquid droplets in a simple manner in order to improve the fluidity of the coating liquid before being ejected from the nozzle N, and to reduce the fluidity of the coating liquid after being ejected from the nozzle N to apply the coating. The opposite requirement is that the liquid material particles adhere uniformly to the surface of the object W to be processed. [0087] As shown in FIG. 14, a bypass flow path connecting the upstream side of the valve V and the downstream side of the heater 71 may be further provided, and a valve 73 may be provided in the bypass flow path. In this case, the controller CU controls the valves V and 73 to selectively supply the nozzle N with nitrogen heated by the heater 71 and nitrogen not heated by the heater 71 (normal temperature nitrogen). . Specifically, when the process of spraying droplets on the surface of the object to be processed W is the first time, even if the valve V is closed by the controller CU and the valve 73 is opened, the heated liquid is relatively reduced (the first Heating liquid). In addition, when the process of spraying liquid droplets on the surface of the object to be processed W is the second time, even if the valve V is opened by the controller CU and the valve 73 is closed, the heated liquid (the second heated liquid) is relatively increased. ) Temperature (4th process; 3rd process). In this way, the liquid droplets sprayed on the surface of the treatment object W for the first time (the third process; the second treatment) tend to have a high fluidity, and therefore it is easy to enter the narrow recesses (projections) in the treatment object W. W2). In addition, since the liquid droplets (the fifth process; the third process) sprayed on the surface of the object W for the second and subsequent times tend to have low fluidity, they are likely to adhere to the side surface of the convex portion W2 of the object W. Therefore, the coating film R can be formed more uniformly along the surface of the processing object W including the convex portion W2. Furthermore, in order to prevent the material particles of the coating liquid from solidifying in the nozzle N and the nozzle N is clogged, the valve V is closed by the controller CU and the valve 73 is opened even after the spraying process of the droplets from the nozzle N is performed. Supply nitrogen at room temperature to the nozzle N and cool the nozzle N. [0088] As shown in FIG. 15, in order to prevent the material particles of the coating liquid from solidifying in the nozzle N and the nozzle N is clogged, the liquid processing unit U1 may further include a cleaning unit 82 for the nozzle N. The washing unit 82 is a container that stores, for example, a solvent. The nozzle N is immersed in the solvent in the washing unit 82 by performing the spraying treatment of the droplets on the nozzle N to cool and clean the nozzle N. [0089] As the gas to be mixed into the coating liquid, various gases other than nitrogen (for example, inert gas, air, etc.) may be used. [Examples] In the case where the coating film R is formed on the surface of the object W using the coating film forming apparatus 1 related to this embodiment mode, it is confirmed that the coating film R can be formed along the surface including the convex portion W2. Since the coating film R was formed uniformly on the surface of the treatment body W, the following tests were performed. [0091] A to-be-processed body W having a plurality of convex portions W2 provided on a disc-shaped substrate W1 having a diameter of 150 mm is prepared. In addition, a photoresist for diluting a positive photoresist with PGMEA was prepared. [0092] Next, the object to be processed W is heated by the heat treatment unit U2 at 120 ° C. for 60 seconds. Next, the heated object W is transferred to the liquid processing unit U1, and the prepared photoresist liquid is sprayed from the nozzle N of the two-fluid nozzle to the surface of the object W to be processed. At this time, the number of rotations of the processing object W caused by the rotation holding unit 40 is changed within a range of 60 rpm to 600 rpm so that the moving speed (linear speed) of the processing object W immediately below the nozzle N becomes constant. . The moving speed of the nozzle N is 10 mm / second to 150 mm / second. In addition, the nozzle N was moved back and forth 14 times on the surface of the object to be processed W. As described above, a photoresist film (coating film R) is formed on the surface of the object to be processed W. [0093] Next, with respect to any two convex portions W2, the state of the cross section is observed with an electron microscope. Figs. 16 (a) and 16 (b) schematically show electron micrographs of the two convex portions W2. It was confirmed that the photoresist film (coating film R) was formed extremely uniformly on any of the convex portions W2 along the surface of the object W to be treated including the convex portions W2.

[0094][0094]

1‧‧‧塗佈膜形成裝置1‧‧‧ coating film forming device

60‧‧‧供給部60‧‧‧Supply Department

70‧‧‧加熱供給部(第1加熱部)70‧‧‧Heating supply unit (first heating unit)

71、81‧‧‧加熱器71, 81‧‧‧ heater

72‧‧‧隔熱材72‧‧‧Insulation

CU‧‧‧控制器(控制部)CU‧‧‧Controller (Control Department)

N‧‧‧噴嘴N‧‧‧Nozzle

N5‧‧‧吐出口N5‧‧‧Spit Out

R‧‧‧塗佈膜R‧‧‧ coated film

U1‧‧‧液處理單元U1‧‧‧Liquid processing unit

U2‧‧‧熱處理單元(第2加熱部)U2‧‧‧ heat treatment unit (second heating section)

W‧‧‧被處理體W‧‧‧ Subject

W1‧‧‧基板W1‧‧‧ substrate

W1a‧‧‧表面W1a‧‧‧ surface

W2‧‧‧凸部W2‧‧‧ convex

W2a‧‧‧表面W2a‧‧‧ surface

[0026]   圖1為表示塗佈膜形成裝置之斜視圖。   圖2為圖1之II-II線剖面圖。   圖3為圖2之III-III線剖面圖。   圖4為表示塗佈膜形成裝置之方塊圖。   圖5為表示控制器之硬體構成的概略圖。   圖6為表示液處理單元之示意圖。   圖7為表示噴嘴之附近的部分剖面圖。   圖8為從側方觀看熱處理單元之剖面圖。   圖9為圖8之IX-IX線剖面圖。   圖10為用以說明塗佈膜之形成順序之流程圖。   圖11為用以說明塗佈膜之形成順序之示意圖。   圖12為部分性地表示液處理單元之其他例的示意圖。   圖13為表示液處理單元之其他例的示意圖。   圖14為表示液處理單元之其他例的示意圖。   圖15為表示液處理單元之其他例的示意圖。   圖16為用以說明實施例之圖式。[0026] FIG. 1 is a perspective view showing a coating film forming apparatus. FIG. 2 is a sectional view taken along the line II-II in FIG. 1. FIG. 3 is a sectional view taken along the line III-III in FIG. 2. FIG. 4 is a block diagram showing a coating film forming apparatus. FIG. 5 is a schematic diagram showing a hardware configuration of the controller. FIG. 6 is a schematic diagram showing a liquid processing unit. FIG. 7 is a partial cross-sectional view showing the vicinity of the nozzle. FIG. 8 is a sectional view of the heat treatment unit viewed from a side. FIG. 9 is a sectional view taken along the line IX-IX in FIG. 8. FIG. 10 is a flowchart for explaining the formation sequence of the coating film. FIG. 11 is a schematic diagram for explaining a forming sequence of a coating film. FIG. 12 is a schematic view partially showing another example of the liquid processing unit. Fig. 13 is a schematic diagram showing another example of the liquid processing unit. FIG. 14 is a schematic diagram showing another example of the liquid processing unit. FIG. 15 is a schematic diagram showing another example of the liquid processing unit. FIG. 16 is a diagram for explaining the embodiment.

Claims (15)

一種塗佈膜形成方法,包含:   第1工程,其係對包含基板和被設置在上述基板之表面的凸部之被處理體進行加熱;   第2工程,其係對加熱塗佈液而取得第1加熱液體;及   第3工程,其係對在上述第1工程中被加熱之後的上述被處理體之表面,在液滴之狀態下從噴嘴噴吹上述第1加熱液體。A method for forming a coating film includes: a first process for heating a processed object including a substrate and a convex portion provided on a surface of the substrate; a second process for heating a coating liquid to obtain a first process; 1 heating liquid; and 3rd process, which sprays said 1st heating liquid from a nozzle on the surface of the said to-be-processed body after being heated in the said 1st process. 如請求項1所記載之塗佈膜形成方法,其中   在上述第2工程中,加熱上述塗佈液使上述噴嘴之出口中之上述第1加熱液體的溫度成為上述塗佈液所含之溶劑之沸點的1/2以下。The method for forming a coating film according to claim 1, wherein in the second process, the coating liquid is heated so that the temperature of the first heating liquid in the outlet of the nozzle becomes the temperature of the solvent contained in the coating liquid. Less than 1/2 of the boiling point. 如請求項1或2所記載之塗佈膜形成方法,其中   在上述第2工程中,加熱上述塗佈液,以使在上述噴嘴之出口中的上述第1加熱液體之溫度成為35℃~60℃。The method for forming a coating film according to claim 1 or 2, wherein in the second process, the coating liquid is heated so that the temperature of the first heating liquid at the outlet of the nozzle is 35 ° C to 60 ° C. ℃. 如請求項1或2所記載之塗佈膜形成方法,其中   在上述第2工程中,藉由在上述噴嘴內混合上述塗佈液和被加熱的氣體,加熱上述塗佈液而取得上述第1加熱液體。The coating film forming method according to claim 1 or 2, wherein in the second process, the coating liquid and the heated gas are mixed in the nozzle, and the coating liquid is heated to obtain the first Heat the liquid. 如請求項1或2所記載之塗佈膜形成方法,其中   在上述第2工程中,在較上述噴嘴更上游側,藉由加熱器加熱上述塗佈液而取得上述第1加熱液體。The coating film forming method according to claim 1 or 2, wherein in the second process, the coating liquid is heated by a heater on the upstream side from the nozzle to obtain the first heating liquid. 如請求項1或2所記載之塗佈膜形成方法,其中   進一步包含:第4工程,其係於上述第3工程之後,加熱上述塗佈液而取得第2加熱液體;和   第5工程,其係於上述第4工程之後,對形成塗佈膜之上述被處理體之上述表面,在液滴之狀態下從上述噴嘴噴吹上述第2加熱液體,   在上述第4工程中之上述第2加熱液體的溫度被設定成高於在上述第2工程中之上述第1加熱液體的溫度。The coating film forming method according to claim 1 or 2, further comprising: a fourth process, which is after the third process, heating the coating liquid to obtain a second heating liquid; and a fifth process, which After the fourth process, the second heating liquid is sprayed from the nozzle on the surface of the object to be coated to form a coating film, and the second heating is performed in the fourth process. The temperature of the liquid is set higher than the temperature of the first heating liquid in the second process. 如請求項1或2所記載之塗佈膜形成方法,其中   在上述第3工程中,對上述被處理體之上述表面,從上述噴嘴噴吹液滴,同時邊使與上述噴嘴不同的氣體噴嘴追隨上述噴嘴,邊從上述氣體噴嘴對上述被處理體之上述表面中上述液滴之噴吹處噴吹被加熱的氮氣。The coating film forming method according to claim 1 or 2, wherein in the third process, the liquid droplets are sprayed from the nozzles on the surface of the object to be processed, while a gas nozzle different from the nozzles is sprayed. Following the nozzle, the heated nitrogen gas is sprayed from the gas nozzle to the spraying point of the liquid droplet on the surface of the object to be processed. 一種塗佈膜形成裝置,具備:   第1加熱部,其係被構成加熱塗佈液;   第2加熱部,其係被構成加熱包含基板和被設置在上述基板之表面的凸部之被處理體;   供給部,其具有噴嘴;及   控制部,   上述控制部實行:   第1處理,其係控制上述第2加熱部而加熱上述被處理體;及   第2處理,其係控制上述第1加熱部及上述供給部,對藉由上述第1處理而被加熱之後的上述被處理體之表面,在液滴之狀態下從上述噴嘴噴出藉由上述第1加熱部被加熱之上述塗佈液亦即第1加熱液體。A coating film forming apparatus comprising: a first heating section configured to heat a coating liquid; a second heating section configured to heat a processed object including a substrate and a convex portion provided on a surface of the substrate A supply unit having a nozzle; and a control unit, the control unit performs: a first process that controls the second heating unit to heat the object to be processed; and a second process that controls the first heating unit and The supply unit is configured to eject the coating liquid heated by the first heating unit from the nozzle in a state of droplets on the surface of the object to be processed heated by the first processing, that is, the first 1 Heat the liquid. 如請求項8所記載之塗佈膜形成裝置,其中   上述第1加熱部加熱上述塗佈液,以使上述噴嘴之出口中之上述第1加熱液體的溫度成為上述塗佈液所含之溶劑之沸點的1/2以下。The coating film forming apparatus according to claim 8, wherein the first heating section heats the coating liquid so that the temperature of the first heating liquid in the outlet of the nozzle becomes the temperature of the solvent contained in the coating liquid. Less than 1/2 of the boiling point. 如請求項8或9所記載之塗佈膜形成裝置,其中   上述第1加熱部加熱上述塗佈液,以使在上述噴嘴之出口中的上述第1加熱液體之溫度成為35℃~60℃。The coating film forming apparatus according to claim 8 or 9, wherein the first heating section heats the coating liquid so that the temperature of the first heating liquid at the outlet of the nozzle is 35 ° C to 60 ° C. 如請求項8或9所記載之塗佈膜形成裝置,其中   上述第1加熱部被構成藉由對上述噴嘴供給被加熱的氣體而在上述噴嘴內混合上述氣體和上述塗佈液,加熱上述塗佈液。The coating film forming apparatus according to claim 8 or 9, wherein the first heating section is configured to supply the heated gas to the nozzle, mix the gas and the coating liquid in the nozzle, and heat the coating. Cloth fluid. 如請求項8或9所記載之塗佈膜形成裝置,其中   上述第1加熱部係在較上述噴嘴更上游側加熱上述塗佈液的加熱器。The coating film forming apparatus according to claim 8 or 9, wherein the first heating unit is a heater that heats the coating liquid on an upstream side from the nozzle. 如請求項8或9所記載之塗佈膜形成裝置,其中   上述控制部進一步實行第3處理,其係於上述第2處理之後,控制上述第1加熱部及上述供給部,對上述被處理體之上述表面,在液滴之狀態下從上述噴嘴噴吹藉由上述第1加熱部被加熱之上述塗佈液亦即第2加熱液體,   在上述第3處理中之上述第2加熱液體的溫度被設定成高於在上述第2處理中之上述第1加熱液體的溫度。The coating film forming apparatus according to claim 8 or 9, wherein the control unit further performs a third process, which is after the second process, controls the first heating unit and the supply unit, and controls the object to be processed On the surface, the second heating liquid, that is, the coating liquid heated by the first heating portion, is sprayed from the nozzle in a state of droplets, and the temperature of the second heating liquid in the third processing is The temperature is set higher than the temperature of the first heating liquid in the second process. 如請求項8或9所記載之塗佈膜形成裝置,其中   進一步具備被構成使被加熱之氮氣從氣體噴嘴吐出之氣體供給部,   上述控制部在上述第2處理中,控制上述第1加熱部及上述供給部,從上述噴嘴噴吹上述液滴,同時控制上述氣體供給部,邊使上述氣體噴嘴追隨上述噴嘴,邊從上述氣體噴嘴對上述被處理體之上述表面中上述液滴之噴吹處噴吹被加熱的氮氣。The coating film forming apparatus according to claim 8 or 9, further comprising a gas supply unit configured to discharge heated nitrogen gas from a gas nozzle, and the control unit controls the first heating unit in the second process. And the supply unit, which sprays the liquid droplets from the nozzles, and controls the gas supply unit to spray the liquid droplets on the surface of the object from the gas nozzles while the gas nozzles follow the nozzles The heated nitrogen was blown everywhere. 一種電腦可讀取的記錄媒體,記錄有用以使塗佈膜形成裝置實行如申請專利範圍第1至7項中之任一項所記載之塗佈膜形成方法的程式。A computer-readable recording medium for recording a program for causing a coating film forming apparatus to perform the coating film forming method described in any one of claims 1 to 7 of the scope of patent application.
TW106124476A 2016-07-27 2017-07-21 Coating film forming method, coating film forming apparatus, and computer-readable recording medium TWI775762B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-147625 2016-07-27
JP2016147625 2016-07-27

Publications (2)

Publication Number Publication Date
TW201816518A true TW201816518A (en) 2018-05-01
TWI775762B TWI775762B (en) 2022-09-01

Family

ID=61016578

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110146334A TWI776749B (en) 2016-07-27 2017-07-21 Coating film forming method, coating film forming apparatus, and computer-readable recording medium
TW106124476A TWI775762B (en) 2016-07-27 2017-07-21 Coating film forming method, coating film forming apparatus, and computer-readable recording medium

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110146334A TWI776749B (en) 2016-07-27 2017-07-21 Coating film forming method, coating film forming apparatus, and computer-readable recording medium

Country Status (5)

Country Link
JP (1) JP6771034B2 (en)
KR (1) KR102424630B1 (en)
CN (1) CN109478501B (en)
TW (2) TWI776749B (en)
WO (1) WO2018020863A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695740B (en) * 2018-07-13 2020-06-11 日商斯庫林集團股份有限公司 Coating processing apparatus and coating processing method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323161B (en) * 2018-03-30 2023-06-06 芝浦机械电子株式会社 Organic film forming apparatus and organic film manufacturing method
JP7261055B2 (en) * 2019-03-27 2023-04-19 株式会社東京精密 Spin coating device and spin coating method
JP7261970B2 (en) * 2019-03-27 2023-04-21 株式会社東京精密 Spin coating device and spin coating method
KR20210024387A (en) * 2019-08-23 2021-03-05 세메스 주식회사 Method for treating a substrate and an apparatus for treating a substrate
KR102278561B1 (en) * 2019-08-23 2021-07-19 세메스 주식회사 Method for treating a substrate and an apparatus for treating a substrate
KR102353648B1 (en) * 2020-10-21 2022-01-21 주식회사 나래나노텍 Slot die coating device and method for printing substrate
KR102548479B1 (en) * 2022-06-17 2023-06-27 대광기업 주식회사 A choke for ship

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151295A (en) * 1992-11-13 1994-05-31 Matsushita Electric Ind Co Ltd Method and device for manufacturing semiconductor device
JP3565443B2 (en) * 1994-06-03 2004-09-15 大日本印刷株式会社 Injection device
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
TWI242663B (en) * 2002-07-09 2005-11-01 Seiko Epson Corp Jetting method of liquid, jetting apparatus of liquid, production method of substrate for electro-optical apparatus and production method of electro-optical apparatus
JP3890025B2 (en) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 Coating processing apparatus and coating processing method
JP3958717B2 (en) * 2003-06-24 2007-08-15 株式会社テックインテック Coating device
JP4383268B2 (en) * 2004-06-29 2009-12-16 アルプス電気株式会社 Spray coating method and spray coating apparatus
JP2008016660A (en) * 2006-07-06 2008-01-24 Dainippon Screen Mfg Co Ltd Method for treating substrate and substrate treating apparatus
JP4803821B2 (en) * 2007-03-23 2011-10-26 大日本スクリーン製造株式会社 Substrate processing equipment
JP5231072B2 (en) * 2008-04-09 2013-07-10 東京応化工業株式会社 Film formation method
JP5523062B2 (en) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
JP5189114B2 (en) * 2010-01-29 2013-04-24 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4844702B1 (en) * 2010-05-10 2011-12-28 トヨタ自動車株式会社 Masking jig, substrate heating apparatus, and film forming method
JP5632860B2 (en) * 2012-01-05 2014-11-26 東京エレクトロン株式会社 Substrate cleaning method, substrate cleaning apparatus, and substrate cleaning storage medium
TW201513942A (en) * 2013-10-03 2015-04-16 Leap Co Ltd Spray coating device
JP2015115462A (en) * 2013-12-11 2015-06-22 東京応化工業株式会社 Coater and coating method
JP6267141B2 (en) * 2014-06-04 2018-01-24 東京エレクトロン株式会社 Liquid coating method, liquid coating apparatus, and computer-readable recording medium
JP6438748B2 (en) * 2014-11-28 2018-12-19 株式会社Screenホールディングス Coating method and coating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695740B (en) * 2018-07-13 2020-06-11 日商斯庫林集團股份有限公司 Coating processing apparatus and coating processing method

Also Published As

Publication number Publication date
TWI775762B (en) 2022-09-01
CN109478501B (en) 2023-06-06
KR20190037237A (en) 2019-04-05
TWI776749B (en) 2022-09-01
CN109478501A (en) 2019-03-15
JPWO2018020863A1 (en) 2019-05-30
JP6771034B2 (en) 2020-10-21
TW202211995A (en) 2022-04-01
KR102424630B1 (en) 2022-07-25
WO2018020863A1 (en) 2018-02-01

Similar Documents

Publication Publication Date Title
TW201816518A (en) Method for forming coating film, apparatus for forming coating film and computer-readable recording medium
JP5681560B2 (en) Substrate drying method and substrate processing apparatus
JP6325067B2 (en) Substrate drying method and substrate processing apparatus
CN102193342B (en) Coating and developing apparatus and developing method
JP6356207B2 (en) Substrate drying method and substrate processing apparatus
JP2015092619A (en) Substrate drying method and substrate processing apparatus
CN107045262B (en) Substrate processing method and substrate processing apparatus
JP4924467B2 (en) Processing apparatus, cleaning method, and storage medium
JP6793048B2 (en) Substrate processing equipment, dummy dispensing method and computer-readable recording medium
JP6807162B2 (en) Substrate cleaning method, substrate cleaning equipment and computer-readable recording medium
JP2018139331A (en) Substrate drying method and substrate processing apparatus
JP6504996B2 (en) Coating film forming method, coating film forming apparatus, and computer readable recording medium
TW201943466A (en) Substrate processing device, substrate processing method, and computer-readable storage medium
TWI808113B (en) Substrate processing device, substrate processing method, and computer-readable storage medium
JP2023174664A (en) Liquid processing apparatus, liquid processing method and computer-readable recording medium
US11036138B2 (en) Substrate processing apparatus, substrate processing method, and computer-readable recording medium
JP2004097881A (en) Thin film removing device
US20220068670A1 (en) Substrate processing method and substrate processing apparatus
JP6626734B2 (en) Substrate processing apparatus, substrate processing method, and computer-readable recording medium
KR20160040937A (en) Chemical coating apparatus and Method

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent