TW201810504A - Semiconductor device positioning system and method for semiconductor device positioning - Google Patents
Semiconductor device positioning system and method for semiconductor device positioning Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Chemical Kinetics & Catalysis (AREA)
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- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
現今譬如積體電路(IC)或離散電晶體等組件係藉在一基板上製造數個組件來大規模生產。例如，各式IC製程實行在一矽晶圓上以製造電子電路。典型地，在單一晶圓上製造數百或數千個組件或IC晶粒。 Today, components such as integrated circuits (ICs) or discrete transistors are produced on a large scale by manufacturing several components on a substrate. For example, various IC processes are performed on a silicon wafer to manufacture electronic circuits. Typically, hundreds or thousands of components or IC dies are manufactured on a single wafer.
在該等IC製程期間，一半導體裝置定位系統係用於定位或置放一半導體裝置，使得可在該半導體裝置上實施不同的操作。例如，一半導體裝置定位系統可包含一半導體固持平台以將一半導體裝置固持於一特定位置、及/或包含一半導體裝置驅動器平台以移動一半導體裝置，來進行半導體裝置加工操作(譬如，一沈積製程或一蝕刻製程)。然而，增加一半導體裝置驅動器平台之加速度通常導致較高之加速力、及因此較高之對該半導體裝置驅動器平台之支撐結構的反作用力。該較高之支撐結構上反作用力可導致在該支撐結構上、該半導體裝置驅動器平台上、及安裝於該支撐結構之其他模組上的動態擾動。 During these IC manufacturing processes, a semiconductor device positioning system is used to position or place a semiconductor device so that different operations can be performed on the semiconductor device. For example, a semiconductor device positioning system may include a semiconductor holding platform to hold a semiconductor device at a specific location, and / or include a semiconductor device driver platform to move a semiconductor device for semiconductor device processing operations (e.g., a deposition Process or an etching process). However, increasing the acceleration of a semiconductor device driver platform usually results in a higher acceleration force and therefore a higher reaction force to the supporting structure of the semiconductor device driver platform. The higher reaction force on the support structure may cause dynamic disturbances on the support structure, on the semiconductor device driver platform, and on other modules mounted on the support structure.
揭露一種用於定位半導體裝置的系統及方法。在一具體實施例中，一種用於定位半導體裝置的定位系統包含一長行程平台及一短行程平台，該長行程平台構造為可在一平面內相對於一支撐結構線性移動，該短行程平台連附至該長行程平台且構造為載運一半導體裝置並可在該平面內線性移動。該長行程平台係作為該短行程平台與該支撐結構之間的一平衡質量。 A system and method for positioning a semiconductor device are disclosed. In a specific embodiment, a positioning system for positioning a semiconductor device includes a long-stroke platform and a short-stroke platform. The long-stroke platform is configured to move linearly in a plane relative to a support structure. The short-stroke platform Attached to the long-stroke platform and configured to carry a semiconductor device and move linearly within the plane. The long-stroke platform serves as a balanced mass between the short-stroke platform and the support structure.
在一具體實施例中，該長行程平台具有一相對於該支撐結構之第一活動範圍。該短行程平台係藉該長行程平台支撐且具有一相對於該長行程平台之第二活動範圍。該第二活動範圍較該第一活動範圍小。 In a specific embodiment, the long-stroke platform has a first range of motion relative to the support structure. The short-stroke platform is supported by the long-stroke platform and has a second range of motion relative to the long-stroke platform. The second range of activity is smaller than the first range of activity.
在一具體實施例中，該短行程平台更被構造為，可在該平面內轉動。 In a specific embodiment, the short-stroke platform is further configured to be rotatable in the plane.
在一具體實施例中，該長行程平台更被構造為，可在一第一方向及一第二方向上移動。 In a specific embodiment, the long-stroke platform is further configured to be movable in a first direction and a second direction.
在一具體實施例中，該長行程平台包含一第一長行程本體及一第二長行程本體，該第一長行程本體被構造為可在該第一方向上線性移動，該第二長行程本體被構造為可在該第二方向上線性移動。 In a specific embodiment, the long-stroke platform includes a first long-stroke body and a second long-stroke body. The first long-stroke body is configured to be linearly movable in the first direction and the second long-stroke body. The body is configured to be linearly movable in the second direction.
在一具體實施例中，該定位系統更包含一第一組線性導件及一第二組線性導件，該第一組線性導件連附至該支撐結構與該第一長行程本體，該第二組線性導件連附至該等第一與第二長行程本體。 In a specific embodiment, the positioning system further includes a first group of linear guides and a second group of linear guides. The first group of linear guides are attached to the support structure and the first long-stroke body. A second set of linear guides is attached to the first and second long-stroke bodies.
在一具體實施例中，該定位系統更包含一第 一長行程驅動器裝置及一第二長行程驅動器裝置，該第一長行程驅動器裝置構造為沿該第一方向驅動該第一組線性導件上之第一長行程本體，該第二長行程驅動器裝置構造為沿該第二方向驅動該第二組線性導件上之第二長行程本體。 In a specific embodiment, the positioning system further includes a first A long-stroke driver device and a second long-stroke driver device, the first long-stroke driver device is configured to drive a first long-stroke body on the first group of linear guides along the first direction, and the second long-stroke driver The device is configured to drive a second long-stroke body on the second set of linear guides along the second direction.
在一具體實施例中，該定位系統更包含複數個感測器裝置，構造為在該長行程平台移動期間，量測該等第一與第二長行程本體之位置。 In a specific embodiment, the positioning system further includes a plurality of sensor devices configured to measure the positions of the first and second long-stroke bodies during the movement of the long-stroke platform.
在一具體實施例中，該短行程平台包含一短行程本體，該短行程本體經由一組線性導件而連附至該第二長行程本體。 In a specific embodiment, the short-stroke platform includes a short-stroke body, and the short-stroke body is attached to the second long-stroke body via a set of linear guides.
在一具體實施例中，該定位系統更包含複數個短行程驅動器裝置，構造為使該短行程平台線性移動。 In a specific embodiment, the positioning system further includes a plurality of short-stroke actuator devices configured to linearly move the short-stroke platform.
在一具體實施例中，該等短行程驅動器裝置更被構造為，使該短行程平台順時針、或逆時針轉動。 In a specific embodiment, the short-stroke actuator devices are further configured to rotate the short-stroke platform clockwise or counterclockwise.
在一具體實施例中，一種用於定位晶圓的定位系統包含一長行程平台及一短行程平台，該長行程平台構造為可在一第一方向與一第二方向上依相對於一支撐結構之一第一活動範圍線性移動，該短行程平台連附至該長行程平台且構造為載運一晶圓並可依相對於該長行程平台之一第二活動範圍線性移動。該第一方向與該第二方向垂直。該第二活動範圍較該第一活動範圍小。該長行程平台係作為該短行程平台與該支撐結構之間的一平衡質量。 In a specific embodiment, a positioning system for positioning a wafer includes a long-stroke platform and a short-stroke platform, and the long-stroke platform is configured to be supported relative to a support in a first direction and a second direction. One of the structures moves linearly at a first range of motion, and the short-stroke platform is attached to the long-stroke platform and is configured to carry a wafer and move linearly with respect to a second range of motion of the long-stroke platform. The first direction is perpendicular to the second direction. The second range of activity is smaller than the first range of activity. The long-stroke platform serves as a balanced mass between the short-stroke platform and the support structure.
在一具體實施例中，該長行程平台包含一第 一長行程本體及一第二長行程本體，該第一長行程本體被構造為可在該第一方向上移動，該第二長行程本體被構造為可在該第二方向上移動。 In a specific embodiment, the long-stroke platform includes a first A long-stroke body and a second long-stroke body. The first long-stroke body is configured to be movable in the first direction, and the second long-stroke body is configured to be movable in the second direction.
在一具體實施例中，該定位系統更包含一第一組線性導件、一第二組線性導件、一第一長行程驅動器裝置、及一第二長行程驅動器裝置，該第一組線性導件連附至該支撐結構與該第一長行程本體，該第二組線性導件連附至該等第一與第二長行程本體，該第一長行程驅動器裝置構造為沿該第一方向驅動該第一組線性導件上之第一長行程本體，該第二長行程驅動器裝置構造為沿該第二方向驅動該第二組線性導件上之第二長行程本體。 In a specific embodiment, the positioning system further includes a first group of linear guides, a second group of linear guides, a first long-stroke driver device, and a second long-stroke driver device. A guide is attached to the support structure and the first long-stroke body, the second set of linear guides is attached to the first and second long-stroke bodies, and the first long-stroke driver device is configured to follow the first The first long-stroke body on the first group of linear guides is driven in a direction, and the second long-stroke driver device is configured to drive the second long-stroke body on the second group of linear guides in the second direction.
在一具體實施例中，該定位系統更包含複數個感測器裝置，構造為在該長行程平台移動期間，檢查該等第一與第二長行程本體之位置。 In a specific embodiment, the positioning system further includes a plurality of sensor devices configured to check the positions of the first and second long-stroke bodies during the movement of the long-stroke platform.
在一具體實施例中，該短行程平台包含一短行程本體，該短行程本體經由一組線性導件而連附至該第二長行程本體。 In a specific embodiment, the short-stroke platform includes a short-stroke body, and the short-stroke body is attached to the second long-stroke body via a set of linear guides.
在一具體實施例中，該定位系統更包含複數個短行程驅動器裝置，構造為使該短行程平台線性移動。 In a specific embodiment, the positioning system further includes a plurality of short-stroke actuator devices configured to linearly move the short-stroke platform.
在一具體實施例中，一種用於定位半導體裝置的方法，該方法包含使一長行程平台在一平面內相對於一支撐結構線性移動，及使在該平面內載運一半導體裝置之一短行程平台線性移動。該短行程平台係藉該長行程平台支撐。 In a specific embodiment, a method for positioning a semiconductor device includes linearly moving a long-stroke platform relative to a support structure in a plane and carrying a short stroke of a semiconductor device carried in the plane. The platform moves linearly. The short-stroke platform is supported by the long-stroke platform.
在一具體實施例中，使該長行程平台線性移動包含使該長行程平台依相對於該支撐結構之一第一活動範圍移動。線性移動該短行程平台線性包含使該相對於該長行程平台之短行程平台以一第二活動範圍移動。該第二活動範圍較該第一活動範圍小。 In a specific embodiment, linearly moving the long-stroke platform includes moving the long-stroke platform according to a first range of motion relative to one of the support structures. Linearly moving the short-stroke platform linearly includes moving the short-stroke platform relative to the long-stroke platform in a second range of motion. The second range of activity is smaller than the first range of activity.
在一具體實施例中，該方法更包含在該平面內轉動該短行程平台。線性地移動該長行程平台包含在一第一方向及一第二方向上移動該長行程平台。 In a specific embodiment, the method further includes rotating the short-stroke platform in the plane. Moving the long-stroke platform linearly includes moving the long-stroke platform in a first direction and a second direction.
由以下連同隨附圖式所作之詳細說明，將明白本發明之具體實施例的其他構想與優點。 Other ideas and advantages of specific embodiments of the present invention will be apparent from the following detailed description, together with the accompanying drawings.
100‧‧‧定位系統 100‧‧‧ Positioning System
102‧‧‧定位系統 102‧‧‧ Positioning System
104‧‧‧半導體裝置 104‧‧‧Semiconductor device
106‧‧‧驅動器系統 106‧‧‧Driver System
108‧‧‧感測器系統 108‧‧‧ Sensor System
202‧‧‧定位平台 202‧‧‧Positioning Platform
204‧‧‧半導體裝置 204‧‧‧Semiconductor device
222‧‧‧長行程平台 222‧‧‧long-travel platform
224‧‧‧短行程平台 224‧‧‧short-stroke platform
226‧‧‧支撐結構 226‧‧‧Support structure
228‧‧‧連附裝置 228‧‧‧ attached device
300‧‧‧定位系統 300‧‧‧ Positioning System
304‧‧‧矽晶圓 304‧‧‧ silicon wafer
320‧‧‧長行程平台 320‧‧‧long-travel platform
324‧‧‧短行程平台 324‧‧‧short-stroke platform
326‧‧‧支撐結構 326‧‧‧ support structure
340‧‧‧平面 340‧‧‧plane
342‧‧‧軸線 342‧‧‧ axis
350-1‧‧‧x方向線性導件/軌道 350-1‧‧‧x-direction linear guide / track
350-2‧‧‧x方向線性導件/軌道 350-2‧‧‧x-direction linear guide / track
350-3‧‧‧x方向線性導件/軌道 350-3‧‧‧x-direction linear guide / track
350-4‧‧‧x方向線性導件/軌道 350-4‧‧‧x-direction linear guide / track
352-1‧‧‧y方向線性導件/軌道 352-1‧‧‧y-direction linear guide / track
352-2‧‧‧y方向線性導件/軌道 352-2‧‧‧y-direction linear guide / track
352-3‧‧‧y方向線性導件/軌道 352-3‧‧‧y-direction linear guide / track
352-4‧‧‧y方向線性導件/軌道 352-4‧‧‧y-direction linear guide / track
356-1‧‧‧x方向線性導件/軌道 356-1‧‧‧ x-direction linear guide / track
356-2‧‧‧x方向線性導件/軌道 356-2‧‧‧x-direction linear guide / track
360‧‧‧長行程X本體 360‧‧‧long stroke X body
362‧‧‧長行程Y本體 362‧‧‧long stroke Y body
460‧‧‧長行程X本體 460‧‧‧long stroke X body
462‧‧‧長行程Y本體 462‧‧‧long stroke Y body
468-1‧‧‧x方向線性導件/軌道 468-1‧‧‧x-direction linear guide / track
468-2‧‧‧x方向線性導件/軌道 468-2‧‧‧ x-direction linear guide / track
470-1‧‧‧y方向線性導件/軌道 470-1‧‧‧y-direction linear guide / track
470-2‧‧‧y方向線性導件/軌道 470-2‧‧‧y-direction linear guide / track
472‧‧‧短行程本體 472‧‧‧Short stroke body
476‧‧‧晶圓托架 476‧‧‧Wafer Carrier
580-1‧‧‧致動器及編碼器 580-1‧‧‧Actuators and encoders
580-2‧‧‧致動器及編碼器 580-2‧‧‧Actuator and encoder
580-3‧‧‧致動器及編碼器 580-3‧‧‧Actuator and encoder
580-4‧‧‧致動器及編碼器 580-4‧‧‧Actuator and encoder
602‧‧‧方塊 602‧‧‧box
604‧‧‧方塊 604‧‧‧box
ySS2BF‧‧‧短行程平台相對於支撐結構之y軸位置 ySS2BF‧‧‧Position of the y-axis of the short-stroke platform relative to the support structure
ySS2LS‧‧‧短行程平台相對於長行程平台之y軸位置 ySS2LS‧Position of y-axis of short-stroke platform relative to long-stroke platform
yLS2BF‧‧‧長行程平台相對於支撐結構之y軸位置 yLS2BF‧Position of y-axis of long-stroke platform relative to the support
FSS‧‧‧短行程平台的力 F SS ‧‧‧Force of short-stroke platform
FLS‧‧‧長行程平台的力 F LS ‧‧‧Force of Long Stroke Platform
MOT_LS_X‧‧‧驅動器/馬達 MOT_LS_X‧‧‧Driver / Motor
MOT_LS_Y‧‧‧驅動器/馬達 MOT_LS_Y‧‧‧Driver / Motor
ENC_LS_XT‧‧‧感測器/編碼器 ENC_LS_XT‧‧‧Sensor / encoder
ENC_LS_XB‧‧‧感測器/編碼器 ENC_LS_XB‧‧‧Sensor / encoder
ENC_LS_YR‧‧‧感測器/編碼器 ENC_LS_YR‧‧‧Sensor / encoder
ENC_LSY2M‧‧‧感測器/編碼器 ENC_LSY2M‧‧‧Sensor / encoder
ENC_LS_YL‧‧‧感測器/編碼器 ENC_LS_YL‧‧‧Sensor / encoder
MOT_SS_TL‧‧‧驅動器/馬達 MOT_SS_TL‧‧‧Driver / Motor
MOT_SS_BL‧‧‧驅動器/馬達 MOT_SS_BL‧‧‧Driver / Motor
MOT_SS_BR‧‧‧驅動器/馬達 MOT_SS_BR‧‧‧Driver / Motor
MOT_SS_TR‧‧‧驅動器/馬達 MOT_SS_TR‧‧‧Driver / Motor
ENC_SS2LS_TL‧‧‧感測器/編碼器 ENC_SS2LS_TL‧‧‧Sensor / encoder
ENC_SS2LS_BL‧‧‧感測器/編碼器 ENC_SS2LS_BL‧‧‧Sensor / encoder
ENC_SS2LS_BR‧‧‧感測器/編碼器 ENC_SS2LS_BR‧‧‧Sensor / encoder
ENC_SS2LS_TR‧‧‧感測器/編碼器 ENC_SS2LS_TR‧‧‧Sensor / encoder
X_WAFER‧‧‧x方向 X _WAFER ‧‧‧ x direction
Y_WAFER‧‧‧y方向 Y _WAFER ‧‧‧y
RZ‧‧‧方向 R Z ‧‧‧ direction
第1圖係描繪依據本發明之一具體實施例的一定位系統。 FIG. 1 illustrates a positioning system according to a specific embodiment of the present invention.
第2圖係描繪第1圖中所描繪半導體裝置定位系統之一定位平台的一具體實施例。 FIG. 2 illustrates a specific embodiment of a positioning platform of a semiconductor device positioning system depicted in FIG. 1.
第3圖係顯示依據本發明之一具體實施例的一定位系統概要。 FIG. 3 shows an outline of a positioning system according to a specific embodiment of the present invention.
第4圖係第3圖中所描繪定位系統之透視圖。 Figure 4 is a perspective view of the positioning system depicted in Figure 3.
第5圖係第4圖中所描繪定位系統之一托架的透視圖。 Figure 5 is a perspective view of one of the brackets of the positioning system depicted in Figure 4.
第6圖係依據本發明之一具體實施例，一用於定位半導體裝置的方法之流程圖。 FIG. 6 is a flowchart of a method for positioning a semiconductor device according to a specific embodiment of the present invention.
全部說明中，相似之參考代碼可用於識別相似之元件。 Throughout the description, similar reference codes can be used to identify similar components.
可輕易地了解到，此中大體說明及隨附圖式中圖示之具體實施例的組件，可依各式各樣的不同架構進行配置與設計。是以，以下對圖式中描繪之各個具體實施例所作的詳細說明，並非意欲限制本案之範疇，而僅為眾多具體實施例之代表。儘管圖式中呈現各個具體實施例之構想，然而除非有特別指明，否則圖式並非必然按比例繪製。 It can be easily understood that the components of the specific embodiment illustrated in the general description and accompanying drawings can be configured and designed according to a variety of different architectures. Therefore, the following detailed description of each specific embodiment depicted in the drawings is not intended to limit the scope of this case, but is only representative of many specific embodiments. Although the concept of each specific embodiment is presented in the drawings, the drawings are not necessarily drawn to scale unless otherwise specified.
可依其他特定形式具體實施本發明，而不致脫離本發明之精神及根本特徵。描述之具體實施例在各方面皆應被認定為僅作為示例而無限制之意。因此，本發明之範疇係藉隨附申請專利範圍、而非藉此詳細說明指示。源自申請專利範圍之等同意義與範疇內的所有變更，皆涵蓋於此等申請專利範圍之範疇內。 The present invention may be embodied in other specific forms without departing from the spirit and essential characteristics of the invention. The specific embodiments described are to be considered in all respects only as examples and not restrictive. Therefore, the scope of the present invention is to accompany the scope of patent application, rather than to specify the indication in detail. All changes within the meaning and scope of the scope of patent applications are covered by the scope of these patent applications.
整份說明書中提及特點、優點、或類似表達方式，並非暗示可藉本發明實現之所有此等特點與優點皆應、或皆係在本發明之任何單一具體實施例中。反而，提及此等特點與優點之表達方式應被了解為意指，結合一具體實施例作說明之一特定特點、優點、或特徵，包含於本發明之至少一具體實施例中。是以，整份說明書中，此等特點與優點之討論、及類似表達方式，並非必然與同一具體實施例關聯。 Mention of features, advantages, or similar expressions throughout the specification does not imply that all such features and advantages that can be achieved by the present invention should be, or all should be, any single specific embodiment of the present invention. Instead, the expressions referring to these features and advantages should be understood to mean that a specific feature, advantage, or characteristic described in conjunction with a specific embodiment is included in at least one specific embodiment of the present invention. Therefore, the discussion of these features and advantages, and similar expressions throughout the specification are not necessarily associated with the same specific embodiment.
更，所述之發明特點、優點、及特徵可依任何適當方式與一個或更多具體實施例結合。熟知此項技藝之人士將根據此中說明而認知到，可實施本發明，而無需一特殊具體實施例之一個或更多特定特點或優點。 其他範例中，可在本發明所有具體實施例中皆未出現之某些特定具體實施例，認知到額外特點與優點。 Furthermore, the described features, advantages, and characteristics of the invention may be combined with one or more specific embodiments in any suitable manner. Those skilled in the art will recognize from the description herein that the invention can be implemented without one or more of the specific features or advantages of a particular embodiment. In other examples, additional specific features and advantages may be recognized in certain specific embodiments that are not present in all specific embodiments of the invention.
整份說明書中提及「某一具體實施例」、「一具體實施例」、或類似表達方式意指，與指出之具體實施例結合作說明的一特殊特點、結構、或特徵係包含於本發明之至少一具體實施例中。是以，整份說明書中，「某一具體實施例中」、「一具體實施例中」、及類似表達方式之詞語可皆、但非必然與同一具體實施例關聯。 Reference throughout the specification to "a specific embodiment", "a specific embodiment", or a similar expression means that a particular feature, structure, or characteristic described in cooperation with the specific embodiment indicated is included in this specification In at least one embodiment of the invention. Therefore, throughout the specification, the words "in a specific embodiment", "in a specific embodiment", and similar expressions can be all, but not necessarily related to the same specific embodiment.
第1圖係描繪依據本發明之一具體實施例，用於定位一半導體裝置104的一定位系統100。該定位系統被構造為，定位半導體裝置104以進行加工。在第1圖所描繪之具體實施例中，該定位系統包含一定位平台102、一驅動器系統106、及一感測器系統108。該定位系統可用於各式半導體裝置加工裝置中。在某些具體實施例中，該定位系統係用於一晶圓加工系統、譬如一晶粒黏合設備中。儘管示例之定位系統顯示出具有某些特定之組件，且此中說明其具有某些特定功能，然該定位系統之其他具體實施例可包含較少或較多組件，以實現相同、較少、或較多功能。在某些具體實施例中，該定位系統可包含一積體電路(IC)晶片傳送機構。 FIG. 1 illustrates a positioning system 100 for positioning a semiconductor device 104 according to a specific embodiment of the present invention. The positioning system is configured to position the semiconductor device 104 for processing. In the specific embodiment depicted in FIG. 1, the positioning system includes a positioning platform 102, a driver system 106, and a sensor system 108. The positioning system can be used in various semiconductor device processing devices. In some embodiments, the positioning system is used in a wafer processing system, such as a die bonding equipment. Although the example positioning system is shown to have certain specific components and it is described herein that it has certain specific functions, other specific embodiments of the positioning system may include fewer or more components to achieve the same, fewer, Or more features. In some embodiments, the positioning system may include an integrated circuit (IC) wafer transfer mechanism.
定位系統100之定位平台102被構造為，將半導體裝置104載運至一特定位置/地點，以進行半導體裝置加工操作(譬如，半導體裝置沈積操作、半導體裝置蝕刻操作、半導體裝置傳送操作、或半導體裝置擴展操作) 。該定位平台可將該半導體裝置固持於一特定位置、或將該半導體裝置驅動/移動至一特定位置，以進行半導體裝置加工操作。 The positioning platform 102 of the positioning system 100 is configured to carry the semiconductor device 104 to a specific location / place for semiconductor device processing operations (such as a semiconductor device deposition operation, a semiconductor device etching operation, a semiconductor device transfer operation, or a semiconductor device Extended operation) . The positioning platform can hold the semiconductor device at a specific position, or drive / move the semiconductor device to a specific position to perform a semiconductor device processing operation.
定位系統100之驅動器系統106被構造為，驅動(譬如，線性移動或轉動)該定位平台。該驅動器系統可包含至少一馬達及/或至少一組線性導件/軌道。 The driver system 106 of the positioning system 100 is configured to drive (eg, linearly move or rotate) the positioning platform. The drive system may include at least one motor and / or at least one set of linear guides / tracks.
定位系統100之感測器系統108被構造為，量測或檢查半導體裝置104之位置。感測器系統106可為一投影系統。 The sensor system 108 of the positioning system 100 is configured to measure or check the position of the semiconductor device 104. The sensor system 106 may be a projection system.
第2圖係描繪第1圖中所描繪定位系統100之定位平台102的一具體實施例。在第2圖所描繪之具體實施例中，一定位平台202包含一長行程平台222及一短行程平台224。該定位系統被構造為，定位一半導體裝置204，其係藉控制該半導體裝置相對於一支撐結構226之位置來定位該半導體裝置。該支撐結構可為任何適當之支撐裝置/系統。在一具體實施例中，該支撐結構係一支架。在某些具體實施例中，該定位平台係用於一晶粒黏合設備中，其中高檢索速度將與高準確度結合。第2圖中描繪之定位系統202係第1圖中所描繪定位平台102之一可能具體實施例。然而，第1圖中描繪之定位平台102並不以第2圖中顯示之具體實施例為限。 FIG. 2 illustrates a specific embodiment of the positioning platform 102 of the positioning system 100 depicted in FIG. 1. In the specific embodiment depicted in FIG. 2, a positioning platform 202 includes a long-stroke platform 222 and a short-stroke platform 224. The positioning system is configured to position a semiconductor device 204 by positioning the semiconductor device relative to a support structure 226. The support structure may be any suitable support device / system. In a specific embodiment, the supporting structure is a bracket. In some embodiments, the positioning platform is used in a die bonding device, where high retrieval speed will be combined with high accuracy. The positioning system 202 depicted in FIG. 2 is a possible specific embodiment of the positioning platform 102 depicted in FIG. 1. However, the positioning platform 102 depicted in FIG. 1 is not limited to the specific embodiment shown in FIG. 2.
在第2圖描繪之具體實施例中，長行程平台222被構造為，可相對於支撐結構226移動。短行程平台224連附至該長行程平台(譬如，經由至少一連附裝置228)(例如，一平板彈簧或任何其他適當裝置)，且被構造 為載運半導體裝置204。在某些具體實施例中，該長行程平台被構造為可相對於該支撐結構線性移動，及該短行程平台被構造為載運一半導體裝置且可線性移動及/或轉動。在某些具體實施例中，該長行程平台具有一相對於該支撐結構之第一活動範圍。該短行程平台具有一相對於該長行程平台之第二活動範圍，該第二活動範圍較該第一活動範圍小。在某些具體實施例中，該長行程平台被構造為可線性移動，且同時該短行程平台被構造為可線性移動及轉動。該長行程平台係作為該短行程平台與該支撐結構之間的一平衡質量。結果，該長行程平台可作為該短行程平台的加速力之一平衡質量且降低該支撐結構上之反作用力，如此將達成允許高速度下之高定位準確度。 In the specific embodiment depicted in FIG. 2, the long-stroke platform 222 is configured to be movable relative to the support structure 226. A short-stroke platform 224 is attached to the long-stroke platform (e.g., via at least one attachment device 228) (e.g., a flat spring or any other suitable device) and is constructed To carry a semiconductor device 204. In some embodiments, the long-stroke platform is configured to be linearly movable relative to the support structure, and the short-stroke platform is configured to carry a semiconductor device and linearly move and / or rotate. In some embodiments, the long-stroke platform has a first range of motion relative to the support structure. The short-stroke platform has a second range of motion relative to the long-stroke platform. The second range of motion is smaller than the first range of motion. In some embodiments, the long-stroke platform is configured to be linearly movable, and at the same time, the short-stroke platform is configured to be linearly movable and rotatable. The long-stroke platform serves as a balanced mass between the short-stroke platform and the support structure. As a result, the long-stroke platform can be used as one of the acceleration forces of the short-stroke platform to balance the mass and reduce the reaction force on the support structure, thus achieving a high positioning accuracy that allows high speeds.
使用長行程平台222及短行程平台224，使定位平台202可降低支撐結構226上之加速力。由於該長行程平台不具有高定位準確度需求，因此該長行程之加速力可較低，且因此較低之力將傳遞至該支撐結構。結果，該短行程平台產生之高加速力將由該長行程平台之慣性吸收，且不致傳遞至該支撐結構。該長行程平台整合平衡質量與量測系統之二功能，且由於該長行程平台之定位準確度需求較該短行程平台之定位準確度需求低，因此可由低性能致動器驅動。相較於結合一短行程平台及一長行程平台使用一分離式移動平衡質量的一半導體裝置定位平台，第2圖中描繪之定位平台202係使用該長行程平台作為該短行程平台與該半導體裝置之間的一平 衡質量。結果，第2圖中描繪之定位系統202係無需一分離式移動平衡質量而可實現。 The use of the long-stroke platform 222 and the short-stroke platform 224 enables the positioning platform 202 to reduce the acceleration force on the support structure 226. Since the long-stroke platform does not have high positioning accuracy requirements, the acceleration force of the long-stroke can be lower, and thus the lower force will be transmitted to the support structure. As a result, the high acceleration force generated by the short-stroke platform will be absorbed by the inertia of the long-stroke platform and will not be transmitted to the support structure. The long-stroke platform integrates two functions of a balanced mass and measurement system, and because the positioning accuracy requirement of the long-stroke platform is lower than that of the short-stroke platform, it can be driven by a low-performance actuator. Compared to a semiconductor device positioning platform that uses a separate mobile balancing mass in combination with a short-stroke platform and a long-stroke platform, the positioning platform 202 depicted in FIG. 2 uses the long-stroke platform as the short-stroke platform and the semiconductor. One level between devices Weighing quality. As a result, the positioning system 202 depicted in FIG. 2 can be realized without a separate moving balance mass.
第2圖描繪之定位平台202中，短行程平台224相對於支撐結構226之位置係該短行程平台相對於長行程平台222之位置、與該長行程平台相對於該支撐結構之位置的總和。例如，該短行程平台相對於該支撐結構之y軸位置可表示為：ySS2BF=ySS2LS+yLS2BF (1) In the positioning platform 202 depicted in FIG. 2, the position of the short-stroke platform 224 relative to the support structure 226 is the sum of the position of the short-stroke platform relative to the long-stroke platform 222 and the position of the long-stroke platform relative to the support structure. For example, the y-axis position of the short-stroke platform relative to the support structure can be expressed as: ySS2BF = ySS2LS + yLS2BF (1)
其中ySS2BF代表該短行程平台相對於該支撐結構之y軸位置，ySS2LS代表該短行程平台相對於該長行程平台之y軸位置，及yLS2BF代表該長行程平台相對於該支撐結構之y軸位置。該長行程平台、該短行程平台、與該支撐結構之間的相對位置可藉感測器系統108之複數個感測器量測。除此以外，該短行程平台之力僅作用於該長行程上。以FSS代表之該短行程平台的力係由該長行程平台補償，且僅FLS代表之該長行程平台的力影響該支撐結構。 Where ySS2BF represents the y-axis position of the short-stroke platform relative to the support structure, ySS2LS represents the y-axis position of the short-stroke platform relative to the long-stroke platform, and yLS2BF represents the y-axis position of the long-stroke platform relative to the support structure . The relative positions of the long-stroke platform, the short-stroke platform, and the support structure can be measured by a plurality of sensors of the sensor system 108. In addition, the force of the short-stroke platform only acts on the long-stroke. The force of the short-stroke platform represented by F SS is compensated by the long-stroke platform, and only the force of the long-stroke platform represented by F LS affects the support structure.
可依各式技術控制長行程平台222。在某些具體實施例中，該長行程平台之一設定點輪廓係計算作為短行程平台224高速度檢索輪廓之總和。可使用該計算設定點輪廓，依一低活動範圍來控制該長行程平台，導致低控制器力、及因此對支撐結構226的低反作用力。對該支撐結構之低反作用力可有效地使該長行程平台成為與該短行程平台一同移動之一被動平衡質量。另一選擇，可使用該計算設定點輪廓，依一高活動範圍來控制該長 行程平台，消除一大部份之該短行程平台的高反作用力且造成該長行程平台作為該短行程平台之一主動平衡質量。在某些具體實施例中，並未直接控制該長行程平台相對於該支撐結構之位置。反而，依一低控制器頻寬來控制該長行程平台與該短行程平台之間的位置差(譬如，設定為一定值)，確保在朝該支撐結構方向上之低反作用力。對該支撐結構之低反作用力可有效地造成該長行程平台作為該短行程平台之一被動平衡質量。 The long-stroke platform 222 can be controlled according to various technologies. In some embodiments, the setpoint profile of one of the long-stroke platforms is calculated as the sum of the high-speed retrieval profiles of the short-stroke platform 224. The calculated setpoint profile can be used to control the long-stroke platform with a low range of motion, resulting in a low controller force and therefore a low reaction force on the support structure 226. The low reaction force to the support structure can effectively make the long-stroke platform a passive balancing mass that moves with the short-stroke platform. Alternatively, the calculated setpoint profile can be used to control the length with a high range of motion The travel platform eliminates a large part of the high reaction force of the short travel platform and causes the long travel platform to actively balance the mass as one of the short travel platforms. In some embodiments, the position of the long-stroke platform relative to the support structure is not directly controlled. Instead, a low controller bandwidth is used to control the position difference between the long-stroke platform and the short-stroke platform (for example, set to a certain value) to ensure a low reaction force in the direction of the support structure. The low reaction force to the support structure can effectively cause the long-stroke platform to be a passively balanced mass as one of the short-stroke platforms.
第3圖係顯示依據本發明之一具體實施例的一定位系統300概要。第3圖所描繪之具體實施例中，該定位系統包含一長行程平台320及一短行程平台324，該長行程平台具有對應之驅動器/馬達MOT_LS_X、MOT_LS_Y及感測器/編碼器ENC_LS_XT、ENC_LS_XB、ENC_LS_YR、ENC_LSY2M、ENC_LS_YL，該短行程平台具有對應之驅動器/馬達MOT_SS_TL、MOT_SS_BL、MOT_SS_BR、MOT_SS_TR及感測器/編碼器ENC_SS2LS_TL、ENC_SS2LS_BL、ENC_SS2LS_BR、ENC_SS2LS_TR。該定位系統具有用於一矽晶圓304之三個自由度(即，可沿三個方向X_WAFER、Y_WAFER、及RZ運動)，包含該長行程平台之二個同平面平移、及該短行程平台之二個同平面平移與一個同平面旋轉。第3圖中描繪之定位系統300亦可用於其他半導體裝置。該定位系統可具有各種活動範圍，且可定位各尺寸之晶圓。在一具體實施例中，該長行程平台可具有一沿X及Y方向之大約350公釐(mm)活動範圍，且該短行程平台具有一沿X及Y 方向之大約6公釐活動範圍。該短行程平台具有一大約0.5度之旋轉範圍，且同時該晶圓尺寸可為200公釐或300公釐。第3圖中描繪之定位系統300係第1圖中描繪之定位系統100的某一可能具體實施例。然而，第1圖中描繪之定位系統100並非以第3圖中顯示之具體實施例為限。 FIG. 3 shows an outline of a positioning system 300 according to a specific embodiment of the present invention. In the specific embodiment depicted in FIG. 3, the positioning system includes a long-stroke platform 320 and a short-stroke platform 324. The long-stroke platform has corresponding drivers / motors MOT_LS_X, MOT_LS_Y and sensors / encoders ENC_LS_XT, ENC_LS_XB. , ENC_LS_YR, ENC_LSY2M, ENC_LS_YL, the short-stroke platform has corresponding drivers / motors MOT_SS_TL, MOT_SS_BL, MOT_SS_BR, MOT_SS_TR and sensors / encoders ENC_SS2LS_TL, ENC_SS2LS_BL, ENC_SS2LS_BR, ENC_SS2LS_BR. The positioning system 304 having a three degrees of freedom of a silicon wafer (i.e., the X _WAFER, Y _WAFER, R Z and motion in three directions), comprising two co-planar translation of the long stroke stage, and that For short-stroke platforms, two coplanar translations and one coplanar rotation. The positioning system 300 depicted in FIG. 3 can also be used in other semiconductor devices. The positioning system can have various ranges of motion and can position wafers of various sizes. In a specific embodiment, the long-stroke platform may have a range of motion of about 350 mm (mm) along the X and Y directions, and the short-stroke platform has a range of motion of about 6 mm along the X and Y directions. The short-stroke stage has a rotation range of about 0.5 degrees, and at the same time, the wafer size can be 200 mm or 300 mm. The positioning system 300 depicted in FIG. 3 is a possible specific embodiment of the positioning system 100 depicted in FIG. 1. However, the positioning system 100 depicted in FIG. 1 is not limited to the specific embodiment shown in FIG. 3.
第3圖所描繪之具體實施例中，長行程平台320被構造為，可在一平面340內相對於一支撐結構(未顯示)線性移動。短行程平台324連附至該長行程平台，及被構造為載運矽晶圓304且可線性移動、並可在平面340內環繞與該平面垂直之一軸線342轉動。該長程平台作用如介於該短行程平台與該支撐結構之間的一平衡質量。該長程平台具有一相對於該支撐結構之第一活動範圍，且同時該短行程平台具有一相對於該長行程平台且較該第一活動範圍小之第二活動範圍。 In the specific embodiment depicted in FIG. 3, the long-stroke platform 320 is configured to be linearly movable relative to a support structure (not shown) in a plane 340. A short-stroke platform 324 is attached to the long-stroke platform, and is configured to carry a silicon wafer 304 and is linearly movable and rotatable within a plane 340 about an axis 342 perpendicular to the plane. The long-range platform acts as a balanced mass between the short-stroke platform and the support structure. The long range platform has a first range of motion relative to the support structure, and at the same time the short range platform has a second range of motion relative to the long range platform and smaller than the first range of motion.
長行程平台320可使矽晶圓304沿x方向、X_WAFER，且沿與x方向、X_WAFER垂直之y方向、Y_WAFER移動。第3圖所描繪之具體實施例中，長行程平台包含一長行程X本體360及一長行程Y本體362，該長行程X本體被構造為可沿連附至該支撐結構之x方向線性導件/軌道350-1、350-2、350-3、350-4移動，及該長行程Y本體連附至該長行程X本體且被構造為可沿連附至該長行程平台之y方向線性導件/軌道352-1、352-2、352-3、352-4移動。明確地，馬達MOT_LS_X被構造為，透過將馬達MOT_LS_X之旋轉轉換成該長行程X本體線性移動之一皮帶或心軸，沿x方向、X_WAFER上之x方向線性導件/軌 道來驅動該長行程X本體。頂部感測器ENC_LS_XT及底部感測器ENC_LS_XB被構造為，在該長行程平台移動期間，量測或檢查該長程X本體在x方向、X_WAFER上之位置。馬達MOT_LS_Y被構造為，透過將馬達MOT_LS_Y之旋轉轉換成該長行程Y本體線性移動之一皮帶或心軸，沿y方向、Y_WAFER上之y方向線性導件/軌道來驅動該長行程Y本體。左側感測器ENC_LS_YL、中間感測器ENC_LSY2M、及右側感測器ENC_LS_YR被構造為，該長行程平台在移動期間，量測或檢查該長行程Y本體在y方向、Y_WAFER上之位置。 The long-stroke stage 320 can move the silicon wafer 304 in the x direction, X_WAFER , and in the y direction, Y_WAFER, which is perpendicular to the x direction, X_WAFER . In the specific embodiment depicted in FIG. 3, the long-stroke platform includes a long-stroke X body 360 and a long-stroke Y body 362. The long-stroke X body is configured to be linearly guided in the x direction attached to the support structure. Pieces / tracks 350-1, 350-2, 350-3, 350-4 move, and the long-stroke Y body is attached to the long-stroke X body and is configured to be y-direction attached to the long-stroke platform Linear guides / rails 352-1, 352-2, 352-3, 352-4 move. Specifically, the motor MOT_LS_X is configured to drive the long by linearly converting the rotation of the motor MOT_LS_X into a belt or mandrel of the long stroke X body linear movement along the x direction and the x direction on the X_WAFER . Stroke X body. The top sensor ENC_LS_XT and the bottom sensor ENC_LS_XB are configured to measure or check the position of the long-range X body in the x direction and X_WAFER during the long-stroke platform movement. The motor MOT_LS_Y is configured to drive the long-stroke Y body by converting a rotation of the motor MOT_LS_Y into a belt or a mandrel that linearly moves the long-stroke Y body, and linearly guides / tracks along the y direction and the y direction on Y_WAFER . . The left sensor ENC_LS_YL, the middle sensor ENC_LSY2M, and the right sensor ENC_LS_YR are configured to measure or check the position of the long-stroke Y body in the y direction and Y_WAFER during the movement of the long-stroke platform.
短行程平台324被構造為，可沿x方向X_WAFER移動、可沿y方向Y_WAFER移動、且可順時針或逆時針轉動。第3圖所描繪之具體實施例中，該短行程平台連附至該長行程平台。結果，馬達MOT_LS_X可在x方向、X_WAFER上沿x方向線性導件/軌道350-1、350-2、350-3、350-4來驅動該短行程平台，及馬達MOT_LS_Y可在y方向、Y_WAFER上沿y方向線性導件/軌道352-1、352-2、352-3、352-4來驅動該短行程平台。除此以外，第3圖所描繪之具體實施例中，對應之馬達MOT_SS_TL、MOT_SS_BL、MOT_SS_BR、MOT_SS_TR被構造為，使矽晶圓304沿x方向、X_WAFER或y方向、Y_WAFER線性移動，或者使該短行程平台及矽晶圓304順時針或逆時針轉動。明確地，左上方馬達MOT_SS_TL、左下方馬達MOT_SS_BL、右下方馬達MOT_SS_BR、及右上方馬達MOT_SS_TR被構造為，透過x方向線性導件/軌道356-1、356-2而沿x方向、 X_WAFER，或透過y方向線性導件/軌道358-1、358-2而沿y方向、Y_WAFER線性移動矽晶圓304，或者順時針或逆時針轉動該短行程平台及該矽晶圓。左上方感測器ENC_SS2LS_TL、左下方感測器ENC_SS2LS_BL、右下方感測器ENC_SS2LS_BR、及右上方感測器ENC_SS2LS_TR被構造為，量測或檢查該短行程平台在運動期間之位置。 The short-stroke platform 324 is configured to be movable in the x-direction X_WAFER , to be movable in the y-direction Y_WAFER , and to be able to rotate clockwise or counterclockwise. In the specific embodiment depicted in FIG. 3, the short-stroke platform is attached to the long-stroke platform. As a result, the motor MOT_LS_X can drive the short-stroke platform with linear guides / tracks 350-1, 350-2 , 350-3 , and 350-4 along the x direction in the x direction and X_WAFER , and the motor MOT_LS_Y can be used in the y direction, y _WAFER the y direction along linear guides / rails 352-1,352-2,352-3,352-4 driving the short stroke stage. In addition, in the specific embodiment depicted in FIG. 3, the corresponding motors MOT_SS_TL, MOT_SS_BL, MOT_SS_BR, MOT_SS_TR are configured to move the silicon wafer 304 linearly in the x direction, X_WAFER or y direction, or Y_WAFER , or The short-stroke platform and the silicon wafer 304 are rotated clockwise or counterclockwise. Specifically, the upper left motor MOT_SS_TL, the lower left motor MOT_SS_BL, the lower right motor MOT_SS_BR, and the upper right motor MOT_SS_TR are configured to pass through the x-direction linear guides / tracks 356-1, 356-2 along the x-direction, X_WAFER , Or linearly move the silicon wafer 304 in the y direction and Y_WAFER through the y-direction linear guides / tracks 358-1, 358-2 , or rotate the short-stroke platform and the silicon wafer clockwise or counterclockwise. The upper left sensor ENC_SS2LS_TL, the lower left sensor ENC_SS2LS_BL, the lower right sensor ENC_SS2LS_BR, and the upper right sensor ENC_SS2LS_TR are configured to measure or check the position of the short-stroke platform during movement.
第4圖係第4圖中描繪之晶圓定位系統300的透視圖。第4圖所描繪之透視圖中，晶圓定位系統300之長行程平台320包含長行程X本體360及長行程Y本體362，該長行程X本體被構造為可沿x方向移動，該長行程Y本體連附至該長行程X本體且被構造為可沿y方向移動。該長行程X本體係藉長行程X馬達MOT_LS_X而沿x方向線性導件468-1、468-2驅動。該長行程Y本體係藉長行程Y馬達MOT_LS_Y而在一組y方向線性導件470-1、470-2上沿y方向驅動。該等y方向線性導件及該長行程Y馬達係固定至支撐結構326(譬如，一支撐板)上，且同時該長行程Y本體置於該等y方向線性導件上之可動結構(譬如，輪子或滾子)上。該x方向線性導件係固定於該長行程Y本體上，且同時該長行程X本體置於該x方向線性導件上之可動結構(譬如，輪子或滾子)上。該長行程X馬達連附至該長行程Y本體或該x方向線性導件。第1圖所描繪之具體實施例中，晶圓定位系統300之短行程平台324包含一短行程本體472，該短行程本體連附至長行程X本體。該短行程本體與該長行程X本體形成一晶圓托架476。 FIG. 4 is a perspective view of the wafer positioning system 300 depicted in FIG. 4. In the perspective view depicted in FIG. 4, the long-stroke platform 320 of the wafer positioning system 300 includes a long-stroke X body 360 and a long-stroke Y body 362. The long-stroke X body is configured to be movable in the x direction. The Y body is attached to the long-stroke X body and is configured to be movable in the y direction. This long-stroke X system uses the long-stroke X motor MOT_LS_X to drive the linear guides 468-1 and 468-2 along the x-direction. This long-stroke Y system uses a long-stroke Y motor MOT_LS_Y to drive a set of y-direction linear guides 470-1 and 470-2 in the y-direction. The y-direction linear guides and the long-stroke Y motor are fixed to a support structure 326 (for example, a support plate), and at the same time, the long-stroke Y body is placed on a movable structure (such as a y-direction linear guide) , Wheels or rollers). The x-direction linear guide is fixed on the long-stroke Y body, and at the same time, the long-stroke X-body is placed on a movable structure (such as a wheel or a roller) on the x-direction linear guide. The long-stroke X motor is attached to the long-stroke Y body or the x-direction linear guide. In the specific embodiment depicted in FIG. 1, the short-stroke platform 324 of the wafer positioning system 300 includes a short-stroke body 472, which is attached to the long-stroke X body. The short-stroke body and the long-stroke X body form a wafer holder 476.
第5圖係第4圖中描繪之晶圓定位系統300的 晶圓托架476透視圖。在第5圖所示之透視圖中，使用四個短行程致動器及編碼器580-1、580-2、580-3、580-4，來線性移動或轉動短行程本體472、及量測或感測該短行程本體在運動期間之位置。 FIG. 5 shows the wafer positioning system 300 shown in FIG. 4. Wafer carrier 476 perspective view. In the perspective view shown in Figure 5, four short-stroke actuators and encoders 580-1, 580-2, 580-3, and 580-4 are used to linearly move or rotate the short-stroke body 472, and the amount Measure or sense the position of the short-stroke body during exercise.
第6圖係依據本發明之一具體實施例，一用於定位半導體裝置的方法之流程圖。在方塊602，長行程平台在一平面內相對於一支撐結構線性移動。在方塊604，在該平面內載運晶圓之一短行程平台線性移動，其中該短行程平台係藉該長行程平台支撐。 FIG. 6 is a flowchart of a method for positioning a semiconductor device according to a specific embodiment of the present invention. At block 602, the long-stroke platform moves linearly in a plane relative to a support structure. At block 604, one of the short-stroke platforms carrying wafers in the plane moves linearly, wherein the short-stroke platform is supported by the long-stroke platform.
儘管此中(多個)方法之動作係依一特殊順序顯示及描述，然可改變每一方法之動作，使得可依相反順序實施某些特定動作，或使得可至少部份地同時實施某些特定動作或其他動作。在另一具體實施例中，可依一間歇及/或交替方式實現不同動作之指令或次動作。 Although the actions of the method (s) are shown and described in a special order, the actions of each method can be changed so that certain specific actions can be performed in the reverse order, or certain actions can be performed at least partially at the same time Specific actions or other actions. In another specific embodiment, instructions or secondary actions of different actions may be implemented in an intermittent and / or alternating manner.
請注意到，可使用儲存於一電腦可用儲存媒體上而藉一電腦執行之軟體指令，實現此等方法之至少某些動作。例如，一電腦程式產品之一具體實施例包含一電腦可用儲存媒體以儲存一電腦可讀程式，當該程式在一電腦上執行時，將使該電腦實施如此中所述之動作。 Please note that at least some actions of these methods may be implemented using software instructions stored on a computer-usable storage medium and borrowed from a computer to execute. For example, a specific embodiment of a computer program product includes a computer-usable storage medium to store a computer-readable program. When the program is executed on a computer, the computer will perform the actions described in this.
該電腦可用或電腦可讀媒體可為一電子、磁性、光學、電磁、紅外線、或半導體系統(或者設備或裝置)、或一傳播媒體。一電腦可讀媒體之範例包含一半導體或固態記憶體、磁帶、一可移除式電腦磁片、一隨機存取記憶體(RAM)、一唯讀記憶體(ROM)、一硬式磁碟、及一光碟。現行之光碟範例包含一唯讀光碟記憶體 (CD-ROM)、一讀/寫型光碟(CD-R/W)、一數位影音光碟(DVD)、及一藍光光碟。 The computer-usable or computer-readable medium may be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system (or apparatus or device), or a propagation medium. Examples of a computer-readable medium include a semiconductor or solid state memory, magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a hard disk, And a disc. The current disc example includes a read-only disc memory (CD-ROM), a read / write disc (CD-R / W), a digital video disc (DVD), and a Blu-ray disc.
以上說明提供各個具體實施例之特定細部設計。然而，可依較所有此等細部設計少者來實施某些具體實施例。在其他範例中，為簡潔及清楚，以相較於達成本發明各個具體實施例者，不致更詳細之方式，說明某些特定方法、程序、組件、結構、及/或功能。 The above description provides specific detailed designs for various specific embodiments. However, certain specific embodiments may be implemented with fewer than all such detailed designs. In other examples, for brevity and clarity, certain specific methods, procedures, components, structures, and / or functions are described in a more detailed manner than those of various embodiments of the invention.
儘管已說明與圖示本發明之特定具體實施例，然本發明並非以如此說明與圖示之特定部件形式或配置為限。本發明之範疇將藉隨附於後之申請專利範圍及其等義者界定。 Although specific embodiments of the invention have been illustrated and illustrated, the invention is not limited to the specific component forms or configurations so described and illustrated. The scope of the invention will be defined by the scope of the appended patents and their equivalents.
100‧‧‧定位系統 100‧‧‧ Positioning System
102‧‧‧定位系統 102‧‧‧ Positioning System
104‧‧‧半導體裝置 104‧‧‧Semiconductor device
106‧‧‧驅動器系統 106‧‧‧Driver system
108‧‧‧感測器系統 108‧‧‧ Sensor System
Claims (20)
Applications Claiming Priority (2)
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| US15/187,162 | 2016-06-20 | ||
| US15/187,162 US10192773B2 (en) | 2016-06-20 | 2016-06-20 | Semiconductor device positioning system and method for semiconductor device positioning |
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| TW201810504A true TW201810504A (en) | 2018-03-16 |
| TWI752022B TWI752022B (en) | 2022-01-11 |
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| TW106113773A TWI752022B (en) | 2016-06-20 | 2017-04-25 | Semiconductor device positioning system and method for semiconductor device positioning |
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| EP (1) | EP3472670B1 (en) |
| JP (1) | JP2019518339A (en) |
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| CN (1) | CN109328323B (en) |
| TW (1) | TWI752022B (en) |
| WO (1) | WO2017220245A1 (en) |
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| CN110491816B (en) * | 2019-08-30 | 2022-01-21 | 京东方科技集团股份有限公司 | Substrate bearing device and gluing and developing equipment |
| DE102019125127A1 (en) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Component handling, component inspection |
| DE102019125134A1 (en) | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Component handling, component inspection |
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| CN109328323A (en) | 2019-02-12 |
| TWI752022B (en) | 2022-01-11 |
| US20170365502A1 (en) | 2017-12-21 |
| JP2019518339A (en) | 2019-06-27 |
| WO2017220245A1 (en) | 2017-12-28 |
| EP3472670B1 (en) | 2022-08-24 |
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| KR102374394B1 (en) | 2022-03-15 |
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| US10192773B2 (en) | 2019-01-29 |
| EP3472670A1 (en) | 2019-04-24 |
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