TW201808621A - Metal-clad laminate printed wiring board method of manufacturing metal-clad laminate and method of manufacturing printed wiring board - Google Patents

Abstract

A metal-clad laminate includes a first insulating layer, a conductor circuit, a second insulating layer, and a metal layer. The conductor circuit is laminated on the first insulating layer. The second insulating layer is laminated on the first insulating layer and the conductor circuit. The metal layer is laminated on the second insulating layer. The second insulating layer includes a reinforcing material and a cured material of thermosetting resin composition in the reinforcing material. A relationship between the interlayer thickness Ta2 of the conductor circuit and the metal layer and the thickness Tb2 of the reinforcing material is 0 ≤ Ta2 - Tb2 ≤ 2 [mu]m. The thickness of the conductor circuit is 3 - 20 [mu]m. The interlayer thickness Ta2 is 10 - 50 [mu]m. The thickness Tb2 is 8 - 50 [mu]m. The metal-clad laminate can be used as a printed wiring board where warpage due to a temperature change is suppressed.

Description

Metal-laminated laminated board, printed wiring board, method for manufacturing metal-clad laminated board, and method for manufacturing printed wiring board

FIELD OF THE INVENTION The present invention relates to a method for manufacturing a metal-clad laminated board, a printed wiring board, a metal-clad laminated board, and a printed wiring board.

BACKGROUND OF THE INVENTION In recent years, with the increase in the functionality and density of electronic devices, electronic components have become increasingly smaller, more integrated, faster, and more prone. Along with this, the requirements for higher density, smaller diameter, lighter weight, and thinner printed wiring boards have also increased. In particular, a thin printed wiring board is prone to warping.

As a copper-clad laminated board that is less prone to warping even if the thickness is thin, Patent Documents 1 and 2 disclose a copper-clad laminated board in which a plurality of prepregs containing an inorganic filler are superimposed, and The copper foil is arranged on one or both sides, and is formed by multi-layer vacuum pressing and lamination. Prior art literature

Patent Literature Patent Literature 1: Japanese Patent Laid-Open No. 2011-195476 Patent Literature 2: Japanese Patent Laid-Open No. 2012-052110

SUMMARY OF THE INVENTION However, as described in Patent Documents 1 and 2, a copper-clad laminated board obtained by a multi-stage vacuum pressing method may not sufficiently meet the requirements for thinning.

Moreover, in the manufacture of a multilayer printed wiring board, it is necessary to embed a conductor circuit of an inner layer substrate in an insulating layer. In a multilayer printed wiring board obtained by a multi-stage vacuum pressing method, the conductor circuit of the inner substrate may not be sufficiently embedded in the insulating layer, and bubbles may remain in the insulating layer. This may be the cause, which may cause interlayer peeling during welding and assembly. In the past, in order to prevent such interlayer peeling, it was necessary to increase the amount of resin constituting the insulating layer. As a result, the thickness of the insulating layer increased, and the thickness of the multilayer printed wiring board was limited. Furthermore, since the amount of the resin constituting the insulating layer is increased, there is a fear that the elastic modulus decreases, and warpage of the multilayer printed wiring board may easily occur.

Therefore, the present invention provides a metal-clad laminated board, a printed wiring board, a method for manufacturing a metal-clad laminated board, and a method for manufacturing a printed wiring board, which can be made to fully respond to thinning, even if the thickness is relatively thin, and it is assembled by welding. A printed wiring board that is not prone to interlayer peeling at the same time and can suppress the amount of warpage due to temperature changes.

The metal-clad laminated board of the first invention includes: an insulating layer having a first surface and a second surface; a first metal layer laminated on the first surface of the insulating layer; and a second metal layer laminated on the insulating layer On the second side. The insulating layer includes a reinforcing material and a hardened material of a thermosetting resin composition impregnated with the reinforcing material. The relationship between the interlayer thickness Ta1 of the first metal layer and the second metal layer and the thickness Tb1 of the reinforcing material is: 0 ≦ Ta1-Tb1 ≦ 2 μm.

The metal-clad laminated board of the second invention includes: a first insulating layer; a conductor circuit laminated on the first insulating layer; a second insulating layer laminated on the first insulating layer and the conductor circuit; and a metal layer laminated On the second insulating layer. The second insulating layer includes a reinforcing material and a hardened material of a thermosetting resin composition impregnated with the reinforcing material. The relationship between the interlayer thickness Ta2 of the conductor circuit and the metal layer and the thickness Tb2 of the reinforcing material is: 0 ≦ Ta2-Tb2 ≦ 2 μm.

The printed wiring board of the third invention includes: a first insulation layer; a first conductor circuit laminated on the first insulation layer; a second insulation layer laminated on the first insulation layer and the first conductor circuit; a second conductor The circuit is laminated on the second insulating layer. The second insulating layer includes a reinforcing material and a hardened material of a thermosetting resin composition impregnated with the reinforcing material. The relationship between the interlayer thickness Ta3 of the first conductor circuit and the second conductor circuit and the thickness Tb3 of the reinforcing material is: 0 ≦ Ta3－Tb3 ≦ 2 μm.

The method for manufacturing a metal-clad laminated board according to the fourth invention includes a preparation step of preparing a core substrate having conductor circuits on both or one side; a lamination step by sequentially stacking prepregs and A metal foil to make a laminate; a heating and pressure forming step, continuously supplying the laminate to a pair of rotating endless belts, and heating and forming the laminate between a pair of endless belts. The prepreg contains a reinforcing material and a thermosetting resin composition impregnated with the reinforcing material. The relationship between the thickness of the interlayer thickness Ta2 of the conductor circuit and the metal foil after heating and pressing and the thickness Tb2 of the reinforcing material is: 0 ≦ Ta2−Tb2 ≦ 2 μm.

The method of manufacturing a printed wiring board according to the fifth invention is to manufacture a metal-clad laminated board by a method of manufacturing a metal-clad laminated board, and perform wiring formation processing on the metal foil.

According to the present invention, a printed wiring board can be produced which can sufficiently respond to thinning, and even if the thickness is thin, interlayer peeling does not easily occur during soldering and assembly, and the amount of warpage due to temperature change can be suppressed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below. [Laminate with metal 100 of the first embodiment]

FIG. 1 is a schematic cross-sectional view of a metal-clad laminate 100 according to a first embodiment of the present invention.

As shown in FIG. 1, the metal-clad laminate 100 includes: an insulating layer 10 having a first surface 10 a and a second surface 10 b opposite to the first surface 10 a; a first metal layer 20; and a second metal layer 30. The first metal layer 20 is laminated on the first surface 10 a of the insulating layer 10. The second metal layer 30 is laminated on the second surface 10 b of the insulating layer 10. The insulating layer 10 includes a reinforcing material 11 and a cured product 12 of a thermosetting resin composition impregnated with the reinforcing material 11.

In the first embodiment, as shown in FIG. 1, the thickness difference (Ta1-Tb1) between the interlayer thickness Ta1 of the first metal layer 20 and the second metal layer 30 and the thickness Tb1 of the reinforcing material 11 is 0 ≦ Ta1-Tb1 ≦ 2 μm, and preferably 1 μm ≦ Ta1-Tb1 ≦ 2 μm. If the thickness difference (Ta1-Tb1) exceeds 2 μm, there is a possibility that the thickness of the printed wiring board cannot be adequately dealt with. If the range of the thickness difference (Ta1-Tb1) is 1 μm or more and 2 μm or less, the reinforcing material 11 and the first metal layer 20 and the second metal layer 30 (hereinafter may be referred to as the metal layers 20 and 30 directly), It is not easy to contact, and the metal-clad laminate 100 is more excellent in electrical reliability.

The interlayer thickness Ta1 and the thickness Tb1 of the reinforcing material 11 can be measured by a method similar to that described in the examples. To make the thickness difference (Ta1-Tb1) within the above range, for example, as described later, a metal-laminated laminate 100 can be produced by a two-belt pressing method that can rapidly increase the heating temperature. In addition, when the insulating layer 10 is a hardened laminated body in which a plurality of prepregs are stacked, and the prepreg includes a reinforcing material 11 and a semi-hardened material of a thermosetting resin composition contained in the reinforcing material 11 (B-stage state) In the case of), the thickness Tb1 of the reinforcing material 11 refers to the total thickness of the plurality of reinforcing materials and the thickness of the cured material of the thermosetting resin composition between adjacent reinforcing materials. The same measurement as the thickness Tb1 of the reinforcing material 11 can.

The thickness of the metal-clad laminate 100 is preferably 14 to 90 μm, and more preferably 16 to 87 μm. The interlayer thickness Ta1 of the first metal layer 20 and the second metal layer 30 is preferably 10 to 50 μm, and more preferably 12 to 47 μm. The thickness between the first metal layer 20 and the reinforcing material 11 and the thickness relationship between the second metal layer 30 and the reinforcing material 11 are not particularly limited as long as the thickness difference (Ta1-Tb1) is within the above range. For example, the following cases may be mentioned: the thickness between the first metal layer 20 and the reinforcing material 11 and the case where the thickness between the second metal layer 30 and the reinforcing material 11 are the same; between the first metal layer 20 and the reinforcing material 11 The thickness between the second metal layer 30 and the reinforcing material 11 is 0 μm; the thickness between the first metal layer 20 and the reinforcing material 11 is 0 μm, and the thickness between the second metal layer 30 and the reinforcing material 11 is 0 μm; When the thickness is 2 μm, etc.

The soldering heat resistance of the metal-clad laminate 100 is preferably 260 ° C or higher, and more preferably 288 ° C or higher. If the soldering heat resistance of the metal-clad laminated board 100 is within the above range, a printed wiring board that is less likely to undergo interlayer peeling during solder assembly can be produced. Welding heat resistance can be measured by the same method as described in the examples.

The amount of warpage of the metal-clad laminate 100 is preferably 20 mm or less, and more preferably 10 mm or less. If the amount of warpage of the metal-clad laminated board 100 is within the above range, a printed wiring board capable of further suppressing the amount of warpage due to temperature changes can be produced. The amount of warpage can be measured by a method similar to that described in the examples. (Insulation layer 10)

The insulating layer 10 includes a reinforcing material 11 and a cured product 12 of a thermosetting resin composition impregnated with the reinforcing material 11.

As the reinforcing material 11, for example, the following materials can be used: woven or non-woven fabrics composed of glass fibers; aramid fibers, PBO (polyparaphenylene benzodioxazole) fibers, and PBI (polybenzimidazole) fibers Woven or non-woven fabrics made of organic fibers such as PTFE (polytetrafluoroethylene) fibers, PBZT (poly-p-phenylene benzodithiazole) fibers, fully aromatic polyester fibers; woven fabrics made of inorganic fibers other than glass fibers Cloth or non-woven cloth, etc. The weaving method of the reinforcing material 11 is not particularly limited, and examples thereof include plain weaving and reed weaving. Examples of the glass composition of the glass fiber include E glass, D glass, S glass, NE glass, T glass, and quartz. The reinforcing material 11 may be a person who has been subjected to an open fiber treatment, or may be a person who has been subjected to a surface treatment with a silane coupling agent or the like.

The thermosetting resin composition constituting the cured product 12 of the thermosetting resin composition contains a thermosetting resin, and may contain a curing agent, a curing accelerator, an inorganic filler, a flame retardant, and the like in addition to the thermosetting resin. Examples of the thermosetting resin include epoxy resin, polyimide resin, phenol resin, and bismaleimide triazine resin. As the curing agent, a diamine-based curing agent such as a primary amine or a secondary amine, a phenol-based curing agent having more than two functional groups, an acid anhydride-based curing agent, dicyandiamide, and a low molecular weight polyphenylene ether compound can be used. As a hardening accelerator, for example, an imidazole-based compound such as 2-ethyl-4-methylimidazole (2E4MZ), a tertiary amine-based compound, an organic phosphine compound, a metal soap, or the like can be used. Examples of the inorganic filler include molybdenum compounds such as silicon dioxide and molybdenum trioxide, aluminum hydroxide, magnesium hydroxide, aluminum silicate, magnesium silicate, talc, clay, mica, and the like. These materials may be used alone or in combination of two or more materials. The content of the inorganic filler is preferably 100 to 200 parts by mass based on the total mass of the thermosetting resin and the hardener. As the flame retardant, a halogen-based flame retardant such as a bromine-containing compound, a non-halogen flame retardant such as a phosphorus-containing compound, and a nitrogen-containing compound can be used. (First metal layer 20, second metal layer 30)

The first metal layer 20 and the second metal layer 30 are made of a foil-shaped metal. In other words, the metal layers 20 and 30 are composed of planar metal that is not patterned. The first metal layer 20 and the second metal layer 30 may have the same configuration or different configurations.

As a material constituting the metal layers 20 and 30, for example, copper, aluminum, stainless steel, or the like can be used, and among them, copper is preferably used. When the material of the metal layers 20 and 30 is copper, either electrolytic copper or rolled copper may be used. The thickness of the metal layers 20 and 30 is preferably 2 to 40 μm, and more preferably 2 to 20 μm.

It is preferable that at least one surface of the metal layers 20 and 30 is a matte surface. In this case, one surface of the metal layers 20 and 30 may be a matte surface, the other surface of the metal layers 20 and 30 may be a bright surface, and both surfaces of the metal layers 20 and 30 may be matte surfaces. If the matte surfaces of the metal layers 20 and 30 are configured to be heated and press-molded toward the prepreg, in the metal-clad laminate, the peeling strength of the first metal layer 20 and the insulating layer 10 can be improved by the anchor effect. And the peel strength of the second metal layer 30 and the insulating layer 10.

The ten-point average roughness (RZJIS) of the matte surface is not particularly limited, but is preferably 0.5 to 5.0 μm. The ten-point average roughness (RZJIS) of the bright surface is not particularly limited, but is preferably 0.5 to 2.5 μm. Compared with the bright surface, there are more dense bumps on the matte surface.

Here, the so-called ten-point average roughness (RZJIS) is stipulated by JISB 0601-2013, and only the reference length is taken from the roughness curve in the direction of its average line, and the average line of the extracted portion is taken at the vertical magnification. The average of the absolute value of the absolute value of the elevation (Yp) from the highest peak to the fifth highest peak measured in the direction from the average value of the absolute value of the absolute value of the elevation (Yv) from the lowest valley to the fifth lowest. Sum is calculated, and this value is expressed in micrometers (μm). [Laminate with Metal 101 of the Second Embodiment]

FIG. 2 is a schematic cross-sectional view of a metal-clad laminate 101 according to a second embodiment of the present invention.

As shown in FIG. 2, the metal-clad laminated board 101 includes: a first insulating layer 40 having a first surface 40 a and a second surface 40 b facing each other; a conductor circuit 50; a second insulating layer 60; a metal layer 21 ( Hereinafter, it is referred to as a first metal layer 21); metal layer 31 (hereinafter, referred to as a second metal layer 31). The conductor circuit 50 is laminated on the first insulating layer 40 (hereinafter, referred to as the first surface 40a). The second insulating layer 60 is laminated on the first surface 40 a and the conductor circuit 50. The first metal layer 21 is laminated on the second insulating layer 60. The second metal layer 31 is laminated on the second surface 40 b of the first insulating layer 40. The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a hardened material 62 of a thermosetting resin composition impregnated with the reinforcing material 61.

In the second embodiment, as shown in FIG. 2, the thickness difference (Ta2-Tb2) between the interlayer thickness Ta2 of the conductor circuit 50 and the first metal layer 21 and the thickness Tb2 of the reinforcing material 61 is 0 ≦ Ta2-Tb2 ≦ 2 μm, In addition, it is preferably 1 μm ≦ Ta2−Tb2 ≦ 2 μm. If the thickness difference (Ta2-Tb2) exceeds 2 μm, there is a possibility that the thickness of the printed wiring board cannot be adequately dealt with. In addition, if the thickness difference (Ta2-Tb2) is 1 μm or more and 2 μm or less, the reinforcing material 61 is difficult to contact with the first metal layer 21 and the conductor circuit 50, and the metal-laminated laminate 101 will be more excellent in electrical reliability . For the same reason, the thickness difference (Tc-Td) between the interlayer thickness Tc of the conductor circuit 50 and the second metal layer 31 and the thickness Td of the reinforcing material 41 is 0 ≦ Tc-Td ≦ 2 μm, and preferably 1 μm ≦ Tc-Td ≦ 2 μm.

The method for measuring the interlayer thickness Ta2 is the same as the method for measuring the interlayer thickness Ta1. The method for measuring the thickness Tb2 of the reinforcing material 61 is the same as the method for measuring the thickness Tb1 of the reinforcing material 11.

The thickness of the metal-clad laminate 101 is preferably 26 to 160 μm, and more preferably 30 to 150 μm. The interlayer thickness Ta2 between the conductor circuit 50 and the first metal layer 21 is preferably 10 to 50 μm, and more preferably 12 to 47 μm. The interlayer thickness Tc of the conductor circuit 50 and the second metal layer 31 is preferably 10 to 50 μm, and more preferably 12 to 47 μm. The thickness between the conductor circuit 50 and the reinforcing material 61, and the thickness relationship between the first metal layer 21 and the reinforcing material 61 are not particularly limited as long as the thickness difference (Ta2-Tb2) is within the above range. For example, the following cases may be mentioned: the thickness between the conductor circuit 50 and the reinforcing material 61 and the case where the thickness between the first metal layer 21 and the reinforcing material 61 are the same; the thickness between the conductor circuit 50 and the reinforcing material 61 is 2 μm, the thickness between the first metal layer 21 and the reinforcing material 61 is 0 μm; the thickness between the conductor circuit 50 and the reinforcing material 61 is 0 μm, and the thickness between the first metal layer 21 and the reinforcing material 61 is 2 μm Situation, etc.

The soldering heat resistance of the metal-clad laminate 101 is preferably 260 ° C or higher, and more preferably 288 ° C or higher. If the soldering heat resistance of the metal-clad laminated board 101 is within the above-mentioned range, a printed wiring board that is less likely to undergo interlayer peeling during solder assembly. Welding heat resistance can be measured by the same method as described in the examples.

The amount of warpage of the metal-clad laminate 101 is preferably 20 mm or less, and more preferably 10 mm or less. If the amount of warpage of the metal-clad laminated board 101 is within the above range, a printed wiring board capable of further suppressing the amount of warpage due to temperature change can be produced. The amount of warpage can be measured by a method similar to that described in the examples. The amount of warpage can be measured by a method similar to that described in the examples. (First insulating layer 40, second insulating layer 60)

The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a hardened material 62 of a thermosetting resin composition impregnated with the reinforcing material 61. The first insulating layer 40 and the second insulating layer 60 may have the same configuration or different configurations.

The reinforcing materials 41 and 61 are not particularly limited. For example, the same materials as those shown as examples of the reinforcing material 11 can be used. The thermosetting resin composition constituting the first insulating layer 40 and the thermosetting resin composition constituting the second insulating layer 60 are not particularly limited. For example, the same contents as those exemplified as the thermosetting resin composition constituting the insulating layer 10 can be used. Material.

The thickness Td of the reinforcing material 41 is preferably 10 to 48 μm, and more preferably 12 to 45 μm. The thickness Tb2 of the reinforcing material 61 is preferably 8 to 50 μm, and more preferably 12 to 45 μm. (Conductor circuit 50)

The conductor circuit 50 is a patterned layer and functions as an inner-layer conductor pattern layer. Except for patterning, the conductor circuit 50 can be made of, for example, the same materials as those shown as examples of the metal layers 20 and 30. The thickness A of the conductor circuit 50 is preferably 2 to 20 μm. The pattern of the conductor circuit 50 is not particularly limited, and may be appropriately adjusted according to the use application of the printed wiring board. (First metal layer 21, second metal layer 31)

The first metal layer 21 and the second metal layer 31 (hereinafter may be referred to as metal layers 21 and 31) are made of a foil-shaped metal. In other words, the metal layers 21 and 31 are composed of a planar metal that is not patterned. As the metal layers 21 and 31, for example, the same materials as those shown as examples of the metal layers 20 and 30 can be used.

In addition, in the second embodiment, the second metal layer 31 is provided, and the second metal layer 31 is laminated on the second surface 40b of the first insulating layer 40. However, the present invention is not limited to this. The metal-clad laminate according to the present invention may be, for example, a metal-clad laminate with the same structure as the metal-clad laminate 101 except that it does not have the second metal layer 31. In addition, the metal-clad laminated board of the present invention may not include the second metal layer 31, and a plurality of conductor circuits and insulating layers are formed on the second surface 40b in this order, and the other is a metal-clad laminated board. The metal-laminated laminated plate having the same structure as the plate 101. In the second embodiment, although the first insulating layer 40 includes the reinforcing material 41, the present invention is not limited to this, and the first insulating layer may not include the reinforcing material. [Printed wiring board 200 of the embodiment]

FIG. 3 is a schematic cross-sectional view of a printed wiring board 200 according to the embodiment of the present invention. In FIG. 3, the same components as those of the metal-laminated laminated plate 101 of the second embodiment shown in FIG. 2 are denoted by the same reference numerals, and descriptions thereof are omitted.

The printed wiring board 200 includes a first insulating layer 40, a first conductor circuit 50, a second insulating layer 60, a second conductor circuit 22, and a third conductor circuit 32. The first conductor circuit 50 is laminated on the first surface 40 a of the first insulating layer 40 (hereinafter, referred to as the first surface 40 a). The second insulating layer 60 is laminated on the first surface 40 a and the first conductor circuit 50. The second conductor circuit 22 is laminated on the second insulating layer 60. The third conductor circuit 32 is laminated on the second surface 40 b of the first insulating layer 40. The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a hardened material 62 of a thermosetting resin composition impregnated with the reinforcing material 61.

In this embodiment, as shown in FIG. 3, the thickness difference (Ta3-Tb3) between the interlayer thickness Ta3 of the conductor circuit 50 and the second conductor circuit 22 and the thickness Tb3 of the reinforcing material 61 is 0 ≦ Ta3-Tb3 ≦ 2 μm, and It is preferably 1 μm ≦ Ta3-Tb3 ≦ 2 μm. If the thickness difference (Ta3-Tb3) exceeds 2 μm, when the thickness of the printed wiring board 200 is reduced, interlayer peeling may easily occur during soldering or assembly, or the amount of warpage due to temperature change may increase. There is a fear that it may not be able to adequately cope with thinning. In addition, if the thickness difference (Ta3-Tb3) is 1 μm or more and 2 μm or less, the reinforcing material 61 and the first conductor circuit 50 and the second conductor circuit 22 are not easily contacted, and the printed wiring board 200 is more excellent in electrical reliability . The interlayer thickness Ta3 corresponds to the interlayer thickness Ta2, and the thickness Tb3 corresponds to the thickness Tb2. For the same reason, the thickness difference (Tc-Td) between the interlayer thickness Tc of the first conductor circuit 50 and the third conductor circuit 32 and the thickness Td of the reinforcing material 41 is 0 ≦ Tc-Td ≦ 2 μm, and is preferably 1 μm ≦ Tc−Td ≦ 2 μm. (Second conductor circuit 22, third conductor circuit 32)

The second conductor circuit 22 and the third conductor circuit 32 (hereinafter may be referred to as conductor circuits 22 and 32) are patterned layers, and each of them functions as an outer conductor pattern layer. The second conductor circuit 22 and the third conductor circuit 32 may have the same configuration or different configurations. As the conductor circuits 22 and 32, except for patterning, for example, the same materials as those shown as examples of the metal layers 20 and 30 can be used. The thickness of the conductor circuits 22 and 32 is preferably 1 to 20 μm. The patterns of the conductor circuits 22 and 32 are not particularly limited, and may be appropriately adjusted according to the use of the printed wiring board.

Moreover, in this embodiment, although the third conductor circuit 32 is provided and is laminated on the second surface 40b of the first insulating layer 40, the present invention is not limited to this. The printed wiring board of the present invention may be, for example, a printed wiring board having the same configuration as the printed wiring board 200 except that it does not include the third conductor circuit 32. In addition, the printed wiring board of the present invention may not include the third conductor circuit 32, and the conductor circuit and the insulating layer may be formed on the second surface 40b in multiple layers in this order. Composition of the printed wiring board. In this embodiment, although the first insulating layer 40 includes the reinforcing material 41, the present invention is not limited to this, and the first insulating layer may not include the reinforcing material. [Manufacturing method of metal-clad laminated board of the third embodiment]

FIGS. 4A to 4D are explanatory diagrams for describing a method for manufacturing a metal-clad laminate according to a third embodiment of the present invention (hereinafter, referred to as a manufacturing method of the third embodiment). In addition, the manufacturing method of the third embodiment is a manufacturing method for manufacturing the metal-clad laminated plate of the second embodiment. FIG. 5 is a schematic view showing a dual-belt pressing apparatus 300. In FIGS. 4A to 4D, the same constituent members as those shown in the second embodiment of FIG. 2 are denoted by the same reference numerals, and descriptions thereof will be omitted.

The manufacturing method of the third embodiment includes a preparation step, a lamination step, and a heating and press forming step. In the preparation step, a core substrate 110 that has a conductor circuit 50 on one surface 40a (hereinafter, referred to as a first surface 40a) is prepared. In the lamination step, a prepreg 60a and a metal foil (metal layer) 21 are sequentially laminated on the first surface 40a provided with the conductor circuit 50 to produce a laminate 101a having a structure shown in FIG. 4D. In the heat and pressure forming step, as shown in FIG. 5, the laminate 101 a is continuously supplied between the rotating pair of endless belts 310 and 310, and the laminate is heat and pressure formed between the pair of endless belts 310 and 310. 101a. The prepreg 60 a includes a reinforcing material 61 and a semi-hardened material 62 a (B-stage shape) of a thermosetting resin composition impregnated with the reinforcing material 61.

In addition, as shown in the configuration (see FIG. 2) of the metal-clad laminated board 101 according to the second embodiment, the interlayer thickness Ta2 of the conductor circuit 50 and the first metal layer 21 after heating and press molding, and the thickness of the reinforcing material 61 The thickness difference (Ta2-Tb2) of Tb2 is 0 ≦ Ta2-Tb2 ≦ 2 μm, and preferably 1 μm ≦ Ta2-Tb2 ≦ 2 μm. (Preparation steps)

In the preparation step, a core substrate 110 having a conductor circuit 50 on one surface 40a shown in FIG. 4B is prepared. This preparation step specifically includes a preparation step and a circuit formation step. In the preliminary step, a metal-clad laminated board 110a shown in FIG. 4A is prepared, wherein a first surface 40a of the first insulating layer 40 is provided with a metal layer 50a for forming a conductor circuit, and the first insulating layer 40 and the first A second metal layer 31 is provided on a surface 40b (hereinafter referred to as a second surface 40b) opposite to the surface 40a. In the circuit formation step, a wiring formation process is performed on the metal layer 50a for forming a conductor circuit, and a core substrate 110 shown in FIG. 4B is obtained.

In the preliminary step, as a method of preparing the metal-clad laminated board 110a, for example, an upper metal foil corresponding to the metal layer 50a for conductor circuit formation, a prepreg corresponding to the first insulating layer 40, and a second The lower metal foil of the metal layer 31 may be laminated, and may be formed by heating and pressing. The material constituting this prepreg can be, for example, the same material as that shown as an example of the material constituting the first insulating layer 40. Examples of the method of the heating and press forming include the same methods as those exemplified as the method of the heating and press forming in the heating and press forming step described later. The method of wiring formation processing in the circuit formation step is not particularly limited, and examples thereof include known circuit formation methods such as a subtractive method and a semi-additive method. (Lamination step)

In the lamination step, as shown in FIG. 4C, a prepreg 60 a and a metal foil (metal layer) 21 are sequentially laminated on the first surface 40 a provided with the conductor circuit 50 to produce a laminate 101 a shown in FIG. 4D. . The method of lamination may be appropriately adjusted in accordance with a method of heating and press forming described later.

The prepreg 60 a includes a reinforcing material 61 and a semi-cured material 62 a of a thermosetting resin composition contained in the reinforcing material 61. The thickness of the prepreg 60a is preferably 10 to 50 μm, and more preferably 12 to 47 μm. The hardening time (Geltime) of the prepreg 60a is preferably 60 to 600 seconds, and more preferably 60 to 300 seconds. Volatile content of the prepreg 60a is preferably 1.5% or less, and more preferably 1.0% or less. The measurement method of the thickness, resin content, resin fluidity, curing time, and volatile matter content of the prepreg 60a is in accordance with JIS 6521. The hardening time (Geltime) is measured at 170 ° C. The thickness of the reinforcing material 61 is preferably 10 to 50 μm, and more preferably 12 to 45 μm. The method for measuring the thickness of the reinforcing material 61 can be measured by the same method as described in the examples.

As the material constituting the prepreg 60a, the same materials as those exemplified as the material constituting the insulating layer 60 can be used.

Prior to the heat and pressure forming, it is preferable to preheat the laminate 101a. The so-called pre-heating refers to the heating of the distance L from the set of rollers 320, 320 on the feeders 340, 350, and 360 to the hot pressing device 330, 330 in the double-belt pressing method described later, as shown in FIG. . The preliminary heating conditions may be performed under conditions of, for example, a heating temperature of 80 to 250 ° C. and a heating time of 5 to 200 seconds (s). (Step of heating and pressing)

In the heat and pressure forming step, as shown in FIG. 5, the laminate 101 a is continuously supplied between the rotating pair of endless belts 310 and 310, and the laminate 101 a is heat and pressure formed between the pair of endless belts 310 and 310. . Thereby, a metal-clad laminate 101 can be obtained.

As described above, the heat and pressure forming is performed by a two-belt pressing method, in which a small amount of laminates 101a of about one or several sheets are continuously supplied between the endless belts 310 and 310, and the endless belts 310 and 310 The laminate 101a is heated while applying a surface pressure. Thereby, the thickness difference (Ta2-Tb2) (refer to FIG. 2) after heat-press molding can be made into 2 micrometers or less which cannot be achieved by a multi-stage vacuum pressing method, and it can fully respond to the thinning of a printed wiring board. In addition, the so-called multi-stage vacuum pressing method refers to a method of obtaining a laminated structure by stacking laminates in multiple stages through a mirror panel at normal temperature, and then inserting the obtained laminated structure between hot plates and heating and pressing the hot plates simultaneously.

In the multi-stage vacuum pressing method, it takes a certain time for heat to be conducted from the outside (hot plate side) of the laminated structure to the center side of the stacked direction of the laminated structure. As a result, the laminated structure cannot be heated rapidly, and it has to be heated at a progressive temperature increase rate. After the laminated structure is heated to reach the melting temperature of the thermosetting resin, the thermosetting resin composition will be melted to reduce the viscosity, and if further heated, it will be in a molten state and the viscosity will be further reduced. However, since the heating is performed at a progressive temperature increase rate, the thermosetting resin in the prepreg also undergoes a thermosetting reaction during the temperature increase before reaching the peak temperature. When the thermosetting reaction of the thermosetting resin progresses to a certain degree and reaches a peak temperature, the viscosity at the peak temperature does not decrease sufficiently. Therefore, for example, if the metal-laminated laminated board 101 is produced by a multi-stage vacuum pressing method, embedding of the conductive circuit 50 into the insulating layer 60 becomes insufficient, and there is a possibility that interlayer peeling may occur during solder assembly. In order to suppress the occurrence of such interlayer peeling, it is effective to increase the amount of the hardened material 62 of the thermosetting resin composition constituting the insulating layer 60, but this cannot sufficiently respond to the thinning of the printed wiring board. Furthermore, in the multi-stage vacuum pressing method, there is a fear that the suppression of the amount of warpage of a printed wiring board having a thin thickness may be insufficient.

In contrast, in the two-belt pressing method, the thermosetting reaction of the thermosetting resin composition in the prepreg 60a does not proceed, and the laminate 101a can be heated at the peak temperature, which can ensure the prepreg 60a at the peak temperature. The viscosity of the thermosetting resin is sufficiently reduced. Therefore, pressure can be applied to the laminate 101a in a state where the viscosity is sufficiently low, and the gas generated inside the prepreg 60a can be extruded to the outside of the prepreg 60a by the rollers 320, 320. As a result, wrinkles and the like are not generated, and no bubbles remain in the insulating layer 60, and the metal-clad laminated board 101 in which the conductor circuit 50 is embedded can be formed. Therefore, a printed wiring board can be prepared which can sufficiently respond to thinning, and even if the thickness is thin, peeling between layers is unlikely to occur during soldering and assembly, and the amount of warpage due to temperature change can be suppressed. ＜ Double-belt pressing method ＞

In the double-belt pressing method, a double-belt pressing device 300 is used. As shown in FIG. 5, the double-belt pressing device 300 includes: a pair of endless belts 310 and 310; two pairs of rollers 320 and 320; and a hot-pressing device 330 and 330. Furthermore, on the material supply side of the dual-belt pressing device 300, there are provided a feeder 340 that winds the long prepreg 60a into a coil shape, and a feeder 350 that makes a long metal foil (metal layer) ) 21 is wound into a coil shape; a feeder 360 is used to wind a long core substrate 110 into a coil shape. A winding machine 370 is provided on the material outlet side of the dual-belt pressing device 300, and winds the long metal-clad laminate 101 in a coil shape.

An endless belt 310 is hung on the pair of rollers 320 and 320 and is configured to rotate the endless belt 310 by the rotation of the roller 320. The two pairs of rollers 320 and 320 are arranged such that both surfaces of the laminate 101a supplied between the endless belts 310 and 310 are in contact with the endless belts 310 and 310, and a surface pressure is applied to the laminate 101a. The hot-pressing devices 330 and 330 are respectively disposed inside the endless belts 310 and 310 to heat the laminate 101 a supplied between the endless belts 310 and 310 through the endless belt 310. The feeders 340, 350, and 360 are arranged to continuously feed the prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110, respectively. The coiler 370 is configured to continuously coil the metal-laminated laminate 101.

The heating and press forming by the two-belt pressing method is not performed by stacking a large number of the laminates 101 a in a multi-stage manner, and is specifically performed as follows.

First, a long prepreg 60a, a metal foil (metal layer) 21, and a core substrate 110 are sent from each of the feeders 340, 350, and 360, and are continuously supplied between the rotating endless belts 310, 310. As shown in FIG. 4C, the prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110 supplied between the endless belts 310 and 310 are sequentially stacked on the surface 40a of the core substrate 110 provided with the conductor circuit 50. The prepreg 60a and the metal foil (metal layer) 21 constitute a laminate 101a. The pair of endless belts 310 and 310 rotate at a speed synchronized with the conveying speed of the prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110. At this time, the endless belts 310 and 310 are in contact with both surfaces of the laminate 101a, and a surface pressure is applied to the laminate 101a.

Next, the layered product 101 a is an area (hereinafter, referred to as a heating and pressurizing area) arranged by the hot pressing device 330 in a state of being sandwiched by the pair of endless belts 310 and 310. When the laminate 101a passes through the heated and pressurized area, the laminate 101a is applied with a surface pressure through the endless belt 310 by the hot pressing device 330 and is simultaneously heated, so that the prepreg 60a and the metal foil (metal layer) that are melted or softened 21 and the core substrate 110 are thermocompression bonded.

Next, the laminated material 101a derived from the dual-belt pressing device 300 is cooled, and becomes a metal-clad laminated plate 101, and is wound into a coil shape by a winder 370.

As a material of the endless belt 310, for example, stainless steel can be used. Examples of the pressure mechanism of the hot-pressing device 330 include pressure rollers, oil pressure, and sliding pressure disks that are generally used as the pressure mechanism of the dual-belt pressing device. Examples of the heating method of the hot pressing device 330 include a heating medium circulation method and an induction heating method.

The heating and pressurizing conditions of the two-belt pressing method may be, for example, the following. If the heating temperature, pressure, and heating and pressing time are within the following ranges, the metal-clad laminated board 101 embedded in the conductor circuit 50 can be easily manufactured.

The lower limit of the heating temperature is preferably a melting point temperature of the thermosetting resin constituting the prepreg 60a, and more preferably a temperature higher than the melting point of the thermosetting resin by 3 ° C. The upper limit of the heating temperature is preferably a temperature that is 20 ° C higher than the melting point of the thermosetting resin, and more preferably a temperature that is 15 ° C higher than the melting point of the thermosetting resin. The temperature increase rate when the laminate 101a is heated to the curing temperature of the thermosetting resin is preferably 2 ° C / second (s) or more, and more preferably 3 to 5 ° C / second (s). The lower limit of the applied pressure is preferably 0.49 MPa, and more preferably 2 MPa. The upper limit of the applied pressure is preferably 5.9 MPa, and more preferably 5 MPa. The lower limit of the heating and pressing time is preferably 90 seconds, and more preferably 120 seconds. The upper limit of the heating and pressing time is preferably 360 seconds, and more preferably 240 seconds.

In addition, in the manufacturing method of the third embodiment, although the core substrate 110 that is provided with the second metal layer 31 on the second surface 40b of the first insulating layer 40 is used, the present invention is not limited to this. In the present invention, However, a core substrate having no metal layer on the second surface 40b of the first insulating layer 40 may be used. [Manufacturing method of metal-clad laminated board of the fourth embodiment]

6A to 6D are explanatory diagrams for describing a method for manufacturing a metal-clad laminate according to a fourth embodiment of the present invention (hereinafter, referred to as a manufacturing method of the fourth embodiment). FIG. 7 is a schematic cross-sectional view of a metal-clad laminated plate 102 according to a fifth embodiment of the present invention. In FIGS. 6A to 6D and FIG. 7, the same constituent members as those shown in the manufacturing method of the third embodiment of FIGS. 4A to 4D are denoted by the same reference numerals, and descriptions thereof are omitted.

The manufacturing method of the fourth embodiment includes a preparation step, a lamination step, and a heating and press forming step. Thereby, the metal-clad laminated plate 102 having the structure shown in FIG. 7 can be obtained. In the preparation step, a core substrate 120 that has the first conductor circuit 50 and the second conductor circuit 51 on the first surface 40 a and the second surface 40 b facing each other is prepared, respectively. In the laminating step, the prepreg 60a and the first metal foil (metal layer) 21 are sequentially laminated on the first surface 40a of the core substrate 120, and the prepreg is sequentially laminated on the second surface 40b of the core substrate 120. The body 70a and the second metal foil (metal layer) 31 are used to produce a laminate 102a having the structure shown in FIG. 6D. In the heat and pressure forming step, the laminate 102a is heat and pressure formed. The prepreg 60 a includes a reinforcing material 61 and a semi-hardened material 62 a (B-stage shape) of a thermosetting resin composition impregnated with the reinforcing material 61. The prepreg 70 a includes a reinforcing material 71 and a semi-cured material 72 a (B-stage shape) of a thermosetting resin composition impregnated with the reinforcing material 71. The prepreg 70a and the prepreg 60a may have the same configuration or different configurations.

As shown in FIG. 7, the metal-clad laminated board 102 includes a first insulating layer 40, a first conductor circuit 50, a second insulating layer 60, a first metal layer 21, a second conductor circuit 51, and a third insulating layer 70. 、 第二 金属 层 31。 Second metal layer 31. The conductor circuit 50 is laminated on the first surface 40a of the first insulating layer 40 (hereinafter referred to as the first surface 40a). The second insulating layer 60 is laminated on the first surface 40 a and the conductor circuit 50. The first metal layer 21 is laminated on the second insulating layer 60. The second conductor circuit 51 is laminated on the second surface 40 b of the first insulating layer 40. The third insulating layer 70 is laminated on the second surface 40 b and the conductor circuit 51. The second metal layer 31 is laminated on the third insulating layer 70. The second insulating layer 60 includes a reinforcing material 61 and a hardened material 62 of a thermosetting resin composition impregnated with the reinforcing material 61. The third insulating layer 70 includes a reinforcing material 71 and a cured material 72 of a thermosetting resin composition impregnated with the reinforcing material 71.

The thickness difference (Ta5-Tb5) between the interlayer thickness Ta5 of the first conductor circuit 50 and the first metal layer 21 after heating and pressing and the thickness Tb5 of the reinforcing material 61 is 0 ≦ Ta5-Tb5 ≦ 2 μm, and preferably 1 μm ≦ Ta5−Tb5 ≦ 2 μm. In addition, the thickness difference (Ta6-Tb6) between the interlayer thickness Ta6 of the second conductor circuit 51 and the second metal layer 31 and the thickness Tb6 of the reinforcing material 71 after heating and pressing is 0 ≦ Ta6-Tb6 ≦ 2 μm, and is preferably It is 1 μm ≦ Ta6−Tb6 ≦ 2 μm. In the manufacturing method of the fourth embodiment, the interlayer thickness Ta5 corresponds to the interlayer thickness Ta2, and the thickness Tb5 corresponds to the thickness Tb2. The method for measuring the interlayer thickness Ta6 is the same as the method for measuring the interlayer thickness Ta1. The method for measuring the thickness Tb6 of the reinforcing material 71 is the same as the method for measuring the thickness Tb1 of the reinforcing material 11. (Preparation steps)

In the preparation step, as shown in FIG. 6B, a core substrate 120 is prepared, which has a first conductor circuit 50 on the first surface 40a and a second conductor circuit 51 on the second surface 40b. This preparation step specifically includes a preparation step and a circuit formation step. In the preliminary step, a metal-laminated laminated board 110a shown in FIG. 6A is prepared, in which a first surface 40a of the first insulating layer 40 is provided with a metal layer 50a for forming a first conductor circuit, and a second surface 40b is provided with a first layer Metal layer 31 for forming a two-conductor circuit. In the circuit forming step, the metal layer 50a for forming the first conductor circuit and the metal layer 31 for forming the second conductor circuit are respectively subjected to wiring formation processing to obtain the core substrate 120 shown in FIG. 6B.

In the preliminary step, as a method for preparing the metal-clad laminate 110a, for example, a metal foil corresponding to the upper side of the metal layer 50a for forming a first conductor circuit, a prepreg corresponding to the first insulating layer 40, and The lower metal foil of the metal layer 31 for forming the second conductor circuit may be laminated and then heated and press-formed. The material constituting this prepreg can be, for example, the same material as that shown as an example of the material constituting the first insulating layer 40. Examples of the method of the heating and press forming include the same methods as those exemplified as the heating and press forming method in the heating and press forming step of the manufacturing method of the third embodiment. In the circuit formation step, a method of forming a wiring is not particularly limited, and examples thereof include known circuit formation methods such as a subtractive method and a semi-additive method. (Lamination step)

In the lamination step, as shown in FIG. 6C, the prepreg 60a and the metal foil (metal layer) 21 are sequentially laminated on the first surface 40a provided with the conductor circuit 50, and the second surface provided with the conductor circuit 51 is laminated. A prepreg 70a and a metal foil (metal layer) 31 are sequentially laminated on the surface 40b to produce a laminate 102a. The method of lamination may be appropriately adjusted according to a method of heating and press forming described later.

As the material constituting the prepregs 60a and 70a, for example, the same materials as those shown as examples of the material constituting the insulating layer 60 can be used.

Prior to the heat and pressure forming, it is preferable to preheat the laminate 102a. The preliminary heating conditions may be performed under conditions of, for example, a heating temperature of 80 to 250 ° C. and a heating time of 5 to 200 seconds (s). (Step of heating and pressing)

In the heat and pressure forming step, the laminate 102a is heat and pressure formed. Thereby, the metal-clad laminate 102 shown in FIG. 7 can be obtained.

Examples of the method of the heating and press forming include the same methods as those exemplified as the method of the heating and press forming in the manufacturing method of the first embodiment. [Manufacturing method of printed wiring board of embodiment]

The manufacturing method of the printed wiring board according to the embodiment is to manufacture the metal-clad laminated boards 101 and 102 by the method for manufacturing the metal-clad laminated board according to the above-mentioned embodiment, and to perform wiring formation processing on the metal foils (metal layers) 21 and 31. . Thereby, a printed wiring board can be obtained. The method for forming the wiring is not particularly limited, and examples thereof include known circuit forming methods such as a subtractive method and a semi-additive method. Examples

Hereinafter, the present invention will be specifically described by way of examples. [Example 1] [Preparation steps]

Use the following long prepreg, long lower metal foil (corresponding to the second metal layer 31), and long upper metal foil (corresponding to the metal layer 50a for conductor circuit formation). As shown in the manufacturing apparatus, a long metal-clad laminate 110a having the structure shown in FIG. 4A is obtained. The preliminary heating conditions in the double-belt pressing apparatus 300 are performed under the conditions of a heating temperature of 100 ° C. and a heating time of 30 seconds (s). The heating and pressurization in the double-belt pressing apparatus 300 was performed under conditions of a heating temperature of 300 ° C., a pressure of 40 MPa, and a heating and pressing time of 3 minutes. (Long prepreg)

As the prepreg, a product number "R-1410E" (plate thickness: 12 μm) manufactured by Panasonic Co., Ltd. was used. "R-1410E" is a glass cloth (glass composition: E-glass) impregnated with a resin composition containing an epoxy resin, a phenol-based hardener, and an inorganic filler such as silicon dioxide, even if the plate thicknesses are different. A product manufactured by drying the composition to a semi-hardened state. The mixing ratio of the inorganic filler to 100 parts by mass of the epoxy resin and the phenol-based hardener is 100 parts by mass. (Long lower metal foil)

As the lower metal foil, a product number "3EC-M2S-VLP" (thickness: 12 μm) made by Mitsui Metals Mining Co., Ltd. was used. (Long top metal foil)

As the upper metal foil, a product number “MicroThin Ex5” (thickness: 5 μm, surface roughness (Rzjis) of the surface opposite to the surface on the prepreg side: 2 μm) made by Mitsui Metals Mining Co., Ltd. was used.

The obtained metal layer 50a for forming a conductor circuit in the elongated metal-clad laminate 110a is subjected to wiring formation processing by etching to form a conductor circuit 50 to obtain a core substrate 110 having a structure shown in FIG. 4B. The residual copper ratio at this time was 80%. In the following, the circuit pattern is evaluated with the same circuit. [Lamination step, heating and press forming step]

Using the long core substrate 110, the following long prepreg 60a, and the long metal foil (corresponding to the first metal layer 21), the manufacturing steps shown in FIG. 4C and FIG. 4D are used, and FIG. 5 is used. As shown in the manufacturing apparatus, a long metal-clad laminate 101 shown in FIG. 2 is obtained. The preliminary heating conditions in the double-belt pressing apparatus 300 are performed under the conditions of a heating temperature of 230 ° C. and a heating time of 30 seconds (s). The heating and pressurization in the double-belt pressing device 300 is performed under the conditions of a heating temperature of 300 ° C., a pressure of 40 MPa, and a heating and pressing time of 3 minutes at a heating rate of 3 ° C./s (s) from 200 ° C. to 300 ° C. get on. (Long prepreg 60a)

As the prepreg 60a, product number "R-1410E" (plate thickness: 12 μm, thickness of reinforcing material 61: 12 μm, resin content: 54%, resin fluidity: 30%, curing time) made by Panasonic Co., Ltd. was used. : 150 seconds, volatile matter content: 0.5%). The values of resin content, resin fluidity, curing time, and volatile matter content are catalog values, and the values of resin content, resin fluidity, curing time, and volatile matter content shown below are also the same. (Long metal foil)

As the metal foil, a product number "3EC-M2S-VLP" (thickness: 12 μm, surface roughness (Rzjis) of the surface of the prepreg side: 2 μm) manufactured by Mitsui Metals Mining Co., Ltd. was used. [Manufacture of printed wiring board 200]

The metal layers 21 and 31 on both sides of the obtained long metal-clad laminated board 101 are subjected to wiring formation processing by etching to form the second conductor circuit 22 and the third conductor circuit 32, and the structure shown in FIG. 3 is obtained. A long printed wiring board 200. [Example 2]

Except in the [layering step, heat-pressing forming step], as the long prepreg 60a, the product number "R-1410E" (plate thickness: 14 μm, reinforcing material 61) manufactured by Panasonic Co., Ltd. is used: Except for 12 μm, resin content: 61%, resin fluidity: 30%, curing time: 150 seconds, volatile matter content: 0.5%), other parts were the same as in Example 1, and a printed wiring having the structure shown in FIG. 3 was obtained. Board 200. [Example 3]

Except in the [Preparation Procedure], as the long upper metal foil, a product number "3EC-M2S-VLP" (thickness: 20 μm, opposite to the surface on the prepreg side) made by Mitsui Metals Mining Co., Ltd. was used. Surface roughness (Rzjis: 2 μm), and in the [layering step, heating and pressing forming step], as the long prepreg 60a, the product number "R-1410E" (made by Panasonic) is used ( Plate thickness: 45 μm, thickness of reinforcing material 61: 45 μm, resin content: 48%, resin fluidity: 10%, hardening time: 150 seconds, volatile content: 0.5%), other parts are the same as in Example 1, Thus, a printed wiring board 200 having a structure shown in FIG. 3 is obtained. [Example 4]

Except in the [layering step, heat-pressing forming step], as the long prepreg 60a, the product number "R-1410E" (plate thickness: 47 μm, reinforcing material 61) manufactured by Panasonic Co., Ltd. is used: Except for 45 μm, resin content: 50%, resin fluidity: 10%, curing time: 150 seconds, volatile content: 0.5%), other parts were the same as in Example 3, and a printed wiring having the structure shown in FIG. 3 was obtained. Board 200. [Example 5]

Use the following long prepreg, long lower metal foil (corresponding to the second metal layer 30) and long upper metal foil (corresponding to the first metal layer 20), and use the manufacturing shown in Figure 5 The device is used to obtain a metal-clad laminated board 100 having the structure shown in FIG. 1. The preliminary heating conditions in the double-belt pressing apparatus 300 are performed under the conditions of a heating temperature of 100 ° C. and a heating time of 30 seconds (s). The heating and pressurization in the dual-belt pressing device 300 is performed under the conditions of a heating temperature of 300 ° C., a pressure of 40 MPa, and a heating and pressing time of 3 minutes at a heating temperature of 3 ° C./s (s) from 200 ° C. to 300 ° C. get on. (Long prepreg)

As the prepreg, Panasonic's product number "R-1410E" (plate thickness: 12 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 54%, resin fluidity: 30 %, Hardening time: 150 seconds, volatile matter content: 0.5%). (Long lower metal foil, upper metal foil)

As the lower metal foil and the upper metal foil, a product number "3EC-M2S-VLP" made by Mitsui Metals Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) . [Example 6]

Except for the long prepreg, Panasonic's product number "R-1410E" (plate thickness: 14 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 59%, resin Except for fluidity: 30%, hardening time: 150 seconds, volatile matter content: 0.5%), the other parts were the same as in Example 5, and a metal-clad laminate 100 having the structure shown in FIG. 1 was obtained. [Comparative Example 1] [Preparation steps]

Using a prepreg, a lower metal foil (corresponding to the second metal layer 31), and an upper metal foil (corresponding to the metal layer 50a for conductor circuit formation), the structure shown in FIG. 4A was obtained by a multi-stage vacuum pressing method. Metal-clad laminate 110a. The heating and pressing in the multi-stage vacuum pressing method are performed under the following conditions.

The unit pressure applied to the laminated structure is 0.49 to 0.98 MPa (5 to 10 kg / cm ² ) (primary pressure) between 20 and 30 minutes from the start of heating and press forming, and then it is raised until the product temperature becomes 120 ° C The pressure was 2.94 MPa (30 kg / cm ² ) (secondary pressure). Thereafter, the secondary pressure is maintained until the process of heating and press forming is completed.

The product temperature is heated at a temperature increase rate of 1 to 3 ° C./minute from the start of heating and press forming until the product temperature reaches 160 ° C., and thereafter, the product temperature is maintained at 160 ° C. or higher for 50 minutes. The maximum product temperature at this time is 170 to 180 ° C. Thereafter, the temperature of the laminated board was cooled to room temperature at a cooling rate of 2 to 6 ° C / minute.

The gaseous environment is a gaseous environment maintained at a product temperature of 130 to 140 ° C. below 13.3 kPa (100 Torr), and then exposed to the atmospheric environment. (Prepreg)

As the prepreg, Panasonic product number "R-1410E" (plate thickness: 15 μm, resin content: 61%, resin fluidity: 30%, curing time: 150 seconds, volatile content: 0.5 % Seconds or less). (Lower metal foil)

As the lower metal foil, a product number "3EC-M2S-VLP" (thickness: 12 μm) made by Mitsui Metals Mining Co., Ltd. was used. (Upper metal foil)

As the upper metal foil, a product number "MicroThinEX5" (thickness: 5 μm, surface roughness (Rzjis) of the surface opposite to the prepreg side surface: 2 μm) made by Mitsui Metals Mining Co., Ltd. was used.

The metal layer 50a for forming a conductor circuit in the obtained metal-clad laminate 110a is subjected to wiring formation processing by etching to form a conductor circuit 50, and a core substrate 110 having a structure shown in FIG. 4B is obtained. [Lamination step, heating and press forming step]

Using the core substrate 110, the following prepreg 60a, and a metal foil (corresponding to the first metal layer 21), a multi-stage vacuum pressing method was used to obtain a metal-laminated laminate 101 shown in FIG. The heating and pressing conditions in the multi-stage vacuum pressing method are performed under the following conditions.

The unit pressure applied to the laminated structure is 0.49 to 0.98 MPa (5 to 10 kg / cm ² ) (primary pressure) between 20 and 30 minutes from the start of heating and press forming, and then it is raised until the product temperature becomes 120 ° C The pressure was 2.94 MPa (30 kg / cm ² ) (secondary pressure). Thereafter, the secondary pressure is maintained until the process of heating and press forming is completed.

The product temperature is heated at a temperature increase rate of 1 to 3 ° C./minute from the start of heating and press forming until the product temperature reaches 160 ° C., and thereafter, the product temperature is maintained at 160 ° C. or higher for 50 minutes. The maximum product temperature at this time is 170 to 180 ° C. Thereafter, the temperature of the laminated board was cooled to room temperature at a cooling rate of 2 to 6 ° C / minute.

The gaseous environment is a gaseous environment maintained at a product temperature of 130 to 140 ° C. below 13.3 kPa (100 Torr), and then exposed to the atmospheric environment. (Prepreg 60a)

As the prepreg 60a, product number "R-1410E" (plate thickness: 15 μm, thickness of reinforcing material 61: 12 μm, resin content: 63%, resin fluidity: 30%, curing time) made by Panasonic Co., Ltd. was used. : 150 seconds, volatile matter content: 0.5%). (Metal foil)

As the metal foil, a product number "3EC-M2S-VLP" (thickness: 12 μm, surface roughness (Rzjis) of the surface of the prepreg side: 2 μm) manufactured by Mitsui Metals Mining Co., Ltd. was used. [Manufacture of printed wiring board 200]

The metal layers 21 and 31 on both sides of the obtained metal-clad laminated board 101 are subjected to wiring formation processing by etching to form the second conductor circuit 22 and the third conductor circuit 32, and a printed wiring board having the structure shown in FIG. 3 is obtained. 200. [Comparative Example 2]

Except in the [layering step, heating and pressing forming step], as the prepreg 60a, the product number "R-1410E" (plate thickness: 17 μm, thickness of the reinforcing material 61: 12 μm, resin) made by Panasonic Co., Ltd. was used. Contents: 67%, resin fluidity: 30%, curing time: 150 seconds, volatile matter content: 0.5%), other parts were the same as those of Comparative Example 1, and printed wiring board 200 was obtained. [Comparative Example 3]

Except in the [Preparation Procedure], as the upper metal foil, a product number "3EC-M2S-VLP" (thickness: 20 μm, surface roughness (Rzjis) of the prepreg-side surface) made by Mitsui Metals Mining Co., Ltd. was used. : 2 μm), and in the [layering step, heat and pressure forming step], as the prepreg 60a, the product number "R-1410E" (plate thickness: 48 μm, reinforcing material 61) made by Panasonic Co., Ltd. was used : 45 μm, resin content: 50%, resin fluidity: 10%, curing time: 150 seconds, volatile matter content: 0.5%), other parts were the same as in Example 1, and a print having the structure shown in FIG. 3 was obtained. The wiring board 200. [Comparative Example 4]

Except in the [layering step, heating and pressing forming step], as the prepreg 60a, a product number "R-1410E" (plate thickness: 55 μm, reinforcement material 61 thickness: 45 μm, resin) made by Panasonic Co., Ltd. was used. Contents: 55%, resin fluidity: 10%, curing time: 150 seconds, volatile matter content: 0.5%), other parts were the same as those of Comparative Example 3, and a printed wiring board 200 was obtained. [Comparative Example 5]

Using the following prepreg, the lower metal foil (corresponding to the second metal layer 30) and the upper metal foil (corresponding to the first metal layer 20), the multi-stage vacuum pressing method was used to obtain the metal-attached structure shown in FIG. 1. The laminated board 100. The heating and pressing in the multi-stage vacuum pressing method were performed under the same conditions as the heating and pressing conditions in [Preparation Step] of Comparative Example 1. (Prepreg)

As the prepreg, Panasonic's product number "R-1410E" (plate thickness: 15 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 61%, resin fluidity: 30 %, Hardening time: 150 seconds, volatile matter content: 0.5%). (Lower metal foil, upper metal foil)

As the lower metal foil and the upper metal foil, a product number "3EC-M2S-VLP" made by Mitsui Metals Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) . [Determination of thickness]

In the metal-clad laminated board 101 obtained in Examples 1 to 4 and Comparative Examples 1 to 4, the interlayer thickness Ta of the conductor circuit 50 and the first metal layer 21 was measured with a digital microscope ("VH" manufactured by Keyence Corporation). -Z500 ", the same applies hereinafter), and measurement was performed by observing a cross section of the metal-clad laminated plate 101. That is, as shown in FIG. 2, in the thickness direction of the metal-clad laminated board 101, the front end portion of the second insulating layer 60 side of the first metal layer 21 and the second end of the conductor circuit 50 are separated by a digital microscope. The length between the two points on the front end portion of the insulating layer 60 side is enlarged by 2000 times, and the measurement is performed by a measurement function. Here, as shown in FIG. 2, the front end portion on the second insulating layer 60 side of the first metal layer 21 refers to a straight line drawn at the average position of three points of the copper foil protrusions under the first metal layer 21. Determined location. As shown in FIG. 2, the front end portion of the second insulating layer 60 side of the conductor circuit 50 refers to a position determined by drawing a straight line on the conductor circuit 50 at an average position of three points of the copper foil protrusions.

In the metal-clad laminated plate 101 obtained in Examples 1 to 4 and Comparative Examples 1 to 4, the thickness Tb of the reinforcing material 61 was observed through a digital microscope, as shown in FIG. 2. As shown, in the thickness direction of the metal-clad laminate 101, the length between the two ends of the front end of the first metal layer 21 side of the reinforcing material 61 and the front end of the conductor circuit 50 side of the reinforcing material 61 is calculated by using a digital The measurement function of the microscope performs calculations. Here, as shown in FIG. 2, the front end portion on the first metal layer 21 side of the reinforcing material 61 refers to the top surface of the reinforcing material 61 that is most polished in the fiber direction of the longitudinal line 61 a constituting the reinforcing material 61. The position determined by the straight line is drawn on the upper portion 61c. As shown in FIG. 2, the front end portion of the conductor circuit 50 side of the reinforcing material 61 refers to a straight line drawn on the lowermost portion 61 d of the reinforcing material 61 which is ground in the fiber direction of the longitudinal line 61 a of the reinforcing material 61. Determined location. When measuring the thickness Tb of the reinforcing material 61, instead of using the horizontal line 61b constituting the reinforcing material 61 but using the vertical line 61a as a reference, it is because the cross-sectional observation of the metal-clad laminated plate 101 is shown in FIG. 2 The cross-sectional shape of the horizontal line 61b constituting the reinforcing material 61 is circular, and it is difficult to distinguish the horizontal line 61b from the inorganic filler. The same applies to the measurement of the thickness Tb of the reinforcing material 11, the thickness of the reinforcing material 61, and the thickness of the reinforcing material corresponding to the reinforcing material 11.

In the metal-clad laminated plate 100 obtained in Examples 5, 6 and Comparative Example 5, the interlayer thickness Ta of the first metal layer 20 and the second metal layer 30 was obtained by using a digital microscope. Observed and measured. That is, as shown in FIG. 1, in the thickness direction of the metal-clad laminate 100, a front end portion of the insulating layer 10 side of the first metal layer 20 and an insulating layer of the second metal layer 30 are separated by a digital microscope. The length between the two points on the front side of the 10 sides was enlarged by 2000 times, and the measurement was performed using the measurement function. Here, the front end portion of the first metal layer 20 on the insulating layer 10 side, as shown in FIG. 1, is defined by drawing a straight line under the first metal layer 20 at an average position of three points of the copper foil protrusions. position. As shown in FIG. 1, the front end portion of the second metal layer 30 on the insulating layer 10 side refers to a position determined by drawing a straight line on the average position of the three points of the copper foil protrusions on the first metal layer 30.

In the metal-clad laminated plate 100 obtained in Examples 5, 6 and Comparative Example 5, the thickness Tb of the reinforcing material 11 was observed with a digital microscope, as shown in FIG. 1. In the thickness direction of the metal-clad laminate 100, a digital microscope was used to separate the front end of the first metal layer 20 side of the reinforcing material 11 and the front end of the second metal layer 30 side of the reinforcing material 11 by a digital microscope. The length of the lens is magnified by 2,000 times and calculated using a measurement function. Here, as shown in FIG. 1, the front end of the first metal layer 20 side of the reinforcing material 11 refers to the surface of the reinforcing material 11 that is most polished in the fiber direction of the longitudinal line 11 a constituting the reinforcing material 11. The position determined by the straight line is drawn on the upper portion 11c. The front end of the second metal layer 30 side of the reinforcing material 11 is, as shown in FIG. 1, the lowermost portion 11 d of the reinforcing material 11 that is ground in the fiber direction of the longitudinal line 11 b constituting the reinforcing material 11. Draw a line to determine the position.

The thickness of the reinforcing material 61 used in Examples 1 to 4 and Comparative Examples 1 to 4 was measured by using a digital microscope to observe the cross-section of the prepreg 60a. In the thickness direction of the reinforcing material 61, the reinforcing material 61 was calculated and measured. The length between the front end portion of the first metal layer 21 side and the front end portion of the conductor circuit 50 side of the reinforcing material 61. Here, the front end of the first metal layer 21 side of the reinforcing material 61 is the same as that of the thickness Tb2 of the reinforcing material 61 and the thickness Tb1 of the reinforcing material 11, as shown in FIG. 2. On the upper surface, a position determined by drawing a straight line is drawn on the uppermost part of the longitudinal direction of the fiber constituting the reinforcing material 61, which is ground. As shown in FIG. 2, the front end portion of the conductor circuit 50 side of the reinforcing material 61 refers to the bottom of the reinforcing material 61, and draws a straight line on the lowermost part of the longitudinal direction of the fiber constituting the reinforcing material 61. s position.

The thickness of the reinforcing material corresponding to the reinforcing material 11 used in Examples 5, 6 and Comparative Example 5 was obtained by using a digital microscope to observe the cross-section of the prepreg. The thickness of the reinforcing material was calculated to determine the thickness of the reinforcing material. The length between the upper metal foil side front end and the lower metal foil side front end of the reinforcing member. Here, the front end portion of the upper metal foil side of the reinforcing material is the same as that of the thickness Tb of the reinforcing material 61 and the thickness Tb of the reinforcing material 11 described above. It is on the reinforcing material and on the longitudinal line constituting the reinforcing material. The position determined by drawing a straight line is drawn on the uppermost part that is ground in the direction of the fiber. The front end portion of the lower metal foil side of the reinforcing material is the same as that of the thickness Tb of the reinforcing material 61 and the thickness Tb of the reinforcing material 11 described above. It is the fiber below the reinforcing material and constituting the longitudinal line of the reinforcing material. The position determined by drawing a straight line is drawn on the lowermost part being polished in the direction. [Welding heat resistance]

The double-sided metal-clad laminates obtained in each of the examples and comparative examples were used as test pieces, and the heat resistance for welding was evaluated in accordance with JIS C6481 as follows. The temperature of the molten solder was raised from about 200 ° C to about every 10 ° C. In the stage of increasing the temperature of the molten solder, the test piece was placed on the molten solder bath at each temperature for 60 seconds. After that, the test piece was taken out from the molten solder bath, and the test piece was cooled to room temperature. The presence or absence of swelling and interlayer peeling of the test piece was confirmed visually. The maximum temperature of the solder with no swelling and interlayer peeling was confirmed as the evaluation result. [Evaluation of warpage amount]

The metal-clad laminates obtained in the examples and comparative examples were cut to obtain a test piece having a plane viewing angle of 20 cm × 20 cm. After the metal layers on both sides of the test piece were completely removed by etching, the test piece was heated at 200 ° C for 1 hour.

Next, among the test pieces obtained in Examples 1 to 4 and Comparative Examples 1 to 4, the test pieces were arranged so that the first insulating layer 40 derived from the core substrate 110 was positioned above. In this state, the amount of warpage of the test piece was measured. The warpage amount is defined as a positive value when the test piece is warped convexly upward, and when the test piece is warped downwardly, it is defined as a negative value. The results are shown in Table 1.

[Table 1]

100, 101, 110a, 102‧‧‧ laminated board with metal
10‧‧‧ Insulation
10a, 40a ‧ ‧ first side
10b, 40b‧‧‧Second side
110, 120‧‧‧ core substrate
101a, 102a‧‧‧Laminates
11, 41, 61, 71‧‧‧ Reinforcing material
12, 42, 62, 72‧‧‧hardened
200‧‧‧printed wiring board
20, 21‧‧‧ first metal layer
22‧‧‧Second Conductor Circuit
30, 31‧‧‧Second metal layer
32‧‧‧Third Conductor Circuit
40‧‧‧first insulating layer
50‧‧‧ conductor circuit (first conductor circuit)
51‧‧‧Second Conductor Circuit
50a‧‧‧metal layer
60‧‧‧Second insulation layer
60a, 70a‧‧‧ prepreg
62a, 72a ‧‧‧ Semi-hardened
61a, 11a, 11b ‧‧‧ vertical
11c, 61c‧‧‧
11d, 61d
61b‧‧‧ horizontal line
70‧‧‧ third insulating layer
300‧‧‧Double-belt pressing device
310‧‧‧ endless belt
320‧‧‧ roller
330‧‧‧Hot pressing device
340, 350, 360‧‧‧Feeders
370‧‧‧ Winder
L‧‧‧ pitch
Ta1, Ta2, Ta3, Tc, Ta5, Ta6 ‧‧‧ interlayer thickness
Tb1, Tb2, Tb3, Td, A, Tb5, Tb6‧‧‧ thickness

FIG. 1 is a schematic cross-sectional view of a metal-clad laminated board according to a first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of a metal-clad laminated board according to a second embodiment of the present invention. 3 is a schematic cross-sectional view of a printed wiring board according to an embodiment of the present invention. FIG. 4A is a diagram for explaining a manufacturing method according to a third embodiment of the present invention. FIG. 4B is a diagram for explaining a manufacturing method according to a third embodiment of the present invention. FIG. 4C is a diagram for explaining a manufacturing method according to a third embodiment of the present invention. FIG. 4D is a diagram for explaining a manufacturing method according to a third embodiment of the present invention. FIG. 5 is a schematic view of a dual-belt pressing apparatus. FIG. 6A is a diagram for explaining a manufacturing method according to a fourth embodiment of the present invention. FIG. 6B is a diagram for explaining a manufacturing method according to a fourth embodiment of the present invention. FIG. 6C is a diagram for explaining a manufacturing method according to a fourth embodiment of the present invention. FIG. 6D is a diagram for explaining a manufacturing method according to a fourth embodiment of the present invention. Fig. 7 is a schematic cross-sectional view of a metal-clad laminated board according to a fifth embodiment of the present invention.

100‧‧‧ laminated board with metal

10‧‧‧ Insulation

10a‧‧‧First side

10b‧‧‧Second Side

11‧‧‧ Reinforcing material

11a, 11b ‧‧‧ vertical line

11c‧‧‧upper

11d‧‧‧ the lowest

12‧‧‧hardened

20‧‧‧ first metal layer

30‧‧‧Second metal layer

Ta1‧‧‧ Interlayer thickness

Tb1‧‧‧thickness

Claims (6)

A metal-clad laminated board includes: a first insulation layer; a conductor circuit laminated on the first insulation layer; a second insulation layer laminated on the first insulation layer and the conductor circuit; and a metal layer laminated On the second insulating layer, the second insulating layer includes a reinforcing material and a hardened material of a thermosetting resin composition impregnated with the reinforcing material, an interlayer thickness Ta2 of the conductor circuit and the metal layer, and a thickness Tb2 of the reinforcing material. The relationship is: 0 ≦ Ta2-Tb2 ≦ 2 μm, the thickness of the conductor circuit is 3 to 20 μm, the interlayer thickness Ta2 is 10 to 50 μm, and the thickness Tb2 of the reinforcing material is 8 to 50 μm. A printed wiring board includes: a first insulation layer; a first conductor circuit laminated on the first insulation layer; a second insulation layer laminated on the first insulation layer and the first conductor circuit; and a second The conductor circuit is laminated on the second insulating layer, the second insulating layer includes a reinforcing material and a hardened body of a thermosetting resin composition impregnated with the reinforcing material, and an interlayer thickness Ta3 of the first conductor circuit and the second conductor circuit. The relationship with the thickness Tb3 of the reinforcing material is: 0 ≦ Ta3-Tb3 ≦ 2 μm, the thickness of the first conductor circuit is 3-20 μm, the interlayer thickness Ta3 is 10-50 μm, and the thickness Tb3 of the reinforcing material is 8-50 μm. . A manufacturing method of a metal-clad laminated board includes: a preparation step of preparing a core substrate that has a conductor circuit on two or one side; a lamination step of sequentially stacking a prepreg and a surface on which the conductor circuit is provided; and A metal foil to make a laminate; and a heating and press forming step, continuously supplying the laminate to a pair of rotating endless belts, and heating and forming the laminate between the pair of endless belts, and the prepreg The body includes a reinforcing material and a thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta2 of the conductor circuit and the metal foil after heating and pressing and the thickness Tb2 of the reinforcing material is: 0 ≦ Ta2－Tb2 ≦ 2 μm, the thickness of the conductor circuit is 3 to 20 μm, the interlayer thickness Ta2 is 10 to 50 μm, and the thickness Tb2 of the reinforcing material is 8 to 50 μm. For example, the method for manufacturing a metal-clad laminated board according to claim 3, wherein in the heating and pressing forming step, the laminated body is heated from normal temperature to the curing of the thermosetting resin composition at a temperature rise rate of 3 ° C / s or more. So far. The method for manufacturing a metal-clad laminated board according to claim 3, wherein the laminated body is prepared to be heated before the heating and pressing forming step. A method for manufacturing a printed wiring board, which uses a method according to any one of claims 5 to 7 to manufacture a metal-clad laminated board, and performs wiring forming processing on the aforementioned metal foil.