TWI581958B - Production method of metal laminated sheet, printed wiring board, metal sheet, and manufacturing method of printed wiring board - Google Patents

Description

Metal-clad laminate, printed wiring board, metal-clad laminate manufacturing method, and printed wiring board manufacturing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-clad laminate, a printed wiring board, a method of manufacturing a metal-clad laminate, and a method of manufacturing a printed wiring board.

Background of the Invention In recent years, with the increase in the functionality and density of electronic devices, electronic components have become more and more compact, highly integrated, high-speed, and multi-pin. Along with this, the demand for higher density, smaller diameter, lighter weight, and thinnerness of the printed wiring board is also improved. In particular, a printed wiring board having a small thickness is likely to be warped.

As a copper-clad laminate which is less likely to warp even if the thickness is thin, Patent Literatures 1 and 2 disclose a copper-clad laminate in which a plurality of prepregs containing an inorganic filler are stacked, and A copper foil is disposed on one or both sides and is formed by multi-stage vacuum pressing. Prior technical literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-195476. Patent Document 2: Japanese Patent Laid-Open Publication No. 2012-052110

SUMMARY OF THE INVENTION However, as for the copper-clad laminate obtained by the multi-stage vacuum pressing method described in Patent Documents 1 and 2, there is a fear that the demand for thinning cannot be sufficiently satisfied.

Further, in the manufacture of a multilayer printed wiring board, it is necessary to embed the conductor circuit of the inner layer substrate in the insulating layer. In the multilayer printed wiring board obtained by the multi-stage vacuum pressing method, the conductor circuit of the inner layer substrate may be insufficiently buried in the insulating layer, and bubbles may remain in the insulating layer. It is feared that this is the cause of the occurrence of delamination during the assembly of the solder. In the past, in order to prevent the occurrence of such interlayer peeling, it is necessary to increase the amount of the resin constituting the insulating layer. As a result, the thickness of the insulating layer is increased, and the thickness of the multilayer printed wiring board is limited. In addition, since the amount of the resin constituting the insulating layer is increased, the elastic modulus is lowered, and the warpage of the multilayer printed wiring board is likely to occur.

Therefore, the present invention provides a metal-clad laminate, a printed wiring board, a method of manufacturing a metal-clad laminate, and a method of manufacturing a printed wiring board, which can be made to sufficiently conform to thinning, even if the thickness is thin, in solder assembly It is also difficult to cause interlayer peeling and a printed wiring board capable of suppressing the amount of warpage caused by temperature changes.

The metal-clad laminate of the first invention comprises: an insulating layer having a first surface and a second surface; a first metal layer laminated on the first surface of the insulating layer; and a second metal layer laminated on the insulating layer On the second side. The insulating layer includes a reinforcing material and a cured product of the thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta1 of the first metal layer and the second metal layer and the thickness Tb1 of the reinforcing material is 0≦Ta1-Tb1≦2 μm.

The metal-clad laminate of the second invention comprises: a first insulating layer; a conductor circuit laminated on the first insulating layer; a second insulating layer laminated on the first insulating layer and the conductor circuit; and a metal layer laminated thereon On the second insulating layer. The second insulating layer includes a reinforcing material and a cured product of the thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta2 of the conductor circuit and the metal layer and the thickness Tb2 of the reinforcing material is 0≦Ta2-Tb2≦2 μm.

A printed wiring board according to a third aspect of the invention includes: a first insulating layer; a first conductor circuit laminated on the first insulating layer; a second insulating layer laminated on the first insulating layer and the first conductor circuit; and a second conductor A circuit that is laminated on the second insulating layer. The second insulating layer comprises a reinforcing material and a cured product of the thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta3 of the first conductor circuit and the second conductor circuit and the thickness Tb3 of the reinforcing material is: 0≦Ta3-Tb3≦ 2 μm.

A method for manufacturing a metal-clad laminate according to a fourth aspect of the invention includes: a preparation step of preparing a core substrate having a conductor circuit on both sides or one side; and a laminating step of sequentially laminating the prepreg on a surface having the conductor circuit The metal foil is used to form a laminate; the heat and pressure forming step is continuously supplied between the pair of rotating endless belts, and the laminated body is heated and pressed between the pair of endless belts. The prepreg includes a reinforcing material and a thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta2 of the conductor circuit and the metal foil after heating and press forming and the thickness Tb2 of the reinforcing material is 0≦Ta2-Tb2≦2 μm.

In the method of manufacturing a printed wiring board according to a fifth aspect of the invention, a metal-clad laminate is produced by a method of manufacturing a metal-clad laminate, and a wiring formation process is performed on the metal foil.

According to the present invention, it is possible to produce a printed wiring board capable of sufficiently reducing the amount of warpage caused by temperature change even when the thickness is thin, and the interlayer peeling is not easily caused during soldering and assembly.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described. [Metal-attached laminated board 100 of the first embodiment]

Fig. 1 is a schematic cross-sectional view showing a metal-clad laminate 100 according to a first embodiment of the present invention.

As shown in FIG. 1, the metal-clad laminate 100 includes an insulating layer 10 having a first surface 10a and a second surface 10b opposite to the first surface 10a, a first metal layer 20, and a second metal layer 30. The first metal layer 20 is laminated on the first surface 10a of the insulating layer 10. The second metal layer 30 is laminated on the second surface 10b of the insulating layer 10. The insulating layer 10 includes a reinforcing material 11 and a cured product 12 of a thermosetting resin composition impregnated with the reinforcing material 11.

In the first embodiment, as shown in FIG. 1, the thickness difference (Ta1-Tb1) between the interlayer thickness Ta1 of the first metal layer 20 and the second metal layer 30 and the thickness Tb1 of the reinforcing material 11 is 0≦Ta1-Tb1≦. 2 μm, and preferably 1 μm ≦Ta1-Tb1≦2 μm. When the thickness difference (Ta1-Tb1) exceeds 2 μm, there is a fear that the thinning of the printed wiring board cannot be sufficiently satisfied. In addition, when the range of the thickness difference (Ta1-Tb1) is 1 μm or more and 2 μm or less, the reinforcing material 11 and the first metal layer 20 and the second metal layer 30 (hereinafter, referred to simply as the metal layers 20 and 30) It is difficult to contact, and the metal-clad laminate 100 is more excellent in electrical reliability.

The interlayer thickness Ta1 and the thickness Tb1 of the reinforcing material 11 can be measured by the same method as described in the examples. In order to make the thickness difference (Ta1-Tb1) within the above range, for example, a metal-clad laminate 100 may be produced by a double-belt pressing method in which the heating temperature is rapidly increased by a method described later. Further, when the insulating layer 10 is cured by laminating a plurality of prepregs, the prepreg contains the reinforcing material 11 and the semi-cured material of the thermosetting resin composition contained in the reinforcing material 11 (B-stage state) In the case of the thickness Tb1 of the reinforcing material 11, the total thickness of the plurality of reinforcing materials and the thickness of the cured product of the thermosetting resin composition between the adjacent reinforcing materials is the same as the thickness Tb1 of the reinforcing material 11 described above. can.

The thickness of the metal-clad laminate 100 is preferably 14 to 90 μm, more preferably 16 to 87 μm. The interlayer thickness Ta1 of the first metal layer 20 and the second metal layer 30 is preferably 10 to 50 μm, more preferably 12 to 47 μm. The thickness between the first metal layer 20 and the reinforcing member 11 and the thickness relationship between the second metal layer 30 and the reinforcing member 11 are not particularly limited as long as the thickness difference (Ta1 - Tb1) is within the above range. For example, a case where the thickness between the first metal layer 20 and the reinforcing member 11 and the thickness between the second metal layer 30 and the reinforcing member 11 are the same may be cited; the first metal layer 20 and the reinforcing member 11 The thickness is 2 μm, the thickness between the second metal layer 30 and the reinforcing material 11 is 0 μm; the thickness between the first metal layer 20 and the reinforcing material 11 is 0 μm, and the second metal layer 30 and the reinforcing material 11 are The case where the thickness is 2 μm or the like.

The solder heat resistance of the metal-clad laminate 100 is preferably 260 ° C or higher, more preferably 288 ° C or higher. When the solder heat resistance of the metal-clad laminate 100 is within the above range, it is possible to form a printed wiring board which is less likely to cause interlayer peeling during solder assembly. The solder heat resistance can be measured by the same method as described in the examples.

The amount of warpage of the metal-clad laminate 100 is preferably 20 mm or less, more preferably 10 mm or less. When the amount of warpage of the metal-clad laminate 100 is within the above range, a printed wiring board capable of suppressing the amount of warpage due to temperature change can be formed. The amount of warpage can be measured by the same method as described in the examples. (insulation layer 10)

The insulating layer 10 includes a reinforcing material 11 and a cured product 12 of a thermosetting resin composition impregnated with the reinforcing material 11.

As the reinforcing material 11, for example, the following materials may be used: a woven fabric or a non-woven fabric composed of glass fibers; aramid fiber, PBO (polyparaphenylene benzobisoxazole) fiber, PBI (polybenzimidazole) fiber , woven fabric or non-woven fabric composed of organic fibers such as PTFE (polytetrafluoroethylene) fiber, PBZT (polyparaphenylene benzobisthiazole) fiber, or wholly aromatic polyester fiber; woven fabric composed of inorganic fibers other than glass fiber Cloth or non-woven cloth, etc. The weaving method of the reinforcing material 11 is not particularly limited, and examples thereof include plain weave and weaving. Examples of the glass composition of the glass fiber include E glass, D glass, S glass, NE glass, T glass, and quartz. The reinforcing material 11 may be a person who has applied the fiber opening treatment, or may be a surface treated person by a decane coupling agent or the like.

The thermosetting resin composition constituting the cured product 12 of the thermosetting resin composition contains a thermosetting resin, and may contain a curing agent, a curing accelerator, an inorganic filler, a flame retardant, or the like in addition to the thermosetting resin. As the thermosetting resin, for example, an epoxy resin, a polyimide resin, a phenol resin, a bismaleimide triazine resin, or the like can be used. As the curing agent, a diamine curing agent such as a primary amine or a secondary amine, a phenolic curing agent having a difunctional or higher group, an acid anhydride curing agent, dicyandiamide or a low molecular weight polyphenylene ether compound can be used. As the curing accelerator, for example, an imidazole compound such as 2-ethyl-4-methylimidazole (2E4MZ), a tertiary amine compound, an organic phosphine compound, or a metal soap can be used. Examples of the inorganic filler include molybdenum compounds such as cerium oxide and molybdenum trioxide, aluminum hydroxide, magnesium hydroxide, aluminum silicate, magnesium citrate, talc, clay, and mica. These materials may be used singly or in combination of two or more materials. The content of the inorganic filler is preferably 20 to 200 parts by mass based on 100 parts by mass of the total mass of the thermosetting resin and the curing agent. As the flame retardant, a halogen-based flame retardant such as a bromine-containing compound, a non-halogen flame retardant such as a phosphorus-containing compound or a nitrogen-containing compound, or the like can be used. (first metal layer 20, second metal layer 30)

The first metal layer 20 and the second metal layer 30 are made of a foil-like metal. In other words, the metal layers 20, 30 are composed of a planar metal that is not patterned. The first metal layer 20 and the second metal layer 30 may have the same configuration or may be different from each other.

As the material constituting the metal layers 20 and 30, for example, copper, aluminum, stainless steel or the like can be used, and among them, copper is preferably used. When the material of the metal layers 20 and 30 is copper, either electrolytic copper or rolled copper may be used. The thickness of the metal layers 20, 30 is preferably 2 to 40 μm, more preferably 2 to 20 μm.

Preferably, the metal layers 20, 30 are matte on at least one side. In this case, one surface of the metal layers 20 and 30 is a matte surface, and the other surfaces of the metal layers 20 and 30 may be bright surfaces, and both surfaces of the metal layers 20 and 30 may be matte surfaces. When the matte surfaces of the metal layers 20 and 30 are arranged to be heated and pressed toward the prepreg, in the metal-clad laminate, the peeling strength of the first metal layer 20 and the insulating layer 10 can be improved by the anchoring effect. And the peel strength of the second metal layer 30 and the insulating layer 10.

The ten-point average roughness (RZJIS) of the matte surface is not particularly limited, but is preferably 0.5 to 5.0 μm. The ten-point average roughness (RZJIS) of the glossy surface is not particularly limited, but is preferably 0.5 to 2.5 μm. Compared with the glossy surface, more dense and uneven bumps are formed on the matte surface.

Here, the ten-point average roughness (RZJIS) is defined by JIS B 0601-2013, and only the reference length is taken out from the roughness curve in the direction of its average line, and the average line from which the part is taken out is in the longitudinal magnification. The average value of the absolute value of the elevation (Yp) from the highest peak to the fifth highest peak measured in the direction, and the average value of the absolute value (Yv) from the lowest valley to the fifth lowest valley. And find and express this value in micrometers (μm). [Metal-attached laminated board 101 of the second embodiment]

Fig. 2 is a schematic cross-sectional view showing a metal-clad laminate 101 according to a second embodiment of the present invention.

As shown in FIG. 2, the metal-clad laminate 101 includes a first insulating layer 40 having a first surface 40a and a second surface 40b opposed to each other, a conductor circuit 50, a second insulating layer 60, and a metal layer 21 ( Hereinafter, it is referred to as a first metal layer 21) and a metal layer 31 (hereinafter referred to as a second metal layer 31). The conductor circuit 50 is laminated on the first insulating layer 40 (hereinafter referred to as the first surface 40a). The second insulating layer 60 is laminated on the first surface 40a and the conductor circuit 50. The first metal layer 21 is laminated on the second insulating layer 60. The second metal layer 31 is laminated on the second surface 40b of the first insulating layer 40. The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a cured product 62 of a thermosetting resin composition impregnated with the reinforcing material 61.

In the second embodiment, as shown in FIG. 2, the thickness difference (Ta2-Tb2) between the interlayer thickness Ta2 of the conductor circuit 50 and the first metal layer 21 and the thickness Tb2 of the reinforcing member 61 is 0≦Ta2-Tb2≦2 μm. And preferably 1 μm ≦Ta2-Tb2≦2 μm. When the thickness difference (Ta2-Tb2) exceeds 2 μm, there is a fear that the thinning of the printed wiring board cannot be sufficiently satisfied. Further, when the thickness difference (Ta2-Tb2) is 1 μm or more and 2 μm or less, the reinforcing material 61 is less likely to come into contact with the first metal layer 21 and the conductor circuit 50, and the metal laminated board 101 is more excellent in electrical reliability. . Further, for the same reason, the thickness difference (Tc - Td) between the interlayer thickness Tc of the conductor circuit 50 and the second metal layer 31 and the thickness Td of the reinforcing member 41 is 0 ≦ Tc - Td ≦ 2 μm, and preferably 1 μm ≦ Tc-Td ≦ 2 μm.

The method of measuring the interlayer thickness Ta2 is the same as the method of measuring the interlayer thickness Ta1. The method of measuring the thickness Tb2 of the reinforcing material 61 is the same as the method of measuring the thickness Tb1 of the reinforcing material 11.

The thickness of the metal-clad laminate 101 is preferably 26 to 160 μm, more preferably 30 to 150 μm. The interlayer thickness Ta2 of the conductor circuit 50 and the first metal layer 21 is preferably 10 to 50 μm, more preferably 12 to 47 μm. The interlayer thickness Tc of the conductor circuit 50 and the second metal layer 31 is preferably 10 to 50 μm, more preferably 12 to 47 μm. The thickness between the conductor circuit 50 and the reinforcing member 61 and the thickness relationship between the first metal layer 21 and the reinforcing member 61 are not particularly limited as long as the thickness difference (Ta2-Tb2) is within the above range. For example, a case where the thickness between the conductor circuit 50 and the reinforcing member 61 and the thickness between the first metal layer 21 and the reinforcing member 61 are the same may be cited; the thickness between the conductor circuit 50 and the reinforcing member 61 is 2 μm, the thickness between the first metal layer 21 and the reinforcing member 61 is 0 μm; the thickness between the conductor circuit 50 and the reinforcing member 61 is 0 μm, and the thickness between the first metal layer 21 and the reinforcing member 61 is 2 μm. Situation, etc.

The solder heat resistance of the metal-clad laminate 101 is preferably 260 ° C or higher, more preferably 288 ° C or higher. When the solder heat resistance of the metal-clad laminate 101 is within the above range, a printed wiring board which is less likely to cause interlayer peeling during soldering can be formed. The solder heat resistance can be measured by the same method as described in the examples.

The amount of warpage of the metal-clad laminate 101 is preferably 20 mm or less, more preferably 10 mm or less. When the amount of warpage of the metal-clad laminate 101 is within the above range, a printed wiring board capable of suppressing the amount of warpage due to temperature change can be formed. The amount of warpage can be measured by the same method as described in the examples. The amount of warpage can be measured by the same method as described in the examples. (first insulating layer 40, second insulating layer 60)

The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a cured material 62 of a thermosetting resin composition impregnated with the reinforcing material 61. The first insulating layer 40 and the second insulating layer 60 may have the same configuration or may be different from each other.

The reinforcing members 41 and 61 are not particularly limited, and for example, the same materials as those exemplified as the reinforcing member 11 can be used. The thermosetting resin composition constituting the first insulating layer 40 and the thermosetting resin composition constituting the second insulating layer 60 are not particularly limited, and for example, the same as those exemplified as the thermosetting resin composition constituting the insulating layer 10 can be used. Material.

The thickness Td of the reinforcing member 41 is preferably from 10 to 48 μm, more preferably from 12 to 45 μm. The thickness Tb2 of the reinforcing material 61 is preferably 8 to 50 μm, more preferably 12 to 45 μm. (conductor circuit 50)

The conductor circuit 50 is a patterned layer that functions as an inner layer conductor pattern layer. As the conductor circuit 50, in addition to the patterning, for example, the same material as that exemplified as the metal layers 20 and 30 can be used. The thickness A of the conductor circuit 50 is preferably 2 to 20 μm. The pattern of the conductor circuit 50 is not particularly limited, and may be appropriately adjusted depending on the intended use of the printed wiring board. (first metal layer 21, second metal layer 31)

The first metal layer 21 and the second metal layer 31 (hereinafter referred to as the metal layers 21 and 31) are made of a foil-like metal. In other words, the metal layers 21, 31 are composed of a planar metal that is not patterned. As the metal layers 21 and 31, for example, the same materials as those exemplified as the metal layers 20 and 30 can be used.

Further, in the second embodiment, the second metal layer 31 is laminated on the second surface 40b of the first insulating layer 40, but the present invention is not limited thereto. The metal-clad laminate of the present invention may be, for example, a metal-clad laminate having the same structure as the metal-clad laminate 101 except for the second metal layer 31. Moreover, the metal-clad laminate of the present invention may not have the second metal layer 31, and the conductor circuit and the insulating layer may be formed on the second surface 40b in plural layers in this order, and the other layers may be laminated with the metal. The plate 101 is similarly constructed of a metal laminated plate. Further, in the second embodiment, the first insulating layer 40 includes the reinforcing member 41. However, the present invention is not limited thereto, and the first insulating layer may not include the reinforcing member. [Printed wiring board 200 of the embodiment]

Fig. 3 is a schematic cross-sectional view showing a printed wiring board 200 according to an embodiment of the present invention. In FIG. 3, the same constituent members as those of the metal-clad laminate 101 of the second embodiment shown in FIG. 2 are denoted by the same reference numerals and will not be described.

The printed wiring board 200 includes a first insulating layer 40, a first conductor circuit 50, a second insulating layer 60, a second conductor circuit 22, and a third conductor circuit 32. The first conductor circuit 50 is laminated on the first surface 40a of the first insulating layer 40 (hereinafter referred to as the first surface 40a). The second insulating layer 60 is laminated on the first surface 40a and the first conductor circuit 50. The second conductor circuit 22 is laminated on the second insulating layer 60. The third conductor circuit 32 is laminated on the second face 40b of the first insulating layer 40. The first insulating layer 40 includes a reinforcing material 41 and a cured product 42 of a thermosetting resin composition impregnated with the reinforcing material 41. The second insulating layer 60 includes a reinforcing material 61 and a cured product 62 of a thermosetting resin composition impregnated with the reinforcing material 61.

In the present embodiment, as shown in FIG. 3, the thickness difference (Ta3-Tb3) between the interlayer thickness Ta3 of the conductor circuit 50 and the second conductor circuit 22 and the thickness Tb3 of the reinforcing material 61 is 0≦Ta3-Tb3≦2 μm, and It is preferably 1 μm ≦Ta3-Tb3≦2 μm. When the thickness difference (Ta3-Tb3) exceeds 2 μm, when the thickness of the printed wiring board 200 is made thin, it is feared that interlayer peeling easily occurs during soldering assembly, or the amount of warpage caused by temperature change becomes large. There is even a fear that it will not be able to fully respond to the thinning. In addition, when the thickness difference (Ta3-Tb3) is 1 μm or more and 2 μm or less, the reinforcing material 61 is less likely to come into contact with the first conductor circuit 50 and the second conductor circuit 22, and the printed wiring board 200 is more excellent in electrical reliability. . The interlayer thickness Ta3 corresponds to the interlayer thickness Ta2, and the thickness Tb3 corresponds to the thickness Tb2. Further, for the same reason, the thickness difference (Tc-Td) between the interlayer thickness Tc of the first conductor circuit 50 and the third conductor circuit 32 and the thickness Td of the reinforcing member 41 is 0 ≦ Tc - Td ≦ 2 μm, and preferably 1 μm ≦Tc-Td ≦ 2 μm. (second conductor circuit 22, third conductor circuit 32)

Each of the second conductor circuit 22 and the third conductor circuit 32 (hereinafter referred to as conductor circuits 22 and 32) is a patterned layer and functions as an outer conductor pattern layer. The second conductor circuit 22 and the third conductor circuit 32 may have the same configuration or may be different from each other. As the conductor circuits 22 and 32, in addition to the patterning, for example, the same materials as those exemplified as the metal layers 20 and 30 can be used. The thickness of the conductor circuits 22, 32 is preferably 1 to 20 μm. The pattern of the conductor circuits 22 and 32 is not particularly limited, and may be appropriately adjusted depending on the intended use of the printed wiring board.

Further, in the present embodiment, the third conductor circuit 32 is laminated on the second surface 40b of the first insulating layer 40, but the present invention is not limited thereto. The printed wiring board of the present invention may be, for example, a printed wiring board having the same configuration as that of the printed wiring board 200 except that the third conductor circuit 32 is not provided. Further, the printed wiring board of the present invention may not have the third conductor circuit 32, and the conductor circuit and the insulating layer may be formed on the second surface 40b in plural layers in this order, and the other is the same as the printed wiring board 200. A printed wiring board. Further, in the present embodiment, the first insulating layer 40 includes the reinforcing member 41. However, the present invention is not limited thereto, and the first insulating layer may not include the reinforcing member. [Manufacturing method of metal-clad laminate according to third embodiment]

4A to 4D are explanatory views for explaining a method of manufacturing a metal-clad laminate according to a third embodiment of the present invention (hereinafter referred to as a manufacturing method of the third embodiment). Further, the manufacturing method of the third embodiment is a method for producing a metal-clad laminate according to the second embodiment. FIG. 5 is a schematic view showing the double belt pressing device 300. In FIGS. 4A to 4D, the same constituent members as those of the second embodiment shown in FIG. 2 are denoted by the same reference numerals, and their description is omitted.

The manufacturing method of the third embodiment includes a preparation step, a lamination step, and a heat and pressure forming step. In the preparation step, the core substrate 110 having the conductor circuit 50 is prepared on the one surface 40a (hereinafter, referred to as the first surface 40a). In the laminating step, the prepreg 60a and the metal foil (metal layer) 21 are sequentially laminated on the first surface 40a including the conductor circuit 50 to form the laminate 101a having the configuration shown in Fig. 4D. In the heat and pressure forming step, as shown in FIG. 5, the laminated body 101a is continuously supplied between the pair of rotating endless belts 310, 310, and the laminated body is heated and pressed between the pair of endless belts 310, 310. 101a. The prepreg 60a includes a reinforcing material 61 and a semi-cured material 62a (B-stage shape) of the thermosetting resin composition impregnated with the reinforcing material 61.

Further, as shown in the configuration of the metal-clad laminate 101 of the second embodiment (see FIG. 2), the interlayer thickness Ta2 of the conductor circuit 50 and the first metal layer 21 after the heat and pressure molding and the thickness of the reinforcing member 61 are as shown in FIG. The thickness difference (Ta2-Tb2) of Tb2 is 0≦Ta2-Tb2≦2 μm, and preferably 1 μm≦Ta2-Tb2≦2 μm. (preparation step)

In the preparation step, the core substrate 110 having the conductor circuit 50 on the one surface 40a shown in Fig. 4B is prepared. This preparation step specifically includes a preliminary step and a circuit forming step. In the preliminary step, the metal-clad laminate 110a shown in FIG. 4A is prepared, wherein the first surface 40a of the first insulating layer 40 is provided with a metal layer 50a for forming a conductor circuit, and the first insulating layer 40 is first. The second metal layer 31 is provided on the surface 40b opposite to the surface 40a (hereinafter referred to as the second surface 40b). In the circuit forming step, the wiring formation process is performed on the metal layer 50a for forming a conductor circuit, and the core substrate 110 shown in FIG. 4B is obtained.

In the preliminary step, as a method of preparing the metal-clad laminate 110a, for example, an upper metal foil corresponding to the metal layer 50a for forming a conductor circuit, a prepreg corresponding to the first insulating layer 40, corresponding to the second The lower metal foil of the metal layer 31 may be laminated and heated and pressure molded. As the material constituting the prepreg, for example, the same material as that exemplified as the material constituting the first insulating layer 40 can be used. The method of the heat and pressure molding may be the same as the method exemplified as the method of the heat and pressure molding in the heat and pressure molding step described later. The method of forming the wiring in the circuit forming step is not particularly limited, and examples thereof include a known circuit forming method such as a subtractive method and a semi-additive method. (layering step)

In the lamination step, as shown in FIG. 4C, the prepreg 60a and the metal foil (metal layer) 21 are sequentially laminated on the first surface 40a including the conductor circuit 50 to form the laminate 101a shown in FIG. 4D. . The method of laminating may be appropriately adjusted in accordance with the method of heating and press forming described later.

The prepreg 60a includes a reinforcing material 61 and a semi-cured material 62a of a thermosetting resin composition contained in the reinforcing material 61. The thickness of the prepreg 60a is preferably from 10 to 50 μm, more preferably from 12 to 47 μm. The hardening time (Geltime) of the prepreg 60a is preferably from 60 to 600 seconds, more preferably from 60 to 300 seconds. The volatile content (Volatile content) of the prepreg 60a is preferably 1.5% or less, more preferably 1.0% or less. The method for measuring the thickness, resin content, resin fluidity, hardening time, and volatile matter content of the prepreg 60a is in accordance with JIS 6521. Further, the gelation time (Geltime) was measured at 170 °C. The thickness of the reinforcing member 61 is preferably 10 to 50 μm, more preferably 12 to 45 μm. The method for measuring the thickness of the reinforcing member 61 can be measured by the same method as described in the examples.

As the material constituting the prepreg 60a, the same material as that exemplified as the material constituting the insulating layer 60 can be used.

It is preferable to preheat the laminate 101a before the heat and pressure forming. The term "preheating" means that in the double-belt pressing method to be described later, as shown in Fig. 5, the heating from the group of the rollers 320, 320 on the side of the feeders 340, 350, 360 to the hot-pressing devices 330, 330 is L. . The preliminary heating conditions may be carried out, for example, at a heating temperature of 80 to 250 ° C and a heating time of 5 to 200 seconds (s). (heating and press forming step)

In the heat and pressure forming step, as shown in FIG. 5, the laminated body 101a is continuously supplied between the pair of rotating endless belts 310, 310, and the laminated body 101a is heated and pressed between the pair of endless belts 310, 310. . Thereby, the metal-clad laminate 101 can be obtained.

The heat press molding is carried out as described above by a double belt pressing method in which a small amount of the laminate 101a of a degree of 1 or several sheets is continuously supplied between the endless belts 310, 310, and by the endless belts 310, 310 A surface pressure is applied to the laminate 101a while heating. In this way, the thickness difference (Ta2-Tb2) (see FIG. 2) after the heat and pressure molding can be made 2 μm or less which cannot be realized in the multi-stage vacuum pressing method, and the thinning of the printed wiring board can be sufficiently performed. In addition, the multi-stage vacuum pressing method is a method in which a laminated structure is stacked in a plurality of stages through a mirror panel at a normal temperature to obtain a laminated structure, and the obtained laminated structure is inserted between hot plates and heated by a hot plate and pressurized at the same time.

In the multi-stage vacuum pressing method, it takes a certain time for heat to be conducted from the outer side (hot plate side) of the laminated structure to the center side in the stacking direction of the laminated body. As a result, the laminated structure cannot be heated rapidly, and it is heated at a gradual temperature increase rate. When the laminated structure is heated and the melting temperature of the thermosetting resin is reached, the thermosetting resin composition is melted and the viscosity is lowered, and if it is further heated, it becomes molten and the viscosity is further lowered. However, since it is heated at a gradual temperature increase rate, the thermosetting resin in the prepreg also undergoes a thermosetting reaction during the temperature rise before reaching the peak temperature. When the thermosetting reaction of the thermosetting resin reaches a certain temperature and reaches a peak temperature, the viscosity at the peak temperature is not sufficiently lowered. Therefore, for example, when the metal-clad laminate 101 is produced by the multi-stage vacuum pressing method, the conductor circuit 50 is insufficiently embedded in the insulating layer 60, and delamination may occur during soldering assembly. In order to suppress the occurrence of such interlayer peeling, it is effective to increase the amount of the cured product 62 of the thermosetting resin composition constituting the insulating layer 60. However, this does not sufficiently respond to the thinning of the printed wiring board. Further, in the multi-stage vacuum pressing method, there is a fear that the suppression of the amount of warpage of the printed wiring board having a small thickness is insufficient.

On the other hand, in the double-belt pressing method, the thermosetting reaction of the thermosetting resin composition in the prepreg 60a does not proceed, and the laminate 101a can be heated at the peak temperature to ensure the prepreg 60a at the peak temperature. The viscosity of the thermosetting resin in the film is sufficiently lowered. Therefore, it is possible to apply pressure to the laminate 101a in a state where the viscosity is sufficiently low, and the gas generated inside the prepreg 60a can be extruded to the outside of the prepreg 60a by the rollers 320, 320. As a result, wrinkles and the like do not occur, and no bubbles remain in the insulating layer 60, and the metal-clad laminate 101 in which the conductor circuit 50 is embedded can be formed. Therefore, it is possible to produce a printed wiring board which can sufficiently reduce the amount of warpage caused by temperature change even when the thickness is thin and the interlayer peeling is not easily caused during soldering and assembly. <Double belt pressing method>

In the double belt pressing method, the double belt pressing device 300 is utilized. As shown in FIG. 5, the double belt pressing device 300 includes a pair of endless belts 310 and 310, two sets of two pairs of rollers 320 and 320, and hot pressing devices 330 and 330. Further, on the material supply side of the double belt pressing device 300, there is provided a feeder 340 which winds the long prepreg 60a into a coil shape, and a feeder 350 which has a long metal foil (metal layer) 21 is wound into a coil shape; a feeder 360 that winds the long core substrate 110 into a coil shape. On the material lead-out side of the double belt pressing device 300, a winder 370 is provided which winds a long metal-clad laminate 101 into a coil shape.

The pair of rollers 320, 320 are hung with an endless belt 310 configured to rotate the endless belt 310 by rotation of the drum 320. The pair of rollers 320 and 320 of the two groups are disposed such that both surfaces of the laminate 101a supplied between the endless belts 310 and 310 are in surface contact with the endless belts 310 and 310, and a surface pressure is applied to the laminate 101a. The hot pressing devices 330, 330 are disposed inside the endless belts 310, 310, respectively, to heat the laminate 101a supplied between the endless belts 310, 310 through the endless belt 310. The feeders 340, 350, 360 are arranged to continuously feed the prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110, respectively. The winder 370 is configured to continuously wind up the metal-clad laminate 101.

The heat and pressure forming by the double belt pressing method does not stack a large number of laminates 101a in a multi-stage manner, specifically, in the following manner.

First, a long prepreg 60a, a metal foil (metal layer) 21, and a core substrate 110 are fed from the respective feeders 340, 350, and 360, and are continuously supplied between the rotating endless belts 310, 310. The prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110 supplied between the endless belts 310 and 310 are sequentially stacked on the surface 40a of the core substrate 110 having the conductor circuit 50 as shown in FIG. 4C. The prepreg 60a and the metal foil (metal layer) 21 constitute a laminate 101a. The pair of endless belts 310 and 310 are rotated at a speed synchronized with the conveyance speed of the prepreg 60a, the metal foil (metal layer) 21, and the core substrate 110. At this time, the endless belts 310 and 310 are in surface contact with both surfaces of the laminate 101a, and a surface pressure is applied to the laminate 101a.

Next, the layered product 101a is placed in a region (hereinafter referred to as a heating and pressurizing region) that is placed by the hot press device 330 in a state of being sandwiched by the pair of endless belts 310 and 310. When the laminate 101a passes through the heated and pressurized region, the laminate 101a is applied with a surface pressure by the heat pressing device 330 through the endless belt 310 and simultaneously heated to melt or soften the prepreg 60a and the metal foil (metal layer). 21 and the core substrate 110 are thermocompression bonded.

Then, the laminated product 101a which is led out from the double-belt pressing apparatus 300 is cooled, and becomes a metal-clad laminated board 101, and is wound up in a coil shape by the winder 370.

As the material of the endless belt 310, for example, stainless steel or the like can be used. As the pressurizing means of the hot press device 330, for example, a pressurizing roller, a hydraulic pressure, a pressurization of a sliding pressurizing disk, and the like which are generally used as a pressurizing mechanism of a double belt pressing device can be cited. Examples of the heating form of the hot press device 330 include a heating medium circulation method, an induction heating method, and the like.

The heating and pressurizing conditions of the double belt pressing method can be, for example, the contents described below. If the heating temperature, the pressing pressure, and the heating and pressing time are within the following ranges, the metal-clad laminate 101 in which the conductor circuit 50 is embedded can be easily formed.

The lower limit of the heating temperature is preferably the melting point temperature of the thermosetting resin constituting the prepreg 60a, and more preferably the temperature higher than the melting point of the thermosetting resin by 3 °C. The upper limit of the heating temperature is preferably a temperature higher than the melting point of the thermosetting resin by 20 ° C, more preferably 15 ° C higher than the melting point of the thermosetting resin. The temperature increase rate when the laminate 101a is heated to the curing temperature of the thermosetting resin is preferably 2 ° C / sec (s) or more, more preferably 3 to 5 ° C / sec (s). The lower limit of the pressing force is preferably 0.49 MPa, more preferably 2 MPa. The upper limit of the pressing force is preferably 5.9 MPa, more preferably 5 MPa. The lower limit of the heating and pressing time is preferably 90 seconds, more preferably 120 seconds. The upper limit of the heating and pressing time is preferably 360 seconds, more preferably 240 seconds.

Further, in the manufacturing method of the third embodiment, the core substrate 110 including the second metal layer 31 on the second surface 40b of the first insulating layer 40 is used, but the present invention is not limited thereto, and the present invention is not limited thereto. In the middle, a core substrate having no metal layer on the second surface 40b of the first insulating layer 40 may be used. [Manufacturing method of metal-clad laminate according to fourth embodiment]

6A to 6D are explanatory views for explaining a method of manufacturing a metal-clad laminate according to a fourth embodiment of the present invention (hereinafter, referred to as a manufacturing method of the fourth embodiment). Fig. 7 is a schematic cross-sectional view showing a metal-clad laminate 102 according to a fifth embodiment of the present invention. In FIGS. 6A to 6D and FIG. 7 , the same components as those shown in the manufacturing method of the third embodiment of FIGS. 4A to 4D are denoted by the same reference numerals, and description thereof will be omitted.

The manufacturing method of the fourth embodiment includes a preparation step, a lamination step, and a heat and pressure forming step. Thereby, the metal-clad laminate 102 having the configuration shown in Fig. 7 can be obtained. In the preparation step, the core substrate 120 including the first conductor circuit 50 and the second conductor circuit 51 is prepared on the first surface 40a and the second surface 40b which face each other. In the laminating step, the prepreg 60a and the first metal foil (metal layer) 21 are sequentially laminated on the first surface 40a of the core substrate 120, and the prepreg is sequentially laminated on the second surface 40b of the core substrate 120. The body 70a and the second metal foil (metal layer) 31 are used to form the laminate 102a having the configuration shown in Fig. 6D. In the heat and pressure forming step, the laminate 102a is heated and pressed. The prepreg 60a includes a reinforcing material 61 and a semi-cured material 62a (B-stage shape) of the thermosetting resin composition impregnated with the reinforcing material 61. The prepreg 70a includes a reinforcing material 71 and a semi-cured material 72a (B-stage shape) of the thermosetting resin composition impregnated with the reinforcing material 71. The prepreg 70a and the prepreg 60a may have the same configuration or may be different from each other.

As shown in FIG. 7, the metal-clad laminate 102 includes a first insulating layer 40, a first conductor circuit 50, a second insulating layer 60, a first metal layer 21, a second conductor circuit 51, and a third insulating layer 70. And a second metal layer 31. The conductor circuit 50 is laminated on the first surface 40a of the first insulating layer 40 (hereinafter referred to as the first surface 40a). The second insulating layer 60 is laminated on the first surface 40a and the conductor circuit 50. The first metal layer 21 is laminated on the second insulating layer 60. The second conductor circuit 51 is laminated on the second face 40b of the first insulating layer 40. The third insulating layer 70 is laminated on the second surface 40b and the conductor circuit 51. The second metal layer 31 is laminated on the third insulating layer 70. The second insulating layer 60 includes a reinforcing material 61 and a cured product 62 of a thermosetting resin composition impregnated with the reinforcing material 61. The third insulating layer 70 includes a reinforcing material 71 and a cured product 72 of a thermosetting resin composition impregnated with the reinforcing material 71.

The thickness difference (Ta5-Tb5) between the interlayer thickness Ta5 of the first conductor circuit 50 and the first metal layer 21 and the thickness Tb5 of the reinforcing material 61 after heating and press forming is 0 ≦ Ta5 - Tb 5 ≦ 2 μm, and preferably 1 μm. ≦Ta5-Tb5≦2μm. Further, the thickness difference (Ta6-Tb6) between the interlayer thickness Ta6 of the second conductor circuit 51 and the second metal layer 31 after the heat and pressure molding and the thickness Tb6 of the reinforcing material 71 is 0 ≦ Ta6 - Tb 6 ≦ 2 μm, and preferably. It is 1 μm ≦Ta6-Tb6≦2 μm. In the manufacturing method of the fourth embodiment, the interlayer thickness Ta5 corresponds to the interlayer thickness Ta2, and the thickness Tb5 corresponds to the thickness Tb2. The method of measuring the interlayer thickness Ta6 is the same as the method of measuring the interlayer thickness Ta1. The method of measuring the thickness Tb6 of the reinforcing material 71 is the same as the method of measuring the thickness Tb1 of the reinforcing material 11. (preparation step)

In the preparation step, as shown in FIG. 6B, the core substrate 120 is prepared, which has the first conductor circuit 50 on the first surface 40a and the second conductor circuit 51 on the second surface 40b. This preparation step specifically includes a preliminary step and a circuit forming step. In the preliminary step, the metal-clad laminate 110a shown in FIG. 6A is prepared, wherein the first surface 40a of the first insulating layer 40 is provided with a metal layer 50a for forming a first conductor circuit, and the second surface 40b is provided with a first layer 40a. A metal layer 31 for forming a two-conductor circuit. In the circuit forming step, the metal layer 50a for forming the first conductor circuit and the metal layer 31 for forming the second conductor circuit are respectively subjected to a wiring forming process, and the core substrate 120 shown in FIG. 6B is obtained.

In the preliminary step, as a method of preparing the metal-clad laminate 110a, for example, a metal foil corresponding to the upper side of the metal layer 50a for forming the first conductor circuit, a prepreg corresponding to the first insulating layer 40, corresponding to The lower metal foil of the metal layer 31 for forming the second conductor circuit may be laminated and heated and formed. As the material constituting the prepreg, for example, the same material as that exemplified as the material constituting the first insulating layer 40 can be used. The method of the heat and pressure molding may be the same as the method exemplified as the heat and pressure molding method in the heat and pressure molding step of the production method of the third embodiment. In the circuit formation step, the method of forming the wiring is not particularly limited, and examples thereof include known circuit formation methods such as a subtractive method and a semi-additive method. (layering step)

In the lamination step, as shown in FIG. 6C, the prepreg 60a and the metal foil (metal layer) 21 are sequentially laminated on the first surface 40a including the conductor circuit 50, and the second conductor circuit 51 is provided. A prepreg 70a and a metal foil (metal layer) 31 are sequentially laminated on the surface 40b to form a laminate 102a. The method of laminating may be appropriately adjusted in accordance with the method of heating and press forming described later.

The material constituting the prepregs 60a and 70a can be, for example, the same material as that exemplified as the material constituting the insulating layer 60.

It is preferable to preheat the laminate 102a before the heat and pressure forming. The preliminary heating conditions may be carried out, for example, at a heating temperature of 80 to 250 ° C and a heating time of 5 to 200 seconds (s). (heating and press forming step)

In the heat and pressure forming step, the laminate 102a is heated and pressed. Thereby, the metal-clad laminate 102 shown in Fig. 7 can be obtained.

The method of the heat press molding may be, for example, the same method as the method exemplified as the method of the heat and pressure molding in the production method of the first embodiment. [Method of Manufacturing Printed Wiring Board of Embodiment]

In the method for producing a printed wiring board according to the embodiment, the metal-clad laminates 101 and 102 are produced by the method for manufacturing a metal-clad laminate according to the above embodiment, and the metal foils (metal layers) 21 and 31 are subjected to wiring formation treatment. . Thereby, a printed wiring board can be obtained. The method of forming the wiring is not particularly limited, and examples thereof include a known circuit forming method such as a subtractive method and a semi-additive method. Example

Hereinafter, the present invention will be specifically described by way of examples. [Example 1] [Preparation step]

The following long prepreg, the long lower metal foil (corresponding to the second metal layer 31) and the long upper metal foil (corresponding to the metal layer 50a for forming a conductor circuit) are used, and the use of FIG. 5 is used. In the manufacturing apparatus shown, a metal-clad laminate 110a of the long shape shown in Fig. 4A is obtained. The preliminary heating conditions in the double belt pressing device 300 were carried out under the conditions of a heating temperature of 100 ° C and a heating time of 30 seconds (s). The heating and pressurization in the double belt pressing device 300 was carried out under the conditions of a heating temperature of 300 ° C, a pressing force of 40 MPa, and a heating and pressing time of 3 minutes. (long strip of prepreg)

As the prepreg, the product number "R-1410E" (sheet thickness: 12 μm) manufactured by Panasonic Co., Ltd. was used. "R-1410E" is a resin composition containing an epoxy resin, a phenolic curing agent, and an inorganic filler such as cerium oxide, which is impregnated with a glass cloth (glass composition: E glass). The composition was dried to a product which was produced in a semi-hardened state. The mixing ratio of the inorganic filler is 100 parts by mass based on 100 parts by mass of the epoxy resin and the phenolic curing agent. (long strip of metal foil)

As the lower metal foil, the product number "3EC-M2S-VLP" (thickness: 12 μm) manufactured by Mitsui Mining & Mining Co., Ltd. was used. (long strip of upper metal foil)

As the upper metal foil, the product number "MicroThin Ex5" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 5 μm, surface roughness (Rzjis) of the surface opposite to the surface on the prepreg side: 2 μm) was used.

The metal layer 50a for forming a conductor circuit in the obtained metal-clad laminate 110a obtained by the etching is subjected to wiring formation processing to form the conductor circuit 50, and the core substrate 110 having the configuration shown in FIG. 4B is obtained. The residual copper ratio at this time was 80%. Below, the circuit pattern is evaluated by the same circuit. [Lamination step, heating and press forming step]

Using a long core substrate 110, the following long prepreg 60a, a long metal foil (corresponding to the first metal layer 21), by the manufacturing steps shown in FIGS. 4C and 4D, and using FIG. The long manufacturing metal-clad laminate 101 shown in Fig. 2 is obtained by the manufacturing apparatus shown. The preliminary heating conditions in the double belt pressing device 300 were carried out under the conditions of a heating temperature of 230 ° C and a heating time of 30 seconds (s). The heating and pressurization in the double belt pressing device 300 is carried out at a heating rate of 3 ° C / sec (s) from 200 ° C to 300 ° C, at a heating temperature of 300 ° C, a pressing force of 40 MPa, and a heating and pressing time of 3 minutes. get on. (long strip of prepreg 60a)

As the prepreg 60a, the product number "R-1410E" manufactured by Panasonic Co., Ltd. was used (thickness: 12 μm, thickness of the reinforcing material 61: 12 μm, resin content: 54%, resin fluidity: 30%, hardening time) : 150 seconds, volatile content: 0.5%). The values of the resin content, the resin fluidity, the hardening time, and the volatile matter content are the list values, and the values of the resin content, the resin fluidity, the hardening time, and the volatile matter content shown below are also the same. (long strip of metal foil)

As the metal foil, the product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) was used. [Production of Printed Wiring Board 200]

The metal layers 21 and 31 on both sides of the obtained metal-clad laminate 101 are subjected to wiring formation processing by etching to form the second conductor circuit 22 and the third conductor circuit 32, and the composition shown in FIG. 3 is obtained. A long printed wiring board 200. [Embodiment 2]

In the [layering step, heating and press forming step], the long prepreg 60a is a product number "R-1410E" manufactured by Panasonic (thickness: 14 μm, thickness of the reinforcing member 61: 12 μm, resin content: 61%, resin fluidity: 30%, hardening time: 150 seconds, volatile content: 0.5%), the other portions were the same as in Example 1, and the printed wiring having the configuration shown in FIG. 3 was obtained. Board 200. [Example 3]

In the [preparation step], the upper metal foil of the long strip is a product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 20 μm, the surface opposite to the surface on the prepreg side) The surface roughness (Rzjis): 2 μm), and in the [layering step, heat and pressure forming step], the product number "R-1410E" manufactured by Panasonic Co., Ltd. is used as the long prepreg 60a ( The thickness of the plate: 45 μm, the thickness of the reinforcing member 61: 45 μm, the resin content: 48%, the resin fluidity: 10%, the hardening time: 150 seconds, and the volatile content: 0.5%), the other portions were the same as in the first embodiment, The printed wiring board 200 having the configuration shown in FIG. 3 is obtained. [Example 4]

In the [layering step, heat and pressure forming step], the long prepreg 60a is made of Panasonic product number "R-1410E" (thickness: 47 μm, thickness of the reinforcing material 61: 45 μm, resin content: 50%, resin fluidity: 10%, hardening time: 150 seconds, volatile content: 0.5%), the other portions were the same as in Example 3, and the printed wiring having the configuration shown in FIG. 3 was obtained. Board 200. [Example 5]

The following long prepreg, the long lower metal foil (corresponding to the second metal layer 30) and the long upper metal foil (corresponding to the first metal layer 20) are used, and are manufactured using the same as shown in FIG. The device is obtained to obtain a metal-clad laminate 100 constructed as shown in FIG. The preliminary heating conditions in the double belt pressing device 300 were carried out under the conditions of a heating temperature of 100 ° C and a heating time of 30 seconds (s). The heating and pressurization in the double belt pressing device 300 is carried out at a heating temperature of 3 ° C / sec (s) from 200 ° C to 300 ° C, at a heating temperature of 300 ° C, a pressing pressure of 40 MPa, and a heating and pressing time of 3 minutes. get on. (long strip of prepreg)

As the prepreg, the product number "R-1410E" manufactured by Panasonic Co., Ltd. (thickness: 12 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 54%, resin flowability: 30) %, hardening time: 150 seconds, volatile content: 0.5%). (long metal foil on the lower side, upper metal foil)

As the lower metal foil and the upper metal foil, the product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) . [Embodiment 6]

In addition to the long prepreg, the product number "R-1410E" manufactured by Panasonic Co., Ltd. (thickness: 14 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 59%, resin) The fluidity: 30%, hardening time: 150 seconds, volatile matter content: 0.5%), the other portions were the same as in Example 5, and a metal-clad laminate 100 having the composition shown in Fig. 1 was obtained. [Comparative Example 1] [Preparation step]

Using the prepreg, the lower metal foil (corresponding to the second metal layer 31), and the upper metal foil (corresponding to the metal layer 50a for forming a conductor circuit), the composition shown in FIG. 4A is obtained by a multi-stage vacuum pressing method. A metal laminated board 110a is attached. The heating and pressurization in the multi-stage vacuum pressing method was carried out under the following conditions.

The unit pressure applied to the laminated structure is 0.49 to 0.98 MPa (5 to 10 kg/cm ² ) (primary pressure) between 20 and 30 minutes from the start of the heat and pressure molding, and then the product temperature is raised to 120 ° C. The pressure was 2.94 MPa (30 kg/cm ² ) (secondary pressure). Thereafter, the secondary pressure is maintained until the treatment of the heat and pressure forming is completed.

The product temperature was heated from a heating press molding to a product temperature of 160 ° C, and was heated at a temperature increase rate of 1 to 3 ° C / min. Thereafter, the product temperature was maintained at 160 ° C or higher for 50 minutes. The maximum temperature of the product at this time is 170 to 180 °C. Thereafter, the temperature of the laminate was cooled to room temperature at a cooling rate of 2 to 6 ° C /min.

The gas atmosphere is maintained in a gas atmosphere of 13.3 kPa (100 Torr) or less until the product temperature is 130 to 140 ° C, and then exposed to the atmosphere. (prepreg)

As a prepreg, the product number "R-1410E" manufactured by Panasonic Co., Ltd. (sheet thickness: 15 μm, resin content: 61%, resin fluidity: 30%, hardening time: 150 seconds, volatile matter content: 0.5) % seconds or less). (lower metal foil)

As the lower metal foil, the product number "3EC-M2S-VLP" (thickness: 12 μm) manufactured by Mitsui Mining & Mining Co., Ltd. was used. (upper metal foil)

As the upper metal foil, the product number "MicroThinEX5" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 5 μm, surface roughness (Rzjis) of the surface opposite to the surface on the prepreg side: 2 μm) was used.

The metal layer 50a for forming a conductor circuit in the obtained metal-clad laminate 110a is subjected to wiring formation processing by etching to form the conductor circuit 50, whereby the core substrate 110 having the configuration shown in FIG. 4B is obtained. [Lamination step, heating and press forming step]

Using the core substrate 110, the following prepreg 60a, and the metal foil (corresponding to the first metal layer 21), the metal-clad laminate 101 shown in Fig. 2 is obtained by a multi-stage vacuum pressing method. The heating and pressurizing conditions in the multi-stage vacuum pressing method were carried out under the following conditions.

In the laminated structure is applied to the unit pressure, the heat and pressure molding is 0.49 ~ 0.98MPa (5 ~ 10kg / cm 2) ( primary pressure) starts between 20 to 30 minutes, and then, the product reaches a temperature of 120 deg.] C liters The pressure was 2.94 MPa (30 kg/cm ² ) (secondary pressure). Thereafter, the secondary pressure is maintained until the treatment of the heat and pressure forming is completed.

The product temperature was heated from a heating press molding to a product temperature of 160 ° C, and was heated at a temperature increase rate of 1 to 3 ° C / min. Thereafter, the product temperature was maintained at 160 ° C or higher for 50 minutes. The maximum temperature of the product at this time is 170 to 180 °C. Thereafter, the temperature of the laminate was cooled to room temperature at a cooling rate of 2 to 6 ° C /min.

The gas atmosphere is maintained in a gas atmosphere of 13.3 kPa (100 Torr) or less until the product temperature is 130 to 140 ° C, and then exposed to the atmosphere. (prepreg 60a)

As the prepreg 60a, the product number "R-1410E" manufactured by Panasonic Co., Ltd. was used (thickness: 15 μm, thickness of the reinforcing material 61: 12 μm, resin content: 63%, resin fluidity: 30%, hardening time) : 150 seconds, volatile content: 0.5%). (metal foil)

As the metal foil, the product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) was used. [Production of Printed Wiring Board 200]

The metal layers 21 and 31 on both sides of the obtained metal-clad laminate 101 are subjected to wiring formation processing by etching to form the second conductor circuit 22 and the third conductor circuit 32, thereby obtaining a printed wiring board having the configuration shown in FIG. 200. [Comparative Example 2]

In the [layering step, heating and press forming step], the product number "R-1410E" manufactured by Panasonic Co., Ltd. is used as the prepreg 60a (thickness: 17 μm, thickness of the reinforcing material 61: 12 μm, resin) The printed wiring board 200 was obtained in the same manner as in Comparative Example 1, except that the content was 67%, the resin fluidity: 30%, the hardening time: 150 seconds, and the volatile content: 0.5%. [Comparative Example 3]

In the [preparation step], the product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 20 μm, surface roughness of the surface on the prepreg side (Rzjis)) is used as the upper metal foil. 2 μm), in the [layering step, heating and press forming step], the product number "R-1410E" manufactured by Panasonic Co., Ltd. (thickness: 48 μm, thickness of the reinforcing material 61) is used as the prepreg 60a. : 45 μm, resin content: 50%, resin fluidity: 10%, hardening time: 150 seconds, volatile matter content: 0.5%), the other portions were the same as in Example 1, and the composition shown in FIG. 3 was obtained. Wiring board 200. [Comparative Example 4]

In the [layering step, heating and press forming step], as the prepreg 60a, the product number "R-1410E" manufactured by Panasonic Co., Ltd. (sheet thickness: 55 μm, thickness of the reinforcing material 61: 45 μm, resin) The printed wiring board 200 was obtained in the same manner as in Comparative Example 3 except that the content was 55%, the resin fluidity: 10%, the hardening time: 150 seconds, and the volatile content: 0.5%. [Comparative Example 5]

Using the following prepreg, the lower metal foil (corresponding to the second metal layer 30) and the upper metal foil (corresponding to the first metal layer 20), the metal attached as shown in FIG. 1 is obtained by a multi-stage vacuum pressing method. The laminate board 100. The heating and pressurization in the multi-stage vacuum pressing method was carried out under the same conditions as those in the [preparation step] of Comparative Example 1. (prepreg)

As the prepreg, the product number "R-1410E" manufactured by Panasonic Co., Ltd. (thickness: 15 μm, thickness of the reinforcing material corresponding to the reinforcing material 11: 12 μm, resin content: 61%, resin flowability: 30) %, hardening time: 150 seconds, volatile content: 0.5%). (lower metal foil, upper metal foil)

As the lower metal foil and the upper metal foil, the product number "3EC-M2S-VLP" manufactured by Mitsui Mining & Mining Co., Ltd. (thickness: 12 μm, surface roughness (Rzjis) of the surface on the prepreg side: 2 μm) . [Measurement of thickness]

In the metal-clad laminate 101 obtained in the first to fourth embodiments and the comparative examples 1 to 4, the interlayer thickness Ta of the conductor circuit 50 and the first metal layer 21 is by a digital microscope ("VH by the company Keyence". -Z500", the same applies hereinafter, and measuring the cross section of the metal-clad laminate 101. That is, as shown in FIG. 2, the front end portion of the second insulating layer 60 side of the first metal layer 21 and the second portion of the conductor circuit 50 are in the thickness direction of the metal-clad laminate 101 by a digital microscope. The length between the two points on the side of the insulating layer 60 was magnified 2000 times, and the measurement function was used for calculation and measurement. Here, the front end portion of the first metal layer 21 on the second insulating layer 60 side, as shown in FIG. 2, means that a straight line is drawn on the lower surface of the copper foil convex portion at the point of the first metal layer 21 below the first metal layer 21. The location is determined. As shown in FIG. 2, the front end portion of the conductor circuit 50 on the second insulating layer 60 side is a position where a straight line is drawn on the upper surface of the copper foil convex portion at the point where the copper foil convex portion 3 is located on the upper surface of the conductor circuit 50.

In the metal-clad laminate 101 obtained in Examples 1 to 4 and Comparative Examples 1 to 4, the thickness Tb of the reinforcing member 61 is a cross-sectional view of the metal-clad laminate 101 by a digital microscope, as shown in FIG. As shown in the thickness direction of the metal-clad laminate 101, the length between the front end portion of the reinforcing member 61 on the first metal layer 21 side and the front end portion of the reinforcing member 61 on the conductor circuit 50 side is represented by a digit. The measurement function of the microscope is calculated and measured. Here, the front end portion of the reinforcing member 61 on the first metal layer 21 side is the most polished on the upper surface of the reinforcing member 61 in the fiber direction of the vertical line 61a constituting the reinforcing member 61, as shown in Fig. 2 . A position determined by a straight line is drawn on the upper portion 61c. As shown in FIG. 2, the front end portion of the reinforcing member 61 on the side of the conductor circuit 50 is a straight line drawn on the lowermost portion 61d which is polished in the fiber direction of the longitudinal line 61a of the reinforcing member 61, as shown in FIG. The location is determined. In the measurement of the thickness Tb of the reinforcing material 61, the vertical line 61a is not used as the reference instead of the horizontal line 61b constituting the reinforcing material 61, because the cross-sectional observation of the metal-clad laminate 101 is as shown in FIG. The cross-sectional shape of the horizontal line 61b constituting the reinforcing material 61 is circular, and it is difficult to distinguish the horizontal line 61b from the inorganic filler. The same applies to the measurement of the thickness Tb of the reinforcing member 11, the thickness of the reinforcing member 61, and the thickness of the reinforcing member corresponding to the reinforcing member 11.

In the metal-clad laminate 100 obtained in the fifth and sixth embodiments and the comparative example 5, the interlayer thickness Ta of the first metal layer 20 and the second metal layer 30 is a metal-clad laminate 100 by a digital microscope. The cross section was observed and measured. That is, as shown in FIG. 1, the insulating layer of the first metal layer 20 on the side of the insulating layer 10 and the insulating layer of the second metal layer 30 are formed by a digital microscope in the thickness direction of the metal-clad laminate 100. The length between the two points on the 10 side front end is enlarged by 2000 times, and the measurement function is used for calculation and measurement. Here, the front end portion of the first metal layer 20 on the side of the insulating layer 10, as shown in FIG. 1, means that a straight line is formed on the lower surface of the copper foil convex portion at the average position of the copper foil convex portion 3 under the first metal layer 20. position. The front end portion of the second metal layer 30 on the side of the insulating layer 10 as shown in FIG. 1 means a position where a straight line is drawn on the upper surface of the first metal layer 30 at an average position of the copper foil convex portion.

In the metal-clad laminate 100 obtained in Examples 5 and 6 and Comparative Example 5, the thickness Tb of the reinforcing member 11 is a cross-sectional view of the metal-clad laminate 100 by a digital microscope, as shown in FIG. In the thickness direction of the metal-clad laminate 100, the front end portion of the first metal layer 20 side of the reinforcing material 11 and the front end portion of the second metal layer 30 side of the reinforcing material 11 are fixed by a digital microscope. The length is magnified 2000 times and the measurement function is used for calculation and measurement. Here, the front end portion of the reinforcing member 11 on the first metal layer 20 side is the most polished on the upper surface of the reinforcing member 11 in the fiber direction of the vertical line 11a constituting the reinforcing member 11, as shown in Fig. 1 . The position of the straight line is drawn on the upper portion 11c. As shown in Fig. 1, the front end portion of the reinforcing member 11 on the second metal layer 30 side is referred to as the lowermost portion 11d which is polished in the fiber direction of the longitudinal line 11b constituting the reinforcing member 11 on the lower surface of the reinforcing member 11. Draw the position where the line is fixed.

In the thicknesses of the reinforcing members 61 used in the first to fourth embodiments and the comparative examples 1 to 4, the cross-section of the prepreg 60a was observed by a digital microscope, and the reinforcing member 61 was calculated and measured in the thickness direction of the reinforcing member 61. The length between the front end portion of the first metal layer 21 side and the front end portion of the reinforcing material 61 on the conductor circuit 50 side. Here, the front end portion of the reinforcing member 61 on the first metal layer 21 side is the same as the thickness Tb2 of the reinforcing member 61 and the thickness Tb1 of the reinforcing member 11, as shown in FIG. The upper surface is drawn at a position where the straight line is drawn on the uppermost portion of the fiber constituting the longitudinal direction of the reinforcing member 61. As shown in FIG. 2, the front end portion of the reinforcing member 61 on the side of the conductor circuit 50 is defined as a straight line on the lowermost portion of the reinforcing member 61 which is polished in the fiber direction of the longitudinal direction of the reinforcing member 61. s position.

Corresponding to the thickness of the reinforcing material of the reinforcing material 11 used in Examples 5 and 6 and Comparative Example 5, the cross-sectional observation of the prepreg was performed by a digital microscope, and the measurement of the reinforcing material was performed in the thickness direction of the reinforcing material. The length between the front end portion of the upper metal foil side and the front end portion of the lower side metal foil side of the reinforcing material. Here, the front end portion of the upper side metal foil side of the reinforcing material is the vertical line of the reinforcing material on the upper surface of the reinforcing material, similarly to the measurement of the thickness Tb of the reinforcing material 61 and the thickness Tb of the reinforcing material 11 The position of the straight line is drawn on the uppermost portion of the fiber direction that is ground. The front end portion of the lower side metal foil side of the reinforcing material is a fiber constituting the longitudinal line of the reinforcing material on the lower surface of the reinforcing material, similarly to the measurement of the thickness Tb of the reinforcing material 61 and the thickness Tb of the reinforcing material 11 A position where a straight line is drawn on the lowermost portion that is ground in the direction. [Welding heat resistance]

The two-sided metal-clad laminate obtained in each of the examples and the comparative examples was used as a test piece, and the solder heat resistance was evaluated in accordance with JIS C6481 in the following manner. The temperature of the molten solder was raised from about 200 ° C to about every 10 ° C. In the stage where the temperature of the molten solder was raised, the test piece was placed on the molten solder bath at each temperature for 60 seconds. Thereafter, the sample piece was taken out from the molten solder bath, and the test piece was cooled to room temperature. The presence or absence of swelling of the test piece and peeling of the interlayer was confirmed by visual observation. The highest temperature of the solder in which the expansion and interlayer peeling were not confirmed was taken as the evaluation result. [warpage evaluation]

The metal-clad laminate obtained in each of the examples and the comparative examples was cut to obtain a test piece having a plane viewing angle of 20 cm × 20 cm. After the metal layers on both sides of the test piece were completely removed by etching, the test piece was heated at 200 ° C for 1 hour.

Next, in the test pieces obtained in Examples 1 to 4 and Comparative Examples 1 to 4, test pieces were placed so that the first insulating layer 40 derived from the core substrate 110 was positioned above. In this state, the amount of warpage of the test piece was measured. The amount of warpage is defined as a positive value when the test piece is warped convexly upward, and is defined as a negative value when it is defined as a positive value and warped convexly downward. The results are shown in Table 1.

[Table 1]         <TABLE border="1" borderColor="#000000" width="_0001"><TBODY><tr><td> </td><td> Example 1 </td><td> Example 2 </ Td><td> Example 3 </td><td> Example 4 </td><td> Example 5 </td><td> Example 6 </td><td> Comparative Example 1 </ Td><td> Comparative Example 2 </td><td> Comparative Example 3 </td><td> Comparative Example 4 </td><td> Comparative Example 5 </td></tr><tr>< Td> metal-clad laminate</td><td> construction</td><td> Figure 2 </td><td> Figure 2 </td><td> Figure 2 </td><td> 2 </td><td> Figure 1 </td><td> Figure 1 </td><td> Figure 2 </td><td> Figure 2 </td><td> Figure 2 </td> <td> Figure 2 </td><td> Figure 1 </td></tr><tr><td> Number of layers in the metal layer</td><td> 3 layers</td><td> 3 Layer </td><td> 3 layers </td><td> 3 layers </td><td> 2 layers </td><td> 2 layers </td><td> 3 layers </td> <td> 3 layers</td><td> 3 layers</td><td> 3 layers</td><td> 2 layers</td></tr><tr><td> Heated pressure forming Mode </td><td> double belt pressing method</td><td> double belt pressing method</td><td> double belt pressing method</td><td> double belt pressing method</td>< Td> double belt pressing method</td><td> double belt pressing method</td><td> multi-stage hot pressing method</td><td> multi-stage heat Method</td><td> Multi-stage hot pressing method</td><td> Multi-stage hot pressing method</td><td> Multi-stage hot pressing method</td></tr><tr><td > Thickness</td><td> Interlayer Thickness (Ta) (μm) </td><td> 12 </td><td> 14 </td><td> 45 </td><td> 47 < /td><td> 12 </td><td> 14 </td><td> 15 </td><td> 17 </td><td> 48 </td><td> 55 </td ><td> 15 </td></tr><tr><td> Thickness of reinforcing material (Tb) (μm) </td><td> 12 </td><td> 12 </td>< Td> 45 </td><td> 45 </td><td> 12 </td><td> 12 </td><td> 12 </td><td> 12 </td><td> 45 </td><td> 45 </td><td> 12 </td></tr><tr><td> Ta-Tb(μm) </td><td> 0 </td>< Td> 2 </td><td> 0 </td><td> 2 </td><td> 0 </td><td> 2 </td><td> 3 </td><td> 5 </td><td> 3 </td><td> 10 </td><td> 3 </td></tr><tr><td> Thickness of conductor circuit (A) (μm) < /td><td> 5 </td><td> 5 </td><td> 20 </td><td> 20 </td><td> — </td><td> — </td ><td> 5 </td><td> 5 </td><td> 20 </td><td> 20 </td><td> — </td></tr><tr><td > Total plate thickness (μm) </td><td> 53 </td><td> 55 </td><td> 101 </td><td> 103 </td><td> 36 </td ><td> 38 </td><td> 56 </td><td> 58 </td><td> 104 </ Td><td> 111 </td><td> 39 </td></tr><tr><td> Evaluation</td><td> Solder heat resistance test (°C) </td><td> 288 </td><td> 288 </td><td> 288 </td><td> 288 </td><td> 288 </td><td> 288 </td><td> 200 < /td><td> 288 </td><td> 200 </td><td> 288 </td><td> 200 </td></tr><tr><td> Warpage Assessment ( Mm) </td><td> -10 </td><td> -10 </td><td> -10 </td><td> -10 </td><td> 0 </td> <td> 0 </td><td> -30 </td><td> -30 </td><td> -30 </td><td> -30 </td><td> 0 </ Td></tr></TBODY></TABLE>

100, 101, 110a, 102‧‧‧ metal-clad laminate
10‧‧‧Insulation
10a, 40a‧‧‧ first side
10b, 40b‧‧‧ second side
110, 120‧‧‧ core substrate
101a, 102a‧‧‧layers
11, 41, 61, 71‧‧‧ reinforcing materials
12, 42, 62, 72‧‧‧ hardened materials
200‧‧‧Printed wiring board
20, 21‧‧‧ first metal layer
22‧‧‧Second conductor circuit
30, 31‧‧‧ second metal layer
32‧‧‧ Third conductor circuit
40‧‧‧First insulation
50‧‧‧Conductor circuit (first conductor circuit)
51‧‧‧Second conductor circuit
50a‧‧‧metal layer
60‧‧‧Second insulation
60a, 70a‧‧‧ prepreg
62a, 72a‧‧‧ semi-hardened
61a, 11a, 11b‧‧‧ vertical line
11c, 61c‧‧‧ top
11d, 61d‧‧‧ lowermost
61b‧‧‧ horizontal line
70‧‧‧ third insulation layer
300‧‧‧Double belt pressing device
310‧‧‧Ring belt
320‧‧‧Roller
330‧‧‧Hot pressure device
340, 350, 360‧‧‧ feeders
370‧‧‧Winding machine
L‧‧‧ spacing
Interlayer thickness of Ta1, Ta2, Ta3, Tc, Ta5, Ta6‧‧
Tb1, Tb2, Tb3, Td, A, Tb5, Tb6‧‧‧ thickness

Fig. 1 is a schematic cross-sectional view showing a metal-clad laminate according to a first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing a metal-clad laminate according to a second embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing a printed wiring board according to an embodiment of the present invention. Fig. 4A is a view for explaining a manufacturing method of a third embodiment of the present invention. Fig. 4B is a view for explaining a manufacturing method of a third embodiment of the present invention. Fig. 4C is a view for explaining a manufacturing method of a third embodiment of the present invention. Fig. 4D is a view for explaining a manufacturing method of a third embodiment of the present invention. Fig. 5 is a schematic view of a double belt pressing device. Fig. 6A is a view for explaining a manufacturing method of a fourth embodiment of the present invention. Fig. 6B is a view for explaining a manufacturing method of a fourth embodiment of the present invention. Fig. 6C is a view for explaining a manufacturing method of a fourth embodiment of the present invention. Fig. 6D is a view for explaining a manufacturing method of a fourth embodiment of the present invention. Fig. 7 is a schematic cross-sectional view showing a metal-clad laminate according to a fifth embodiment of the present invention.

100‧‧‧Metal laminate with metal

10‧‧‧Insulation

10a‧‧‧ first side

10b‧‧‧ second side

11‧‧‧ reinforcing materials

11a, 11b‧‧‧ vertical line

11c‧‧‧ top

11d‧‧‧Bottom

12‧‧‧ hardened material

20‧‧‧First metal layer

30‧‧‧Second metal layer

Ta1‧‧‧ interlayer thickness

Tb1‧‧‧ thickness

Claims (6)

A metal-clad laminate comprising: a first insulating layer; a conductor circuit laminated on the first insulating layer; a second insulating layer laminated on the first insulating layer and the conductor circuit; and a metal layer, laminated In the second insulating layer, the second insulating layer includes a reinforcing material and a cured product of the thermosetting resin composition impregnated with the reinforcing material, and an interlayer thickness Ta2 of the conductor circuit and the metal layer and a thickness Tb2 of the reinforcing material The relationship is: 0≦Ta2-Tb2≦2 μm, the thickness of the conductor circuit is 3 to 20 μm, the interlayer thickness Ta2 is 10 to 50 μm, and the thickness Tb2 of the reinforcing material is 8 to 50 μm. A printed wiring board comprising: a first insulating layer; a first conductor circuit laminated on the first insulating layer; a second insulating layer laminated on the first insulating layer and the first conductor circuit; and a second a conductor circuit laminated on the second insulating layer, the second insulating layer comprising a reinforcing material and a cured product of the thermosetting resin composition impregnated with the reinforcing material, and an interlayer thickness of the first conductor circuit and the second conductor circuit The relationship between Ta3 and the thickness Tb3 of the reinforcing material is 0≦Ta3-Tb3≦2 μm, the thickness of the first conductor circuit is 3 to 20 μm, the interlayer thickness Ta3 is 10 to 50 μm, and the thickness Tb3 of the reinforcing material is 8~. 50 μm. A method for manufacturing a metal-clad laminate comprising: a preparation step of preparing a core substrate having a conductor circuit on both sides or one side; and a laminating step of sequentially laminating a prepreg on a surface having the conductor circuit and a metal foil for forming a laminate; and a heat and pressure forming step of continuously supplying the laminate to a rotating pair of endless belts, and heating and press-forming the laminate between the pair of endless belts, the prepreg The body includes a reinforcing material and a thermosetting resin composition impregnated with the reinforcing material, and the relationship between the interlayer thickness Ta2 of the conductor circuit and the metal foil after the heat and pressure molding and the thickness Tb2 of the reinforcing material is: 0≦Ta2-Tb2≦ 2 μm, the thickness of the conductor circuit is 3 to 20 μm, the interlayer thickness Ta2 is 10 to 50 μm, and the thickness Tb2 of the reinforcing material is 8 to 50 μm. The method for producing a laminated metal sheet according to claim 3, wherein in the heating and press forming step, the laminate is heated from a normal temperature to a thermosetting resin at a temperature elevation rate of 3 ° C/s or more. The hardening temperature of the object. A method of producing a metal laminate according to claim 3, wherein the laminate is preheated before the heat and pressure forming step. A method of manufacturing a printed wiring board, which comprises producing a metal-clad laminate by the method according to any one of claims 3 to 5, and subjecting the metal foil to a wiring forming treatment.