TW201802279A - Conveyance apparatus capable of surely cooling an object to be conveyed while conveying the object in a vacuum atmosphere chamber - Google Patents

Conveyance apparatus capable of surely cooling an object to be conveyed while conveying the object in a vacuum atmosphere chamber Download PDF

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TW201802279A
TW201802279A TW106109375A TW106109375A TW201802279A TW 201802279 A TW201802279 A TW 201802279A TW 106109375 A TW106109375 A TW 106109375A TW 106109375 A TW106109375 A TW 106109375A TW 201802279 A TW201802279 A TW 201802279A
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Taiwan
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cooling
belt
conveying
conveyed
conveying device
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TW106109375A
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Chinese (zh)
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安田淳一
村山吉信
降矢新治
蛭間雅義
松崎淳介
高橋明久
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愛發科低溫泵股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Structure Of Belt Conveyors (AREA)

Abstract

Provided is a conveyance apparatus having a cooling structure with a simple configuration, which is capable of surely cooling an object to be conveyed while conveying the object in a vacuum atmosphere chamber. The conveyance apparatus includes: a conveyance belt (10) wound around at least two rollers (20), (30) for carrying a substrate (S) on an outer surface and advancing around. One portion of one of the portions of the conveyance belt that are positioned between the rollers and advance in opposite directions to each other is configured as an upper belt portion (Uv), and the other one of the portions is configured as a lower belt portion (Dv). The direction along which the upper belt portion and the lower belt portion are opposite to each other is configured as a vertical direction. On at least one surface of the lower surface of the upper belt portion and the upper surface and the lower surface of the lower belt portion, there is a cooling panel (40) with a length equal to or greater than the width of the conveyance belt, which is oppositely arranged in a manner of emptying out a specific interval in the vertical direction. The conveyance apparatus further includes: a cooling means (5) for cooling the cooling panel; and a gas supply means (70) for supplying an inert gas to the space (60) defined by the cooling panel and the conveyance belt.

Description

搬送裝置 Conveying device

本發明,係有關於用以在真空氛圍之腔內而一面冷卻被搬送物(主要為基板)一面進行搬送的搬送裝置。 The present invention relates to a conveying device for conveying an object to be conveyed (mainly a substrate) while cooling it in a cavity in a vacuum atmosphere.

此種搬送裝置,例如係藉由專利文獻1而為周知。此裝置,係在經由閘閥而相互連接設置之複數個的真空氛圍之腔內,將作為被搬送物之基板在被保持於托盤上的狀態下而依序作搬送,並成為藉由設置在其之搬送路徑的途中之冷卻用腔來使基板被冷卻。在冷卻用腔內,複數根之冷卻輥係在搬送方向上以特定間隔而被作並排設置,並且係與各冷卻輥分別相對峙地而並排設置有複數根的按壓輥。之後,藉由在以各冷卻輥和各按壓輥來將托盤從其之兩面而作了挾持的狀態下,旋轉驅動兩輥,托盤係被從搬送方向上游側起朝向下游側而作搬送,於此期間中,藉由起因於與冷卻輥之間的熱傳導所致的熱交換,托盤係被冷卻,其結果,基板係一面被冷卻一面被作搬送。 Such a conveying device is known, for example, from Patent Document 1. This device sequentially transfers the substrates as objects to be transported while being held on a tray in a plurality of vacuum atmosphere chambers connected to each other via a gate valve, and is installed in the chambers. The substrate is cooled by a cooling cavity in the middle of its transport path. In the cooling chamber, a plurality of cooling rollers are arranged side by side at a specific interval in the conveying direction, and a plurality of pressing rollers are arranged side by side opposite to each cooling roller. After that, with the cooling rollers and the pressing rollers holding the tray from both sides, the two rollers are driven to rotate, and the tray is conveyed from the upstream side to the downstream side in the conveying direction. During this period, the tray system is cooled by heat exchange due to heat conduction with the cooling roller, and as a result, the substrate system is transported while being cooled.

在各冷卻輥處,係分別被連接有通過冷卻手段之往路管和返路管。在托盤之搬送時,冷媒係從冷卻手 段來經由往路管而分別被供給至各冷卻輥處,冷媒係在各冷卻輥之內部通路中流動,之後,經由返路管而回到冷卻手段處。於此,在上述先前技術例之構成中,例如當作為被搬送物之基板的面積為較大的情況時,由於係能夠因應於此而將冷卻輥形成為較長乃至於亦使內部通路變長,因此係能夠將冷卻輥有效地作冷卻。然而,例如當基板之面積為較小的情況時,若是對於裝置之小型化等作考慮,則係亦必須要使冷卻輥本身作縮短。因此,係有著內部通路會變短並成為無法將冷卻輥有效地作冷卻的問題,如此一來,係會有無法將基板冷卻至特定溫度以下之虞。又,當採用了在真空氛圍之腔內而對於複數根的冷卻輥分別供給冷媒之構成的情況時,係成為需要唇型密封等的零件,而亦有著使裝置變得複雜的問題。 At each of the cooling rollers, a forward pipe and a return pipe through cooling means are connected respectively. When the pallet is transported, the refrigerant The sections are supplied to the respective cooling rollers via the return pipes, and the refrigerant flows in the internal passages of the respective cooling rollers, and then returns to the cooling means through the return pipes. Here, in the configuration of the above-mentioned prior art example, for example, when the area of the substrate to be transferred is large, the cooling roller can be made longer or even the internal passage can be changed because of this. It is long, so the cooling roller can be effectively cooled. However, for example, when the area of the substrate is small, if the miniaturization of the device is considered, the cooling roller itself must be shortened. Therefore, the system has a problem that the internal path becomes short and the cooling roller cannot be effectively cooled. As a result, the system may not be able to cool the substrate to a certain temperature or less. In addition, when a configuration in which refrigerant is supplied to a plurality of cooling rollers in a vacuum atmosphere chamber is adopted, it becomes a component that requires a lip seal or the like, and also has a problem that the device becomes complicated.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Literature]

[專利文獻1]日本特開2010-21403號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2010-21403

本發明,係有鑑於以上之點,而以提供一種能夠在真空氛圍之腔內而一面確實地冷卻被搬送物一面進行搬送的具有簡單的構成之冷卻構造之搬送裝置一事,作為課題。 The present invention has been made in view of the foregoing points, and it is an object of the present invention to provide a conveying device having a cooling structure with a simple structure capable of reliably conveying an object to be conveyed while in a cavity of a vacuum atmosphere.

為了解決上述課題,用以在真空氛圍之腔內一面冷卻被搬送物一面進行搬送之本發明之搬送裝置,其特徵為,係具備有:搬送帶,係被捲掛在至少2個的旋轉構件上,並於外表面上積載被搬送物而進行周回前進,將位置在各旋轉構件之間並相互朝向反方向而前進的搬送帶之部分中之被積載有被搬送物之其中一方的部份設為上帶部,並將另外一方的部份設為下帶部,並且將上帶部和下帶部所相互對向的方向設為上下方向,在上帶部之下面與下帶部之上下面的至少其中一面上,具備有與搬送帶之寬幅同等以上的長度之冷卻面板,係於上下方向空出有特定間隔地而被作對向配置,該搬送裝置,係更進而具備有:冷卻手段,係將冷卻面板冷卻;和氣體供給手段,係對於藉由冷卻面板和搬送帶所區劃出之空間而供給惰性氣體。 In order to solve the above-mentioned problems, the conveying device of the present invention for conveying objects while cooling the objects to be conveyed in a vacuum atmosphere chamber is characterized in that it includes a conveying belt and is wound around at least two rotating members. On the outer surface, the object to be transported is placed on the outer surface for cyclical advancement. One of the objects to be transported is stored in the part of the transport belt that is positioned between the rotating members and advances in the opposite direction to each other. Let it be the upper band part, and let the other part be the lower band part, and set the direction in which the upper band part and the lower band part oppose each other as the up-down direction, and below the upper band part and the lower band part At least one of the upper and lower surfaces is provided with a cooling panel having a length equal to or greater than the width of the conveying belt, and is arranged opposite to each other at a certain interval in the vertical direction. The conveying device further includes: The cooling means is to cool the cooling panel; and the gas supply means is to supply an inert gas to the space defined by the cooling panel and the conveying belt.

在本發明之另外一個態樣中,係具備有下述特徵:亦即是,係將2個的上述搬送裝置,以使其之上帶部相互對面的方式來作配置,並構成為在藉由兩上帶部而將被搬送物從其之上下方向而作了挾持的狀態下,使搬送帶作周回前進。 In another aspect of the present invention, it has the following features: that is, two of the above-mentioned conveying devices are arranged so that the upper belt portions thereof face each other, and are configured to borrow In a state where the object to be conveyed is held by the upper and lower belt portions from the upper and lower directions, the conveying belt is advanced forward and backward.

若依據上述構成,則搬送帶係藉由從與其相對向之冷卻面板而來的輻射,而涵蓋其之寬幅方向全長地被作冷卻,進而,被供給至空間中之惰性氣體,係藉由冷卻面板而被冷卻,藉由使此被作了冷卻的惰性氣體與搬送 帶相碰撞,來進行熱交換,藉由此,搬送帶係更進一步被冷卻。又,當被搬送物在被積載於搬送帶上的狀態下或者是在被上下一對之搬送帶所挾持的狀態下而從搬送方向上游側起朝向下游側被作搬送的期間中,如同上述一般,藉由由與被作了冷卻的搬送帶之間之熱傳導所致的熱交換,被搬送物係被有效地作冷卻。於此情況,由於在腔內係僅為以與搬送帶相對向的方式而配置冷卻面板,因此,相較於如同上述之先前技術例一般的採用對於複數根之冷卻輥而分別供給冷媒的構成者,係僅需要較簡單的裝置構成即可。於此,冷卻手段,例如,係藉由冷卻頭和具備有壓縮機、冷凝機以及膨脹閥之冷凍機本體所構成,藉由以從熱交換機所供給、循環至冷凍機本體處之冷媒來作冷卻,係能夠將包含冷卻面板之冷卻頭冷卻至特定溫度。於此情況,係僅需要將冷卻頭配置在腔內即可,而能夠將裝置構成更加簡單化。另外,搬送帶與冷卻面板之間之上下方向的間隔,係對於在將被搬送物一面冷卻一面進行搬送時之腔內的真空度(壓力)和惰性氣體(原子和分子)之平均自由行程等作考慮,而適宜設定之。 According to the above configuration, the conveying belt is cooled by radiation from the cooling panel opposite to the conveying belt over the entire width direction, and the inert gas supplied to the space is formed by The panel is cooled and cooled, and the cooled inert gas and The belts collide with each other to perform heat exchange, whereby the conveying belt is further cooled. In addition, when the object to be transported is carried on the conveyer belt or is held by the upper and lower pair of conveyer belts, the period from when it is conveyed from the upstream side to the downstream side in the conveyance direction is as described above. Generally, the object to be conveyed is effectively cooled by heat exchange due to heat conduction with the conveyed belt to be cooled. In this case, since the cooling panel is arranged only in the cavity so as to face the conveying belt, the configuration in which the cooling medium is supplied to a plurality of cooling rollers as compared with the above-mentioned prior art example is adopted. In other words, only a relatively simple device configuration is required. Here, the cooling means is constituted, for example, by a cooling head and a refrigerator body provided with a compressor, a condenser, and an expansion valve, and by using a refrigerant supplied from a heat exchanger and circulating to the refrigerator body. Cooling can cool the cooling head including the cooling panel to a specific temperature. In this case, it is only necessary to arrange the cooling head in the cavity, and the structure of the device can be simplified. In addition, the vertical distance between the conveying belt and the cooling panel is the average free stroke of the vacuum (pressure) in the cavity and the inert gas (atoms and molecules) in the cavity when the conveyed object is cooled while being conveyed. For consideration, it is appropriate to set it.

在本發明中,較理想,係具備有:氛圍分離手段,係包圍前述空間之周圍,並將該空間從腔內而作氛圍分離。若依據此,則係能夠對於搬送帶而使被作了冷卻的惰性氣體反覆作碰撞,而能夠將冷卻面板之冷卻效率提昇。又,較理想,冷卻面板,係為使其之搬送帶側之面被作黑色化加工並使其之背向搬送帶之側之面被作鏡面加工 者。若依據此,則冷卻面板自身係成為更有效率地被冷卻,而為有利。進而,較理想,前述氣體供給手段,係具備有被嵌合插入至被開設在前述冷卻面板處的孔中之氣體管。若依據此,則氣體管係藉由從冷卻面板而來的熱傳導而被作冷卻,通過其之內部的惰性氣體係在被供給至上述空間中之前而被預備性地冷卻,藉由使被作了冷卻的惰性氣體與搬送帶相碰撞,係能夠使冷卻效率作更進一步的提升。 In the present invention, it is desirable to include an atmosphere separation means for surrounding the space and separating the space from the cavity for atmosphere separation. According to this, the cooled inert gas can be repeatedly collided with the conveying belt, and the cooling efficiency of the cooling panel can be improved. Also, it is preferable that the cooling panel is blackened so that the surface on the side of the conveying belt is blackened, and the surface on the side facing away from the conveying belt is mirror-finished. By. According to this, the cooling panel itself is more efficiently cooled, which is advantageous. Furthermore, it is preferable that the gas supply means includes a gas pipe fitted into a hole opened in the cooling panel. According to this, the gas pipe system is cooled by the heat conduction from the cooling panel, and the inert gas system passing through it is preliminarily cooled before being supplied to the space, and the gas pipe system is cooled by The collision of the cooling inert gas with the conveyor belt can further improve the cooling efficiency.

TM1、TM2‧‧‧搬送裝置 TM 1 , TM 2 ‧‧‧ transport device

S‧‧‧基板(被搬送物) S‧‧‧ substrate (to be transported)

Vc‧‧‧冷卻用腔(腔) Vc‧‧‧Cooling cavity (cavity)

11、12、10‧‧‧搬送帶 1 1 , 1 2 , 10‧‧‧ transport belt

Dv‧‧‧下帶部 Dv‧‧‧ Lower Belt

Uv‧‧‧上帶部 Uv‧‧‧ Upper Belt Department

2a、3a、20‧‧‧驅動輥(旋轉構件) 2a, 3a, 20‧‧‧ drive roller (rotating member)

2b、3b、30‧‧‧被動輥(旋轉構件) 2b, 3b, 30‧‧‧ Passive roller (rotating member)

4a、4b、40‧‧‧冷卻面板 4a, 4b, 40‧‧‧ cooling panel

5‧‧‧冷凍機 5‧‧‧Freezer

6a、6b、60‧‧‧空間 6a, 6b, 60‧‧‧ space

7a、7b、70‧‧‧氣體管(氣體供給手段之構成要素) 7a, 7b, 70‧‧‧ gas pipes (components of gas supply means)

8‧‧‧金屬箔(氛圍分離手段) 8‧‧‧ Metal foil (means of atmospheric separation)

[圖1]係為對於本發明之第1實施形態之搬送裝置的構成作示意性展示之剖面圖。 [FIG. 1] A cross-sectional view schematically showing the configuration of a conveying device according to a first embodiment of the present invention.

[圖2]從圖1之Ⅱ-Ⅱ線所觀察之圖。 [Fig. 2] A diagram viewed from a line II-II in Fig. 1. [Fig.

[圖3]圖1中之以一點鍊線所包圍的部分之擴大圖。 [Fig. 3] An enlarged view of a portion surrounded by a one-point chain line in Fig. 1. [Fig.

[圖4]係為對於第1實施形態之變形例作部分性展示之重要部分立體圖。 [Fig. 4] A perspective view of an important part of a partial modification of the first embodiment.

[圖5]係為對於具備有第2實施形態之搬送裝置的成膜裝置之構成作示意性展示之剖面圖。 [FIG. 5] A cross-sectional view schematically showing a configuration of a film forming apparatus provided with a conveying apparatus according to a second embodiment.

以下,參考圖面,將被搬送物設為玻璃基板或矽晶圓等之基板S,並針對用以將此基板S在真空氛圍之腔內而一面冷卻一面進行搬送的本發明之搬送裝置之實 施形態作說明。以下,係設為以圖1中所示之姿勢而將搬送裝置作了設置者,又,基板S,係作為在圖1中從左側朝向右側來作搬送者而進行說明。 Hereinafter, referring to the drawings, the object to be conveyed is a substrate S such as a glass substrate or a silicon wafer, and the conveying device of the present invention is used for conveying the substrate S while cooling the substrate S in a vacuum atmosphere chamber. real The application form is explained. Hereinafter, a person who sets the conveying device in the posture shown in FIG. 1 will be described, and the substrate S will be described as a person who moves from the left side to the right side in FIG. 1.

參考圖1以及圖2,TM1,係為第1實施形態之搬送裝置。雖並未特別圖示,但是,搬送裝置TM1,係在經由閘閥而相互連接設置之複數個的腔內之中之位於其之搬送路徑的途中之冷卻用腔Vc處。在冷卻用腔Vc處,係被連接有真空幫浦Pu,並成為能夠真空抽氣至特定壓力且作保持。 Referring to Fig. 1 and Fig. 2, TM 1 is a transfer device according to the first embodiment. Although not particularly shown, the transfer device TM 1 is located in a cooling chamber Vc located in the middle of the transfer path among a plurality of chambers connected to each other via a gate valve. A vacuum pump Pu is connected to the cooling chamber Vc, and can be evacuated to a specific pressure and maintained.

搬送裝置TM1,係具備有將基板S從其上下兩側來作挾持並進行周回前進的上下一對之搬送帶11,12。於圖1中,位置於上側之搬送帶11,係分別被捲掛在於基板S之搬送方向上空出有特定間隔所配置的驅動輥2a和被動輥2b上,並藉由使附加設置於驅動輥2a處之馬達M1作旋轉驅動,而成為以特定之速度來進行周回前進。又,於圖1中,位置於下側之搬送帶12,亦係分別被捲掛在於上下方向而分別與驅動輥2a和被動輥2b相對峙之驅動輥3a和被動輥3b上,並藉由使附加設置於驅動輥3a處之馬達M2作旋轉驅動,而成為與搬送帶11同步地進行周回前進。於此情況,各驅動輥2a、3a和各被動輥2b、3b之旋轉軸21、31,係在冷卻用腔Vc之壁面上被作軸支撐,並於從冷卻用腔Vc而突出至外側的各驅動輥2a、3a之部分處,分別被連接有驅動馬達M1、M2。另外,例如,係亦可在各驅動輥2a、3a之旋轉軸21、31處 捲掛正時皮帶,並構成為藉由單一之馬達來同步作旋轉驅動。 The conveying device TM 1 is provided with a pair of upper and lower conveying belts 1 1 , 1 2 that hold the substrate S from both sides of the upper and lower sides and advance the cycle. In FIG. 1, the upper conveying belt 1 1 is respectively wound on the driving roller 2 a and the passive roller 2 b arranged at a certain interval in the conveying direction of the substrate S, and is additionally provided on the driving The motor M1 at the roller 2a is rotationally driven to perform the cycle forward at a specific speed. Further, in FIG. 1, a position to transfer the lower side of the conveyor belt 12, also based are wound in that the vertical direction respectively driving roller 2a and the driven roller 2b confrontation with the drive roller 3a and driven roller 3B, and by of the additional motor M2 disposed on the drive roller 3a of the rotational drive, the conveyor belt becomes for 11 weeks back in synchronization proceeds. In this case, the rotation shafts 21, 31 of each of the driving rollers 2a, 3a and each of the passive rollers 2b, 3b are supported by the shaft on the wall surface of the cooling cavity Vc, and protrude to the outside from the cooling cavity Vc. Drive motors M1 and M2 are connected to portions of the drive rollers 2a and 3a, respectively. In addition, for example, the timing belt may be wound around the rotation shafts 21 and 31 of each of the driving rollers 2a and 3a and configured to be synchronously rotated by a single motor.

作為各搬送帶11,12,係適宜選擇比熱為小而熱傳導為佳並且適於進行真空氛圍中之使用的材料,例如,係可使用0.1mm~1.2mm之範圍之厚度的鐵帶。各搬送帶11,12之寬幅,係因應於基板S之尺寸(亦即是,以成為較基板S之寬幅而更大的方式)來適宜作設定。另一方面,在各驅動輥2a、3a以及被動輥2b、3b之外表面上,係被設置有橡膠或樹脂等之熱傳導為較差(絕熱效果為高)的材料,而構成為難以使熱從驅動輥2a、3a以及被動輥2b、3b而傳導至各搬送帶11、12處。各驅動輥2a、3a以及各被動輥2b、3b之長度,係因應於各搬送帶11、12之寬幅而被適宜作設定,又,各驅動輥2a、3a以及各被動輥2b、3b之間的間隔,係因應於基板S之冷卻溫度而被適宜作設定。 As each of the conveying belts 1 1 and 1 2 , it is suitable to select a material having a small specific heat and excellent heat conduction and suitable for use in a vacuum atmosphere. For example, an iron belt having a thickness in a range of 0.1 mm to 1.2 mm can be used. Each conveyor belt 11, width 12, the system response to the size of the substrate S (i.e., the width of the substrate so as to be relatively larger and the S mode) to be set appropriately. On the other hand, the outer surfaces of each of the driving rollers 2a, 3a and the passive rollers 2b, 3b are provided with a material having poor thermal conductivity (high thermal insulation effect) such as rubber or resin, and it is difficult to make the heat from driving roller 2a, 3a and the driven roller 2b, 3b and is conducted to each of the conveyor belt 1 a, 1 2. Each of the drive rollers 2a, 3a, and each of the driven roller 2B, lengths 3b, the lines in response to each of the conveyor belt 11, width 12 of is suitable as set, and each said drive roll 2a, 3a, and each of the driven roller 2B, The interval between 3b is appropriately set according to the cooling temperature of the substrate S.

於此,將分別位置在各驅動輥2a、3a以及被動輥2b、3b處並相互朝向反方向而前進的各搬送帶11、12之部分中之挾持基板S之其中一方的部份設為上帶部Uv,並將另外一方的部份設為下帶部Dv,在冷卻用腔Vc中,係於各搬送帶11、12之下帶部Dv的上方向和下方向處分別空出有特定之間隔地而被對向配置有具備與各搬送帶11、12之寬幅同等以上的長度之冷卻面板4a、4b。在本實施形態中,冷卻面板4a、4b,係以具備有涵蓋位置於驅動輥2a、3a和被動輥2b、3b之下帶部Dv的搬送方 向之略全長之長度的方式,而被作尺寸制定。冷卻面板4a、4b,係藉由以熱傳導為佳之材質、例如以從銅或鋁所選擇的金屬或者是以此些之金屬作為主成分的合金所成的特定厚度之板材,而構成之。冷卻面板4a、4b,係如同圖3中所示一般,使其之下帶部Dv側之面41被作黑色化加工並使其之背向下帶部Dv之側之面42被作鏡面加工。又,冷卻面板4a、4b,係成為藉由冷凍機5而被冷卻至特定溫度(例如,200K)。 Thereto, respectively in the position of the driving roller 2a, 3a and the driven roller 2B, and 3b to each other at the forward face in the opposite direction of each conveyor belt 11, wherein one of the sandwiching portion 12 of the substrate S in the portion of the set the upper band portion of Uv, additional belt portion and the lower portion Dv set one, the cooling chamber in the Vc, based on the respective conveyor belt 11, the direction of the belt portion under Dv 12 and the lower directions respectively at empty of specific intervals are arranged to be provided on the respective conveyor belt 11, over width equal to the length of the cooling panel 12 of the 4a, 4b. In the present embodiment, the cooling panels 4a and 4b are dimensioned so as to include a length that covers the entire length of the belt Dv in the transport direction of the belt rollers 2a and 3a and the passive rollers 2b and 3b. Developed. The cooling panels 4a and 4b are made of a material having a good thermal conductivity, for example, a plate having a specific thickness made of a metal selected from copper or aluminum or an alloy containing these metals as a main component. The cooling panels 4a, 4b are as shown in FIG. 3, so that the surface 41 on the lower side of the belt portion Dv is blackened, and the surface 42 on the side that faces the lower side of the belt portion Dv is mirror-finished. . The cooling panels 4 a and 4 b are cooled to a specific temperature (for example, 200K) by the refrigerator 5.

冷凍機5,係藉由與冷卻面板4a、4b相接觸之冷卻頭51、和具備有省略圖示之壓縮機、冷凝機以及膨脹閥之冷凍機本體52所構成,並從圖外之熱交換機來將冷媒供給、循環至冷凍機本體52處而被作冷卻。冷凍機本體52,由於係可利用公知之構造者,因此,係將更進一步之詳細的說明作省略。在本實施形態中,係於朝向基板S之搬送方向上游側(圖1中之左側)而作了偏移的位置處,對於1枚的冷卻面板4a、4b而使1個的冷卻頭51作接觸。另外,對於冷卻面板4a、4b之冷卻頭51的接觸位置,只要是能夠在將基板S藉由搬送帶11、12而作挾持之前先將搬送帶11、12冷卻至特定溫度,則係並不特別作限定,又,係亦可因應於冷卻面板4a、4b之尺寸或基板S之冷卻溫度等,而構成為在基板S之搬送方向上作複數個的配置。 The refrigerator 5 is composed of a cooling head 51 in contact with the cooling panels 4a and 4b, and a refrigerator body 52 provided with a compressor, a condenser, and an expansion valve (not shown). The refrigerant is supplied and circulated to the refrigerator body 52 to be cooled. Since the refrigerator main body 52 can use a known structure, further detailed description is omitted. In this embodiment, it is located at a position shifted toward the upstream side (left side in FIG. 1) of the substrate S in the conveying direction, and one cooling head 51 is used for one cooling panel 4 a and 4 b. contact. In addition, 4a, 4b of the cooling headers the contact position of the cooling panel 51, as long as it can be in the substrate S by the conveyor belt 11, first transfer before 12 and for pinching the conveyor belt 11, 12 is cooled to a predetermined temperature, It is not particularly limited, and it may be configured to have a plurality of arrangements in the conveying direction of the substrate S according to the size of the cooling panels 4a, 4b, the cooling temperature of the substrate S, and the like.

在冷卻面板4a、4b之特定位置處,係分別開設有於上下方向作貫通之孔43,在孔43中,係嵌合插入 有作為對於藉由下帶部Dv和冷卻面板4a、4b所區劃出之空間6a、6b而供給惰性氣體之氣體供給手段的構成零件之氣體管7a、7b之前端部分。作為惰性氣體,係使用氦氣或氬氣等之稀有氣體或氮氣,並成為在藉由中介設置於氣體管7a、7b中之作成氣體供給手段的構成零件之質量流控制器(未圖示)來調整為特定之流量的狀態下,被供給至空間6a、6b中。 At specific positions of the cooling panels 4a and 4b, holes 43 are formed in the upper and lower directions for penetration, and the holes 43 are fitted and inserted. There are front end portions of gas pipes 7a, 7b which are constituent parts of a gas supply means for supplying inert gas to the spaces 6a, 6b defined by the lower band portion Dv and the cooling panels 4a, 4b. As the inert gas, a rare gas such as helium or argon or nitrogen is used as a mass flow controller (not shown) as a constituent part of a gas supply means provided in the gas pipes 7a and 7b through an intermediary. It is adjusted to a specific flow rate and is supplied to the spaces 6a and 6b.

於此,在如同本實施形態一般之於朝向基板S之搬送方向上游側而作了偏移的位置處對於1枚的冷卻面板4a、4b而使1個的冷卻頭51作接觸並將冷卻面板4a、4b作冷卻的情況時,依存於冷卻面板4a、4b之面積,係會有在其之面內而產生有溫度梯度的情況。因此,係於搬送帶11、12之寬幅方向略中央部處,而在朝向基板S之搬送方向下游側(亦即是,在搬送方向上之與冷卻頭51之接觸位置相反側處)作了偏移的位置處,開設有1個的孔43(於此情況,係亦可在搬送帶11、12之寬幅方向上以特定之間隔而開設複數之孔)。藉由此,若是將氣體管7a、7b之前端部分作嵌合插入並對於藉由下帶部Dv和冷卻面板4a、4b所區劃出之空間6a、6b而供給惰性氣體,則就算是對於相對性而言溫度會變得較高之從冷卻頭51之接觸位置而遠離了的區域處,也成為能夠有效地將搬送帶11、12冷卻,而為有利。另外,氣體管7a、7b所被作嵌合插入的孔43之數量或者是相對於冷卻面板4a、4b之形成位置,係並未特別作限定,而因應於與冷卻面板 4a、4b作接觸之冷卻頭51的數量和下帶部Dv之面積來適宜作設計。 Here, one cooling head 51 is brought into contact with one cooling panel 4a, 4b at a position shifted toward the upstream side in the conveying direction of the substrate S as in this embodiment, and the cooling panel is cooled. When 4a and 4b are used for cooling, depending on the area of the cooling panels 4a and 4b, there may be a temperature gradient in their surfaces. Thus, based on the conveyor belt 11, the width direction 12 of the substantially central portion, and toward the substrate S of the transport downstream side (i.e. that the contact with the cooling head 51 of a position in the conveyance direction, opposite side ) were made at a location offset 43 defines (in this case one of the holes in the conveyor belt system can also be 1 1, 1 2 of the width direction at specific intervals of a plurality of holes opened). Therefore, if the front ends of the gas pipes 7a, 7b are fitted and inserted, and the inert gas is supplied to the spaces 6a, 6b defined by the lower band portion Dv and the cooling panels 4a, 4b, in terms of the temperature becomes high at a region of the cooling head 51 from the contact position and away from it, has become possible to efficiently conveyor belt 11, 12 is cooled, and is advantageous. In addition, the number of holes 43 into which the gas pipes 7a and 7b are fitted and inserted or the positions where they are formed with respect to the cooling panels 4a and 4b are not particularly limited, and they correspond to the contact with the cooling panels 4a and 4b. The number of the cooling heads 51 and the area of the lower band portion Dv are appropriately designed.

又,下帶部部Dv和冷卻面板4a、4b之間的上下方向之間隔Ds,係因應於被供給至空間6a、6b處之惰性氣體的種類、流量而適宜作設定。亦即是,因應於惰性氣體之種類、流量,空間6a、6b之熱傳導係數係被決定,因應於此,間隔Ds係被決定。熱傳導係數,係以越大為越理想,而希望為3.0W/m2/K以上。例如,若是將惰性氣體設為Ar,並身為會使空間6a、6b之壓力成為100Pa一般之流量,則熱傳導係數係成為3.0W/m2/K。又,間隔Ds係以越小為越理想,供給至空間6a、6b中之流量,係以越大(空間6a、6b之壓力變得越高)為越理想。 The interval Ds in the vertical direction between the lower band portion Dv and the cooling panels 4a and 4b is appropriately set in accordance with the type and flow rate of the inert gas supplied to the spaces 6a and 6b. That is, depending on the type and flow rate of the inert gas, the thermal conductivity coefficients of the spaces 6a and 6b are determined, and accordingly, the interval Ds is determined. The larger the thermal conductivity, the more preferable it is, and it is desirable to be 3.0 W / m 2 / K or more. For example, if the inert gas is Ar and the flow rate is such that the pressure in the spaces 6a and 6b becomes 100 Pa, the thermal conductivity is 3.0 W / m 2 / K. The smaller the interval Ds is, the more ideal it is, and the larger the flow rate to be supplied to the spaces 6a and 6b (the higher the pressure in the spaces 6a and 6b) is, the more ideal.

若依據以上之實施形態,則搬送帶11、12係藉由從與其相對向之冷卻面板4a、4b而來的輻射,而涵蓋其之寬幅方向全長地被作冷卻,進而,被供給至空間6a、6b中之惰性氣體,係藉由冷卻面板4a、4b而被冷卻,藉由使此被作了冷卻的惰性氣體與搬送帶11、12相碰撞,來進行熱交換,藉由此,搬送帶11、12係更進一步被冷卻。又,藉由將基板S以搬送帶11、12來作挾持,基板S之上面以及下面係與搬送帶11、12作面接觸,在以此狀態而從搬送方向上游側起朝向下游側被作搬送的期間中,藉由由與被作了冷卻的搬送帶11、12之間之熱傳導所致的熱交換,基板S係從其之上下面起而被有效地作冷卻。於 此情況,由於係僅是在冷卻用腔Vc內以與搬送帶11、12相對向的方式而配置冷卻面板4a、4b,並使冷卻頭51分別與冷卻面板4a、4b作接觸,因此係能夠將裝置構成簡單化。並且,冷卻面板4a、4b,由於係為使其之搬送帶11、12側之面41被作黑色化加工並且使其之背向搬送帶11、12之側之面42被作鏡面加工者,因此,冷卻面板4a、4b自身係被更有效率地作冷卻,進而,由於在冷卻面板4a、4b之孔中係嵌合插入有氣體管7a、7b,因此,氣體管7a、7b係藉由冷卻面板4a、4b而被作冷卻,藉由此,通過氣體管7a、7b之內部的惰性氣體係在被供給至空間6a、6b中之前而被預備性地冷卻,藉由使被作了冷卻的惰性氣體與搬送帶11、12相碰撞,係能夠使冷卻效率作更進一步的提升。 If according to the above embodiment, the conveyor belt 11, 12 opposing thereto from the system by the cooling panel, 4b from the radiation 4a, and covers the entire length of the width direction thereof as being cooled, and then, is supplied to the space 6a, 6b in the inert gas system by cooling panel 4a, 4b to be cooled, so that this is made by an inert gas and cooling the conveyor belt 11, 12 collide, to exchange heat, by Thereby, the conveying belts 1 1 and 12 are further cooled. And, with the substrate S to the conveyor belt 11, 12 to be sandwiched between the above substrate S's and the following system and the conveyor belt 11, 12 for surface contact in this state from the transport from upstream side toward during transport downstream side is made of, by the heat conduction between the heat 12 to be made cooled conveyor belt 11, due to the exchange, based on the substrate S from beneath from being efficiently cooled as . In this case, since the system is only in the cooling chamber arranged at Vc cooling panel 4a, 4b and the conveyor belt 11, opposite to the manner 12, and head 51 are cooled with cooling panel 4a, 4b to make contacts, Therefore, the structure of the device can be simplified. And wherein the cooling panel 4a, 4b, since the system is a conveyor belt so that 11, 12 of the side surface 41 and allowed for the processing of black away from the conveyor belt 11, 12 of the side 42 for For mirror finishers, the cooling panels 4a and 4b themselves are cooled more efficiently. Furthermore, the gas pipes 7a and 7b are inserted into the holes of the cooling panels 4a and 4b. 7b is cooled by cooling the panels 4a, 4b, whereby the inert gas system passing through the interior of the gas pipes 7a, 7b is preliminarily cooled before being supplied into the spaces 6a, 6b, It is made an inert gas and cooled conveyor belt 11, 12 collide, so that the cooling efficiency of the system can be made further improved.

以上,雖係針對本發明之實施形態作了說明,但是,本發明,係並不被限定於上述形態。上述實施形態,雖係針對在冷卻面板4a、4b處開設孔43,並在各孔43中僅將氣體管7a、7b之前端部分作嵌合插入的構成為例來作了說明,但是,係並不被限定於此,亦可構成為從搬送帶11、12之寬幅方向其中一側或者是兩側來直接將惰性氣體導入至空間6a、6b中。進而,例如,係亦能夠以會使氣體管7a、7b之特定長度之部分與冷卻面板4a、4b之面42作接觸的方式來預先進行配管,並在將惰性氣體導入至空間6a、6b中之前,更進一步地進行預備性之冷卻。 As mentioned above, although embodiment of this invention was described, this invention is not limited to the said form. The above embodiment has been described with an example in which the holes 43 are formed in the cooling panels 4a and 4b, and only the front ends of the gas pipes 7a and 7b are inserted into each hole 43 as an example. is not limited thereto, can also be configured from the conveyor belt 11, the direction in which the width 12 of one side or both sides of the inert gas is directly introduced into the space 6a, 6b are. Furthermore, for example, the piping can be performed in advance so that a specific length of the gas pipes 7a, 7b and the face 42 of the cooling panels 4a, 4b are brought into contact, and the inert gas is introduced into the spaces 6a, 6b. Prior to this, preliminary cooling was further performed.

又,在上述實施形態中,雖係針對將11、12捲掛在驅動輥2a、3a和被動輥2b、3b之間者為例來作了說明,但是,亦能夠以在基板S被作搬送之間而恆常使基板S和搬送帶11、12作面接觸的方式,來於驅動輥2a、3a和被動輥2b、3b之間例如設置其他之輥。藉由此,在將基板S從搬送方向上游側來朝向下游側作搬送之間,從搬送帶11、12所對於基板S施加之面壓力係增加,基板S與搬送帶11、12係更為確實地作面接觸,由被作了冷卻的搬送帶11、12與基板S之間之熱傳導所致的熱交換係變得更有效率,而能夠將基板S迅速地作冷卻。又,為了從搬送帶11、12而將熱有效率地傳導至基板S處,係亦可在搬送帶11、12之與基板S之間的接觸面處,設置所謂的高熱傳導性橡膠。 Further, in the above embodiment, though for the Department, however, also possible to substrate S is 11, 12 wound around the driving roller 2a, 3a and driven roller 2B, and 3b are an example has been described, and constancy for transport between the substrate S and the conveyor belt 11, 12 for the embodiment of the contact surface to the driving roller 2a, for example, disposed between the other of the rollers 3a and the driven roller 2b, 3b. By this, the substrate S from the upstream side in the conveyance direction toward the downstream side as between conveyance from the conveyor belt 1 1, 1 2 to the surface pressure system applying the substrates S increases, the substrate S and the conveyor belt 11, 1 2 based surface contact for more reliably, is made by a cooled conveyor belt 11, between the heat 12 and the substrate S to be more efficient due to conductive heat exchange system, and the substrate S can be made quickly cool down. Further, in order from the conveyor belt 11, 12 and the heat efficiently conducted to the substrate S, the system can also be in the conveyor belt 11 at the contact surface between the substrate S, 12, is provided a so-called high thermal conductivity Sex rubber.

進而,在上述實施形態中,作為將冷卻面板4a、4b作冷卻之冷卻手段,雖係以使用冷凍機5者為例來作了說明,但是,係並不被限定於此,例如,亦可使用公知之構成的冷卻單元(Chiller unit),並從冷卻單元來使冷媒在冷卻面板中循環而將該冷卻面板4a、4b冷卻。進而,在上述實施形態中,雖係以冷卻面板4a、4b為具備有涵蓋下帶部Dv之搬送方向略全長之長度者為例來作了說明,但是,係並不被限定於此,只要是藉由具備有與各搬送帶11、12之寬幅同等以上的長度而能夠將搬送帶11、12涵蓋其之寬幅方向全長來作冷卻者,則對於其之長度係並不作限定。又,雖係針對將冷卻面板4a、4b在各 搬送帶11、12之下帶Dv的上方向和下方向處而分別空出有特定間隔地來作了對向配置者為例,來作了說明,但是,冷卻面板4a、4b之位置係並不被限定於此。例如,亦可採用在上帶部Uv和下帶部Dv之間的空間中,設置使兩面被作了黑色化加工之1枚的冷卻面板,並將上帶部Uv和下帶部Dv同時作冷卻之構成。 Furthermore, in the above-mentioned embodiment, as the cooling means for cooling the cooling panels 4a and 4b, although the description is made by using the refrigerator 5 as an example, the system is not limited to this. For example, it may be A well-known cooling unit (Chiller unit) is used, and a cooling medium is circulated from the cooling unit to the cooling panel to cool the cooling panels 4a, 4b. Furthermore, in the above-mentioned embodiment, although the cooling panels 4a and 4b are described as taking the length including the conveying direction covering the lower belt part Dv as a whole length as an example, the system is not limited to this, as long as there is provided by the respective conveyor belt 11, the conveyor belt can be at least equal to the length of the width 12 of 11, 12 covering the entire length of the width direction thereof are cooled to make, which is the length of the line and Not limited. Further, although the system for cooling panel 4a, 4b in the conveyor belt 11, the belt 12 under the direction and the lower direction Dv respectively at specific intervals in the air to an example of the configuration are made to Although the description has been given, the positions of the cooling panels 4a and 4b are not limited to this. For example, a cooling panel may be provided in the space between the upper band portion Uv and the lower band portion Dv by blackening both sides, and the upper band portion Uv and the lower band portion Dv may be used simultaneously. Cooling composition.

另外,在如同上述實施形態一般地通過在冷卻面板4a、4b處所開設之孔43來將惰性氣體供給至空間6a、6b中的情況時,被供給至空間6a、6b中之惰性氣體,係成為從冷卻面板4a、4b之外周緣部和搬送帶11、12之寬幅方向端部之間的空隙而被排出至冷卻用腔Vc內,但是,係並不被限定於此。例如,係亦可為了將冷卻面板4a、b之外周緣部與搬送帶11、12之間的上述空隙(亦即是,空間6a、6b之周圍)作包圍並將該空間6a、6b從冷卻用腔Vc而作氛圍分離,而設置氛圍分離手段。作為氛圍分離手段,例如,係如同圖4中所示一般,能夠藉由安裝在冷卻面板4a、4b之周圍的金屬箔8來構成,並設為使其之前端側一直延伸至搬送帶11、12之近旁處。藉由此,係能夠對於搬送帶11、12而使被作了冷卻的惰性氣體反覆作碰撞,而能夠將冷卻面板4a、4b之冷卻效率提昇。另外,作為氛圍分離手段,雖係以使用金屬箔8者為例來作了說明,但是,只要是不會使搬送帶之表面損傷的材質,則係並不被限定於此,例如,亦可使用在表面上施加有氟塗敷之橡膠板。 When the inert gas is supplied to the spaces 6a and 6b through the holes 43 provided in the cooling panels 4a and 4b as in the above embodiment, the inert gas supplied to the spaces 6a and 6b becomes from the cooling panel 4a, 4b outside the peripheral portion of the conveyor belt, the gap width 12 between the direction of the end portion 11 is discharged into the cavity Vc of the cooling, however, is not limited to this system. For example, in order to also based cooling panel 4a, b beyond the peripheral edge portion of the conveyor belt 11, the gap between 12 (i.e., the space 6a, 6b of the surrounding) and for enclosing the space 6a, 6b Atmosphere separation is performed from the cooling chamber Vc, and an atmosphere separation means is provided. As the means for separating the atmosphere, for example, as shown in FIG. 4, it can be constituted by a metal foil 8 installed around the cooling panels 4 a and 4 b, and the front end side can be extended to the conveying belt 1 1. , 1 2 nearby. By this, it is possible for the conveyor belt system 11, 12 is made so that the inert gas be cooled repeated collisions, it is possible to cool the panel 4a, 4b of the cooling efficiency is improved. In addition, although the description of the atmosphere separation method is made by using a metal foil 8 as an example, the material is not limited to this as long as it does not damage the surface of the conveying belt. For example, it may be Use a rubber sheet with a fluorine coating applied to the surface.

接著,參考圖5,FC,係為具備有第2實施形態之搬送裝置TM2的成膜裝置。若是針對與上述第1實施形態相同之構件、要素而附加相同的元件符號來作說明,則成膜裝置FC,係具備有能夠藉由真空幫浦Pu來進行真空抽氣之成膜用腔Vf,在成膜用腔Vf之頂版面上,係被設置有濺鍍陰極等之成膜源Fu。又,與成膜源Fu相對向地,在成膜用腔Vf之底面處,係被設置有第2實施形態之搬送裝置TM2Next, referring to FIG. 5, the FC is a film forming apparatus including a transfer apparatus TM 2 of the second embodiment. If the same components and elements as those of the first embodiment described above are added with the same element symbols for explanation, the film forming apparatus FC is provided with a film forming chamber Vf capable of performing vacuum evacuation by vacuum pump Pu. On the top surface of the film-forming cavity Vf, a film-forming source Fu such as a sputtering cathode is provided. In addition, the conveying device TM 2 of the second embodiment is installed on the bottom surface of the film-forming cavity Vf facing the film-forming source Fu.

搬送裝置TM2,係具備有積載基板S並進行周回前進的搬送帶10。搬送帶10,係分別被捲掛在於基板S之搬送方向上空出有特定間隔所配置的驅動輥20和被動輥30上,並藉由使附加設置於驅動輥20處之馬達(未圖示)作旋轉驅動,而成為以特定之速度來進行周回前進。作為搬送帶10,係使用與上述第1實施形態相同者。又,在搬送帶10之下帶部Dv的下方處,係空出有特定之間隔地而對向配置有具備與搬送帶10之寬幅同等以上的長度之冷卻面板40。作為冷卻面板40,係使用與上述第1實施形態相同者,並藉由冷凍機5而被冷卻至特定之溫度。又,在冷卻面板40之特定位置處,係分別開設有於上下方向作貫通之孔43,在孔43中,係嵌合插入有作為對於藉由下帶部Dv和冷卻面板4a、4b所區劃出之空間60而供給惰性氣體之氣體供給手段的構成零件之氣體管70之前端部分。又,在成膜用腔Vf內,係從上帶部Uv起而於上方空出有特定之間隔地來設置有具備面臨基 板S之開口90之防附著板9。 The transfer device TM 2 is provided with a transfer belt 10 on which a substrate S is stored and which is advanced in a cycle. The conveying belt 10 is wound on the driving roller 20 and the passive roller 30 which are arranged at a certain interval in the conveying direction of the substrate S, and a motor (not shown) additionally provided at the driving roller 20 is provided. It is driven to rotate, so that it advances in a cycle at a certain speed. As the conveying belt 10, the same one as the first embodiment is used. In addition, a cooling panel 40 having a length equal to or larger than the width of the conveying belt 10 is arranged opposite to the belt portion Dv below the conveying belt 10 at a specific interval. The cooling panel 40 is the same as the first embodiment described above, and is cooled to a specific temperature by the refrigerator 5. In addition, at a specific position of the cooling panel 40, holes 43 are formed in the vertical direction to penetrate therethrough. In the holes 43, the holes 43 are fitted and inserted as areas for dividing by the lower band portion Dv and the cooling panels 4a and 4b. The front end portion of the gas pipe 70 which is a component of the gas supply means which supplies the inert gas out of the space 60. In addition, in the film-forming chamber Vf, an adhesion preventing plate 9 having an opening 90 facing the substrate S is provided at a predetermined interval from the upper band portion Uv.

在對於基板S而進行成膜處理時,係於搬送方向上游側處而將基板S積載在搬送帶10上,之後使搬送帶10進行周回前進。此時,冷卻面板40係藉由冷凍機5而被作冷卻,並且係設為對於空間60而供給有惰性氣體的狀態。之後,若是基板S到達了於上下方向上而基板S會與開口90相互一致之位置處,則搬送帶10之驅動係被停止,在此狀態下,成膜源Fu係動作,特定之成膜處理係被進行。於成膜處理中,基板S係成為維持於被作了冷卻的狀態。之後,若是成膜處理結束,則搬送帶10係再度進行周回前進,已完成成膜處理之基板S係被朝向下游側作搬送,於此期間中,基板S係被冷卻。另外,係亦可構成為並不將搬送帶10之驅動停止地而在使該搬送帶10作了周回前進的狀態下來進行成膜處理。又,第2實施形態之搬送裝置TM2,就算是在已於基板S之其中一面上施加有特定之處理而無法使該面與搬送帶相接觸一般的情況中,亦可對於僅單純將基板作冷卻的情況作適用。 When the film formation process is performed on the substrate S, the substrate S is placed on the conveyance belt 10 at the upstream side in the conveyance direction, and then the conveyance belt 10 is advanced forward and backward. At this time, the cooling panel 40 is cooled by the refrigerator 5 and is in a state where an inert gas is supplied to the space 60. After that, if the substrate S reaches the position where the substrate S and the opening 90 coincide with each other in the up-down direction, the driving system of the conveying belt 10 is stopped. In this state, the film-forming source Fu system operates to specify the film formation. Processing is performed. During the film formation process, the substrate S is maintained in a cooled state. After that, if the film-forming process is completed, the conveying belt 10 series advances the cycle again, and the substrate S system that has completed the film-forming process is conveyed to the downstream side, and during this period, the substrate S system is cooled. In addition, the system may be configured to perform the film forming process without stopping the driving of the conveyance belt 10 and in a state where the conveyance belt 10 is advanced in a cycle. In addition, in the general case where the transfer device TM 2 of the second embodiment has been subjected to a specific treatment on one surface of the substrate S and the surface cannot be brought into contact with the transfer belt, it is also possible to simply transfer the substrate Applicable for cooling situations.

另外,在上述第2實施形態中,雖係針對在搬送帶10之下帶部Dv的下方處空出有特定之間隔地來將冷卻面板40作了對向配置者為例,來作了說明,但是,係並不被限定於此,亦可代替設置在下帶部Dv之下方或者是除了下帶部Dv之下方以外亦更進而在搬送帶10之上帶部Uv之下方處控制有特定之間隔地來將冷卻面板(未圖示)作對向配置。 In addition, in the second embodiment described above, the cooling panel 40 has been described as an example in which the cooling panel 40 is arranged opposite to each other with a certain interval left below the belt portion Dv under the conveying belt 10, and has been described. However, the system is not limited to this, and may be provided below the lower belt portion Dv or in addition to the lower belt portion Dv, and further controlled under the belt portion Uv above the conveying belt 10 Cooling panels (not shown) are arranged to face each other at intervals.

TM2‧‧‧搬送裝置 TM 2 ‧‧‧ Transfer Device

S‧‧‧基板(被搬送物) S‧‧‧ substrate (to be transported)

10‧‧‧搬送帶 10‧‧‧ transport belt

Dv‧‧‧下帶部 Dv‧‧‧ Lower Belt

Uv‧‧‧上帶部 Uv‧‧‧ Upper Belt Department

FC‧‧‧成膜裝置 FC‧‧‧Film forming device

Vf‧‧‧成膜用腔 Vf‧‧‧film forming cavity

Fu‧‧‧成膜源 Fu‧‧‧ Film Source

Pu‧‧‧真空幫浦 Pu‧‧‧Vacuum Pump

20‧‧‧驅動輥(旋轉構件) 20‧‧‧Drive roller (rotating member)

30‧‧‧被動輥(旋轉構件) 30‧‧‧Passive roller (rotating member)

40‧‧‧冷卻面板 40‧‧‧ cooling panel

43‧‧‧孔 43‧‧‧hole

5‧‧‧冷凍機 5‧‧‧Freezer

51‧‧‧冷卻頭 51‧‧‧cooling head

52‧‧‧冷凍機本體 52‧‧‧Freezer body

60‧‧‧空間 60‧‧‧ space

70‧‧‧氣體管(氣體供給手段之構成要素) 70‧‧‧Gas tube (component of gas supply means)

9‧‧‧防附著板 9‧‧‧Anti-adhesive plate

90‧‧‧開口 90‧‧‧ opening

Claims (5)

一種搬送裝置,係為用以在真空氛圍之腔內一面冷卻被搬送物一面進行搬送之搬送裝置,其特徵為,係具備有:搬送帶,係被捲掛在至少2個的旋轉構件上,並於外表面上積載被搬送物而進行周回前進,將位置在各旋轉構件之間並相互朝向反方向而前進的搬送帶之部分中之被積載有被搬送物之其中一方的部份設為上帶部,並將另外一方的部份設為下帶部,並且將上帶部和下帶部所相互對向的方向設為上下方向,在上帶部之下面與下帶部之上下面的至少其中一面上,具備有與搬送帶之寬幅同等以上的長度之冷卻面板,係於上下方向空出有特定間隔地而被作對向配置,該搬送裝置,係更進而具備有:冷卻手段,係將冷卻面板冷卻;和氣體供給手段,係對於藉由冷卻面板和搬送帶所區劃出之空間而供給惰性氣體。 A conveying device is a conveying device for conveying an object to be conveyed while cooling an object to be conveyed in a cavity in a vacuum atmosphere, and is characterized in that it is provided with a conveying belt which is wound on at least two rotating members, The object to be conveyed is stored on the outer surface for cyclical advancement. One of the parts of the conveying belt that is positioned between the rotating members and advances in the opposite direction to each other is set as The upper belt part, and the other part is set as the lower belt part, and the direction in which the upper belt part and the lower belt part oppose each other is set as the up and down direction, under the upper belt part and above and below the lower belt part At least one of the surfaces is provided with a cooling panel having a length equal to or greater than the width of the conveying belt. The conveying device is further provided with: Is to cool the cooling panel; and gas supply means is to supply inert gas to the space defined by the cooling panel and the conveyor belt. 一種搬送裝置,其特徵為:係將2個的如申請專利範圍第1項所記載之搬送裝置,以使其之上帶部相互對面的方式來作配置,並構成為在藉由兩上帶部而將被搬送物從其之上下方向而作了挾持的狀態下,使搬送帶作周回前進。 A conveying device characterized by arranging two conveying devices as described in item 1 of the patent application scope so that the upper belt portions thereof face each other, and is configured to pass between the two upper belts. In a state where the object to be conveyed is held from above and below, the conveying belt is moved forward and backward. 如申請專利範圍第1項或第2項所記載之搬送裝置,其中,係具備有:氛圍分離手段,係包圍前述空間之周圍,並將該空間從腔內而作氛圍分離。 The conveying device described in item 1 or 2 of the scope of the patent application, wherein the conveying device includes: an atmosphere separating means for surrounding the space and separating the space from the cavity for atmosphere separation. 如申請專利範圍第1~3項中之任一項所記載之搬送裝置,其中,前述冷卻面板,係為使其之搬送帶側之面被作黑色化加工並使其之背向搬送帶之側之面被作鏡面加工者。 The conveying device according to any one of claims 1 to 3 in the scope of the patent application, wherein the cooling panel is formed by blackening the surface of the conveying belt side and facing away from the conveying belt. The side surface is used as a mirror finisher. 如申請專利範圍第1~4項中之任一項所記載之搬送裝置,其中,前述氣體供給手段,係具備有被嵌合插入至被開設在前述冷卻面板處的孔中之氣體管。 The conveying device according to any one of claims 1 to 4, wherein the gas supply means includes a gas pipe fitted into a hole opened in the cooling panel.
TW106109375A 2016-06-13 2017-03-21 Conveyance apparatus capable of surely cooling an object to be conveyed while conveying the object in a vacuum atmosphere chamber TW201802279A (en)

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US11975922B2 (en) 2020-08-18 2024-05-07 Illinois Tool Works Inc. Hold down tray conveyor
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Family Cites Families (12)

* Cited by examiner, † Cited by third party
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JPS59143066A (en) * 1983-02-02 1984-08-16 Fuji Photo Film Co Ltd Cooling method of substrate
JP2521154Y2 (en) * 1990-08-04 1996-12-25 日本真空技術株式会社 Heat shield device for magnetic levitation transfer device in vacuum
JPH074817A (en) * 1992-12-15 1995-01-10 Taiyo Setsubi Kk Article cooling carrier device and article cooling carrier method
JP4876352B2 (en) * 2000-08-31 2012-02-15 Dic株式会社 Liquid crystal composition and liquid crystal display element
JP2005029895A (en) * 2003-07-04 2005-02-03 Agfa Gevaert Nv Vapor deposition apparatus
KR20080018465A (en) * 2006-08-24 2008-02-28 주식회사 탑 엔지니어링 Conveyor appratus of brittle material substrate
CN101889103B (en) * 2007-12-05 2011-12-28 松下电器产业株式会社 Thin film forming apparatus and thin film forming method
US20110117279A1 (en) * 2008-02-20 2011-05-19 Panasonic Corporation Thin film forming method and film forming apparatus
JP2012121715A (en) * 2010-12-10 2012-06-28 Canon Anelva Corp Transport mechanism, and vacuum treatment device using the same
US8673777B2 (en) * 2011-09-30 2014-03-18 First Solar, Inc. In-line deposition system and process for deposition of a thin film layer
JP5969506B2 (en) * 2011-12-27 2016-08-17 キヤノンアネルバ株式会社 Substrate heat treatment equipment
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