JP2017224644A - Conveying device - Google Patents

Conveying device Download PDF

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Publication number
JP2017224644A
JP2017224644A JP2016116998A JP2016116998A JP2017224644A JP 2017224644 A JP2017224644 A JP 2017224644A JP 2016116998 A JP2016116998 A JP 2016116998A JP 2016116998 A JP2016116998 A JP 2016116998A JP 2017224644 A JP2017224644 A JP 2017224644A
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Japan
Prior art keywords
cooling
belt
conveyor belt
substrate
belt portion
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JP2016116998A
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Japanese (ja)
Inventor
淳一 安田
Junichi Yasuda
淳一 安田
吉信 村山
Yoshinobu Murayama
吉信 村山
新治 降矢
Shinji Furuya
新治 降矢
雅義 蛭間
Masayoshi Hiruma
雅義 蛭間
淳介 松崎
Junsuke Matsuzaki
淳介 松崎
高橋　明久
Akihisa Takahashi
明久 高橋
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Ulvac Inc
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Ulvac Inc
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Priority to JP2016116998A priority Critical patent/JP2017224644A/en
Priority to TW106109375A priority patent/TW201802279A/en
Priority to KR1020170073179A priority patent/KR20170140780A/en
Priority to CN201710442073.XA priority patent/CN107488835A/en
Publication of JP2017224644A publication Critical patent/JP2017224644A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Abstract

PROBLEM TO BE SOLVED: To provide a conveying device having a cooling structure in simple configuration capable of conveying a conveyed object while surely cooling it within a chamber of a vacuum atmosphere.SOLUTION: A conveying device comprises a conveyor belt 10 which is wound around at least two rollers 20 and 30 and traveled in a circulating manner while loading a substrate S on an outer surface. Between portions of the conveyor belt which are positioned between the rollers and traveled reversely to each other, one portion on which the conveyed object is loaded is defined as an upper belt portion Uv, the other portion is defined as a lower belt portion Dv and a direction in which the upper belt portion and the lower belt portion face each other is defined as a vertical direction. On at least one of a bottom face of the upper belt portion and a top/bottom face of the lower belt portion, cooling panels 40 are disposed oppositely with predetermined spacing interposed in the vertical direction, the cooling panel having a length equal to or greater than a width of the conveyor belt. The conveying device further comprises: cooling means 5 for cooling the cooling panels; and gas supply means 70 for supplying an inert gas to a space 60 that is defined by the cooling panels and the conveyor belt.SELECTED DRAWING: Figure 5

Description

本発明は、真空雰囲気のチャンバ内で被搬送物（主として、基板）を冷却しながら搬送するための搬送装置に関する。   The present invention relates to a transport apparatus for transporting a transported object (mainly a substrate) while cooling it in a vacuum atmosphere chamber.

この種の搬送装置は例えば特許文献１で知られている。このものでは、ゲートバルブを介して互いに連設された複数個の真空雰囲気のチャンバ内を被搬送物としての基板がトレイに保持された状態で順次搬送され、その搬送経路の途中に設けた冷却用チャンバにて基板が冷却されるようになっている。冷却用チャンバ内には、複数本の冷却ローラが搬送方向に所定間隔で並設されると共に、各冷却ローラに夫々対峙させて複数本の押えローラが並設されている。そして、各冷却ローラと各押えローラとでトレイをその両面から挟持した状態で両ローラを回転駆動することで、搬送方向上流側から下流側に向かってトレイが搬送され、その間、冷却ローラとの熱伝導による熱交換でトレイが冷却され、結果として、基板が冷却されながら搬送される。   This type of conveying apparatus is known from Patent Document 1, for example. In this device, a substrate as a transported object is sequentially transported in a plurality of vacuum atmosphere chambers connected to each other via a gate valve while being held by a tray, and is provided in the middle of the transport path. The substrate is cooled in the chamber. In the cooling chamber, a plurality of cooling rollers are juxtaposed at a predetermined interval in the transport direction, and a plurality of pressing rollers are juxtaposed against each cooling roller. Then, by rotating both rollers in a state where the tray is sandwiched from both surfaces by each cooling roller and each presser roller, the tray is conveyed from the upstream side to the downstream side in the conveyance direction. The tray is cooled by heat exchange by heat conduction, and as a result, the substrate is conveyed while being cooled.

各冷却ローラには、冷却手段に通じる往路管と復路管とが夫々接続されている。トレイの搬送時、冷却手段から往路管を介して冷媒が各冷却ローラに夫々供給され、冷媒が各冷却ローラの内部通路を流れた後、復路管を介して冷却手段に戻るようにしている。ここで、上記従来例の構成では、例えば被搬送物としての基板の面積が比較的大きい場合、これに応じて冷却ローラを長く形成でき、ひいては、内部通路も長くなるため、冷却ローラを効果的に冷却できる。然し、例えば基板の面積が比較的小さい場合、装置の小型化等を考慮すると、冷却ローラ自体も短くせざるを得ない。このため、内部通路が短くなって冷却ローラを効果的に冷却できないという問題があり、これでは、基板を所定温度以下に冷却できない虞がある。また、真空雰囲気のチャンバ内で複数本の冷却ローラに冷媒を夫々供給する構成を採用した場合、リップシールなどの部品が必要となって装置構成が複雑になるという問題もある。   Each cooling roller is connected to an outward pipe and a return pipe that communicate with the cooling means. When the tray is transported, the coolant is supplied from the cooling means to the respective cooling rollers via the forward pipe, and after the refrigerant flows through the internal passages of the respective cooling rollers, the refrigerant is returned to the cooling means via the return pipe. Here, in the configuration of the above-described conventional example, for example, when the area of the substrate as the object to be conveyed is relatively large, the cooling roller can be formed longer accordingly, and the internal passage also becomes longer. Can be cooled. However, for example, when the area of the substrate is relatively small, the cooling roller itself must be shortened in consideration of downsizing of the apparatus. For this reason, there exists a problem that an internal channel | path becomes short and cannot cool a cooling roller effectively, and there exists a possibility that a board | substrate cannot be cooled below to predetermined temperature by this. In addition, when a configuration in which refrigerant is supplied to each of a plurality of cooling rollers in a vacuum atmosphere chamber, there is a problem that parts such as a lip seal are required and the apparatus configuration becomes complicated.

特開２０１０−２１４０３号公報JP 2010-214033 A

本発明は、以上の点に鑑み、真空雰囲気のチャンバ内で被搬送物を確実に冷却しながら搬送できる簡単な構成の冷却構造を持つ搬送装置を提供することをその課題とするものである。   In view of the above, it is an object of the present invention to provide a transfer device having a simple cooling structure that can transfer an object to be transferred in a vacuum atmosphere chamber while reliably cooling the transferred object.

上記課題を解決するために、真空雰囲気のチャンバ内で被搬送物を冷却しながら搬送するための本発明の搬送装置は、少なくとも２個の回転部材に巻き掛けられ、外表面に被搬送物を積載して周回走行される搬送ベルトを備え、各回転部材間に位置して互いに逆方向に走行される搬送ベルトの部分のうち被搬送物が積載される一方の部分を上ベルト部、他方の部分を下ベルト部、上ベルト部と下ベルト部とが向かい合う方向を上下方向として、上ベルト部の下面と下ベルト部の上下面との少なくとも一面に、上下方向に所定間隔を置いて搬送ベルトの幅と同等以上の長さを有する冷却パネルが対向配置され、冷却パネルを冷却する冷却手段と、冷却パネルと搬送ベルトとで区画される空間に不活性ガスを供給するガス供給手段とを更に備えることを特徴とする。   In order to solve the above-described problems, a transport apparatus of the present invention for transporting a transported object in a vacuum atmosphere chamber is wound around at least two rotating members, and the transported object is wound on an outer surface. A conveyor belt that travels in a circular and loaded manner is provided. Among the conveyor belt portions that run between the rotating members and run in opposite directions, one portion on which the object to be conveyed is loaded is the upper belt portion, and the other The belt is a lower belt part, and the direction in which the upper belt part and the lower belt part face each other is the vertical direction. A cooling panel having a length equal to or greater than the width of the cooling panel, and a cooling means for cooling the cooling panel; and a gas supply means for supplying an inert gas to a space defined by the cooling panel and the conveyor belt Prepare And wherein the door.

本発明の別態様においては、上記搬送装置の２個をその上ベルト部が対面するように配置し、両上ベルト部で被搬送物をその上下方向から挟持した状態で搬送ベルトが周回走行されるように構成したことを特徴とする。   In another aspect of the present invention, two of the above-described conveying devices are arranged so that the upper belt portions thereof face each other, and the conveying belt is circulated while holding the conveyed object between the upper belt portions from the vertical direction. It is configured to be configured as described above.

以上によれば、搬送ベルトがこれに対向する冷却パネルからの輻射によりその幅方向全長に亘って冷却され、これに加えて、空間に供給された不活性ガスが冷却パネルで冷却され、この冷却された不活性ガスが搬送ベルトに衝突することで熱交換により更に搬送ベルトが冷却される。そして、被搬送物が搬送ベルトに積載された状態、または、上下一対の搬送ベルトで挟持された状態で搬送方向上流側から下流側に向かって搬送される間、上記の如く、冷却された搬送ベルトとの熱伝導による熱交換で被搬送物が効果的に冷却される。この場合、チャンバ内にて搬送ベルトに対向するように冷却パネルを配置するだけであるため、上記従来例の如く、複数本の冷却ローラに冷媒を夫々供給する構成を採用するものと比較して装置構成は簡単で済む。ここで、冷却手段が、例えば、冷却ヘッドと、圧縮器、凝縮器及び膨張弁を備える冷凍機本体とで構成され、熱交換機から冷凍機本体に供給・循環された冷媒で冷却されることにより冷却パネルを含む冷却ヘッドを所定温度に冷却することができる。この場合、冷却ヘッドのみをチャンバ内に配置すればよく、より装置構成を簡素化できる。なお、搬送ベルトと冷却パネルとの上下方向における間隔は、被搬送物を冷却しながら搬送するときのチャンバ内の真空度（圧力）や不活性ガス（原子や分子）の平均自由行程等を考慮して適宜設定される。   According to the above, the conveyor belt is cooled over the entire length in the width direction by radiation from the cooling panel facing the conveyor belt, and in addition, the inert gas supplied to the space is cooled by the cooling panel. As the inert gas collides with the conveyor belt, the conveyor belt is further cooled by heat exchange. And while being transported from the upstream side to the downstream side in the transport direction with the object to be transported loaded on the transport belt or sandwiched between a pair of upper and lower transport belts, the transport cooled as described above The conveyed object is effectively cooled by heat exchange by heat conduction with the belt. In this case, since only the cooling panel is disposed so as to face the conveyor belt in the chamber, as compared with a configuration in which a refrigerant is supplied to each of a plurality of cooling rollers as in the conventional example. The device configuration is simple. Here, the cooling means includes, for example, a cooling head and a refrigerator main body including a compressor, a condenser, and an expansion valve, and is cooled by a refrigerant supplied and circulated from the heat exchanger to the refrigerator main body. The cooling head including the cooling panel can be cooled to a predetermined temperature. In this case, only the cooling head needs to be arranged in the chamber, and the apparatus configuration can be further simplified. Note that the vertical distance between the conveyor belt and the cooling panel takes into account the degree of vacuum (pressure) in the chamber and the mean free path of inert gases (atoms and molecules) when the object to be conveyed is conveyed while being cooled. And set as appropriate.

本発明においては、前記空間の周囲を囲って当該空間をチャンバ内から雰囲気分離する雰囲気分離手段を備えることが好ましい。これによれば、搬送ベルトに対して冷却された不活性ガスを繰り返し衝突させることができ、冷却パネルの冷却効率を向上することができる。また、冷却パネルは、その搬送ベルト側の面が黒色化加工され、その搬送ベルトに背向する側の面が鏡面加工されたものであることが好ましい。これによれば、冷却パネル自体がより効率よく冷却されるようになり、有利である。更に、前記ガス供給手段は、前記冷却パネルに開設した孔に嵌挿されるガス管を有することが好ましい。これによれば、ガス管が冷却パネルからの熱伝導で冷却されることにより、その内部を通る不活性ガスが上記空間に供給される前に予備的に冷却され、冷却された不活性ガスを搬送ベルトに衝突させることで、冷却効率をより一層向上させることができる。   In the present invention, it is preferable to include an atmosphere separation unit that surrounds the space and separates the space from the chamber. According to this, the inert gas cooled against the conveyor belt can be repeatedly collided, and the cooling efficiency of the cooling panel can be improved. Moreover, it is preferable that the surface on the side of the conveyance belt of the cooling panel is blackened and the surface on the side facing away from the conveyance belt is mirror-finished. This is advantageous because the cooling panel itself can be cooled more efficiently. Furthermore, it is preferable that the gas supply means has a gas pipe fitted into a hole opened in the cooling panel. According to this, the gas pipe is cooled by heat conduction from the cooling panel, so that the inert gas passing through the inside is preliminarily cooled before being supplied to the space, and the cooled inert gas is removed. By making it collide with a conveyance belt, cooling efficiency can be improved further.

本発明の第１実施形態の搬送装置の構成を模式的に示す断面図。Sectional drawing which shows typically the structure of the conveying apparatus of 1st Embodiment of this invention. 図１のＩＩ−ＩＩ線から視た図。The figure seen from the II-II line | wire of FIG. 図１の一点鎖線で囲う部分の拡大図。The enlarged view of the part enclosed with the dashed-dotted line of FIG. 第１実施形態の変形例を部分的に示す要部斜視図。The principal part perspective view which shows the modification of 1st Embodiment partially. 第２実施形態の搬送装置を備える成膜装置の構成を模式的に示す断面図。Sectional drawing which shows typically the structure of the film-forming apparatus provided with the conveying apparatus of 2nd Embodiment.

以下、図面を参照して、被搬送物をガラス基板やシリコンウエハなどの基板Ｓとし、この基板Ｓを真空雰囲気のチャンバ内で冷却しながら搬送するための本発明の搬送装置の実施形態を説明する。以下においては、図１に示す姿勢で搬送装置が設けられるものとし、また、基板Ｓは、図１中、左側から右側に向かって搬送されるものとして説明する。   Hereinafter, with reference to the drawings, an embodiment of a transport apparatus of the present invention for transporting an object to be transported as a substrate S such as a glass substrate or a silicon wafer while cooling the substrate S in a vacuum atmosphere chamber will be described. To do. In the following description, it is assumed that the transfer device is provided in the posture shown in FIG. 1, and the substrate S is transferred from the left side to the right side in FIG.

図１及び図２を参照して、ＴＭ１は、第１実施形態の搬送装置である。搬送装置ＴＭ１は、特に図示して説明しないが、ゲートバルブを介して互いに連設された複数個のチャンバ内のうちその搬送経路の途中にある冷却用チャンバＶｃに設けられている。冷却用チャンバＶｃには真空ポンプＰｕが接続され、所定圧力に真空引きして保持できるようになっている。 Referring to FIGS. 1 and 2, TM 1 is a conveying apparatus of the first embodiment. Conveying apparatus TM 1 is particularly although not shown and described, is provided in the cooling chamber Vc in the middle of the transport path of the plurality of chambers which are mutually contiguous via a gate valve. A vacuum pump Pu is connected to the cooling chamber Vc so that it can be evacuated to a predetermined pressure.

搬送装置ＴＭ１は、基板Ｓをその上下両側から挟持して周回走行される上下一対の搬送ベルト１１，１２を備える。図１中、上側に位置する搬送ベルト１１は、基板Ｓの搬送方向に所定間隔を置いて配置された駆動ローラ２ａと従動ローラ２ｂとに夫々巻き掛けられ、駆動ローラ２ａに付設したモータＭ１を回転駆動することで所定の速度で周回走行されるようになっている。図１中、下側に位置する搬送ベルト１２もまた、上下方向で駆動ローラ２ａ及び従動ローラ２ｂに夫々対峙させて配置された駆動ローラ３ａと従動ローラ３ｂとに夫々巻き掛けられ、駆動ローラ３ａに付設したモータＭ２を回転駆動することで搬送ベルト１１に同期して周回走行するようになっている。この場合、各駆動ローラ２ａ,３ａと各従動ローラ２ｂ，３ｂの回転軸２１，３１は、冷却用チャンバＶｃの壁面で軸支され、冷却用チャンバＶｃから外方に突出した各駆動ローラ２ａ，３ａの部分に駆動モータＭ１，Ｍ２が夫々連結されている。なお、例えば、各駆動ローラ２ａ，３ａの回転軸２１，３１にタイミングベルトを巻き掛け、単一のモータで同期して回転駆動するようにしてもよい。 Conveying apparatus TM 1 is provided with its upper and lower pair of upper and lower conveyor belts on both sides are orbiting travels sandwiched from 1 1, 1 2 the substrate S. In Figure 1, the conveyor belt 1 1 located on the upper side is subjected respectively wound on the driving roller 2a and the driven roller 2b disposed at predetermined intervals in the conveying direction of the substrate S, the motor M1 which is attached to the driving roller 2a Is driven to rotate at a predetermined speed. In Figure 1, also the conveyor belt 1 2 positioned on the lower side also respectively wound hung on a driving roller 3a which is arranged to be respectively opposed and the driven roller 3b to drive roller 2a and the driven roller 2b in the vertical direction, the driving roller It adapted to orbit travels synchronously with motor M2 that is attached to conveyor belt 1 1 by rotationally driving the 3a. In this case, the rotating shafts 21 and 31 of the driving rollers 2a and 3a and the driven rollers 2b and 3b are pivotally supported by the wall surface of the cooling chamber Vc and protrude outward from the cooling chamber Vc. Drive motors M1 and M2 are connected to the portion 3a. Note that, for example, a timing belt may be wound around the rotation shafts 21 and 31 of the drive rollers 2a and 3a, and the drive rollers 2a and 3a may be rotationally driven in synchronization with a single motor.

各搬送ベルト１１，１２としては、比熱が小さくて熱伝導が良く、しかも、真空雰囲気での使用に適した材料から適宜選択され、例えば、０．１ｍｍ〜１．２ｍｍの範囲の厚さのスチールベルトを用いることができる。各搬送ベルト１１，１２の幅は、基板Ｓサイズに応じて（即ち、基板Ｓの幅より大きくなるように）適宜設定される。他方、各駆動ローラ２ａ，３ａ及び従動ローラ２ｂ，３ｂの外表面には、ゴムや樹脂などの熱伝導が比較的悪い（断熱効果が高い）材料が設けられ、駆動ローラ２ａ，３ａ及び従動ローラ２ｂ，３ｂから各搬送ベルト１１，１２に熱が伝達されないようにしている。各駆動ローラ２ａ，３ａ及び各従動ローラ２ｂ，３ｂの長さは、各搬送ベルト１１，１２の幅に応じて適宜設定され、また、各駆動ローラ２ａ，３ａ及び各従動ローラ２ｂ，３ｂの間の間隔は基板Ｓの冷却温度に応じて適宜設定される。 Each of the conveyor belts 1 1 and 1 2 is appropriately selected from materials having a small specific heat and good thermal conductivity, and suitable for use in a vacuum atmosphere. For example, the thickness is in a range of 0.1 mm to 1.2 mm. Steel belts can be used. Each conveyor belt 1 1, 1 2 of the width, depending on the substrate size S (i.e., to be larger than the width of the substrate S) is appropriately set. On the other hand, the outer surfaces of the driving rollers 2a and 3a and the driven rollers 2b and 3b are provided with a material having relatively poor heat conduction (high heat insulating effect) such as rubber and resin, and the driving rollers 2a and 3a and the driven rollers. 2b, the conveyor belt 1 1, 1 2 to the heat is prevented from being transmitted from 3b. Each driving roller 2a, 3a and the length of each driven rollers 2b, 3b is set as appropriate depending on the conveyor belt 1 1, 1 2 of the width, and each driving roller 2a, 3a and the driven rollers 2b, 3b Is appropriately set according to the cooling temperature of the substrate S.

ここで、駆動ローラ２ａ，３ａ及び従動ローラ２ｂ，３ｂに夫々位置して互いに逆方向走行される各搬送ベルト１１，１２の部分のうち基板Ｓを挟持する一方の部分を上ベルト部Ｕｖ、他方の部分を下ベルト部Ｄｖとして、冷却用チャンバＶｃには、各搬送ベルト１１，１２の下ベルト部Ｄｖの上方向と下方向とに夫々所定間隔を置いて各搬送ベルト１１，１２の幅と同等以上の長さを有する冷却パネル４ａ，４ｂが対向配置されている。本実施形態では、冷却パネル４ａ，４ｂが、駆動ローラ２ａ，３ａと従動ローラ２ｂ，３ｂとの間に位置する下ベルト部Ｄｖの搬送方向略全長に亘る長さを有するように定寸されている。冷却パネル４ａ，４ｂは、熱伝導のよい材質、例えば銅やアルミニウムから選択される金属またはこれらの金属を主成分とする合金からなる所定厚さの板材で構成されている。冷却パネル４ａ，４ｂは、図３に示すように、その下ベルト部Ｄｖ側の面４１が黒色化加工され、その下ベルト部Ｄｖに背向する側の面４２が鏡面加工されている。そして、冷却パネル４ａ，４ｂが冷凍機５により所定温度（例えば、２００Ｋ）に冷却されるようになっている。 Here, the driving roller 2a, 3a and the driven roller 2b, the upper belt portion one part for holding the substrate S out of the conveyor belt 1 1, 1 2 moieties which are backward traveling each other respectively located 3b Uv the other part as a lower belt portion Dv, cooling the chamber Vc, the conveyor belt 1 1, 1 2 of the lower belt portion upper and lower directions and respectively at a predetermined interval each conveyor belt 1 1 Dv , cooling panels 4a, 4b are disposed opposite with a 1 second width equal to or greater than the length. In the present embodiment, the cooling panels 4a and 4b are sized so as to have a length over the entire length in the conveying direction of the lower belt portion Dv located between the driving rollers 2a and 3a and the driven rollers 2b and 3b. Yes. The cooling panels 4a and 4b are made of a plate having a predetermined thickness made of a material having good thermal conductivity, for example, a metal selected from copper and aluminum, or an alloy mainly composed of these metals. As shown in FIG. 3, the cooling panel 4a, 4b has a surface 41 on the lower belt portion Dv side that is blackened and a surface 42 that faces away from the lower belt portion Dv is mirror-finished. And cooling panel 4a, 4b is cooled by the refrigerator 5 to predetermined temperature (for example, 200K).

冷凍機５は、冷却パネル４ａ、４ｂに接触する冷却ヘッド５１と、図示省略の圧縮器、凝縮器及び膨張弁を備える冷凍機本体５２とで構成され、図外の熱交換機から冷凍機本体５２に冷媒が供給・循環されて冷却される。冷凍機本体５２は、公知のものが利用できるため、これ以上の詳細な説明は省略する。本実施形態では、基板Ｓの搬送方向上流側（図１中、左側）にずらした位置にて１枚の冷却パネル４ａ，４ｂに対して１個の冷却ヘッド５１を接触させている。なお、冷却パネル４ａ，４ｂに対する冷却ヘッド５１の接触位置は、基板Ｓを搬送ベルト１１，１２で挟持する前に、搬送ベルト１１，１２を所定温度に冷却できるのであれば、特に限定されるものではなく、また、冷却パネル４ａ，４ｂのサイズや基板Ｓの冷却温度等に応じて、基板Ｓの搬送方向に複数個配置するようにしてもよい。 The refrigerator 5 includes a cooling head 51 that contacts the cooling panels 4a and 4b, and a refrigerator main body 52 that includes a compressor, a condenser, and an expansion valve (not shown). The refrigerant is supplied and circulated to cool. Since the refrigerator main body 52 can utilize a well-known thing, the detailed description beyond this is abbreviate | omitted. In the present embodiment, one cooling head 51 is brought into contact with one cooling panel 4a, 4b at a position shifted to the upstream side in the transport direction of the substrate S (left side in FIG. 1). The contact position of the cooling head 51 with respect to the cooling panel 4a, 4b, prior to clamping the substrate S in the conveyor belt 1 1, 1 2, as long as it can cool the conveyor belt 1 1, 1 2 to a predetermined temperature, in particular The present invention is not limited, and a plurality of the cooling panels 4a and 4b may be arranged in the transport direction of the substrate S according to the size of the cooling panels 4a and 4b, the cooling temperature of the substrate S, and the like.

冷却パネル４ａ，４ｂの所定位置には上下方向に貫通する孔４３が夫々開設され、孔４３には、下ベルト部Ｄｖと、冷却パネル４ａ，４ｂとで区画される空間６ａ，６ｂに不活性ガスを供給するガス供給手段の構成部品としてのガス管７ａ，７ｂの先端部分が嵌挿されている。不活性ガスとしては、ヘリウムガスやアルゴンガス等の希ガスや窒素ガスが用いられ、ガス管７ａ，７ｂに介設したガス供給手段の構成部品としてのマスフローコントローラ（図示せず）で所定の流量に調整した状態で空間６ａ，６ｂに供給されるようになっている。   Holes 43 penetrating in the vertical direction are formed in predetermined positions of the cooling panels 4a and 4b, respectively, and the holes 43 are inactive in the spaces 6a and 6b defined by the lower belt portion Dv and the cooling panels 4a and 4b. The distal end portions of the gas pipes 7a and 7b as components of the gas supply means for supplying the gas are inserted. As the inert gas, a rare gas such as helium gas or argon gas or nitrogen gas is used, and a predetermined flow rate is obtained by a mass flow controller (not shown) as a component of the gas supply means provided in the gas pipes 7a and 7b. In this state, it is supplied to the spaces 6a and 6b.

ここで、本実施形態のように基板Ｓの搬送方向上流側にずらした位置にて１枚の冷却パネル４ａ，４ｂに対して１個の冷却ヘッド５１を接触させて冷却パネル４ａ，４ｂを冷却する場合、冷却パネル４ａ，４ｂの面積によっては、その面内で温度勾配がつく場合がある。そこで、搬送ベルト１１，１２の幅方向略中央部で基板Ｓの搬送方向下流側（即ち、冷却ヘッド５１の接触位置と搬送方向逆側）にずらした位置に１個の孔４３を開設している（この場合、搬送ベルト１１，１２の幅方向に所定間隔で複数の孔を開設してもよい）。これにより、ガス管７ａ，７ｂの先端部分を嵌挿して下ベルト部Ｄｖと冷却パネル４ａ，４ｂとで区画される空間６ａ，６ｂに不活性ガスを供給すれば、比較的温度が高くなる、冷却ヘッド５１の接触位置から離れた領域でも効果的に搬送ベルト１１，１２が冷却されるようになり、有利である。なお、ガス管７ａ，７ｂが嵌挿される孔４３の数や冷却パネル４ａ，４ｂに対する形成位置は特に限定されるものではなく、冷却パネル４ａ，４ｂに接触させる冷却ヘッド５１の数や下ベルト部Ｄｖの面積に応じて適宜設計される。 Here, as in the present embodiment, one cooling head 51 is brought into contact with one cooling panel 4a, 4b at a position shifted upstream in the transport direction of the substrate S to cool the cooling panels 4a, 4b. In this case, depending on the area of the cooling panels 4a and 4b, there may be a temperature gradient in the plane. Therefore, opening the conveyor belt 1 1, 1 conveying direction downstream side of the substrate S 2 in the width direction substantially central portion (i.e., the contact position to the conveying direction opposite side of the cooling head 51) one hole 43 at a position shifted in the it is (in this case, may be established a plurality of holes at predetermined intervals in the width direction of the conveyor belt 1 1, 1 2). Thereby, if the inert gas is supplied to the spaces 6a and 6b partitioned by the lower belt portion Dv and the cooling panels 4a and 4b by inserting the tip portions of the gas pipes 7a and 7b, the temperature becomes relatively high. Advantageously, the conveyor belts 1 1 and 1 2 can be effectively cooled even in a region away from the contact position of the cooling head 51. The number of holes 43 into which the gas pipes 7a and 7b are inserted and the positions where the gas pipes 7a and 7b are inserted are not particularly limited. The number of cooling heads 51 to be brought into contact with the cooling panels 4a and 4b and the lower belt portion are not particularly limited. It is designed appropriately according to the area of Dv.

また、下ベルト部Ｄｖと冷却パネル４ａ，４ｂとの間の上下方向の間隔Ｄｓは、空間６ａ，６ｂに供給される不活性ガスの種類、流量に応じて適宜設定される。つまり、不活性ガスの種類、流量で空間６ａ，６ｂの熱伝達係数が決まり、これに応じて間隔Ｄｓが決められる。熱伝達係数は大きいほどよく、３．０Ｗ／ｍ２／Ｋ以上が望ましい。例えば、不活性ガスをＡｒとし、空間６ａ，６ｂの圧力が１００Ｐａになるような流量であれば、熱伝達係数が３．０Ｗ／ｍ２／Ｋとなる。また、間隔Ｄｓは小さいほどよく、空間６ａ，６ｂに供給する流量が大きい（空間６ａ，６ｂの圧力が高くなる）ほどよい。 The vertical distance Ds between the lower belt portion Dv and the cooling panels 4a and 4b is appropriately set according to the type and flow rate of the inert gas supplied to the spaces 6a and 6b. That is, the heat transfer coefficient of the spaces 6a and 6b is determined by the type and flow rate of the inert gas, and the interval Ds is determined accordingly. The larger the heat transfer coefficient, the better, and 3.0 W / m 2 / K or more is desirable. For example, if the inert gas is Ar and the flow rate is such that the pressure in the spaces 6a and 6b is 100 Pa, the heat transfer coefficient is 3.0 W / m 2 / K. Further, the smaller the distance Ds, the better. The larger the flow rate supplied to the spaces 6a and 6b (the higher the pressure in the spaces 6a and 6b), the better.

以上の実施形態によれば、搬送ベルト１１，１２がこれに対向する冷却パネル４ａ，４ｂからの輻射によりその幅方向全長に亘って冷却され、これに加えて、空間６ａ，６ｂに供給された不活性ガスが冷却パネル４ａ，４ｂで冷却され、この冷却された不活性ガスが搬送ベルト１１，１２に衝突することで熱交換により更に搬送ベルト１１，１２が冷却される。そして、基板Ｓを搬送ベルト１１，１２で挟持することで基板Ｓの上面及び下面が搬送ベルト１１，１２と面接触し、この状態で搬送方向上流側から下流側に向かって搬送される間、冷却された搬送ベルト１１，１２との熱伝導による熱交換でその上下面から基板Ｓが効果的に冷却される。この場合、冷却用チャンバＶｃ内にて搬送ベルト１１，１２に対向するように冷却パネル４ａ，４ｂを配置すると共に、冷却パネル４ａ，４ｂに夫々冷却ヘッド５１を接触させるだけであるため、装置構成を簡素化できる。しかも、冷却パネル４ａ，４ｂは、その搬送ベルト１１，１２側の面４１が黒色化加工され、その搬送ベルト１１，１２に背向する側の面４２が鏡面加工されたものであるため、冷却パネル４ａ，４ｂ自体がより効率よく冷却され、その上、冷却パネル４ａ，４ｂの孔にガス管７ａ，７ｂを嵌挿しているため、ガス管７ａ，７ｂが冷却パネル４ａ，４ｂで冷却されることで、その内部を通る不活性ガスが空間６ａ，６ｂに供給される前に予備的に冷却され、冷却された不活性ガスを搬送ベルト１１，１２に衝突させることで、冷却効率をより一層向上させることができる。 According to the above embodiment, the conveyor belts 1 1 and 1 2 are cooled over the entire length in the width direction by radiation from the cooling panels 4a and 4b facing the conveyor belts 1 1 and 1 2 and, in addition, supplied to the spaces 6a and 6b. inert gas is cooled by the cooling panels 4a, 4b are further conveyor belt 1 1, 1 2 by heat exchange is cooled by the cooled inert gas impinges on the conveyor belt 1 1, 1 2 . Then, the substrate S conveyor belt 1 1, 1 2 conveyed upper and lower surfaces of the substrate S belt 1 1 by sandwiching in, 1 2 and in surface contact, toward the downstream side from the upstream side in this state the transport while being, the substrate S can be effectively cooled from its upper and lower surfaces in the heat exchanger by heat conduction between the cooled conveyor belt 1 1, 1 2. In this case, the cooling panels 4a and 4b are disposed so as to face the conveyor belts 1 1 and 1 2 in the cooling chamber Vc, and the cooling head 51 is merely brought into contact with the cooling panels 4a and 4b. The device configuration can be simplified. Moreover, the cooling panel 4a, 4b is intended to face 41 of the conveyor belt 1 1, 1 2 side is processed blackened surface 42 on the side facing away from its conveying belt 1 1, 1 2 is mirror-finished Therefore, the cooling panels 4a and 4b themselves are cooled more efficiently, and the gas pipes 7a and 7b are inserted into the holes of the cooling panels 4a and 4b, so that the gas pipes 7a and 7b are inserted into the cooling panels 4a and 4b. in that the cooling inert gas space 6a through its interior, is preliminarily cooled before being supplied to 6b, the cooled inert gas conveyor belt 1 1, 1 2 or be impinging on The cooling efficiency can be further improved.

以上、本発明の実施形態について説明したが、本発明は上記のものに限定されるものではない。上記実施形態は、冷却パネル４ａ，４ｂに孔４３を開設し、各孔４３にガス管７ａ，７ｂの先端部分のみを嵌挿したものを例に説明したが、これに限定されるものではなく、搬送ベルト１１，１２の幅方向一側または両側から空間６ａ，６ｂに直接不活性ガスが導入されるように構成することができる。更に、例えば、ガス管７ａ，７ｂの所定長さの部分が冷却パネル４ａ，４ｂの面４２に接触するように配管しておき、空間６ａ，６ｂに不活性ガスを導入する前に、より予備的に冷却されるようにしてもよい。 As mentioned above, although embodiment of this invention was described, this invention is not limited to said thing. Although the said embodiment opened the hole 43 in the cooling panels 4a and 4b and demonstrated what has inserted only the front-end | tip part of the gas pipes 7a and 7b in each hole 43 as an example, it is not limited to this. , can be configured to the conveyor belt 1 1, 1 2 in the width direction on one side or both sides of the space 6a, direct inert gas 6b is introduced. Further, for example, piping is performed so that portions of the predetermined lengths of the gas pipes 7a and 7b are in contact with the surfaces 42 of the cooling panels 4a and 4b, and a spare is provided before introducing the inert gas into the spaces 6a and 6b. It may be allowed to be cooled.

また、上記実施形態では、駆動ローラ２ａ，３ａと従動ローラ２ｂ，３ｂとの間に搬送ベルト１１，１２を巻き掛けたものを例に説明したが、基板Ｓが搬送される間、基板Ｓと搬送ベルト１１，１２とが常時面接触するように駆動ローラ２ａ，３ａと従動ローラ２ｂ，３ｂとの間に、例えば他のローラを設置してもよい。これにより、基板Ｓが搬送方向上流側から下流側に向かって搬送される間、基板Ｓに対して搬送ベルト１１，１２から加わる面圧が増加し、基板Ｓと搬送ベルト１１，１２とがより確実に面接触して、冷却された搬送ベルト１１，１２と基板Ｓとの熱伝導による熱交換がより効率的になり、基板Ｓを速やかに冷却することができる。また、搬送ベルト１１，１２から基板Ｓに熱を効率的に伝達するために、所謂高熱伝導性ゴムを搬送ベルト１１，１２の基板Ｓとの接触面に設けても良い。 Further, while in the above embodiment, the driving roller 2a, 3a and the driven roller 2b, has been described as an example that wound conveyor belt 1 1, 1 2 between 3b, the substrate S is transported, the substrate For example, another roller may be installed between the driving rollers 2a and 3a and the driven rollers 2b and 3b so that S and the conveyor belts 1 1 and 1 2 are always in surface contact. Thus, while the substrate S is transported toward the downstream side from the upstream side in the conveying direction, the surface pressure applied from the conveyor belt 1 1, 1 2 is increased relative to the substrate S, transported substrate S belt 1 1, 1 2 and is more reliable surface contact, heat exchange by thermal conduction between the cooled conveyor belt 1 1, 1 2 and the substrate S is more efficient, it is possible to rapidly cool the substrate S. Further, in order to transfer heat efficiently to the substrate S from the conveyor belt 1 1, 1 2, may be provided a so-called high heat conductivity rubber contact surface between the substrate S of the conveyor belt 1 1, 1 2.

更に、上記実施形態では、冷却パネル４ａ，４ｂを冷却する冷却手段として冷凍機５を用いるものを例に説明したが、これに限定されるものではなく、例えば、公知の構成のチラーユニットを用い、チラーユニットから冷却パネル内に冷媒を循環させて当該冷却パネル４ａ，４ｂを冷却するようにしてもよい。更に、上記実施形態では、冷却パネル４ａ，４ｂが、下ベルト部Ｄｖの搬送方向略全長に亘る長さを有するものを例に説明したが、これに限定されるものではなく、各搬送ベルト１１，１２の幅と同等以上の長さを有することで搬送ベルト１１，１２がその幅方向全長に亘って冷却されるものであれば、その長さは問わない。また、冷却パネル４ａ，４ｂを各搬送ベルト１１，１２の下ベルトＤｖの上方向と下方向とに夫々所定間隔を置いて対向配置したものを例に説明したが、冷却パネル４ａ，４ｂの位置はこれに限定されるものではない。例えば、上ベルト部Ｕｖと下ベルト部Ｄｖとの間の空間に、両面が黒色化加工された一枚の冷却パネルを設置し、上ベルト部Ｕｖと下ベルト部Ｄｖとを同時に冷却する構成を採用することができる。 Further, in the above-described embodiment, the example in which the refrigerator 5 is used as the cooling means for cooling the cooling panels 4a and 4b has been described as an example. However, the present invention is not limited to this. For example, a chiller unit having a known configuration is used. The cooling panels 4a and 4b may be cooled by circulating a refrigerant from the chiller unit into the cooling panel. Furthermore, in the above-described embodiment, the cooling panels 4a and 4b have been described by way of example as having the length over the substantially entire length of the lower belt portion Dv in the conveyance direction. However, the present invention is not limited to this. as long as 1, 1 conveyor belt 1 1 by having a second width equal to or greater than the length, 1 2 is cooled over its width direction entire length, no limitation on the length. The cooling panels 4a, the conveyor belt 1 1 4b, 1 2 of has been described as an example on the direction to that at a respective predetermined interval arranged to face the lower direction of the lower belt Dv, cooling panels 4a, 4b The position of is not limited to this. For example, in the space between the upper belt portion Uv and the lower belt portion Dv, a single cooling panel whose both surfaces are blackened is installed, and the upper belt portion Uv and the lower belt portion Dv are simultaneously cooled. Can be adopted.

ところで、上記実施形態のように、冷却パネル４ａ，４ｂに開設した孔４３を通して不活性ガスを空間６ａ，６ｂに供給した場合、空間６ａ，６ｂに供給された不活性ガスは、冷却パネル４ａ，４ｂの外周縁部と搬送ベルト１１，１２の幅方向端部との間の隙間から冷却用チャンバＶｃ内へと排出されることになるが、この構成に限定されるものではない。例えば、冷却パネル４ａ，ｂの外周縁部と搬送ベルト１１，１２との間の上記隙間（即ち、空間６ａ，６ｂの周囲）を囲って当該空間６ａ，６ｂを冷却用チャンバＶｃから雰囲気分離するために雰囲気分離手段を設けてもよい。雰囲気分離手段としては、例えば、図４に示すように、冷却パネル４ａ，４ｂの周囲に取り付けた金属箔８で構成することができ、その先端側が搬送ベルト１１，１２の近傍までのびるようにしている。これにより、搬送ベルト１１，１２に対して冷却された不活性ガスを繰り返し衝突させることができ、冷却パネル４ａ，４ｂの冷却効率を向上することができる。なお、雰囲気分離手段として金属箔８を用いるものを例に説明するが、搬送ベルトの表面を損傷させない材質であれば、これに限定されるものではなく、例えば、表面にフッ素コーティングを施したゴム板を用いることができる。 By the way, when the inert gas is supplied to the spaces 6a and 6b through the holes 43 provided in the cooling panels 4a and 4b as in the above embodiment, the inert gas supplied to the spaces 6a and 6b is supplied to the cooling panels 4a and 6b. conveying an outer peripheral edge belt 1 1 4b, 1 although the gap between the second end portion in the width direction to be discharged into the cooling chamber Vc, is not limited to this configuration. For example, the atmosphere cooled panels 4a, the gap between the outer periphery of the b and the conveying belt 1 1, 1 2 (i.e., the space 6a, the surrounding 6b) the space 6a encloses, 6b from the cooling chamber Vc An atmospheric separation means may be provided for separation. The atmosphere separating means, for example, as shown in FIG. 4, the cooling panel 4a, can be made of metal foil 8 attached to the periphery of the 4b, so that the distal end side extends to the vicinity of the conveyor belt 1 1, 1 2 I have to. Thus, the conveyor belt 1 1, 1 2 cooled inert gas can be repeatedly collide against the cooling panel 4a, it is possible to improve 4b cooling efficiency. In addition, although what uses the metal foil 8 as an atmosphere separation means is demonstrated to an example, if it is a material which does not damage the surface of a conveyance belt, it will not be limited to this, For example, the rubber | gum which gave the fluorine coating to the surface A plate can be used.

次に、図５参照して、ＦＣは、第２の実施形態の搬送装置ＴＭ２を備える成膜装置である。上記第１実施形態と同一の部材、要素については同一の符号を付して説明すれば、成膜装置ＦＣは、真空ポンプＰｕにより真空引き可能な成膜用チャンバＶｆを備え、成膜用チャンバＶｆの天井面には、スパッタリングカソード等の成膜源Ｆｕが設けられている。そして、成膜源Ｆｕに対向させて成膜用チャンバＶｆの底面に第２実施形態の搬送装置ＴＭ２が設けられている。 Next, with reference to FIG. 5, FC is a film-forming apparatus provided with the transfer apparatus TM2 of the second embodiment. If the same members and elements as those in the first embodiment are described with the same reference numerals, the film forming apparatus FC includes a film forming chamber Vf that can be evacuated by a vacuum pump Pu. A film forming source Fu such as a sputtering cathode is provided on the ceiling surface of Vf. The conveying apparatus TM 2 of the second embodiment is provided on the bottom surface of the film forming chamber Vf to face the film formation source Fu.

搬送装置ＴＭ２は、基板Ｓが積載されて周回走行される搬送ベルト１０を備える。搬送ベルト１０は、基板Ｓの搬送方向に所定間隔を置いて配置された駆動ローラ２０と従動ローラ３０とに夫々巻き掛けられ、駆動ローラ２０に付設したモータ（図示せず）を回転駆動することで所定の速度で周回走行される。搬送ベルト１０としては、上記第１実施形態と同一のものが用いられる。そして、搬送ベルト１０の下ベルト部Ｄｖの下方に所定間隔を置いて搬送ベルト１０の幅と同等以上の長さを有する冷却パネル４０が対向配置されている。冷却パネル４０としては、上記第１実施形態と同一のものが用いられ、冷凍機５により所定温度に冷却される。また、冷却パネル４０の所定位置には上下方向に貫通する孔４３が夫々開設され、孔４３には、下ベルト部Ｄｖと冷却パネル４ａ，４ｂとで区画される空間６０に不活性ガスを供給するガス供給手段の構成部品としてのガス管７０の先端部分が嵌挿されている。また、成膜用チャンバＶｆ内には、上ベルト部Ｕｖから上方に所定間隔を置いて基板Ｓが臨む開口９０を備えた防着板９が設けられている。 Conveying apparatus TM 2 is provided with a conveyor belt 10 on which the substrate S is circulating cars are loaded. The transport belt 10 is wound around a driving roller 20 and a driven roller 30 that are arranged at a predetermined interval in the transport direction of the substrate S, and rotationally drives a motor (not shown) attached to the driving roller 20. The vehicle travels around at a predetermined speed. As the conveyor belt 10, the same one as in the first embodiment is used. A cooling panel 40 having a length equal to or greater than the width of the conveyance belt 10 is disposed opposite to the lower belt portion Dv of the conveyance belt 10 at a predetermined interval. As the cooling panel 40, the same thing as the said 1st Embodiment is used, and it cools to predetermined temperature with the refrigerator 5. FIG. Further, holes 43 penetrating in the vertical direction are opened at predetermined positions of the cooling panel 40, and inert gas is supplied to the holes 43 in the space 60 defined by the lower belt portion Dv and the cooling panels 4a and 4b. A distal end portion of a gas pipe 70 as a component part of the gas supply means is inserted. Further, in the film formation chamber Vf, an adhesion preventing plate 9 having an opening 90 facing the substrate S is provided at a predetermined interval upward from the upper belt portion Uv.

基板Ｓに対して成膜処理するのに際しては、搬送方向上流側で搬送ベルト１０に基板Ｓが積載された後、搬送ベルト１０が周回走行させる。このとき、冷却パネル４０は冷凍機５で冷却されると共に空間６０に不活性ガスが供給された状態とする。そして、上下方向で基板Ｓと開口９０とが一致する位置に基板Ｓが到達すると、搬送ベルト１０の駆動が停止され、この状態で成膜源Ｆｕが作動して所定の成膜処理が行われる。成膜処理中、基板Ｓは冷却されたままとなる。そして、成膜処理が終了すると、搬送ベルト１０が再度周回走行され、成膜処理済みの基板Ｓが下流側へと搬送され、その間、基板Ｓは冷却される。なお、搬送ベルト１０の駆動を停止せずに、当該搬送ベルト１０が周回走行した状態で成膜処理するようにしてもよい。また、第２実施形態の搬送装置ＴＭ２は、基板Ｓの一方の面に所定の処理が既に施され、当該面に搬送ベルトを接触することができないような場合に、単に基板を冷却する場合にも適用できる。 When the film formation process is performed on the substrate S, the substrate S is loaded on the conveyance belt 10 on the upstream side in the conveyance direction, and then the conveyance belt 10 runs around. At this time, the cooling panel 40 is cooled by the refrigerator 5 and an inert gas is supplied to the space 60. When the substrate S reaches a position where the substrate S and the opening 90 coincide with each other in the vertical direction, the driving of the transport belt 10 is stopped, and in this state, the film forming source Fu is operated to perform a predetermined film forming process. . During the film forming process, the substrate S remains cooled. When the film forming process is completed, the conveyor belt 10 is circulated again and the substrate S after the film forming process is transported to the downstream side, while the substrate S is cooled. Alternatively, the film forming process may be performed in a state where the conveyor belt 10 travels around without stopping the driving of the conveyor belt 10. The transport device TM 2 of the second embodiment, one predetermined process on the surface of the substrate S is already decorated, in the case so that it can not contact the conveyor belt on the surface, a simple cooling the substrate It can also be applied to.

なお、上記第２の実施形態では、搬送ベルト１０の下ベルト部Ｄｖの下方に所定間隔を置いて冷却パネル４０を対向配置したものを例に説明したが、これに限定されるものではなく、下ベルト部Ｄｖの下方に代えてまたは下ベルト部Ｄｖの下方に加えて、搬送ベルト１０の上ベルト部Ｕｖの下方に所定間隔を置いて冷却パネル（図示せず）を対向配置することもできる。   In the second embodiment, the cooling panel 40 is disposed opposite to the lower belt portion Dv of the transport belt 10 at a predetermined interval. However, the present invention is not limited to this. Instead of the lower belt portion Dv or in addition to the lower belt portion Dv, a cooling panel (not shown) may be disposed opposite the upper belt portion Uv of the conveying belt 10 at a predetermined interval. .

ＴＭ１，ＴＭ２…搬送装置、Ｓ…基板（被搬送物）、Ｖｃ…冷却用チャンバ（チャンバ）、１１，１２，１０…搬送ベルト、Ｄｖ…下ベルト部、Ｕｖ…上ベルト部、２ａ，３ａ，２０…駆動ローラ（回転部材）、２ｂ，３ｂ，３０…従動ローラ（回転部材）、４ａ，４ｂ，４０…冷却パネル、５…冷凍機、６ａ，６ｂ，６０…空間、７ａ，７ｂ，７０…ガス管（ガス供給手段の構成要素）、８…金属箔（雰囲気分離手段）。 TM 1 , TM 2 ... transport device, S ... substrate (conveyed object), Vc ... cooling chamber (chamber), 1 1 , 1 2 , 10 ... transport belt, Dv ... lower belt part, Uv ... upper belt part, 2a, 3a, 20 ... driving roller (rotating member), 2b, 3b, 30 ... driven roller (rotating member), 4a, 4b, 40 ... cooling panel, 5 ... refrigerator, 6a, 6b, 60 ... space, 7a, 7b, 70 ... gas pipe (component of gas supply means), 8 ... metal foil (atmosphere separation means).

Claims (5)

真空雰囲気のチャンバ内で被搬送物を冷却しながら搬送するための搬送装置であって、
少なくとも２個の回転部材に巻き掛けられ、外表面に被搬送物を積載して周回走行される搬送ベルトを備え、
各回転部材間に位置して互いに逆方向に走行される搬送ベルトの部分のうち被搬送物が積載される一方の部分を上ベルト部、他方の部分を下ベルト部、上ベルト部と下ベルト部とが向かい合う方向を上下方向として、上ベルト部の下面と下ベルト部の上下面との少なくとも一面に、上下方向に所定間隔を置いて搬送ベルトの幅と同等以上の長さを有する冷却パネルが対向配置され、
冷却パネルを冷却する冷却手段と、冷却パネルと搬送ベルトとで区画される空間に不活性ガスを供給するガス供給手段とを更に備えることを特徴とする搬送装置。 A transport device for transporting an object to be transported in a vacuum atmosphere chamber,
A conveyor belt that is wound around at least two rotating members, and is loaded around the outer surface and travels around,
Of the portions of the conveyor belt that are positioned between the rotating members and run in opposite directions, one portion on which the object is loaded is the upper belt portion, the other portion is the lower belt portion, and the upper belt portion and the lower belt A cooling panel having a length equal to or greater than the width of the transport belt with a predetermined interval in the vertical direction on at least one of the lower surface of the upper belt portion and the upper and lower surfaces of the lower belt portion, with the direction facing the portion being the vertical direction Are placed facing each other,
A transport apparatus, further comprising: a cooling unit that cools the cooling panel; and a gas supply unit that supplies an inert gas to a space defined by the cooling panel and the transport belt. 請求項１記載の搬送装置の２個をその上ベルト部が対面するように配置し、両上ベルト部で被搬送物をその上下方向から挟持した状態で搬送ベルトが周回走行されるように構成したことを特徴とする搬送装置。   The two conveyor devices according to claim 1 are arranged so that the upper belt portion faces each other, and the conveyor belt is configured to run around in a state where the conveyed object is sandwiched between the upper belt portions from above and below. A conveying device characterized by that. 前記空間の周囲を囲って当該空間をチャンバ内から雰囲気分離する雰囲気分離手段を備えることを特徴とする請求項１または請求項２記載の搬送装置。   The transport apparatus according to claim 1, further comprising an atmosphere separation unit that surrounds the space and separates the space from the chamber. 前記冷却パネルは、その搬送ベルト側の面が黒色化加工され、その搬送ベルトに背向する側の面が鏡面加工されたものであることを特徴とする請求項１〜請求項３のいずれか１項に記載の搬送装置。   4. The cooling panel according to claim 1, wherein the surface on the side of the conveyor belt is blackened, and the surface facing away from the conveyor belt is mirror-finished. 5. The transport apparatus according to item 1. 前記ガス供給手段は、前記冷却パネルに開設した孔に嵌挿されるガス管を有することを特徴とする請求項１〜請求項４のいずれか１項に記載の搬送装置。   The said gas supply means has a gas pipe inserted by the hole opened in the said cooling panel, The conveying apparatus of any one of Claims 1-4 characterized by the above-mentioned.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022039922A1 (en) * 2020-08-18 2022-02-24 Illinois Tool Works Inc. Hold down tray conveyor
CN114783908A (en) * 2022-03-30 2022-07-22 深圳市冠禹半导体有限公司 Heat treatment device for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108144668A (en) * 2017-12-29 2018-06-12 明光市海春米业有限公司 A kind of cold rice device of conveying type

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440030U (en) * 1990-08-04 1992-04-06
JPH074817A (en) * 1992-12-15 1995-01-10 Taiyo Setsubi Kk Article cooling carrier device and article cooling carrier method
JP2002146356A (en) * 2000-08-31 2002-05-22 Dainippon Ink & Chem Inc Liquid crystal composition and liquid crystal display element
WO2009072242A1 (en) * 2007-12-05 2009-06-11 Panasonic Corporation Thin film forming apparatus and thin film forming method
WO2009104382A1 (en) * 2008-02-20 2009-08-27 パナソニック株式会社 Thin film forming apparatus and thin film forming method
JP2012121715A (en) * 2010-12-10 2012-06-28 Canon Anelva Corp Transport mechanism, and vacuum treatment device using the same
WO2013099063A1 (en) * 2011-12-27 2013-07-04 キヤノンアネルバ株式会社 Substrate heat treatment apparatus
JP2014101532A (en) * 2012-11-16 2014-06-05 Sumitomo Metal Mining Co Ltd Vacuum film forming apparatus and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143066A (en) * 1983-02-02 1984-08-16 Fuji Photo Film Co Ltd Cooling method of substrate
JP2005029895A (en) * 2003-07-04 2005-02-03 Agfa Gevaert Nv Vapor deposition apparatus
KR20080018465A (en) * 2006-08-24 2008-02-28 주식회사 탑 엔지니어링 Conveyor appratus of brittle material substrate
US8673777B2 (en) * 2011-09-30 2014-03-18 First Solar, Inc. In-line deposition system and process for deposition of a thin film layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0440030U (en) * 1990-08-04 1992-04-06
JPH074817A (en) * 1992-12-15 1995-01-10 Taiyo Setsubi Kk Article cooling carrier device and article cooling carrier method
JP2002146356A (en) * 2000-08-31 2002-05-22 Dainippon Ink & Chem Inc Liquid crystal composition and liquid crystal display element
WO2009072242A1 (en) * 2007-12-05 2009-06-11 Panasonic Corporation Thin film forming apparatus and thin film forming method
WO2009104382A1 (en) * 2008-02-20 2009-08-27 パナソニック株式会社 Thin film forming apparatus and thin film forming method
JP2012121715A (en) * 2010-12-10 2012-06-28 Canon Anelva Corp Transport mechanism, and vacuum treatment device using the same
WO2013099063A1 (en) * 2011-12-27 2013-07-04 キヤノンアネルバ株式会社 Substrate heat treatment apparatus
JP2014101532A (en) * 2012-11-16 2014-06-05 Sumitomo Metal Mining Co Ltd Vacuum film forming apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
東海林 篤: "光学工房 冷凍光線！？", 光学, vol. 41巻8号, JPN6020026625, August 2012 (2012-08-01), JP, pages 38 - 451, ISSN: 0004310953 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022039922A1 (en) * 2020-08-18 2022-02-24 Illinois Tool Works Inc. Hold down tray conveyor
CN114783908A (en) * 2022-03-30 2022-07-22 深圳市冠禹半导体有限公司 Heat treatment device for semiconductor device
CN114783908B (en) * 2022-03-30 2022-10-04 深圳市冠禹半导体有限公司 Heat treatment device for semiconductor device

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