KR20200135180A - Stage device and processing apparatus - Google Patents

Abstract

Provided are a stage device which can rotate a substrate while the substrate is cooled to an ultralow temperature, can be reduced in size, and can have excellent maintainability, and a processing device using the same. The stage device for holding a substrate in the processing device for processing the substrate comprises a stage, a stage rotating mechanism, and a cold heat transfer mechanism. The stage is configured to hold the substrate in a processing chamber. The stage rotating mechanism includes a rotary shaft extending downward from a center of a lower surface of the stage and a motor configured to rotate the stage via the rotary shaft. The cold heat transfer mechanism includes a cold heat transfer body which is fixedly disposed at a position spaced away from the rotary shaft below the stage and is configured to transfer cold heat of a chiller. The cold heat transfer mechanism is disposed with a gap between the cold heat transfer mechanism and the stage.

Description

Stage device and processing device {STAGE DEVICE AND PROCESSING APPARATUS}

The present disclosure relates to a stage device and a processing device.

As a processing apparatus for a substrate such as a semiconductor substrate, for example, a film forming apparatus, there is a process requiring a cryogenic temperature. For example, in order to obtain a magnetoresistive element having a high magnetoresistive ratio, a technique of forming a magnetic film in an environment of ultra-high vacuum and cryogenic temperature is known.

As a technology to cool the substrate at cryogenic temperatures and uniformly in an ultra-high vacuum environment, a stage on which the substrate is mounted is rotatably provided, and a refrigeration heater is placed in the center of the rear side of the stage with a gap with respect to the rear surface of the stage. One is known (for example, Patent Document 1). This technique uniformly cools the substrate at a cryogenic temperature by supplying cooling gas from the refrigerator to the stage via the refrigeration heater while supplying cooling gas to the gap between the rotating stage and the refrigerating heater.

Japanese Patent Publication No. 2019-016771

The present disclosure provides a stage device capable of rotating a substrate in a state of being cooled to a cryogenic temperature, and capable of miniaturization and excellent maintainability, and a processing device using the same.

A stage device according to an aspect of the present disclosure includes a stage device for holding a substrate in a processing device for processing a substrate, a stage for holding a substrate in a processing container, a rotation shaft provided to extend downward at a center of a lower surface of the stage, and A stage rotation mechanism having a motor that rotates the stage via the rotation shaft, and a refrigeration heat transfer body fixedly disposed at a position outside the rotation shaft below the stage to heat the cold heat of the refrigerator, and between the stage It has a refrigeration heat transfer mechanism provided through a gap.

According to the present disclosure, there are provided a stage device capable of rotating a substrate in a state of being cooled to a cryogenic temperature, further miniaturization, and excellent maintenance properties, and a processing device using the same.

1 is a schematic cross-sectional view showing an example of a processing apparatus including a stage apparatus according to a first embodiment.
2 is a plan view showing an example of the stage device according to the first embodiment.
3 is a schematic cross-sectional view showing an example of a processing device including a stage device according to a second embodiment.
4 is a plan view showing an example of a stage device according to a second embodiment.
5 is a plan view showing another example of the stage device according to the second embodiment.
6 is a plan view showing still another example of the stage device according to the second embodiment.
7 is a schematic cross-sectional view showing an example of a processing device including a stage device according to a third embodiment.
8 is a plan view showing an example of a stage device according to the third embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.

<First embodiment>

First, a first embodiment will be described.

[Processing device]

First, an example of a processing device including a stage device according to the first embodiment will be described. 1 is a schematic cross-sectional view showing an example of such a processing apparatus, and FIG. 2 is a plan view showing an example of a stage apparatus according to the first embodiment.

As shown in FIG. 1, the processing device 1 includes a processing container 10 that can be held in a vacuum, a target 30, and a stage device 50. In the processing apparatus 1, a magnetic film is sputtered on a semiconductor wafer (hereinafter, simply referred to as "wafer") W, which is a substrate to be processed, in an environment of ultra-high vacuum and cryogenic temperature in the processing container 10. It is configured as a possible film forming apparatus. The magnetic film is used for, for example, a tunneling magneto resistance (TMR) device.

The processing container 10 is a processing container for processing the wafer W as a substrate. An exhaust means (not shown) such as a vacuum pump capable of reducing pressure with an ultra-high vacuum is connected to the processing container 10, and the interior thereof is configured to be depressurized with an ultra-high vacuum (for example, 10 ^-5 Pa or less). . A gas supply pipe (not shown) is connected to the processing vessel 10 from the outside, and a sputter gas required for sputter deposition from the gas supply pipe (for example, argon (Ar) gas, krypton (Kr) gas, neon (Ne) gas) Rare gas or nitrogen gas) is supplied. Further, on the side wall of the processing container 10, a carry-in/out port (not shown) for the wafer W is formed, and the carry-in/out port can be opened and closed by a gate valve (not shown).

The target 30 is provided on the upper part of the processing container 10 so as to face above the wafer W held by the stage device 50. An AC voltage or a DC voltage is applied to the target 30 from a plasma generating power source (not shown). When an alternating current or direct current voltage is applied to the target 30 from the plasma generating power source while the sputter gas is introduced into the processing container 10, plasma of the sputter gas is generated in the processing container 10, and ions in the plasma are generated. By this, the target 30 is sputtered. Atoms or molecules of the sputtered target material are deposited on the surface of the wafer W held in the stage device 50. The number of targets 30 is not particularly limited, but a plurality of targets are preferred from the viewpoint of being able to form a film of different materials with one processing device 1. For example, in the case of depositing a magnetic film (a film containing a ferromagnetic material such as Ni, Fe, or Co), as the material of the target 30, for example, CoFe, FeNi, NiFeCo can be used. In addition, as the material of the target 30, a material containing other elements in these materials may be used.

[Stage device]

Next, the stage device 50 will be described in detail.

The stage device 50 holds the wafer W on the stage 52 and cools the wafer W to a cryogenic temperature through the stage 52 while rotating the stage 52 together with the wafer W.

As shown in FIG. 1, the stage device 50 includes a stage 52, a stage rotation mechanism 54, a stage lifting mechanism 56, a refrigeration heat transfer mechanism 58, and a refrigerator 60. have.

The stage 52 has a main body part forming a disk shape, an electrostatic chuck 61 provided on the upper part of the main body, and a first heat transfer part 64 provided on a lower surface of the main body part. The main body portion and the first heat transfer portion 64 of the stage 52 are made of a material having high thermal conductivity, such as pure copper (Cu). The electrostatic chuck 61 is made of a dielectric film, and a chuck electrode 62 is embedded therein. The chuck electrode 62 is connected to a DC power supply (not shown) via wiring, and the wafer W is electrostatically sucked by applying a DC voltage to the chuck electrode 62. Further, a heater 63 is embedded in the stage 52. The heater 63 is connected to a heater power supply (not shown) via wiring, and is capable of heating the stage 52 by being fed to the heater 63. A convex portion 64a is formed on the lower surface of the first heat transfer portion 64 in a concentric shape with respect to the center of the stage 52. The first heat transfer part 64 has a cylindrical part 64b on the outermost circumference. In addition, the stage 52 is provided with a temperature sensor (not shown) that measures the temperature of the stage 52.

The stage rotation mechanism 54 is for rotating the stage 52, and a rotation shaft 70 extending downward from the center of the lower surface of the stage 52 and a motor rotating the stage 52 via the rotation shaft 70 ( 71). The rotation shaft 70 is connected via an insulating member 72 to a protrusion 64c protruding downward from the center of the lower surface of the first heat transfer part 64. The motor 71 is configured as, for example, a direct drive motor that directly drives the rotation shaft 70 without using a deceleration mechanism or the like. Bearings 73 for the rotating shaft 70 are provided above and below the motor 71. Driving units such as the motor 71 and bearing 73 are accommodated in the housing 74.

Inside the rotating shaft 70, a heat transfer gas flow path 75 for supplying heat transfer gas to the back surface of the wafer W is provided. The heat transfer gas flow path 75 passes through the insulating member 72 and the stage 52 and reaches the surface of the stage 52. The heat transfer gas is supplied from a gas supply source (not shown) to the rear surface of the wafer W through the heat transfer gas flow path 75. As the heat transfer gas, it is preferable to use He gas having high thermal conductivity. In addition, the chuck electrode 62 and the heater wiring are provided inside the rotation shaft 70.

The stage lifting mechanism 56 passes the plate 91 to the stage 52, the transfer position when the wafer W is mounted on the stage 52, and the wafer W mounted on the stage 52. It is movable between processing positions when performing film formation. The conveying position is set at a position lower than the processing position. Moreover, the distance between the target 30 and the wafer W can be controlled by the stage lifting mechanism 56.

The refrigeration heat transfer mechanism 58 is for transferring cold heat from the refrigerator 60 to the stage 52 and is provided with a gap therebetween. The refrigeration heat transfer mechanism 58 includes a refrigeration heat transfer body 65 and a second heat transfer part (stage side heat transfer part) 66. As shown in FIG. 2, the refrigeration heat transfer body 65 has a cylindrical shape, and is fixedly arranged in an eccentric state at a position below the stage 52 and outside of the rotation shaft 70. The second heat transfer unit 66 is connected on the refrigeration heat transfer body 65 and is for transferring the cold heat reaching the refrigeration heat transfer body 65 to the stage 52 through the cooling gas supplied to the gap. The refrigeration heat transfer body 65 and the second heat transfer part 66 are formed of a material having high thermal conductivity, such as pure copper (Cu), in order to efficiently heat the cold heat of the refrigerator 60. The refrigerator 60 functions as at least part of a cooling fluid supply mechanism.

The refrigerator 60 is mounted on the base plate 92, holds the refrigeration heat transfer body 65, and cools the refrigeration heat transfer body 65. The refrigerator 60 cools the upper surface of the refrigeration heat transfer mechanism 58 (that is, the upper surface of the second heat transfer unit 66) to a cryogenic temperature (for example, -20°C or less). The refrigerator 60 has a cold head portion at an upper portion, and cold heat is transferred from the cold head portion to the refrigerating heater 65. The refrigerator 60 is preferably of a type using a GM (Gifford-McMahon) cycle from the viewpoint of cooling capacity. When forming the magnetic film used for the TMR element, the cooling temperature of the stage 52 that has passed through the refrigeration and heat transfer mechanism 58 by the refrigerator 60 is preferably in the range of -23°C to -223°C (250K to 500K). .

Further, by driving the refrigeration cycle of the refrigerator 60 to the stationary cycle, the heating mode can be set. During maintenance, etc., by setting the refrigerator 60 to the heating mode, it is possible to heat the stage 52 via the refrigeration heat transfer mechanism 58 to return to room temperature. At this time, by heating the stage 52 by the heater 63, the stage 52 can be returned to room temperature more quickly.

A heat insulating structure 59 is provided on the outer periphery of the refrigeration heat transfer body 65. The heat insulating structure 59 has, for example, a vacuum heat insulating structure (vacuum double tube structure) with a vacuum inside. The heat insulation structure 59 can suppress a decrease in the cooling performance of the refrigeration heat transfer body 65.

The second heat transfer part 66 of the refrigeration heat transfer mechanism 58 is provided corresponding to the stage 52 (the first heat transfer part 64), and has a hole 66a through which the rotation shaft 70 is inserted. It forms a torus. The second heat transfer part 66 has a size substantially corresponding to that of the first heat transfer part 64 and is configured to be slightly smaller than the first heat transfer part 64. An unevenness corresponding to the unevenness of the first heat transfer part 64 is formed on the upper surface of the second heat transfer part 66, and both are arranged with a gap. That is, the concentric concave portion 66b corresponding to the concentric convex portion 64a of the first heat transfer portion 64 is formed in the second heat transfer portion 66, and the convex portion 64a and the concave portion Reference numeral 66b is fitted with a gap G of 2 mm or less, for example, and constitutes a heat exchanger portion forming a comb tooth shape.

A cooling gas supply path 76 through which cooling gas can flow is formed in the center of the refrigeration heat transfer body 65, and the cooling gas supply path 76 extends through the second heat transfer part 66. In addition, the cooling gas supplied from a gas supply source (not shown) is supplied to the gap G through the cooling gas supply path 76, and the cold heat of the refrigerator 60 transfers the refrigeration heat transfer mechanism 58 and the cooling gas. After that, heat is transferred to the stage 52, and the stage 52 is cooled to a cryogenic temperature. In this way, since the stage 52 is cooled via the cooling gas, the stage 52 can be rotated.

At this time, since the gap G is bent in the shape of a comb in the heat exchange part, it is possible to increase the heat transfer efficiency by the cooling gas between the first heat transfer part 64 and the second heat transfer part 66. The shape and number of the convex portions 64a and the concave portions 66b are appropriately set so that appropriate heat exchange is performed. The height of the concave portion 66b may be the same as that of the convex portion 64a, and may be, for example, 40 mm to 50 mm. The width of the concave portion 66b may be slightly wider than that of the convex portion 64a, and may be, for example, 7 mm to 9 mm.

The convex portion 64a and the concave portion 66b can have a shape forming a wave shape. Further, the surfaces of the convex portion 64a and the concave portion 66b may be subjected to uneven processing by blasting or the like. Thereby, the surface area for heat transfer can be increased, and heat transfer efficiency can be improved more.

In addition, as a means for rotatably cooling the stage 52, in addition to using a cooling gas as described above, a liquid refrigerant such as antifreeze may be used, and a thermally conductive lubricating oil having good thermal conductivity is filled in the gap G. You may do it.

The refrigeration heat transfer body 65 and the second heat transfer part 66 of the refrigeration heat transfer mechanism 58 may be integrally formed, or may be formed into separate bodies and joined together.

The refrigeration and heat transfer mechanism 58 is supported by the fixed frame 80. In addition, a cover member 77 extending downwardly and forming a cylindrical shape is mounted on the outer lower end of the cylindrical portion 64b of the first heat transfer portion 64, and the cover member 77 is mounted as the stage 52 rotates. ) Is also supposed to rotate. The cover member 77 is provided so as to cover the upper portions of the second heat transfer part 66 and the refrigeration heat transfer body 65.

The fixing frame 80 has a cylindrical portion 80a facing the inside of the cover member 77, and between the rotatable cover member 77 and the cylindrical portion 80a of the fixing frame 80, a magnetic fluid seal 81 ) Is provided. Further, heaters 82a and 82b for heating the magnetic fluid seal 81 are provided in the vicinity of the magnetic fluid seal 81. In addition, a magnetic fluid seal 83 is also provided between the rotating shaft 70 and the fixed frame 80, and a heater 84 for heating the magnetic fluid seal 83 is provided in the vicinity of the magnetic fluid seal 83. . In a state where the cover member 77 and the fixed frame 80 and between the rotating shaft 70 and the fixed frame 80 are airtightly sealed by the magnetic fluid seals 81 and 83, the stage via the rotating shaft 70 (52) can be rotated. Further, the magnetic fluid seals 81 and 83 can be heated by the heaters 82a, 82b, 84, so that a decrease in sealing performance or condensation due to a decrease in the temperature of the magnetic fluid can be suppressed.

Between the second heat transfer part 66 and the protrusion 64c of the first heat transfer part 64, and between the second heat transfer part 66 and the cylindrical part 64b of the first heat transfer part 64, respectively, a sealing member (85 and 86) are provided. The leakage of the cooling gas from the gap G is prevented by the sealing members 85 and 86.

In addition, a heat insulating member 87 is provided on the back side of the second heat transfer section 66, so that the release of cold heat from the second heat transfer section 66 is suppressed.

Between the plate 91 and the lower surface of the processing container 10, a bellows 88, which is a corrugated box structure made of metal that can expand and contract in the vertical direction, is provided. Further, a bellows 89 is similarly provided between the base plate 92 and the lower surface of the processing container 10. The bellows 88 and 89 have a function of separating a vacuum-held space communicating with the processing container 10 and an atmospheric atmosphere.

In Fig. 1, for convenience, the portion rotated by the stage rotating mechanism 54 and the rotating shaft 70 are indicated with dots.

[Operation of processing unit and stage unit]

In the processing apparatus 1, the refrigerator 60 of the stage apparatus 50 is operated with the inside of the processing container 10 in a vacuum state. Further, a cooling gas (for example, He gas) is supplied to the gap G via the cooling gas flow path 76. Thereby, the stage 52 is held at a cryogenic temperature of -20°C or less by the cold heat transferred from the refrigerator 60 held at the cryogenic temperature to the refrigerating heat transfer mechanism 58. More specifically, the cold heat transferred from the refrigerator 60 to the second heat transfer unit 66 through the refrigeration heat transfer body 65 is transferred to the stage 52 via the cooling gas in the gap G, and the stage 52 ) Is held at cryogenic temperatures below -20℃.

Then, the stage 52 is moved (lowered) to the transfer position by the stage lifting mechanism 56, and the wafer W is transferred from the vacuum transfer chamber into the processing container 10 by a transfer device (all not shown). It conveys and mounts on the stage 52. Next, a DC voltage is applied to the chuck electrode 62, and the wafer W is electrostatically sucked by the electrostatic chuck 61. In addition, a heat transfer gas (for example, He gas) is supplied to the rear surface of the wafer W through a heat transfer gas flow path 75 to the rear surface of the wafer W, and the wafer W is also -20°C like the stage 52 It is regarded as the following cryogenic temperatures.

After that, the stage 52 is raised to the processing position, and the film forming process is performed while rotating the stage 52 held at a cryogenic temperature.

By the way, the technique of cooling while rotating the stage via the cooling gas supplied to the gap formed in the gap formed between the refrigeration heat transfer body and the stage by transferring the cold heat of the refrigerator through the refrigeration heat transfer body is described in Patent Document 1.

However, in the technique of Patent Document 1, since the refrigeration heat transfer body is provided in the center of the stage and the stage rotation mechanism is provided around the refrigeration heat transfer body, the stage rotation mechanism is large and the motor becomes large. In addition, the presence of the stage rotation mechanism prevents the refrigerator from being placed close to the stage, the refrigeration heat transfer body becomes larger (longer), and the refrigerator is also required to be larger. In addition, since the stage rotation mechanism is provided around the refrigeration heat transfer body, the maintainability is also poor.

In contrast, in the present embodiment, a rotation shaft 70 extending downward from the center of the lower surface of the stage 52 is provided, and the stage is rotated through the rotation shaft 70 by the motor 71, and 65 was provided at a position outside the rotation shaft 70 below the stage 52.

Thereby, the rotation shaft 70 can be provided in the center of the stage 52, and the motor 71 can be provided in the vicinity of the rotation shaft, without considering the position of the refrigeration heat transfer body 65. For this reason, a small motor 71 can be used. In addition, since the rotation mechanism 54 and the refrigeration heat transfer body 65 are separated in this manner, the refrigerator 60 can be disposed at a desired position without considering the stage rotation mechanism 54. For this reason, the refrigerator 60 can be arranged above the motor 71, and the length of the refrigeration heat transfer body 65 can be shortened. In addition, since the length of the refrigeration heater 65 can be shortened, the refrigerator 60 can also be downsized. Accordingly, the entire stage device 50 can be downsized. In addition, since the stage rotation mechanism 54 and the refrigeration heat transfer member 65 are provided separately, the attachment and detachment of the parts of the stage rotation mechanism 54 and the refrigeration heat transfer mechanism 58 becomes easy, and maintainability is improved. .

In addition, when the refrigeration heat transfer body 65 is provided in the center of the stage 52 as in Patent Document 1, the temperature distribution of the refrigeration heat transfer body 65 and the second heat transfer part 66 remains the same as the stage 52 and the wafer. It is easy to be transferred to (W), and distribution of concentric circles is easy. On the other hand, in this embodiment, since the refrigeration heat transfer body 65 is provided at a position eccentric from the center of the stage 52, the temperature distribution is averaged by the rotation of the stage 52 and the stage 52 and the wafer W The temperature distribution of) can be made more uniform.

In addition, in this embodiment, since the refrigeration heat transfer mechanism 58 has the second heat transfer section 66 provided to correspond to the stage 52, heat exchangeability through the refrigeration heat transfer mechanism 58 and the cooling gas of the stage 52 This increases, and the stage 52 can be cooled efficiently. In particular, the convex portion 64a of the first heat transfer portion 64 of the stage 52 and the concave portion 66b of the second heat transfer portion 66 of the refrigeration heat transfer mechanism 58 constitute a heat exchanger forming a comb tooth shape. Thus, since the cooling gas is supplied to the curved gap G, cooling efficiency can be further improved.

In addition, since the refrigeration heating element 65 can be miniaturized (shortened), the operation of returning the stage 52 to room temperature via the refrigeration heat transfer mechanism 58 by placing the refrigerator 60 in the heating mode during maintenance is short time. Can be executed, and the maintenance time can be shortened. In addition to this, since the stage 52 can be directly heated by the heater 63, the maintenance time can be further shortened.

<Second Embodiment>

Next, a second embodiment will be described.

3 is a schematic cross-sectional view showing an example of a processing apparatus including a stage apparatus according to a second embodiment, and FIG. 4 is a plan view showing an example of a stage apparatus according to the second embodiment.

The stage device 50' of this embodiment has a plurality of refrigeration heat transfer elements 65 (two in this example) instead of the refrigeration heat transfer mechanism 58 of the first embodiment, and the plurality of refrigeration heat transfer elements 65 Is provided with a refrigeration heat transfer mechanism 58 ′ having a structure connected to the second heat transfer unit 66. A plurality of refrigerators 60 are provided corresponding to the plurality of refrigeration heat transfer elements 65. However, for the plurality of refrigeration heat transfer elements 65, a common refrigerator may be provided. Configurations other than the stage device 50' are the same as those of the stage device 50 of the first embodiment.

In this embodiment, since the refrigeration heat transfer body 65 forming a column shape is provided below the stage 52, the refrigeration heat transfer mechanism 58 ′ has a plurality of the refrigeration heat transfer body 65, but the first embodiment The footprint from the refrigeration and heat transfer mechanism 58 of the form does not increase. For this reason, the stage device 50' can realize downsizing, similar to the stage device 50 of the first embodiment. Moreover, even if a plurality of refrigeration heat transfer bodies 65 are provided, the maintenance property is good. For this reason, according to the stage device 50' of this embodiment, the cooling effect of the stage 52 can be improved by the number of the refrigeration heat transfer bodies 65 as it keeps miniaturization and good maintainability.

In particular, in the case of cooling the stage 52 to a cryogenic temperature such as -23°C to -223°C (250K to 50K) via a cooling gas, as in the present embodiment, the cylindrical refrigeration heating element 65 is It is effective to enhance cooling by arranging a plurality of them.

In Fig. 4, as the refrigeration heat transfer mechanism 58', it is illustrated that the number of refrigeration heat transfer elements 65 forming a column shape is two. It is not limited, and any number that can be accommodated under the stage 52 may be sufficient. 5 shows an example in which four refrigeration heat transfer elements 65 are disposed. In Figs. 4 and 5, a plurality of refrigeration heat transfer elements 65 are equally provided, but as shown in Fig. 6, a plurality of refrigeration heat transfer elements 65 may be unevenly distributed.

<Third embodiment>

Next, a third embodiment will be described.

Fig. 7 is a schematic cross-sectional view showing an example of a processing device including a stage device according to the third embodiment, and Fig. 8 is a plan view showing an example of the stage device according to the third embodiment.

The stage mechanism 150 of this embodiment has a cylindrical refrigeration heat transfer body 165 in place of the refrigeration heat transfer mechanism 58 of the first embodiment, and the refrigeration heat transfer body 165 is connected to the second heat transfer part 66 It is provided with a refrigeration heat transfer mechanism 158 having a structured. The refrigeration heat transfer body 165 is fixedly arranged to surround the rotation shaft 70 and, like the refrigeration heat transfer body 65, is made of a material having high thermal conductivity such as pure copper (Cu).

The refrigeration heat transfer body 165 is connected to the refrigerator 60 similar to the first embodiment via a connection member 161 formed of a material having high thermal conductivity, such as pure copper (Cu). The connection member 161 is supported by the base plate 191.

A cooling gas supply path 176 through which the cooling gas can flow is formed in the refrigeration heat transfer body 165, and the cooling gas supply path 176 extends through the second heat transfer part 66. And, the cooling gas supplied from a gas supply source (not shown) is supplied to the gap G through the cooling gas supply path 176, and the cold heat of the refrigerator 60 passes through the refrigeration heat transfer mechanism 158 and the cooling gas. Heat is transferred to the stage 52, and the stage 52 is cooled to a cryogenic temperature.

The refrigeration and heat transfer mechanism 158 is supported by the fixed frame 180. In addition, a cover member 177 extending downwardly and forming a cylindrical shape having a step is mounted at the outer lower end of the cylindrical portion 64b of the first heat transfer unit 64, and the cover member is mounted as the stage 52 rotates. (177) is also supposed to rotate. The cover member 177 is provided so as to cover the upper portions of the second heat transfer part 66 and the refrigeration heat transfer body 165. The cover member 177 has a large diameter portion on the upper side and a small diameter portion on the lower side. A heat insulation structure 159 is provided on the outer periphery of the refrigeration heat transfer body 165. Further, a heat insulating member 187 is provided on the rear surface of the second heat transfer member 66.

A magnetic fluid seal 181 is provided between the fixed frame 180 and the small diameter portion of the cover member 177. Further, a heater 182 for heating the magnetic fluid seal 181 is provided in a portion of the fixed frame 180 in the vicinity of the magnetic fluid seal 181. In addition, a magnetic fluid seal 183 is also provided between the rotation shaft 70 and the base plate 191, and a heater 184 for heating the magnetic fluid seal 83 is provided in the vicinity of the magnetic fluid seal 183. . With the magnetic fluid seals 81 and 83, between the cover member 177 and the fixed frame 180, and between the rotation shaft 70 and the base plate 191 are sealed airtightly, via the rotation shaft 70 The stage 52 can be rotated. Further, the magnetic fluid seals 181 and 183 can be heated by the heaters 182 and 184, so that the decrease in the sealing performance or condensation due to the decrease in the temperature of the magnetic fluid can be suppressed. Other configurations of the stage device 150 are the same as those of the stage device 50 of the first embodiment.

In this embodiment, since the cylindrical refrigeration heat transfer body 165 is provided at a position below the stage 52 so as to surround the rotation shaft 70, it is possible to realize the miniaturization of the stage device 150 as in the first embodiment. have. In addition, even if the thickness of the refrigeration heat transfer body 165 is thin, a volume for heat transfer of cold heat can be secured, so that the outer diameter of the refrigeration heat transfer body 165 can be reduced, thereby saving space and at the same time being magnetic. The fluid seal 181 can be made small. Moreover, good maintainability can also be ensured.

<Other application>

As mentioned above, although the embodiment has been described, it should be considered that the embodiment disclosed this time is an illustration in all points and is not restrictive. The above embodiments may be omitted, substituted, or changed in various forms, without departing from the scope of the appended claims and the gist thereof.

For example, in the above embodiment, an example of using a cylindrical or cylindrical refrigeration heater arranged to surround the rotation shaft is shown, but the refrigeration heater is not limited thereto as long as it is disposed outside the rotation shaft.

Incidentally, in the above embodiment, the case of applying to sputtering of a magnetic film used in a TMR element has been described as an example, but it is not limited to this as long as it is a treatment requiring uniform treatment at cryogenic temperatures.

1: processing device 10: processing vessel
30: target 50, 50', 150: stage device
52: stage 54: stage rotation mechanism
56: stage lifting mechanism 58, 58', 158: refrigeration electric heater
60: refrigerator 61: electrostatic chuck
62: chuck electrode 64: first heat transfer unit
65, 165: refrigeration heating element 66: second heat transfer unit
70: rotation shaft 71: motor
76, 176: cooling gas supply path 81, 83, 181, 183: magnetic fluid seal
G: gap W: wafer (substrate)

Claims (13)

In a stage apparatus for holding a substrate in a processing apparatus for processing a substrate,
A stage for holding the substrate in the processing container,
A stage rotation mechanism having a rotation shaft provided to extend downward at the center of the lower surface of the stage and a motor rotating the stage via the rotation shaft,
It has at least one refrigeration heat transfer body that heats cold heat of the refrigerator, fixedly disposed at a position outside the rotation shaft below the stage, and has a refrigeration heat transfer mechanism provided with a gap therebetween.
Stage device. The method of claim 1,
Further comprising a cooling fluid supplying mechanism for supplying a cooling fluid for transferring the cold heat of the refrigerating heat transfer mechanism to the stage in the gap.
Stage device. The method of claim 2,
The cooling fluid is a cooling gas
Stage device. The method according to any one of claims 1 to 3,
The refrigeration heat transfer mechanism is provided corresponding to the stage with the gap therebetween, and further has a stage side heat transfer part to which the refrigeration heat transfer body is connected.
Stage device. The method of claim 4,
It has a comb-shaped heat exchange part between the stage and the stage-side heat transfer part, with the gap therebetween.
Stage device. The method according to any one of claims 1 to 5,
The refrigeration heat transfer element has a column shape and is disposed at a position eccentric from the rotation shaft.
Stage device. The method of claim 6,
The refrigeration heat transfer mechanism has a plurality of the refrigeration heat transfer elements
Stage device. The method according to any one of claims 1 to 5,
The refrigeration heating element has a cylindrical shape and is arranged to surround the rotating shaft.
Stage device. The method according to any one of claims 1 to 8,
The motor of the stage rotation mechanism is a direct drive motor disposed around the rotation shaft.
Stage device. The method according to any one of claims 1 to 9,
The stage is cooled to a temperature of -23 ℃ to -223 ℃
Stage device. In a processing apparatus for processing a substrate,
A processing container accommodating a substrate,
The stage device according to any one of claims 1 to 10 for holding the substrate rotatably in the processing container, and
Having a processing mechanism for processing the substrate in the processing container
Processing device. The method of claim 11,
The processing mechanism has a target for sputtering film formation, disposed above the stage in the processing container.
Processing device. The method of claim 12,
The target is made of a material for forming a magnetic material used in the tunnel magnetoresistive element
Processing device.

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