TW201801197A - 超音波式指紋辨識模組及其製造方法 - Google Patents

超音波式指紋辨識模組及其製造方法 Download PDF

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TW201801197A
TW201801197A TW106115022A TW106115022A TW201801197A TW 201801197 A TW201801197 A TW 201801197A TW 106115022 A TW106115022 A TW 106115022A TW 106115022 A TW106115022 A TW 106115022A TW 201801197 A TW201801197 A TW 201801197A
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ultrasonic
substrate
film transistor
thin film
circuit board
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仲珉 林
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致伸科技股份有限公司
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Abstract

本案係提供一種超音波式指紋辨識模組及其製造方法。該超音波式指紋辨識模組包括一基板、一超音波發射元件、一薄膜電晶體以及一超音波接收元件。該製造方式包括下述步驟：(a)提供該基板、該超音波發射元件、該薄膜電晶體以及該超音波接收元件；(b)貼疊該超音波發射元件至該基板的一上表面，並將該超音波發射元件與該基板電性連接；(c)貼疊該超音波接收元件至該薄膜電晶體；(d)貼疊該薄膜電晶體至該超音波發射元件；以及(e)將該超音波接收元件透過打線電性連接至該薄膜電晶體，將該薄膜電晶體透過打線電性連接至該基板。

Description

超音波式指紋辨識模組及其製造方法
本案是關於一種指紋辨識模組，特別是一種超音波式指紋辨識模組。
隨著科技的快速發展，基本上已人人配備一支行動電子裝置或筆記型電腦，為便於使用者在行動電子裝置或筆記型電腦能簡易且安全地被辨識身份，目前最新流行的生物辨識類別包括臉部、虹膜和指紋辨識等等。其中，指紋係由許多凸出的脊紋和凹陷的紋谷所組成，也是目前已逐漸開始遍及大眾的一項生物辨識技術。
如圖1所示，傳統超音波式指紋辨識模組1包括一軟性電路板10、一超音波發射元件11以及一超音波接收元件12，其中，軟性電路板10的尾端以彎折形成一彎折處105的方式以執行電性連接。但缺點是，彎折處105的結構因受本身材料的彈性恢復力的影響而結構不穩定，因此，製程上必需於由彎折處105所界定出 彎折空間105a內填塞具有黏性的結合物質，以協助固著彎折處105。然而，將黏性的結合物質填塞至彎折空間105a屬十分精細的繁鎖製程，而提高人力成本。此外，即便是使用結合物質將彎折空間105a填塞後，整體超音波式指紋辨識模組1的結構信賴度仍舊偏低，仍容易有翹起的問題。有鑑於此，習知的超音波式指紋辨識模組仍亟待改進。
本發明之主要目的在於提供一種超音波式指紋辨識模組，透過將超音波發射元件、薄膜電晶體以及超音波接收元件建置於高密度電路板，將可使整體體積更微型化。並且，透過打線的方式執行電性連接，進而提高整體結構的信賴度。
本案之一較佳實施概念，在於提供一種超音波式指紋辨識模組的製造方法，包括下述步驟：(a)提供一基板、一超音波發射元件、一薄膜電晶體(Thin-Film Transistor；TFT)以及一超音波接收元件，其中，該薄膜電晶體具有一第一電性接墊以及一第二電性接墊；(b)貼疊該超音波發射元件至該基板的一上表面，並將該超音波發射元件與該基板電性連接；(c)貼疊該超音波接收元件至該薄膜電晶體；(d)貼疊該薄膜電晶體至該超音波發射元件；以及 (e)透過一第一打線將該超音波接收元件與該薄膜電晶體的該第一電性接墊電性連接，透過一第二打線將該薄膜電晶體的該第二電性接墊與該基板電性連接。
於一較佳實施例中，於步驟(b)包括下述步驟
(b0)以電漿清潔技術清理該基板的該上表面。
於一較佳實施例中，於步驟(b0)後，更包括： (b1)透過一黏膠將該超音波發射元件黏疊於該基板的該上表面，且將一導電性物質注入該超音波發射元件的一中空通孔，以使該超音波發射元件以及該基板之間相互電性連接。
於一較佳實施例中，該黏膠係為一感壓膠(Pressure Sensitive Adhesive；PSA)。
於一較佳實施例中，步驟(e)包括下述步驟：(e1)以正打的方式，先將該第一打線的一端焊接於該超音波接收元件後，再將該第一打線的另一端焊接於該薄膜電晶體的該第一電性接墊，並且，先將該第二打線的一端焊接於該薄膜電晶體的該第二電性接墊，再將該第二打線的另一端焊接於該基板；抑或是(e1’)以反打的方式，先將該第一打線的一端焊接於該薄膜電晶體的該第一電性接墊後，再將該第一打線的另一端焊接於該超音波接收元件，並且，先將該第二打線的一端焊接於該基板，再將該第二打線的另一端焊接於該薄膜電晶體的該第二電性接 墊。
於一較佳實施例中，於步驟(e)後，更包括下述步驟：(f)貼疊該基板至一軟性電路板。
於一較佳實施例中，該基板係為一高密度(High Density Interconnect；HDI)電路板，該高密度電路板承載有一電子元件，且該電子元件電性連接於該高密度電路板。
本案之另一較佳實施概念，在於提供一種超音波式指紋辨識模組，包括：一基板；一超音波發射元件，疊設於該基板之上；一薄膜電晶體(Thin-Film Transistor；TFT)疊設於該超音波發射元件之上，其中，該薄膜電晶體具有一第一電性接墊以及一第二電性接墊；一超音波接收元件，疊設於該薄膜電晶體之上；以及一第一打線以及一第二打線，該超音波接收元件透過該第一打線電性連接至該薄膜電晶體的該第一電性接墊，該薄膜電晶體的該第二電性接墊透過該第二打線電性連接至該基板。
於一較佳實施例中，該基板係為一高密度(High Density Interconnect；HDI)電路板；抑或是，該基板係為一高密度(High Density Interconnect；HDI)電路板，且該高密度電路板係為 由一單導體層所構成的高密度電路板。
於一較佳實施例中，該高密度電路板承載有一積體電路，且該積體電路電性連接於該高密度電路板。
於一較佳實施例中，該高密度電路板承載有一被動元件，且該被動元件電性連接於該高密度電路板。
於一較佳實施例中，該超音波發射元件與該基板係透過一黏膠黏合，其中該黏膠係為一感壓膠(Pressure Sensitive Adhesive；PSA)。
於一較佳實施例中，該超音波式指紋辨識模組更包括一軟性電路板，該基板設置於該軟性電路板上，並與該軟性電路板電性連接。
於一較佳實施例中，該超音波發射元件的一上表面以及一下表面皆係為一銀層，該超音波接收元件的一上表面係為一銀層。
於一較佳實施例中，該薄膜電晶體包括一主動區域，該主動區域包括複數感應單元，該些感應單元用以感測一指紋面上的複數脊紋以及複數脊谷。
於一較佳實施例中，每一該感應單元係為一感應電壓像素，而該些感應電壓像素呈矩陣排列。
1‧‧‧傳統超音波指紋辨識模組
10‧‧‧軟性電路板
105‧‧‧彎折處
105a‧‧‧彎折空間
11‧‧‧超音波發射元件
12‧‧‧超音波接收元件
2‧‧‧超音波式指紋辨識模組
20‧‧‧軟性電路板
21‧‧‧基板
22‧‧‧超音波發射元件
220‧‧‧中空通孔
23‧‧‧薄膜電晶體
231‧‧‧第一電性接墊
233‧‧‧第二電性接墊
235‧‧‧主動區域
235a‧‧‧感應單元
24‧‧‧超音波接收元件
25‧‧‧電子元件
26‧‧‧第一打線
27‧‧‧第二打線
28‧‧‧黏膠
29‧‧‧銀層
9‧‧‧手指
90‧‧‧指紋面
圖1係為本案傳統的超音波式指紋辨識模組的剖面示意圖。
圖2係為本案超音波式指紋辨識模組的第一實施例的剖面示意圖。
圖3係為本案超音波式指紋辨識模組的第二實施例的剖面示意圖。
圖4係為本案超音波式指紋辨識模組的第一實施例的流程圖。
請參考圖2，圖2係為本案超音波式指紋辨識模組的第一實施例的剖面示意圖。本案超音波式指紋辨識模組2包括一基板21、一超音波發射元件22、一薄膜電晶體23(Thin-Film Transistor；TFT)、一超音波接收元件24、一第一打線26以及一第二打線27。各上述元件從下而上的順序依序是：基板21位於底部、超音波發射元件22疊置於基板21之上、薄膜電晶體23疊置於超音波發射元件22之上、超音波接收元件24疊置於薄膜電晶體23之上。至於，第一打線26的兩端分別連接於超音波接收元件24以及薄膜電晶體23的一第一電性接墊231，使超音波接收元件24以及薄膜電晶體23相互電性連接；且第二打線27的兩端分別連接於薄膜 電晶體23一第二電性接墊233以及基板21，使薄膜電晶體23以及基板21相互電性連接。
於此需特別說明者為，本案超音波式指紋辨識模組2的超音波發射元件22以及超音波接收元件24皆係由壓電材料所製成，故其具有「壓電效應」。進一步而言，超音波發射元件22會因應電信號壓縮超音波發射元件22的壓電材料產生一發射波，而超音波接收元件24會因應所接收的一反射波而產生電信號。另外，基板21係為一高密度(High Density Interconnect；HDI)電路板，較佳地，該高密度電路板係為由一單導體層所構成的高密度電路板。並且，本案的該高密度電路板厚度薄，厚度實質上僅為100微米。該高密度電路板結構強度高，故該高密度電路板可直接承載有一電子元件25，較佳地，電子元件25焊接於該高密度電路板。藉此設置，電子元件25得以非常鄰靠於超音波發射元件22、薄膜電晶體23、超音波接收元件24，且具有讓整體體積窄化及扁化的微形化好處。其中，電子元件25包含但不限於：積體電路、微處理器、濾波器以及被動元件等等不同功能的電子元件。
由於本案之超音波式指紋辨識模組2一般會裝載於一電子裝置(圖未示)上，像是智慧型手機、筆記型電腦及電子門鎖等，因此本案的超音波式指紋辨識模組2，較佳但不限於，更包括一軟性電路板20，軟性電路板20的一上表面接合於基板21的一下表面，且軟性電路板20與基板21電性連接。因此，於本案之超音波式指紋辨識模組2應用於該電子裝置中時，超音波式指紋辨識模 組2得以透過軟性電路板20進一步與該電子裝置裡的電路電性連接。
再者，超音波發射元件22的一上表面以及一下表面皆係一銀層29，超音波接收元件24的一上表面亦係一銀層29。銀層29的功用在於作為電極之用。
除此之外，超音波發射元件22與基板21係透過一黏膠28黏合，其中黏膠28係為一感壓膠(Pressure Sensitive Adhesive；PSA)或是一低溫黏膠。
薄膜電晶體23包括一主動區域235，主動區域235包括複數感應單元235a，而多個感應單元235a用以判斷一手指9的一指紋面90上的複數脊紋以及複數脊谷。較佳地，每一個感應單元235a係為一感應電壓像素，且多個感應電壓像素呈各式矩陣排列，形狀可呈方形、矩形、圓形等。詳細來說，超音波式指紋辨識模組2在對指紋面90進行感測的當下，超音波發射元件22會向上發射出至少一發射波，當該至少一發射波到達指紋面90時，會因應指紋面90上的脊紋以及脊谷而相應形成有獨特的至少一反射波，而向下反射後被超音波接收元件24所接收，且超音波接收元件24將該至少一反射波轉換成電壓。接者，薄膜電晶體23的主動區域235的多個感應單元235a就可感測超音波接收元件24所產生的電壓，進而推斷出指紋面90的特徵。
圖3係為本案超音波式指紋辨識模組的第二實施例的剖面示意圖。第二實施例與第一實施例的相異之處在於，第二 實施例的超音波式指紋辨識模組3的超音波發射元件以及超音波接收元件設置於同一層內，也就是超音波發射元件以及超音波接收元件皆設置於超音波發射及接收模組32內。如此的結構設計的好處在於，更有助於本案超音波式指紋辨識模組3的整體體積薄形化。
請參照圖4，圖4係為本案超音波式指紋辨識模組的第一實施例的流程圖。本案超音波式指紋辨識模組2的製造方法，首先執行步驟(a)提供一基板21、一超音波發射元件22、一薄膜電晶體23(Thin-Film Transistor；TFT)以及一超音波接收元件24。其中，薄膜電晶體23具有一第一電性接墊231以及一第二電性接墊233，且基板21係為一高密度(High Density Interconnect；HDI)電路板。
步驟(a)後，執行步驟(b)。於步驟(b)中，貼疊超音波發射元件22至基板21的一上表面，並將超音波發射元件22與基板21電性連接。詳細而言，步驟(b)包括步驟(b0)以及步驟(b1)。步驟(b0)以電漿清潔技術清理基板21的上表面。於步驟(b0)後，執行步驟(b1)，透過一黏膠28將超音波發射元件22黏疊於基板21的該上表面，黏膠28係為一感壓膠(Pressure Sensitive Adhesive；PSA)或一低溫黏膠。接者，將一導電性物質注入超音波發射元件22的一中空通孔220，以使超音波發射元件22以及基板21之間相互電性連接。
再者，於步驟(c)中，貼疊超音波接收元件24至薄膜 電晶體23。於此需說明者為，超音波接收元件24因本身係壓電元件所製成，故本身不易黏著，較佳為使用紫外光固化製程所製成。因此，於紫外光固化製程中，薄膜電晶體23與超音波接收元件24相接觸，且必須由薄膜電晶體23的一側對超音波接收元件24執行紫外光照射，以使超音波接收元件24固著於薄膜電晶體23，而這也是本案超音波式指紋辨識模組的製造過程中，超音波發射元件22、薄膜電晶體23、超音波接收元件24並非依次序一一向上堆疊組裝的原因。
於此需特別說明者為，由於步驟(b)與步驟(c)係對不同元件做組裝，故步驟(b)與步驟(c)可同時發生、或是前後時間對調發生，於此不作限制。
接者，於步驟(d)中，將(已貼疊有超音波接收元件24的)薄膜電晶體23貼疊至(已貼疊至基板21的)超音波發射元件22。較佳地，步驟(d)前亦可以電漿清潔技術清理超音波發射元件22的一上表面以及薄膜電晶體23的一下表面。
在步驟(d)之後，本案超音波式指紋辨識模組2更包含步驟(e)。於步驟(e)中，透過一第一打線26將超音波接收元件24與薄膜電晶體23的第一電性接墊231電性連接，透過一第二打線27將薄膜電晶體23的第二電性接墊233基板21電性連接。因此，相較於習知的超音波式指紋辨識模組，本案的超音波式指紋辨識模組2藉由打線之設置，簡化了整體製造流程步驟，且能夠提高整體產品的可靠度。
更進一步而言，於步驟(e)包括步驟(e1)或步驟(e1’)。步驟(e1)係以正打的方式，先將第一打線26的一端焊接於超音波接收元件24後，再將第一打線26的另一端焊接於薄膜電晶體23的第一電性接墊231，並且，先將第二打線27的一端焊接於該薄膜電晶體23的第二電性接墊233，再將第二打線27的另一端焊接於基板21。步驟(e1’)係以反打的方式，先將第一打線26的一端焊接於薄膜電晶體23的第一電性接墊231後，再將第一打線26的另一端焊接於超音波接收元件24，並且，先將第二打線27的一端焊接於基板21，再將第二打線27的另一端焊接於薄膜電晶體23的第二電性接墊233。於此需特別說明的是，這裡的第一電性接墊231以及第二電性接墊233的數量並不作一限制。
在步驟(e)之後，於步驟(e)後，更包括步驟(f)貼疊基板21至一軟性電路板20。藉由軟性電路板20之設置，使得本案超音波式指紋辨識模組2得以被建置於一電子裝置內，即透過軟性電路板20與電子裝置電性連接。
綜上所述，本案超音波式指紋辨識模組藉由打線的方式將高密度電路板、薄膜電晶體以及超音波接收元件電性連接，以簡化製造流程步驟來精簡人力和製造時間，且同時使得本案超音波式指紋辨識模組的整體結構強度提高。並透過將超音波發射元件、薄膜電晶體以及超音波接收元件直接設置於高密度電路板，同時也可以將其它功能的電子元件(像是積體電路、被動元件等)設置於高密度電路板上，而有使體積微型化的優點。
上述實施例僅為例示性說明本發明之原理及其功效，以及闡釋本發明之技術特徵，而非用於限制本發明之保護範疇。任何熟悉本技術者之人士均可在不違背本發明之技術原理及精神的情況下，可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍。因此，本發明之權利保護範圍應如後述之申請專利範圍所列。
2‧‧‧超音波指紋辨識模組
21‧‧‧基板
22‧‧‧超音波發射元件
220‧‧‧中空通孔
23‧‧‧薄膜電晶體
231‧‧‧第一電性接墊
233‧‧‧第二電性接墊
235‧‧‧主動區域
235a‧‧‧感應單元
24‧‧‧超音波接收元件
25‧‧‧電子元件
26‧‧‧第一打線
27‧‧‧第二打線
28‧‧‧黏膠
29‧‧‧銀層

Claims (16)

  1. 一種超音波式指紋辨識模組的製造方法，包括下述步驟：(a)提供一基板、一超音波發射元件、一薄膜電晶體(Thin-Film Transistor；TFT)以及一超音波接收元件，其中，該薄膜電晶體具有一第一電性接墊以及一第二電性接墊；(b)貼疊該超音波發射元件至該基板的一上表面，並將該超音波發射元件與該基板電性連接；(c)貼疊該超音波接收元件至該薄膜電晶體；(d)貼疊該薄膜電晶體至該超音波發射元件；以及(e)透過一第一打線將該超音波接收元件與該薄膜電晶體的該第一電性接墊電性連接，透過一第二打線將該薄膜電晶體的該第二電性接墊與該基板電性連接。
  2. 如申請專利範圍第1項所述之超音波式指紋辨識模組的製造方法，其中於步驟(b)包括下述步驟：(b0)以電漿清潔技術清理該基板的該上表面。
  3. 如申請專利範圍第2項所述之超音波式指紋辨識模組的製造方法，其中於步驟(b0)後，更包括：(b1)透過一黏膠將該超音波發射元件黏疊於該基板的該上表面，且將一導電性物質注入該超音波發射元件的一中空通孔，以使該超音波發射元件以及該基板之間相互電性連接。
  4. 如申請專利範圍第3項所述之超音波式指紋辨識模組的製造方 法，其中該黏膠係為一感壓膠(Pressure Sensitive Adhesive；PSA)。
  5. 如申請專利範圍第1項所述之超音波式指紋辨識模組的製造方法，其中於步驟(e)包括下述步驟：(e1)以正打的方式，先將該第一打線的一端焊接於該超音波接收元件後，再將該第一打線的另一端焊接於該薄膜電晶體的該第一電性接墊，並且，先將該第二打線的一端焊接於該薄膜電晶體的該第二電性接墊，再將該第二打線的另一端焊接於該基板；抑或是(e1’)以反打的方式，先將該第一打線的一端焊接於該薄膜電晶體的該第一電性接墊後，再將該第一打線的另一端焊接於該超音波接收元件，並且，先將該第二打線的一端焊接於該基板，再將該第二打線的另一端焊接於該薄膜電晶體的該第二電性接墊。
  6. 如申請專利範圍第1項所述之超音波式指紋辨識模組的製造方法，其中於步驟(e)後，更包括下述步驟：(f)貼疊該基板至一軟性電路板。
  7. 如申請專利範圍第1項所述之超音波式指紋辨識模組的製造方法，其中該基板係為一高密度(High Density Interconnect；HDI)電路板，該高密度電路板承載有一電子元件，且該電子元件電性連接於該高密度電路板。
  8. 一種超音波式指紋辨識模組，包括： 一基板；一超音波發射元件，疊設於該基板之上；一薄膜電晶體(Thin-Film Transistor；TFT)疊設於該超音波發射元件之上，其中，該薄膜電晶體具有一第一電性接墊以及一第二電性接墊；一超音波接收元件，疊設於該薄膜電晶體之上；以及一第一打線以及一第二打線，該超音波接收元件透過該第一打線電性連接至該薄膜電晶體的該第一電性接墊，該薄膜電晶體的該第二電性接墊透過該第二打線電性連接至該基板。
  9. 如申請專利範圍第7項所述之超音波式指紋辨識模組，其中該基板係為一高密度(High Density Interconnect；HDI)電路板；抑或是，其中該基板係為一高密度(High Density Interconnect；HDI)電路板，且該高密度電路板係為由一單導體層所構成的高密度電路板。
  10. 如申請專利範圍第9項所述之超音波式指紋辨識模組，其中該高密度電路板承載有一積體電路，且該積體電路電性連接於該高密度電路板。
  11. 如申請專利範圍第9項所述之超音波式指紋辨識模組，其中該高密度電路板承載有一被動元件，且該被動元件電性連接於該高密度電路板。
  12. 如申請專利範圍第9項所述之超音波式指紋辨識模組，其中該 超音波發射元件與該基板係透過一黏膠黏合，其中該黏膠係為一感壓膠(Pressure Sensitive Adhesive；PSA)。
  13. 如申請專利範圍第9項所述之超音波式指紋辨識模組，更包括一軟性電路板，該基板設置於該軟性電路板上，並與該軟性電路板電性連接。
  14. 如申請專利範圍第9項所述之超音波式指紋辨識模組，其中該超音波發射元件的一上表面以及一下表面皆係為一銀層，該超音波接收元件的一上表面係為一銀層。
  15. 如申請專利範圍第9項所述之超音波式指紋辨識模組，其中該薄膜電晶體包括一主動區域，該主動區域包括複數感應單元，該些感應單元用以感測一指紋面上的複數脊紋以及複數脊谷。
  16. 如申請專利範圍第15項所述之超音波式指紋辨識模組，其中每一該感應單元係為一感應電壓像素，而該些感應電壓像素呈矩陣排列。
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