TW201743054A - Bio-detection device and manufacturing method thereof - Google Patents

Abstract

A bio-detection device, including a carrier, a plurality of spacers, an electronic circuit, and a package layer. The carrier includes a test region and signal transmission wirings, wherein the test region is for locating an object under test in liquid or aqueous state. The spacers are located on the test region and electrically connected to two different voltage levels to form a capacitor for sensing a capacitance of the object. The spacers are connected to the signal transmission wirings. The electronic circuit receives and processes the capacitance sensing signal. The package layer covers a part of the carrier but does not cover the test region. Thus, an open platform is formed whereby a user can easily put in the object; the open platform has a bottom which includes the test region, and an area of the open platform is defined by the spacers and the package layer.

Description

Biomedical testing device and method for manufacturing biomedical testing device

The invention relates to a biomedical testing device, which is a biomedical detecting device comprising an open platform for carrying and sensing a capacitance value of a liquid to be tested, and calculating a component concentration of the liquid to be tested according to the capacitance value.

Conventional biomedical detection devices, such as microchannel technology, require a fluid to pass through a closed elongated flow path and control the forward state of the fluid to be tested by controlling pressure, temperature, surface tension and the like. According to the requirements of different test methods, the micro flow channel needs to be adjusted corresponding to each fluid state requirement, so the technology, structure, and manufacturing process are very complicated.

In addition, the microchannel requires a large area, in addition to the need to accommodate the path of the microchannel and the need for shunting therein, and because the flow of the fluid to be tested needs to be controlled, it is controlled by means of voltage or surface tension. Drive components, which add to the required area of the microchannel.

In view of this, the present invention is directed to the above-mentioned deficiencies of the prior art, and proposes a biomedical detection device with low detection control complexity, compact size, and simple process.

In one aspect, the present invention provides a biomedical testing device comprising: a carrier plate comprising a carrier surface and a signal transmission line for carrying a liquid to be tested; a plurality of metal spaces a board, located on the surface of the carrier, and electrically connected to at least two different potentials to form at least one capacitor for sensing a capacitance value of the liquid to be tested, wherein the plurality of metal spacers are respectively coupled to the signal transmission An electronic circuit coupled to the signal transmission line for receiving and processing the sensing signal of the capacitor; an encapsulation layer covering a portion of the carrier but not covering the carrier surface; An open platform having a bottom region including the carrier surface, the range being defined by the plurality of metal spacers and the encapsulation layer to facilitate placement of the test solution on the carrier surface.

In one embodiment, the biomedical detection device further comprises a hydrophilic layer disposed on the surface of the carrier.

In one embodiment, the biomedical detection device further includes a rustproof layer on a surface of the signal transmission line on a portion of the open platform and on a surface of the plurality of metal spacers.

In one embodiment, a portion of the rustproof layer is located on a side surface and a top surface of the open platform, and the biomedical detection device further includes a hydrophilic layer disposed on the rustproof layer and the open platform The surface of the substrate on which the rustproof layer is not coated or the hydrophilic layer is disposed on the surface of the open platform where the rustproof layer is not coated.

In one embodiment, the material of the plurality of metal spacers comprises copper, nickel, gold, palladium, a copper-containing alloy, a nickel-containing alloy, a gold-containing alloy, a palladium-containing alloy, or a combination thereof, and/or the signal transmission line. The material comprises copper, nickel, gold, a copper-containing alloy, a nickel-containing alloy, a gold-containing alloy, or a combination thereof. In one embodiment, the material of the rustproof layer comprises an ORGANIC SOLDERABILITY PRESERVATIVES (OSP) to coat the metal spacer.

In one embodiment, the electronic circuit is located on the carrier, and the encapsulation layer encapsulates the electronic circuit.

In one embodiment, the encapsulation layer is formed by an Open Cavity Molding method to cover the carrier other than the outermost metal spacer on the carrier surface.

The biomedical testing device according to claim 1, wherein the carrier is formed by a molded interconnecting device.

In another aspect, the present invention provides a method for manufacturing a biomedical testing device, comprising: providing a carrier plate comprising a carrier surface and a signal transmission line; and providing a plurality of metal spacers on the carrier The plurality of metal spacers are coupled to the signal transmission line, and the plurality of metal spacers are used to sense a capacitance value of the liquid to be tested; and an encapsulation layer is formed by an open cavity molding to cover the carrier layer. A portion, but not covering the surface, thereby forming an open platform to facilitate placement of the test solution on the surface.

In one embodiment, the method for manufacturing the biomedical detection device further includes: disposing an electronic circuit on the carrier board and coupling the signal transmission line, wherein the electronic circuit is configured to receive and process the plurality of spacers to sense the capacitance value. Sensing signal.

In one embodiment, the carrier is formed by: providing a substrate; forming the signal transmission line on the substrate; wrapping the substrate and the signal transmission line thereon by a filling layer; and removing the substrate The substrate is such that the signal transmission line is exposed on the first surface of the filling layer.

In an embodiment, the method for manufacturing the biomedical detection device further comprises: grinding the filling layer to expose a portion of the signal transmission line to the second surface of the filling layer, the second surface being opposite to the first surface surface.

In one embodiment, the encapsulation layer is formed by: providing a template to abut the carrier; filling a filling melt stream, wherein the template is configured to block the filling melt from flowing into the loading surface; Curing the fill stream to form the encapsulation layer; and removing the template.

In one embodiment, the template includes a protrusion, and when the template is placed on the carrier, the protrusion abuts the outermost metal spacer in the plurality of metal spacers to isolate the filling and melting The flow is such that the filling melt does not flow into the carrier surface.

The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. The drawings in the present invention are intended to be illustrative, and are intended to represent the functional relationship between the various components and the components. The shapes, thicknesses, and widths are not drawn to scale.

In one aspect, referring to the cross-sectional view of FIG. 1A, the present invention provides a biomedical testing device 10 comprising a carrier 11, a plurality of metal spacers 12A and 12B, an electronic circuit 13, and an encapsulation layer. 14. The metal spacers 12A and 12B are respectively connected to different potentials to constitute a capacitor. The top view layout of the metal spacers 12A and 12B can be designed as needed, and the present invention is not limited to any one of the layout shapes, and FIG. 1C shows an example of a possible layout (the cross-sectional view of FIG. 1A is along the 1C chart). The profile obtained from the AA line). The biomedical detection device 10 may also include more metal spacers, connected to the same or different potentials as the metal spacers 12A and 12B, as needed. The carrier 11 includes a carrier surface 111 and a signal transmission line 112 (not shown for the simplified drawing, which is connected to the metal spacer 12A). The metal spacers 12A and 12B are located on the carrier surface 111; the carrier surface 111 is used to carry a liquid to be tested (Fig. 1B), and the metal spacers 12A and 12B generate corresponding capacitance values according to the liquid to be tested. The liquid to be tested is, for example but not limited to, a biological fluid, or other biological tissue liquid or aqueous solution to be detected, wherein the biological fluid or biological tissue may be doped with an additive for assisting detection, as needed. The signal transmission line 112 transmits the sensing signal Ss generated according to the capacitance value to the electronic circuit 13. The electronic circuit 13 is coupled to the signal transmission line 112 for receiving the sensing signal Ss and corresponding processing. For example, the sensing signal Ss can be used to calculate the concentration of certain components of the liquid to be tested, or Generate other readings. The encapsulation layer 14 is used to cover the electronic circuit 13, but does not cover the carrier surface 111, and the area of the encapsulation layer 14 covered by the carrier surface 111 can be determined as needed. Referring to FIG. 1B, an open platform 15 is defined by the range surrounded by the object surface 111, the metal spacer 12B, and the encapsulation layer 14 so as to place the liquid to be tested on the carrier surface 111 without passing through the microfluid. Road.

The biomedical testing device 10 of the present invention provides a detecting platform, and the detecting platform is an open platform 15 having the effect of the microfluidic channel of the prior art. For example, the open platform 15 does not require a large area like a microfluidic channel to accommodate the path of the microchannel and the need for shunting therein, nor the drive elements in the microchannel that control the flow of the fluid to be tested. Compared with the prior art, the open platform 15 is easy to design the micro flow channel regardless of the detection control, the related manufacturing process, and the quality control, and the manufacturing cost is also low.

Referring to Figures 2 and 3, the user can adjust the components in the biomedical detection device as needed. For example, the biomedical testing device 20 of FIG. 2 may further include a rustproof layer 114 on the metal spacers 12A and 12B in the open platform 15 to increase the effect of metal rust prevention, such as the rustproof layer 114. It is not limited to being a gold plating layer. For example, in the biomedical detection device 30 of FIG. 3, the carrier surface 111 is coated with a hydrophilic layer 115, that is, a portion of the substrate surface 111 to be in contact with the liquid to be tested is coated with a hydrophilic layer 115, wherein the hydrophilic layer The loading surface 111 of the rustproof layer 114 is not covered in the open platform 15 . When the liquid droplets of the liquid to be tested are carried on the loading surface 111, the liquid droplets of the liquid to be tested are affected by the surface tension of the hydrophilic layer 115, and are covered on the hydrophilic layer 115, so that the liquid to be tested can be sufficiently distributed on the loading surface 111. Within the top view area. In the foregoing two embodiments, the anti-rust layer 114 and the hydrophilic layer 115 may also be disposed at the same time, as in the embodiment of FIG. 4, wherein the hydrophilic layer 115 is disposed on the anti-rust layer 114 in the open platform 15 and is disposed in the open type. The platform 15 is not covered with the loading surface 111 of the rustproof layer 114.

Referring to Fig. 2, the rustproof layer 114 of the present invention can be plated on the side faces 12A1, 12B1 and the top faces 12A2, 12B2 of the electrode 112 and the metal spacers 12A and 12B by electroless plating. Since electroless plating is a conventional technique, the process is not detailed here.

The metal spacers 12A and 12B and the signal transmission line 112 in the carrier 11 can be fabricated using a conductive material, such as a metal; in one embodiment, the metal spacers 12A and 12B are, for example but not limited to, copper, nickel, gold, palladium. A copper-containing alloy, a nickel-containing alloy, a gold-containing alloy, a palladium-containing alloy, or a combination thereof, and the signal transmission line 112 located in the carrier 11 is also the same.

Although the electronic circuit 13 of FIG. 1A is located in the carrier board 11, the electronic circuit 13 may be located outside the carrier board 11 as needed, and connected to the carrier board 11 by other lines (not shown). For example, to save the cost of the electronic circuit 13, a single electronic circuit 13 can be used to receive the sensed signals from the plurality of carriers 11.

In one embodiment, the electronic circuit 13 may include a control IC, an Application-Specific Integrated Circuit (ASIC), or other types of electronic circuits. Its choice depends on the needs.

In addition to the signal transmission line 112 in the carrier 11 for transmitting the sensing signal Ss between the capacitors and the electronic circuit 13 formed by the metal spacers 12A and 12B, the electronic circuit 13 itself or the other Other signal transmission lines can also be provided between the electrical components, which are not shown. In addition, since the metal spacers 12A and 12B are electrically connected to different potentials, respectively, the signal transmission line should include a plurality of wires to be electrically connected to the metal spacers 12A and 12B, respectively; that is, the signal transmission described in this specification. A line is a collection of nouns that represent a collection of complex lines.

5A to 5D are views showing a process of fabricating an encapsulation layer in a carrier according to an embodiment of the present invention, in which an electronic circuit is coated and coated by means of Open Cavity Molding. A carrier other than the surface and the metal spacer 12B. Fig. 5A shows a state in which the carrier board is not covered with the encapsulation layer, and the electronic circuit 13 and the metal spacers 12A and 12B have been fabricated on the carrier. Figure 5B shows the carrier plate without the encapsulation layer, preferably, but not necessarily, subjected to a plasma cleaning and wetting step to enhance surface cleaning and the encapsulation effect of the encapsulating layer material and the metal. Figure 5C shows a gap between a template 200 and a carrier plate that is not coated with an encapsulation layer. The protruding portion 201 of the template 200 abuts on the outermost metal spacer 12B (may not but need to abut against the metal spacer 12A) to isolate the filling flow of the encapsulation layer 14 so that the flow range of the filling melt is blocked. Therefore, it does not pass between the protruding portion 201 and the carrying surface; therefore, the filling melt flow can only be filled under the template, the portion of the protruding portion and the outermost metal spacer 12B. Figure 5D shows the removal of the template 200 after the filling melt is cured into an encapsulation layer. In this embodiment, the extent of the encapsulation layer is defined by the protrusion 201 contacting the outermost metal spacer 12B. However, it is obvious that the configuration of the template 200 can be changed, and the barrier wall can be provided, and the range of the encapsulation layer can also be defined. It is not necessary to define the range of the encapsulation layer with the outermost metal spacer 12B. In addition, the carrier plate of the embodiment is exemplified by the fact that the rust-preventing layer and the hydrophilic layer are not included, and the carrier plate containing the rust-proof layer or the hydrophilic layer can be subjected to other process steps after the 5D drawing, such as electroless plating or coating. Process to form the desired structure.

As previously mentioned, the electronic circuit 13 can determine whether it is located on the carrier board 11 as needed. The 5A to 5D drawings show the encapsulation layer filling process when the electronic circuit 13 is placed on the carrier board 11. If the electronic circuit 13 is not on the carrier board 11, the encapsulation layer filling process can still be analogized by the 5A to 5D drawings and the related description, and the encapsulation layer 14 is coated with the package by means of Open Cavity Molding. One of the outermost metal spacers on the face of the carrier. Therefore, according to the present invention, the encapsulation layer 14 may or may not cover the electronic circuit 13.

6A to 6H are views showing a process of fabricating a carrier according to an embodiment of the present invention, wherein the carrier is fabricated by molding a interconnected component. Referring to FIGS. 6A, 6B, and 6C, a substrate 300 is provided, and a signal transmission line 112 is formed on the substrate 300 by electroplating. Fig. 6A shows the first layer structure of the signal transmission line 112 formed on the substrate by electroplating, and Fig. 6B shows the second layer structure of the signal transmission line 112 formed on the substrate by electroplating. If necessary, more layer structures can be formed, such as Figure 6C. The 6A, 6B, and 6C diagrams are only examples of the process of the signal transmission line 112. The user can change the design of the signal transmission line 112 and the related manufacturing process as needed. Figure 6D shows the removal of the non-electroplated portion of the substrate (Fig. 6C). FIG. 6E shows a substrate layer 300 and a signal transmission line 112 thereon by a filling layer 310. FIG. 6F shows the height of the filling layer 310 being lowered to expose the signal transmission line 112 for transmitting signals from the back side of the carrier board 11 (see FIGS. 1A, 1B, 2 to 4), such as without the carrier board 11 being required. You can omit this step by passing the signal on the back. Reducing the height of the fill layer 310 can be achieved, for example, but not limited to, by grinding the fill layer or by etching the fill layer. Fig. 6G shows the removal of the substrate 300 to expose the signal transmission line 112 to the other surface, which is the upper surface of the carrier 11 shown in Figs. 1A, 1B, 2 to 4. Fig. 6H shows that the 6G image is inverted, and the metal spacers 12A and 12B are formed on the signal transmission line 112, and the electronic circuit 13 is electrically connected to the signal transmission line 112. As described above, if it is not necessary to dispose the electronic circuit 13 on the carrier 11, the electronic circuit 13 can be omitted.

The material of the above-mentioned filling layer can be determined whether it is the same as the material of the encapsulating layer as needed. For example, in an embodiment, the adhesion between the filling layer and the encapsulation layer is a factor, and the material of the filling layer is the same as the material of the encapsulation layer. For another example, in another embodiment, the filling flow of the encapsulating layer does not affect the size and structure of the filling layer, and the melting point of the material of the filling layer is higher than the material of the encapsulating layer, so as to prevent the filling layer of the encapsulating layer from forming a filling layer. Local thermal deformation. Therefore, the material selection of the filling layer and the material selection of the encapsulation layer are determined as needed.

Referring to FIG. 7A, in another aspect, the present invention provides a method of manufacturing a biomedical testing device, the method comprising: providing a carrier plate, such as but not limited to, as shown in FIGS. 6A-6G Molded Interconnect System (Molded Interconnect System), the carrier board includes a carrier surface and a signal transmission line (S1); a plurality of metal spacers are disposed on the carrier board and coupled to the signal transmission line, and the plurality of metals The spacer board is configured to sense a capacitance value of the liquid to be tested (S2); an electronic circuit is disposed on the carrier board and coupled to the signal transmission line, and the electronic circuit is configured to receive and process the plurality of spacers to sense the capacitance value. Generating a sensing signal, such as but not limited to a sensing signal based on the capacitance value to calculate a component concentration of the liquid to be tested (S3); and forming an encapsulation layer by means of Open Cavity Molding to The electronic circuit is covered, but the carrier surface is not coated, thereby forming an open platform for placing the liquid to be tested on the load surface (S4).

Referring to FIG. 7B, if it is not necessary to dispose the electronic circuit on the carrier, step S5 may be performed after step S2: forming an encapsulation layer by means of open cavity molding to cover a part of the carrier. However, the coating surface is not coated, thereby forming an open platform for placing the liquid to be tested on the loading surface.

The present invention has been described with reference to the preferred embodiments thereof, and the present invention is not intended to limit the scope of the present invention. In the same spirit of the invention, various equivalent changes can be conceived by those skilled in the art. For example, the aforementioned metal spacer may be made of a non-metallic material having conductivity, and the non-metal material may not be provided with a rustproof layer. In the embodiments, the two circuits or components directly connected may be inserted into other circuits or components that do not affect the main functions, and only need to modify the meaning of the related circuits or signals. All such modifications may be made in accordance with the teachings of the present invention, and the scope of the present invention should be construed to cover the above and other equivalents. The foregoing various embodiments are not limited to the single application, and may be combined applications, such as but not limited to, the two embodiments are used in combination, or the partial circuit of one embodiment is substituted for the corresponding circuit of another embodiment.

10, 20, 30, 40‧‧‧ biomedical testing devices
11‧‧‧ Carrier Board
111‧‧‧Loading surface
112‧‧‧ electrodes
112‧‧‧Signal transmission line
114‧‧‧Anti-rust layer
115‧‧‧Hydrophilic layer
12A, 12B‧‧‧Metal spacer
12A1, 12B1‧‧‧ side
12A2, 12B2‧‧‧ top surface
13‧‧‧Electronic circuits
14‧‧‧Encapsulation layer
15‧‧‧Open platform
200‧‧‧ template
201‧‧‧Protruding
300‧‧‧Substrate
310‧‧‧ fill layer
S1, S2, S3, S4, S5‧‧ steps
Ss‧‧ Sensing signal

[Fig. 1A, 1B, 1C] showing a schematic diagram of a biomedical detection device according to an embodiment of the present invention; [Figs. 2 to 4] showing a schematic diagram of a biomedical detection device according to a third embodiment of the present invention; [5A to 5D] FIG. 6 is a schematic view showing a process of fabricating a package-coated carrier according to an embodiment of the present invention; [FIG. 6A to 6H] is a schematic view showing a process of fabricating a carrier according to an embodiment of the present invention; [FIG. 7A] A flowchart showing the manufacture of the biomedical detection device according to an embodiment of the present invention; [Fig. 7B] is a flow chart showing the manufacture of the biomedical detection device according to another embodiment of the present invention.

10‧‧‧Biomedical testing device

11‧‧‧ Carrier Board

111‧‧‧Loading surface

112‧‧‧Signal transmission line

12A, 12B‧‧‧Metal spacer

13‧‧‧Electronic circuits

14‧‧‧Encapsulation layer

Claims (17)

A biomedical testing device comprises: a carrier plate comprising a loading surface and a signal transmission line for carrying a liquid to be tested; a plurality of spacer plates on the loading surface and electrically connected And at least two different potentials to form at least one capacitor for sensing a capacitance value of the liquid to be tested, wherein the plurality of spacers are respectively coupled to the signal transmission line; and an electronic circuit coupled to the signal transmission line a sensing signal for receiving and processing the capacitor; an encapsulation layer covering a portion of the carrier board but not covering the carrier surface; and an open platform having a bottom surface region including the carrier surface The range is defined by the plurality of spacers and the encapsulation layer, so as to place the liquid to be tested on the carrier surface. The biomedical testing device according to claim 1, further comprising a hydrophilic layer disposed on the loading surface. The biomedical testing device of claim 1, wherein the signal transmission line is located on a surface of a portion of the open platform and on a surface of the plurality of spacers, further comprising a rust preventive Floor. The biomedical testing device of claim 3, wherein a part of the anti-rust layer is located at a side and a top of the open platform, and the biomedical detecting device further comprises a hydrophilic layer, the hydrophilic layer Provided on the surface of the rustproof layer and the surface of the open platform that is not covered with the rustproof layer, or the hydrophilic layer is disposed in the open platform without covering the rustproof layer On the carrying surface. The biomedical testing device according to claim 1, wherein the material of the plurality of spacers comprises copper, nickel, gold, palladium, a copper-containing alloy, a nickel-containing alloy, a gold-containing alloy, a palladium-containing alloy, or the like. The material of the combination, and/or the signal transmission line, comprises copper, nickel, gold, palladium, a copper-containing alloy, a nickel-containing alloy, a gold-containing alloy, a palladium-containing alloy, or a combination thereof. The biomedical testing device of claim 1, wherein the electronic circuit is located on the carrier, and the encapsulating layer covers the electronic circuit. The biomedical testing device according to claim 1, wherein the encapsulating layer is formed by an Open Cavity Molding method, and covers an outermost partitioning plate on the loading surface. The carrier board is not included. The biomedical testing device according to claim 1, wherein the carrier is formed by a molded interconnecting device. The biomedical testing device of claim 8, wherein the carrier is formed by: providing a substrate; forming the signal transmission line on the substrate; coating the substrate by a filling layer; The signal transmission line is disposed thereon; and the substrate is removed to expose the signal transmission line to a surface of the filling layer. The biomedical testing device of claim 1, wherein the encapsulating layer is formed by: providing a template to abut the carrier; filling a filling melt, wherein the template is configured Blocking the filling melt from flowing into the carrier surface; curing the filling melt to form the encapsulation layer; and removing the template. A method for manufacturing a biomedical testing device, comprising: providing a carrier board, wherein the carrier board comprises a carrier surface and a signal transmission line; and a plurality of spacer boards are disposed on the carrier board and coupled to the signal transmission line, a plurality of spacers for sensing a capacitance value of a liquid to be tested; and forming an encapsulation layer by an open cavity molding to cover a part of the carrier but not covering the carrier surface Thereby, an open platform is formed to facilitate placing the test solution on the load surface. The manufacturing method of the biomedical testing device of claim 11, further comprising: disposing an electronic circuit on the carrier board and coupling the signal transmission line, the electronic circuit receiving and processing the plurality of spacer column sensing The sensing signal generated by the capacitance value. The method of manufacturing a biomedical testing device according to claim 11, wherein the encapsulating layer covers the electronic circuit. The manufacturing method of the biomedical testing device according to claim 11, wherein the carrier is manufactured by: providing a substrate; forming the signal transmission line on the substrate; coating by a filling layer The substrate and the signal transmission line thereon; and removing the substrate to expose the signal transmission line to the first surface of the filling layer. The manufacturing method of the biomedical testing device of claim 14, further comprising: grinding the filling layer to expose a portion of the signal transmission line to the second surface of the filling layer, the second surface Relative to the aforementioned first surface. The method for manufacturing a biomedical testing device according to claim 11, wherein the step of forming an encapsulating layer by means of open cavity molding comprises: providing a template to abut on the carrier; filling in a filling melt flow, wherein the template is configured to block the filling melt from flowing into the carrier surface; curing the filling melt to form the encapsulation layer; and removing the template. The method of manufacturing a biomedical testing device according to claim 16, wherein the template comprises a protrusion, and when the template is placed on the carrier, the protrusion abuts the plurality of intervals The outermost partitioning plate of the plate isolates the filling melt flow so that the filling melt flow does not flow into the loading surface.