TW201731157A - 帶有天線的框體及使用其之電子機器以及帶有天線的框體之製造方法 - Google Patents

帶有天線的框體及使用其之電子機器以及帶有天線的框體之製造方法 Download PDF

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Publication number
TW201731157A
TW201731157A TW105137175A TW105137175A TW201731157A TW 201731157 A TW201731157 A TW 201731157A TW 105137175 A TW105137175 A TW 105137175A TW 105137175 A TW105137175 A TW 105137175A TW 201731157 A TW201731157 A TW 201731157A
Authority
TW
Taiwan
Prior art keywords
antenna
radio wave
region
frame
wave shielding
Prior art date
Application number
TW105137175A
Other languages
English (en)
Chinese (zh)
Inventor
朝日昇
宮本芳範
佐佐木英晃
岡田賢也
橳島英樹
重田和樹
Original Assignee
東麗工程股份有限公司
東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東麗工程股份有限公司, 東麗股份有限公司 filed Critical 東麗工程股份有限公司
Publication of TW201731157A publication Critical patent/TW201731157A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Support Of Aerials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW105137175A 2015-11-25 2016-11-15 帶有天線的框體及使用其之電子機器以及帶有天線的框體之製造方法 TW201731157A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015229493 2015-11-25

Publications (1)

Publication Number Publication Date
TW201731157A true TW201731157A (zh) 2017-09-01

Family

ID=58763075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105137175A TW201731157A (zh) 2015-11-25 2016-11-15 帶有天線的框體及使用其之電子機器以及帶有天線的框體之製造方法

Country Status (3)

Country Link
JP (1) JPWO2017090417A1 (ja)
TW (1) TW201731157A (ja)
WO (1) WO2017090417A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109994826A (zh) * 2017-12-29 2019-07-09 深圳市海德门电子有限公司 一种基于lds工艺的近场通讯天线及其通讯设备
CN112235005B (zh) * 2019-06-30 2022-01-04 Oppo广东移动通信有限公司 显示屏组件、天线组件及电子设备
JPWO2022239238A1 (ja) * 2021-05-14 2022-11-17

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000219829A (ja) * 1999-01-29 2000-08-08 Toppan Forms Co Ltd 光硬化導電ペーストとこれを塗工したシート類
JP4960153B2 (ja) * 2007-06-19 2012-06-27 株式会社東芝 電子機器
US8896488B2 (en) * 2011-03-01 2014-11-25 Apple Inc. Multi-element antenna structure with wrapped substrate
JP2012253094A (ja) * 2011-05-31 2012-12-20 Sony Corp 電子機器
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路

Also Published As

Publication number Publication date
JPWO2017090417A1 (ja) 2018-09-13
WO2017090417A1 (ja) 2017-06-01

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