TW201727698A - Substrate separating method characterized by preventing circuits formed on a substrate from being irradiated by light and separating a substrate from a laminated body quickly - Google Patents

Abstract

The present invention is to prevent circuits formed on a substrate from being irradiated by light and to separate a substrate by a laminated body quickly. The whole periphery of a surrounding-circuit-formation area in a substrate 1 that is formed with opposite circuits and at least a part of a separation layer 4 that is obtained by stacking in a specific area occupying an area of 65%~100% width of a non-circuit-formation area in a radius direction are irradiated by laser light L, so as to separate the substrate by laminated body 10.

Description

Support separation method

The present invention relates to a method of separating a support.

In recent years, electronic devices such as IC cards and portable telephones have been required to be thinner, smaller, and lighter. In order to meet these requirements, it is also necessary to use a thin semiconductor wafer with respect to the mounted semiconductor wafer. Therefore, the thickness (film thickness) of the wafer substrate which is the basis of the semiconductor wafer is 125 to 150 μm in the current state, but it is necessary to form 25 μm to 50 μm for the next generation wafer system. Therefore, in order to obtain the thin film formation step of the wafer substrate wafer substrate having the above film thickness, it is necessary to be indispensable.

Since the wafer substrate is thinned and the strength is lowered, in order to prevent damage of the thinned wafer substrate, in the manufacturing process, the wafer substrate is bonded to the support plate and automatically transferred, and the circuit is mounted on the wafer substrate. Structures. Then, after the manufacturing process, the wafer substrate is separated from the support plate. Therefore, various methods of peeling off the support from the wafer substrate have been used so far.

Patent Document 1 describes a member peeling method, which The step of arranging the photothermal conversion layer on at least a part of the outer edge of the first main surface, and disposing the photothermal conversion layer between the first main surface and the second main surface, and the first main surface and the The second main surface is joined to each other via the adhesive layer, the step of irradiating the laser light to the photothermal conversion layer, and the outer peripheral portion of the member of the first member and the second member to the first portion A force is applied to the member and the second member from the direction in which the other member is separated, and the first member is at least partially peeled off from the second member.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2015-122370 (published on July 2, 2015)

In contrast to the member peeling method described in Patent Document 1, the area where the light is irradiated to the separation layer (photothermal conversion layer) is small, and the new support body can be smoothly separated from the laminate by the laminate. According to the method, it is possible to prevent the circuit formed on the substrate from being irradiated with light and to quickly separate the support from the laminate. Therefore, the support separation method is expected.

The present invention has been made in view of the foregoing problems, and an object thereof is to provide a novel support separation method which can prevent a pair from being formed on a substrate The circuit illuminates the light while the support can be quickly separated by the laminate.

In order to solve the above-described problems, the support separation method of the present invention separates a substrate and a support for transmitting light by a laminate formed by laminating a separation layer which is deteriorated by absorption of light. The support body separation method of the support body is characterized in that the substrate has a circuit formation region in which a circuit is formed, and a non-circuit formation region in which the circuit is not formed over the entire circumference of the circuit formation region, and the method includes A light irradiation step of arranging the entire circumference of the circuit formation region so as to face the substrate, and occupying 65% or more of the width in the radial direction of the non-circuit formation region, and not exceeding 100%, via the support body At least a part of the separation layer laminated in a specific region is irradiated with light, and a separation step is performed by applying a force to the laminate that has irradiated the light, and the support is separated by the laminate.

By exhibiting an effect by the present invention, it is possible to provide a novel support separation method which can prevent the circuit formed on the substrate from being irradiated with light while the support can be quickly separated from the laminate.

1‧‧‧Substrate

2‧‧‧Support plate (support)

3‧‧‧Next layer

4‧‧‧Separation layer

4A‧‧‧Area (separation layer)

4B‧‧‧ Area (separation layer)

4C‧‧‧ area (separation layer)

4C-1‧‧‧divided area (separation layer)

4C-2‧‧‧divided area (separation layer)

5‧‧‧Cut Tape

6‧‧‧cut box

10‧‧‧Layer

50‧‧‧Laser illumination device

L‧‧‧Light

W1‧‧ wide

W2‧‧ wide

[Fig. 1] A support body according to an embodiment of the present invention is described A schematic diagram of the method.

[Fig. 2] A schematic view of a region where light is incident on a separation layer in a method for separating a support according to an embodiment of the present invention.

[Fig. 3] A schematic view showing a light irradiation stage included in a support separation method according to an embodiment and a modification of the present invention.

[Fig. 4] A schematic view showing an illumination pattern of a support separation method according to an embodiment of the present invention.

<Support separation method according to the first embodiment>

A method of separating a support body according to an embodiment (first embodiment) of the present invention will be described in more detail with reference to Figs. 1 to 4 .

As shown in Fig. 1(a), the support separation method according to the present embodiment is a substrate 1 made of ruthenium and a support plate (support) 2 made of ruthenium, via the subsequent layer 3, and borrowed. The laminate 10 is formed by laminating the separation layer 4 which is deteriorated by the absorption of the laser light L, and the support plate 2 is separated. Further, the laminated body 10 has a circular shape in plan view. Further, in the laminate 10, the dicing tape 5 is adhered to the substrate 1 side, and the dicing tape 5 is provided with a dicing frame 6.

As shown in FIG. 1(b), the support separation method according to the present embodiment includes a light irradiation step in which the light irradiation step and the rotation phase are alternately repeated, and the region 4C in the separation layer 4 is applied. The entire area is irradiated with laser light L (Fig. 2(a)). Still, in relation to this reality In the support separation method of the embodiment, the so-called swirling phase and the light irradiation phase may be performed at different times, and any of them may be performed first.

Further, as shown in (c) and (d) of the first embodiment, the support separation method according to the present embodiment includes applying force to the laminated body 10 to which the laser light L has been irradiated, and separating the support plate 2 by the laminated body 10. Separation step.

[Light irradiation step]

The light irradiation step included in the support separation method of the present embodiment will be described in more detail. As shown in FIG. 1(b) and FIG. 2(a), in the light irradiation step, by completely repeating the light irradiation phase and the rotation phase, the entire circuit formation region is surrounded by the substrate 1 in the opposite direction. The region 4C of the separation layer 4 laminated in a manner of not occupying a specific region of the region of the non-circuit formation region is irradiated with light via the support plate 2 at a level of 65% or more in the radial direction of the non-circuit formation region.

Thereby, the area where the separation layer 4 is irradiated with the laser light L can be made small. Therefore, the time required for performing the light irradiation step can be shortened.

(circuit formation area)

The circuit formation region means a region formed by a structure such as an integrated circuit on the inner peripheral portion of the substrate 1. Further, in the circuit formation region, the structure such as the integrated circuit can be formed on the side exposed to the outside of the laminate 10 of the substrate 1, and on both sides of the side of the subsequent layer 3 of the substrate 1. Or either party. The circuit formation region of the substrate 1 is in the laminate 10 so as to be located in comparison with the dotted line A1 located on the separation layer 4. The side area 4A is arranged (Fig. 2(a)).

(non-circuit forming area)

The non-circuit forming region means that the substrate 1 surrounds the entire circumference of the circuit formation region, and occupies a region further outside the peripheral end portion of the circuit formation region than the outer peripheral end portion of the substrate 1. The non-circuit formation region of the substrate 1 is disposed on the laminate 10 so as to be disposed in a region 4B located between the broken line A1 and the broken line A2 of the separation layer 4 (Fig. 2(a)). Here, the outer peripheral end portion of the substrate 1 is disposed above the broken line A2 of the separation layer 4.

(specific area)

The specific region is a region that is formed by dividing a specific region by enclosing the entire circumference of the circuit formation region and occupying a region in which the width of the non-circuit formation region is 65% or more and less than 100%. Further, in the support separation method according to the present embodiment, the inner peripheral end portion of the specific region of the substrate 1 is separated from the outer peripheral end portion of the circuit formation region, and the peripheral end portion of the specific region is separated from the outer peripheral end portion of the substrate 1. . In the laminated body 10, the separation layer 4 is disposed in a specific region of the substrate 1, and is disposed in a region 4C between the broken line B1 and the broken line B2 (Fig. 2(a)).

(dividing a specific area)

The division of a specific region means that the center point of the laminate 10 is set. A region that is divided at a specific angle or the like in a specific region of the substrate 1 is centered. The divided specific region of the substrate 1 is in the laminated body 10 so as to correspond to the divided region 4C divided by the region 4C by the single-dot chain lines C1 to C3 of the separation layer 4 shown in (a) of Fig. 2 The configuration of the divided regions exemplified by -1 and 4C-2. In addition, the angle at which the specific region of the substrate 1 is divided may be an angle at which the center point of the laminate 10 is equally divided, and for example, 20°, 30°, or 45° is preferable, and 20° is preferable.

(light irradiation stage)

In the light irradiation stage, the laminated body 10 is irradiated with light to each divided region of the separation layer 4 via the support plate 2. For example, the laser light L is irradiated to each divided region in which the specific angle is equally divided by 20°. Thereby, the scanning range of the laser light L irradiated by the laser irradiation device 50 can be narrowed, and the shape of the irradiation pattern which is generated when the laser light L is scanned can be reduced. Therefore, it is possible to prevent the laser light L that has been irradiated onto the divided region 4C-1 of the separation layer 4 from being irradiated out of the range, and it is possible to suitably prevent the circuit provided on the substrate 1 and the dicing tape 5 from being irradiated with light.

Further, as shown in (a) of FIG. 3, in the light irradiation stage, the region of the width W2 which is 65% or more and less than 100% of the non-circuit formation region having the width W1 in the radial direction of the substrate 1 is used. The separation layer 4 of the specific region is divided to illuminate the laser light L. Further, the width W1 is also the width in the radial direction of the region 4B of the separation layer 4 shown in (a) of Fig. 2 . Further, the width W2 is also the width in the radial direction of the divided region 4C-1 of the separation layer 4 shown in (a) of Fig. 2 .

The width W1 of the non-circuit forming region is not limited as long as it is appropriately set depending on the size of the substrate. However, the substrate having a diameter of about 300 mm (12 inches) used in the present embodiment is larger than 1.0 mm, 3.0. It is ideal in the range of widths below mm, and is preferably in the range of more than 1.3 mm and widths of 2.0 mm or less.

Further, the width W2 of the division specific region (in other words, the width of the divided region 4C-1 of the separation layer 4) is 65% or more of the width W1 of the non-circuit formation region, and the width within the range of less than 100% is ideal and wide. The smaller the W1 is, the larger the ratio of the width W1 and the width W2 becomes. Thereby, at least a part of the separation layer 4 can be deteriorated by appropriately separating the support sheets 2 from the laminate 10 by performing the separation step thereafter.

In the light irradiation stage, when the laser beam L is irradiated to the separation layer 4 in the region 4C-1 via the support plate 2, the laser beam L is used to deteriorate the separation layer 4 while being transmitted through the separation layer 4 to be irradiated on the substrate. 1 divides a specific area. Here, in the substrate 1, the division specific region occupying the width W2 is separated by the circuit formation region of the substrate 1. Therefore, it is possible to smoothly prevent the laser light L from being irradiated onto the circuit formed in the circuit formation region of the substrate 1 as compared with the case where the inner side of the division specific region is set to be in contact with the circuit formation region. Therefore, it is possible to prevent the circuit from being damaged by the laser light L. Further, in the substrate 1, the division specific region occupying the width W2 is separated from the outer peripheral end portion of the substrate 1. Therefore, it is possible to smoothly prevent the laser light L from being irradiated to the outside of the outer peripheral end portion of the substrate 1 as compared with the case where the peripheral end portion of the divided specific region is overlapped with the outer peripheral end portion of the substrate 1. Therefore, it is possible to more suitably prevent the dicing tape 5 located outside the peripheral end portion of the substrate 1 from being irradiated by the laser light L, and the dicing tape 5 is damaged.

In the present specification, the term "deterioration" of the separation layer means a state in which the separation layer can be broken by a slight external force or a state in which the adhesion force of the layer in contact with the separation layer is low. As a result of the deterioration of the separation layer generated by the absorption of light, the separation layer loses the strength or adhesion before the irradiation of the received light. In summary, the separation layer 4 becomes brittle by absorbing light. The metamorphic system of the separation layer may be a substance that constitutes the separation layer, such as decomposition due to energy of absorbed light, change in spatial arrangement, or dissociation of functional groups. The metamorphic layer of the separation layer 4 is produced as a result of absorbing light.

Therefore, for example, the support plate and the substrate can be easily separated by, for example, deforming only by raising the support plate and breaking it. More specifically, for example, one of the substrate and the support plate of the laminate is fixed to the mounting table by a support separation device or the like, and the other is held by the adsorption pad (holding portion) provided with the adsorption means. When the support plate and the substrate are separated, or the chamfered portion of the end portion of the peripheral portion of the support plate is gripped by a separation plate such as a jig (claw portion), the substrate and the support plate can be separated. Further, for example, by a support separating device including a peeling means for supplying a peeling liquid for peeling off the adhesive, the support plate may be peeled off from the substrate of the laminate. By applying the peeling liquid to at least a part of the peripheral end portion of the adhesive layer of the laminate by the peeling means, by swelling the adhesive layer of the laminate, the adhesive layer can be swollen and concentrated in the separation layer. Way, on the substrate Apply force to the support plate. Therefore, the substrate and the support plate can be appropriately separated.

In addition, the external force is applied to the laminate, that is, the external force is appropriately adjusted depending on the size of the laminate, and the material of the support plate (support) such as glass or crucible, and the like. A laminate having a diameter of about 300 mm is, for example, a force of about 0.1 to 5 kgf. The substrate and the support plate can be appropriately separated by applying a force of about 0.1 to 5 kgf.

In the support separation method according to the present embodiment, a CO ₂ laser (carbonic acid laser) is used as the laser light L that emits light irradiated to the separation layer 4 . Thereby, it is possible to generate the laser light L that passes through the support plate 2 composed of the crucible.

In the laser light irradiation condition, the average output value of the laser light is preferably 1.0 W or more and 5.0 W or less, and more preferably 3.0 W or more and 4.0 W or less. The repetition frequency of the laser light is preferably 20 kHz or more and 60 kHz or less, and preferably 30 kHz or more and 50 kHz or less. The scanning speed of the laser light is preferably 100 mm/s or more and 10000 mm/s or less. Thereby, the laser irradiation conditions can be set for the conditions suitable for deteriorating the separation layer 4.

Here, the illumination pattern of the laser light L is, for example, as shown in (a) to (f) of Fig. 4, and any one of a linear shape, a spiral shape, a polygonal dot shape, a dot shape, a polygonal ring shape, or a ring shape is preferable. In the light irradiation stage, between the broken lines B1 and B2 at the boundary of the separation layer 4 in the radial direction, an area occupying 50% or more of the area of the divided area in which the divided areas 4C-1 and 4C-2 are started is occupied. , forming a pattern of illumination of light. Thereby making The separation layer 4 in the divided region 4C-1 is suitably deteriorated and becomes brittle.

For example, as shown in (a) of FIG. 4, in the case of adopting a linear linear pattern, the direction of the linear pattern is not limited. Further, if the pattern can be formed by 50% or more of the area of the divided area, the width and the number of lines of the pattern of the line are not limited. Further, among the patterns shown in (a) to (f) of Fig. 4, the linear line pattern is optimal at the point of shortening the irradiation time of the laser light L for the divided region. .

Further, as shown in FIG. 4(b), the illumination pattern of the laser light L may be a spiral pattern. The pattern of the line shape in which the spiral is drawn is the same as the pattern of the line shape, and can be continuously formed in the divided region of the separation layer 4, which is preferable in that the irradiation time of the laser light L is shortened. Further, when irradiated to the divided region 4C-1 of the separation layer 4, a space in which the laser light L is repeatedly irradiated is generated in a spiral pattern. However, in the support separation method according to the present embodiment, the laser beam L that has passed through the separation layer 4 is irradiated on the division-specific region of the substrate 1, and therefore is not irradiated onto the circuit and the dicing tape 5 formed on the substrate 1. Therefore, in the place where the laser light L is repeatedly irradiated, the integrated circuit formed on the substrate 1 and the dicing tape 5 can be prevented from being damaged even if the irradiation output of the laser light L is not excessively adjusted.

Further, as shown in (c) of FIG. 4, the illumination pattern of the laser light L is a polygonal dot shape, and may be, for example, a square dot shape. Here, the size of each dot of the square dot shape is such that the inner peripheral portion of the divided region 4C-1 can form a pattern so as to occupy an area of 50% or more of the area of the divided region. It is not limited. Similarly, as shown in (d) of FIG. 4, the illumination pattern of the laser light L may also be a dot shape. Such a dot pattern having a polygonal dot shape and a dot shape is shorter than the linear shape to shorten the time of irradiation on the divided region, and is preferable in that the divided region can densely form a pattern.

Further, as shown in (e) of FIG. 4, the illumination pattern of the laser light L may be a polygonal ring shape. Further, as shown in (f) of Fig. 4, the illumination pattern of the laser light L may be a ring shape. By forming these polygonal annular and annular patterns, the separation layer 4 in the divided region 4C-1 can be suitably deteriorated. However, in the pattern of each ring, the width of the ring pattern and the size of the pattern can also be appropriately adjusted.

(rotation phase)

In the swirling stage, the layered body 10 of the laser beam L is irradiated to the divided area by the light irradiation stage, and the center point of the layered body 10 is centered, and the plane of the layered body 10 is rotated at a specific angle. . In the support separation method according to the present embodiment, the region 4C of the separation layer 4 is divided by a specific angle of 20 or the like. Therefore, in the swirling stage, the laminated body 10 of the laser beam L is irradiated to the divided region 4C-1 of the separation layer 4 by a light irradiation step, and is rotated at a specific angle of 20°. Thereby, the laser irradiation device 50 is disposed above the divided region 4C-2 of the separation layer 4 of the laminate 10.

Thereafter, the separation layer 4 in the divided region 4C-2 is deteriorated by the light irradiation step. Further, the rotation phase and the light irradiation phase are alternately repeated, and the laser light L is irradiated to the entire region 4C of the separation layer 4.

Still, in the spinning stage, the cutting glue with the cutting frame 6 will be provided. The laminate 10 having the tape 5 attached to the substrate 1 side may be fixed to, for example, a mounting table having a porous portion and a rotatable platform (not shown), and may be rotated at a specific angle.

(separation step)

In the separation step, a force is applied to the laminated body 10 to which the laser light L has been irradiated, and the support plate 2 is separated by the laminated body 10 ((c) of Fig. 1). More specifically, for example, a state in which the substrate 1 side of the laminate 10 is fixed by a rotatable platform is adsorbed by a separation plate (holding portion, not shown) including a suction pad such as a bellows pad. The upper surface of the support plate 2 is held while raising the separation plate. Thereby, a force is applied to the laminated body 10, and the support plate 2 is separated by the laminated body 10.

Further, in the support separation method according to the present embodiment, in the light irradiation step, the separation layer 4 in the entire region 4C is deteriorated by alternately performing the light irradiation step and the swirling step. In short, in the laminate 10, the peripheral portion of the separation layer 4 is deteriorated throughout the entire circumference. Therefore, after the light irradiation step, the direction of the laminate 10 is not specified, and the peripheral portion of the support plate 2 of the laminate 10 can be held, and the separation step can be performed. Further, in the separation step, if a force is applied to the laminate 10, the force is concentrated in the region 4C to the deteriorated separation layer 4. Thus, first, the separation layer 4 in the region 4C is broken, and then the separation layer 4 other than the region C is destroyed by the force concentrated on the separation layer 4 other than the region C. Thereby, the support plate 2 can be appropriately separated by the laminated body 10.

Still, in the separation step, for example via a floating joint or universal A joint (not shown) of a joint or the like is separated from the support plate 2 by the laminate 10 by raising the separation plate. Such a joint is rotatable and is movable in an inclined manner with respect to the plane of the laminate 10 fixed to the platform.

When a force is applied to the laminated body 10 by the separating plate via a floating joint or the like, when the force concentrates on a portion of the outer peripheral end portion of the laminated body 10, the floating joint is movable toward a portion of the outer peripheral end portion to face The adsorption pad is in such a manner as to be in contact with the face of the support plate 2, and the separation plate is inclined. Along with this, the support plate 2 in the middle of separation by the laminated body 10 is inclined. Thereby, excessive force can be prevented from being applied to one of the support plate 2 and the substrate 1, and the force can be concentrated on the separation layer 4 which is laminated between the support plate 2 and the adhesive layer 3. Therefore, it is possible to prevent the support plate 2 and the substrate 1 from being damaged by excessive force, and the support plate 2 can be appropriately peeled off from the substrate 1.

[other steps]

After the separation step, as shown in FIG. 1(d), the substrate 1 on which the support plate 2 is separated is attached to the dicing tape 5, and is removed by, for example, a stripping solution containing an organic solvent. A washing step of the residue of layer 3 and separation layer 4. Further, after the washing step, a cutting step of manufacturing a semiconductor wafer from the substrate 1 to which the dicing tape 5 has been attached is performed. Here, the dicing tape 5 to which the substrate 1 has been adhered is prevented from being damaged by the irradiation of the laser light L. Therefore, according to the support separation method of the present embodiment, the dicing tape 5 can be adhered to the laminate 10, and the step of connecting one of the substrates 1 to the semiconductor wafer can be smoothly performed. Therefore, the substrate 1 which has been thinned in the step of forming the circuit on the substrate 1 can avoid being cut on the paste. When the tape was cut 5, it was broken.

[Layer 10]

The laminate 10 used in the support separation method of the present embodiment will be described in more detail. The laminate 10 is formed by laminating the substrate 1, the adhesion layer 3, the separation layer 4, and the support plate 2 in this order.

[Substrate 1]

In the support separation method according to the present embodiment, a wafer substrate made of tantalum is used as the substrate 1. The substrate 1 is supported by the support plate 2 via the adhesive layer 3 and the separation layer 4, and is available for thinning, mounting, and the like. Further, in the circuit formation region of the substrate 1, for example, a structure such as an integrated circuit or a metal bump is attached.

Further, in the support separation method according to the present embodiment, the ruthenium wafer substrate is used as the substrate, but the substrate 1 is not limited to the ruthenium wafer substrate, and a ceramic substrate, a thin film substrate, a flexible substrate, or the like may be used. A substrate made of any material.

[support plate 2]

The support plate (support) 2 supports the support of the substrate 1, and the substrate 1 is adhered via the adhesive layer 3. Therefore, when the support plate 2 is subjected to a process of thinning, transporting, or mounting the substrate 1, it is necessary to have necessary strength in order to prevent breakage or deformation of the substrate 1. Further, it is sufficient to transmit light for deteriorating the separation layer 4.

A support plate made of glass, tantalum or acrylic resin may be used for the support system. However, in the support separation method according to the present embodiment, the support plate 2 made of tantalum is used. By laminating the support plate 2 composed of the crucible on the substrate 1, the difference in thermal expansion coefficient between the substrate 1 and the support plate 2 can be made small, so that the bending of the laminated body 10 due to heating can be reduced.

Further, a notch portion (notch, not shown) for specifying the direction of the support plate 2 is provided on the support plate 2.

[Next layer 3]

Next, the layer 3 is used to attach the substrate 1 to the support plate 2 on which the separation layer 4 has been formed. Further, the adhesive layer 3 is a layer formed by an adhesive used to attach the substrate 1 and the support sheet 2.

The thickness of the layer 3 may be appropriately set according to the type of the substrate 1 and the support plate 2 to be attached, the treatment applied to the substrate 1 after the attachment, and the like, but it is preferably in the range of 10 to 150 μm. It is ideal in the range of 15 to 100 μm.

Next, the layer 3 can be formed, for example, by applying a binder by a method such as spin coating, dipping, roll doctoring, spray coating, or slit coating. Further, the adhesive layer 3 may be formed by, for example, applying an adhesive directly to the substrate 1 or by applying a film to both surfaces (that is, a dry film) in advance, and attaching it to the substrate 1.

As the adhesive for forming the adhesive layer 3, for example, an acrylic type, a phenol type, a naphthoquinone type, a hydrocarbon type, a polyimide type, an elastomer, or the like can be used. Polyurethanes and the like which are generally known in the art.

The resin contained in the adhesive layer, that is, the resin contained in the adhesive layer 3 may have an adhesive property. For example, a hydrocarbon resin, an acrylic-styrene resin, a maleic imine resin, or an elastomer may be preferably used. Resin, polyfluorene-based resin, etc., or a combination thereof. Hereinafter, the composition of the resin contained in the adhesive layer 3 of the embodiment of the present embodiment will be described.

(hydrocarbon resin)

The hydrocarbon resin is a resin having a hydrocarbon skeleton and polymerizing a monomer composition. Examples of the hydrocarbon resin include a cycloolefin polymer (hereinafter referred to as "resin (A)", and at least one selected from the group consisting of a terpene resin, a rosin resin, and a petroleum resin. Hereinafter, there is a case called "resin (B)", but the invention is not limited thereto.

The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin monomer. Specifically, a ring-opening (co)polymer containing a monomer component of a cycloolefin type monomer, and a resin obtained by addition (co)polymerization of a monomer component containing a cycloolefin type monomer are mentioned.

Examples of the cycloolefin-based monomer to be contained in the monomer component constituting the resin (A) include a bicyclic compound such as norbornene and norbornadiene, dicyclopentadiene, and hydroxydicyclopentadiene. a tetracyclic compound, a tetracyclic substance such as tetracyclododecene, a pentacyclic substance such as a cyclopentadiene terpolymer, a heptacyclic substance such as tetracyclopentadiene, or an alkyl group of such a polycyclic substance (methyl, ethyl, propyl, butyl, etc.) substituted, alkenyl (vinyl or the like) substituted, alkylene (ethylene, etc.) substituted, aryl (phenyl, tolyl, naphthyl) Substitute Wait. Among these, a norbornene-based monomer selected from the group consisting of norbornene, tetracyclododecene, or an alkyl-substituted product thereof is preferable.

The monomer component constituting the resin (A) may contain another monomer copolymerizable with the above cycloolefin-based monomer, and for example, an olefin monomer is preferable. Examples of the olefinic system include ethylene, propylene, 1-butene, isobutylene, 1-hexene, and α-olefin. The olefinic system may be linear or branched.

In addition, it is preferable that the monomer component constituting the resin (A) contains a cycloolefin monomer from the viewpoint of high heat resistance (low thermal decomposition and thermogravimetric reduction). The ratio of the cycloolefin monomer of the entire monomer component constituting the resin (A) is preferably 5 mole% or more, more preferably 10 mole% or more, more preferably 20 mole% or more. In addition, the ratio of the cycloolefin monomer of the entire monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mole% or less from the viewpoint of solubility and stability with time in the solution, and 70 mole% or less is preferable. More ideal.

Further, the monomer component constituting the resin (A) may contain a linear or branched olefin monomer. The ratio of the olefin monomer constituting the entire monomer component of the resin (A) is preferably from 10 to 90 mole% from the viewpoint of solubility and flexibility, and more preferably from 20 to 85 mole%, more preferably from 30 to 80 mole%.

In addition, the resin (A) is, for example, a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an olefin monomer, and is a resin having no polar group, and suppresses gas generation at a high temperature. Ideal.

Polymerization method or polymerization condition when polymerizing monomer components The system is not particularly limited and may be appropriately set according to a general method.

For example, a resin (A) having a repeating unit represented by the following chemical formula (1) and a cyclic olefin copolymer of a copolymer represented by the following chemical formula (2) as a binder component can be used.

(In the chemical formula (2), n is an integer of 0 or 1 to 3).

As such a cyclic olefin copolymer, APL 8008T, APL 8009T, and APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

In addition, as a commercially available product which can be used as the resin (A), for example, "TOPAS" manufactured by POLYPLASTICS Co., Ltd., "APEL" manufactured by Mitsui Chemicals Co., Ltd., "ZEONOR" and "ZEONEX" manufactured by Japan ZEON Co., Ltd., and JSR The company's "ARTON" and so on.

The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C or higher, and particularly preferably 70 ° C or higher. When the glass transition temperature of the resin (A) is 60 ° C or more, the softening of the adhesive layer 3 can be further suppressed when the laminate is exposed to a high temperature environment.

The resin (B) is a resin selected from the group consisting of a terpene resin, a rosin resin, and a petroleum resin. Specifically, Examples of the terpene-based resin include a terpene resin, a terpene phenol resin, a modified terpene resin, a hydrogenated terpene resin, and a hydrogenated terpene phenol resin. Examples of the rosin-based resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of the petroleum resin include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone oxime petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are preferred.

The softening point of the resin (B) is not particularly limited, but is preferably from 80 to 160 °C. When the softening point of the resin (B) is 80 to 160 ° C, it is possible to prevent the laminate from softening when exposed to a high temperature environment, and no defects are caused.

The weight average molecular weight of the resin (B) is not particularly limited, but 300 to 3,000 is preferable. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the amount of exhaust gas is reduced in a high temperature environment. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the dissolution rate to the adhesive layer of the hydrocarbon solvent is good. Therefore, the residue of the adhesive layer on the substrate on which the support plate has been separated can be quickly dissolved and removed. In addition, the weight average molecular weight of the resin (B) of this embodiment means the molecular weight of polystyrene converted by gel permeation chromatography (GPC).

Further, as the resin, those in which the resin (A) and the resin (B) are mixed may be used. By mixing, heat resistance is good. For example, the mixing ratio of the resin (A) and the resin (B) is (A): (B) = 80:20 to 55:45 (mass ratio), which is excellent in heat resistance and flexibility in a high-temperature environment. .

(acrylic-styrene resin)

The acrylic-styrene-based resin may, for example, be a resin obtained by polymerizing a derivative of styrene or styrene, a (meth) acrylate or the like as a monomer.

Examples of the (meth) acrylate include (meth)acrylic acid alkyl ester composed of a chain structure, (meth) acrylate having an aliphatic ring, and (meth)acrylic acid having an aromatic ring. ester. Examples of the alkyl (meth)acrylate composed of a chain structure include an acrylic long-terminated alkyl ester having an alkyl group having 15 to 20 carbon atoms, and an acrylic alkyl group having an alkyl group having 1 to 14 carbon atoms. Base ester and the like. Examples of the acrylic sulfonium alkyl esters include an alkyl group of n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, and n-nonadecyl group. An alkyl ester of acrylic acid or methacrylic acid such as n-eicosyl group. Still, the alkyl group may also be branched.

The acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms is a generally known acrylic alkyl ester which is used in an existing acrylic adhesive. For example, the alkyl group may be methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isodecyl, isodecyl, dodecyl, lauryl or tridecyl. An alkyl ester of acrylic acid or methacrylic acid.

Examples of the (meth) acrylate having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, and thiol group. (meth) acrylate, isodecyl (meth) acrylate, tricyclodecyl (meth) propylene The acid ester, tetracyclododecyl (meth) acrylate, dicyclopentyl (meth) acrylate, but isodecyl methacrylate, dicyclopentyl (meth) acrylate is preferred.

The (meth) acrylate having an aromatic ring is not particularly limited, and examples of the aromatic ring system include a phenyl group, a benzyl group, a tolyl group, a fluorenyl group, a biphenyl group, a naphthyl group, a fluorenyl group, and a benzene group. Oxymethyl, phenoxyethyl and the like. Further, the aromatic ring system may have a linear or branched alkyl group having 1 to 5 carbon atoms. In particular, phenoxyethyl acrylate is desirable.

(Malay ylide resin)

Examples of the maleic imine resin-based resin include N-methyl maleimide, N-ethyl maleimide, Nn-propyl maleimide, and N-iso. Propyl maleimide, Nn-butyl maleimide, N-isobutyl maleimide, N-sec-butyl maleimide, N-tert-butyl maleate Imine, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-lauryl malayan Anthracene, N-cyclohexylmaleimide, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-ring Maleic acid having an aliphatic hydrocarbon group such as pentyl maleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide or the like Amine, N-phenylmaleimide, Nm-methylphenylmaleimide, No-methylphenylmaleimide, Np-methylphenylmaleimide, etc. A resin obtained by polymerization of an aromatic aryl maleimide or the like.

(elastomer)

The elastic system preferably contains a styrene unit as a constituent unit of the main chain, and the "styrene unit" may have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an ethoxy group, a carboxyl group and the like. Further, the content of the styrene unit is preferably in the range of 14% by weight or more and 50% by weight or less. Furthermore, it is preferable that the weight average molecular weight of the elastic system is in the range of 10,000 or more and 200,000 or less.

When the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, because it is easily dissolved in a hydrocarbon-based solvent to be described later. The subsequent layer can be removed relatively easily and quickly. Further, by the content of the styrene unit and the weight average molecular weight within the above range, the wafer substrate is a resist solvent (for example, PGMEA, PGME, etc.) and an acid (hydrofluorocarbon) which are exposed when the resist lithography step is applied. Acid, etc., and alkali (TMAH, etc.) exert excellent tolerance.

Further, the above (meth) acrylate may be further blended in the elastomer.

The content of the styrene unit is preferably 17% by weight or more, and more preferably 40% by weight or less.

The preferred range of the weight average molecular weight is 20,000 or more, and more preferably, the range is 150,000 or less.

As the content of the elastic system such as styrene unit, the weight average molecular weight of the elastomer is in the range of 14% by weight or more and 50% by weight or less. When the amount is in the range of 10,000 or more and 200,000 or less, a wide variety of elastomers can be used. For example, polystyrene-poly(ethylene/propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene Block copolymer (SBS), styrene-butadiene-butene-styrene block copolymer (SBBS), and hydride, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene block The copolymer (SEEPS) and the styrene block are a reaction-crosslinked type styrene-ethylene-ethylene-propylene-styrene block copolymer (Septon V9461 (manufactured by Kuraray Co., Ltd.), Septon V9475 (manufactured by Kuraray Co., Ltd.)), and styrene-embedded The segment is a reaction-crosslinked type styrene-ethylene-butylene-styrene block copolymer (Septon V9827 (manufactured by Kuraray Co., Ltd.) having a reactive polystyrene-based hard block), and polystyrene-poly(ethylene- Ethylene/propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl group modification), etc., the content of the styrene unit of the elastomer and the weight average molecular weight can be used. By the above-described range.

In addition, hydrides are also preferred in elastomers. In the case of a hydride, the stability to heat is improved, and deterioration such as decomposition or polymerization is hard to occur. Further, it is also preferable from the viewpoints of solubility in a hydrocarbon solvent and resistance to a solvent.

In addition, it is also preferred to have a block polymer of styrene at both ends of the elastomer. The styrene having high thermal stability is blocked at both ends, so that higher heat resistance is exhibited.

More specifically, a hydride of a block copolymer of an elastomeric system of styrene and a conjugated diene is preferred. The stability to heat is increased, and it is difficult to cause deterioration such as decomposition or polymerization. Further, styrene having high thermal stability is blocked at both ends to exhibit higher heat resistance. Further, it is also preferable from the viewpoints of solubility to a hydrocarbon solvent and resistance to a resist solvent.

For example, "Septon (trade name)" manufactured by Kuraray Co., Ltd., "HYBRAR (trade name)" manufactured by Kuraray Co., Ltd., and "Asahi Kasei Co., Ltd.", which are used as the elastomers to be used in the adhesives of the adhesive layer 3, may be used. "Tuftec (trade name)", "DYNARON (trade name)" manufactured by JSR Corporation.

The content of the elastomer to be contained in the adhesive layer constituting the adhesive layer 3 is, for example, 100 parts by weight or more, preferably 50 parts by weight or more and 99 parts by weight or less, based on the total amount of the adhesive composition. It is preferably in the range of 99 parts by weight or less, and more preferably in the range of 70 parts by weight or more and 95 parts by weight or less. By setting it as such a range, it can hold|maintain the board|substrate and a support board suitably, while maintaining heat resistance.

In addition, the elastomer may be mixed in a plurality of types. In short, the adhesive constituting the adhesive layer 3 may also contain a plurality of types of elastomers. Then, at least one of the plurality of types of elastomers may contain a styrene unit as a constituent unit of the main chain. Further, at least one of the plurality of types of elastomers is in the range of 14% by weight or more and 50% by weight or less, or the weight average molecular weight is in the range of 10,000 or more and 200,000 or less. It is the scope of the invention. In addition The adhesive which forms the adhesive layer 3 may contain a plurality of types of elastomers, and may be adjusted so that the content of the styrene unit and the content of the styrene unit are within the above range. For example, Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd., and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight in a styrene unit ratio of 1 to 1 by weight. In the case of mixing, the styrene content of the entire elastomer contained in the adhesive is 21 to 22% by weight, and thus 14% by weight or more. In addition, for example, when the styrene unit is 10% by weight and the 60% by weight is mixed at a weight ratio of 1 to 1, the ratio is 35% by weight, which is within the above range. The invention may also be in such a form. Further, all of the plurality of types of elastic systems contained in the adhesive constituting the adhesive layer 3 contain styrene units within the above range, and the weight average molecular weight within the above range is most preferable.

It is preferable to form the adhesive layer 3 using a resin other than a photocurable resin (for example, a UV curable resin). It is possible to prevent the use of a resin other than the photocurable resin, and after the peeling or removal of the adhesive layer 3, a residue is generated around the minute unevenness of the substrate 1. In particular, it is preferable that the adhesive agent constituting the adhesive layer 3 is not dissolved in all the solvents but dissolved in a specific solvent. This is because the physical force is not applied to the substrate 1, but can be removed by dissolving the adhesive layer 3 in a solvent. When the adhesive layer 3 is removed, even if the substrate 1 having a low strength is not damaged or deformed, the adhesive layer 3 can be easily removed.

(Polyfluorene resin)

The adhesive for forming the adhesive layer 3 may also contain a polyfluorene-based resin. By forming the adhesive layer 3 with a polyfluorene-based resin, it is possible to produce a laminate in which the support layer is peeled off from the substrate by dissolving the adhesive layer in a subsequent step even if the laminate is processed at a high temperature. When the adhesive layer 3 contains a polyfluorene resin, for example, a laminate may be suitably used in a high-temperature process in which the laminate is treated at a high temperature of 300 ° C or higher by annealing or the like.

The polyfluorene-based resin has a structure composed of a constituent unit represented by the following general formula (3) and a constituent unit of at least one of the constituent units represented by the following general formula (4).

(here, R ¹ , R ² and R ³ of the general formula (3), and R ¹ and R ² in the general formula (4) are each independently composed of a phenylene group, an anthranyl group and a fluorene group. In the group, X' is a carbon group having a carbon number of 1 or more and 3 or less.

The polyfluorene-based resin is formed by providing at least one of a polyfluorene constituent unit represented by the formula (3) and a polyether fluorene constituent unit represented by the formula (4), and is formed into a laminate which is attached. After the substrate 1 and the support plate 2, even if the substrate 1 is treated under high temperature conditions, the layer 3 can be prevented from being insolubilized by decomposition and polymerization. In addition, the polyfluorene-based resin is a polyfluorene resin composed of a polyfluorene constituent unit represented by the above formula (3), and even if it is added Heat to a higher temperature is also stable. Therefore, it is possible to prevent the substrate 1 after the cleaning from being caused by the residue of the adhesive layer.

The weight average molecular weight (Mw) of the polyfluorene-based resin is preferably in the range of 30,000 or more and 70,000 or less, and more preferably in the range of 30,000 or more and 50,000 or less. When the weight average molecular weight (Mw) of the polyfluorene-based resin is in the range of 30,000 or more, for example, an adhesive composition which can be used at a temperature higher than 300 ° C can be obtained. Further, when the weight average molecular weight (Mw) of the polyfluorene-based resin is in the range of 70,000 or less, it can be suitably dissolved depending on the solvent. That is, an adhesive composition which can be suitably removed depending on the solvent can be obtained.

(diluted solvent)

Examples of the diluent solvent used in forming the adhesive layer 3 include linear chains of hexane, heptane, octane, decane, methyl octane, decane, undecane, dodecane, and tridecane. a hydrocarbon having a hydrocarbon number of 4 to 15 and a cyclic hydrocarbon such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene or tetrahydronaphthalene, p-menthane, ortho Mentane, metamentane, diphenyl menthane, 1,4-decanediol, 1,8-nonanediol, decane, norbornane, decane, oxane, decane, longene, Geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, alpha-terpineol, beta-terpineol, gamma-terpineol, terpinene -1-ol, terpinen-4-ol, indoline acetate, 1,4-nonyl oleyl alcohol, 1,8-nonyl oleyl alcohol, decyl alcohol, carvone, ionone, arborvitae Terpene solvent such as ketone, camphor, d-limonene, l-limonene, dipentene, etc.; lactones such as γ-butyrolactone; acetone, methyl Ketones such as ethyl ketone, cyclohexanone (CH), methyl-n-amyl ketone, methyl isoamyl ketone, and 2-heptanone; ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, etc. a polyvalent alcohol; a compound having an ester bond such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate or dipropylene glycol monoacetate; and the above polyvalent alcohol Or a polyvalent alcohol such as a monomethyl ether of a compound of the above ester bond, a monoalkyl ether such as monoethyl ether, monopropyl ether or monobutyl ether, or a compound having an ether bond such as monophenyl ether. a derivative (in which propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME) is desirable); a cycloether such as dioxane, or methyl lactate, Ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, butyl methoxyacetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate An ester or the like; an aromatic organic solvent such as anisole, ethylbenzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenethyl ether or butylphenyl ether.

(other ingredients)

The adhesive constituting the adhesive layer 3 is also in a range that does not impair the essential properties, and may further contain other substances which are miscible. For example, various additives conventionally used for improving the performance of the adhesive, such as an additional resin, a plasticizer, a bonding agent, a stabilizer, a coloring agent, a thermal polymerization inhibitor, a surfactant, and the like can be used.

[separation layer 4]

Next, the separation layer 4 is irradiated by absorption through the support plate 2 The layer of light that is degraded by the material.

The thickness of the separation layer 4 is preferably in the range of 0.05 μm or more and 50 μm or less, and more preferably in the range of 0.3 μm or more and 1 μm or less. If the thickness of the separation layer 4 is in the range of 0.05 μm or more and 50 μm or less, the separation layer 4 can be subjected to desired deterioration by irradiation of light for a short period of time and irradiation of low-energy light. Further, the thickness of the separation layer 4 is preferably from the viewpoint of productivity, and is particularly preferably in the range of 1 μm or less.

Further, in the laminate 10, another layer may be formed between the separation layer 4 and the support plate 2. In this case, the other layers may be composed of a material that transmits light. In this way, it is possible to add a layer which does not interfere with the incidence of light to the separation layer 4, and which has an ideal property or the like attached to the laminate 10. The wavelength of light that can be used differs depending on the kind of material constituting the separation layer 4. Therefore, the material constituting the other layer is not required to transmit all of the light, and a material that transmits light of a wavelength at which the material constituting the separation layer 4 can be deteriorated can be appropriately selected.

Further, the separation layer 4 is preferably formed of a material having a structure that absorbs light, but a separation layer 4 may be formed by adding a material having no structure that absorbs light in a range that does not impair the essential characteristics of the present invention. . Further, it is preferable that the surface of the separation layer 4 on the side opposite to the adhesion layer 3 is flat (no unevenness is formed), whereby the formation of the separation layer 4 can be easily performed, and the attachment can be uniformly attached. .

The separation layer 4 may be appropriately selected depending on the type of the substrate and the support plate 2 and the properties required for the laminate. In the support separation method according to the present embodiment, among the separation layers shown below, it is preferable to use a separation which is deteriorated by a CO ₂ laser which can transmit infrared rays transmitted through the support plate 2 made of ruthenium. Floor.

(fluorocarbon)

The separation layer 4 may also be composed of fluorocarbon. The separation layer 4 is made of fluorocarbon, and absorbs light to cause deterioration. As a result, the strength or adhesion before the irradiation of the received light is lost. Thus, by applying a slight external force (for example, raising the support plate 2 or the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. The fluorocarbon constituting the separation layer 4 can be suitably formed into a film by a plasma CVD (Chemical Vapor Deposition) method.

Fluorocarbon absorbs light having a wavelength within a specific range depending on the type. The fluorocarbon can be suitably deteriorated by irradiating light of a wavelength in the range of absorption of fluorocarbon of the separation layer 4 to the separation layer. Further, it is preferable that the light absorption rate of the separation layer 4 is 80% or more.

As the light system irradiated to the separation layer 4, a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser or the like is suitably used in accordance with a wavelength at which fluorocarbon can be absorbed. Laser lasers such as pigment lasers, laser beams such as CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc. Laser light can be. The wavelength which can deteriorate the fluorocarbon is not limited thereto, and for example, a range of 600 nm or less can be used.

(A polymer having a light absorbing property is included in the polymer of the repeating unit)

The separation layer 4 may also contain a polymer containing a structure having light absorbability in the repeating unit. The polymer is degraded by irradiation with light. The deterioration of the polymer is produced by absorbing light that illuminates the above configuration. The separation layer 4 loses the strength or adhesion before the irradiation of the light as a result of the deterioration of the polymer. Thus, by applying a slight external force (for example, raising the support plate 2 or the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated.

The above structure having light absorbability absorbs light, and a chemical structure which deteriorates a polymer containing the structure as a repeating unit. This structure is, for example, a conjugated π-electron atomic group composed of a substituted or unsubstituted benzene ring, a condensed ring or a heterocyclic ring. More specifically, the structure may be a cardo structure, a diphenyl ketone structure present in a side chain of the polymer, a diphenyl fluorene structure, a diphenyl fluorene structure (diphenyl fluorene structure), Diphenyl structure or diphenylamine structure.

In the case where the above configuration is present in the side chain of the above polymer, the structure can be represented by the following formula.

(wherein R is independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a ketone group, an anthranylene group, a sulfo group or N(R ⁴ )(R ⁵ ) (here, R ⁴ and R ⁵ are each Each of the independent hydrogen atoms or the alkyl group having 1 to 5 carbon atoms, the Z system is absent or -CO-, -SO ₂ -, -SO- or -NH-, and n is 0 or an integer of 1 to 5).

Further, the polymer is contained, for example, in the following formula, and the repeating unit represented by any one of (a) to (d), or (e) or the structure of (f) is included in the main chain. .

(wherein, l is an integer of 1 or more, m is an integer of 0 or 1 to 2, and X is any one of the formulas shown by (a) to (e) above-mentioned "chemical 3", in (f) Any one of the formulas shown in the above "Chemical Formula 3" or the absence of -CO- or SO ₂ -1 which is independent of each of Y ₁ and Y ₂ is preferably an integer of 10 or less).

Examples of the benzene ring, the condensed ring and the hetero ring represented by the above "Chemical 3" The phenyl group, substituted phenyl group, benzyl group, substituted benzyl group, naphthalene, substituted naphthalene, anthracene, substituted anthracene, anthracene, substituted anthracene, acridine, substituted acridine, azobenzene, substituted azobenzene , fluorescamine, substituted fluorescamine, Furuorimon, substituted Furuorimon, carbazole, substituted carbazole, N-alkylcarbazole, dibenzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, anthracene, substituted hydrazine. In the case where the exemplified substituent is a more substituent, the substituent is exemplified by an alkyl group, an aryl group, a halogen atom, an alkoxy group, a nitro group, an aldehyde group, a cyano group, a decylamine group, or a dialkylamino group. , sulfonamide, quinone imine, acid, carboxylate, sulfonic acid, sulfonate, alkylamine and arylamine.

Among the substituents represented by the above-mentioned "Chemical Formula 3", the fifth substituent having two phenyl groups, and the case where Z is -SO ₂ - is exemplified by bis(2,4-dihydroxyl). Phenyl) anthracene, bis(3,4-dihydroxyphenyl)anthracene, bis(3,5-dihydroxyphenyl)anthracene, bis(3,6-dihydroxyphenyl)anthracene, bis(4-hydroxybenzene) Base) bismuth, bis(3-hydroxyphenyl)anthracene, bis(2-hydroxyphenyl)anthracene, and bis(3,5-dimethyl-4-hydroxyphenyl)anthracene.

Among the substituents represented by the above-mentioned "Chemical 3", the fifth substituent having two phenyl groups, and the case where Z is -SO-, bis(2,3-dihydroxybenzene) Athene, bis(5-chloro-2,3-dihydroxyphenyl)arylene, bis(2,4-dihydroxyphenyl)arene, bis(2,4-dihydroxy-6-methyl Phenyl) anthracene, bis(5-chloro-2,4-dihydroxyphenyl)arylene, bis(2,5-dihydroxyphenyl)anthracene, bis(3,4-dihydroxyphenyl) Anthraquinone, bis(3,5-dihydroxyphenyl)arylene, bis(2,3,4-trihydroxyphenyl)anthracene, bis(2,3,4-trihydroxy-6-methylphenyl) Azulene, bis(5-chloro-2,3,4-trihydroxyphenyl)arylene, bis(2,4,6-trihydroxyphenyl)arene, bis(5-chloro-2,4,6 -trihydroxyphenyl) Hey.

Among the substituents represented by the above "Chemical 3", the fifth substituent having two phenyl groups, and examples in the case where Z is -C(=O)-, 2,4-di Hydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,2',5,6'-tetrahydroxydiphenyl Methyl ketone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octyloxybenzophenone, 2-hydroxy-4-dodecylbenzophenone, 2,2' -dihydroxy-4-methoxybenzophenone, 2,6-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxydiphenyl Methyl ketone, 4-amino-2'-hydroxybenzophenone, 4-dimethylamino-2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone , 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4-dimethylamino-2',4'-dihydroxybenzophenone, and 4-di Methylamino-3',4'-dihydroxybenzophenone and the like.

In the case where the above-described structure is present in the side chain of the polymer, the ratio of the above-mentioned polymer in the repeating unit including the above-described structure is such that the transmittance of light to be the separation layer 4 is in the range of 0.001% or more and 10% or less. . When the polymer is prepared so as to be included in such a range, the separation layer 4 sufficiently absorbs light and can be deteriorated reliably and rapidly. That is, it is easy to remove the support plate 2 of the laminated body 10, and the irradiation time of the light necessary for the removal can be shortened.

The above structure is capable of absorbing light having a wavelength of a desired range by the choice of the kind. For example, it is preferable that the wavelength of light absorbable by the above structure is in the range of 100 nm or more and 2,000 nm or less. Within this range, the wavelength of light that can be absorbed by the above structure is shorter wavelength The side is, for example, in the range of 100 nm or more and 500 nm or less. For example, the above configuration is desirably such that the polymer containing the structure can be deteriorated by absorbing ultraviolet light having a wavelength in the range of about 300 nm or more and 370 nm or less.

The above-structured absorbable light system such as a high pressure mercury lamp (wavelength range: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength) : 157 nm), XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid UV laser (wavelength: 355 nm), light, g-line (wavelength: 436 nm), h-line (wavelength: 405 nm) or i line (wavelength: 365 nm) or the like.

The separation layer 4 described above contains a polymer having the above structure as a repeating unit, but the separation layer 4 is further contained, and may contain components other than the above polymer. Examples of the component include a filler, a plasticizer, and a component which can improve the peelability of the support plate 2. These components are suitably selected from substances or materials which have not been impeded or promoted by the absorption of light according to the above structure and the deterioration of the polymer.

(inorganic matter)

The separation layer 4 can also be composed of an inorganic substance. The separation layer 4 is made of an inorganic substance, and absorbs light to cause deterioration. As a result, the strength or adhesion before the irradiation of the received light is lost. Thus, by applying a slight external force (for example, raising the support plate 2 or the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated.

The inorganic material may be formed by absorbing light, and for example, one or more inorganic substances selected from the group consisting of a metal, a metal compound, and carbon may be suitably used. The metal compound refers to a compound containing a metal atom, and may be, for example, a metal oxide or a metal nitride. Examples of such inorganic substances are not limited thereto, and examples thereof include a group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. One or more inorganic substances are selected. Further, the carbon system may also contain the concept of a carbon allotrope, and may be, for example, diamond, fullerene, diamond-like carbon, or carbon nanotube.

The inorganic substance absorbs light having a wavelength in a specific range depending on the type. The above inorganic substance can be suitably deteriorated by irradiating light of a wavelength in a range in which the inorganic substance in the separation layer 4 is absorbed to the separation layer.

The light system irradiated to the separation layer 4 composed of an inorganic substance is, for example, a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, in accordance with a wavelength absorbable by the inorganic substance. Liquid lasers such as solid lasers, pigment lasers, gas lasers such as CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc. Laser light or non-laser light can be used.

The separation layer 4 composed of an inorganic material can be formed on the support plate 2 by, for example, a generally known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating. The thickness of the separation layer 4 composed of an inorganic substance is not particularly limited, as it is sufficiently absorbable The film thickness of the light to be used may be, for example, preferably a film thickness of 0.05 μm or more and 10 μm or less. In addition, an adhesive may be applied to both sides or one surface of an inorganic film (for example, a metal film) composed of an inorganic material constituting the separation layer 4, and attached to the support plate 2 and the substrate 1.

In the case where a metal film is used as the separation layer 4, it is possible to generate a reflection of a laser or a charge to a film by the conditions of the film quality of the separation layer 4, the type of the laser light source, and the laser output. Therefore, it is preferable to provide an anti-reflection film or an anti-static film on the upper or lower side of the separation layer 4, and to achieve such countermeasures.

(a compound having an infrared absorbing structure)

The separation layer 4 can also be formed by a compound having an infrared absorbing structure. This compound is degraded by absorption of infrared rays. The separation layer 4 loses strength or adhesion before irradiation with infrared rays as a result of deterioration of the compound. Thus, by applying a slight external force (for example, raising the support plate 2 or the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated.

The structure having an infrared absorbing property or a structure containing an infrared absorbing property may be, for example, an alkane or an olefin (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, or cumulative). Alkene, cyclic formula, alkyne (monosubstituted, disubstituted), monocyclic aromatic (benzene, monosubstituted, disubstituted, trisubstituted), alcohol and phenol (OH radical, intramolecular hydrogen bond, intermolecular Hydrogen bond, saturated second stage, saturated third stage, unsaturated second stage, unsaturated third stage), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane cyclic ether , peroxide ether, ketone, dialkylcarbonyl, aromatic carbonyl, 1,3-diketone enol, o-hydroxyaryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer, carboxy Acid anion), formate, acetate, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid chloride, Anhydride (conjugated, non-conjugated, cyclic, acyclic), primary guanamine, secondary guanamine, indoleamine, primary amine (aliphatic, aromatic), secondary amine (fat) Family, aromatic), tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic Isonitrile, aromatic isonitrile, isocyanate, thiocyanate, aliphatic thiocyanate, aromatic thiocyanate, aliphatic nitrate compound, aromatic nitrate compound, nitramine, nitrosamine, nitrate, sub Nitrate, nitroso bond (aliphatic, aromatic, monomeric, dimer), sulfur compounds such as thiol, thiophenol and sulfuric acid, thiocarbonyl, hydrazine, hydrazine, sulfonium chloride, primary sulfonamide , a second sulfonamide, a sulfate, a carbon-halogen bond, a Si-A ¹ bond (A ¹ H, C, O or halogen), a PA ² bond (A ² H, C or O), or Ti- O key.

Examples of the structural formula containing the above carbon number-halogen bond include -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=. CF ₂ , fluorinated aryl, and aryl chloride.

Examples of the structure including the Si—A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si—CH ₃ , Si—CH ₂ —, Si—C ₆ H ₅ , SiO—aliphatic, and Si—OCH _{3 .} , Si—OCH ₂ CH ₃ , Si—OC ₆ H ₅ , Si—O—Si, Si—OH, SiF, SiF ₂ , and SiF ₃ . The structure containing a Si-A ¹ bond is particularly preferably a naphthene skeleton and a sesquiterpene skeleton.

Examples of the structure including the PA ² bond include PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , and A ³ ₃ -PO (A ³ aliphatic or aromatic). (A ⁴ O) _3- PO (A ⁴ alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH, and O=P-OH.

The above structure is capable of absorbing infrared rays having a wavelength of a desired range by the selection of the kind. Specifically, the wavelength of the infrared ray which can be absorbed is, for example, in the range of 1 μm or more and 20 μm or less, and can be suitably absorbed in the range of 2 μm or more and 15 μm or less. Further, in the case where the above structure is Si-O bonding, Si-C bonding, and Ti-O bonding, it may be in the range of 9 μm or more and 11 μm or less. Still, the wavelength of the infrared light that can be absorbed by each structure can be easily understood by the industry. For example, as an absorption band in each configuration, reference can be made to the non-patent document: SILVERSTEIN. BASSLER. MORRILL is described in "Identification of Spectra of Organic Compounds (5th Edition) - Combination of MS, IR, NMR, and UV-" (published in 1992) on pages 146 to 151.

As a compound to be used for the formation of the separation layer 4, a compound having a structural formula of infrared absorbing property is a compound having a structure as described above, and if it is soluble in a solvent for coating, it can be cured to form a solid layer. There is no particular limitation. However, in order to effectively deteriorate the compound in the separation layer 4, it is preferable to separate the support plate 2 from the substrate 1 so that the absorption of infrared rays in the separation layer 4 is large, that is, the infrared rays when the separation layer 4 is irradiated with infrared rays. The transmission rate is low. Specifically, it is preferable that the transmittance of infrared rays in the separation layer 4 is less than 90%, and the transmittance of infrared rays is less than 80%. More ideal.

As an example of the compound having a oxoxane skeleton, for example, a resin having a repeating unit represented by the following chemical formula (5) and a copolymer of a repeating unit represented by the following chemical formula (6), or It is a resin which is a repeating unit represented by the following chemical formula (5) and a copolymer derived from a repeating unit of an acrylic compound.

(In the chemical formula (6), R ⁶ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms).

In the above, the compound having a fluorinated alkane skeleton is a t-butyl styrene (TBST)-dimethyl group which is a repeating unit represented by the above chemical formula (5) and a repeating unit represented by the following chemical formula (7). The hydrazine-based oxyalkylene copolymer is preferably contained in a repeating unit represented by the above chemical formula (5) and a repeating unit represented by the following chemical formula (7) in a ratio of 1:1, TBST-dimethyloxane copolymer For the better.

Further, as the compound having a sesquiterpene oxide skeleton, for example, a resin having a copolymer of a repeating unit represented by the following chemical formula (8) and a repeating unit represented by the following chemical formula (9) can be used.

(In the chemical formula (8), R ⁷ is hydrogen or an alkyl group having 1 or more and 10 or less carbon atoms, and in the chemical formula (9), R ⁸ is an alkyl group having 1 or more and 10 or less carbon atoms or a phenyl group).

The compound having a sesquiterpene skeleton may be combined with In Japan, JP-A-2007-258663 (published on October 4, 2007), JP-A-2010-120901 (published on June 3, 2010), and JP-A-2009-263316 (2009) Each of the sesquioxaxane resins disclosed in Japanese Laid-Open Patent Publication No. 2009-263596 (published on Nov. 12, 2009).

In particular, the compound having a sesquiterpene skeleton is preferably a repeating unit represented by the following chemical formula (10) and a repeating unit represented by the following chemical formula (11), and is preferably the following chemical formula (10) The repeating unit shown and the repeating unit represented by the following chemical formula (11) are more preferably a copolymer of 7:3.

The polymer having a sesquiterpene skeleton may have a random structure, a trapezoidal structure, or a cage structure, and any of the structures may be used.

Further, examples of the compound containing a Ti-O bond include (i) tetra-i-propoxy titanium, tetra-n-butoxy titanium, ruthenium (2-ethylhexyloxy) titanium, and titanium. Alkoxy titanium such as -i-propoxy octyl glycolate; (ii) di-i-propoxy bis (acetyl acetonide) titanium, and propane dioxy titanium bis (ethyl acetonitrile) Chelate titanium; (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ , and nC ₄ H ₉ O-[-Ti( OnC ₄ H ₉ ) ₂ -O-] _n -nC ₄ H ₉ such as titanium polymer; (iv) tri-n-butoxy titanium monostearate, titanium stearate, di-i-propoxy Titanium diisostearate, and titanium dichloride of (2-n-butoxycarbonylbenzylideneoxy) tributoxide, etc.; (v) di-n-butoxy bis (three) Ethanolamine) a water-soluble titanium compound such as titanium.

Among them, as a compound containing a Ti-O bond, it is a di-n-butoxy bis (triethanolamine ketone) titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) ₂ ] ₂ ) is ideal.

The separation layer 4 described above contains a compound having a structure having infrared absorbing properties, but the separation layer 4 is further contained, and may contain components other than the above compounds. Examples of the component include a filler, a plasticizer, and a component which can improve the peelability of the support plate 2. These components are suitably selected from those generally known in the art or materials which do not hinder or promote the absorption of infrared rays according to the above structure and the deterioration of the compound.

(infrared absorbing material)

The separation layer 4 may also contain an infrared absorbing material. The separation layer 4 is composed of an infrared absorbing material, and absorbs light to cause deterioration. As a result, the strength or adhesion before the irradiation of the received light is lost. Thus, by applying a slight external force (for example, raising the support plate 2, etc.) The support layer 2 and the substrate 1 can be easily separated by breaking the separation layer 4.

The infrared absorbing material may be formed by absorbing infrared rays, and for example, carbon black, iron particles, or aluminum particles may be suitably used. The infrared absorbing material absorbs light having a wavelength within a specific range depending on the type. By irradiating the separation layer 4 with light having a wavelength in a range in which the infrared absorbing material of the separation layer 4 is absorbed, the infrared absorbing material can be appropriately deteriorated.

(reactive polysesquioxane)

The separation layer 4 can be formed by polymerizing a reactive polysesquioxane, whereby the separation layer 4 has high chemical resistance and high heat resistance.

In the present specification, the reactive polysesquioxane is a polysilsesquioxane having a sterol group at the end of the polysilsesquioxane skeleton or a functional group capable of forming a sterol group by hydrolysis. By condensing the sterol group or a functional group capable of forming a decyl group, it is possible to polymerize with each other. Further, when the reactive polysesquioxane is a functional group having a sterol group or a sterol group, a sesquiterpene skeleton having a random structure, a cage structure, a trapezoidal structure or the like can be used.

Further, the reactive polysesquioxane having a structure represented by the following formula (12) is preferred.

In the formula (12), R" is independently selected from the group consisting of hydrogen and an alkyl group having 1 or more carbon atoms and 10 or less alkyl groups, and is composed of hydrogen and an alkyl group having 1 or more carbon atoms and 5 or less carbon atoms. It is preferable to select a group. If R is hydrogen or an alkyl group having a carbon number of 1 or more and 10 or less, the reactive polycondensation represented by the formula (12) can be obtained by heating in the separation layer forming step. The hemidecane is suitably condensed.

In the formula (12), an integer of 1 or more and 100 or less in p is preferable, and an integer of 1 or more and 50 or less is preferable. The reactive polysesquioxane is formed by using a repeating unit represented by the formula (12), and is formed by using other materials, and has a higher content of Si-O bonds, and can be formed in infrared rays (0.78 μm or more, 1000 μm or less) is preferably a far infrared ray (3 μm or more and 1000 μm or less), and more preferably a separation layer 4 having a high absorbance of a wavelength of 9 μm or more and 11 μm or less.

Further, in the formula (12), R' is an organic group which is independent of each other, or which is the same or different from each other. Here, R is, for example, an aryl group, an alkyl group, an alkenyl group or the like, and these organic groups may have a substituent.

When R' is an aryl group, a phenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group or the like is exemplified, and a phenyl group is preferred. Further, the aryl group may be bonded to the polysilsesquioxane skeleton via an alkylene group having 1 to 5 carbon atoms.

When R' is an alkyl group, the alkyl group may be a linear, branched or cyclic alkyl group. Further, when R is an alkyl group, the carbon number is preferably from 1 to 15, and preferably from 1 to 6. Further, in the case where R is a cyclic alkyl group, it may be an alkyl group having a monocyclic or two to four cyclic structure.

When R' is an alkenyl group, as in the case of an alkyl group, a linear, branched or cyclic alkenyl group may be mentioned, and an alkenyl group having a carbon number of 2 to 15 is desirable, and 2 to 6 is preferable. It is ideal. Further, in the case where R is a cyclic alkenyl group, it may be an alkenyl group having a monocyclic or two to four cyclic structure. Examples of the alkenyl group include a vinyl group and an allyl group.

Further, examples of the substituent which R' may have include a hydroxyl group and an alkoxy group. When the substituent is an alkoxy group, a linear, branched or cyclic alkyl alkoxy group may be mentioned, and the alkoxy group has a carbon number of from 1 to 15 and preferably from 1 to 10. ideal.

Further, in one aspect, the content of the oxonane of the reactive polysesquioxane is preferably 70 mole% or more and 99 mole% or less, and preferably 80 mole% or more and 99 mole% or less. When the content of the oxonane of the reactive polysesquioxanes is 70 mole% or more and 99 mole% or less, it is possible to form infrared rays (preferably, far infrared rays, more preferably light having a wavelength of 9 μm or more and 11 μm or less). A suitably degraded separation layer.

Further, in one aspect, the weight average molecular weight (Mw) of the reactive polysesquioxane is preferably 500 or more and 50,000 or less, and more preferably 1,000 or more and 10,000 or less. Reactive poly half When the weight average molecular weight (Mw) of the decane is 500 or more and 50,000 or less, it can be suitably dissolved in a solvent, and can be suitably applied to a support plate.

Commercially available products which can be used as the reactive polysesquioxane include, for example, SR-13, SR-21, SR-23, and SR-33 manufactured by Kosei Chemical Industry Co., Ltd.

〔other〕

In the support separation method according to the present embodiment, as the other configuration, the dicing tape 5 including the dicing frame 6 can be used.

(Cutting Tape 5)

The dicing tape 5 is adhered to the side of the substrate 1 of the laminate 10. The dicing tape 5 is used by manufacturing the semiconductor wafer by cutting the substrate 1 from which the support plate 2 has been peeled off.

As the dicing tape 5, for example, a dicing tape 5 having a structure in which an adhesive layer is formed on a base film can be used. As the base film, for example, a resin film of PVC (polyvinyl chloride), polyolefin, or polypropylene can be used. The outer diameter of the dicing tape 5 is larger than the outer diameter of the substrate 1, and if it adheres to the outer edge portion of the substrate 1, a part of the dicing tape 5 is exposed.

(Cutting Box 6)

A cutting frame 6 for preventing deflection of the dicing tape 5 is attached to the outer periphery of the exposed surface of the dicing tape 5. The cutting frame 6 is, for example, a cutting frame made of metal such as aluminum or an alloy made of stainless steel (SUS). Frame, and resin cutting frame.

<Support separation method for a modification example>

The support separation method according to the present invention is not limited to the above embodiment. For example, in the support separation method according to a modification, as shown in FIG. 3(b), the laminated body 10 covers the entire circumference of the circuit formation region and occupies the width W'1 in the radial direction. Among the non-circuit formation regions, the specific region occupying the range of the width W'2 is a configuration in which the circuit formation region on the substrate 1 is not separated. In the support separation method of the present modification, for example, when the value of the width W'1 is less than 2 mm, the width W'2 of the divided region of the separation layer 4 irradiated with the laser light L can be easily secured to about 1.3 mm. The above points are valid.

According to the configuration described above, it is possible to prevent the laser light L from being directly irradiated to the circuit formation region of the substrate 1. Therefore, it is possible to prevent the integrated circuit formed on the substrate 1 from being damaged by the laser light L.

Further, in the support separation method according to another modification, as shown in FIG. 3(c), the entire circumference of the circuit formation region is surrounded by the non-circuit in the range of the width W"2 in the radial direction of the specific region. The width of the formation area is less than 100%.

According to the configuration described above, it is possible to prevent the laser light L from being irradiated to the outside of the outer peripheral end portion of the substrate 1, and to prevent the laser light L from being irradiated onto the circuit formation region of the substrate 1. In the present modification, for example, when the width of the non-circuit forming region of the substrate 1 is about 1.3 mm, it is effective at a point where the region of the separation layer 4 that irradiates the laser light L can be secured.

<Support separation method according to the second embodiment>

The support separation method according to the present invention is not limited to the above embodiment. For example, in the support separation method according to an embodiment (the second embodiment), before the light irradiation step, a detection step of detecting the direction of the laminate 10 is further included, and in the separation step, the layer detected by the detection step is used. In the direction of the integrated body 10, a separating plate (holding portion, not shown) for holding the adsorption pad of the support plate (support) 2 for applying the force to the laminated body 10 is disposed in the divided region 4C where the laser beam L is irradiated. A configuration in which the laminated body 10 is rotated in a manner of -1 to 4C-6. Here, when the separation plate holds the support plate 2, four adsorption pads arranged at equal intervals are provided on the peripheral portion of the support plate 2.

According to the above configuration, even if the laser light L is not irradiated to the entire region 4C of the separation layer 4, the detection step is based on the direction of the specific laminate 10, and the laminate 10 is only in conformity with the separation plate. It is sufficient that the divided region of the position at which the adsorption pad is disposed is subjected to the light irradiation phase. Therefore, the time during which the separation layer 4 irradiates the laser light L can be shortened, and the support plate 2 can be separated more quickly by the laminate 10. In the support separation method according to the present embodiment, only the difference from the support separation method according to the first embodiment will be described, and the description will be omitted for the same point.

[detection step]

In the detecting step, an optical alignment device (not shown) provided in the notch portion (not shown) of the support plate 2 is detected before the light irradiation step is performed (not As shown in the figure, the direction of the layered body 10 is specified by using the notch portion as a reference. Thereby, in the subsequent light irradiation step, it is possible to specify whether or not any of the divided regions of the separation layer 4 has been irradiated with light.

In the detection step, for example, as shown in FIG. 2(b), the direction of the laminated body 10 before the light irradiation step is set so as to be disposed at the notch portion of the support plate 2 at the position of the single-dot chain line C1. can.

[Light irradiation step]

As shown in FIG. 2(b), the light irradiation step included in the support separation method according to the present embodiment is performed by repeating the light irradiation step and the swirling step by the single-point chain line after the detection step. The separation layer 4 of the divided regions 4C-1 to 4C-6 divided by C1 to C10 is deteriorated. By this, the separation layer 4 of the divided regions 4C-1 to 4C-6 arranged in a total of four places is degraded so as to be separated at equal intervals in the peripheral portion of the separation layer 4.

(separation step)

In the separation step, first, the four adsorption pads of the separation plate of the support plate 2 are held in accordance with the direction of the laminate 10 detected by the detection step, and are disposed in the divided regions 4C-1 to 4C of the irradiation laser light L. The above method of 6 causes the above laminated body 10 to be rotated. Thereafter, the support plates 2 located above the divided regions 4C-1 to 4C-6 are held by the respective adsorption pads, and raised. Thereby, the force applied from the separation plate can be concentrated in the separation layer 4 in which the divided regions 4C-1 to 4C-6 have been deteriorated. Therefore, after the separation layer 4 which has been deteriorated in the divided regions 4C-1 to 4C-6 is destroyed, for the region where the laser light L is not irradiated The separation layer 4 of the domain concentrates the forces. Thereby, the support plate 2 can be appropriately separated by the laminated body 10.

<Support separation method according to other embodiments>

The support separation method according to the present invention is not limited to the above embodiment (the first embodiment and the second embodiment). For example, in the support separation method according to another embodiment, the support plate (support) and the material of the separation layer are appropriately selected in accordance with the performance required for the laminate. Therefore, the laser system that emits light that illuminates the separation layer is not limited to a CO ₂ laser, and a solid ray such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser is used. Laser lasers such as liquid lasers, pigment lasers, laser beams such as CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers, semiconductor lasers, free electron lasers, etc., or The non-laser light or the like may be appropriately selected and used according to the wavelength at which the material constituting the separation layer 4 can be deteriorated.

In addition, in the support body separation method of the present embodiment, the holding portion of the support plate 2 of the laminate 10 is provided with, for example, a plurality of jigs (claw portions, not shown) that grip the outer peripheral end portions of the support plate 2. The separator plate shown) can also be used.

Further, in the support separation method according to still another embodiment, in the light irradiation step, the number and arrangement of the divided regions to be irradiated with light may be appropriately changed depending on the number or arrangement of the adsorption pads of the holding portion.

The present invention is not limited to the above embodiments, and is The range shown in the above-mentioned items can be variously changed, and the embodiments obtained by appropriately combining the technical means each of which is shown in different embodiments are also included in the technical scope of the present invention.

[Industrial Applicability]

The support separation method according to the present invention can be suitably utilized in the production steps of the miniaturized semiconductor device.

1‧‧‧Substrate

2‧‧‧Support plate (support)

3‧‧‧Next layer

4‧‧‧Separation layer

5‧‧‧Cut Tape

6‧‧‧cut box

10‧‧‧Layer

50‧‧‧Laser illumination device

Claims (10)

A method for separating a support body by laminating a substrate and a support for transmitting light through a laminate layer and a separation layer which is deteriorated by absorbing light, and separating the support of the support body The body separation method is characterized in that the substrate has a circuit formation region forming a circuit and a non-circuit formation region in which the circuit is not formed over the entire circumference of the circuit formation region; and the method has the following steps: interposing the support And stratified by a specific region that is opposite to the entire circumference of the circuit formation region of the substrate and that is 65% or more and less than 100% of the width in the radial direction of the non-circuit formation region. At least a part of the obtained separation layer, a light irradiation step of irradiating light, and a separation step of separating the support from the laminate by applying a force to the laminate that irradiates the light. The support body separation method according to claim 1, wherein the inner peripheral end portion of the specific region is separated from the outer peripheral end portion of the circuit formation region, and the outer peripheral end portion of the specific region and the outer peripheral end portion of the substrate Separation. The support separation method according to claim 1 or 2, wherein the width in the radial direction of the non-circuit formation region is in a range of more than 1.3 mm and 2.0 mm or less, and the width in the radial direction of the specific region is 1.3. Above mm, less than 2.0mm. The method for separating a support according to claim 1, wherein the light irradiation is performed The step includes a light irradiation stage which is formed by laminating a plurality of divided specific regions which are opposite to the center of the plane of the laminate and which divides the specific region at a specific angle. At least a portion of the separation layer is irradiated with light, and a swirling phase is formed by centering the center of the plane of the laminate, and the plane of the laminate is rotated at the specific angle. The method for separating a support according to claim 4, further comprising, before the step of irradiating the light, a detecting step of detecting a direction of the laminate, wherein the separating step is based on a direction of the laminate detected by the detecting step In order to apply a force to the laminate, the holding portion of the support is held so as to be placed on the divided specific region of the light to be irradiated, and the laminate is rotated. The support separation method according to claim 4 or 5, wherein, before the separating step, the light irradiation phase and the above-described rotation phase are alternately repeated, and the layers are stacked in such a manner as to face all of the division specific regions. The resulting separation layer is irradiated with light. The support separation method according to claim 4, wherein the light is irradiated to an area of 50% or more of the separation layer which is laminated so as to be opposed to the division-specific region. The support separation method according to claim 1, wherein the illumination pattern of the light is a linear shape, a dot shape, a circular shape, a polygonal shape, a polygonal shape, or a spiral shape. The method for separating a support according to claim 1, wherein the support system is composed of a crucible, The above-mentioned light system is a carbonic acid laser. The method of separating a support according to claim 1, wherein a dicing tape is attached to the substrate side of the laminate, and a part of the dicing tape is exposed at an outer edge portion of the substrate.