TW201727178A - Liquid-cooling heat dissipation apparatus - Google Patents

Abstract

A liquid-cooling heat dissipation apparatus is used for cooling a heat generating member, comprises a heat transfer module disposed on said heat generating member, a guiding-flow module disposed on the heat transfer module, where an interior volume is formed herein, and a liquid cycling-loop module. The heat transfer module includes a vapor chamber and at least one heat conductive column disposed on the vapor chamber, the liquid cycling-loop module includes a pump and a cover body, the outer side of the cover body have a liquid-input pipe and a liquid-output pipe, which connected with the interior volume respectively. As a result of leading a cooling liquid flows in the interior volume through the liquid-input pipe and the liquid-output pipe to effect multiple-cooling cycle.

Description

Liquid cooled heat sink

The invention relates to a liquid cooling heat dissipating device, in particular to a heat dissipating device which improves the overall heat dissipating performance through a liquid circulation cooling method.

With the increase in processing speed and performance of the central processing unit (CPU), the current heat generation of the CPU is increased, and the higher operating frequency also increases the wattage during operation, and the high temperature generated by the CPU reduces the CPU. Lifespan, especially when too much heat is not effectively removed, can easily cause system instability. In order to solve the problem of CPU overheating, a combination of a heat sink and a fan is generally used to remove heat in a forced cooling manner, thereby achieving the effect of maintaining the normal operation of the CPU, but the interference generated by a conventional fan at a high rotational speed. People's noise and high power consumption are often problems that manufacturers cannot overcome.

However, the conventional water-cooling head heat-dissipating device not only contacts the heat source of the heat sink or the heat-conducting plate to absorb the heat generated by the heat source, but the cover body and other components are mostly made of plastic material, which cannot effectively improve the overall heat dissipation performance. The inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems.

An object of the present invention is to provide a liquid cooling heat dissipating device which is designed with a water cooling head combined with a temperature equalizing plate and a heat conducting column to effectively improve the overall heat dissipation efficiency.

In order to achieve the above object, the present invention provides a liquid cooling heat dissipating device for cooling a heat source, comprising a heat conducting module, a liquid supply module and a flow guiding module, wherein the heat conducting module comprises a temperature equalizing plate and An at least one heat conducting column, the temperature equalizing plate has at least one chamber and one side of the temperature equalizing plate contacts the heat source, and the chamber supplies a working fluid flowing therein; the heat conducting column is disposed on the temperature equalizing plate away from the heat source The liquid supply module is disposed on one side of the temperature equalization plate, the liquid supply module comprises a cover body and a pump, and the outer side of the cover body is provided with a liquid input end and a liquid discharge end; the flow guiding module is disposed at the same An accommodating space is formed between one side of the warming plate and the temperature equalizing plate; wherein the liquid supply module communicates with the accommodating space to guide a cooling liquid to the accommodating space, and discharge the cooling liquid from the liquid discharging end.

In an embodiment of the invention, the heat conducting column is configured with a plurality of heat dissipating fins.

In an embodiment of the invention, the heat conducting columns are plural and are arranged in an upright position parallel to each other.

In an embodiment of the invention, the thermally conductive column is a solid cylinder.

In an embodiment of the invention, the heat conducting column is a heat pipe extending from one side of the temperature equalizing plate, and the heat pipe has a cavity communicating with the chamber of the temperature equalizing plate for the working fluid to flow therein.

In an embodiment of the invention, the material of the temperature equalizing plate, the heat conducting column, the heat dissipating fin, the baffle and the shunt plate comprises at least one of aluminum, copper and graphite.

Compared with the prior art, the liquid-cooled heat dissipating device of the present invention has the following effects: the heat source is respectively conducted or convected to the temperature equalizing plate and the heat conducting column by the heat dissipating module, the diversion module and the structural configuration of the liquid supply module. The heat dissipating fins, the diverter plate and the baffle plate are pumped to guide the circulating coolant for heat exchange and brought to the outside, and have multiple cooling cycles in the heat dissipating device to more effectively improve the overall heat dissipation of the liquid cooling heat dissipating device. efficacy.

The detailed description and technical content of the present invention are set forth in the accompanying drawings.

Referring to FIGS. 1 to 3, 7, and 8, the present invention provides a liquid-cooled heat sink M1 including a heat-conducting module 1, a flow-guiding module 2, and a liquid supply module 3.

The heat conducting module 1 includes a temperature equalizing plate 10 and a heat conducting column 20, as shown in FIG. 2A. Further, a heat dissipating fin 90 may be further included. As shown in FIG. 2B, the heat dissipating fins 90 may have perforations. The heat-collecting column 20 and the heat-dissipating fins 90 are in a pressing manner or a soldering manner, and the heat-dissipating fins 90 respectively have a through-hole. The sheet body is located at a position corresponding to the notch 901 of the confluent opening 311 to form a passage of the cooling liquid L1, as shown in FIGS. 2B and 8 , but not limited thereto, and the structural form of the heat dissipating fin 90 will be as follows. Detailed description.

As described above, the temperature equalizing plate 10 has at least one chamber R10 and a wall structure is formed with a capillary structure layer 12, and the chamber is supplied with a working fluid W therein, and one side of the temperature equalizing plate 10 (heat receiving surface) S1) is in contact with a heat source H, such as an electronic component such as a CPU, and the working fluid W conducted from the heat source H to the chamber R10 forms a heat convection H1 upward, and from the other side of the temperature equalization plate 10 (heat dissipation surface S2) A side wall 11 having a plurality of holes extending upwardly, and the extended portion and the heat receiving surface S2 form an accommodating space R40; the heat conducting column 20 is disposed and coupled to a side of the temperature equalizing plate 10 away from the heat source (heat dissipation) The surface of the heat-conducting column 20 is preferably arranged in a plurality of parallel and spaced apart from each other in an upright position on the heat dissipating surface S2 of the temperature equalizing plate 10, and the number is represented by four in the drawings, but is not limited thereto. The material of the temperature equalizing plate 10 is selected from at least one of aluminum, copper, and graphite. Further, the plurality of heat conducting columns 20 may be disposed upright on the heat dissipating surface S2 of the temperature equalizing plate 10 at intervals. Although the plurality of heat conducting columns 20 are arranged in parallel with each other in parallel, but not according to this Limit.

As described above, the heat conducting column 20 can be a solid cylinder, such as a cylinder, a tapered cylinder, a square cylinder, etc., and the material thereof can include any one of aluminum, copper, and graphite. The alloy; or the thermally conductive column 20 can be a heat pipe structure extending from the heat dissipating surface S2 of the temperature equalizing plate 10, and various embodiments will be described in detail below with respect to the heat conducting column 20. .

The liquid supply module 3 includes a pump 50 and a cover 60. The liquid supply module 3 is detachably locked to the temperature equalizing plate 10 through a hole through which the side flap 11 of the temperature equalizing plate 10 is screwed, and the cover body The outer side of the 60 is respectively provided with a liquid input end 61 and a liquid discharge end 62; and the pump 50 includes a rotor portion 52 detachably disposed between the cover body 60 and the flow guiding module 2, and a rotor portion corresponding to the rotor The fixed sub-portion 51 of 52 indicates that the liquid input end 61 and the liquid discharge end 62 are disposed on the same side of the cover 60.

The flow guiding module 2 is detachably disposed between the cover body 60 and the temperature equalizing plate 10, and the flow guiding module 2 includes a deflector 40 and a shunting plate 30. The shunting plate 30 is disposed on the deflector 40 and Between the temperature equalizing plates 10 and covering the heat conducting column 20, the flow dividing plate 30 has a first dividing opening 301 and a second dividing opening 302, and the two are disposed on the same side of the dividing plate 30, but are not limited thereto, and are divided. A side of the heat dissipating surface S2 of the board 30 has a recess 30A for a busbar 31 to be embedded therein. The buster board 31 has a confluence opening 311 and communicates with the receiving space R40 and the first shunt opening. 301, the second split opening 302 is connected to the liquid discharge end 62; the side of the bus bar 31 adjacent to the heat dissipating surface S2 has a convex portion 31A, and the peripheral wall of the confluent opening 311 is from the top surface of the bus bar 31 to the convex portion The bottom surface of the portion 31A forms a curved contour. In addition, the splitter plate 30 has a first wall portion 30W that abuts the peripheral wall of the temperature equalizing plate 10 and extends upward to form the receiving space R40, and connects the wall portion 30W and covers the heat conducting columns. a cover portion 30S of 20, wherein the first split opening 301 penetrates the cover portion 30S, and The splitter opening 302 extends through the cover portion 30S and adjacent to the wall portion 30W. Further, the materials of the splitter plate 30 and the bus bar 31 are selected from at least one of aluminum, copper, and graphite, and the heat source H is generated. Heat is conducted to the cover portion 30S via the wall portion 30W to thereby improve the heat dissipation efficiency of the overall structure by the thermal conductivity of the material of the splitter plate 30.

As shown in FIG. 6 to FIG. 8 , the deflector 40 is disposed on the splitter plate 30 and has a first diversion opening 401 and a second diversion opening 402 , and the diversion plate 40 is adjacent to the diversion flow. A plurality of top posts 41 are disposed on one side of the plate 30 to abut the cover portion 30S of the splitter plate 30 to form a first flow guiding space R20 to communicate with the first guiding opening 401 and the second guiding opening 402. A second guiding space R30 is formed on a side of the flow dividing plate 30 adjacent to the heat dissipating surface S2 to communicate with the first diversion opening 401 and the first diversion opening 301, and the first diversion space R20 and the second diversion space R30 and the volume The space R40 is in communication with each other. Further, the material of the baffle 40 is selected from at least one of aluminum, copper, and graphite.

As described above, the top pillar 41 may be a cylinder, a conical cylinder, a square cylinder, a tapered cylinder or a polygonal cylinder, and may be a solid or hollow cylinder, and further, each of the pillars 41 The diameters may be the same or different, and are not limited herein, and are designed according to actual needs. The manner in which the top pillars 41 are coupled to the top plate 40S may be provided on the corresponding side of the top plate 40S for the plurality of top pillars 41 to be embedded. a hole (not shown) is disposed in the hole so that the top column can be firmly stuck in the holes. Further, the material of the baffle 40 and the top post 41 is selected from at least aluminum and copper. And any of the graphite, and the heat conducted by the heat source H to the cover portion 30S of the splitter plate 30 can be uniformly conducted to a top plate 40S of the deflector 40 by the plurality of top posts 41, and by the deflector The thermal conductivity of the 40 material improves the heat dissipation efficiency of the overall structure.

Referring to FIG. 9a, the present invention provides a first embodiment of the heat conducting column 20. Although the drawing is shown as a hollow heat pipe structure, it is not limited by the drawings, and is only used to illustrate the embodiment. The heat equalizing plate 10 in the heat conducting module 1 of the present invention is provided with a plurality of heat pipes 20a which are alternately spaced apart from each other on the heat dissipating surface S2, but not limited thereto, and a plurality of heat pipes 20a arranged in parallel with each other in parallel. The side of the heat pipe 20a away from the heat dissipating surface S2 is not in contact with the manifold 30 or the busbar 31, and the end surface of the heat pipe 20a may be a plane profile, a step profile, an arc profile or a curved profile, although the figure is The equation is expressed as an arcuate profile, but is not limited thereto; and the heat pipe 20a has a cavity 201a communicating with the chamber R10 of the temperature equalization plate 10, and the wall surface of the cavity 201a of the heat pipe 20a is formed with a capillary structure layer. 210a, and interconnected with the capillary structure layer 12 of the chamber R10 of the temperature equalization plate 10, wherein the capillary structure layer 10 and the capillary structure layer (12, 210a) of the heat pipe 20a are respectively selected from a mesh structure and a fiber structure. (fiber), powder sintered (sintered powder) And any one of the groove structures, and the heat pipes 20 are made of a material selected from at least one of aluminum, copper, and graphite.

Referring to FIG. 8 and FIG. 9b, the present invention provides a second embodiment of the heat conducting column 20. Although the drawing is shown as a hollow heat pipe structure, it is not limited by the drawing, and is only used to match the drawing. The embodiment illustrates that the present embodiment mainly describes the difference from the heat pipe 20a of the first embodiment. The plurality of heat pipes 20b have a cavity 201b communicating with the chamber R10 of the temperature equalizing plate 10, and the cavity 201b of the heat pipe 20b. The wall surface is formed with a capillary structure layer 210b, and is interconnected with the capillary structure layer 12 of the chamber R10 of the temperature equalization plate 10. The plurality of heat dissipation fins 90a have at least one through hole 902a, which is provided according to the plurality of heat pipes 20b. The heat dissipation fins 90 are disposed in the outer peripheral wall of the heat pipes 20b. The series connection is performed by the heat pipe 20b and the heat dissipation fins 90a in an urgent manner or by welding. For example, the heat dissipation fins 90a respectively have the slots 901 extending through the fins and corresponding to the flow openings 311 to form a passage for the coolant L1. Further, the heat sink fins 90a are selected from at least one of the materials. Aluminum, copper And any one of graphite. Referring to FIG. 9c, the present invention provides a third embodiment of the heat conducting column 20. Although the drawing is shown as a hollow heat pipe structure, it is not limited by the drawings, and is only used to illustrate the embodiment. The present embodiment mainly describes the difference between the heat pipes (20a, 20b) and the heat dissipation fins 90a of the first and second embodiments, and the plurality of heat pipes 20c have a cavity communicating with the chamber R10 of the temperature equalizing plate 10. 201c, and the wall surface of the cavity 201c of the heat pipe 20c is formed with a capillary structure layer 210c, and is connected to the capillary structure layer 12 of the chamber R10 of the temperature equalization plate 10, and the outer peripheral walls of the plurality of heat pipes 20c are respectively provided with a plurality of The heat dissipation fins 90b are respectively provided with a through hole 902b in the heat dissipation fins 90b, so that the heat dissipation fins 90b are disposed and spaced apart from each other in the outer peripheral wall of the heat pipes 20c. Further, the heat dissipation fins are further illustrated. One end of the recessed heat pipe 20c is a free end (not shown), and the other end is a fixed end. The free ends of the heat dissipating fins 90b disposed in each of the heat pipes 20c are not in contact with each other. The length of the heat sink fin 90b from the fixed end to the free end may be Equivalent or unequal, not limited here.

Referring to FIG. 9d, the present invention provides a fourth embodiment of the heat conducting column 20. Although the drawing is shown as a hollow heat pipe structure, it is not limited by the drawings, and is only used to illustrate the embodiment. The present embodiment mainly describes the difference between the heat pipes (20a, 20b, 20c) and the heat dissipation fins (90a, 90b) of the first, second and third embodiments, and the plurality of heat pipes 20d have a temperature equalization plate. A cavity 201d communicating with the chamber R10 of 10, and a wall structure of the cavity 201d of the heat pipe 20d is formed with a capillary structure layer 210d, and is interconnected with the capillary structure layer 12 of the chamber R10 of the temperature equalization plate 10, wherein a heat dissipation fin The sheet 90c is a plurality of sheets which are respectively scooped from the outer wall surface of the heat conducting column 20, and the sheet system extends toward the outside of the heat conducting column 20 and is formed with at least one bend, such as an arc or a wave, to reduce Thermal resistance between the heat sink fins 90 and the heat conducting posts 20.

As described above, the heat dissipation fins (90a, 90b, 90c) in the foregoing embodiments of the present invention can be applied to the solid heat conduction column 20, and are not limited to being formed with the heat pipes (20a, 20b, 20c, 20d). Furthermore, the heat pipes (20a, 20b, 20c, 20d) and the cavities (201a, 201b, 201c, 201d) in the foregoing embodiments may be the same or different, such as an outer diameter, an inner diameter, and a tube. The wall thickness or tube length and the like are not limited herein, and the geometry of the capillary structure layers (210a, 210b, 210c, 210d) in the foregoing embodiments of the present invention may be the same or different, such as thickness, porosity, and the like.

Referring to FIGS. 1 and 5 to 8, the heat dissipating device M1 of the present invention is provided with a housing cover 100 on the cover 60 and is locked to the cover 60 to reduce noise during operation of the pump 50, and when the heat source H is generated. When the heat is separately transmitted and convected to the heat dissipating surface S2 of the temperature equalizing plate 10, the heat conducting column 20, the heat dissipating fins 90, the shunt plate 30, and the baffle 40, a condensing device M2 is externally connected via the heat dissipating device M1, The liquid input end 61 and the liquid discharge end 62 of the cover 60 are respectively connected to a circulating water outlet M22 of the external condensing device M2 and a circulating water inlet M21, and are operated through the rotor portion 52 of the pump 50 to pass the coolant L1 through the liquid input end. 61 is introduced into the cover body 60, and guides the cooling liquid L1 and sequentially enters the first flow guiding space R20 and the second flow guiding space R30 and merges into the accommodating space R40 through the notch 901, so that the cooling liquid L1 respectively Absorbing heat and convection to the heat dissipating surface S2 of the temperature equalizing plate 10, the heat conducting column 20, the heat dissipating fins 90, the shunt plate 30, and the baffle 40, and after the endothermic cooling liquid L2 is discharged through the second shunt opening 302 and the liquid The end 62 is transferred to the condensing device M2 through a pipeline for cooling to form a coolant L1 and then sequentially repeating the foregoing procedure, there is formed a working fluid in vapor chamber 10 and a multi-channel cooling cycle W cover 60 of the cooling liquid L1 in chambers R10 in order to more effectively improve the overall thermal efficiency.

In summary, the liquid-cooled heat dissipating device of the present invention can achieve the intended purpose of use, and solves the lack of conventional knowledge, and is extremely novel and progressive, fully conforms to the requirements of the invention patent application, and is proposed according to the patent law. To apply, please check and grant the patent in this case to protect the rights of the inventor.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent changes to the scope of the present invention are included in the scope of the present invention. Bright.

M1‧‧‧Liquid cooling device

M2‧‧‧condenser

M21‧‧‧Circulating water outlet

M22‧‧‧Circular water inlet

1‧‧‧thermal module

2‧‧‧Flow Guide Module

3‧‧‧liquid supply module

10‧‧‧Wall plate

11‧‧‧Flanking

12‧‧‧Capillary structure

20‧‧‧thermal column

20a, 20b, 20c, 20d‧‧‧ heat pipe

201a, 201b, 201c, 201d‧‧‧ cavity

210a, 210b, 210c, 210d‧‧‧ capillary structure

30‧‧‧Splitter

30A‧‧‧ recess

30S‧‧‧ Cover Section

30W‧‧‧Retaining wall

301‧‧‧First diversion opening

302‧‧‧Second split opening

31‧‧‧Converter

31A‧‧‧ convex

311‧‧‧ confluence opening

40‧‧‧Baffle

40S‧‧‧ top board

401‧‧‧First diversion opening

402‧‧‧Second diversion opening

41‧‧‧Top column

50‧‧‧ pump

51‧‧‧ stator

52‧‧‧Rotor Department

60‧‧‧ Cover

61‧‧‧Liquid input

62‧‧‧Liquid discharge end

90, 90a, 90b, 90c‧‧‧ heat sink fins

901‧‧‧ notch

902a, 902b‧‧‧ perforation

100‧‧‧ housing cover

H‧‧‧heat source

H1‧‧‧Hot convection

L1‧‧‧ Coolant

L2‧‧‧Endothermic coolant

R10‧‧‧室

R20‧‧‧First Diversion Space

R30‧‧‧Second diversion space

R40‧‧‧ accommodating space

S1‧‧‧ Heating surface

S2‧‧‧ heat sink

W‧‧‧Working fluid

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of a liquid-cooled heat sink of the present invention coupled to a condensing unit.

Fig. 2A is an exploded perspective view showing the liquid cooling type heat dissipating device of the present invention.

2B is an exploded perspective view of the liquid-cooled heat sink of the present invention (including heat sink fins).

Figure 3 is an exploded perspective view showing the other side of the liquid-cooled heat sink of the present invention.

Fig. 4 is a perspective view showing the appearance of the liquid-cooled heat sink of the present invention.

Figure 5 is a combination view of the other side of the liquid-cooled heat sink of the present invention.

Figure 6 is a cross-sectional view taken along line C-C of Figure 5.

Figure 7 is a cross-sectional view taken along line A-A of Figure 5.

Figure 8 is a cross-sectional view taken along line B-B of Figure 5.

Figure 9a is a cross-sectional view of a first embodiment of a thermally conductive column of the present invention.

Figure 9b is a cross-sectional view of a second embodiment of the thermally conductive column of the present invention.

Figure 9c is a cross-sectional view of a third embodiment of the thermally conductive column of the present invention.

Figure 9d is a cross-sectional view of a fourth embodiment of the thermally conductive column of the present invention.

M1‧‧‧Liquid cooling device

10‧‧‧Wall plate

12‧‧‧Capillary structure

20‧‧‧thermal column

30‧‧‧Splitter

30S‧‧‧ Cover Section

30W‧‧‧Retaining wall

301‧‧‧First diversion opening

302‧‧‧Second split opening

31‧‧‧Converter

311‧‧‧ confluence opening

40‧‧‧Baffle

50‧‧‧ pump

60‧‧‧ Cover

61‧‧‧Liquid input

62‧‧‧Liquid discharge end

90‧‧‧ Heat sink fins

901‧‧‧ notch

100‧‧‧ housing cover

H‧‧‧heat source

H1‧‧‧Hot convection

L2‧‧‧Endothermic coolant

R10‧‧‧室

R20‧‧‧First Diversion Space

R30‧‧‧Second diversion space

R40‧‧‧ accommodating space

S1‧‧‧ Heating surface

S2‧‧‧ heat sink

W‧‧‧Working fluid

Claims (17)

A liquid-cooling heat dissipating device is adapted to cool a heat source. The liquid-cooling heat dissipating device comprises: a heat conducting module comprising: a temperature equalizing plate having at least one chamber, one side of the temperature equalizing plate contacting the heat source And the chamber is provided with a working fluid flowing therein; at least one heat conducting column is disposed on a side of the temperature equalizing plate away from the heat source; a liquid supply module is disposed on one side of the temperature equalizing plate, the liquid supply The module includes a cover body and a pump, and the outer side of the cover body is provided with a liquid input end and a liquid discharge end; and a flow guiding module is disposed on one side of the temperature equalizing plate and between the temperature equalizing plate Forming an accommodating space; wherein the liquid supply module communicates with the accommodating space to guide a cooling liquid to the accommodating space, and discharge the cooling liquid from the liquid discharging end. The liquid-cooled heat sink according to claim 1, wherein the heat-conducting column is plural and arranged in parallel with each other in an upright position, or in an upright arrangement with respect to each other. The liquid-cooled heat sink of claim 2, wherein the heat-conducting column is a solid cylinder. The liquid-cooled heat sink of claim 2, wherein the heat-conducting column is a heat pipe structure extending from one side of the temperature-regulating plate, and the heat pipe has a cavity communicating with the chamber of the temperature-regulating plate, The cavity wall surface is formed with a capillary structure layer. The liquid-cooled heat sink according to claim 4, wherein the capillary structure layer on the wall surface of the chamber and the capillary structure layer on the wall surface of the cavity are connected to each other. The liquid-cooled heat sink according to claim 1, wherein the capillary structure layer is selected from the group consisting of a mesh, a fiber, a sintered powder, and a groove. One. The liquid-cooled heat sink of claim 1, wherein the heat-conducting column is provided with a plurality of heat-dissipating fins. The liquid-cooling heat dissipating device according to claim 7, wherein the material of each of the heat dissipating fins comprises at least one of aluminum, copper and graphite. The liquid-cooling heat dissipating device of claim 7, wherein each of the heat dissipating fins is serially fixed to the heat conducting column, and each of the heat dissipating fins has a notch. The liquid-cooling heat dissipating device of claim 7, wherein each of the heat dissipating fins is a sheet formed on an outer wall of the heat conducting column and extending outward from an outer wall of the heat conducting column. The liquid-cooled heat sink according to claim 1, wherein the liquid input end and the liquid discharge end are disposed on the same side of the cover. The liquid-cooling heat dissipating device of claim 1, wherein the liquid input end and the liquid discharge end are respectively connected to a circulating water outlet of an external condensing device and a circulating water inlet to form a cooling cycle. The liquid-cooled heat dissipating device of claim 1, wherein a plurality of top columns are embedded in a side of the deflector adjacent to the splitter plate, and the top column can be a solid cylinder, a solid conical cylinder, and a solid square. The cylinder, the solid cone cylinder, the solid polygonal cylinder, or a hollow cylinder, a hollow conical cylinder, a hollow square cylinder, a hollow cone cylinder, a hollow polygonal cylinder. The liquid-cooled heat sink of claim 13, wherein the outer diameter of each of the top posts may be the same or different. The liquid-cooled heat sink according to claim 13, wherein the temperature equalizing plate, the heat conducting column, the deflector, and the material of the flow dividing plate comprise at least one of aluminum, copper, and graphite. The liquid-cooling heat dissipating device of claim 1, wherein the flow guiding module comprises a baffle and a shunt plate, the shunt plate is disposed between the baffle and the temperature equalizing plate and covers the heat conducting column The accommodating space is formed on a side of the flow dividing plate and the heat concentrating plate away from the heat source, and a first guiding space is formed between the deflector and the cover body, and between the flow dividing plate and the deflector A second flow guiding space is formed, and the liquid input end, the first flow guiding space, the second guiding space, the accommodating space and the liquid discharging end are in communication with each other. The liquid-cooled heat dissipating device of claim 16, further comprising a busbar embedded on one side of the shunt plate adjacent to the temperature equalizing plate, wherein the bus bar has a confluence with the receiving space Opening.