TW201723656A - Photosensitive resin composition, photosensitive resin laminate, resin pattern manufacturing method, hardened film pattern manufacturing method and display device comprising alkali soluble resin, chemical compound, photo-polymerizatoin initiator, and rust inhibitor - Google Patents

Photosensitive resin composition, photosensitive resin laminate, resin pattern manufacturing method, hardened film pattern manufacturing method and display device comprising alkali soluble resin, chemical compound, photo-polymerizatoin initiator, and rust inhibitor Download PDF

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TW201723656A
TW201723656A TW105142184A TW105142184A TW201723656A TW 201723656 A TW201723656 A TW 201723656A TW 105142184 A TW105142184 A TW 105142184A TW 105142184 A TW105142184 A TW 105142184A TW 201723656 A TW201723656 A TW 201723656A
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Taiwan
Prior art keywords
photosensitive resin
resin composition
protective film
group
forming
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TW105142184A
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Chinese (zh)
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TWI639889B (en
Inventor
Mayuki Yoshida
Satoshi Shibui
Koichiro Shimoda
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Asahi Chemical Ind
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Priority claimed from JP2016240484A external-priority patent/JP7112827B2/en
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of TW201723656A publication Critical patent/TW201723656A/en
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Publication of TWI639889B publication Critical patent/TWI639889B/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)

Abstract

A problem to be solved in this invention is to provide a photosensitive resin composition with excellent balance of rust inhibition, bendability, removal property of various patterns such as circular hole, and sensitivity while suitable for protecting conductor portion such as wirings and electrodes. The photosensitive resin composition of this invention for forming a protective film of conductor portion comprises the following constituents: (A) alkali soluble resin; (B) a chemical compound with ethylenically unsaturated double bond; (C) a photo-polymerization initiator; and (D) a rust inhibitor; and (C) an oxime compound with extinction coefficient 17 mL/(mg.cm) to 60 mL/(mg.cm) and wavelength 365 nm in alcohol solution.

Description

感光性樹脂組合物、感光性樹脂積層體、樹脂圖案製造方法、硬化膜圖案製造方法及顯示裝置Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film pattern production method, and display device

本發明係關於一種感光性樹脂組合物、感光性樹脂積層體、使用感光性樹脂積層體之樹脂圖案製造方法、硬化膜圖案製造方法及顯示裝置等。The present invention relates to a photosensitive resin composition, a photosensitive resin laminate, a resin pattern production method using the photosensitive resin laminate, a cured film pattern production method, a display device, and the like.

近年來，伴隨電子機器不斷高性能化、多樣化及小型輕量化，於液晶等顯示元件之整個表面安裝有透明觸控面板(觸控感測器)之機器不斷增加。經由透明觸控面板進行顯示元件所顯示之字元、符號、圖樣等之視認及選擇，藉由透明觸控面板之操作進行機器之各功能之切換亦增加。觸控面板不僅用於電腦、電視等大型電子機器，亦用於汽車導航、行動電話、電子詞典等小型電子機器及OA(Office Automation，辦公自動化)、FA(Finite Automation，有限自動化)機器等顯示機器，觸控面板上設有包含透明導電電極材料之電極。作為透明導電電極材料，已知ITO(Indium-Tin-Oxide，氧化銦錫)、氧化銦及氧化錫，該等材料因具有較高之可見光透過率而主要用作液晶顯示元件用基板等之電極材料。作為既有之觸控面板之方式，可列舉電阻膜方式、光學方式、壓力方式、靜電電容方式、電磁波感應方式、圖像識別方式、振動檢測方式、超音波方式等，各種方式不斷實用化，但近年來靜電電容方式觸控面板之利用發展最快。於靜電電容方式觸控面板中，若作為導電體之指尖接觸觸控輸入面，則指尖與導電膜之間發生靜電電容耦合，形成電容器。因此，靜電電容方式觸控面板藉由獲取指尖之接觸位置之電荷之變化而檢測出接觸位置之座標。尤其是投影型靜電電容方式之觸控面板能夠實現指尖之多點檢測，故而具備可進行複雜指示之良好之操作性，因此不斷用作具有行動電話、攜帶式音樂播放器等小型顯示裝置之機器之顯示面上之輸入裝置。一般而言，於投影型靜電電容方式之觸控面板中，為了表現基於X軸與Y軸之二維座標，複數個X電極與和複數個X電極正交之複數個Y電極形成有兩層結構，且使用ITO作為電極材料。此處，觸控面板之邊框區域為無法檢測出觸控位置之區域，故而縮小該邊框區域之面積為提高製品價值之重要要素。對於邊框區域，為了傳遞觸控位置之檢測信號，需要金屬配線，但為了實現邊框面積之狹小化，必須縮小金屬配線之寬度。由於ITO之導電性不夠高，故而一般而言金屬配線使用銅。然而，於指尖接觸如上述之觸控面板時，存在水分、鹽分等腐蝕成分自感測區域滲入內部之情形。若腐蝕成分滲入觸控面板之內部，則有金屬配線腐蝕，電極與驅動用電路間之電阻增加或斷線之虞，為了防止該等情況，金屬配線上需要具有防銹效果之保護膜。又，關於用於傳遞檢測信號之金屬配線，為了以端子部分與其他構件連接，必須確保導通，端子部分必須去除保護膜。因此，保護膜需要良好之顯影性或圓孔等各種圖案之良好之脫除性。又，於觸控面板之製造步驟中，為了提高生產性而期望於短時間內能夠曝光之高感度保護膜。進而，於保護膜設於軟性顯示器基板之情形時，伴隨基板之彎曲而對保護膜之負載亦變大，易產生龜裂，故而要求與基板之較高之密接性及可耐受基板之彎曲之彎曲性。就保護膜之形狀、透明性、透濕性、防銹性或鹼性顯影性之觀點而言，提出有附硬化膜之觸控面板用基材之製造方法(專利文獻1、2)。再者，於用於形成彩色濾光片及有機EL(Electroluminescence，電致發光)液晶顯示裝置之感光性著色樹脂組合物或感光性樹脂組合物之領域中，就感光性樹脂層之耐溶劑性或解像性之觀點而言，研究樹脂組合物中所含之起始劑之吸光係數(專利文獻3、4)。[先前技術文獻][專利文獻][專利文獻1]日本專利特開2015-121929號公報[專利文獻2]日本專利特開2015-108881號公報[專利文獻3]國際公開第2015/025689號[專利文獻4]國際公開第2015/060240號In recent years, with the increasing performance, versatility, and compactness and weight reduction of electronic devices, machines for mounting transparent touch panels (touch sensors) on the entire surface of display elements such as liquid crystals have been increasing. The display and selection of characters, symbols, patterns, and the like displayed on the display elements are performed through the transparent touch panel, and the switching of the functions of the machine by the operation of the transparent touch panel is also increased. The touch panel is not only used for large electronic devices such as computers and televisions, but also for small electronic devices such as car navigation, mobile phones, electronic dictionaries, and displays such as OA (Office Automation) and FA (Finite Automation) machines. In the machine, the touch panel is provided with an electrode comprising a transparent conductive electrode material. As a transparent conductive electrode material, ITO (Indium-Tin-Oxide), indium oxide, and tin oxide are known, and these materials are mainly used as electrodes for substrates for liquid crystal display elements because of their high visible light transmittance. material. Examples of the conventional touch panel include a resistive film method, an optical method, a pressure method, a capacitive method, an electromagnetic wave sensing method, an image recognition method, a vibration detecting method, and an ultrasonic method, and various methods are continuously put into practical use. However, in recent years, the use of electrostatic capacitive touch panels has developed fastest. In the capacitive touch panel, if the fingertip of the conductor contacts the touch input surface, electrostatic capacitance coupling occurs between the fingertip and the conductive film to form a capacitor. Therefore, the capacitive touch panel detects the coordinates of the contact position by acquiring a change in the charge of the contact position of the fingertip. In particular, the projection type capacitive touch panel can realize multi-point detection of fingertips, and therefore has good operability for performing complicated instructions, and thus is continuously used as a small display device such as a mobile phone or a portable music player. Input device on the display surface of the machine. Generally, in a projection type capacitive touch panel, in order to express a two-dimensional coordinate based on an X-axis and a Y-axis, a plurality of X electrodes and a plurality of Y electrodes orthogonal to a plurality of X electrodes are formed in two layers. Structure, and ITO is used as an electrode material. Here, the frame area of the touch panel is an area where the touch position cannot be detected. Therefore, reducing the area of the frame area is an important factor for improving the value of the product. In the frame area, in order to transmit the detection signal of the touch position, metal wiring is required, but in order to narrow the frame area, it is necessary to reduce the width of the metal wiring. Since the conductivity of ITO is not sufficiently high, copper is generally used for metal wiring. However, when the fingertip is in contact with the touch panel as described above, there is a case where corrosion components such as moisture and salt permeate into the interior from the sensing region. When the corroding component penetrates into the inside of the touch panel, the metal wiring is corroded, and the electric resistance between the electrode and the driving circuit is increased or broken. In order to prevent such a situation, a protective film having an anti-rust effect is required on the metal wiring. Further, regarding the metal wiring for transmitting the detection signal, in order to connect the terminal portion to another member, it is necessary to ensure conduction, and the terminal portion must be removed from the protective film. Therefore, the protective film requires good developability or good removability of various patterns such as round holes. Further, in the manufacturing process of the touch panel, in order to improve productivity, a high-sensitivity protective film which can be exposed in a short time is desired. Further, when the protective film is provided on the flexible display substrate, the load on the protective film is increased as the substrate is bent, and cracking is likely to occur. Therefore, high adhesion to the substrate and bending of the substrate are required. Flexibility. A method for producing a base material for a touch panel with a cured film is proposed from the viewpoint of the shape, transparency, moisture permeability, rust resistance, and alkali developability of the protective film (Patent Documents 1 and 2). Further, in the field of a photosensitive colored resin composition or a photosensitive resin composition for forming a color filter and an organic EL (Electroluminescence) liquid crystal display device, solvent resistance of the photosensitive resin layer From the viewpoint of resolution, the absorption coefficient of the initiator contained in the resin composition was examined (Patent Documents 3 and 4). [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. 2015-108881 [Patent Document 2] Japanese Patent Laid-Open No. 2015-108881 (Patent Document 3) International Publication No. 2015/025689 [ Patent Document 4] International Publication No. 2015/060240

[發明所欲解決之問題]專利文獻1中所記載之附硬化膜之觸控面板用基材之製造方法用於抑制用於傳遞觸控位置之檢測信號之銅配線之腐蝕，但無彎曲性相關之記載。於專利文獻2中雖言及腐蝕之抑制或顯影性，但亦仍無彎曲性相關之記載。又，於專利文獻3、4中雖記載有藉由使用特定吸光係數之起始劑而獲得耐溶劑性或解像性良好之組合物，但關於防銹性或彎曲性並無敍述。因此，本發明所欲解決之問題在於提供一種防銹性、彎曲性、圓孔等各種圖案之脫除性(以下稱為「解像性」)及感度之平衡優異，且適於保護配線、電極等導體部之感光性樹脂組合物。[解決問題之技術手段]本發明者等人為了解決上述問題進行努力研究，結果發現藉由使感光性樹脂組合物中含有(A)鹼溶性樹脂、(B)具有乙烯性不飽和雙鍵之化合物、(C)光聚合起始劑及(D)防銹劑，且作為(C)成分含有具有特定吸光係數之肟化合物，可獲得防銹性、彎曲性、解像性及感度之平衡優異，且適於保護配線、電極等導體部之感光性樹脂組合物，從而完成本發明。即，本發明如下所述。[1]一種導體部之保護膜形成用感光性樹脂組合物，其包含以下成分：(A)鹼溶性樹脂；(B)具有乙烯性不飽和雙鍵之化合物；(C)光聚合起始劑；及(D)防銹劑；且作為(C)成分包含於乙醇溶液中波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟化合物。[2]如[1]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含具有包括碳(C)原子與氮(N)原子及/或硫(S)原子之雜環，且於同一雜環中N原子數為3以下或S原子數為3以下或N原子與S原子之合計數為3以下之化合物。[3]如[1]或[2]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含選自由苯并三唑、苯并三唑衍生物、咪唑及咪唑衍生物所組成之群中之至少一種化合物。[4]如[3]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含苯并三唑或苯并三唑衍生物。[5]如[1]或[2]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含選自由三唑、三唑衍生物、四唑、四唑衍生物、噻二唑、噻二唑衍生物、吲唑及吲唑衍生物所組成之群中之至少一種化合物。[6]如[5]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含三唑或三唑衍生物。[7]如[5]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含四唑或四唑衍生物。[8]如[5]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含噻二唑或噻二唑衍生物。[9]如[5]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含吲唑或吲唑衍生物。[10]如[1]至[9]中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(4)所表示之化合物：[化1]{式中，X4 及X5 分別獨立地表示一價之有機基，至少一者包含下述式(5)：[化2]所表示之結構，且Y4 表示H或一價之有機基}。[11]如[10]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(6)所表示之化合物：[化3]{式中，Y5 為H、-CH3 、碳數2以上之脂肪族烴基、或碳數3以上之可經雜原子或/及鹵素原子取代之脂環式烴基，n由0或1之整數表示，Y5 為H或-CH3 時n＝0，Y5 為碳數2以上之脂肪族烴基或碳數3以上之可具有雜原子或/及鹵素原子之脂環式烴基時n＝1，且Y6 表示H或一價之有機基}。[12]如[1]至[9]中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(1)所表示之化合物、及/或下述式(2)所表示之化合物：[化4]{式中，X1 表示包含可具有取代基之雜環之一價基，Y1 表示選自由可形成分枝或環結構之碳數1～8之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z1 表示一價之有機基}[化5]{式中，X2 及X3 表示相同或不同之拉電子基，Y2 及Y3 相同或不同，Y2 及Y3 表示選自由可形成分枝或環結構之碳數1～10之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z2 表示選自由碳數1～16之伸烷基、及可具有取代基之伸苯基所組成之群中之二價基}。[13]如[12]之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含上述式(1)中X1 為下述式(3)所表示之一價基之化合物：[化6]{式中，A表示氧(O)原子或S原子}。[14]如[1]至[13]中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(A)成分包含側鏈具有芳香族基之鹼溶性樹脂。[15]如[1]至[14]中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物包含(E)矽烷偶合劑。[16]如[1]至[15]中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物包含(F)胺化合物。[17]一種感光性樹脂積層體，其具備支持膜及設於該支持膜上之包含如[1]至[16]中任一項之導體部之保護膜用感光性樹脂組合物之感光性樹脂層。[18]如[17]之感光性樹脂積層體，其中上述感光性樹脂層之厚度為15 μm以下，且上述感光性樹脂層之波長365 nm之吸光度相對於厚度每1 μm為0.01～0.05。[19]一種圖案製造方法，其包括以下步驟：於基材上層壓如[17]或[18]之感光性樹脂積層體並進行曝光，然後進行顯影，藉此製作圖案。[20]一種硬化膜圖案製造方法，其包括以下步驟：於基材上層壓如[17]或[18]之感光性樹脂積層體並進行曝光，然後進行顯影，藉此製作圖案；及將該圖案供於後曝光處理及/或加熱處理而使其硬化。[21]一種硬化膜，其係藉由如[20]之硬化膜圖案製造方法而製造。[22]一種觸控面板顯示裝置、具有觸控感測器之裝置或具有測力感測器之裝置，其具備藉由如[20]之硬化膜圖案製造方法而製造之硬化膜。[發明之效果]根據本發明，可提供一種防銹性、彎曲性、解像性及感度之平衡優異，且適於保護配線、電極等導體部之感光性樹脂組合物及感光性樹脂積層體。[Problem to be Solved by the Invention] The method for manufacturing a substrate for a touch panel with a cured film described in Patent Document 1 is for suppressing corrosion of a copper wiring for transmitting a detection signal of a touch position, but has no bendability. Related records. Although Patent Document 2 mentions corrosion inhibition or developability, there is no description about bending property. Further, in Patent Documents 3 and 4, a composition having good solvent resistance or resolving property by using an initiator having a specific light absorption coefficient is described, but the rust preventing property and the bending property are not described. Therefore, the problem to be solved by the present invention is to provide a detachment resistance (hereinafter referred to as "resolution") of various patterns such as rust resistance, flexibility, and round hole, and excellent balance of sensitivity, and is suitable for protecting wiring, A photosensitive resin composition of a conductor portion such as an electrode. [Means for Solving the Problem] In order to solve the above problems, the inventors of the present invention have found that the photosensitive resin composition contains (A) an alkali-soluble resin and (B) an ethylenically unsaturated double bond. a compound, (C) a photopolymerization initiator, and (D) a rust inhibitor, and an antimony compound having a specific absorption coefficient as the component (C), and excellent balance between rust resistance, flexibility, resolution, and sensitivity The present invention is also suitable for protecting a photosensitive resin composition of a conductor portion such as a wiring or an electrode. That is, the present invention is as follows. [1] A photosensitive resin composition for forming a protective film for a conductor portion, comprising: (A) an alkali-soluble resin; (B) a compound having an ethylenically unsaturated double bond; (C) a photopolymerization initiator And (D) a rust preventive agent; and as a component (C), an antimony compound having an absorption coefficient at a wavelength of 365 nm in an ethanol solution of 17 mL/(mg·cm) to 60 mL/(mg·cm). [2] The photosensitive resin composition for a protective film formation of the said conductor part containing the carbon (C) atom and nitrogen (N) atom as a (D) component, And a compound having a heterocyclic ring of a sulfur (S) atom and having a number of N atoms of 3 or less or a number of S atoms of 3 or less or a total of N atoms and S atoms in the same hetero ring is 3 or less. [3] The photosensitive resin composition for forming a protective film of the said conductor part, and the (D) component is selected from the benzotriazole and the benzo At least one compound of the group consisting of an azole derivative, an imidazole, and an imidazole derivative. [4] The photosensitive resin composition according to the above [3], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a benzotriazole or a benzotriazole derivative as the component (D). [5] The photosensitive resin composition for forming a protective film of the above-mentioned conductor part, wherein the (D) component is selected from the group consisting of triazoles and triazole derivatives, At least one compound of the group consisting of tetrazole, tetrazole derivative, thiadiazole, thiadiazole derivative, oxazole and carbazole derivative. [6] The photosensitive resin composition according to the above [5], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a triazole or a triazole derivative as the component (D). [7] The photosensitive resin composition according to the above [5], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a tetrazole or a tetrazole derivative as the component (D). [8] The photosensitive resin composition according to the above [5], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a thiadiazole or a thiadiazole derivative as the component (D). [9] The photosensitive resin composition according to the above [5], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a carbazole or a carbazole derivative as the component (D). [10] The photosensitive resin composition for protective film formation of the said conductor part contains the following formula (4) as (C) component. Compound represented: [Chemical 1] In the formula, X 4 and X 5 each independently represent a monovalent organic group, and at least one of them includes the following formula (5): [Chemical 2] The structure indicated, and Y 4 represents H or a monovalent organic group}. [11] The photosensitive resin composition for forming a protective film according to the above [10], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a compound represented by the following formula (6) as the component (C): ] In the formula, Y 5 is H, -CH 3 , an aliphatic hydrocarbon group having 2 or more carbon atoms, or an alicyclic hydrocarbon group having 3 or more carbon atoms which may be substituted by a hetero atom or/and a halogen atom, and n is 0 or 1 The integer indicates that when Y 5 is H or -CH 3 , n = 0, Y 5 is an aliphatic hydrocarbon group having 2 or more carbon atoms or an alicyclic hydrocarbon group having 3 or more carbon atoms which may have a hetero atom or/and a halogen atom; 1, and Y 6 represents H or a monovalent organic group}. [12] The photosensitive resin composition for forming a protective film of the conductor portion, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains the following formula (1) as the component (C) The compound represented, and/or the compound represented by the following formula (2): [Chemical 4] Wherein X 1 represents a valence group containing a heterocyclic ring which may have a substituent, and Y 1 represents a phenyl group selected from a C 1-8 alkyl group which may form a branched or cyclic structure, and a phenyl group which may have a substituent Substituents in the group formed, and Z 1 represents a monovalent organic group} Wherein X 2 and X 3 represent the same or different electron withdrawing groups, Y 2 and Y 3 are the same or different, and Y 2 and Y 3 represent an alkane having a carbon number of from 1 to 10 which can form a branched or cyclic structure. a substituent in the group consisting of a phenyl group which may have a substituent, and Z 2 represents a group selected from the group consisting of an alkylene group having 1 to 16 carbon atoms and a stretching phenyl group which may have a substituent Divalent base}. [13] The photosensitive resin composition according to [12], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains, as the component (C), X 1 in the above formula (1) is a formula (3) a compound represented by one of the valence groups: [Chemical 6] In the formula, A represents an oxygen (O) atom or an S atom}. [14] The photosensitive resin composition for forming a protective film of the conductor portion, wherein the component (A) contains a side chain having an aromatic group as the photosensitive resin composition according to any one of the above aspects of the invention. An alkali soluble resin. [15] The photosensitive resin composition according to any one of [1] to [14] wherein the photosensitive resin composition for forming a protective film of the conductor portion contains (E) a decane coupling agent. [16] The photosensitive resin composition of any one of [1] to [15], wherein the photosensitive resin composition for forming a protective film of the conductor portion contains (F) an amine compound. [17] A photosensitive resin laminate comprising a support film and a photosensitive resin composition for a protective film comprising the conductor portion according to any one of [1] to [16], which is provided on the support film. Resin layer. [18] The photosensitive resin laminate according to [17], wherein the photosensitive resin layer has a thickness of 15 μm or less, and the photosensitive resin layer has a light absorption at a wavelength of 365 nm of 0.01 to 0.05 per 1 μm. [19] A pattern manufacturing method comprising the steps of laminating a photosensitive resin laminate such as [17] or [18] on a substrate, performing exposure, and then developing, thereby patterning. [20] A method for producing a cured film pattern, comprising the steps of: laminating a photosensitive resin laminate such as [17] or [18] on a substrate, performing exposure, and then developing, thereby patterning; The pattern is cured by post exposure treatment and/or heat treatment. [21] A cured film produced by a method for producing a cured film pattern as in [20]. [22] A touch panel display device, a device having a touch sensor, or a device having a force sensor, which is provided with a cured film manufactured by a method of manufacturing a cured film pattern as in [20]. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive resin composition and a photosensitive resin laminate which are excellent in a balance between rust resistance, flexibility, resolution, and sensitivity, and are suitable for protecting conductor portions such as wirings and electrodes. .

以下，對用於實施本發明之形態(以下簡稱為「實施形態」)進行詳細說明。再者，本發明不僅限定於以下實施形態，可於其主旨之範圍內進行各種變化而實施。[感光性樹脂組合物及感光性樹脂積層體]於本發明之實施形態中，感光性樹脂積層體包含支持膜及由包含以下成分之感光性樹脂組合物所形成之感光性樹脂層：(A)鹼溶性樹脂；(B)具有乙烯性不飽和雙鍵之化合物；(C)光聚合起始劑；及(D)防銹劑。感光性樹脂組合物視所需亦可包含(E)矽烷偶合劑、(F)胺化合物、及其他成分。以下對構成感光性樹脂組合物之各成分進行具體說明。＜(A)鹼溶性樹脂＞本實施形態之鹼溶性樹脂為含有羧基之高分子體，如下所述，較佳為藉由使分子中含有羧基之第一單體之至少一種進行聚合而獲得。鹼溶性樹脂更佳為藉由使第一單體之至少一種與下述第二單體之至少一種進行共聚而獲得。作為第一單體，例如可列舉(甲基)丙烯酸、富馬酸、肉桂酸、丁烯酸、伊康酸、馬來酸酐、馬來酸酯等。此處，甲基丙烯酸表示丙烯酸及/或甲基丙烯酸，包括(甲基)丙烯酸酯在內以下相同。第二單體為非酸性且分子中具有至少1個聚合性不飽和基之單體。作為第二單體，例如可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯腈、乙酸乙烯酯等乙烯醇之酯類；(甲基)丙烯酸苄酯等(甲基)丙烯酸芳香族酯；苯乙烯及其可聚合衍生物等。於該等共聚物中，就基材上所製作之配線或電極之防銹性之觀點而言，較佳為含有源自(甲基)丙烯酸之結構單元與源自(甲基)丙烯酸芳香族酯或苯乙烯之結構單元之共聚物。進而，就彎曲性之觀點而言，更佳為含有源自(甲基)丙烯酸之結構單元與源自(甲基)丙烯酸芳香族酯之結構單元之共聚物。藉由使具有芳香族基之單元與其他單元共聚，而鹼溶性樹脂之疏水性及感光性樹脂積層體之硬化後之膜密度變高，防銹性提高，另一方面，若疏水性過高，則顯影性惡化。因此，關於鹼溶性樹脂中之具有芳香族基之單元之含有率，相對於鹼溶性樹脂之質量，較佳為20質量%～90質量%，更佳為50質量%～85質量%。再者，芳香族基例如為可具有取代基之苯基等即可。鹼溶性樹脂之酸當量(g/mol)較佳為430～860。關於酸當量，就防銹性提高之觀點而言，較佳為430以上，就顯影性提高之觀點而言，較佳為860以下。關於酸當量，就防銹性與顯影性之平衡之觀點而言，更佳為430～570，進而較佳為430～510。酸當量之測定係使用平沼產業(股)製造之平沼自動滴定裝置(COM-555)，並使用0.1 mol/L之氫氧化鈉藉由電位差滴定法而進行。於組合物中包含複數種(A)鹼溶性樹脂之情形時，其酸當量係指鹼溶性樹脂整體之酸當量。鹼溶性樹脂之重量平均分子量並無限定，就塗佈性、塗膜強度及顯影性之觀點而言，通常較佳為5,000以上且500,000以下。關於鹼溶性樹脂之重量平均分子量，就顯影凝集物之性狀、及感光性樹脂積層體之邊緣熔融性、切屑性等未曝光膜之性狀之觀點而言，較佳為5,000以上，就顯影性提高之觀點而言，較佳為500,000以下。此處，邊緣熔融性係指於作為感光性樹脂積層體捲取為輥狀之情形時，感光性樹脂組合物層自輥之端面伸出之現象。切屑性係指於利用切割器切斷未曝光膜之情形時碎片飛散之現象。若飛散之碎片附著於感光性樹脂積層體之上表面等，則會於後續之曝光衝程等中轉印至遮罩而成為不良之原因。鹼溶性樹脂之重量平均分子量更佳為5,000以上且300,000以下，進而較佳為10,000以上且200,000以下。重量平均分子量之測定係使用設定為以下條件之日本分光(股)製造之凝膠滲透層析法(GPC)進行。所獲得之重量平均分子量成為聚苯乙烯換算值。泵：Gulliver、PU-1580型管柱：昭和電工(股)製造之Shodex(註冊商標)(KF-807、KF-806M、KF-806M、KF-802.5)4根串聯移動床溶劑：四氫呋喃校準曲線：使用聚苯乙烯標準樣品所規定之校準曲線{使用基於聚苯乙烯標準樣品(昭和電工(股)製造之Shodex STANDARD SM-105)之校準曲線}感光樹脂組合物中之鹼溶性樹脂之含量以感光性樹脂組合物之質量為基準為30質量%～70質量%，就防銹性及彎曲性之觀點而言，較佳為40質量%～65質量%，進而更佳為50質量%～65質量%。＜(B)具有乙烯性不飽和雙鍵之化合物＞本實施形態之具有乙烯性不飽和雙鍵之化合物為藉由於其結構中具有乙烯性不飽和基而具有聚合性之化合物。作為具有乙烯性不飽和雙鍵之化合物，例如可列舉於聚環氧烷之一末端加成(甲基)丙烯酸而成之化合物、於一末端加成(甲基)丙烯酸且對另一末端進行烷基醚或烯丙醚化而成之化合物等。又，作為具有乙烯性不飽和雙鍵之化合物，例如亦可列舉於聚環氧烷鏈之兩末端具有(甲基)丙烯醯基之化合物、或於聚環氧乙烷鏈與聚環氧丙烷鏈以無規或嵌段之方式鍵結之環氧烷鏈之兩末端具有(甲基)丙烯醯基之化合物、對雙酚A進行環氧烷改性且於兩末端具有(甲基)丙烯醯基之化合物等。此外，作為具有乙烯性不飽和雙鍵之化合物，可列舉作為二異氰酸酯化合物與一分子中具有羥基及(甲基)丙烯酸基之化合物之反應產物之胺基甲酸酯化合物等。進而，作為具有乙烯性不飽和雙鍵之化合物，亦可使用一分子中具有超過2個之(甲基)丙烯醯基之化合物。此種化合物於分子內具有3莫耳以上之可加成環氧烷基之基作為中心骨架，藉由將對該基加成環氧乙烷基、環氧丙烷基或環氧丁烷基等環氧烷基而獲得之醇轉換為(甲基)丙烯酸酯而獲得。又，亦可不利用環氧烷基使中心骨架改性，而使中心骨架直接與(甲基)丙烯酸反應。作為可成為中心骨架之化合物，例如可列舉甘油、三羥甲基丙烷、季戊四醇、雙甘油、二-三羥甲基丙烷、二季戊四醇、異氰尿酸酯環等。就防銹性之觀點而言，具有乙烯性不飽和雙鍵之化合物較佳為包含一分子中具有3個以上(甲基)丙烯醯基之化合物，更佳為包含二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、或二-三羥甲基丙烷三(甲基)丙烯酸酯。關於具有乙烯性不飽和雙鍵之化合物於感光樹脂組合物中之含量，就解像性、密接性及防銹性之觀點而言，以感光性樹脂組合物之質量為基準，較佳為20質量%～60質量%，更佳為35質量%～50質量%。＜(C)光聚合起始劑＞本實施形態之光聚合起始劑之特徵在於為肟化合物，且於乙醇溶液中之波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)。肟化合物之於乙醇溶液中之波長365 nm之吸光係數，就保護膜之表面硬化性及感度之觀點而言，較佳為17 mL/(mg・cm)以上，尤佳為26 mL/(mg・cm)以上。又，就保護膜底部之硬化性之觀點而言，較佳為60 mL/(mg・cm)以下。就相同之理由而言，上述吸光係數更佳為35 mL/(mg・cm)～55 mL/(mg・cm)。藉由使用於波長365 nm下具有較高吸光係數之肟起始劑，可獲得於i射線曝光下具有高感度之保護膜。又，可認為於利用碳酸鈉水溶液之顯影步驟中，若鈉離子滲透至硬化之保護膜表面，與鹼溶性樹脂之羧酸形成鈉鹽，則水易於滲透至保護膜，防銹性惡化。此處，可推測若使用具有較高吸光係數之肟起始劑，則曝光時保護膜表面之吸收變大，故而獲得較高之表面硬化性，可抑制顯影時之鈉離子之滲入，結果獲得較高之防銹性。於該情形時，進而促進表面硬化，故而保護膜之底部不過度硬化，獲得良好之彎曲性。相反地，若吸光係數過高，則反應僅於保護膜之表面進行，保護膜之底部硬化不充分，與基材之密接性或彎曲性惡化。作為該等之平衡良好之範圍，肟化合物之於乙醇溶液中之波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)。作為肟化合物，例如可列舉咔唑及其衍生物、具有茀結構之肟系化合物等，於本實施形態中較佳。作為於乙醇中之波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟起始劑之具體例，可列舉日本專利第5682094號說明書中所記載之化合物2、D-1、D-3、D-4、D-9、D-12、D-14、D-15、D-20、C-2等，又，作為市售品，可列舉(7-硝基-9,9-二丙基-9H-茀-2-基)(鄰甲苯基)甲酮 O-乙醯肟(Daito Chemix(股)製造之DFI-020)、1,2-丙二酮,3-環己基-1-[9-乙基-6-(2-呋喃羰基)-9H-咔唑-3-基]-,2-(O-乙醯肟)(日興Chemtec(股)製造之TR-PBG-326，製品名)、1,8-辛二酮,1,8-雙[9-(2-乙基己基)-6硝基-9H-咔唑-3-基]-,1,8-雙(O-乙醯肟)(ADEKA(股)公司製造之ADEKA ARKLS NCI-831，製品名)、3-環己基-1-(6-(2-(苯甲醯氧基亞胺基)辛醯基)-9-乙基-9H-咔唑-3-基)-丙烷-1,2-二酮-2-(O-苯甲醯肟)(日興Chemtec(股)製造之TR-PBG-371，製品名)等，均可容易獲取。就防銹性、彎曲性及解像性之觀點而言，更佳為TR-PBG-326、NCI-831及TR-PBG-371，就防銹性、彎曲性、解像性及保存穩定性之觀點而言，尤佳為TR-PBG-371。又，作為光聚合起始劑，下述通式(1)所表示之化合物、及/或下述通式(2)所表示之化合物之表面硬化性較高，就感度、防銹性及彎曲性之觀點而言優異。[化7]{式中，X1 表示包含可具有取代基之雜環之一價基，Y1 表示選自由可形成分枝或環結構之碳數1～8之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z1 表示一價之有機基}{式中，X2 及X3 表示相同或不同之拉電子基，Y2 及Y3 相同或不同，Y2 及Y3 表示選自由可形成分枝或環結構之碳數1～10之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z2 表示選自由碳數1～16之伸烷基、及可具有取代基之伸苯基所組成之群中之二價基}一價之有機基為烴基(可為飽和亦可為不飽和，可為直鏈型亦可為支鏈型，結構中亦可包含環狀結構)，亦可包含雜原子或鹵素原子。作為式(1)所表示之化合物，就感度、防銹性及彎曲性之觀點而言，更佳為式(1)中之X1 為下述通式(3)所表示之一價基之化合物。[化9]{式中，A表示氧(O)原子或S原子}作為式(1)所表示之化合物，例如可列舉1,2-丙二酮,3-環己基-1-[9-乙基-6-(2-呋喃羰基)-9H-咔唑-3-基]-,2-(O-乙醯肟)(日興Chemtec(股)製造之TR-PBG-326，製品名)。 關於式(2)所表示之化合物，作為與X2 或X3 對應之拉電子基，例如可列舉鹵基、硝基、羰基、氰基等，較佳為硝基。 作為式(2)所表示之化合物之具體例，可列舉1,7-庚二酮,1,7-雙[9-乙基-6硝基-9H-咔唑-3-基]-,1,7-雙(O-乙醯肟)、1,7-庚二酮,1,7-雙[9-(2-乙基己基)-6硝基-9H-咔唑-3-基]-,1,7-雙(O-乙醯肟)、及1,8-辛二酮,1,8-雙[9-(2-乙基己基)-6硝基-9H-咔唑-3-基]-,1,8-雙(O-乙醯肟)(ADEKA(股)公司製造之ADEKA ARKLS NCI-831，製品名)等。進而，作為光聚合起始劑，下述式(4)所表示之化合物就感度、防銹性、彎曲性、解像性及保存穩定性之觀點而言尤佳。[化10]{式中，X4 及X5 分別獨立地表示一價之有機基，至少一者包含下述式(5)：[化11]所表示之結構，且Y4 表示H或一價之有機基}保存穩定性係指感光性樹脂積層體經過長期保存而以感度為代表之各種性能是否不變化而穩定之性能。保存穩定性之惡化於將感光性樹脂積層體於產業上利用之情形時，會導致使用期限之縮短、及管理工時或管理成本之增加，故而保存穩定性作為感光性樹脂積層體之性能較重要。進而，作為光聚合起始劑，下述式(6)所表示之化合物就感度、防銹性、彎曲性、解像性及保存穩定性之觀點而言尤佳。[化12]{式中，Y5 為H、-CH3 、碳數2以上之脂肪族烴基、或碳數3以上之可經雜原子或/及鹵素原子取代之脂環式烴基，n由0或1之整數表示，Y5 為H或-CH3 時n＝0，Y5 為碳數2以上之脂肪族烴基或碳數3以上之可具有雜原子或/及鹵素原子之脂環式烴基時n＝1，且Y6 表示H或一價之有機基}作為光聚合起始劑之肟化合物於酸共存下肟基水解，起始劑之功能易於失活。因此，於包含具有羧基之鹼溶性樹脂之感光性樹脂組合物或感光性樹脂積層體中，存在因長期保管而起始劑失活所致之感度降低或各種性能惡化之問題。可認為由於式(4)及(6)所表示之光聚合起始劑具有苯甲醯肟基，故而於酸性化合物之存在下水解之情形時，產生苯基自由基，由於苯自由基與甲基自由基等相比移動性較小，故而難以失活。進而，由於式(4)及(6)所表示之光聚合起始劑具有較高之吸光係數，故而顯示較高之反應性，於實用性方面以較佳之水準平衡性良好地獲得感度、防銹性、彎曲性、解像性、及保存穩定性。又，若拉電子性較強之基鍵結於咔唑骨架，則與咔唑骨架之共軛相關之肟基之-C=N-之電荷偏向C側，故而可推測肟基之N-O鍵易於斷裂，可認為保存穩定性惡化。因此，鍵結於咔唑骨格之基較佳為拉電子性較弱之基。因此，就保存穩定性之觀點而言，式(4)之基Y4 較佳為拉電子性較弱之基，更佳為式(6)之-Y5 -(Y6 )n 所示之基。作為拉電子性較弱之基，可列舉烷基、羥基、胺基等。作為式(4)或(6)所表示之化合物之具體例，可列舉3-環己基-1-(6-(2-(苯甲醯氧基亞胺基)辛醯基)-9-乙基-9H-咔唑-3-基)-丙烷-1,2-二酮-2-(O-苯甲醯肟)(日興Chemtec(股)製造之TR-PBG-371，製品名)等。關於在乙醇溶液中之波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟化合物於感光樹脂組合物中之含量，以感光性樹脂組合物之質量為基準，就防銹性、彎曲性、解像性及感度之平衡之觀點而言，較佳為0.05質量%～5質量%，更佳為0.1質量%～3質量%，進而較佳為0.1質量%～1質量%。於本實施形態中，感光性樹脂組合物根據所需除於乙醇溶液中之波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟化合物以外，亦可包含於乙醇溶液中之波長365 nm之吸光係數未達17 mL/(mg・cm)或超過60 mL/(mg・cm)之肟化合物、或肟化合物以外之光聚合起始劑。感光樹脂組合物中之全部光聚合起始劑之合計含量以感光性樹脂組合物之質量為基準，較佳為0.1質量%～10質量%，就感度與解像性之觀點而言，更佳為0.3質量%～5質量%。若光聚合起始劑之含量於0.1質量%～10質量%之範圍內，則光感度充分，並且於照射活性光線時組合物之表面之吸收增大，故而可抑制內部之光硬化不充分等不良情形。＜(D)防銹劑＞本實施形態之防銹劑係指具有防銹效果之化合物，例如為於金屬表面形成覆膜而防止金屬之腐蝕或鏽之物質等。作為防銹劑，就與本實施形態之感光性樹脂組合物之相容性及感度之觀點而言，較佳為包含N、S、O等之雜環化合物，例如可列舉四唑及其衍生物、三唑及其衍生物、咪唑及其衍生物、吲唑及其衍生物、吡唑及其衍生物、咪唑啉及其衍生物、㗁唑及其衍生物、異㗁唑及其衍生物、㗁二唑及其衍生物、噻唑及其衍生物、異噻唑及其衍生物、噻二唑及其衍生物、噻吩及其衍生物等。此處所記載之衍生物中包含於成為母體之結構中導入取代基之化合物。例如，若為四唑衍生物，則包含於四唑中導入取代基之化合物。作為取代基並無特別限制，例如可列舉包含一個以上烴基(可為飽和亦可為不飽和，可為直鏈型亦可為支鏈型，結構中亦可包含環狀結構)、或羥基、羰基、羧基、胺基、醯胺基、硝基、氰基、硫醇基及具有鹵(氟、氯、溴、碘等)基等雜原子之官能基之取代基。進而，就防銹性之觀點而言，作為雜環化合物，較佳為具有包括C與N及/或S之雜環，且於同一雜環中N原子數為3以下或S原子數為3以下或N原子與S原子之合計數為3以下之化合物，更佳為三唑及其衍生物、咪唑及其衍生物、咪唑啉及其衍生物、噻唑及其衍生物、異噻唑及其衍生物、噻二唑及其衍生物、噻吩及其衍生物等，就防銹性及顯影性之觀點而言，進而較佳為苯并三唑及其衍生物、及咪唑及其衍生物。藉由使用顯影性良好之(D)成分，所形成之圖案之麓部變小，於將本發明之保護膜應用於端子部分之情形時，於確保導通之方面更佳。將具有包括C與N及/或S之雜環，且於同一雜環中N原子數為3以下或S原子數為3以下或N原子與S原子之合計數為3以下之化合物之具體例示於以下：三唑，例如1,2,3-三唑、1,2,4-三唑等；三唑衍生物，例如3-巰基三唑、3-胺基-5-巰基三唑、苯并三唑、1H-苯并三唑-1-乙腈、1-[N,N-雙(2-乙基己基)胺甲基]苯并三唑、1-(2-二正丁胺甲基)-5-羧基苯并三唑、1-(2-二正丁胺甲基)-6-羧基苯并三唑、1H-苯并三唑-1-甲醇、5-甲基-1H-苯并三唑、5-羧基苯并三唑、1-羥基苯并三唑、5-氯苯并三唑、5-硝基苯并三唑等；咪唑；咪唑衍生物，例如十一烷基咪唑、苯并咪唑、5-羧基苯并咪唑、6-溴苯并咪唑、5-氯苯并咪唑、2-羥基苯并咪唑、2-(1-羥基甲基)苯并咪唑、2-甲基苯并咪唑、5-硝基苯并咪唑、2-苯基苯并咪唑、2-胺基苯并咪唑、5-胺基苯并咪唑、5-胺基-2-巰基苯并咪唑等；咪唑啉；咪唑啉衍生物，例如2-十一烷基咪唑啉、2-丙基-2-咪唑啉、2-苯基咪唑啉等；噻唑；噻唑衍生物，例如2-胺基-4-甲基噻唑、5-(2-羥基乙基)-4-甲基噻唑、苯并噻唑、2-巰基苯并噻唑、2-胺基苯并噻唑、2-胺基-6-甲基苯并噻唑、(2-苯并噻唑硫基)乙酸、3-(2-苯并噻唑硫基)丙酸等；異噻唑；異噻唑衍生物，例如3-氯-1,2-苯并異噻唑等；噻二唑，例如1,2,3-噻二唑、1,2,5-噻二唑、1,3,4-噻二唑等；噻二唑衍生物，例如4-胺基-2,1,3-苯并噻二唑、2-胺基-5-巰基-1,3,4-噻二唑、2-胺基-5-甲基-1,3,4-噻二唑、2-胺基-1,3,4-噻二唑、5-胺基-1,2,3-噻二唑、2-巰基-5-甲基-1,3,4-噻二唑等；噻吩；噻吩衍生物，例如2-噻吩羧酸、3-胺基-2-噻吩羧酸甲酯、3-甲基苯并噻吩等。於上述防銹劑之中，就防銹性及顯影性之觀點而言，尤佳為苯并三唑、5-羧基苯并三唑、1-羥基苯并三唑、及5-氯苯并三唑。另一方面，作為(D)成分，就防銹性與密接性之觀點而言，較佳為四唑及其衍生物、三唑及其衍生物、吲唑及其衍生物及噻二唑及其衍生物。作為四唑之具體例，可列舉1H-四唑。作為四唑衍生物之具體例，可列舉5-胺基-1H-四唑、5-甲基-1H-四唑、1-甲基-5-乙基-1H-四唑、1-甲基-5-巰基-1H-四唑、1-苯基-5-巰基-1H-四唑、1-(二甲胺基乙基)-5-巰基-1H-四唑及5-苯基-1H-四唑等。作為吲唑之具體例，可列舉1H-吲唑。作為吲唑衍生物，可列舉5-胺基吲唑、6-胺基吲唑、1-苄基-3-羥基-1H-吲唑、5-溴吲唑、6-溴吲唑、6-羥基吲唑、3-羧基吲唑及5-硝基吲唑等。三唑及其衍生物及噻二唑及其衍生物之具體例如上述已說明。該等之中，就防銹性與密接性之觀點而言，尤佳為5-胺基-1H-四唑、5-羧基苯并三唑、5-胺基吲唑及5-胺基-1,2,3-噻二唑。於使用如本發明之反應性較高之光聚合起始劑之情形時，藉由曝光或加熱處理而產生感光性樹脂組合物之硬化收縮，硬化膜產生與基材之應力，藉此出現硬化膜與基材之密接性惡化之問題。然而，藉由組合使用本實施形態之(C)成分與就上述防銹性及密接性之觀點而言較佳之(D)成分，可於實用性方面以較佳之水準平衡性良好地表現感度、防銹性、彎曲性、解像性、保存穩定性及密接性。於本實施形態中，可單獨使用上述所說明之防銹劑之一種，亦可併用兩種以上。關於感光性樹脂組合物中之防銹劑之含量，就防銹性或顯影性之觀點而言，以感光性樹脂組合物之質量為基準，較佳為0.05質量%～10質量%，更佳為0.1質量%～5質量%，進而較佳為0.2質量%～3質量%。＜(E)矽烷偶合劑＞於本實施形態中，就與基材之密接性、防銹性、及顯影性之觀點而言，感光性樹脂組合物較佳為包含矽烷偶合劑。作為矽烷偶合劑，例如可列舉3-縮水甘油氧基丙基甲基二甲(或乙)氧基矽烷(信越化學(股)製造之KBM-402、KBE-402，製品名)、3-縮水甘油氧基丙基三甲(或乙)氧基矽烷(信越化學(股)製造之KBM-403、KBE-403，製品名)、3-甲基丙烯醯氧基丙基甲基二甲(或乙)氧基矽烷(信越化學(股)製造之KBM-502、KBE-502，製品名)、3-甲基丙烯醯氧基丙基三甲(或乙)氧基矽烷(信越化學(股)製造之KBM-503、KBE-503，製品名)、3-胺基丙基三甲(或乙)氧基矽烷(信越化學(股)製造之KBM-903、KBE-903，製品名)、異氰尿酸三-(三甲氧基矽烷基丙基)酯(信越化學(股)製造之KBM-9659，製品名)、3-巰基丙基甲基二甲氧基矽烷(信越化學(股)製造之KBM-802，製品名)、3-巰基丙基三甲氧基矽烷(信越化學(股)製造之KBM-803，製品名)、2-[3-(三乙氧基矽烷基)丙基]琥珀酸酐、3-三甲氧基矽烷基丙基琥珀酸酐(信越化學(股)製造之X-12-967C，製品名)等。關於感光性樹脂組合物中之矽烷偶合劑之含量，就與基材之密接性、防銹性及顯影性之觀點而言，以感光性樹脂組合物之質量為基準，較佳為0.1質量%～5質量%，更佳為0.5質量%～3質量%。＜(F)胺化合物＞於本實施形態中，為了進一步提高(D)防銹劑之效果，感光性樹脂組合物較佳為包含胺化合物。作為胺化合物，例如可列舉氨、乙二胺、三伸乙基四胺、單乙醇胺、二乙醇胺、三乙醇胺、單異丙醇胺、二異丙醇胺、三異丙醇胺、二伸乙基三胺、二乙胺、二丁胺、六氫苯胺、四伸乙基五胺、五伸乙基六胺、烯丙基胺、2-胺基丙醇、3-胺基丙醇、4-胺基丁醇、4-甲胺基丁醇、乙基胺基乙基胺、2-乙基己基胺、二-2-乙基己基胺、三(2-乙基己基)胺、油胺、十二烷基胺、二環己基胺、辛基胺、十八烷基胺、己基胺等。該等胺化合物可單獨使用一種或組合兩種以上使用。於該等胺化合物之中尤佳為二丁胺。關於感光性樹脂組合物中之胺化合物之含量，就防銹性之觀點而言，以感光性樹脂組合物之質量為基準，較佳為0.05質量%～3質量%，更佳為0.1質量%～2質量%。＜其他成分＞ 於本實施形態中，除成分(A)～(F)以外，亦可使感光性樹脂組合物中含有加成3莫耳亞硝基苯基羥胺之鋁鹽等聚合抑制劑、調平劑、塑化劑、填充劑、消泡劑、阻燃劑等，該等可單獨或組合兩種以上使用。 ＜感光性樹脂層＞本實施形態之感光性樹脂層較佳為厚度為15 μm以下，且感光性樹脂層之波長365 nm之吸光度相對於感光性樹脂層之厚度每1 μm為0.01～0.05。若感光性樹脂層之膜厚過大則柔軟性惡化，故而感光性樹脂層之厚度較佳為15 μm以下，就追隨配線之凹凸之觀點、及確保防銹性之觀點而言，較佳為3 μm以上。若感光性樹脂層之吸光度較高，則促進表面之硬化，如上述般防銹性提高，底部不過度硬化，可維持彎曲性，故而感光性樹脂層之吸光度較佳為0.01以上，另一方面，若感光層之吸光度過高，則底部硬化不充分，與基材之密接性惡化，故而較佳為0.05以下。＜感光性樹脂積層體之詳情＞感光性樹脂積層體包括包含感光性樹脂組合物之感光性樹脂層及支持膜。具體而言，於支持膜上積層有包含上述感光性樹脂組合物之層。感光性樹脂積層體視需要亦可於感光性樹脂層之與支持膜側為相反側之表面具有保護層。作為本實施形態中所使用之支持膜，較理想為可透過自曝光光源放射之光之透明者。作為此種支持膜，例如可列舉聚對苯二甲酸乙二酯膜、聚乙烯醇膜、聚氯乙烯膜、氯乙烯共聚物膜、聚偏二氯乙烯膜、偏二氯乙烯共聚膜、聚甲基丙烯酸甲酯共聚物膜、聚苯乙烯膜、聚丙烯腈膜、苯乙烯共聚物膜、聚醯胺膜、包含纖維素及其衍生物之膜等。該等膜視需要亦可使用經延伸者。支持膜之霧度較佳為5以下。支持膜之厚度越小，於解像性及經濟性方面越有利，但為了維持強度，較佳為10 μm～30 μm。用於感光性樹脂積層體之保護層之重要特性在於：關於與感光性樹脂層之密接力，與支持膜相比保護層足夠小，可容易地剝離。作為保護層，例如可較佳地使用聚乙烯膜、聚丙烯膜等。又，作為保護層，亦可使用日本專利特開昭59-202457號公報中所示之剝離性優異之膜。保護層之膜厚較佳為10 μm～100 μm，更佳為10 μm～50 μm。感光性樹脂積層體之製作方法包括將塗佈液塗佈於支持體(例如支持膜)上並進行乾燥之步驟，進而視需要包括於感光性樹脂層上層壓保護層之步驟。塗佈液可藉由將上述所說明之感光性樹脂組合物均勻地溶解於溶劑中而獲得。作為溶解感光性樹脂組合物之溶劑，例如可列舉以甲基乙基酮(MEK)為代表之酮類；以甲醇、乙醇或異丙醇為代表之醇類等。溶劑較佳為以塗佈於支持體上之感光性樹脂組合物之溶液之黏度於25℃下成為10 mPa・s～800 mPa・s之方式添加於感光性樹脂組合物中。作為塗佈方法，例如可列舉刮刀塗佈法、邁耶棒式塗佈法、輥塗法、網版塗佈法、旋轉塗佈法、噴墨塗佈法、噴霧塗佈法、浸漬塗佈法、凹版塗佈法、簾幕式塗佈法、模嘴塗佈法等。塗佈液之乾燥條件並無特別限制，乾燥溫度較佳為50℃～130℃，乾燥時間較佳為30秒～30分鐘。於本實施形態中，感光性樹脂積層體較佳為用於形成導體部之保護膜，於該情形時，導體部更佳為銅電極、銅與鎳之合金電極或透明電極。更詳細而言，感光性樹脂積層體可用作用於觸控面板(觸控感測器或測力感測器)之邊框區域之引出配線之保護膜、或用於感測區域之銅電極之保護膜。[樹脂圖案與硬化膜圖案及該等之製造方法]使用感光性樹脂積層體之樹脂圖案之形成可藉由包括以下步驟之樹脂圖案之製造方法而進行：層壓步驟，其係於基材上層壓上述感光性樹脂積層體；曝光步驟，其係對該層壓之感光性樹脂積積層體進行曝光；及顯影步驟，其係對該曝光之感光性樹脂積層體進行顯影。進而，為了將樹脂圖案用作導體部之保護膜，較佳為樹脂圖案之製造方法於顯影步驟後包括將樹脂圖案供於後曝光處理及/或加熱處理而形成硬化膜圖案之步驟。以下例示具體方法之一例。作為基材，可使用於軟性覆銅積層板上形成銅配線而成之基材、於玻璃基材、透明樹脂基材上形成透明電極(例如ITO、Ag奈米線基材等)或金屬電極(例如Cu、Al、Ag、Ni、Mo及該等之至少兩種之合金等)而成之觸控面板基材或觸控感測器基材(例如測力感測器等)等。軟性覆銅積層板、觸控面板電極形成用基材或觸控感測器電極形成用基材為於軟性膜上形成銅層或透明電極或成為金屬電極之原料之金屬層而成之基材。作為上述膜，例如可列舉包含聚醯亞胺、聚酯(PET、PEN)、環烯烴聚合物(COP)等膜原料之膜。上述膜之厚度較佳為10 μm～100 μm。又，作為上述銅，除純銅以外可使用含有銅作為主成分之合金。此處「主成分」係指合金之至少50質量%為銅。作為合金金屬，例如可列舉鎳、鈀、銀、鈦、鉬等與銅之合金。銅層之厚度較佳為50 nm～2 μm。就銅層之均勻性之觀點而言，銅層之厚度更佳為100 nm以上。藉由進行對如上述之基材層壓感光性樹脂積層體之步驟，而於基材之銅層上形成感光性樹脂層。於感光性樹脂積層體具有保護層之情形時，較佳為剝離該保護層後，利用貼合機進行加熱壓接而將感光性樹脂積層體積層於基材表面。於該情形時，可將感光性樹脂積層體僅積層於基材表面之單面，亦可積層於雙面。加熱溫度一般而言約為40℃～160℃。加熱壓接可使用具備雙聯輥之二段式貼合機進行，亦可藉由使感光性樹脂積層體與基材複數次反覆通過輥而進行。又，若使用真空貼合機，則保護膜對於因基材上之配線等所致之凹凸之追隨性良好，可防止於感光性樹脂積層體與基材之間混入空氣之缺點。其次，使用曝光機進行曝光步驟。視需要自感光性樹脂積層體剝離支持膜，經由光罩藉由活性光對感光性樹脂層進行曝光。曝光量由光源照度及曝光時間決定。曝光量亦可使用光量計進行測定。作為曝光機，可列舉將超高壓水銀燈作為光源之散射光曝光機、調整平行度之平行光曝光機、於遮罩與工件之間設置間隙之近接曝光機等。進而作為曝光機，可列舉遮罩與圖像之尺寸比為1：1之投影型曝光機、高照度之被稱為步進機(註冊商標)之縮小投影曝光機、或被稱為鏡面投影對準曝光器(註冊商標)之利用凹面鏡之曝光機。又，於曝光步驟中亦可使用直接刻寫曝光方法。直接刻寫曝光係指不使用光罩，而於基板上直接刻寫進行曝光之方式。作為光源，例如使用波長350 nm～410 nm之固體雷射、半導體雷射或超高壓水銀燈。刻寫圖案藉由電腦控制。該情形之曝光量由光源照度與基板之移動速度決定。其次，使用顯影裝置進行顯影步驟。曝光後，於感光性樹脂層上存在支持膜之情形時，視需要去除支持膜，繼而使用鹼性水溶液之顯影液將未曝光部顯影去除而獲得樹脂圖案。作為鹼性水溶液，較佳為使用Na2 CO3 或K2 CO3 之水溶液(鹼性水溶液)。鹼性水溶液可根據感光性樹脂層之特性而適當選擇，一般而言選擇濃度約0.2質量%～2質量%、約20℃～40℃之Na2 CO3 水溶液。亦可於鹼性水溶液中混入表面活性劑、消泡劑、用於促進顯影之少量有機溶劑等。考慮到對基材之影響，亦可使用氫氧化四甲基銨(TMAH)水溶液等胺系鹼性水溶液。可根據顯影速度適當選擇水溶液中之鹼性化合物之濃度。就臭氣較少，操作性優異且管理及後處理簡便之觀點而言，尤佳為1質量%、30℃～35℃之Na2 CO3 水溶液。作為顯影方法，可列舉鹼性水噴霧、噴淋、擺動浸漬、刷洗、刮洗等已知之方法。顯影後，可使用有機酸、無機酸或該等之酸水溶液，並藉由噴霧、擺動浸漬、刷洗、刮洗等已知之方法對殘存於樹脂圖案上之鹼性水溶液之鹼進行酸處理(中和處理)。進而，亦可於酸處理(中和處理)之後進行水洗步驟。經由上述各步驟可獲得樹脂圖案，進而亦可實施後曝光步驟及/或加熱步驟。藉由實施後曝光步驟及/或加熱步驟而防銹性進一步提高。作為後曝光處理中之曝光量，較佳為200 mJ/cm2 ～1000 mJ/cm2 ，於加熱步驟中較佳為進行40℃～200℃之處理，就製造製程之觀點而言，加熱處理時間較佳為60分鐘以下。作為加熱處理之方式，可使用熱風、紅外線、遠紅外線等適當之方式之加熱爐，作為加熱處理之氛圍，可列舉N2 氛圍下、或N2 /O2 氛圍下。根據本實施形態，可提供一種防銹性、柔軟性、解像性及感度之平衡優異，適於保護配線、電極等導體部之感光性樹脂組合物及感光性樹脂積層體。此種感光性樹脂積層體例如可較佳地用作觸控面板、觸控感測器或測力感測器用途之配線、電極等之保護膜。[觸控面板顯示裝置、具有觸控感測器或測力感測器之裝置]藉由於觸控面板用基材上形成本實施形態之感光性樹脂積層體之硬化膜，可提供一種具有感光性樹脂積層體之硬化膜之觸控面板顯示裝置、及具有感光性樹脂積層體之硬化膜與觸控感測器及/或測力感測器之裝置。作為觸控面板用基材，一般而言可列舉用於觸控面板、觸控感測器或測力感測器之基材，例如玻璃板、塑膠板、塑膠膜、陶瓷板等。於該基材上設有成為形成保護膜之對象之ITO、Cu、Al、Ag、Ni、Mo及包含該等之至少兩種之合金等觸控面板用電極或金屬配線，於基材與電極之間亦可設有絕緣層。具有觸控面板用電極之觸控面板用基材例如可利用以下順序獲得。於聚酯、COP膜等觸控面板用基材上按照ITO、Cu之順序藉由濺鍍法形成金屬膜後，於金屬膜上貼附蝕刻用感光性膜，形成所需之抗蝕圖案，並利用氯化鐵水溶液等蝕刻液去除不需要之Cu，進而剝離、去除抗蝕圖案。於觸控面板用基材上形成作為保護膜之硬化膜之方法較佳為依序包括以下步驟：第一步驟，其係將本實施形態之感光性樹脂積層體層壓於觸控面板用基材上；第二步驟，其係藉由活性光線之照射使保護膜之特定部分硬化；第3步驟，其係去除保護膜之特定部分以外之部分(保護膜之未經活性光線照射之部分)，形成經圖案化之保護膜之硬化物；及第4步驟，其係對經圖案化之保護膜進行曝光及/或熱處理。如上述般藉由製作具有感光性樹脂積層體之硬化膜圖案之觸控面板用基材，可較佳地提供一種具有感光性樹脂積層體之硬化膜之觸控面板顯示裝置、或具有感光性樹脂積層體之硬化膜與觸控感測器及/或測力感測器之裝置。[實施例]基於以下之實施例具體地說明本發明，但本發明並不限定於該等。首先例示起始劑之吸光係數之測定方法。繼而，說明實施例1～38及比較例1～6之評價用膜之製作方法，並例示關於所獲得之膜之評價方法及其評價結果。1.起始劑之吸光係數之測定方法藉由精密天平秤量100 mg下述表1記載之各起始劑，分別溶解於100 mL之乙醇中。將起始劑完全溶解後，採取10 mL溶液，使用100 mL之量瓶藉由乙醇稀釋10倍。再次同樣地將稀釋液稀釋10倍而獲得1 mg/100 mL溶液。將1 mg/100 mL溶液放入樣品之光路長度1 cm之石英池中置於測定側，於參考側放置裝有乙醇之石英池，藉由Hitachi High-Technologies Corporation(股)製造之分光光度計(U-3010)進行測定，並根據測定值算出吸光係數。將結果示於表1。2.評價用膜之製作藉由以下方式製作實施例及比較例中之評價用膜。＜感光性樹脂積層體之製作＞將下述表2～6所示之組合(其中，各成分之數字表示作為固形物成分之調配量(質量份))之感光性樹脂組合物及溶劑充分攪拌及混合而獲得感光性樹脂組合物調合液。於作為支持膜之16 μm厚之聚對苯二甲酸乙二酯膜(三菱樹脂(股)製造之R310-16B)之表面使用刮刀塗佈機均勻地塗佈感光性樹脂組合物調合液，於95℃之乾燥機中乾燥3分鐘，而於支持膜上形成均勻之感光性樹脂層。使用明產(股)製造之桌上厚度計(RC-1W-200/1000)，分別測定支持膜及於支持膜上形成有均勻之感光性樹脂層之樣品之膜厚，自於支持膜上形成有均勻之感光性樹脂層之樣品之膜厚減去支持膜之膜厚而算出感光性樹脂層之厚度，結果感光性樹脂層之厚度為10 μm。繼而，於感光性樹脂層之表面上貼合33 μm厚之聚乙烯膜(Tamapoly(股)製造之GF-858)作為保護膜而獲得感光性樹脂積層體。將於表2～6中以略語表示之感光性樹脂組合物調合液中之材料成分之名稱示於表7。3.感光性樹脂層之吸光度測定使用Hitachi High-Technologies Corporation(股)製造之分光光度計(U-3010)，剝離所獲得之感光性樹脂積層體之聚乙烯膜，將支持體與感光性樹脂層於積層之狀態下置於測定側，於參考側放置支持膜，而測定感光性樹脂積層體之吸光度(365 nm)。測定值除以膜厚，將相對於膜厚每1 μm之吸光度示於表2～4。4.感度及解像性評價＜樣品製作方法＞一面將感光性樹脂積層體之保護膜剝離，一面藉由加熱輥貼合機(大成貼合機(股)製造之VA-400III)於輥溫度100℃下將其層壓於依序積層有樹脂、ITO及濺鍍銅之基板之銅表面。氣壓設定為0.4 mPa，層壓速度設定為1.0 m/分鐘。靜置15分鐘後，於支持膜上並列放置PET遮罩與Stouffer 21段階段式曝光表(將光學密度0.00設為第1段，且每1段光學密度逐次增加0.15之階段式曝光表)，自PET遮罩及階段式曝光表側藉由平行光曝光機(OAK製作所(股)製造之HMW-801)曝光各組合之最佳曝光量。使用未曝光部分具有成為圓孔之圖案者作為PET遮罩。靜置15分鐘以上後，剝離感光性樹脂積層體之支持膜，使用富士機工(股)製造之顯影裝置藉由全錐型噴嘴於顯影噴壓0.07 mPa下將35℃之1質量%Na2 CO3 水溶液噴霧60秒鐘而進行顯影，並將感光性樹脂層之未曝光部分溶解去除。此時，水洗步驟藉由扁平型噴嘴於水洗噴壓0.07 mPa下進行與顯影步驟相同之時間，藉由鼓風將水洗之樣品加以乾燥而形成評價用圖案。上述最佳曝光量意指於藉由上述處理經由Stouffer 21段階段式曝光表進行曝光之情形時殘膜之段數成為8～9段之曝光量。＜評價方法＞・感度以下述之方式對藉由上述樣品製作方法而獲得之最佳曝光量進行分級，並彙總至表2～4中。作為保護膜較佳為等級C以上。A：最佳曝光量為30 mJ以下B：最佳曝光量高於30 mJ且為60 mJ以下C：最佳曝光量高於60 mJ且為90 mJ以下D：最佳曝光量高於90 mJ・解像性將藉由上述樣品製作方法正常形成有圓孔圖案之最小圓孔遮罩之直徑設為解像性之值，以下述之方式對解像性進行分級，並將結果彙總至表2～4中。作為保護膜較佳為等級B以上。A：解像性之值超過70 μm且為80 μm以下B：解像性之值超過80 μm且為100 μm以下C：解像性之值超過100 μm5.耐彎曲性評價＜樣品製作方法＞將感光性樹脂積層體切割為2 cm×20 cm，藉由散射光曝光機(OAK製作所(股)製造之HMW-201KB)自支持膜側以各組合之曝光量進行曝光。靜置15分鐘後，自感光性樹脂積層體剝離保護膜，利用與感度、解像性評價樣品之製作方法相同之方法進行顯影、水洗、乾燥步驟。其後，藉由散射光曝光機自感光層側以350 mJ/cm2 之曝光量進行曝光，繼而藉由熱風循環式烘箱於150℃下處理30分鐘。於23℃、50%RH下對所製作之樣品進行1天濕度控制後進行試驗。＜評價方法＞如圖1所示，以固定之具有特定直徑φ之圓筒形心軸(2)為支點，以所製作之樣品(1)之感光性樹脂層為外側歷時1秒～2秒彎折90℃然後恢復原狀，將上述操作設為1次，重複同樣之操作特定次數。其後，針對樣品(1)，使用顯微鏡觀察有無剝離及感光性樹脂層有無破裂，按照以下之方式進行分級。將其結果示於表2～4。作為保護膜較佳為等級C以上。A：藉由0.5 mmφ之心軸彎折10次，無破裂及剝離B：藉由0.5 mmφ之心軸彎折1次，無破裂及剝離C：藉由1 mmφ之心軸彎折10次，無破裂及剝離D：藉由2 mmφ之心軸彎折10次，無破裂及剝離6.防銹性評價＜試驗用基材之製作＞如日本專利第4515123號說明書之實施例2中所記載般，製作感光性樹脂積層體，一面自感光性樹脂積層體剝離保護膜，一面藉由加熱輥貼合機將其層壓於依序積層有樹脂、ITO、及濺鍍銅之大小5 cm×10 cm之軟性基材之銅表面。此時，輥溫度設定為100℃，氣壓設定為0.4 mPa，層壓速度設定為1.5 m/分鐘。靜置15分鐘後，於支持膜上放置PET遮罩，自PET遮罩側藉由平行光曝光機以120 mJ/cm2 進行曝光。PET遮罩使用具有線/間隙＝80 μm/80 μm之圖案者。靜置15分鐘以上後，自感光性樹脂積層體剝離支持膜，使用富士機工(股)製造之顯影裝置，藉由全錐型噴嘴於顯影噴壓0.15 mPa下將30℃之1質量%Na2 CO3 水溶液以最小顯影時間之2倍時間進行噴霧，並將感光性樹脂層之未曝光部分溶解去除。此處，最小顯影時間係指至感光性樹脂組合物層之未曝光部分完全溶解去除為止所需之最小時間。此時，水洗步驟藉由扁平型噴嘴於水洗噴壓0.15 mPa下進行與顯影步驟相同之時間，進而藉由鼓風將水洗之樣品加以乾燥而於銅表面上形成抗蝕圖案。繼而，藉由以於液溫30℃之鹽酸濃度2質量%、氯化鐵2質量%之水溶液中浸漬最少蝕刻時間之1.5倍時間之浸漬方式對形成有抗蝕圖案之基板進行蝕刻。其後，進行水洗及風乾處理。此處，最小蝕刻時間係指於上述條件下將基板上之銅箔完全溶解去除所需之最小時間。於上述蝕刻後，將基板浸漬於液溫50℃之3質量%之NaOH水溶液中，藉由浸漬方式進行抗蝕劑之去除，並進行水洗及風乾處理。藉此，獲得於樹脂上積層有ITO，進而於ITO層上形成有銅配線圖案之試驗用基材。若更詳細地敍述銅配線圖案，則長度8cm、寬度80 μm之銅線以線：間隙＝1：1形成有10根。＜樣品製作方法＞一面將實施例1～38及比較例1～3之各感光性樹脂積層體之保護膜剝離，一面使用加熱輥貼合機(大成貼合機(股)製造之VA-400III)將其對藉由上述方法製作之形成有銅配線之基材之銅配線存在之面進行層壓。此時，輥溫度設定為100℃，氣壓設定為0.4 mPa，層壓速度設定為1.0 m/分鐘。靜置15分鐘後，自保護膜之支持膜側藉由散射光曝光機對整個表面曝光各組合之最佳曝光量。靜置15分鐘後，自感光性樹脂積層體剝離支持膜，使用富士機工(股)製造之顯影裝置，藉由全錐型噴嘴於顯影噴壓0.07 mPa下將35℃之1質量%Na2 CO3 水溶液噴霧60秒鐘而進行顯影，並將感光性樹脂層之未曝光部分溶解去除。此時，水洗步驟藉由扁平型噴嘴於水洗噴壓0.07 mPa下進行與顯影步驟相同之時間，藉由鼓風將水洗之樣品加以乾燥。其後，藉由散射光曝光機自感光層側以350 mJ/cm2 之曝光量進行曝光，繼而，藉由熱風循環式烘箱於150℃下處理30分鐘而製作評價用樣品。＜評價方法＞將JIS L0848中所記載之酸性人工汗液滴加於所製作之評價用樣品之銅配線上後，保管於85℃、85%RH之恆溫恆濕烘箱(Advantech東洋(股)製造之THN050FA)中。經過特定時間後自烘箱中取出樣品，自保護膜面及與保護膜相反之面藉由顯微鏡進行觀察，確認銅配線有無變色或腐蝕，以下述之方式進行分級。將其結果示於表2～4。作為保護膜較佳為等級D以上。A：於85℃、85%RH之環境下經過144小時以上後發生變色或腐蝕B：於85℃、85%RH之環境下於120小時以上且未達144小時發生變色或腐蝕C：於85℃、85%RH之環境下於96小時以上且未達120小時發生變色或腐蝕D：於85℃、85%RH之環境下於72小時以上且未達96小時發生變色或腐蝕E：於85℃、85%RH之環境下於未達72小時發生變色或腐蝕7.保存穩定性評價＜樣品製作方法＞關於實施例29～32及比較例4，準備2個20 cm×30 cm之感光性樹脂積層體，將其中一個於50℃、60%RH之恆溫恆濕烘箱(Nagano Science(股)製造之LH21-11M)中保管3天，另一個於室溫下保管3天而獲得兩種樣品。其後，一面將感光性樹脂積層體之保護膜剝離，一面使用加熱輥貼合機(大成貼合機(股)製造之VA-400III)將該等感光性樹脂積層體分別層壓於依序積層有樹脂、ITO及濺鍍銅之基板之銅表面上。此時，輥溫度設定為100℃，氣壓設定為0.4 mPa，層壓速度設定為1.0 m/分鐘。靜置15分鐘後，自保護膜之支持膜側藉由散射光曝光機經由Stouffer 21段階段式曝光表進行曝光。此時，以於室溫下保管3天之感光性樹脂積層體之最佳曝光量對兩種樣品進行曝光。靜置15分鐘後，自感光性樹脂積層體剝離支持膜，使用富士機工(股)製造之顯影裝置，藉由全錐型噴嘴於顯影噴壓0.07 mPa下將35℃之1質量%Na2 CO3 水溶液噴霧60秒鐘而進行顯影，並將感光性樹脂層之未曝光部分溶解去除。此時，水洗步驟藉由扁平型噴嘴於水洗噴壓0.07 mPa下進行與顯影步驟相同之時間，藉由鼓風將水洗之樣品加以乾燥。＜評價方法＞讀取藉由上述樣品製作方法而獲得之各樣品之Stouffer 21段階段式曝光表之殘膜段數，按照以下之方式對於室溫下保管3天之樣品與於50℃及60%RH下保管之樣品之殘膜段數之差進行分級，將其結果示於表5。若為A等級，則即便長期於常溫下保管樣品，於實用性方面性能亦無變化而無問題。於為B等級之情形時，若未以冷藏保管方式進行長期保管，則感度發生變化，於實用性方面產生問題。於將感光性樹脂積層體於產業上利用時，若可進行冷藏保管，即便B等級亦能夠穩定使用，但就管理成本及工時之觀點而言，更佳為A等級。A：殘膜段數之差為3段以下B：殘膜段數之差大於3段8.圓孔圖案麓部長度＜評價方法＞使用未曝光部分成為圓孔之直徑為100 μm之圓孔遮罩作為PET遮罩，根據「4.感度及解像性評價」之項目所記載之樣品製作方法而獲得圓孔圖案。藉由掃描電子顯微鏡(Hitachi High-Technologies Corporation(股)製造之S-3400N)將該圓孔圖案放大5000倍，觀察圓孔圖案之底部所產生之麓部。按照以下之方式對觀察結果進行分級。將等級示於表5。測定自圓孔側壁面至麓部端部之沿基板表面之距離作為麓部之長度。作為保護膜較佳為等級A或B。A：圓孔之麓部長度為2.0 μm以下B：圓孔之麓部長度大於2.0 μm且為3.0 μm以下C：圓孔之麓部長度大於3.0 μm9.密接性評價＜樣品製作方法＞將基板變為依序積層有樹脂、ITO及濺鍍銅之基板，且一面將實施例33～38及比較例5及6中所獲得之感光性樹脂積層體之保護膜剝離，一面將其層壓於銅表面，除此以外，利用與「6.防銹性評價」之＜樣品製作方法＞相同之方法製作樣品。＜評價法＞使用所製作之樣品，關於未特別提及之評價過程，利用依據JIS K-5600-5-6之方法，按照以下之方式進行交叉切割試驗。使用導件以1 mm為間隔利用切割器於樣品上平行切出10條切口，進而以可形成晶格圖案之方式相對於該等呈直角地切出10條切口。於晶格狀之切口部分壓接寬度15 mm之黏著帶(Nichiban(股)製造之Sellotape(註冊商標)，製品名)後，於0.5秒～1秒內以相對於壓接面為60°之角度剝離黏著帶。利用光學顯微鏡觀察剝離了黏著帶之樣品表面，按照以下之方式進行分級。將其結果示於表6。作為保護膜較佳為等級A或B。A：自基材之銅表面剝離保護膜之面積未達10%。B：自基材之銅表面剝離保護膜之面積為10%以上且未達20%。C：自基材之銅表面剝離保護膜之面積為20%以上。10.評價結果實施例1～38及比較例1～6之評價結果如表2～6所示，關於實施例1～38，可知藉由使用本實施形態之起始劑及防銹劑，作為保護膜所需之防銹性、彎曲性、感度及解像性優異。另一方面，關於不含本實施之形態之起始劑或防銹劑之比較例1～3，成為防銹性、彎曲性、感度及解像性中之任一性能均較差之結果，於比較例4中，成為圓孔圖案之麓部長度較差之結果，於比較例5、6中，成為密接性較差之結果。更詳細而言，若比較例1與實施例17比較，則可明確由於感光性樹脂組合物不含於乙醇溶液中波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟起始劑，故而於防銹性、彎曲性、感度及解像性之所有性能方面比較例1較差。又，若比較比較例2與實施例13，則可知因同樣之原因就防銹性、彎曲性及感度之方面而言比較例2較差。進而，若比較比較例3與實施例21，則可明確由於比較例3中感光性樹脂組合物不含防銹劑，故而就防銹性之方面而言較差。根據實施例2與實施例3之對比可知藉由感光性樹脂組合物含有胺化合物而防銹性提高。其次，根據實施例6與實施例7之對比可知藉由感光性樹脂組合物中添加矽烷偶合劑而防銹性提高。又，藉由比較實施例17與實施例18可知藉由使用側鏈具有芳香族基之鹼溶性樹脂而防銹性及彎曲性提高。另一方面，根據實施例1與實施例4之對比可知藉由使感光性樹脂組合物中含有於同一雜環中具有3個以下N及/或S之(D)成分而防銹性提高。進而，若比較實施例22、實施例23及實施例24，則可知於同一雜環中具有3個以下N及/或S之(D)成分之中，苯并三唑及其衍生物就防銹性之觀點而言良好。又，若比較實施例17與實施例19，則可知含有作為較佳之防銹劑而於上述列舉之苯并三唑及其衍生物及咪唑及其衍生物之中尤佳之例之一的5-羧基苯并三唑之感光性樹脂組合物就防銹性之觀點而言更優異。再者，根據實施例20與實施例21之對比可確認藉由將感光性樹脂層之365 nm之吸光度調整為相對於膜厚每1 μm為0.01～0.05而獲得更優異之防銹性。進而，若比較實施例29與實施例30，則可知藉由使感光性樹脂組合物中含有式(4)所表示之(C)成分，則防銹性與耐彎曲性之性能平衡提高，進而保存穩定性提高。又，若比較比較例4與實施例32，則可確認藉由將(D)成分添加於感光性樹脂組合物而圓孔圖案之麓部變小。又，對於實施例32，若比較實施例30及31，則可確認藉由使用作為就顯影性之觀點而言較佳之(D)成分而於上述列舉之苯并三唑或其衍生物，而顯影性提高，圓孔圖案之麓部變得更小。進而，若比較比較例5及6與實施例33～38，則可知藉由將(D)成分添加於感光性樹脂組合物而密接性提高。又，根據實施例36與實施例33～35之對比、或實施例38與37之對比可確認藉由將作為(D)成分之四唑及其衍生物、三唑及其衍生物、吲唑及其衍生物及噻二唑及其衍生物添加於感光性樹脂組合物而密接性進一步提高。   [表1] 表1 [表2] [表3] [表4] [表5] [表6] [表7] Hereinafter, the form for carrying out the invention (hereinafter simply referred to as "embodiment") will be described in detail. The present invention is not limited to the following embodiments, and various modifications can be made without departing from the spirit and scope of the invention. [Photosensitive Resin Composition and Photosensitive Resin Laminate] In the embodiment of the present invention, the photosensitive resin laminate includes a support film and a photosensitive resin layer formed of a photosensitive resin composition containing the following components: (A) An alkali-soluble resin; (B) a compound having an ethylenically unsaturated double bond; (C) a photopolymerization initiator; and (D) a rust inhibitor. The photosensitive resin composition may contain (E) a decane coupling agent, (F) an amine compound, and other components as needed. Hereinafter, each component constituting the photosensitive resin composition will be specifically described. <(A) Alkali-Soluble Resin> The alkali-soluble resin of the present embodiment is a polymer body containing a carboxyl group, and is preferably obtained by polymerizing at least one of the first monomers having a carboxyl group in the molecule as described below. The alkali-soluble resin is more preferably obtained by copolymerizing at least one of the first monomers and at least one of the following second monomers. Examples of the first monomer include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, maleic anhydride, and maleic acid ester. Here, methacrylic acid means acrylic acid and/or methacrylic acid, and the following is the same as (meth)acrylate. The second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule. Examples of the second monomer include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, and n-butyl (meth)acrylate. Ester, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclomethacrylate Ester of vinyl alcohol such as ester, 2-ethylhexyl (meth)acrylate, (meth)acrylonitrile or vinyl acetate; aromatic (meth)acrylic acid ester such as benzyl (meth)acrylate; styrene And its polymerizable derivatives and the like. Among these copolymers, from the viewpoint of the rust preventive property of the wiring or the electrode formed on the substrate, it is preferred to contain a structural unit derived from (meth)acrylic acid and derived from a (meth)acrylic aromatic group. a copolymer of structural units of an ester or styrene. Further, from the viewpoint of flexibility, a copolymer containing a structural unit derived from (meth)acrylic acid and a structural unit derived from an aromatic (meth)acrylic acid ester is more preferable. When the unit having an aromatic group is copolymerized with another unit, the hydrophobicity of the alkali-soluble resin and the film density after curing of the photosensitive resin laminate are increased, and the rust prevention property is improved. On the other hand, if the hydrophobicity is too high Then, the developability deteriorates. Therefore, the content of the unit having an aromatic group in the alkali-soluble resin is preferably 20% by mass to 90% by mass, and more preferably 50% by mass to 85% by mass based on the mass of the alkali-soluble resin. Further, the aromatic group may be, for example, a phenyl group or the like which may have a substituent. The acid equivalent (g/mol) of the alkali-soluble resin is preferably from 430 to 860. The acid equivalent is preferably 430 or more from the viewpoint of improvement in rust preventive property, and is preferably 860 or less from the viewpoint of improving developability. The acid equivalent is more preferably 430 to 570, and still more preferably 430 to 510 from the viewpoint of the balance between rust resistance and developability. The acid equivalent was measured by a potentiometric titration method using a flat-automatic titrator (COM-555) manufactured by Hiranuma Industries Co., Ltd., using 0.1 mol/L of sodium hydroxide. In the case where a plurality of (A) alkali-soluble resins are contained in the composition, the acid equivalent thereof means the acid equivalent of the entire alkali-soluble resin. The weight average molecular weight of the alkali-soluble resin is not limited, and is usually preferably 5,000 or more and 500,000 or less from the viewpoints of coatability, film strength, and developability. The weight average molecular weight of the alkali-soluble resin is preferably 5,000 or more from the viewpoint of the properties of the developed agglomerate and the properties of the unexposed film such as edge melting property and chipability of the photosensitive resin laminate, and the developability is improved. From the viewpoint, it is preferably 500,000 or less. Here, the edge meltability refers to a phenomenon in which the photosensitive resin composition layer protrudes from the end surface of the roll when the photosensitive resin laminated body is wound into a roll shape. Chipiness refers to the phenomenon of debris scattering when the unexposed film is cut by a cutter. When the scattered debris adheres to the upper surface of the photosensitive resin laminate or the like, it is transferred to the mask in the subsequent exposure stroke or the like, which is a cause of failure. The weight average molecular weight of the alkali-soluble resin is more preferably 5,000 or more and 300,000 or less, and still more preferably 10,000 or more and 200,000 or less. The measurement of the weight average molecular weight was carried out by gel permeation chromatography (GPC) manufactured by JAP (Japan) set to the following conditions. The weight average molecular weight obtained is a value in terms of polystyrene. Pump: Gulliver, PU-1580 pipe column: Shodex (registered trademark) (KF-807, KF-806M, KF-806M, KF-802.5) manufactured by Showa Denko Electric Co., Ltd. 4 series moving bed solvent: tetrahydrofuran calibration curve : Calibration curve prescribed using a polystyrene standard sample {calibration curve using a polystyrene-based standard sample (Shodex STANDARD SM-105 manufactured by Showa Denko Co., Ltd.)} content of alkali-soluble resin in the photosensitive resin composition The mass of the photosensitive resin composition is 30% by mass to 70% by mass based on the basis of the rust preventive property and the bendability, and is preferably 40% by mass to 65% by mass, and more preferably 50% by mass to 65% by mass. quality%. <(B) Compound having an ethylenically unsaturated double bond> The compound having an ethylenically unsaturated double bond in the present embodiment is a compound having polymerizability due to an ethylenically unsaturated group in its structure. Examples of the compound having an ethylenically unsaturated double bond include a compound obtained by adding (meth)acrylic acid to one end of a polyalkylene oxide, addition of (meth)acrylic acid to one terminal, and the other end. A compound obtained by alkyl ether or allyl etherification. Further, examples of the compound having an ethylenically unsaturated double bond include a compound having a (meth)acryl fluorenyl group at both terminals of the polyalkylene oxide chain, or a polyethylene oxide chain and polypropylene oxide. a compound having a (meth) acrylonitrile group at both ends of an alkylene oxide chain bonded in a random or block manner, an alkylene oxide modification to bisphenol A, and (meth) propylene at both ends a compound of sulfhydryl and the like. In addition, examples of the compound having an ethylenically unsaturated double bond include a urethane compound which is a reaction product of a diisocyanate compound and a compound having a hydroxyl group and a (meth)acrylic group in one molecule. Further, as the compound having an ethylenically unsaturated double bond, a compound having more than two (meth)acryl fluorenyl groups in one molecule can also be used. Such a compound has a radical of 3 mol or more of an alkylene group added as a central skeleton in the molecule, and an oxiranyl group, an oxypropylene group or a butylene oxide group is added to the group. It is obtained by converting an alcohol obtained by alkylene oxide into (meth) acrylate. Further, the central skeleton may be directly reacted with (meth)acrylic acid without modifying the central skeleton by using an alkylene oxide group. Examples of the compound which can be a central skeleton include glycerin, trimethylolpropane, pentaerythritol, diglycerin, ditrimethylolpropane, dipentaerythritol, and isocyanurate ring. From the viewpoint of rust prevention, the compound having an ethylenically unsaturated double bond preferably contains a compound having three or more (meth) acryloyl fluorenyl groups in one molecule, and more preferably contains dipentaerythritol hexa(methyl). Acrylate, trimethylolpropane tri(meth)acrylate, or di-trimethylolpropane tri(meth)acrylate. The content of the compound having an ethylenically unsaturated double bond in the photosensitive resin composition is preferably 20 based on the mass of the photosensitive resin composition from the viewpoint of resolution, adhesion, and rust resistance. The mass% to 60% by mass, more preferably 35% by mass to 50% by mass. <(C) Photopolymerization initiator> The photopolymerization initiator of the present embodiment is characterized by being a ruthenium compound, and the absorption coefficient at a wavelength of 365 nm in an ethanol solution is 17 mL/(mg·cm) to 60 mL. / (mg·cm). The absorption coefficient at a wavelength of 365 nm of the ruthenium compound in an ethanol solution is preferably 17 mL/(mg·cm) or more, and particularly preferably 26 mL/(mg) from the viewpoint of surface hardenability and sensitivity of the protective film.・cm) or more. Further, from the viewpoint of the curability of the bottom of the protective film, it is preferably 60 mL/(mg·cm) or less. For the same reason, the above absorption coefficient is preferably from 35 mL/(mg·cm) to 55 mL/(mg·cm). By using a ruthenium initiator having a high absorption coefficient at a wavelength of 365 nm, a protective film having high sensitivity under i-ray exposure can be obtained. Further, in the development step using the sodium carbonate aqueous solution, when sodium ions permeate the surface of the cured protective film to form a sodium salt with the carboxylic acid of the alkali-soluble resin, the water easily permeates into the protective film, and the rust prevention property is deteriorated. Here, it is presumed that when a ruthenium starter having a high light absorption coefficient is used, the absorption of the surface of the protective film at the time of exposure becomes large, so that high surface hardenability is obtained, and penetration of sodium ions during development can be suppressed, and as a result, Higher rust resistance. In this case, the surface hardening is further promoted, so that the bottom of the protective film is not excessively hardened, and good bending property is obtained. On the other hand, when the light absorption coefficient is too high, the reaction proceeds only on the surface of the protective film, the bottom of the protective film is insufficiently cured, and the adhesion to the substrate or the bendability is deteriorated. As a well-balanced range, the absorption coefficient of the ruthenium compound at a wavelength of 365 nm in an ethanol solution is 17 mL/(mg·cm) to 60 mL/(mg·cm). Examples of the ruthenium compound include carbazole and a derivative thereof, and an oxime compound having a ruthenium structure, and the like is preferable in the present embodiment. Specific examples of the oxime initiator having an absorption coefficient at a wavelength of 365 nm in ethanol of 17 mL/(mg·cm) to 60 mL/(mg·cm) include those described in the specification of Japanese Patent No. 5682094. Compound 2, D-1, D-3, D-4, D-9, D-12, D-14, D-15, D-20, C-2, etc., as a commercial product, 7-Nitro-9,9-dipropyl-9H-indol-2-yl)(o-tolyl)methanone O-acetamidine (DFI-020, manufactured by Daito Chemix Co., Ltd.), 1,2- Propanedione, 3-cyclohexyl-1-[9-ethyl-6-(2-furancarbonyl)-9H-indazol-3-yl]-, 2-(O-acetamidine) (Nisshin Chemtec) Manufactured TR-PBG-326, product name), 1,8-octanedione, 1,8-bis[9-(2-ethylhexyl)-6-nitro-9H-carbazol-3-yl ]-,1,8-bis(O-acetamidine) (ADEKA ARKLS NCI-831, manufactured by ADEKA Co., Ltd., product name), 3-cyclohexyl-1-(6-(2-(benzamide) Oxyimido)octyl)-9-ethyl-9H-indazol-3-yl)-propane-1,2-dione-2-(O-benzamide) (manufactured by Nikko Chemtec Co., Ltd.) TR-PBG-371, product name), etc., are readily available. From the viewpoints of rust prevention, flexibility, and resolution, TR-PBG-326, NCI-831, and TR-PBG-371 are more preferable in terms of rust resistance, flexibility, resolution, and storage stability. In terms of point of view, TR-PBG-371 is especially preferred. In addition, as a photopolymerization initiator, the compound represented by the following formula (1) and/or the compound represented by the following formula (2) have high surface hardenability, and have sensitivity, rust resistance, and bending. Excellent from the point of view of sex. [Chemistry 7] {式,X 1 Represents a valence group containing a heterocyclic ring which may have a substituent, Y 1 And a substituent selected from the group consisting of an alkyl group having 1 to 8 carbon atoms which may form a branched or cyclic structure, and a phenyl group which may have a substituent, and Z 1 An organic base representing a price} {式,X 2 And X 3 Represents the same or different pull electron base, Y 2 And Y 3 Same or different, Y 2 And Y 3 And a substituent selected from the group consisting of an alkyl group having 1 to 10 carbon atoms which may form a branched or cyclic structure, and a phenyl group which may have a substituent, and Z 2 And a monovalent organic group selected from the group consisting of an alkylene group having 1 to 16 carbon atoms and a stretching phenyl group having a substituent. The monovalent organic group is a hydrocarbon group (which may be saturated or unsaturated). It may be a linear type or a branched type, and a cyclic structure may be included in the structure, and may also contain a hetero atom or a halogen atom. The compound represented by the formula (1) is more preferably X in the formula (1) from the viewpoints of sensitivity, rust resistance and flexibility. 1 It is a compound which is a valence group represented by the following general formula (3). [Chemistry 9] In the formula, A represents an oxygen (O) atom or an S atom} as a compound represented by the formula (1), and, for example, 1,2-propanedione, 3-cyclohexyl-1-[9-ethyl-6 -(2-furancarbonyl)-9H-indazol-3-yl]-, 2-(O-acetamidine) (TR-PBG-326, manufactured by Nikko Chemtec Co., Ltd., product name). Regarding the compound represented by formula (2), as with X 2 Or X 3 Examples of the electron withdrawing group include a halogen group, a nitro group, a carbonyl group, a cyano group and the like, and a nitro group is preferred. Specific examples of the compound represented by the formula (2) include 1,7-heptanedione, 1,7-bis[9-ethyl-6nitro-9H-carbazol-3-yl]-, 1 ,7-bis(O-acetamidine), 1,7-heptanedione, 1,7-bis[9-(2-ethylhexyl)-6-nitro-9H-indazol-3-yl]- 1,7-bis(O-acetamidine), and 1,8-octanedione, 1,8-bis[9-(2-ethylhexyl)-6-nitro-9H-indazole-3- Base]-, 1,8-bis(O-acetamidine) (ADEKA ARKLS NCI-831, manufactured by ADEKA Co., Ltd., product name). Further, as the photopolymerization initiator, the compound represented by the following formula (4) is particularly preferable from the viewpoints of sensitivity, rust resistance, flexibility, resolution, and storage stability. [化10] {式,X 4 And X 5 Each of the organic groups of one valence is independently represented, and at least one of the following includes the following formula (5): [Chemical 11] The structure represented, and Y 4 The storage stability of H or a monovalent resin is a property in which the photosensitive resin laminate is stabilized by long-term storage and the properties represented by sensitivity are not changed. When the storage stability is deteriorated in the case where the photosensitive resin laminate is used industrially, the lifespan is shortened, and the management man-hour or the management cost is increased. Therefore, the storage stability is higher as the performance of the photosensitive resin laminate. important. Further, as the photopolymerization initiator, the compound represented by the following formula (6) is particularly preferable from the viewpoints of sensitivity, rust resistance, flexibility, resolution, and storage stability. [化12] {式, Y 5 H, -CH 3 An aliphatic hydrocarbon group having 2 or more carbon atoms or an alicyclic hydrocarbon group having 3 or more carbon atoms which may be substituted by a hetero atom or/and a halogen atom, and n is represented by an integer of 0 or 1, Y 5 H or -CH 3 When n=0, Y 5 When it is an aliphatic hydrocarbon group having 2 or more carbon atoms or an alicyclic hydrocarbon group having 3 or more carbon atoms which may have a hetero atom or/and a halogen atom, n=1, and Y 6 The hydrazine compound which represents H or a monovalent organic group as a photopolymerization initiator is hydrolyzed in the presence of an acid, and the function of the initiator is easily deactivated. Therefore, in the photosensitive resin composition or the photosensitive resin laminate including the alkali-soluble resin having a carboxyl group, there is a problem that the sensitivity of the initiator is deactivated due to long-term storage, and various properties are deteriorated. It is considered that since the photopolymerization initiator represented by the formulas (4) and (6) has a benzamidine group, when it is hydrolyzed in the presence of an acidic compound, a phenyl radical is generated due to benzene radical and A The radical radicals and the like are less mobile and therefore difficult to deactivate. Further, since the photopolymerization initiator represented by the formulas (4) and (6) has a high light absorption coefficient, it exhibits high reactivity, and is excellent in practicality in obtaining a sensitivity and a good balance with a good level of balance. Rust, bendability, resolution, and storage stability. Further, if the electron-strength group is bonded to the carbazole skeleton, the charge of the -C=N- group of the sulfhydryl group associated with the conjugate of the carbazole skeleton is biased toward the C side, so that the NO bond of the sulfhydryl group is easily estimated. When the fracture is broken, the storage stability is considered to be deteriorated. Therefore, the group bonded to the carbazole skeleton is preferably a group having a weak electron pull. Therefore, in terms of preservation stability, the base Y of the formula (4) 4 It is preferably a base with weaker electron pull, more preferably -Y of formula (6) 5 -(Y 6 ) n The base shown. Examples of the group having weak electron pullability include an alkyl group, a hydroxyl group, and an amine group. Specific examples of the compound represented by the formula (4) or (6) include 3-cyclohexyl-1-(6-(2-(benzylideneoxyimino)octyl)-9-ethyl- 9H-carbazol-3-yl)-propane-1,2-dione-2-(O-benzamide) (TR-PBG-371, manufactured by Nikko Chemtec Co., Ltd., product name) and the like. The content of the bismuth compound in the photosensitive resin composition having an absorption coefficient at a wavelength of 365 nm in an ethanol solution of 17 mL/(mg·cm) to 60 mL/(mg·cm), based on the mass of the photosensitive resin composition The basis of the balance between rust resistance, flexibility, resolution and sensitivity is preferably from 0.05% by mass to 5% by mass, more preferably from 0.1% by mass to 3% by mass, even more preferably from 0.1% by mass. Mass% to 1% by mass. In the present embodiment, the photosensitive resin composition is in addition to the ytterbium compound having an absorption coefficient of 365 nm at a wavelength of 365 nm in an ethanol solution of 17 mL/(mg·cm) to 60 mL/(mg·cm). It may be contained in an ethanol solution at a wavelength of 365 nm with an absorption coefficient of less than 17 mL/(mg·cm) or more than 60 mL/(mg·cm) of a ruthenium compound or a photopolymerization initiator other than a ruthenium compound. The total content of all the photopolymerization initiators in the photosensitive resin composition is preferably from 0.1% by mass to 10% by mass based on the mass of the photosensitive resin composition, and is more preferably from the viewpoint of sensitivity and resolution. It is 0.3% by mass to 5% by mass. When the content of the photopolymerization initiator is in the range of 0.1% by mass to 10% by mass, the light sensitivity is sufficient, and the absorption of the surface of the composition is increased when the active light is irradiated, so that insufficient internal light hardening can be suppressed. Bad situation. <(D) Rust Preventive Agent> The rust preventive agent of the present embodiment refers to a compound having a rust preventive effect, and is, for example, a material which forms a coating on a metal surface to prevent corrosion or rust of metal. The rust inhibitor is preferably a heterocyclic compound containing N, S, O or the like from the viewpoint of compatibility and sensitivity to the photosensitive resin composition of the present embodiment, and examples thereof include tetrazole and derivatives thereof. , triazole and its derivatives, imidazole and its derivatives, carbazole and its derivatives, pyrazole and its derivatives, imidazoline and its derivatives, carbazole and its derivatives, isoxazole and its derivatives , oxadiazole and its derivatives, thiazole and its derivatives, isothiazole and its derivatives, thiadiazole and its derivatives, thiophene and its derivatives. The derivative described herein contains a compound in which a substituent is introduced into the structure of the parent. For example, in the case of a tetrazole derivative, a compound in which a substituent is introduced into a tetrazole is included. The substituent is not particularly limited, and examples thereof include one or more hydrocarbon groups (which may be saturated or unsaturated, may be linear or branched, and may include a cyclic structure in the structure), or a hydroxyl group. a substituent of a functional group of a carbonyl group, a carboxyl group, an amine group, a decylamino group, a nitro group, a cyano group, a thiol group, and a hetero atom having a halogen (fluorine, chlorine, bromine, iodine or the like) group. Further, from the viewpoint of rust prevention, the heterocyclic compound preferably has a hetero ring including C and N and/or S, and the number of N atoms is 3 or less or the number of S atoms is 3 in the same hetero ring. The following or a combination of N atom and S atom is 3 or less, more preferably triazole and its derivatives, imidazole and its derivatives, imidazoline and its derivatives, thiazole and its derivatives, isothiazole and its derivatives The thiadiazole and its derivatives, thiophene and its derivatives, etc., are preferably benzotriazole and its derivatives, and imidazole and its derivatives from the viewpoint of rust resistance and developability. By using the component (D) having good developability, the crotch portion of the formed pattern becomes small, and when the protective film of the present invention is applied to the terminal portion, it is more preferable in terms of ensuring conduction. A specific example of a compound having a heterocyclic ring including C and N and/or S, and having a number of N atoms of 3 or less or a number of S atoms of 3 or less or a total of N atoms and S atoms of 3 or less in the same hetero ring. In the following: triazoles, such as 1,2,3-triazole, 1,2,4-triazole, etc.; triazole derivatives, such as 3-mercaptotriazole, 3-amino-5-mercaptotriazole, benzene Triazole, 1H-benzotriazole-1-acetonitrile, 1-[N,N-bis(2-ethylhexyl)aminemethyl]benzotriazole, 1-(2-di-n-butylaminomethyl) )-5-carboxybenzotriazole, 1-(2-di-n-butylaminomethyl)-6-carboxybenzotriazole, 1H-benzotriazole-1-methanol, 5-methyl-1H-benzene And triazole, 5-carboxybenzotriazole, 1-hydroxybenzotriazole, 5-chlorobenzotriazole, 5-nitrobenzotriazole, etc.; imidazole; imidazole derivatives, such as undecylimidazole Benzimidazole, 5-carboxybenzimidazole, 6-bromobenzimidazole, 5-chlorobenzimidazole, 2-hydroxybenzimidazole, 2-(1-hydroxymethyl)benzimidazole, 2-methyl Benzimidazole, 5-nitrobenzimidazole, 2-phenylbenzimidazole, 2-aminobenzimidazole, 5-aminobenzimidazole, 5-amino-2-mercaptobenzimidazole, etc.; imidazole Porphyrin; imidazoline derived For example, 2-undecyl imidazoline, 2-propyl-2-imidazoline, 2-phenylimidazoline, etc.; thiazole; thiazole derivative, such as 2-amino-4-methylthiazole, 5- (2-hydroxyethyl)-4-methylthiazole, benzothiazole, 2-mercaptobenzothiazole, 2-aminobenzothiazole, 2-amino-6-methylbenzothiazole, (2-benzene And thiazolylthio)acetic acid, 3-(2-benzothiazolylthio)propionic acid, etc.; isothiazole; isothiazole derivatives, such as 3-chloro-1,2-benzisothiazole; thiadiazole, for example 1,2,3-thiadiazole, 1,2,5-thiadiazole, 1,3,4-thiadiazole, etc.; thiadiazole derivatives, such as 4-amino-2,1,3-benzene Thiadiazole, 2-amino-5-mercapto-1,3,4-thiadiazole, 2-amino-5-methyl-1,3,4-thiadiazole, 2-amino-1 , 3,4-thiadiazole, 5-amino-1,2,3-thiadiazole, 2-mercapto-5-methyl-1,3,4-thiadiazole, etc.; thiophene; thiophene derivative, For example, 2-thiophenecarboxylic acid, methyl 3-amino-2-thiophenecarboxylate, 3-methylbenzothiophene, and the like. Among the above rust inhibitors, benzotriazole, 5-carboxybenzotriazole, 1-hydroxybenzotriazole, and 5-chlorobenzoic are particularly preferable from the viewpoint of rust prevention and developability. Triazole. On the other hand, as the component (D), tetrazole and its derivatives, triazole and its derivatives, carbazole and its derivatives, and thiadiazole are preferred from the viewpoint of rust resistance and adhesion. Its derivatives. Specific examples of the tetrazole include 1H-tetrazole. Specific examples of the tetrazole derivative include 5-amino-1H-tetrazole, 5-methyl-1H-tetrazole, 1-methyl-5-ethyl-1H-tetrazole, and 1-methyl group. -5-mercapto-1H-tetrazole, 1-phenyl-5-mercapto-1H-tetrazole, 1-(dimethylaminoethyl)-5-mercapto-1H-tetrazole and 5-phenyl-1H - tetrazole and the like. Specific examples of the carbazole include 1H-carbazole. Examples of the carbazole derivative include 5-aminocarbazole, 6-aminocarbazole, 1-benzyl-3-hydroxy-1H-carbazole, 5-bromocarbazole, 6-bromocarbazole, and 6- Hydroxycarbazole, 3-carboxycarbazole and 5-nitrocarbazole. Specific examples of the triazole and its derivatives and the thiadiazole and its derivatives have been described above. Among these, in view of rust resistance and adhesion, 5-amino-1H-tetrazole, 5-carboxybenzotriazole, 5-aminocarbazole, and 5-amino group are particularly preferred. 1,2,3-thiadiazole. When a photopolymerization initiator having a higher reactivity as in the present invention is used, the curing shrinkage of the photosensitive resin composition is caused by exposure or heat treatment, and the cured film generates stress with the substrate, whereby the cured film and the cured film are formed. The problem of poor adhesion of the substrate. However, by using the component (C) of the present embodiment in combination with the component (D) which is preferable from the viewpoint of the rust preventive property and the adhesion property, the sensitivity can be satisfactorily expressed in terms of practicality with a good level balance. Rust resistance, flexibility, resolution, storage stability and adhesion. In the present embodiment, one type of the rust inhibitor described above may be used alone or two or more types may be used in combination. The content of the rust preventive agent in the photosensitive resin composition is preferably 0.05% by mass to 10% by mass based on the mass of the photosensitive resin composition, from the viewpoint of rust preventing property and developability. It is 0.1% by mass to 5% by mass, and more preferably 0.2% by mass to 3% by mass. <(E) decane coupling agent> In the present embodiment, the photosensitive resin composition preferably contains a decane coupling agent from the viewpoint of adhesion to a substrate, rust resistance, and developability. Examples of the decane coupling agent include 3-glycidoxypropylmethyl dimethyl (or ethoxy) decane (KBM-402, KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd., product name), and 3-shrinkage. Glyceroxypropyltrimethyl (or ethoxy) decane (KBM-403, KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-methylpropenyloxypropylmethyl dimethyl (or B) Oxydecane (KBM-502, KBE-502, manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-methacryloxypropyltrimethyl (or ethyl)oxydecane (manufactured by Shin-Etsu Chemical Co., Ltd.) KBM-503, KBE-503, product name), 3-aminopropyltrimethyl (or ethoxy) decane (KBM-903, KBE-903, manufactured by Shin-Etsu Chemical Co., Ltd., product name), isocyanuric acid -(Trimethoxydecylpropyl)ester (KBM-9659, manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-mercaptopropylmethyldimethoxydecane (KBM-802, manufactured by Shin-Etsu Chemical Co., Ltd.) , product name), 3-mercaptopropyltrimethoxydecane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd., product name), 2-[3-(triethoxydecyl)propyl]succinic anhydride, 3 -Trimethoxydecylpropyl succinic anhydride (X-12-967, manufactured by Shin-Etsu Chemical Co., Ltd.) C, product name) and so on. The content of the decane coupling agent in the photosensitive resin composition is preferably 0.1% by mass based on the mass of the photosensitive resin composition from the viewpoint of adhesion to the substrate, rust resistance, and developability. ～5% by mass, more preferably 0.5% by mass to 3% by mass. <(F) Amine Compound> In the present embodiment, in order to further improve the effect of the (D) rust inhibitor, the photosensitive resin composition preferably contains an amine compound. Examples of the amine compound include ammonia, ethylenediamine, triethylamine, monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, and diethylene glycol. Triamine, diethylamine, dibutylamine, hexahydroaniline, tetraethylamamine, pentaethylhexamine, allylamine, 2-aminopropanol, 3-aminopropanol, 4 - aminobutanol, 4-methylaminobutanol, ethylaminoethylamine, 2-ethylhexylamine, di-2-ethylhexylamine, tris(2-ethylhexyl)amine, oleylamine , dodecylamine, dicyclohexylamine, octylamine, octadecylamine, hexylamine, and the like. These amine compounds may be used alone or in combination of two or more. Among these amine compounds, dibutylamine is particularly preferred. The content of the amine compound in the photosensitive resin composition is preferably 0.05% by mass to 3% by mass, and more preferably 0.1% by mass based on the mass of the photosensitive resin composition from the viewpoint of rust preventing property. ～2% by mass. <Other components> In the present embodiment, in addition to the components (A) to (F), the photosensitive resin composition may contain a polymerization inhibitor such as an aluminum salt to which 3 mol nitrophenylphenylhydroxylamine is added, A leveling agent, a plasticizer, a filler, an antifoaming agent, a flame retardant, etc., which may be used alone or in combination of two or more. <Photosensitive Resin Layer> The photosensitive resin layer of the present embodiment preferably has a thickness of 15 μm or less, and the absorbance of the photosensitive resin layer at a wavelength of 365 nm is 0.01 to 0.05 per 1 μm with respect to the thickness of the photosensitive resin layer. When the film thickness of the photosensitive resin layer is too large, the flexibility is deteriorated. Therefore, the thickness of the photosensitive resin layer is preferably 15 μm or less, and it is preferably 3 from the viewpoint of observing the unevenness of the wiring and ensuring rust prevention. More than μm. When the absorbance of the photosensitive resin layer is high, the surface is hardened, and the rust preventive property is improved as described above, and the bottom portion is not excessively hardened, and the bendability is maintained. Therefore, the absorbance of the photosensitive resin layer is preferably 0.01 or more. When the absorbance of the photosensitive layer is too high, the under-hardening is insufficient, and the adhesion to the substrate is deteriorated, so it is preferably 0.05 or less. <Details of Photosensitive Resin Laminate> The photosensitive resin laminate includes a photosensitive resin layer and a support film containing a photosensitive resin composition. Specifically, a layer containing the above-mentioned photosensitive resin composition is laminated on the support film. The photosensitive resin laminate may have a protective layer on the surface opposite to the support film side of the photosensitive resin layer as needed. As the support film used in the present embodiment, it is preferable that the light that is transmitted through the exposure light source is transparent. Examples of such a support film include a polyethylene terephthalate film, a polyvinyl alcohol film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyvinylidene chloride film, a vinylidene chloride copolymer film, and a polycondensation film. A methyl methacrylate copolymer film, a polystyrene film, a polyacrylonitrile film, a styrene copolymer film, a polyamide film, a film containing cellulose and a derivative thereof, and the like. These films may also be used as extensions as needed. The haze of the support film is preferably 5 or less. The smaller the thickness of the support film, the more advantageous in terms of resolution and economy, but in order to maintain the strength, it is preferably 10 μm to 30 μm. An important characteristic of the protective layer for the photosensitive resin laminate is that the adhesion to the photosensitive resin layer is sufficiently smaller than that of the support film and can be easily peeled off. As the protective layer, for example, a polyethylene film, a polypropylene film, or the like can be preferably used. Further, as the protective layer, a film excellent in peeling properties as shown in JP-A-59-202457 can be used. The film thickness of the protective layer is preferably from 10 μm to 100 μm, more preferably from 10 μm to 50 μm. The method for producing a photosensitive resin laminate includes a step of applying a coating liquid onto a support (for example, a support film) and drying, and further including a step of laminating a protective layer on the photosensitive resin layer as needed. The coating liquid can be obtained by uniformly dissolving the above-described photosensitive resin composition in a solvent. Examples of the solvent for dissolving the photosensitive resin composition include ketones represented by methyl ethyl ketone (MEK); alcohols represented by methanol, ethanol or isopropyl alcohol. The solvent is preferably added to the photosensitive resin composition so that the viscosity of the solution of the photosensitive resin composition applied to the support is from 10 mPa·s to 800 mPa·s at 25 °C. Examples of the coating method include a knife coating method, a Meyer bar coating method, a roll coating method, a screen coating method, a spin coating method, an inkjet coating method, a spray coating method, and a dip coating method. Method, gravure coating method, curtain coating method, die coating method, and the like. The drying conditions of the coating liquid are not particularly limited, and the drying temperature is preferably from 50 ° C to 130 ° C, and the drying time is preferably from 30 seconds to 30 minutes. In the present embodiment, the photosensitive resin laminate is preferably a protective film for forming a conductor portion. In this case, the conductor portion is more preferably a copper electrode, an alloy electrode of copper and nickel, or a transparent electrode. In more detail, the photosensitive resin laminate can be used as a protective film for the lead wiring of the frame region of the touch panel (touch sensor or load cell), or for the protection of the copper electrode of the sensing region. membrane. [Resin Pattern and Cured Film Pattern and Manufacturing Method Thereof] The formation of the resin pattern using the photosensitive resin laminate can be carried out by a method of producing a resin pattern comprising the following steps: a lamination step, which is applied to the upper layer of the substrate The photosensitive resin laminate is pressed; the exposure step is performed by exposing the laminated photosensitive resin laminate; and the developing step is to develop the exposed photosensitive resin laminate. Further, in order to use the resin pattern as a protective film for the conductor portion, it is preferable that the method for producing the resin pattern includes a step of forming a cured film pattern by subjecting the resin pattern to post-exposure treatment and/or heat treatment after the development step. An example of a specific method will be exemplified below. As the substrate, a substrate formed by forming a copper wiring on a soft copper-clad laminate, a transparent electrode (for example, an ITO or Ag nanowire substrate), or a metal electrode can be formed on the glass substrate or the transparent resin substrate. (For example, Cu, Al, Ag, Ni, Mo, and at least two of these alloys, etc.), a touch panel substrate or a touch sensor substrate (for example, a force sensor, etc.). The soft copper-clad laminate, the touch panel electrode-forming substrate, or the touch sensor electrode-forming substrate is a substrate formed by forming a copper layer or a transparent electrode or a metal layer as a raw material of the metal electrode on the flexible film. . Examples of the film include a film of a film material such as polyimine, polyester (PET, PEN), or cycloolefin polymer (COP). The thickness of the above film is preferably from 10 μm to 100 μm. Further, as the copper, an alloy containing copper as a main component can be used in addition to pure copper. Here, "main component" means that at least 50% by mass of the alloy is copper. Examples of the alloy metal include an alloy of copper, such as nickel, palladium, silver, titanium, or molybdenum. The thickness of the copper layer is preferably from 50 nm to 2 μm. The thickness of the copper layer is more preferably 100 nm or more from the viewpoint of uniformity of the copper layer. A photosensitive resin layer is formed on the copper layer of the substrate by the step of laminating the photosensitive resin laminate to the substrate as described above. In the case where the photosensitive resin laminate has a protective layer, it is preferred to peel the protective layer and then heat-compress the pressure by a bonding machine to deposit a layer of the photosensitive resin on the surface of the substrate. In this case, the photosensitive resin laminate may be laminated on only one side of the surface of the substrate, or may be laminated on both sides. The heating temperature is generally from about 40 ° C to 160 ° C. The thermocompression bonding can be carried out by using a two-stage laminator having a double roll, or by repeatedly passing the photosensitive resin laminate and the substrate over the roll several times. In addition, when a vacuum laminator is used, the protective film has a good followability with respect to irregularities due to wiring or the like on the substrate, and it is possible to prevent the air from being mixed between the photosensitive resin laminate and the substrate. Next, the exposure step is performed using an exposure machine. The support film is peeled off from the photosensitive resin laminate as needed, and the photosensitive resin layer is exposed by active light through a photomask. The amount of exposure is determined by the illumination of the source and the exposure time. The amount of exposure can also be measured using a light meter. Examples of the exposure machine include a diffused light exposure machine using an ultrahigh pressure mercury lamp as a light source, a parallel light exposure machine for adjusting parallelism, and a proximity exposure machine for providing a gap between the mask and the workpiece. Further, as the exposure machine, a projection type exposure machine having a size ratio of a mask to an image of 1:1, a reduced projection projection machine called a stepping machine (registered trademark) having high illumination, or a specular projection is exemplified. Align the exposure machine (registered trademark) with a concave mirror. Also, a direct writing exposure method can be used in the exposure step. Direct engraving exposure means that the exposure is not directly applied to the substrate, and the exposure is directly written on the substrate. As the light source, for example, a solid laser having a wavelength of 350 nm to 410 nm, a semiconductor laser or an ultrahigh pressure mercury lamp is used. The engraved pattern is controlled by a computer. The amount of exposure in this case is determined by the illumination of the light source and the speed of movement of the substrate. Next, the developing step is carried out using a developing device. After the exposure, when the support film is present on the photosensitive resin layer, the support film is removed as necessary, and then the unexposed portion is developed and removed using a developing solution of an alkaline aqueous solution to obtain a resin pattern. As the alkaline aqueous solution, it is preferred to use Na 2 CO 3 Or K 2 CO 3 An aqueous solution (alkaline aqueous solution). The alkaline aqueous solution can be appropriately selected depending on the characteristics of the photosensitive resin layer, and generally, a concentration of about 0.2% by mass to 2% by mass and about 20 ° C to 40 ° C is selected. 2 CO 3 Aqueous solution. A surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed in the alkaline aqueous solution. An amine-based alkaline aqueous solution such as a tetramethylammonium hydroxide (TMAH) aqueous solution can also be used in consideration of the influence on the substrate. The concentration of the basic compound in the aqueous solution can be appropriately selected depending on the development speed. In terms of less odor, excellent workability, and ease of management and post-treatment, it is particularly preferable to be 1% by mass, Na of 30 ° C to 35 ° C 2 CO 3 Aqueous solution. Examples of the development method include known methods such as alkaline water spraying, spraying, swing immersion, brushing, and scraping. After development, an organic acid, an inorganic acid or an aqueous acid solution may be used, and the base of the alkaline aqueous solution remaining on the resin pattern may be acid-treated by a known method such as spraying, swing dipping, brushing, and scraping. And processing). Further, the water washing step may be performed after the acid treatment (neutralization treatment). The resin pattern can be obtained through the above steps, and further, a post-exposure step and/or a heating step can be performed. The rust prevention property is further improved by performing the post exposure step and/or the heating step. The exposure amount in the post-exposure treatment is preferably 200 mJ/cm. 2 ~1000 mJ/cm 2 It is preferable to carry out the treatment at 40 ° C to 200 ° C in the heating step, and the heat treatment time is preferably 60 minutes or less from the viewpoint of the production process. As a method of heat treatment, a heating furnace of an appropriate method such as hot air, infrared rays, or far infrared rays can be used, and as an atmosphere for heat treatment, N can be cited. 2 Atmosphere, or N 2 /O 2 In the atmosphere. According to the present embodiment, it is possible to provide a photosensitive resin composition and a photosensitive resin laminate which are excellent in a balance between rust resistance, flexibility, resolution, and sensitivity, and are suitable for protecting conductor portions such as wirings and electrodes. Such a photosensitive resin laminate can be preferably used, for example, as a protective film for wiring, electrodes, and the like of a touch panel, a touch sensor, or a force sensor. [The touch panel display device, the device having the touch sensor or the load cell sensor] can provide a photosensitive film by forming the cured film of the photosensitive resin laminate of the present embodiment on the substrate for the touch panel. A touch panel display device for a cured film of a resin laminate, and a device having a cured film of a photosensitive resin laminate and a touch sensor and/or a load cell. As a substrate for a touch panel, generally, a substrate for a touch panel, a touch sensor, or a load cell, such as a glass plate, a plastic plate, a plastic film, a ceramic plate, or the like, may be cited. An electrode or a metal wiring for a touch panel such as ITO, Cu, Al, Ag, Ni, Mo, and an alloy containing at least two of the above-mentioned materials to be formed on the substrate is provided on the substrate, and the substrate and the electrode are provided on the substrate and the electrode. An insulating layer can also be provided between them. The substrate for a touch panel having electrodes for a touch panel can be obtained, for example, in the following order. A metal film is formed on a substrate for a touch panel such as a polyester or a COP film by sputtering in the order of ITO or Cu, and then a photosensitive film for etching is attached to the metal film to form a desired resist pattern. An etching solution such as an aqueous solution of ferric chloride is used to remove unnecessary Cu, and the resist pattern is removed and removed. The method of forming a cured film as a protective film on a substrate for a touch panel preferably includes the following steps: a first step of laminating the photosensitive resin laminate of the present embodiment on a substrate for a touch panel a second step of hardening a specific portion of the protective film by irradiation with active light; and a third step of removing a portion other than a specific portion of the protective film (the portion of the protective film irradiated with the active light), Forming a cured film of the patterned protective film; and a fourth step of exposing and/or heat treating the patterned protective film. As described above, a touch panel display device having a cured film of a photosensitive resin laminate can be preferably provided by a base material for a touch panel having a cured film pattern of a photosensitive resin laminate, or is photosensitive. A device for curing a film of a resin laminate and a touch sensor and/or a load cell. [Examples] The present invention will be specifically described based on the following examples, but the present invention is not limited thereto. First, a method for measuring the absorption coefficient of the initiator will be exemplified. Next, the production methods of the films for evaluation of Examples 1 to 38 and Comparative Examples 1 to 6 will be described, and the evaluation methods of the obtained films and the evaluation results thereof will be exemplified. 1. Method for Measuring Absorbance of Starting Agent A 100 g of each of the starting agents described in Table 1 below was weighed and dissolved in 100 mL of ethanol by a precision balance. After the starter was completely dissolved, 10 mL of the solution was taken and diluted 10 times with ethanol using a 100 mL measuring flask. The dilution was again diluted 10 times to obtain a 1 mg/100 mL solution. A 1 mg/100 mL solution was placed in a quartz cell with a light path length of 1 cm on the measurement side, and a quartz cell containing ethanol was placed on the reference side, and a spectrophotometer manufactured by Hitachi High-Technologies Corporation. (U-3010) The measurement was performed, and the absorption coefficient was calculated from the measured value. The results are shown in Table 1. 2. Preparation of Film for Evaluation The films for evaluation in the examples and the comparative examples were produced in the following manner. <Preparation of Photosensitive Resin Laminate> The photosensitive resin composition and solvent in which the combination shown in the following Tables 2 to 6 (wherein the number of each component indicates the amount of the solid component (parts by mass)) and the solvent are sufficiently stirred And mixing to obtain a photosensitive resin composition preparation liquid. The photosensitive resin composition preparation liquid was uniformly coated on the surface of a 16 μm-thick polyethylene terephthalate film (R310-16B manufactured by Mitsubishi Resin Co., Ltd.) as a support film by using a knife coater. The film was dried in a dryer at 95 ° C for 3 minutes to form a uniform photosensitive resin layer on the support film. The film thickness of the support film and the sample on which the uniform photosensitive resin layer was formed on the support film was measured using a table thickness meter (RC-1W-200/1000) manufactured by Mingsheng Co., Ltd., from the support film. The film thickness of the sample having the uniform photosensitive resin layer was subtracted from the film thickness of the support film, and the thickness of the photosensitive resin layer was calculated. As a result, the thickness of the photosensitive resin layer was 10 μm. Then, a polyethylene film (GF-858 manufactured by Tamapoly Co., Ltd.) having a thickness of 33 μm was bonded to the surface of the photosensitive resin layer as a protective film to obtain a photosensitive resin laminate. The names of the material components in the photosensitive resin composition preparation liquid which will be abbreviated in Tables 2 to 6 are shown in Table 7. 3. The absorbance of the photosensitive resin layer was measured by using the split light manufactured by Hitachi High-Technologies Corporation. The luminometer (U-3010) was used to peel off the polyethylene film of the photosensitive resin laminate obtained, and the support and the photosensitive resin layer were placed on the measurement side while being laminated, and the support film was placed on the reference side, and the photosensitive film was measured. The absorbance of the resin laminate (365 nm). The measured value is divided by the film thickness, and the absorbance per 1 μm of the film thickness is shown in Tables 2 to 4. 4. Sensitivity and resolution evaluation <Sample preparation method> The protective film of the photosensitive resin laminate is peeled off. This was laminated on a copper surface of a substrate on which a resin, ITO, and copper-plated substrate were sequentially laminated at a roll temperature of 100 ° C by a heating roll laminator (VA-400III manufactured by Dacheng Laminator Co., Ltd.). The air pressure was set to 0.4 mPa and the lamination speed was set to 1.0 m/min. After standing for 15 minutes, a PET mask and a Stouffer 21-stage stage exposure meter were placed side by side on the support film (a staged exposure meter in which the optical density of 0.00 was set to the first stage and the optical density per section was sequentially increased by 0.15). The optimum exposure amount of each combination was exposed from the PET mask and the stage exposure side by a parallel light exposure machine (HMW-801 manufactured by OAK Co., Ltd.). A non-exposed portion having a pattern of a circular hole is used as a PET mask. After standing for 15 minutes or more, the support film of the photosensitive resin laminate was peeled off, and a developing device manufactured by Fuji Electric Co., Ltd. was used to have a mass of 35 ° C of 1 mass % Na by a full cone type nozzle at a developing pressure of 0.07 mPa. 2 CO 3 The aqueous solution was sprayed for 60 seconds to develop, and the unexposed portion of the photosensitive resin layer was dissolved and removed. At this time, the water washing step was carried out by a flat nozzle at a water spray pressure of 0.07 mPa for the same period as the development step, and the water-washed sample was dried by air blowing to form an evaluation pattern. The above-mentioned optimum exposure amount means an exposure amount of 8 to 9 segments when the exposure is performed by the Stouffer 21-stage stage exposure meter by the above-described processing. <Evaluation Method> ・ Sensitivity The optimum exposure amount obtained by the above sample preparation method was classified as follows, and summarized in Tables 2 to 4. The protective film is preferably at least grade C. A: The optimum exposure is below 30 mJ. B: The optimum exposure is higher than 30 mJ and below 60 mJ. C: The optimum exposure is higher than 60 mJ and below 90 mJ. D: The optimum exposure is higher than 90 mJ.・Resolution property The diameter of the smallest circular hole mask in which the circular hole pattern is normally formed by the above sample preparation method is set as the resolution value, and the resolution is classified in the following manner, and the results are summarized into a table. 2 to 4 in. The protective film is preferably grade B or higher. A: The resolution value exceeds 70 μm and is 80 μm or less. B: The resolution value exceeds 80 μm and is 100 μm or less. C: The resolution value exceeds 100 μm. 5. Flexibility evaluation <Sample preparation method> The photosensitive resin laminate was cut into 2 cm × 20 cm, and exposed by the exposure amount of each combination from the support film side by a scattered light exposure machine (HMW-201 KB manufactured by OAK Co., Ltd.). After standing for 15 minutes, the protective film was peeled off from the photosensitive resin laminate, and development, washing with water, and drying were carried out in the same manner as in the method of producing a sensitivity and resolution evaluation sample. Thereafter, by the scattered light exposure machine from the side of the photosensitive layer at 350 mJ/cm 2 The exposure amount was exposed, followed by treatment in a hot air circulating oven at 150 ° C for 30 minutes. The prepared sample was subjected to humidity control at 23 ° C and 50% RH for 1 day and then tested. <Evaluation Method> As shown in Fig. 1, the cylindrical mandrel (2) having a specific diameter φ is fixed as a fulcrum, and the photosensitive resin layer of the prepared sample (1) is left outside for 1 second to 2 seconds. Bend 90 ° C and then return to the original state, set the above operation to 1 time, repeat the same operation a specific number of times. Then, with respect to the sample (1), the presence or absence of peeling and the presence or absence of cracking of the photosensitive resin layer were observed with a microscope, and classification was carried out in the following manner. The results are shown in Tables 2 to 4. The protective film is preferably at least grade C. A: Bending 10 times by a 0.5 mmφ mandrel, without cracking and peeling B: bending by a 0.5 mmφ mandrel once, without cracking and peeling C: bending 10 times by a 1 mmφ mandrel, No cracking and peeling D: bending by a mandrel of 2 mmφ 10 times without cracking and peeling 6. Evaluation of rust resistance <Production of test substrate> As described in Example 2 of the specification of Japanese Patent No. 4515123 In the same manner, a photosensitive resin laminate was produced, and the protective film was peeled off from the photosensitive resin laminate, and laminated on a layer of resin, ITO, and sputtered copper by a heating roll laminator. A copper surface of a 10 cm soft substrate. At this time, the roll temperature was set to 100 ° C, the gas pressure was set to 0.4 mPa, and the lamination speed was set to 1.5 m / min. After standing for 15 minutes, a PET mask was placed on the support film from the PET mask side by a parallel light exposure machine at 120 mJ/cm. 2 Exposure. The PET mask uses a pattern with a line/gap = 80 μm / 80 μm. After standing for 15 minutes or more, the support film was peeled off from the photosensitive resin laminate, and a developing device manufactured by Fuji Electric Co., Ltd. was used, and a full-cone nozzle was used to develop a mass of 30 ° C at a developing pressure of 0.15 mPa. 2 CO 3 The aqueous solution was sprayed at twice the minimum development time, and the unexposed portion of the photosensitive resin layer was dissolved and removed. Here, the minimum development time means the minimum time required until the unexposed portion of the photosensitive resin composition layer is completely dissolved and removed. At this time, the water washing step was carried out by a flat nozzle at a water spray pressure of 0.15 mPa for the same period as the development step, and the water-washed sample was dried by blowing to form a resist pattern on the copper surface. Then, the substrate on which the resist pattern was formed was etched by immersion in an aqueous solution having a liquid temperature of 30 ° C and a hydrochloric acid concentration of 2% by mass and a ferric chloride of 2% by mass for 1.5 times the minimum etching time. Thereafter, washing with water and air drying are carried out. Here, the minimum etching time refers to the minimum time required to completely dissolve the copper foil on the substrate under the above conditions. After the above etching, the substrate was immersed in a 3% by mass aqueous NaOH solution having a liquid temperature of 50 ° C, and the resist was removed by immersion, and washed with water and air-dried. Thereby, a test substrate in which ITO was laminated on the resin and a copper wiring pattern was formed on the ITO layer was obtained. When the copper wiring pattern is described in more detail, the copper wire having a length of 8 cm and a width of 80 μm is formed by 10 lines having a gap of 1:1. <Sample Preparation Method> The protective film of each of the photosensitive resin laminates of Examples 1 to 38 and Comparative Examples 1 to 3 was peeled off, and a heating roll laminator (VA-400 III manufactured by Dacheng Laminator Co., Ltd.) was used. The surface on which the copper wiring of the substrate on which the copper wiring is formed by the above method is laminated is laminated. At this time, the roll temperature was set to 100 ° C, the gas pressure was set to 0.4 mPa, and the lamination speed was set to 1.0 m / min. After standing for 15 minutes, the optimum exposure amount of each combination was exposed to the entire surface by a diffused light exposure machine from the side of the support film of the protective film. After standing for 15 minutes, the support film was peeled off from the photosensitive resin laminate, and a developing device manufactured by Fuji Machin Co., Ltd. was used, and a full-cone nozzle was used to produce 1 mass% Na at 35 ° C at a development pressure of 0.07 mPa. 2 CO 3 The aqueous solution was sprayed for 60 seconds to develop, and the unexposed portion of the photosensitive resin layer was dissolved and removed. At this time, the water washing step was carried out by a flat nozzle at the same time as the development step at a water spray pressure of 0.07 mPa, and the water-washed sample was dried by air blowing. Thereafter, by the scattered light exposure machine from the side of the photosensitive layer at 350 mJ/cm 2 The exposure amount was exposed, and then a sample for evaluation was prepared by a hot air circulating oven at 150 ° C for 30 minutes. <Evaluation method> The acidic artificial sweat droplets described in JIS L0848 were applied to the copper wiring of the prepared sample for evaluation, and then stored in a constant temperature and humidity oven at 85 ° C and 85% RH (Advantech Toyo Co., Ltd.). THN050FA). After a certain period of time, the sample was taken out from the oven, and the surface of the protective film and the surface opposite to the protective film were observed by a microscope to confirm whether or not the copper wiring was discolored or corroded, and classification was carried out in the following manner. The results are shown in Tables 2 to 4. The protective film is preferably grade D or more. A: Discoloration or corrosion occurs after 144 hours or more in an environment of 85 ° C and 85% RH. B: Discoloration or corrosion occurs in an environment of 85 ° C and 85% RH for 120 hours or more and less than 144 hours. C: 85 Discoloration or corrosion occurred in an environment of °C and 85% RH for more than 96 hours and less than 120 hours. D: Discoloration or corrosion occurred in an environment of 85 ° C, 85% RH for 72 hours or more and less than 96 hours. E: 85 Discoloration or corrosion occurred in less than 72 hours in an environment of °C and 85% RH. 7. Evaluation of storage stability <Sample preparation method> For Examples 29 to 32 and Comparative Example 4, two 20 cm × 30 cm photosensitivity were prepared. The resin laminate was stored in a constant temperature and humidity oven (LH21-11M manufactured by Nagano Science Co., Ltd.) at 50 ° C and 60% RH for 3 days, and the other was stored at room temperature for 3 days to obtain two samples. . Then, the photosensitive resin laminate is laminated on the surface of the photosensitive resin laminate, and the photosensitive resin laminates are laminated in a sequential manner using a heating roll laminator (VA-400III manufactured by Daisei Co., Ltd.). It is laminated on the copper surface of the substrate of resin, ITO and copper plated. At this time, the roll temperature was set to 100 ° C, the gas pressure was set to 0.4 mPa, and the lamination speed was set to 1.0 m / min. After standing for 15 minutes, the support film side of the protective film was exposed through a Stouffer 21-stage stage exposure meter by a scattered light exposure machine. At this time, the two samples were exposed to light at an optimum exposure amount of the photosensitive resin laminate which was stored at room temperature for 3 days. After standing for 15 minutes, the support film was peeled off from the photosensitive resin laminate, and a developing device manufactured by Fuji Machin Co., Ltd. was used, and a full-cone nozzle was used to produce 1 mass% Na at 35 ° C at a development pressure of 0.07 mPa. 2 CO 3 The aqueous solution was sprayed for 60 seconds to develop, and the unexposed portion of the photosensitive resin layer was dissolved and removed. At this time, the water washing step was carried out by a flat nozzle at the same time as the development step at a water spray pressure of 0.07 mPa, and the water-washed sample was dried by air blowing. <Evaluation Method> The number of residual film segments of the Stouffer 21-stage staged exposure meter of each sample obtained by the above sample preparation method was read, and the samples were stored at room temperature for 3 days and at 50 ° C and 60 as follows. The difference in the number of residual film segments of the sample stored under %RH was classified, and the results are shown in Table 5. When the grade is A, even if the sample is stored at a normal temperature for a long period of time, there is no problem in terms of practicality and there is no problem. In the case of the B grade, if the long-term storage is not carried out by the refrigerator storage method, the sensitivity changes, and there is a problem in practical use. When the photosensitive resin laminate is used industrially, it can be used stably even if it can be stored in a refrigerator, but it is more preferably A grade from the viewpoint of management cost and man-hour. A: The difference between the number of residual film segments is 3 segments or less B: The difference between the number of residual film segments is greater than 3 segments 8. The length of the circular hole pattern crotch portion <Evaluation method> Use a non-exposed portion to become a circular hole with a diameter of 100 μm. The mask is a PET mask, and a circular hole pattern is obtained according to the sample preparation method described in the item "4. Sensitivity and resolution evaluation". The circular hole pattern was magnified 5000 times by a scanning electron microscope (S-3400N manufactured by Hitachi High-Technologies Corporation), and the crotch portion generated at the bottom of the circular hole pattern was observed. The observations were ranked as follows. The ratings are shown in Table 5. The distance from the side wall surface of the circular hole to the end portion of the crotch portion along the surface of the substrate was measured as the length of the crotch portion. The protective film is preferably grade A or B. A: The length of the crotch portion of the round hole is 2.0 μm or less. B: The length of the crotch portion of the circular hole is larger than 2.0 μm and 3.0 μm or less C: The length of the crotch portion of the circular hole is larger than 3.0 μm. 9. Adhesion evaluation <Sample preparation method> Substrate The protective film of the photosensitive resin laminate obtained in Examples 33 to 38 and Comparative Examples 5 and 6 was peeled off while being laminated on the substrate in which the resin, the ITO, and the copper-plated substrate were laminated. A sample was produced by the same method as the <sample preparation method> of "6. Rust prevention evaluation" except the copper surface. <Evaluation Method> Using the prepared sample, a cross-cut test was carried out in the following manner using a method according to JIS K-5600-5-6 for an evaluation process not specifically mentioned. Ten slits were cut in parallel on the sample by a cutter at a spacing of 1 mm using a guide, and ten slits were cut at right angles to each other in such a manner as to form a lattice pattern. After bonding the adhesive tape having a width of 15 mm (Sellotape (registered trademark), product name) manufactured by Nichiban in the slit portion of the lattice shape, it is 60° with respect to the crimping surface in 0.5 second to 1 second. Angle peeling adhesive tape. The surface of the sample from which the adhesive tape was peeled off was observed with an optical microscope, and classified in the following manner. The results are shown in Table 6. The protective film is preferably grade A or B. A: The area of the protective film peeled off from the copper surface of the substrate was less than 10%. B: The area of the protective film peeled off from the copper surface of the substrate was 10% or more and less than 20%. C: The area of the protective film peeled off from the copper surface of the substrate was 20% or more. 10. Evaluation results The evaluation results of Examples 1 to 38 and Comparative Examples 1 to 6 are shown in Tables 2 to 6. With respect to Examples 1 to 38, it was found that the initiator and the rust inhibitor of the present embodiment were used. The protective film is excellent in rust resistance, bendability, sensitivity, and resolution. On the other hand, Comparative Examples 1 to 3 which do not contain the initiator or the rust preventive agent of the present embodiment are inferior in any of rust resistance, flexibility, sensitivity, and resolution. In Comparative Example 4, as a result of the poor length of the crotch portion of the circular hole pattern, in Comparative Examples 5 and 6, the adhesion was poor. More specifically, when Comparative Example 1 is compared with Example 17, it is clear that the photosensitive resin composition does not contain an absorption coefficient at a wavelength of 365 nm in an ethanol solution of 17 mL/(mg·cm) to 60 mL/( The initiator of mg/cm) was inferior to Comparative Example 1 in terms of all properties of rust resistance, flexibility, sensitivity and resolution. Further, when Comparative Example 2 and Example 13 were compared, it was found that Comparative Example 2 was inferior in terms of rust resistance, flexibility, and sensitivity for the same reason. Further, when Comparative Example 3 and Example 21 were compared, it was confirmed that the photosensitive resin composition of Comparative Example 3 does not contain a rust preventive agent, and therefore is inferior in terms of rust preventive property. According to the comparison between Example 2 and Example 3, it was found that the rust resistance was improved by containing the amine compound in the photosensitive resin composition. Next, according to the comparison between Example 6 and Example 7, it was found that the rust resistance was improved by adding a decane coupling agent to the photosensitive resin composition. Further, by comparing Example 17 with Example 18, it was found that rust resistance and flexibility were improved by using an alkali-soluble resin having an aromatic group in a side chain. On the other hand, according to the comparison between Example 1 and Example 4, it is found that the rust preventive property is improved by including the component (D) having three or less N and/or S in the same hetero ring in the photosensitive resin composition. Further, when Comparative Example 22, Example 23, and Example 24 were compared, it was found that among the components (D) having three or less N and/or S in the same hetero ring, benzotriazole and its derivatives were prevented. It is good from the viewpoint of rust. Further, when Comparative Example 17 and Example 19 were compared, it is understood that 5 of the above-exemplified examples of benzotriazole and its derivatives and imidazole and derivatives thereof are preferred as a preferred rust inhibitor. The photosensitive resin composition of the -carboxybenzotriazole is more excellent from the viewpoint of rust prevention. Further, according to the comparison between Example 20 and Example 21, it was confirmed that the 365 nm absorbance of the photosensitive resin layer was adjusted to 0.01 to 0.05 per 1 μm with respect to the film thickness to obtain more excellent rust preventive property. Furthermore, when the components (C) represented by the formula (4) are contained in the photosensitive resin composition, the balance between the rust resistance and the bending resistance is improved, and further, Increased storage stability. Further, when Comparative Example 4 and Example 32 were compared, it was confirmed that the portion of the round hole pattern was reduced by adding the component (D) to the photosensitive resin composition. Further, in Comparative Example 32, when Comparative Examples 30 and 31 were compared, it was confirmed that the above-exemplified benzotriazole or a derivative thereof was used by using the component (D) which is preferable from the viewpoint of developability. The developability is improved, and the crotch portion of the circular hole pattern becomes smaller. Further, when Comparative Examples 5 and 6 and Examples 33 to 38 were compared, it was found that the adhesion was improved by adding the component (D) to the photosensitive resin composition. Further, according to the comparison of Example 36 with Examples 33 to 35, or the comparison of Examples 38 and 37, it was confirmed that tetrazole and its derivative, triazole and its derivative, carbazole were used as the component (D). The derivative and the thiadiazole and its derivative are added to the photosensitive resin composition, and the adhesion is further improved. [Table 1] Table 1 [Table 2] [table 3] [Table 4] [table 5] [Table 6] [Table 7]

1‧‧‧樣品
2‧‧‧具有任意直徑φ之圓筒形心軸1‧‧‧ samples
2‧‧‧Cylinder mandrel with arbitrary diameter φ

圖1係用於說明實施例中之耐彎曲性試驗之方法之圖。Fig. 1 is a view for explaining a method of the bending resistance test in the examples.

1‧‧‧樣品 1‧‧‧ samples

2‧‧‧具有任意直徑之圓筒形心軸 2‧‧‧With any diameter Cylindrical mandrel

Claims (22)

一種導體部之保護膜形成用感光性樹脂組合物，其包含以下成分：(A)鹼溶性樹脂；(B)具有乙烯性不飽和雙鍵之化合物；(C)光聚合起始劑；及(D)防銹劑；且作為(C)成分包含於乙醇溶液中波長365 nm之吸光係數為17 mL/(mg・cm)～60 mL/(mg・cm)之肟化合物。A photosensitive resin composition for forming a protective film for a conductor portion, comprising the following components: (A) an alkali-soluble resin; (B) a compound having an ethylenically unsaturated double bond; (C) a photopolymerization initiator; D) a rust preventive agent; and as a component (C), a ruthenium compound having an absorption coefficient at a wavelength of 365 nm in an ethanol solution of 17 mL/(mg·cm) to 60 mL/(mg·cm) is contained. 如請求項1之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含具有包括碳(C)原子與氮(N)原子及/或硫(S)原子之雜環，且於同一雜環中N原子數為3以下或S原子數為3以下或N原子與S原子之合計數為3以下之化合物。The photosensitive resin composition of claim 1, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains, as component (D), a carbon (C) atom and a nitrogen (N) atom and/or sulfur. (S) a heterocyclic ring of an atom, wherein the number of N atoms in the same hetero ring is 3 or less, or the number of S atoms is 3 or less, or the total number of N atoms and S atoms is 3 or less. 如請求項1或2之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含選自由苯并三唑、苯并三唑衍生物、咪唑及咪唑衍生物所組成之群中之至少一種化合物。The photosensitive resin composition of Claim 1 or 2, wherein the photosensitive resin composition for forming a protective film of the above-mentioned conductor part contains the component (D) selected from the group consisting of a benzotriazole, a benzotriazole derivative, and an imidazole. And at least one compound of the group consisting of imidazole derivatives. 如請求項3之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含苯并三唑或苯并三唑衍生物。The photosensitive resin composition of the claim 3, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a benzotriazole or a benzotriazole derivative as the component (D). 如請求項1或2之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含選自由三唑、三唑衍生物、四唑、四唑衍生物、噻二唑、噻二唑衍生物、吲唑及吲唑衍生物所組成之群中之至少一種化合物。The photosensitive resin composition of Claim 1 or 2, wherein the photosensitive resin composition for forming a protective film of the conductor part contains the component (D) selected from the group consisting of triazole, triazole derivative, tetrazole, and tetrazole. At least one compound of the group consisting of a derivative, a thiadiazole, a thiadiazole derivative, an oxazole, and a carbazole derivative. 如請求項5之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含三唑或三唑衍生物。The photosensitive resin composition of the claim 5, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a triazole or a triazole derivative as the component (D). 如請求項5之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含四唑或四唑衍生物。The photosensitive resin composition of the claim 5, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a tetrazole or a tetrazole derivative as the component (D). 如請求項5之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含噻二唑或噻二唑衍生物。The photosensitive resin composition of the claim 5, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a thiadiazole or a thiadiazole derivative as the component (D). 如請求項5之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(D)成分包含吲唑或吲唑衍生物。The photosensitive resin composition of the claim 5, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains a carbazole or a carbazole derivative as the component (D). 如請求項1至9中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(4)所表示之化合物：[化1]{式中，X4 及X5 分別獨立地表示一價之有機基，至少一者包含下述式(5)：[化2]所表示之結構，且Y4 表示H或一價之有機基}。In the photosensitive resin composition for forming a protective film of the above-mentioned conductor part, the photosensitive resin composition for forming a protective film of the above-mentioned conductor part contains the compound represented by following formula (4) as (C) component: [Chemical 1] In the formula, X 4 and X 5 each independently represent a monovalent organic group, and at least one of them includes the following formula (5): [Chemical 2] The structure indicated, and Y 4 represents H or a monovalent organic group}. 如請求項10之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(6)所表示之化合物：[化3]{式中，Y5 為H、-CH3 、碳數2以上之脂肪族烴基、或碳數3以上之可經雜原子或/及鹵素原子取代之脂環式烴基，n表示0或1之整數，Y5 為H或-CH3 時n＝0，Y5 為碳數2以上之脂肪族烴基或碳數3以上之可具有雜原子或/及鹵素原子之脂環式烴基時n＝1，且Y6 表示H或一價之有機基}。In the photosensitive resin composition for forming a protective film of the above-mentioned conductor portion, the photosensitive resin composition for forming a protective film of the above-mentioned conductor portion contains a compound represented by the following formula (6) as a component (C): [Chemical 3] In the formula, Y 5 is H, -CH 3 , an aliphatic hydrocarbon group having 2 or more carbon atoms, or an alicyclic hydrocarbon group having 3 or more carbon atoms which may be substituted by a hetero atom or/and a halogen atom, and n represents 0 or 1 An integer, when Y 5 is H or -CH 3 , n = 0, Y 5 is an aliphatic hydrocarbon group having 2 or more carbon atoms, or an alicyclic hydrocarbon group having 3 or more carbon atoms which may have a hetero atom or/and a halogen atom; n = 1 And Y 6 represents H or a monovalent organic group}. 如請求項1至9中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含下述式(1)所表示之化合物、及/或下述式(2)所表示之化合物：[化4]{式中，X1 表示包含可具有取代基之雜環之一價基，Y1 表示選自由可形成分枝或環結構之碳數1～8之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z1 表示一價之有機基}[化5]{式中，X2 及X3 表示相同或不同之拉電子基，Y2 及Y3 相同或不同，Y2 及Y3 表示選自由可形成分枝或環結構之碳數1～10之烷基、及可具有取代基之苯基所組成之群中之取代基，且Z2 表示選自由碳數1～16之伸烷基、及可具有取代基之伸苯基所組成之群中之二價基}。In the photosensitive resin composition for forming a protective film of the conductor portion, the photosensitive resin composition for forming a protective film of the above-mentioned conductor portion contains a compound represented by the following formula (1) as a component (C), And/or a compound represented by the following formula (2): [Chemical 4] Wherein X 1 represents a valence group containing a heterocyclic ring which may have a substituent, and Y 1 represents a phenyl group selected from a C 1-8 alkyl group which may form a branched or cyclic structure, and a phenyl group which may have a substituent Substituents in the group formed, and Z 1 represents a monovalent organic group} Wherein X 2 and X 3 represent the same or different electron withdrawing groups, Y 2 and Y 3 are the same or different, and Y 2 and Y 3 represent an alkane having a carbon number of from 1 to 10 which can form a branched or cyclic structure. a substituent in the group consisting of a phenyl group which may have a substituent, and Z 2 represents a group selected from the group consisting of an alkylene group having 1 to 16 carbon atoms and a stretching phenyl group which may have a substituent Divalent base}. 如請求項12之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(C)成分包含上述式(1)中X1 為下述式(3)所表示之一價基之化合物：[化6]{式中，A表示氧(O)原子或S原子}。The requested item 12 of the photosensitive resin composition, wherein the conductive portion of the protective film is formed with a photosensitive resin composition, as the component (C) comprises the above-described formula (1) X 1 is the following formula (3) represented by One of the valence compounds: [Chemical 6] In the formula, A represents an oxygen (O) atom or an S atom}. 如請求項1至13中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物中，作為(A)成分包含側鏈具有芳香族基之鹼溶性樹脂。In the photosensitive resin composition for forming a protective film of the above-mentioned conductor portion, the photosensitive resin composition for forming a protective film of the above-mentioned conductor portion contains an alkali-soluble resin having an aromatic group in a side chain as the component (A). 如請求項1至14中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物包含(E)矽烷偶合劑。The photosensitive resin composition of any one of Claims 1 to 14, wherein the photosensitive resin composition for forming a protective film of the conductor portion contains (E) a decane coupling agent. 如請求項1至15中任一項之感光性樹脂組合物，其中上述導體部之保護膜形成用感光性樹脂組合物包含(F)胺化合物。The photosensitive resin composition of any one of Claims 1-15, wherein the photosensitive resin composition for forming a protective film of the said conductor part contains (F) amine compound. 一種感光性樹脂積層體，其具備支持膜及設於該支持膜上之包含如請求項1至16中任一項之導體部之保護膜用感光性樹脂組合物之感光性樹脂層。A photosensitive resin laminate comprising a support film and a photosensitive resin layer comprising a photosensitive resin composition for a protective film of the conductor portion according to any one of claims 1 to 16 provided on the support film. 如請求項17之感光性樹脂積層體，其中上述感光性樹脂層之厚度為15 μm以下，且上述感光性樹脂層之波長365 nm之吸光度相對於厚度每1 μm為0.01～0.05。The photosensitive resin laminate according to claim 17, wherein the photosensitive resin layer has a thickness of 15 μm or less, and the photosensitive resin layer has a light absorption at a wavelength of 365 nm of 0.01 to 0.05 per 1 μm. 一種圖案製造方法，其包括以下步驟：於基材上層壓如請求項17或18之感光性樹脂積層體並進行曝光，然後進行顯影，藉此製作圖案。A pattern manufacturing method comprising the steps of laminating a photosensitive resin laminate according to claim 17 or 18 on a substrate and performing exposure, followed by development to thereby pattern. 一種硬化膜圖案製造方法，其包括以下步驟：於基材上層壓如請求項17或18之感光性樹脂積層體並進行曝光，然後進行顯影，藉此製作圖案；及 將該圖案供於後曝光處理及/或加熱處理而使其硬化。A method for producing a cured film pattern, comprising the steps of: laminating a photosensitive resin laminate according to claim 17 or 18 on a substrate, performing exposure, and then developing, thereby patterning; and providing the pattern for post exposure It is hardened by treatment and/or heat treatment. 一種硬化膜，其係藉由如請求項20之硬化膜圖案製造方法而製造。A cured film produced by the method of producing a cured film pattern as claimed in claim 20. 一種觸控面板顯示裝置、具有觸控感測器之裝置或具有測力感測器之裝置，其具備藉由如請求項20之硬化膜圖案製造方法而製造之硬化膜。A touch panel display device, a device having a touch sensor or a device having a force sensor, which is provided with a cured film manufactured by a method of manufacturing a cured film pattern as claimed in claim 20.
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