TW201714806A - Vacuum lock system and its method for processing substrate to reduce the transporting pressure of the mechanical arm, enhance the working efficiency, and increase the output - Google Patents

Abstract

This invention relates to a vacuum lock system and its method for processing a substrate. The vacuum lock system comprises a chamber body and a substrate transfer supporting component and a substrate lifting component disposed in the chamber body. The chamber body comprises a processing chamber and a substrate transferring chamber vertically stacked, wherein the processing chamber performs plasma processing to the substrate; and the substrate transferring chamber can be selectively connected to the atmospheric environment or vacuum processing environment. The substrate transfer supporting component comprises a substrate supporting device and a substrate rotating device, wherein the substrate supporting device has trays thereon for placing the substrate; and the substrate rotating device realizes the transfer of the substrate between adjacent trays. The substrate lifting component is disposed in the chamber body and can be lifted, driving the movement of the substrate between the processing chamber and the substrate transferring chamber. This invention can fast and effectively realize simultaneously transporting multiple substrates, so as to reduce the transporting pressure of the mechanical arm, enhance the working efficiency, and increase the output.

Description

Vacuum lock system and processing method thereof

The present invention relates to a vacuum lock system and a method of processing the same.

In the manufacturing steps of the semiconductor element, a specific process such as thin film deposition, etching, oxidation or nitridation, heat treatment, or the like is performed on the semiconductor wafer as the substrate to be processed in a vacuum environment, usually using various vacuum processing chambers. The transfer of the semiconductor wafer from the outside to such a vacuum processing chamber is usually performed by a load lock device that switches the internal pressure between the atmospheric pressure state and the vacuum state. Typically, the load lock device is disposed between the vacuum transfer chamber and the exterior of the atmospheric environment, such as a wafer cassette or factory interface. The vacuum transfer chamber is coupled to each of the vacuum processing chambers to form an integrated vacuum processing apparatus, and the wafers in the vacuum transfer chamber can be used to transport the wafers to the respective vacuum processing chambers. When the load lock device is switched to the atmospheric pressure state, the wafer from the atmospheric pressure environment is carried into the load lock device, and then the load lock device is switched to the vacuum state, and the wafer therein is transferred to the vacuum transfer chamber.

In order to further improve the efficiency of the load lock device, a load lock device having both wafer processing and wafer transfer functions has been proposed in the prior art. If a plasma processing chamber is disposed above the load lock device to complete the process of removing the photoresist from the substrate, the etched substrate is evacuated from the vacuum etching processing chamber by a vacuum robot (manipulator in the vacuum transfer chamber). The plasma processing chamber is transferred to the plasma processing chamber above the load lock device for heat treatment to remove surface deposited halogen residues or photoresist. The plasma processing chamber is then vented to atmospheric pressure to equalize the pressure between the plasma and the factory interface, and the substrate after removal of the halogen residue or photoresist residue by the robot is transferred to the wafer cassette of the factory interface.

Although the load lock device further improves the utilization efficiency, the robot manipulator separately carries the substrate for the load lock device and the plasma processing chamber of different heights, and for the vacuum processing chamber having multiple vacuum processing chambers. For the vacuum processing device, if the utilization rate of the vacuum processing chamber is to be increased, the work of the vacuum robot will undoubtedly be greatly burdened, and the work efficiency and the output are greatly limited.

The invention provides a vacuum lock system and a processing method thereof for the substrate, which can realize the simultaneous transport of a plurality of substrates quickly and effectively, reduce the transfer pressure of the robot, improve the working efficiency and increase the output.

In order to achieve the above object, the present invention provides a vacuum lock system comprising a chamber body, a substrate transfer support assembly disposed in the chamber body, and a substrate lifting assembly; the chamber body including the processing chamber and the substrate transfer chamber The processing chamber is vertically stacked on the upper portion of the substrate transfer chamber, and the bottom of the processing chamber has an opening communicating with the substrate transfer chamber for plasma processing the substrate placed therein; the substrate transfer chamber is selectable Optionally connected to an atmospheric environment or a vacuum processing environment for effecting substrate exchange transfer between the atmospheric environment and the substrate transfer chamber, or between the vacuum processing environment and the substrate transfer chamber; the substrate transfer support assembly comprises a substrate supporting device and a substrate rotating device; the substrate supporting device comprises a lifting plate under the processing chamber, at least one atmospheric side fixing plate disposed on one side of the lifting plate, and a lifting plate At least one vacuum side fixed disk on the other side, the disk on the substrate supporting device is used for placing the substrate; the substrate rotating device is fixed on the substrate supporting device a rotating shaft and a plurality of rotating arms connecting the rotating shaft, wherein the rotating arm can be raised and lowered along the rotating shaft, and can also rotate around the rotating shaft to realize transfer of the substrate between adjacent disks; the substrate lifting assembly The lifting and lowering assembly is disposed in the chamber body, and the substrate lifting assembly comprises a separating plate disposed under the lifting plate and a lifting pin fixed under the separating plate; the size of the separating plate is larger than that of the lifting plate Dimensions are provided with a sealing ring on the contact surface of the separating plate and the processing chamber; the lifting pin driving the separating plate and the lifting plate move between the first position and the second position; the first position means The liftable disc is located in the processing chamber, and the partition plate seals the bottom opening of the processing chamber; the second position means that the liftable disc is located in the substrate transfer chamber.

Preferably, the substrate transfer chamber has an atmospheric opening formed on the sidewall and a vacuum opening for connecting the substrate transfer chamber to the atmosphere, the vacuum opening for the substrate The transfer chamber is connected to a vacuum processing environment, and the atmospheric opening has an atmospheric gate valve for sealing the atmospheric opening in an open and closed manner, the vacuum opening having a vacuum gate valve for sealing the vacuum opening in an open and closed manner, so that the substrate is transferred The chamber can be selectively connected to an atmospheric environment or a vacuum processing environment.

Preferably, the processing chamber is provided with a gas supply device and an exhaust device, and the processing chamber can be subjected to plasma treatment in a vacuum environment.

Preferably, the substrate transfer chamber is provided with an exhaust device for controlling the switching of the pressure in the substrate transfer chamber to atmospheric pressure or vacuum ambient pressure.

Preferably, the number of the rotating arms is equal to the sum of the number of the liftable disk, the atmospheric side fixed disk and the vacuum side fixed disk on the substrate supporting device.

Preferably, when not in use, the rotating arm of the substrate rotating device is located outside the range of the liftable disk, the atmospheric side fixed disk and the vacuum side fixed disk, and descends to the bottom along the rotating shaft, and the substrate supporting device The surface is fitted. When the substrate needs to be rotated, the rotating arm rotates until each rotating arm is located below the substrate at the lifting plate, the atmospheric side fixing plate and the vacuum side fixing plate, and stops rotating, so that the rotating arm Ascending along the axis of rotation, after lifting the substrate on the disk, the rotating arm continues to rotate in the original direction until each rotating arm is located above the liftable plate, the atmospheric side fixed disk and the vacuum side fixed disk, and stops rotating. The rotating arm descends along the rotating shaft, and the substrate is placed on the disc, and the rotating arm continues to rotate in the original direction until the rotating arm is outside the range of the liftable plate, the atmospheric side fixed plate and the vacuum side fixed plate, and the rotation is stopped and along The axis of rotation drops to the bottom.

Preferably, the temperature control module is disposed in the liftable disc to heat the substrate placed on the liftable disc, and the temperature control module is separated by a heat insulating member and the partition plate to prevent heat leakage.

The present invention further provides a dual vacuum lock system comprising two vacuum lock systems, the two vacuum lock systems being arranged in mirror symmetry, and the substrate rotation devices in the two vacuum lock systems are rotated in opposite directions.

The invention further provides a vacuum processing system comprising at least one vacuum lock system, one side of each vacuum lock system being coupled to a vacuum processing device, the other side of each vacuum lock system being coupled to the atmospheric device; The vacuum processing device includes a vacuum transfer chamber coupled to the substrate transfer chamber of the vacuum lock system, and a plurality of vacuum processing chambers coupled to the vacuum transfer chamber; the vacuum transfer chamber has a vacuum robot; the atmospheric device includes An atmospheric manipulator working chamber coupled to the substrate transfer chamber of the vacuum lock system, and a plurality of substrate cassettes coupled to the working chamber of the atmospheric manipulator; the atmospheric manipulator working chamber has an atmospheric manipulator.

Preferably, the vacuum manipulator has at least one mechanical arm, the number of mechanical arms of the vacuum manipulator is equal to the number of vacuum lock systems; the atmospheric manipulator has at least one mechanical arm, and the number of mechanical arms of the atmospheric manipulator is equal to the number of vacuum lock systems.

The invention further provides a method for substrate processing using a vacuum lock system, comprising the steps of:

Step S1, the substrate transfer chamber in the vacuum lock system is maintained in a vacuum environment, and the substrate lifting assembly is raised to the first position, and the first substrate processed by the vacuum processing environment in the lifting tray is subjected to plasma processing in the processing chamber. At this time, the second substrate after being processed by the processing chamber in the vacuum lock system is placed on the atmospheric side fixed disk, and the untreated third substrate from the atmospheric environment is placed on the vacuum side fixed plate at this time;

Step S2, switching the substrate transfer chamber in the vacuum lock system to an atmospheric environment, so that the substrate transfer chamber communicates with the atmospheric environment, and the second substrate processed by the processing chamber in the vacuum lock system is fixed from the atmospheric side fixed plate. Transfer to the atmosphere while placing an untreated fourth substrate from the atmosphere on the atmospheric side fixed disk;

Step S3, switching the substrate transfer chamber in the vacuum lock system to a vacuum environment, connecting the substrate transfer chamber to the vacuum processing environment, and transferring the unprocessed third substrate on the vacuum side fixed plate to the vacuum processing environment. Processing, and placing the fifth substrate processed in the vacuum processing environment on the vacuum side fixed plate, the substrate lifting assembly is lowered to the second position, and the first substrate processed through the processing chamber in the vacuum lock system is located on the liftable plate Putting an unprocessed fourth substrate on the atmospheric side fixed disk at this time, and placing the fifth substrate processed by the vacuum processing environment on the vacuum side fixed plate at this time;

Step S4, the substrate transfer chamber in the vacuum lock system is maintained in a vacuum environment, and the substrate rotating device in the vacuum lock system transfers the substrate position, and the first substrate processed through the processing chamber in the vacuum lock system is The lifting plate is transferred to the atmospheric side fixed plate, the unprocessed fourth substrate is transferred from the atmospheric side fixed plate to the vacuum side fixed plate, and the fifth substrate processed by the vacuum processing environment is transferred from the vacuum side fixed plate to the Lifting plate

Steps S1 to S4 are repeated.

Preferably, the substrate rotating device in the vacuum lock system performs the following steps: the rotating arm rotates to the bottom of the substrate at the disk, stops rotating, and the rotating arm rises along the rotating axis, and the disk is mounted on the disk. When the substrate is lifted up, the rotating arm continues to rotate in the original direction until the rotating arm is above the disk, stops rotating, the rotating arm descends along the rotating shaft, the substrate is placed on the disk, and the rotating arm continues to rotate in the original direction until the rotating arm is located Outside the disk range, the rotation stops and the rotating arm descends to the bottom along the axis of rotation.

Preferably, the substrate is transferred between the atmospheric environment and the substrate transfer chamber in the vacuum lock system by an atmospheric manipulator; the substrate of the substrate in the vacuum processing environment and the vacuum lock system is realized by a vacuum robot. Transfer between transfer chambers.

Preferably, the environment switching in the substrate transfer chamber in the vacuum lock system comprises: first sealing the atmosphere opening and the vacuum opening in the substrate transfer chamber, and discharging the gas in the substrate transfer chamber, and then correspondingly The opening in the substrate transfer chamber in communication with the atmospheric environment or the vacuum processing environment is opened and the other opening is sealed, thereby enabling environmental switching within the substrate transfer chamber.

The invention can realize the simultaneous transportation of a plurality of substrates quickly and effectively, reduces the transportation pressure of the robot, improves the working efficiency, and increases the output.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be specifically described with reference to Figs.

As shown in Figures 1 to 4, a vacuum lock system provided by the present invention comprises a chamber body, a substrate transfer support assembly disposed within the chamber body, and a substrate lift assembly.

The chamber body includes a processing chamber 11 and a substrate transfer chamber 12 which are vertically stacked on the upper portion of the substrate transfer chamber 12.

The bottom of the processing chamber 11 has an opening communicating with the substrate transfer chamber 12, and the processing chamber 11 is used for plasma treatment of the substrate 4 placed therein, for example, it may be removed from the surface of the substrate 4. The photoresist-removing plasma processing chamber of the photoresist may also be other plasma processing chambers such as etch residues. A gas supply device (such as a gas shower head, not shown) for inputting a reaction gas and an exhaust device may be disposed in the processing chamber 11, and the gas supply device may be connected to a remote plasma source to generate electricity of the reaction gas generated thereby. The slurry is supplied to the processing chamber 11, or may be coupled to an RF source to ionize the reactant gases into plasma within the processing chamber 11.

The substrate transfer chamber 12 is for substrate exchange between adjacent environments, the substrate transfer chamber 12 having an atmospheric opening 121 and a vacuum opening 122 formed on the side wall, the atmospheric opening 121 being used for The substrate transfer chamber 12 is connected to an atmospheric environment, such as a substrate storage environment, such as a substrate storage case, for connecting the substrate transfer chamber 12 to a vacuum processing environment, such as for each substrate 4 Vacuum processing chamber for vacuum processing. The atmospheric opening 121 has an atmospheric gate valve 123 for sealing the atmospheric opening 121 in an open and closed manner. The vacuum opening 122 has a vacuum gate valve 124 for sealing the vacuum opening 122 in an open and closed manner, so that the substrate transfer chamber 12 is closed. It can be selectively connected to an atmospheric environment or a vacuum processing environment to transfer the substrate between two different atmospheric pressure environments. The substrate transfer chamber 12 also has an exhaust device (such as a vacuum pump) for controlling the switching of the pressure within the substrate transfer chamber 12 to atmospheric or vacuum ambient pressure. Since the processing chamber 11 and the substrate transfer chamber 12 each have an exhaust device to independently control the pressure therein, the processing chamber 11 can be subjected to plasma treatment of the substrate therein under a vacuum environment, and the substrate transfer The chamber 12 is switched to an atmospheric pressure environment when the substrate is transferred to the atmosphere, and is switched to a vacuum environment when the substrate is transferred to the vacuum processing environment.

The substrate transfer support assembly includes a substrate support device 101 and a substrate rotation device 102.

The substrate supporting device 101 includes a liftable disc 105, at least one atmospheric side fixed disc 108 disposed on one side of the liftable disc 105, and at least one vacuum side fixed disc disposed on the other side of the liftable disc 105. 107, the liftable disc 105 is located below the processing chamber 11, and there is a gap 55 between the liftable disc 105 and the substrate supporting device 101 (as shown in FIGS. 3 and 4), and each atmospheric side fixed disc 108, vacuum Both the side fixed disk 107 and the liftable disk 105 have a substrate ejector pin 33 (shown in Figures 3 and 4) for supporting a substrate 4 in a suspended state.

As shown in FIG. 5, the substrate rotating device 102 includes a rotating shaft 1021 and a plurality of rotating arms 1022. The rotating shaft 1021 is fixed on the substrate supporting device 101, and the rotating arm 1022 is rotatable about the rotating shaft. When the 1021 is rotated, the rotating arm 1022 can also be raised and lowered along the rotating shaft 1021. The number of the rotating arms 1022 is equal to the sum of the number of the liftable discs 105, the atmospheric side fixed discs 108, and the vacuum side fixed discs 107 on the substrate supporting device 101. When not in use, the rotating arm 1022 in the substrate rotating device 102 is located outside the range of the liftable plate 105, the atmospheric side fixed disk 108, and the vacuum side fixed disk 107, and is lowered to the bottom, with the substrate supporting device 101. The surface is fitted, and when the substrate needs to be rotated, the rotating arm 1022 is rotated in a clockwise or counterclockwise direction until each of the rotating arms 1022 is located at the corresponding liftable disk 105, the atmospheric side fixed disk 108 and the vacuum side fixed disk 107. Below the substrate, the rotation is stopped, and the rotating arm 1022 is raised along the rotating shaft 1021. After the substrate 4 on the disk is lifted up, the rotating arm 1022 continues to rotate in the original direction until each rotating arm 1022 is in the corresponding liftable position. Above the disk 105, the atmospheric side fixed disk 108 and the vacuum side fixed disk 107, the rotation is stopped, the rotating arm 1022 is lowered along the rotating shaft 1021, the substrate 4 is placed on the disk, and the rotating arm 1022 continues to rotate in the original direction until the rotation The arm 1022 is outside the range of the liftable plate 105, the atmospheric side fixed disk 108, and the vacuum side fixed disk 107, stops rotating, and descends to the bottom. The substrate rotating device 102 realizes simultaneous transfer of a plurality of substrates, improving processing efficiency.

The substrate lifting assembly is disposed in the chamber body in a liftable manner, and the substrate lifting assembly includes a spacer 104 and a jacking pin 103. The spacer 104 is disposed under the liftable disc 105, and the jacking pin 103 is fixed below the partition 104.

The spacer 104 has a size larger than that of the liftable disc 105 for sealing the opening of the bottom of the processing chamber 11 to communicate with the substrate transfer chamber 12 when the liftable disc 105 is in the processing chamber 11, thereby treating the processing chamber 11 with The substrate transfer chamber 12 is isolated. In order to further improve the sealing effect of the spacer 104, an O-ring 106 is disposed on the contact surface of the spacer 104 and the processing chamber 11.

On the other hand, since the processing chamber 11 is subjected to plasma treatment of the substrate 4 placed therein, the substrate 4 needs to be heated, and therefore, a temperature control module (not shown) is disposed in the liftable tray 105, For example, the heating wire is used to heat the substrate 4 placed on the liftable plate 105 in accordance with the plasma treatment of the processing chamber 11, and the heating temperature reaches 200 degrees. The temperature control module is isolated from the insulation plate 104 by a heat insulating member to prevent heat leakage.

The jacking pin 103 drives the spacer 104 and the liftable disc 105 to move between a first position (shown in Figure 2) and a second position (shown in Figures 3 and 4). The first position means that the liftable disc 105 is located in the processing chamber 11, and the partitioning plate 104 seals the bottom opening of the processing chamber 11. The second position means that the liftable disc 105 is located in the substrate transfer chamber 12 and is at the same level as the atmospheric side fixed disc 108 and the vacuum side fixed disc 107. When the substrate lifting assembly is raised to the first position, the separating plate 104 isolates the processing chamber 11 from the substrate transfer chamber 12, and the processing chamber 11 performs plasma processing on the substrate 4 processed by the vacuum processing environment. The substrate lifting assembly is lowered to the second position, and the plasma-treated substrate is lowered onto the substrate supporting device 101, and the substrate transfer chamber 12 is rotated by the substrate rotating device 102 to cooperate with the robot. The substrate from the atmospheric environment is transferred to a vacuum processing environment, and the substrate processed through the processing chamber 11 is transferred to the atmosphere.

In a preferred embodiment as shown in Figure 1, a dual vacuum lock system is provided, comprising two vacuum lock systems, a first vacuum lock system 1-1 and a second vacuum lock system 1-2, respectively. The vacuum lock system is mirrored symmetrically. One side of the two vacuum lock systems is coupled to the vacuum transfer chamber 201 of the vacuum processing device 2, and the other side is coupled to the atmospheric robot working chamber 301 of the atmospheric device 3. In the embodiment, the vacuum transfer chamber 201 is coupled to six vacuum processing chambers 202 for vacuum processing the substrate transported through the robot working chamber 50, and the vacuum transfer chamber 201 has a vacuum machine. The hand 203, the atmospheric manipulator working chamber 301 is coupled to a plurality of substrate cassettes 302, and the atmospheric manipulator working chamber 301 has an atmospheric manipulator 303. In the present embodiment, the substrate supporting device 101 of each vacuum lock system includes an atmospheric side fixed disk 108, a vacuum side fixed disk 107 and a liftable plate 105, which is in the first vacuum lock system 1-1. The substrate rotating device 102 rotates clockwise, and the substrate rotating device 102 in the second vacuum lock system 1-2 rotates counterclockwise. In the present embodiment, the vacuum manipulator 203 and the atmospheric manipulator 303 are both dual-arm manipulators, and two substrates can be simultaneously transported.

As shown in FIG. 1, the first vacuum lock system 1-2 is taken as an example to specifically describe the processing process of the vacuum lock system on the substrate, and the process involves processing five substrates W1, W2, W3, W4, and W5. Where Wi denotes an unprocessed substrate from the atmospheric environment, Wi' denotes a substrate processed by the vacuum processing chamber 202, and Wi'' denotes a substrate processed by the processing chamber 11 in the vacuum lock system 1-2, i=1, 2 3, 4, 5, the substrate supporting device 101 in the first vacuum lock system 1-2 comprises two fixed disks and a lifting plate C, and the fixed disk A is close to the atmospheric manipulator working chamber 301, and the fixing plate B Near the vacuum transfer chamber 201.

Step 1, the substrate transfer chamber 12 reaches a vacuum environment, the substrate lifting assembly is raised to the first position, and the processing chamber 11 is isolated from the substrate transfer chamber 12, and the substrate processed by the vacuum processing chamber 202 in the liftable disk C at this time W1' is placed in the processing chamber 11 for plasma processing. At this time, the substrate W2'' processed by the processing chamber 11 is placed on the fixed disk A, and the unprocessed substrate W3 is placed on the fixed disk B at this time.

In step 2, the vacuum opening 122 is closed by the vacuum gate valve, the atmospheric opening 121 is opened by the atmospheric gate valve 123, and the substrate transfer chamber 12 is connected to the atmosphere, and the atmospheric robot 303 passes the substrate W2'' processed by the processing chamber 11. Transfer from the fixed tray A to the substrate cassette 302 while the unprocessed substrate W4 from the substrate cassette 302 is placed on the fixed tray A.

In step 3, the atmospheric opening 121 is closed by the atmospheric gate valve 123, and the substrate transfer chamber 12 is brought into a vacuum environment by the exhaust device of the substrate transfer chamber 12. At this time, the vacuum opening 122 is opened by the vacuum gate valve, and the vacuum robot 203 is fixed. The unprocessed substrate W3 on the disk B is transferred to the vacuum processing chamber 202 for processing, and the substrate W5' processed through the vacuum processing chamber 202 is placed on the fixed disk B, and the substrate lifting assembly is lowered to the second position. The substrate W1'' processed by the processing chamber 11 is located on the liftable disk C. At this time, the unprocessed substrate W4 is placed on the fixed disk A, and the substrate W5' processed by the vacuum processing chamber 202 is placed on the fixed disk B at this time. .

Step 4, the substrate rotating device 102 performs substrate position transfer, transfers the substrate W1'' processed through the processing chamber 11 from the liftable disk C to the fixed disk A, and transfers the unprocessed substrate W4 from the fixed disk A to On the fixed disk B, the substrate W5' processed by the vacuum processing chamber 202 is transferred from the fixed disk B to the liftable disk C, and the substrate W1'' processed by the processing chamber 11 is placed on the fixed disk A at this time. The unprocessed substrate W4 is placed on the fixed disk B at this time, and the substrate W5' processed by the vacuum processing chamber 202 is placed on the liftable disk C at this time.

Steps 1 to 4 are repeated, and the processing of the substrate is continuously performed.

According to another aspect of the invention, a vacuum processing system having the above described vacuum lock system or dual vacuum lock system is provided. The vacuum processing system includes at least one vacuum lock system, one side of each vacuum lock system being coupled to the vacuum processing device 2, and the other side of each vacuum lock system being coupled to the atmospheric device 3.

The vacuum processing device 2 includes a vacuum transfer chamber 201 coupled to the vacuum lock system substrate transfer chamber 12, and a plurality of vacuum processing chambers 202 coupled to the vacuum transfer chamber 201; the vacuum transfer chamber 201 has a vacuum machine Hand 203, the vacuum manipulator 203 can be a dual arm robot.

The atmospheric device 3 includes an atmospheric manipulator working chamber 301 coupled to the vacuum lock system substrate transfer chamber 12, and a plurality of substrate cassettes 302 coupled to the atmospheric robot working chamber 301; the atmospheric manipulator working chamber The 301 has an atmospheric manipulator 303, which may be a dual-arm manipulator.

According to another aspect of the present invention, there is provided a substrate processing method using the above single vacuum lock system or double vacuum lock system, comprising the steps of:

Step S1, the substrate transfer chamber in the vacuum lock system is maintained in a vacuum environment, and the substrate lifting assembly is raised to the first position, and the first substrate processed by the vacuum processing environment in the lifting tray is subjected to plasma processing in the processing chamber. At this time, the second substrate subjected to the processing chamber in the vacuum lock system is placed on the atmospheric side fixed disk, and the untreated third substrate from the atmospheric environment is placed on the vacuum side fixed plate at this time.

Step S2, switching the substrate transfer chamber in the vacuum lock system to an atmospheric environment, so that the substrate transfer chamber communicates with the atmospheric environment, and the second substrate processed by the processing chamber in the vacuum lock system is fixed from the atmospheric side fixed plate. Transfer to the atmosphere while placing an untreated fourth substrate from the atmosphere on the atmospheric side fixed disk.

Step S3, switching the substrate transfer chamber in the vacuum lock system to a vacuum environment, connecting the substrate transfer chamber to the vacuum processing environment, and transferring the unprocessed third substrate on the vacuum side fixed plate to the vacuum processing environment. Processing, and placing the fifth substrate processed in the vacuum processing environment on the vacuum side fixed plate, the substrate lifting assembly is lowered to the second position, and the first substrate processed through the processing chamber in the vacuum lock system is located on the liftable plate On the above, the unprocessed fourth substrate is placed on the atmospheric side fixed disk at this time, and the fifth substrate subjected to the vacuum processing environment is placed on the vacuum side fixed disk at this time.

Step S4, the substrate transfer chamber in the vacuum lock system is maintained in a vacuum environment, and the substrate rotating device in the vacuum lock system transfers the substrate position, and the first substrate processed through the processing chamber in the vacuum lock system is The lifting plate is transferred to the atmospheric side fixed plate, the unprocessed fourth substrate is transferred from the atmospheric side fixed plate to the vacuum side fixed plate, and the fifth substrate processed by the vacuum processing environment is transferred from the vacuum side fixed plate to the On the lift plate.

Steps S1 to S4 are repeated.

The transfer of the substrate between the atmospheric environment and the substrate transfer chamber in the vacuum lock system is achieved by an atmospheric manipulator; the substrate is moved between the vacuum processing environment and the substrate transfer chamber in the vacuum lock system by a vacuum robot Transfer.

The environmental switching in the substrate transfer chamber in the vacuum lock system comprises: first sealing the atmosphere opening and the vacuum opening in the substrate transfer chamber, discharging the gas in the substrate transfer chamber, and then correspondingly the substrate An opening in the transfer chamber that communicates with the atmosphere or with the vacuum processing environment opens and maintains another open seal to effect environmental switching within the substrate transfer chamber.

If the substrate is processed by the double vacuum lock system, both the atmospheric manipulator and the vacuum manipulator are two-arm manipulators, respectively, between the substrate transfer chamber and the atmospheric environment in the vacuum lock system, and in the vacuum lock system. Synchronous substrate transfer is performed between the substrate transfer chamber and the vacuum processing environment.

The invention can realize the simultaneous transportation of a plurality of substrates quickly and effectively, reduces the transportation pressure of the robot, improves the working efficiency, and increases the output.

Although the present invention has been described in detail by the preferred embodiments thereof, it should be understood that the foregoing description should not be construed as limiting. Various modifications and alterations of the present invention will become apparent to those skilled in the <RTIgt; Therefore, the scope of protection of the present invention should be defined by the scope of the patent application.

1-1‧‧‧First vacuum lock system
1-2‧‧‧Second vacuum lock system
101‧‧‧Substrate support device
102‧‧‧Substrate rotation device
1021‧‧‧Rotary axis
1022‧‧‧Rotating arm
103‧‧‧ top sales
104‧‧‧Isolation board
105, C‧‧‧ lifting tray
106‧‧‧O-ring seal
107‧‧‧Vacuum side fixed plate
108‧‧‧Atmospheric side fixed plate
11‧‧‧Processing chamber
12‧‧‧Substrate transfer chamber
121‧‧‧Atmospheric opening
122‧‧‧vacuum opening
123‧‧‧ atmospheric valve
124‧‧‧Vacuum valve
2‧‧‧Vacuum treatment unit
201‧‧‧vacuum transfer room
202‧‧‧ Vacuum processing chamber
203‧‧‧vacuum manipulator
3‧‧‧Atmospheric installation
301‧‧‧Atmospheric manipulator working chamber
302‧‧‧Substrate
303‧‧‧Atmospheric manipulator
33‧‧‧Substrate thimble
4. W1, W2, W3, W4, W5‧‧‧ substrates
55‧‧‧ gap
A, B‧‧‧ fixed disk
S1, S2, S3, S4‧‧‧ steps

1 is a top cross-sectional view of a vacuum lock system provided by the present invention. Figure 2 is a cross-sectional view taken along the line D-D of the vacuum lock system shown in Figure 1. Figure 3 is a cross-sectional view taken along the line E-E of the vacuum lock system shown in Figure 2; Figure 4 is a cross-sectional view taken along the line E-E of the vacuum lock system shown in Figure 2; Fig. 5 is a schematic structural view of a substrate rotating device.

1-1‧‧‧First vacuum lock system

1-2‧‧‧Second vacuum lock system

101‧‧‧Substrate support device

102‧‧‧Substrate rotation device

C‧‧‧ lifting tray

11‧‧‧Processing chamber

2‧‧‧Vacuum treatment unit

201‧‧‧vacuum transfer room

202‧‧‧ Vacuum processing chamber

203‧‧‧vacuum manipulator

3‧‧‧Atmospheric installation

301‧‧‧Atmospheric manipulator working chamber

302‧‧‧Substrate

303‧‧‧Atmospheric manipulator

A, B‧‧‧ fixed disk

Claims (14)

A vacuum lock system comprising: a chamber body comprising a processing chamber (11) and a substrate transfer chamber (12) vertically stacked on an upper portion of the substrate transfer chamber (12) The bottom of the processing chamber (11) has an opening communicating with the substrate transfer chamber (12) for plasma treatment of the substrate (4) placed therein, the substrate transfer chamber (12) selectively connectable to an atmospheric environment or a vacuum processing environment for achieving a basis between the atmospheric environment and the substrate transfer chamber (12), or between the vacuum processing environment and the substrate transfer chamber (12) a wafer transfer support assembly, disposed in the chamber body, comprising a substrate support device (101) and a substrate rotation device (102), the substrate support device (101) being located a liftable disc (105) below the processing chamber (11), at least one atmospheric side fixed disc (108) disposed on one side of the liftable disc (105), and another set on the liftable disc (105) At least one vacuum side fixed disk (107) on the side, the substrate support A disk on the device (101) is used to place a substrate; the substrate rotating device (102) includes a rotating shaft (1021) fixed to the substrate supporting device (101) and a plurality of connecting the rotating shaft (1021) a rotating arm (1022), the plurality of rotating arms (1022) can be raised and lowered along the rotating shaft (1021), and can also rotate around the rotating shaft (1021) to realize the transfer of the substrate between adjacent disks; a substrate lifting assembly disposed in the chamber body and disposed in the chamber body in a liftable manner, the substrate lifting assembly including a spacer (104) disposed under the liftable plate (105) And a lifting pin (103) fixed under the separating plate (104), the separating plate (104) having a size larger than a size of the lifting plate (105), the separating plate (104) and the processing chamber a sealing ring (106) is disposed on the contact surface of (11); wherein the lifting pin (103) drives the separating plate (104) and the lifting plate (105) in a first position and a second position Moving between, the first position means that the hoistable disc (105) is located in the process Within the chamber (11), the spacer (104) seals the bottom opening of the processing chamber (11), the second position indicating that the liftable disc (105) is located within the substrate transfer chamber (12). The vacuum lock system of claim 1, wherein the substrate transfer chamber (12) has an atmospheric opening (121) and a vacuum opening (122) formed on the sidewall, the atmospheric opening (121) The substrate transfer chamber (12) is coupled to an atmospheric environment, the vacuum opening (122) for connecting the substrate transfer chamber (12) to a vacuum processing environment, the atmosphere opening (121) having an atmospheric gate valve (123) The opening (121) is sealed in an open and closed manner, the vacuum opening (122) having a vacuum gate valve (124) for sealing the vacuum opening (122) in an open and closed manner, so that the substrate transfer chamber (12) Optionally connected to the atmospheric environment or vacuum processing environment. The vacuum lock system of claim 1, wherein the processing chamber (11) is provided with a gas supply device and an exhaust device, and the processing chamber (11) can be realized in a vacuum environment. Perform plasma treatment. The vacuum lock system of claim 2, wherein the substrate transfer chamber (12) is provided with an exhaust device for controlling the pressure in the substrate transfer chamber (12) to be switched to atmospheric pressure. Or vacuum environment pressure. The vacuum lock system of claim 1, wherein the number of the plurality of rotating arms (1022) is equal to the liftable disk (105) on the substrate supporting device (101), the atmospheric side fixed disk ( 108) The sum of the number of the vacuum side fixed disks (107). The vacuum lock system of claim 5, wherein the plurality of rotating arms (1022) in the substrate rotating device (102) are located on the liftable disk (105), the atmosphere side when not in use. The fixed disk (108) and the vacuum side fixed disk (107) are out of range and descend to the bottom along the rotating shaft (1021) to fit the surface of the substrate supporting device (101), and the substrate is required When rotating, the plurality of rotating arms (1022) rotate until each of the plurality of rotating arms (1022) is respectively located at the liftable disk (105), the atmospheric side fixed disk (108), and the vacuum side fixed disk ( Under the substrate at 107), the rotation is stopped, and the plurality of rotating arms (1022) are raised along the rotating shaft (1021). After the substrate (4) on the disk is lifted up, the plurality of rotating arms (1022) Continue to rotate in the original direction until each of the plurality of rotating arms (1022) is respectively located above the liftable disk (105), the atmospheric side fixed disk (108) and the vacuum side fixed disk (107), and stops rotating. Having the plurality of rotating arms (1022) along the axis of rotation 1021) descending, placing the substrate (4) on the disk, the plurality of rotating arms (1022) continuing to rotate in the original direction until the plurality of rotating arms (1022) are located on the liftable plate (105), the atmosphere side Outside the range of the fixed disk (108) and the vacuum side fixed disk (107), the rotation is stopped and lowered to the bottom along the rotating shaft (1021). The vacuum lock system of claim 1, wherein the temperature control module is disposed in the liftable disk (105), and the substrate placed on the liftable disk (105) is heated. The module is isolated from the isolation plate (104) by a heat insulating member to prevent heat leakage. A double vacuum lock system comprising two vacuum lock systems as claimed in any one of claims 1 to 7, the two vacuum lock systems being arranged in mirror symmetry, in the two vacuum lock systems The substrate rotating device (102) has the opposite direction of rotation. A vacuum processing system comprising at least one vacuum lock system according to any one of claims 1 to 7, each side of the vacuum lock system being coupled to a vacuum processing device (2) The other side of the vacuum lock system is coupled to an atmospheric device (3); wherein the vacuum processing device (2) includes a vacuum coupled to the substrate transfer chamber (12) of the vacuum lock system a transfer chamber (201) and a plurality of vacuum processing chambers (202) coupled to the vacuum transfer chamber (201), the vacuum transfer chamber (201) having a vacuum robot (203); the atmospheric device (3) comprising An atmospheric manipulator working chamber (301) coupled to the substrate transfer chamber (12) of the vacuum lock system, and a plurality of substrate cassettes (302) coupled to the atmospheric robot working chamber (301), the atmosphere The robot working chamber (301) has an atmospheric manipulator (303). The vacuum processing system of claim 9, wherein the vacuum manipulator (203) has at least one mechanical arm, the number of robot arms of the vacuum robot (203) being equal to the number of the vacuum lock system, the atmospheric machine The hand (303) has at least one robot arm, the number of robot arms of the atmospheric manipulator (303) being equal to the number of the vacuum lock system. A method for substrate processing using the vacuum lock system of claim 10, comprising the following steps: Step S1, the substrate transfer chamber in the vacuum lock system is maintained in a vacuum environment, the substrate Lifting assembly is raised to the first position, a first substrate processed by the vacuum processing environment in the hoisting disc is subjected to plasma processing in the processing chamber, and the atmospheric side fixed disc is placed through the vacuum lock system at this time a second substrate processed by the processing chamber, wherein the vacuum side fixed disk is placed on the untreated third substrate from the atmospheric environment; and step S2, switching the substrate in the vacuum lock system The transfer chamber is an atmospheric environment, and the substrate transfer chamber is connected to the atmospheric environment, and the second substrate processed through the processing chamber in the vacuum lock system is transferred from the atmospheric side fixed disk to the atmospheric environment. At the same time, an unprocessed fourth substrate from the atmospheric environment is placed on the atmospheric side fixed disk; in step S3, the substrate in the vacuum transfer system is switched to a vacuum environment, and the substrate is turned The cavity is in communication with the vacuum processing environment, the unprocessed third substrate on the vacuum side fixed disk is transferred to a vacuum processing environment for processing, and a fifth substrate processed by the vacuum processing environment is placed on the vacuum side. On the fixed disk, the substrate lifting assembly is lowered to the second position, and the first substrate processed by the processing chamber in the vacuum lock system is located on the liftable plate, and the atmospheric side fixed plate is placed on the fixed disk. The fourth substrate is untreated, and the fifth substrate processed by the vacuum processing environment is placed on the vacuum side fixed disk at this time; in step S4, the substrate transfer cavity in the vacuum lock system is maintained in a vacuum environment. The substrate rotating device in the vacuum lock system performs substrate position transfer, and the first substrate processed through the processing chamber in the vacuum lock system is transferred from the liftable disk to the atmospheric side fixed plate. Transferring the unprocessed fourth substrate from the atmospheric side fixed disk to the vacuum side fixed disk, transferring the fifth substrate processed by the vacuum processing environment from the vacuum side fixed disk to the liftable disk;Repeat steps S1 ~ step S4. The method for substrate processing using a vacuum lock system according to claim 11, wherein the substrate rotating device in the vacuum lock system performs substrate position transfer comprising the steps of: rotating the plurality of rotating arms to the disk Below the substrate, the rotation is stopped, the plurality of rotating arms rise along the rotating axis, the substrate on the disk is lifted up, and the plurality of rotating arms continue to rotate in the original direction until the plurality of rotating arms are located above the disk. Stopping the rotation, the plurality of rotating arms descending along the rotating shaft, placing the substrate on the disk, and the plurality of rotating arms continue to rotate in the original direction until the plurality of rotating arms are outside the disk range, stopping the rotation, the plural The rotating arms descend to the bottom along the axis of rotation. The method for substrate processing using a vacuum lock system according to claim 11, wherein the substrate is transferred between the atmospheric environment and the substrate transfer chamber in the vacuum lock system by the atmospheric manipulator. The transfer of the substrate between the vacuum processing environment and the substrate transfer chamber in the vacuum lock system is achieved by the vacuum robot. The method for substrate processing using a vacuum lock system according to claim 11, wherein the environmental switching in the substrate transfer chamber in the vacuum lock system comprises: first transferring the substrate to the atmosphere in the chamber The opening and the vacuum opening are both sealed, the gas in the substrate transfer chamber is exhausted, and then the opening in the substrate transfer chamber that communicates with the atmosphere or the vacuum processing environment is opened and the other opening is sealed. The substrate transfers the environment within the chamber.