TW201711855A - Electrode release film, electrode-attached color filter substrate, and methods for manufacturing same - Google Patents

Abstract

The purpose of the present invention is to provide an electrode release film, an electrode-attached color filter substrate, and methods for manufacturing the same, which demonstrate a good yield, allow for a stable operation, and have versatility for compatibility with various display designs. This electrode release film is characterized by being provided with a film substrate, a release layer, a resin layer, and an adhesive layer in this order, wherein the release layer and the resin layer are brought into direct contact with each other, and an electrode layer is embedded in the adhesive layer.

Description

Electrode peeling film, color filter substrate with electrodes, and manufacturing method thereof

The present invention relates to an electrode release film, a color filter substrate with electrodes, and a method of manufacturing the same. Accordingly, the present invention relates to an electrode peeling film for a touch sensor that operates in a capacitance type, a color filter substrate with an electrode, and a method of manufacturing the same.

In recent years, transparent touch panels have been used as input devices on displays of various electronic devices. In the touch panel method, there are a resistive film type, an electrostatic capacity type, and the like. The resistive film type is a method of detecting the touch position by the contact of the upper and lower electrodes. The electrostatic capacitance type is a method of detecting a touch position by a change in electrostatic capacitance of a surface when a fingertip or the like is touched.

The sensor of the capacitive touch panel is formed of an electrode pattern on a resin substrate or a glass substrate such as a PET film, and generally has an out-cell structure disposed outside the display structure (Patent Literature) 1)

On the other hand, in recent years, an in-cell configuration or an on-cell configuration in which a touch sensor is incorporated in a display configuration has been employed. A display with a touch sensor has been made Thinner type and lighter weight assembly (Patent Document 2, Patent Document 3, and Patent Document 10).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-178758

[Patent Document 2] Japanese Invention Patent No. 4816668

[Patent Document 3] Japanese Invention Patent No. 4584342

[Patent Document 4] Japanese Patent Laid-Open No. Hei 6-273936

[Patent Document 5] Japanese Patent Laid-Open No. Hei 10-98266

[Patent Document 6] Japanese Patent Laid-Open Publication No. 2003-122004

[Patent Document 7] Japanese Patent Laid-Open No. 48-89003

[Patent Document 8] Japanese Patent Laid-Open Publication No. 60-3625

[Patent Document 9] Japanese Patent Laid-Open Publication No. 63-27829

[Patent Document 10] Japanese Patent Laid-Open Publication No. 2014-063484

However, the in-line configuration must incorporate the circuitry of the touch sensor in the TFT substrate of the driver circuit shown in the display. At this time, it has been pointed out that the design or the process is more complicated than before, and the yield of the product is deteriorated. Further, particularly in the case of a liquid crystal display, the externally embedded structure forms a touch sensor in a state in which a cell of liquid crystal is enclosed. Therefore, there is a problem of programming which considers damage to liquid crystal due to program conditions such as heat. In addition, for the thinned liquid crystal cell, the yield of the good product is deteriorated due to the complicated touch sensor forming step.

One of the problems of the present invention is to provide a high-yield, stable operation, an electrode-releasing film having a versatility corresponding to various display designs, a color filter substrate with electrodes, and the like. method. Conveniently, the subject of the present invention solves the problems of the prior art as described above in the production of a display integrated with a touch sensor.

An example of a means for solving the problem of the present invention is an electrode release film comprising a film substrate (11, 31, 51, 71), a release layer (10, 30, 50, 70), and a resin layer (4) in this order. , 24, 44, 64) and the adhesive layer (3, 23, 43, 63), the peeling layer (10, 30, 50, 70) and the resin layer (4, 24, 44, 64) are in direct contact with each other. Electrode layers (5, 25, 45, 65) are buried in the subsequent layers (3, 23, 43, 63).

Here, the electrode layers (5, 25, 45, 65) are preferably sandwiched between the resin layers (4, 24, 44, 64) and the subsequent layers (3, 23, 43, 63).

Further, the wiring layers (8, 28, 48, 68) are preferably provided adjacent to the resin layers (4, 24, 44, 64). Further, it is preferable to provide a wiring layer (8, 28, 48, 68) on the surface of the wiring layer (8, 28, 48, 68) on the side of the peeling layer (10, 30, 50, 70) (8a) The surfaces (4a, 24a, 44a, 64a) on the side of the peeling layer (10, 30, 50, 70) of the resin layer (4, 24, 44, 64) are preferably located at the same Height or become the same horizontal plane. Alternatively, it is preferable to provide a wiring layer (8, 28), a groove portion (4x, 24x) is provided in the resin layer (4, 24), and the wiring layer (8) is provided in the groove portion (4x, 24x). 28).

Further, it is preferable to provide a further one in the resin layer (24). The step portion (24y) of the step is provided with a bridge layer (27) in the further groove portion (24y), and a transparent insulating layer (26) is disposed between the bridge layer (27) and the electrode layer (25). Further, it is preferable that the surface (27a) of the bridge layer (27) on the side of the peeling layer (30) is at the same height as the surface (24a) of the peeling layer (30) side of the resin layer (24) or Become the same level.

Alternatively, it is preferable to provide a wiring layer (48, 68) on the surface (48a, 68a) of the wiring layer (48, 68) on the side of the peeling layer (50, 70) and the bonding layer (43, 63) The surfaces (43a, 63a) on the side of the peeling layer (50, 70) are at the same height or are in the same horizontal plane. Further, it is preferable that the wiring layers (48, 68) are provided by being sandwiched by the subsequent layers (43, 63).

Here, the resin layer (4, 24, 44, 64) may include a material that has photohardened the photosensitive resin, or the resin layer (4, 24, 44, 64) may be a thermoplastic resin. Resin.

Further, a spacer film may be provided on the surfaces (3b, 23b, 43b, 63b) on the side opposite to the peeling layer (10, 30, 50, 70) of the adhesive layer (3, 23, 43, 63).

Another example of a means for solving the problems of the present invention is a color filter substrate with an electrode, which is characterized in that a color filter layer (14, 34, 54, 74) and a transparent substrate (13, 33) are sequentially provided. , 53, 73), an adhesive layer (3, 23, 43, 63) and a resin layer (4, 24, 44, 64), the transparent substrate (13, 33, 53, 73) and the adhesive layer (3, 23, 43, 63) are in direct contact with each other, and electrode layers (5, 25, 45, 65) are buried in the subsequent layers (3, 23, 43, 63).

Here, the electrode layer (5, 25, 45, 65) is preferably a clip. It is held between the above-mentioned adhesive layer (3, 23, 43, 63) and the aforementioned resin layer (4, 24, 44, 64).

Further, the wiring layers (8, 28, 48, 68) are preferably provided adjacent to the aforementioned resin layers (4, 24, 44, 64). Further, it is preferable to provide a wiring layer (8, 28, 48, 68) on the opposite side of the wiring substrate (8, 28, 48, 68) from the transparent substrate (13, 33, 53, 73) Surfaces (4a, 28a, 48a, 68a) and surfaces (4a, 24a, 44a, opposite to the transparent substrate (13, 33, 53, 73) of the resin layer (4, 24, 44, 64) 64a), at the same height or at the same level. Alternatively, it is preferable to provide a wiring layer (8, 28), a groove portion (4x, 24x) is provided in the resin layer (4, 24), and the wiring layer (8) is provided in the groove portion (4x, 24x). 28).

Further, it is preferable that a further groove portion (24y) is provided in the resin layer (24), and a bridge layer (27) is provided in the further groove portion (24y), and the bridge layer (27) and the electrode are provided A transparent insulating layer (26) is disposed between the layers (25). Furthermore, it is preferably a surface (27a) of the bridge layer (27) opposite to the transparent substrate (33) and a surface opposite to the transparent substrate (33) of the resin layer (24) ( 24a), at the same height or at the same level.

Alternatively, it is preferable to provide a wiring layer (48, 68), a surface (48a, 68a) of the wiring layer (48, 68) opposite to the transparent substrate (53, 73), and the above-mentioned bonding layer (43). The surfaces (43a, 63a) on the opposite side to the transparent substrate (53, 73) of 63) are at the same height or in the same horizontal plane. Further, it is preferable that the wiring layers (48, 68) are provided by being sandwiched by the subsequent layers (43, 63).

Here, the resin layer (4, 24, 44, 64) may include a material that has photohardened the photosensitive resin, or the resin layer (4, 24, 44, 64) may be a thermoplastic resin. Resin.

Further, it is preferable to provide wiring layers (8, 28, 48, 68) and the wiring layers (8, 28, 48) measured from the opposite sides of the color filter layers (14, 34, 54, 74). 68) The reflectance is 20% or less.

Still another example of the means for solving the problems of the present invention is a display device provided with the aforementioned color filter substrate with electrodes attached thereto.

Still another example of the means for solving the problems of the present invention is a method for producing an electrode release film comprising: preparing a film substrate (11, 31), a release layer (10, 30), and the release layer in advance ( 10, 30) a step of directly laminating the resin material layer on the layer, and forming the resin material layer to form a resin layer (4, 24) having the groove portions (4x, 24x) a step of forming a wiring layer (8, 28) by applying a wiring material to the groove portions (4x, 24x), a step of laminating an electrode layer (5, 25) over the resin layer (4, 24), and the electrode layer (5, 25) The step of laminating the layers (3, 23).

Here, in the step of applying the wiring material to the groove portions (4x, 24x), it is preferable to scrape the wiring material into a printed ink shape by a blade-shaped or blade-shaped member, and the groove portion (4x, 24x) The step of embedding the aforementioned wiring material.

Further, it is preferable to include a step of developing or molding the resin material layer to form a resin layer (24) having a further groove portion (24y), and coating a bridge material in the further groove portion (24y) to form a bridge material a step of the bridge layer (27), laminating a transparent insulating layer over the bridge layer (27) (26) a step of laminating the electrode layer (25) over the transparent insulating layer (26).

Further, preferably, the resin material layer is developed or molded to form a resin layer (24) having a groove portion (24x), and the resin material layer is developed or molded to form a resin material layer. Further steps of the resin layer (24) of the groove portion (24y). Further, it is preferable to simultaneously perform the steps of applying the wiring material to the groove portion (4x) and applying the bridge material to the further groove portion (24y).

Still another example of the means for solving the problem of the present invention is a method for producing an electrode release film comprising: preparing a film substrate (51, 71), a release layer (50, 70), and the release layer in advance ( 50, 70) a step of directly laminating a layer of a resin material layer, and the resin material layer is developed or molded to form a resin layer (44, 64) on the peeling layer (50, 70). a step of forming a pattern in a place and an unformed portion, forming a wiring layer (48, 68) at a portion where the resin layer (44, 64) is not formed, and forming an electrode layer on the resin layer (44, 64) (45, 65), and the step of laminating the subsequent layers (43, 63) over the electrode layers (45, 65).

Here, the step of forming the wiring layer (48, 68) at a place where the resin layer (44, 64) is not formed is preferably a step of printing a wiring material, or a photolithography after the film formation of the wiring material is formed. The step of pattern formation.

Moreover, it is preferable to further include a step of laminating a transparent insulating layer (66) on the electrode layer (65), and a step of forming a further electrode layer (69) on the transparent insulating layer (66).

Still another example of a means for solving the problems of the present invention is a method of manufacturing a color filter substrate with electrodes, comprising: preparing a color filter layer (14, 34, 54, 74) and a transparent substrate. The step of laminating the layers (13, 33, 53, 73), and the bonding layer (3, 23, 43, 63) of the electrode stripping film (12, 32, 52, 72) produced by the above-described manufacturing method The surface (3b, 23b, 43b, 63b) on the opposite side of the peeling layer (10, 30, 50, 70) is bonded to the aforementioned color filter layer of the transparent substrate (13, 33, 53, 73) 14, 34, 54, 74) the steps of the opposite side surfaces (13a, 33a, 53a, 73a), and peeling the peeling layer (10, 30, 50, 70) from the resin layer (4, 24, 44, 64) ) The steps.

Still another example of the means for solving the problem of the present invention is a method of manufacturing a display device, which is a method of manufacturing a display device including the above-described method for manufacturing a color filter substrate with an electrode, further comprising: On the surface of the filter layer (14, 34, 54, 74) opposite to the transparent substrate (13, 33, 53, 73), the TFT substrate is bonded in advance, and is electrically connected to the electrode layer (5, 25). , 45, 65) steps of the driving circuit of the touch sensor.

According to the present invention, it is possible to provide an electrode peeling film having high yield or stable operation, or having a versatility corresponding to various display designs, a color filter substrate with electrodes, and the like.

3, 23, 43, 63‧‧‧ layers

4, 24, 44, 64‧‧‧ resin layer

4x, 24x‧‧‧ ditch

5, 25, 45, 65‧‧‧ electrode layer (transparent electrode)

8, 28, 48, 68‧‧‧ wiring layers

69‧‧‧ Further electrode layer

10, 30, 50, 70‧‧‧ peeling layer

11, 31, 51, 71‧‧ ‧ film substrate

12, 32, 52, 72‧‧‧ electrode stripping film

13, 33, 53, 73‧‧‧ Transparent substrate

14, 34, 54, 74‧‧‧ color filter layers (CF)

15, 35, 55, 75‧‧‧ color filter substrate with electrodes

24y‧‧‧ further ditch

26, 66‧‧‧ Transparent insulation

27‧‧‧Bridge (bridge electrode)

102, 202‧‧‧TFT substrate

104, 204‧‧‧ liquid crystal layer

106, 206‧‧‧ polarizing plate

108, 208‧‧‧ backlight

110, 210‧‧ ‧ cover glass

112‧‧‧White organic light-emitting layer

100, 200‧‧‧ display devices

300‧‧‧Organic EL display

Fig. 1 is a view showing the schematic portion of the electrode release film of the first embodiment. An example of a longitudinal profile.

Fig. 2 is a schematic longitudinal sectional view showing a schematic portion of an electrode-attached color filter substrate according to the first embodiment.

Fig. 3 is a view showing an example of a longitudinal sectional view of a schematic portion of the electrode release film of the second embodiment.

Fig. 4 is a schematic longitudinal sectional view showing a schematic portion of an electrode-attached color filter substrate according to a second embodiment.

Fig. 5 is a view showing an example of a longitudinal sectional view of a schematic portion of the electrode release film of the third embodiment.

Fig. 6 is a schematic longitudinal sectional view showing a schematic portion of the electrode-attached color filter substrate of the third embodiment.

Fig. 7 is a view showing an example of a longitudinal sectional view of a schematic portion of the electrode release film of the fourth embodiment.

Fig. 8 is a schematic longitudinal sectional view showing a schematic portion of an electrode-attached color filter substrate according to a fourth embodiment.

Fig. 9 is a view showing an example of a schematic partial view showing the shape of an electrode of the electrode-attached color filter substrate of the second embodiment.

Fig. 10 is a view showing an example of a schematic partial view showing the shape of an electrode of the electrode-attached color filter substrate of the fourth embodiment.

Fig. 11 is a view showing an example of a longitudinal sectional view of a schematic portion of a display device using a color filter substrate with electrodes attached thereto.

Fig. 12 is a view showing an example of a schematic longitudinal section of an organic EL display using the electrode-attached color filter substrate of the present invention.

[Formation of the Invention]

Hereinafter, the form for carrying out the invention will be described using the drawings.

[First Embodiment]

In the first to second embodiments, an example of the electrode release film and the color filter substrate with electrodes according to the first embodiment of the present invention are shown.

Electrode Stripping Film

The electrode release film 12 of the present embodiment includes the film substrate 11, the release layer 10, the resin layer 4, and the adhesive layer 3 in this order. The release layer 10 and the resin layer 4 are in direct contact with each other. An electrode layer 5 is buried in the adhesive layer 3.

<film substrate>

The film substrate 11 may be any film having a good mold release property. The material of the film substrate 11 is not particularly limited. As the film substrate 11, it is preferable to use a resin in which a resin containing a fluorene-based material or a fluorine-based material for imparting mold release property is formed. A plastic film can be used as the film substrate 11. Further, a polyolefin such as polyethylene or polypropylene, or a film of 6-nylon, 6,6-nylon, PMMA (polymethyl methacrylate) or the like can be used. When the surface of the film substrate 11 has irregularities, unevenness marks are transferred on the resin layer 4 after peeling, or problems such as peeling failure occur. Therefore, the surface of the film substrate 11 is preferably smooth.

<peeling layer>

A release layer 10 is formed on one surface of the film substrate 11. As the release layer 10, a cured product such as a melamine resin, a polyolefin resin, a urethane resin, or a cellulose acetate can be used. The thickness of the peeling layer 10 is not particularly limited. However, the thickness thereof is preferably from 0.1 μm to 3 μm, for example, 1 μm. The material for forming the release layer may be applied by various well-known coating methods, and then dried to form a release layer. The aforementioned coating method can be, for example The outlet mode coating method, the curtain flow coating method, the roll coating method, the reverse roll coating method, the gravure coating method, the knife coating method, the bar coating method, the spin coating method, the micro gravure coating method, and the like.

<Resin layer>

The resin layer 4 is formed on the surface of the peeling layer 10 on the side opposite to the film substrate 11. The resin layer 4 is, for example, a layer obtained by exposing and curing a photosensitive resin. The photosensitive resin may be a negative photosensitive resin or a positive photosensitive resin. The material of the negative photosensitive resin is not particularly limited. However, the negative photosensitive resin is generally composed of a material containing at least a binder material, a photopolymerizable material, and a photopolymerization initiator. As the negative photosensitive resin, for example, materials described in Patent Documents 4 to 6 can be used. Further, the material of the positive photosensitive resin is not particularly limited. However, the positive photosensitive resin is generally formed of a material containing an alkali-soluble resin material, a photo-acid generating material, a compound containing an acid-decomposable functional group, or the like. As the positive photosensitive resin, for example, the materials described in Patent Documents 7 to 9 can be used.

The photosensitive resin can be formed by applying the above materials by various well-known coating methods and drying them. The coating method may be an exit mode coating method, a curtain flow coating method, a roll coating method, a reverse roll coating method, a gravure coating method, a knife coating method, a bar coating method, a spin coating method, a micro gravure coating method, or the like. The film thickness of the photosensitive resin is preferably 0.1 μm or more and 25 μm or less, for example, 5 μm, but is not limited thereto. Typically, the photosensitive resin has almost no change in film thickness before and after curing. Therefore, the film thickness is described later as the film thickness after hardening. When the film thickness is preferably 25 μm or less, formation of a high-definition pattern is facilitated. When the film thickness is 0.1 μm or more, unevenness does not occur. It is distorted in appearance and shows sufficient adhesion to adjacent layers. The photosensitive resin can form a soluble portion and an insoluble portion in the developing solution by light irradiation through the photomask. The soluble portion in the developing solution of the photosensitive resin is dissolved into the groove portion 4x by development, and a pattern of the resin layer 4 formed of the insoluble portion can be formed. The developing liquid system can be appropriately selected depending on the type of the photosensitive resin or its material, and generally can be an aqueous alkali solution or an organic solvent.

<Next layer>

On the resin layer 4, an adhesive layer 3 is formed. As the adhesive layer 3, a well-known heat sealable adhesive or an adhesive can be used. For example, a vinyl acetate resin, an ethylene vinyl acetate copolymerization resin, a vinyl chloride-vinyl acetate resin, an acrylic resin, a butyral resin, an epoxy resin, a polyester resin, a polyurethane resin, etc. are mentioned. Acrylic adhesive, rubber-based adhesive, crepe-based adhesive, urethane-based adhesive, and the like. The thickness of layer 3 is then preferably in the range of 0.5 μm to 10 μm, for example 2 μm.

A separator (not shown) which is premised on the peeling may be superposed on the surface 3b of the adhesive layer 3 on the side opposite to the peeling layer 10. The separator is used to wind the electrode release film 12 after forming the adhesive layer 3 into a roll shape, or to overlap it when it is stacked in a planar shape. The separator may be formed, for example, of a resin containing an epoxy resin or a fluorine-based material which is easily peelable to a film made of polyolefin such as polyethylene or polypropylene, PET, PMMA or the like.

<electrode layer>

The electrode layer 5 is buried in the adhesive layer 3. Furthermore, the electrode layer 5 is embedded in the adhesive layer 3, and includes at least a part of the electrode layer 5, typically It means all in the range of the height or thickness direction of the subsequent layer 3. In the example shown in FIGS. 1 to 2, the electrode layer 5 is sandwiched between the resin layer 4 and the adhesive layer 3. As the electrode layer 5, any one of indium oxide, zinc oxide, and tin oxide, or a mixed oxide of two or three types thereof, and other additives may be used as the inorganic compound. However, the electrode layer 5 can be used in various materials according to the purpose and purpose, and is not particularly limited. At present, the most reliable material with many achievements is indium tin oxide (ITO).

The most common transparent conductive material as the electrode layer 5 is indium tin oxide (ITO). When indium tin oxide (ITO) is used as the electrode layer 5, the content ratio of the tin oxide doped in the indium oxide is selected in an arbitrary ratio according to the specifications required for the apparatus. For example, the sputtering target material used for crystallizing the film for the purpose of improving mechanical strength preferably contains less than 10% by weight of tin oxide. In order to make the film amorphous and flexible, the content of the tin oxide is preferably 10% by weight or more. Further, when the film is required to have a low electric resistance, the content of the tin oxide is preferably in the range of 2% by weight to 20% by weight.

The method for producing the electrode layer 5 can be any film forming method as long as the film thickness can be controlled, and the dry method for forming a thin film is excellent. As the film formation method, a physical vapor deposition method such as a vacuum deposition method or sputtering, or a chemical vapor deposition method such as a CVD method can be used. In particular, in order to form a film of a uniform film quality over a large area, a sputtering method of process stabilization and film densification is preferred.

As the electrode layer 5, a material such as a metal nanoparticle, a metal nanowire, a carbon nanotube, a graphene, or a conductive polymer can be used. The electrode layer 5 can be dissolved or dispersed in an organic solvent or an alcohol, water, or the like. It is formed by coating and drying. Further, in view of sheet resistance or transparency as a transparent conductive film, a metal nanowire is preferably used.

The metal nanowire system can be mixed with a resin or the like, and dispersed in water, an alcohol, an organic solvent, or the like to adjust the liquid. After coating, the metal nanowires are mutually entangled by drying to form a mesh shape, and a small amount of conductive material can form a good conductive path. In this way, the resistance value of the conductive layer can be further lowered. Further, when such a mesh shape is formed, the opening of the gap portion of the mesh is large. Therefore, even if the fibrous conductive material itself is not transparent, good transparency can be achieved as a coating film.

Specific examples of the metal of the metal nanowire include iron, cobalt, nickel, copper, zinc, ruthenium, rhodium, palladium, silver, cadmium, osmium, iridium, platinum, and gold. From the viewpoint of conductivity, gold, silver, copper, platinum, and gold are preferred.

As a method of forming the electrode layer 5 on a transparent substrate using the above-described metal nanowire or the like, various well-known coating methods can be used. Examples of the coating method include spray coating, bar coating, roll coating, die coating, inkjet coating, screen coating, dip coating, and the like.

If the film thickness of the electrode layer 5 is too thin, there is a tendency that sufficient conductivity as a conductor cannot be achieved. When the film thickness of the electrode layer 5 is too thick, the transparency tends to be impaired due to an increase in the haze value and a decrease in the total light transmittance. Appropriate adjustments are usually made between 10 nm and 10 μm. However, when the conductive material such as the metal nanowire itself is opaque, it is easy to lose transparency due to an increase in film thickness, and a conductive layer having a thinner film thickness is often formed. At this time, there are a large number of conductive layers in the opening portion. When measured by a contact type film thickness meter, the average film thickness is preferably in the range of 10 nm to 500 nm, more preferably 30 nm to 300 nm, and most preferably 50 nm to 150 nm.

<wiring layer>

The wiring layer 8 is provided adjacent to the resin layer 4 in contact with each other. In the example shown in FIGS. 1 to 2, the groove portion 4x is provided in the resin layer 4, and the wiring layer 8 is provided in the groove portion 4x. The wiring layer 8 can be formed by electrically treating a wiring material such as a metal material precursor. As the metal material precursor, metal nanoparticles having a particle diameter of 100 nm or less, for example, a particle diameter of 60 nm, or metal oxide nanoparticles, or particles having a size of submicron to several μm, or flakes, fibers, or powders can be used. An ink, paste or dispersion as a main raw material, or an ink, solution or the like containing a metal complex. The concentration (solid content concentration) of the ink or the like of the metal material precursor is 10% by weight or more and 90% by weight or less, for example, 50% by weight based on the precursor material. As the metal, at least one element selected from the group consisting of gold, silver, copper, aluminum, iron, titanium, molybdenum, indium, tin, and antimony can be preferably used. When a metal oxide is used, indium tin oxide is preferably used, and other tin oxide, zinc oxide, or the like can be used. Further, instead of the metal material, a conductive carbon material such as graphite, carbon nanotube, graphene or fullerene may be used. These carbon materials are black and have a low reflectance characteristic. Therefore, when a display device using a color filter substrate with an electrode is formed, it is possible to make the electrode inconspicuous by being disposed on the visual recognition side, which is a better use example. When a carbon material is not used, a compound such as a metal oxide or a metal nitride may be disposed on the visual recognition side. In this way, the anti-reflection function can be imparted, the reflectance can be reduced, and the electrode can be made inconspicuous in the same manner.

The ink or the like of the precursor of the metal material can be applied by various well-known coating methods. The coating method may, for example, be an exit mode coating method, a curtain flow coating method, a roll coating method, a reverse roll coating method, or a gravure coating method. , knife coating method, bar coating method, spin coating method, micro gravure coating method, and the like. After coating by the above-described coating method, it is scraped off with a doctor blade or a doctor blade, and ink or the like can be filled in the groove portion 4x formed in the resin layer 4. At this time, the depth of the groove portion 4x is preferably formed to be, for example, 500 nm or more and 10 μm or less.

The wiring layer 8 can be formed by firing a metal material precursor or the like into electrical conductivity. The calcination method can be suitably selected in accordance with the material or properties of the precursor. In the thermal baking, a hot air oven, an IR heater, a hot plate, or the like can be used. As a photo-baking, a xenon flash lamp is generally used. Further, conductivity can be imparted by chemical treatment.

When the electrode release film 12 is produced, a film material layer 11 and a release layer 10 and a resin material layer (not shown. The layer corresponding to the resin layer 4) directly laminated on the release layer 10 are prepared in this order. body. For example, the film substrate 11 is prepared, and the release layer 10 is applied onto the film substrate 11 and dried. A resin material can be prepared by applying a resin material thereon as a laminate.

Next, the resin material layer is developed or molded to form a resin layer having the groove portion 4x, and the wiring material is applied to the groove portion 4x to form the wiring layer 8. For example, the exposed portion is exposed to light in a state where the unexposed portion is shielded by the photomask. After washing and drying, it is baked to form a resin layer having a predetermined pattern. Next, after printing on the resin layer by printing a conductive ink as a wiring material, the ink can be scraped off by a doctor blade. In this manner, the ink can be buried in the groove of the resin layer and exposed to light after drying.

Next, the electrode layer 5 is laminated on the resin layer 4, and the subsequent layer 3 is laminated on the electrode layer 5 to produce the electrode release film 12. For example, the electrode material layer is formed into a film by sputtering, and is etched by photolithography. After patterning, an adhesive layer was applied by printing to prepare an electrode release film.

In the present embodiment, the electrode release film 12 is formed of at least four layers of the film substrate 11, the release layer 10, the resin layer 4 directly contacting the release layer 10, and the adhesion layer 3 (with the electrode layer 5 embedded therein). Therefore, the electrode release film 12 can be formed extremely thin. Further, the adhesive layer 10 can be peeled off (i.e., transferred) from the resin layer 4 by subsequently adhering the adhesive layer 3 to a transparent substrate or the like. Therefore, even when the peeling layer 10 is damaged, the resin layer 4 may be damaged. Thus, the resin layer 4 can be processed irrespective of the influence on the peeled peeling layer 10.

In particular, since the electrode layer 5 is buried in the adhesive layer 3, the electrode layer 5 can be strongly held by the adhesive layer 3. When the peeling layer 10 is peeled off from the resin layer 4, peeling can be performed without peeling off the electrode layer 5. Further, in the example shown in Fig. 1, since the electrode layer 5 is sandwiched between the resin layer 4 and the adhesive layer 3, the electrode layer 5 can be strongly held by the resin layer 4 and the adhesive layer 3. When the peeling layer 10 is peeled off from the resin layer 4, the peeling layer 10 can be peeled off without peeling off the electrode layer 5.

In the example shown in Fig. 1, the surface 8a on the side of the peeling layer 10 of the wiring layer 8 and the surface 4a on the side of the peeling layer 10 of the resin layer 4 are at the same height or in the same horizontal plane. Further, a groove portion 4x is provided in the resin layer 4, and a wiring layer 8 is provided in the groove portion 4x. According to the above configuration, both side faces of the wiring layer 8 can be strongly held in the resin layer 4. When the peeling layer 10 is peeled off from the resin layer 4, the wiring layer 8 reliably remains in the resin layer 4, and the wiring layer 8 does not remain in the peeling layer 10, and can be peeled off favorably. The wiring layer 8 is strongly held by the two faces of the resin layer 4. Therefore, when the peeling layer 10 is peeled off from the resin layer 4, the resin layer 4 is such that the wiring layer 8 is surely left, and the wiring layer 8 is not caused. It remains in the peeling layer 10 and can be peeled off favorably.

After the electrode stripping film 12 as shown in Fig. 1 is produced, for example, the adhesive layer 3 is bonded to a transparent substrate on a color filter layer (corresponding to the layer of the color filter layer 14 of Fig. 2). The glass surface corresponding to the layer of the transparent substrate 13 of Fig. 2 (corresponding to the surface of the surface 13a of the transparent substrate 13 on the opposite side to the color filter layer 14 of Fig. 2). Then, by peeling the peeling layer 10 from the resin layer 4, the electrode-attached color filter substrate 15 as shown in Fig. 2 can be produced.

"Color Filter Substrate with Electrode"

The color filter substrate 15 with electrodes attached to the second embodiment includes the color filter layer 14, the transparent substrate 13, the adhesive layer 3, and the resin layer 4 in this order. The transparent substrate 13 and the subsequent layer 3 are in direct contact with each other. An electrode layer 5 is buried in the adhesive layer 3.

<Transparent substrate>

As the transparent substrate 13, a glass or plastic film can be used. The transparent base material 13 is not particularly limited as long as it has sufficient strength in the film forming step and the subsequent steps, and has excellent transparency and good surface smoothness. As the glass, an alkali-free glass for display use is preferably used. Examples of the plastic film include a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polycarbonate film, a polyether ruthenium film, and a polyruthenium film. , a polyarylate film, a cyclic polyolefin film, a polyimide film, and the like. Further, the transparent substrate 13 must have high transparency because it is typically used for a color filter of a display device, and it is preferable to use a total light transmittance of 85% or more. The transparent substrate 13 is designed to improve the adhesion to each layer, and can be subjected to corona treatment. Low temperature plasma treatment, ion bombardment treatment, drug treatment, etc. are pretreated.

<Color filter layer>

On the surface of the transparent substrate 13 opposite to the adhesive layer 3, a color filter layer 14 is formed. The color filter layer 14 is typically referred to as a layer comprising at least a black matrix and red, green, and blue colored layers. The color filter layer 14 can be formed by performing exposure, baking, or the like after applying a coloring photosensitive ink. The coating method may be, for example, spin coating, spray coating, inkjet, or the like. Further, a transparent electrode may be formed by covering the black matrix and the coloring layer. The colored layer is made of, for example, an acrylic resin having a thickness of 0.5 to 3.0 μm in which pigments of respective colors are dispersed. The black matrix is formed, for example, of an acrylic resin having a thickness of 0.5 to 3.0 μm in which a black pigment is dispersed or a metal film having a thickness of 10 to 200 nm. The color filter layer 14 can also be a yellow, cyan, magenta or white (colorless) layer. The electrode layer 5 is made of, for example, ITO having a thickness of 10 to 200 nm. Further, a transparent resin layer may be formed on the color filter layer 14 for the purpose of planarization or protection.

The adhesive layer 3, the electrode layer 5, and the resin layer 4 are formed in this order on the surface of the transparent substrate 13 opposite to the color filter layer 14. When the adhesive layer 3, the electrode layer 5, and the resin layer 4 are used as the electrodes on the color filter substrates (the transparent substrate 13 and the color filter layer 14), the electrode layer 5 functions as an electrode.

In the electrode release film 12 of Fig. 1, the adhesive layer 3 is bonded to the glass surface of the transparent substrate 13 of the color filter layer 14. Then, the release layer 10 is peeled off together with the film substrate 11. In this manner, the color filter substrate 15 with the electrodes attached can be easily formed on the color filter substrate (the transparent substrate 13 and the color filter layer 14). This procedure is called transfer. Then layer 3 When it is bonded by a material, heat or UV is applied as appropriate, and it is followed by pressurization.

Further, the position to be bonded is preferably determined by a registration camera, an alignment mark, and the like. The wiring layer 8 is preferably disposed so as to be invisible from the visual recognition side of the display device, and is superposed on the frame portion formed by the black material of the color filter layer 14.

In the present embodiment, at least four layers of the color filter substrate 14, the transparent substrate 13, and the adhesive layer 3 (the embedded electrode layer 5) directly contacting the transparent substrate 13 and the resin layer 4 are preferably used. A color filter substrate 15 with electrodes is formed. Therefore, the color filter substrate 15 with electrodes can be formed extremely thin. In other words, the adhesive layer 3 can be peeled off from the resin layer 4 while the adhesive layer 3 is next to the transparent substrate 13 . Therefore, in the color filter substrate 15 with the electrodes, the peeling layer and the film substrate do not remain, and the color filter substrate 15 with the electrodes can be formed extremely thin.

In particular, since the electrode layer 5 is buried in the adhesive layer 3, the electrode layer 5 can be strongly held by the adhesive layer 3. Moreover, in the example shown in FIG. 2, the electrode layer 5 is sandwiched between the resin layer 4 and the adhesive layer 3. Therefore, the electrode layer 5 can be strongly held by the resin layer 4 and the adhesive layer 3.

Moreover, the surface 8a of the wiring layer 8 on the opposite side to the transparent base material 13 and the surface 4a of the resin layer 4 on the opposite side to the transparent base material 13 are located at the same height or in the same horizontal plane. Therefore, the resin layer 4 can be further processed from the wiring layer 8 directly to the external driving circuit without further processing.

[Second Embodiment]

In the third to fourth and ninth embodiments, an example of the electrode release film of the second embodiment of the present invention and the color filter substrate with the electrode are shown. at this time, Can be used as a touch sensor on a color filter substrate. In the second embodiment, the reference numerals of the reference numerals in the first embodiment are denoted by the reference numerals of 20 in the same manner as the materials or members described in the first embodiment. The description of the first embodiment will be referred to.

In the electrode release film 32 of the present embodiment, a further groove portion 24y is provided in the resin layer 24, a bridge layer 27 is provided in the further groove portion 24y, and a transparent insulating layer is provided between the bridge layer 27 and the electrode layer 25. 26. Further, the surface 27a on the side of the peeling layer 30 of the bridge layer 27 and the surface 24a on the side of the peeling layer 30 of the resin layer 24 are at the same height or in the same horizontal plane.

<bridge layer>

In the electrode stripping film 32 of Fig. 3, a bridge layer (also referred to as a bridge electrode) 27 can be formed by electrically treating a bridge material such as a metal material precursor. Further, the bridge material can be the same as the wiring material of the wiring layer 28. The bridge layer 27 and the wiring layer 28 may be simultaneously formed by electrically baking a precursor of a metal material or the like, or may be separately formed.

When the wiring layer and the bridge layer are simultaneously formed, the reflectance of the wiring layer 28 measured from the opposite side of the color filter layer 34 (that is, the side of the resin layer 24 and the wiring layer 28) is preferably 20% or less. This is difficult to be visually recognized when the bridge layer is formed at a position overlapping on the display portion of the display device. The reflectance is the reflectance in the entire wavelength band of 400 nm to 780 nm measured by a spectrophotometer (Hitachi High-Tech Co., Ltd., Hitachi Spectrophotometer U-4100).

<Transparent insulation layer>

A transparent insulating layer 26 is formed over the bridge layer 27. The transparent insulating layer 26 can be formed in the same manner as the material of the resin layer 24. Or, Various printing methods such as screen printing, inkjet, gravure lithography, flexography, and the like are used. The transparent insulating layer 26 is disposed such that the electrode layer 25 and the bridge layer 27 are not electrically short-circuited with each other. As the transparent insulating layer 26, a material which can obtain sufficient insulating properties is preferably selected. It is preferable to select a film thickness in the range of 0.1 to 10 μm in accordance with the insulating property, for example, 2 μm.

In the example shown in Fig. 3, the surface 27a on the side of the peeling layer 30 of the bridge layer 27 and the surface 24a on the side of the peeling layer 30 of the resin layer 24 are at the same height or in the same horizontal plane. Therefore, both side faces of the bridge layer 27 are strongly held by the resin layer 24, and when the peeling layer 30 is peeled off from the resin layer 24, the bridge layer 27 can surely remain in the resin layer 24. Further, the bridge layer 27 does not remain on the peeling layer 30, and can be peeled off favorably. When the bridge layer 27 is strongly held by the two faces of the resin layer 24, when the peeling layer 30 is peeled off from the resin layer 24, the resin layer 24 can surely remain in the wiring layer 28. Moreover, the wiring layer 28 is not left in the peeling layer 30, and it can be peeled favorable.

[Third embodiment]

In the fifth to sixth embodiments, an electrode peeling film and an electrode-attached color filter substrate according to a third embodiment of the present invention are shown. In the third embodiment, the reference symbols are added only to the first and second embodiments, respectively, in the same or common or similar members to the materials and members described in the first and second embodiments. There are 40 and 20 reference symbols, and the description of the first and second embodiments can be used.

In Fig. 5, a portion where the resin layer 44 is formed on the peeling layer 50 and a portion where it is not formed are patterned by developing or molding the resin material layer. At this time, the resin layer 44 can be utilized, for example, by light. The cover is exposed to light in a state where the unexposed portion is shielded from light, and is exposed to light after washing and drying, and is formed as a resin layer having a predetermined pattern. Further, the electrode layer 45 is formed on the resin layer 44 as an electrode pattern. The electrode layer 45 can be formed, for example, by sputtering ITO and then etched by photolithography to form a desired pattern. Further, the wiring layer 48 can be formed where the resin layer 44 is not formed. At this time, the wiring layer 48 can be formed, for example, by a printed wiring material or a thin film of a wiring material, and then etched by photolithography. The electrode layer 45 and the wiring layer 48 can be electrically short-circuited and formed as a circuit.

In FIG. 5, the wiring layer 48 is formed with the adhesive layer 44 therebetween, but the resin layer 44 may be formed.

In Fig. 5, the surface 48a on the side of the peeling layer 50 of the wiring layer 48 and the surface 43a on the side of the peeling layer 50 of the adhesive layer 43 are at the same height or in the same horizontal plane. The wiring layer 48 is provided by being sandwiched between the resin layer 44 and the adhesive layer 43. According to the above configuration, since both side faces of the wiring layer 48 are strongly held by the resin layer 44 and the adhesive layer 43, when the peeling layer 50 is peeled off from the resin layer 44, the wiring layer 48 can surely remain in the resin layer 44 and Next between layers 43. Moreover, the wiring layer 48 does not remain on the peeling layer 50, and can be peeled off favorably. When the resin layer 44 and the adhesive layer 44 strongly hold the wiring layer 48, when the peeling layer 50 is peeled off from the resin layer 44, the resin layer 44 and the adhesive layer 43 can reliably retain the wiring layer 48. Moreover, the wiring layer 48 is not left on the peeling layer 50, and it can be peeled favorably.

Further, the surface 48 on the side of the peeling layer 50 of the wiring layer 48 and the surface 43a on the side of the peeling layer 50 of the adhesive layer 43 are at the same height or at the same horizontal plane, and the wiring layer 48 is sandwiched by the adhesive layer 43. By In the above configuration, since both side faces of the wiring layer 48 are strongly held by the adhesive layer 43, when the peeling layer 50 is peeled off from the resin layer 44, the wiring layer 48 can be surely left between the adhesive layers 43. Further, the wiring layer 48 does not remain on the peeling layer 50, and can be peeled off favorably. When the wiring layer 48 is strongly held by the two faces of the adhesive layer 43, when the peeling layer 50 is peeled off from the resin layer 44, the subsequent layer 43 can reliably leave the wiring layer 48. Further, the wiring layer 48 is not left on the peeling layer 50, so that it can be peeled off favorably.

[Fourth embodiment]

In the seventh to eighth and tenth drawings, an example of the electrode release film and the color filter substrate with electrodes according to the fourth embodiment of the present invention is shown. In this case, it can also be used as a touch sensor on a color filter substrate. In the fourth embodiment, the first, second, and third embodiments are attached to the members of the fourth embodiment, the second embodiment, the second embodiment, and the third embodiment. The reference numerals of the form are denoted by reference numerals of 60, 40, and 20, and the description of the first, second, and third embodiments can be used.

In FIG. 7, a transparent insulating layer 66 is laminated on the electrode layer 65, and a further electrode layer 69 is formed on the transparent insulating layer 66.

When the transparent insulating layer 66 and the further electrode layer 69 are patterned in the same shape as the electrode stripping film 72 of Fig. 7, the transparent insulating layer 66 and the further electrode layer 69 can be laminated in a uniform planar shape in advance. Then, a pattern can be formed by development or etching of the transparent insulating layer 66. At this time, it is more preferable to use a metal nanowire which is excellent in patterning property as the electrode layer 65 and the further electrode layer 69.

The electrode formed in the electrode-attached color filter substrate 75 shown in Figs. 8 and 10 is such that the electrode layer 65 formed in one direction can be combined with Further electrode layers 69 formed in the direction of the intersection are paired and used as electrodes of the capacitive touch sensor. At this time, each of the electrode layers 65, 69 can be a pseudo diamond pattern in plan view. The interior of the quasi-diamond pattern can be composed of thin wire electrodes. At this time, by making the fine line width 5 μm or less, an electrode pattern having light transmissivity can be formed.

As shown in Figs. 7 and 8, the electrode layer 65 can be partially sandwiched between the resin layer 64 and the adhesive layer 63 by using a part of the electrode layer 65. The electrode layer 65 may also be indirectly sandwiched between the resin layer 64 and the adhesive layer 63 through the transparent insulating layer 66 and the further electrode layer 69.

The electrode-attached color filter substrates 15, 35, 55, and 75 produced as described above can have a plurality of faces attached to one glass substrate. At this time, by dicing the color filter substrates 15 , 35 , 55 , and 75 to which the electrodes are attached or the state in which the TFT substrate is bonded, the singulation can be efficiently performed in plural. Examples of the singulation method include a diamond knife cutting process, a slicing process, a water jet process, an etching process, and a laser process. After singulation, the wiring layers 8, 28, 48, and 68 connected to the electrode layers 5, 25, 45, and 65 can be connected to the driving IC through an anisotropic conductive adhesive (ACF) and a printed substrate (FPC). And so on, it acts as a capacitive touch panel. At this time, on the wiring layers 8, 28, 48, and 68 drawn from the electrode layers 5, 25, 45, and 65, the FPC is connected to the driving IC of the touch sensor via the ACF thermocompression bonding FPC. The TFT substrate can be connected to the driver IC and the FPC, and connected to the drive circuit.

Display device

Examples of the display device having the electrode-attached color filter substrate of the present invention include a liquid crystal display, an organic EL display, and an electronic device. Paper, MEMS display, reflective or semi-transmissive liquid crystal display, etc.

As an example of the display device having a liquid crystal layer, a structure having the structure shown in Fig. 11 can be cited. In the display device 100 of FIG. 11, a liquid crystal layer 104 is formed between the color filter substrates 15, 35, 55, 75 with electrodes and the TFT substrate 102. A polarizing plate 106 and a cover glass 110 are formed in this order on the surface of the color filter substrates 15, 35, 55, and 75 on which the electrodes are attached, on the side opposite to the liquid crystal layer 104. A polarizing plate 106 and a backlight 108 are formed in this order on the surface of the TFT substrate 102 opposite to the liquid crystal layer 104.

In the TFT substrates 102 and 202, a plurality of scanning lines are formed at regular intervals. Further, above the scanning line, a plurality of signal lines are formed at regular intervals. The scanning lines and the signal lines are arranged to intersect each other with an insulating film. Therefore, a thin film transistor (TFT) as a switching element is disposed in the vicinity of the intersection of the scanning line and the signal line. Through the TFT, the signal line is supplied with a display signal to the pixel electrode. The pixel electrode is formed, for example, of a transparent conductive film of ITO or the like. The display area of the liquid crystal display element is composed of a plurality of pixels. The display area is usually formed in a shape close to a rectangle. Further, in the display element, a frame area provided to surround the display area is disposed.

The liquid crystal layers 104 and 204 can be formed using well-known materials, and the color filter substrates 15, 35, 55, and 75 with electrodes are enclosed between the TFT substrates 102 and 202. At this time, the surfaces of the color filter layers 14, 34, 54, 74 and the TFT substrates 102, 202 of the color filter substrates 15, 35, 55, and 75 to which the electrodes are attached are formed by offset printing or the like. Orientation film. Then, the liquid crystal layer 104 is sealed by performing a rubbing treatment. And 204, the liquid crystal molecules can be arranged in a certain direction.

The polarizing plates 106 and 206 disposed on both sides of the liquid crystal cell each have an absorption axis in a substantially orthogonal direction. By the direction of the linear polarization controlled by the liquid crystal, it is possible to determine the lighting, gray scale, and light-off of each pixel.

The backlights 108 and 208 are attached to the polarizing plates 106 and 206 on the reverse visual recognition (back surface) side by a material or the like. The backlights 108 and 208 illuminate the polarizing plates 106 and 206 with planar light. As the backlights 108 and 208, for example, a general configuration including a light source, a light guide plate, a cymbal sheet, or the like can be used.

The cover glass 110, 210 can be connected to the four sides of the polarizing plates 106, 206 on the visual recognition side or the four sides of the display casing by double-sided tape or the like, or can be transparently optically bonded to fully cover the display portion including the liquid crystal display. Hehe. The cover glass 110, 210 is formed of chemically strengthened glass or a transparent resin or the like. Thereby, the display devices 100 and 200 are completed.

When the display devices 100 and 200 are manufactured, for example, the color filter substrates 15 , 35 , 55 , and 75 with the electrodes and the TFT substrates 102 and 202 are sandwiched by the polarizing plates 106 and 206, and the liquid crystal layers 104 and 204 are formed. The LCD cell. Then, the backlights 108 and 208 are disposed on the back surface, and the cover glasses 110 and 210 are disposed on the display surface. In this way, the display device 100, 200 can be provided, preferably a liquid crystal display of an electrostatic capacitance type touch sensor integrated type.

The electrodes of the electrode stripping films 12, 32, 52, and 72 may be previously applied to the color filter substrate (the color filter layers 14, 34, 54, 74 and the transparent substrates 13, 33, 53, 73). The upper transfer is formed and then the display is made. Alternatively, the electrodes of the electrode stripping films 12, 32, 52, and 72 may be turned on the back side of the color filter substrate after the display is made. Printed. When the latter process is used, the glass (transparent substrate 13, 33, 53, 73) of the color filter substrate in the crystallized display and the both sides of the glass which becomes the TFT substrate are dissolved by a chemical solution such as hydrofluoric acid. , can be thinned. Further, the transparent base material 13, 33, 53, 73, on which the color filter layer is formed, may be bonded to the TFT substrate by an electrode or the like, and formed in a display device for cell formation.

Organic EL Display

An example of the structure of the organic EL display is shown in Fig. 12. For the TFT substrate 102 on which TFTs are formed on the glass, a white organic light-emitting layer 112 is formed. In this manner, a transparent upper electrode layer was formed to form an organic EL light-emitting device structure. Then, the color filter substrates 15, 35, 55, and 75 to which the electrodes are attached are bonded via a sealant having a moisture absorbing ability. In this manner, the organic EL display 300 is obtained by forming a layer having a capacitance type touch sensor, a color filter, and a sealing glass. The white organic light-emitting layer 112 is composed of a hole transport layer, a hole injection layer, a light-emitting layer, an electron injection layer, an electron transport layer, and the like, and can be formed using a well-known material.

[Examples]

Hereinafter, the present invention will be described in detail by way of specific examples. The examples are intended for the purpose of illustration. The invention is not limited by the examples.

<Example 1>

A display device corresponding to the display device 100 of Fig. 11 is produced.

First, an electrode release film corresponding to the electrode release film of Fig. 3 was produced. As a film substrate, 50 μm thick PET was prepared, and a urethane resin was applied as a release layer by gravure printing, and dried at 40 ° C for 1 minute. Next, a negative photosensitive acrylic resin was applied by a die coater and dried at 90 ° C for 1 minute. Then, the light was exposed to light at 400 mJ/cm ^{2 in a} state where the unexposed portion was shielded by a photomask. After washing with 1.5 wt% TMAH, washing with pure water and drying, the film was baked at 150 ° C for 3 minutes to prepare a pattern of a photosensitive resin to form a resin layer. Further, the pattern shaded by the mask is formed to have a width corresponding to the wiring layer 28 of the electrode-attached color filter substrate 35 of FIGS. 4 and 9 with a width of 10 μm, and is formed to have a bridge layer 27 with a width of 3 μm. section.

Next, a copper nanoparticle-carbon particle mixed material was formed as a wiring layer and a bridge layer. At this time, the dispersed ink of the copper nanoparticles having an average particle diameter of 80 nm and the carbon particles having an average particle diameter of 200 nm was applied by gravure printing, and then the ink was scraped off with a doctor blade. In this manner, the ink was embedded in the pattern prepared by the above-mentioned photosensitive resin, and dried at 120 ° C for 5 minutes. Then, it was made conductive by irradiating 5 J/cm ² with a xenon flash lamp.

Subsequently, a transparent insulating layer was formed in a thickness of 2 μm so as not to cover both ends of the bridge layer. The pattern was applied by screen printing using a UV-curable acrylic resin as a transparent insulating layer. Then, it was hardened by UV irradiation of 200 mJ/cm ² . Next, as an electrode layer, ITO (indium tin oxide) was formed into a film by DC magnetron sputtering at a thickness of 30 nm, and patterned by photolithography. The pattern forms a portion corresponding to the electrode layer 25 of the electrode-attached color filter substrate 35 of Figs. 4 and 9. At this time, a dry film resist of 15 μm thick was used in the resist. A mixture of diluted hydrochloric acid and diluted nitric acid was used as an etchant.

Furthermore, as an adhesive layer, the amine base is coated by gravure printing. An acid ester acrylic resin. An electrode release film was produced by laminating and winding a lightly peeled polyethylene film with a ruthenium-based release layer.

On the other hand, a liquid crystal cell was produced as follows. Using aluminosilicate glass, the black photosensitive coloring composition was applied on one surface by a spin coater, and dried on a hot plate at 100 ° C for 5 minutes to dry the coating film. Then, using a high pressure mercury lamp as a light source, exposure was performed at 100 mJ/cm ² through a photomask having a desired opening. Then, spray development was carried out for 30 seconds using a 0.2% by mass aqueous solution of sodium hydrogencarbonate. After washing with water, heat treatment was carried out at 230 ° C for 30 minutes in a hot air circulating oven to form a black matrix pattern. Then, in addition to changing the type of the photosensitive coloring composition, red, green, and blue patterns were sequentially formed in the same manner to form a color filter layer. In this manner, a color filter substrate including a transparent substrate and a color filter layer is formed.

Next, an alignment film is formed by printing on the color filter layer of the color filter substrate and the surface of the TFT substrate on which the TFT circuit is formed. Then, it was baked at 230 ° C and subjected to a rubbing treatment. Then, the color filter substrate and the TFT substrate are bonded together by a sealing material, and a liquid crystal material is injected into the gap to form a liquid crystal layer, thereby producing a liquid crystal cell. The obtained liquid crystal cell line was protected with a Teflon seal tape and immersed in a hydrofluoric acid aqueous solution at 35 °C. In this manner, the glass portion was chemically ground to have a total thickness of 300 μm.

Subsequently, the light release film of the electrode release film was peeled off to expose the surface of the adhesive layer. Then, on the glass surface on the side where the color filter layer is formed by the chemical polishing treatment, the above-mentioned adhesive layer is bonded by roll pressing at 120 ° C, and the peeling layer is peeled off together. Film substrate.

Further, a touch sensor driver IC is connected by using a flexible printed wiring board (FPC) to electrically connect the terminals of the FPC and the connection terminals of the wiring layer via the ACF. Further, an FPC and a liquid crystal drive IC are also connected to the end portion of the TFT substrate. Next, a polarizing plate is attached to each of the upper surface of the electrode layer of the color filter substrate to which the electrode is attached and the lower surface of the TFT substrate. Further, a backlight is mounted on the polarizing plate on the reverse visual recognition (back side) side, and on the visual recognition side (upper) polarizing plate, the chemically strengthened glass which is bonded to the cover glass is bonded using an optical adhesive. Through the above, a liquid crystal display in which a capacitive touch sensor is integrated is produced. The display is good and the touch sensor can be operated well. Unlike the in-line configuration, the liquid crystal and the touch sensor can be separately driven, which can be easily manufactured compared to the in-line configuration.

A liquid crystal display is usually driven by applying an electric field to a liquid crystal by two transparent electrodes formed in a pixel, and is displayed by controlling the amount of light passing through the liquid crystal layer. The in-line structure is usually performed by alternately performing liquid crystal and touch sensors by causing one of the transparent electrodes formed in the above-mentioned pixels to function as an electrode of the touch sensor (as a common electrode). The construction of the drive. Therefore, the in-line configuration must incorporate a wiring for driving the touch sensor or an element configuration as a driver in the TFT substrate that drives the liquid crystal.

Furthermore, the present invention is not limited to the above embodiments and examples. The shape of the groove portion, the wiring layer, the electrode layer, and the like is not limited to those shown in the drawings. The present invention is susceptible to design changes based on the knowledge of those of ordinary skill in the art. You can change the components described in a diagram The constituent elements described in the other drawings may be added to the constituent elements described in the other drawings. For example, the resin layer may be provided with a groove portion while having a portion where the resin layer is not formed in the surface of the resin layer. Unless otherwise specified, a further layer may be added to the inside or outside of any two layers.

[Industrial availability]

The electrode-attached color filter substrate of the present invention can be used, for example, as a liquid crystal display using a color filter, an organic EL display, or a capacitive touch sensor integrated touch panel display, and can be utilized. It is used as a display and user interface for smart phones or tablets, notebook PCs, etc.

23‧‧‧Next layer

23b‧‧‧ Surface of the layer opposite the peeling layer

24‧‧‧ resin layer

24a‧‧‧ Surface of the resin layer opposite to the transparent substrate

24x‧‧‧ditch

24y‧‧‧ further ditch

25‧‧‧electrode layer (transparent electrode)

26‧‧‧Transparent insulation

27‧‧‧Bridge (bridge electrode)

27a‧‧‧ Surface of the bridge opposite the transparent substrate

28‧‧‧Wiring layer

28a‧‧‧ Surface of the peeling layer side of the wiring layer

30‧‧‧ peeling layer

31‧‧‧ Film substrate

32‧‧‧electrode stripping film

Claims (37)

An electrode release film characterized by comprising a film substrate (11, 31, 51, 71), a release layer (10, 30, 50, 70), a resin layer (4, 24, 44, 64) and an adhesive layer in this order. (3, 23, 43, 63), the peeling layer (10, 30, 50, 70) and the resin layer (4, 24, 44, 64) are in direct contact with each other, and the bonding layer (3, 23, 43) 63) is embedded with an electrode layer (5, 25, 45, 65). The electrode stripping film of claim 1, wherein the electrode layer (5, 25, 45, 65) is sandwiched between the resin layer (4, 24, 44, 64) and the adhesive layer (3, 23, 43, 63) )between. The electrode stripping film of claim 1, wherein the wiring layer (8, 28, 48, 68) is disposed adjacent to the resin layer (4, 24, 44, 64). The electrode stripping film of claim 1, wherein a wiring layer (8, 28, 48, 68) is provided, and the peeling layer (10, 30, 50, 70) side of the wiring layer (8, 28, 48, 68) The surface (4a, 28a, 48a, 68a) and the surface (4a, 24a, 44a, 64a) of the resin layer (4, 24, 44, 64) on the side of the peeling layer (10, 30, 50, 70) are Located at the same height or at the same level. An electrode stripping film according to claim 1, wherein a wiring layer (8, 28) is provided, and a groove portion (4x, 24x) is provided in the resin layer (4, 24), and the groove portion (4x, 24x) is provided in the groove portion (4x, 24x). This wiring layer (8, 28). The electrode stripping film of claim 1, wherein a further groove portion (24y) is provided in the resin layer (24), and a bridge layer (27) is provided in the further groove portion (24y), the bridge layer (27) ) is transparent with the electrode layer (25) Insulation layer (26). The electrode stripping film of claim 6, wherein the surface (27a) of the peeling layer (30) side of the bridge layer (27) and the surface (24a) of the peeling layer (30) side of the resin layer (24) are Located at the same height or at the same level. The electrode stripping film of claim 1, wherein a wiring layer (48, 68) is provided, and the surface (48a, 68a) of the wiring layer (48, 68) on the side of the peeling layer (50, 70) and the adhesive layer ( The surfaces (43a, 63a) on the side of the peeling layer (50, 70) of 43, 63) are located at the same height or at the same horizontal plane. The electrode stripping film of claim 1, wherein the wiring layer (48, 68) is provided by being sandwiched by the adhesive layer (43, 63). The electrode release film of claim 1, wherein the resin layer (4, 24, 44, 64) comprises a material which has photohardened the photosensitive resin. The electrode release film of claim 1, wherein the resin layer (4, 24, 44, 64) is a resin obtained by molding a thermoplastic resin. An electrode stripping film according to claim 1, wherein a surface (3b, 23b, 43b, 63b) on the opposite side of the peeling layer (10, 30, 50, 70) from the adhesive layer (3, 23, 43, 63) Above, there is a separator film. A color filter substrate with electrodes, characterized in that a color filter layer (14, 34, 54, 74), a transparent substrate (13, 33, 53, 73), and an adhesive layer (3, 23, 43, 63) and the resin layer (4, 24, 44, 64), the transparent substrate (13, 33, 53, 73) and the adhesive layer (3, 23, 43, 63) are in direct contact with each other, Electrode layers (5, 25, 45, 65) are buried in the adhesive layer (3, 23, 43, 63). The color filter substrate with an electrode attached to claim 13, wherein the electrode layer (5, 25, 45, 65) is sandwiched between the adhesive layer (3, 23, 43, 63) and the resin layer (4) Between, 24, 44, 64). A color filter substrate having an electrode attached thereto, wherein the wiring layer (8, 28, 48, 68) is disposed adjacent to the resin layer (4, 24, 44, 64). A color filter substrate having an electrode attached thereto, wherein a wiring layer (8, 28, 48, 68) is provided, the wiring layer (8, 28, 48, 68) and the transparent substrate (13) , 33, 53, 73) the opposite side surface (8a, 28a, 48a, 68a), and the resin layer (4, 24, 44, 64) opposite to the transparent substrate (13, 33, 53, 73) The side surfaces (4a, 24a, 44a, 64a) are located at the same height or at the same level. A color filter substrate having an electrode attached thereto, wherein a wiring layer (8, 28) is provided, and a groove portion (4x, 24x) is provided in the resin layer (4, 24), and the groove portion (4x) The wiring layer (8, 28) is provided in 24x). The color filter substrate with an electrode attached to claim 13, wherein a further groove portion (24y) is disposed in the resin layer (24), and a bridge layer (27) is disposed in the further groove portion (24y). A transparent insulating layer (26) is disposed between the bridge layer (27) and the electrode layer (25). The color filter substrate with an electrode attached to claim 18, wherein the surface (27a) of the bridge layer (27) opposite to the transparent substrate (33) and the resin layer (24) are transparent The surface (24a) on the opposite side of the substrate (33) is at the same height or is in the same horizontal plane. A color filter substrate having an electrode attached thereto, wherein a wiring layer (48, 68) is provided, the wiring layer (48, 68) and the transparent substrate (53) 73) the surface (48a, 68a) on the opposite side and the surface (43a, 63a) on the opposite side of the transparent substrate (53, 73) from the adhesive layer (43, 63) are at the same height or are the same level. A color filter substrate having an electrode attached thereto, wherein the wiring layer (48, 68) is sandwiched by the adhesive layer (43, 63). A color filter substrate having an electrode attached thereto, wherein the resin layer (4, 24, 44, 64) comprises a material which has photohardened the photosensitive resin. A color filter substrate having an electrode attached thereto, wherein the resin layer (4, 24, 44, 64) is a resin obtained by molding a thermoplastic resin. A color filter substrate having an electrode attached thereto, wherein a wiring layer (8, 28, 48, 68) is provided, from the opposite side of the color filter layer (14, 34, 54, 74) The measured wiring layer (8, 28, 48, 68) had a reflectance of 20% or less. A display device provided with a color filter substrate with an electrode attached as claimed in item 13. A method for producing an electrode release film comprising: preparing a film substrate (11, 31), a release layer (10, 30), and a resin material layer directly laminated on the release layer (10, 30) in this order In the step of laminating the resin material, the resin material layer is developed or molded to form a resin layer (4, 24) having the groove portions (4x, 24x), and the wiring material is applied to the groove portions (4x, 24x). a step of forming a wiring layer (8, 28), The steps of laminating the electrode layers (5, 25) over the resin layers (4, 24) and laminating the subsequent layers (3, 23) over the electrode layers (5, 25). The method for producing an electrode stripping film according to claim 26, wherein the step of applying the wiring material in the groove portion (4x, 24x) is to scrape the wiring material by using a blade-shaped or blade-like member. The step of embedding the wiring material in the groove portion (4x, 24x). The method for producing an electrode release film according to claim 26, comprising the step of developing or molding the resin material layer to form a resin layer (24) having a further groove portion (24y), in the further groove portion ( 24y) a step of coating a bridge material to form a bridge layer (27), a step of laminating a transparent insulating layer (26) over the bridge layer (27), and laminating an electrode layer over the transparent insulating layer (26) 25) The steps. The method for producing an electrode release film according to claim 28, wherein the step of: developing or molding the resin material layer to form a resin layer (24) having a groove portion (24x), and applying the resin material layer The step of developing or molding to form a resin layer (24) having a further groove portion (24y). The method for producing an electrode release film according to claim 28, wherein the step of applying the wiring material in the groove portion (4x) and the step of coating the bridge material in the further groove portion (24y) are simultaneously performed. A method for producing an electrode release film comprising: preparing a film substrate (51, 71), a release layer (50, 70), and a resin material layer directly laminated on the release layer (50, 70) in this order In the step of laminating the resin material, the resin material layer is developed or molded, and the step of forming the resin layer (44, 64) on the peeling layer (50, 70) and the unformed portion are patterned. a step of forming a wiring layer (48, 68) where the resin layer (44, 64) is not formed, forming an electrode layer (45, 65) over the resin layer (44, 64), and The step of laminating the layers (43, 63) over the electrode layers (45, 65). The method for producing an electrode release film according to claim 31, wherein the step of forming the wiring layer (48, 68) at a place where the resin layer (44, 64) is not formed is a step of printing a wiring material, or a film of a wiring material. The step of pattern formation by photolithography after formation. The method for fabricating an electrode stripping film of claim 31, further comprising the steps of: laminating a transparent insulating layer (66) over the electrode layer (65), and forming a further electrode over the transparent insulating layer (66) Step of layer (69). A method of manufacturing a color filter substrate with an electrode, comprising: preparing a layered body in which a color filter layer (14, 34, 54, 74) and a transparent substrate (13, 33, 53, 73) are laminated The step of (3, 23, 43, 63) of the electrode stripping film (12, 32, 52, 72) manufactured by the manufacturing method of claim 26 The surface (3b, 23b, 43b, 63b) on the opposite side of the peeling layer (10, 30, 50, 70) is bonded to the transparent substrate (13, 33, 53, 73) and the color filter layer (14, 34, 54, 74) the steps of the opposite side surfaces (13a, 33a, 53a, 73a), and peeling the peeling layer (10, 30, 50, from the resin layer (4, 24, 44, 64) 70). A method of manufacturing a display device, comprising the method of manufacturing a display device for manufacturing a color filter substrate with an electrode according to claim 34, further comprising: the color filter layer (14, 34, 54, 74) on the surface opposite to the transparent substrate (13, 33, 53, 73), the TFT substrate is pre-bonded, and the touch sensing is electrically connected to the electrode layer (5, 25, 45, 65) The steps of the drive circuit of the device. A method of manufacturing a color filter substrate with an electrode, comprising: preparing a layered body in which a color filter layer (14, 34, 54, 74) and a transparent substrate (13, 33, 53, 73) are laminated The step of peeling the film (10, 23, 43, 63) of the electrode stripping film (12, 32, 52, 72) manufactured by the manufacturing method of claim 31 and the peeling layer (10, 30) , 50, 70) the opposite side surface (3b, 23b, 43b, 63b) is attached to the transparent substrate (13, 33, 53, 73) and the color filter layer (14, 34, 54, 74) And the step of peeling off the peeling layer (10, 30, 50, 70) from the resin layer (4, 24, 44, 64). A method of manufacturing a display device, comprising the method of manufacturing a display device for manufacturing a color filter substrate with an electrode according to claim 36, further comprising: the color filter layer (14, 34, The surface opposite to the transparent substrate (13, 33, 53, 73) of 54 and 74) is bonded to the TFT substrate in advance, and is electrically connected to the electrode layer (5, 25, 45, 65) touch sensor. The steps of the drive circuit.