TW201710054A - Manufacturing method of optical microstructure, processing machine table and its light guide plate mold having excellent structural strength for prolonging service life of the convex portion as the mold - Google Patents

Manufacturing method of optical microstructure, processing machine table and its light guide plate mold having excellent structural strength for prolonging service life of the convex portion as the mold Download PDF

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TW201710054A
TW201710054A TW104129325A TW104129325A TW201710054A TW 201710054 A TW201710054 A TW 201710054A TW 104129325 A TW104129325 A TW 104129325A TW 104129325 A TW104129325 A TW 104129325A TW 201710054 A TW201710054 A TW 201710054A
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substrate
light guide
guide plate
laser beam
convex portion
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TW104129325A
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Chinese (zh)
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葉鈞皓
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茂林光電科技股份有限公司
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Publication of TW201710054A publication Critical patent/TW201710054A/en

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Abstract

This invention provides a manufacturing method of an optical microstructure, a processing machine table and its light guide plate mold. The manufacturing method comprises the following steps: irradiating a base material with a melting point temperature by using a laser beam and making a processing temperature of the laser beam conform to a condition of C1 ≤ C2 ≤ (1.1×X), so that when the laser beam is irradiated onto the base material, the base material is melted and cooled to form at least one convex portion on the surface of the base material and a recessed portion on the peripheral side of the convex portion. By controlling the processing temperature, convex portion can be formed on the base material through laser processing, and further utilizing the base material as a manufacturing mold of a light guide plate. The base material is wrapped around the outer side of a roller to emboss the light guide plate so that the surface of the light guide plate corresponding to the convex portion forms a recessed microstructure. The convex portion is not easily cracked during the embossing process, and has excellent structural strength for prolonging service life of the convex portion as the mold.

Description

光學微結構製造方法、加工機台及其導光板模具 Optical microstructure manufacturing method, processing machine and light guide plate mold thereof

本發明係關於導光板加工領域,尤其是一種製造光學微結構之導光板的加工領域。 The invention relates to the field of light guide plate processing, in particular to the field of processing light guide plates for manufacturing optical microstructures.

導光板係為背光模組中用以導引光線而形成均勻出光之一元件,其係利用全反射原理,將自導光板入光面入射之光線傳遞至導光板遠端,並利用導光板之複數光學微結構破壞全反射以調整出光量以及出光均勻度,而形成均勻之面光源。 The light guide plate is a component of the backlight module for guiding light to form a uniform light output, and the light incident from the light guide surface of the light guide plate is transmitted to the distal end of the light guide plate by using the principle of total reflection, and the light guide plate is utilized. The complex optical microstructure destroys total reflection to adjust the amount of light and the uniformity of light emission to form a uniform surface source.

傳統於導光板上形成光學微結構之方式係多採印刷方式。其係將設計好之光學微結構圖樣利用高散光源物質印刷材料印製於導光板以形成網點,藉由該些網點破壞光線全反射達控制出光之目的。惟透過印刷方式形成於導光板之網點結構,由於印刷油墨之黏度易受環境因素影響而不易控制,使網點結構之均一性以及個別尺寸皆不易控制,進而降低產品良率,並且耗費整體製程時間。 Traditionally, the way to form an optical microstructure on a light guide plate is a multi-printing method. The optical microstructure pattern is designed to be printed on the light guide plate by using a high-scattering light source material to form a dot, and the dots are destroyed by the full reflection of the light to control the light. However, the dot structure formed on the light guide plate by printing is difficult to control because the viscosity of the printing ink is easily affected by environmental factors, so that the uniformity of the dot structure and the individual dimensions are difficult to control, thereby reducing the yield of the product and consuming the overall process time. .

鑒於印刷製成光學微結構之不便,因此後續係衍生多種非屬印刷式光學微結構之製造方法。如為求於導光板成型時即將光學微結構一併結合於上,可針對導光板模仁進行機械加工,或透過蝕刻方式使光學微結構圖樣成形於模仁表面。機械加工例如直接透過刀具於模仁切割出所需之光學微結構圖樣,以供透過模仁成型之導光板對應形成光學微結構圖樣 而具有複數網點。惟藉刀具切割方式,光學微結構之最小尺寸係受限於刀具而無法達到極微小化,不符現今市場產品需求,且製程極為耗時又成型之微結構尺寸易具有誤差。蝕刻方式則需透過繁複過程如塗佈、曝光及電鑄等製程手續,亦提升模仁製造時間成本與難度。 In view of the inconvenience of printing optical microstructures, subsequent fabrication methods for a variety of non-printed optical microstructures have been derived. For the purpose of forming the light guide plate into the optical microstructure together, the light guide plate mold can be machined, or the optical microstructure pattern can be formed on the surface of the mold by etching. Machining, for example, directly cutting the desired optical microstructure pattern through the cutter to form an optical microstructure pattern corresponding to the light guide plate formed by the mold core And has multiple outlets. However, with the tool cutting method, the minimum size of the optical microstructure is limited by the tool and cannot be extremely miniaturized, which is inconsistent with the demand of the current market, and the microstructure of the process is extremely time consuming and easy to have errors. The etching method requires a complicated process such as coating, exposure and electroforming, and also increases the manufacturing cost and difficulty of the mold.

故為解決於模仁製造光學微結構之效率,中華民國專利申請號第93113610號之導光板結構及其製造方法,係揭露一種導光板製造方法,其步驟包括提供一基板;利用至少一雷射照射於該基板上之不同位置,以於每一位置上形成一皺褶網點,藉以形成一模仁;以及利用該模仁成型一導光板。該方法係利用雷射加工,以於模仁上形成皺褶網點,再利用模仁透過射出、熱壓、鑄造、壓鑄或灌注等方式成型導光板。而除了可直接透過上述方式成型導光板外,現今亦有採用滾輪針對導光板進行壓印以於導光板上形成光學微結構之方式,其類似於上述方法,差異在於該基板形成皺褶網點後,係使其包覆於滾輪外表面,再利用滾輪針對導光板表面進行壓印而使光學微結構成形。 Therefore, in order to solve the problem of the efficiency of manufacturing the optical microstructure of the mold core, the light guide plate structure of the Republic of China Patent Application No. 93113610 and the manufacturing method thereof disclose a method for manufacturing a light guide plate, the steps of which include providing a substrate; using at least one laser Irradiating at different positions on the substrate to form a wrinkle dot at each position to form a mold core; and forming a light guide plate by using the mold core. The method utilizes laser processing to form a wrinkle dot on the mold core, and then uses the mold to form the light guide plate by injection, hot pressing, casting, die casting or pouring. In addition to directly forming the light guide plate by the above method, there is also a method of using the roller to imprint the light guide plate to form an optical microstructure on the light guide plate, which is similar to the above method, except that the substrate forms a wrinkle dot. The film is coated on the outer surface of the roller, and the optical microstructure is formed by embossing the surface of the light guide plate with a roller.

然而,無論後續採用何種製程製作導光板,利用雷射加工而形成於基板或模仁上之皺褶網點,係受雷射高溫照射影響而產生熔渣噴濺現象,並形成凹陷之皺褶網點,且於皺褶網點周圍會形成一個或多個凸起物,即為俗稱之火山口態樣。特別於進行壓印製程時,由於滾輪相對導光板須施以一定壓力,因此在長時間壓輾後,該些皺褶網點容易因受力而崩裂,如周側之凸起物可能會因彎折或崩塌而落入皺褶網點內,造成基板或模仁之加工壽命縮減。且透過該種基板壓印製成之導光板,其表面之光學微結構形狀或尺寸都會受到影響,導致導光板之光學微結構加工良率下降。 However, regardless of the process used to fabricate the light guide plate, the wrinkle dots formed on the substrate or the mold by laser processing are affected by the high temperature irradiation of the laser to cause slag splashing and form wrinkles of the recess. The dots, and one or more protrusions are formed around the wrinkled dots, which is commonly known as the crater. Especially when performing the imprint process, since the roller has to apply a certain pressure to the light guide plate, after a long time of pressing, the wrinkle dots are easily broken by the force, for example, the protrusion on the circumference may be bent. Folded or collapsed and fell into the wrinkle dot, resulting in a reduction in the processing life of the substrate or mold. Moreover, the optical microstructure of the surface of the light guide plate embossed by the substrate is affected, resulting in a decrease in the optical microstructure processing yield of the light guide plate.

此外,透過雷射加工形成於模仁或基板之皺折網點,係屬凹陷之態樣,而使導光板經上述利用模仁或基板成型後之光學微結構之形狀受限。隨導光板之應用範疇擴增,單一態樣結構已無法滿足更多樣化之導光效能要求,因此如何調整並改善用以製造導光板之模仁或基板上的皺摺網點形狀與加工製程,以及模仁或基板之使用壽命等,係為目前需改良的課題之一。 In addition, the wrinkle dots formed on the mold core or the substrate by laser processing are in the form of depressions, and the shape of the optical microstructure of the light guide plate after being molded by the above-mentioned mold core or substrate is limited. With the application of the light guide plate, the single-state structure can not meet the more diverse light-conducting performance requirements, so how to adjust and improve the shape and processing process of the wrinkle dots on the mold or the substrate used for manufacturing the light guide plate And the service life of the mold or the substrate is one of the topics that need to be improved.

故本發明人係構思一種光學微結構製造方法、加工機台及其導光板模具,希冀可有效解決於導光板模具之皺褶網點等微結構所具有之缺失,以使其具有更佳之結構強度與變化性,並進一步提升壓印良率。 Therefore, the inventor conceived an optical microstructure manufacturing method, a processing machine and a light guide plate mold thereof, and the invention can effectively solve the defects of the microstructures such as the wrinkle dots of the light guide plate mold, so as to have better structural strength. With variability and further increase the imprint yield.

本發明之一目的,旨在提供一種光學微結構製造方法、加工機台及其導光板模具,其係透過雷射加工於一基材上形成凸狀微形結構,並可使該基材作為導光板模具以於導光板上形成對應之凹陷微結構。 An object of the present invention is to provide an optical microstructure manufacturing method, a processing machine, and a light guide plate mold thereof, which are formed by laser processing on a substrate to form a convex micro-structure, and the substrate can be used as a substrate. The light guide plate mold forms a corresponding concave microstructure on the light guide plate.

為達上述目的,本發明於一實施方式揭示一種光學微結構製造方法,係包括以下步驟:提供一基材,且該基材具有一熔點溫度C1;及照射至少一雷射光束至該基材,且該雷射光束具有一加工溫度C2,並符合C 1 C 2 (1.1×C 1)之條件,以使該雷射光束轟擊至該基材時,令該基材呈熔融狀態,進而於冷卻後在該基材表面形成至少一凸部及位於該凸部之周側的一凹陷部。藉由控制該加工溫度,使該基材受該雷射光束轟擊時形成熔融狀態而利於熔融物質堆積形成該凸部。 In order to achieve the above object, an embodiment of the present invention discloses an optical microstructure manufacturing method comprising the steps of: providing a substrate having a melting point temperature C 1 ; and irradiating at least one laser beam to the substrate Material, and the laser beam has a processing temperature C 2 and conforms to C 1 C 2 a condition of (1.1 × C 1 ) such that when the laser beam is bombarded to the substrate, the substrate is in a molten state, and after cooling, at least one convex portion is formed on the surface of the substrate and located at the convex portion a depression on the side of the circumference. By controlling the processing temperature, the substrate is formed into a molten state by being bombarded by the laser beam to facilitate deposition of the molten material to form the convex portion.

本發明於另一實施方式則揭露一種雷射加工機台,用以執行如前述之光學微結構製造方法,該雷射加工機台包括:一承載平台,供以 放置該基材;一雷射共振腔,供以發射該雷射光束;一加工狀態監測器,用以即時監控該凸部之變化,並產生一狀態訊號;以及一加工溫度控制器,用以根據該狀態訊號,調整該雷射光束之該加工溫度。該雷射加工機台係可即時監控該凸部之成形狀態,並透過該加工溫度控制器隨時調整該加工溫度,以提升加工製程良率。 Another embodiment of the present invention discloses a laser processing machine for performing the optical microstructure manufacturing method as described above, the laser processing machine comprising: a carrying platform for Placing the substrate; a laser cavity for emitting the laser beam; a processing state monitor for instantly monitoring the change of the protrusion and generating a status signal; and a processing temperature controller for The processing temperature of the laser beam is adjusted according to the status signal. The laser processing machine can instantly monitor the forming state of the convex portion, and adjust the processing temperature through the processing temperature controller at any time to improve the processing yield.

為使該凸部可順利堆積形成,除控制加工溫度外,亦可針對該雷射光束之能量狀態進行調整,故本發明基於上述各實施方式,進一步使該基材係位於該雷射光束之焦距外,使該雷射光束採用離焦方式針對該基材進行轟擊。 In order to enable the convex portion to be smoothly stacked, in addition to controlling the processing temperature, the energy state of the laser beam can be adjusted. Therefore, the present invention further enables the substrate to be located in the laser beam based on the above embodiments. Outside the focal length, the laser beam is bombarded against the substrate in a defocused manner.

此外,使該基材為一金屬板時,於複數之該凸部成形後,該基材係包覆一滾輪,以透過壓輾方式於一導光板表面形成複數微結構。藉此,本發明之該基材即可做為供以製造導光板之模具使用,而使導光板可對應該等凸部形成該等微結構。 Further, when the substrate is a metal plate, after the plurality of the convex portions are formed, the substrate is coated with a roller to form a plurality of microstructures on the surface of a light guide plate by pressure pressing. Thereby, the substrate of the present invention can be used as a mold for manufacturing a light guide plate, and the light guide plate can form the microstructures corresponding to the convex portions.

於另一實施方式中,係使該雷射光束之橫模圖像係為旋轉對稱,以供該雷射光束轟擊於該基材後所形成之熔融區域更利於該凸部之堆積。 In another embodiment, the transverse mode image of the laser beam is rotationally symmetric, such that the molten region formed by the laser beam bombarding the substrate is more conducive to the accumulation of the convex portion.

本發明並於再一實施方式中,揭示一種導光板模具,其係以前述之光學微結構製造方法加工而成,該導光板模具包括:一基材,具有一轉寫表面,用以轉寫一導光板;以及複數個光學微結構,位於該轉寫表面,任一該些光學微結構係由一凸部及位於該凸部之周側的一凹陷部所組成;其中,該凸部係由原位於該凹陷部之物質所構成。 In yet another embodiment, the present invention discloses a light guide plate mold which is processed by the optical microstructure manufacturing method described above. The light guide plate mold comprises: a substrate having a transfer surface for transliteration a light guide plate; and a plurality of optical microstructures on the transfer surface, any of the optical microstructures being composed of a convex portion and a concave portion on a circumferential side of the convex portion; wherein the convex portion is It consists of the substance originally located in the depression.

基於上述實施方式,本發明係揭露該導光板模具之一應用方 式,亦即使該基材為一金屬板,並包覆一滾輪以透過壓輾方式轉寫該導光板。 Based on the above embodiments, the present invention discloses one application of the light guide plate mold. Even if the substrate is a metal plate, and a roller is coated to transfer the light guide plate by compression.

綜上所述,本發明之光學微結構製造方法,係透過控制該雷射光束之參數,以於該基材透過雷射加工製成該凸部,並於本發明中搭配該凸部之要求而針對該雷射光束做參數調控,亦可使成形之該凸部具有更佳之結構剛性。此外,該基材於複數之該凸部製成後,即可作為導光板之模具使用,並可配合一滾輪,將該基材包覆於該滾輪以針對導光板進行壓印加工,使該導光板對應該等凸部形成複數微結構,以利於該導光板於後續應用時達到調光與導光效能。 In summary, the optical microstructure manufacturing method of the present invention is to form the convex portion by laser processing by controlling the parameters of the laser beam, and the requirement of the convex portion in the present invention. The parameter adjustment of the laser beam can also make the formed convex portion have better structural rigidity. In addition, after the plurality of the convex portions are formed, the substrate can be used as a mold of the light guide plate, and can be coated with the roller on the roller to perform imprint processing on the light guide plate. The light guide plate forms a plurality of microstructures corresponding to the convex portions to facilitate the dimming and light guiding performance of the light guide plate in subsequent applications.

10‧‧‧基材 10‧‧‧Substrate

101‧‧‧凸部 101‧‧‧ convex

102‧‧‧凹陷部 102‧‧‧Depression

11‧‧‧雷射光束 11‧‧‧Laser beam

2‧‧‧導光板 2‧‧‧Light guide plate

20‧‧‧微結構 20‧‧‧Microstructure

3‧‧‧滾輪 3‧‧‧Rollers

4‧‧‧雷射加工機台 4‧‧‧Laser processing machine

40‧‧‧承載平台 40‧‧‧Loading platform

41‧‧‧雷射共振腔 41‧‧‧Laser Resonator

42‧‧‧加工狀態監測器 42‧‧‧Processing condition monitor

43‧‧‧加工溫度控制器 43‧‧‧Processing temperature controller

5‧‧‧導光板模具 5‧‧‧Light guide plate mould

50‧‧‧基材 50‧‧‧Substrate

501‧‧‧轉寫表面 501‧‧‧Transfer surface

51‧‧‧光學微結構 51‧‧‧Optical microstructure

511‧‧‧凸部 511‧‧‧ convex

512‧‧‧凹陷部 512‧‧‧Depression

S101~S102‧‧‧步驟 S101~S102‧‧‧Steps

a‧‧‧失焦狀態 A‧‧‧defocused state

b‧‧‧聚焦狀態 B‧‧‧ Focus state

c‧‧‧離焦狀態 C‧‧‧ defocused state

第1圖,為本發明第一實施例之步驟流程圖。 Fig. 1 is a flow chart showing the steps of the first embodiment of the present invention.

第2圖,為本發明第一實施例基材於加工後之立體示意圖。 Fig. 2 is a perspective view showing the substrate of the first embodiment of the present invention after processing.

第3圖,為本發明第一實施例之加工示意圖(一)。 Fig. 3 is a schematic view (1) of the processing of the first embodiment of the present invention.

第4圖,為本發明第一實施例之加工示意圖(二)。 Fig. 4 is a schematic view (2) of the processing of the first embodiment of the present invention.

第5圖,為本發明第一實施例加工後基材之應用示意圖。 Fig. 5 is a schematic view showing the application of the substrate after processing according to the first embodiment of the present invention.

第6圖,為本發明第二實施例之加工示意圖。 Figure 6 is a schematic view showing the processing of the second embodiment of the present invention.

第7圖,為本發明第三實施例之立體示意圖。 Figure 7 is a perspective view of a third embodiment of the present invention.

為使 貴審查委員能清楚了解本發明之內容,謹以下列說明搭配圖式,敬請參閱。 In order for your review board to have a clear understanding of the contents of the present invention, please refer to the following description for matching drawings.

請參閱第1、2及3~4圖,其係為本發明第一實施例之步驟 流程示意圖、基材於加工後之立體示意圖及各加工示意圖。本發明係揭示一種光學微結構製造方法,包括以下步驟。 Please refer to Figures 1, 2 and 3 to 4, which are steps of the first embodiment of the present invention. The schematic diagram of the process, the schematic diagram of the substrate after processing and the schematic diagram of each processing. The present invention discloses an optical microstructure manufacturing method comprising the following steps.

首先,提供一基材10,此即為步驟S101。其中,該基材10係具有一熔點溫度C1。接著,如步驟S102所示,照射至少一雷射光束11至該基材10,以使該雷射光束11轟擊至該基材10時,令該基材10呈熔融狀態,進而於冷卻後在該基材10表面形成至少一凸部101及位於該凸部101周側之一凹陷部102。其中,該雷射光束11係具有一加工溫度C2,且符合C 1 C 2 (1.1×C 1)之條件,藉由該限制條件以確保該雷射光束11轟擊該基材10時,係可使該基材10維持於熔融狀態,避免該加工溫度C2過高導致該基材10轉呈氣化狀態,而於該雷射光束11轟擊後僅於該基材10表面形成該凹陷部102甚或穿孔。例如,以一般鋼板作為基材10來說,其熔點溫度C1係為1200℃,則該加工溫度C2可被允許之溫度範圍則介於1200℃與1320℃之間,以免該加工溫度C2過低而無法順利熔融該基材10,或該加工溫度C2過高而導致該基材10被氣化。而該雷射光束11之該加工溫度C2,係可由該雷射光束11之頻率及/或功率調整控制。整體而言,雷射光束11照射至基材10後並使其形成熔融狀態,再自然冷卻使熔融之基材10逐漸堆積,進而形成凸部101,於凸部101周側被熔融之區域則相對凸部101形成凹陷部102。 First, a substrate 10 is provided, which is step S101. Wherein, the substrate 10 has a melting point temperature C 1 . Next, as shown in step S102, at least one laser beam 11 is irradiated to the substrate 10 to bombard the laser beam 11 to the substrate 10, so that the substrate 10 is in a molten state, and then after cooling The surface of the substrate 10 is formed with at least one convex portion 101 and one concave portion 102 on the circumferential side of the convex portion 101. Wherein, the laser beam 11 has a processing temperature C 2 and conforms to C 1 C 2 The condition of (1.1× C 1 ), by the constraint condition to ensure that the laser beam 11 bombards the substrate 10, the substrate 10 can be maintained in a molten state, avoiding the processing temperature C 2 being too high, thereby causing the The substrate 10 is turned into a vaporized state, and after the bombardment of the laser beam 11, the depressed portion 102 or even the perforations are formed only on the surface of the substrate 10. For example, in the case of a general steel sheet as the substrate 10, the melting point temperature C 1 is 1200 ° C, and the processing temperature C 2 can be allowed to be in a temperature range between 1200 ° C and 1320 ° C to avoid the processing temperature C. 2 is too low to melt the substrate 10 smoothly, or the processing temperature C 2 is too high to cause the substrate 10 to be vaporized. The processing temperature C 2 of the laser beam 11 can be controlled by the frequency and/or power of the laser beam 11 . In general, after the laser beam 11 is irradiated onto the substrate 10 and is in a molten state, the molten substrate 10 is gradually cooled and gradually formed, thereby forming the convex portion 101, and the region melted on the circumferential side of the convex portion 101 is formed. The concave portion 102 is formed with respect to the convex portion 101.

其中,本發明亦可於一實施方式中使該基材10位於該雷射光束11之焦距外,使該雷射光束11採用離焦方式針對該基材10進行轟擊,藉此使該雷射光束11之能量分布為最適狀態,避免該雷射光束11之能量過於集中或分散而導致該基材10無法由熔融狀態配合溫度冷卻形成該凸部 101。雷射光束係利用電磁波透過增益介質調整輸出雷射光束之特性,增益介質係可封閉於光學共振腔內,以進一步使電磁波於光學共振腔內產生共振現象,電磁波在往返來回的過程中不斷地經過增益介質,當到達臨界狀態後即可輸出雷射光束。當該雷射光束11於輸出時,可進一步調整其能量聚集狀態,即一般常稱之失焦、聚焦及離焦狀態,而依據離輸出該雷射光束11之共振腔由近至遠分別為雷射光束之失焦狀態a、聚焦狀態b及離焦狀態c。當雷射光束11為失焦狀態a時,其能量係呈分散並為漸趨聚集之態樣以於雷射光束11繼續行進後轉為聚焦狀態b,此狀態之雷射光束11照射至該基材10時,該基材10易形成較廣且深度較淺之凹槽;當雷射光束11繼續前進而為聚焦狀態b時,其能量係匯聚於幾近一點,此狀態之雷射光束11照射至該基材10時,容易使溫度過高而氣化該基材10,使其形成一較深之凹槽甚或穿孔之狀態;雷射光束11由聚焦狀態b轉換為離焦狀態c時,其能量會由聚集一點而漸趨分散,亦即能量向外擴散分布,並使雷射光束11之能量呈由中心向外漸強之態樣,此狀態之雷射光束11照射至該基材10後,相較於非離焦狀態c之雷射光束11,於該基材10所形成之熔融區域面積更大,並且該基材10對應鄰近雷射光束11邊緣之區域溫度較高,中央區域則相對邊緣區域溫度較低,而使熔融狀態之該基材10可於溫度較低處冷卻而堆積形成該凸部101,而鄰近雷射光束11邊緣區域則形成該凹陷部102。故如第3圖所示,本實施方式係使該雷射光束11以離焦狀態轟擊該基材10,以藉由受該雷射光束11照射而形成熔融狀態之該基材10,其中第3圖之雷射光束11係以放大狀態示意以利於說明該雷射光束11之各種狀態。接著即如第4圖所示,熔融之該基材10則逐漸堆積形成該凸部101 與該凹陷部102。 In one embodiment, the substrate 10 can be positioned outside the focal length of the laser beam 11 to cause the laser beam 11 to be bombarded against the substrate 10 in a defocusing manner, thereby enabling the laser to be used. The energy distribution of the light beam 11 is in an optimum state, and the energy of the laser beam 11 is prevented from being excessively concentrated or dispersed, so that the substrate 10 cannot be cooled by the molten state and the temperature is formed to form the convex portion. 101. The laser beam is modulated by the electromagnetic wave through the gain medium to adjust the characteristics of the output laser beam. The gain medium can be enclosed in the optical resonant cavity to further generate electromagnetic waves in the optical resonant cavity, and the electromagnetic wave continuously flows back and forth. After the gain medium, the laser beam is output when the critical state is reached. When the laser beam 11 is output, the energy accumulation state can be further adjusted, that is, generally referred to as out-of-focus, focus and defocus state, and the resonance cavity from the output of the laser beam 11 is respectively from near to far. The defocus state a of the laser beam, the focus state b, and the defocus state c. When the laser beam 11 is out of focus state a, its energy is dispersed and gradually gathers, so that after the laser beam 11 continues to travel, it is turned into a focus state b, and the laser beam 11 in this state is irradiated to the laser beam 11 When the substrate 10 is used, the substrate 10 is easy to form a wide and shallow depth groove; when the laser beam 11 continues to advance to the in-focus state b, its energy is concentrated at a little closer, and the laser beam in this state When the substrate 10 is irradiated onto the substrate 10, the substrate 10 is easily vaporized to form a deep groove or even a perforated state; the laser beam 11 is converted from the in-focus state b to the defocused state c. When the energy is concentrated, it is gradually dispersed, that is, the energy is diffused and distributed, and the energy of the laser beam 11 is gradually increased from the center. The laser beam 11 in this state is irradiated to the state. After the substrate 10, the area of the molten region formed in the substrate 10 is larger than that of the laser beam 11 in the non-defocused state c, and the temperature of the substrate 10 corresponding to the edge adjacent to the laser beam 11 is relatively high. The central region has a lower temperature relative to the edge region, and the substrate 10 in a molten state is available The bulk of the cooling is formed at the lower portion of the projection 101, the laser beam 11 adjacent the edge region of the recessed portion 102 is formed. Therefore, as shown in FIG. 3, in the present embodiment, the laser beam 11 is bombarded with the substrate 10 in an out-of-focus state to form the substrate 10 in a molten state by being irradiated by the laser beam 11, wherein The laser beam 11 of Fig. 3 is shown in an enlarged state to facilitate the description of the various states of the laser beam 11. Then, as shown in FIG. 4, the molten substrate 10 is gradually deposited to form the convex portion 101. And the recessed portion 102.

又,電磁波於光學共振腔內傳遞時,受到光學共振腔邊界規範而會影響其電磁場態樣,一般簡稱為雷射光束之模態,其中,又可分為縱模(Longitudinal Mode)及橫模(Transverse Mode),不同模態之雷射光束,除有光強度的差異外,亦具有頻率的差異。而橫模光強度分布,係可由肉眼觀察雷射光束之圖像以得知其橫模態樣,縱模則無法由肉眼看出其光強度分布。常見之橫模圖像有兩種形式,一種為軸對稱圖像(Hermite-Gaussian Modes),另一種則為旋轉對稱(Laguerre-Gaussian Modes)。由於透過邊界條件即可有效調整雷射光束11之橫模圖像,而考量該凸部101之結構強度與成形態樣,因此本發明係於一實施方式中使該雷射光束11之橫模圖像為旋轉對稱之態樣,例如採用呈環狀之橫模圖像,藉此於該雷射光束11轟擊該基材10後,使該基材10形成環狀之熔融區域,亦即於該基材10上,受該雷射光束11環狀照射部分之溫度高於該態樣所包圍之一中央區域,並因中央區域溫度較低而可冷卻熔融狀態之該基材10,使其向中央堆積以形成該凸部101,而該凸部101周側即為環狀之該凹陷部102。惟其係可依據所需形成凸部101之態樣,選擇對應之旋轉對稱橫模圖像,故本發明並不侷限於此。 Moreover, when electromagnetic waves are transmitted in the optical resonant cavity, they are affected by the boundary of the optical resonant cavity and affect the electromagnetic field state, which is generally referred to as the mode of the laser beam, and can be further divided into a longitudinal mode and a transverse mode. (Transverse Mode), different modes of laser beam, in addition to the difference in light intensity, also have a difference in frequency. The horizontal mode light intensity distribution can be observed by the naked eye to see the image of the laser beam, and the longitudinal mode can not be seen by the naked eye. Common transverse mode images come in two forms, one is Hermite-Gaussian Modes and the other is Laguerre-Gaussian Modes. Since the transverse mode image of the laser beam 11 can be effectively adjusted by the boundary condition, and the structural strength and the morphology of the convex portion 101 are considered, the present invention is used to make the transverse mode of the laser beam 11 in one embodiment. The image is in a rotationally symmetrical state, for example, a circular transverse mode image, whereby after the laser beam 11 bombards the substrate 10, the substrate 10 is formed into a ring-shaped molten region, that is, In the substrate 10, the temperature of the portion irradiated by the laser beam 11 in an annular portion is higher than a central region surrounded by the state, and the substrate 10 in the molten state can be cooled due to the low temperature in the central region, so that the substrate 10 can be cooled. The convex portion 101 is formed to be stacked toward the center, and the concave portion 102 is annular on the circumferential side of the convex portion 101. However, the corresponding rotationally symmetric transverse mode image can be selected according to the aspect in which the convex portion 101 is required to be formed, and the present invention is not limited thereto.

請一併參閱第5圖,其係為本發明第一實施例加工後基材之應用示意圖。此外,該基材10可為一金屬板或一金屬模具,以利於複數之該凸部101成形後,透過各類加工方式製成一導光板2上之複數微結構20。當該基材10為一金屬模具時,可採射出成型或灌注等方式製成該導光板2,並使該導光板2上對應該等凸部101具有該等微結構20。而當該基材10為 一金屬板時,於該等凸部101成形後,可使該基材10包覆一滾輪3,以透過壓輾方式於該導光板2表面形成複數微結構20。該基材10透過前述方式以該雷射光束11加工而形成該等凸部101後,即可透過該滾輪3針對該導光板2進行壓印,使該導光板2之至少一表面對應該等凸部101形成凹陷態樣之該等微結構20,以使該導光板2於應用時可藉該等微結構20調整光線狀態。此外,由於各該凸部101係由熔融之該基材10冷卻堆積形成,並於壓印時與該導光板2具有一定之接觸面積,因此,即使包覆於該滾輪3並受壓以針對該導光板2加工而形成該等微結構20,該等凸部101亦不易因受力而產生崩裂之現象,而具有較佳之結構強度,除可確保該等微結構20之形狀尺寸等而可增加該導光板2之生產良率外,亦可延長該基材10之使用壽命。 Please refer to FIG. 5, which is a schematic diagram of the application of the substrate after processing according to the first embodiment of the present invention. In addition, the substrate 10 can be a metal plate or a metal mold to facilitate the formation of the plurality of microstructures 20 on the light guide plate 2 through various processing methods after the plurality of the convex portions 101 are formed. When the substrate 10 is a metal mold, the light guide plate 2 can be formed by injection molding or pouring, and the convex portion 101 corresponding to the light guide plate 2 has the microstructures 20. And when the substrate 10 is In the case of a metal plate, after the convex portions 101 are formed, the substrate 10 can be coated with a roller 3 to form a plurality of microstructures 20 on the surface of the light guide plate 2 by compression. After the base material 10 is processed by the laser beam 11 to form the convex portions 101, the light guide plate 2 can be embossed through the roller 3 to match at least one surface of the light guide plate 2, etc. The protrusions 101 form the microstructures 20 in a recessed manner, so that the light guide plate 2 can adjust the state of light by the microstructures 20 when applied. In addition, since each of the convex portions 101 is formed by cooling and stacking the molten substrate 10, and has a certain contact area with the light guide plate 2 at the time of imprinting, even if it is coated on the roller 3 and pressed, it is directed against The light guide plate 2 is processed to form the microstructures 20. The convex portions 101 are also less likely to be cracked by force, and have better structural strength, in addition to ensuring the shape and size of the microstructures 20 and the like. In addition to increasing the production yield of the light guide plate 2, the service life of the substrate 10 can also be extended.

請參閱第6圖,其係為本發明第二實施例之加工示意圖。於本實施例,本發明係揭示一種雷射加工機台4,其係用以執行如前述之光學微結構製造方法,而同於第一實施例之技術特徵於此即不再加以贅述。該雷射加工機台4包括一承載平台40、一雷射共振腔41、一加工狀態監測器42及一加工溫度控制器43。 Please refer to Fig. 6, which is a schematic view of the processing of the second embodiment of the present invention. In the present embodiment, the present invention discloses a laser processing machine 4 for performing the optical microstructure manufacturing method as described above, and the technical features of the first embodiment are not described herein. The laser processing machine 4 includes a carrying platform 40, a laser resonant cavity 41, a processing state monitor 42 and a processing temperature controller 43.

該承載平台40供以放置該基材10,該雷射共振腔41係供以發射該雷射光束11,以針對該基材10進行加工以形成至少一該凸部101與該凹陷部102。該加工狀態監測器42係供以即時監控該凸部101之變化,並依據該凸部101之變化狀態產生一狀態訊號,該加工狀態監測器42係可連接設於該承載平台40一側或可獨立架設,僅需使該加工狀態監測器42可順利準確地監控該凸部101即可。該加工溫度控制器43係與該加工狀態 監測器42電訊連接,以根據該狀態訊號,透過調整該雷射光束11之功率或頻率等變因以控制該加工溫度C2。其中該加工溫度控制器43與該加工狀態監測器42可採無線或有線方式電訊連接,於本實施例該加工溫度控制器43係呈與該雷射共振腔41一併設置為一體,並透過無線方式與該加工狀態監測器42電訊連接之態樣為例說明。其中,該凸部101之變化狀態係如若於該雷射光束11轟擊該基材10後,無法使該基材10順利形成熔融態樣,進而導致無足夠呈熔融狀態之該基材10堆積形成該凸部101,則該加工狀態監測器42即產生並發送該狀態訊號予該加工溫度控制器43,以使其可根據該狀態訊號調高該加工溫度C2。又或者,該基材10於受該雷射光束11照射後,係呈熔融狀態但卻無法因冷卻而使該凸部101成形或甚至形成氣化狀態,此時可能為該加工溫度C2過高而導致,因此該加工狀態監測器42即依據此種狀況產生並發送該狀態訊號予該加工溫度控制器43,以使其調低該加工溫度C2。藉此,本發明之該雷射加工機台4係可隨時監控加工製程狀態,並即時地調整該加工溫度C2,以提升加工良率並確保該凸部101係可依循所需態樣成形。 The carrying platform 40 is configured to place the substrate 10, and the laser cavity 41 is configured to emit the laser beam 11 to process the substrate 10 to form at least one of the protrusions 101 and the recesses 102. The processing state monitor 42 is configured to monitor the change of the convex portion 101 in real time, and generate a state signal according to the changed state of the convex portion 101. The processing state monitor 42 can be connected to the side of the carrying platform 40 or It can be erected independently, and only the processing state monitor 42 can smoothly and accurately monitor the convex portion 101. The processing temperature controller 43 is in telecommunication connection with the processing state monitor 42 to control the processing temperature C 2 by adjusting the power or frequency of the laser beam 11 according to the state signal. The processing temperature controller 43 and the processing state monitor 42 can be connected by wireless or wired mode. In the embodiment, the processing temperature controller 43 is integrated with the laser cavity 41 and is transparent. The wireless mode is electrically connected to the processing state monitor 42 as an example. The change state of the convex portion 101 is such that after the laser beam 11 bombards the substrate 10, the substrate 10 cannot be smoothly formed into a molten state, thereby causing the substrate 10 to be formed in a sufficiently molten state. In the convex portion 101, the processing state monitor 42 generates and transmits the status signal to the processing temperature controller 43 so that the processing temperature C 2 can be increased according to the status signal. Alternatively, the substrate 10 is in a molten state after being irradiated by the laser beam 11, but the convex portion 101 cannot be formed by cooling or even forms a vaporized state. In this case, the processing temperature C 2 may be Therefore, the processing status monitor 42 generates and transmits the status signal to the processing temperature controller 43 according to the condition to lower the processing temperature C 2 . Thereby, the laser processing machine 4 of the present invention can monitor the processing state at any time, and adjust the processing temperature C 2 in time to improve the processing yield and ensure that the convex portion 101 can be formed according to the desired state. .

同於前述,為維持該凸部101之成形良率,係可藉由調整該承載平台40與該雷射共振腔41之間距,使該基材10位於該雷射光束11之焦距外,以利該雷射光束11採離焦方式針對該基板10進行轟擊,並可使該雷射光束11之橫模圖像為旋轉對稱。此外,該基材10係可為一金屬板或一金屬模具,以利後續透過各類加工方式製成一導光板及其上之複數微結構。其中,該基材10為一金屬板時,係於複數之該等凸部101成形後使其包覆一滾輪3,以利用壓輾方式於該導光板2表面形成該等微結構20,而可 如第5圖所示。而各詳細技術特徵已於前一實施例述及,於此即不再加以贅述。 In the same manner as described above, in order to maintain the forming yield of the convex portion 101, the substrate 10 can be positioned outside the focal length of the laser beam 11 by adjusting the distance between the carrying platform 40 and the laser resonant cavity 41. The laser beam 11 is subjected to bombardment in a defocusing manner for the substrate 10, and the transverse mode image of the laser beam 11 can be rotationally symmetric. In addition, the substrate 10 can be a metal plate or a metal mold to facilitate subsequent fabrication of a light guide plate and a plurality of microstructures thereon by various processing methods. When the substrate 10 is a metal plate, the plurality of the convex portions 101 are formed and coated with a roller 3 to form the microstructures 20 on the surface of the light guide plate 2 by compression. can As shown in Figure 5. The detailed technical features have been described in the previous embodiment, and thus will not be further described herein.

請參閱第7圖,其係為本發明第三實施例之立體示意圖。於本實施例,本發明係揭示一種導光板模具5,其係以如第一實施例所述之光學微結構製造方法加工而成,該導光板模具5係包括一基材50及複數個光學微結構51。 Please refer to FIG. 7, which is a perspective view of a third embodiment of the present invention. In the present embodiment, the present invention discloses a light guide plate mold 5 which is processed by the optical microstructure manufacturing method according to the first embodiment. The light guide plate mold 5 includes a substrate 50 and a plurality of opticals. Microstructure 51.

該基材50具有一轉寫表面501,用以轉寫一導光板。該等光學微結構51位於該轉寫表面501,任一該些光學微結構51係由一凸部511及位於該凸部511周側之一凹陷部512組成,其中,該凸部511係由原位於該凹陷部512之物質所構成,亦即採用如第一實施例所述之光學微結構製造方法加工,而使該雷射光束轟擊該基材50後,於轟擊位置使該基材50呈熔融現象並冷卻以堆積形成該凸部511及該凹陷部512,因此該凸部511即屬原位於熔融區域之該基材50所堆積而成。並可參閱第5圖,如前述,透過該雷射光束照射後,該基材50即形成有該凸部511及其周側之該凹陷部512而組合形成該光學微結構51,藉由該等光學微結構51即可針對一導光板進行轉寫製程,例如前述藉包覆於該滾輪並透過壓印方式於該導光板形成對應之微結構之加工製程。 The substrate 50 has a transfer surface 501 for transducing a light guide plate. The optical microstructures 51 are located on the transfer surface 501, and any of the optical microstructures 51 is composed of a convex portion 511 and a concave portion 512 located on the circumferential side of the convex portion 511, wherein the convex portion 511 is composed of The material originally located in the recessed portion 512 is formed by the optical microstructure manufacturing method as described in the first embodiment, and after the laser beam is bombarded against the substrate 50, the substrate 50 is placed at the bombardment position. The convex portion 511 and the depressed portion 512 are formed by being melted and cooled, so that the convex portion 511 is deposited on the substrate 50 originally located in the molten region. Referring to FIG. 5, as described above, after the laser beam is irradiated, the substrate 50 is formed with the convex portion 511 and the concave portion 512 on the circumferential side thereof to form the optical microstructure 51. The optical microstructure 51 can be transferred to a light guide plate, for example, by the process of coating the roller and forming a corresponding microstructure on the light guide plate by imprinting.

本發明之光學微結構製造方法、加工機台及其導光板模具,係透過控制該雷射光束之該加工溫度,以於其照射至該基材後,使該基材形成熔融狀態,並因冷卻而堆積形成該凸部以及於其周側之該凹陷部,以利用具有該凸部及該凹陷部之該基材作為導光板之模具以對導光板進行轉寫加工,使導光板表面可對應該凸部形成微結構。為使該凸部可順利堆積 形成,本發明亦限定該加工溫度高低,以及該雷射光束之能量態樣,以使成形之該凸部具有更精準之形狀與尺寸。且本發明製成之該凸部,係具有極佳之結構強度,以避免於長時間加工下而產生崩裂毀壞之現象,導致導光板對應形成之微結構形狀及尺寸產生巨大誤差。 The optical microstructure manufacturing method, the processing machine and the light guide plate mold thereof of the present invention control the processing temperature of the laser beam to irradiate the substrate to form a molten state, and Cooling and stacking the convex portion and the concave portion on the circumferential side thereof to transfer the light guide plate by using the substrate having the convex portion and the concave portion as a light guide plate, so that the surface of the light guide plate can be The convex portion is formed to form a microstructure. In order for the convex part to be stacked smoothly Forming, the present invention also defines the processing temperature and the energy state of the laser beam so that the formed convex portion has a more precise shape and size. Moreover, the convex portion prepared by the invention has excellent structural strength to avoid the phenomenon of cracking and destruction caused by long-time processing, and causes a large error in the shape and size of the microstructure formed by the light guide plate.

惟,以上所述者,僅為本發明之較佳實施例而已,並非用以限定本發明實施之範圍;故在不脫離本發明之精神與範圍下所作之均等變化與修飾,皆應涵蓋於本發明之專利範圍內。 However, the above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention; therefore, equivalent changes and modifications may be made without departing from the spirit and scope of the invention. Within the scope of the patent of the present invention.

S101~S102‧‧‧步驟 S101~S102‧‧‧Steps

Claims (10)

一種光學微結構製造方法,包括以下步驟:提供一基材,且該基材具有一熔點溫度C1;及照射至少一雷射光束至該基材,且該雷射光束具有一加工溫度C2,並符合C 1 C 2 (1.1×C 1)之條件,以使該雷射光束轟擊至該基材時,令該基材呈熔融狀態,進而於冷卻後在該基材表面形成至少一凸部及位於該凸部之周側的一凹陷部。 An optical microstructure manufacturing method comprising the steps of: providing a substrate having a melting point temperature C 1 ; and irradiating at least one laser beam to the substrate, and the laser beam has a processing temperature C 2 And in accordance with C 1 C 2 a condition of (1.1 × C 1 ) such that when the laser beam is bombarded to the substrate, the substrate is in a molten state, and after cooling, at least one convex portion is formed on the surface of the substrate and located at the convex portion a depression on the side of the circumference. 如申請專利範圍第1項所述之光學微結構製造方法,其中,該基材係位於該雷射光束之焦距外,使該雷射光束採用離焦方式針對該基材進行轟擊。 The optical microstructure manufacturing method of claim 1, wherein the substrate is located outside a focal length of the laser beam, and the laser beam is bombarded against the substrate by a defocusing method. 如申請專利範圍第2項所述之光學微結構製造方法,其中,該基材係為一金屬板,且於複數之該凸部成形後,該基材係包覆一滾輪,以透過壓輾方式於一導光板表面形成複數微結構。 The optical microstructure manufacturing method according to claim 2, wherein the substrate is a metal plate, and after the plurality of the convex portions are formed, the substrate is coated with a roller to pass through the pressure. The method forms a plurality of microstructures on a surface of a light guide plate. 如申請專利範圍第2或3項所述之光學微結構製造方法,其中,該雷射光束之橫模圖像係為旋轉對稱。 The optical microstructure manufacturing method of claim 2, wherein the transverse mode image of the laser beam is rotationally symmetric. 一種雷射加工機台,用以執行如申請專利範圍第1項所述之光學微結構製造方法,該雷射加工機台包括:一承載平台,供以放置該基材;一雷射共振腔,供以發射該雷射光束;一加工狀態監測器,用以即時監控該凸部之變化,並產生一狀態訊號;以及一加工溫度控制器,用以根據該狀態訊號,調整該雷射光束之該加 工溫度。 A laser processing machine for performing the optical microstructure manufacturing method according to claim 1, wherein the laser processing machine comprises: a carrying platform for placing the substrate; and a laser cavity And a processing state monitor for instantly monitoring the change of the convex portion and generating a state signal; and a processing temperature controller for adjusting the laser beam according to the state signal The plus Working temperature. 如申請專利範圍第5項所述之加工機台,其中,該基材係位於該雷射光束之焦距外,使該雷射光束採用離焦方式針對該基板進行轟擊。 The processing machine of claim 5, wherein the substrate is located outside a focal length of the laser beam, and the laser beam is bombarded against the substrate by a defocusing method. 如申請專利範圍第6項所述之加工機台,其中,該基材係為一金屬板,且於複數之該凸部成形後,該基材係包覆一滾輪,以透過壓輾方式於一導光板表面形成複數微結構。 The processing machine of claim 6, wherein the substrate is a metal plate, and after the plurality of the convex portions are formed, the substrate is coated with a roller to pass through the compression method. A plurality of microstructures are formed on the surface of a light guide plate. 如申請專利範圍第6或7項所述之雷射加工機台,其中,該雷射光束之橫模圖像係為旋轉對稱。 The laser processing machine of claim 6 or 7, wherein the transverse mode image of the laser beam is rotationally symmetric. 一種導光板模具,係以如申請專利範圍第1項所述之光學微結構製造方法加工而成,該導光板模具包括:一基材,具有一轉寫表面,用以轉寫一導光板;以及複數個光學微結構,位於該轉寫表面,任一該些光學微結構係由一凸部及位於該凸部之周側的一凹陷部所組成;其中,該凸部係由原位於該凹陷部之物質所構成。 A light guide plate mold is processed by the optical microstructure manufacturing method according to claim 1, wherein the light guide plate mold comprises: a substrate having a transfer surface for transferring a light guide plate; And a plurality of optical microstructures on the transfer surface, any of the optical microstructures being composed of a convex portion and a concave portion on a circumferential side of the convex portion; wherein the convex portion is originally located The substance of the depression is composed of. 如申請專利範圍第9項所述之導光板模具,其中,該基材係為一金屬板,用以包覆一滾輪,透過壓輾方式轉寫該導光板。 The light guide plate mold according to claim 9, wherein the substrate is a metal plate for covering a roller, and the light guide plate is transferred by compression.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108627912A (en) * 2018-05-16 2018-10-09 深圳新纳光电科技有限公司 Light guide plate manufacturing system and method for manufacturing light guide plate
CN114346456A (en) * 2022-01-26 2022-04-15 扬昕科技(苏州)有限公司 Processing method and processing equipment for light guide plate mold core

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108627912A (en) * 2018-05-16 2018-10-09 深圳新纳光电科技有限公司 Light guide plate manufacturing system and method for manufacturing light guide plate
CN114346456A (en) * 2022-01-26 2022-04-15 扬昕科技(苏州)有限公司 Processing method and processing equipment for light guide plate mold core

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