JP5379394B2 - Optical device, method for manufacturing optical device, mold for optical device, and method for manufacturing mold for optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing of a mold of an optical device for manufacturing the optical device of high performance. <P>SOLUTION: The method for manufacturing of the mold for the optical device includes the first step of forming a lens-forming part of the optical device in a cavity block, and the second step of forming a plurality of recesses in the lens-forming part by irradiating the cavity block with a laser. In the second step the recess is made by irradiating the position where the recess is made with the laser several times, and the irradiating direction of the laser is changed depending on the positions of a plurality of the recesses. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an optical device mold manufacturing method and an optical device manufacturing method. The present invention also relates to an optical device mold and an optical device manufactured by such a method.

  Conventionally, light emitting devices such as light emitting diodes and laser diodes, and light receiving devices such as photodiodes and phototransistors are known as optical devices that emit or receive light. Such an optical device is provided with a lens unit for radiating light from the light emitting chip to the outside or condensing light from the outside on the light receiving chip.

  For example, as an example of this type of optical device, in a light emitting device, the surface of the lens unit may be a mirror surface or a satin surface in order to obtain desired luminance and light diffusibility. In this case, electric discharge machining or blasting has been used for the satin processing of the mold cavity for manufacturing the light emitting device on which the matte surface is formed.

On the other hand, Japanese Patent Laid-Open No. 2006-168260 (Patent Document 1) discloses a mold manufacturing method capable of manufacturing a light guide plate by laser processing.
JP 2006-168260 A

    However, for example, when manufacturing a die for a light-emitting device by electric discharge machining, it is difficult to obtain a micro-ordered uniform processed surface shape due to its processing characteristics, and uniformity of light diffusion from the light-emitting chip It was difficult to improve. Further, in order to obtain a desired machined surface shape by electric discharge machining, it is necessary to perform electric discharge machining for a long time, and it is also necessary to manufacture an electrode for machining, so that it is difficult to improve the machining efficiency. In addition, when blasting is used, due to the processing characteristics, it is difficult to obtain a microscopically regular and uniform processed surface shape although the processing time can be shortened.

    On the other hand, the mold manufacturing method of Patent Document 1 is a technique in which a large number of dots each having a predetermined shape are drawn by a laser on the mold surface to form a textured surface for improving light diffusibility. It was not a suitable technique.

    Accordingly, an object of the present invention is to provide an optical device manufacturing method capable of improving optical characteristics and an optical device mold manufacturing method for manufacturing such an optical device. Another object of the present invention is to provide an optical device for uniformly diffusing light, and an optical device mold for manufacturing such an optical device.

An optical device mold manufacturing method according to one aspect of the present invention is a first method in which a lens molding portion having a concave shape for molding a lens portion of an optical device on a workpiece is formed on a member constituting the bottom surface of the cavity . And a second step of irradiating the workpiece with a laser to form a plurality of recesses in the lens molding portion, wherein the optical device mold includes the recesses in which the plurality of recesses are formed. The optical molding device mounted on the substrate of the optical device is sealed by filling the cavity including the lens molding portion with a translucent resin and curing the cavity. The lens portion of the optical device is formed.

An optical device mold according to another aspect of the present invention is a lens molding having a concave shape for molding a lens portion of an optical device formed on a member constituting a bottom surface of a cavity of the optical device mold. And a plurality of concave portions formed in the lens molding portion by irradiating a laser, and the optical device mold has the concave shape in which the plurality of concave portions are formed. And sealing the optical chip mounted on the substrate of the optical device and forming the lens portion of the optical device by filling the cavity including the lens molding portion with a translucent resin and curing It is comprised so that it may do.

    According to another aspect of the present invention, there is provided an optical device manufacturing method comprising: a first step of forming a lens forming portion for forming a lens portion of an optical device on a workpiece; The second step of forming a plurality of recesses in the molding part, the third step of mounting the optical chip on the substrate, and the mold manufactured through the first step and the second step are translucent. And filling and curing the resin to seal the optical chip and form a lens portion of the optical device.

    An optical device according to another aspect of the present invention includes a substrate, an optical chip mounted on the substrate, and a lens unit formed of a translucent resin that seals the optical chip, and the lens unit Is molded using a mold provided with a plurality of concave portions by laser irradiation, and has a plurality of convex portions.

  Other objects and advantages of the present invention are illustrated in the following examples.

    ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the optical device which can improve an optical characteristic, and the manufacturing method of the metal mold | die for optical devices for manufacturing such an optical device can be provided.

    Moreover, according to this invention, the optical device which can improve an optical characteristic, and the metal mold | die for optical devices for manufacturing such an optical device can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic configuration diagram of a laser processing apparatus in the present embodiment. The light emitting device mold of the present embodiment is an example of an optical device mold according to the present invention, and is manufactured by processing a workpiece in the atmosphere using a laser processing apparatus 100 equipped with a galvano scanner. .

  Reference numeral 101 denotes a laser oscillator. The laser oscillator 101 outputs a laser beam 20 having a predetermined output. The laser oscillator 101 is configured to stably supply a high-power laser beam 20 for performing laser processing. The laser beam 20 has a certain wavelength depending on the laser medium. For example, when a YAG laser is used, 1064 nm infrared rays are emitted as the laser beam 20. However, the laser of the present embodiment is not limited to the YAG laser, and a CO2 laser as long as it has an output suitable for processing the mold member (corresponding to the workpiece in the present invention) of the present embodiment. Or YVO4 laser or the like. In this case, for example, as will be described later, other types of lasers described later can be used as long as an output sufficient to melt the surface layer of the mold member and form the recesses can be obtained by short-time irradiation.

  Reference numeral 102 denotes a shutter. The shutter 102 controls on / off of the laser beam 20 output from the laser oscillator 101. In this way, the output period of the laser beam 20 output from the laser oscillator 101 can be controlled by controlling the on / off of the laser beam 20 by the shutter 102. It should be noted that the shutter 102 is in an on / off state so that the driving unit (not shown) does not block the passage of the laser beam 20 and an off position (closed position) that blocks the passage. Driven between.

  Reference numeral 103 denotes an expander. The expander 103 widens the beam diameter of the laser beam 20 output from the laser oscillator 101. The expander 103 is configured by a combination of a concave lens and a convex lens. The laser beam incident from the concave lens is magnified at a predetermined magnification and becomes parallel light by passing through the convex lens. Thus, the expander 103 can control the beam diameter of the laser beam 20 to a beam diameter suitable for processing the mold member in this embodiment.

  Reference numeral 104 denotes a galvanometer mirror (X-axis mirror). The galvanometer mirror 104 operates so that the laser processing position on the cavity block 110, which is an example of a mold member, can be moved in the X-axis direction. By changing the direction of the galvanometer mirror 104, the laser can be scanned on the cavity block 110 in the X-axis direction at a predetermined speed.

  Reference numeral 105 denotes a galvanometer mirror (Y-axis mirror). The galvanometer mirror 105 operates so that the laser processing device on the cavity block 110 can be moved in the Y-axis direction. By changing the direction of the galvanometer mirror 105, the laser can be scanned in the Y-axis direction on the cavity block 110.

    Reference numeral 106 denotes a vendor mirror. The bender mirror 106 reflects the incident laser beam and changes the direction of the laser beam. At this time, the laser beam is reflected in a direction depending on the position (angle) of the galvanometer mirrors 105 and 106, such as the laser beam 20a or the laser beam 20b.

    Reference numeral 107 denotes an f-θ lens that converges an incident laser beam to a target position. For example, the f-θ lens 107 cancels out the difference in incident angle generated in the laser beams 20 a and 20 b having different incident positions, and always makes the laser beam incident on the surface of the cavity block 110 at substantially the same angle. The f-θ lens 107 corrects the laser beam scanning speed to be constant. At this time, the f-θ lens 107 converges the laser beam at an arbitrary depth in the vicinity of the surface of the cavity block 110 (that is, the distance from the surface), and the focal position of the laser beam output from the bender mirror 106 is Z-axis. Adjust the direction. As described above, the galvano scanner including the galvanometer mirrors 104 and 105 and the f-θ lens 107 can scan the laser beam at a constant speed while adjusting the focal point of the laser beam to the target processing position of the cavity block 110.

    110 is a cavity block. The cavity block 110 is processed by the laser processing apparatus 100, whereby the mold surface constituting the cavity bottom surface of the light emitting device mold is processed into a satin surface. The metal mold | die for light emitting devices is comprised from metals, such as stainless steel and alloy tool steel. Moreover, a metal mold | die can be comprised using materials other than a cemented carbide alloy and a metal, for example, a metal mold | die can also be comprised using ceramics.

    Reference numeral 111 denotes a scanning region where the laser beam is scanned on the cavity block 110. The laser beam emitted from the f-θ lens 107 is scanned at a predetermined speed in the X axis direction and the Y axis direction in the scanning region 111 to process the surface of the cavity block 110.

    Reference numeral 112 denotes a lens molding unit. The lens forming unit 112 is formed in a spherical shape (concave shape) having a circular shape in plan view by, for example, milling before performing laser processing by the laser processing apparatus 100. In other words, laser processing by the laser processing apparatus 100 is performed on the cavity block 110 on which the lens molding portion 112 has already been formed.

    As described above, the method for manufacturing the light emitting device mold according to the present embodiment includes the first step of forming the lens molding portion 112 for molding the lens portion of the light emitting device in the cavity block 110. The manufacturing method of the present embodiment further includes a second step of irradiating the cavity block 110 with a laser to form a plurality of concave portions 50 in the lens molding portion 112, as will be described later.

    In addition, the light emitting device mold of this embodiment has a lens molding portion 112 for molding the lens portion of the light emitting device, and a plurality of concave portions 50 formed in the lens molding portion 112 by irradiating a laser. .

    The plurality of lens forming portions 112 formed in the cavity block 110 are processed into a satin finish as described later, and then filled with a translucent resin to form each lens portion of the plurality of light emitting devices. It will be.

    Note that a region 113 indicates one lens molding portion on the cavity block 110 and its peripheral range.

    FIG. 2 is an enlarged view of a lens molding portion formed in the cavity block in the present embodiment. FIG. 2A is a plan view of the lens molding portion, and corresponds to an enlarged view of a region 113 in FIG. FIG. 2B is a cross-sectional view of the lens molding portion, and shows a cut surface taken along line BB in FIG.

    This figure shows the cavity block 110 before laser processing by the laser processing apparatus 100. In the cavity block 110, a lens forming portion 112 is formed in advance by the above milling before laser processing. As will be described later, the lens molding section 112 molds a spherical (convex) lens section by being cured after being filled with a translucent resin.

    For this reason, as shown in FIG. 2B, the shape of the lens molding portion 112 in the cavity block 110 is spherical (concave), and a structure in which a spherical depression is formed on the surface of the cavity block 110 is used. Have. However, the shape of the lens molding portion 112 is not limited to a spherical depression, and may be, for example, a rounded depression, such as an aspherical lens, a cylindrical lens, a lenticular lens, a Fresnel lens, It may be a concave shape capable of molding various lenses such as a toric lens or a toroidal lens.

    FIG. 3 is a diagram illustrating an example of a laser beam scanning method in the present embodiment. 3A is a schematic plan view showing the entire scanning region (scanning range) of the laser beam, and FIG. 3B is an enlarged plan view showing a part of the scanning region (for example, the inside of one lens molding portion). It is.

    As shown in FIG. 3A, the laser processing apparatus 100 of the present embodiment scans in the scanning area 111 from the left to the right (X-axis direction). This state is indicated by a solid scanning line 131. Specifically, the laser processing apparatus 100 changes the angle of the galvanometer mirrors 104 and 105 to control the position where the laser beam is incident on the f-θ lens 107, thereby changing the irradiation direction of the laser beam in the X-axis direction or Scan in the Y-axis direction.

    While the scanning line 131 is being scanned, the surface of the cavity block 110 is processed by irradiating the cavity block 110 with a laser beam at a predetermined position. When irradiating the cavity block 110 with the laser beam, the shutter 102 of the laser processing apparatus 100 is driven to the ON position (open position), and the laser beam 20 from the laser oscillator 101 is passed through to the expander 103. Make it incident.

    When the scanning by the laser processing apparatus 100 reaches the right end of the scanning region 111, the scanning direction is changed, and the scanning is returned while scanning from the right to the left (−X axis direction). More precisely, the next scan is controlled to start from a position different from the previous scan by moving it back in the lower left direction. This state is indicated by a broken scanning line 132.

    In the laser processing apparatus 100 of the present embodiment, while scanning on the scanning line 132, the shutter 102 is always driven to the off position (closed position) to block the laser beam 20. For this reason, the laser beam is not irradiated onto the cavity block 110 while scanning the scanning line 132. These operations are repeated until one scan on the entire surface of the scan region 111 is completed.

    However, the cavity block 110 may be controlled to be processed while scanning the scanning line 132, that is, while returning the scanning position. If such a scanning method is adopted, the processing time of the cavity block 110 can be shortened. In this case, the scanning lines 131 and 132 are scanned in parallel, and when scanning is performed up to the ends of the scanning lines 131 and 132, they are finely fed in the Y-axis direction by the same distance as between adjacent scanning lines 131 described later. .

    The laser processing apparatus 100 according to the present embodiment has been studied by the inventors of the present application. As a result, for example, in an example shown in FIG. It has been found that the desired surface properties can be obtained even by scanning. In this case, if the cavity block is several centimeters square, the processing can be completed in a few seconds. Thus, since the laser beam is scanned at a high speed in the present invention, the machining time can be shortened as compared with the blast machining as well as the electric discharge machining, and the surface machining can be executed extremely efficiently. ing. However, the scanning speed can be appropriately changed and controlled to an optimum speed.

    In the drawing, there are 21 lens forming portions in total of 3 in the vertical direction and 7 in the horizontal direction, but this is only an example of the cavity block 110. In the present embodiment, the number of lens molding portions formed in the cavity block 110 and the arrangement method thereof are not limited at all.

    As shown in FIG. 3B, the laser processing apparatus 100 linearly scans from the left to the right as the scanning line 131 in the scanning region 111 of the cavity block 110. At this time, by irradiating the laser beam at a predetermined location, a process is performed in which the surface layer of the cavity block 110 is melted and the melted portion is brought closer to the outer peripheral side of the laser beam, the irradiated portion is recessed, and the recess 50 (Dent) is formed. For this reason, while scanning on one scanning line 131, a plurality of concave portions 50 positioned on the scanning line 131 are sequentially formed.

    When the scanning on one scanning line 131 is completed, the irradiation position of the laser beam is moved toward the lower left in FIG. In this manner, similarly, the next scanning line 131 (one scanning line 131 in the figure) is scanned.

    At this time, various arrangements of the recesses 50 formed on the cavity block 110 are conceivable. In the present embodiment, the recesses 50 are formed in a staggered arrangement as an example in which the plurality of recesses 50 are densely (densely) arranged for the reasons described later. Specifically, when the interval between the adjacent recesses 50 in the scan line 131 is 1, the interval between the adjacent scan lines 131 is √3 / 2, and the nearest recess 50 located in the adjacent scan line 131 is. Is ½ in the scanning direction. In this manner, by forming the plurality of concave portions 50 in a staggered arrangement, a large number of concave portions 50 can be provided in the lens molding portion 112.

    However, the arrangement of the plurality of recesses 50 is not limited to the arrangement shown in FIG. 3B, and other arrangement methods may be adopted. The plurality of recesses 50 can be formed at arbitrary positions by controlling on / off of the shutter 102 of the laser processing apparatus 100 while scanning the cavity block 110. For this reason, the plurality of recesses 50 can be formed in a desired arrangement by controlling the shutter 102.

    The laser processing apparatus 100 irradiates the cavity block 110 with the laser beam 20 having an appropriate power, thereby forming a plurality of recesses 50 in the lens molding portion 112. However, if the power of the laser beam 20 (the amplitude of the pulse 171) is increased in an attempt to form a relatively deep and large recess 50, there is a risk that cracks may occur in the cavity block 110. For this reason, it may be difficult to increase the size of the recess 50 by increasing the power of the laser beam 20.

    Therefore, when the relatively large recess 50 is formed or when a laser with a small output is used, the laser beam 20 is not irradiated once but at the same position on the cavity block 110 several times. Irradiation is desirable. When laser beam irradiation is performed a plurality of times in this way, after the scanning of the entire scanning region 111 is completed, the scanning region 111 is scanned in the same manner as the previous time by returning to the origin (original position) at the previous scanning. To do. For example, during the second scanning, the laser beam 20 is irradiated again at the same position as the irradiation position of the laser beam 20 during the first scanning. Such a plurality of times of scanning continues up to the Nth time (N ≧ 2) as necessary.

    Thus, in the manufacturing method of the light emitting device mold in the present embodiment, it is preferable that the second step described above forms the recess 50 by irradiating the position where the recess 50 is formed with the laser a plurality of times.

    FIG. 4 is a diagram showing the irradiation timing of the laser beam in the present embodiment. This figure is an example when N times (N ≧ 2) of laser beam irradiation is performed, and shows irradiation timings in the first laser irradiation, the second laser irradiation,..., The Nth laser irradiation. . In this figure, the horizontal axis represents the laser beam irradiation position X, and the vertical axis represents the scanning order of the scanning lines 131 (Line 1 to Line M) during scanning of the number of times of laser beam irradiation (first time N times). The order of forming the recesses 50 is shown as a whole. In this embodiment, since the laser beam is scanned at a constant scanning speed, the horizontal axis in this figure indicates not only the irradiation position but also the irradiation timing. In addition, “Line 1” in the drawing indicates the first scanning line 131 when scanning the entire scanning region 111, and “Line M” indicates the last scanning line 131 at this time.

    As shown in FIG. 4, the waveform 170 of each scanning line includes a plurality of pulses 171. In the waveform 170, a pulse 171 indicates that the cavity block 110 is irradiated with the laser beam. The pulse 171 of each scanning line appears on the waveform 170 at a constant pulse interval 151 (pulse period). As described above, the laser beam is irradiated at a constant distance interval and time interval during scanning on each scanning line 131. As described above, the pulse interval 151 can be adjusted by controlling the on / off time of the shutter 102 of the laser processing apparatus 100.

    For example, the interval between the recesses 50 formed adjacent to each other on the predetermined scanning line 131 corresponds to the product of the time interval (pulse period) irradiated with the laser beam and the scanning speed. However, the scanning speed, the on time, or the pulse period can be changed as necessary. As described above, according to the processing method of this embodiment, various recesses (patterns) are formed on the cavity block 110 within a range of, for example, about several μm to several hundred μm by controlling the on-time, the pulse period, and the like. It becomes possible to easily form a desired size.

    As shown in FIG. 4, when the scan on the first scan line (Line 1) is completed during the first scan, the scan on the second scan line (Line 2) starts. The pulse generated in the second scanning line is located between two adjacent pulses generated in the first scanning line. The interval 152 shown in FIG. 4 corresponds to half of the pulse interval 151. Thereafter, an odd-numbered scan line after the third scan line (Line 3) has a pulse 171 appearing at the same position as the first scan line (Line 1), and an even-numbered scan line after the fourth scan line (Line 4). Shows a pulse 171 at the same position as the second scanning line (Line 2). This is repeated until the last scan on the Mth scan line (LineM).

    As described above, the generation positions of the pulses 171 are alternately set in order to form the plurality of concave portions 50 in a staggered arrangement as shown in FIG. Therefore, for example, when a plurality of concave portions 50 are formed in a square arrangement as will be described later (see FIG. 15), pulses are applied to the same position from the first scanning line (Line1) to the Mth scanning line (LineM). 171 appears (see FIG. 15).

    When the first scan is completed, the original position is restored and the second scan is started. In the second scan, a pulse 171 appears at the same position as the first scan. That is, the laser beam irradiation during the second scanning is performed at the same position as the laser beam irradiation position during the first scanning. Then, the laser beam is irradiated at the same position until the Nth scan. For this reason, each irradiation position where the recess 50 is formed is irradiated with the laser beam N times.

    FIG. 5 is an enlarged cross-sectional view of the cavity block for explaining the formation process of the recess 50 when the laser beam irradiation is performed a plurality of times. 5A shows a cross section of the cavity block during the first irradiation, FIG. 5B shows the second irradiation, and FIG. 5C shows the cross section of the cavity block during the third irradiation.

    As shown in FIG. 5A, when the cavity block 110 is irradiated with the first laser beam 181a, a shallow recess 50a is formed by the above process. The laser beam 181a is scanned from left to right, which is the direction of the arrow in the drawing. For this reason, a concave portion 50a having substantially the same shape is formed in the left portion where the laser beam 181a has already been irradiated. In this case, as the recess 50a, a shallow depression having a flat bottom portion is formed by the first irradiation. On the other hand, since the laser beam 181a is not yet irradiated on the right portion, the surface of the cavity block 110 remains flat.

    As shown in FIG. 5B, when the cavity block 110 is irradiated with the second laser beam 181b, the recess 50b that is more advanced than the recess 50a is formed by generating the above process twice. The laser beam 181b is scanned in the same direction as the first scan. For this reason, a concave portion 50b having substantially the same shape is formed in the left portion where the laser beam 181b has already been irradiated. In this case, since the concave portion 50b formed by the second irradiation is obtained by further irradiating the concave portion 50a formed by the first irradiation with the laser beam, the concave portion is deeper than the concave portion 50a and has a cross-sectional shape closer to a spherical shape. It becomes. On the other hand, since the laser beam 181b has not been irradiated yet on the right side portion, the recess 50a formed by the first irradiation is still formed on the surface of the cavity block 110.

    As shown in FIG. 5C, when the cavity block 110 is irradiated with the laser beam 181c for the third time, the recess 50c that is further processed than the recess 50a is formed by generating the above process three times. . The laser beam 181c is scanned in the same direction as the first and second scans. Therefore, a concave portion 50c having substantially the same shape and a spherical shape is formed in the left portion where the laser beam 181c has already been irradiated. In this case, the recess 50c formed by the third irradiation is a recess deeper than the substantially spherical recess 50b because the recess 50b formed by the second irradiation is further irradiated with laser. On the other hand, since the laser beam 181c is not yet irradiated on the right side portion, the concave portion 50b formed by the second irradiation is still formed on the surface of the cavity block 110.

    In FIG. 5, for the sake of convenience, the surface of the cavity block 110 is assumed to be a flat surface, and changes in the recesses 50a, 50b, and 50c are shown. However, since the lens molding portion 112 is sufficiently large with respect to these recesses, Even when 50a, 50b, and 50c are formed in the spherical lens molding portion 112, the same change is shown. Note that the same change is basically exhibited even in the inclined portion on the edge side of the lens molding portion 112.

    FIG. 6 is an enlarged plan view of the cavity block (scanning region 111) when a plurality of laser beam irradiations are performed. In this figure, the concave portion 50a formed by the first laser irradiation is indicated by a dotted line, and the concave portion 50b formed by the second laser irradiation is indicated by a solid line.

    As shown in FIG. 6, the recess 50b formed by the second irradiation is larger than the recess 50a formed by the first irradiation. The relationship between the recess 50a and the recess 50b can be generalized to the relationship between the recess formed by the Nth irradiation and the recess formed by the (N + 1) th irradiation.

    In this embodiment, when performing laser irradiation a plurality of times, laser irradiation can always be performed with a constant power (pulse amplitude). However, the power (pulse amplitude) of the laser beam 20 may be controlled to decrease as the number of irradiations increases. According to such control, it becomes possible to form the deep recessed part 50 more efficiently.

    FIG. 7 is a cross-sectional view showing a state of laser beam irradiation in this embodiment.

    As shown in FIG. 7, the laser beam 181 is always irradiated perpendicularly to the processing plane 110a that forms the lens wall 112 in the cavity block 110 and forms the wall surface of the cavity. For this reason, since the inclination with respect to the processing plane 110a increases as it approaches the edge of the lens molding portion 112, the laser beam 181 is irradiated relatively obliquely on the edge side, and the beam diameter is slightly expanded. The focal point of the laser beam 181 is always maintained at a constant distance (depth) from the processing plane 110a. For example, the focal point of the laser beam 181 is set at the position of the processing plane 110a. Alternatively, the focal point of the laser beam 181 may be set at a position between the bottom portion 122 of the lens forming portion or between the processing plane 110a and the bottom portion 122 of the lens forming portion.

    FIG. 8 is a sectional view conceptually showing the shapes of a plurality of recesses formed in the cavity block by the laser beam irradiation shown in FIG. As shown in FIG. 8, a plurality of recesses 50 formed in the lens molding portion 112 and a plurality of recesses 51 formed in the processing plane 110 a are formed on the surface of the cavity block 110.

    As a result of intensive studies by the inventors of the present application, even when laser irradiation is performed by the method shown in FIG. 7, when the lens molding portion 112 has a relatively shallow spherical shape, as shown in FIG. It was confirmed that the recesses 50 and 51 can be formed. As described above, the beam diameter is slightly enlarged on the edge side as described above. Similarly, the bottom 122 has a certain distance from the focal position, so the beam diameter is slightly enlarged. In this case, the beam diameter does not change greatly, and the concave portions 50 having substantially the same size are formed on the entire surface. Therefore, it is not necessary to change the irradiation direction of the laser beam 181 when performing laser irradiation on the shallow spherical lens forming portion 112. In addition, although there is a certain distance between the bottom 122 of the lens molding portion and the processing plane 110a, control for changing the focal position of the laser beam 181 is not necessary. Therefore, according to the present embodiment, it is not necessary to perform control for changing the focal position and the like, and the inside of the spherical lens molding unit 112 is scanned by a simple method in which the focal position is aligned with the processing plane 110a. A uniform recess can be formed.

    However, the focal position of the laser beam may be controlled in order to form a more uniform recess. For example, when the concave portion 51 is formed on the processing plane 110a, the focal position of the laser beam is set to the processing plane 110a, and when the concave portion 50 is formed on the bottom portion 122 of the lens unit, the focal position of the laser beam is set to the lens unit. Set to the bottom 122 of the. At this time, the focal position of the laser beam can be changed by moving the cavity block 110 in the Z direction (vertical direction) using a focus control unit (not shown). Further, when laser irradiation is performed on the relatively deep spherical lens molding portion 112, the laser irradiation diameter is approximately the same as other positions even when the laser beam 181 is expanded on the edge side of the lens molding portion 112. To reduce the size of the laser, a method of reducing the laser diameter and reducing the size can be considered.

    As shown in FIG. 8, the cavity block 110 according to the present embodiment includes a recess 50 formed in the lens molding portion 112 and a recess 51 formed in the processing plane 110 a that is a peripheral portion of the lens molding portion 112. Is provided. Thus, in the manufacturing method of the light emitting device mold in the present embodiment, it is preferable that the second step described above irradiates the lens molding portion 112 and the peripheral portion of the lens molding portion 112 with laser.

    Further, the recess 51 of the cavity block 110 of this embodiment may be formed not only on the periphery of the lens molding portion 112 but also on the entire surface of the cavity block 110 (the entire surface of the scanning region 111). In this case, the above-described second step irradiates the entire surface of the cavity block 110 with a laser.

    FIG. 9 is a cross-sectional view showing a resin sealing method of the light emitting device in this example. This figure shows a state before resin sealing. In this embodiment, the light emitting chip is resin sealed (molded) by transfer molding to form a light emitting device.

    10 corresponds to a “die” in the present invention, and plating treatment using Ni, Cr, Ni alloy, Cr alloy, Ni—Cr alloy, fluorine-based alloy or the like is performed on the cavity block 110 before finishing. It is a cavity block which gave the finishing process of etc. and was set as the metal mold | die for light emitting devices. The formation positions of the plurality of lens forming portions 112 in the cavity block 10 are substantially the same positions so as to overlap with the mounting positions of the light emitting chips 90 described later. Each lens part in the plurality of light emitting devices is respectively molded by a plurality of lens molding parts 112 formed in the cavity block 10. A plurality of concave portions 50 are formed in the lens molding portion 112 of the cavity block 10 by the laser irradiation described above.

    The cavity block 10 is mounted and fixed to an upper mold 11 formed separately from the cavity block 10. By clamping (pinching) the lead frame 80 between the upper mold 11 and the lower mold 12, a cavity 214 is formed between the cavity block 10 and the lead frame 80. As described above, since the plurality of recesses are formed only in the cavity block 10, only the cavity block 110 may be handled during the operations of the first step and the second step. Therefore, since it is not necessary to handle the larger upper mold 11, the operations of these steps can be performed easily.

    Reference numeral 90 denotes a light emitting chip (light emitting element) such as a light emitting diode (LED) or a laser diode. The light-emitting chip 90 is a semiconductor chip that includes an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light of a specific color by applying a forward bias between the pair of electrodes. The emission color varies depending on the material used for the light emitting chip 90. As the light emitting chip 90, for example, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, or the like is used.

    Reference numeral 80 denotes a lead frame as an example of a “substrate” in the present embodiment. Note that the “substrate” in this embodiment refers to a member on which a light emitting chip can be mounted, such as various substrates such as a resin substrate or a film substrate, and a lead frame. The lead frame 80 is made of, for example, a copper alloy, and the light emitting chip 90 is mounted thereon. Finally, a plurality of light emitting devices (LED packages) are completed by dicing the lead frame 80 on which the light emitting chip 90 is mounted and resin-sealed.

    At this time, the diced lead frame becomes an inner lead to which the anode electrode and the cathode electrode of the light emitting chip 90 are connected. An anode electrode is provided on the front surface of the light emitting chip 90, and a cathode electrode is provided on the back surface of the light emitting chip 90. For this reason, the anode electrode of the light emitting chip 90 mounted on one inner lead on the cathode electrode side is electrically connected to the other inner lead using a wire such as gold.

    30 is a resin tablet. The resin tablet 30 is formed by molding a thermosetting resin or the like into a tablet (column) shape. As will be described later, the resin tablet 30 is melted by the heat of the mold and is pumped to fill the space between the cavity block 10 (upper mold 11) and the lead frame 80 with a translucent resin. By curing for a predetermined time after filling with the translucent resin, the light-emitting chip 90 is resin-sealed, and the lens portion of the light-emitting device is molded.

    The translucent resin is a thermosetting resin having a property of transmitting light (translucency). For example, a silicone resin having translucency is used, but is not limited thereto. Silicone resin is particularly suitable for sealing the light-emitting chip 90 because it has a property that its translucency is not easily lowered by ultraviolet rays or heat. However, it is not limited to this, Other thermosetting resins, such as an epoxy resin, can also be used as translucent resin.

    Further, the translucent resin is not limited to a transparent color, and a resin colored with red or the like may be used as long as it has translucency. Depending on the type of the light emitting chip 90, a resin containing a fluorescent material for light emission can also be used.

    201 is a plunger and 202 is a pot. At the time of resin sealing, the resin tablet 30 is put into the pot 202 that is attached to the lower mold 12 and preheated together with the plunger 201 and melted, and the plunger 201 is moved upward to pump the melted resin, whereby the cavity block A space between 10 (upper mold 11) and lower mold 12 is filled with a translucent resin. The plunger 201 is configured to be slidable up and down along the pot 202 by a transfer mechanism (not shown). In addition, it replaces with the resin tablet 30 and can also supply liquid thermosetting resin using a dispenser not shown.

    Alternatively, the resin may be supplied after the parting surfaces of the cavity block 10 (upper mold 11) and the lower mold 12 are covered with a release film (not shown) having a predetermined thickness. At this time, the lead frame 80 can be clamped by the cavity block 10 (upper mold 11) and the lower mold 12 via the release film. In this case, if a thin release film that can be brought into close contact with the shapes of the plurality of recesses 50 is used, the textured surface formed by laser irradiation can be transferred to the surface of the light emitting device.

    When the resin is pumped by the plunger 201, the molten resin is supplied to the cavity 214 through the cull 211, the runner 212, and the gate 213.

    As described above, the light emitting device manufacturing method according to the present embodiment includes the first step of forming the lens forming portion 112 for forming the lens portion of the light emitting device in the cavity block 110. In addition, the manufacturing method includes a second step of irradiating the cavity block 110 with a laser to form a plurality of concave portions 50 in the lens molding portion 112. Further, the manufacturing method includes a third step of mounting the light emitting chip 90 on the lead frame 80. Then, the light emitting chip 90 is sealed and the lens of the light emitting device by filling the cavity block 10 manufactured through the first step and the second step with a translucent resin (resin tablet 30) and curing it. A fourth step of forming the part.

    FIG. 10 is a cross-sectional view of the light emitting device in this example. FIG. 10A illustrates a light emitting device including a spherical lens portion, and FIG. 10B illustrates a light emitting device including a planar lens portion.

    As shown in FIG. 10A, the light emitting device of this example includes a spherical lens portion 65. The lens unit 65 is located above the light emitting chip 90 mounted on the lead frame 80. Light from the light emitting chip 90 is emitted to the outside through the lens unit 65.

    On the surface of the lens portion 65, a convex portion 60a that functions as a microlens that uniformly diffuses light from the light emitting chip 90 and improves optical characteristics is formed. The convex part 60a is formed by sealing the translucent resin 31a using the cavity block 10 provided with the concave part 50. For this reason, the convex part 60a of the lens part 65 reflects the shape of the concave part 50 of the cavity block 10 as it is.

    Further, as shown in FIG. 10A, a convex portion 61a that is the same as or similar to the convex portion 60a is also formed on the surface around the lens portion 65. The convex portion 61a is formed because the concave portion 51 is formed around the lens molding portion by laser irradiation when the cavity block 10 is manufactured. Light from the light emitting chip 90 is also emitted from the periphery of the lens unit 65. For this reason, since the convex part 61a is also formed around the lens part 65, the light from the light emitting chip 90 can be diffused without leakage, so that the light from the light emitting chip can be diffused more uniformly. Become.

    However, when it is not necessary to form the convex portion 61a around the lens portion 65, a mold in which the concave portion 51 is not formed around the lens molding portion may be used. Whether or not the convex portion 61a is formed around the lens portion 65 can be appropriately selected depending on the form of the light emitting device, the usage situation, and the like.

    Further, the shape of the lens portion 65 is not limited to the spherical shape as shown in FIG. 10A, and other shapes may be employed. For example, instead of the spherical lens portion 65, a planar lens portion 67 may be formed as shown in FIG.

    When such a form is adopted, the surfaces of the lens portion 67 and the translucent resin 31b around the lens portion are substantially the same plane. As shown in FIG. 10B, a convex portion 60b is formed on the surface of the lens portion 67, and a convex portion 61b is also formed on the surface around the lens portion. However, similarly to the form shown in FIG. 10A, whether or not to form the convex portion 61b can be appropriately selected depending on the form of the light-emitting device, the usage situation, and the like.

    As described above, the light emitting device according to the present embodiment includes the lead frame 80, the light emitting chip 90 mounted on the lead frame 80, and the lens portion 65 formed of the translucent resins 31a and 31b that seal the light emitting chip 90. , 67. Further, the lens portions 65 and 67 of the light emitting device are molded using the cavity block 10 provided with a plurality of concave portions 50 by laser irradiation, and include a plurality of convex portions 60a and 60b.

    In the cavity block 110, the size of the recesses 50 and 51 can be changed depending on the location. If the cavity block 110 (light emitting device mold) having different sizes of the concave portions 50 and 51 depending on the location is used, the convex portions 60a, 60b, 61a and 61b having different sizes depending on the location are formed in the light emitting device. For this reason, by changing the size of the convex portion depending on the location, the diffusion characteristics of light from the light emitting device can be controlled, and the uniformity of the diffused light can be further improved.

    The cavity block of the above embodiment is irradiated with a laser beam in the entire scanning region 111. However, the laser beam irradiation can be limited to a predetermined area in the scanning area 111.

    FIG. 11 is a plan view showing another example of other laser beam irradiation locations in the cavity block.

    As shown in FIG. 11, the laser processing apparatus scans the scanning region 111 of the cavity block 110 in a certain direction (from left to right in the figure), as in FIG. 3A. This scanning line 131 is indicated by a one-dot chain line. However, in the cavity block of FIG. 11, a plurality of concave portions 50 are formed only inside the lens molding portion 112, and the concave portions 50 are not formed in portions other than the lens molding portion 112. For this reason, the cavity block shown in FIG. 11 is not formed with the recess 51 in the processing plane 110a unlike the cavity block of FIG. Therefore, the light emitting device manufactured using the cavity block of FIG. 11 does not have the convex portion 61a formed around the lens portions 65 and 67, unlike the light emitting device shown in FIG.

    The light emitted from the light emitting chip 90 is diffused to the outside mainly through the lens portions 65 and 67. Thus, if it is sufficient to make the diffusibility in the lens molding portion 112 uniform, the concave portion 50 may be formed only inside the lens molding portion 112.

    In order to form the recess 50 only inside the lens molding unit 112, the coordinates of the plurality of lens molding units 112 in the scanning region 111 of the cavity block 110 are stored in advance in a recording device (not shown). When the laser processing apparatus 100 determines that a predetermined position in the lens molding unit 112 is scanned based on the coordinates, the laser processing apparatus 100 turns on the shutter 102 at the formation position of the recess 50 (corresponding to the irradiation position described above). Then, the lens molding unit 112 is irradiated with a laser beam. On the other hand, when the laser processing apparatus 100 determines that the outside of the lens forming unit 112 is being scanned, the laser processing apparatus 100 always controls the shutter 102 to be off so as not to irradiate the cavity block 110 with the laser beam.

    In the above embodiment, the method of linearly scanning the laser beam has been described, but the scanning method of this embodiment is not limited to the above method. For example, a method of scanning the laser beam along the circumferential direction of the lens forming portion, a method of scanning the laser beam along the radiation direction, or the like can be employed.

    FIG. 12 is a diagram showing another scanning method of the laser beam. FIG. 12A shows a method of scanning the laser beam along the circumferential direction of the lens forming portion, and FIG. 12B shows a method of scanning the laser beam along the emission direction of the lens forming portion. .

    As shown as a scanning line 131a in FIG. 12A, the laser beam can be scanned along a plurality of circular scanning lines 131a (orbits) having the same center as the lens forming portion and different sizes. . In this case, for example, the distance from the f-θ lens 107 to the irradiation position can be made uniform on each scanning line 131a in the spherical lens molding portion 112. For this reason, by setting the focal position according to the distance, it is possible to irradiate the laser beam with an appropriate output, and it is possible to form a plurality of concave portions more uniformly inside the spherical lens molding portion 112. . Further, the laser beam can be scanned in a spiral manner using the center part starting point (end point) of the lens molding part 112. In this case, by setting the focal position according to the distance from the f-θ lens 107 to the irradiation position, a plurality of concave portions can be formed more uniformly inside the spherical lens molding portion 112. Further, as represented as a scanning line 131b in FIG. 12B, the laser beam is emitted in the direction of the lens forming portion (radial) while controlling the focal position along the scanning line 131b corresponding to the radius of the lens forming portion 112. ) Can also form a uniform recess. In this figure, the scanning line 131b is shown so as to scan from the center toward the circumferential side, but the present invention is not limited to this, and scanning can also be performed from the circumferential side toward the center. Furthermore, it is possible to scan from end to end along the scanning line corresponding to the diameter of the lens molding portion 112 at a time.

    The scanning of the laser beam shown as the scanning lines 131a and 132b can be controlled by scanning the laser beam in the X axis direction and the Y axis direction with the galvanometer mirrors 104 and 105, respectively. Further, by moving the cavity block 110 in the Z-axis direction using a focus control means (not shown), the focus position can be controlled more accurately, and a more uniform recess can be formed.

    As described above, in the method for manufacturing the light emitting device mold according to the present embodiment, it is more preferable that the second step described above changes the laser irradiation direction according to the positions of the plurality of recesses.

    FIG. 12 shows a scanning state of the laser beam inside the lens molding portion 112 of the cavity block 110. Outside the lens molding unit 112, the laser processing apparatus 100 linearly scans the laser beam. At this time, it is possible to form a concave portion outside the lens molding portion 112 by irradiating the laser beam. However, as shown in FIG. 11, it may be controlled not to form a concave portion outside the lens molding portion 112.

    FIG. 13 is a plan view showing another example of the shape of the recess formed in the cavity block. In FIG. 13, reference numeral 133a denotes a laser beam scanning line, 135 denotes a laser beam pulse irradiation point, and 52 denotes a concave portion formed by pulse irradiation. Note that the scanning line 133a and the pulse irradiation point 135 are set to have the same distance relationship as in FIG.

    In this case, the concave portion 52 is formed larger than the concave portion 50b shown in FIG. 6 by increasing the number of times the laser beam is irradiated at the pulse irradiation point 135 or increasing the power. Therefore, a circular (spherical) concave portion 52 is formed on the cavity block when viewed only from that point. This state is shown in the upper left concave portion 52 (circle drawn with a solid line and a broken line) in FIG. However, as shown in the figure, for example, when the number of times of irradiation is set to be particularly large, the radius of the recess 52 may become larger than half of the interval between the pulse irradiation points 135. In this case, when the laser beam is scanned from the left to the right (X-axis direction) and the next pulse irradiation is executed, the concave portion formed at this time is a partial region of the left concave portion already formed ( A part of the recessed part 52 that has already been formed is crushed by the recessed part 52 that is formed later and becomes a chipped shape.

    In addition, when the radius of the recess 52 is larger than half of the interval between the nearest recesses 52 in each adjacent scanning line 133a, the recess formed in the next row (the lower row in the figure) A part of the recesses already formed in the row (broken line portion) is affected, and a part of the recesses 52 already formed is crushed by the recesses 52 formed in the next row and becomes a chipped shape. . As a result, as shown in FIG. 13, the surface of the cavity block 110 has a shape in which the adjacent concave portions 52 overlap with each other and the scaly concave portions 52 are arranged.

    Thus, when the interval between the pulse irradiation points 135 is narrower than the size of the recess 52, adjacent recesses that have already been formed are deformed when each recess is formed. In such a case, the plurality of recesses 52 formed in the completed mold are not completely circular. However, when the entire scanning region 111 is viewed macroscopically, the plurality of recesses 52 are finely ground with a uniform shape. For this reason, it is possible to form a textured surface composed of a plurality of convex portions having a uniform shape in the light emitting device, and to uniformly diffuse light from the light emitting chip.

    In FIG. 13, the recess 52 can be formed by one-time laser beam irradiation. However, the recess 52 may be formed by a plurality of pulse irradiations.

    FIG. 14 is a plan view showing a second form of the forming method when the concave portions are arranged in a staggered manner in the cavity block. In FIG. 14, reference numeral 133b denotes a laser beam scanning line, 136 denotes a laser beam pulse irradiation point, and 53 denotes a recess formed by pulse irradiation.

    A plurality of recesses 53 are formed on the cavity block by irradiating a pulse of the laser beam at the pulse irradiation point 136 according to the scanning line 133b of the laser beam. Each recess 53 has an interval between adjacent recesses on the next scanning line of 1/2 in the X-axis direction and 1/2 in the Y-axis direction, where the interval between adjacent recesses in the X-axis direction (scanning direction) is 1. 1 / √3.

    The staggered arrangement of the recesses 53 in this figure differs from the recesses 50 in FIG. 3B in the interval between adjacent recesses in the Y-axis direction, but as a result, the plurality of recesses 53 shown in FIG. Similar to the recesses 50, a plurality of recesses 53 are staggered. The arrangement of the recesses 53 shown in FIG. 14 is a staggered arrangement in which the recesses 50 shown in FIG. 3B are rotated by 90 ° with respect to the scanning direction. Also in this case, since the concave portions 53 can be densely arranged, the surface formed in the first step can be extremely reduced. For this reason, for example, the processing traces formed by milling can be eliminated from the lens molding portion 112 to form a more uniform textured surface, and light can be diffused more uniformly. In addition, in FIG. 14, if the center point (pulse irradiation point 136) of the three adjacent recessed parts 53 is connected, it will become the equilateral triangle 190 shown with a broken line.

    FIG. 15 is a plan view showing a third form of the recess formed in the cavity block of the present embodiment.

    In FIG. 15, 133c is a laser beam scanning line, 137 is a laser beam pulse irradiation point, and 54 is a recess formed by pulse irradiation.

    By irradiating a pulse of the laser beam at the pulse irradiation point 137 according to the scanning line 133c of the laser beam, a plurality of recesses 54 are formed on the cavity block. Each recess 54 is 1 in the X-axis direction and 1 in the Y-axis direction when the interval between the recesses adjacent to each other in the X-axis direction (scanning direction) is 1. Become.

    In FIG. 15, when the center points (pulse irradiation points 137) of four adjacent concave portions 54 are connected, a square 191 indicated by a broken line is formed. As described above, the recesses 54 in FIG. 15 have a square arrangement.

    FIG. 16 is a plan view showing a fourth form of the recess formed in the cavity block of the present embodiment. In FIG. 16, 133d is a laser beam scanning line, 138 is a laser beam pulse irradiation point, and 55 is a recess formed by pulse irradiation.

    A plurality of recesses 55 are formed on the cavity block by irradiating a pulse of the laser beam at the pulse irradiation point 138 according to the scanning line 133d of the laser beam. Each recess 55 has an interval between adjacent recesses on the next scanning line of 1/2 in the X-axis direction and 1/2 in the Y-axis direction, where the interval between adjacent recesses in the X-axis direction (scanning direction) is 1. 1/2.

    The plurality of recesses 55 shown in FIG. 16 are the same as the plurality of recesses 54 in FIG. However, the staggered arrangement of the recesses 55 in FIG. 16 differs from the recesses 54 in FIG. 15 in the interval between adjacent recesses in the Y-axis direction.

    In FIG. 16, when the center points (pulse irradiation points 138) of four adjacent recesses 55 are connected, a square 192 indicated by a broken line is formed. As described above, the square 192 in FIG. 16 is arranged by rotating the square 191 in FIG. 15 by 45 °.

    Next, the actual surface shape of the light emitting device mold in which the concave portion is formed in the cavity block 110 by the laser processing apparatus 100 of the present embodiment, and the lens portion of the light emitting device molded using the mold will be described. .

    FIG. 17 is an optical micrograph showing the surface shape of the light emitting device mold in this example. FIG. 17A is a photograph magnified 450 times, and FIG. 17B is a photograph magnified 1000 times.

    The photograph in FIG. 17 shows the surface shape at the bottom of the lens molding portion 112 obtained by setting the scanning speed of the laser beam, the pulse width (on time) of the laser beam, and the pulse period to predetermined values. is there. As an example, in the example shown in this figure, the scanning speed is 5000 mm / s, and the formation is performed under a very high speed condition. The plurality of recesses are formed by irradiating the laser beam 10 times using the scanning method shown in FIG. As shown in FIGS. 17A and 17B, the plurality of substantially circular recesses are uniformly arranged in a staggered arrangement. In addition, as shown in this figure, a plurality of concave portions are uniformly formed even in a spherical lens molding portion where the distance (height) from the f-θ lens 107 to the irradiation position is not uniform. I understand.

    FIG. 18 is an optical micrograph showing the surface shape of the lens portion of the light emitting device in this example. FIG. 18 shows the surface shape of a light emitting device (lens portion) molded using the light emitting device mold of FIG. 18A is a photograph magnified 450 times, and FIG. 18B is a photograph magnified 1000 times. As shown in FIGS. 18A and 18B, a plurality of substantially circular convex portions are uniformly arranged in a staggered arrangement. Thus, it can be seen that the plurality of convex portions can be uniformly formed on the lens portion of the light emitting device by the spherical lens molding portion 112 in which the plurality of concave portions are uniformly formed.

    According to the present embodiment, uniform recesses can be formed in the light emitting device mold using laser processing. Therefore, by emitting uniform light, it is possible to provide a light emitting device that can diffuse uniformly while efficiently emitting light. In addition, since the plurality of recesses can be formed in a short time by laser processing, it is possible to realize mold processing at a low cost.

    Therefore, according to this embodiment, a high-performance light-emitting device can be provided at a low cost.

    In addition, this invention includes the light-emitting device and its manufacturing method, the metal mold | die for light-emitting devices, and the manufacturing method of the metal mold | die.

    In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

    For example, although the light emitting device in which the light emitting chip is sealed and the manufacturing method thereof have been described, the present invention is not limited to this. For example, also for a light receiving device in which a light receiving chip (light receiving element) such as a photodiode or a phototransistor is sealed, the present invention can be applied to the lens portion to improve the light collecting property. As described above, the present invention can be applied to various optical devices, and optical characteristics can be improved by applying to any of a light emitting device and a light receiving device. Further, the present invention can also be adopted when not only the light emitting chip and the light receiving chip but also other semiconductor chips are encapsulated with resin.

    In addition, an example in which the cavity block 110 as a mold member (work) is configured separately from the upper mold 11 of the main body portion and a plurality of recesses are formed only in the cavity block 110 has been described. It is not limited to. For example, a configuration in which the cavity block is assembled to the upper mold, or a plurality of recesses can be formed in the upper mold in which the cavity portion is configured without separating the cavity block portion. In this case, for example, a plurality of recesses can be formed collectively on another surface such as the side surface of the cavity, so that a plurality of recesses can be efficiently formed.

    Further, it has been described that the optical characteristics such as light diffusibility can be improved as the operational effects of the present invention, but the present invention has other useful effects. By forming a plurality of concave portions as in the above embodiment, it is possible to make the surface of the mold a fine textured surface having good light diffusibility. In this case, it is possible to improve the mold releasability by making the surface of the mold a matte surface. Therefore, in order to improve the mold releasability of a general thermosetting resin containing a filler, a cartridge other than the cavity is used. The pear ground may be formed in the same manner on the mold member constituting the runner or the gate. In this case, a satin surface having a uniform concave portion (in other words, a uniform concave and convex portion) can be formed, so that good release properties can be obtained. In addition, this type of pear ground is generally formed by electrical discharge machining. However, when the pear ground is formed by the method of the present invention, the machining time required for the pear ground formation itself is extremely small compared to electrical discharge machining. Can be shortened. In addition, the electrode machining time and machining cost required for electrical discharge machining are not required, and the machining time and machining cost as a whole can be significantly cut. Therefore, a high-quality mold with improved releasability is extremely efficient. It has another effect that it can be manufactured automatically.

    Furthermore, in the above embodiment, an example in which the present invention is applied to a mold for transfer molding in which a light-emitting chip is sealed with a thermosetting resin as one form of injection molding has been described, but the present invention is not limited thereto. For example, as a molding method for molding a thermosetting resin or a thermoplastic resin, various molding molds that require the molded product to be released from the mold, such as compression molding, injection molding, extrusion molding, or blow molding. It can also be applied to. Furthermore, the present invention is applied not only to a mold for sealing an optical chip or the like but also to a mold for molding an optical member such as a light guide plate, a diffusion sheet or a prism sheet used for a backlight. Can do.

    As for the laser oscillator, various lasers such as an infrared laser, a visible laser, an ultraviolet laser, and an X-ray may be used as long as the laser is suitable for processing a workpiece even if it is a laser other than the laser described above. It can be used regardless of the oscillation method such as continuous oscillation, normal pulse oscillation or Q-switch pulse oscillation. For example, a solid-state laser using a ruby laser or glass as a base material, a semiconductor laser using a laser diode such as GaAs or InGaAsP, a liquid laser such as a dye laser, a He-Ne laser, an argon ion laser, various excimers Various lasers such as a gas laser such as a laser can be used.

    It is also possible to use a laser oscillator that obtains a desired output using a pulse oscillation fiber system in which laser beams output from a plurality of laser diodes are amplified in the fiber. In this case, instead of the on / off control of the laser beam 20 by the shutter 102 described above, the output of the laser diode can be controlled on / off to control the irradiation of the laser beam 20 on / off.

    Furthermore, although the embodiment in which the output of the laser beam 20 is turned on / off to form a plurality of recesses has been described, it is possible to adopt a configuration that performs control to change the intensity irradiated with the laser beam 20 in an analog manner. it can. For example, the output of the laser oscillator 101 can be controlled to a predetermined waveform (for example, a sine wave) so that the level is high at the point of the pulse 171 in FIG. 4 and the level between the pulses 171 is low. Even in such a case, a plurality of recesses can be formed uniformly as in the above embodiment. In addition, a method for changing the degree of opening of the shutter or a predetermined power so as to reduce the beam diameter to the point of the pulse 171 in FIG. It can also be controlled to change the beam diameter in an analog manner into a wave shape.

    Further, although the embodiment in which the laser beam is scanned at a constant scanning speed has been described, the present invention is not limited to this, and the scanning speed of the laser beam can be appropriately changed. For example, when the scanning speed is different between the odd-numbered scanning lines and the even-numbered scanning lines, when the scanning speed is different between the lens forming unit 112 and other places, or when the same position is irradiated with the laser beam multiple times It can be increased or decreased according to the number of times of irradiation.

    Moreover, although the example which scans a laser beam using a galvano scanner was demonstrated, this invention is not limited to this. For example, it is possible to adopt a configuration in which the laser beam is scanned on the workpiece relatively by operating the workpiece by a servo mechanism or the like without scanning the laser beam itself. Also, scanning in the X-axis direction and scanning in the Y direction can be realized by combining a galvano scanner and a servo mechanism.

    Moreover, although the Example which processes a workpiece | work in air | atmosphere was demonstrated, this invention is not limited to this, It can also process in various assist gas and shield gas atmosphere.

It is a schematic block diagram of the laser processing apparatus in a present Example. It is an enlarged view of the lens molding part formed in the cavity block in a present Example. It is a figure which shows an example of the scanning method of the laser beam in a present Example. It is a figure which shows the irradiation timing of the laser beam in a present Example. In this example, it is an enlarged cross-sectional view of a cavity block for explaining a formation process of a recess 50 when a laser beam irradiation is performed a plurality of times. In an Example, it is an enlarged plan view of the cavity block at the time of performing multiple times of laser beam irradiation. It is sectional drawing which showed the mode of the laser beam irradiation in a present Example. It is sectional drawing which shows notionally the shape of the several recessed part formed in the cavity block by the laser beam irradiation shown by FIG. It is sectional drawing which shows the resin sealing method of the light emitting device in a present Example. It is sectional drawing of the light-emitting device in a present Example. It is a top view which shows the other example of the other laser beam irradiation location in a cavity block. It is a figure which shows the other scanning method of a laser beam. It is a top view which shows the other example of the shape of the recessed part formed in a cavity block. It is a top view which shows the 2nd form of the formation method at the time of carrying out staggered arrangement | positioning of the recessed part in a cavity block. It is a top view which shows the 3rd form of the recessed part formed in the cavity block of a present Example. It is a top view which shows the 4th form of the recessed part formed in the cavity block of a present Example. It is an optical microscope photograph which shows the surface shape of the metal mold | die for light emitting devices in a present Example. It is an optical microscope photograph which shows the surface shape of the lens part of the light-emitting device in a present Example.

Explanation of symbols

10, 110 ... cavity block 11 ... upper mold 12 ... lower mold 20, 181 ... laser beam 30 ... resin tablet 31a, 31b ... translucent resin 50, 50a, 50b, 51 ... concave portions 60a, 60b ... convex portions 65, 67 ... lens portion 80 ... lead frame 90 ... light emitting chip 100 ... laser processing apparatus 101 ... laser oscillator 102 ..Shutter 103 ... Expander 104 ... Galvano mirror (X-axis mirror)
105 ... Galvano mirror (Y-axis mirror)
106 ... bender mirror 107 ... f- [theta] lens 110a ... processing plane 111 ... scanning area 112 ... lens molding part 113 ... area 122 ... bottom part 131, 131a of the lens molding part 131b, 132, 133a, 133b, 133c, 133d ... scanning lines 135, 136, 137, 138 ... pulse irradiation points 151 ... pulse interval 152 ... interval 170 ... waveform 171 ... Pulse 201 ... plunger 202 ... pot 211 ... cal 212 ... runner 213 ... gate 214 ... cavity

Claims (8)

A method of manufacturing a mold for an optical device,
A first step of forming a lens molding part having a concave shape for molding a lens part of an optical device on a workpiece on a member constituting the bottom surface of the cavity ;
A second step of irradiating the workpiece with a laser to form a plurality of recesses in the lens molding part, and
The optical device mold includes the lens molding portion having the concave shape in which the plurality of concave portions are formed, and the cavity including the lens molding portion is filled with a translucent resin and cured. A method of manufacturing a mold for an optical device, wherein the optical chip mounted on a substrate of the optical device is sealed and a lens portion of the optical device is formed.   2. The method of manufacturing an optical device mold according to claim 1, wherein in the second step, the recess is formed by irradiating the laser at a position where the recess is formed a plurality of times.   3. The method of manufacturing an optical device mold according to claim 1, wherein in the second step, the laser is irradiated to the lens molding portion and a peripheral portion of the lens molding portion.   4. The method of manufacturing a mold for an optical device according to claim 1, wherein the second step irradiates the entire surface of the workpiece with the laser. 5.   5. The method for manufacturing a mold for an optical device according to claim 1, wherein in the second step, the irradiation direction of the laser is changed according to the positions of the plurality of recesses. . An optical device mold for manufacturing an optical device,
A lens molding part having a concave shape for molding the lens part of the optical device , formed on a member constituting the bottom surface of the cavity of the optical device mold ;
A plurality of concave portions formed in the lens molding portion by irradiating with a laser,
The optical device mold includes the lens molding portion having the concave shape in which the plurality of concave portions are formed, and the cavity including the lens molding portion is filled with a translucent resin and cured. An optical device mold characterized by being configured to seal an optical chip mounted on a substrate of the optical device and to form a lens portion of the optical device. An optical device manufacturing method comprising:
A first step of forming a lens molding part for molding the lens part of the optical device on the workpiece;
A second step of irradiating the workpiece with a laser to form a plurality of recesses in the lens molding part;
A third step of mounting the optical chip on the substrate;
A mold manufactured through the first step and the second step is filled with a translucent resin and cured, thereby sealing the optical chip and forming a lens portion of the optical device. And a step of manufacturing the optical device. An optical device,
A substrate,
An optical chip mounted on the substrate;
A lens portion formed of a translucent resin that seals the optical chip,
The said lens part is shape | molded using the metal mold | die provided with the some recessed part by laser irradiation, and is provided with a some convex part.