TWI579091B - A method of manufacturing an optical micro-structure, the machine and the light guide plate - Google Patents

A method of manufacturing an optical micro-structure, the machine and the light guide plate Download PDF

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TWI579091B
TWI579091B TW104116813A TW104116813A TWI579091B TW I579091 B TWI579091 B TW I579091B TW 104116813 A TW104116813 A TW 104116813A TW 104116813 A TW104116813 A TW 104116813A TW I579091 B TWI579091 B TW I579091B
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laser beam
laser
substrate
micro
recess
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TW201641205A (en
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葉鈞皓
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茂林光電科技股份有限公司
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光學微結構之製造方法、機台及其導光板 Optical microstructure manufacturing method, machine and light guide plate thereof

本發明係關於雷射加工領域,尤其是一種藉由多模雷射加工以形成光學微結構之製造方法、機台及其導光板。 The invention relates to the field of laser processing, in particular to a manufacturing method, a machine table and a light guide plate thereof for forming an optical microstructure by multi-mode laser processing.

導光板係為一種使用於背光模組內供以導引光線之元件,其透過全反射原理將光源提供之光線先行傳導至導光板遠端,並利用其上佈設之數個光學結構破壞光線全反射,以將光線導引至出光面形成均勻面光源。 The light guide plate is an element for guiding light in the backlight module, and transmits the light provided by the light source to the distal end of the light guide plate through the principle of total reflection, and destroys the light by using several optical structures disposed thereon. Reflecting to direct light to the exit surface to form a uniform surface source.

傳統於導光板形成光學結構所採用之方式,係將設計好之光學結構圖樣透過網印方式直接於導光板形成網點,但此種方式由於印刷時之油墨黏度不易控制且因油墨特性而使光學結構之尺寸受限,進而影響產出品質與出光均勻度。且無法於導光板成型時一併設置有光學結構,須進行二次加工,而不符大量生產之需求。綜合上述缺點,因此後續係衍伸出屬非印刷式導光板之製造方法。 Conventionally, the light guide plate is formed into an optical structure by forming a well-designed optical structure pattern through a screen printing method directly to the light guide plate to form a dot, but this method is difficult to control due to ink viscosity during printing and is optical due to ink characteristics. The size of the structure is limited, which in turn affects the quality of the output and the uniformity of light output. Moreover, it is impossible to provide an optical structure when the light guide plate is formed, and secondary processing is required, which is inconsistent with the demand for mass production. In combination with the above disadvantages, the subsequent process is a method of manufacturing a non-printed light guide plate.

為了於導光板射出成形時將光學結構一併結合於上,係採用針對導光板模仁直接進行機械加工,或是透過蝕刻方式使光學結構圖樣成形於模仁表面,以利直接於導光板上直接產生光學結構。然而,採用機械加工之方式係極為耗時且光學結構之尺寸亦容易具有誤差,或是無法達到所需的微小尺寸要求。而蝕刻方式則需透過繁複過程如塗佈、曝光及電鑄 等等手續,亦提升模仁製造之時間成本與難度。 In order to bond the optical structure together on the light guide plate, the optical structure is directly processed by the mold, or the optical structure is formed on the surface of the mold by etching, so as to directly on the light guide plate. Directly produces an optical structure. However, the use of machining is extremely time consuming and the size of the optical structure is subject to errors or the required small size requirements. The etching method needs to pass through complicated processes such as coating, exposure and electroforming. The procedures, etc., also increase the time cost and difficulty of manufacturing the mold.

故為可提升模仁或導光板上光學結構圖樣之製造效率,係出現如中華民國申請號第93113610號所揭示之導光板結構及其製造方法,其係利用至少一雷射照射於一基板表面之不同位置,並於每一位置上形成皺褶網點以形成一模仁,並藉所述模仁成型一導光板。亦有直接於一基材上,依據設計之光學結構圖樣以雷射照射形成數個微型凹孔,並使基材可為導光板本體或為金屬基材而作為導光板之印壓模具之方式,藉此以快速且準確地直接於導光板或模仁表面形成光學結構圖樣。然而,在雷射高溫照射下並無法有效地避免所述基板或基材產生熔渣噴濺之現象,因此於所述微型凹孔或皺褶網點周圍會形成一個或多個凸起物。所述凸起物極易因彎折或崩塌而落入所述微型凹孔或皺褶網點內,進而影響光學結構圖樣之形狀,造成於實際應用時均光與導引光線之效能。 Therefore, in order to improve the manufacturing efficiency of the optical structure pattern on the mold core or the light guide plate, there is a light guide plate structure and a manufacturing method thereof disclosed in the Republic of China Application No. 93113610, which is irradiated to a substrate surface by using at least one laser. Different positions, and wrinkle dots are formed at each position to form a mold, and a light guide plate is formed by the mold. There is also a method of forming a plurality of micro-recessed holes by laser irradiation directly on a substrate according to a designed optical structure pattern, and making the substrate a light guide plate body or a metal substrate as a printing mold of the light guide plate. Thereby, the optical structure pattern is formed directly and directly on the surface of the light guide plate or the mold core quickly and accurately. However, under the high-temperature exposure of the laser, the phenomenon that the substrate or the substrate is caused to slag splashing cannot be effectively prevented, so that one or more protrusions are formed around the micro-recessed or wrinkled dots. The protrusions are easily collapsed or collapsed into the micro-recessed holes or wrinkle points, thereby affecting the shape of the optical structure pattern, resulting in the effect of uniform light and guiding light in practical applications.

為了消彌利用雷射光束製造光學結構圖樣時所產生之所述凸起物,係出現如中華民國申請號第100103674號所述之一種雷射加工火山口之平整方法,其係適用於製作一光學微結構圖案,方法係於一基材根據一圖案設計,對所述基材之一外表面進行雷射加工,以致所述外表面形成多個微型凹孔,其中每一所述微型凹孔之開口周緣係具有至少一凸起物,於雷射加工完畢後移除每一微型凹孔周緣之凸起物,以致平整化微型凹孔之周緣,使微型凹孔形成所述光學微結構圖案。其中,於第100103674號專利中更進一步提示可藉由一刀具切除所述凸起物,或以噴出高壓砂礫以撞擊所述基材表面,或藉由一研磨工具研磨基材之所述外表面以移除所述凸起物等方式。然而無論以上述何種方式移除所述凸起物,皆為在雷射加工 後再一次進行其他加工製程,且切除、撞擊及研磨等製程步驟亦相當繁複,而造成製作光學微結構圖案需耗費大量時間,且針對移除凸起物之成效亦不彰。 In order to eliminate the protrusions produced when the optical structure pattern is produced by using a laser beam, a method for leveling a laser processing crater as described in the Republic of China Application No. 100103674 is suitable for making a An optical microstructure pattern is formed by laser processing a surface of an outer surface of a substrate according to a pattern such that the outer surface forms a plurality of micro recesses, wherein each of the micro recesses The periphery of the opening has at least one protrusion, and after the laser processing is completed, the protrusion of the periphery of each micro-recess hole is removed, so that the periphery of the micro-recess hole is planarized, so that the micro-recess hole forms the optical microstructure pattern . Further, it is further indicated in the patent of No. 100103674 that the protrusion may be cut by a cutter, or the high pressure grit may be sprayed to strike the surface of the substrate, or the outer surface of the substrate may be ground by an abrasive tool. To remove the protrusions and the like. However, regardless of the manner in which the protrusions are removed in the above manner, they are all processed in laser processing. After another processing process, the process steps of cutting, impacting, and grinding are quite complicated, and it takes a lot of time to make the optical microstructure pattern, and the effect of removing the protrusions is not good.

接著,中華民國申請號第100103673號係揭示之一種導光板之光學微結構圖案之製作方法。所述製作方法係先藉由一第一雷射光束轟擊一基材之表面,待形成所述微型凹孔與其周緣之多個凸起物後,沿每一所述微型凹孔周緣之時針方向,藉由多個第二雷射光束間隔地轟擊所述凸起物,以破壞凸起物並形成多個凹陷部。其於消除所述凸起物時係藉由移動一雷射發射器以順時針或逆時針方向使所述第二雷射光束依序轟擊所述凸起物。藉此,係消除所述微型凹孔受所述凸起物影響而形成之火山口型態,避免造成導光板之導光效果下降,或是具有所述微型凹孔之印壓模具製造之導光板光學圖樣產生誤差。 Next, the method of fabricating an optical microstructure pattern of a light guide plate disclosed in the Republic of China Application No. 100103673. The manufacturing method firstly bombards a surface of a substrate by a first laser beam, and after forming a plurality of protrusions of the micro concave hole and the periphery thereof, a clockwise direction along a circumference of each of the micro concave holes The protrusions are bombarded at intervals by a plurality of second laser beams to break the protrusions and form a plurality of recesses. When the protrusion is removed, the second laser beam is sequentially bombarded with the protrusion by moving a laser emitter in a clockwise or counterclockwise direction. Thereby, the crater shape formed by the micro-recess holes being affected by the protrusions is eliminated, the light guiding effect of the light guide plate is prevented from being lowered, or the guide die manufacturing with the micro-recess holes is formed. The optical pattern of the light plate produces an error.

惟,上述方式雖可降低所述凸起物對整體光學結構圖樣之影響,但必須經過二次雷射加工,又所述凸起物之分布態樣並無一定,因此第二雷射光束亦須逐一依據所述凸起物之分布調整轟擊位置。並且需沿所述微型凹孔周緣間隔地照射,係需耗費極長之加工時間。再者,隨光學結構圖樣包含之凹孔數量提高,加工時間亦須隨之拉長。 However, although the above method can reduce the influence of the protrusion on the overall optical structure pattern, it must undergo secondary laser processing, and the distribution of the protrusion is not constant, so the second laser beam is also The bombardment position must be adjusted one by one according to the distribution of the protrusions. Moreover, it is necessary to illuminate at intervals along the circumference of the micro-recessed holes, which requires extremely long processing time. Furthermore, as the number of recessed holes included in the optical structure pattern increases, the processing time must also be lengthened.

因此,如何有效地降低消除所述凸起物所需之加工時間,同時確保所述微型凹孔之完整性,係為當前雷射加工亟需改善之處。故本發明人係構思一種多模雷射加工機台、方法及其導光板,以解決上述於當前導光板製造方法尚存有之缺失。 Therefore, how to effectively reduce the processing time required to eliminate the projections while ensuring the integrity of the micro-recessed holes is an improvement in current laser processing. Therefore, the inventors conceived a multi-mode laser processing machine, method and light guide plate thereof to solve the above-mentioned shortcomings in the current light guide plate manufacturing method.

本發明之一目的,旨在提供一種光學微結構之製造方法、機台及其導光板,其係可增進雷射加工製造光學微結構之能力,並有效地節省加工時間,提升生產效率。 An object of the present invention is to provide a method for manufacturing an optical microstructure, a machine table and a light guide plate thereof, which can improve the ability of laser processing to manufacture an optical microstructure, and effectively save processing time and improve production efficiency.

為達上述目的,本發明於一實施方式中提出一種多模雷射加工機台之光學微結構製造方法,其步驟包括:提供一基板;照射一第一雷射光束及一第二雷射光束至一合束鏡,且所述第一雷射光束與所述第二雷射光束具有相異雷射模態;及通過所述合束鏡之所述第一雷射光束及所述第二雷射光束重合照射至所述基板,所述第一雷射光束係於基板形成一微型凹部,並同時於所述微型凹部周側產生一噴濺區,所述第二雷射光束則轟擊所述噴濺區並形成一凹陷部,且凹陷部之深度小於所述微型凹部之深度。藉此,係可透過所述合束鏡重合所述第一雷射光束及第二雷射光束,以達單次轟擊即可形成平整之所述微型凹部之功效,大幅縮短製造光學微結構所需之時間。且針對所述第一雷射光束及第二雷射光束之各項參數皆可因應欲成型之光學微結構圖樣而獨立調整。此外,本發明於下列其他實施方式中,承襲上述實施方式之技術特徵,並更進一步提出改良方案。 In order to achieve the above object, the present invention provides an optical microstructure manufacturing method for a multi-mode laser processing machine in an embodiment, the method comprising: providing a substrate; illuminating a first laser beam and a second laser beam a beam splitter mirror, and the first laser beam and the second laser beam have different laser modes; and the first laser beam and the second through the beam combiner The laser beam is incident on the substrate, the first laser beam is formed on the substrate to form a micro recess, and at the same time, a splash zone is generated on the circumference of the micro recess, and the second laser beam is bombarded. The sputtering zone is formed and a recess is formed, and the depth of the recess is smaller than the depth of the micro recess. Thereby, the first laser beam and the second laser beam can be superposed through the beam combining mirror to form a flattened micro-recessed portion by a single bombardment, thereby greatly shortening the manufacturing of the optical microstructure. Time required. And the parameters of the first laser beam and the second laser beam can be independently adjusted according to the optical microstructure pattern to be formed. Further, the present invention inherits the technical features of the above-described embodiments in the following other embodiments, and further proposes an improvement.

又,本發明於一實施方式中,係設計所述第一雷射光束及第二雷射光束之橫模圖像係為旋轉對稱,且於照射至所述基板時,所述第一雷射光束及第二雷射光束之橫模圖像電磁場分佈狀態為相互錯開。藉由控制調整所述第一雷射光束及第二雷射光束之橫模圖像,確保所述第二雷射光束照射至所述基板時係準確地轟擊於所述噴濺區,以有效於噴濺區處形成所述凹陷部。 Moreover, in one embodiment, the transverse mode image of the first laser beam and the second laser beam is designed to be rotationally symmetric, and the first laser is irradiated to the substrate. The electromagnetic field distribution states of the transverse mode image of the beam and the second laser beam are staggered from each other. Controlling and adjusting the transverse mode image of the first laser beam and the second laser beam to ensure that the second laser beam is accurately bombarded to the splash region when irradiated to the substrate, so as to be effective The recess is formed at the splash region.

此外,為了達到最佳轟擊噴濺區之成效,而使所述微型凹孔 周側保持平整化,本發明經實驗後針對所述第二雷射光束之橫模圖像進一步提供另一實施方式,於實施方式中,所述第二雷射光束之橫模圖像係為一圓環,或於另一實施方式中,所述第二雷射光束之橫模圖像係為數個不相連花瓣狀排列區塊。 In addition, in order to achieve the best effect of bombarding the splash zone, the micro recess The circumferential side remains flat, and the present invention further provides another embodiment for the transverse mode image of the second laser beam after the experiment. In an embodiment, the transverse mode image of the second laser beam is A ring, or in another embodiment, the transverse mode image of the second laser beam is a plurality of discrete petal-like array blocks.

而本發明之製造方法係提供再一實施方式為使所述基板為一金屬模具,以於所述基板形成所述微型凹部後,利用基板對已製作完成之一導光板進行印壓,以於所述導光板上形成微型凹孔。或於另一實施方式中,使所述基板為一導光板,於此係揭露本發明之光學微結構製造方法係可直接針對導光板進行加工,以將由數個微型凹孔組成之光學微結構形成於導光板表面。 The manufacturing method of the present invention provides another embodiment in which the substrate is a metal mold, and after the micro concave portion is formed on the substrate, one of the light guide plates that have been fabricated is pressed by the substrate. A micro concave hole is formed on the light guide plate. Or in another embodiment, the substrate is a light guide plate, and the optical microstructure manufacturing method of the present invention is directly processed for the light guide plate to form an optical microstructure composed of a plurality of micro recessed holes. Formed on the surface of the light guide plate.

本發明並更進一步於一實施方式中揭露一種用以執行如前諸實施方式述及之多模雷射加工機台之光學微結構製造方法之多模雷射機台,係包括:一第一雷射共振腔,用以產生所述第一雷射光束;一第二雷射共振腔,用以產生所述第二雷射光束;一承載平台,用以容置所述基板;及一加工機組,包括所述合束鏡及一傳動件,所述傳動件用以根據一光學微結構分布設計資料,利用經所述合束鏡重合之第一雷射光束與第二雷射光束,加工所述基板。 The present invention further provides, in an embodiment, a multi-mode laser machine for performing the optical microstructure manufacturing method of the multi-mode laser processing machine as described in the foregoing embodiments, including: a first a laser cavity for generating the first laser beam; a second laser cavity for generating the second laser beam; a carrier platform for accommodating the substrate; and a processing The unit includes the beam combining mirror and a transmission member, wherein the transmission member is configured to distribute design data according to an optical microstructure, and process the first laser beam and the second laser beam by the combination of the beam combining mirrors. The substrate.

基於上述實施方式,為使所述微型凹部之製程可達到最佳化與快速化之優點,係於一實施方式中,使所述第一雷射光束及第二雷射光束之橫模圖像係為旋轉對稱,且於照射至所述基板時,所述第一雷射光束及第二雷射光束之橫模圖像電磁場分佈狀態為相互錯開,確保第二雷射光束照射至基板時係準確地轟擊於所述噴濺區,以有效於噴濺區處形成所述 凹陷部。 Based on the above embodiment, in order to optimize the process of the micro-recess, the transverse laser image of the first laser beam and the second laser beam is obtained in an embodiment. Rotatingly symmetrical, and when irradiating to the substrate, the electromagnetic field distribution states of the transverse mode images of the first laser beam and the second laser beam are shifted from each other to ensure that the second laser beam is irradiated to the substrate Accurately bombarding the splash zone to effectively form the shower zone Depression.

此外,本發明亦於一實施方式揭露一種導光板,其特徵在於:具有數個光學微結構,任一光學微結構係透過如前諸實施方式述及之多模雷射加工機台之光學微結構製造方法製成,因而具有所述微型凹部,及環狀排列於所述噴濺區之所述些凹陷部,且所述之凹陷部呈不相連花瓣狀排列。 In addition, the present invention also discloses a light guide plate having a plurality of optical microstructures, and any optical microstructures are transmitted through the optical micros of the multimode laser processing machine as described in the previous embodiments. The structure manufacturing method is formed to have the micro recesses and the recesses arranged annularly in the splash zone, and the recesses are arranged in a non-contiguous petal shape.

綜上所述,本發明之多模雷射加工機台、方法及其導光板,係利用所述合束鏡重合所述第一雷射光束與第二雷射光束,使單次加工照射下即可於所述基板形成所述微型凹部及凹陷部,有效地縮短加工所需時間,藉以提升生產效率,並相較於習知雷射加工製程,可使基板表面具更佳之平整效果。此外,於本發明提供之製造方法,係可自由地調整所述第一雷射光束及第二雷射光束之各項參數如模態、相互間距及能量強弱等,除可縮短加工時間外,亦可使加工後之微型凹部更符合所設計之光學微結構圖樣需求。 In summary, the multi-mode laser processing machine and method of the present invention and the light guide plate thereof use the beam combining mirror to overlap the first laser beam and the second laser beam to make a single processing illumination. The micro concave portion and the concave portion can be formed on the substrate, thereby effectively shortening the processing time, thereby improving the production efficiency, and the substrate surface can have a better flattening effect than the conventional laser processing process. In addition, in the manufacturing method provided by the present invention, the parameters of the first laser beam and the second laser beam, such as modality, mutual spacing, and energy intensity, can be freely adjusted, except that the processing time can be shortened. The processed micro-recesses can also be made to conform to the designed optical microstructure design requirements.

【第一實驗例】 [First Experimental Example]

10‧‧‧基板 10‧‧‧Substrate

101‧‧‧微型凹部 101‧‧‧ miniature recess

102‧‧‧凸起物 102‧‧‧Protrusions

11‧‧‧第一雷射光束 11‧‧‧First laser beam

12‧‧‧第一光學鏡頭 12‧‧‧First optical lens

13‧‧‧第二雷射光束 13‧‧‧second laser beam

14‧‧‧第二光學鏡頭 14‧‧‧Second optical lens

S101~S103‧‧‧步驟 S101~S103‧‧‧Steps

【第二實驗例】 [Second Experimental Example]

20‧‧‧基板 20‧‧‧Substrate

201‧‧‧微型凹部 201‧‧‧ miniature recess

202‧‧‧凹陷部 202‧‧‧Depression

21‧‧‧第一雷射光束 21‧‧‧First laser beam

S201~S202‧‧‧步驟 S201~S202‧‧‧Steps

【本發明】 【this invention】

30‧‧‧基板 30‧‧‧Substrate

301‧‧‧微型凹部 301‧‧‧ miniature recess

302‧‧‧噴濺區 302‧‧‧Splash area

303‧‧‧凹陷部 303‧‧‧Depression

31‧‧‧第一雷射光束 31‧‧‧First laser beam

32‧‧‧第二雷射光束 32‧‧‧second laser beam

4‧‧‧多模雷射機台 4‧‧‧Multimode laser machine

40‧‧‧第一雷射共振腔 40‧‧‧First laser cavity

41‧‧‧第二雷射共振腔 41‧‧‧Second laser cavity

42‧‧‧承載平台 42‧‧‧Loading platform

43‧‧‧加工機組 43‧‧‧Processing unit

431‧‧‧合束鏡 431‧‧ ‧ beam mirror

432‧‧‧傳動件 432‧‧‧ Transmission parts

5‧‧‧導光板 5‧‧‧Light guide plate

50‧‧‧光學微結構 50‧‧‧Optical microstructure

S301~S303‧‧‧步驟 S301~S303‧‧‧Steps

第1圖,為本發明第一實驗例之方法步驟圖。 Fig. 1 is a flow chart showing the method of the first experimental example of the present invention.

第2圖,為本發明第一實驗例之加工示意圖。 Fig. 2 is a schematic view showing the processing of the first experimental example of the present invention.

第3圖,為本發明第二實驗例之方法步驟圖。 Fig. 3 is a flow chart showing the method of the second experimental example of the present invention.

第4圖,為本發明第二實驗例之加工狀態及微型凹孔示意圖。 Fig. 4 is a schematic view showing the processing state and micro-recessed holes of the second experimental example of the present invention.

第5圖,為本發明一實施例之方法步驟圖。 Figure 5 is a diagram showing the steps of a method according to an embodiment of the present invention.

第6圖,為本發明一實施例之第一雷射光束橫模圖像示意圖。 Figure 6 is a schematic view showing a transverse mode image of a first laser beam according to an embodiment of the present invention.

第7A圖,為本發明一實施例之第二雷射光束橫模圖像示意圖(一)。 FIG. 7A is a schematic diagram (1) of a transverse laser image of a second laser beam according to an embodiment of the invention.

第7B圖,為本發明一實施例之第二雷射光束橫模圖像示意圖(二)。 FIG. 7B is a schematic diagram (2) of a transverse mode image of a second laser beam according to an embodiment of the invention.

第7C圖,為本發明一實施例之第二雷射光束橫模圖像示意圖(三)。 FIG. 7C is a schematic diagram (3) of a transverse mode image of a second laser beam according to an embodiment of the invention.

第8圖,為本發明一實施例之第一雷射光束及第二雷射光束重合後之橫模態樣示意圖。 FIG. 8 is a schematic diagram showing a transverse mode after the first laser beam and the second laser beam are overlapped according to an embodiment of the invention.

第9圖,為本發明一實施例之雷射加工基板之示意圖(一)。 Figure 9 is a schematic view (1) of a laser processing substrate according to an embodiment of the present invention.

第10圖,為本發明一實施例之雷射加工基板之示意圖(二)。 Figure 10 is a schematic view (2) of a laser processing substrate according to an embodiment of the present invention.

第11圖,為本發明一實施例之機台示意圖。 Figure 11 is a schematic view of a machine table according to an embodiment of the present invention.

第12圖,為本發明一實施例之導光板示意圖。 Figure 12 is a schematic view of a light guide plate according to an embodiment of the present invention.

請參閱第1及2圖,其係為本發明第一實驗例之方法步驟圖及加工示意圖。鑒於習知應用雷射針對導光板製造光學結構之方法缺失,本發明人為可有效解決所述些缺失並且提升加工效率,係於雷射加工領域進行諸多實驗以獲得透過雷射進行光學微結構加工之一最佳方法。以下係針對本發明人之一第一實驗例進行說明。 Please refer to FIGS. 1 and 2, which are process diagrams and processing diagrams of the first experimental example of the present invention. In view of the lack of a conventional method for manufacturing an optical structure for a light guide plate by using a laser, the inventors can effectively solve the above-mentioned defects and improve the processing efficiency, and carry out many experiments in the field of laser processing to obtain optical microstructure processing through laser. One of the best ways. The following is a description of the first experimental example of one of the inventors.

常見之雷射光束輸出係利用電磁波透過增益介質來調整輸出雷射光束之特性。且增益介質係可封閉於光學共振腔內,以進一步使電磁波可於光學共振腔內產生共振現象,使電磁波在往返來回的過程中不斷地經過增益介質,當到達臨界狀態後即可輸出雷射光束,惟電磁波於光學共振腔之運作及光學共振腔之設計等,已為目前極為普遍之技術,於此即不再加以贅述。而電磁波於光學共振腔內傳遞時,係會受到光學共振腔邊界規範影響其電磁場態樣,因此電磁波之電磁場隨相異的邊界條件即會產 生不同之分布狀態,而上述狀態即為電磁場的模式,簡稱為模(Mode)。雷射光束的模可分為縱模(Longitudinal Mode)及橫模(Transverse Mode),不同的縱模與橫模之間,除了有光強度的差異外,亦具有頻率的差異。對於不同的橫模光強度分布,係可由肉眼觀察雷射光束之圖像(Patten)得知其橫模圖像之態樣,而縱模則無法由肉眼看出其光強度分布。進一步言,當電磁波於光學共振腔內穩定地來回反射震盪時,其允許存在穩定的橫向電磁場分佈形態,其即為上述所稱的橫模圖像。而常見的橫模圖像有兩種形式,一種為軸對稱圖像,一般稱為Hermite-Gaussian Modes,另一種則為旋轉對稱,一般稱為Laguerre-Gaussian Modes。 A common laser beam output uses electromagnetic waves to transmit a gain medium to adjust the characteristics of the output laser beam. The gain medium can be enclosed in the optical resonant cavity to further enable the electromagnetic wave to generate a resonance phenomenon in the optical resonant cavity, so that the electromagnetic wave continuously passes through the gain medium during the round-trip process, and the laser can be output when the critical state is reached. The beam, but the operation of the electromagnetic wave in the optical cavity and the design of the optical cavity, has become a very common technology, and will not be described here. When the electromagnetic wave is transmitted in the optical cavity, the electromagnetic field is affected by the boundary condition of the optical cavity, so the electromagnetic field of the electromagnetic wave will be produced according to the different boundary conditions. Different distribution states occur, and the above state is the mode of the electromagnetic field, which is simply referred to as mode. The mode of the laser beam can be divided into a longitudinal mode and a transverse mode. The difference between the longitudinal mode and the transverse mode has a difference in frequency in addition to the difference in light intensity. For different transverse mode light intensity distributions, the image of the laser beam can be visually observed by the naked eye (Patten), and the longitudinal mode can not be seen by the naked eye. Further, when the electromagnetic wave is stably reflected back and forth in the optical cavity, it allows a stable lateral electromagnetic field distribution form, which is the above-mentioned transverse mode image. Common transverse mode images come in two forms, one is axisymmetric image, generally called Hermite-Gaussian Modes, and the other is rotationally symmetric, commonly known as Laguerre-Gaussian Modes.

由於雷射光束之橫模圖樣係可根據邊界條件之調整而改變成所需之態樣,因此本發明人係利用改變雷射橫模圖樣之方式製造光學微結構,希冀可減少加工所需時間。於本實驗例中,係揭示一種製造光學微結構之方法,其步驟為:提供一基板10(步驟S101);以一第一雷射光束11透過一第一光學鏡頭12進行聚焦並轟擊至所述基板10表面,以於所述基板10形成一微型凹部101,且所述微型凹部101之周緣係形成有至少一凸起物102(步驟S102);接著,更換一第二光學鏡頭14並以一第二雷射光束13透過所述第二光學鏡頭14進行聚焦,轟擊所述凸起物102以平整所述微型凹部101周緣(步驟S103)。 Since the transverse mode pattern of the laser beam can be changed to the desired state according to the adjustment of the boundary conditions, the inventors have made the optical microstructure by changing the laser transverse mode pattern, and hope to reduce the processing time. . In the present experimental example, a method for manufacturing an optical microstructure is disclosed, the steps of which are: providing a substrate 10 (step S101); focusing and bombarding a first laser beam 11 through a first optical lens 12 The surface of the substrate 10 is such that a micro-recess 101 is formed on the substrate 10, and at least one protrusion 102 is formed on the periphery of the micro-recess 101 (step S102); then, a second optical lens 14 is replaced and A second laser beam 13 is focused through the second optical lens 14 to bombard the protrusion 102 to flatten the periphery of the micro recess 101 (step S103).

相較於習知技術揭露之方式,本實驗例係藉由更換所述第一光學鏡頭12與第二光學鏡頭14,並進一步調整所述第二雷射光束13之橫模圖像使其符合所欲轟擊區域之態樣,以減少所述第二雷射光束13之轟擊次數,藉此希冀於單次照射所述第二雷射光束13同時即可消除所述凸起物 102,達到縮短加工時間之目的。但由於在進行第二次雷射加工時,所述第二雷射光束13之位置需精準地照射於所述微型凹部101周側,以使所述第二雷射光束13藉由單發轟擊即可將所述凸起物102消除。因此在更換所述第二光學鏡頭14時,需針對所述第一雷射光束11及其搭配之所述第一光學鏡頭12之照射中心點進行位置校正,使所述第一雷射光束11與所述第二雷射光束13之照射中心點相同以避免最終轟擊至所述基板10時產生偏移,而無法有效地消除所述凸起物102。惟,實際執行時,於更換第二光學鏡頭14後,在照射位置之校準上極為不易,容易在轟擊後於基板10產生中心誤差,因此雖可減少加工所需時間,卻產生降低消除所述凸起物102之效能及準確度,以及提升製程上之困難度等問題。 Compared with the method disclosed by the prior art, the experimental example is to replace the first optical lens 12 and the second optical lens 14 and further adjust the transverse mode image of the second laser beam 13 to conform to it. The aspect of the area to be bombarded to reduce the number of bombardment times of the second laser beam 13, thereby hoping to single-illuminate the second laser beam 13 while eliminating the protrusion 102, to achieve the purpose of shortening processing time. However, since the position of the second laser beam 13 needs to be accurately irradiated on the circumferential side of the micro concave portion 101 during the second laser processing, the second laser beam 13 is bombarded by a single shot. The protrusions 102 can be eliminated. Therefore, when the second optical lens 14 is replaced, position correction is performed on the illumination center point of the first laser beam 11 and the collocation of the first optical lens 12, so that the first laser beam 11 is The same as the illumination center point of the second laser beam 13 to avoid an offset when the final bombardment to the substrate 10 is made, and the protrusion 102 cannot be effectively eliminated. However, in actual implementation, after the second optical lens 14 is replaced, it is extremely difficult to calibrate the irradiation position, and it is easy to generate a center error on the substrate 10 after bombardment. Therefore, although the time required for processing can be reduced, the reduction is eliminated. The effectiveness and accuracy of the protrusions 102, as well as the difficulty in improving the process.

鑒於第一實驗例仍具有之缺失,本發明人係構思另種加工方式,而如以下第二實驗例所述內容。請參閱第3及4圖,其係為本發明第二實驗例之方法步驟圖及加工狀態及微型凹孔示意圖。第二實驗例中提出一種製造光學微結構之方法,其步驟為:提供一基板20(步驟S201);及照射具有同心圓橫模圖像之一第一雷射光束21至所述基板20,以於所述基板20形成一微型凹部201及一凹陷部202,所述凹陷部202係位於所述微型凹部201周側(步驟S202)。 In view of the absence of the first experimental example, the inventors conceived another processing mode, as described in the second experimental example below. Please refer to FIGS. 3 and 4, which are process diagrams, processing states and micro-recessed holes of the second experimental example of the present invention. In a second experimental example, a method of fabricating an optical microstructure is provided, the steps of: providing a substrate 20 (step S201); and illuminating a first laser beam 21 having a concentric circular transverse mode image to the substrate 20, The substrate 20 is formed with a micro recess 201 and a recess 202, and the recess 202 is located on the circumferential side of the micro recess 201 (step S202).

如圖4所示,其係為利用同心圓橫模圖像之所述第一雷射光束轟擊後,於所述基板20所形成之所述微型凹部201及所述凹陷部202之態樣。如圖所示,採用所述第一雷射光束21係可直接於所述基板20形成所述微型凹部201,並藉同心圓橫模中分布於外圈之雷射能量,消除原先分次擊發雷射光束時會產生之凸起物。此方法係為利用單一雷射光束之同心圓 橫模圖像,直接使所述微型凹部201及凹陷部202成形,係可有效降低加工所需時間,惟,所述第一雷射光束之能量分布調整與校正,係較難達到內外兩區具有能量強弱差異之態樣,且於內外區域之間隔調整亦屬困難,故而較易導致所述凹陷部202亦出現火山口態樣。 As shown in FIG. 4, the micro-recess 201 and the recess 202 formed on the substrate 20 after being bombarded by the first laser beam of the concentric circular mode image. As shown, the first laser beam 21 can be used to form the micro recess 201 directly on the substrate 20, and the laser energy distributed in the outer ring in the concentric circular mode can eliminate the original split firing. A projection that is produced when a laser beam is emitted. This method is a concentric circle using a single laser beam The transverse mode image directly forms the micro concave portion 201 and the concave portion 202, which can effectively reduce the time required for processing. However, it is difficult to achieve the inner and outer regions by adjusting and correcting the energy distribution of the first laser beam. It is difficult to adjust the interval between the inner and outer regions, and the crater is also likely to occur in the depressed portion 202.

是以,本發明人經多次調整與實驗後,進而衍生出本發明所揭示之多模雷射加工機台之光學微結構製造方法,請參閱第5、6、7A~7C、8及9~10圖,其係為本發明一實施例之方法步驟圖、第一雷射光束橫模圖像示意圖、各第二雷射光束橫模圖像示意圖、第一雷射光束及第二雷射光束重合後之橫模態樣示意圖及各雷射加工基板之示意圖。所述多模雷射加工機台之光學微結構製造方法,係包括以下步驟。 Therefore, after many adjustments and experiments, the inventors have derived the optical microstructure manufacturing method of the multi-mode laser processing machine disclosed in the present invention, please refer to the 5th, 6th, 7th, 7th, 7th, 8th and 9th. FIG. 10 is a schematic diagram of a method according to an embodiment of the present invention, a schematic diagram of a transverse mode image of a first laser beam, a schematic diagram of a transverse mode image of each of the second laser beams, a first laser beam, and a second laser beam. A schematic diagram of a transverse mode after beam overlap and a schematic diagram of each laser processed substrate. The optical microstructure manufacturing method of the multi-mode laser processing machine includes the following steps.

提供一基板30(步驟S301),其中所述基板30係可為一金屬模具或為一導光板。 A substrate 30 is provided (step S301), wherein the substrate 30 can be a metal mold or a light guide plate.

照射一第一雷射光束31及一第二雷射光束32至一合束鏡,且所述第一雷射光束31與第二雷射光束32具有相異雷射模態(步驟S302)。其中,較佳者第一雷射光束31及所述第二雷射光束32係可為氣態雷射、固態雷射或光纖雷射。 A first laser beam 31 and a second laser beam 32 are irradiated to a combination beam, and the first laser beam 31 and the second laser beam 32 have different laser modes (step S302). Preferably, the first laser beam 31 and the second laser beam 32 are gaseous lasers, solid lasers or fiber lasers.

通過所述合束鏡之所述第一雷射光束31及第二雷射光束32重合照射至所述基板30,所述第一雷射光束31係於所述基板30形成一微型凹部301,並同時於所述微型凹部301周側產生一噴濺區302,所述第二雷射光束32則轟擊所述噴濺區302並形成一凹陷部303,且所述凹陷部303之深度小於所述微型凹部301之深度(步驟S303)。其中,所述凹陷部303可為單一環狀之態樣,或為多個不連續環設於所述微型凹部301周側之態樣 等,其係依據所述第二雷射光束32之雷射模態相異而隨之變化。 The first laser beam 31 and the second laser beam 32 are superimposed and irradiated to the substrate 30 by the beam combining mirror, and the first laser beam 31 is formed on the substrate 30 to form a micro recess 301. At the same time, a splash zone 302 is formed on the circumference of the micro recess 301, and the second laser beam 32 bombards the splash zone 302 and forms a recess 303, and the depth of the recess 303 is smaller than The depth of the micro recess 301 is described (step S303). The recessed portion 303 may be in a single annular shape or in a manner in which a plurality of discontinuous rings are disposed on the circumferential side of the micro recess 301. Etc., it varies depending on the laser mode of the second laser beam 32.

接著並重複步驟S301~S303,以於所述基板30上形成數個所述微型凹部301,使微型凹部301構築成光學微結構圖樣。如前述,所述基板30可為一金屬模具或一導光板,亦即本發明之方法係可直接於導光板加工以形成光學微結構外,亦可於金屬模具上進行加工形成符合光學微結構圖樣之所述微型凹部301後,再利用印壓方式於導光板上輾壓出光學微結構,或是利用金屬模具作為製造導光板之模仁,以於導光板射出成形時直接於其表面形成光學微結構。 Then, steps S301 to S303 are repeated to form a plurality of the micro recesses 301 on the substrate 30, and the micro recesses 301 are constructed into an optical microstructure pattern. As described above, the substrate 30 can be a metal mold or a light guide plate, that is, the method of the present invention can be directly processed on the light guide plate to form an optical microstructure, or can be processed on the metal mold to form an optical microstructure. After the micro recess 301 is patterned, the optical microstructure is extruded on the light guide plate by using a stamping method, or the mold is used as a mold for manufacturing the light guide plate, so as to form a light guide plate directly on the surface thereof when the light guide plate is formed and formed. Optical microstructure.

本發明中,係採用透過所述合束鏡將具有相異雷射模態之所述第一雷射光束31及第二雷射光束32重合照射至所述基板30,因此係可分別針對所述第一雷射光束31及第二雷射光束32之橫模圖樣及功率等依據預定之光學微結構態樣進行調整,再利用所述合束鏡將所述第一雷射光束31及第二雷射光束32重合,以利達到透過單次加工即可消除所述微型凹部301之火山口態樣,降低製作光學微結構所需之時間。如前述,可藉調整邊界條件而改變所述第一雷射光束31及第二雷射光束32之一橫模圖像,而當所述第一雷射光束31及第二雷射光束32之橫模圖像於一定之態樣下係有利於達到最佳加工效果,符合所需之光學微結構形式。經由反覆實驗後,本發明之所述光學微結構製造方法係使所述第一雷射光束31及第二雷射光束32之橫模圖像為旋轉對稱,並於照射至所述基板30時,所述第一雷射光束31及第二雷射光束32之橫模圖像電磁場分佈狀態為相互錯開,且所述第二雷射光束32之橫模圖像較佳者係呈環繞於所述第一雷射光束31外側,藉此以確保第二雷射光束32之轟擊區域係落於所述微型凹部301周側之所述噴 濺區302。 In the present invention, the first laser beam 31 and the second laser beam 32 having different laser modes are superimposed and irradiated onto the substrate 30 through the beam combining mirror, so that The transverse mode pattern and power of the first laser beam 31 and the second laser beam 32 are adjusted according to a predetermined optical microstructure, and the first laser beam 31 and the first beam are used by the beam combining mirror The two laser beams 32 are coincident so as to eliminate the crater pattern of the micro recess 301 by a single process, and reduce the time required to fabricate the optical microstructure. As described above, one of the first laser beam 31 and the second laser beam 32 may be changed by adjusting the boundary condition, and when the first laser beam 31 and the second laser beam 32 are The transverse mode image is beneficial to achieve the best processing effect under certain conditions, and conforms to the required optical microstructure. After the repeated experiment, the optical microstructure manufacturing method of the present invention is such that the transverse mode images of the first laser beam 31 and the second laser beam 32 are rotationally symmetric and are irradiated to the substrate 30. The transverse mode image electromagnetic field distribution states of the first laser beam 31 and the second laser beam 32 are shifted from each other, and the transverse mode image of the second laser beam 32 is preferably surrounded by The outside of the first laser beam 31, thereby ensuring that the bombardment region of the second laser beam 32 is attached to the periphery of the micro recess 301 Splash zone 302.

而透過此種方式,係可更為自由地分別調整所述第一雷射光束31及第二雷射光束32之各項參數,如第一雷射光束31及所述第二雷射光束32之能量強度差異,可使所述第二雷射光束32之能量強度小於所述第一雷射光束31之能量強度,藉此可使所述凹陷部303更趨向平整化,甚或經合適之調整,所述第二雷射光束32所形成之所述凹陷部303可不具火山口外觀。或可藉由直接調整所述第一雷射光束31及第二雷射光束32相對所述合束鏡之位置或距離,以調整重合後之所述第一雷射光束31及第二雷射光束32之間距。由此可知,本發明將所述第一雷射光束31及第二雷射光束32透過所述合束鏡進行重合並單次轟擊至所述基板30之方式,除可便於針對所述第一雷射光束31及第二雷射光束32進行個別調整外,亦可同時達到單次加工形成所述微型凹部301之功效,以大幅縮短光學微結構之加工時間。 In this way, the parameters of the first laser beam 31 and the second laser beam 32, such as the first laser beam 31 and the second laser beam 32, can be adjusted more freely. The difference in energy intensity can make the energy intensity of the second laser beam 32 smaller than the energy intensity of the first laser beam 31, thereby making the recess 303 more flat, or even adjusted appropriately The recess 303 formed by the second laser beam 32 may have no crater appearance. Or adjusting the position and distance of the first laser beam 31 and the second laser beam 32 relative to the beam combining mirror to adjust the first laser beam 31 and the second laser beam after the coincidence. The distance between the beams 32. It can be seen that the present invention passes the first laser beam 31 and the second laser beam 32 through the combining mirror to recombine a single bombardment to the substrate 30, in addition to facilitating the first The laser beam 31 and the second laser beam 32 are individually adjusted, and the effect of forming the micro recess 301 in a single process can be simultaneously achieved to greatly shorten the processing time of the optical microstructure.

請參閱第6圖,於本實施例中,較佳者所述第一雷射光束31之橫模圖像係呈圓形,而所述第二雷射光束32之橫模圖像係為一圓環或可為數個不相連花瓣狀排列區塊,如圖7A所示即為所述第二雷射光束32之橫模圖像為圓環狀,圖7B及7C所示則為所述第二雷射光束32之橫模圖像為數個不相連花瓣狀排列區塊。圖8則為所述第一雷射光束31及第二雷射光束32重合後於所述基板30形成之橫模圖像,所述第二雷射光束32之橫模圖像係呈環設於所述第一雷射光束31之橫模圖像外側,藉此於所述第一雷射光束31形成所述微型凹部301時,所述第二雷射光束即可轟擊所述微型凹部301周側之所述噴濺區302,以消除於習知加工方法會產生之凸起 物,維持所述微型凹部301周側之平整度。 Referring to FIG. 6, in the embodiment, preferably, the transverse mode image of the first laser beam 31 is circular, and the transverse mode image of the second laser beam 32 is one. The ring may be a plurality of non-contiguous petal-like array blocks. As shown in FIG. 7A, the transverse mode image of the second laser beam 32 is annular, and the seventh embodiment is shown in FIGS. 7B and 7C. The transverse mode image of the two laser beams 32 is a plurality of non-contiguous petal-like array blocks. 8 is a transverse mode image formed by the first laser beam 31 and the second laser beam 32 superimposed on the substrate 30, and the transverse mode image of the second laser beam 32 is ring-shaped. On the outside of the transverse mode image of the first laser beam 31, when the micro-recess 301 is formed by the first laser beam 31, the second laser beam can bombard the micro-recess 301 The splash zone 302 on the side of the circumference to eliminate bumps generated by conventional processing methods The flatness of the peripheral side of the micro recess 301 is maintained.

為可更為明顯表示於加工時所述基板30之表面變化,因此係將所述基板30於加工時之變化過程拆解並經由圖9及10示意,惟如前述,本發明之方法係將所述第一雷射光束31及第二雷射光束32重合後並照射至所述基板30以進行加工,是以進行加工時,當所述第一雷射光束31於所述基板30表面形成所述微型凹部301,同時所述微型凹部301周側受所述第一雷射光束31之高溫照射形成所述噴濺區302時,則如圖9所示,接著所述第二雷射光束32即隨之轟擊所述噴濺區302,以形成深度小於所述微型凹部301之所述凹陷部303,而如圖10所示。此外,上述之第一雷射光束31及第二雷射光束32之各橫模圖像,僅為應用於本發明之一較佳態樣,本發明之所述第一雷射光束31及第二雷射光束32之橫模圖像,係不侷限於此。 In order to more clearly show the surface change of the substrate 30 during processing, the process of changing the substrate 30 during processing is disassembled and illustrated in FIGS. 9 and 10, but as described above, the method of the present invention will The first laser beam 31 and the second laser beam 32 are superimposed and irradiated to the substrate 30 for processing, when the first laser beam 31 is formed on the surface of the substrate 30 during processing. The micro-recess 301, while the peripheral side of the micro-recess 301 is irradiated by the high-temperature of the first laser beam 31 to form the splatter 302, as shown in FIG. 9, then the second laser beam 32, the splash zone 302 is subsequently bombarded to form the recess 303 having a depth smaller than that of the micro recess 301, as shown in FIG. In addition, the transverse mode images of the first laser beam 31 and the second laser beam 32 are only used in a preferred embodiment of the present invention, and the first laser beam 31 and the first embodiment of the present invention. The transverse mode image of the two laser beams 32 is not limited thereto.

請繼續參閱第11圖,其係為本發明一實施例之機台示意圖。本發明亦揭露一種用以執行如前述之光學微結構製造方法之多模雷射機台4。所述多模雷射機台4包括一第一雷射共振腔40、一第二雷射共振腔41、一承載平台42及一加工機組43。 Please refer to FIG. 11 , which is a schematic diagram of a machine platform according to an embodiment of the present invention. The present invention also discloses a multimode laser machine 4 for performing the optical microstructure manufacturing method as described above. The multi-mode laser machine 4 includes a first laser cavity 40, a second laser cavity 41, a carrier platform 42, and a processing unit 43.

所述第一雷射共振腔40係用以產生所述第一雷射光束31,所述第二雷射共振腔41係用以產生所述第二雷射光束32。所述承載平台42係供以容置固定所述基板30,所述加工機組43係包括所述合束鏡431及一傳動件432,所述傳動件432係用以根據一光學微結構分布設計資料,調整及利用所述合束鏡431以使經所述合束鏡431重合之所述第一雷射光束31及第二雷射光束32,以加工所述基板30。其中,並設定所述第一雷射光束 31及第二雷射光束32之橫模圖像為旋轉對稱,且於照射至所述基板30時,所述第一雷射光束31及第二雷射光束32之橫模圖像電磁場分佈狀態為相互錯開,以確保所述第二雷射光束32係轟擊於所述噴濺區302以形成深度小於所述微型凹部301之所述凹陷部303。其餘製造方法之細部特徵,係可參照前述內容。 The first laser cavity 40 is used to generate the first laser beam 31, and the second laser cavity 41 is used to generate the second laser beam 32. The carrying platform 42 is configured to receive and fix the substrate 30. The processing unit 43 includes the combining mirror 431 and a transmission member 432, and the transmission member 432 is designed to be distributed according to an optical microstructure. The first beam of laser light 31 and the second laser beam 32 that are superposed by the beam combining mirror 431 are processed, adjusted, and utilized to process the substrate 30. Wherein, and setting the first laser beam 31 and the transverse mode image of the second laser beam 32 are rotationally symmetric, and the electromagnetic field distribution state of the transverse mode image of the first laser beam 31 and the second laser beam 32 when irradiated to the substrate 30 To be staggered from each other, it is ensured that the second laser beam 32 is bombarded by the splash zone 302 to form the recess 303 having a depth smaller than that of the micro recess 301. For the detailed features of the remaining manufacturing methods, reference may be made to the foregoing.

再請參閱第12圖,其係為本發明一實施例之導光板示意圖。本發明亦提供一種導光板5,所述導光板5之特徵在於具有多個光學微結構50,任一光學微結構50係透過前述之光學微結構製造方法製成,且第二雷射光束32之橫模圖像係為數個不相連花瓣狀排列區塊,而具有所述微型凹部301及環狀排列於所述噴濺區302之所述凹陷部303,且所述凹陷部303呈不相連花瓣狀排列。所述光學微結構50並佈設於所述導光板5之一表面51,而所述表面51可為所述導光板50之出光面、入光面或反射面等,以利應用於如背光模組內可將光源投射之光線藉光學微結構調整光線之出光量或均勻度等要件。 Referring to FIG. 12 again, it is a schematic diagram of a light guide plate according to an embodiment of the invention. The present invention also provides a light guide plate 5, which is characterized by having a plurality of optical microstructures 50, which are made by the optical microstructure manufacturing method described above, and the second laser beam 32 The transverse mode image is a plurality of non-contiguous petal-like arrangement blocks, and has the micro recesses 301 and the recesses 303 annularly arranged in the splash zone 302, and the recesses 303 are disconnected. Petal-like arrangement. The optical microstructures 50 are disposed on one surface 51 of the light guide plate 5, and the surface 51 may be a light emitting surface, a light incident surface or a reflective surface of the light guide plate 50, etc., so as to be applied to, for example, a backlight mold. In the group, the light projected by the light source can be adjusted by the optical microstructure to adjust the light amount or uniformity of the light.

本發明之所述光學微結構製造方法,係將所述第一雷射光束及第二雷射光束應用所述合束鏡使其重合並照設至所述基板,以於所述基板形成所述微型凹部。除可達到單次加工即使所述微型凹部及凹陷部成形以大幅縮短所需加工時間之優點外,亦可更為自由地調整所述第一雷射光束及第二雷射光束之各項參數如橫模圖像及能量強度,以及所述第一雷射光束及第二雷射光束重合後之間距,以因應各類光學微結構圖樣之需求。 In the optical microstructure manufacturing method of the present invention, the first laser beam and the second laser beam are applied to the substrate by applying the combined beam to the substrate to form the substrate. Miniature recesses. In addition to the single processing, even if the micro recess and the recess are formed to greatly shorten the required processing time, the parameters of the first laser beam and the second laser beam can be more freely adjusted. For example, the transverse mode image and the energy intensity, and the distance between the first laser beam and the second laser beam are coincident to meet the requirements of various optical microstructure patterns.

惟,以上所述者,僅為本發明之較佳實施例而已,並非用以限定本發明實施之範圍;故在不脫離本發明之精神與範圍下所作之均等變 化與修飾,皆應涵蓋於本發明之專利範圍內。 However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; therefore, the equivalent changes are made without departing from the spirit and scope of the present invention. Both modifications and modifications are intended to be included within the scope of the invention.

S301~S303‧‧‧步驟 S301~S303‧‧‧Steps

Claims (9)

一種多模雷射加工機台之光學微結構製造方法,其步驟包括:提供一基板;照射一第一雷射光束及一第二雷射光束至一合束鏡,且該第一雷射光束與該第二雷射光束具有相異雷射模態;及通過該合束鏡之該第一雷射光束及該第二雷射光束重合照射至該基板,該第一雷射光束係於該基板形成一微型凹部,並同時於該微型凹部周側產生一噴濺區,該第二雷射光束則轟擊該噴濺區並形成一凹陷部,且該凹陷部之深度小於該微型凹部之深度。 A method for fabricating an optical microstructure of a multimode laser processing machine, the method comprising: providing a substrate; illuminating a first laser beam and a second laser beam to a combination beam, and the first laser beam Having a different laser mode from the second laser beam; and the first laser beam and the second laser beam passing through the beam combiner are incident on the substrate, the first laser beam being attached to the substrate Forming a micro recess in the substrate, and simultaneously forming a splash region on the periphery of the micro recess, the second laser beam bombards the splash region and forming a recess, and the depth of the recess is less than the depth of the micro recess . 如申請專利範圍第1項所述之多模雷射加工機台之光學微結構製造方法,其中,該第一雷射光束及該第二雷射光束之橫模圖像係為旋轉對稱,且於照射至該基板時,該第一雷射光束及該第二雷射光束之橫模圖像電磁場分佈狀態為相互錯開。 The optical microstructure manufacturing method of the multi-mode laser processing machine according to claim 1, wherein the transverse laser image of the first laser beam and the second laser beam is rotationally symmetric, and When irradiated to the substrate, the electromagnetic field distribution states of the transverse mode images of the first laser beam and the second laser beam are shifted from each other. 如申請專利範圍第2項所述之多模雷射加工機台之光學微結構製造方法,其中,該第二雷射光束之橫模圖像係為一圓環。 The optical microstructure manufacturing method of the multi-mode laser processing machine according to claim 2, wherein the transverse mode image of the second laser beam is a ring. 如申請專利範圍第2項所述之多模雷射加工機台之光學微結構製造方法,其中,該第二雷射光束之橫模圖像係為複數不相連花瓣狀排列區塊。 The optical microstructure manufacturing method of the multi-mode laser processing machine of claim 2, wherein the transverse mode image of the second laser beam is a plurality of non-contiguous petal-like arrangement blocks. 如申請專利範圍第1項所述之多模雷射加工機台之光學微結構製造方法,其中,該基板係為一金屬模具。 The optical microstructure manufacturing method of the multi-mode laser processing machine according to the first aspect of the invention, wherein the substrate is a metal mold. 如申請專利範圍第1項所述之多模雷射加工機台之光學微結構製造方法,其中,該基板係為一導光板。 The optical microstructure manufacturing method of the multi-mode laser processing machine according to the first aspect of the invention, wherein the substrate is a light guide plate. 一種用以執行如申請專利範圍第1項所述之多模雷射加工機台之光學微 結構製造方法之多模雷射機台,係包括:一第一雷射共振腔,用以產生該第一雷射光束;一第二雷射共振腔,用以產生該第二雷射光束;一承載平台,用以容置該基板;及一加工機組,包括該合束鏡及一傳動件,該傳動件用以根據一光學微結構分布設計資料,利用經該合束鏡重合之該第一雷射光束與該第二雷射光束,加工該基板。 An optical micro for performing a multimode laser processing machine as described in claim 1 The multi-mode laser machine of the structural manufacturing method comprises: a first laser cavity for generating the first laser beam; and a second laser cavity for generating the second laser beam; a carrying platform for accommodating the substrate; and a processing unit including the beam combining mirror and a transmission member for distributing design data according to an optical microstructure, and using the same by the beam combining mirror A laser beam and the second laser beam are processed to the substrate. 如申請專利範圍第7項所述之多模雷射機台,其中,該第一雷射光束及該第二雷射光束之橫模圖像係為旋轉對稱,且於照射至該基板時,該第一雷射光束及該第二雷射光束之橫模圖像電磁場分佈狀態為相互錯開。 The multi-mode laser machine of claim 7, wherein the transverse laser image of the first laser beam and the second laser beam is rotationally symmetric, and when irradiated to the substrate, The electromagnetic field distribution states of the transverse mode images of the first laser beam and the second laser beam are shifted from each other. 一種導光板,其特徵在於:具有複數個光學微結構,任一該等光學微結構係透過如申請專利範圍第4項所述之多模雷射加工機台之光學微結構製造方法製成,因而具有該微型凹部,及環狀排列於該噴濺區之該些凹陷部,且該些凹陷部呈不相連花瓣狀排列。 A light guide plate having a plurality of optical microstructures, any one of which is made by an optical microstructure manufacturing method of a multimode laser processing machine as described in claim 4 of the patent application. Therefore, the micro recesses and the recesses are annularly arranged in the splash zone, and the recesses are arranged in a non-contiguous petal shape.
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