TW201633363A - Plasma processing apparatus - Google Patents

Plasma processing apparatus Download PDF

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TW201633363A
TW201633363A TW105102233A TW105102233A TW201633363A TW 201633363 A TW201633363 A TW 201633363A TW 105102233 A TW105102233 A TW 105102233A TW 105102233 A TW105102233 A TW 105102233A TW 201633363 A TW201633363 A TW 201633363A
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plasma
metal window
metal
processing apparatus
window
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TW105102233A
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TWI696208B (en
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Shingo Deguchi
Youhei Yamada
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119Windows
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332Coating
    • H01J2237/3321CVD [Chemical Vapor Deposition]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334Etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Provided is a plasma processing apparatus capable of maintaining mechanical strength while installing metal windows by using lighter mechanism. In a vacuum process space (100), plasma process is performed for a processed substrate (G) in plasma processing apparatus (1). Processing vessel (10) made of metal has a placing stage for the processed substrate (G). At a position where block is formed over an opening thereof, a metal window (3) with conductivity is provided through an insulation member (31) in between. The metal window (3) is suspended and supported on a top part (61) arranged at top side of a plasma antenna (5) for producing plasma. Furthermore, the top part (61) is suspended and supported by top supporting mechanism (7) having cross parts (71, 711) and a frame structure of the foot column part (72).

Description

電漿處理裝置 Plasma processing device

本發明係關於藉由被電漿化之處理氣體進行被處理基板之電漿處理的電漿處理裝置。 The present invention relates to a plasma processing apparatus for performing plasma treatment of a substrate to be processed by a plasma-treated processing gas.

在液晶顯示裝置(LCD)等之平面顯示器(FPD)之製造工程中,存在有對作為被處理基板之玻璃基板供給被電漿化之處理氣體,進行蝕刻處理或成膜處理等之電漿處理之工程。在該些電漿處理中,使用電漿蝕刻裝置或電漿CVD裝置等之各種電漿處理裝置。近年來,作為處理氣體電漿化之方法,以具有可以取得高真空度且高密度之電漿之一大優點的感應耦合電漿(Inductively Coupled Plasma:ICP)受到注目。 In the manufacturing process of a flat panel display (FPD) such as a liquid crystal display (LCD), there is a plasma processing in which a plasma-treated processing gas is supplied to a glass substrate as a substrate to be processed, and etching treatment or film formation processing is performed. Engineering. In the plasma treatment, various plasma processing apparatuses such as a plasma etching apparatus or a plasma CVD apparatus are used. In recent years, as a method of plasma processing gas, an inductively coupled plasma (ICP) having one of the advantages of high-density plasma having a high degree of vacuum has been attracting attention.

另一方面,玻璃基板之尺寸朝著大型化進展。在例如LCD用之矩形狀玻璃基板中,需要能夠處理短邊×長邊之長度約2200mm×約2400mm,甚至約2800mm×約3000mm之尺寸的電漿處理裝置。 On the other hand, the size of the glass substrate is progressing toward enlargement. In a rectangular glass substrate such as an LCD, a plasma processing apparatus capable of processing a length of a short side × a long side of about 2200 mm × about 2400 mm, or even about 2800 mm × about 3000 mm is required.

隨著電漿裝置之大型化,被配置在玻璃基板之上方側,與產生上述感應耦合電漿之電漿天線相向配置 的介電質窗也大型化。但是,構成介電質窗之石英等之介電質材料因機械性強度小且脆,故不適合於大型化。於是,在專利文獻1中,記載著具備剛性較石英高之金屬製之金屬窗的電漿處理裝置。 As the plasma device is enlarged, it is disposed on the upper side of the glass substrate, and is disposed opposite to the plasma antenna that generates the inductively coupled plasma. The dielectric window is also large. However, since a dielectric material such as quartz constituting a dielectric window is small in mechanical strength and brittle, it is not suitable for enlargement. Then, Patent Document 1 describes a plasma processing apparatus including a metal window made of metal having a higher rigidity than quartz.

在此,為了經由金屬窗使產生感應耦合電漿,需要在與構成電漿處理裝置之本體的金屬製之處理容器絕緣之狀態下安裝金屬窗。再者,對於構成成為真空氛圍之處理空間之上述金屬窗,由於不僅其自體重量也施加大氣壓,故必須支撐金屬窗以使承受該些力量。因此,隨著金屬窗之大型化,有將該金屬窗安裝在處理容器之機構也大型化、大重量化之問題。 Here, in order to generate the inductively coupled plasma via the metal window, it is necessary to mount the metal window in a state insulated from the metal processing container constituting the body of the plasma processing apparatus. Further, in the above-described metal window constituting the processing space to be a vacuum atmosphere, since not only the self-weight but also the atmospheric pressure is applied, it is necessary to support the metal window so as to withstand the force. Therefore, as the size of the metal window increases, there is a problem that the mechanism for attaching the metal window to the processing container is also increased in size and weight.

在此,在專利文獻2中,記載著對被進行照射雷射光至玻璃基板之改質處理的製程腔室之上部蓋構件,設置補強其機械性強度之肋條構件,抑制使雷射光透過之窗產生傾斜或變形的雷射退火裝置。再者,在專利文獻3中,記載著在進行FPD用之玻璃基板之處理的真空處理裝置之腔室部之外壁面,由肋條構件和接合肋條構件之板狀接合構件所構成,且被構成藉由螺栓對上述外壁面拆裝自如的補強構件。 Here, Patent Document 2 describes that a process chamber upper cover member that is subjected to a modification process of irradiating laser light to a glass substrate is provided with a rib member that reinforces mechanical strength, and a window for suppressing transmission of laser light is suppressed. A laser annealing device that produces a tilt or deformation. Further, Patent Document 3 describes that the outer wall surface of the chamber portion of the vacuum processing apparatus for performing the processing of the glass substrate for FPD is composed of a rib member and a plate-shaped joint member of the joint rib member, and is configured. The reinforcing member is detachably attached to the outer wall surface by bolts.

但是,在該些專利文獻2、3中之任一者中,皆無揭示邊維持與處理容器絕緣之狀態,邊設置大型金屬窗之方法。 However, in any of the above-mentioned Patent Documents 2 and 3, there is no disclosure of a method of providing a large metal window while maintaining the state of being insulated from the processing container.

〔先行技術文獻〕 [prior technical literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特開2012-227427號公報,段落0018、圖1 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2012-227427, paragraph 0018, Fig. 1

〔專利文獻2〕日本專利第3451478號公報:段落0002、0018、圖1、2 [Patent Document 2] Japanese Patent No. 3451478: Paragraphs 0002, 0018, Figs. 1, 2

〔專利文獻3〕日本專利第5232801號:段落0028~0029、圖3 [Patent Document 3] Japanese Patent No. 5232801: Paragraphs 0028 to 0029, Fig. 3

本發明係鑒於如此之情形而創作出,其目的在於提供邊保持機械性強度,邊利用輕量機構安裝金屬窗之電漿處理裝置。 The present invention has been made in view of such circumstances, and an object thereof is to provide a plasma processing apparatus in which a metal window is attached by a lightweight mechanism while maintaining mechanical strength.

本發明之電漿處理裝置係對被真空排氣之處理空間內之被處理基板,實施藉由被電漿化之處理氣體進行的電漿處理,該電漿處理裝置之特徵在於具備:金屬製之處理容器,其具備載置上述被處理基板之載置台,與該載置台相向之上面開口,並且被電性接地;導電性之金屬窗,其係被配置在堵塞上述處理容器之開口之位置上而形成上述處理空間,並且在隔著絕緣構件而與上述處理容器絕緣之狀態下被設置;電漿天線,其係以與該金屬窗相向之方式被設置在上 述金屬窗之上方側,用以藉由感應耦合使上述處理氣體電漿化;金屬窗支撐機構,其具備以與上述金屬窗相向之方式被配置在電漿天線之上方側的天板部,和被設置在該天板部,用以懸吊支撐上述金屬窗之複數第1懸吊部;及骨架構造之天板支撐機構,其具備設置有用以從上方側懸吊支撐上述天板部之複數第2懸吊部的橫架部,和用以支撐上述橫架部的腳柱部。 In the plasma processing apparatus of the present invention, the substrate to be processed in the processing space to be vacuum-exhausted is subjected to plasma treatment by a plasma-treated processing gas, and the plasma processing apparatus is characterized in that it is made of metal. The processing container includes a mounting table on which the substrate to be processed is placed, is open to the upper surface of the mounting table, and is electrically grounded; and the conductive metal window is disposed at a position blocking the opening of the processing container Forming the above-described processing space, and being provided in a state of being insulated from the processing container via an insulating member; the plasma antenna is disposed on the opposite side of the metal window The upper side of the metal window is used to plasmaize the processing gas by inductive coupling; and the metal window supporting mechanism is provided with a ceiling portion disposed on the upper side of the plasma antenna so as to face the metal window. And a plurality of first suspension portions that are disposed on the ceiling portion for suspending and supporting the metal window; and a slab support structure of the slab structure, which is provided to suspend and support the slab portion from the upper side a cross frame portion of the plurality of second suspension portions and a leg portion for supporting the horizontal frame portion.

上述電漿處理裝置即使具備以下構成亦可。 The plasma processing apparatus described above may have the following configuration.

(a)上述金屬窗被分割成複數部分窗,相鄰的部分窗彼此隔著絕緣構件互相被絕緣。絕緣上述處理容器和金屬窗之絕緣構件,及絕緣該金屬窗之相鄰部分窗彼此的絕緣構件,被上述處理容器支撐。 (a) The metal window is divided into a plurality of partial windows, and adjacent partial windows are insulated from each other with an insulating member interposed therebetween. An insulating member that insulates the processing container and the metal window, and an insulating member that insulates adjacent portions of the window of the metal window are supported by the processing container.

(b)上述腳柱部被設置在上述開口之周圍之處理容器上。 (b) The above-mentioned leg portion is provided on the processing container around the opening.

(c)上述天板部係被電性接地的金屬製,上述第1懸吊部具備絕緣上述金屬窗和天板部之絕緣構件。上述天板支撐機構之橫架部及腳柱部之導電性較上述天板部低,為機械性強度高之金屬製。 (c) The ceiling portion is made of a metal that is electrically grounded, and the first suspension portion includes an insulating member that insulates the metal window and the ceiling portion. The cross frame portion and the leg portion of the slab support mechanism are lower in electrical conductivity than the slab portion, and are made of metal having high mechanical strength.

(d)上述橫架部被形成拱橋狀。 (d) The horizontal frame portion is formed in an arch shape.

(e)上述金屬窗兼作對上述處理空間供給處理氣體的氣體噴淋頭。 (e) The metal window also serves as a gas shower head for supplying a processing gas to the processing space.

本發明因將構成處理空間之金屬窗懸吊支撐在天板部,而且利用骨架構造之天板支撐機構懸吊支撐該天板部,故可以使分散從金屬窗施加的荷重,且邊保持在處理容器安裝金屬窗所需之機械性強度,邊將支撐該金屬窗之機構予以輕量化。 In the present invention, since the metal window constituting the processing space is suspended and supported by the ceiling portion, and the slab supporting mechanism is suspended and supported by the slab supporting mechanism, the load applied from the metal window can be dispersed and kept at the side. The mechanical strength required to mount the metal window of the container is treated, and the mechanism supporting the metal window is lightened.

G‧‧‧玻璃基板 G‧‧‧glass substrate

1、1a~1c‧‧‧電漿處理裝置 1, 1a~1c‧‧‧ plasma processing equipment

10‧‧‧容器本體 10‧‧‧ container body

100‧‧‧處理空間 100‧‧‧Processing space

11‧‧‧金屬框 11‧‧‧Metal frame

13‧‧‧載置台 13‧‧‧ mounting table

3‧‧‧金屬窗 3‧‧‧Metal windows

30‧‧‧部分窗 30‧‧‧Some windows

31‧‧‧絕緣構件 31‧‧‧Insulating components

5‧‧‧高頻天線 5‧‧‧High frequency antenna

61、61a‧‧‧天板部 61, 61a‧‧‧Surface Department

62‧‧‧金屬窗懸吊部 62‧‧‧Metal window suspension

7、7a~7c‧‧‧天板支撐機構 7, 7a~7c‧‧‧Sky support mechanism

71‧‧‧橫棒部 71‧‧‧ horizontal bar

711‧‧‧傾斜部 711‧‧‧ inclined section

72‧‧‧腳柱部 72‧‧‧Foot section

721‧‧‧天板支撐部 721‧‧‧Surface Support

73‧‧‧天板懸吊部 73‧‧‧Aisan suspension

8‧‧‧控制部 8‧‧‧Control Department

圖1為與實施型態有關之電漿處理裝置之縱斷側面圖。 Fig. 1 is a longitudinal side view of a plasma processing apparatus in accordance with an embodiment.

圖2為上述電漿處理裝置之一部分斷裂的俯視圖。 Figure 2 is a plan view showing a portion of the above plasma processing apparatus broken.

圖3為表示被設置在上述電漿處理裝置之金屬窗之安裝狀態的縱斷側面圖。 Fig. 3 is a longitudinal side view showing a state in which a metal window provided in the plasma processing apparatus is mounted.

圖4為與比較例有關之電漿處理裝置之縱斷側面圖。 Fig. 4 is a longitudinal side view showing a plasma processing apparatus according to a comparative example.

圖5表示被設置在電漿處理裝置之天板支撐機構之變形例的一部分斷裂俯視圖。 Fig. 5 is a partially broken plan view showing a modification of the sunroof support mechanism provided in the plasma processing apparatus.

圖6為表示上述天板支撐機構之其他變形例的縱斷側面圖。 Fig. 6 is a longitudinal side view showing another modification of the above-described roof supporting mechanism.

圖7為表示上述天板支撐機構之又一變形例的縱斷側面圖。 Fig. 7 is a longitudinal side view showing still another modification of the above-described roof supporting mechanism.

以下,一面參照圖1~圖3,一面說明與本發明之實施型態有關之電漿處理裝置1之構成。 Hereinafter, the configuration of the plasma processing apparatus 1 according to the embodiment of the present invention will be described with reference to Figs. 1 to 3 .

電漿處理裝置1可以使用於形成在作為被處理基板之矩形基板,例如FPD用之基板G上形成薄膜電晶體之時的金屬膜、ITO膜、氧化膜等之成膜處理,或蝕刻該些膜之蝕刻處理、光阻膜之灰化處理等之各種電漿處理。在此,作為FPD,例示有液晶顯示器(LCD)、電激發光(Electro Luminescence;EL)顯示器,電漿顯示面板(PDP)等。再者,電漿處理裝置1並不限定於FPD用之基板G,對於太陽電池面板用之基板G亦可以使用於上述各種電漿處理。 The plasma processing apparatus 1 can be used for forming a metal film, an ITO film, an oxide film, or the like when a thin film transistor is formed on a rectangular substrate as a substrate to be processed, for example, a substrate G for FPD, or etching the film Various plasma treatments such as etching treatment of the film and ashing treatment of the photoresist film. Here, examples of the FPD include a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), and the like. Further, the plasma processing apparatus 1 is not limited to the substrate G for FPD, and the substrate G for a solar cell panel can be used for the above various plasma treatments.

如圖1之縱斷側面圖所示般,電漿處理裝置1具備由導電性材料,例如內壁面被陽極氧化處理之鋁所構成的角筒形狀之容器本體10,該容器本體10被電性接地。在容器本體10之上面形成開口,該開口藉由設置成與該容器本體10絕緣的矩形狀之金屬窗3被氣密堵塞。藉由該些容器本體10及金屬窗3而包圍之空間成為基板G之處理空間100,金屬窗3之上方側之空間成為配置高頻天線(電漿天線)5之天線室50。再者,在處理空間100之側壁,設置有用以搬入搬出玻璃基板(以下僅記載成基板)G之搬入搬出口101及對搬入搬出口101進行開關的閘閥102。 As shown in the longitudinal side view of Fig. 1, the plasma processing apparatus 1 is provided with a container body 10 having a rectangular tube shape made of a conductive material such as aluminum whose inner wall surface is anodized, and the container body 10 is electrically Ground. An opening is formed in the upper surface of the container body 10, and the opening is hermetically sealed by a rectangular metal window 3 provided to be insulated from the container body 10. The space surrounded by the container body 10 and the metal window 3 serves as the processing space 100 of the substrate G, and the space above the metal window 3 serves as the antenna chamber 50 in which the high-frequency antenna (plasma antenna) 5 is disposed. Further, in the side wall of the processing space 100, a loading/unloading port 101 for loading and unloading a glass substrate (hereinafter simply referred to as a substrate) G and a gate valve 102 for opening and closing the loading/unloading port 101 are provided.

在處理空間100之下部側,以與上述金屬窗3相向之方式,設置有用以載置基板G之載置台13。載置台13係由導電性材料,例如表面被陽極氧化處理之鋁所構成。被載置於載置台13之基板G係藉由無圖示之靜電 夾具被吸附保持。載置台13被收納在絕緣體框14內,經由該絕緣體框14被配置在容器本體10之底面。 On the lower side of the processing space 100, a mounting table 13 for mounting the substrate G is provided so as to face the metal window 3. The mounting table 13 is made of a conductive material such as aluminum whose surface is anodized. The substrate G placed on the mounting table 13 is electrostatically sealed The clamp is held by the adsorption. The mounting table 13 is housed in the insulator frame 14 and is disposed on the bottom surface of the container body 10 via the insulator frame 14.

在載置台13,經由匹配部151連接有第2高頻電源152。第2高頻電源152對載置台13施加偏壓用之高頻電力,例如頻率為3.2MHz之高頻電力。藉由基於該偏壓用之高頻電力所生成之自偏壓,將在處理空間100內生成之電漿中之離子導入至基板G。 The second high frequency power supply 152 is connected to the mounting table 13 via the matching unit 151. The second high-frequency power source 152 applies high-frequency power for biasing to the mounting table 13, for example, high-frequency power having a frequency of 3.2 MHz. The ions in the plasma generated in the processing space 100 are introduced to the substrate G by the self-bias generated by the high-frequency power for the bias voltage.

而且,在載置台13內,為了控制基板G之溫度,設置有由陶磁加熱器等之加熱手段和冷媒流路所構成之溫度控制機構、溫度感測器、用以對基板G之背面供給熱傳達用之He氣體的氣體流路(皆無圖示)。 Further, in the mounting table 13, in order to control the temperature of the substrate G, a temperature control mechanism composed of a heating means such as a ceramic heater or a refrigerant flow path, a temperature sensor, and heat for supplying the back surface of the substrate G are provided. The gas flow path for the He gas is conveyed (all are not shown).

再者,在容器本體10之底面形成排氣口103,在該排氣口103連接有包含真空泵等之真空排氣部12。處理空間100之內部,藉由該真空排氣部12被真空排氣成電漿處理時之壓力。 Further, an exhaust port 103 is formed on the bottom surface of the container body 10, and a vacuum exhaust unit 12 including a vacuum pump or the like is connected to the exhaust port 103. The inside of the processing space 100 is evacuated by vacuum to a pressure at the time of plasma treatment.

金屬窗3係藉由例如非磁性體且導電性之金屬、鋁或包含鋁之合金等被構成。再者,為了提升金屬窗3之耐電漿性,即使在金屬窗3之處理空間100側之面設置介電體膜或介電體蓋亦可。作為介電體膜,可以舉出陽極氧化膜或熱噴塗陶磁膜。再者,作為介電質蓋,可以舉出石英製或陶瓷製者。 The metal window 3 is formed of, for example, a non-magnetic, electrically conductive metal, aluminum, or an alloy containing aluminum. Further, in order to improve the plasma resistance of the metal window 3, a dielectric film or a dielectric cap may be provided on the surface of the processing space 100 of the metal window 3. Examples of the dielectric film include an anodized film or a thermally sprayed ceramic film. Further, examples of the dielectric cover include quartz or ceramics.

如圖1、圖2所示般,在容器本體10側壁之上面側,設置有由鋁等之金屬所構成之矩形狀之框體的金屬框11。在容器本體10和金屬框11之間設置有用以將 處理空間100保持氣密之密封構件110。在此,容器本體10及金屬框11構成本實施型態之處理容器。 As shown in Figs. 1 and 2, a metal frame 11 having a rectangular frame body made of a metal such as aluminum is provided on the upper surface side of the side wall of the container body 10. Between the container body 10 and the metal frame 11 is provided to The processing space 100 maintains a hermetic sealing member 110. Here, the container body 10 and the metal frame 11 constitute the processing container of this embodiment.

而且,本例之金屬窗3被分割成複數部分窗30,該些部分窗30被配置在金屬框11之內側,整體構成矩形狀之金屬窗3。互相被分割之部分窗30藉由絕緣構件31與金屬框11或其下方側之容器本體10電性絕緣,並且相鄰之部分窗30彼此也藉由絕緣構件31互相絕緣。 Further, the metal window 3 of this example is divided into a plurality of partial windows 30 which are disposed inside the metal frame 11 and integrally constitute a rectangular metal window 3. The partial windows 30 which are divided from each other are electrically insulated from the metal frame 11 or the container body 10 on the lower side thereof by the insulating member 31, and the adjacent partial windows 30 are also insulated from each other by the insulating member 31.

絕緣構件31被例如金屬框11支撐。另外,藉由絕緣構件31與金屬框11或相鄰之部分窗30絕緣之各部分窗30,與該些絕緣構件31獨立而從天板部61被懸吊支撐。針對懸吊支撐金屬窗3(部分窗30)之機構,於後段詳細說明。 The insulating member 31 is supported by, for example, the metal frame 11. Further, each of the partial windows 30 insulated from the metal frame 11 or the adjacent partial window 30 by the insulating member 31 is suspended from the top plate portion 61 independently of the insulating members 31. The mechanism for suspending the supporting metal window 3 (partial window 30) will be described in detail later.

並且,部分窗30之分割形狀並不限定於矩形狀。再者,為了補強絕緣構件31,即使構成以從上面側觀看分割金屬框11之內面之方式,設置金屬樑,利用該金屬樑支撐絕緣構件31亦可。 Further, the divided shape of the partial window 30 is not limited to a rectangular shape. In addition, in order to reinforce the insulating member 31, a metal beam may be provided so that the inner surface of the divided metal frame 11 is viewed from the upper surface side, and the insulating member 31 may be supported by the metal beam.

而且,本例之部分窗30兼作處理氣體供給用之噴淋頭。如圖1、圖3所示般,在各部分窗30之內部,形成有使處理氣體擴散之處理氣體擴散室301。再者,在各部分窗30之下面,形成有用以從處理氣體擴散室301對處理空間100供給處理氣體之複數處理氣體吐出孔302。而且,如圖1所示般,各部分窗30之處理氣體擴散室301經氣體供給管41而連接於處理氣體供給部42。從處理氣體供給部42供給先前已述之成膜處理、蝕 刻處理、灰化處理等所需要的處理氣體。並且,為了方便圖示,雖然在圖1中表示將處理氣體供給部42連接於一個部分窗30之狀態,但是實際上,各部分窗30之處理氣體擴散室301被連接於處理氣體供給部42。 Further, the partial window 30 of this example also serves as a shower head for supplying a processing gas. As shown in FIGS. 1 and 3, a process gas diffusion chamber 301 for diffusing a processing gas is formed inside each partial window 30. Further, a plurality of processing gas discharge holes 302 for supplying a processing gas to the processing space 100 from the processing gas diffusion chamber 301 are formed under the partial windows 30. Further, as shown in FIG. 1, the process gas diffusion chamber 301 of each partial window 30 is connected to the process gas supply unit 42 via the gas supply pipe 41. The film forming process, etch described above, is supplied from the process gas supply unit 42. Processing gas required for engraving, ashing, etc. Further, for convenience of illustration, although the state in which the processing gas supply unit 42 is connected to one partial window 30 is shown in FIG. 1, actually, the processing gas diffusion chamber 301 of each partial window 30 is connected to the processing gas supply unit 42. .

而且,在天線室50之內部,以面對部分窗30之方式,配置有高頻天線5。高頻天線5被配置成經例如無圖示之絕緣構件所構成之間隔物而與部分窗30間隔開。例如,高頻天線5係在與各部分窗30對應之面內,以沿著矩形狀之金屬窗3之周方向環繞之方式,形成漩渦狀。並且,高頻天線5之形狀並不限定於渦旋,即使為使一條或複數之天線線成為環狀之環狀天線亦可。而且,即使採用一面偏移角度一面捲繞複數天線線,且使全體成為漩渦狀之多重天線亦可。如此一來,若在與金屬窗3或構成金屬窗3之各部分窗30對應之面內,以沿著其周方向環繞之方式設置天線線時,則不論高頻天線5之構造。 Further, inside the antenna room 50, a high frequency antenna 5 is disposed to face the partial window 30. The high frequency antenna 5 is disposed to be spaced apart from the partial window 30 by, for example, a spacer formed of an insulating member (not shown). For example, the high-frequency antenna 5 is formed in a spiral shape so as to surround the circumferential direction of the rectangular metal window 3 in a plane corresponding to each of the partial windows 30. Further, the shape of the radio-frequency antenna 5 is not limited to the vortex, and may be a loop antenna in which one or a plurality of antenna wires are formed in a ring shape. Further, even if a plurality of antenna lines are wound with one offset angle, and the entire antenna is formed into a spiral shape. In this manner, when the antenna wire is provided so as to surround the metal window 3 or the partial window 30 constituting the metal window 3 so as to surround the circumferential direction thereof, the configuration of the radio-frequency antenna 5 is employed.

在各高頻天線5,經由匹配部511連接有第1高頻電源512。在各高頻天線5,從第1高頻電源512經匹配器511被供給例如13.56MHz之高頻電力。依此,在電漿處理之間、部分窗30之各個表面激起渦電流,藉由該渦電流在處理空間100之內部形成感應電場。從氣體吐出孔302被吐出之處理氣體藉由感應電場在處理空間100之內部被電漿化。 The first high frequency power supply 512 is connected to each of the high frequency antennas 5 via the matching unit 511. In each of the high-frequency antennas 5, high-frequency power of, for example, 13.56 MHz is supplied from the first high-frequency power source 512 via the matching unit 511. Accordingly, an eddy current is excited between the plasma treatments and the respective surfaces of the partial windows 30, and the eddy current forms an induced electric field inside the processing space 100. The process gas discharged from the gas discharge hole 302 is plasma-treated inside the processing space 100 by an induced electric field.

而且,如圖1所示般,在該電漿處理裝置1設置有控制部8。控制部8係由具備有無圖示之CPU (Central Processing Unit)和記憶部之電腦所構成,在該記憶部記憶有編排用以輸出控制訊號之步驟(命令)群的程式,該控制訊號係實行使配置有基板G之處理空間100內真空排氣,且使用高頻天線5將處理氣體予以電漿化而處理基板G的動作。該程式係被儲存於例如硬碟、CD、光磁性碟、記憶卡等之記憶媒體,自此被安裝於記憶部。 Further, as shown in FIG. 1, the plasma processing apparatus 1 is provided with a control unit 8. The control unit 8 is provided with a CPU having or not shown (Central Processing Unit) and a computer of the memory unit, wherein a program for outputting a step (command) group for outputting a control signal is stored in the memory unit, and the control signal is implemented to perform vacuum in the processing space 100 in which the substrate G is disposed. The operation of the substrate G is performed by exhausting the plasma using the high frequency antenna 5 to plasma the processing gas. The program is stored in a memory medium such as a hard disk, a CD, a magneto-optical disk, a memory card, etc., and is installed in the memory unit.

在具備上述說明之構成的電漿處理裝置1中,支撐金屬窗3之機構除了金屬窗3之自重外,需要承受施加於金屬窗3之大氣壓的能力。但是,例如被配置在各部分窗30之周圍的絕緣構件31因機械性強度小且脆,故不適合當作支撐如此被施加大的力之構件的機構。另外,可知當利用金屬樑等補強絕緣構件31使能夠利用絕緣構件31來支撐部分窗30時,不僅增加無助於電漿形成之金屬樑之面積,連用以形成電漿之感應電場也變弱。 In the plasma processing apparatus 1 having the configuration described above, the mechanism for supporting the metal window 3 needs to withstand the atmospheric pressure applied to the metal window 3 in addition to the weight of the metal window 3. However, for example, the insulating member 31 disposed around each of the partial windows 30 is not suitable as a mechanism for supporting a member to which a large force is applied because the mechanical strength is small and brittle. Further, it is understood that when the partial insulating member 31 is used to support the partial window 30 by the reinforcing member 31 such as a metal beam, not only the area of the metal beam which does not contribute to the plasma formation but also the induced electric field for forming the plasma is weakened. .

作為金屬窗3之支撐機構,可想像如例如圖4之電漿處理裝置1a所示般,利用側壁部63包圍天線室50之周圍,在其上面側配置天板部61a而使金屬窗3和天板部61a上下相向,經由金屬窗懸吊部62,從天板部61a懸吊支撐各部分窗30之機構。在此,天板部61a採用導電性高之鋁等。在此,雖然以藉由鋁製之天板部61a構成支撐機構為前提,進行強度設計,但是如先前所述般,在處理約2200mm×約2400mm之尺寸之基板G的電漿處理裝置1a,為了支撐從金屬窗3側施加之荷重,天板部61a之厚度也成為10cm以上。可知為了支撐如此笨重的 天板部61a,也增大側壁部63之厚度尺寸,金屬窗3之支撐機構變得大型化、大重量化。 As the supporting means of the metal window 3, as shown, for example, in the plasma processing apparatus 1a of Fig. 4, the periphery of the antenna chamber 50 is surrounded by the side wall portion 63, and the ceiling portion 61a is disposed on the upper surface side thereof to make the metal window 3 and The roof portion 61a faces up and down, and the mechanism for supporting the partial windows 30 is suspended from the roof portion 61a via the metal window hanging portion 62. Here, the ceiling portion 61a is made of aluminum or the like having high conductivity. Here, the strength design is performed on the premise that the support mechanism is formed by the aluminum top plate portion 61a. However, as described above, the plasma processing apparatus 1a of the substrate G having a size of about 2200 mm × about 2400 mm is processed. In order to support the load applied from the metal window 3 side, the thickness of the roof portion 61a is also 10 cm or more. I know that in order to support such a cumbersome The ceiling portion 61a also increases the thickness of the side wall portion 63, and the support mechanism of the metal window 3 is increased in size and weight.

為了解決上述問題,本實施型態之電漿處理裝置1如圖1所示般,成為設置有邊維持使用天板部61懸吊支撐金屬窗3之方式,邊補強且支撐天板部61之骨架構造之天板支撐機構7的構造。藉由以天板支撐機構7補強天板部61,將天板部61之厚度降低至10cm以下,並且藉由使天板支撐機構7成為骨架構造,省略圖4之電漿處理裝置1a所示之側壁部63的設置。 In order to solve the above problem, the plasma processing apparatus 1 of the present embodiment is provided with a method of supporting and supporting the metal window 3 by suspending the use of the ceiling portion 61 as shown in FIG. The structure of the slab structure support mechanism 7 of the skeleton structure. By reinforcing the roof portion 61 with the roof supporting mechanism 7, the thickness of the roof portion 61 is reduced to 10 cm or less, and by making the roof supporting mechanism 7 into a skeleton structure, the plasma processing apparatus 1a of Fig. 4 is omitted. The arrangement of the side wall portions 63.

以下,針對金屬窗3之支撐機構之構成予以詳細說明。 Hereinafter, the configuration of the support mechanism of the metal window 3 will be described in detail.

如圖1所示般,例如天板部61藉由與金屬窗3略相同大小之鋁製板材所構成,被配置成夾著天線室50而使其下面與金屬窗3相向。如圖1所示般,該天板部61被電性接地。再者,在天板部61之下面和部分窗30之上面之間,安裝作為第1懸吊部之複數金屬窗懸吊部62,藉由該些金屬窗懸吊部62懸吊支撐金屬窗3(部分窗30)。並且,在此,部分窗30係以對金屬窗懸吊部62成為電性浮動之狀態之方式,對該金屬懸吊部62絕緣。該些天板部61及金屬窗懸吊部62相當於本實施型態之金屬窗支撐機構。 As shown in FIG. 1, for example, the ceiling portion 61 is formed of an aluminum plate material having a size slightly the same as that of the metal window 3, and is disposed so as to face the metal window 3 with the antenna chamber 50 interposed therebetween. As shown in Fig. 1, the top plate portion 61 is electrically grounded. Furthermore, between the lower surface of the ceiling portion 61 and the upper portion of the partial window 30, a plurality of metal window suspension portions 62 as the first suspension portion are mounted, and the metal window suspension portions 62 are suspended to support the metal window. 3 (partial window 30). Further, here, the partial window 30 is insulated from the metal hanging portion 62 so that the metal window hanging portion 62 is electrically floated. The roof portion 61 and the metal window hanging portion 62 correspond to the metal window supporting mechanism of the present embodiment.

例如,如圖3所示般,金屬窗懸吊部62係在上端部形成有凸緣部621之金屬製的棒狀構件。該金屬窗懸吊部62之凸緣部621藉由螺栓622與天板部61之下面 連結。 For example, as shown in FIG. 3, the metal window hanging portion 62 is a metal rod-shaped member in which the flange portion 621 is formed at the upper end portion. The flange portion 621 of the metal window hanging portion 62 is surrounded by the bolt 622 and the ceiling portion 61. link.

再者,即使在相鄰部分窗30之境界配置各金屬窗懸吊部62,藉由一根金屬窗懸吊部62,懸吊支撐兩個部分窗30,依此抑制金屬窗懸吊部62之設置數量的增大亦可。而且,即使在該金屬窗懸吊部62形成對部分窗30之處理氣體擴散室301供給處理氣體之先前已述之氣體供給管41亦可。 Furthermore, even if the metal window hanging portions 62 are disposed at the boundary of the adjacent partial windows 30, the two partial windows 30 are suspended and supported by a metal window hanging portion 62, thereby suppressing the metal window hanging portion 62. The number of settings can also be increased. Further, even in the metal window hanging portion 62, the gas supply pipe 41 which has been described above for supplying the processing gas to the processing gas diffusion chamber 301 of the partial window 30 may be formed.

如使用圖4之電漿處理裝置1a進行說明般,當僅以天板部61a支撐在全面施加強的拉伸荷重之金屬窗3時,不得不使用笨重的板材,使得金屬窗3之支撐機構大重量化。於是,在本例之電漿處理裝置1中,採用了使用骨架構造之天板支撐機構7進一步懸吊支撐天板部61的構成。 As described using the plasma processing apparatus 1a of Fig. 4, when the metal window 3 to which a strong tensile load is applied is applied only by the roof portion 61a, a bulky plate material has to be used, so that the supporting mechanism of the metal window 3 is used. Large weight. Then, in the plasma processing apparatus 1 of the present embodiment, the configuration in which the roof portion 61 is supported by the roof supporting mechanism 7 using the skeleton structure is further suspended.

如圖1所示般,天板支撐機構7成為具備被架設在天板部61之上面側的複數根之橫棒部71,和支撐各橫棒部71之腳柱部72的骨架構造。例如,各腳柱部72係被配置成朝向上方側伸出的棒狀構件,成為機械性強度(彎曲長度或拉伸強度)較鋁高的鐵製。各腳柱部72經由被形成在其下端部之凸緣部720而與金屬框11之上面側連結。 As shown in FIG. 1, the roof supporting mechanism 7 has a skeleton structure including a plurality of horizontal bar portions 71 that are stretched on the upper surface side of the roof portion 61, and a leg portion 72 that supports the respective horizontal bar portions 71. For example, each of the leg portions 72 is a rod-shaped member that is disposed to protrude toward the upper side, and is made of iron having a higher mechanical strength (bending length or tensile strength) than aluminum. Each of the leg portions 72 is coupled to the upper surface side of the metal frame 11 via a flange portion 720 formed at a lower end portion thereof.

在腳柱部72之上端,經由從上面側觀看時朝向容器本體10之內側彎曲至斜上方的傾斜部711,連接在橫向延伸之棒狀的橫棒部71。即使針對該些橫棒部71和其兩端之傾斜部711,也藉由鐵製之構件而被構成。再 者,藉由以橫棒部71和傾斜部711,形成由複數之直線所構成的拱橋構造,來提高天板支撐機構7之強度。橫棒部71及傾斜部711相當於本實施型態之橫架部。並且,即使藉由曲線狀之拱橋構成該橫架部當然亦可。 At the upper end of the leg portion 72, a bar-shaped horizontal bar portion 71 extending in the lateral direction is connected via an inclined portion 711 bent toward the upper side of the container body 10 when viewed from the upper side. Even the inclined portion 711 of the horizontal bar portion 71 and both ends thereof is configured by a member made of iron. again The strength of the roof supporting mechanism 7 is increased by forming the arch structure composed of a plurality of straight lines by the horizontal bar portion 71 and the inclined portion 711. The horizontal bar portion 71 and the inclined portion 711 correspond to the horizontal frame portion of the present embodiment. Further, it is a matter of course that the cross frame portion is constituted by a curved arch bridge.

如圖2所示般,各橫棒部71係從金屬框11(容器本體10之側壁)之各邊之中央部,及金屬框11之四角落,朝向天板部61之上方側之中央部伸出,經由金屬製之矩形狀之框體所構成之連結部712互相連結。連結部712之開口710除了通過朝高頻天線5的供電線或氣體供給管41外,在連結部712之上面配置有將電極分配至各高頻天線5之無圖示之分配器或匹配器511等。 As shown in Fig. 2, each of the horizontal bar portions 71 is formed from the central portion of each side of the metal frame 11 (the side wall of the container body 10) and the four corners of the metal frame 11 toward the upper portion of the upper side of the ceiling portion 61. The connecting portions 712 formed by the metal rectangular frame are connected to each other. In addition to the power supply line or the gas supply pipe 41 of the high-frequency antenna 5, the opening 710 of the connection portion 712 is provided with a distributor or a matching device (not shown) for distributing the electrodes to the respective high-frequency antennas 5 on the upper surface of the connection portion 712. 511 and so on.

在橫棒部71及傾斜部711之下面,安裝作為第2懸吊部之複數天板懸吊部73,藉由該些天板懸吊部73懸吊支撐天板部61。並且,在本例中,從橫棒部71之下面朝向下方側伸出之棒狀之柱體構件73a,和從傾斜部711之下面朝向下方側伸出之板狀之肋條構件73b之兩種類的天板懸吊部73。 A plurality of slab suspension portions 73 as second suspension portions are attached to the lower surface of the horizontal bar portion 71 and the inclined portion 711, and the slab suspension portion 73 suspends and supports the slab portion 61. Further, in this example, the rod-shaped column member 73a projecting from the lower surface of the horizontal bar portion 71 toward the lower side and the plate-like rib member 73b projecting from the lower surface of the inclined portion 711 toward the lower side are two types. The ceiling suspension portion 73.

如圖3所示般,柱體構件73a係在上端部及下端部具備凸緣部731之鐵製之棒狀的構件,上端部側之凸緣部731藉由螺栓732與橫棒部71之下面連結。再者,柱體構件73a之下端部側之凸緣部731藉由螺栓732與天板部61之上面連結。即使針對肋條構件73b,因經由凸緣部等與傾斜部711之下面,及天板部61之上面連結之點也相同,故省略圖示。並且,即使柱體構件73a、 73b構成藉由熔接等與橫棒部71及傾斜部711成為一體亦可。 As shown in FIG. 3, the column member 73a is a rod-shaped member made of iron having a flange portion 731 at the upper end portion and the lower end portion, and the flange portion 731 at the upper end portion side is provided by the bolt 732 and the horizontal rod portion 71. Link below. Further, the flange portion 731 on the lower end side of the column member 73a is coupled to the upper surface of the top plate portion 61 by a bolt 732. Even if the rib member 73b is connected to the lower surface of the inclined portion 711 via the flange portion or the like and the upper surface of the top plate portion 61 is the same, the illustration is omitted. And even if the column member 73a, The 73b may be integrated with the horizontal bar portion 71 and the inclined portion 711 by welding or the like.

藉由上述說明的構成,懸吊支撐金屬窗3(部分窗30)之天板部61,又成為藉由天板支撐機構7(橫棒部71、傾斜部711、腳柱部72)而被懸吊支撐的構造。 According to the configuration described above, the roof portion 61 that suspends the supporting metal window 3 (partial window 30) is again supported by the roof supporting mechanism 7 (the horizontal bar portion 71, the inclined portion 711, and the leg portion 72). The construction of the suspension support.

以下,針對與本發明之實施型態有關之電漿處理裝置1之作用予以說明。 Hereinafter, the action of the plasma processing apparatus 1 relating to the embodiment of the present invention will be described.

首先,打開閘閥102,從相鄰之真空搬運室藉由搬運機構(任一者皆無圖示),經搬入搬出口101將基板G搬入至處理空間100內。接著,在載置台13上載置基板G,藉由無圖示之靜電夾具固定,另外,使上述搬運機構從處理空間100退避而關閉閘閥102。 First, the gate valve 102 is opened, and the substrate G is carried into the processing space 100 through the loading/unloading port 101 from the adjacent vacuum transfer chamber by a transport mechanism (none of which is not shown). Next, the substrate G is placed on the mounting table 13 and fixed by an electrostatic chuck (not shown), and the transport mechanism is retracted from the processing space 100 to close the gate valve 102.

然後,從處理氣體供給部42經各部分窗30之處理氣體擴散室301而對處理空間100內供給處理氣體,另外藉由真空排氣部12進行處理空間100內之真空排氣,將處理空間100內調節至例如0.66~26.6Pa程度之壓力氛圍。再者,從無圖示之氣體流路對基板G供給熱傳達用之He氣體。 Then, the processing gas is supplied from the processing gas supply unit 42 to the processing space 100 through the processing gas diffusion chamber 301 of each partial window 30, and the vacuum exhausting portion 12 performs vacuum evacuation in the processing space 100 to process the processing space. The pressure within 100 is adjusted to a pressure atmosphere of, for example, 0.66 to 26.6 Pa. Further, He gas for heat transfer is supplied to the substrate G from a gas flow path (not shown).

接著,從第1高頻電源512對高頻天線5施加高頻電力,依此經金屬窗3在處理空間100內生成均勻之感應電場。其結果,藉由感應電場,處理氣體在處理空間100內電漿化,生成高密度之感應耦合電漿。而且,藉由從第2高頻電源152被施加至載置台13之偏壓用之高頻電力,電漿中之離子朝向基板G被導入,進行基板G 之電漿處理。 Next, high-frequency power is applied to the high-frequency antenna 5 from the first high-frequency power source 512, whereby a uniform induced electric field is generated in the processing space 100 via the metal window 3. As a result, the process gas is plasmad in the processing space 100 by the induced electric field to generate a high-density inductively coupled plasma. By the high-frequency power for bias applied to the mounting table 13 from the second high-frequency power source 152, ions in the plasma are introduced toward the substrate G to perform the substrate G. Plasma treatment.

而且,當僅以事先設定之時間進行電漿處理時,停止自各高頻電源512、152供給電力、自處理氣體供給部42供給處理氣體、及處理空間100內之真空排氣,以與搬入時相反之順序搬出基板G。 Further, when the plasma treatment is performed only at the time set in advance, the supply of electric power from the respective high-frequency power sources 512 and 152, the supply of the processing gas from the processing gas supply unit 42 and the evacuation of the vacuum in the processing space 100 are performed. The substrate G is carried out in the reverse order.

以上進行動作說明之處理空間100之內部如先前已述般,被真空排氣成高真空之狀態,在配置在處理空間100之上面側金屬窗3(部分窗30)除其自重外被施加大氣壓。金屬窗3係抵抗該些力量而藉由天板部61被懸吊支撐,保持在與容器本體10之間,形成處理空間100之狀態。 The inside of the processing space 100, which has been described above, is evacuated to a high vacuum state as described above, and the metal window 3 (partial window 30) disposed on the upper side of the processing space 100 is subjected to atmospheric pressure in addition to its own weight. . The metal window 3 is suspended and supported by the roof portion 61 against the force, and is held between the container body 10 and the processing space 100.

在此,懸吊支撐金屬窗3之天板部61藉由以機械性強度較天板部61之強度高的構件所構成之骨架構造之天板支撐機構7進一步被懸吊支撐,而被補強。另外,天板支撐機構7之腳柱部72由於被安裝於金屬框11之上面側,故金屬窗3之懸吊荷重經天板支撐機構7而分散至其腳柱部72,被轉換成推壓金屬框11(即是,容器本體10之側壁)之力量。具有對處理空間100內之真空氛圍的耐壓性能之容器本體10,係具有可以穩定地抵抗上述推壓力而支撐天板支撐機構7之足夠強度。 Here, the roof portion 61 of the suspension supporting metal window 3 is further suspended and supported by the slab supporting mechanism 7 having a skeleton structure in which the mechanical strength is higher than that of the member of the slab portion 61, and is reinforced. . Further, since the leg portion 72 of the roof supporting mechanism 7 is attached to the upper surface side of the metal frame 11, the hanging load of the metal window 3 is dispersed to the leg portion 72 via the roof supporting mechanism 7, and is converted into a push. The force of the metal frame 11 (i.e., the side wall of the container body 10) is pressed. The container body 10 having the pressure resistance to the vacuum atmosphere in the processing space 100 has sufficient strength to stably support the roof supporting mechanism 7 against the above pressing force.

若藉由本發明之電漿處理裝置1時,具有以下之效果。因將構成處理空間100之金屬窗3懸吊支撐於天板部61,並且利用由機械性強度高的構件所構成之骨架構造之天板支撐機構7懸吊支撐該天板部61,故可以 分散金屬窗3之懸吊荷重。 According to the plasma processing apparatus 1 of the present invention, the following effects are obtained. The metal window 3 constituting the processing space 100 is suspended and supported by the roof portion 61, and the roof portion 61 is suspended and supported by the roof supporting mechanism 7 having a skeleton structure composed of a member having high mechanical strength. The suspended load of the metal window 3 is dispersed.

其結果,比起藉由圖4之電漿處理裝置1a所示之鋁製之天板部61a,和被設置在其周緣部之側壁部63,懸吊支撐金屬窗3之情形,可以邊保持安裝金屬窗3所需要之機械性強度,邊使支撐該金屬窗3之機構予以輕量化。 As a result, it is possible to hold the supporting metal window 3 as compared with the aluminum ceiling portion 61a shown in the plasma processing apparatus 1a of Fig. 4 and the side wall portion 63 provided at the peripheral portion thereof. The mechanical strength required to mount the metal window 3 is made lighter by the mechanism supporting the metal window 3.

並且,當與圖4之側壁部63做比較時,本發明之天板支撐機構7之「骨架構造」係指分別藉由橫寬較金屬框11(容器本體10之側壁)之短邊及長邊短的構件而構成天板支撐機構7的情形。例如骨架構造之構件使用數cm~數十cm程度之橫寬的構件。 Further, when compared with the side wall portion 63 of Fig. 4, the "skeleton structure" of the roof supporting mechanism 7 of the present invention means the short side and the length of the metal frame 11 (the side wall of the container body 10) by the lateral width, respectively. The case where the shield supporting mechanism 7 is constituted by a short member. For example, a member having a skeleton structure uses a member having a width of several cm to several tens of cm.

在此,天板支撐機構7之構成並不限定於使用圖1~圖3所示之例,可以採用各種變化。 Here, the configuration of the roof supporting mechanism 7 is not limited to the example shown in FIGS. 1 to 3, and various changes can be employed.

並且,在以下說明之圖5~圖7之各圖中,針對與圖1~圖3所示者共同的構成要素,賦予與標示在該些圖中者相同的符號。 In the respective drawings of FIGS. 5 to 7 described below, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals as those shown in the drawings.

天板支撐機構7之平面形狀如圖2所示般,並不限定於各橫棒部71被配置成從容器本體10之中央部側延伸成放射狀之情形。例如圖5所示般,即使沿著容器本體10之短邊方向,互相平行地配置複數根之橫棒部71的構成亦可。 As shown in FIG. 2, the planar shape of the top plate support mechanism 7 is not limited to the case where each of the horizontal bar portions 71 is arranged to extend radially from the central portion side of the container body 10. For example, as shown in FIG. 5, a configuration in which a plurality of horizontal bar portions 71 are arranged in parallel with each other in the short-side direction of the container body 10 may be employed.

再者,支撐天板部61之手法並不限定於僅藉由懸吊支撐支撐其全面之情形。例如,如圖6所示之電漿處理裝置1b之天板支撐機構7a般,即使針對天板部61 之周緣部,藉由設置在腳柱部72之側面的天板支撐部721從下面側支撐亦可。 Furthermore, the method of supporting the roof portion 61 is not limited to the case where it is supported only by the suspension support. For example, as shown in the solar panel supporting mechanism 7a of the plasma processing apparatus 1b shown in Fig. 6, even for the roof portion 61 The peripheral portion may be supported from the lower side by the roof supporting portion 721 provided on the side surface of the leg portion 72.

而且,天板支撐機構7也無須設置在金屬框11之上面(容器本體10之側壁上)。例如,如圖7所示之電漿處理裝置1c之天板支撐機構7b般,即使在配置電漿處理裝置1c之底面或台座面等設置腳柱部72亦可。在此,固定腳柱部72之底面或台座面之高度位置不一定要較天板部61更下方側亦可。若可以穩定地固定腳柱部72時,即使與天板部61相同之高度或位於比此更高位置之底面或台座面固定腳柱部72亦可。 Moreover, the roof supporting mechanism 7 does not need to be disposed above the metal frame 11 (on the side wall of the container body 10). For example, as in the slab support mechanism 7b of the plasma processing apparatus 1c shown in Fig. 7, the leg portion 72 may be provided on the bottom surface or the pedestal surface of the plasma processing apparatus 1c. Here, the height position of the bottom surface or the seating surface of the fixed leg portion 72 does not have to be lower than the top plate portion 61. When the leg portion 72 can be stably fixed, the leg portion 72 can be fixed even at the same height as the crown portion 61 or at a bottom surface or a pedestal surface at a higher position.

而且,天板支撐機構7、7a、7b無須設置在上下方向延伸之棒狀之腳柱部72。例如,即使在金屬框11等之上面直接固定例如拱橋形狀之橫架部(由圖1所示之橫棒部71及傾斜部711或曲線狀之拱橋所構成之橫架部)之下端部亦可。此時該些拱橋之基端部成為腳柱部。 Further, the roof supporting mechanisms 7, 7a, 7b need not be provided with a rod-shaped leg portion 72 extending in the vertical direction. For example, even if the cross frame portion (such as the horizontal bar portion 71 and the inclined portion 711 or the curved frame portion formed by the curved arch bridge shown in FIG. 1) is directly fixed to the upper surface of the metal frame 11 or the like, the lower end portion is also fixed. can. At this time, the base end portions of the arch bridges become the leg portions.

其他,即使針對金屬窗3之構成,可以舉出各種變化。例如,即使設成在金屬窗3設置使溫度調整用之流體流通之流路,進行金屬窗3之溫度調整的構成亦可。此時,即使在金屬窗懸吊部62設置使上述溫度調整用之流體流通的流路亦可。 Others, various changes can be made even for the configuration of the metal window 3. For example, even if a flow path through which the fluid for temperature adjustment flows is provided in the metal window 3, the temperature of the metal window 3 may be adjusted. At this time, the metal window hanging portion 62 may be provided with a flow path through which the fluid for temperature adjustment is circulated.

而且,天板部61並不限定於藉由一片板材構成的情形,即使分割成複數板材亦可。即使將該些複數天板部61懸吊支撐在共同的天板支撐機構7亦可,即使藉 由互相不同之複數天板支撐機構7支撐各天板部61亦可。 Further, the roof portion 61 is not limited to the case of being formed of one sheet material, and may be divided into a plurality of sheets. Even if the plurality of slab portions 61 are suspended and supported by the common slab support mechanism 7, even if borrowed It is also possible to support the respective ceiling portions 61 by a plurality of different roof supporting mechanisms 7 that are different from each other.

並且,利用導電性比鐵高的鋁製之一片板構成天板部61,依此也有容易對被接地之天板部61進行除電的效果。 Further, the ceiling portion 61 is formed of one piece of aluminum having a higher electrical conductivity than iron, and thus it is easy to remove the grounded portion 61 from the ground.

而且又雖然表示使用FPD基板當作被處理基板的例,但若為矩形基板時,亦能適用對於太陽電池面板用之基板等之其他種類的基板進行的電漿處理。 Further, although the FPD substrate is used as an example of the substrate to be processed, in the case of a rectangular substrate, plasma treatment for other types of substrates such as a substrate for a solar cell panel can be applied.

G‧‧‧玻璃基板 G‧‧‧glass substrate

1‧‧‧電漿處理裝置 1‧‧‧Plastic processing unit

10‧‧‧容器本體 10‧‧‧ container body

100‧‧‧處理空間 100‧‧‧Processing space

101‧‧‧搬入搬出口 101‧‧‧ Move in and out

102‧‧‧閘閥 102‧‧‧ gate valve

103‧‧‧排氣口 103‧‧‧Exhaust port

11‧‧‧金屬框 11‧‧‧Metal frame

110‧‧‧密封構件 110‧‧‧ Sealing members

12‧‧‧真空排氣部 12‧‧‧ Vacuum Exhaust Department

13‧‧‧載置台 13‧‧‧ mounting table

14‧‧‧絕緣體框 14‧‧‧Insulator frame

151‧‧‧匹配器 151‧‧‧matcher

152‧‧‧第2高頻電源 152‧‧‧2nd high frequency power supply

3‧‧‧金屬窗 3‧‧‧Metal windows

30‧‧‧部分窗 30‧‧‧Some windows

31‧‧‧絕緣構件 31‧‧‧Insulating components

301‧‧‧處理氣體擴散室 301‧‧‧Processing gas diffusion chamber

302‧‧‧處理氣體吐出孔 302‧‧‧Processing gas discharge hole

41‧‧‧氣體供給管 41‧‧‧ gas supply pipe

42‧‧‧處理氣體供給部 42‧‧‧Process Gas Supply Department

5‧‧‧高頻天線 5‧‧‧High frequency antenna

50‧‧‧天線室 50‧‧‧Antenna room

511‧‧‧匹配部 511‧‧‧ Matching Department

512‧‧‧第1高頻電源 512‧‧‧1st high frequency power supply

61‧‧‧天板部 61‧‧‧Surface Department

62‧‧‧金屬窗懸吊部 62‧‧‧Metal window suspension

7‧‧‧天板支撐機構 7‧‧‧Sky support mechanism

71‧‧‧橫棒部 71‧‧‧ horizontal bar

710‧‧‧開口 710‧‧‧ openings

711‧‧‧傾斜部 711‧‧‧ inclined section

712‧‧‧連結部 712‧‧‧Linking Department

72‧‧‧腳柱部 72‧‧‧Foot section

720‧‧‧凸緣部 720‧‧‧Flange

73‧‧‧天板懸吊部 73‧‧‧Aisan suspension

73a‧‧‧柱體構件 73a‧‧‧Cylinder components

73b‧‧‧肋條構件 73b‧‧‧ rib members

8‧‧‧控制部 8‧‧‧Control Department

Claims (8)

一種電漿處理裝置,其係對被真空排氣之處理空間內之被處理基板,實施藉由被電漿化之處理氣體進行的電漿處理,該電漿處理裝置之特徵在於具備:金屬製之處理容器,其具備載置上述被處理基板之載置台,與該載置台相向之上面開口,並且被電性接地;導電性之金屬窗,其係被配置在堵塞上述處理容器之開口之位置上而形成上述處理空間,並且在隔著絕緣構件而與上述處理容器絕緣之狀態下被設置;電漿天線,其係以與該金屬窗相向之方式被設置在上述金屬窗之上方側,用以藉由感應耦合使上述處理氣體電漿化;金屬窗支撐機構,其具備以與上述金屬窗相向之方式被配置在電漿天線之上方側的天板部,和被設置在該天板部,用以懸吊支撐上述金屬窗之複數第1懸吊部;及骨架構造之天板支撐機構,其具備設置有用以從上方側懸吊支撐上述天板部之複數第2懸吊部的橫架部,和用以支撐上述橫架部的腳柱部。 A plasma processing apparatus for performing plasma treatment by a plasma-treated processing gas on a substrate to be processed in a vacuum evacuated processing space, the plasma processing apparatus comprising: metal The processing container includes a mounting table on which the substrate to be processed is placed, is open to the upper surface of the mounting table, and is electrically grounded; and the conductive metal window is disposed at a position blocking the opening of the processing container The processing space is formed in the upper portion, and is provided in a state of being insulated from the processing container via an insulating member; and the plasma antenna is disposed on the upper side of the metal window so as to face the metal window. The processing gas is plasma-pulled by inductive coupling; the metal window supporting mechanism includes a ceiling portion disposed on the upper side of the plasma antenna so as to face the metal window, and is disposed on the sky plate portion a plurality of first suspension portions for suspending and supporting the metal window; and a slab support structure of the slab structure, which is provided with a utility for suspending and supporting the slab portion from the upper side a cross frame portion of the plurality of second suspension portions and a leg portion for supporting the horizontal frame portion. 如請求項1所記載之電漿處理裝置,其中上述金屬窗被分割成複數之部分窗,相鄰之部分窗彼此經絕緣構件被互相絕緣。 The plasma processing apparatus according to claim 1, wherein the metal window is divided into a plurality of partial windows, and adjacent partial windows are insulated from each other via an insulating member. 如請求項2所記載之電漿處理裝置,其中絕緣上述處理容器和金屬窗之絕緣構件,及絕緣該金屬窗之相鄰部分窗彼此的絕緣構件,被上述處理容器支 撐。 The plasma processing apparatus according to claim 2, wherein the insulating member that insulates the processing container and the metal window, and the insulating member that insulates the adjacent partial windows of the metal window are supported by the processing container support. 如請求項1至3中之任一項所記載之電漿處理裝置,其中上述腳柱部被設置在上述開口之周圍之處理容器上。 The plasma processing apparatus according to any one of claims 1 to 3, wherein the leg portion is provided on a processing container around the opening. 如請求項1至4中之任一項所記載之電漿處理裝置,其中上述天板部係被電性接地的金屬製,上述第1懸吊部具備絕緣上述金屬窗和天板部的絕緣構件。 The plasma processing apparatus according to any one of claims 1 to 4, wherein the ceiling portion is made of a metal that is electrically grounded, and the first suspension portion is insulated from the metal window and the ceiling portion. member. 如請求項5所記載之電漿處理裝置,其中上述天板支撐機構之橫架部及腳柱部相較於上述天板部,係導電性低,機械性強度高的金屬製。 The plasma processing apparatus according to claim 5, wherein the cross frame portion and the leg portion of the roof supporting mechanism are made of metal having low conductivity and high mechanical strength compared to the top plate portion. 如請求項1至6所記載之電漿處理裝置,其中上述橫架部被形成拱橋狀。 The plasma processing apparatus according to any one of claims 1 to 6, wherein the lateral frame portion is formed in an arch shape. 如請求項1至7所記載之電漿處理裝置,其中上述金屬窗兼作對上述處理空間供給處理氣體的氣體噴淋頭。 The plasma processing apparatus according to any one of claims 1 to 7, wherein the metal window also serves as a gas shower head for supplying a processing gas to the processing space.
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Publication number Priority date Publication date Assignee Title
JP6719290B2 (en) * 2016-06-22 2020-07-08 東京エレクトロン株式会社 Reinforcement structure, vacuum chamber, and plasma processing equipment
JP6804392B2 (en) * 2017-06-05 2020-12-23 東京エレクトロン株式会社 Plasma processing equipment and gas shower head
CN107633991B (en) * 2017-09-20 2019-10-11 武汉华星光电半导体显示技术有限公司 A kind of dry etching equipment
KR102409375B1 (en) * 2018-11-15 2022-06-15 주식회사 원익아이피에스 Substrate processing apparatus
JP7303980B2 (en) * 2019-07-09 2023-07-06 日新電機株式会社 Plasma processing equipment
CN112117176B (en) * 2019-06-20 2023-03-07 中微半导体设备(上海)股份有限公司 Plasma processing apparatus and plasma processing system
CN112820616B (en) * 2021-01-18 2024-04-12 北京北方华创微电子装备有限公司 Semiconductor process chamber

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986618A (en) 1975-09-05 1976-10-19 Lee C. Moore Corporation Pipe rack with pivoted fingers and screw conveyors
JP4028534B2 (en) * 1999-05-13 2007-12-26 東京エレクトロン株式会社 Inductively coupled plasma processing equipment
JP3451478B2 (en) 1999-12-21 2003-09-29 住友重機械工業株式会社 Process chamber
JP4522980B2 (en) * 2005-11-15 2010-08-11 パナソニック株式会社 Plasma processing apparatus and plasma processing method
KR101089877B1 (en) * 2008-04-15 2011-12-05 도쿄엘렉트론가부시키가이샤 Vacuum container and plasma processing apparatus
US8187381B2 (en) * 2008-08-22 2012-05-29 Applied Materials, Inc. Process gas delivery for semiconductor process chamber
JP5479867B2 (en) * 2009-01-14 2014-04-23 東京エレクトロン株式会社 Inductively coupled plasma processing equipment
JP5327147B2 (en) * 2009-12-25 2013-10-30 東京エレクトロン株式会社 Plasma processing equipment
JP2011258622A (en) * 2010-06-07 2011-12-22 Tokyo Electron Ltd Plasma processing apparatus and its dielectric window structure
US9184028B2 (en) * 2010-08-04 2015-11-10 Lam Research Corporation Dual plasma volume processing apparatus for neutral/ion flux control
JP5745812B2 (en) * 2010-10-27 2015-07-08 東京エレクトロン株式会社 Plasma processing equipment
JP5727281B2 (en) * 2011-04-21 2015-06-03 東京エレクトロン株式会社 Inductively coupled plasma processing equipment
JP6228400B2 (en) * 2013-07-16 2017-11-08 東京エレクトロン株式会社 Inductively coupled plasma processing equipment

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