TW201632306A - Retainer ring structure for chemical-mechanical polishing apparatus and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a retainer ring structure for a CMP apparatus and a method for manufacturing the same. The retainer ring structure may include screws for fixing the retainer ring structure mounted on a polishing head during a CMP process, the screw being made of a high-strength metallic material, and the method for manufacturing the retainer ring structure may be simplified. Thus, a coupling force with the polishing head may be increased to reduce a defect rate, and the process may be simplified to reduce an operation time and a manufacturing cost, thereby increasing merchantability.

Description

Retaining ring structure member for chemical mechanical polishing device and manufacturing method thereof

The present invention relates to a snap ring structural member for a chemical mechanical polishing (CMP) (CMP) device and a method for manufacturing the same, and more particularly to the following snap ring structural member for a CMP device and a method for manufacturing the same, that is, In the CMP process, the fixing screw portion of the snap ring structure attached to the polishing head is made of a high-strength metal material, and the other parts are made of a low-cost metal alloy, which not only reduces the manufacturing cost but also increases the bonding with the polishing head. Force, thereby reducing product failure rate, simplifying processes, reducing work time, and improving salesability.

In general, with the trend of high speed and high integration of semiconductor devices, in the multilayer wiring structure, the demand for the increase in the number of wiring layers and the refinement of the wiring pattern is gradually increased, and thus the wiring technology becomes a submicron process. important topic.

In particular, since the process era of 0.35 μm or less, in order to realize a fine surface, the process depth of the exposure apparatus has been gradually reduced, and in order to secure a sufficient depth of focus, a comprehensive planarization technique in the field of trans wafers is required.

Therefore, in order to achieve comprehensive flatness, a technique called chemical mechanical polishing (CMP) is widely used, and this technology is not only indispensable for the manufacturing process of semiconductor components, but also actively develops research on a new generation of components. activity. and Further, the above-described CMP is not only widely applied to logic elements using multilayer wiring for the purpose of realizing high-speed components, but also gradually applied to the above-described memory elements in accordance with the trend of multi-layering of memory elements.

Also, in the CMP apparatus, the polishing head is used to fix the wafer to perform a mechanical action, and the polishing head is provided with a retainer ring, and the snap ring is used to fix the held wafer. In situ.

However, since the above-mentioned snap ring is manufactured only of a plastic material as a resin material, it is not only weak in strength, but also increases the time required for the flattening operation of the ring itself to be performed before the CMP process, and is caused by the fastening of the cover bolt. The force is uneven, and there is a problem of partial wear.

Therefore, in the snap ring structure which is widely used at present, an insert ring as an inner ring is made of a metal material, and an outer ring formed by surrounding the insert ring is made of a resin such as plastic.

As described above, the manufacturing method of the ring structure member composed of the inner ring and the outer ring has been applied to and authorized by the Korean Patent Office on June 9, 2010 under the name of "the method for manufacturing the snap ring of the mechanical polishing device"; On August 18, 2010, the applicant applied for and authorized the Korean Patent Office on August 18, 2010 under the name “Knife Ring Structure for Chemical Mechanical Grinding Devices and Its Manufacturing Method”.

However, in the above-described snap ring manufacturing method, since the portion to which the screw attached to the polishing head is fastened is formed of a resin material, not only the fastening force is weak but also local deformation is caused at the time of fastening.

In addition, according to the manufacturing method, the inner ring as the metal material is molded, and the hole formed on the upper surface of the inner ring is combined with the insertion pin formed with the head, and then the resin material is injected into the mold. forming.

Thereafter, after cooling, the head of the insertion pin is cut, and the body of the insertion pin is machined with holes or threads to complete the snap ring structure. This method is not only very complicated, but also needs to be completed through multiple process steps. Therefore, there is a problem that the manufacturing cost is high and the work is difficult.

Accordingly, the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a snap ring structure for a CMP apparatus and a method of manufacturing the same, that is, a fixing of a snap ring structure attached to a polishing head in a CMP process High-strength metal materials are used for the screw parts, and the manufacturing method is simplified, thereby increasing the bonding force with the polishing head, thereby not only reducing the product failure rate, but also simplifying the process, reducing the working time and manufacturing cost, and improving Marketability.

The above object is achieved by the present invention. According to an aspect of the invention, a snap ring structural member for a chemical mechanical polishing apparatus includes: an insert ring having an upper surface formed for combining with a head of the chemical mechanical polishing apparatus; a plurality of holes, wherein the insertion ring is formed of two or more metal materials; the insertion pins are respectively combined with the plurality of holes of the insertion ring, and are formed in an integral manner, and the upper surface has an open shape and a center inner portion is formed a threaded body, the insertion pin being formed of a metal material different from the insertion ring; and an outer ring surrounding the insertion ring except the upper surface of the insertion pin.

At this time, the strength of the insertion pin is higher than the strength of the insertion ring, and the insertion pin includes: a body having a cylindrical shape; and a chamfered portion which is partially cut along a longitudinal direction on a side surface of the body; A pair of disc-shaped heads are disposed on the upper and lower portions of the body, and the diameter of the pair of disc-shaped heads is larger than the diameter of the body.

According to another aspect of the present invention, a card for a CMP device The method for manufacturing a ring structure member includes: forming a plurality of holes for bonding with a head portion of the above-described chemical mechanical polishing device on an upper surface of an insertion ring formed of two or more kinds of metal materials, which is different from a material of the above-mentioned insertion ring a cylindrical insertion pin made of a metal material is combined with a plurality of holes of the insertion ring to form an integral step; the insertion ring to which the insertion pin is coupled is attached to a mold, and a resin material is injection-molded, and a resin material is used. a step of forming an outer ring of the resin material in a portion other than the upper portion of the insertion pin, and a step of processing the upper surface of the insertion pin in an open shape and having a thread in the center.

In this case, preferably, the insertion pin is made of stainless steel, and the insert ring is made of a zinc alloy or an aluminum alloy.

According to the structure and the method as described above, the fixing screw portion of the snap ring structural member attached to the polishing head in the CMP process is made of a high-strength metal material, and the manufacturing method thereof is simplified, thereby increasing the bonding with the polishing head. Therefore, not only can the product failure rate be reduced, but also the process can be simplified, the working time and the manufacturing cost can be reduced, and the salesability can be improved.

10‧‧‧Snap ring structure

12‧‧‧Outer Ring

14‧‧‧insert ring

15‧‧‧ hole

16‧‧‧Insert pin

17‧‧‧ chamfered

18‧‧‧ head

19‧‧‧Ontology

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing an insertion ring and an insertion pin of a snap ring structural member according to a preferred embodiment of the present invention.

2 is a schematic perspective view of an insertion ring of a snap ring structural member in accordance with a preferred embodiment of the present invention.

Fig. 3 is a cross-sectional view taken along line A-A of Fig. 3.

4 is a schematic perspective view of a snap ring structural member in accordance with a preferred embodiment of the present invention.

Figure 5 is a view showing a manufacturing process of a snap ring structural member according to a preferred embodiment of the present invention; flow chart.

In the following, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the The same reference numerals.

As shown, the snap ring structure of the present invention illustrated by reference numeral 10 will be described with reference to the drawings.

First, the CMP apparatus is composed of a body, and a polishing head, the body including a polishing platen mounted on the upper surface and a polishing pad disposed on the upper surface of the polishing platen.

The polishing head is composed of a snap ring structural member 10 for fixing a wafer, a polishing housing to which the structural member 10 is attached, and a rotating arm, and the grinding housing is rotated by the rotating arm.

The upper surface of the polishing platen has a polishing pad that contacts the surface of the crystal to be polished, and a lower surface of the polishing platen is formed with a rotary drive shaft connected to the driving device, and the polishing platen is driven by the driving device. Perform orbital movements.

As shown in FIGS. 1 to 4, the snap ring structure 10 includes an insert ring 14 having a plurality of holes 15 formed in the upper surface for coupling with the head of the chemical mechanical polishing apparatus, and the insert ring has two or more types. The metal material is formed; the insertion pin 16 is formed of a metal material by press-fitting into the hole 15 of the insertion ring 14; and the outer ring 12 surrounds the insertion pin 16 and the insertion ring 14.

At this time, as shown in FIG. 2, the insertion pin 16 includes: a body 19 having a cylindrical shape; and a chamfered portion 17 partially cut along a length direction on a side surface of the body 19; And a pair of heads 18, which are disposed on the upper and lower portions of the body 19, have a disk shape, and the diameter of the head portion 18 is larger than the diameter of the body 19.

In particular, the insertion pin 16 is formed with a chamfered portion 17, and is tightly coupled to the above-described insertion pin 14 of two materials, so that the post-processing of the insertion pin 16 is performed more safely.

The method for manufacturing the snap ring structure of the above-described structure of the present invention is as follows. First, a plurality of joints for joining the head of the chemical mechanical polishing apparatus are formed on the upper surface of the insert ring 14 formed of two or more kinds of metal materials. The hole 15 is formed integrally with the insertion pin 16 and the insertion ring 14 by a die casting process, so that an insertion pin 16 made of a metal material different from the material of the insertion ring is formed in the plurality of holes of the insertion ring 14. (Step S12).

In this case, the present invention is characterized in that the strength of the insertion pin 16 is higher than the strength of the insertion ring 14, and the insertion ring 14 can be made of zinc alloy or aluminum alloy if it is only used to support the outer ring 12. Although the insertion pin 16 is screwed to the head of the polishing apparatus after post-processing, it is preferably formed of a stainless steel material to maintain a more excellent fastening force.

Thereafter, the insertion ring 14 to which the insertion pin 16 is coupled is attached to a mold, and a resin material is injection-molded to form an outer ring 12 that surrounds the insertion pin 14 with a resin material (step S12), and the insertion pin 16 is inserted. The upper surface is open and threaded inside the center, so that the snap ring structure 10 can be easily manufactured (step S14).

Further, as described above, the insertion pin 16 has a body 19 having a cylindrical shape, a chamfered portion 17 which is partially cut along the longitudinal direction on the side surface of the body 19, and a pair of head portions 18 which are provided In the upper and lower portions of the body 19, in the shape of a disk, the above The diameter of the head 18 is larger than the diameter of the body 19 described above.

The present invention is not limited to the snap ring structure for a chemical mechanical polishing apparatus of the embodiment described, and a method of manufacturing the same, and those skilled in the art to which the present invention pertains, without departing from the scope of the present invention It is obvious that many modifications and variations can be made. Therefore, such modifications or modifications are also intended to fall within the scope of the invention.

[Industrial availability]

According to the present invention, in the CMP process, the fixing screw portion of the snap ring structural member attached to the polishing head is made of a high-strength metal material, and the manufacturing method thereof is simplified, thereby increasing the bonding force with the polishing head, thereby not only reducing The product failure rate also simplifies the process, reduces the working time and the manufacturing cost, and therefore has industrial availability.

10‧‧‧Snap ring structure

12‧‧‧Outer Ring

14‧‧‧insert ring

15‧‧‧ hole

16‧‧‧Insert pin

17‧‧‧ chamfered

18‧‧‧ head

19‧‧‧Ontology

Claims (5)

A snap ring structural member for a chemical mechanical polishing apparatus, comprising: an insertion ring having a plurality of holes formed in the upper surface for coupling with a head of the chemical mechanical polishing device, wherein the insertion ring is made of two or more metals Forming a material; the insertion pin is respectively combined with the plurality of holes of the insertion ring, and is formed in an integral manner, the insertion pin having a body having an open upper surface and a thread formed inside the center, the insertion pin being The metal material of a different material of the insertion ring is formed, the strength of the insertion pin is higher than the strength of the insertion ring, and the outer ring surrounds the insertion ring except the upper surface of the insertion pin. The snap ring structural member for a chemical mechanical polishing apparatus according to claim 1, wherein the insertion pin comprises: a body having a cylindrical shape; and a chamfered portion on a side of the body along a length direction portion And being cut off; and a pair of disc-shaped heads disposed on the upper and lower portions of the body, wherein the diameter of the pair of disc-shaped heads is larger than the diameter of the body. A method of manufacturing a snap ring structural member for a chemical mechanical polishing apparatus, comprising: forming an upper surface of an insert ring formed of two or more kinds of metal materials for bonding with a head of the chemical mechanical polishing apparatus; a plurality of holes, a cylindrical insertion pin of a metal material different from a material of the insertion ring is combined with a plurality of holes of the insertion ring to form an integral step; and the insertion ring to which the insertion pin is coupled is mounted In the mold, the resin material is injection molded, and the resin material is used to surround the portion other than the upper portion of the insertion pin. a step of forming an outer ring of the resin material; and a step of processing the upper surface of the insertion pin in an open shape and having a thread inside the center. The method for manufacturing a snap ring structural member for a chemical mechanical polishing apparatus according to claim 3, wherein the insertion pin comprises: a body having a cylindrical shape; and a chamfered portion along a side surface of the body The longitudinal direction portion is cut; and a pair of disc-shaped heads are disposed on the upper and lower portions of the body, and the diameter of the pair of disc-shaped heads is larger than the diameter of the body. The method for manufacturing a snap ring structure for a chemical mechanical polishing apparatus according to claim 3, wherein the insertion pin is made of stainless steel, and the insert ring is made of a zinc alloy or an aluminum alloy.