TW201619571A - Optical calibration device and optical calibration method - Google Patents
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本揭露是有關於一種光學校正裝置，且特別是關於一種利用發光量測裝置取得光學影像以進行校正的光學校正裝置與光學校正方法。 The present disclosure relates to an optical correction device, and more particularly to an optical correction device and an optical correction method for taking an optical image for correction using a luminescence measurement device.
一般而言，使用非接觸式光學技術量測物體厚度有兩種方法。第一種方法是使用一個量測模組，取得待測物體上、下表面的兩組反射訊號以計算出厚度資訊。但是這種方法所計算出之量測結果容易受到待測物體之介質的影響，故不適合使用。第二種方法是使用兩個量測模組，透過上、下兩個量測模組對待測物體進行量測，再依據所回傳的訊號計算出厚度資訊。舉例而言，對於藍寶石晶圓拋光後的厚度量測與晶圓厚度量測等，皆是利用此方法來進行量測。厚度量測的基準在於上、下兩個量測模組需要量測到物體上相同的位置點，因此兩個量測模組的量測定位校準對於厚度量測具有重大的影響。 In general, there are two methods for measuring the thickness of an object using non-contact optical techniques. The first method is to use a measurement module to obtain two sets of reflection signals on the upper and lower surfaces of the object to be tested to calculate the thickness information. However, the measurement results calculated by this method are easily affected by the medium of the object to be tested, so it is not suitable for use. The second method uses two measurement modules to measure the object to be measured through the upper and lower measurement modules, and then calculates the thickness information according to the signal transmitted back. For example, thickness measurement and wafer thickness measurement after sapphire wafer polishing are measured by this method. The benchmark for thickness measurement is that the upper and lower measurement modules need to measure the same position on the object, so the measurement of the two measurement modules has a significant impact on the thickness measurement.
然而，就第二種方法而言，為了確保得到準確的厚度數值，則必須先透過位移機構來進行校正。一般習知的調整方式只單純透過雙軸移動平台來移動，並沒有透過其他工具 進行輔助，無法確保兩個量測模組對位的準確性。因此，需要一種光學校正裝置與光學校正方法，取得校正圖案並提升量測模組之對位的準確性與便利性，準確取得量測模組的光點位置，提升光學量測的準確性。 However, in the case of the second method, in order to ensure an accurate thickness value, it is necessary to perform correction by a displacement mechanism. The conventional adjustment method is only simple to move through the two-axis mobile platform, and does not pass other tools. Assistance does not ensure the accuracy of the alignment of the two measurement modules. Therefore, an optical correction device and an optical correction method are needed to obtain a correction pattern and improve the accuracy and convenience of the alignment of the measurement module, accurately obtain the position of the light spot of the measurement module, and improve the accuracy of the optical measurement.
有鑑於此，本揭露之主要目的，在於提供一種光學校正裝置與光學校正方法，使用至少一發光量測模組以及一定位校正模組，藉由取得與分析校正圖案，校正光學裝置的傾斜角度偏差與平面錯位偏差，以提升量測模組之對位的準確性與便利性。 In view of the above, the main purpose of the present disclosure is to provide an optical correction device and an optical correction method, which use at least one illuminance measurement module and a positioning correction module to correct the tilt angle of the optical device by acquiring and analyzing the correction pattern. Deviation and plane misalignment to improve the accuracy and convenience of the alignment of the measurement module.
本揭露提供一種光學校正裝置，包括至少一發光量測模組以及一定位校正模組。至少一發光量測模組發出至少一入射光線至一定位校正片，其中定位校正片反射至少一入射光線而產生至少一反射光線。定位校正模組耦接至少一發光量測模組，以及接收至少一反射光線以產生關於至少一反射光線之至少一校正圖案，並且對至少一校正圖案進行量測與分析以校正至少一發光量測模組之傾斜角度偏差及/或平面錯位偏差。 The present disclosure provides an optical calibration apparatus including at least one illuminance measurement module and a positioning correction module. The at least one illuminating measurement module emits at least one incident light to a positioning correction sheet, wherein the positioning correction sheet reflects at least one incident ray to generate at least one reflected ray. The positioning correction module is coupled to the at least one illuminating measurement module, and receives at least one reflected light to generate at least one correction pattern for the at least one reflected ray, and measures and analyzes the at least one correction pattern to correct the at least one illuminating amount Measuring the tilt angle deviation and/or the plane misalignment of the module.
本揭露提供一種光學校正裝置，包括一第一發光量測模組、一第二發光量測模組以及一定位校正模組。第一發光量測模組係配置於定位校正片之一第一側，第二發光量測模組係配置於定位校正片之一第二側，其中第二側係不同且相對 於第一側。當第一發光量測模組分別配置於第一高度以及第二高度時，第一發光量測模組分別發出第一入射光線與第二入射光線至定位校正片以分別產生第一校正圖案與第二校正圖案，定位校正模組量測與分析第一校正圖案以及第二校正圖案上之座標位置以校正第一發光量測模組之傾斜角度偏差，並且當第二發光量測模組分別配置於一第三高度以及不同於第三高度之一第四高度時，第二發光量測模組分別發出一第三入射光線與一第四入射光線至定位校正片以分別產生一第三校正圖案與一第四校正圖案，第一發光量測模組停止發出第一入射光線與第二入射光線，定位校正模組量測與分析第三校正圖案以及第四校正圖案上之座標位置以校正第二發光量測模組之傾斜角度偏差。當第一發光量測模組配置於一第五高度時，第一發光量測模組發出一第五入射光線至定位校正片以產生一第五校正圖案，當第二發光量測模組配置於一第六高度時，第二發光量測模組發出一第六入射光線至定位校正片以產生一第六校正圖案，第一發光量測模組停止發出第五入射光線，定位校正模組量測與分析第五校正圖案以及第六校正圖案上之座標位置以校正第一發光量測模組與第二發光量測模組之平面錯位偏差。 The present disclosure provides an optical calibration device including a first illumination measurement module, a second illumination measurement module, and a positioning correction module. The first illuminating measuring module is disposed on one side of the positioning correcting piece, and the second illuminating measuring module is disposed on the second side of the positioning correcting piece, wherein the second side is different and opposite On the first side. When the first illuminance measurement modules are respectively disposed at the first height and the second height, the first illuminance measurement module respectively emits the first incident ray and the second incident ray to the positioning correction sheet to respectively generate the first correction pattern and a second calibration pattern, the positioning correction module measures and analyzes the coordinate positions on the first correction pattern and the second correction pattern to correct the tilt angle deviation of the first illumination measurement module, and when the second illumination measurement module respectively The second illuminating measurement module respectively emits a third incident ray and a fourth incident ray to the positioning correction sheet to generate a third correction respectively. a pattern and a fourth correction pattern, the first illuminance measurement module stops emitting the first incident ray and the second incident ray, and the positioning correction module measures and analyzes the coordinate position on the third correction pattern and the fourth correction pattern to correct The tilt angle deviation of the second illuminating measurement module. When the first illuminating measurement module is disposed at a fifth height, the first illuminating measurement module sends a fifth incident light to the positioning correction piece to generate a fifth correction pattern, and when the second illuminating measurement module is configured At a sixth height, the second illuminating measurement module emits a sixth incident light to the positioning correction sheet to generate a sixth correction pattern, and the first illuminating measurement module stops emitting the fifth incident ray, and the positioning correction module The coordinate positions on the fifth correction pattern and the sixth correction pattern are measured and analyzed to correct the plane misalignment deviation between the first illumination measurement module and the second illumination measurement module.
本揭露提供一種光學校正方法，包括藉由至少一發光量測模組發出至少一入射光線至一定位校正片；藉由定位校正片反射至少一入射光線而產生至少一反射光線；接收至少 一反射光線以產生關於至少一反射光線之至少一校正圖案；以及量測與分析至少一校正圖案以校正至少一發光量測模組之傾斜角度偏差及/或平面錯位偏差。 The present disclosure provides an optical correction method, comprising: transmitting at least one incident light to a positioning correction piece by at least one illumination measurement module; generating at least one reflected light by reflecting the at least one incident light by the positioning correction piece; receiving at least Reflecting light to generate at least one correction pattern for the at least one reflected light; and measuring and analyzing the at least one correction pattern to correct a tilt angle deviation and/or a plane misalignment of the at least one illumination measurement module.
本揭露提供一種光學校正方法，包括當第一發光量測模組分別配置於第一高度以及第二高度時，藉由第一發光量測模組分別發出第一入射光線與第二入射光線至定位校正片以分別產生第一校正圖案與第二校正圖案；藉由定位校正模組量測與分析第一校正圖案以及第二校正圖案上之座標位置，並且校正第一發光量測模組之傾斜角度偏差；當第二發光量測模組分別配置於第三高度以及不同於第三高度之第四高度時，藉由第二發光量測模組分別發出第三入射光線與第四入射光線至定位校正片以分別產生第三校正圖案與第四校正圖案，並且第一發光量測模組停止發出第一入射光線與第二入射光線；藉由定位校正模組量測與分析第三校正圖案以及第四校正圖案上之座標位置以校正第二發光量測模組之傾斜角度偏差；當第一發光量測模組配置於一第五高度時，藉由第一發光量測模組發出一第五入射光線至定位校正片以產生一第五校正圖案；當第二發光量測模組配置於一第六高度時，藉由第二發光量測模組發出第六入射光線至定位校正片以產生第六校正圖案，並且第一發光量測模組停止發出第五入射光線；藉由定位校正模組量測與分析第五校正圖案以及第六校正圖案上之座標位置以校正第一發光量測模組與第二發光量測模組之平面錯位偏 差。 The present disclosure provides an optical correction method, including: when the first illuminance measurement modules are respectively disposed at the first height and the second height, the first illuminating measurement module respectively emits the first incident ray and the second incident ray to Positioning the calibration sheet to respectively generate a first correction pattern and a second correction pattern; measuring and analyzing the coordinate positions on the first correction pattern and the second correction pattern by the positioning correction module, and correcting the first illumination measurement module a tilting angle deviation; when the second illuminating measuring module is respectively disposed at the third height and the fourth height different from the third height, the third illuminating and the fourth incident ray are respectively emitted by the second illuminating measuring module Positioning the calibration sheet to generate a third correction pattern and a fourth correction pattern, respectively, and the first illumination measurement module stops emitting the first incident light and the second incident light; and the third correction is performed by the positioning correction module a pattern and a coordinate position on the fourth correction pattern to correct a tilt angle deviation of the second illumination measurement module; when the first illumination measurement module is disposed at a fifth height, A fifth illumination light is sent from the first illumination measurement module to the positioning correction sheet to generate a fifth correction pattern; and when the second illumination measurement module is disposed at a sixth height, the second illumination quantity is measured by the second illumination quantity. The group emits a sixth incident light to the positioning correction sheet to generate a sixth correction pattern, and the first illumination measurement module stops emitting the fifth incident light; the fifth correction pattern and the sixth correction are measured and analyzed by the positioning correction module. The coordinate position on the pattern is used to correct the plane misalignment of the first illuminance measurement module and the second luminescence measurement module difference.
100‧‧‧光學校正裝置 100‧‧‧Optical correction device
110‧‧‧發光量測模組 110‧‧‧Lighting measurement module
110A‧‧‧第一發光量測模組 110A‧‧‧First illuminance measurement module
110B‧‧‧第二發光量測模組 110B‧‧‧Second luminescence measurement module
120‧‧‧定位校正模組 120‧‧‧Position correction module
122‧‧‧光學元件 122‧‧‧Optical components
122A‧‧‧分光鏡 122A‧‧‧beam splitter
122B‧‧‧三角反射鏡 122B‧‧‧triangular mirror
124‧‧‧感應元件 124‧‧‧Inductive components
126‧‧‧成像元件 126‧‧‧ imaging components
128‧‧‧對焦調整元件 128‧‧‧Focus adjustment components
130‧‧‧支撐元件 130‧‧‧Support components
140‧‧‧定位校正片 140‧‧‧ Positioning correction film
150‧‧‧對焦定位機構 150‧‧‧ Focusing mechanism
A1、A2、B1、B2‧‧‧座標位置 A1, A2, B1, B2‧‧‧ coordinates
第1圖為根據本揭露實施例所提供之光學校正裝置之示意圖；第2A圖為根據本揭露實施例所提供之定位校正模組之示意圖；第2B圖為根據本揭露實施例所提供之另一種光學校正裝置之示意圖；第3A圖為根據本揭露實施例所提供之發光量測模組的傾斜角度偏差之示意圖；第3B圖為根據本揭露實施例所提供之傾斜角度偏差之示意圖；第4A圖為根據本揭露實施例所提供之發光量測模組的平面錯位偏差之示意圖；第4B圖為根據本揭露實施例所提供之平面錯位偏差之示意圖；第4C圖為根據本揭露實施例所提供之另一種發光量測模組的平面錯位偏差之示意圖；第4D圖為根據本揭露實施例所提供之另一種平面錯位偏差之示意圖；第5圖為根據本揭露實施例所提供之光學校正方法之流程 圖；第6圖為根據本揭露實施例所提供之另一種光學校正方法之流程圖。 1 is a schematic diagram of an optical calibration apparatus according to an embodiment of the present disclosure; FIG. 2A is a schematic diagram of a positioning correction module according to an embodiment of the disclosure; FIG. 2B is another diagram according to an embodiment of the present disclosure. A schematic diagram of an optical correction device; FIG. 3A is a schematic diagram of a tilt angle deviation of a luminescence measurement module according to an embodiment of the present disclosure; FIG. 3B is a schematic diagram of a tilt angle deviation according to an embodiment of the present disclosure; 4A is a schematic diagram of a plane misalignment deviation according to an embodiment of the present disclosure; FIG. 4B is a schematic diagram of a plane misalignment deviation according to an embodiment of the disclosure; FIG. 4C is a diagram according to an embodiment of the present disclosure; FIG. 4D is a schematic diagram showing another plane misalignment deviation according to an embodiment of the present disclosure; FIG. 5 is an optical diagram provided according to an embodiment of the present disclosure; Correction method flow Figure 6 is a flow chart of another optical correction method provided in accordance with an embodiment of the present disclosure.
以下將詳細討論本揭露各種實施例之裝置及使用方法。然而值得注意的是，本揭露所提供之許多可行的揭露概念可實施在各種特定範圍中。這些特定實施例僅用於舉例說明本揭露之裝置及使用方法，但非用於限定本揭露之範圍。 The apparatus and method of use of the various embodiments of the present disclosure are discussed in detail below. It should be noted, however, that many of the possible disclosed concepts disclosed in this disclosure can be implemented in various specific scopes. These specific embodiments are only intended to illustrate the apparatus and methods of use of the present disclosure, but are not intended to limit the scope of the disclosure.
第1圖為根據本揭露實施例所提供之光學校正裝置100之示意圖。在一實施例中，光學校正裝置100包括至少一發光量測模組110、一定位校正模組120、以及一對焦定位機構150。詳細而言，發光量測模組110發出至少一入射光線至一定位校正片140(未顯示)，然後定位校正片140反射至少一入射光線而產生至少一反射光線。定位校正模組120耦接發光量測模組110，以及接收至少一反射光線以產生關於該至少一反射光線之至少一校正圖案。此外，定位校正模組120對該至少一校正圖案進行量測與分析，並且校正發光量測模組110之傾斜角度偏差及/或水平位置偏差。值得注意的是，在此實施例中，光學校正裝置100除了具有對焦定位機構150用以移動、對焦以及定位之外，更包括一外加式的定位校正模組120，以取得與分析校正圖案，提升光學校正裝置100之對位的準確性。在另一實施例中，定位校正模組120為可拆卸式，因此方便進行安 裝以及拆卸，提升光學校正裝置100之對位的便利性。 FIG. 1 is a schematic diagram of an optical calibration apparatus 100 provided in accordance with an embodiment of the present disclosure. In one embodiment, the optical calibration device 100 includes at least one illuminance measurement module 110, a locating correction module 120, and a focus positioning mechanism 150. In detail, the illuminating measurement module 110 emits at least one incident light to a positioning correction sheet 140 (not shown), and then the positioning correction sheet 140 reflects at least one incident ray to generate at least one reflected ray. The positioning correction module 120 is coupled to the illuminating measurement module 110 and receives at least one reflected ray to generate at least one correction pattern for the at least one reflected ray. In addition, the positioning correction module 120 measures and analyzes the at least one calibration pattern, and corrects the tilt angle deviation and/or the horizontal position deviation of the luminescence measurement module 110. It should be noted that, in this embodiment, in addition to the focus positioning mechanism 150 for moving, focusing, and positioning, the optical correction device 100 further includes an external positioning correction module 120 for obtaining and analyzing the correction pattern. The accuracy of the alignment of the optical correction device 100 is improved. In another embodiment, the positioning correction module 120 is detachable, thus facilitating the installation. The ease of alignment of the optical alignment device 100 is facilitated by loading and unloading.
在一實施例中，當光學校正裝置100的至少一發光量測模組110配置於一第一高度時，發光量測模組110發出一第一入射光線至定位校正片以產生一第一校正圖案。然後，當發光量測模組110配置於不同於第一高度之第二高度時，發光量測模組110發出一第二入射光線至定位校正片以產生一第二校正圖案。值得注意的是，光學校正裝置100之定位校正模組120量測與分析第一校正圖案以及第二校正圖案上之座標位置，以校正發光量測模組100之傾斜角度偏差。由此可知，藉由上述發光量測模組110以及定位校正模組120，可取得與分析校正圖案，並且即時調整校正光學裝置100的傾斜角度偏差。 In one embodiment, when the at least one illuminating measurement module 110 of the optical calibrating device 100 is disposed at a first height, the illuminating measurement module 110 emits a first incident ray to the positioning aligning sheet to generate a first correction. pattern. Then, when the illuminating measurement module 110 is disposed at a second height different from the first height, the illuminating measurement module 110 emits a second incident light to the positioning correction sheet to generate a second correction pattern. It should be noted that the positioning correction module 120 of the optical calibration device 100 measures and analyzes the coordinate positions on the first correction pattern and the second correction pattern to correct the tilt angle deviation of the luminescence measurement module 100. Therefore, it can be seen that the illumination measurement module 110 and the positioning correction module 120 can acquire and analyze the correction pattern, and adjust the tilt angle deviation of the correction optical device 100 in real time.
第2A圖為根據本揭露實施例所提供之定位校正模組120之示意圖。如第2A圖所示，定位校正模組120包括光學元件122、感應元件124、成像元件126、對焦調整元件128以及支撐元件130。在一實施例中，光學元件122係用以形成至少一入射光線與該至少一反射光線之同軸光路。舉例而言，光學元件122可包括分光鏡、三角反射鏡、及/或其他透鏡或稜鏡等。值得注意的是，上述分光鏡及/或三角反射鏡係搭配光學校正裝置100之各項參數與規格，配置於特定位置，以形成上述入射光線以及反射光線之同軸光路。感應元件124係用以感應與接收至少一反射光線。成像元件126耦接感應元件124，用以形成關於該至少一反射光線之校正圖案。舉例而言，成像元件126 可為一遠心鏡頭，搭配上述入射光線以及反射光線之同軸光路，以形成高品質、低失真的校正圖案。此外，對焦調整元件128耦接感應元件124與成像元件126，並且可移動定位校正模組120以對焦該至少一反射光線。支撐元件130耦接對焦調整元件128，用以固定與支撐定位校正模組120。 FIG. 2A is a schematic diagram of a positioning correction module 120 according to an embodiment of the present disclosure. As shown in FIG. 2A, the positioning correction module 120 includes an optical element 122, an inductive element 124, an imaging element 126, a focus adjustment element 128, and a support element 130. In one embodiment, the optical component 122 is configured to form a coaxial optical path of at least one incident ray and the at least one reflected ray. For example, optical element 122 can include a beam splitter, a triangular mirror, and/or other lenses or cymbals, and the like. It should be noted that the spectroscope and/or the triangular mirror are matched with the parameters and specifications of the optical calibration device 100, and are disposed at specific positions to form the coaxial optical path of the incident light and the reflected light. The sensing element 124 is configured to sense and receive at least one reflected light. The imaging element 126 is coupled to the sensing element 124 for forming a correction pattern with respect to the at least one reflected light. For example, imaging element 126 It can be a telecentric lens with the above-mentioned incident light and coaxial light path of reflected light to form a high quality, low distortion correction pattern. In addition, the focus adjustment component 128 is coupled to the sensing component 124 and the imaging component 126, and the positioning correction module 120 is movable to focus the at least one reflected light. The support component 130 is coupled to the focus adjustment component 128 for fixing and supporting the positioning correction module 120.
第2B圖為根據本揭露實施例所提供之另一種光學校正裝置100之示意圖。在此實施例中，光學校正裝置100包括第一發光量測模組110A、第二發光量測模組110B、光學元件122、感應元件124、成像元件126、支撐元件130、以及定位校正片140。光學元件122包括分光鏡122A以及三角反射鏡122B。如第2B圖所示，第一發光量測模組110A係配置於定位校正片140之第一側，第二發光量測模組110B係配置於定位校正片140之第二側，其中第二側係不同且相對於第一側。舉例而言，第一發光量測模組110A係配置於定位校正片140的上面，第二發光量測模組110B係配置於定位校正片140的下面。此外，值得注意的是，定位校正片140係由一透明材質所構成。舉例而言，定位校正片140係由玻璃或塑膠所構成。 FIG. 2B is a schematic diagram of another optical correction device 100 provided in accordance with an embodiment of the present disclosure. In this embodiment, the optical calibration device 100 includes a first illumination measurement module 110A, a second illumination measurement module 110B, an optical component 122, an inductive component 124, an imaging component 126, a support component 130, and a positioning correction patch 140. . The optical element 122 includes a beam splitter 122A and a triangular mirror 122B. As shown in FIG. 2B, the first illuminating measurement module 110A is disposed on the first side of the positioning correction sheet 140, and the second illuminating measurement module 110B is disposed on the second side of the positioning correction sheet 140, wherein the second The side systems are different and relative to the first side. For example, the first illuminance measurement module 110A is disposed on the top of the positioning correction sheet 140 , and the second luminescence measurement module 110B is disposed under the positioning correction sheet 140 . In addition, it is worth noting that the positioning correction sheet 140 is composed of a transparent material. For example, the positioning correction sheet 140 is made of glass or plastic.
在一實施例中，當第一發光量測模組110A分別配置於第一高度以及第二高度時，第一發光量測模組110A分別發出第一入射光線與第二入射光線至定位校正片140，並且分別產生第一校正圖案與第二校正圖案。然後，定位校正模組120量測與分析第一校正圖案以及第二校正圖案上之座標位置，以 及校正第一發光量測模組110A之傾斜角度偏差。此外，當第二發光量測模組110B分別配置於一第三高度以及不同於第三高度之一第四高度時，第二發光量測模組110B分別發出一第三入射光線與一第四入射光線至定位校正片140，並且分別產生一第三校正圖案與一第四校正圖案。值得注意的是，當第二發光量測模組110B發出第三入射光線與第四入射光線至定位校正片140時，第一發光量測模組110A停止發出第一入射光線與第二入射光線，以避免對第二發光量測模組110B所發出之第三入射光線與第四入射光線造成干擾。然後，定位校正模組120量測與分析第三校正圖案以及第四校正圖案上之座標位置，並且校正第二發光量測模組110B之傾斜角度偏差。 In one embodiment, when the first illuminance measurement modules 110A are respectively disposed at the first height and the second height, the first illuminance measurement module 110A respectively emits the first incident ray and the second incident ray to the positioning correction slice. 140, and generating a first correction pattern and a second correction pattern, respectively. Then, the positioning correction module 120 measures and analyzes the coordinate positions on the first correction pattern and the second correction pattern to And correcting the tilt angle deviation of the first illuminance measuring module 110A. In addition, when the second illuminating measurement module 110B is respectively disposed at a third height and a fourth height different from the third height, the second illuminating measurement module 110B respectively emits a third incident ray and a fourth The incident light is incident on the positioning correction sheet 140, and a third correction pattern and a fourth correction pattern are respectively generated. It should be noted that when the second illuminating measurement module 110B emits the third incident ray and the fourth incident ray to the positioning correction sheet 140, the first illuminating measurement module 110A stops emitting the first incident ray and the second incident ray. In order to avoid interference with the third incident light and the fourth incident light emitted by the second illuminating measurement module 110B. Then, the positioning correction module 120 measures and analyzes the coordinate positions on the third correction pattern and the fourth correction pattern, and corrects the inclination angle deviation of the second illumination measurement module 110B.
詳細而言，當第一發光量測模組110A發出第一入射光線時，第一入射光線會先經過分光鏡122A而進行分光。然後，一部分的第一入射光線到達定位校正片140，然後被定位校正片140反射而成為第一反射光線。然後，第一反射光線到達分光鏡122A而進行分光，使得一部分的第一反射光線被三角反射鏡122B反射而到達感應元件124與成像元件126。值得注意的是，上述第一入射光線以及第一反射光線係沿著一同軸光路。此外，其他入射光線與其他反射光線也是沿著此同軸光路而進行反射或透射，故此處不再贅述。 In detail, when the first illuminating measurement module 110A emits the first incident ray, the first incident ray is first split by the beam splitter 122A. Then, a portion of the first incident light reaches the positioning correction sheet 140, and is then reflected by the positioning correction sheet 140 to become the first reflected light. Then, the first reflected light reaches the beam splitter 122A to be split, so that a portion of the first reflected light is reflected by the triangular mirror 122B to reach the sensing element 124 and the imaging element 126. It should be noted that the first incident light and the first reflected light are along a coaxial optical path. In addition, other incident light rays and other reflected light rays are also reflected or transmitted along the coaxial optical path, and thus will not be described herein.
第3A圖為根據本揭露實施例所提供之發光量測模組110的傾斜角度偏差之示意圖，第3B圖為根據本揭露實施例 所提供之傾斜角度偏差之示意圖。如第3A圖所示，第一發光量測模組110A配置於定位校正片140的上方。然而，第一發光量測模組110A具有一傾斜角度，並非垂直於定位校正片140。當第一發光量測模組110A配置於第一高度以及發出第一入射光線時，定位校正模組120量測到第一圖案，並且第一圖案之座標位置A1為(x1-1,y1-1)。當第一發光量測模組110A配置於不同於第一高度之第二高度以及發出第二入射光線時，定位校正模組120量測到第二圖案，並且第二圖案之座標位置A2為(x1-2,y1-2)。如第3B圖所示，在一實施例中，座標位置A1與A2的橫向偏移(亦即x方向)為△x，座標位置A1與A2的縱向偏移(亦即y方向)為△y，並且第一高度與第二高度之間的差距為△h。第一發光量測模組110A之傾斜角度偏差(θx,θy)為：θx=tan-1(△h/△x)=tan-1(△h/x 1-2-x1-1) θy=tan-1(△h/△y)=tan-1(△h/y 1-2-y 1-1) FIG. 3A is a schematic diagram of the tilt angle deviation of the illuminance measurement module 110 according to the embodiment of the disclosure, and FIG. 3B is a schematic diagram of the tilt angle deviation according to the embodiment of the disclosure. As shown in FIG. 3A, the first illuminance measurement module 110A is disposed above the positioning correction sheet 140. However, the first illuminating measurement module 110A has an oblique angle, which is not perpendicular to the positioning correction sheet 140. When the first illuminating measurement module 110A is disposed at the first height and emits the first incident ray, the positioning correction module 120 measures the first pattern, and the coordinate position A1 of the first pattern is (x 1-1 , y 1-1 ). When the first illuminance measurement module 110A is disposed at a second height different from the first height and emits the second incident ray, the positioning correction module 120 measures the second pattern, and the coordinate position A2 of the second pattern is ( x 1-2 , y 1-2 ). As shown in FIG. 3B, in one embodiment, the lateral offset (ie, the x direction) of the coordinate positions A1 and A2 is Δx, and the longitudinal offset (ie, the y direction) of the coordinate positions A1 and A2 is Δy. And the difference between the first height and the second height is Δh. The tilt angle deviation ( θ x, θ y) of the first illuminance measuring module 110A is: θx = tan -1 (Δ h / Δ x ) = tan -1 (Δ h / x 1-2 - x 1-1 Θy=tan -1 (Δ h /Δ y )=tan -1 (Δ h / y 1-2 - y 1-1 )
其中θx與θy分別是第一發光量測模組110A在x方向與y方向的傾斜角度。如此一來，光學校正裝置100就可以藉由校正圖案計算出第一發光量測模組110A是否具有傾斜角度偏差。當θx或θy不等於零的時候，就表示第一發光量測模組110A具有傾斜角度偏差，並且定位校正模組120與對焦定位機構150可進一步依據θx或θy之數值來調整第一發光量測模組110A的傾斜角度偏差。 Where θ x and θ y are the inclination angles of the first illuminance measurement module 110A in the x direction and the y direction, respectively. In this way, the optical calibration device 100 can calculate whether the first illuminance measurement module 110A has a tilt angle deviation by using the correction pattern. When θ x or θ y is not equal to zero, it means that the first illuminating measurement module 110A has a tilt angle deviation, and the positioning correction module 120 and the focus positioning mechanism 150 can further adjust according to the value of θ x or θ y . The tilt angle deviation of a luminescence measurement module 110A.
第4A圖為根據本揭露實施例所提供之發光量測模 組110的平面錯位偏差之示意圖；第4B圖為根據本揭露實施例所提供之平面錯位偏差之示意圖。在一實施例中，當第一發光量測模組110A配置於一第五高度時，第一發光量測模組110A發出一第五入射光線至定位校正片140，並且產生一第五校正圖案，並且第五圖案之座標位置B1為(x1,y1)。當第二發光量測模組110B配置於一第六高度時，第二發光量測模組110B發出一第六入射光線至定位校正片140，並且產生一第六校正圖案，並且第六圖案之座標位置B2為(x2,y2)。值得注意的是，當第二發光量測模組110B發出第六入射光線至定位校正片140時，第一發光量測模組停止發出第五入射光線，以避免對第二發光量測模組110B所發出之第六入射光線造成干擾。然後，定位校正模組120量測與分析第五校正圖案以及第六校正圖案上之座標位置B1與B2，並且校正第一發光量測模組110A與第二發光量測模組110B之平面錯位偏差。 4A is a schematic diagram of a plane misalignment deviation of the illuminance measurement module 110 according to an embodiment of the present disclosure; FIG. 4B is a schematic diagram of a plane misalignment deviation according to an embodiment of the disclosure. In one embodiment, when the first illuminance measurement module 110A is disposed at a fifth height, the first illuminance measurement module 110A emits a fifth incident ray to the positioning correction sheet 140, and generates a fifth correction pattern. And the coordinate position B1 of the fifth pattern is (x 1 , y 1 ). When the second illuminance measurement module 110B is disposed at a sixth height, the second illuminance measurement module 110B emits a sixth incident ray to the positioning correction sheet 140, and generates a sixth correction pattern, and the sixth pattern The coordinate position B2 is (x 2 , y 2 ). It should be noted that when the second illuminating measurement module 110B emits the sixth incident light to the positioning correction sheet 140, the first illuminating measurement module stops emitting the fifth incident ray to avoid the second illuminating measurement module. The sixth incident light emitted by 110B causes interference. Then, the positioning correction module 120 measures and analyzes the coordinate positions B1 and B2 on the fifth correction pattern and the sixth correction pattern, and corrects the plane misalignment between the first illumination measurement module 110A and the second illumination measurement module 110B. deviation.
如第4A圖以及第4B圖所示，由於第一發光量測模組110A與第二發光量測模組110B具有平面錯位偏差，因此第五校正圖案以及第六校正圖案之座標位置B1與B2並未重疊在一起。然後，定位校正模組120與對焦定位機構150可進一步調整第一發光量測模組110A的平面錯位偏差，以提升光學校正裝置100的量測精確性。在另一實施例中，第4C圖為根據本揭露實施例所提供之另一種發光量測模組110的平面錯位偏差之示意圖；第4D圖為根據本揭露實施例所提供之另一種平面錯位偏差 之示意圖。第五校正圖案以及第六校正圖案之座標位置B1與B2重疊在一起，因此第一發光量測模組110A與第二發光量測模組110B沒有平面錯位偏差。相較於只單純透過雙軸移動平台來移動與校正，本揭露所提供之定位校正模組120可搭配對焦定位機構150一起使用，分析第一發光量測模組110A與第二發光量測模組110B是否具有傾斜角度偏差以及平面錯位偏差。值得注意的是，由於本揭露是分析校正圖案以及其座標位置，因此能夠及時且動態地分析傾斜角度偏差以及平面錯位偏差，改善量測模組之對位的準確性與便利性。 As shown in FIG. 4A and FIG. 4B , since the first illuminance measurement module 110A and the second illuminance measurement module 110B have a plane misalignment deviation, the coordinate positions B1 and B2 of the fifth correction pattern and the sixth correction pattern are Not overlapping. Then, the positioning correction module 120 and the focus positioning mechanism 150 can further adjust the plane misalignment deviation of the first illumination measurement module 110A to improve the measurement accuracy of the optical calibration apparatus 100. In another embodiment, FIG. 4C is a schematic diagram of a plane misalignment deviation of another luminescence measurement module 110 according to an embodiment of the disclosure; FIG. 4D is another plane dislocation provided according to the embodiment of the disclosure. deviation Schematic diagram. The coordinate positions B1 and B2 of the fifth correction pattern and the sixth correction pattern are overlapped, so that the first illumination measurement module 110A and the second illumination measurement module 110B have no plane misalignment deviation. The positioning correction module 120 provided by the present disclosure can be used together with the focus positioning mechanism 150 to analyze the first illuminance measurement module 110A and the second illuminance measurement module. Whether the group 110B has a tilt angle deviation and a plane misalignment deviation. It is worth noting that since the present disclosure analyzes the correction pattern and its coordinate position, it can timely and dynamically analyze the tilt angle deviation and the plane misalignment deviation, and improve the accuracy and convenience of the alignment of the measurement module.
第5圖為根據本揭露實施例所提供之光學校正方法之流程圖。在步驟S500中，藉由至少一發光量測模組110發出至少一入射光線至一定位校正片140。然後在步驟S502中，藉由定位校正片140反射至少一入射光線而產生至少一反射光線。然後在步驟S504中，接收至少一反射光線以產生關於至少一反射光線之至少一校正圖案。然後在步驟S506中，量測與分析至少一校正圖案以校正至少一發光量測模組110之傾斜角度偏差及/或水平位置偏差。 FIG. 5 is a flow chart of an optical correction method provided in accordance with an embodiment of the present disclosure. In step S500, at least one incident light is emitted by at least one illuminating measurement module 110 to a positioning correction sheet 140. Then, in step S502, at least one reflected light is generated by the positioning correction sheet 140 reflecting at least one incident light. Then in step S504, at least one reflected light is received to generate at least one correction pattern for the at least one reflected light. Then, in step S506, at least one correction pattern is measured and analyzed to correct the tilt angle deviation and/or the horizontal position deviation of the at least one luminescence measurement module 110.
第6圖為根據本揭露實施例所提供之另一種光學校正方法之流程圖。在步驟S600中，當第一發光量測模組110A分別配置於第一高度以及第二高度時，藉由第一發光量測模組110A分別發出第一入射光線與第二入射光線至定位校正片140以分別產生第一校正圖案與第二校正圖案。然後在步驟S602 中，藉由定位校正模組120量測與分析第一校正圖案以及第二校正圖案上之座標位置，並且校正第一發光量測模組110A之傾斜角度偏差。然後在步驟S604中，當第二發光量測模組110B分別配置於第三高度以及不同於第三高度之第四高度時，藉由第二發光量測模組110B分別發出第三入射光線與第四入射光線至定位校正片140以分別產生第三校正圖案與第四校正圖案，並且第一發光量測模組110A停止發出第一入射光線與第二入射光線。在步驟S606中，藉由定位校正模組120量測與分析第三校正圖案以及第四校正圖案上之座標位置以校正第二發光量測模組110B之傾斜角度偏差。然後在步驟S608中，當第一發光量測模組110A配置於一第五高度時，藉由第一發光量測模組110A發出一第五入射光線至定位校正片140以產生一第五校正圖案。然後在步驟S610中，當第二發光量測模組110B配置於一第六高度時，藉由第二發光量測模組110B發出第六入射光線至定位校正片以產生第六校正圖案，並且第一發光量測模組110A停止發出第五入射光線。最後在步驟S612中，藉由定位校正模組120量測與分析第五校正圖案以及第六校正圖案上之座標位置以校正第一發光量測模組110A與第二發光量測模組110B之平面錯位偏差。 Figure 6 is a flow chart of another optical correction method provided in accordance with an embodiment of the present disclosure. In step S600, when the first illuminance measurement module 110A is respectively disposed at the first height and the second height, the first illuminance measurement module 110A respectively emits the first incident ray and the second incident ray to the positioning correction. The sheet 140 is to produce a first correction pattern and a second correction pattern, respectively. Then at step S602 The positioning correction module 120 measures and analyzes the coordinate positions on the first correction pattern and the second correction pattern, and corrects the tilt angle deviation of the first illumination measurement module 110A. Then, in step S604, when the second illuminance measurement module 110B is respectively disposed at the third height and the fourth height different from the third height, the second illuminating measurement module 110B respectively emits the third incident ray and The fourth incident light is incident on the positioning correction sheet 140 to respectively generate the third correction pattern and the fourth correction pattern, and the first illumination measurement module 110A stops emitting the first incident light and the second incident light. In step S606, the positioning correction module 120 measures and analyzes the coordinate positions on the third correction pattern and the fourth correction pattern to correct the tilt angle deviation of the second illumination measurement module 110B. Then, in step S608, when the first illuminance measurement module 110A is disposed at a fifth height, the first illuminating measurement module 110A sends a fifth incident ray to the positioning correction sheet 140 to generate a fifth correction. pattern. Then, in step S610, when the second illuminance measurement module 110B is disposed at a sixth height, the second illuminating measurement module 110B issues a sixth incident ray to the positioning correction sheet to generate a sixth correction pattern, and The first illuminance measuring module 110A stops emitting the fifth incident ray. Finally, in step S612, the positioning correction module 120 measures and analyzes the coordinate positions on the fifth correction pattern and the sixth correction pattern to correct the first illumination measurement module 110A and the second illumination measurement module 110B. Plane misalignment.
惟以上所述者，僅為本揭露之較佳實施例而已，當不能以此限定本揭露實施之範圍，即大凡依本揭露申請專利範圍及揭露說明內容所作之簡單的等效變化與修飾，皆仍屬本 揭露專利涵蓋之範圍內。另外，本揭露的任一實施例或申請專利範圍不須達成本揭露所揭露之全部目的或優點或特點。此外，摘要部分和標題僅是用來輔助專利文件搜尋之用，並非用來限制本揭露之權利範圍。 The above is only the preferred embodiment of the present disclosure, and the scope of the disclosure is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the disclosure and the disclosure of the disclosure are Still belong to this Cover the scope of the patent coverage. In addition, any of the embodiments or advantages of the present disclosure are not required to achieve all of the objects or advantages or features disclosed in the present disclosure. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the disclosure.
100‧‧‧光學校正裝置 100‧‧‧Optical correction device
110A‧‧‧第一發光量測模組 110A‧‧‧First illuminance measurement module
110B‧‧‧第二發光量測模組 110B‧‧‧Second luminescence measurement module
122‧‧‧光學元件 122‧‧‧Optical components
122A‧‧‧分光鏡 122A‧‧‧beam splitter
122B‧‧‧三角反射鏡 122B‧‧‧triangular mirror
124‧‧‧感應元件 124‧‧‧Inductive components
126‧‧‧成像元件 126‧‧‧ imaging components
130‧‧‧支撐元件 130‧‧‧Support components
140‧‧‧定位校正片 140‧‧‧ Positioning correction film
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