TW201616135A - Method of reducing tip size of probe and stage - Google Patents

Abstract

A method of reducing a tip size of a probe including following steps is provided. A probe is fixed on the stage. A tilt angle ion cutting process is respectively performed to the probe on locations at a plurality of rotation angles of the stage in a manner that the ion beam is tilted at an angle relative to the probe to make a tip of the probe to be pyramidal.

Description

Method for reducing the tip size of a probe and a stage

The present invention relates to a method and a stage for adjusting a probe, and more particularly to a method and a stage for reducing the size of a tip of a probe.

In the field of semiconductor technology, integrated circuit chips must be electrically tested with a probe using a probe. In the case of a conventional probe, the probe must have good electrical continuity with the wafer contacts. However, under the current trend of thinning and thinning of various consumer electronic devices, and in order to cut more wafers on the same wafer unit area to reduce production costs, the area of the wafer needs to be continuously reduced, so that the inside of the wafer The component density is also getting higher and higher, so the size and spacing of the contacts on the integrated circuit wafer are getting smaller and smaller. The trend toward miniaturization of the wafer has made the probe size ever smaller, ensuring that the final point of contact between the tip of the probe and the surface of the test piece falls at the tip of the needle during operation.

The present invention provides a method of reducing the tip size of a probe that effectively reduces the tip size of the probe.

The present invention provides a stage that can stably fix a probe and facilitates an operation of reducing the tip size of the probe.

The present invention provides a method of reducing the tip size of a probe, comprising the following steps. Secure the probe to the stage. At a plurality of rotation angles of the stage, the probe is subjected to a tilt angle ion cutting process in such a manner that the ion beam is inclined to the probe, so that the tip of the probe has a pyramid shape.

According to an embodiment of the present invention, in the method for reducing the tip size of the probe, before the tilting angle ion cutting process, the method further includes: the needle tip is opposite to the ion beam by having different inner diameters. The ion beam of the plurality of annular cutting patterns performs a forward ion cutting process on the probe.

According to an embodiment of the invention, in the above method for reducing the tip size of the probe, the apparatus for emitting the ion beam is, for example, a dual beam type focused ion beam microscope or a single beam type focused ion beam microscope.

According to an embodiment of the invention, in the method for reducing the tip size of the probe, after the tilting angle ion cutting process is performed on the probe, it is further included whether the size of the measuring tip conforms to the specification.

According to an embodiment of the invention, in the method for reducing the size of the tip of the probe, when the size of the tip does not conform to the specification, the position of the plurality of rotation angles of the stage is further included. The needle performs a tilt angle ion cutting process.

According to an embodiment of the present invention, in the above method of reducing the tip size of the probe, the apparatus for measuring whether the size of the tip conforms to the specification is, for example, a scanning electron microscope.

In accordance with an embodiment of the present invention, in the method of reducing the tip size of the probe, the stage includes a base, a carrier, and a detachable spacer. The carrier is attached to the surface of the base and has at least one groove, wherein the groove extends in a direction perpendicular to the surface of the base, and the groove is for receiving the probe. A detachable gasket spans the groove and is secured to the carrier to secure the probe to the carrier.

In accordance with an embodiment of the present invention, in the method of reducing the tip size of the probe, the carrier further includes a fixing member for fixing the detachable spacer to the carrier.

The invention provides a stage suitable for carrying at least one probe and comprising a base, a carrier plate and a detachable gasket. The carrier is attached to the surface of the base and has at least one groove, wherein the groove extends in a direction perpendicular to the surface of the base, and the groove is for receiving the probe. A detachable gasket spans the groove and is secured to the carrier to secure the probe to the carrier.

According to an embodiment of the invention, in the above-mentioned stage, a fixing member is further included for fixing the detachable spacer on the carrier.

Based on the above, in the method for reducing the tip size of the probe proposed by the present invention, the probe is subjected to the oblique angle ion cutting process at a plurality of rotation angle positions of the stage, and the ion beam is cut. The angle formed by the pattern sharpens the tip of the probe, thus effectively reducing the tip size of the probe.

In addition, with the loading platform proposed by the present invention, the probe can be stably fixed by the groove and the detachable gasket, and the probe can be stood on the base to facilitate the operation of reducing the tip size of the probe. .

The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧stage

102‧‧‧Base

104‧‧‧ Carrier Board

106‧‧‧Removable gasket

108‧‧‧floor

110‧‧‧ Connecting rod

112‧‧‧ trench

114‧‧‧Fixed parts

200‧‧‧ probe

202‧‧‧Needle

300‧‧‧Focused ion beam emitter

302, 304‧‧‧ ion beam

302a~302g‧‧‧Circular cutting pattern

304a, 304b‧‧‧ cutting pattern

400‧‧‧Scanning electron microscope

S100, S102, S104, S106,

S108, S110, S112‧‧‧ steps

1 is an exploded view of a stage according to an embodiment of the present invention.

Figure 2 is a combination view of the stage of Figure 1.

3 is a flow chart of reducing the tip size of a probe according to an embodiment of the present invention.

4 is a schematic view showing the relative positions of a probe-mounted stage, a focused ion beam emitter, and a scanning electron microscope according to an embodiment of the present invention.

5 is a schematic view showing another relative position of a probe-mounted stage, a focused ion beam emitter, and a scanning electron microscope according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of a forward ion cutting process of a probe according to an embodiment of the invention.

Figure 7 is a schematic illustration of a probe after a forward ion cutting process in accordance with an embodiment of the present invention.

FIG. 8 is a schematic diagram of a tilt angle ion cutting process for a probe according to an embodiment of the present invention.

Figure 9 is a schematic illustration of a probe after performing a tilt angle ion cutting process in accordance with an embodiment of the present invention.

Figure 10 is a top view of the needle tip of Figure 9.

1 is an exploded view of a stage according to an embodiment of the present invention. Figure 2 is a combination view of the stage of Figure 1.

Referring to FIG. 1 and FIG. 2 simultaneously, the stage 100 is adapted to carry at least one probe 200. The stage 100 includes a base 102, a carrier 104, and a detachable spacer 106.

The base 102 includes a bottom plate 108 and a connecting rod 110. The material of the bottom plate 108 is, for example, aluminum. One end of the link 110 is coupled to the bottom surface of the bottom plate 108. The other end of the link 110 can be coupled to a drive (not shown) to move or rotate the stage 100 by the drive. The material of the connecting rod 110 is, for example, aluminum. The connection of the link 110 to the bottom plate 108 is, for example, integrally formed or welded.

The carrier 104 is coupled to the surface of the base 102 and has at least one trench 112, wherein the trench 112 extends perpendicular to the surface of the base 102, and the trench 112 is used to receive the probe 200. The material of the carrier 104 is, for example, aluminum. The manner in which the carrier 104 is coupled to the base 102 is, for example, integrally formed or welded. The depth of the trench 112 is, for example, smaller than the probe diameter at which the probe 200 is secured with the detachable spacer 106 such that a portion of the probe 200 can be received in the trench 112. In this embodiment, although the number of the grooves 112 is described by taking three examples, the present invention is not limited thereto, and those skilled in the art can adjust the number of the grooves 112 according to the process design requirements. Furthermore, the number of probes 200 that can be carried by the stage 100 is determined by the number of grooves 112.

A detachable spacer 106 spans the trench 112 and is secured to the carrier 104 to secure the probe 200 to the carrier 104. The material of the detachable gasket 106 is, for example, a guide Body material, such as aluminum.

In addition, the stage 100 may further include a fixing member 114 for fixing the detachable spacer 106 to the carrier 104. The fixing member 114 is, for example, a screw.

Based on the above embodiment, the stage 100 can stably hold the probe 200 by accommodating the probe 200 in the groove 112 and covering the probe 200 with the detachable spacer 106.

In addition, since the extending direction of the groove 112 is perpendicular to the surface of the base 102, the probe can be stood on the base 102, which facilitates the operation of reducing the tip size of the probe 200.

3 is a flow chart of reducing the tip size of a probe according to an embodiment of the present invention. 4 is a schematic view showing the relative positions of a probe-mounted stage, a focused ion beam emitter, and a scanning electron microscope according to an embodiment of the present invention. 5 is a schematic view showing another relative position of a probe-mounted stage, a focused ion beam emitter, and a scanning electron microscope according to an embodiment of the present invention. FIG. 6 is a schematic diagram of a forward ion cutting process of a probe according to an embodiment of the invention. Figure 7 is a schematic illustration of a probe after a forward ion cutting process in accordance with an embodiment of the present invention. FIG. 8 is a schematic diagram of a tilt angle ion cutting process for a probe according to an embodiment of the present invention. Figure 9 is a schematic illustration of a probe after performing a tilt angle ion cutting process in accordance with an embodiment of the present invention. Figure 10 is a top view of the needle tip of Figure 9.

First, referring to FIG. 3 and FIG. 4, step S100 is performed to fix the probe 200 to the stage 100. For the structure of the stage 100 and the manner in which the probe 200 is fixed on the stage 100, reference may be made to the description of FIG. 2, and details are not described herein again.

Next, referring to FIG. 3, FIG. 4, FIG. 6, and FIG. 7, step S102 can be selectively performed, in which the needle tip 202 faces the ion beam 302 by the annular cutting patterns 302a-302g having different inner diameters. The ion beam 302 performs a forward ion cutting process on the probe 200. Wherein, the tip 202 of the probe 200 can be directed against the ion beam 302 by moving the position of the stage 100. The current intensity of the ion beam 302 is, for example, 9800 pA to 21000 pA. The stage that emits the ion beam 302 is, for example, a dual beam type focused ion beam microscope or a single beam type focused ion beam microscope with a focused ion beam emitter 300. In the present embodiment, the machine that emits the ion beam 302 is exemplified by a dual beam type focused ion beam microscope including a focused ion beam emitter 300 (ion beam) and a scanning electron microscope 400 (electron beam). However, the invention is not limited thereto.

The annular cutting patterns 302a-302g of the ion beam 302 emitted by the focused ion beam emitter 300 are schematic cross-sectional patterns perpendicular to the direction of travel of the ion beam 302. Among the annular cutting patterns 302a to 302g, the annular cutting pattern 302a has the smallest inner diameter and the largest cutting range. The annular cutting pattern 302g has the largest inner diameter and the smallest cutting range. Therefore, by performing the forward ion cutting process on the probe 200 by the ion beam 302 having the annular cutting patterns 302a to 302g in sequence, the probe 200 can be roughly cut to reduce the size of the tip 202 of the probe 200 in advance. Further, the shape of the needle tip 202 after the step S102 is, for example, approximately conical (as shown in FIG. 7).

Then, referring to FIG. 3, FIG. 5, and FIG. 8 to FIG. 10, step S104 is performed, and at the position of the plurality of rotation angles of the stage 100, the probe 200 is tilted so that the ion beam 304 is inclined to the probe 200. Perform a tilt angle ion cutting process to make a probe The needle tip 202 of the needle 200 has a pyramid shape. The ion beam 304 emitted by the focused ion beam emitter 300 can be tilted to the probe 200 by moving the position of the stage 100. The current intensity of the ion beam 304 is, for example, 28 pA to 2800 pA.

In this embodiment, the tip 202 of the probe 200 after the tilting angle ion cutting process is set to a "positive" hexagonal pyramid shape (as shown in FIG. 10), and ions are used at each position of the rotation angle. The angle formed by the two cutting patterns 304a, 304b of the beam 304 is described by taking the tip of the probe 200 of the probe 200 as an example. Therefore, the tilting angle ion cutting process of the probe 200 must be performed on the three equal angles of 180 degrees. . That is, at each position of the rotation angle, the two faces of the "positive" hexagonal cone can be cut on the needle tip 202, so that the probe 200 is placed at a position of a rotation angle of 0 degrees, 60 degrees, and 120 degrees. By performing the oblique angle ion cutting process, a "positive" hexagonal tapered tip 202 can be obtained.

In another embodiment, if the tip 202 is only formed into a hexagonal cone shape instead of a "positive" hexagonal cone shape, and only needs to have two cutting patterns 304a, 304b at a position of a rotation angle of 0 degrees. After the ion beam 304 performs the oblique angle ion cutting process on the probe 200, the stage 100 is rotated twice, and the probe 200 is tilted by the ion beam 304 having the two cutting patterns 304a, 304b, respectively, after each rotation. The hexagonal cone-shaped tip 202 is obtained by the angular ion cutting process.

For example, in this embodiment, step S104 may include steps S106, S108, S110. First, in step S106, the tilting angle ion cutting process is performed on the probe 200 at a position of 0 degrees of the stage 100, and the angle formed by the two cutting patterns 304a, 304b of the ion beam 304 is used to probe the probe 200. The tip 202 is sharpened. also That is, by performing the forward ion cutting process on the probe 200 by the ion beam 304 having the cutting patterns 304a and 304b in sequence, the two faces of the "positive" hexagonal cone can be cut on the needle tip 202.

Next, in step S108, the stage 100 is rotated at a position of 60 degrees in the rotation direction 116, and the rotated probe 200 is subjected to a tilt angle ion cutting process by the two cutting patterns 304a of the ion beam 304, The angle formed by 304b sharpens the tip 202 of the probe 200. That is, by performing the forward ion cutting process on the probe 200 with the ion beam 304 having the cutting patterns 304a, 304b in sequence, the other two faces of the "positive" hexagonal cone can be cut on the tip 202.

Then, in step S110, the stage 100 is rotated to a position of 120 degrees in the rotation direction 116, and the rotated probe 200 is subjected to a tilt angle ion cutting process by the two cutting patterns 304a of the ion beam 304, The angle formed by 304b sharpens the tip 202 of the probe 200. That is, by performing a forward ion cutting process on the probe 200 with the ion beam 304 having the cutting patterns 304a, 304b in sequence, the last two faces of the "positive" hexagonal cone can be cut on the tip 202, thereby making the probe The tip 202 of the 200 has a "positive" hexagonal taper shape.

In the above embodiment, although the oblique angle ion cutting process is performed at the position of each rotation angle by the ion beam 304 having the two cutting patterns 304a, 304b, the present invention is not limited thereto. In another embodiment, the ion beam may be cut in a single pattern at each rotation angle (eg, 0 degrees, 60 degrees, 120 degrees, 180 degrees, 240 degrees, 300 degrees) (not shown) ) to perform a tilt angle ion cutting process, formed by a cutting pattern of an ion beam at a position of a rotation angle The angle of the tip of the probe 200 is sharpened by the included angle, and the number of rotations of the stage 100 is increased.

Next, referring to FIG. 3, FIG. 5, and FIG. 10, step S112 is performed to measure whether the size of the needle tip 202 conforms to the specifications. If YES, the operation of reducing the tip size of the probe is ended. If "No", the process proceeds to step S104. A device that measures the size of the tip 202 to conform to specifications is, for example, a scanning electron microscope 400.

In the above embodiment, the rough cutting of the probe 200 in the step S102 will be described as an example. However, in another embodiment, the probe 200 may be rough-cut by a tilting angle ion cutting process with a larger current intensity (eg, 450 pA to 2800 pA) in step S104, and then by a smaller The tilting angle ion cutting process of current intensity (eg, 28 pA to 280 pA) is used to finely cut the probe 200.

In addition, although the above embodiment is described by taking one probe 200 as an example, the present invention is not limited thereto. In another embodiment, the plurality of probes 200 can also be operated to reduce the tip size of the probe by means of automatic control.

In addition, although the tip 202 of the above embodiment is described by taking a "positive" hexagonal cone as an example, the present invention is not limited thereto, and the needle tip 202 is formed into a pyramid shape by the technical concept of the above method. The scope of protection.

Based on the above embodiment, it can be seen that by performing the oblique angle ion cutting process on the probes 200 at a plurality of rotation angles of the stage 100, the angle formed by the ion beam cutting patterns 304a, 304b will be The tip 202 of the probe 200 is sharpened, so that the tip size of the probe can be effectively reduced (e.g., below 20 nm), and the microprobe can be obtained in a low cost manner.

In summary, the above embodiment has at least the following features. The method of reducing the tip size of the probe of the above embodiment can effectively reduce the tip size of the probe, and the microprobe can be obtained in a low cost manner. Further, the stage proposed in the above embodiment can stably fix the probe and facilitate the operation of reducing the tip size of the probe.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

S100, S102, S104, S106, S108, S110, S112‧‧‧ steps

Claims (10)

A method of reducing the size of a tip of a probe, comprising: fixing a probe on a stage; and at a position of a plurality of rotation angles of the stage, an ion beam is inclined to the probe, The probe performs an oblique angle ion cutting process, so that a tip of the probe has a pyramid shape. The method for narrowing the tip size of the probe according to the first aspect of the invention, wherein before the performing the oblique angle ion cutting process, the method further comprises: facing the ion beam by the tip of the probe, by having different inner diameters The ion beam of the plurality of annular cutting patterns performs a forward ion cutting process on the probe. The method of reducing the tip size of a probe according to the first or second aspect of the invention, wherein the apparatus for emitting the ion beam comprises a dual beam type focused ion beam microscope or a single beam type focused ion beam microscope. The method for reducing the tip size of the probe according to the first aspect of the invention, wherein after the tilting angle ion cutting process is performed on the probe, the method further comprises measuring whether the size of the tip meets a specification. The method for reducing the tip size of a probe according to claim 4, wherein when the size of the tip does not conform to the specification, the position of the rotation angle of the stage is further included, and the probe is repeated. The tilt angle ion cutting processes are performed. The method of reducing the tip size of a probe according to claim 1, wherein the device for measuring whether the size of the tip conforms to a specification comprises a scanning electron microscope. The method of reducing the tip size of a probe according to claim 1, wherein the carrier comprises: a base; a carrier attached to the surface of the base and having at least one groove, wherein the at least a trench extending perpendicular to the surface of the base, the at least one trench for receiving the probe, and a detachable spacer spanning the at least one trench and fixed to the carrier The probe is fixed to the carrier. The method of reducing the tip size of a probe according to claim 7, wherein the stage further comprises a fixing member for fixing the detachable spacer to the carrier. A carrier adapted to carry at least one probe, and comprising: a base; a carrier plate coupled to the surface of the base and having at least one groove, wherein the at least one groove extends perpendicular to the base a surface, and the at least one groove is for receiving the at least one probe; and a detachable spacer spans the at least one groove and is fixed on the carrier to fix the at least one probe On the carrier board. The stage according to claim 9 further comprising a fixing member for fixing the detachable spacer to the carrier.