JP2009300313A - Inspection method for glass substrate, glass substrate inspected by the same method, inspection device for glass substrate, and manufacturing method for glass substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device for finding foreign matter in a chamfer slope of a glass substrate, and a manufacturing method for a glass substrate. <P>SOLUTION: According to this inspection method of inspecting by applying an electron beam on defects in a surface of a glass substrate mounted on a stage, the stage is inclined so that an application angle between the chamfer slope and the electron beam in inspecting the chamfer slope of the glass substrate is equal to an application angle between a magnetic-layer forming face and an electron beam in inspecting the magnetic layer forming face of the glass substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an inspection method and the like, and more particularly, to a glass substrate inspection method, a glass substrate inspected by the inspection method, a glass substrate inspection apparatus, and a glass substrate manufacturing method.

  An inspection apparatus that performs defect detection and detailed observation of a sample using the same electron beam apparatus is provided (Patent Document 1). In Patent Document 1, a semiconductor wafer is an inspection object. As shown in FIG. 9, the semiconductor wafer has an element formation region 910 and a peripheral region 920 that surrounds the element formation region 910 and is positioned at the peripheral edge of the wafer. The element formation region 910 is an important region for a wafer because a semiconductor chip is formed, and is an object to be reliably inspected. On the other hand, the peripheral region 920 is a region where a semiconductor chip is not formed and an electrode for taking a substrate potential is formed at most, and is not an important region for the wafer. Therefore, the peripheral region 920 of the semiconductor wafer has not been sufficiently inspected.

  On the other hand, the glass substrate has a donut shape, and as shown in FIGS. 10 and 11, chamfered slopes 1000 are formed at the inner peripheral end and the outer peripheral end. In recent years, there has been a problem that foreign matter exists on the chamfered slope 1000 of the glass substrate, and the foreign matter wraps around the surface of the glass substrate on which the magnetic layer is formed, causing adverse effects such as head crashes.

JP 2005-209645 A

  However, the inspection method and apparatus disclosed in Patent Document 1 are intended for semiconductor wafers, and it is not necessary to inspect peripheral areas. For this reason, the inspection method and apparatus of Patent Document 1 are not suitable for inspecting a chamfered slope of a glass substrate. Therefore, the inspection method and apparatus disclosed in Patent Document 1 cannot sufficiently find foreign matter on the chamfered slope that causes a head crash or the like.

  In the glass substrate inspection method of one embodiment of the present invention, the irradiation angle between the chamfered slope and the electron beam when inspecting the chamfered slope of the glass substrate mounted on the stage is the magnetic layer forming surface of the glass substrate. The stage is tilted so that the irradiation angle between the magnetic layer forming surface and the electron beam at the time of inspection is the same.

  An inspection apparatus for a glass substrate according to one embodiment of the present invention includes an electron beam irradiation unit that emits an electron beam, a table unit that includes an upper surface on which a glass substrate to be inspected and a lower surface facing the upper surface, A glass provided by the irradiation of the electron beam emitted from the electron beam emitted from the electron beam emitted from the coupling part provided on the lower surface and capable of tilting the table part, the elevating mechanism part connected to the coupling part and moving the table part in the vertical direction And a detector for detecting secondary electron beams and reflected electrons emitted from the substrate.

  The method for manufacturing a glass substrate of one embodiment of the present invention includes a step of preparing a glass substrate processed into a donut shape, a step of polishing the surface of the glass substrate, and mounting the polished glass substrate on a stage of an inspection apparatus And inspecting the chamfered slope of the glass substrate while tilting the stage.

  ADVANTAGE OF THE INVENTION According to this invention, the inspection method and inspection apparatus which can discover the foreign material of the chamfering slope of a glass substrate can be provided.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the figure, corresponding parts are indicated by corresponding reference numerals. The following embodiment is shown as an example, and various modifications can be made without departing from the spirit of the present invention.

  Here, the inspection method described below is one step in the glass substrate manufacturing method. More specifically, first, a glass substrate processed into a donut shape is prepared. Next, the surface and end surface of the glass substrate are polished. Next, the polished glass substrate is inspected by an inspection method described later.

<First Embodiment>
Hereinafter, the inspection apparatus and the inspection method of the first embodiment will be described with reference to the drawings. FIG. 1 is a view showing a state of a stage when a chamfered slope at an outer peripheral end (outside) of a glass substrate is inspected, and is a partial cross-sectional view taken along line YY of FIG. FIG. 2 is a drawing showing the state of the stage when the chamfered slope at the inner peripheral end (inner side) of the glass substrate is inspected, and is a partial cross-sectional view taken along line YY of FIG. FIG. 3 is a drawing showing a state of the stage when the upper surface (surface on which the magnetic layer is formed) of the glass substrate is inspected, and is a partial cross-sectional view taken along the line YY of FIG. FIG. 4 is a plan view showing the relationship between the glass substrate and the stage as seen from the upper side of the table portion. FIG. 5 is a plan view showing the relationship between the table of the stage and the lifting mechanism as seen from below the table portion.

  As shown in the drawings, the inspection apparatus according to the first embodiment includes an electron beam irradiation unit 100, a detection unit 110, and a stage unit 120.

<Electron beam irradiation unit>
The electron beam irradiation unit 100 irradiates the sample with an electron beam emitted from an electron gun. Although not shown, the electron beam irradiation unit 100 includes an electron gun, an electrostatic lens, an aperture, a lens, and an aligner. The electron gun includes an electron source, a cathode that extracts an electron beam from the electron source, and an anode that accelerates the electron beam extracted by the cathode. The aperture shapes the electron beam into a predetermined cross-sectional shape.

  Here, the electron beam irradiation part 100 of 1st Embodiment is located diagonally upward, when the stage part 120 is located horizontally with respect to the ground. Needless to say, the position of the electron beam irradiation unit 100 with respect to the stage unit 120 is not limited to an obliquely upward direction. The position of the electron beam irradiation unit 100 may be vertically above the stage unit 120 depending on the positional relationship with the detection unit 110.

<Detector>
The detection unit 110 includes a detector and detects secondary electrons emitted from the sample. Although not shown, the detection unit 110 includes a projection lens, a microchannel plate (MCP), a fluorescent plate, a relay lens, a time delay integration (TDI) or CCD camera, and an image processing device.

<Stage>
The stage 120 includes a table unit 121, an elevating mechanism unit 122, a coupling unit 123, and a support unit 124.

  The table unit 121 includes an upper surface 121a on which a glass substrate as a sample is mounted, and a lower surface 121b on which the coupling unit 123 is formed.

  The lifting mechanism unit 122 is located on the lower surface side of the table unit 121, is connected to the coupling unit 123, and moves the table unit 121 in the vertical (vertical) direction 130.

  As shown in FIG. 5, the joining portion 123 is provided at the center of the lower surface of the table portion 121, connects the table portion 121 and the lifting mechanism portion 122, and makes the table portion 121 horizontal or tilted obliquely. Or can be rotated in the lateral direction 140. For example, when inspecting a chamfered slope of a glass substrate that is a sample, the coupling portion 123 tilts the table portion 121 so that the chamfered slope is horizontal with the ground surface. When the inspection of the corresponding portion is completed, the table portion 121 is rotated in the lateral direction 140 so that the other chamfered slopes on the outside can be continuously inspected. The joint portion 123 is provided at the center of the lower surface of the table portion 121 (the center point when the table portion 121 is circular, or the intersection of diagonal lines when the table portion 121 is rectangular). It is also good for stable control. However, it goes without saying that the joint portion 123 may be provided at a location other than the center (for example, the periphery) as long as the table portion 121 can be stably controlled by the mechanism of the joint portion 123.

  As shown in FIG. 4, the support part 124 is formed on the upper surface of the table part 121, and supports the sample so that the sample is not displaced or dropped even when the table part 121 is inclined. A plurality of support portions 124 are preferably provided in accordance with the shape of the sample. Since the table part 121 moves freely, it is preferable that there are at least four support parts 124. Further, considering that the sample is a donut-shaped glass substrate, it is preferable that the inner hole also has a support portion 124 in order to support it reliably. In this case, if the support portion 124 is similar to the shape of the inner hole, the sample can be supported more reliably. For example, when the inner hole is circular when viewed from above, the support portion 124 is circular when viewed from above.

<Inspection method>
(1) When inspecting the upper surface of the glass substrate When inspecting the upper surface 300a of the glass substrate 300, the table portion 121 of the stage 120 is parallel to the ground as shown in FIG. The detection unit 110 detects the secondary electrons 110b emitted by irradiating the upper surface 300a of the glass substrate 300 with the electron beam 100a emitted from the electron beam irradiation unit 100. When a foreign object is found, the signal processing device stores the size and position information (X coordinate, Y coordinate) of the foreign object. By processing the detection signal, the presence / absence and size of the foreign matter and position information (XY coordinates and R-Θ coordinates) are stored. When a signal corresponding to a foreign object is found, the signal processing device stores the size and position information (X coordinate, Y coordinate) of the foreign object.

(2) When inspecting the chamfered slope located on the outer peripheral edge of the glass substrate When inspecting the chamfered slope 300b of the glass substrate 300, as shown in FIG. The chamfered slope you want tends to be horizontal to the ground. By doing in this way, when inspecting the chamfered slope located in the outer peripheral edge portion, the inspection can be performed without moving the electron irradiation unit 100 and the detection unit 110. Here, when the distance between the electron irradiation unit and the sample is too short, the elevating mechanism unit 122 moves downward. Then, the detection unit 110 detects the secondary electrons 110 b emitted by irradiating the electron beam 100 a emitted from the electron beam irradiation unit 100. When a foreign object is found, the size and position information (X coordinate, Y coordinate) of the foreign object is stored in the image processing apparatus. When the inspection of the corresponding part is completed, the table part 121 is rotated in the horizontal direction 140 and the inspection of other parts is continued. Here, it goes without saying that the chamfered slope may be other than horizontal with respect to the ground surface so that the electron beam 100a sufficiently hits the chamfered slope and / or the secondary electron 100b can be sufficiently detected. . Here, sufficient detection means that the amount by which the detection unit 110 can detect the secondary electrons 110b when the chamfered slope 300b of the glass substrate 300 is inspected is the upper surface 300a (magnetic layer forming surface) of the glass substrate 300. This means that the amount of detection of the secondary electrons 110b by the detection unit 110 is substantially the same (notably not much) when inspecting.

(3) When inspecting a chamfered slope located on the inner peripheral edge of the glass substrate When inspecting the chamfered slope 300c of the glass substrate 300, as shown in FIG. The chamfered slope you want tends to be horizontal to the ground. By doing in this way, when inspecting the chamfered slope located in the inner peripheral edge, the inspection can be performed without moving the electron irradiation unit 100 or the detection unit 110. Here, when the distance between the electron irradiation unit and the sample is too far, the elevating mechanism unit 122 moves upward. Then, the detection unit 110 detects the secondary electrons 110 b emitted by irradiating the electron beam 100 a emitted from the electron beam irradiation unit 100. When a foreign object is found, the size and position information (X coordinate, Y coordinate) of the foreign object is stored in the image processing apparatus. When the inspection of the corresponding part is completed, the table part 121 is rotated in the horizontal direction 140 and the inspection of other parts is continued. Here, it goes without saying that the chamfered slope may be other than horizontal with respect to the ground surface so that the electron beam 100a sufficiently hits the chamfered slope and / or the secondary electron 100b can be sufficiently detected. . Here, sufficient detection means that the amount by which the detection unit 110 can detect the secondary electrons 110b when the chamfered slope 300c of the glass substrate 300 is inspected is the upper surface 300a (magnetic layer forming surface) of the glass substrate 300. This means that the amount of detection of the secondary electrons 110b by the detection unit 110 is substantially the same (notably not much) when inspecting.

  According to the inspection apparatus and the inspection method of the first embodiment, it is possible to inspect the chamfered slope and side surface of the glass substrate with a small number of parts.

<Second Embodiment>
Hereinafter, an inspection apparatus and an inspection method according to the second embodiment will be described with reference to the drawings. FIG. 6 is a drawing showing the state of the stage when inspecting the chamfered slope on the outside of the glass substrate, and is a partial cross-sectional view taken along the line ZZ of FIG. FIG. 7 is a plan view of the relationship between the stage table and the lifting mechanism as seen from the lower side of the table portion.

  As shown in the drawing, the inspection apparatus according to the second embodiment includes an electron beam irradiation unit 100, a detection unit 110, and a stage 600. In addition, the same number is given to what shows the same structure as the inspection apparatus of 1st Embodiment, and the duplicate description is abbreviate | omitted.

<Stage>
The stage 600 includes a table unit 121, five elevating mechanism units 610 to 614, five coupling units 620 to 624, and a support unit 124.

  The elevating mechanism units 610 to 614 are provided on the lower surface side of the table unit 121 and move the table unit 121 in the vertical (up and down) direction 130.

  As shown in FIG. 7, the five joint portions 620 to 624 are provided on the lower surface of the table portion 121, and are connected to any one of the table portion 121 and the lifting mechanism portions 610 to 614, respectively. Direction, tilted in an oblique direction, or rotated in the lateral direction 140. Note that, unlike the stage in the inspection apparatus of the first embodiment, the stage 600 in the inspection apparatus of the second embodiment does not move the lifting mechanism section 610 and moves the other four lifting mechanism sections 611 to 614 vertically. By moving it, the table can be leveled or tilted. Needless to say, the lifting mechanism 610 may also move in the vertical direction.

  According to the inspection apparatus and the inspection method of the second embodiment, in addition to being able to inspect the chamfered slope and side surface of the glass substrate in the same manner as the inspection apparatus and inspection method of the first embodiment, a plurality of lifting mechanisms By finely moving the part, it is possible to inspect with high accuracy.

<Third Embodiment>
The inspection apparatus and inspection method of the third embodiment will be described below using the drawings. FIG. 8 is a partial cross-sectional view showing a state in which a chamfered slope inside the glass substrate is being inspected.

  As shown in the drawing, the inspection apparatus according to the third embodiment includes an electron beam irradiation unit 800, a detection unit 810, a stage 820, and rails 830 and 840. In addition, the same number is given to what shows the same structure as the inspection apparatus of 1st and 2nd embodiment, and the duplicate description is abbreviate | omitted.

<Electron beam irradiation unit>
The electron beam irradiation unit 800 has the same configuration as the electron beam irradiation unit 100 and performs the same operation. Here, the electron beam irradiation unit 800 is provided so as to be movable on a rail 830 provided in the inspection apparatus. The electron beam irradiation unit 800 moves along the rail 830 so that the sample to be inspected can be optimally inspected.

<Detector>
The detection unit 810 has the same configuration as the detection unit 110 and performs the same operation. Here, the detection unit 810 is provided to be movable on a rail 840 provided in the inspection apparatus. The detection unit 810 moves along the rail 840 so that the sample to be inspected can be optimally inspected.

<Stage>
The stage 820 includes a table unit 121 and an elevating mechanism unit 821.

  The elevating mechanism unit 821 is provided on the lower surface side of the table unit 121, and moves the table unit 121 in the vertical (vertical) direction 130 or rotates it in the horizontal direction 140.

<Inspection method>
The electron beam irradiation unit 800 moves along the rail 830 for each part of the sample to be inspected. And it stops where it can irradiate an electron beam optimally. On the other hand, the detection unit 810 stops when it can optimally receive secondary electrons emitted from the sample. Then, the detection unit 810 detects secondary electrons 810 b emitted by irradiating the electron beam 800 a emitted from the electron beam irradiation unit 800. When a foreign object is found, the size and position information (X coordinate, Y coordinate) of the foreign object is stored in the image processing apparatus.

  According to the inspection apparatus and the inspection method of the third embodiment, in addition to being able to inspect the chamfered slope and side surface of the glass substrate in the same manner as the inspection apparatuses and inspection methods of the first and second embodiments, an electron beam The inspection can be performed only by moving the irradiation unit and the detection unit.

  In addition to inspecting a glass substrate, the inspection method of the present invention can also be used for inspection of a semiconductor wafer whose outer periphery is to be inspected.

FIG. 5 is a diagram illustrating a stage state when an outer chamfered slope of a glass substrate is inspected in the inspection method according to the first embodiment of the present invention, and is a partial cross-sectional view taken along line YY in FIG. 4. . It is drawing which shows the condition of the stage when test | inspecting the chamfering slope inside a glass substrate, and is a fragmentary sectional view in the YY line of FIG. It is drawing which shows the condition of the stage when inspecting the upper surface of a glass substrate, and is a fragmentary sectional view in the YY line of FIG. It is a top view which shows the relationship between a glass substrate and a stage. It is a top view which shows the relationship between the table part of a stage, and a raising / lowering mechanism. In the inspection method of the 2nd Embodiment of this invention, it is drawing which shows the condition of the stage when test | inspecting the chamfering slope of the outer side of a glass substrate, and is a fragmentary sectional view in the ZZ line | wire of FIG. . It is a top view which shows the relationship between the table part of a stage, and a raising / lowering mechanism. In the inspection method of the 3rd Embodiment of this invention, it is a fragmentary sectional view which shows the condition which is test | inspecting the chamfering slope inside a glass substrate. It is a top view which shows a semiconductor wafer. It is sectional drawing which shows the structure of a glass substrate. It is drawing which shows the structure of a glass substrate, and is a fragmentary sectional view in the XX line of FIG.

Explanation of symbols

100, 800 Electron beam irradiation unit 110, 810 Detection unit 120, 600, 820 Stage 121 Table unit 122, 610, 611, 612, 613, 614, 821 Lifting mechanism unit 123, 620, 621, 622, 623, 624 Coupling unit 124 support part 830, 840 rail

Claims (5)

In the inspection method of irradiating the surface of the glass substrate mounted on the stage with an electron beam and inspecting it,
The irradiation angle between the chamfered slope and the electron beam when inspecting the chamfered slope of the glass substrate is such that the magnetic layer formation surface and the electron beam are inspected when the magnetic layer formation surface of the glass substrate is inspected. The method for inspecting a glass substrate, wherein the stage is tilted so as to be the same as the irradiation angle. In the inspection method of irradiating the surface of the glass substrate mounted on the stage with an electron beam and inspecting it,
When inspecting the chamfered slope of the glass substrate, the detected amount of secondary electrons or reflected electrons emitted from the chamfered slope of the glass substrate is determined when the glass layer surface of the glass substrate is inspected. A method for inspecting a glass substrate, wherein the stage is tilted so as to be equal to a detection amount of secondary electrons or reflected electrons emitted from the magnetic layer forming surface of the substrate.   A glass substrate inspected by the inspection method according to claim 1. An electron beam irradiation unit for emitting an electron beam;
A table portion having an upper surface on which a glass substrate to be inspected is mounted, and a lower surface facing the upper surface;
A coupling portion provided on the lower surface of the table portion and capable of tilting the table portion;
An elevating mechanism connected to the coupling and moving the table in the vertical direction;
A detection unit that detects a secondary electron beam or a reflected electron emitted from the glass substrate when the electron beam emitted from the electron beam irradiation unit is irradiated onto the glass substrate; Glass substrate inspection equipment. Preparing a glass substrate processed into a donut shape;
Polishing the surface of the glass substrate;
Mounting the polished glass substrate on a stage of an inspection apparatus, and inspecting a chamfered slope of the glass substrate while tilting the stage.

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