JP2013196925A - Electric contact and socket for electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric contact, configured to electrically contact an electric component as a plurality of projections contact a spherical terminal, and a socket for electric component such that manufacture is facilitated, durability is improved, and trouble of contacting of a contact portion of the electric contact with the top of the spherical terminal of an electric component is prevented.SOLUTION: There is provided an electric contact 15 that has a contact portion 31 contacting a spherical terminal 2 of an electric component 2, wherein the contact portion has a recesses 35 which is formed on a tip side contacting the spherical terminal and substantially circular in plan view, and a plurality of projections 36 having tops 36a at tips of inner walls 35a of the recesses and inclined surfaces 37 on sides of an outer periphery 38 relative to the tops, and electrically contacts the electric component as the plurality of projections contact the spherical terminal.

Description

  The present invention relates to an electrical contact that is electrically connected to an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), and an electrical component socket in which the electrical contact is disposed.

  Conventionally, as this type of electrical contact, a probe pin provided in an IC socket as an electrical component socket is known. The IC socket is arranged on the wiring board and accommodates the IC package to be inspected. The terminals of the IC package and the electrodes of the wiring board are connected via the probe pins. It is electrically connected to perform tests such as a continuity test.

  Some such probe pins come into contact with an IC package having a spherical terminal. And as such a probe pin, the contact part which contacts the spherical terminal of IC package is formed in the substantially crown shape which has a some projection part, and the some outer peripheral side from the substantially center part inside a contact part is formed. A plurality of inclined ridges extending toward the protrusion are known to come into contact with the spherical terminal (see, for example, Patent Document 1).

JP 2002-357622 A

  Here, in recent years, it is spherical at the tips of the plurality of protrusions in the substantially crown-shaped contact portion of the probe pin because the conductivity is better than that in contact with the spherical terminal at the plurality of peak portions as described above. There has been proposed a probe pin having a configuration in which the contact portion of the probe pin and the spherical terminal of the IC package are brought into contact with each other so as to pierce the terminal. In such a probe pin, the diameter of the contact portion of the probe pin is made smaller than that of the probe pin configured to contact the spherical terminal at a plurality of peak portions, and the projection portion is directed from the substantially central portion of the contact portion. By making the inclination angle of the ridge-shaped part steep, the spherical terminal comes into contact with the protrusion on the outer peripheral side without contacting the inner ridge-shaped part.

  However, in such a probe pin, there is a problem that it is necessary to make the contact portion very small in diameter with respect to the diameter of the spherical terminal, which makes it difficult to produce the probe pin. Further, by making the inclination angle of the ridge-shaped part steep, the tip of the projection part becomes thin and sharp and easily damaged, which may cause a problem in durability of the probe pin. In addition, since the diameter of the contact portion of the probe pin is reduced, a plurality of protrusions are arranged in a narrow range near the center of the contact portion, and the protrusion is at the apex of the spherical terminal that should not be contacted in the test stage. There is also a problem that there is a risk of contact.

  Accordingly, the present invention provides an electrical contact (probe pin) and an electrical component socket (IC socket) configured to be in electrical contact with an electrical component (IC package) by contacting a plurality of protrusions with a spherical terminal. Provided are an electrical contact and an electrical component socket that can be easily manufactured, can improve durability, and can prevent a problem that the contact portion of the electrical contact contacts the apex of a spherical terminal of the electrical component. It is an issue.

  In order to achieve this object, the invention according to claim 1 has a contact portion that contacts a spherical terminal of an electrical component, and the contact portion is a plan view formed on a distal end side that contacts the spherical terminal. A substantially circular recess, and a plurality of protrusions provided with apexes at the tips of the inner walls of the recesses and provided with inclined surfaces on the outer peripheral side from the apexes. By contacting the terminal, an electrical contact that makes electrical contact with the electrical component is obtained.

  The invention according to claim 2 is characterized in that, in addition to the configuration according to claim 1, the inner wall of the recess is formed substantially parallel to the longitudinal direction of the contact portion.

  The invention described in claim 3 is characterized in that, in addition to the configuration described in claim 1 or 2, four protrusions are provided at equal intervals.

  According to a fourth aspect of the present invention, there is provided a socket body that is disposed on the wiring board and has an accommodating portion that accommodates an electrical component, and a spherical terminal that is disposed on the socket body and provided on the electrical component. It is set as the socket for electrical components which has an electrical contact as described in any one of Claims 1 thru | or 3.

  According to the first aspect of the present invention, the contact portion of the electric contact has a plurality of protrusions provided with apexes at the tips of the inner walls of the substantially circular concave portion in plan view without the ridge-shaped portion. Therefore, it is not necessary to consider the possibility that the spherical terminal of the electrical component will contact the ridge-shaped part inside it instead of the protruding part as in the past, and the diameter of the contact part is designed to be smaller than the diameter of the spherical terminal The spherical terminal can be reliably brought into contact with the plurality of protrusions without making the tip of the protrusions into a thin and sharp shape. As a result, an electric contact that is easy to manufacture and has improved durability can be obtained.

  In addition, since it is not necessary to design the diameter of the contact portion to be smaller than the diameter of the spherical terminal, the plurality of protrusions are separated from the center of the contact portion without being arranged in a narrow range near the center of the contact portion. Can be arranged in a wide range. As a result, it is possible to prevent a problem that the contact portion of the electrical contact contacts the apex of the spherical terminal of the electrical component.

  According to the invention of claim 2, the inner wall of the recess is formed substantially parallel to the longitudinal direction of the contact portion, so that the inner wall has almost no inclination like a conventional ridge, The spherical terminal can be brought into contact with the plurality of protrusions more reliably.

  According to the invention described in claim 3, since the four protrusions are provided at equal intervals, the spherical terminal can be brought into contact with the protrusion in a stable state.

  According to the fourth aspect of the present invention, since the electric contactor according to any one of the first to third aspects is included, the fabrication is easy, the durability is improved, and the contact of the electric contactor is achieved. It can be set as the socket for electrical components which prevented the malfunction which a part contacts the vertex of the spherical terminal of an electrical component.

It is sectional drawing of the probe pin vicinity in the IC socket which concerns on embodiment of this invention. It is sectional drawing which shows the state which mounted | wore the IC package and wiring board to the IC socket of FIG. It is a top view of the contact part of the probe pin which concerns on the same embodiment. FIG. 4 is a side view of the contact portion of the probe pin of FIG. It is BB sectional drawing of the contact part of the probe pin of FIG. It is a perspective view of the contact part of the probe pin of FIG. It is a top view of the contact part of the probe pin which shows the modification of this invention. It is the C view side view of the contact part of the probe pin of FIG. It is DD sectional drawing of the contact part of the probe pin of FIG. It is a perspective view of the contact part of the probe pin of FIG.

  Embodiments of the present invention will be described below.

  1 to 6 show an embodiment of the present invention.

  As shown in FIGS. 1 and 2, an IC socket 10 as an “electrical component socket” of this embodiment is fixed on a wiring board 1, and an IC package 2 as an “electrical component” is mounted on the upper part. The electrode 1a of the wiring board 1 and the solder ball 2a as the “spherical terminal” of the IC package 2 are electrically connected to each other. For example, a test apparatus for a continuity test such as a burn-in test for the IC package 2 It is used for etc.

  In the IC package 2 of this embodiment, a plurality of spherical solder balls 2a are provided on the lower surface of a substantially rectangular package body 2b.

  The IC socket 10 includes an upper plate 11, a lower plate 12, and a floating plate 13 that is disposed on the upper plate 11 and accommodates the IC package 2 and can move up and down. A socket body 14 and a plurality of probe pins 15 as “electrical contacts” arranged in a matrix on the socket body 14 and arranged vertically through the socket body 14 are provided. The socket body 14 is positioned on the wiring board 1 by positioning pins (not shown) in a state where the upper plate 11 and the lower plate 12 are fixed by fixing screws (not shown).

  In this embodiment, the arrangement pitch of the solder balls 2a of the IC package 2 and the arrangement pitch of the electrodes 1a of the wiring board 1 electrically connected to the solder balls 2a are the same, and the arrangement of the probe pins 15 The pitch is the same as these arrangement pitches.

  As shown in FIGS. 1 and 2, each probe pin 15 has a first plunger 20 having a first contact portion 21 that is in electrical contact with the electrode 1 a of the wiring substrate 1 along the longitudinal axis L. A second plunger 30 having a second contact portion 31 as a “contact portion” that is in electrical contact with the solder ball 2 a of the IC package 2 at the tip, and between the first plunger 20 and the second plunger 30. A continuous cylindrical member 40 is provided, and a coil spring 50 that energizes the first plunger 20 and the second plunger 30 in the direction of separating from each other along the axis L is accommodated in the cylindrical member 40. ing.

  The first plunger 20 includes a first protrusion 22 having a substantially conical first contact portion 21 in contact with the electrode 1 a of the wiring substrate 1 at the tip, and a first insertion portion 23 that is thicker than the first protrusion 22. It has. Among these, the 1st insertion part 23 is accommodated in the state which contacted slidably in the cylindrical member 40, and the 1st plunger is formed by the 1st latching | locking part 41 formed in the lower end part of the cylindrical member 40. The movement in the protruding direction (downward) of 20 is restricted. A first receiving portion 24 that locks the coil spring 50 is integrally formed in an end portion of the first insertion portion 23 in a conical shape with the axis L as the center. The first projecting portion 22 is slidably inserted into the through hole 12 a of the lower plate 12.

  The second plunger 30 includes a second projecting portion 32 provided with a second contact portion 31 having a predetermined shape that contacts the solder ball 2a of the IC package 2 at the tip, and a second projecting portion 32. And a thick second insertion portion 33. Among these, the 2nd insertion part 33 is accommodated in the state which contacted slidably in the cylindrical member 40, and the 2nd plunger is carried out by the 2nd latching | locking part 42 formed in the upper end part of the cylindrical member 40. The movement in the protruding direction (upward direction) of 30 is restricted. In addition, a second receiving portion 34 that locks the coil spring 50 is integrally formed in an end portion of the second insertion portion 33 in a conical shape with the axis L as the center. The protruding portion 32 protrudes from the upper plate 11, and the second contact portion 31 is slidably inserted into the through hole 13 a of the floating plate 13 that can accommodate the solder ball 2 a of the IC package 2.

  Further, as shown in FIGS. 2 and 5, the second contact portion 31 of the second plunger 30 contacts the solder ball 2a so as to pierce the solder ball 2a, thereby electrically connecting the IC package 2 and the IC socket 10 to each other. Are connected to each other. As shown in FIGS. 3 to 6, the second contact portion 31 is formed in a shape having a recess 35, a protrusion 36, an inclined surface 37, and the like. Hereinafter, each part which comprises the 2nd contact part 31 is explained in full detail.

  The recess 35 is formed on the tip surface facing the solder ball 2a on the tip side of the second contact portion 31 that contacts the solder ball 2a, and has a substantially circular shape in plan view as shown in FIG. As will be described later, the apex of the solder ball 2 a supported by the protrusion 36 is formed in a depth and shape that does not contact the second contact portion 31. The recess 35 is formed by drilling, lathe processing, or the like. As shown in FIGS. 5 and 6, in this embodiment, the inner wall 35 a is elongated by the length of the second contact portion 31 by drilling. It is formed in a pentagonal shape in sectional view in which a substantially conical hole is continued below a substantially cylindrical hole formed substantially parallel to the direction (the direction of the axis L in FIGS. 1 and 2).

  The protruding portion 36 is a pointed portion that faces the solder ball 2 a, and is formed on the front end surface of the second contact portion 31 that faces the solder ball 2 a, as with the recessed portion 35. Is formed. More specifically, as shown in FIGS. 5 and 6, the protrusion 36 has a plurality of positions such that a pointed apex 36 a is provided at the tip of the inner wall 35 a of the recess 35 (tip facing the solder ball 2 a). Is formed. In this embodiment, four protrusions 36 are provided at equal intervals, and each of these protrusions 36 is apex 36a at the tip of the inner wall 35a of the recess 35 extending in a direction substantially parallel to the axis L. It is formed to have.

  As shown in FIGS. 4 and 6, each protrusion 36 has an inclined surface 37 that is formed by cutting or the like and is inclined downward from the apex 36 a toward the outer periphery 38 of the second plunger 30. ing. In this embodiment, the second contact portion 31 is chamfered along the four side surfaces of the regular quadrangular pyramid from the solder ball 2a side, whereby 4 boundary lines between the four side surfaces of the regular quadrangular pyramid 4 An inclined surface 37 is formed by cutting the periphery of the recess 35 so as to have the apexes 36 a of the two protrusions 36. As a result, from one apex 36a of the protrusion 36, two inclined surfaces 37 intersecting at right angles are provided downward toward the outer periphery 38 side. In addition, such two inclined surfaces 37 passing through the apex 36a form the protrusion 36 in a pointed shape having the apex 36a on the inner side and the ridged part 36b inclined downward on the outer periphery 38 side. Yes.

  Next, a manufacturing method of the IC socket 10 provided with the probe pin 15 will be described with reference to FIGS. In addition, since it is the manufacturing method similar to the past except for the manufacturing method of the 2nd contact part 31 in the 2nd plunger 30 of the probe pin 15 demonstrated below, description is abbreviate | omitted.

  First, the solder ball 2a is drilled or turned on the second contact portion 31 of the second plunger 30 on which the predetermined second projecting portion 32, second insertion portion 33, second receiving portion 34, etc. are formed. A recess 35 is formed on the tip surface facing the solder ball 2a on the tip side in contact with the solder. In this embodiment, by drilling, a substantially cylindrical hole whose inner wall 35a is substantially parallel to the direction of the axis L, which is the longitudinal direction of the second contact portion 31, and a substantially conical hole below the hole are substantially formed. Formed simultaneously. As a result, the concave portion 35 having a substantially circular shape in plan view and a pentagonal shape in cross section is formed, and the apex of the solder ball 2a supported by the protrusion 36 formed later is formed in a depth and shape that does not contact the second contact portion 31. Is done.

  Next, an inclined surface 37 inclined downward from the inner side toward the outer peripheral side 38 is formed around the recess 35 by cutting or the like. In this embodiment, the wall portion around the recess 35 is cut into a planar shape at a predetermined angle from the solder ball 2a side by a cutting tool to form the inclined surface 37, and the second contact portion 31 is 90 ° about the axis L. The four inclined surfaces 37 are evenly formed at the same angle by rotating them one by one. As a result, there are four inclined surfaces 37 in which the second contact portion 31 is chamfered along the four side surfaces of the regular quadrangular pyramid from the solder ball 2a side.

  At the same time, a vertex 36a continuous from the inner wall 35a of the concave portion 35 is formed at a position where the four boundary lines between the sides of the regular pyramid are located, and the peak-shaped portion extends downward from the vertex 36a toward the outer periphery 38 side. 36b is formed, and the four protrusions 36 having these are formed in a pointed shape.

  In this way, the second contact portion 31 having the four protrusions 36 around the recess 35 is formed.

  Next, the operation of the IC socket 10 including the probe pin 15 having the second plunger 30 will be described. When this IC socket 10 is used, a plurality of probe pins 15 are respectively attached to the socket body 14, and the first contact portion 21 of the first plunger 20 protrudes downward as shown in FIG. The second contact portion 31 of the two plunger 30 is arranged in a state of facing the through hole 13 a of the floating plate 13. Then, the IC socket 10 is positioned and fixed to the wiring board 1, and the first contact portion 21 of the first plunger 20 is brought into contact with the electrode 1 a of the wiring board 1 as shown in FIG. 2. At this time, the coil spring 50 is compressed in the cylindrical member 40 by the first receiving portion 24 of the first insertion portion 23 of the first plunger 20.

  Thereafter, the IC package 2 is accommodated in the floating plate 13, and the solder balls 2a are accommodated in the through holes 13a. When the floating plate 13 is lowered in this state, the plurality of protrusions 36 in the second contact portion 31 of the second plunger 30 pierce the solder ball 2a at the apex 36a as shown in FIG. Contact the ball 2a.

  At this time, the apexes 36a of the plurality of protrusions 36 are formed on the inner wall 35a of the concave portion 35 having a substantially circular shape in plan view and having no ridges formed substantially parallel to the direction of the axis L which is the longitudinal direction of the second contact portion 31. Therefore, before the inner wall 35a of the recess 35 comes into contact with the solder ball 2a, the apex 36a of the protrusion 36 is always in contact with the solder ball 2a.

  For this reason, it is not necessary to consider the possibility that the solder ball 2a of the IC package 2 contacts the ridge-shaped portion inside the protrusion 36 instead of the conventional one, and the diameter of the second contact portion 31 is reduced to the solder ball. The solder ball 2a can be reliably brought into contact with the plurality of protrusions 36 without being designed to be smaller than the diameter of 2a or without making the tip of the protrusion 36 extremely sharp and sharp. As a result, the probe pin 15 that is easy to manufacture and has improved durability can be obtained.

  In addition, since it is not necessary to design the diameter of the second contact portion 31 to be smaller than the diameter of the solder ball 2 a, the plurality of protrusions 36 are arranged in a narrow range near the center of the second contact portion 31. And can be arranged in a wide range away from the center of the second contact portion 31. As a result, the problem that the second contact portion 31 of the probe pin 15 contacts the apex of the solder ball 2a of the IC package 2 can be prevented.

  Further, according to the probe pin 15, the inner wall 35 a of the recess 35 is formed substantially parallel to the direction of the axis L that is the longitudinal direction of the second contact portion 31, so that the inner wall 35 a is a conventional ridge-shaped portion. Thus, the solder ball 2a can be more reliably brought into contact with the plurality of protrusions 36.

  Further, according to the probe pin 15 of this embodiment, the four protruding portions 36 are provided at equal intervals, so that the solder ball 2a can be brought into contact with the protruding portion 36 in a stable state.

  Moreover, according to the IC socket 10 of this embodiment, since it has such a probe pin 15, it is easy to manufacture and improves durability, and the second contact portion 31 of the probe pin 15 is an IC package. The IC socket 10 can be prevented from being in contact with the apex of the second solder ball 2a.

  Thereafter, when the floating plate 13 is lowered, the coil spring 50 is compressed in the cylindrical member 40 by the second receiving portion 34 of the second insertion portion 33 of the second plunger 30 as shown in FIG. Then, by compressing the coil spring 50 by the first plunger 20 and the second plunger 30 in this way, the first contact portion 21 of the first plunger 20 and the second contact portion 31 of the second plunger 30 are compressed by the coil spring 50. Are urged in a direction away from each other and in contact with the electrodes 1a of the wiring board 1 and the solder balls 2a of the IC package 2, a continuity test such as a burn-in test of the IC package 2 is performed.

  In this embodiment, four protrusions 36 are provided at equal intervals. However, the present invention is not limited to this, and the protrusions 36 may be provided as long as the solder balls 2a can be stably supported. It does not have to be provided at equal intervals, and the number thereof is not four, but may be three or five or more. When three protrusions 36 are provided at equal intervals, the second contact portion 31 is chamfered along the three side faces of the regular triangular pyramid from the solder ball 2a side, and the three side faces of the regular triangular pyramid are formed. The inclined surface 37 of the shape which cut | disconnected the circumference | surroundings of the recessed part 35 so that it may have the vertex 36a of the three projection parts 36 in the three boundary lines of each other will be provided.

  Furthermore, the shape of the protrusion is not limited to that of the above-described embodiment, and may be formed in other shapes. For example, it may have a shape like the modification shown in FIGS. Details will be described below. Since this modification is the same as the above-described embodiment except for the second contact portion 131 of the second plunger 30 described below, the same reference numerals are given except for matters different from the above-described embodiment. Therefore, the description is omitted.

  Similar to the second contact portion 31 shown in FIGS. 2 and 5, the second contact portion 131 of the second plunger 30 of this modification contacts the solder ball 2a so as to pierce the solder ball 2a. The package 2 and the IC socket 10 are electrically connected. As shown in FIGS. 7 to 10, the second contact portion 131 is formed in a shape having a recess 135, a protrusion 136, an inclined surface 137, and the like. Hereinafter, each part which comprises the 2nd contact part 31 is explained in full detail.

  The concave portion 135 is formed on the tip surface facing the solder ball 2a on the tip side of the second contact portion 131 that contacts the solder ball 2a, and has a substantially circular shape in plan view as shown in FIG. As will be described later, the apex of the solder ball 2 a supported by the protrusion 136 is formed to a depth and shape that does not contact the second contact portion 131. The recess 135 is formed by drilling, lathe processing, or the like. As shown in FIGS. 9 and 10, in this modification, the inner wall 135 a is formed in the longitudinal direction of the second contact portion 131 by drilling. It is formed in a pentagonal shape in sectional view in which a substantially conical hole is continued below a substantially cylindrical hole formed substantially parallel to (the direction of the axis L in FIGS. 1 and 2).

  The protrusion 136 is a pointed portion that faces the solder ball 2 a, and is formed on the tip surface of the second contact portion 131 that faces the solder ball 2 a as well as the recess 135. Is formed. More specifically, as shown in FIG. 9 and FIG. 10, the protrusion 136 has a plurality of locations such that a pointed apex 136a is provided at the tip of the inner wall 135a of the recess 135 (tip facing the solder ball 2a). Is formed. In this modification, four protrusions 136 are provided at equal intervals, and each of the protrusions 136 has a vertex 136a at the tip of the inner wall 135a of the recess 135 extending in a direction substantially parallel to the axis L. It is formed to have.

  As shown in FIGS. 8 and 10, each of the protrusions 136 has an inclined surface 137 that is formed by cutting or the like and is inclined downward from the apex 136 a toward the outer periphery 138 of the second plunger 30. ing. In this modified example, the second contact portion 131 is chamfered along the conical side surface from the solder ball 2a side, and the slanted surface 137 is formed by shaving the hatched portion of FIG. ing. As a result, it is formed on the four pointed protrusions 136 having the apex 136a on the inner side and the inclined surface 137 inclined downward on the outer periphery 138 side.

  Next, a method for manufacturing the IC socket 10 including the probe pin 15 having the second plunger 30 in which the second contact portion 131 is formed will be described with reference to FIGS. 1 to 2 and FIGS. 7 to 10. . In addition, since it is the manufacturing method similar to the past except for the manufacturing method of the 2nd contact part 131 in the 2nd plunger 30 of the probe pin 15 demonstrated below, description is abbreviate | omitted.

  First, the solder ball 2a is formed by drilling or turning on the second contact portion 131 of the second plunger 30 on which the predetermined second projecting portion 32, second insertion portion 33, second receiving portion 34, etc. are formed. A recess 135 is formed on the tip surface facing the solder ball 2a on the tip side in contact with the solder. In this modified example, by drilling, a substantially cylindrical hole whose inner side wall 135a is substantially parallel to the direction of the axis L, which is the longitudinal direction of the second contact portion 131, and a substantially conical hole below it are substantially simultaneously. It is formed. As a result, the concave portion 135 having a substantially circular shape in plan view and a pentagonal shape in cross section is formed, and the apex of the solder ball 2a supported by the protrusion 136 formed later is formed in a depth and shape that does not contact the second contact portion 131. Is done.

  Next, an inclined surface 137 inclined downward from the inside toward the outer periphery 138 is formed around the recess 135 by cutting or the like. In this modified example, while the second contact portion 131 is rotated about the axis L, the inclined surface 137 is formed by cutting the wall portion around the concave portion 135 from the solder ball 2a side to a conical side surface shape at a predetermined angle with a cutting tool. Form. As a result, an inclined surface 137 is formed in which the second contact portion 131 is chamfered along the conical side surface from the solder ball 2a side.

  Thereafter, a portion corresponding to the shaded portion in FIG. 7 around the concave portion 135 is cut off in a planar shape from the solder ball 2a side. At this time, the size and shape of the protrusion 136 are formed so that the position of the apex 136a continuing from the inner wall 135a of the recess 135 in the protrusion 136 is formed in a pointed shape.

  In this way, the second contact portion 131 having the four protrusions 136 around the recess 135 is formed.

  The “electric contactor” of the present invention is not limited to the probe pin having the structure as in the above-described embodiments and modifications, and can be applied to other structures. In the above-described embodiments and modifications, the “electrical component socket” of the present invention is applied to an IC socket. However, the present invention is not limited to this and can be applied to other sockets.

1 Wiring board
1a electrode
2 IC package (electrical parts)
2a Solder ball (spherical terminal)
10 IC socket (socket for electrical parts)
14 Socket body
15 Probe pin (electric contact)
20 First plunger
21 First contact
30 Second plunger
31,131 2nd contact part (contact part)
35,135 recess
35a, 135a inner wall
36,136 Protrusions
36a, 136a vertex
36b Peak
37,137 inclined surface
38,138 circumference
40 Tubular member
50 coil spring

Claims (4)

Having a contact portion that contacts the spherical terminal of the electrical component;
The contact portion is provided with a substantially circular concave portion in plan view formed on the tip side that contacts the spherical terminal, and a vertex is provided at the tip of the inner wall of the concave portion, and an inclined surface is provided from the vertex to the outer peripheral side. A plurality of protrusions,
The electrical contact, wherein the plurality of protrusions are in electrical contact with the electrical component by contacting the spherical terminal.   The electrical contact according to claim 1, wherein an inner wall of the recess is formed substantially parallel to a longitudinal direction of the contact portion.   The electric contact according to claim 1, wherein four protrusions are provided at equal intervals. A socket body that is disposed on the wiring board and has a housing portion that houses electrical components;
An electrical component socket comprising: the electrical contact according to any one of claims 1 to 3, wherein the electrical contact is disposed on the socket body and contacts a spherical terminal provided on the electrical component.

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