TW201615074A - Interposer and manufacturing method therefor - Google Patents

Interposer and manufacturing method therefor

Info

Publication number
TW201615074A
TW201615074A TW103135365A TW103135365A TW201615074A TW 201615074 A TW201615074 A TW 201615074A TW 103135365 A TW103135365 A TW 103135365A TW 103135365 A TW103135365 A TW 103135365A TW 201615074 A TW201615074 A TW 201615074A
Authority
TW
Taiwan
Prior art keywords
interposer
manufacturing
conductive
vias
glass substrate
Prior art date
Application number
TW103135365A
Other languages
English (en)
Other versions
TWI572268B (zh
Inventor
Ming-Chih Chen
Ra-Min Tain
Dyi-Chung Hu
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW103135365A priority Critical patent/TWI572268B/zh
Publication of TW201615074A publication Critical patent/TW201615074A/zh
Application granted granted Critical
Publication of TWI572268B publication Critical patent/TWI572268B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW103135365A 2014-10-13 2014-10-13 中介板及其製造方法 TWI572268B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103135365A TWI572268B (zh) 2014-10-13 2014-10-13 中介板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103135365A TWI572268B (zh) 2014-10-13 2014-10-13 中介板及其製造方法

Publications (2)

Publication Number Publication Date
TW201615074A true TW201615074A (en) 2016-04-16
TWI572268B TWI572268B (zh) 2017-02-21

Family

ID=56361345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103135365A TWI572268B (zh) 2014-10-13 2014-10-13 中介板及其製造方法

Country Status (1)

Country Link
TW (1) TWI572268B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840203B2 (en) 2016-05-06 2020-11-17 Smoltek Ab Assembly platform
TWI718860B (zh) * 2020-02-04 2021-02-11 金像電子股份有限公司 多層印刷電路板的製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809053B2 (ja) * 2000-01-20 2006-08-16 新光電気工業株式会社 電子部品パッケージ
JPWO2003007370A1 (ja) * 2001-07-12 2004-11-04 株式会社日立製作所 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法
JP5286893B2 (ja) * 2007-04-27 2013-09-11 日立化成株式会社 接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法
TWI353650B (en) * 2008-05-13 2011-12-01 Nan Ya Printed Circuit Board Chip embedded package structure and method for fab

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840203B2 (en) 2016-05-06 2020-11-17 Smoltek Ab Assembly platform
TWI743119B (zh) * 2016-05-06 2021-10-21 瑞典商斯莫勒科技公司 裝配平台
US11348890B2 (en) 2016-05-06 2022-05-31 Smoltek Ab Assembly platform
TWI718860B (zh) * 2020-02-04 2021-02-11 金像電子股份有限公司 多層印刷電路板的製造方法

Also Published As

Publication number Publication date
TWI572268B (zh) 2017-02-21

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