TW201614720A - Semiconductor plasma cleaning apparatus - Google Patents

Semiconductor plasma cleaning apparatus

Info

Publication number
TW201614720A
TW201614720A TW103144100A TW103144100A TW201614720A TW 201614720 A TW201614720 A TW 201614720A TW 103144100 A TW103144100 A TW 103144100A TW 103144100 A TW103144100 A TW 103144100A TW 201614720 A TW201614720 A TW 201614720A
Authority
TW
Taiwan
Prior art keywords
magazine
semiconductor
semiconductor component
cleaning
rotary stage
Prior art date
Application number
TW103144100A
Other languages
English (en)
Other versions
TWI579908B (zh
Inventor
Tong-Seob Yoon
Original Assignee
Vision Semicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vision Semicon Co Ltd filed Critical Vision Semicon Co Ltd
Publication of TW201614720A publication Critical patent/TW201614720A/zh
Application granted granted Critical
Publication of TWI579908B publication Critical patent/TWI579908B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW103144100A 2014-10-01 2014-12-17 半導體電漿清除裝置 TWI579908B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140132286A KR101580104B1 (ko) 2014-10-01 2014-10-01 반도체용 플라즈마 세정장치

Publications (2)

Publication Number Publication Date
TW201614720A true TW201614720A (en) 2016-04-16
TWI579908B TWI579908B (zh) 2017-04-21

Family

ID=55085032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144100A TWI579908B (zh) 2014-10-01 2014-12-17 半導體電漿清除裝置

Country Status (4)

Country Link
KR (1) KR101580104B1 (zh)
CN (1) CN106796873B (zh)
TW (1) TWI579908B (zh)
WO (1) WO2016052808A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123587A (zh) * 2016-09-23 2017-09-01 深圳市复德科技有限公司 等离子清洗机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109761003A (zh) * 2019-03-12 2019-05-17 无锡奥威赢科技有限公司 物料输送装置、物料清洗设备和方法
US20240201580A1 (en) * 2022-12-16 2024-06-20 Applied Materials, Inc. Photomask handling assembly for atmospheric pressure plasma chamber

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3521721B2 (ja) * 1997-12-25 2004-04-19 セイコーエプソン株式会社 電子部品の実装方法および装置
KR100666546B1 (ko) * 2005-06-02 2007-01-09 비전세미콘 주식회사 반도체용 플라즈마 세정장치
KR200406544Y1 (ko) * 2005-09-29 2006-01-23 한동희 편광필름 본딩장치
KR100851242B1 (ko) * 2008-03-27 2008-08-08 비전세미콘 주식회사 반도체용 플라즈마 세정장치
KR101104927B1 (ko) * 2010-04-29 2012-01-12 비전세미콘 주식회사 반도체용 플라즈마 세정장치
JP5447399B2 (ja) * 2011-01-28 2014-03-19 Ｔｄｋ株式会社 基板供給装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123587A (zh) * 2016-09-23 2017-09-01 深圳市复德科技有限公司 等离子清洗机

Also Published As

Publication number Publication date
CN106796873A (zh) 2017-05-31
CN106796873B (zh) 2020-06-19
TWI579908B (zh) 2017-04-21
WO2016052808A1 (ko) 2016-04-07
KR101580104B1 (ko) 2015-12-28

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