TW201613438A - Method for manufacturing wiring board - Google Patents

Method for manufacturing wiring board

Info

Publication number
TW201613438A
TW201613438A TW104125056A TW104125056A TW201613438A TW 201613438 A TW201613438 A TW 201613438A TW 104125056 A TW104125056 A TW 104125056A TW 104125056 A TW104125056 A TW 104125056A TW 201613438 A TW201613438 A TW 201613438A
Authority
TW
Taiwan
Prior art keywords
forming
wiring board
insulation layer
connection terminal
via conductor
Prior art date
Application number
TW104125056A
Other languages
Chinese (zh)
Other versions
TWI569703B (en
Inventor
Tomohiro Nishida
Makoto Wakazono
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201613438A publication Critical patent/TW201613438A/en
Application granted granted Critical
Publication of TWI569703B publication Critical patent/TWI569703B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

To provide a method for manufacturing a wiring board capable of inhibiting resin residues on a connection terminal. A wiring board of this invention is characterized by comprising the following steps: forming a first via hole in a first insulation layer and forming a second via hole in a second insulation layer; forming a first via conductor in the first via hole and forming a second via conductor in the second via hole, forming a first connection terminal on the first via conductor and the first insulation layer and forming a second connection terminal on the second via conductor and the second insulation layer; and forming on the second connection terminal a conductive protrusion which has an outer diameter greater than that of the second via conductor.
TW104125056A 2014-08-05 2015-08-03 Wiring substrate manufacturing method TWI569703B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014159241A JP6230971B2 (en) 2014-08-05 2014-08-05 Wiring board manufacturing method

Publications (2)

Publication Number Publication Date
TW201613438A true TW201613438A (en) 2016-04-01
TWI569703B TWI569703B (en) 2017-02-01

Family

ID=55357280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125056A TWI569703B (en) 2014-08-05 2015-08-03 Wiring substrate manufacturing method

Country Status (3)

Country Link
JP (1) JP6230971B2 (en)
KR (1) KR101792335B1 (en)
TW (1) TWI569703B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021124507A1 (en) 2019-12-19 2021-06-24 ヤマハ発動機株式会社 Vehicle
WO2021124506A1 (en) 2019-12-19 2021-06-24 ヤマハ発動機株式会社 Vehicle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3152796B2 (en) * 1993-05-28 2001-04-03 株式会社東芝 Semiconductor device and method of manufacturing the same
JPH11298141A (en) * 1998-04-08 1999-10-29 Hitachi Ltd Manufacture for electronic device
JP2003332716A (en) * 2002-03-04 2003-11-21 Ngk Spark Plug Co Ltd Wiring board and method of manufacturing same
JP3851607B2 (en) * 2002-11-21 2006-11-29 ローム株式会社 Manufacturing method of semiconductor device
JP4142680B2 (en) * 2005-10-28 2008-09-03 ハリマ化成株式会社 Solder bump formation method
JP5415632B2 (en) * 2011-07-25 2014-02-12 日本特殊陶業株式会社 Wiring board
JP5800674B2 (en) * 2011-10-25 2015-10-28 日本特殊陶業株式会社 Wiring board and manufacturing method thereof
JP2013105908A (en) * 2011-11-14 2013-05-30 Ngk Spark Plug Co Ltd Wiring board
JP5502139B2 (en) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 Wiring board
WO2014091869A1 (en) * 2012-12-11 2014-06-19 日本特殊陶業株式会社 Wiring substrate and production method therefor

Also Published As

Publication number Publication date
KR20160016688A (en) 2016-02-15
JP2016039158A (en) 2016-03-22
TWI569703B (en) 2017-02-01
JP6230971B2 (en) 2017-11-15
KR101792335B1 (en) 2017-10-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees