TW201613438A - Method for manufacturing wiring board - Google Patents
Method for manufacturing wiring boardInfo
- Publication number
- TW201613438A TW201613438A TW104125056A TW104125056A TW201613438A TW 201613438 A TW201613438 A TW 201613438A TW 104125056 A TW104125056 A TW 104125056A TW 104125056 A TW104125056 A TW 104125056A TW 201613438 A TW201613438 A TW 201613438A
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- wiring board
- insulation layer
- connection terminal
- via conductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 abstract 5
- 238000009413 insulation Methods 0.000 abstract 4
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
To provide a method for manufacturing a wiring board capable of inhibiting resin residues on a connection terminal. A wiring board of this invention is characterized by comprising the following steps: forming a first via hole in a first insulation layer and forming a second via hole in a second insulation layer; forming a first via conductor in the first via hole and forming a second via conductor in the second via hole, forming a first connection terminal on the first via conductor and the first insulation layer and forming a second connection terminal on the second via conductor and the second insulation layer; and forming on the second connection terminal a conductive protrusion which has an outer diameter greater than that of the second via conductor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014159241A JP6230971B2 (en) | 2014-08-05 | 2014-08-05 | Wiring board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201613438A true TW201613438A (en) | 2016-04-01 |
TWI569703B TWI569703B (en) | 2017-02-01 |
Family
ID=55357280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104125056A TWI569703B (en) | 2014-08-05 | 2015-08-03 | Wiring substrate manufacturing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6230971B2 (en) |
KR (1) | KR101792335B1 (en) |
TW (1) | TWI569703B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021124507A1 (en) | 2019-12-19 | 2021-06-24 | ヤマハ発動機株式会社 | Vehicle |
WO2021124506A1 (en) | 2019-12-19 | 2021-06-24 | ヤマハ発動機株式会社 | Vehicle |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3152796B2 (en) * | 1993-05-28 | 2001-04-03 | 株式会社東芝 | Semiconductor device and method of manufacturing the same |
JPH11298141A (en) * | 1998-04-08 | 1999-10-29 | Hitachi Ltd | Manufacture for electronic device |
JP2003332716A (en) * | 2002-03-04 | 2003-11-21 | Ngk Spark Plug Co Ltd | Wiring board and method of manufacturing same |
JP3851607B2 (en) * | 2002-11-21 | 2006-11-29 | ローム株式会社 | Manufacturing method of semiconductor device |
JP4142680B2 (en) * | 2005-10-28 | 2008-09-03 | ハリマ化成株式会社 | Solder bump formation method |
JP5415632B2 (en) * | 2011-07-25 | 2014-02-12 | 日本特殊陶業株式会社 | Wiring board |
JP5800674B2 (en) * | 2011-10-25 | 2015-10-28 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
JP2013105908A (en) * | 2011-11-14 | 2013-05-30 | Ngk Spark Plug Co Ltd | Wiring board |
JP5502139B2 (en) * | 2012-05-16 | 2014-05-28 | 日本特殊陶業株式会社 | Wiring board |
WO2014091869A1 (en) * | 2012-12-11 | 2014-06-19 | 日本特殊陶業株式会社 | Wiring substrate and production method therefor |
-
2014
- 2014-08-05 JP JP2014159241A patent/JP6230971B2/en not_active Expired - Fee Related
-
2015
- 2015-07-31 KR KR1020150108739A patent/KR101792335B1/en active IP Right Grant
- 2015-08-03 TW TW104125056A patent/TWI569703B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20160016688A (en) | 2016-02-15 |
JP2016039158A (en) | 2016-03-22 |
TWI569703B (en) | 2017-02-01 |
JP6230971B2 (en) | 2017-11-15 |
KR101792335B1 (en) | 2017-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |