TW201612290A - Sapphire substrate polishing agent composition - Google Patents

Sapphire substrate polishing agent composition

Info

Publication number
TW201612290A
TW201612290A TW104130330A TW104130330A TW201612290A TW 201612290 A TW201612290 A TW 201612290A TW 104130330 A TW104130330 A TW 104130330A TW 104130330 A TW104130330 A TW 104130330A TW 201612290 A TW201612290 A TW 201612290A
Authority
TW
Taiwan
Prior art keywords
polishing
sapphire substrate
agent composition
polishing agent
substrate polishing
Prior art date
Application number
TW104130330A
Other languages
Chinese (zh)
Other versions
TWI664277B (en
Inventor
Yoshinobu Yamaguchi
Kenji Naito
Sanaki Horimoto
Original Assignee
Yamaguchi Seiken Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaguchi Seiken Kogyo Kk filed Critical Yamaguchi Seiken Kogyo Kk
Publication of TW201612290A publication Critical patent/TW201612290A/en
Application granted granted Critical
Publication of TWI664277B publication Critical patent/TWI664277B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent composition contains, as components, inorganic polishing particles, a polishing accelerator, and water. The inorganic polishing particles are alumina particles, the polishing accelerator is an organic carboxylic acid-based chelating compound, and the pH is 9.0-13.0.
TW104130330A 2014-09-16 2015-09-14 Abrasive composition for sapphire substrate TWI664277B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-187563 2014-09-16
JP2014187563 2014-09-16

Publications (2)

Publication Number Publication Date
TW201612290A true TW201612290A (en) 2016-04-01
TWI664277B TWI664277B (en) 2019-07-01

Family

ID=55533127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130330A TWI664277B (en) 2014-09-16 2015-09-14 Abrasive composition for sapphire substrate

Country Status (3)

Country Link
JP (1) JPWO2016043088A1 (en)
TW (1) TWI664277B (en)
WO (1) WO2016043088A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113817410A (en) * 2020-06-18 2021-12-21 福吉米株式会社 Concentrate of polishing composition and polishing method using same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6788988B2 (en) * 2016-03-31 2020-11-25 株式会社フジミインコーポレーテッド Polishing composition
JP6096969B1 (en) 2016-04-26 2017-03-15 株式会社フジミインコーポレーテッド Abrasive material, polishing composition, and polishing method
CN106700944B (en) * 2016-12-09 2018-08-21 北京国瑞升科技股份有限公司 A kind of synthetic alkali, A are to sapphire polishing liquid and preparation method thereof
CN110744362A (en) * 2019-10-17 2020-02-04 江苏吉星新材料有限公司 Sapphire wafer grinding and polishing method
CN115216224A (en) * 2022-07-20 2022-10-21 苏州博来纳润电子材料有限公司 Sapphire polishing solution and preparation method and application thereof

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH0781132B2 (en) * 1990-08-29 1995-08-30 株式会社フジミインコーポレーテッド Abrasive composition
JPH0770553A (en) * 1993-09-01 1995-03-14 Asahi Glass Co Ltd Abrasive fluid and grinding of substrate therewith
JP2000135673A (en) * 1998-10-30 2000-05-16 Okamoto Machine Tool Works Ltd Polishing end point detecting method and polishing end point detecting device of wafer
JP2003136406A (en) * 2001-10-25 2003-05-14 Speedfam Co Ltd Method and system for recycling abrasive
JP2005205542A (en) * 2004-01-22 2005-08-04 Noritake Co Ltd Sapphire polishing grinding wheel and sapphire polishing method
AU2007290605B2 (en) * 2006-08-30 2011-03-03 Saint-Gobain Ceramics & Plastics, Inc. Concentrated abrasive slurry compositions, methods of production, and methods of use thereof
US20110258938A1 (en) * 2008-06-13 2011-10-27 Fujimi Inc. Aluminum oxide particle and polishing composition containing the same
JP5919189B2 (en) * 2010-04-28 2016-05-18 株式会社バイコウスキージャパン Sapphire polishing slurry and sapphire polishing method
JP2014024157A (en) * 2012-07-26 2014-02-06 Fujimi Inc Abrasive composition, polishing method of crustaceous material, and manufacturing method of crustaceous material substrate
JP6273281B2 (en) * 2012-08-24 2018-01-31 エコラブ ユーエスエイ インク How to polish sapphire surface
JP6029895B2 (en) * 2012-08-31 2016-11-24 株式会社フジミインコーポレーテッド Polishing composition and method for producing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113817410A (en) * 2020-06-18 2021-12-21 福吉米株式会社 Concentrate of polishing composition and polishing method using same

Also Published As

Publication number Publication date
JPWO2016043088A1 (en) 2017-08-10
WO2016043088A1 (en) 2016-03-24
TWI664277B (en) 2019-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees