TW201608203A - Heat dissipation structure for mobile device abstract of the disclosure - Google Patents

Abstract

A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling module set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling module has a cold surface and an opposite hot surface. The cooling module is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein.

Description

Mobile device heat dissipation structure

A mobile device heat dissipation structure, in particular, a mobile device heat dissipation structure that dissipates heat inside a mobile device by providing a cooling wafer and improves heat dissipation efficiency.

According to the current mobile devices (such as thin notebooks, tablets, smart phones, etc.), the faster the calculation rate, the heat generated by the internal computing execution unit is relatively increased, and it is also considered to be portable. The devices are made thinner and thinner; in addition, the mobile device prevents foreign matter and moisture from entering the interior, and the mobile device has few open apertures except for the hole of the earphone hole or the connector. The outside air forms convection. Therefore, due to the congenital factors of thinning, the heat generated by the calculation execution unit and the battery cannot be quickly discharged to the outside, and the inside of the mobile device is closed, so it is difficult to produce Convection heat dissipation, and thus it is easy to generate heat accumulation or heat accumulation inside the mobile device, which seriously affects the working efficiency or heat of the mobile device.

Furthermore, due to the above problems, passive heat dissipating components such as hot plates, temperature equalizing plates, flat heat pipes, and heat sinks are disposed inside the mobile devices for heat dissipation, but still due to thinning of the mobile device. As a result, the internal space of the device is limited, and the heat dissipating component provided here is inevitably reduced to a super thin (thick) thickness and thickness, and can be disposed in a limited internal space, but the heat plate and the uniform temperature are reduced as the size is limited. Because the capillary structure and the steam passage inside the plate are set to be ultra-thin, the above requirements are limited, so that the heat plates and the uniform temperature plates are greatly reduced in the overall heat transfer efficiency, and the heat dissipation performance cannot be effectively improved; When the internal calculation unit of the mobile device is too high, conventional hot plates, flat heat pipes, and temperature equalizing plates cannot effectively dissipate heat or dissipate heat, so how to set effective heat-dissipating components in a narrow confined space.

Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a mobile device heat dissipation structure, the mobile device heat dissipation structure, comprising: a carrier;

The carrier system has a bearing portion and a uniform cold wafer, and the cooling chip is embedded in the bearing portion. The bearing portion has a first side and a second side, and the cooling chip has a cold surface and a heat. The cold surface and the hot surface of the cooling chip are respectively aligned with the first and second sides.

Through the invention, the electronic components inside the mobile device can be quickly decomposed and not accumulated in the interior, thereby improving the overall heat dissipation performance of the heat sink.

1‧‧‧Carrier

11‧‧‧Loading Department

111‧‧‧ first side

112‧‧‧ second side

12‧‧‧Chilled wafer

121‧‧‧ cold noodles

122‧‧‧ hot noodles

123‧‧‧heat layer

13‧‧‧ accommodating space

131‧‧‧ open side

132‧‧‧ Closed side

133‧‧‧through hole

2‧‧‧Electronic components

21‧‧‧heat source

3‧‧‧Heat components

1 is a perspective view of a first embodiment of a heat dissipation structure of a mobile device of the present invention;

Figure 2 is a cross-sectional view showing a first embodiment of the heat dissipation structure of the mobile device of the present invention;

Figure 3 is a perspective exploded view of a second embodiment of the heat dissipation structure of the mobile device of the present invention;

Figure 4 is a cross-sectional view showing the second embodiment of the heat dissipation structure of the mobile device of the present invention;

Figure 5 is a cross-sectional view showing a combination of a third embodiment of the heat dissipation structure of the mobile device of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

1 and 2 are a perspective view and a cross-sectional view of a first embodiment of the heat dissipation structure of the mobile device of the present invention. As shown, the heat dissipation structure of the handheld device includes: a carrier 1;

The carrier 1 has a carrier portion 11 and a uniform cold wafer 12, and the cooling wafer 12 is embedded in the carrier portion 11. The carrier portion 11 has a first side 111 and a second side 112. The cold wafer 12 has a cold surface 121 and a hot surface 122. The cold surface 121 and the hot surface 122 of the refrigerant wafer 12 are respectively aligned with the first and second sides 111 and 112.

The bearing body 1 further has an accommodating space 13 having an open side 131 and a closed side 132. The carrying portion 11 is disposed on the closed side 132 of the carrier 1 and defines a through hole in the closed side 132. The chilled wafer 12 is embedded in the 133 so that the cold surface 121 and the hot surface 122 of the chilled wafer 12 can be aligned with the first side 111 and the second side 112, respectively.

The carrier 1 is an aluminum plate or an aluminum-copper alloy plate body or a stainless steel plate body or other powder metallurgy or plastic formed plate body.

3 and 4 are a perspective exploded view and a combined cross-sectional view of a second embodiment of the heat dissipation structure of the mobile device of the present invention. This embodiment has the same structure as that of the first embodiment, and therefore will not be further described herein. The difference between the embodiment and the first embodiment is that the first side 111 carries a plurality of electronic components 2, and the electronic components 2 have at least one heat source 21 attached or adjacent to the heat source 21 The cold surface 121 of the cold wafer 12, which is a circuit board or a transistor or a flash memory or a central processing unit, and transmits the cold surface of the heat generating source 21 and the cooling wafer 12 121 is attached, and the heat source 21 of the electronic component 2 is cooled by the cold surface 121 of the refrigerant chip 12.

The second side 112 carries at least one heat dissipating component 3, and the heat dissipating component 3 is a copper foil or a temperature equalizing plate or a heat pipe or graphite (graphene), and the heat dissipating component 3 is attached. The hot surface 122 of the cooling chip 12 is aligned with the second side 112, and the heat generated by the hot surface 122 is transmitted to the other portions of the carrier 1 through the heat dissipating member 3 to uniformly dissipate heat.

FIG. 5 is a cross-sectional view showing a third embodiment of the heat dissipation structure of the mobile device of the present invention. The present embodiment is identical to the second embodiment, and therefore will not be described again. However, the present embodiment and the present embodiment are not described herein. The second embodiment differs in that a heat dissipation layer 123 is formed on the hot surface of the refrigerant chip 12, and the heat dissipation layer 123 is further increased in efficiency of radiation heat dissipation.

The heat dissipation layer 123 is subjected to Micro Arc Oxidation (MAO) or Plasma Electrolytic Oxidation (PEO), Anodic Spark Deposition (ASD), and Anodic Oxidation by Spark Deposition. , ANOF) Any of these forms are formed on the hot side of the aforementioned cooled wafer.

The heat dissipation layer 123 is a porous structure or a nanostructure or a high-radiation ceramic structure or a high-hardness ceramic structure, and the heat dissipation layer 123 is in the form of black or sub-black or dark color. .

1‧‧‧Carrier

11‧‧‧Loading Department

111‧‧‧ first side

112‧‧‧ second side

12‧‧‧Chilled wafer

121‧‧‧ cold noodles

122‧‧‧ hot noodles

13‧‧‧ accommodating space

131‧‧‧ open side

132‧‧‧ Closed side

Claims (6)

[Item 1] A mobile device heat dissipation structure comprising:
a carrier having a carrying portion and a uniform cold wafer, the cooling chip being embedded in the carrying portion, the carrying portion having a first side and a second side, the cooling chip having a cold surface and a The hot surface, the cold surface and the hot surface of the cooling chip are respectively aligned with the first and second sides. [Item 2] The mobile device heat dissipation structure of claim 1, wherein the first side carries a plurality of electronic components, the electronic components having at least one heat source attached or adjacent to the cooled wafer Cold noodles. [Item 3] The mobile device heat dissipation structure according to claim 1, wherein the second side carries at least one heat dissipating component, and the heat dissipating component is a copper foil or a temperature equalizing plate or a heat pipe or graphite (graphene) ) Any of them. [Item 4] The mobile device heat dissipation structure according to claim 1, wherein the bearing system is an aluminum plate or an aluminum-copper alloy plate body or a stainless steel plate body or other powder metallurgy or plastic formed plate body. [Item 5] The mobile device heat dissipation structure according to claim 1, wherein the carrier further has an accommodating space having an open side and a closed side. [Item 6] The mobile device heat dissipation structure according to claim 1, wherein the hot surface of the refrigerant chip is formed with a heat dissipation layer, wherein the heat dissipation layer is permeable to micro arc oxidation (MAO) or plasma electrolytic oxidation (Plasma) Electrolytic Oxidation (PEO), Anodic Spark Deposition (ASD), and Anodic Oxidation by Spark Deposition (ANOF) are formed on the hot side of the cooled wafer.